JP2020062658A - Laser processing device and laser processing method - Google Patents

Abstract

To enhance beam quality in an imaging optical system.SOLUTION: The laser processing device comprises: first and second AODs that deflect a laser beam emitted from a laser beam sources in two directions orthogonal to each other; a first lens optical system that positions a scanning focal point of the laser beam from the first AOD at a position of the second AOD or in a vicinity of the position; a second lens optical system that positions scanning focal points in a deflection direction of the first AOD and the second AOD of the laser beam from the second AOD at first and second common positions respectively; first and second aperture grills that are arranged at the first and second common positions, and form a cross sectional shape of the laser beam from the second AOD; first and second galvano scanners that deflect the laser beam in two directions orthogonal to each other; and a fθ lens that converges the laser beam emitted from the second galvano scanner at a position of a work-piece.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a laser processing apparatus and a laser processing method for irradiating a processing object with a laser beam to perform fine perforation processing.

  In the technical field of printed wiring boards in recent years, in order to meet the demand for higher density of electronic circuits, a multilayer printed wiring board is formed by stacking a plurality of build-up layers on a core substrate or a support plate. Is proposed.

  The build-up layer is usually composed of an interlayer insulating layer and a conductor layer above it.In a multilayer printed wiring board, the conductor layers between the core substrate and the build-up layer and between the build-up layers are electrically connected. Through hole is formed in the interlayer insulating layer and the via hole conductor is provided in the through hole by plating or the like.

  The through hole for the via-hole conductor has an extremely small diameter and a large number, and in recent years, for its formation, laser beam irradiation by a laser processing apparatus as described in Patent Document 1, for example, has been used. .

  FIG. 3 schematically shows an image forming optical system and a scanning optical system in a conventional laser processing apparatus of this kind, respectively, in the upper part and the lower part of the figure. A layer-shaped flat object W is irradiated with a laser beam B of carbon dioxide gas to perform fine perforation processing. A laser beam B from a laser light source 21 including an oscillator such as a carbon dioxide laser is used. The cross-sectional shape of the beam is shaped by passing through the opening of the first aperture grill 22.

  Next, X-axis and Y-axis AODs (acousto-optical deflection) as first and second AODs for deflecting the laser beam B in the biaxial directions orthogonal to each other at an angle according to the frequency of the input ultrasonic wave Device 23, 24 for two-dimensional deflection, and the laser beam B scans the inside of a minute rectangular area. At this time, a damper (not shown) located between the X-axis and Y-axis AODs 23, 24 The damper of the half-wave plate blocks the 0th-order light from the X-axis AOD 23, and the half-wave plate adapts the polarization direction of the laser beam B from the X-axis AOD 23 to the incidence on the Y-axis AOD 24. Rotate 90 degrees.

  Next, the laser beam B for scanning within the minute rectangular area is expanded by the lens optical system 25 in which a plurality of lenses 25a and 25b are combined while blocking the 0th order light from the Y-axis AOD 24 with a damper (not shown). , A second cross-sectional shape of the beam is shaped by passing through the opening of the second aperture grill 26, and then the laser beam B is rotated by a motor to rotate the galvanometer mirror about support shafts extending in the directions perpendicular to each other. The X-axis and Y-axis galvano scanners 27 and 28 are sequentially passed through the galvano-scanners 27 and 28, and the laser beam B is deflected two-dimensionally by reflection at the galvano-mirrors of the X-axis and Y-axis galvano scanners 27 and 28. By moving the minute rectangular area to be scanned in the small rectangular area larger than that, the entire small rectangular area is scanned with the laser beam B. .

  Then, the laser beam B for scanning the entire small rectangular area is passed through the fθ lens 29 to irradiate the surface of the processing object W perpendicularly and converge at the hole forming position H on the surface of the processing object W, On the other hand, a table (not shown) that supports the workpiece W is two-dimensionally moved to move the small rectangular area scanned by the laser beam B over the entire perforation processing range of the surface of the workpiece W.

  The conventional laser processing apparatus has a very small diameter and a large number of through holes formed in the object to be processed by the above-described configuration with a laser beam, so that the surface of the object to be processed can be finely drilled over the entire range. We perform high-precision drilling in a short time to increase the throughput of drilling.

JP, 2008-049383, A

  In the conventional laser processing apparatus, the laser beam B passing through the first aperture grill 22 is sequentially passed through the X-axis and Y-axis AODs 23 and 24 to be two-dimensionally deflected. When the laser beam B whose cross-sectional shape is shaped into a circular shape by the grill 22 exits the X-axis AOD 23, it extends in the X-axis direction that is its deflection direction, and when it exits the Y-axis AOD 24, it extends in the Y-axis direction that is its deflection direction. , The beam quality in the imaging optical system is deteriorated by passing through the second aperture grill 26 in a state where the beam spreads in the X-axis direction and the Y-axis direction.

  Further, in the above-described conventional laser processing apparatus, since the position of the X-axis AOD 23 and the position of the Y-axis AOD 24 are separated by the distance L1 in the optical path direction, the X-axis of the laser beam B after being expanded by the lens optical system 25. The X-axis scanning focus position where the directional deflection amount is 0 and the Y-axis scanning focus position where the Y-axis direction deflection amount of the laser beam B is 0 are separated from each other in the optical path direction by a distance L2 larger than the distance L1. , If the deflection angles of the X-axis AOD 23 and the Y-axis AOD 24 are large, the laser beam B may not be contained in the opening of the second aperture grill 26 and the galvano mirrors of the X-axis and Y-axis galvano scanners 27 and 28. There was also a problem with the scanning optics.

The laser processing apparatus of the present invention irradiates a laser beam on a processing object to perform fine perforation processing,
Laser beams emitted from a laser light source are arranged in series on the optical path of the laser beams, and the laser beams are sequentially incident, and are deflected in two axial directions orthogonal to each other at an angle according to the frequency of each input ultrasonic wave. The first AOD and the second AOD,
It is arranged on the optical path of the laser beam between the first AOD and the second AOD, and the scanning focus in the deflection direction of the first AOD of the laser beam emitted from the first AOD is set to the position of the second AOD. Or a first lens optical system located in the vicinity thereof,
The galvanomirrors are arranged in series with each other and are combined so as to rotate about axes perpendicular to each other, and the laser beams emitted from the second AOD are sequentially incident on the galvanomirrors. A first galvano-scanner and a second galvano-scanner for deflecting by reflection of
It is arranged on the optical path of the laser beam between the second AOD and the first galvano scanner, and the scanning focus in the deflection direction of the first AOD of the laser beam emitted from the second AOD and the second AOD A second lens optical system for sequentially arranging the scanning focal points in the deflection direction at a first common position and a second common position located in the vicinity of the first galvano scanner, respectively, from the second AOD side;
A first aperture grill disposed at a first common position and shaping the cross-sectional shape of the laser beam emitted from the second AOD;
A second aperture grill disposed at a second common position for shaping the cross-sectional shape of the laser beam passing through the first aperture grill;
An fθ lens that causes a laser beam emitted from the second galvano scanner to enter the object to be processed perpendicularly and converge at the position of the object to be processed;
It is equipped with.

Further, the laser processing method of the present invention is a method of irradiating a laser beam to an object to be processed to perform fine perforation processing,
A laser beam emitted from a laser light source is arranged in series on the optical path of the laser beam, and the first AOD and the second AOD sequentially injecting the laser beam cause biaxial directions orthogonal to each other. , Deflecting and outputting at an angle according to the frequency of each input ultrasonic wave,
The first lens optical system disposed on the optical path of the laser beam between the first AOD and the second AOD scans the laser beam emitted from the first AOD in the deflection direction of the first AOD. Locating the focal point at or near the position of the second AOD;
The laser beams emitted from the second AOD are arranged in series on the optical path of the laser beam, and the galvanomirrors are combined so as to rotate about axes orthogonal to each other. Deflecting the laser beam by reflection by a galvanomirror by the first galvanoscanner and the second galvanoscanner which are incident, and emitting the laser beam;
By the second lens optical system arranged on the optical path of the laser beam between the second AOD and the first galvano scanner, the deflection direction of the first AOD of the laser beam emitted from the second AOD is changed. The scanning focal point and the scanning focal point in the deflection direction of the second AOD are sequentially positioned from the second AOD side to a first common position and a second common position located in the vicinity of the first galvano scanner. That
Arranging the first aperture grill at a first common position to shape the cross-sectional shape of the laser beam emitted from the second AOD;
Arranging a second aperture grill in a second common position to shape the cross-sectional shape of the laser beam through the first aperture grill;
The laser beam emitted from the second galvano scanner is made incident vertically on the object to be processed by the fθ lens and converged at the position of the object to be processed;
Is included.

  According to the embodiment of the present invention, the laser beam emitted from the laser light source and two-dimensionally deflected by the first and second AODs is made incident on the first and second galvano scanners, and the galvano scanners are made. The laser beam is two-dimensionally deflected and emitted in a larger range by the galvanometer mirror No. 1, and the laser beam is vertically incident on the object to be processed by the fθ lens and converges at the position of the object to be processed. Accordingly, it is possible to form minute through holes in the object to be processed, and to perform minute hole drilling over the entire hole forming range of the surface of the object to be processed W having a large number of small diameter through holes in a short time. be able to.

  Further, according to the embodiment of the present invention, the first lens optical system arranged between the first and second AODs has a deflection direction of the first AOD of the laser beam emitted from the first AOD. Of the laser beam emitted from the second AOD in the deflection direction of the first AOD and the second focus of the second lens optical system. The scanning focus in the deflection direction of the AOD is sequentially positioned from the second AOD side to the first common position and the second common position located near the first galvanometer scanner. As a result, the amount of deviation of the laser beam from the center of each galvano-mirror of each of the first and second galvano-scanners is reduced, so that the laser beam of each of the first and second galvano-scanners does not need to be enlarged. Since it is accommodated in each galvano mirror, it is possible to avoid the reduction in the operating speed of the first and second galvano scanners, while effectively utilizing the maximum deflection angle of each of the first and second AODs for drilling. The efficiency can be increased.

  Further in accordance with an embodiment of the present invention, the first aperture grill is located at the first common position and the second aperture grill is located at the second common position, the laser beam cross-section at each common position. Shape the shape. As a result, the laser beam whose cross-sectional shape is shaped by the first aperture grille falls within the opening of the second aperture grille even if the deflection angles of the first and second AODs are large, so it is incident on the fθ lens. The circularity of the cross-sectional shape of the laser beam is improved to improve the beam quality in the imaging optical system, and particularly, the intensity of the laser beam incident on the surface of the object to be processed from the fθ lens is maintained and The roundness of the through hole that is drilled by the laser beam can be increased.

It is explanatory drawing which shows the imaging optical system and scanning optical system of the laser processing apparatus of one Embodiment of this invention in correlation with each other in an upper part and a lower part. It is explanatory drawing which shows the imaging optical system and scanning optical system of the laser processing apparatus of other one Embodiment of this invention mutually associated with an upper part and a lower part. It is explanatory drawing which shows the imaging optical system and scanning optical system of the conventional laser processing apparatus in correlation with each other in an upper part and a lower part.

  Embodiments of a laser processing apparatus and a laser processing method according to the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory diagram showing an imaging optical system and a scanning optical system of a laser processing apparatus according to an embodiment of the present invention in an upper part and a lower part in association with each other.

  The laser processing apparatus according to this embodiment irradiates a flat plate-shaped processing target W, which is an interlayer insulating layer of a printed wiring board, with a laser beam B of carbon dioxide gas to perform fine perforation processing with a diameter of several tens of μm. A laser light source 1 including an oscillator such as a carbon dioxide gas laser, and an X-axis AOD 2 as a first AOD (acousto-optic deflector) arranged in series on the optical path of a laser beam B emitted from the laser light source 1. And a Y-axis AOD5 as a second AOD (acousto-optical deflector), a first lens optical system 3 arranged on the optical path of the laser beam B between the X-axis AOD2 and the Y-axis AOD5, and a first lens optical system 3. The half-wave plate 4 disposed between the lens optical system 3 and the Y-axis AOD 5 and the first damper (not shown).

  The X-axis AOD 2 deflects and emits the primary light of the laser beam B from the laser light source 1 in the X-axis direction orthogonal to the optical path direction at an angle according to the frequency of the input ultrasonic wave. The first lens optical system 3 is configured by combining two lenses 3a and 3b having the same focal length with each other, and has a scanning focus (deflection amount) in the X-axis direction, which is the deflection direction of the laser beam B from the X-axis AOD2. The point 0) is positioned at or near the position of the Y-axis AOD5 by the two lenses 3a and 3b, and the position is set as the original common position P0. The Y-axis AOD5 deflects the primary light of the laser beam B emitted from the X-axis AOD2 in the Y-axis direction orthogonal to the optical path direction and the X-axis direction at an angle according to the frequency of the input ultrasonic wave. Let out.

  The laser processing apparatus of this embodiment deflects the laser beam B two-dimensionally by these X-axis and Y-axis AODs 2 and 5, and scans the minute rectangular region with the laser beam B, in which case the above-mentioned first Damper blocks the 0th-order light from the X-axis AOD2, and the half-wave plate 4 rotates the polarization direction of the laser beam B from the X-axis AOD2 by 90 degrees so as to match the incidence on the Y-axis AOD5. Let

  The laser processing apparatus of this embodiment also includes an X-axis galvano scanner 10 as a first galvano scanner and a Y as a second galvano scanner, which are arranged in series on the optical path of the laser beam B emitted from the Y-axis AOD 5. Axial galvano scanner 11, a second lens optical system including two sets of lens optical systems 6 and 8 arranged on the optical path of the laser beam B between the Y-axis AOD 5 and the X-axis galvano scanner 10, and not shown. It has a second damper.

  The second damper blocks the 0th order light of the laser beam B emitted from the Y-axis AOD 5. The two sets of lens optical systems 6 and 8 of the second lens optical system are each configured by combining two lenses, and the primary light of the laser beam B emitted from the Y-axis AOD 5 is transmitted to the second lens optical system. For example, the diameter of the laser beam B is expanded three times in the entire system, and the scanning focus (X-axis scanning focus) of the laser beam B in the X-axis AOD2 deflection direction and the Y-axis direction of the Y-axis AOD5 deflection direction. Both the scanning focus (Y-axis scanning focus) is sequentially arranged from the Y-axis AOD side 5 in the vicinity of the first common position P1 between the two sets of lens optical systems 6 and 8 and the front side of the X-axis galvano scanner. It is located at the second common position P2. Then, the X-axis galvano scanner 10 and the Y-axis galvano scanner 11 are combined so that the galvano mirrors rotate about axes perpendicular to each other, and the laser beam B emitted from the Y-axis AOD 5 is sequentially incident on the laser beam B. The beam B is deflected in the X-axis direction and the Y-axis direction by reflection on the galvano mirror.

  With these X-axis and Y-axis galvano scanners 10 and 11, the laser processing apparatus of this embodiment two-dimensionally deflects the laser beam B by reflection at the galvano mirrors of each of the X-axis and Y-axis galvano scanners 10 and 11. Then, the minute rectangular area to be scanned by the laser beam B is moved within the small rectangular area larger than that, so that the entire small rectangular area is scanned with the laser beam B.

  The laser processing apparatus of this embodiment further includes a first aperture grill 7 disposed at a first common position P1 on the optical path of the laser beam B between the Y-axis AOD 5 and the X-axis galvano scanner 10, And a second aperture grille 9 arranged at two common positions P2.

  The first aperture grill 7 has an opening, and the laser beam B emitted from the lens optical system 6 and having a beam diameter narrower than that of the Y-axis AOD 5 at the opening position is passed through the opening. Shape the cross-sectional shape. The second aperture grill 9 also has an opening, and the laser beam B emitted from the lens optical system 8 and having a diameter increased at the opening position is passed through the opening to shape the cross-sectional shape of the beam.

  The first aperture grille 7 and the second aperture grille 9 are respectively a scanning focus in the X-axis direction in which the deflection amount of the X-axis AOD2 becomes 0 and a scanning focus in the Y-axis direction in which the deflection amount of the Y-axis AOD5 becomes 0. Since the laser beam B is located at a common position with, the laser beam B can be housed in these openings even when the deflection amounts of the X-axis AOD2 and the Y-axis AOD5 are large.

  The laser processing apparatus of this embodiment further includes an fθ lens 12 located in the vicinity of the Y-axis galvanometer scanner 11 and a work table (not shown) that supports the workpiece W by arranging the workpiece W at a position facing the fθ lens 12. I am.

  The fθ lens 12 irradiates the laser beam B, which is deflected by the X-axis and Y-axis galvano scanners 10 and 11 and scans the entire small rectangular area, perpendicularly to the surface of the object W to be processed, and at the same time, to the object W to be processed. The light is converged at the hole forming position H on the surface. In the work table, the object W is two-dimensionally moved in a plane parallel to the surface of the object W so that a small rectangular area scanned by the laser beam B is entirely formed on the surface of the object W. Move with.

  By the way, in the conventional laser processing apparatus, since the above-mentioned half-wave plate (not shown) is provided between the X-axis AOD 23 and the Y-axis AOD 24, as shown in the upper part of FIG. The distance L1 from the axis AOD24 is large. Therefore, as shown in the lower part of FIG. 3, it is indicated by a broken line in FIG. 3 between the X-axis scanning focus and the Y-axis scanning focus at the maximum deflection angle by each of the X-axis AOD 23 and the Y-axis AOD 24. The distance L2 of the non-deflected laser beam in the optical axis (scanning center optical axis) direction becomes large, and the laser beam B from the galvano mirrors of the openings of the second aperture grille 26 and the X-axis and Y-axis galvano scanners 27 and 28 is increased. Partial disconnection occurs.

  On the other hand, in the laser processing apparatus of this embodiment, as shown in FIG. 1, the first lens optical system 3 is provided between the X-axis AOD2 and the Y-axis AOD5. In the system 3, for example, two lenses 3a and 3b, which are convex lenses having the same specifications as each other, are combined with a distance 2A that is twice the focal length A of those lenses, and the lens 3a is rearward with respect to the X-axis AOD2 in the optical path direction. The lens 3b may be arranged at the position of the focal length A from the X-axis AOD2 on the side, and the lens 3b may be arranged at the position of the focal length A from the Y-axis AOD5 on the front side in the optical path direction with respect to the Y-axis AOD5.

  According to the first lens optical system 3, the laser beam B deflected and emitted from the X-axis AOD 2 is made into a beam parallel to the optical axis (scanning center optical axis) of the undeflected laser beam by the lens 3a. To the lens 3b, and then is incident on the Y-axis AOD5 at the focal position of the lens 3b, so that the X-axis scanning focus by the X-axis AOD2 is generated at the position of the Y-axis AOD5.

  Therefore, as shown in FIG. 1, the optical axis of the undeflected laser beam between the X-axis scanning focus and the Y-axis scanning focus at the maximum deflection angle by each of the X-axis AOD2 and the Y-axis AOD5 ( The distance in the scanning center optical axis direction becomes extremely small at the original common position P0 or becomes substantially 0 (zero), so that the X-axis scanning focus and the Y-axis scanning focus are both the first common position P1 and the first common position P1. Since the laser beam B is located at the second common position P2, the entire cross section of the laser beam B remains at the first common position P1 even when the deflection amounts by the X-axis AOD2 and the Y-axis AOD5 increase. Of the second aperture grill 9 and the second common position P2.

  Therefore, according to the laser processing apparatus of this embodiment and the laser processing method of this embodiment in which the laser processing apparatus performs the boring processing as described above, the workpiece W having a very small diameter and a large number of through holes is formed. It is possible to perform minute drilling over the entire drilling range of the surface of the above in a short time, and both the X-axis scanning focus and the Y-axis scanning focus are both the first common position P1 and the second common position. Since it is located at P2, the laser beam B is contained in the galvanomirrors of the X-axis and Y-axis galvano scanners 10 and 11, so that the maximum deflection angle by each of the X-axis AOD2 and the Y-axis AOD5 is effectively used to make a hole. Since the processing efficiency of the processing can be improved and the laser beam B is contained in the opening of the second aperture grill 9, the circularity of the laser beam B incident on the fθ lens 12 can be improved. By, it is possible to increase the roundness of the through holes of the hole drilled machining.

  FIG. 2 is an explanatory view showing an imaging optical system and a scanning optical system of a laser processing apparatus according to another embodiment of the present invention in an upper portion and a lower portion in association with each other. 1 is different from the laser processing apparatus of the previous embodiment shown in FIG. 1 only in the configuration in the vicinity of the first aperture grill 7, and therefore the different portions will be mainly described below.

  That is, the laser processing apparatus of this embodiment is the same as the previous embodiment in that the first aperture grill 7 is located between the two lens optical systems 6 and 8 that form the second lens optical system. However, on the optical path of the laser beam B, between the lens optical system 6 near the Y-axis AOD 5 and the lens optical system 8 near the second aperture grille 9, the laser beam B is narrowed down in the first embodiment and the first The laser beam B is passed through the opening of the first aperture grill 7 with a beam diameter larger than that of the Y-axis AOD 5 in this embodiment.

  Also by the laser processing apparatus of this embodiment and the laser processing method of this embodiment in which the laser processing apparatus performs the drilling in the same manner as the method of the previous embodiment, the processing target of a very small diameter and a large number of through holes It is possible to perform minute drilling over the entire drilling range on the surface of the object W in a short time, and both the X-axis scanning focus and the Y-axis scanning focus are at the first common position P1 and the second common position P1. Since the laser beam B is located in the galvano mirrors of the X-axis and Y-axis galvano scanners 10 and 11 because it is located at the common position P2, the maximum deflection angle by each of the X-axis AOD2 and the Y-axis AOD5 is effectively used. Since it is possible to improve the processing efficiency of drilling, and since the laser beam B is contained within the opening of the second aperture grill 9, the laser beam B incident on the fθ lens 12 is To improve circularity, it is possible to improve the roundness of the through holes of the hole drilled machining.

  The present invention is not limited to the above embodiment, and various changes and modifications can be made without departing from the scope of the claims. For example, in the laser processing apparatus and the laser processing method of the embodiment, the second common position where both the X-axis scanning focus and the Y-axis scanning focus are located is the second aperture near the front side of the X-axis galvanometer scanner 10. Although it is set to the position of the grill 9, it may be set to the position of the X-axis galvano scanner 10 or the Y-axis galvano scanner 11 or a position in the vicinity thereof in place of this.

  Further, in the laser processing apparatus and the laser processing method of the above-described embodiment, each of the two sets of lens optical systems 6 and 8 of the second lens optical system is configured by combining two lenses. You may have a structure.

1,21 Laser light source 2,23 X-axis AOD (first AOD)
3 First lens optical system 3a, 3b Lens 4 1/2 wavelength plate 5, 24 Y-axis AOD (second AOD)
6,8 lens optical system (second lens optical system)
6a, 6b, 8a, 8b Lens 7,22 First aperture grill 9,26 Second aperture grill 10,27 X-axis galvano scanner (first galvano scanner)
11,28 Y-axis galvano scanner (second galvano scanner)
12, 29 fθ lens 25 lens optical system 25a, 25b lens B laser beam H hole position P0 original common position P1 first common position P2 second common position W object to be processed

Claims (6)

A laser processing apparatus for irradiating a processing object with a laser beam to perform fine perforation processing,
Laser beams emitted from a laser light source are arranged in series on the optical path of the laser beams, and the laser beams are sequentially incident, and are deflected in two axial directions orthogonal to each other at an angle according to the frequency of each input ultrasonic wave. The first AOD and the second AOD,
It is arranged on the optical path of the laser beam between the first AOD and the second AOD, and the scanning focus in the deflection direction of the first AOD of the laser beam emitted from the first AOD is set to the position of the second AOD. Or a first lens optical system located in the vicinity thereof,
The galvanomirrors are arranged in series with each other and are combined so as to rotate about axes perpendicular to each other, and the laser beams emitted from the second AOD are sequentially incident on the galvanomirrors. A first galvano-scanner and a second galvano-scanner for deflecting by reflection of
It is arranged in the optical path of the laser beam between the second AOD and the first galvano scanner, and the scanning focus in the deflection direction of the first AOD of the laser beam emitted from the second AOD and the second AOD A second lens optical system for sequentially arranging the scanning focal points in the deflection direction at a first common position and a second common position located in the vicinity of the first galvano scanner, respectively, from the second AOD side;
A first aperture grill disposed at a first common position and shaping the cross-sectional shape of the laser beam emitted from the second AOD;
A second aperture grill disposed at a second common position for shaping the cross-sectional shape of the laser beam passing through the first aperture grill;
An fθ lens that causes a laser beam emitted from the second galvano scanner to enter the object to be processed perpendicularly and converge at the position of the object to be processed;
Equipped with.   The laser processing apparatus according to claim 1, wherein the second aperture grill is located at the second common position.   The laser processing apparatus according to claim 1 or 2, wherein the laser beam is narrowed at the first common position than at the second AOD position. A laser processing method for irradiating a processing object with a laser beam to perform fine perforation processing,
A laser beam emitted from a laser light source is arranged in series on the optical path of the laser beam, and the first AOD and the second AOD sequentially injecting the laser beam cause biaxial directions orthogonal to each other. , Deflecting and outputting at an angle according to the frequency of each input ultrasonic wave,
The first lens optical system disposed on the optical path of the laser beam between the first AOD and the second AOD scans the laser beam emitted from the first AOD in the deflection direction of the first AOD. Locating the focal point at or near the position of the second AOD;
The laser beams emitted from the second AOD are arranged in series on the optical path of the laser beam, and the galvanomirrors are combined so as to rotate about axes orthogonal to each other. Deflecting the laser beam by reflection by a galvanomirror by the first galvanoscanner and the second galvanoscanner which are incident, and emitting the laser beam;
By the second lens optical system arranged on the optical path of the laser beam between the second AOD and the first galvano scanner, the deflection direction of the first AOD of the laser beam emitted from the second AOD is changed. The scanning focal point and the scanning focal point in the deflection direction of the second AOD are sequentially positioned from the second AOD side to a first common position and a second common position located in the vicinity of the first galvano scanner. That
Arranging the first aperture grill at a first common position to shape the cross-sectional shape of the laser beam emitted from the second AOD;
Arranging a second aperture grill in a second common position to shape the cross-sectional shape of the laser beam through the first aperture grill;
The laser beam emitted from the second galvano scanner is made incident vertically on the object to be processed by the fθ lens and converged at the position of the object to be processed;
Is included.   The laser processing method according to claim 4, wherein the second aperture grill is located at the second common position.   The laser processing method according to claim 4 or 5, wherein the laser beam is narrowed at the first common position than at the second AOD position.