JP2018116970A - Processing method for workpiece - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing method for a workpiece capable of suppressing generation of chipping.SOLUTION: A processing method for a workpiece is provided for removing a predetermined removal region in an outer periphery of a disc-like workpiece with which multiple devices are formed on a surface. The processing method for the workpiece includes: a first positioning step ST1 of positioning a cutting direction of a cutting blade in a tangential direction of an edge of the workpiece; a first cutting step ST2 of removing a first predetermined removal region by rotating the workpiece while making the cutting blade cut into the workpiece; a second positioning step ST3 of positioning the cutting blade at such an angle that the cutting direction of the cutting blade and a tangent of the edge of the workpiece form an angle that exceeds 0°; and a second cutting step ST4 of removing a second predetermined removal region by rotating the workpiece while making the cutting blade cut into the workpiece. The second predetermined removal region includes a region that is closer to a device region than the first predetermined removal region.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method for processing a workpiece.

  The problem that the edge of the workpiece after thinning is chipped or the edge of the workpiece joined to the substrate is peeled off when performing a process to form a film on the workpiece in the process after thinning was there. Therefore, conventionally, the cutting blade is positioned at a position where the tangential direction of the disk-shaped workpiece, that is, the cutting direction of the cutting blade and the tangent of the peripheral edge of the workpiece are 0 degrees, and the cutting blade is cut. However, edge trimming is performed to remove the outer peripheral portion by rotating the workpiece (see, for example, Patent Document 1).

JP-A-2006-2623

  When a wafer containing copper or a wafer with a thick oxide film on the device surface, which is the workpiece, is edge trimmed by the conventional method disclosed in Patent Document 1, fine chipping (chipping) occurs in the vicinity of the device region. In some cases, the fine chipping may cause a scratch on the device surface after bonding the wafer in the subsequent process.

  This invention is made | formed in view of such a point, and it aims at providing the processing method of the workpiece which can suppress generation | occurrence | production of chipping.

  In order to solve the above-described problems and achieve the object, a processing method for a workpiece according to the present invention removes a region to be removed from the outer periphery of a disk-shaped workpiece on which a plurality of devices are formed. A processing method for a workpiece, the first positioning step of positioning a cutting direction of a cutting blade in a tangential direction of a peripheral portion of the workpiece, and the workpiece while cutting the cutting blade into the workpiece The cutting blade is positioned at an angle in which the first cutting step of rotating the workpiece to remove the first region to be removed and the cutting direction of the cutting blade and the tangent to the peripheral edge of the workpiece exceed 0 degree. A second positioning step, and a second cutting step in which the workpiece is rotated while cutting the cutting blade into the workpiece to remove a second scheduled removal region, The planned removal area is more depleted than the first planned removal area. Characterized in that it comprises a region close to the chair region.

  A processing method for a workpiece according to the present invention is a processing method for a workpiece that removes a region to be removed on the outer periphery of a disk-shaped workpiece, and includes a cutting direction of a cutting blade and a peripheral portion of the workpiece. A first positioning step of positioning the cutting blade at an angle of more than 0 degrees with respect to the tangent line, and a first removal scheduled region by rotating the workpiece while cutting the cutting blade from the surface of the workpiece A first cutting step of removing the cutting blade, a second positioning step of positioning the cutting direction of the cutting blade in the tangential direction of the peripheral portion of the workpiece, and rotating the workpiece while cutting the cutting blade And a second cutting step for removing the second scheduled removal region, wherein the first scheduled removal region includes a region closer to the device region than the second scheduled removal region. .

  The angle exceeding 0 degree is desirably 5 degrees or more.

  The angle exceeding 0 degree is preferably 90 degrees.

  Therefore, the processing method of the workpiece of the present invention is to perform chipping at the time of edge trimming by positioning the cutting direction and the tangent of the peripheral edge of the workpiece at an angle exceeding 0 degree in an area closer to the device area. Can be suppressed.

FIG. 1 is a perspective view illustrating an example of a workpiece to be processed by the workpiece processing method according to the first embodiment. FIG. 2 is a cross-sectional view taken along the line II-II in FIG. FIG. 3 is a flowchart showing a flow of a workpiece processing method according to the first embodiment. FIG. 4 is a perspective view illustrating a configuration example of a cutting apparatus used in the workpiece processing method according to the first embodiment. FIG. 5 is a plan view showing a first positioning step of the workpiece processing method according to the first embodiment. FIG. 6 is a side view showing a first cutting process of the workpiece processing method according to the first embodiment. FIG. 7 is a side cross-sectional view illustrating the workpiece after the first cutting step of the workpiece processing method according to the first embodiment. FIG. 8 is a plan view showing a second positioning step of the workpiece processing method according to the first embodiment. FIG. 9 is a side view showing a second cutting step of the workpiece processing method according to the first embodiment. FIG. 10 is a side view showing a first scheduled removal area and a second scheduled removal area of the workpiece processing method according to the first embodiment. FIG. 11 is a side sectional view showing the workpiece after the second cutting step of the workpiece processing method according to the first embodiment. FIG. 12 is a side cross-sectional view illustrating a state where a substrate is attached to a workpiece in a grinding process of the workpiece processing method according to the first embodiment. FIG. 13 is a side cross-sectional view illustrating a grinding step of the workpiece processing method according to the first embodiment. FIG. 14 is a flowchart showing a flow of a workpiece processing method according to the second embodiment. FIG. 15 is a plan view showing a first positioning step of the workpiece processing method according to the second embodiment. FIG. 16 is a side view showing a first cutting step of the workpiece processing method according to the second embodiment. FIG. 17 is a side sectional view showing the workpiece after the first cutting step of the workpiece processing method according to the second embodiment. FIG. 18 is a plan view showing a second positioning step of the workpiece processing method according to the second embodiment. FIG. 19 is a side view illustrating a second cutting step of the workpiece processing method according to the second embodiment. FIG. 20 is a side view illustrating a first scheduled removal area and a second scheduled removal area of the workpiece processing method according to the second embodiment. FIG. 21 is a side sectional view showing the workpiece after the second cutting step of the workpiece processing method according to the second embodiment. FIG. 22 is a plan view showing a positioning step of a processing method for a workpiece according to a modification of each embodiment. FIG. 23 is a diagram showing the size of chipping that occurs when the angle is changed in the processing method according to each embodiment.

  Embodiments for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment 1
The processing method of the to-be-processed object which concerns on Embodiment 1 is demonstrated based on drawing. FIG. 1 is a perspective view illustrating an example of a workpiece to be processed by the workpiece processing method according to the first embodiment. FIG. 2 is a cross-sectional view taken along the line II-II in FIG.

  In the first embodiment, the workpiece W to be processed by the workpiece processing method is a disc-shaped semiconductor wafer or optical device wafer having silicon, sapphire, gallium or the like as a base material, as shown in FIG. is there. The workpiece W has a disk shape, and a device D is formed in a region partitioned by a plurality of division lines L formed in a lattice shape on a flat surface WS. The workpiece W has a plurality of devices D formed on the surface WS. Further, the back surface WR on the back side of the surface WS of the workpiece W is formed flat as shown in FIG. As shown in FIG. 2, the workpiece W is provided with a curved surface CF that is curved in a convex manner on the outer periphery. For this purpose, the workpiece W includes a flat surface WS, a back surface WR, and a curved surface CF that is convexly curved. Further, the workpiece W includes an outer peripheral scheduled removal region ER surrounding a device region DR in which a plurality of devices D are provided. The to-be-removed area ER is an area provided on the outer periphery of the workpiece W and in which the device D is not formed. At least the curved surface CF, the boundary BS between the surface WS and the curved surface CF, and the back surface WR and the curved surface CF. The boundary BR is included. In the workpiece W according to the first embodiment, a metal or a film is formed in the planned removal region ER.

  The processing method of the to-be-processed object which concerns on Embodiment 1 is demonstrated based on drawing. FIG. 3 is a flowchart showing a flow of a workpiece processing method according to the first embodiment. FIG. 4 is a perspective view illustrating a configuration example of a cutting apparatus used in the workpiece processing method according to the first embodiment. FIG. 5 is a plan view showing a first positioning step of the workpiece processing method according to the first embodiment. FIG. 6 is a side view showing a first cutting process of the workpiece processing method according to the first embodiment. FIG. 7 is a side cross-sectional view illustrating the workpiece after the first cutting step of the workpiece processing method according to the first embodiment. FIG. 8 is a plan view showing a second positioning step of the workpiece processing method according to the first embodiment. FIG. 9 is a side view showing a second cutting step of the workpiece processing method according to the first embodiment. FIG. 10 is a side view showing a first scheduled removal area and a second scheduled removal area of the workpiece processing method according to the first embodiment. FIG. 11 is a side sectional view showing the workpiece after the second cutting step of the workpiece processing method according to the first embodiment. FIG. 12 is a side cross-sectional view illustrating a state where a substrate is attached to a workpiece in a grinding process of the workpiece processing method according to the first embodiment. FIG. 13 is a side cross-sectional view illustrating a grinding step of the workpiece processing method according to the first embodiment.

  A processing method for a workpiece according to the first embodiment (hereinafter simply referred to as a processing method) includes a surface WS in a region to be removed ER on the outer periphery of the workpiece W and is processed after being thinned from the surface WS. This is a method in which a portion deeper than the thickness of the workpiece W (shown by parallel oblique lines and intersecting parallel oblique lines in FIG. 10) is removed, so that the workpiece W is so-called edge trimmed, and the workpiece W is thinned. . As shown in FIG. 3, the processing method includes a first positioning step ST1, a first cutting step ST2, a second positioning step ST3, a second cutting step ST4, and a grinding step ST5. The processing method uses the cutting device 1 that is the processing device shown in FIG. 4 in the first positioning step ST1, the first cutting step ST2, the second positioning step ST3, and the second cutting step ST4.

  As shown in FIG. 4, the cutting apparatus 1 includes a chuck table 10 that holds a workpiece W, a cutting means 20 that performs a cutting process on the workpiece W held on the chuck table 10, a chuck table 10, and a cutting tool. X-axis moving means 30 for relatively moving the means 20 in the X-axis direction parallel to the horizontal direction, and the relative movement of the chuck table 10 and the cutting means 20 in the Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction Y-axis moving means 40, Z-axis moving means 50 for relatively moving the chuck table 10 and the cutting means 20 in the Z-axis direction orthogonal to both the X-axis direction and the Y-axis direction, the imaging means 60, and the control Means 100.

  The chuck table 10 holds the workpiece W by placing the workpiece W before processing on the holding surface 10a. The chuck table 10 has a disk shape in which a portion constituting the holding surface 10a is formed of porous ceramic or the like, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown) and placed on the holding surface 10a. The workpiece W is held by being sucked. Further, the chuck table 10 is rotated around an axis parallel to the Z-axis direction by a rotation drive source 11.

  The X-axis moving unit 30 is a processing feeding unit that moves the chuck table 10 in the X-axis direction by moving the chuck table 10 in the X-axis direction together with the rotation drive source 11. The Y-axis moving means 40 is an index feeding means for indexing and feeding the chuck table 10 by moving the cutting means 20 in the Y-axis direction. The Z-axis moving unit 50 is a cutting feed unit that cuts and feeds the cutting unit 20 by moving the cutting unit 20 in the Z-axis direction. The X-axis moving means 30, the Y-axis moving means 40, and the Z-axis moving means 50 are arranged around the well-known ball screws 31, 41, 51 and ball screws 31, 41, 51 provided so as to be rotatable around the axis. And known guide rails 33, 43, 53 for supporting the known pulse motors 32, 42, 52, and the chuck table 10 or the cutting means 20 so as to be movable in the X-axis direction, the Y-axis direction, or the Z-axis direction.

  The cutting means 20 includes a spindle motor (not shown) that rotates about an axis parallel to the Y-axis direction, a spindle motor that is accommodated in the Y-axis direction and the Z-axis direction by the Y-axis moving means 40 and the Z-axis moving means 50. A spindle housing 21 to be moved and a cutting blade 22 attached to the spindle motor are provided. The cutting blade 22 is a cutting grindstone formed in an extremely thin ring shape, and is rotated by a spindle motor around an axis parallel to the Y-axis direction, whereby the workpiece W held on the chuck table 10 is removed. To cut. In Embodiment 1, the thickness of the cutting blade 22 is about 1 mm or more and about 3 mm or less.

  The image pickup means 60 picks up an image of the workpiece W held on the chuck table 10 and is arranged at a position parallel to the cutting means 20 in the X-axis direction. In the first embodiment, the imaging unit 60 is attached to the spindle housing 21. The imaging means 60 is configured by a CCD camera that images the workpiece W held on the chuck table 10.

  The control unit 100 controls the above-described components of the cutting apparatus 1 to cause the cutting apparatus 1 to perform a machining operation on the workpiece W. The control means 100 includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device. And a computer capable of executing a computer program. The arithmetic processing unit of the control means 100 executes a computer program stored in the ROM on the RAM, and generates a control signal for controlling the cutting device 1. The arithmetic processing device of the control means 100 outputs the generated control signal to each component of the cutting device 1 via the input / output interface device. Further, the control means 100 is connected to a display means (not shown) constituted by a liquid crystal display device or the like that displays a processing operation state or an image, or an input means used when an operator registers processing content information or the like. . The input means includes at least one of a touch panel provided on the display means, a keyboard, and the like.

  In the first positioning step ST1, the operator places the back surface WR of the workpiece W on the holding surface 10a of the chuck table 10 of the cutting apparatus 1, and instructs the control means 100 to start processing of the cutting apparatus 1 via the input means. It is implemented by inputting. In the first positioning step ST1, a straight line SL (indicated by a dotted line in FIG. 5) that bisects the thickness of the cutting blade 22 that is the cutting direction of the cutting blade 22 is tangent TG (FIG. 5) of the peripheral edge of the workpiece W. (Indicated by a one-dot chain line). In the first positioning step ST1, the control unit 100 of the cutting apparatus 1 causes the imaging unit 60 to image the workpiece W held on the chuck table 10, and performs alignment between the cutting unit 20 and the workpiece W. As shown in FIG. 5, the cutting blade 22 is positioned on the peripheral edge of the workpiece W in the plan view of the cutting apparatus 1. In the first positioning step ST1, the control means 100 of the cutting device 1 makes an angle θ (shown in FIG. 8) between the straight line SL that bisects the thickness of the cutting blade 22 and the tangent TG of the peripheral edge of the workpiece W. ) Position the chuck table 10 and the cutting blade 22 of the cutting means 20 at a position where 0) is 0 degree. That is, in the first positioning step ST1, the control unit 100 positions the tangent line TG of the peripheral portion of the workpiece W and the cutting blade 22 in parallel in the plan view of the cutting apparatus 1.

  The angle θ formed by the straight line SL that bisects the thickness of the cutting blade 22 and the tangent TG of the peripheral edge of the workpiece W is a straight line that bisects the thickness of the cutting blade 22 in plan view of the cutting device 1. An angle formed by SL and a tangent TG indicated by a one-dot chain line in FIG. 5 at a position overlapping the cutting edge of the cutting blade 22 in the peripheral edge of the workpiece W.

  In the first cutting process ST2, the workpiece W is rotated while the cutting blade 22 is cut into the workpiece W, and the first removal of the planned removal region ER on the peripheral edge on the surface WS side of the workpiece W is performed. This is a step of removing the planned area ER1. In the first cutting step ST2, the control means 100 rotates the cutting blade 22 of the cutting means 20 to move the cutting blade 22 in the Z-axis direction to the Z-axis moving means 50 as shown in FIG. By rotating the chuck table 10 around the axis of the rotation drive source 11 while cutting the cutting blade 22 into at least the first scheduled removal region ER1 of the removal planned region ER of the workpiece W, The first removal scheduled region ER1 on the surface WS side is removed over the entire circumference.

  In the first embodiment, as shown in FIG. 10, the first planned removal area ER1 refers to a portion of the planned removal area ER that includes the boundary BS and is closer to the curved surface CF than the boundary BS. The first planned removal region ER1 may include a portion closer to the center of the workpiece W than the boundary BS. After the first cutting step ST2, as shown in FIG. 7, the workpiece W has the first scheduled removal region ER1 on the surface WS side removed over the entire circumference. In the first embodiment, the first cutting step ST2 is a portion located from the outer periphery to the inner periphery of the curved surface CF of the workpiece W from 2 mm to 3 mm and at a depth of about 100 μm to 150 μm from the surface WS (FIG. 10) (represented by parallel diagonal lines).

  The second positioning step ST3 bisects the thickness of the cutting blade 22 that is the cutting direction of the cutting blade 22, and a straight line SL shown by a dotted line in FIG. 8 and an alternate long and short dash line in FIG. This is a step of positioning the cutting blade 22 at an angle θ that exceeds 0 degree with the tangent TG indicated by. In the first embodiment, the angle θ exceeding 0 degrees formed by the straight line SL that bisects the thickness of the cutting blade 22 and the tangent TG of the peripheral edge of the workpiece W is 5 degrees or more.

  In the second positioning step ST3, the control means 100 positions the cutting blade 22 on the peripheral edge of the workpiece W in a plan view of the cutting device 1 as shown in FIG. 8 based on the alignment result. In the second positioning step ST3, the control means 100 chucks at a position where the angle θ formed by the straight line SL that bisects the thickness of the cutting blade 22 and the tangent TG of the peripheral edge of the workpiece W is 5 degrees or more. The table 10 and the cutting blade 22 of the cutting means 20 are positioned.

  In the second cutting step ST4, the workpiece W is rotated while cutting the cutting blade 22 into the workpiece W, and the second scheduled removal area ER2 of the scheduled removal area ER is removed from the workpiece W. It is a process. In the second cutting step ST4, the control means 100 rotates the cutting blade 22 of the cutting means 20 to move the cutting blade 22 in the Z-axis direction to the Z-axis moving means 50 as shown in FIG. By rotating the chuck table 10 around the axis center of the rotary drive source 11 while cutting the cutting blade 22 into the second scheduled removal area ER2 of the workpiece W, the second scheduled removal area from the workpiece W is obtained. ER2 is removed over the entire circumference.

  In the first embodiment, the second scheduled removal area ER2 includes the boundary BS in the planned removal area ER and includes a portion closer to the center of the workpiece W than the boundary BS, as shown in FIG. In the invention, the second scheduled removal region ER2 only needs to include a region closer to the device region DR of the workpiece W than the first scheduled removal region ER1. After the second cutting step ST4, as shown in FIG. 11, the workpiece W has the first scheduled removal area ER1 and the second scheduled removal area ER2 on the surface WS side removed over the entire circumference. Yes. In the first embodiment, the second cutting step ST4 is, for example, from 1 mm to 1.5 mm from the corner on the surface WS side formed by the first cutting step ST2 of the workpiece W to the inner peripheral side and the surface WS. The portion located at a depth of about 10 μm to 20 μm (shown by crossed diagonal lines in FIG. 10) is removed.

  The grinding step ST5 is a step of grinding the back surface WR of the workpiece W, thinning the workpiece W, and removing the planned removal region ER. In the grinding step ST5, as shown in FIG. 12, the substrate SB is adhered to the surface WS side of the workpiece W. The substrate SB is formed in a disk shape made of a hard material. The outer diameter of the substrate SB is slightly larger than the outer diameter of the workpiece W.

  In the grinding step ST5, as shown in FIG. 13, the substrate SB is sucked and held on the holding surface 71a of the chuck table 71 of the grinding device 70, and the grinding wheel 72 is brought into contact with the back surface WR of the workpiece W, thereby holding the chuck The table 71 and the grinding wheel 72 are rotated around the axis, and the back surface WR of the workpiece W is ground. As a result, the grinding step ST5 thins the workpiece W and removes the removal scheduled region ER from the workpiece W over the entire circumference.

  In the processing method according to the first embodiment, the straight line SL that bisects the thickness of the cutting blade 22 and the tangent TG of the peripheral edge of the workpiece W are formed in the second positioning step ST3 in plan view of the cutting device 1. The chuck table 10 and the cutting blade 22 of the cutting means 20 are positioned at a position where the angle θ exceeds 0 degree and desirably 5 degrees or more. In the second cutting step ST4, the cutting blade 22 is removed in the region ER to be removed. The removal target region ER is removed from the workpiece W by cutting into the second planned removal region ER2 including the region closer to the device region DR than the first removal planned region ER1. For this reason, it is possible to suppress chipping generated on the outer periphery of the workpiece W after removing the planned removal region ER, and in particular, the straight line SL that bisects the thickness of the cutting blade 22 and the peripheral portion of the workpiece W. When the angle θ formed with the tangent TG exceeds 0 degree and is 5 degrees or more, chipping hardly occurs on the outer periphery of the workpiece W. As a result, the processing method according to the first embodiment can remove the planned removal region ER without causing chipping of the workpiece W during edge trimming.

  In addition, the machining method according to the first embodiment is positioned at a position where the angle θ formed by the straight line SL that bisects the thickness of the cutting blade 22 and the tangent TG of the peripheral edge of the workpiece W is 0 degree. Is removed in the first cutting step ST2, the angle θ formed by the straight line SL that bisects the thickness of the cutting blade 22 and the tangent TG of the peripheral edge of the workpiece W exceeds 0 degree. Since the second planned removal region ER2 including the region closer to the device region DR than the first planned removal region ER1 is removed at the position, the second chipping generated when the first planned removal region ER1 is removed is the second. Can be removed when removing the intended removal region ER2. As a result, the processing method according to the first embodiment can suppress the occurrence of chipping in the vicinity of the device region DR. Therefore, the processing method according to the first embodiment can suppress the occurrence of chipping of the workpiece W during edge trimming, and form a scratch on the device D after joining the workpiece W in the subsequent process. There is an effect that it can be suppressed.

[Embodiment 2]
The processing method of the to-be-processed object which concerns on Embodiment 2 is demonstrated based on drawing. FIG. 14 is a flowchart showing a flow of a workpiece processing method according to the second embodiment. FIG. 15 is a plan view showing a first positioning step of the workpiece processing method according to the second embodiment. FIG. 16 is a side view showing a first cutting step of the workpiece processing method according to the second embodiment. FIG. 17 is a side sectional view showing the workpiece after the first cutting step of the workpiece processing method according to the second embodiment. FIG. 18 is a plan view showing a second positioning step of the workpiece processing method according to the second embodiment. FIG. 19 is a side view illustrating a second cutting step of the workpiece processing method according to the second embodiment. FIG. 20 is a side view illustrating a first scheduled removal area and a second scheduled removal area of the workpiece processing method according to the second embodiment. FIG. 21 is a side sectional view showing the workpiece after the second cutting step of the workpiece processing method according to the second embodiment. 14 to 21, the same parts as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The workpiece processing method according to the second embodiment (hereinafter simply referred to as a processing method) includes the surface WS in the area to be removed ER-2 on the outer periphery of the workpiece W, as in the first embodiment. A portion deeper than the thickness of the workpiece W after the thinning is removed from the surface WS (shown by parallel oblique lines and intersecting parallel oblique lines in FIG. 20), so that the workpiece W is so-called edge trimmed and processed. This is a method of thinning the object W. As shown in FIG. 14, the processing method includes a first positioning step ST1-2, a first cutting step ST2-2, a second positioning step ST3-2, and a second cutting step ST4-2. And grinding step ST5. In the first positioning step ST1-2, the first cutting step ST2-2, the second positioning step ST3-2, and the second cutting step ST4-2, the processing method is the same as in the first embodiment. A cutting device 1 which is a processing device shown in FIG.

  In the first positioning step ST1-2, the operator places the back surface WR of the workpiece W on the holding surface 10a of the chuck table 10 of the cutting apparatus 1, and the control means 100 performs the processing of the cutting apparatus 1 via the input means. This is implemented by inputting a start instruction. In the first positioning step ST1-2, a straight line SL (indicated by a dotted line in FIG. 15) that bisects the thickness of the cutting blade 22 that is the cutting direction of the cutting blade 22 and a tangent TG ( 15 is a step of positioning the cutting blade 22 at an angle θ exceeding 0 degrees. In the second embodiment, the angle θ exceeding 0 degrees formed by the straight line SL that bisects the thickness of the cutting blade 22 and the tangent TG of the peripheral edge of the workpiece W is 5 degrees or more.

  In the first positioning step ST1-2, the control unit 100 of the cutting apparatus 1 causes the imaging unit 60 to image the workpiece W held on the chuck table 10, and aligns the cutting unit 20 and the workpiece W. As shown in FIG. 15, the cutting blade 22 is positioned on the peripheral edge of the workpiece W in the plan view of the cutting device 1. In the first positioning step ST1-2, the control unit 100 of the cutting device 1 makes the angle θ formed by the straight line SL that bisects the thickness of the cutting blade 22 and the tangent TG of the peripheral edge of the workpiece W be 5 degrees. The chuck table 10 and the cutting blade 22 of the cutting means 20 are positioned at the above positions.

  In the first cutting step ST2-2, the workpiece W is rotated while cutting the cutting blade 22 from the surface WS of the workpiece W to remove the peripheral region ER of the peripheral portion on the surface WS side of the workpiece W. -2 is a step of removing the first scheduled removal region ER1-2. In the first cutting step ST2-2, the control unit 100 rotates the cutting blade 22 of the cutting unit 20 to cause the Z-axis moving unit 50 to move the cutting blade 22 in the Z-axis direction as shown in FIG. By rotating the chuck table 10 around the axis center to the rotational drive source 11 while cutting the cutting blade 22 into at least the first scheduled removal area ER1-2 of the removal planned area ER-2 of the workpiece W. The first removal scheduled area ER1-2 on the surface WS side of the workpiece W is removed over the entire circumference. After the first cutting step ST2-2, as shown in FIG. 17, the workpiece W has the first scheduled removal region ER1-2 on the surface WS side removed over the entire circumference.

  In the second positioning step ST3-2, a straight line SL indicated by a dotted line in FIG. 18 that bisects the thickness of the cutting blade 22 that is the cutting direction of the cutting blade 22 is shown in FIG. This is a step of positioning in the tangential line TG direction indicated by a one-dot chain line. In the second positioning step ST3-2, the control unit 100 places the cutting blade 22 on the peripheral edge of the workpiece W in the plan view of the cutting device 1 as shown in FIG. Position. In the second positioning step ST3-2, the control unit 100 has an angle θ (shown in FIG. 15) formed by the straight line SL that bisects the thickness of the cutting blade 22 and the tangent TG of the peripheral edge of the workpiece W. The chuck table 10 and the cutting blade 22 of the cutting means 20 are positioned at a position of 0 degree. That is, in the second positioning step ST3-2, the control unit 100 positions the tangent TG of the peripheral edge of the workpiece W and the cutting blade 22 in parallel in the plan view of the cutting device 1.

  In the second cutting step ST4-2, the workpiece W is rotated while cutting the cutting blade 22 into the workpiece W, and the second scheduled removal region ER2-2 of the planned removal region ER-2 is covered. This is a step of removing from the workpiece W. In the second cutting step ST4-2, the control means 100 rotates the cutting blade 22 of the cutting means 20 and causes the Z-axis moving means 50 to move the cutting blade 22 in the Z-axis direction as shown in FIG. Then, the cutting blade 22 is cut into the second scheduled removal region ER2-2 of the workpiece W while the chuck table 10 is rotated around the axis center by the rotation drive source 11, thereby the second from the workpiece W. The removal scheduled area ER2-2 is removed over the entire circumference.

  In the second embodiment, the second planned removal area ER2-2 refers to a portion of the removal planned area ER-2 that includes the boundary BS and is closer to the curved surface CF than the boundary BS, as shown in FIG. In the present invention, the second scheduled removal region ER2-2 may include a portion closer to the center of the workpiece W than the boundary BS.

  In the second embodiment, the first scheduled removal area ER1-2 includes the boundary BS in the scheduled removal area ER-2 and is closer to the center of the workpiece W than the boundary BS, as shown in FIG. In the present invention, the first scheduled removal region ER1-2 only needs to include a region closer to the device region DR of the workpiece W than the second scheduled removal region ER2-2. After the second cutting step ST4-2, as shown in FIG. 21, the workpiece W has the first scheduled removal area ER1-2 and the second scheduled removal area ER2-2 on the surface WS side all around. Has been removed.

  As in the first embodiment, the grinding step ST5 is a step of grinding the back surface WR of the workpiece W using the grinding device 70 to thin the workpiece W and remove the planned removal region ER-2. is there.

  The processing method according to the second embodiment includes a straight line SL that bisects the thickness of the cutting blade 22 and a tangent line TG of the peripheral edge of the workpiece W in a plan view of the cutting device 1 in the first positioning step ST1-2. The chuck table 10 and the cutting means 20 are positioned at a position where the angle θ is greater than 0 degree and desirably 5 degrees or more, and the cutting blade 22 is to be removed in the first cutting step ST2-2. The second scheduled removal region ER2-2 is cut into the first planned removal region ER1-2 including the region closer to the device region DR, and the planned removal region ER-2 is removed from the workpiece W. For this reason, chipping generated on the outer periphery of the workpiece W after removing the planned removal area ER-2 can be suppressed, and in particular, the straight line SL that bisects the thickness of the cutting blade 22 and the peripheral edge of the workpiece W When the angle θ formed by the tangent line TG of the part exceeds 0 degree and is 5 degrees or more, chipping hardly occurs on the outer periphery of the workpiece W. As a result, the processing method according to the second embodiment can remove the to-be-removed region ER-2 without causing chipping on the workpiece W during edge trimming.

  Further, the machining method according to the second embodiment is positioned at a position where the angle θ formed by the straight line SL that bisects the thickness of the cutting blade 22 and the tangent TG of the peripheral edge of the workpiece W is 0 degree. Between the straight line SL that bisects the thickness of the cutting blade 22 and the tangent line TG of the peripheral edge of the workpiece W before the removal scheduled region ER2-2 is removed in the second cutting step ST4-2. Is positioned at a position exceeding 0 degree and the first scheduled removal region ER1-2 including the region closer to the device region DR than the second scheduled removal region ER2-2 is removed. Since 2 is not cut into the metal or film of the surface WS when removing 2, chipping can be suppressed. In addition, since the first planned removal region ER1-2 has already been removed before the second cutting step ST4-2 is performed, the volume to be removed in the second cutting step ST4-2 can be reduced. In addition, it is not necessary to slow down the feed rate in the second cutting step ST4-2, and it is not necessary to use the cutting blade 22 having a large abrasive grain size in the second cutting step ST4-2.

[Modification]
The processing method of the workpiece which concerns on the modification of each embodiment is demonstrated based on drawing. FIG. 22 is a plan view showing a positioning step of a processing method for a workpiece according to a modification of each embodiment. In FIG. 22, the same reference numerals are given to the same portions as those of the embodiments, and the description thereof is omitted.

  In the processing method of the workpiece according to the modification, in the second positioning step ST3 of the first embodiment and the first positioning step ST1-2 of the second embodiment, the angle θ is 90 degrees in plan view of the cutting device 1. The chuck table 10 and the cutting blade 22 of the cutting means 20 are positioned at such positions. Thus, the processing method of the workpiece of this invention is the cutting blade 1 in planar view of the cutting device 1 in the second positioning step ST3 of the first embodiment and the first positioning step ST1-2 of the second embodiment. The chuck table 10 and the cutting means 20 are positioned at a position where the angle θ formed by the straight line SL that bisects the thickness 22 and the tangent TG of the peripheral edge of the workpiece W exceeds 0 °, and preferably the angle θ is 5 The chuck table 10 and the cutting means 20 are positioned at a position where the angle θ is 90 degrees or less, and more preferably, the chuck table 10 and the cutting means 20 are positioned at a position where the angle θ is 90 degrees.

  Next, the inventors of the present invention have confirmed the chipping suppression effect of the workpiece processing method according to the present invention. In confirmation, the magnitude | size of the chipping which generate | occur | produces in the boundary of the area | region cut and the uncut surface when removing the removal plan area | region ER and ER-2 from the surface WS side of the workpiece W was measured. FIG. 23 is a diagram showing the size of chipping that occurs when the angle is changed in the processing method according to each embodiment. In FIG. 23, the average value of the chipping size is indicated by diamonds.

  According to FIG. 23, it has been clarified that the size of chipping can be suppressed as the angle θ is gradually increased from 0 degree. Therefore, according to FIG. 23, it is clear that chipping can be suppressed during edge trimming by setting the angle θ to an angle exceeding 0 degree. Further, according to FIG. 23, it has been clarified that no chipping occurs when the angle θ is 5 degrees or more. Therefore, according to FIG. 23, it has been clarified that chipping can be more reliably suppressed during edge trimming by setting the angle θ to 5 degrees or more. Further, according to FIG. 23, it has been clarified that by setting the angle θ to 90 degrees, chipping can be more reliably suppressed during edge trimming.

  In addition, this invention is not limited to the said Embodiment 1, Embodiment 2, and a modification. That is, various modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Cutting device 10 Chuck table 20 Cutting means 22 Cutting blade 30 X-axis moving means (moving means)
40 Y-axis moving means (moving means)
50 Z-axis moving means (moving means)
100 Control means
ER planned removal area ER-2 planned removal area ER1 first planned removal area ER1-2 first planned removal area ER2 second planned removal area ER2-2 second planned removal area D device DR device area SL straight line ( Cutting direction)
TG Tangent W Workpiece WS Surface ST1 First positioning step ST1-2 First positioning step ST2 First cutting step ST2-2 First cutting step ST3 Second positioning step ST3-2 Second positioning step ST4 Second cutting process ST4-2 Second cutting process θ angle

Claims (4)

A workpiece processing method for removing a region to be removed from the outer periphery of a disk-shaped workpiece having a plurality of devices formed on the surface,
A first positioning step of positioning the cutting direction of the cutting blade in the tangential direction of the peripheral edge of the workpiece;
A first cutting step of removing the first planned removal region by rotating the workpiece while cutting the cutting blade into the workpiece;
A second positioning step of positioning the cutting blade at an angle in which the cutting direction of the cutting blade and the tangent to the peripheral edge of the workpiece exceed 0 degrees;
A second cutting step of rotating the work piece while cutting the cutting blade into the work piece to remove a second scheduled removal area, and
The method for processing a workpiece, wherein the second scheduled removal region includes a region closer to the device region than the first scheduled removal region. A processing method of a workpiece for removing a planned removal area on the outer periphery of a disk-shaped workpiece,
A first positioning step of positioning the cutting blade at an angle where a cutting direction of the cutting blade and a tangent to the peripheral edge of the workpiece exceed 0 degrees;
A first cutting step of removing the first planned removal region by rotating the workpiece while cutting the cutting blade from the surface of the workpiece;
A second positioning step of positioning the cutting direction of the cutting blade in the tangential direction of the peripheral edge of the workpiece;
A second cutting step of rotating the workpiece while cutting the cutting blade to remove a second scheduled removal region, and
The method for processing a workpiece, wherein the first scheduled removal region includes a region closer to the device region than the second scheduled removal region.   The workpiece processing method according to claim 1, wherein the angle exceeding 0 degrees is 5 degrees or more. The workpiece processing method according to claim 1, wherein the angle exceeding 0 degrees is 90 degrees.

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