JP2018186116A - Board working device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable imaging the work center of a working head more properly.SOLUTION: A board working device includes: a working head for performing a predetermined work on a substrate; and a camera having a lens arranged offset in a predetermined direction with respect to the work center of a working head so as to allow imaging directly below the work center of the working head and an imaging element arranged offset in the predetermined direction with respect to the optical axis center of the lens.SELECTED DRAWING: Figure 3

Description

  The present specification discloses an anti-substrate working apparatus.

  2. Description of the Related Art Conventionally, a substrate work apparatus has been proposed that performs a predetermined work using a work head that can move in the X and Y directions on a substrate that has been fed to a predetermined position by a feeding device (see, for example, Patent Document 1). In this apparatus, a reference plate provided with a large number of reference marks is sent to a predetermined position by a feeding device, and then all the reference marks are sequentially picked up by a camera that moves together with the work head. It is assumed that the movement amount of the head is acquired and corrected.

JP-A-4-345445

  However, in the above-described apparatus, there may be an error between the imaging center of the camera and the work center of the work head due to manufacturing errors or assembly errors of each member of the apparatus, distortion caused by changes over time, and the like. . In this case, even if correction is made to the movement amount of the head based on the image captured by the camera, the correction is not appropriate for the actual work center of the work head, and the work accuracy may be reduced. In addition, in order to eliminate the influence of such errors, it may be possible to arrange the camera obliquely so that the imaging center of the camera faces the work center of the work head, but distortion and blurring occur in the captured image. Therefore, it may be difficult to calculate an appropriate correction value from the image.

  The main object of the present disclosure is to enable more appropriate imaging of the work center of the work head.

  The present disclosure has taken the following measures in order to achieve the main object described above.

  The substrate work apparatus according to the present disclosure includes a work head that performs a predetermined work on the substrate, and an offset in a predetermined direction with respect to the work center of the work head so that an image can be captured immediately below the work center of the work head. And a camera having an imaging element arranged offset in the predetermined direction with respect to the optical axis center of the lens.

  A substrate work apparatus according to the present disclosure includes a work head, a lens arranged offset in a predetermined direction with respect to the work center of the work head, and a lens And a camera having an image pickup device arranged to be offset in a predetermined direction with respect to the center of the optical axis. As a result, it is possible to take an image of the work head, the lens, and the imaging element that are offset, that is, a so-called tilt arrangement, directly under the work center of the work head. For this reason, it is possible to capture an image immediately below the work center of the work head with less distortion and blurring without turning the camera obliquely. As a result, the work center of the work head can be captured more appropriately, and the work accuracy of the work head can be improved using the captured image.

FIG. 2 is a configuration diagram showing a configuration of a component mounting apparatus 10. FIG. 3 is a block diagram relating to control of the component mounting apparatus 10. Explanatory drawing which shows the positional relationship of the suction nozzle 24 and the mark camera 25. FIG. Explanatory drawing which shows a typical optical path. Explanatory drawing which shows the image of the reference | standard mark imaged with the mark camera 25. FIG. The flowchart which shows an example of a mounting process routine. The flowchart which shows a mark detection process. Explanatory drawing which shows the mode of correction | amendment based on the upper surface height of the board | substrate S. FIG. The flowchart which shows the mounting process routine of a modification.

  Next, an embodiment of the present disclosure will be described with reference to the drawings. FIG. 1 is a configuration diagram showing the configuration of the component mounting apparatus 10. FIG. 2 is a block diagram relating to the control of the component mounting apparatus 10. The component mounting apparatus 10 is an apparatus that performs a mounting process for mounting a component on the substrate S. The mounting process includes a process of placing, mounting, inserting, joining, and adhering components on a substrate. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG.

  As shown in FIGS. 1 and 2, the component mounting apparatus 10 includes a board transfer unit 12, a mounting unit 13, a component supply unit 14, and a control device 40. In addition to these components, the component mounting apparatus 10 includes a parts camera 30 that captures an image of the components sucked by the mounting head 22 (suction nozzle 24) of the mounting unit 13 from below.

  The substrate transport unit 12 is a unit that carries in, transports, fixes and unloads the substrate S at the mounting position. The substrate transport unit 12 transports the substrate S by a pair of conveyor belts provided at intervals in the front-rear direction of FIG. 1 and spanned in the left-right direction. In addition, the component mounting apparatus 10 includes a board height sensor 18 (see FIG. 2) that measures the height of the upper surface (mounting surface) of the board S fixed at the mounting position. The substrate height sensor 18 is configured as, for example, a non-contact type sensor such as a laser type or a contact type displacement sensor such as a touch sensor.

  The mounting unit 13 collects components from the component supply unit 14 and arranges them on the substrate S fixed to the substrate transport unit 12. The mounting unit 13 includes a head moving unit 20 and a mounting head 22. The head moving unit 20 includes a slider that is guided by a guide rail and moves in the XY directions, and a motor that drives the slider. The mounting head 22 is detachably mounted on the slider and is moved in the XY direction by the head moving unit 20. One or more suction nozzles 24 are detachably mounted on the lower surface of the mounting head 22. The suction nozzle 24 is a collection member that collects parts using negative pressure. The mounting head 22 has a built-in Z-axis motor 23, and the Z-axis motor 23 moves the suction nozzle 24 up and down along the Z direction. The mounting head 22 includes a rotating device that rotates (spins) the suction nozzle 24 by a drive motor (not shown), and can adjust the angle of the component held (sucked) by the suction nozzle 24. When the mounting head 22 is configured as a rotary head in which a plurality of suction nozzles 24 are mounted so as to be rotatable in the circumferential direction, one suction nozzle 24 moved to a predetermined work position is moved by a Z-axis motor 23. Move up and down.

  A mark camera 25 is disposed on the lower surface side of the mounting head 22 (or slider). The mark camera 25 moves in the XY directions as the mounting head 22 moves. The mark camera 25 images the reference mark attached to the upper surface of the substrate S, images the upper surface of the component supplied by the component supply unit 14, and outputs the image to the control device 40. FIG. 3 is an explanatory diagram showing the positional relationship between the suction nozzle 24 and the mark camera 25. When a plurality of suction nozzles 24 are mounted on the lower surface of the mounting head 22, FIG. 3 shows the suction nozzles 24 in a working position that can be moved up and down in the Z direction. For this reason, for example, a position on the substrate S immediately below the suction nozzle 24 (center Nc) shown in FIG. 3 is a component mounting position. Further, the position immediately below the suction nozzle 24 shown in FIG.

  As shown in FIG. 3, the mark camera 25 includes, for example, an image sensor 26 having a rectangular image surface in which a plurality of light receiving elements such as a CCD are two-dimensionally arranged, and a CCTV lens disposed obliquely below the image sensor 26. And a lens 27. The image sensor 26 and the lens 27 are disposed in a housing 25 a that is attached to the lower surface of the mounting head 22. In the present embodiment, the center Nc (work center) of the suction nozzle 24 at the work position, the center Lc (optical axis center) of the lens 27, and the center Ic (imaging center) of the image sensor 26 (image plane) are: The suction nozzle 24 and the mark camera 25 (the image sensor 26 and the lens 27) are configured so as to be offset in the front-rear direction (Y direction). That is, the lens 27 is arranged so that the center Lc of the lens 27 is offset backward with respect to the center Nc of the suction nozzle 27, and the center Ic of the imaging element 26 is offset backward with respect to the center Lc of the lens. The so-called tilting arrangement in which the image pickup element 26 is arranged so as to become is as follows.

  Here, the schematic optical path in the positional relationship of FIG. 3 is shown in FIG. As shown in the figure, the focal length of the lens 27 disposed at the position L in the Z direction is defined as the focal length f, and the front focal point ff away from the position L toward the imaging target by the focal length f, and the upper side from the position L And a rear focal point fr that is separated by a focal length f on the image sensor 26 side. Further, a distance Z is defined from the front focal point ff to the upper surface of the imaging target (for example, the substrate S), and a distance Z ′ is defined from the rear focal point fr to the image plane I of the image sensor 26. In addition, a target range for imaging on the upper surface of the substrate S is set as a target range t, a distance y from the front end position in the Y direction to the center Lc of the lens 27 in the target range t, and The distance y ′ is the distance from the rear end position in the Y direction on the image plane. The target range t is a range centered on the center Nc of the suction nozzle 24. It is assumed that light from the target range t travels on an optical path indicated by a dotted line in the figure. For convenience of explanation, it is assumed that the lens 27 is in a wide range, and light is bent at the positions L (1), L (2), and the like. From this schematic diagram and the general relationship between the focal length f and imaging, the following equations (1) and (2) are established. Further, for the magnification M, which is the ratio between the size of the target range t to be imaged and the size of the image formed on the image plane of the image sensor 26, the following relational expression (3) is generally established. . In the present embodiment, these formulas (1) to (3), the target range t necessary for imaging an imaging target object such as a reference mark on the substrate S, the size of the usable image sensor 26, and the usable lens are used. The distances y and y ′ can be determined so as to satisfy the distance 27, the focal length f thereof, the distances Z and Z ′ that can be taken from the layout constraints of the image sensor 26 and the lens 27, and the like. In this way, as a tilt arrangement for imaging the target range t, distances y and y suitable for offsetting the center Nc of the suction nozzle 24, the center Lc of the lens 27, and the center Ic of the imaging element 26 are used. 'Will be decided.

y / y '= Z / f ... (1)
y / y '= f / Z' ... (2)
M = y / y '... (3)

  Thus, the component mounting apparatus 10 sets the position immediately below the suction nozzle 24 at the work position as the imaging range of the mark camera 25 without arranging the mark camera 25 (the lens 27 and the imaging element 26) obliquely. be able to. For this reason, for example, the reference mark can be imaged by the mark camera 25 in a state where the substrate S is positioned so that the reference mark of the substrate S is directly below the suction nozzle 24. FIG. 5 is an explanatory diagram showing an image of the reference mark imaged by the mark camera 25. 5A shows an image of the present embodiment adopting the tilt arrangement, and FIG. 5B shows a mark camera so that the center of the lens coincides with the center of the image sensor without adopting the tilt arrangement. The image of the comparative example imaged by tilting is shown. As shown in the drawing, in the present embodiment, the reference mark (black circle in the figure) can be appropriately captured by suppressing the distortion of the captured image and the blur of the image due to the depth of field as compared with the comparative example. .

  The component supply unit 14 supplies components from the front side of the component mounting apparatus 10, and as shown in FIG. 1, the components are arranged so as to be aligned in the left-right direction (X direction), and components can be supplied by tape. A tape feeder 15 and a tray feeder 16 capable of supplying parts by a tray are provided. The tape feeder 15 supplies the components by pulling out the tape, in which the components are accommodated in the recesses formed at predetermined intervals, from the reel. The tray feeder 16 supplies parts using a tray in which the parts are aligned and arranged.

  As shown in FIG. 2, the control device 40 is configured as a microprocessor centered on a CPU 41, and includes a ROM 42 that stores a processing program, an HDD 43 that stores various data, a RAM 44 used as a work area, an external device and an electrical device. An input / output interface 45 for exchanging signals is provided. These are connected via a bus 46. The control device 40 outputs control signals to the substrate transport unit 12, the mounting unit 13, the component supply unit 14, and the parts camera 30, and the mounting unit 13 (mark camera 25), the component supply unit 14, the substrate height sensor 18, A signal from the part camera 30 is input.

  The following is a description of the mounting process of the component mounting apparatus 10 of the present embodiment configured as described above. FIG. 6 is a flowchart illustrating an example of a mounting process routine executed by the CPU 41 of the control device 40. This routine is stored in the HDD 43 of the control device 40, and is executed by a mounting process start instruction from an operator via an input device (not shown).

  When this routine is started, the CPU 41 of the control device 40 performs a carry-in process of the substrate S by the substrate transfer unit 12 (S100), and executes a mark detection process for detecting the reference mark of the substrate S (S110). The mark detection process of S110 is performed based on the flowchart shown in FIG. In this mark detection procedure, the CPU 41 moves the mounting head 22 onto the reference mark of the substrate S (S200). In S <b> 200, the CPU 41 moves the mounting head 22 to a predetermined position where the center Nc of the suction nozzle 24 at the work position is located immediately above the reference mark of the substrate S. Next, the CPU 41 captures an image of the reference mark on the substrate S with the mark camera 25 (S210). Subsequently, the CPU 41 acquires the upper surface height of the substrate S from the substrate height sensor 18 (S220), and corrects the image captured in S210 based on the upper surface height of the substrate S (S230).

  FIG. 8 is an explanatory diagram showing a state of correction based on the upper surface height of the substrate S. FIG. 8 shows a case where the upper surface height of the substrate S is displaced to a position Su shifted by Δh above the reference or displaced to a position Sd shifted by Δh below. As described above, in the present embodiment, the mark camera 25 images the target range t immediately below the suction nozzle 24 by the tilt arrangement. The target range t is a range determined on the substrate S at the reference upper surface height. The optical axis connecting the center point C, which is the position on the nozzle center Nc in the target range t, the center point of the lens 27, and the center point of the image sensor 26 is inclined by an angle θ with respect to the nozzle center Nc. . As shown in the enlarged view of FIG. 8, when the upper surface height of the substrate S is displaced to a position Su shifted by Δh upward, the center point C of the target range t becomes a position Cu shifted backward by Δy. Further, the distance Z from the front focal point ff to the upper surface of the substrate S becomes the distance (Z−Δh), and the magnification M also changes. On the other hand, when the upper surface height of the substrate S is displaced to a position Sd shifted downward by Δh, the center point C of the target range t becomes a position Cd shifted forward by Δy. Further, the distance Z becomes the distance (Z + Δh), and the magnification M also changes. The relationship between the positional deviation amount Δy of the center point C of the target range t and the displacement Δh of the upper surface height of the substrate S is expressed by the following equation (4) using the angle θ of the optical axis. Further, the angle θ can be determined as the following equation (5) using the distance Z, the focal length f, the target range t, and the distance y. In the correction process of S230, the CPU 41 uses these formulas (4) and (5) and the above-described formulas (1) to (3) to shift the position at the top surface height of the substrate S displaced by Δh with respect to the reference. Changes in the amount Δy and the magnification M can be calculated, and the position and magnification M in the captured image can be corrected. Then, the CPU 41 detects the position of the reference mark from the corrected image (S240), and ends the mark detection process. The CPU 41 detects the position of the reference mark, for example, by extracting an area where the color (pixel value), shape, number of pixels, etc. of the reference mark match from the image. As described above, the image captured by the mark camera 25 suppresses image distortion due to image distortion and depth of field, so that the reference mark can be detected with high accuracy.

Δy = Δh ・ tanθ ・ ・ ・ (4)
tanθ = (yt / 2) / (Z + f) ... (5)

  When the reference mark is detected in this way, the CPU 41 moves the mounting head 22 to a supply position where the component supply unit 14 supplies the component (S120), and causes the suction nozzle 24 to suck the component (S130). Note that the CPU 41 lifts and lowers the suction nozzle 24 at the work position by driving the Z-axis motor 23 to suck parts. Further, the CPU 41 repeats the suction operation as many times as the number of suction nozzles 24 provided in the mounting head 22. Then, the CPU 41 corrects the mounting position of the component based on the position of the reference mark detected in the mark detection process of S110 (S140), moves the mounting head 22 to the corrected mounting position of the component (S150), and the component. Is implemented (S160). The CPU 41 repeats the mounting operation of S140 to S160 by the number of suction nozzles 24 provided in the mounting head 22.

  Here, in the case where the mark camera 25 is configured so that the center Lc of the lens 27 and the center Ic of the image sensor 26 coincide with each other and captures a vertically lower part of the mark camera 25, the CPU 41 determines the position of the reference mark. It is necessary to correct the mounting position of the component on the basis of the deviation and the distance between the mark camera 25 and the suction nozzle 24. In that case, when the mounting head 22 moves by the distance between the mark camera 25 and the suction nozzle 24, it is caused by a manufacturing error or assembly error of the guide rail or slider of the head moving unit 20, an assembly error, a distortion caused by a change with time, or the like. Thus, an error may occur in the movement position (distance) due to pitching or yawing of the mounting head 22. If such an error occurs, the CPU 41 cannot appropriately correct the position of the suction nozzle 24, which may affect the component mounting accuracy. The component mounting apparatus 10 of the present embodiment images the reference mark located immediately below the suction nozzle 24 at the working position by the tilt arrangement, detects the position of the reference mark from the captured image, and detects the reference mark. The mounting position of the component is corrected based on the position. Therefore, the CPU 41 can correct the mounting position of the component without taking into account the distance between the mark camera 25 and the suction nozzle 24 based on the displacement of the reference mark position. As described above, the CPU 41 can directly correct the position of the center Nc of the suction nozzle 24 without being affected by an error caused by distortion or the like, so that the component mounting accuracy can be improved.

  The CPU 41 returns to S120 and repeats the processing until it determines that the processing of all the components to be mounted on the current board S is completed (S170). When the CPU 41 determines in S170 that the processing of all components scheduled to be mounted on the current substrate S has been completed, the substrate transport unit 12 carries out the substrate S (S180), and the mounting processing routine ends. .

  Here, the correspondence between the constituent elements of the present embodiment and the constituent elements of the substrate work apparatus of the present disclosure will be clarified. The mounting head 22 of this embodiment corresponds to a working head of the present disclosure, the lens 27 corresponds to a lens, the image sensor 26 corresponds to an image sensor, the mark camera 25 corresponds to a camera, and the component mounting apparatus 10 It corresponds to a substrate working device. The substrate height sensor 18 corresponds to a detection sensor, and the control device 40 (CPU 41) corresponds to an image processing device and a control device.

  The component mounting apparatus 10 according to the embodiment described above is offset backward in the Y direction with respect to the center Nc of the suction nozzle 24 so as to be able to capture an image directly below the center Nc of the suction nozzle 24 at the working position of the mounting head 22. The mark camera 25 having the lens 27 arranged in this manner and the image sensor 26 arranged offset from the center Lc of the lens 27 in the Y direction rearward is provided. For this reason, by the tilt arrangement in which the suction nozzle 24, the lens 27, and the image pickup element 26 are offset, an image immediately below the center Nc of the suction nozzle 24 can be captured with distortion and blurring suppressed.

  The component mounting apparatus 10 performs image processing so as to correct the position of the reference mark in the image captured by the mark camera 25 based on the height of the upper surface of the substrate S detected by the substrate height sensor 18. For this reason, even if the upper surface height of the substrate S varies, the position of the reference mark can be detected appropriately. Accordingly, it is possible to accurately correct the mounting position based on the position of the reference mark.

  Further, the component mounting apparatus 10 controls the mark camera 25 so as to capture an image in a state where the center Nc of the suction nozzle 24 is positioned on the reference mark provided on the substrate S, and the position of the reference mark from the captured image. The mounting head 22 is controlled so as to mount the component by correcting the mounting position based on the detected position of the reference mark. For this reason, it is possible to accurately detect the position of the reference mark by capturing an image of the reference mark with distortion and blurring suppressed by the tilt arrangement. Further, the component mounting apparatus 10 detects the position of the reference mark from the image captured by the mark camera 25 in a state where the center Nc of the suction nozzle 24 of the mounting head 22 is positioned on the reference mark, and corrects the mounting position. Thus, the mounting accuracy of the components can be improved by directly correcting the position of the center Nc of the suction nozzle 24 during the mounting operation.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  In the above-described embodiment, the image correction processing is performed based on the upper surface height of the substrate S detected using the substrate height sensor 18. However, the present invention is not limited to this, and the image is based on the upper surface height of the substrate S. The correction processing may not be performed.

  In the embodiment described above, both the position of the reference mark and the magnification are corrected when the correction process based on the upper surface height of the substrate S is performed in the mark detection process, but at least the position of the reference mark is corrected. It suffices that the magnification is not corrected. Since the CPU 41 can accurately detect the reference mark area from an image in which distortion and blurring are suppressed, the CPU 41 can detect the position (center position) of the reference mark from the detected area even if the magnification is slightly changed. Is possible.

  In the above-described embodiment, when the reference mark on the substrate S is detected, an image is captured by the mark camera 25, and the mounting position of the component is corrected based on the position of the reference mark detected from the captured image. In addition to this, processing using an image captured by the mark camera 25 may be performed. FIG. 9 is a flowchart illustrating a mounting process routine according to a modification. In the flowchart of FIG. 9, the same steps as those in the flowchart of FIG.

  In the mounting process routine of the modified example, when the CPU 41 moves the mounting head 22 to the component supply position in S120, the mark camera 25 moves the upper surface of the component to be suctioned directly below the center Nc of the suction nozzle 24, that is, at the supply position. An image is taken (S122). In S120, the CPU 41 moves the mounting head 22 so that the suction nozzle 24 at the work position is directly above the supply position of the component, and the component in which distortion and blurring are suppressed by the mark camera 25 arranged in a tilted manner. It is possible to take a top image of Next, the CPU 41 corrects the position of the center Nc of the suction nozzle 24 based on the captured image (S124). In S124, the CPU 41 acquires an appropriate suction position (for example, a center position) on the upper surface of the component from the captured image, and controls the head moving unit 20 so that the suction nozzle 24 at the work position moves on the acquired suction position. To do. The CPU 41 can accurately correct the position of the suction nozzle 24 using the upper surface image with reduced distortion and blur captured by the mark camera 25. Here, since the components supplied from the tape feeder 15 may be displaced in the recesses formed at predetermined intervals on the tape, the CPU 41 causes the suction nozzle 24 to suck the components with the center of the recess as the supply position. Adsorption failure may occur. For example, the suction nozzle 24 may not be able to suck a component, or the sucked component may fall while the mounting head 22 is moving. Therefore, the CPU 41 finely adjusts the position of the suction nozzle 24 so as to be positioned on the appropriate suction position on the upper surface of the component in S122 and S124, thereby improving the sampling accuracy of the component and preventing the occurrence of suction failure. Can do.

  In addition, when the supplied component has a characteristic portion on the upper surface and the CPU 41 needs to recognize the position, shape, orientation, etc. of the characteristic portion of the component, distortion and blurring captured by the mark camera 25 are suppressed. The feature portion can be appropriately recognized using the top image of the selected component. In addition, as a characteristic part of components, the light emission part which light-emits, the connection part to which another component is connected, etc. are mentioned, for example. Further, the tray used by the tray feeder 16 may be supplied in a state in which components are arranged up to the position on the front end side in the Y direction. In that case, the suction nozzle 24 can move on all components, but the mark camera 25 may not be able to move directly above the components on the front end side due to restrictions on the movement range of the mounting head 22. Even in such a case, the mark camera 25 of the present embodiment can capture an image immediately below the center Nc of the suction nozzle 24, and thus can appropriately capture the front end part. Therefore, the CPU 41 can appropriately perform the position correction of the suction nozzle 24 and the recognition of the characteristic part of the component.

  Further, when the mounting head 22 is moved to the component mounting position in S150, the CPU 41 images the mounting target portion with the mark camera 25 (S152), and corrects the position of the suction nozzle 24 based on the captured image (S154). ). In step S150, the CPU 41 moves the mounting head 22 so that the suction nozzle 24 at the work position is directly above the component mounting position, and the mounting target location in which distortion and blurring are suppressed by the mark camera 25 arranged in a tilted manner. Can be imaged. For this reason, since the CPU 41 can accurately acquire the position of the land or the like that is the mounting position of the component from the captured image, when the center Nc of the suction nozzle 24 at the work position is shifted from the mounting position, S154. To correct the deviation. As described above, when mounting each component, the CPU 41 finely adjusts the mounting position by capturing the image immediately below the suction nozzle 24 with the mark camera 25 and correcting the position of the suction nozzle 24 based on the captured image. Therefore, each component can be mounted with higher accuracy. Note that the CPU 41 may perform the correction based on the height of the upper surface of the substrate S described above even when correcting in S124 and S154.

  In the above-described embodiment, the component mounting apparatus that performs the component mounting process on the substrate S has been described as the substrate working apparatus. However, the substrate S such as a coating apparatus that applies a viscous fluid (such as an adhesive) to the substrate S is described. Any device that performs a predetermined operation on the device may be used.

  The substrate work apparatus according to the present disclosure may be configured as follows.

  In the substrate work apparatus according to the present disclosure, a detection sensor that detects a height of the work surface of the substrate, and an image picked up by an image picked up by the camera based on the height of the work surface detected by the detection sensor And an image processing apparatus that performs image processing so as to correct the position of the object. In this way, even if there is a variation in the height of the work surface of the substrate, it is possible to cope with an image obtained by capturing an image directly under the work center of the work head. For this reason, regardless of variations in the height of the work surface of the substrate, it is possible to appropriately improve the work accuracy of the work head using an image obtained by capturing an image immediately below the work center of the work head.

  In the substrate work apparatus according to the present disclosure, the work head performs a mounting operation for collecting the component and mounting the component by aligning a work center with a mounting position of the substrate as the predetermined operation. Controlling the camera to image directly under the work center in a state where the work center of the work head is located on the reference mark provided on the camera, and detecting the position of the reference mark from an image captured by the camera; A control device that controls the work head so as to mount the component by correcting the mounting position based on the detected position of the reference mark may be provided. In this way, it is possible to accurately detect the position of the reference mark by capturing an image of the reference mark with distortion and blurring suppressed by the tilt arrangement. In addition, the position of the work center of the work head at the time of mounting work can be directly determined by detecting the position of the reference mark from the image captured with the work center of the work head positioned on the reference mark and correcting the mounting position. Therefore, it is possible to improve the component mounting accuracy.

  In the substrate work apparatus according to the present disclosure, the control device controls the camera so as to capture an image directly below the work center in a state where the work center of the work head is located on the mounting position, and the image is captured by the camera. The work head may be controlled so that the component is mounted after correcting the displacement of the work center of the work head based on the image. In this way, it is possible to further improve the component mounting accuracy using an image obtained by imaging an area directly below the work center of the work head.

  In the substrate work apparatus according to the present disclosure, the control device controls the camera so as to take an image immediately below the work center in a state where the work center of the work head is located on the sampling position of the component, and the image is picked up by the camera. The work head may be controlled so that the part is picked up after correcting the displacement of the work center of the work head based on the obtained image. In this way, it is possible to further improve the accuracy of component collection using an image obtained by imaging the work head of the work head.

  The present invention can be used in an apparatus that performs operations on a substrate.

  DESCRIPTION OF SYMBOLS 10 Component mounting apparatus, 12 Substrate conveyance unit, 13 Mounting unit, 14 Component supply unit, 15 Tape feeder, 16 Tray feeder, 18 Substrate height sensor, 20 Head moving part, 22 Mounting head, 23 Z-axis motor, 24 Adsorption nozzle , 25 mark camera, 25a housing, 26 imaging device, 27 lens, 30 parts camera, 40 control device, 41 CPU, 42 ROM, 43 HDD, 44 RAM, 45 input / output interface (input / output I / F), 46 bus , F focal length, ff front focus, fr back focus, S substrate, t target range, y, y ′, Z, Z ′ distance.

Claims (5)

A working head for performing a predetermined work on the substrate;
A lens disposed offset in a predetermined direction with respect to the work center of the work head so as to enable imaging immediately below the work center of the work head; and in the predetermined direction with respect to the optical axis center of the lens. A camera having an image sensor disposed offset;
The board | substrate working apparatus provided with. The substrate-working apparatus according to claim 1,
A detection sensor for detecting the height of the work surface of the substrate;
An image processing device that performs image processing so as to correct the position of the imaging object in the image captured by the camera based on the height of the work surface detected by the detection sensor;
The board | substrate working apparatus provided with. The substrate-working apparatus according to claim 1 or 2,
The working head, as the predetermined work, performs a mounting work of collecting the component and mounting the component with the work center being matched with the mounting position of the substrate,
The camera is controlled to take an image directly under the work center in a state where the work center of the work head is located on the reference mark provided on the substrate, and the position of the reference mark is detected from an image taken by the camera. And a control device that controls the work head so as to mount the component by correcting the mounting position based on the detected position of the reference mark. The substrate working apparatus according to claim 3,
The control device controls the camera to take an image immediately below the work center in a state where the work center of the work head is located on the mounting position, and the work of the work head is based on an image captured by the camera. A substrate working apparatus that controls the work head so as to mount the component after correcting a center position shift. The substrate-working apparatus according to claim 3 or 4,
The control device controls the camera to take an image immediately below the work center in a state where the work center of the work head is located on the sampling position of the part, and based on the image taken by the camera, the work head The work head is controlled so that the work head is picked up after correcting the work center misalignment.

Images