JP2018159902A - Optical processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical processor suitable for optical processing on a processing object which sensitive to weak light.SOLUTION: A light directing device 1 for irradiating polarized light which is polarized by a wire grid polarizer unit 20 onto the object W to be aligned, which includes: a light source 10 configured to radiate ultraviolet light; and a wire grid polarizer unit 20. The processing object W is a photosensitive resin composition which has the sensitivity with an integrated light amount required for exposure in a wavelength region of 200 to 400 nm of less than 100 mJ/cm. The light source 10 is a low-pressure discharge lamp 11.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an optical processing apparatus.

  2. Description of the Related Art Conventionally, an optical processing apparatus that performs optical processing by irradiating a processing target with polarized light is known. Generally, a high pressure discharge lamp such as an HID lamp is used as a light source of this type of light processing apparatus (see, for example, Patent Document 1). In particular, a long arc type high-pressure mercury lamp or a metal halide lamp is generally used as a light source of a photo-alignment apparatus for aligning a liquid crystal panel or the like.

JP, 2006-218389, A

When the light source is a high pressure discharge lamp, the light processing device needs to be provided with a high pressure power source and a relatively large-scale cooling mechanism.
Furthermore, when a processing target that is sensitive to weak light is subjected to light processing, the light output of the high-pressure discharge lamp lamp is too high. Therefore, it is necessary to diminish the light from the light source with a neutral density filter or the like and irradiate the processing target.
Therefore, an object of the present invention is to provide an optical processing apparatus suitable for optically processing a processing object that is sensitive to weak light.

The present invention is a light processing apparatus that includes a light source that emits ultraviolet rays, and a wire grid polarizer, and irradiates a processing target with polarized light polarized by the wire grid polarizer, The processing target is a photosensitive resin composition having a sensitivity with an integrated light quantity required for photosensitivity of less than 100 mJ / cm ² in a wavelength range of 200 nm to 400 nm, and the light source is a low pressure discharge lamp or a light emitting element. Features.

  The present invention is characterized in that, in the above-described photoprocessing apparatus, the photosensitive resin composition to be processed is a material having a photosensitive group that causes photocrosslinking, photoisomerization, or photofleece rearrangement.

  In the light processing apparatus according to the aspect of the invention, the light source is a linear light source, and illuminates a high illuminance spot according to the illuminance of the low illuminance spot generated in the processing target due to luminance unevenness in the longitudinal direction of the linear light source. A filter that reduces light or an auxiliary reflection mechanism that increases light is provided.

  The present invention, in the above light processing apparatus, comprises a plurality of the light sources that are linear light sources arranged in parallel with each other, each of the light sources, the low-pressure discharge lamps are arranged in series with a gap, or A plurality of the light emitting elements are linearly arranged with gaps therebetween, and the gaps between the low pressure discharge lamps or the light emitting elements are shifted between the light sources in adjacent rows.

  The present invention provides the above light processing apparatus, comprising: a plurality of the light sources; and a reflection plate provided for each of the light sources, the reflection direction of which is variable, and the object to be processed is irradiated according to the reflection direction of each of the reflection plates. The amount of light to be changed is variable.

  The present invention is characterized in that the light processing apparatus includes an irradiator that houses a plurality of light sources that are linear light sources, and the light sources are arranged in parallel in the irradiator.

  ADVANTAGE OF THE INVENTION According to this invention, the optical processing apparatus suitable for optically processing the process target exposed to weak light is implement | achieved.

It is a figure which shows the structure of the photo-alignment apparatus which concerns on embodiment of this invention. It is a figure which shows schematic structure of an irradiator. It is a top view which shows typically the structure of the light source in an irradiator. It is a figure which expands and shows between the low pressure discharge lamps located in series. It is explanatory drawing which shows rotation of a reflecting plate, (A) shows a non-rotation state, (B) shows a rotation state. It is a figure which shows the ultraviolet-ray (UV) absorption spectrum of sample S1 used for the evaluation test. The integrated light quantity of the polarized light of a wavelength 200nm~400nm varied in the range of 1 mJ / cm ² of 20 mJ / cm ² is a diagram showing an anisotropy measurement results when light treatment. FIG. 8 is a graph of measurement results for sample S1 in FIG. It is the figure which plotted the measurement result about sample S2 in FIG. The integrated light quantity of the polarized light of a wavelength 200nm~400nm varied in the range of 1 mJ / cm ² of 20 mJ / cm ² is a diagram showing the orientation of evaluation results when light treatment. It is a figure which shows schematic structure of the irradiator which concerns on the modification of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram illustrating a configuration of a photo-alignment apparatus 1 according to the present embodiment.
The photo-alignment apparatus 1 is an apparatus that performs an alignment process as an optical process, and irradiates the processing target W with polarized light and performs the alignment process on the processing target W.
As shown in FIG. 1, the photo-alignment apparatus 1 of the present embodiment includes a stage transport base 2, a work stage 4 on which a processing target W is placed, an irradiator installation base 6, and an irradiator 8. .

The stage transport base 2 is a base that extends linearly, and its upper surface is configured as a transport surface 2 </ b> A that transports the work stage 4. The stage transport base 2 is provided with a transport mechanism, and the transport mechanism transports the work stage 4 linearly in the transport direction X.
The irradiator installation base 6 is located at a predetermined distance upward from the stage transport base 2 and in the width direction Y of the stage transport base 2 (in the direction perpendicular to the transport direction X on the transport surface 2A of the stage transport base 2). It is a bridge body spanned over, and is fixedly attached to the stage carrier 2.
The irradiator 8 is a device that irradiates polarized light onto the transport surface 2A immediately below, and is installed in the irradiator installation base 6. When the processing target W placed on the work stage 4 passes directly below the irradiator 8, the processing target W is exposed to the polarized light of the irradiator 8, whereby the processing target W is subjected to orientation processing.

FIG. 2 is a diagram showing a schematic configuration of the irradiator 8.
As shown in FIG. 2, the irradiator 8 includes a plurality of (two in the illustrated example) light sources 10, a reflector 12, and a filter unit 19.

  Each light source 10 is a linear light source that emits linear light extending in the width direction Y of the work stage 4. The light source 10 of the present embodiment includes a low-pressure discharge lamp 11 as a linear light source that emits ultraviolet light having a wavelength of 300 nm to 400 nm and has an output smaller than that of the high-pressure discharge lamp. As the low-pressure discharge lamp 11, a black light or a chemical lamp (that is, a fluorescent lamp) is used. Each of the light sources 10 is arranged in parallel with each other at the same height in the transport direction X.

  The reflection plate 12 is an optical member that is provided for each light source 10 and condenses while reflecting the light from the light source 10 toward the wire grid polarizer unit 20. A cylindrical concave reflecting mirror that extends along the longitudinal direction of the light source 10 is used for the reflecting plate 12 of the present embodiment. The concave surface of the reflecting plate 12 is an ellipsoid, and the light source 10 (the central axis of the low-pressure discharge lamp 11) is disposed at the focal point f of the ellipsoid. Thereby, the light of the light source 10 is condensed by the reflecting plate 12.

  The filter unit 19 includes a wavelength control filter 16, a neutral density filter 18, and a wire grid polarizer unit 20, and these are stacked between the light source 10 and the work stage 4.

The wavelength control filter 16 is an optical filter that transmits light having a wavelength necessary for optical alignment.
The neutral density filter 18 is an optical filter that attenuates transmitted light. As the neutral density filter 18, an ND filter, a mesh filter, or the like is used. The neutral density filter 18 is provided exclusively to suppress illuminance unevenness, and details thereof will be described later.
The wire grid polarizer unit 20 polarizes and emits the transmitted light. By irradiating the processing target W with the polarized light from the wire grid polarizer unit 20, the processing target W is subjected to orientation processing.

  In this photo-alignment apparatus 1, a black light or a chemical lamp is used for the low-pressure discharge lamp 11 of the light source 10, so that the light source 10 generates less heat than the high-pressure discharge lamp. For this reason, the cooling function of the light source 10 can be simplified. Moreover, since neither the black light nor the emitted light of the chemical lamp contains a wavelength component of 300 nm or less, ozone is not generated, and oxidation of the wire grid portion of the wire grid polarizer unit 20 is promoted. It will never happen.

FIG. 3 is a plan view schematically showing the configuration of the light source 10 in the irradiator 8.
Each of the light sources 10 includes low-pressure discharge lamps 11 having the same length or different lengths in accordance with a plurality (three in the illustrated example) of work effective widths. These low-pressure discharge lamps 11 are arranged in series in the width direction Y of the work stage 4 so as to form a linear light source having a length that irradiates light over the entire width range of the processing target W that is long in the width direction Y. In the present embodiment, the total length in the width direction Y of the light source 10 can cover an eleventh generation (G11) mother glass in manufacturing a liquid crystal panel, and can cope with a larger mother glass size.

  Further, each of the light sources 10 is arranged in the length direction of the low-pressure discharge lamp 11 (that is, the width direction Y of the work stage 4) by being shifted from each other by a distance α. Thereby, the gap 15 between the low-pressure discharge lamps 11 in each light source 10 does not overlap in the width direction Y of the work stage 4, and uneven illumination due to the overlap of the gap 15 is suppressed.

FIG. 4 is an enlarged view showing the space between the low-pressure discharge lamps 11 arranged in series.
As shown in the figure, the light source 10 has a plate-like insulator 13 in a gap 15 between the low-pressure discharge lamps 11, and sockets 17 of the low-pressure discharge lamp 11 are arranged on both sides of the insulator 13. Has been. The width β (the length in the width direction Y) of the socket 17 is formed to be 20 mm or less shorter than the off-the-shelf product in order to suppress uneven illuminance due to the gap 15 between the low-pressure discharge lamps 11. It is prevented.
Furthermore, the light source 10 includes a dedicated auxiliary reflector 22 extending in the longitudinal direction of the low-pressure discharge lamp 11 (that is, the width direction Y of the work stage 4) so as to cover the gap 15 of the low-pressure discharge lamp 11. The dedicated auxiliary reflector 22 reflects light leaking from the gap 15 toward the work stage 4, thereby suppressing a decrease in illuminance.

By the way, in the photo-alignment by the photo-alignment apparatus 1, it is desirable that the processing object W is uniformly irradiated with light. In the present embodiment, as described above, each of the light sources 10 is arranged by being shifted by a distance α in the width direction Y of the work stage 4, and each of the light sources 10 employs a socket 17 having a width β of 20 mm or less, In addition, a dedicated auxiliary reflector 22 that covers the gap 15 is provided. Thereby, the illumination nonuniformity by the clearance gap 15 is suppressed favorably.
However, the low-pressure discharge lamp 11 provided in the light source 10 causes luminance unevenness in the longitudinal direction, and due to the luminance unevenness, illuminance unevenness occurs in the light irradiated to the processing target W.
Therefore, the irradiator 8 of the present embodiment includes the above-described neutral density filter 18 in order to cancel out the uneven illuminance.

  Specifically, the neutral density filter 18 reduces the light that illuminates the high illuminance spot in accordance with the illuminance of the low illuminance spot on the irradiation surface of the processing target W. An appropriate number of such neutral density filters 18 are provided in the irradiator 8 at appropriate positions. Thereby, even when the low-pressure discharge lamp 11 has luminance unevenness, unevenness in illuminance due to the luminance unevenness can be suppressed, and the processing object W can be irradiated with uniform light, and high-quality alignment processing can be realized.

  Here, since the light source 10 of the photo-alignment apparatus 1 of the present embodiment emits the light of the low-pressure discharge lamp 11 whose light amount is smaller than that of the high-pressure discharge lamp, the sensitivity is very high that the light is exposed with a relatively weak light amount. Even if it is the process target W, it can align favorably.

Specifically, the photo-alignment apparatus 1 uses the low-pressure discharge lamp 11, so that the photosensitive resin composition having a high sensitivity such that the integrated light amount required for photosensitivity is less than 100 mJ / cm ² is the processing target W. However, this can be favorably oriented. The integrated light quantity is the product of the irradiation light illuminance (unit: mW / cm ² ) and the irradiation time (unit: seconds).

The photosensitive resin composition to be treated W is a composition having a photosensitive group that causes photocrosslinking, photoisomerization, or photofleece rearrangement. Furthermore, the photosensitive resin composition to be processed W has a property of causing anisotropy when the integrated light quantity is in the range of 1 mJ / cm ² to 100 mJ / cm ² .
Such photosensitive resin compositions are used for liquid crystal display elements, liquid crystal lenses, liquid crystal optical elements such as diffraction gratings, or insulating resist materials in general.

In this case, the chemical structure of the site having photosensitivity is arbitrary, but the processing target W is preferably a structure that undergoes a cross-linking reaction, an isomerization reaction, or a photo-Fries rearrangement in response to light, and further undergoes a cross-linking reaction. The chemical structure that occurs is more desirable.
Moreover, it is desirable that the photosensitive resin composition to be processed W has a photosensitive group that reacts with light in a wavelength range of 200 nm to 400 nm (at least 250 nm to 400 nm). Examples of the photosensitive group include cinnamic acid, azobenzene, coumarin, chalcone and the like.

Here, although the light source 10 emits weak light from the low-pressure discharge lamp 11, the processing object W having a very high sensitivity can be satisfactorily light-processed. It is not possible to optically process the processing target W that exceeds the optical output of.
Therefore, the irradiator 8 of the present embodiment is configured such that each of the plurality of reflectors 12 can rotate around the focal point f.

FIG. 5 is an explanatory view showing the rotation of the reflecting plate 12, FIG. 5 (A) shows an unrotated state, and FIG. 5 (B) shows a rotated state.
The irradiator 8 includes a rotation mechanism that rotates each of the reflection plates 12 around a focal point f (a central axis of the low-pressure discharge lamp 11). As shown in FIG. 5A, the reflecting direction K of the reflected light of the reflecting plate 12 (the optical axis of the reflecting plate 12) is directed downward, that is, the reflecting directions K of the reflecting plate 12 are parallel to each other. In comparison, as shown in FIG. 5B, the light of the light source 10 is synthesized by crossing the reflection directions K by the rotation of the reflection plate 12, and the illuminance in the processing target W (irradiating the processing target W is irradiated). Light intensity). This illuminance can be arbitrarily changed according to the rotation angle of the reflecting plate 12. As a result, even with a processing target W in which the amount of light required for exposure exceeds the light output of the light source 10, light processing can be performed with appropriate illuminance.
Needless to say, in addition to the light synthesis by the rotation of the reflecting plate 12, the integrated light quantity may be adjusted by changing the transport speed of the work stage 4.

Next, an optical processing evaluation test by the photo-alignment apparatus 1 of the present embodiment will be described.
In this evaluation test, a product (model: RN-3993) having a sensitivity between wavelengths of 300 nm to 400 nm is used as the photosensitive resin composition of the processing target W.

(Anisotropy evaluation test)
In the anisotropy test, the anisotropy generated in the processing target W by irradiation with polarized light was evaluated. In addition, two samples S1 and S2 having different temperatures at the time of main baking were prepared and tested as the photosensitive resin composition to be processed W.
Specifically, both of the two samples S1 and S2 are made of a quartz material for the substrate, and pre-baked for 90 seconds using a 70 ° C. hot press. And sample S1 is main-baked by baking for 20 minutes using a 150 degreeC hot press, and sample S2 is main-baked by baking for 20 minutes using a 160 degreeC hot press.

FIG. 6 shows the ultraviolet (UV) absorption spectrum of sample S1.
As shown in the figure, the sample S1 has a relatively high absorbance in a wavelength range of 200 nm to 300 nm, and the absorbance is substantially equal to zero at a wavelength of 350 nm or more.

  Note that the ultraviolet absorption spectrum of the sample S2 shows almost the same tendency as the sample S1.

  In the anisotropy test, a chemical lamp was used as the low-pressure discharge lamp 11 of the light source 10 of the photo-alignment apparatus 1, and a special wavelength control filter manufactured by Eye Graphics Co., Ltd. was used as the wavelength control filter 16. Further, as a comparative test, a test was also performed when light processing was performed without using the wavelength control filter 16.

FIG. 7 shows measurement results of anisotropy generated in samples S1 and S2 by changing the integrated light amount of polarized light having a wavelength of 200 to 400 nm in the range of 1 mJ / cm ² to 20 mJ / cm ² and performing light treatment. FIG. Each numerical value in FIG. 7 is a relative value normalized by the maximum value of the measurement results of both samples S1 and S2. 8 and 9 are graphs of the measurement results of FIG. 7, FIG. 8 shows the measurement results of sample S1, and FIG. 9 shows the measurement results of sample S2.
These 7 as shown in FIG. 9, sample S1, S2 are both or baking temperatures, with or without a long wavelength pass filter, integrated light quantity is high at between 2 mJ / cm ² of 6 mJ / cm ² different Showed directionality.
On the other hand, in the range where the integrated light quantity exceeds 6 mJ / cm ² , the anisotropy of both the samples S1 and S2 decreases as the integrated light quantity increases. In particular samples S1, integrated light quantity anisotropy becomes larger than 15 mJ / cm ² does not occur, the sample S2, the integrated light quantity becomes large when the anisotropic than 12 mJ / cm ² did not occur.

(Orientation evaluation)
In the orientation test, the orientation produced in the processing object W by irradiation with polarized light was evaluated. Moreover, as the photosensitive resin composition to be processed W, two samples S3 and S4 having different temperatures during the main baking were used for the test.
Specifically, in both the samples S3 and S4, ITO solid glass is used for the substrate, and pre-baking is performed for 90 seconds using a 70 ° C. hot press. And sample S3 is main-baked by baking for 20 minutes using a 150 degreeC hot press, and sample S4 is main-fired by baking for 20 minutes using a 160 degreeC hot press.

  Note that the ultraviolet absorption spectra of the samples S3 and S4 show almost the same tendency as the sample S1.

  The light source 10 and the wavelength control filter 16 of the photo-alignment apparatus 1 are the same as in the anisotropy evaluation test.

FIG. 10 is a diagram showing the evaluation results of the orientation produced in samples S3 and S4 by changing the integrated light quantity of polarized light having a wavelength of 200 to 400 nm in the range of 1 mJ / cm ² to 20 mJ / cm ² and performing the light treatment. It is.
As shown in the figure, in each of the samples S3 and S4, the orientation using the wavelength control filter 16 was better in a wide range of integrated light quantity. In addition, the sample S3 had better orientation in a wider range of integrated light quantity than the sample S4.

Specifically, in the sample S3, when the wavelength control filter 16 is not used, the accumulated amount of light orientation in the range of 3 mJ / cm ² of 9 mJ / cm ² was good. When the wavelength control filter 16 was used, the orientation was good when the integrated light quantity was in the range of 3 mJ / cm ² to 7 mJ / cm ² .
On the other hand, in the sample S4, it is good orientation in a range integrated light quantity from 3 mJ / cm ² of 5 mJ / cm ² in the case of the wavelength control filter 16 is not used, also, 7 mJ / cm from 1 mJ / cm ^{2 Even in} the range of ^2, the orientation was relatively good. When the wavelength control filter 16 was used, the orientation was good when the integrated light quantity was in the range of 3 mJ / cm ² to 5 mJ / cm ² .
Furthermore, in samples S3 and S4, both were non-oriented even after the light treatment, regardless of the presence or absence of the wavelength control filter 16, in the range where the integrated light quantity was 15 mJ / cm ² or more.

According to these evaluation tests, the photosensitive resin composition of the processing object W can be satisfactorily oriented with a weak integrated light quantity of several mJ / cm ² regardless of the presence or absence of the wavelength control filter 16. Indicated. Further, it is shown that a sufficiently good alignment treatment can be performed without actively limiting the wavelength using the wavelength control filter 16.

As described above, in the optical alignment apparatus 1 of the present embodiment, the light source 10 includes the low-pressure discharge lamp 11 and the alignment process is performed with the light from the low-pressure discharge lamp 11.
Thereby, it is possible to perform a good alignment process using a highly sensitive photosensitive resin composition that is sensitive to a minute light amount of less than 100 mJ / cm ² in the wavelength range of 200 to 400 nm as the processing object W.
In addition, since the light source 10 has a low output, the configuration of the photo-alignment apparatus 1 is simplified because the light source 10 requires less capacity and power than the configuration in which the light source 10 includes a high-pressure discharge lamp, for example. And cost can be reduced. In addition to this, the wavelength control filter 16 and the wire grid polarizer unit 20 are also prevented from being deteriorated by the heat of the light source 10.

  Moreover, according to this embodiment, the photosensitive resin composition which is the processing target W is a material having a photosensitive group that causes photocrosslinking, photoisomerization, or photofleece rearrangement. Thereby, a liquid crystal display element, a liquid crystal lens, a liquid crystal optical element such as a diffraction grating, or a photosensitive resin composition used for all insulating resist materials can be suitably subjected to light treatment.

Further, in the photo-alignment apparatus 1 of the present embodiment, the light source 10 includes a straight tube type low-pressure discharge lamp 11, and the high illuminance is set in accordance with the illuminance of the low-illuminance location generated in the processing target W due to uneven brightness of the low-pressure discharge lamp 11. A neutral density filter 18 is provided to reduce the light that illuminates the spot.
Thereby, the uneven illuminance of the processing target W caused by the uneven brightness of the light source 10 is suppressed.

The photo-alignment device 1 of the present embodiment includes a plurality of light sources 10, each light source 10 includes a low-pressure discharge lamp 11 arranged in series, and the light sources 10 are arranged in parallel. Adjacent light sources 10 are arranged such that a gap 15 between the low-pressure discharge lamps 11 arranged in series is shifted, and a dedicated auxiliary reflector 22 is provided in the gap 15.
Thereby, since the light source 10 includes the low-pressure discharge lamps 11 arranged in series, the large processing target W can be optically processed. Further, the adjacent light sources 10 are arranged such that the gap 15 between the low-pressure discharge lamps 11 arranged in series is shifted, and the dedicated auxiliary reflector 22 is provided in the gap 15. Is suppressed.

In addition, the optical alignment apparatus 1 of the present embodiment includes a plurality of light sources 10 and a reflection plate 12 that is provided for each light source 10 and has a variable reflection direction K, and is processed according to the reflection direction K of each reflection plate 12. The amount of light irradiated on W is variable.
As a result, even when the sensitivity of the processing target W is low and the light cannot be exposed with only the light amount of one light source 10, the light from the plurality of light sources 10 can be combined to increase the illuminance for exposure.

Moreover, the photo-alignment apparatus 1 of the present embodiment includes an irradiator 8 in which a plurality of light sources 10 in which a plurality of low-pressure discharge lamps 11 are arranged in series are arranged in parallel.
Thereby, not only the full width range of the processing target W whose width direction Y is longer than the full length of the low pressure discharge lamp 11 but also light in a wide range in the direction perpendicular to the width direction Y (the parallel direction of the manual pressure discharge lamps 11). Can be irradiated. Further, the gap 15 between the low-pressure discharge lamps 11 in each light source 10 does not overlap in the width direction Y of the work stage 4, and uneven illuminance due to the overlap of the gap 15 is suppressed.

  The above-described embodiment is merely an example of one aspect of the present invention, and can be arbitrarily modified and applied within the scope of the gist of the present invention.

FIG. 11 is a diagram showing a schematic configuration of an irradiator 108 according to a modification of the present invention.
In the embodiment described above, the illuminance unevenness of the processing target W caused by the luminance unevenness of the light source 10 is suppressed by providing the neutral density filter 18. On the other hand, as shown in FIG. 11, a side auxiliary reflector 118 that increases the illuminance at a low illuminance point may be provided.
The side auxiliary reflector 118 constitutes an auxiliary reflection mechanism that increases light that illuminates a low illuminance spot on the irradiation surface of the processing target W and increases the illuminance at the low illuminance spot. An appropriate number of side auxiliary reflectors 118 are provided at appropriate positions between both side surfaces inside the irradiator 108 and between the light sources 10.
According to this modification, even when the low-pressure discharge lamp 11 has luminance unevenness, it is possible to suppress unevenness in illuminance caused by the luminance unevenness and irradiate the processing target W with uniform light.

In the above-described embodiment, the light source 10 of the irradiator 8 includes the low-pressure discharge lamp 11, but this is not a limitation. For example, a light emitting element such as an LED that emits ultraviolet rays may be used.
In this case, for example, a light emitting element having a rectangular light emitting surface as long as the low pressure discharge lamp 11 may be used as the light source 10. Alternatively, a linear light source in which a plurality of light emitting elements are linearly arranged with a gap may be used as the light source 10.
Even when the light source 10 composed of a light emitting element has luminance unevenness in the longitudinal direction, the above-described neutral density filter 18 and auxiliary reflection mechanism (side auxiliary reflection 118) are used to suppress uneven illumination on the irradiated surface. be able to.
Further, when the light source 10 that is a linear light source is configured by arranging a plurality of light emitting elements in a straight line with a gap, when the plurality of light sources 10 are arranged in parallel, the light sources 10 in adjacent rows emit light. It is preferable to dispose the gaps between the elements.

  For example, the light source 10 may be a medium pressure UV lamp. In this case, when the processing target W is exposed with a small amount of light, the light from the light source 10 is reduced by a dimming means such as an ND filter, as necessary.

  Further, for example, in the above-described embodiment, the optical alignment apparatus 1 is illustrated as an example of the optical processing apparatus, but the present invention is not limited to this and can be applied to arbitrary optical processing.

1 Photo-alignment device (light processing device)
8, 108 Irradiator 10 Light source 11 Low-pressure discharge lamp 12 Reflector 13 Insulator 15 Gap 16 Wavelength control filter 18 Neutral filter (filter)
19 Filter unit 20 Wire grid polarizer unit 22 Dedicated auxiliary reflector 118 Side auxiliary reflector (auxiliary reflection mechanism)
K Reflection direction W Process target X Transport direction Y Width direction f Focus α Distance β Width

Claims (6)

A light processing device having a light source that emits ultraviolet light, and a wire grid polarizer, and irradiating the processing object with polarized light polarized by the wire grid polarizer,
The object to be treated is a photosensitive resin composition having a sensitivity with an integrated light amount required for photosensitivity of less than 100 mJ / cm ² in a wavelength range of 200 nm to 400 nm,
The light source is a low-pressure discharge lamp or a light-emitting element. The photoprocessing apparatus according to claim 1, wherein the photosensitive resin composition to be processed is a material having a photosensitive group that causes photocrosslinking, photoisomerization, or photofleece rearrangement. The light source is a linear light source;
A filter that reduces light that illuminates a high illuminance spot or an auxiliary reflection mechanism that increases light according to the illuminance of a low illuminance spot that occurs in the processing target due to luminance unevenness in the longitudinal direction of the linear light source. Item 3. The optical processing device according to item 1 or item 2. A plurality of light sources that are linear light sources arranged in parallel with each other;
Each of the light sources, the low-pressure discharge lamps are arranged in series with a gap, or a plurality of the light emitting elements are linearly arranged with a gap,
The light processing apparatus according to claim 1, wherein a gap between the low pressure discharge lamps or the light emitting elements is shifted between the light sources in adjacent rows. A plurality of the light sources;
A reflection plate provided for each light source and having a variable reflection direction;
The light processing apparatus according to claim 1, wherein the amount of light applied to the processing target is variable depending on a reflection direction of each of the reflection plates. An illuminator containing a plurality of light sources that are linear light sources;
In the irradiator, the light sources are arranged in parallel.
The optical processing apparatus according to claim 1, wherein

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