JP2018146639A - Optical transceiver - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical transceiver capable of efficiently arranging an internal fiber. An optical transceiver according to an embodiment receives an external optical connector between ROSA 12 that converts an optical signal into an electric signal, TOSA 11 that converts an electric signal into an optical signal, and the optical connector. A circuit board 13 on which a receptacle for transmitting and receiving optical signals, each of TOSA11 and ROSA12, an internal fiber F for optically connecting the receptacle, and a circuit for processing an electric signal are mounted, and each of ROSA12 and TOSA11 are circuit boards. A first holding member 30 and a second holding member 40 for holding the 13 are provided. The first holding member 30 and the second holding member 40 have a plurality of grooves 32, 33, 42, 43 that guide the internal fiber F. [Selection diagram] FIG. 18

Description

  The present invention relates to an optical transceiver.

  Patent Document 1 describes an optical transceiver in which a flat printed board, ROSA, and TOSA are arranged inside a casing. This optical transceiver includes four TOSAs arranged in parallel to each other and one ROSA. A printed circuit board is provided on the back side of four TOSA and one ROSA. Each of TOSA and ROSA is connected to the printed circuit board by soldering the FPC.

JP, 2006-55767, A

  In the above-described optical transceiver, the number of components arranged in the inside increases, and the components and the wiring connecting the components are complicated. Along with this, it is required to efficiently arrange the internal fibers wired inside the optical transceiver.

  An object of this invention is to provide the optical transceiver which can arrange | position an internal fiber efficiently.

  An optical transceiver according to an aspect of the present invention receives a ROSA that converts an optical signal into an electrical signal, a TOSA that converts an electrical signal into an optical signal, and an external optical connector, and transmits the optical signal to and from the optical connector. A receptacle for transmitting and receiving, each of ROSA and TOSA, an internal fiber for optically connecting the receptacle, a circuit board on which a circuit for processing an electrical signal is mounted, and each of ROSA and TOSA are held on the circuit board. And a holding member, the holding member having a plurality of grooves for guiding the internal fiber.

  According to the present invention, the internal fiber can be efficiently arranged.

FIG. 1 is a perspective view illustrating an optical transceiver according to an embodiment. FIG. 2 is a perspective view showing the internal structure of the optical transceiver of FIG. 3 is an exploded perspective view of the optical transceiver of FIG. FIG. 4 is a side view showing the OSA, FPC, and circuit board. FIG. 5 is a perspective view showing a first holding member of the optical transceiver of FIG. 6 is a perspective view of the first holding member of FIG. 5 as viewed from the opposite side of FIG. FIG. 7 is a perspective view showing a second holding member of the optical transceiver of FIG. 8 is a perspective view of the second holding member of FIG. 7 as viewed from the opposite side of FIG. FIG. 9 is a plan view showing components of the optical transceiver of FIG. FIG. 10 is a perspective view showing the OSA, the circuit board, and the first holding member. FIG. 11A is a perspective view showing a multiplexer (demultiplexer). FIG. 11B is a diagram schematically showing the internal structure of the duplexer (multiplexer). FIG. 12 is a perspective view showing a multiplexer (demultiplexer), an internal fiber, and a simple connector. FIG. 13 is a cross-sectional view showing an OSA, a circuit board, and a circuit mounted on the circuit board inside the housing. FIG. 14 is a perspective view showing the OSA, FPC, and circuit board. FIG. 15 is a perspective view showing a state where a simple connector is attached to the OSA of FIG. FIG. 16 is a perspective view showing a state where the simple connector, the multiplexer (demultiplexer), and the first holding member are attached to the OSA. FIG. 17 is a perspective view showing a state where the first holding member is attached to the OSA of FIG. FIG. 18 is a perspective view showing a state in which a multiplexer (demultiplexer) and a second holding member are attached to each component of FIG. FIG. 19 is a perspective view showing a state in which the intermediate assembly is assembled by temporarily fixing the multiplexer (demultiplexer) to the first holding member. FIG. 20 is a perspective view showing a state in which the intermediate assembly of FIG. 19 is incorporated in the upper housing. FIG. 21 is a perspective view showing a state where the receptacle is mounted on the upper housing of FIG. FIG. 22 is a perspective view showing an example in which the components shown in FIG. 15 are first assembled in the upper housing. FIG. 23 is a perspective view showing a state where internal fibers are wired on the OSA and the circuit board of FIG.

  Hereinafter, embodiments of an optical transceiver and a manufacturing method thereof according to the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and repeated description is omitted as appropriate.

  FIG. 1 is a perspective view showing an optical transceiver 1 according to the embodiment. The optical transceiver 1 is a so-called CFP8 module whose standard specifications are determined in the industry. The optical transceiver 1 drives an NRZ signal having a communication speed of 25 Gbps on both the transmission side and the reception side with a PAM4 (Pulse Amplitude Modulation) signal, thereby causing 50 Gbps per wavelength. By installing two optical subassemblies (OSAs) each having 50 Gbps × 4 wavelengths, a transmission capacity of 400 Gbps in total for 8 lanes is achieved.

  The optical transceiver 1 includes a housing 2, and the housing 2 includes an upper housing 7 and a lower housing 8. The outer dimension of the housing 2 conforms to the CFP8 standard. For example, the length of the housing 2 is 106 mm, the width of the housing 2 is 40 mm, and the height of the housing 2 is 9.5 mm.

  The housing 2 is provided with a receptacle 4 that receives an external optical connector that is an LC connector. Hereinafter, the terms “front-rear direction”, “up-down direction”, and “left-right direction” are used in the drawings, but these terms are for convenience based on the illustrated state. In the following description, the upper direction is the direction in which the upper housing 7 is provided as viewed from the lower housing 8, the front direction is the direction in which the receptacle 4 is provided as viewed from the housing 2, and the left-right direction is the width direction of the housing 2. is there.

  The receptacle 4 is formed at the center in the left-right direction of the housing 2. Pull tabs 5 extend forward from the left and right sides of the housing 2. The left and right sides of the housing 2 are each provided with a slider 6 that slides in conjunction with the movement of the pull tab 5 in the front-rear direction. The rear end of the slider 6 has a protrusion 6a that pushes the tab formed in the cage of the host system. . The protrusion 6a pushes and expands the tab in synchronism with the slide of the slider 6 to the front side, so that the engagement between the tab and the housing 2 can be released and the optical transceiver 1 can be removed from the cage. Further, as described above, the height of the housing 2 is about 10 mm and is slightly larger than the width of the slider 6. Thereby, the mounting density of the optical transceiver 1 to the host system can be increased.

  FIG. 2 is a perspective view showing the internal structure of the optical transceiver 1 with a part of the upper housing 7 cut away. FIG. 3 is an exploded perspective view of the optical transceiver 1. In the optical transceiver 1, the above-described receptacle 4, a multiplexer (Optical-Multiplexer: O-Mux) 9 and a duplexer (Optical-De-Multiplexer: O-DeMux) 10 located on the left and right sides of the receptacle 4 are provided. , TOSA11, ROSA12, circuit board 13, and FPC14 are arranged.

  The optical transceiver 1 transmits and receives signal light having different wavelengths of 8 lanes on both the transmission side and the reception side. The optical signal of 8 lanes is separated into 4 lanes on the long wavelength side and 4 lanes on the short wavelength side by the multiplexer 9 and the demultiplexer 10, respectively, and optically coupled to each of the TOSA 11 and the ROSA 12. In the following description, each of the TOSA 11 and the ROSA 12 may be referred to as an OSA (optical subassembly) 50.

  The receptacle 4 is optically connected to the OSA 50 via the internal fiber F and the simple connector C. The multiplexer 9 is connected to one internal fiber F extending from the receptacle 4 and two internal fibers F toward the TOSA 11. The duplexer 10 is connected to two internal fibers F extending from the ROSA 12 and one internal fiber F toward the receptacle 4.

  Two TOSAs 11 and two ROSAs 12 are arranged behind the multiplexer 9 and the duplexer 10. These OSAs 50 perform photoelectric conversion of optical signals and electrical signals. Two internal fibers F extending from the multiplexer 9 and the duplexer 10 are connected to each OSA 50 via a simple connector C. Each internal fiber F is connected to the optical connection unit of each OSA 50. Optical components such as a lens and an isolator are built in the optical connection unit of the OSA 50.

  For example, the multiplexer 9 and the duplexer 10 have the same shape and the same size. The multiplexer 9 and the duplexer 10 have projecting portions 9a and 10a projecting rearward at the bottom portions 9b and 10b. From each of the multiplexer 9 and the demultiplexer 10, three internal fibers F are drawn out in a pigtail manner.

  The internal fiber F includes a first internal fiber F1 and a second internal fiber F2. Each of the multiplexer 9 and the duplexer 10 is connected to the receptacle 4 via the first internal fiber F1. Further, each of the multiplexer 9 and the duplexer 10 is connected to the simple connector C via the second internal fiber F2.

  Each OSA 50 is mounted on the circuit board 13 via a first holding member 30 and a second holding member 40 described later. Thereby, the connection location of the FPC 14 and the circuit board 13 extending from each OSA 50 can be protected (reinforced). Therefore, connection reliability can be improved. The circuit board 13 mounts a circuit that is electrically connected to the OSA 50 via the FPC 14. The circuit board 13 is disposed on the rear side of the OSA 50. The circuit board 13 includes a first circuit board 15 located on the upper side and a second circuit board 16 located on the lower side. On the first circuit board 15, two LD drivers 17, a DSP (Digital Signal Processor) 18, a preamplifier IC and the like facing the two TOSAs 11 are mounted. The DSP 18 is mounted at the center of the first circuit board 15. The DSP 18 is a signal conversion IC that converts a binary signal of 25 Gbps into a quaternary modulation signal, and performs signal processing on the transmission side 8 signal and the reception side 8 signal.

  The second circuit board 16 is connected to the first circuit board 15 located on the upper side by a stack connector. By using the stack connector, it is possible to realize connection in a space-saving manner as compared with the FPC, and it is also possible to cope with high-frequency signals. The first circuit board 15 has circuit components mounted on both sides thereof, and the second circuit board 16 has circuit components mounted only on the upper surface thereof.

  Further, the optical transceiver 1 has a plug substrate 23 that is separated from the circuit board 13 behind the circuit board 13. The plug substrate 23 engages with an electrical connector provided in the host system cage. 100 or more electrodes are densely arranged on the electrical connector and the plug substrate 23.

  Therefore, in order to ensure the accuracy of the relative position between the electrical connector and the plug substrate 23, it is necessary to increase the engagement force between the electrical connector and the plug substrate 23, and the insertion / extraction force of the optical transceiver 1 with respect to the electrical connector is large. In order to prevent the stress exerted on the plug board 23 when the optical transceiver 1 is inserted and removed from being applied to the circuit board 13 and to firmly engage the plug board 23 with the electrical connector, the plug board 23 is separated from the circuit board 13. The body.

  As shown in FIG. 4, each OSA 50 includes rectangular packages 11a and 12a and terminals 11b and 12b drawn out only from the rear side. The packages 11 a and 12 a have terminals 11 b and 12 b only in the longitudinal direction of the optical transceiver 1 and only on the opposite side of the receptacle 4. The bottom surfaces 11 c and 12 c of the packages 11 a and 12 a are in contact with the inner surface of the upper housing 7. That is, each OSA 50 is mounted inside the upper housing 7 in an upside down state.

  5 and 6 are perspective views showing the first holding member 30. FIG. The first holding member 30 has a rectangular appearance. The first holding member 30 includes a protruding portion 31, grooves 32 and 33, holes 34 and 35, an engaging portion 36, a protrusion 37, and a protruding portion 38 in order from the front side. The protrusions 31 are provided on both the left and right sides.

  The grooves 32 and 33 are guide grooves for arranging the internal fiber F. The groove 32 is provided on the left and right inner sides of the first holding member 30, and the groove 33 is provided on the left and right outer sides of the first holding member 30. The grooves 32 and 33 are provided on the inner surface of the first holding member 30. Inserted into the grooves 32 and 33 is an internal fiber F that is drawn out from the multiplexer 9 and the demultiplexer 10 and expands largely at the rear, and then extends to the simple connector C.

  The hole 34 is a hole for engaging the first holding member 30 with the second holding member 40. The hole 34 has a circular cross section. The hole portion 35 exposes the bottom surfaces 11c and 12c of each OSA 50. The engaging part 36 is a part for engaging the first holding member 30 with the second holding member 40. The engaging portion 36 is provided at each of the rear portions of the left and right side walls of the first holding member 30. The protrusion 37 is a part for engaging the first holding member 30 with the circuit board 13, and is provided on a protruding portion 38 that extends rearward from the left and right ends of the first holding member 30.

  When the optical transceiver 1 is assembled, the multiplexer 9 and the duplexer 10 are temporarily fixed on the projecting portion 31 so that the assembly can be efficiently performed. A recess 31 a is formed at the base of the protrusion 31. By inserting the protruding portions 9 a and 10 a of the multiplexer 9 and the duplexer 10 into the recess 31 a, the multiplexer 9 and the duplexer 10 are temporarily fixed on the protruding portion 31.

  Further, when the optical transceiver 1 is assembled, the multiplexer 9, the duplexer 10, and the OSA 50 are temporarily held integrally with the first holding member 30. That is, the assembly efficiency is improved by assembling the intermediate assembly including the multiplexer 9, the duplexer 10, and the OSA 50 by the first holding member 30.

  Among the components mounted inside the OSA 50, TEC (Thermo Electric Cooler) that maintains the temperature of the semiconductor optical device at a predetermined temperature is cited as a component that requires heat dissipation. In particular, the bottom surface of the TEC has a high need for heat dissipation. Therefore, the heat dissipation effect of the OSA 50 can be enhanced by bringing the bottom surfaces 11c and 12c of the OSA 50 on which the bottom surface of the TEC is located into physical contact with the inner surface of the upper housing 7 through the hole 35.

  Further, the area of the bottom surface 11c, 12c of the OSA 50 may be smaller than the area of each hole 35, and in this case, the OSA 50 is prevented from falling out of the hole 35. However, in this state, a gap is formed between the bottom surfaces 11 c and 12 c and the inner surface of the upper housing 7. Therefore, the OSA 50 contacts the inner surface of the upper housing 7 via the heat dissipation member by filling the gap with a gel-like heat dissipation member and making the thickness of the heat dissipation member thicker than the thickness of the first holding member 30. To do. Therefore, a heat radiation path from the OSA 50 to the upper housing 7 is secured.

  7 and 8 are perspective views showing the second holding member 40. FIG. The second holding member 40 has a rectangular appearance. The second holding member 40 includes a protrusion 41, grooves 42 and 43, protrusions 45 and 46, and a protrusion 49. The protrusion 41 is provided in a portion where the OSA 50 is mounted. The protrusion 41 includes an elastic force that presses the OSA 50 against the upper housing 7.

  The protruding portion 41 is a stress applying portion that presses the OSA 50 against the inner surface of the upper housing 7. The protrusion 41 has a protrusion 41a having a triangular cross section at its tip. The protrusion 41 a can increase the elastic force of the protrusion 41 against the OSA 50, and the bottom surfaces 11 c and 12 c of each OSA 50 can be reliably brought into contact with the inner surface of the upper housing 7.

  Further, when the second holding member 40 is assembled to the first holding member 30, the total height of the first holding member 30 and the second holding member 40 is slightly lower than the total height of the OSA 50. As a result, the bottom surfaces 11c and 12c of the OSA 50 are surely protruded from the hole portion 35 toward the upper housing 7 side, and a mechanism in which the OSA 50 reliably contacts the inner surface of the upper housing 7 is realized.

  The engaging portion 36 of the first holding member 30 is engaged with each protrusion 45. The protrusion 49 engages with the hole 34 of the first holding member 30. Therefore, the second holding member 40 ensures engagement with the first holding member 30 at the three positions of the protrusion 49 and the pair of protrusions 45. A hole 45 a is formed on the protruding portion 45, and a protrusion 36 a is formed on the engaging portion 36. By fitting the projection 36a into the hole 45a, the rear side engagement of the first holding member 30 and the second holding member 40 is ensured.

  The protrusion 49 has a cylindrical shape. The protrusion 49 has a tip diameter larger than the root diameter. That is, the protrusion 49 has an enlarged diameter portion 49a at the tip thereof, and when the projection 49 is inserted into the hole 34, the enlarged diameter portion 49a is prevented from coming off. Therefore, since the protrusion 49 can be firmly engaged with the hole 34, the front side engagement of the first holding member 30 and the second holding member 40 is ensured.

  The grooves 42 and 43 are guide grooves that guide the internal fiber F. Three grooves 42 are formed on the front side and the left and right outer sides of the second holding member 40, and two grooves 43 are formed on the front side and the left and right inner sides of the second holding member 40. The groove 43 (first groove) faces the receptacle 4 and accommodates the first internal fiber F <b> 1 extending from the receptacle 4. The groove 42 (second groove) faces each of the multiplexer 9 and the duplexer 10. In the groove 42, one first internal fiber F1 and two second internal fibers F2 facing the multiplexer 9 and the duplexer 10 are inserted. Two first internal fibers F <b> 1 heading toward the receptacle 4 are inserted into the groove 43.

  The grooves 42 and 43 are both formed on the bottom surface 47 of the second holding member 40. The three grooves 42 go straight rearward as they are, and then merge. The two grooves 43 go straight rearward and extend in the left and right reverse directions after crossing each other at the rear part of the second holding member 40. Therefore, out of the four protrusions 41 described above, the two left and right protrusions 41 are narrower than the two left and right inner protrusions 41. Each of the grooves 42 and 43 is provided with a plurality of protrusions 46, and the protrusions 46 prevent the internal fibers F inserted into the grooves 42 and 43 from jumping out. The OSA 50 is sandwiched between the first holding member 30 and the second holding member 40.

  FIG. 9 is a diagram for explaining the routing of the internal fiber F. FIG. In FIG. 9, the first holding member 30 and the second holding member 40 are not shown. The first inner fiber F1 drawn out from the receptacle 4 goes straight rearward as it is, curves on the left and right sides on the OSA 50 (the outer surface of the second holding member 40), and keeps the curvature as it is on the circuit board 13. Is bent to the opposite side, passes through the left and right outer sides of the OSA 50, and is connected to the multiplexer 9 and the duplexer 10, respectively.

  The two second internal fibers F2 drawn out from the multiplexer 9 and the duplexer 10 are arranged in the left and right inner grooves 42 of the three grooves 42, and go straight to the rear as they are. The substrate 13 is largely curved in the left and right reverse direction, drawn forward along the wall portion of the engaging portion 36 at the rear end of the first holding member 30, and provided on the outermost side of the groove 33 of the first holding member 30. It bends further on the outer side of the wall and faces rearward, and is accommodated in the grooves 32 and 33 and connected to the simple connector C. By bending the second internal fiber F2 along the outermost wall portion of the groove 33, the curvature of bending of the second internal fiber F2 can be suppressed. The curvature of the second inner fiber F2 is smaller than 20 mm, for example.

  Next, the connection of the OSA 50 and the circuit board 13 by the FPC 14 will be described. FIG. 10 shows a state in which the first holding member 30 is assembled to the circuit board 13 after the OSA 50 and the circuit board 13 are assembled. As shown in FIGS. 4 and 10, the FPC 14 includes a first FPC 14 a that connects the surfaces of the terminals 11 b and 12 b and the surface of the circuit board 13, and a second FPC 14 b that connects the back surfaces of the terminals 11 b and 12 b and the back surface of the circuit board 13. Including. In the TOSA 11 and the ROSA 12, the positions in the vertical direction for pulling out the terminals 11b and 12b are different from each other. Therefore, a large stress must be applied to either the FPC 14 connected to the TOSA 11 or the FPC 14 connected to the ROSA 12 to perform forming.

  In the example of FIG. 10, since the height difference between the surface of the terminal 12 b and the surface of the circuit board 13 is larger, a large stress is applied to the FPC 14 connected to the ROSA 12. When various handling is performed for assembling the optical transceiver 1 in this state, it is assumed that a large moment is particularly applied to the FPC 14 connected to the ROSA 12. Therefore, in the optical transceiver 1, stress (moment due to the weight of the TOSA 11 and ROSA 12) exerted on the FPC 14 is reduced by temporarily mounting the OSA 50 on the first holding member 30 during assembly.

  FIG. 11A is a perspective view showing the appearance of the multiplexer 9. FIG. 11B is a diagram for explaining the function of the duplexer 10. Since the appearance of the duplexer 10 is the same as the appearance of the multiplexer 9, description regarding the appearance of the duplexer 10 is omitted as appropriate. The multiplexer 9 is mounted inside the optical transceiver 1 with its bottom 9b facing up. The circuit board 13, the OSA 50, the first holding member 30, and the second holding member 40 are assembled while temporarily fixing the bottom portion 9 b to the protruding portion 31 of the first holding member 30.

  Since the thickness of the protruding portion 9a is slightly larger than the thickness of the concave portion 31a of the protruding portion 31 described above, the insertion of the protruding portion 9a into the concave portion 31a is due to press fitting depending on the elastic force of the resin. Therefore, it is possible to prevent the multiplexer 9 from sliding off the protruding portion 31 when the optical transceiver 1 is assembled. Moreover, even after the upper housing 7 and the lower housing 8 are assembled, rattling of the multiplexer 9 can be suppressed.

  In the present embodiment, the multiplexer 9 is temporarily fixed to the first holding member 30 by the protruding portion 9a and the recessed portion 31a, but the multiplexer 9 is configured by the configuration other than the protruding portion 9a and the recessed portion 31a. It may be temporarily fixed to. For example, a ring member surrounding the multiplexer 9 is provided at the base of the protruding portion 31, and the multiplexer 9 is temporarily fixed to the first holding member 30 by fitting the multiplexer 9 to the ring member. Also good.

  As shown in FIG. 11B, the duplexer 10 includes a wavelength selection filter 10c. The optical transceiver 1 targets signal light of eight types of wavelengths set at intervals of 4 to 5 nm in the range of 1274 nm to 1310 nm. The wavelength selection filter 10c includes four long-wavelength signal lights (1310 nm, 1305 nm, 1300 nm, and 1295 nm) and four short-wavelength signal lights (1274 nm, 1278 nm, 1282 nm, 1286 nm) signal light is separated.

  The wavelength selection filter 10c has a cutoff wavelength between 1286 nm and 1295 nm (1290 nm as an example). The wavelength selective filter 10c is obtained by forming a dielectric multilayer film on a substantially transparent base material for this wavelength. The wavelength selection function of the wavelength selection filter 10c depends on the incident angle of light, that is, the angle formed by the normal line of the wavelength selection filter 10c and the optical axis of the incident light. The best wavelength selection function can be obtained when the incident angle of light is 0 °, and the wavelength selection function decreases as the incident angle of light increases.

  In the duplexer 10, the 8 multiplexed wavelength multiplexed light having each wavelength described above enters from the port 10 d of the duplexer 10, is totally reflected by the mirror 10 e, and then enters the wavelength selection filter 10 c. Of the eight multiplexed wavelength multiplexed lights, four long wavelength (or four short wavelength) lights are transmitted through the wavelength selection filter 10c and output from the port 10f, and the short wavelength four (or long wavelength side). Is reflected by the wavelength selection filter 10c. The four signal lights reflected by the wavelength selection filter 10c are totally reflected by the mirror 10g and output from the port 10h. Each of the ports 10d, 10f, and 10h is provided with a collimating lens, and a collimating optical system is employed inside the duplexer 10.

  Although the duplexer 10 has been described above, the input / output of the duplexer 10 is reversed with respect to the multiplexer 9. That is, four long-wavelength (or four short-wavelength) signal lights are incident from the port 9h, totally reflected by the mirror 9g, and then reflected again by the wavelength selection filter 9c. On the other hand, four short-wavelength-side (or four long-wavelength-side) signal lights enter from the port 9f and pass through the wavelength selection filter 9c. The four signal lights reflected by the wavelength selection filter 9c and the four signal lights transmitted through the wavelength selection filter 9c are totally reflected by the mirror 9e and then output from the port 9d. As described above, the optical component mounted inside the multiplexer 9 can be the same as the optical component mounted inside the duplexer 10.

  FIG. 12 is a perspective view showing the multiplexer 9 (the duplexer 10), the receptacle 4, the simple connector C, and the internal fiber F. FIG. The connection between the multiplexer 9 and the internal fiber F and the connection between the receptacle 4 and the internal fiber F are so-called pigtail connection (permanent connection). The simple connector C is attached to the OSA 50, and the OSA 50 and the internal fiber F are connected via the simple connector C. The simple connector C has hooks C1 on both sides thereof, and is connected to the OSA 50 via the hooks C1.

  Since the multiplexer 9 (the duplexer 10) and the receptacle 4 are so-called passive components, variations in performance among the components are relatively small. On the other hand, since the OSA 50 has a semiconductor optical element such as an LD or PD mounted therein, there is a relatively large variation in performance among components. Therefore, the frequency of replacement of the OSA 50 is higher than that of the passive component. Therefore, when the OSA 50 is connected to the connector using the simple connector C, each OSA 50 can be replaced independently.

  The circuit components mounted on the circuit board 13 such as the OSA 50, the LD driver 17 and the DSP 18 described above are heating elements. Therefore, as shown in FIG. 13, the heat radiating surfaces of the OSA 50, the LD driver 17, the DSP 18, and the like are arranged on the upper housing 7 side where the heat sink H contacts. Thereby, the thermal connection of the OSA 50, the LD driver 17, the DSP 18, and the like to the upper housing 7 is maintained.

  The circuit board 13 has a slight inclination with respect to a horizontal plane (a plane extending in the front-rear and left-right directions). However, by applying a sheet or gel having elasticity and heat conductivity as the heat sink H between the upper housing 7 and the LD driver 17 and DSP 18, the tolerance of the circuit board 13 due to the inclination is absorbed.

  Next, assembly of the optical transceiver 1 will be described. FIG. 14 shows the back surface of the first circuit board 15 and the ceiling surface of the OSA 50. First, as shown in FIG. 14, the first circuit board 15 and the OSA 50 are electrically connected to each other (first step). The first circuit board 15 on which circuit components are already mounted on both sides and the OSA 50 are connected by the FPC 14.

  At this time, forming is performed on each FPC 14. Specifically, forming is performed by bending the FPC 14 connected to the ROSA 12 larger than the FPC 14 connected to the TOSA 11. Thereafter, the FPC 14 is soldered to the terminals 11 b and 12 b of the OSA 50 and the pads of the first circuit board 15 to fix the FPC 14.

  As shown in FIG. 15, the simple connector C is connected to each sleeve of the OSA 50 (second step). Although not shown in FIG. 15, an internal fiber F is connected to each simple connector C. Next, as shown in FIG. 16, the first circuit board 15 and the first holding member 30 are assembled while supporting the OSA 50 (third process).

  At this time, the protrusion 37 at the rear end of the first holding member 30 is inserted into the opening 15 a formed in the first circuit board 15. Since the diameter of the tip of the protrusion 37 is larger than the diameter of the opening 15a, the protrusion 37 is prevented from coming off from the opening 15a after the protrusion 37 is engaged with the opening 15a. Further, an internal fiber F extends from each simple connector C attached to the OSA 50.

  Next, in the state shown in FIGS. 16 and 17, the internal fiber F drawn forward from the simple connector C is disposed in the grooves 32 and 33 of the first holding member 30 (fourth step). Specifically, as shown in FIG. 18, the left and right inner fibers F are inserted into the grooves 32, the left and right outer fibers F are inserted into the grooves 33, and they are bent in directions opposite to each other. Then, each of the multiplexer 9 and the duplexer 10 is moved to the circuit board 13 portion.

  Next, the second holding member 40 is assembled to the first holding member 30. At this time, as shown in FIG. 19, the internal fiber F is largely bent in the left-right reverse direction on the circuit board 13. Then, the internal fiber F connected to the receptacle 4 is inserted into the groove 43, and the internal fiber F connected to each of the multiplexer 9 and the duplexer 10 is inserted into the groove 42 (fifth step).

  Further, each of the multiplexer 9 and the duplexer 10 is temporarily fixed to the protruding portion 31, and the multiplexer 9 and the duplexer 10 are supported by the first holding member 30 (sixth step). At this time, the protrusions 9 a and 10 a are inserted into the recesses 31 a, respectively, and the multiplexer 9 and the duplexer 10 are temporarily fixed on the protrusion 31.

  The above assembly is performed outside the housing 2. Thus, the intermediate assembly M including the circuit board 13, the OSA 50, the simple connector C, the first holding member 30, the second holding member 40, the multiplexer 9 and the duplexer 10 can be efficiently assembled outside the housing 2. Yes (assembling the intermediate assembly).

  According to this assembling method, the internal fiber F can be routed with a high degree of freedom outside the housing 2, and obstruction of the internal fiber F by the housing 2 can be avoided. Further, when the internal fiber F is being routed, the internal fiber F can be efficiently arranged in the grooves 32, 33, 42, and 43 of the first holding member 30 and the second holding member 40, respectively.

  Furthermore, since the plurality of protrusions 46 are provided in each of the grooves 42 and 43, it is possible to prevent the inner fiber F that has been once arranged from coming out of the grooves 42 and 43. In addition, since the multiplexer 9 and the duplexer 10 having a large weight are temporarily fixed to the first holding member 30, stress applied to the roots of the internal fibers F connected to the multiplexer 9 and the duplexer 10 are alleviated. can do.

  After assembling the intermediate assembly M, the intermediate assembly M is installed in the upper housing 7 as shown in FIG. Subsequently, as shown in FIG. 21, the receptacle 4 is installed at the front end and at the center of the left and right of the upper housing 7 (seventh step). The inner surface of the upper housing 7 does not have a structure that defines the mounting position of the receptacle 4. The structure is provided on the inner surface of the lower housing 8, and the position of the receptacle 4 is defined by assembling the lower housing 8 to the upper housing 7.

  In assembling the receptacle 4 to the lower housing 8, the sleeve of the receptacle 4 is passed through a hole formed in the lower housing 8. At this time, the sleeve is assembled in the lower housing 8 by moving the entire unit including the receptacle 4 forward. Components including the upper housing 7, the lower housing 8, the multiplexer 9, the duplexer 10, the receptacle 4, the first holding member 30, the second holding member 40, the OSA 50, and the circuit board 13 obtained by the above incorporation. The group is unitized, and even if the front and back (upper and lower) positions are changed, the positional relationship between the components is maintained, so that handling is easy.

  As mentioned above, although embodiment of the optical transceiver and its manufacturing method was described, this invention is not limited to embodiment mentioned above. That is, it is easily recognized by those skilled in the art that various modifications and changes can be made within the scope of the present invention described in the claims.

  For example, the shapes of the first holding member 30 and the second holding member 40 can be changed as appropriate. Further, instead of the first holding member 30 and the second holding member 40, one holding member may be provided. Furthermore, the order of assembling the optical transceiver described above can be changed as appropriate. As shown in FIG. 15, the first holding member 30 and the upper housing 7 may be assembled from the state where the simple connector C is attached to each OSA 50 as shown in FIG.

  In this case, as shown in FIG. 23, after the first to fourth steps described above are performed and the four inner fibers F are arranged in the grooves 32 and 33, the four inner fibers F are moved to the front side of the upper housing 7. Cross two at a time. Then, the four internal fibers F are stretched toward the side wall of the upper housing 7 located on the opposite sides of the left and right sides.

  Thereafter, the internal fiber F is wired on the left and right outer sides of the upper housing 7, and the internal fiber F is expanded to the position of the circuit board 13. At this time, the curvature of bending of the internal fiber F is suppressed to a specified value or less by allowing the internal fiber F to pass outside the outermost wall portion of the groove 33 of the first holding member 30.

  After extending the internal fiber F onto the circuit board 13, the second holding member 40 is assembled to the first holding member 30 as shown in FIG. 20. As described above, after the circuit board 13, the OSA 50, the simple connector C, the first holding member 30 and the second holding member 40 are mounted in the upper housing 7, the first holding member 30 allows the multiplexer 9 (demultiplexer). The fifth step described above is performed in support of 10). Thereafter, the assembly of the optical transceiver 1 can be completed through the same procedure as described above.

DESCRIPTION OF SYMBOLS 1 ... Optical transceiver, 2 ... Housing, 4 ... Receptacle, 5 ... Pull tab, 6 ... Slider, 6a ... Protrusion, 7 ... Upper housing, 8 ... Lower housing, 9 ... Multiplexer (optical component), 10 ... Demultiplexer (Optical parts), 9a, 10a ... projecting portion, 9b, 10b ... bottom, 9c, 10c ... wavelength selection filter, 9d, 9f, 9h, 10d, 10f, 10h ... port, 9e, 9g, 10e, 10g ... mirror, DESCRIPTION OF SYMBOLS 11 ... TOSA, 11a, 12a ... Package, 11b, 12b ... Terminal, 12 ... ROSA, 13 ... Circuit board, 14 ... FPC, 15 ... First circuit board, 15a ... Opening, 16 ... Second circuit board, 17 ... LD driver, 23 ... plug substrate, 30 ... first holding member, 31 ... protrusion, 31a ... recess, 32, 33, 42, 43 ... groove, 34, 35 ... hole, 36 ... engagement portion, 36a, 37 ... 40, second holding member, 41, protrusion, 41a, protrusion, 42, 43, groove, 45, 46, protrusion, 45a, hole, 47, bottom surface, 49, protrusion, 49a, enlarged diameter part, 50 ... OSA, C ... simple connector, C1 ... hook, F ... internal fiber, H ... heat sink, M ... intermediate assembly.

Claims (7)

ROSA that converts optical signals into electrical signals;
TOSA that converts electrical signals into optical signals;
A receptacle for receiving an external optical connector and transmitting / receiving an optical signal to / from the optical connector;
An internal fiber that optically connects each of the ROSA and the TOSA and the receptacle;
A circuit board on which a circuit for processing electrical signals is mounted;
A holding member for holding each of the ROSA and the TOSA with respect to the circuit board;
With
The holding member has a plurality of grooves for guiding the internal fiber.
Optical transceiver. The internal fiber and each of the ROSA and the TOSA are optically connected to each other by a simple connector,
The inner fiber is pigtailed to the receptacle;
The optical transceiver according to claim 1. The internal fiber includes a first internal fiber and a second internal fiber,
A multiplexer for multiplexing the optical signal; and a duplexer for demultiplexing the optical signal;
Each of the multiplexer and the duplexer is connected to the receptacle via a first internal fiber, and is connected to the simplified connector via the second internal fiber.
The optical transceiver according to claim 2. The holding member includes a first groove that accommodates the first internal fiber facing the receptacle, and a second groove that accommodates the second internal fiber facing each of the multiplexer and the duplexer. ,
The first internal fiber is drawn from the receptacle and extends in the first groove, and is developed on the circuit board and connected to each of the multiplexer and the duplexer;
The second internal fiber is drawn from each of the multiplexer and the duplexer and extends in the second groove, and is unfolded on the circuit board and connected to the simple connector.
The optical transceiver according to claim 3. The second internal fiber extends from the circuit board toward the multiplexer and the duplexer, and extends outside the holding member.
The optical transceiver according to claim 3 or 4. The second internal fiber is bent along the wall of the holding member, and the curvature of the bend is smaller than 20 mm;
The optical transceiver according to claim 4. The holding member has the first groove and the second groove on the bottom surface, and has the wall portion on the opposite side of the bottom surface,
The optical transceiver according to claim 6.

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