JP2018036291A - Method for manufacturing electro-optic device, electro-optic device and electronic apparatus - Google Patents

Abstract

An electro-optical device manufacturing method, an electro-optical device, and an electronic apparatus capable of suppressing the occurrence of defects such as chipping and burrs when a mother substrate is divided.
When the electro-optical device 100 is manufactured by dividing a composite substrate 400, the first mother substrate 200 is divided in the thickness direction of the first mother substrate 200 in the step of dividing the first mother substrate 200 along the second outline LY2. A first laser scribing process for forming a crack by laser scribing to a position;
A dicing process is performed to cut the first mother substrate 200 with a dicing saw from the first outer surface 200t to the crack. The second mother board 300 is connected to the fourth outline LX4 and the fifth outline LY5.
In the step of dividing along the line, a crack is formed by laser scribing on the entire thickness of the second mother substrate 300.
[Selection] Figure 5

Description

The present invention relates to an electro-optical device manufacturing method, an electro-optical device, and an electronic apparatus that include a step of dividing a mother substrate.

In an electro-optical device such as a liquid crystal device, a first substrate and a second substrate are bonded together by a sealing material provided in a frame shape, and a region surrounded by the sealing material between the first substrate and the second substrate An electro-optic layer is provided inside. In manufacturing such an electro-optical device, a first mother substrate for obtaining a first substrate and a second mother substrate for obtaining a second substrate are bonded together with a sealing material, and the first mother substrate and the second mother substrate are bonded together. A mechanical process such as a break process for cutting the mother board along a groove formed by a scribe head or a dicing process using a dicing saw is used (see Patent Documents 1 and 2).

JP 2010-181696 A JP 2015-13785 A

However, mechanical processing such as break processing and dicing processing may cause chipping or burrs of the substrate, and the occurrence of such a failure causes damage to terminals, wiring, sealing materials, and the like.

In view of the above problems, the present invention provides an electro-optical device manufacturing method, an electro-optical device, and an electronic apparatus that can suppress the occurrence of defects such as chipping and burrs when a mother substrate is divided. There is.

In order to solve the above-described problems, an aspect of the method for manufacturing an electro-optical device according to the present invention includes dividing a composite substrate in which a first mother substrate and a second mother substrate are bonded to each other by a frame-shaped sealing material. An electro-optical device manufacturing method for manufacturing a device, wherein a first dividing step of dividing the first mother substrate along an outer edge of the sealing material, and a second mother substrate along the outer edge of the sealing material. A second dividing step of dividing, wherein in the first dividing step, the second mother of the first mother substrate is at least from a first inner surface that is a surface of the first mother substrate on the second mother substrate side. A first laser scribing process for forming a crack by laser scribing to a position halfway toward the first outer surface, which is a surface opposite to the substrate; and a first dicing saw from the first outer surface to the crack. A dicing process for cutting the plate, and in the second dividing step, the first mother substrate from the second outer surface that is the surface of the second mother substrate opposite to the first mother substrate. A second laser scribing process is performed in which a crack is formed by laser scribing to the second inner surface which is a surface on the mother substrate side.

In the present invention, since the laser scribing is used when dividing the first mother substrate and the second mother substrate, chipping or burring of the substrate is unlikely to occur. Therefore, it is difficult for the terminal, wiring, sealing material, and the like to be damaged due to chipping or burrs of the substrate. Further, when using laser scribing for dividing the second mother substrate, a crack is formed by laser scribing from the first inner surface of the first mother substrate to an intermediate position, and the first mother substrate is formed by a dicing saw from the first outer surface to the crack. Disconnect. Therefore, the first divided from the first mother substrate
The substrate has a cut surface by a dicing saw, and the cut surface has high position and shape accuracy. For this reason, when the electro-optical device is mounted on the electronic apparatus, the position of the electro-optical device can be adjusted based on the cut surface by the dicing saw.

In the present invention, the first dividing step may further employ a break process in which the first mother substrate is cleaved starting from a groove formed in the first outer surface. If it is a break process, a board | substrate can be cut | disconnected efficiently from a laser scribe. Therefore, if the break process is used for cutting a portion where damage to the terminal, wiring, sealing material, etc. is unlikely to occur, the manufacturing efficiency can be improved as compared with the case where all are cut by laser scribing.

In the present invention, one direction extending along the first outer surface is a first direction, and the first direction
When the direction intersecting the first direction along the outer surface is defined as the second direction, the first dividing step extends in the second direction along outer edges located on both sides of the sealing material in the first direction. A first step of cleaving the first mother substrate by the break process along the existing first outline;
A second extending in the first direction along outer edges located on both sides of the sealing material in the second direction;
The first laser scribing process and the dicing process are performed along the outline.
A second step of cutting the mother substrate and a position on one side in the first direction of the sealing material between the first outline and the sealing material on one side in the first direction with respect to the sealing material; And a third step of cleaving the first mother substrate by the breaking process along a third outline extending in the second direction along the outer edge, and in the second dividing step, the sealing material A fourth step of cutting the second mother substrate by the second laser scribing process along a fourth outline extending in the second direction along outer edges located on both sides of the first direction; A fifth step of cutting the second mother substrate by the second laser scribing process along a fifth outline extending in the first direction along outer edges located on both sides of the seal material in the second direction; , Can be adopted .

In the present invention, after performing the second step, the third step, the fourth step, and the fifth step, when performing the first step, an adhesive sheet is pasted on the first outer surface, After cleaving the first mother substrate along the first outline, the first outline, the second outline, the third outline, on the other side of the first direction with respect to the sealing material, The electro-optical device divided along the fourth outline and the fifth outline is peeled from the pressure-sensitive adhesive sheet, and the first mother substrate on the one side in the first direction with respect to the sealing material. The aspect which leaves the division piece divided | segmented by the outline, the said 2nd outline, and the said 3rd outline on the said adhesive sheet is employable. According to such a configuration, there is an advantage that the divided pieces are not scattered.

In the present invention, in the first step, the groove is formed by a dicing saw, and in the first division step, the groove is formed by the dicing saw along the third outline after the third step. Can be adopted. According to this aspect, the cut surface by the dicing saw exists on all the side surfaces of the first substrate divided from the first mother substrate. For this reason, when the electro-optical device is mounted on the electronic apparatus, the position of the electro-optical device can be adjusted based on the cut surface by the dicing saw.

In the present invention, the sealing material is connected around the entire circumference, and before performing the first dividing step and the second dividing step, a liquid electro-optical layer is provided in a region surrounded by the sealing material. It is possible to adopt a mode of placing. In the case of such a configuration, the electro-optical material is used with less disposal, and on the other hand, pressure is easily applied from the liquid electro-optical layer to the sealing material when performing the first division step and the second division step. However, according to the present invention, it is possible to prevent the sealing material from being damaged. Therefore, even if pressure is applied to the sealing material from the liquid electro-optic layer during the first dividing step or the second dividing step, the electro-optic Layer leakage is unlikely to occur.

In the present invention, the first mother substrate is provided with a lens surface formed of a concave or convex curved surface and a lens layer covering the lens surface in a region surrounded by the sealing material. can do. In such an embodiment, the light utilization efficiency can be improved. On the other hand, since a thick film is formed in the vicinity of the sealing material as much as the lens layer is formed, defects are likely to occur in the vicinity of the sealing material during the dicing process. . However, according to the present invention, even if the film near the sealing material is thick, it is possible to prevent the film near the sealing material from being damaged during the first dividing step and the second dividing step. Leakage hardly occurs.

An electro-optical device to which the present invention is applied includes a first substrate, a second substrate facing the first substrate, and having a terminal on a projecting portion that projects from the first substrate toward one side in the first direction, A frame-shaped sealing material that is provided along a first side surface that is a side surface of the first substrate, and that bonds the first substrate and the second substrate, and between the first substrate and the second substrate An electro-optic layer provided, and of the first side surface, any one of a surface located on both sides in the first direction and a surface located on both sides in the second direction intersecting the first direction The first portion from the first inner surface, which is the surface of the first substrate on the second substrate side, to the midway position toward the first outer surface, which is the surface of the first substrate on the side opposite to the second substrate. And a second portion from the midway position to the first outer surface,
The outer edge of the first substrate including the first portion has a larger planar size than the outer edge of the first substrate including the second portion.

In the electro-optical device according to the aspect of the invention, any one of a surface located on the other side of the first direction and a surface located on both sides of the second direction among the second side surfaces that are the side surfaces of the second substrate is ,
It is possible to adopt an aspect that overlaps the first portion in plan view.

In the present invention, a spot-like thermally modified portion is distributed in the first portion, and a second side surface that is a side surface of the second substrate is not distributed in the second portion. Of the first
The surface located on both sides in the direction and the surface located on both sides in the second direction may include a second inner surface that is a surface on the first substrate side of the second substrate, and the second surface of the second substrate. It is possible to adopt a mode in which the thermally modified portion is distributed to the second outer surface that is the surface opposite to the one substrate. In laser scribe, a portion irradiated with a laser spot is thermally modified, and a crack is generated by the stress. Therefore, if spot-like thermally modified portions exist on the first substrate and the second substrate, it can be understood that laser scribing was used in dividing the first mother substrate and the second mother substrate.

In the electro-optical device according to the aspect of the invention, the first portion and the second portion are present on surfaces of the first side surface that are located on both sides of the second direction, and the first direction is the first direction. It is possible to adopt a mode in which the thermally modified portion is distributed on both the surface located on both sides of the surface and the surface located on both sides in the second direction.

In the electro-optical device according to the aspect of the invention, of the first side surface, the surfaces located on both sides in the first direction may include a third portion formed from the first outer surface to a midway position toward the first inner surface,
The aspect provided with the 4th part with light scattering property lower than the said 3rd part from the said 3rd part to the said 1st inner surface is employable. Since the fractured surface formed by the break process has a light scattering property lower than that of the cut surface formed by the dicing process, a groove is formed from the first outer surface by the dicing saw if the third part and the fourth part exist. I understand that.

The electro-optical device to which the present invention is applied is used in various electronic apparatuses. Such an electronic device has, for example, a light source unit that allows light to enter the electro-optical device from the element substrate side. In addition, when an electro-optical device is used for a projection display device among various electronic devices, the projection display device is modulated by a light source unit that emits light supplied to the electro-optical device and the electro-optical device. A projection optical system for projecting the light.

FIG. 3 is a plan view of the electro-optical device to which the present invention is applied as viewed from the first substrate side. FIG. 2 is a Y0-Y0 ′ sectional view of the electro-optical device shown in FIG. 1. FIG. 2 is an explanatory diagram illustrating an enlarged end portion on both sides in the Y direction of the electro-optical device illustrated in FIG. 1. FIG. 2 is an explanatory diagram illustrating an enlarged end portion on both sides in the X direction of the electro-optical device illustrated in FIG. 1. FIG. 2 is a plan view of a composite substrate used in the method for manufacturing the electro-optical device shown in FIG. 1. FIG. 6 is an enlarged plan view showing a part of the composite substrate shown in FIG. 5. It is sectional drawing which expands and shows a part of composite substrate shown in FIG. FIG. 6 is a process cross-sectional view illustrating a method for manufacturing the electro-optical device illustrated in FIG. 1. FIG. 6 is a process cross-sectional view illustrating a method for manufacturing the electro-optical device illustrated in FIG. 1. 1 is a schematic configuration diagram of a projection display device (electronic device) using an electro-optical device to which the present invention is applied.

Hereinafter, a liquid crystal device which is a typical electro-optical device will be described as an embodiment of the present invention.
In the drawings to be referred to in the following description, the scales are different for each layer and each member so that each layer and each member have a size that can be recognized on the drawing.

(Configuration of electro-optical device)
FIG. 1 is a plan view of an electro-optical device to which the present invention is applied as viewed from the first substrate 20, and FIG. 2 is a cross-sectional view of the electro-optical device shown in FIG. In the following description, the Y direction is the “first direction” in the present invention, and the X direction is the “second direction” in the present invention. Moreover, Y2 is attached to one side in the Y direction (one side in the first direction), and the other side in the Y direction (first side).
Y1 is attached to the other side in the direction, X2 is attached to one side in the X direction (one side in the second direction), and X1 is attached to the other side in the X direction (the other side in the second direction). .

The electro-optical device 100 shown in FIGS. 1 and 2 is a liquid crystal device, and a first substrate 20 (counter substrate) and a second substrate 30 (element substrate) are formed in a frame shape along the edge of the first substrate 20. It is bonded by the extending sealing material 60. The sealing material 60 is made of an adhesive such as a photocurable resin, a thermosetting resin, or an anaerobic curable resin. In the electro-optical device 100, a liquid electro-optical layer 50 made of a liquid crystal material is provided in a region surrounded by the sealing material 60 between the first substrate 20 and the second substrate 30. , The first substrate 20 and the second substrate 30 are bonded together, and the electro-optic layer 50 is sealed. The sealing material 60 contains a gap material 69, and the gap material 69 controls the distance between the first substrate 20 and the second substrate 30 (the thickness of the electro-optic layer 50). In this embodiment, when the electro-optic layer 50 is provided, a liquid crystal dropping injection method (OD
F (One Drop Fill) method) is used. In such a method, for example, after the sealing material 60 is provided in a frame shape on the second substrate 30 side, a liquid electro-optic material is dropped inside the sealing material 60, and then the first substrate 20 is attached to the second substrate 30. And paste together. For this reason, the sealing material 60 is connected all around. Note that the first substrate 20 in a state where a part of the sealing material 60 is interrupted.
May be bonded to the second substrate 30, and then a liquid electro-optical material may be vacuum-injected from a discontinuous portion of the sealing material 60. In this case, the interrupted portion of the sealing material 60 is closed with the sealing material.

In the electro-optical device 100, the substrate body 20w of the first substrate 20 and the substrate body 30w of the second substrate 30 are translucent substrates such as glass and quartz substrates. The first substrate 20 (substrate body 20w) and the second substrate 30 (substrate body 30w) are both about 1 mm in thickness. The first substrate 20 (substrate body 20w) and the second substrate 30 (substrate body 30w) are quadrangular on the plane (XY plane) and have side surfaces on four sides. When the side surface of the first substrate 20 is the first side surface, the first substrate 20 has two first side surfaces 20e and 20f that face each other in the Y direction.
And two first side surfaces 20g and 20h facing each other in the X direction. The second substrate 3
When the 0 side surface is the second side surface, the second substrate 30 has two second side surfaces 30 that face each other in the Y direction.
e, 30f, and two second side faces 30g, 30h facing each other in the X direction. A display area 10 a is provided as a rectangular area at the approximate center of the electro-optical device 100.

In the electro-optical device 100, the first substrate 20 is smaller than the second substrate 30, and the sealing material 60
And the 2nd board | substrate 30 is provided in the position biased to the other side Y1 of the Y direction in the 1st board | substrate 20. FIG. For this reason, the second substrate 30 has a projecting portion 37 that projects from the first substrate 20. Specifically, the second substrate 30 projects from the first side surface 20 e of the first substrate 20, and a projecting portion is formed between the second side surface 30 e of the second substrate 30 and the first side surface 20 e of the first substrate 20. 37. On the other hand, both the first side surface 20f and the second side surface 30f are
It overlaps with the outer edge 61 of the sealing material 60 in plan view on the other side Y1 in the Y direction. 1st side 20g
Both the second side surface 30g and the outer edge 61 of the sealing material 60 overlap each other on the other side X1 in the X direction in plan view. Further, both the first side face 20h and the second side face 30h overlap with the outer edge 61 of the sealing material 60 in a plan view on one side X2 in the X direction.

In the second substrate 30, in the outer region of the display region 10a, a data line driving circuit 35a and a plurality of terminals 31 are formed on one side Y2 in the Y direction.
Are arranged along the second side surface 30e. The second substrate 30 has a second side surface 3.
A scanning line drive circuit 35b is formed along each of 0g and 30h. A flexible wiring board (not shown) is connected to the terminal 31, and various potentials and various signals are input to the second substrate 30 from the external control circuit via the flexible wiring board.

The first substrate 20 has a first inner surface 20s that is a surface on the second substrate 30 side, and a first outer surface 20t that is a surface opposite to the second substrate 30 side. A common electrode 21 is formed.

The second substrate 30 has a second inner surface 30s that is a surface on the first substrate 20 side, and a second outer surface 30t that is a surface opposite to the second substrate 30 side. On the side, the display area 10
In a, pixel electrodes 38a, pixel transistors (not shown), and the like are arranged in a matrix. In the second inner surface 30s of the second substrate 30, a dummy pixel electrode formed simultaneously with the pixel electrode 38a in a region sandwiched between the display region 10a and the first side surfaces 20e, 20f, 20g, and 20h of the first substrate 20 38b is formed. The dummy pixel electrode 38b has a common potential Vcom.
Is applied, and the disorder of the alignment of the liquid crystal molecules at the outer peripheral end of the display region 10a is prevented.
An alignment film 36 is formed on the pixel electrode 38a and the dummy pixel electrode 38b.

In the first substrate 20, the common electrode 21 is formed across a plurality of pixels as a substantially entire surface of the display region 10 a or a plurality of strip electrodes. In this embodiment, the common electrode 21 is formed on the entire rectangular area including the display area 10a. On the first inner surface 20 s of the first substrate 20, a protective film 28 and a light shielding layer 27 are formed below the common electrode 21, and an alignment film 26 is laminated on the surface of the common electrode 21. The light shielding layer 27 is formed as a frame portion 27 a extending along the outer peripheral edge of the display area 10 a, and the display area 10 a is defined by the inner peripheral edge of the light shielding layer 27. The light shielding layer 27 is also formed as a black matrix portion 27b that overlaps an inter-pixel region sandwiched between adjacent pixel electrodes 38a.

Inter-substrate conduction electrodes 25 are formed near the four corners of the first inner surface 20 s of the first substrate 20, and the inter-substrate conduction electrodes of the first substrate 20 are formed on the second inner surface 30 s of the second substrate 30. A substrate-to-substrate electrode 39 is formed at a position facing 25. In this embodiment, the inter-substrate conduction electrode 25 is composed of a part of the common electrode 21. Between the inter-substrate conducting electrode 39 and the inter-substrate conducting electrode 25, an inter-substrate conducting material 39a containing conductive particles such as silver is disposed, and the first substrate 20
The common electrode 21 is electrically connected to the second substrate 30 side via the inter-substrate conducting electrode 39, the inter-substrate conducting material 39a, and the inter-substrate conducting electrode 25. Therefore, the common electrode 21 is
A common potential Vcom is applied from the second substrate 30 side.

(Configuration of lens 24)
The first substrate 20 is formed with a plurality of lenses 24 that overlap with each of the plurality of pixel electrodes 38a in a one-to-one relationship in a plan view (as viewed from a direction perpendicular to the XY plane of the first substrate 20). The lens 24 is configured as a lens array substrate, and the lens 24 plays a role of effectively guiding light to the opening region of the second substrate 30. In this embodiment, a lens surface 240 having a concave or convex surface or a convex curved surface is formed on the substrate body 20 w, and a lens layer 241 is laminated on the lens surface 240. In this embodiment, the lens surface 240 is a concave curved surface. The lens layer 241
The refractive index is larger than that of the substrate body 20w. For this reason, the lens surface 240 functions as the lens 24 having positive power.

In this embodiment, the electro-optical device 100 is a transmissive liquid crystal device, and the pixel electrode 38a and the common electrode 21 are made of an ITO (Indium Tin Oxide) film or an IZO (Indi).
um Zinc Oxide) film or the like. In such a transmissive liquid crystal device (electro-optical device 100), for example, as indicated by an arrow L in FIG. 2, light incident from the first outer surface 20t of the first substrate 20 is emitted from the second substrate 30. Modulated to display the image. When the electro-optical device 100 is a reflective liquid crystal device, the common electrode 21 is formed of a light-transmitting conductive film such as an ITO film or an IZO film, and the pixel electrode 38a is a reflective conductive film such as an aluminum film. It is formed by. Such a reflective liquid crystal device (electro-optical device 100
), The light incident from the first outer surface 20t of the first substrate 20 is modulated while being reflected by the second substrate 30 and emitted to display an image.

The electro-optical device 100 can be used as a color display device for an electronic apparatus such as a mobile computer or a mobile phone. In this case, a color filter (not shown) is formed on the first substrate 20. The electro-optical device 100 can be used as electronic paper. Further, in the electro-optical device 100, depending on the type of the electro-optical layer 50 (liquid crystal material) to be used and the normally white mode / normally black mode, a polarizing film,
A retardation film, a polarizing plate, and the like are arranged in a predetermined direction with respect to the electro-optical device 100. Further, the electro-optical device 100 is a projection display device (liquid crystal projector) described later.
It can be used as a light valve for RGB. In this case, each of the RGB electro-optical devices 100 receives light of each color separated through RGB color separation dichroic mirrors as projection light, so that no color filter is formed. .

(Configuration of the first side surfaces 20e to 20h of the first substrate 20)
FIG. 3 is an explanatory diagram showing enlarged ends of both sides in the Y direction of the electro-optical device 100 shown in FIG. 1, and corresponds to a Y0-Y0 ′ cross section. FIG. 4 is an explanatory diagram showing enlarged ends of both sides in the X direction of the electro-optical device 100 shown in FIG. 1, and corresponds to a cross section taken along line X0-X0 ′.

As shown in FIGS. 3 and 4, the electro-optical device 100 according to the present embodiment is manufactured by the method described later with reference to FIGS. 5 to 9, and thus the first side surfaces 20 e and 20 f of the first substrate 20. 2
0g, 20h and the second side surfaces 30e, 30f, 30g, 30h of the second substrate 30 have the following configurations.

First, the first side surfaces 20 e, 20 f, 20 g, and 20 h of the first substrate 20 extend along the outer edge 61 of the sealing material 60. Of the first side surfaces 20e, 20f, 20g, 20h,
One of the first side surfaces 20e and 20f located on both sides in the Y direction and the first side surfaces 20g and 20h located on both sides in the X direction has an intermediate position in the thickness direction (first inner surface 20).
The first portion 207a in which the spot-like thermally modified portion M is distributed by laser scribing between the intermediate position and the first outer surface 20t, and between the intermediate position and the first outer surface 20t. There is a second portion 207b in which the mass portion M is not distributed, and the first portion 207a and the second portion 20
7b is formed with a stepped portion 207c. In this embodiment, the first located on both sides in the X direction.
A first portion 207a, a second portion 207b, and a step portion 207c exist on the side surfaces 20g and 20h. The first portion 207a is composed of a crack formed by laser scribing, and the crack is caused by stress when the spot-like thermally modified portion M is formed by the heat of the laser spot irradiated during laser scribing. Occur. Since the second portion 207b is a cut surface by a dicing saw, the thermally modified portion M does not exist. Further, a step portion 207c resulting from the thickness of the dicing saw is formed between the first portion 207a and the second portion 207b.
The first portion 207a protrudes from the second portion 207b to the side opposite to the electro-optic layer 50.
Therefore, the size of the first substrate 20 in the X direction at the position corresponding to the first portion 207a is larger than the size in the X direction at the position corresponding to the second portion 207b. That is, the first portion 207a
The outer edge of the first substrate 10 including the plane has a larger planar size than the outer edge of the first substrate 10 including the second portion 207b.

On the other hand, the first side surface 20e, 20f located on both sides in the Y direction has a first outer surface 20t.
Between the third portion 208a and the third portion 208a between the first portion 20a and the first inner surface 20s, and the third portion 208a between the third portion 208a and the first inner surface 20s. There is a fourth portion 208b having a light scattering property lower than that of the third portion 208a, and a step portion 208c is formed between the third portion 208a and the fourth portion 208b. The third portion 208a is a cut surface by a dicing saw, and since the trace of the dicing saw at the time of cutting remains as fine irregularities, the light scattering property is high. On the other hand, the fourth portion 208b is formed of a split section that reaches the first inner surface 20s starting from a groove formed on the first outer surface 20t in the breaking process, and has a substantially mirror surface. For this reason, the fourth portion 208b is less light scattering than the third portion 208a. Further, a step portion 208c resulting from the thickness of the dicing saw is formed between the third portion 208a and the fourth portion 208b, and the fourth portion 208b is opposite to the electro-optic layer 50 than the third portion 208a. Protrudes to the side. Accordingly, the first substrate 20 is larger in size in the Y direction at the position corresponding to the fourth portion 208b than in the Y direction at the position corresponding to the third portion 208a. That is, the outer edge of the first substrate 10 including the fourth portion 208b has a larger planar size than the outer edge of the first substrate 10 including the third portion 208a.

Of the second side surfaces 30e, 30f, 30g, and 30h, which are side surfaces of the second substrate 30, second side surfaces 30e and 30f that are located on both sides in the Y direction and second side surfaces 30g that are located on both sides in the X direction.
, 30h, the thermally modified portion M is distributed over the entire area from the second inner surface 30s to the second outer surface 30t. In this embodiment, in any of the second side surfaces 30e, 30f, 30g, and 30h, the surface 3 on which the thermal reforming portion M is distributed from the second inner surface 30s to the second outer surface 30t.
It is 08. That is, the second side surfaces 30e, 30f, 30g, 30h of the second substrate 30.
Both of these are cut surfaces by laser scribing. Such second side faces 30e, 30f, 3
Of 0g and 30h, one of the surface located on the other side Y1 in the Y direction and the surface located on both sides in the second direction Y overlaps the first portion 207a of the first substrate 20 in plan view. In this embodiment, the side surfaces 30 located on both sides (one side X2 and the other side X1) of the second substrate 30 in the X direction.
g and 30h overlap the first portion 207a of the first substrate 20 in plan view. Further, the surface 30f located on the other side Y1 of the second substrate 30 in the Y direction overlaps the fourth portion 208b of the first substrate 20 in plan view.

(Composition of composite substrate 400 and outline)
FIG. 5 is a plan view of a composite substrate 400 used in the method for manufacturing the electro-optical device 100 shown in FIG. The composite substrate 400 includes a first mother substrate 200 and a second mother substrate 300. FIG. 6 is an enlarged plan view showing a part of the composite substrate 400 shown in FIG. FIG. 7 is an enlarged cross-sectional view showing a part of the composite substrate 400 shown in FIG. 5. Y0-Y0 ′ shown in FIG.
It corresponds to a cross-sectional view along the line. In FIG. 5, the end portions of the first mother substrate 200 and the second mother substrate 300 are shifted so as to be easily recognized. Further, in FIG. 6, the outline and the sealing material 60 are shown separated from each other so that the outline can be easily recognized.

In the manufacturing process of the electro-optical device 100 described with reference to FIG. 1 and the like, as shown in FIG. 5, the first mother substrate 200 that can take a large number of first substrates 20 and the second that can take a large number of second substrates 30. A mother substrate 300 is prepared. Next, the common electrode 21 and the like are formed for each of the plurality of regions divided as the first substrate 20 in the first mother substrate 200, while the plurality of regions divided as the second substrate 30 in the second mother substrate 300. Pixel electrode 38 for each of the regions
a etc. are formed. Next, the first mother substrate 200 and the second mother substrate 300 are bonded to the sealing material 60.
Paste with. At that time, the sealing material 60 is formed in a frame shape connected all around, and the sealing material 6
An electro-optical layer 50 is provided in a region surrounded by zero. Accordingly, the first inner surface 200 s that is the surface facing the second mother substrate 300 in the first mother substrate 200 corresponds to the first inner surface 20 s of the first substrate 20, and what is the second mother substrate 300 in the first mother substrate 200? The first outer surface 200t that is the opposite surface corresponds to the first outer surface 20t of the first substrate 20. In addition, the second inner surface 300 s that is a surface facing the first mother substrate 200 in the second mother substrate 300 corresponds to the second inner surface 30 s of the second substrate 30, and what is the first mother substrate 200 in the second mother substrate 300? The second outer surface 300 t that is the opposite surface corresponds to the second outer surface 30 t of the second substrate 30.

Hereinafter, it is combined along the outlines (first outline LX1, second outline LY2, third outline LX3, fourth outline LX4, and fifth outline LY5) shown in FIG. 5, FIG. 6, and FIG. Substrate 400
Is divided into a plurality of electro-optical devices 100. 1st outline LX1, 2nd outline LY2
, Third outline LX3, fourth outline LX4, and fifth outline LY5 represent the electro-optical device 10.
This is a planned dividing line composed of virtual lines that define the outer shapes of the first substrate 20 and the second substrate 30 of zero. Here, in the composite substrate 400, the region where the electro-optical device 100 is divided is the Y direction and the X direction.
Adjacent in direction. Therefore, in the following description, the description will focus on two regions (the first region 400a and the second region 400b) adjacent in the Y direction.

In the present embodiment, the first outline LX1 is a planned cutting line for the first mother substrate 200, and extends in the X direction along the outer edges 61 located on both sides of the sealing material 60 in the Y direction. The second outline LY2 is a cutting line for the first mother substrate 200, and the X of the sealing material 60
It extends in the Y direction along the outer edge 61 located on both sides of the direction. The third outline LX3 is a cutting line for the first mother substrate 200, and is one side Y in the Y direction with respect to the sealing material 60.
2 extends in the X direction along the outer edge 61 located on one side Y2 in the Y direction of the sealing material 60 between the first outline LX1 and the sealing material 60.

The fourth outline LX4 is a cutting line for the second mother substrate 300, and the sealing material 60
It extends in the X direction along the outer edge 61 located on both sides in the Y direction. 5th outline L
Y <b> 5 is a planned cutting line for the second mother substrate 300, and extends in the Y direction along the outer edges 61 positioned on both sides in the X direction of the sealing material 60. In the present embodiment, the first outline LX1 and the fourth outline LX4 overlap in plan view, and the second outline LY2 and the fifth outline LY5 overlap in plan view.

(Method of manufacturing electro-optical device 100)
8 and 9 are process cross-sectional views illustrating a method for manufacturing the electro-optical device 100 shown in FIG. 8 and 9, the Y0-Y0 'section is shown on the left side of the drawing, and the X0-X0' section is shown on the right side of the drawing. However, in FIGS. 8 and 9, the electro-optic layer 5
Illustrations such as 0 are omitted.

In this embodiment, as will be described below with reference to FIGS. 8 and 9, the first mother substrate 200 is used.
Are divided along the outer edge 61 of the sealing material 60 and a second dividing process of dividing the second mother substrate 300 along the outer edge 61 of the sealing material 60 is performed. In the first division step, at least a first laser scribing process for forming a crack by laser scribing from the first inner surface 200s of the first mother substrate 200 to a midway position toward the first outer surface 200t,
A dicing process is performed to cut the first mother substrate 200 with a dicing saw from the outer surface 200t to the crack. Further, in the first dividing step, a break process is performed in which the first mother substrate 200 is cleaved starting from a groove formed in the first outer surface 200t. More specifically, as shown in FIG. 6, in the first dividing step, the first step ST10 for cleaving the first mother substrate 200 by the breaking process along the first outline LX1, and the second outline LY2 2nd process ST2 which cut | disconnects the 1st mother board | substrate 200 by a 1st laser scribe process and a dicing process along
0 and the third step ST30 for cleaving the first mother substrate 200 by the break process along the third outline LX3. Here, in the first division step, a break processing groove is formed by a dicing saw in the first step ST10. In addition, after the third step ST30, the third step
A groove is formed by a dicing saw along the outline LX3. In the second dividing step, a second laser scribing process is performed to form a crack by laser scribing from the second outer surface 300t of the second mother substrate 300 to the second inner surface 300s. More specifically, as shown in FIG. 6, in the second dividing step, a fourth step ST40 for cutting the second mother substrate 300 by the second laser scribing process along the fourth outline LX4, and a fifth outline A fifth step ST50 for cutting the second mother substrate 300 by the second laser scribing process along the line LY5 is performed.

More specifically, first, in step ST1 shown in FIG. 8, the first mother substrate 200 faces upward, and travels from the first inner surface 200s to the first outer surface 200t along the second outer shape line LY2 of the first mother substrate 200. Laser scribing to irradiate a laser spot Ls made of a pulsed laser is performed halfway to form a crack 202e (first laser scribing process).

Next, in step ST2 shown in FIG. 8, a scribe groove 203a extending along the third outline LX3 on the first outer surface 200t of the first mother substrate 200 by a scribe head 751 provided with a diamond cutter or a carbide cutter. Form.

Next, in step ST3 shown in FIG. 8, the first mother sheet 300 is faced upward, the first adhesive sheet 701 is attached to the second outer surface 300t of the second mother board 300, and then the break bar 752 is used to The second mother substrate 300 is pressed through the adhesive sheet 701. As a result, a load is applied to the first mother substrate 200 to generate stress, and the split section 203b reaches the first inner surface 200s of the first mother substrate 200 with the scribe groove 203a as a starting point. Accordingly, the first mother substrate 200 is cleaved along the third outline LX3 (third step ST30).

Next, in step ST4 shown in FIG. 8, the first outline LX with respect to the first mother substrate 200.
1. Dicing processing is performed on the second outline LY2 and the third outline LX3. More specifically, first, in step ST4 shown in FIG. 8, after removing the first adhesive sheet 701,
With the first mother substrate 200 facing upward, dicing processing is performed on the first mother substrate 200 along the second outline LY2. At that time, the dicing saw 753 is caused to enter the crack 202e from the first outer surface 200t of the first mother substrate 200 along the second outline LY2, and the dicing groove 202c is formed in the first mother substrate 200. As a result, the first mother substrate 200 is cut along the second outline LY2 (second step ST20).

Further, in the first outline LX1, the dicing saw 753 is advanced from the first outer surface 200t of the first mother substrate 200 to the middle position in the thickness direction, and the first mother substrate 200 is moved to the middle position in the thickness direction to the dicing groove 201c. Form.

Further, in the third outline LX3, the dicing saw 753 is advanced from the first outer surface 200t of the first mother substrate 200 to the middle position in the thickness direction, and the first mother substrate 200 is moved to the middle position in the thickness direction to the dicing groove 203c. Form.

Next, in step ST <b> 5 shown in FIG. 9, the second adhesive sheet 702 is attached to the first outer surface 200 t of the first mother substrate 200 with the first mother substrate 200 facing upward. Next, in step ST6 shown in FIG. 9, the second mother substrate 300 faces upward, and the laser is a pulse laser from the second inner surface 300s to the second outer surface 300t along the fourth outer shape line LX4 of the second mother substrate 300. Laser scribing to irradiate the spot Ls is performed (second laser scribing process), and a crack 304e is formed. As a result, the second mother substrate 300 is cut along the fourth outline LX4 (fourth step ST50). In addition, the fifth outline LY of the second mother substrate 300
5, laser scribing to irradiate the laser spot Ls from the second inner surface 300 s to the second outer surface 300 t is performed (second laser scribing process), and a crack 305 e is formed. As a result, the second mother substrate 300 is cut along the fifth outline LY5 (fifth step ST50).
.

Next, in step ST <b> 7 shown in FIG. 9, the first mother substrate 200 is turned upward, and the first mother substrate 200 is pressed by the break bar 752 through the second adhesive sheet 702.
As a result, a load is applied to the first mother substrate 200 to generate stress, and the dicing groove 201c
From the starting point, the fractured surface 201b reaches the first inner surface 200s of the first mother substrate 200. Accordingly, the first mother substrate 200 is cleaved along the first outline LX1 (first step ST10).
.

As a result, the first region 400 a and the second region 400 b are each separated from the composite substrate 400 as the electro-optical device 100. Accordingly, the first region 40 is absorbed by the suction chuck 760.
The 0a and the second region 400b are peeled off from the composite substrate 400 as the electro-optical device 100 and collected. At this time, the composite substrate 400 includes a first outer surface 200t of the first mother substrate 200.
Since the second adhesive sheet 702 is attached to the first mother substrate 200, the first adhesive sheet 702 is attached to the first adhesive substrate 702.
Divided pieces 2 divided by the outline LX1, the second outline LY2, and the third outline LX3
70 remains on the adhesive sheet 702. In the electro-optical device 100 configured as described above, the first side surface 20f of the first substrate 20 is formed by a portion corresponding to the first outline LX1, and the second substrate 30 is formed by a portion corresponding to the second outline LY2. First side surfaces 20g and 20h are formed,
The first side surface 20e of the first substrate 20 is formed by a portion corresponding to the third outline LX3. Further, the second side surface 30e, 3e of the second substrate 30 is formed by a portion corresponding to the fourth outline LX4.
0f is formed, and the second side surface 3 of the second substrate 30 is formed by a portion corresponding to the fifth outline LY5.
0 g, 30 h are formed.

(Main effects of this form)
As described above, in this embodiment, the first mother substrate 200 and the second mother substrate 300 are used.
Since laser scribing is used to divide the substrate, chipping of the substrate, burrs, and the like are unlikely to occur. Therefore, it is difficult for the terminal, wiring, sealing material, and the like to be damaged due to chipping or burrs of the substrate. Further, when using laser scribing for dividing the first mother substrate 200, a crack 202e is formed by laser scribing from the first inner surface 200s of the first mother substrate 200 to an intermediate position, and dicing is performed from the first outer surface 200t to the crack 200e. The first mother substrate 200 is cut by the saw 753. For this reason, the first substrate 20 divided from the first mother substrate 200 has a cut surface by the dicing saw 753, and the cut surface has high position and shape accuracy. For this reason, when the electro-optical device 100 is mounted on an electronic device,
The position of the electro-optical device 100 can be adjusted based on the cut surface by the dicing saw 753.

In the first dividing step of dividing the first mother substrate 200, the first outer surface 200t is further added.
The first mother substrate 2 starting from the scribe groove 203a and the dicing groove 201a formed in
Break processing to cleave 00. If it is a break process, a board | substrate can be cut | disconnected efficiently from a laser scribe. Therefore, if a break process is used to cut a portion where damage to the terminal, wiring, sealing material or the like is unlikely to occur, the manufacturing efficiency can be improved as compared with a case where all are cut by laser scribing.

In the first dividing step of dividing the first mother substrate 200, dicing grooves 201c, 202c, and 203c are formed by the dicing saw 753 in any of the first outline LX1, the second outline LY2, and the third outline LX3. To do. Therefore, the first mother board 200
A cut surface by a dicing saw 753 is present on all of the first side surfaces 20e, 20f, 20g, and 20h of the first substrate 10 divided from. For this reason, when the electro-optical device 100 is mounted on an electronic apparatus, the position of the electro-optical device 100 can be adjusted based on the cut surface of the dicing saw 753.

In particular, when the ODF method is used when the electro-optic layer 50 is provided, it is formed from the liquid electro-optic layer 50 in the vicinity of the sealing material 60 or the sealing material 60 in the manufacturing process such as the first dividing process or the second dividing process. Pressure is easily applied to sealing materials such as membranes. However, according to this embodiment, since the sealing material can be prevented from being damaged, even when pressure is applied from the liquid electro-optic layer 50 to the sealing material when performing the first dividing step or the second dividing step, the sealing material. Can prevent damage. Therefore, it is difficult for moisture to enter the electro-optical layer 50 through the sealing material or the electro-optical layer 50 to leak. In addition, since the thick film is formed in the vicinity of the sealing material 60 as much as the lens layer 241 is formed on the first substrate 20, the film in the vicinity of the sealing material 60 is likely to be damaged during the dicing process. However, according to this embodiment, since a large vibration is not applied to the film near the sealing material 60 during the dicing process, even if a thick film exists near the sealing material 60, the film near the sealing material 60 is prevented from being damaged. can do. Therefore, it is difficult for moisture to enter the electro-optical layer 50 through the sealing material or the electro-optical layer 50 to leak.

Further, when the electro-optical device 100 is collected from the composite substrate 400, the divided pieces 270 generated on the first mother substrate 200 can be left on the second adhesive sheet 702. Therefore, the segment 27
There is an advantage that 0 is not scattered. That is, the second step ST20 and the third step ST3
After 0, the split piece 270 is held by the second pressure-sensitive adhesive sheet 702 in order to perform the breaking process at the first outline LX1 in a state where the second pressure-sensitive adhesive sheet 702 is pasted on the first outer surface 200t of the first mother substrate 200. can do. Therefore, it is difficult for the split pieces 270 to scatter and damage the terminals and wiring. Further, the dicing saw 7 for the first mother substrate 200 is used.
Since the cutting of the dicing grooves 201c, 202c, 203c by 53 can be performed collectively in the same step ST4, the production efficiency can be improved.

[Other embodiments]
In the above embodiment, the first side surfaces 20e and 20f of the second substrate 20 are formed by the break process, but the first side surfaces 20e and 20f of the second substrate 20 may be formed by the laser scribing process and the dicing process. In this case, the first side surfaces 20e, 20f of the second substrate 20
In place of the third surface 208a and the fourth surface 208b, the first surface 207a and the second surface 2
07b is formed. In the above embodiment, a liquid crystal device is exemplified as the electro-optical device 100. However, the present invention may be applied to other electro-optical devices such as an electrophoretic display device and an organic electroluminescence device.

[Example of mounting on electronic devices]
FIG. 10 shows a projection display device (electronic apparatus) using the electro-optical device 100 to which the present invention is applied.
FIG. In the following description, a plurality of electro-optical devices 100 to which light having different wavelength ranges are supplied are used. However, the electro-optical device 100 to which the present invention is applied is used for any of the electro-optical devices 100. It has been.

A projection display device 110 shown in FIG. 10 is a liquid crystal projector using the transmissive electro-optical device 100, and irradiates light onto a projection target member 111 made of a screen or the like to display an image. The projection display device 110 includes an illumination device 160 and an illumination device 16 along the device optical axis L0.
A plurality of electro-optical devices 100 (liquid crystal light valves 115 to 115) to which light emitted from 0 is supplied
117), a cross dichroic prism 119 (light combining optical system) that combines and outputs the light emitted from the plurality of electro-optical devices 100, and a projection optical system 118 that projects the light combined by the cross dichroic prism 119. Have. In addition, the projection display device 1
10 includes dichroic mirrors 113 and 114 and a relay system 120. In the projection display device 110, the electro-optical device 100 and the cross dichroic prism 119 constitute an optical unit 150.

In the illumination device 160, along the device optical axis L0, a light source unit 161, a first integrator lens 162 composed of a lens array such as a fly-eye lens, a second integrator lens 163 composed of a lens array such as a fly-eye lens, and a polarization conversion element 164 and a condenser lens 165 are arranged in this order. The light source unit 161 includes a light source 168 that emits white light including red light R, green light G, and blue light B, and a reflector 169. The light source 168 is configured by an ultra-high pressure mercury lamp or the like, and the reflector 169 has a parabolic cross section. The first integrator lens 162 and the second integrator lens 163 make the illuminance distribution of the light emitted from the light source unit 161 uniform. Polarization conversion element 16
4 changes the light emitted from the light source unit 161 into polarized light having a specific vibration direction such as s-polarized light.

The dichroic mirror 113 is a red light R included in the light emitted from the illumination device 160.
And green light G and blue light B are reflected. Dichroic mirror 11
4 transmits the blue light B and reflects the green light G out of the green light G and the blue light B reflected by the dichroic mirror 113. Thus, the dichroic mirror 113
, 114 constitute a color separation optical system that separates the light emitted from the illumination device 160 into red light R, green light G, and blue light B.

The liquid crystal light valve 115 is transmitted through the dichroic mirror 113 and reflected by the reflection mirror 123.
This is a transmissive liquid crystal device that modulates the red light R reflected by the light according to the image signal. The liquid crystal light valve 115 includes a λ / 2 retardation plate 115a, a first polarizing plate 115b, an electro-optical device 100 (red electro-optical device 100R), and a second polarizing plate 115d. Here, the red light R incident on the liquid crystal light valve 115 remains as s-polarized light because the polarization of the light does not change even if it passes through the dichroic mirror 113.

The λ / 2 phase difference plate 115a is an optical element that converts s-polarized light incident on the liquid crystal light valve 115 into p-polarized light. The first polarizing plate 115b is a polarizing plate that blocks s-polarized light and transmits p-polarized light. The electro-optical device 100 (red electro-optical device 100R) is configured to convert p-polarized light into s-polarized light (circularly polarized light or elliptically polarized light in the case of halftone) by modulation according to an image signal. The second polarizing plate 115d is a polarizing plate that blocks p-polarized light and transmits s-polarized light. Accordingly, the liquid crystal light valve 115 modulates the red light R according to the image signal, and emits the modulated red light R toward the cross dichroic prism 119. The λ / 2 phase difference plate 115a and the first polarizing plate 115b are arranged in contact with a light-transmitting glass plate 115e that does not convert the polarization, and the λ / 2 phase difference plate 115a and the first polarizing plate 115b are arranged. Distortion due to heat generation can be avoided.

The liquid crystal light valve 116 is a transmissive liquid crystal device that modulates green light G reflected by the dichroic mirror 114 after being reflected by the dichroic mirror 113 in accordance with an image signal. Similarly to the liquid crystal light valve 115, the liquid crystal light valve 116 includes a first polarizing plate 116b,
The electro-optical device 100 (green electro-optical device 100G) and the second polarizing plate 116d are provided. The green light G incident on the liquid crystal light valve 116 is emitted from the dichroic mirror 113,
The s-polarized light is reflected by 114 and incident. The first polarizing plate 116b blocks p-polarized light and s
It is a polarizing plate that transmits polarized light. The electro-optical device 100 (green electro-optical device 100G) converts the s-polarized light into p-polarized light (circularly polarized light or elliptically polarized light in the case of halftone) by modulating the image signal.
It becomes the composition to convert to. The second polarizing plate 116d is a polarizing plate that blocks s-polarized light and transmits p-polarized light. Therefore, the liquid crystal light valve 116 modulates the green light G according to the image signal, and emits the modulated green light G toward the cross dichroic prism 119.

The liquid crystal light valve 117 is a transmissive liquid crystal device that modulates the blue light B reflected by the dichroic mirror 113, transmitted through the dichroic mirror 114, and then passed through the relay system 120 in accordance with an image signal. Similarly to the liquid crystal light valves 115 and 116, the liquid crystal light valve 117 includes a λ / 2 phase difference plate 117a, a first polarizing plate 117b, an electro-optical device 100 (blue electro-optical device 100B), and a second polarizing plate 117d. I have. Liquid crystal light valve 11
7 is reflected by the dichroic mirror 113, passes through the dichroic mirror 114, and then is reflected by the two reflection mirrors 125a and 125b of the relay system 120, so that it is s-polarized light.

The λ / 2 phase difference plate 117a is an optical element that converts s-polarized light incident on the liquid crystal light valve 117 into p-polarized light. The first polarizing plate 117b is a polarizing plate that blocks s-polarized light and transmits p-polarized light. The electro-optical device 100 (blue electro-optical device 100B) is configured to convert p-polarized light into s-polarized light (circularly polarized light or elliptically polarized light in the case of halftone) by modulation according to an image signal. The second polarizing plate 117d is a polarizing plate that blocks p-polarized light and transmits s-polarized light. Accordingly, the liquid crystal light valve 117 modulates the blue light B according to the image signal, and emits the modulated blue light B toward the cross dichroic prism 119. The λ / 2 phase difference plate 11
7a and the first polarizing plate 117b are disposed in contact with the glass plate 117e.

The relay system 120 includes relay lenses 124a and 124b and reflection mirrors 125a and 125b.
And. The relay lenses 124a and 124b are provided to prevent light loss due to the long optical path of the blue light B. The relay lens 124a is disposed between the dichroic mirror 114 and the reflection mirror 125a. The relay lens 124b is disposed between the reflection mirrors 125a and 125b. The reflection mirror 125a transmits the blue light B transmitted through the dichroic mirror 114 and emitted from the relay lens 124a to the relay lens 1.
Reflected toward 24b. The reflection mirror 125b reflects the blue light B emitted from the relay lens 124b toward the liquid crystal light valve 117.

The cross dichroic prism 119 includes two dichroic films 119a and 119b.
Is a color synthesizing optical system in which X is orthogonally arranged in an X shape. The dichroic film 119a is a film that reflects blue light B and transmits green light G, and the dichroic film 119b is a film that reflects red light R and transmits green light G. Accordingly, the cross dichroic prism 119 combines the red light R, the green light G, and the blue light B that are modulated by the liquid crystal light valves 115 to 117, and emits the resultant light toward the projection optical system 118.

The light that enters the cross dichroic prism 119 from the liquid crystal light valves 115 and 117 is s-polarized light, and the cross dichroic prism 1 from the liquid crystal light valve 116.
The light incident on 19 is p-polarized light. Thus, by making the light incident on the cross dichroic prism 119 into different types of polarized light, the cross dichroic prism 11
9, the light incident from the liquid crystal light valves 115 to 117 can be synthesized. Here, in general, the dichroic films 119a and 119b are excellent in the reflection characteristics of s-polarized light. For this reason, red light R and blue light B reflected by the dichroic films 119a and 119b are s-polarized light, and green light G transmitted through the dichroic films 119a and 119b is p-polarized light. The projection optical system 118 has a projection lens (not shown), and projects the light combined by the cross dichroic prism 119 onto a projection target 111 such as a screen.

[Other projection display devices]
In the projection display device, an LED light source that emits light of each color may be used as the light source unit, and the color light emitted from the LED light source may be supplied to another liquid crystal device.

Regarding the electro-optical device 100 to which the present invention is applied, in addition to the above-described electronic apparatus, a projection-type HUD (head-up display) and a direct-view type HMD (head-mounted display)
, Mobile phones, personal digital assistants (PDA: Personal Digital Assistance)
ants), digital cameras, liquid crystal televisions, car navigation devices, videophones, and the like.

10a ... display region, 20 ... first substrate, 20e, 20f, 20g, 20h ... first side surface, 20
s, 200s ... first inner surface, 20t, 200t ... first outer surface, 21 ... common electrode, 24 ... lens, 30 ... second substrate, 30s, 300s ... second inner surface, 30t, 300t ... second outer surface, 31 ...
Terminals 37. Projected portions 38 a Pixel electrodes 50 Electro-optical layers 60 Sealing materials 61
... outer edge, 100 ... electro-optical device, 110 ... projection type display device, 200 ... first mother substrate, 2
02e, 304e, 305e ... crack, 201b, 203b ... split section, 201c, 202c
, 203c ... dicing groove, 207a ... first part, 207b ... second part, 208a ... third.
Portion 208b fourth portion 240 lens surface 241 lens layer 270 divided piece 3
00 ... 2nd mother substrate, 400 ... Composite substrate, 701 ... 1st adhesive sheet, 702 ... 2nd adhesive sheet, 751 ... Scribe head, 752 ... Break bar, 753 ... Dicing saw,
760 ... Adsorption chuck, M ... Thermally modified portion, LX1 ... First outline, LY2 ... Second outline,
LX3 ... third outline, LX4 ... fourth outline, LY5 ... fifth outline, ST10 ... first step,
ST20 ... 2nd process, ST30 ... 3rd process, ST40 ... 4th process, ST50 ... 5th process,
Ls: Laser spot.

Claims (15)

An electro-optical device manufacturing method for manufacturing an electro-optical device by dividing a composite substrate in which a first mother substrate and a second mother substrate are bonded together by a frame-shaped sealing material,
A first dividing step of dividing the first mother substrate along an outer edge of the sealing material;
A second dividing step of dividing the second mother substrate along an outer edge of the sealing material;
With
In the first dividing step, a first surface that is at least a surface of the first mother substrate opposite to the second mother substrate from a first inner surface that is a surface of the first mother substrate on the second mother substrate side.
Performing a first laser scribing process for forming a crack by laser scribing to an intermediate position toward the outer surface, and a dicing process for cutting the first mother substrate by a dicing saw from the first outer surface to the crack;
In the second dividing step, from the second outer surface that is the surface of the second mother substrate opposite to the first mother substrate to the second inner surface that is the surface of the second mother substrate on the first mother substrate side. A method for manufacturing an electro-optical device, comprising performing a second laser scribing process for forming a crack by laser scribing. The method of manufacturing the electro-optical device according to claim 1,
In the first dividing step, the electro-optical device manufacturing method is further characterized by performing a breaking process for cleaving the first mother substrate starting from a groove formed in the first outer surface. The method of manufacturing the electro-optical device according to claim 2.
When one direction extending along the first outer surface is a first direction and the direction intersecting the first direction along the first outer surface is a second direction,
In the first dividing step, the first mother substrate is cleaved by the breaking process along a first outline extending in the second direction along outer edges located on both sides of the sealing material in the first direction. And a first laser scribing process and a dicing process along a second outline extending in the first direction along outer edges located on both sides of the sealing material in the second direction. A second step of cutting the first mother substrate and one of the sealing materials in the first direction between the first outline and the sealing material on one side of the first direction with respect to the sealing material; Performing a third step of cleaving the first mother substrate by the breaking process along a third outline extending in the second direction along the outer edge located on the side;
In the second dividing step, the second laser scribing process performs the second laser scribing process along a fourth outline extending in the second direction along outer edges located on both sides of the sealing material in the first direction.
The fourth step of cutting the mother substrate, and the second laser scribing process along the fifth outline extending in the first direction along the outer edges located on both sides of the sealing material in the second direction. And a fifth step of cutting the second mother substrate. The method of manufacturing an electro-optical device according to claim 3,
When performing the first step after performing the second step, the third step, the fourth step, and the fifth step, an adhesive sheet is pasted on the first outer surface, and the first outline Along the first
After cleaving the mother substrate, the first outline, the second outline, the third outline, the fourth outline, and the fifth outline on the other side of the first direction with respect to the sealing material The electro-optical device divided along the adhesive sheet is peeled from the pressure-sensitive adhesive sheet, and the first outline, the second outline, and the first outline on one side of the first direction with respect to the sealing material in the first mother substrate A method of manufacturing an electro-optical device, wherein the divided pieces divided by the third outline are left on the pressure-sensitive adhesive sheet. The method of manufacturing an electro-optical device according to claim 3 or 4,
In the first step, the groove is formed by a dicing saw,
In the first dividing step, after the third step, a groove is formed by a dicing saw along the third outer shape line. In the manufacturing method of the electro-optical device according to any one of claims 1 to 5,
The sealing material is connected all around,
A method of manufacturing an electro-optical device, wherein a liquid electro-optical layer is provided in a region surrounded by the sealing material before performing the first dividing step and the second dividing step. In the manufacturing method of the electro-optical device according to any one of claims 1 to 6,
The first mother substrate is provided with a lens surface having a concave or convex curved surface and a lens layer covering the lens surface in a region surrounded by the sealing material. Device manufacturing method. A first substrate;
A second substrate having a terminal on an overhanging portion facing the first substrate and projecting from the first substrate toward one side in the first direction;
A frame-shaped sealing material which is provided along a first side surface which is a side surface of the first substrate, and which bonds the first substrate and the second substrate;
An electro-optic layer provided between the first substrate and the second substrate;
With
Of the first side surfaces, one of the surfaces located on both sides in the first direction and the surfaces located on both sides in the second direction intersecting the first direction is the second side of the first substrate. A first portion from a first inner surface that is a surface on the substrate side to a midway position toward the first outer surface that is a surface opposite to the second substrate of the first substrate, and from the midway position to the first outer surface A second part of
The electro-optical device, wherein an outer edge of the first substrate including the first portion has a larger planar size than an outer edge of the first substrate including the second portion. The electro-optical device according to claim 8.
Of the second side surface, which is the side surface of the second substrate, one of the surface located on the other side of the first direction and the surface located on both sides of the second direction is in plan view with the first portion. An electro-optical device that overlaps. The electro-optical device according to claim 8 or 9,
In the first portion, spot-like thermal reforming portions are distributed,
In the second part, the thermal reforming part is not distributed,
Of the second side surface, which is the side surface of the second substrate, one of the surface located on both sides in the first direction and the surface located on both sides in the second direction is the first side of the second substrate. The electro-optical device is characterized in that the thermally modified portion is distributed from a second inner surface that is a surface on the substrate side to a second outer surface that is a surface on the opposite side of the second substrate from the first substrate. . The electro-optical device according to claim 10.
Of the first side surface, the first portion and the second portion are disposed on surfaces located on both sides in the second direction.
Part exists,
In the second side surface, the thermally modified portion is distributed on both the surface located on both sides in the first direction and the surface located on both sides in the second direction. apparatus. The electro-optical device according to claim 11.
Of the first side surface, the surfaces positioned on both sides in the first direction are the first outer surface and the first side surface.
An electro-optical device comprising: a third portion formed up to a position toward the inner surface; and a fourth portion having a light scattering property lower than that of the third portion from the third portion to the first inner surface. apparatus. The electro-optical device according to any one of claims 8 to 12,
The sealing material is connected all around,
The electro-optical device is characterized in that the electro-optical layer is liquid. The electro-optical device according to any one of claims 8 to 13,
An electro-optical device, wherein the first substrate is provided with a lens surface having a concave or convex curved surface and a lens layer covering the lens surface in a region surrounded by the sealing material. . An electronic apparatus comprising the electro-optical device according to claim 8.