JP2018087927A - LED display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to provide an LED display device that suppresses a reduction in transparency.SOLUTION: An LED display device comprises: a transparent LED substrate; a display part 20 that is formed of a plurality of LED elements provided on a first principal surface of the LED substrate; data lines 40 that are provided on a second principal surface of the LED substrate opposite the first principal surface, and are connected to the LED elements through first through holes penetrating the first principal surface and the second principal surface; and a power line 50 that is provided on the second principal surface of the LED substrate, and is connected to the LED elements through second through holes penetrating the first principal surface and the second principal surface. In the display part 20, the data lines 40 and power line 50 intersect with the LED elements and extend in parallel with each other in plan view.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an LED display device.

  Many display devices such as LED (Light Emitting Diode) display devices are installed on the street. These display devices display various videos related to advertisements, such as still images and moving images, and provide information to passersby.

  For example, in Patent Document 1, when a large LED display is observed at a short distance, a natural image is obtained without making the light of each LED element feel as a point. An LED display device that can prevent the above is disclosed. Specifically, in an LED display device that displays a predetermined image by arranging a plurality of LED elements corresponding to a plurality of pixels in a predetermined pattern, the function of diffusing light from each LED element while maintaining a certain distance is provided. A plate-like or film-like optical member is disposed, and an optical member having light permeability that is in contact with both the LED element and the optical member is disposed between the LED element and the optical member.

  Patent Document 2 discloses a thin and light panel type display module. Specifically, it is a panel type display module, in which a plurality of LED lamps are mounted on the surface of a rectangular printed wiring board in a straight line at a pitch a in the vertical direction, and the first to third color LED lamp arrays. A total of three rows are arranged in parallel at a pitch b equal to or less than the pitch a to form a three-primary-color LED lamp row set, and a plurality of three-primary-color LED lamp row sets are arranged in parallel at predetermined intervals. A non-lamp strip-shaped area having a width d of at least twice the pitch b between the matching three primary color LED lamp train sets is provided, and one or more integrated circuits are mounted in each of the non-lamp strip-shaped areas, and the right and left LED lamp rows The total dimension of the distances p and q between the right end and the left end of the wiring board is made smaller than the width d of the non-lamp belt-like area, and the connector or LED lamp mounted on the end of the wiring board is connected to the integrated circuit. Emissions are patterned.

JP 2014-202816 A JP 2012-27484 A

  In the LED display device disclosed in Patent Document 1, the overall configuration of the device becomes large. For this reason, much labor is required for the installation work of the LED display device. On the other hand, since the panel type display module of Patent Document 2 is thin and light, labor required for installation work is reduced. Therefore, it is conceivable to install such a panel type display module in various places such as a building wall and a window glass. When the LED display device is installed on the window glass, a passerby who walks outside can view various images displayed on the LED display device. On the other hand, the person in the office is blocked by the LED display device and cannot see the scenery outside the window.

  In order to avoid such a situation, for example, a substrate made of a transparent material is used for the LED display device. However, since various members related to the display of various images besides the LED chip are arranged on the substrate, it cannot be said that the transparency of the display is sufficiently secured.

  Further, in order to display a high-quality video, it is necessary to increase the number of pixels in the display unit. However, since the power consumption increases when the number of pixels is increased, it is necessary to increase the power supplied to the LED chip by increasing the width of the power supply line or increasing the number of power supply lines. Then, the wiring area increases due to the increase in the number of data lines and the increase in the power supply lines accompanying the increase in the number of pixels, and the transparency of the display decreases.

  In addition, in order to display a high-quality video, for example, the pixel pitch may be reduced. However, when the pixel pitch is reduced, the ratio of the area occupied by the components such as the LED chip and the wiring in the display unit is increased, so that the transparency of the display is lowered.

  Accordingly, an object of the present invention is to provide an LED display device that displays a high-quality image while suppressing a decrease in transparency.

  Of the inventions disclosed in this application, the outline of typical ones will be briefly described as follows.

  An LED display device according to an exemplary embodiment of the present invention includes a transparent LED substrate, a display unit including a plurality of LED elements provided on a first main surface of the LED substrate, and a first LED substrate. A data line provided on a second main surface opposite to the main surface of the LED and connected to the LED element through a first through hole penetrating the first main surface and the second main surface; A power line provided on the second main surface of the substrate and connected to the LED element through a second through hole penetrating the first main surface and the second main surface; The data line and the power line intersect the LED element in plan view and extend in parallel.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  That is, according to the typical embodiment of the present invention, it is possible to provide an LED display device capable of displaying a high-quality image while suppressing a decrease in transparency.

It is a top view which shows an example of a structure of the LED display apparatus which concerns on Embodiment 1 of this invention. It is a top view which expands and shows an example of a structure of the display part which concerns on Embodiment 1 of this invention. It is sectional drawing which shows an example of a structure of the LED display apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the other example of a structure of the LED display apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing which shows an example of a structure of the LED display apparatus which concerns on Embodiment 2 of this invention. It is sectional drawing which shows the other example of a structure of the LED display apparatus which concerns on Embodiment 2 of this invention. It is a figure which shows an example of the wiring structure which concerns on Embodiment 2 of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted.

(Embodiment 1)
<Configuration of LED display device>
FIG. 1 is a plan view showing an example of the configuration of the LED display device according to Embodiment 1 of the present invention. FIG. 2 is an enlarged plan view showing an example of the configuration of the display unit according to Embodiment 1 of the present invention. FIG. 3 is a cross-sectional view showing an example of the configuration of the LED display device according to Embodiment 1 of the present invention. 1 and 2, a part of the display unit 20 of the LED display device 100 is shown. In FIG. 1, the data lines 40 and 50 provided on a surface different from the surface on which the LED elements 30 are arranged are indicated by dotted lines. In FIG. 3, some LED elements 30 and the cross-sectional shape of the circumference | surroundings are typically shown. In FIG. 3, the connection structure between the wirings is shown in a simplified manner in order to clearly show the connection structure.

  The LED display device 100 includes, for example, an LED substrate 10, a display unit 20, a data line 40, a power line 50, an LED protective layer 60, an adhesive layer 70, a protective layer 80, as shown in FIGS. 1 to 3. .

  The LED substrate 10 is a transparent substrate made into a flat plate shape, for example. The shape of the LED substrate 10 in plan view is, for example, a rectangle, a circle, an ellipse, etc., but is not limited to these shapes. For example, the shape of the LED substrate 10 may be an arbitrary shape considering the installation location of the LED display device 100 and the like.

  The LED substrate 10 is made of a material having high heat resistance. In this specification, “having high heat resistance” means that even when the temperature of the LED substrate 10 reaches 160 ° C., for example, the LED substrate 10 does not change in quality and the LED display device 100 operates normally. Say. Moreover, it is preferable that the LED board 10 is comprised with the material which has flexibility. Thereby, the LED substrate 10 can be deformed into an arbitrary shape according to the installation location of the LED display device 100.

  The LED substrate 10 is made of, for example, PCB (Poly Chlorinated Biphenyl: Polychlorinated Biphenyl), PET (Poly Ethylene Terephthalate), PEN (Poly Ethylene Naphthalate), PI (Poly Ethylene Naphthalate), or PI (Phosphorus Naphthalate) as materials satisfying these characteristics. polyimide (polyimide).

  A display unit 20 and the like are provided on the first main surface 10 a of the LED substrate 10. As shown in FIGS. 1 and 2, the display unit 20 includes a plurality of pixels 25 arranged in a matrix along each of the X-axis direction (row direction) and the Y-axis direction (column direction).

  Each pixel 25 includes a plurality of LED elements 30 that emit different colors. Specifically, as illustrated in FIG. 2, the pixel 25 includes a red LED element 30 </ b> R, a green LED element 30 </ b> G, a blue LED element 30 </ b> B, and an LED element 30 </ b> X. Here, the LED element 30X may be an LED element that emits a color different from these colors, or may be an LED element that emits the same color as any of these colors. That is, as shown in FIG. 2, the display unit 20 includes a plurality of LED elements 30 arranged in a matrix along each of the X-axis direction (row direction) and the Y-axis direction (column direction). .

  In one pixel 25, as shown in FIG. 2, the LED elements 30R and 30G are arranged adjacently along the X-axis direction, and the LED elements 30X and 30B are arranged adjacently along the X-axis direction. ing. Further, the LED elements 30R and 30X are disposed adjacently along the Y-axis direction, and the LED elements 30G and 30B are disposed adjacently along the Y-axis direction. In addition, in FIG. 1, although an example of the color arrangement | positioning of the LED element 30 is shown, the color arrangement | positioning of the LED element 30 in the pixel 25 is not limited to this. Further, the color arrangement of the LED elements 30 may be changed for each pixel 25.

  On the first main surface 10 a of the LED substrate 10, lead wires 45 and 55 are provided for each LED element 30. As shown in FIG. 3, each LED element 30 is connected to lead wires 45 and 55 via wires 46 and 56, respectively. For example, gold is used as the material of the wire 46.

  For example, as shown in FIG. 3, the LED substrate 10 has a through hole (first through hole) that passes through the first main surface 10 a and the second main surface 10 b opposite to the first main surface. 15, a through hole (second through hole) 16 is formed. The through holes 15 and 16 are provided for each LED element 30. For example, the through hole 15 is formed so that an opening is provided in the wiring region of the lead wire 45 connected to the corresponding LED element 30. The through hole 16 is formed so that an opening is provided in the wiring region of the lead wire 55 connected to the corresponding LED element 30.

  FIG. 4 is a cross-sectional view showing another example of the configuration of the LED display device according to Embodiment 1 of the present invention. For example, as shown in FIG. 4, chamfered portions 15 a and 15 b may be formed at the end of the through hole 15. A chamfered portion 15a is formed at the end of the through hole 15 on the first main surface 10a side. A chamfered portion 15b is formed at the end of the through hole 15 on the second main surface 10b side. For example, as shown in FIG. 4, chamfered portions 16 a and 16 b may be formed at the end of the through hole 16. A chamfered portion 16a is formed at the end of the through hole 16 on the first main surface 10a side. A chamfered portion 16b is formed at the end of the through hole 16 on the second main surface 10b side. The chamfered portions 15a, 15b, 16a, and 16b are formed so that the through-holes 15 and 16 and the first main surface 10a and the second main surface 10b are smoothly connected. A metal layer (not shown) is provided on the side walls of the through holes 15 and 16 and the chamfered portions 15a, 15b, 16a and 16b.

  As shown in FIGS. 1 and 2, a plurality of data lines 40 and a plurality of power supply lines 50 are provided on the second main surface 10 b opposite to the first main surface 10 a of the LED substrate 10. As shown in FIGS. 1 and 2, the data line 40 and the power supply line 50 intersect with the plurality of LED elements 30 in a plan view and extend in parallel. Specifically, it is provided so as to extend in the same direction in the display unit 20 from the periphery of the display unit 20 into the display unit 20 in a plan view. Specifically, as shown in FIGS. 1 and 2, the data line 40 and the power supply line 50 respectively extend along the column direction of the matrix constituted by the plurality of LED elements 30 in the display unit 20. More specifically, for example, as shown in FIG. 1, the data line 40 and the power supply line 50 enter the display unit 20 from the negative side of the Y axis, and extend toward the positive side of the Y axis in the display unit 20. It is provided as follows.

  For example, in the column in which the LED elements 30R and 30X are arranged, as shown in FIG. 2, the data lines 40 (40R and 40X) and the power supply line 50 intersect the LED elements 30R and 30X in a plan view and are parallel to each other. It is extended. In the column in which the LED elements 30G and 30B are arranged, as shown in FIG. 2, the data lines 40 (40G and 40B) and the power supply line 50 intersect the LED elements 30G and 30B in parallel when viewed in plan. It is extended.

  For example, the data line 40 is provided for each LED element 30. On the other hand, the power supply line 50 is connected to a plurality of LED elements 30 as shown in FIGS. Specifically, as shown in FIGS. 1 and 2, the power supply line 50 is provided for each column of the matrix of the LED elements 30 in the display unit 20, and each power supply line 50 includes all the LEDs arranged in a line. It is connected to the element 30. As described above, two power supply lines 50 are connected to one pixel 25.

  Further, in the column in which the LED elements 30G and 30B shown in FIG. 2 are arranged, a data line 40 connected to the other LED elements 30 in this column is provided. Thus, in each LED element 30, the maximum number of data lines 40 arranged in the same column as the number of LED elements 30 intersect in plan view and extend in parallel.

  The data line 40 is connected to the LED element 30 through the through hole 15. Specifically, as shown in FIG. 3, the data line 40 is connected to the LED element 30 via a metal layer (not shown) of the through hole 15, a lead wire 45, and a wire 46. On the other hand, the power supply line 50 is connected to the LED element 30 through the through hole 16 as shown in FIG. Specifically, the power supply line 50 is connected to the LED element 30 via a metal layer (not shown) of the through hole 16, the lead wire 55, and the wire 56.

  The metal layers (not shown) of the data line 40, the power supply line 50, the lead wires 45 and 55, and the through holes 15 and 16 are made of, for example, copper as a main component. Here, “copper is the main component” means that the material constituting these wirings and the like is almost copper, but also includes cases where impurities are mixed.

  The data lines 40 (40R, 40G, 40B, 40X) and the power supply line 50 are connected to a control unit (controller) (not shown). A predetermined signal (for example, potential) is output from the control unit to the data line 40 (40R, 40G, 40B, 40X) and the power supply line 50. Each LED element 30 is turned on / off based on a signal (for example, a potential) supplied from the data line 40 (40R, 40G, 40B, 40X) and the power line 50. By switching the on / off state of each LED element 30, a still image or a moving image is displayed on the display unit 20.

  The transparency of the LED display device 100 is the area of the LED substrate 10 in plan view, excluding the area in plan view of components such as the LED elements 30, data lines 40, and power lines 50 provided on the LED substrate 10. This is the ratio of the area to the area of the LED substrate 10 in plan view.

  Below, the outline of the process of forming the through holes 15 and 16, the data line 40, the lead wires 45 and 55, and the power supply line 50 will be described. First, the through holes 15 and 16 are formed by irradiating the LED substrate 10 with a laser, for example. The through hole 15 is formed at a predetermined position determined in consideration of the position where the LED element 30 is disposed and the position where the lead wire 45 is formed. The through hole 16 is formed at a predetermined position determined in consideration of the position where the LED element 30 is disposed and the position where the lead wire 55 is formed. A step of forming chamfered portions 15a, 15b, 16a, and 16b may be provided for the through holes 15 and 16 as necessary.

  Next, a metal layer mainly composed of, for example, copper is formed on the side walls of the through holes 15 and 16 by, for example, a plating process. In the plating step, the metal layer may be formed so that not only the side walls but also the entire through holes 15 and 16 are filled.

  Next, lead wires 45 and 55 are formed on the first main surface 10a. For example, a metal layer containing, for example, copper as a main component is formed on the first main surface 10a by a film forming process such as sputtering. Then, the lead wires 45 and 55 are formed by patterning the metal layer based on a predetermined wiring pattern.

  Next, the data line 40 and the power supply line 50 are formed with respect to the 2nd main surface 10b. Since the data line 40 and the power supply line 50 are formed in the same process as that performed on the first main surface 10a, detailed description thereof is omitted. In addition, after performing the process of forming the data line 40 and the power supply line 50 with respect to the 2nd main surface 10b, you may perform the process of forming the lead wires 45 and 55 with respect to the 1st main surface 10a.

  As shown in FIG. 3, an LED protective layer 60 that covers the LED element 30 is provided on the first main surface 10 a side of the LED substrate 10. For example, the LED protective layer 60 is provided so as to cover the LED element 30 and the wires 46 and 56. The LED protective layer 60 is made of a material having transparency, insulation, and ductility (for example, silicon epoxy resin).

  For example, the LED protective layer 60 may be provided for each pixel 25 or may be provided for each LED element 30. Alternatively, the LED protective film 60 may be provided over the plurality of pixels 25.

  Further, an adhesive layer 70 is provided on the first main surface 10a side of the LED substrate 10, as shown in FIG. It is preferable that the adhesive layer 70 is also made of a material having transparency and ductility. The adhesive layer 70 is provided in the space between the adjacent LED protective layers 60. For example, the LED protective layer 60 and the adhesive layer 70 are configured to have the same height from the first main surface 10 a of the LED substrate 10.

  As shown in FIG. 2, a protective layer 80 is provided on the second main surface 10 b side of the LED substrate 10. The protective layer 80 is provided to protect the data line 40, the power supply line 50, the LED substrate 10, and the like. The protective layer 80 is preferably made of a material having transparency and ductility, for example.

<Effects of this embodiment>
According to the present embodiment, the data line 40 and the power supply line 50 are provided on the second main surface 10b of the LED substrate 10, intersect with the LED element 30 in a plan view, and extend in parallel.

  According to this configuration, since the combined area of the data line 40, the power supply line 50, and the LED element 30 in plan view is reduced, the LED display device 100 that suppresses the decrease in transparency even when the number of pixels increases is provided. The Thereby, the LED display device 100 capable of displaying a high-quality image while suppressing a decrease in transparency is provided. In addition, by this, even when the LED display device 100 is installed, for example, on a window glass, when viewing the scenery outside the window through the LED display device 100 from the surface opposite to the surface that displays the image The decrease in visibility is suppressed. That is, it is possible to suppress a decrease in the visibility of the scenery outside the window while displaying a high-quality image by the LED display device 100.

  Further, according to the present embodiment, the display unit 20 is configured by arranging a plurality of pixels 25 including a plurality of LED elements 30 in a matrix, and the data lines 40 and the power supply lines 50 are respectively arranged in the matrix column direction. It is extended.

  According to this configuration, since the data line 40 can intersect the adjacent pixel 25 at the shortest distance, the length of the data line 40 is suppressed, and the wiring load is reduced. Thereby, the power consumption of the LED display device 100 is suppressed. Further, according to this configuration, since the pixels 25 are arranged at regular intervals in the display unit 20, the quality of the displayed video can be improved.

  Further, according to the present embodiment, the power line 50 is connected to the plurality of LED elements 30. According to this configuration, since it is not necessary to provide the power supply line 50 for each LED element 30, the number of the power supply lines 50 is suppressed, and the wiring area is reduced.

  Further, according to the present embodiment, the metal layers of the data line 40, the power supply line 50, the lead wires 45 and 46, and the through holes 15 and 16 are composed mainly of copper. According to this configuration, since an inexpensive material is used for these wirings, the manufacturing cost is reduced.

  Moreover, according to this Embodiment, the LED board 10 is comprised with the material which has high heat resistance. According to this configuration, since the LED substrate 10 does not deteriorate even when the LED element 30 is in a high temperature state, the LED display device 100 with improved operation performance is provided.

  Moreover, according to this Embodiment, the LED board 10 is comprised with the material which has flexibility.

  According to this configuration, since it is arbitrarily deformed according to the installation location, an LED display device with improved flexibility in installation location is provided.

  Moreover, according to this Embodiment, the LED board 10 is comprised by PCB. According to this configuration, since an inexpensive material is used, the manufacturing cost is reduced.

  Further, according to the present embodiment, chamfered portions 15 a, 15 b, 16 a, and 16 b are formed at the end portions of the through holes 15 and 16.

  According to this configuration, since the end portions of the through holes 15 and 16 have a gentle shape, the disconnection between the through hole 15, the lead wire 45 and the data line 40, and the connection between the through hole 16, the lead wire 55 and the power supply line 50. Disconnection is suppressed. Thereby, the LED display apparatus 100 which improved the reliability line is provided.

  Moreover, according to this Embodiment, the pixel 25 is comprised by the several LED element 30 which emits a different color.

  According to this configuration, it is possible to display various colors on each pixel 25, so that the LED display device 100 with improved display quality is provided.

  Moreover, according to this Embodiment, the LED protective layer 60 which covers the LED element 30 and the wires 46 and 56 is provided on the first main surface 10a side of the LED substrate 10.

  According to this configuration, since the impact on the LED element 30 and the wires 46 and 56 is mitigated, the LED display device 100 in which the wires 46 and 56 are prevented from being disconnected and the reliability is improved is provided.

  Further, according to the present embodiment, the adhesive layer 70 is provided in the space between the adjacent LED protective layers 60.

  According to this configuration, since the LED display device 100 is fixed at an arbitrary location, the LED display device 100 with improved flexibility in installation location is provided.

  Moreover, according to this Embodiment, the LED protective layer 60 and the contact bonding layer 70 are provided so that it may become the same height from the 1st main surface 10a of the LED board 10. FIG.

  According to this configuration, since the LED display device 100 can be closely attached to the installation location, the LED display device 100 that is stably fixed to the installation location is provided.

(Embodiment 2)
Next, a second embodiment will be described. In Embodiment 2, a case where a plurality of substrates are stacked will be described. In the following description, the description overlapping with that of the first embodiment is omitted in principle.

  FIG. 5 is a cross-sectional view showing an example of the configuration of the LED display device according to Embodiment 2 of the present invention. The LED display device 200 according to the present embodiment is configured by stacking a wiring substrate 110 on the LED display device 100 of the first embodiment. Specifically, the LED display device 200 is configured by laminating a transparent wiring substrate 110 on the second main surface 10 b side of the LED substrate 10.

  Since the wiring board 110 has the same properties as those of the LED board 10 described in the above embodiment, a detailed description of materials and the like is omitted. A data line 140 and a power supply line 150 are provided on the first main surface 110a of the wiring substrate 110 facing the second main surface 10b of the LED substrate 10. As described above, in this embodiment, the data lines and the power supply lines are provided on a plurality of surfaces and a plurality of substrates, and are hierarchized.

  As shown in FIG. 5, a lead wire 145 connected to the through hole 15 and a lead wire 155 connected to the through hole 16 are provided on the second main surface 10 b of the LED substrate 10. A protective layer 80 is provided on the second main surface 10b side of the LED substrate 10 so that the lead wires 145 and 155 are exposed. On the other hand, the LED substrate 10 and the wiring substrate 110 are bonded so that the power line 150 and the lead wire 155 are in contact with each other so that the data line 140 and the lead wire 145 are in contact with each other, as shown in FIG. As described above, the data line 140 is connected to the lead wire 145, and the power supply line 150 is connected to the lead wire 155.

  The data line 140 is connected to the LED element 30 through the through hole 15 of the LED substrate 10. Specifically, as shown in FIG. 5, the data line 140 is connected to the LED element 30 via a lead wire 145, a metal layer (not shown) of the through hole 15, a lead wire 45, and a wire 46. On the other hand, the power line 150 is connected to the LED element 30 through the through hole 16 of the LED substrate 10. Specifically, the power supply line 150 is connected to the LED element 30 via the lead wire 155, a metal layer (not shown) of the through hole 16, the lead wire 55, and the wire 56.

  In addition, the protective layer 80 in this Embodiment is an electrical connection between the wiring provided in the 2nd main surface 10b of the LED board 10, and the wiring provided in the 1st main surface 110a of the wiring board 110. Functions as an insulating layer to prevent short circuit.

  In the display unit 20, the data line 140 and the power line 150 provided on the first main surface 110a of the wiring board 110 intersect with the LED element 30 in a plan view and extend in parallel as shown in FIG. doing. Further, the data line 140 and the power line 150 extend in parallel to the data line 40 and the power line 50 provided on the LED substrate 10. At this time, the data line 140 and the power supply line 150 may be arranged so as to overlap the data line 40 and the power supply line 50 in plan view.

  Although the case where the data line 140 and the power supply line 150 are provided on the first main surface 110a of the wiring board 110 has been described here, the LED display device 200 according to the present embodiment has such a configuration. It is not limited. For example, only the data line 140 or the power supply line 150 may be provided on the first main surface 110a of the wiring board 110. In this case, the LED element 30 may be connected to the data line 140 and the power supply line 50, for example, or may be connected to the data line 40 and the power supply line 150, for example.

  Further, even when both the data line 140 and the power supply line 150 are provided on the first main surface 110a of the wiring board 110, the LED element 30 may be connected to the data line 140 and the power supply line 50, or the data It may be connected to the line 40 and the power line 150.

  FIG. 6 is a cross-sectional view showing another example of the configuration of the LED display device according to Embodiment 2 of the present invention. In the following, detailed description of the same contents as those in FIG. 5 will be omitted in principle. The second main surface 110b opposite to the first main surface 110a of the wiring board 110 has a through-hole (a third hole) passing through the first main surface 110a and the second main surface 110b of the wiring board 110. A through hole 115 and a through hole (fourth through hole) 116 are formed. Since the through holes 115 and 116 are the same as the through holes 15 and 16 of the first embodiment, detailed description thereof is omitted here.

  A lead wire 245 connected to the through hole 115 and a lead wire 255 connected to the through hole 116 are provided on the first main surface 110 a of the wiring board 110. A data line 240 connected to the through hole 115 and a power line 250 connected to the through hole 116 are provided on the second main surface 110b opposite to the first main surface 110a of the wiring board 110. As shown in FIG. 6, the LED substrate 10 and the wiring substrate 110 are bonded so that the lead wire 155 and the lead wire 255 are in contact with each other so that the lead wire 145 and the lead wire 245 are in contact with each other. Thus, the lead wire 245 is connected to the lead wire 145, and the lead wire 255 is connected to the lead wire 155.

  The data line 240 is connected to the LED element 30 through the through hole 115 of the wiring substrate 110 and the through hole 15 of the LED substrate 10. Specifically, as shown in FIG. 6, the data line 240 includes a metal layer (not shown) of the through hole 115, a lead wire 245, a lead wire 145, a metal layer (not shown) of the through hole 15, the lead wire 45, and the wire 46. And is connected to the LED element 30. On the other hand, the power supply line 250 is connected to the LED element 30 through the through hole 116 of the wiring board 110 and the through hole 16 of the LED board 10. Specifically, the power line 250 is connected to the LED element 30 through a metal layer (not shown) of the through hole 116, the lead wire 255, the lead wire 155, a metal layer (not shown) of the through hole 16, the lead wire 55, and the wire 56. Has been.

  In the display unit 20, the data line 240 and the power line 250 provided on the second main surface 110b of the wiring board 110 intersect with the LED element 30 in a plan view and extend in parallel as shown in FIG. doing. The data line 240 and the power line 250 are connected to the data line 40 and the power line 50 provided on the LED substrate 10 and the data line 140 and the power line 150 provided on the first main surface 110 a of the wiring board 110. Also extends in parallel. At that time, the data line 240 and the power line 250 may be arranged so as to overlap the data line 40, the power line 50, the data line 140, and the power line 150 in plan view.

  A protective layer 180 is provided on the second main surface 110 b side of the wiring substrate 110. Since the material and the like of the protective layer 180 are the same as those of the protective layer 80 described above, detailed description thereof is omitted here.

  Note that the lead wires 145 and 155, the data line 40, and the power supply line 50 may be mixed on the second main surface 10 b of the LED substrate 10. In addition, lead wires 245 and 255, data lines 140, and power supply lines 150 may be mixed on the first main surface 110 a of the wiring board 110.

  Although the case where the data line 240 and the power supply line 250 are provided on the second main surface 110b of the wiring board 110 has been described here, the LED display device 200 according to the present embodiment has such a configuration. It is not limited. For example, only the data line 240 or the power supply line 250 may be provided on the second main surface 110b of the wiring board 110. In this case, the LED element 30 may be connected to, for example, the data line 240 and the power supply lines 50 and 150 in addition to the combinations described above, or connected to the data line 40 and 140 and the power supply line 250, for example. May be.

  Even when both the data line 240 and the power supply line 250 are provided on the second main surface 110b of the wiring board 110, the LED element 30 includes the data lines 40, 140, 240 and the power supply provided at different levels. It may be connected to the lines 50, 150, 250.

  FIG. 7 is a diagram showing an example of a wiring structure according to the second embodiment of the present invention. In FIG. 7, in order to clearly show the hierarchical wiring structure, a detailed configuration for each substrate is omitted.

  In the case where the data lines are hierarchized as in the present embodiment, the LED elements 30 provided on the leading end side in the extending direction of the data lines 40 (140, 240) are arranged in the stacking direction of the wiring board 110. It is preferable to be connected to data lines (for example, data lines 140 and 240) provided on the front end side in the (+ Z axis direction).

  Specifically, the data line 240 provided on the second main surface 110b of the wiring board 110 farthest from the LED element 30 is a group provided on the positive side of the Y axis in the matrix, for example, as shown in FIG. The display unit 20 is extended over almost the entire area in the + Y-axis direction so as to be connected to the LED element 30 of A. The data lines 140 provided on the first main surface 110a of the wiring board 110 are connected to the LED elements 30 of the group B provided in the middle row of the matrix as shown in FIG. 7, for example. Extend. Further, the data line 40 provided on the second main surface 10b of the LED substrate 10 is connected to the LED element 30 of the group C provided on the negative side of the Y axis in the matrix, for example, as shown in FIG. Extend like so.

<Effects of this embodiment>
According to the present embodiment, in addition to the effects described in the first embodiment, the following effects can be obtained.

  According to the present embodiment, the data line 140 connected to the LED element 30 is provided on the first main surface 110a of the transparent wiring substrate 110 stacked on the second main surface 10b side of the LED substrate 10. In the display unit 20, the data line 140 and the power supply line 150 of the wiring substrate 110 intersect with the LED element 30 in a plan view and extend in parallel.

  According to this configuration, since the data lines and the power supply lines are hierarchized, the number of data lines and power supply lines can be increased without increasing the wiring area in plan view. Thereby, even when the number of pixels increases, a decrease in transparency can be suppressed. Therefore, it is possible to provide an LED display device in which high-quality video is displayed and a decrease in transparency is suppressed.

  Further, according to the present embodiment, the data lines 150 connected to the LED elements 30 are also provided on the second main surface 110b of the wiring board 110, and in the display unit 20, the data lines 150 of the wiring board 110 are It intersects with the LED element 30 in a plan view and extends in parallel.

  According to this configuration, since the data lines and the power supply lines are further hierarchized, the number of data lines and power supply lines can be further increased without expanding the wiring area in plan view. Thereby, even when the number of pixels further increases, a decrease in transparency is suppressed. Therefore, an LED display device is provided in which a higher quality image is displayed and a decrease in transparency is suppressed.

  Further, according to the present embodiment, the data lines 40, 140, and 240 extend in the same direction in the display unit 20 from the peripheral portion of the display unit 20 into the display unit 20 in plan view. The LED element 30 provided on the front end side in the extending direction (+ Y axis direction) of the data lines 40, 140, 240 is data provided on the front end side in the stacking direction (+ Z axis direction) of the wiring board 110. It is connected to the line 240 (140).

  According to this configuration, the wirings connected to the data lines in different levels do not overlap in the same level, so that the data lines are efficiently wired. Accordingly, the number of data lines can be further increased without increasing the wiring area in plan view, and even when the number of pixels is further increased, a decrease in transparency can be suppressed. Therefore, an LED display device is provided in which a higher quality image is displayed and a decrease in transparency is suppressed.

(Other embodiments)
Embodiments other than these may be sufficient as the LED display apparatus of this invention. For example, the LED display device may be configured by stacking a plurality of wiring boards 110 in a direction from the first main surface 10a of the LED substrate 10 to the second main surface 10b.

  According to this configuration, since the data lines and the power supply lines are further hierarchized, the number of data lines and power supply lines can be further increased without expanding the wiring area in plan view. Thereby, even when the number of pixels further increases, a decrease in transparency is suppressed. Therefore, it is possible to provide an LED display device that displays a higher quality image and suppresses a decrease in transparency.

  Also in the present embodiment, the data lines are preferably provided with a wiring structure as shown in FIG. 7, for example. In the above-described embodiment, the LED elements 30 are divided into three groups according to the number of levels in the hierarchy. On the other hand, in the present embodiment, as the number of layers of the wiring board 110 increases, the number of levels in the hierarchy increases. Therefore, the LED elements 30 may be grouped according to the new number of levels.

  According to this configuration, even if the number of wiring boards 110 is increased, the number of data lines can be further increased without increasing the wiring area in plan view, and even when the number of pixels is further increased, the transparency is lowered. It can be suppressed. Therefore, it is possible to provide an LED display device that displays a higher quality image and suppresses a decrease in transparency.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiments. However, the present invention is not limited to the embodiments described so far, and various modifications can be made without departing from the scope of the invention. Needless to say.

  DESCRIPTION OF SYMBOLS 10 ... LED board, 10a ... 1st main surface, 10b ... 2nd main surface, 15, 16 ... Through-hole, 20 ... Display part, 25 ... Pixel, 30, 30R, 30G, 30B, 30X ... LED element, 40, 40R, 40G, 40B, 40X ... data line, 50 ... power supply line, 60 ... LED protective layer, 70 ... adhesive layer, 80 ... protective layer, 100 ... LED display device, 110 ... wiring board, 110a ... first Main surface, 110b ... second main surface, 115, 116 ... through hole, 140 ... data line, 150 ... power supply line, 200 ... LED display device, 240 ... data line, 250 ... power supply line

Claims (16)

A transparent LED substrate;
A display unit composed of a plurality of LED elements provided on the first main surface of the LED substrate;
The LED is provided on a second main surface opposite to the first main surface of the LED substrate, and through the first through hole penetrating the first main surface and the second main surface. A data line connected to the element;
A power supply line provided on the second main surface of the LED substrate and connected to the LED element via a second through-hole penetrating the first main surface and the second main surface; With
In the display unit, the data line and the power line intersect the LED element in a plan view and extend in parallel.
LED display device. The LED display device according to claim 1,
The display unit is configured by arranging a plurality of pixels including the LED elements in a matrix.
The data line and the power line extend in the column direction of the matrix, respectively.
LED display device. The LED display device according to claim 1,
The power line is connected to a plurality of the LED elements.
LED display device. The LED display device according to claim 1,
The data line and the power line are composed mainly of copper.
LED display device. The LED display device according to claim 1,
The LED substrate is made of a material having high heat resistance,
LED display device. The LED display device according to claim 1,
The LED substrate is made of a flexible material,
LED display device. The LED display device according to claim 1,
The LED substrate is made of PCB,
LED display device. The LED display device according to claim 1,
A chamfered portion is formed at the end of the through hole.
LED display device. The LED display device according to claim 2,
The pixel is composed of a plurality of the LED elements that emit different colors.
LED display device. The LED display device according to claim 1,
An LED protective layer that covers the LED element is provided on the first main surface side of the LED substrate.
LED display device. The LED display device according to claim 10.
An adhesive layer is provided in a space between the adjacent LED protective layers,
LED display device. The LED display device according to claim 11,
The LED protective layer and the adhesive layer are provided to have the same height from the first main surface of the LED substrate.
LED display device. The LED display device according to claim 1,
A transparent wiring substrate is laminated on the second main surface side of the LED substrate,
On the first main surface of the wiring board facing the second main surface of the LED board, the data line connected to the LED element via the first through hole of the LED board; The power supply line connected to the LED element through the second through hole of the LED substrate,
In the display unit, the data line and the power line provided on the first main surface of the wiring board extend in parallel with the LED element in a plan view.
LED display device. The LED display device according to claim 13.
The second main surface opposite to the first main surface of the wiring board has a third through-hole penetrating the first main surface and the second main surface of the wiring board; A data line connected to the LED element via the first through hole of the LED substrate;
The LED element is connected via a fourth through hole penetrating the first main surface and the second main surface of the wiring board and the second through hole of the LED board. A power line, and
In the display unit, the data line and the power line provided on the second main surface of the wiring board extend in parallel with the LED element in a plan view.
LED display device. The LED display device according to claim 13.
On the second main surface side of the LED substrate, a plurality of the wiring substrates are stacked in a direction from the first main surface of the LED substrate toward the second main surface.
LED display device. The LED display device according to claim 13.
The data line is provided so as to extend in the same direction in the display unit from the peripheral part of the display unit into the display unit in plan view.
The LED element provided on the leading end side in the extending direction of the data line is connected to a data line provided on the leading end side in the stacking direction of the wiring board,
LED display device.

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