JP2017135166A - Joint system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively perform a joint processing of a processed substrate and a supporting substrate through an adhesion tape, and improve through-put in the joint processing.SOLUTION: A joint system 1 includes: a processing station 3 that executes a predetermined processing to a processed substrate W, a supporting substrate S, and a polymerization substrate T; and a carry-in/out station 2 that can hold a plurality of processed substrates W, a plurality of supporting substrates S, or a plurality of polymerization substrates T, and carries in/out the processed substrates W, supporting substrates S, or polymerization substrates T to the processing station 3. The supporting substrate S is made of a material penetrating an ultraviolet ray. The processing station 3 includes: a jointing device 40 that joints the processed substrate W and the supporting substrate S through an adhesion tape; a turnover device 41 that turns a front and back surfaces of the polymerization substrate T; an ultraviolet ray processing device 42 that irradiates the polymerization substrate T with the ultraviolet ray; and a second substrate conveying device 60 to which a second substrate conveying device 61 conveying the processed substrate W, supporting substrate S, or polymerization substrate T is provided.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a joining system that joins a substrate to be processed and a support substrate via an adhesive tape.

  In recent years, for example, in semiconductor device manufacturing processes, semiconductor substrates such as silicon wafers and compound semiconductor wafers have become larger and thinner. Such a large-diameter and thin semiconductor substrate (hereinafter referred to as a substrate to be processed) may be warped or cracked during transport or polishing. For this reason, the substrate to be processed is reinforced by attaching a support substrate to the substrate to be processed.

  For example, Patent Document 1 discloses that a substrate to be processed (wafer) and a support substrate (glass plate) are bonded via an adhesive tape. And after bonding a to-be-processed substrate and a support substrate in this way, an ultraviolet-ray is irradiated toward an adhesive tape from the support substrate side, and the adhesiveness of an adhesive tape is improved.

Japanese Patent Laying-Open No. 2015-149433

  However, although it is necessary to perform the joining of the board | substrate described in patent document 1, and the irradiation of the ultraviolet-ray to an adhesive tape with a separate apparatus, in patent document 1, performing such a series of joining processes efficiently is completely. It was not considered. For this reason, there is room for improvement in the throughput of the bonding process.

  This invention is made | formed in view of this point, and it aims at performing the joining process of a to-be-processed substrate and a support substrate through an adhesive tape efficiently, and improving the throughput of the said joining process.

  To achieve the above object, the present invention provides a bonding system for bonding a substrate to be processed and a support substrate via an adhesive tape, the substrate to be processed, the support substrate, and the substrate to be processed and the support substrate. A processing station that performs a predetermined process on the superposed substrate to which the substrate is bonded, a plurality of the substrate to be processed, the support substrate, or the superposed substrate, and a plurality of the substrate to be processed, the support substrate, or the superposed substrate. A loading / unloading station for loading / unloading to / from the processing station, wherein the support substrate is made of a material that transmits ultraviolet rays, and the processing station bonds the substrate to be processed and the support substrate via the adhesive tape. And a reversing device for reversing the front and back surfaces of the superposed substrate, and ultraviolet light from the support substrate side toward the adhesive tape with respect to the superposed substrate. And a transfer region provided with a transfer device for transferring the substrate to be processed, the support substrate, or the superposed substrate with respect to the bonding device, the reversing device, and the ultraviolet processing device. It is characterized by that.

  According to the bonding system of the present invention, for example, when an adhesive tape is affixed to the support substrate before bonding, the substrate to be processed and the support substrate are arranged in a state where the support substrate is disposed below the substrate to be processed in the bonding apparatus. Be joined. Thereafter, the front and back surfaces of the polymerization substrate are reversed by the reversing device, that is, the support substrate is disposed above the substrate to be processed, and further, the ultraviolet light is irradiated from the support substrate side of the polymerization substrate toward the adhesive tape in the ultraviolet processing device. .

  On the other hand, for example, when an adhesive tape is attached to the substrate to be processed before bonding, the substrate to be processed and the support substrate are bonded in a state where the substrate to be processed is arranged below the support substrate in the bonding apparatus. Thereafter, ultraviolet rays are irradiated from the support substrate side of the polymerization substrate toward the adhesive tape in the ultraviolet treatment apparatus. That is, the inversion of the superposed substrate in the inverting device is omitted.

  In any case, according to the present invention, it is possible to efficiently perform a series of bonding processes from bonding of the substrate to be processed and the support substrate to ultraviolet treatment of the superposed substrate in one bonding system. Further, during the bonding of the substrate to be processed and the support substrate in the bonding apparatus, it is possible to perform the ultraviolet treatment on another superposed substrate in the ultraviolet processing apparatus. Therefore, it is possible to efficiently perform the bonding process between the substrate to be processed and the support substrate and improve the throughput of the bonding process.

  In addition, since the loading / unloading station can hold a plurality of substrates to be processed, a plurality of supporting substrates, or a plurality of superposed substrates, the substrate to be processed and the supporting substrate are continuously transferred from the loading / unloading station to the processing station. Continuous processing can be performed at the station. Therefore, the throughput of the bonding process can be further improved.

  The reversing device includes a first reversing device for reversing the front and back surfaces of the superposition substrate before the ultraviolet treatment is performed by the ultraviolet treatment device, and the superposition substrate after the ultraviolet treatment is performed by the ultraviolet treatment device. A second reversing device for reversing the front and back surfaces.

  The pressure in the joining device, the pressure in the reversing device, and the pressure in the ultraviolet treatment device may be negative with respect to the pressure in the transfer region.

  ADVANTAGE OF THE INVENTION According to this invention, the to-be-processed substrate and support substrate can be efficiently bonded via the adhesive tape, and the throughput of the bonding process can be improved.

It is a top view which shows the outline of a structure of the joining system concerning this embodiment. It is a side view which shows the outline of the internal structure of the joining system concerning this embodiment. It is a side view of a to-be-processed substrate and a support substrate. It is explanatory drawing of the airflow which arises in a joining system. It is a flowchart which shows the main processes of a joining process. It is a top view which shows the outline of a structure of the joining system concerning other embodiment.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

<1. Structure of joining system>
First, the structure of the joining system which concerns on this embodiment is demonstrated with reference to FIGS. 1-3. FIG. 1 is a plan view showing an outline of the configuration of the joining system. FIG. 2 is a side view illustrating the outline of the internal configuration of the joining system. FIG. 3 is a side view of the substrate to be processed and the support substrate. In the following, in order to clarify the positional relationship, the X-axis direction, the Y-axis direction, and the Z-axis direction that are orthogonal to each other are defined, and the positive direction of the Z-axis is the vertically upward direction.

  In the following, as shown in FIG. 3, the plate surface of the substrate W to be processed that is bonded to the support substrate S via the adhesive tape P is referred to as a “bonding surface Wj”, and the bonding surface Wj Is referred to as the “non-bonding surface Wn”. Further, among the plate surfaces of the support substrate S, the plate surface on the side bonded to the substrate W to be processed via the adhesive tape P is referred to as “bonding surface Sj”, and the plate surface opposite to the bonding surface Sj is referred to as “ This is referred to as “non-joint surface Sn”.

  The substrate W to be processed is a substrate in which a plurality of electronic circuits (devices) are formed on a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, and the plate surface on the side where the electronic circuits are formed is used as a bonding surface Wj. The substrate W to be processed is thinned by polishing the non-bonded surface Wn after bonding to the support substrate S. In the present embodiment, the diameter of the substrate to be processed W is, for example, 300 mm.

  The support substrate S is a substrate having substantially the same diameter as the substrate to be processed W, and supports the substrate to be processed W. As the support substrate S, for example, a glass substrate or the like can be used. The support substrate S is not particularly limited as long as it is made of a material that transmits ultraviolet rays. For example, a quartz plate or a sapphire plate may be used.

  The adhesive tape P is a tape in which an adhesive is attached to both the front surface and the back surface, and bonds the bonded substrate W and the support substrate S together. For the adhesive, a material that is cured by ultraviolet rays is used.

  As shown in FIG. 1, the bonding system 1 carries in and out cassettes Cw, Cs, and Ct that can accommodate a plurality of substrates W, a plurality of support substrates S, and a plurality of superposed substrates T, respectively, with the outside. The loading / unloading station 2 and the processing station 3 including various processing apparatuses for performing predetermined processing on the substrate W to be processed, the support substrate S, and the superposed substrate T are integrally connected.

  The loading / unloading station 2 is provided with a cassette mounting table 10. The cassette mounting table 10 is provided with a plurality of, for example, five cassette mounting plates 11. The cassette mounting plates 11 are arranged in a line in the Y-axis direction (vertical direction in FIG. 1). The cassettes Cw, Cs, and Ct can be placed on these cassette placement plates 11 when the cassettes Cw, Cs, and Ct are carried into and out of the joining system 1. As described above, the carry-in / out station 2 is configured to be capable of holding a plurality of substrates to be processed W, a plurality of support substrates S, and a plurality of superposed substrates T.

  In addition, the number of cassette mounting plates 11 is not limited to this embodiment, and can be set arbitrarily. One of the cassettes may be used for collecting defective substrates. That is, it is a cassette that can separate a substrate in which a problem occurs in joining of the substrate to be processed W and the support substrate S due to various factors from another normal superposed substrate T.

  In the carry-in / out station 2, a first substrate transfer region 20 is provided adjacent to the cassette mounting table 10. The first substrate transport region 20 is provided with a first substrate transport device 22 that is movable on a transport path 21 extending in the Y-axis direction. The first substrate transfer device 22 is also movable in the vertical direction and around the vertical axis (θ direction), and the cassettes Cw, Cs, Ct on each cassette mounting plate 11 and the third of the processing station 3 to be described later. The substrate to be processed W, the support substrate S, and the superposed substrate T can be transferred to and from the transition devices 50 and 51 of the processing block G3. In the first substrate transfer area 20, an air flow that is referred to as a downward flow and is directed downward is generated. The atmosphere inside the first substrate transfer region 20 is exhausted from an exhaust port (not shown). Therefore, the pressure in the first substrate transfer region 20 is equal to or higher than atmospheric pressure, and the substrate to be processed W, the support substrate S, and the superposed substrate T are transferred in the so-called atmospheric system in the first substrate transfer region 20. .

  The processing station 3 is provided with a plurality of, for example, three processing blocks G1, G2, and G3 including various processing apparatuses. For example, a first processing block G1 is provided on the front side of the processing station 3 (Y-axis negative direction side in FIG. 1), and on the back side of the processing station 3 (Y-axis positive direction side in FIG. 1). A second processing block G2 is provided. Further, a third processing block G3 is provided on the loading / unloading station 2 side of the processing station 3 (X-axis negative direction side in FIG. 1).

  For example, the first processing block G1 includes a sticking device 30 for sticking the adhesive tape P to the support substrate S, and an inspection device 31 for inspecting whether or not the adhesive tape P is properly attached to the support substrate S. These are arranged in the X axis positive direction in this order from the loading / unloading station 2 side. In addition, a general apparatus can be used for each of the pasting apparatus 30 and the inspection apparatus 31. Further, the sticking device 30 and the inspection device 31 may be integrally formed.

  For example, in the second processing block G2, as shown in FIG. 2, a joining device 40 that joins the substrate to be processed W and the support substrate S via an adhesive tape P, and a reversing device 41 that reverses the front and back surfaces of the superposed substrate T. And an ultraviolet treatment device 42 for irradiating the polymerization substrate T with ultraviolet rays are disposed. The reversing device 41 and the ultraviolet processing device 42 are provided in two stages in this order from the bottom, and the joining device 40 is further disposed on the X axis positive direction side from the reversing device 41 and the ultraviolet processing device 42.

  In the bonding apparatus 40, the substrate to be processed W and the support substrate S are pressed and bonded in a vacuum atmosphere in a state where the support substrate S to which the adhesive tape P is attached is disposed below the substrate to be processed W. Further, the bonding apparatus 40 adjusts the horizontal orientation of the substrate to be processed W and the support substrate S before bonding, and further reverses the front and back surfaces of the substrate to be processed W.

In the ultraviolet treatment device 42, the polymerization substrate T is irradiated with ultraviolet rays having a high output of, for example, 100 mW / cm ^{2 and having} a wavelength band of 405 nm, for example, from a plurality of LEDs (light emitting diodes). More specifically, the adhesive tape P is irradiated with ultraviolet rays from the support substrate S side to cure the adhesive of the adhesive tape P, and the adhesive property of the adhesive tape P is improved. The ultraviolet ray in the 405 nm wavelength band refers to an ultraviolet ray having a wavelength in the range of 380 nm to 440 nm and a peak wavelength of 405 nm, for example.

  For example, in the third processing block G3, transition devices 50 and 51 for the target substrate W, the support substrate S, and the superposed substrate T are provided in two stages in this order from the bottom. In addition, in the third processing block G3, a substrate identification device (not shown) for identifying the target substrate W and the support substrate S by reading the identification numbers of the target substrate W and the support substrate S before bonding. Alternatively, a buffer device (not shown) for the target substrate W, the support substrate S, and the superposed substrate T may be provided.

  As shown in FIG. 1, a second substrate transfer region 60 is formed in a region surrounded by the first processing block G1 to the third processing block G3. For example, a second substrate transfer device 61 is disposed in the second substrate transfer region 60. In the second substrate transfer area 60, an air flow that is called a downward flow is generated in the vertical downward direction. The atmosphere inside the second substrate transfer region 60 is exhausted from an exhaust port (not shown). Accordingly, the pressure in the second substrate transfer region 60 is equal to or higher than the atmospheric pressure, and the so-called atmospheric system transfer of the target substrate W, the support substrate S, and the superposed substrate T is performed in the second substrate transfer region 60. .

  The second substrate transfer device 61 includes a transfer arm that can move around the vertical direction, the horizontal direction (X-axis direction, Y-axis direction), and the vertical axis, for example. The second substrate transfer device 61 moves in the second substrate transfer region 60 and covers the predetermined devices in the surrounding first processing block G1, second processing block G2, and third processing block G3. The processing substrate W, the support substrate S, and the superposed substrate T can be transported.

  The above joining system 1 is provided with a controller 70 as shown in FIG. The control unit 70 is, for example, a computer and has a program storage unit (not shown). The program storage unit stores a program for controlling processing of the substrate to be processed W, the support substrate S, and the superposed substrate T in the bonding system 1. The program storage unit also stores a program for controlling the operation of drive systems such as the above-described various processing apparatuses and transfer apparatuses to realize the below-described joining process in the joining system 1. The program is recorded on a computer-readable storage medium H such as a computer-readable hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical desk (MO), or a memory card. May have been installed in the control unit 70 from the storage medium H.

<2. Airflow in the joining system>
Next, the airflow generated in the bonding system 1 when performing the bonding process between the target substrate W and the support substrate S in the bonding system 1 configured as described above will be described with reference to FIG. In addition, the arrow in FIG. 4 has shown the direction of the airflow.

  In the bonding system 1, the pressure inside the first substrate transfer area 20 of the loading / unloading station 2, the pressure inside each of the processing blocks G1 to G3 of the processing station 3, and the pressure inside the second substrate transfer area 60 are These are respectively more positive than the atmospheric pressure outside the joining system 1.

  In addition, the atmosphere in the first substrate transfer area 20, the devices in the processing blocks G1 to G3, and the second substrate transfer area 60 is exhausted to the outside, and the atmosphere in the bonding system 1 is all. Exhausted outside. Therefore, the presence of particles in the atmosphere in the bonding system 1 can be suppressed.

  Further, in the processing station 3, the pressure in the second substrate transfer region 60 is the highest. That is, the pressure in the sticking device 30, the pressure in the inspection device 31, the pressure in the bonding device 40, the pressure in the reversing device 41, and the pressure in the ultraviolet treatment device 42 are respectively pressures in the second substrate transport region 60. Negative pressure. Therefore, when opening / closing shutters (not shown) of the respective devices 30, 31, 40, 41, 42 are opened, an air flow is generated from the second substrate transfer region 60 toward the respective devices 30, 31, 40, 41, 42. .

  In such a case, particles generated in the respective apparatuses 30, 31, 40, 41, 42 do not flow into the second substrate transfer area 60. Therefore, it is possible to prevent particles from adhering to the substrate W to be processed, the support substrate S, and the superposed substrate T that are being transported in the second substrate transport region 60. In particular, since it is possible to prevent particles from adhering to the superposed substrate T that has been subjected to all the processes in the processing station, the yield of products can be improved.

<3. Operation of joining system>
Next, a method for bonding the substrate to be processed W and the support substrate S performed using the bonding system 1 configured as described above will be described. FIG. 5 is a flowchart showing an example of main steps of the joining process.

  First, a cassette Cw that accommodates a plurality of substrates to be processed W, a cassette Cs that accommodates a plurality of support substrates S, and an empty cassette Ct are placed on a predetermined cassette placement plate 11 of the carry-in / out station 2. The Thereafter, the support substrate S in the cassette Cs is taken out by the first substrate transfer device 22 and transferred to the transition device 50 of the third processing block G3 of the processing station 3. At this time, the support substrate S is transported with the bonding surface Sj facing upward.

  Next, the support substrate S is transferred to the sticking device 30 by the second substrate transfer device 61. In the pasting device 30, the adhesive tape P is pasted on the joint surface Sj with the non-joint surface Sn held on the support substrate S (step A1 in FIG. 5).

  Next, the support substrate S is transferred to the inspection device 31 by the second substrate transfer device 61. In the inspection apparatus 31, it is inspected whether or not the adhesive tape P is properly attached to the support substrate S (step A2 in FIG. 5). Specifically, the state of the adhesive tape P at the end of the support substrate S is inspected.

  When it is determined in step A2 that the adhesive tape P is not attached, the support substrate S is transported to the transition device 51 by the second substrate transport device 61, and further, a predetermined cassette is formed by the first substrate transport device 22. It is conveyed to the cassette Cs of the mounting plate 11. Then, the superposed substrate T is unloaded from the loading / unloading station 2 and collected. On the other hand, when it is determined in step A <b> 2 that the adhesive tape P is applied, the support substrate S is transported to the bonding device 40 by the second substrate transport device 61.

  In the bonding apparatus 40, the position of the notch portion of the support substrate S is adjusted to adjust the horizontal direction of the support substrate S. The support substrate S stands by in a state where the bonding surface Sj faces upward, that is, in a state where the adhesive tape P faces upward.

  While the supporting substrate S is subjected to the above-described processes A1 to A2, the processing of the substrate W to be processed is performed following the supporting substrate S. The substrate W to be processed is transferred from the cassette Cw of the loading / unloading station 2 to the transition device 50 by the first substrate transfer device 22 and further transferred to the bonding device 40 by the second substrate transfer device 61. At this time, the substrate W to be processed is transported with its bonding surface Wj facing upward.

  In the bonding apparatus 40, the position of the notch portion of the substrate to be processed W is adjusted to adjust the horizontal direction of the substrate to be processed W. As for the to-be-processed substrate W in which the horizontal direction was adjusted, the front and back are reversed (process A3 of FIG. 5). Then, the substrate to be processed W stands by with the bonding surface Wj facing downward.

  Thereafter, in the bonding apparatus 40, the relative position in the horizontal direction between the substrate to be processed W disposed above and the support substrate S disposed below is adjusted, and then the processing atmosphere is evacuated. Then, the substrate to be processed W and the support substrate S are pressed and bonded in a vacuum atmosphere (step A4 in FIG. 5). In addition, since it maintains in a vacuum atmosphere, even if it makes the to-be-processed substrate W and the support substrate S contact, generation | occurrence | production of the void between the said to-be-processed substrate W and the support substrate S can be suppressed. The pressure for pressing the substrate to be processed W and the support substrate S is set according to the type of the adhesive tape P, the type of device on the substrate to be processed W, and the like.

  Next, the superposed substrate T on which the substrate to be processed W and the support substrate S are bonded is transferred to the reversing device 41 by the second substrate transfer device 61. In the reversing device 41, the front and back surfaces of the superposed substrate T are reversed, and the support substrate S of the superposed substrate T is directed upward (step A5 in FIG. 5).

  Next, the superposed substrate T is transported to the ultraviolet processing device 42 by the second substrate transport device 61. In the ultraviolet processing apparatus 42, for example, ultraviolet light having a wavelength band of 405 nm is irradiated onto the polymerization substrate T from a plurality of LEDs provided above the polymerization substrate T (step A6 in FIG. 5). The ultraviolet rays are transmitted through the support substrate S and applied to the adhesive tape P, and the adhesive of the adhesive tape P is cured. Thus, the adhesiveness of the adhesive tape P is improved.

  Next, the superposed substrate T is transported to the transition device 51 by the second substrate transport device 61 and then transported to the cassette Ct of the predetermined cassette mounting plate 11 by the first substrate transport device 22 of the loading / unloading station 2. . In this way, a series of bonding processing of the target substrate W and the support substrate S is completed.

  According to the above embodiment, the steps A1 to A6 are performed inside the one bonding system 1, that is, from the bonding of the adhesive tape P to the support substrate S, the bonding of the target substrate W and the support substrate S, A series of joining processes up to the ultraviolet treatment of the superposed substrate T can be performed efficiently. Further, the application of the adhesive tape P to the support substrate S in the pasting device 30, the joining of the substrate to be processed W and the support substrate S in the joining device 40, and the ultraviolet treatment of the superposed substrate T in the ultraviolet treatment device are performed on different substrates. Can be done in parallel. Therefore, it is possible to efficiently perform the bonding process between the target substrate W and the support substrate S and improve the throughput of the bonding process.

  Further, since the loading / unloading station 2 can have a plurality of substrates to be processed W, a plurality of supporting substrates S or a plurality of superposed substrates T, the processing substrate W and the supporting substrate S are transferred from the loading / unloading station 2 to the processing station 3. It is possible to carry out continuous processing at the processing station 3 by continuously conveying. For this reason, the throughput of the bonding process can be further improved.

  In addition, although the above embodiment demonstrated the case where the adhesive tape P was affixed on the support substrate S before joining, you may affix the adhesive tape P to the to-be-processed substrate W before joining. In such a case, steps A1 to A2 are performed on the substrate to be processed W, and step A3 is performed on the support substrate S. Thereafter, in step A4, the substrate to be processed W and the support substrate S are bonded in a state where the substrate to be processed W is disposed below the support substrate S in the bonding apparatus 40. Thereafter, in step A6, the ultraviolet ray treatment device 42 irradiates the adhesive tape P with ultraviolet rays from the support substrate S side of the polymerization substrate T. Thus, when the adhesive tape P is affixed to the to-be-processed substrate W, inversion of the superposition | polymerization board | substrate T in the inversion apparatus of process A5 is abbreviate | omitted.

<4. Other embodiments>
Next, another embodiment of the present invention will be described. In the joining system 1 described above, the arrangement and number of each device of the processing station 3 can be arbitrarily set.

  For example, in the joining system 1, the sticking device 30 and the inspection device 31 may be omitted. In such a case, the above-described steps A1 to A2 are performed outside the bonding system 1, and the adhesive tape P is affixed to the support substrate S conveyed to the bonding system 1 in advance. And process A3-A6 mentioned above is performed.

  Thus, even if the sticking device 30 and the inspection device 31 are omitted, the same effect as that of the above embodiment can be obtained. That is, a series of bonding processes from bonding of the substrate to be processed W and the support substrate S to ultraviolet treatment of the superposed substrate T can be efficiently performed within one bonding system 1. Further, while the substrate to be processed W and the support substrate S are bonded in the bonding apparatus 40, the ultraviolet ray processing apparatus 42 can perform ultraviolet treatment on another superposed substrate T. Therefore, it is possible to efficiently perform the bonding process between the target substrate W and the support substrate S and improve the throughput of the bonding process.

  For example, as shown in FIG. 6, the joining system 1 may be provided with two joining devices 40. The two joining devices 40, 40 are arranged side by side in the X-axis direction, for example, on the X-axis positive direction side from the reversing device 41 and the ultraviolet processing device 42 of the second processing block G2. In such a case, the two bonding apparatuses 40 can perform the bonding of the target substrate W and the support substrate S in the process A4 in parallel, so that the throughput of the bonding process can be further improved.

  For example, as shown in FIG. 6, the bonding system 1 may further include a reversing device 80 that reverses the front and back surfaces of the superposed substrate T after the ultraviolet treatment is performed. For example, in the first processing block G1, the reversing device 80 is arranged on the X axis negative direction side from the pasting device 30. The reversing device 41 constitutes the first reversing device of the present invention, and the reversing device 80 constitutes the second reversing device of the present invention.

  In such a case, the superposed substrate T that has been subjected to the ultraviolet treatment in step A6 described above is transported to the reversing device 80 by the second substrate transport device 61. In the reversing device 80, the front and back surfaces of the superposed substrate T are reversed, and the substrate W to be processed is directed upward in the superposed substrate T. In this state, the superposed substrate T is transported to the cassette Ct of the predetermined cassette mounting plate 11 in the carry-in / out station 2.

  The orientation of the front and back surfaces of the superposed substrate T unloaded from the bonding system 1 is set according to the subsequent transport of the superposed substrate T, the subsequent processing performed on the superposed substrate T, and the like. By providing the two reversing devices 41 and 80 as described above, the orientation of the front and back surfaces of the superposed substrate T can be freely adjusted, and the degree of freedom of the bonding process is improved. In addition, the reversing device 41 reverses the front and back surfaces of the superposed substrate T before the ultraviolet treatment, and the reversing device 80 reverses the front and back surfaces of the superposed substrate T after the ultraviolet treatment. Therefore, the throughput of the bonding process can be further improved.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood.

DESCRIPTION OF SYMBOLS 1 Joining system 2 Carrying in / out station 3 Processing station 30 Pasting apparatus 31 Inspection apparatus 40 Joining apparatus 41 Inversion apparatus 42 Ultraviolet processing apparatus 60 2nd board | substrate conveyance area 61 2nd board | substrate conveyance apparatus 70 Control part 80 Inversion apparatus P Adhesive tape S Support substrate T Superposition substrate W Substrate

Claims (3)

A bonding system for bonding a substrate to be processed and a support substrate via an adhesive tape,
A processing station for performing a predetermined process on the substrate to be processed, the support substrate, and a superposed substrate to which the substrate to be processed and the support substrate are bonded;
A loading / unloading station capable of holding a plurality of the substrate to be processed, the supporting substrate or the superposed substrate and carrying the substrate to be processed, the supporting substrate or the superposed substrate to / from the processing station; ,
The support substrate is made of a material that transmits ultraviolet rays,
The processing station is
A bonding apparatus for bonding the substrate to be processed and the support substrate via the adhesive tape;
A reversing device for reversing the front and back surfaces of the superposed substrate;
An ultraviolet treatment device that irradiates ultraviolet rays toward the adhesive tape from the support substrate side with respect to the superposed substrate,
A transfer region provided with a transfer device for transferring the substrate to be processed, the support substrate, or the polymerization substrate to the bonding device, the reversing device, and the ultraviolet processing device. system. The reversing device is
A first reversing device for reversing the front and back surfaces of the superposition substrate before the ultraviolet treatment is performed by the ultraviolet treatment device;
The bonding system according to claim 1, further comprising: a second reversing device that reverses the front and back surfaces of the superposed substrate after the ultraviolet treatment is performed by the ultraviolet treatment device. The pressure in the joining device, the pressure in the reversing device, and the pressure in the ultraviolet processing device are negative pressures relative to the pressure in the transfer region, respectively. Joining system.

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