JP2017135153A - Led module for vehicle lighting - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize an LED module for vehicle lighting, in which an LED mounting interval is minimized with respect to the area of an LED light emission face and which is able to efficiently obtain a required light distribution characteristic by virtue of LED emission light.SOLUTION: Above a base substrate 30 on which a plurality of sub-substrates 10 with respective LED elements 2 thereon are mounted, a separator 50 that controls an area where light emitted from each LED element 2 is illuminated is provided. A rib 52, which is a light non-passage part of the separator 50, is located right above a light non-emission area composed of empty spaces 14 among the upper electrode 6 of each LED element 2 in the form of a narrow belt, a wiring pattern 11c formed on each sub-substrate 10, and each sub-substrate 10. Right below an opening 51 of the separator 50, a light emission face 7 of each LED element 2 is located.SELECTED DRAWING: Figure 6

Description

  The present invention relates to an LED module for a vehicle lamp, and more particularly to an LED module for a vehicle lamp formed by mounting a plurality of LED elements on a substrate.

  Conventionally, as this type of LED module, for example, there is one disclosed in Patent Document 1 under the name of “separator fixing structure for vehicle lamp”.

  The disclosed separator fixing structure for a vehicular lamp constitutes a variable light distribution type headlamp (Adaptive Driving Beam: ADB). The ADB technology detects the presence / position of a preceding vehicle / oncoming vehicle in front of the vehicle by a detection means such as an image recognition camera system, and partially reduces the portion that becomes dazzling so as not to dazzle the driver of the preceding vehicle. It is a system to shut off.

  As shown in FIG. 7, the disclosed specific structure is a separator 82 in which a minute gap is provided between the LED 80 and a front surface of a substrate 81 on which a plurality of LEDs (light emitting elements) 80 are mounted at an appropriate interval. Is arranged, and the substrate 81 and the separator 82 are held by the heat sink 84 by the holder 83 to constitute a light source unit.

  In the separator 82, an opening 85 serving as an entrance for light emitted from the LED 80 is formed at each position corresponding to the LED 80 on the surface facing the LED 80. In each opening 85, A reflection surface 86 that reflects light emitted from the LED 80 and passing through the opening 85 toward the front is formed on the front side in all directions.

JP 2013-229131 A

  By the way, in the separator fixing structure having the above configuration, in order to increase the luminous flux (light amount) from each opening 85, it is necessary to increase the light emission amount of the LED 80. For example, the light emission area of the LED 80 is increased. Can be considered.

  In that case, as the light emitting area of the LED 80, in other words, the area of the light emitting surface of the LED 80 increases, the irradiation area by the emitted light from each LED 80 is expanded and the luminous flux is dispersed, and as a result, desired light distribution characteristics are obtained. There is a risk of being lost.

  Further, as the area of the light emitting surface of the LED 80 increases, the mounting interval (pitch) of the LEDs 80 increases, and as a result, the size of the light source unit becomes larger than necessary, and the size of the lamp unit (high beam lamp unit) also increases. This may increase the size of the entire headlamp.

  Therefore, the present invention was devised in view of the above problems, and the object of the present invention is to make the mounting interval of the LED as small as possible with respect to the area of the light emitting surface of the LED, and to achieve the desired by the emitted light of the LED. The object is to realize a light source unit (light source module) capable of efficiently obtaining light distribution characteristics.

  In order to solve the above-mentioned problem, the invention described in claim 1 of the present invention is the light emitted from each LED element above the base substrate on which at least one sub-board on which the LED element is mounted is mounted. An LED module for a vehicle lamp comprising a separator for controlling the irradiation area of the LED, wherein the separator has a window hole having substantially the same shape and dimension as the light emitting surface at a position immediately above each light emitting surface of the LED element. And a rib projecting on the opposite side of the base substrate between the adjacent window holes.

  According to a second aspect of the present invention, in the first aspect, a die bonding pad for mounting the LED element is formed on the submount substrate, and the LED element and the die bonding pad are Both have a rectangular shape, the LED elements are mounted on the sub-board with the same longitudinal direction as the same direction, and the plurality of sub-boards are arranged in a short direction of the sub-board. Is.

  According to a third aspect of the present invention, in any one of the first and second aspects, at least the upper electrode of the LED element and the adjacent sub-substrate are disposed below the rib of the separator. The gap is located.

  According to a fourth aspect of the present invention, in any one of the first to third aspects, the rib of the separator rises from the opening end of the window hole and is opposite to the base substrate. It has an inner surface that is inclined outward.

  According to the present invention, an LED module for a vehicle lamp comprising a separator for controlling an irradiation area of emitted light from each LED element above a base substrate on which a plurality of sub-boards on which LED elements are mounted is mounted. , The rib of the separator is located at least directly above the gap between the upper electrode of the LED element and the adjacent sub-substrate, and the window hole of the separator is located directly above the light emitting surface of the LED element.

  As a result, in the base substrate and the separator on which the plurality of sub-substrates on which the LED elements are mounted are mounted, the region related to the optical path formation and the region not related to the optical path formation are efficiently arranged, thereby adjacent sub-substrates. The arrangement interval between the light emitting surfaces of the LED elements mounted on each of the substrates is shortened and the arrangement pitch is also shortened, thereby realizing miniaturization of the vehicle lamp module.

It is a top view of the LED element which concerns on embodiment. It is a top view of the sub board | substrate which mounted the LED element. It is a top view of the base substrate carrying a sub board | substrate. It is a top view of the state which has arrange | positioned the separator above the base substrate. It is AA sectional drawing of FIG. It is the B section enlarged explanatory view of FIG. It is explanatory drawing of a prior art example.

  Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to FIGS. 1 to 6 (the same parts are denoted by the same reference numerals). The embodiments described below are preferable specific examples of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention particularly limits the present invention in the following description. Unless stated to the effect, the present invention is not limited to these embodiments.

  1 is a plan view of an LED element, FIG. 2 is a plan view of a sub-board on which the LED element is mounted, FIG. 3 is a plan view of a base board on which the sub-board is mounted, and FIG. 4 is a separator disposed above the base board. FIG. 5 is a cross-sectional view taken along the line AA of FIG. 4, and FIG. 6 is an enlarged explanatory view of a portion B of FIG.

  The LED module 1 according to the present invention includes an LED (LED element) 2 as a light source, a sub board 10 on which the LED element 2 is mounted, a base board 30 on which a plurality of sub boards 10 are mounted, and the LED elements 2. A separator 50 for controlling the irradiation area of the light is provided.

  In the LED element 2, a board mounting side surface (hereinafter referred to as “lower surface”) 3 and a surface opposite to the lower surface 3 (hereinafter referred to as “upper surface”) 5 that are opposed to each other have a rectangular shape. In addition, one electrode (hereinafter referred to as “lower electrode”) 4 of a pair of element electrodes is formed on the lower surface 3, and the other electrode of the pair of element electrodes (hereinafter referred to as “upper electrode”) is formed on the upper surface 5. 6) and a light exit surface 7 are formed.

  The lower electrode 4 is formed on the entire lower surface 3, the upper electrode 6 is formed in a strip shape in the edge region along one longitudinal direction of the upper surface 5, and the light emitting surface 7 is formed in the other wide area. Yes.

  For example, an AlN substrate having good thermal conductivity is used as the sub-substrate 10 and has a rectangular shape. The die-bonding pad 13, the pair of wire bonding pads 11a and 11b, and the pair of base substrate connection electrodes 12a are used. , 12b is formed

  Then, the LED element 2 is mounted on one edge side of the edge along the longitudinal direction of the sub-board 10 with the longitudinal direction of the LED element 2 set in the same direction as the longitudinal direction of the sub-board 10 (die bonding). Has been. Thereby, the lower electrode 4 of the LED element 2 and the die bonding pad 13 of the sub-substrate 10 are electrically connected.

  In addition, a pair of wire bonding pads 11a and 11b are arranged on both ends of the upper electrode 6 of the LED element 2 on the other edge side of the edge along the longitudinal direction of the sub-board 10, and are bonded to each other. The pads 11 a and 11 b are connected to each other by a wiring pattern 11 c that is wired along the other edge along the longitudinal direction of the sub-board 10.

  The wire bonding pads 11a and 11b and the die bonding pad 13 are respectively connected to a pair of base substrate connection electrodes 12a and 12b arranged in parallel at one edge portion along the short side direction of the sub-substrate 10. . Among them, the die bonding pad has a rectangular shape, and an extra space to the extent that the bonding material such as solder protrudes is taken into consideration, but has the same shape and dimension as the outer shape of the LED element.

  And each of the both ends of the upper electrode 6 of the LED element 2 is connected to each wire bonding pad 11a, 11b via the bonding wire 8, and the upper electrode 6 of the LED element 2 and each wire bonding pad 11a, 11b are connected. Electrically connected. In this case, each bonding wire 8 is connected to the wire bonding pads 11 a and 11 b from the upper electrode 6 substantially parallel to the longitudinal direction of the LED element 2, but the light emitting surface 7 of the LED element 2 is covered. In other words, if the bonding wire 8 is connected so as to be accommodated in the rib 52 disposed later, the light emitted from the light emitting surface 7 of the LED element 2 is not blocked.

  Thereby, each of the upper electrode 6 and the lower electrode 4 of the LED element 2 is electrically connected to the base substrate connection electrodes 12 a and 12 b of the sub substrate 10.

  The base substrate 30 has good thermal conductivity, for example, an Al substrate or a Cu substrate, and is used for connecting a pair of sub-substrates connected to the pair of base substrate connecting electrodes 12a and 12b of each sub-substrate 10 to be mounted. Electrodes 31a and 31b are formed, and the sub-substrate connection electrodes 31a and 31b are wired on the base substrate 30 and connected to the external connection electrodes 32a and 32b.

  On the base substrate 30, a plurality of sub-substrates 10 are linearly mounted in the short direction at predetermined (constant) intervals, and the base substrate connection electrodes 12 a and 12 b of the sub-substrates 10 and the base substrate 30 are arranged. The sub-substrate connection electrodes 31a and 31b are electrically connected via the bonding wires 8.

  Accordingly, the upper electrode 6 and the lower electrode 4 of the LED element 2 are electrically connected to the external connection electrodes 32 a and 32 b of the base substrate 30.

  Above the base substrate 30, openings (window holes) 51 having the same interval as the arrangement intervals of the plurality of sub-substrates 10 (see FIG. 3) mounted on the base substrate 30, and the openings 51 and the openings A separator 50 having a rib 52 protruding between the base substrate 30 and the opposite side is provided.

  As shown in FIG. 5, each opening 51 has substantially the same shape and dimension as the light emitting surface 7 of the LED element 2, and is positioned immediately above the light emitting surface 7 of each LED element 2. Each rib 52 is located between the light emitting surface 7 of the adjacent LED element 2 and immediately above the area where the wiring pattern 11 c of the sub-board 10 is formed and the area of the upper electrode 6 of the LED element 2. The inner side surface 52a is light-reflective and has an inclined surface that opens outward from the opening end 51a.

  Of the light emitted from the light emitting surface 7 of the LED element 2 when each LED element 2 is lit (during light emission), the light flux emitted directly in the direction directly above the light emitting surface 7 and in the vicinity thereof is directly high. Light is emitted toward the front of the LED element 2 directly through the opening 51 located immediately above.

  On the other hand, of the light emitted from the light emitting surface 7 of the LED element 2, the light having a relatively low luminous flux emitted in the direction away from the directly upward direction rises from the opening end 51 through the opening 51 located immediately above. The inner surface 52a of the rib 52 is reached, reflected by the inner surface 52a, and the reflected light is emitted obliquely forward.

  Thereby, a light distribution pattern for each LED element 2 is formed by the combined light of the direct light emitted from each LED element 2 and the reflected light emitted from the LED element 2 and reflected by the inner surface 52a of the rib 52. Is done.

  Therefore, a desired light distribution pattern (for example, for example, by lighting an appropriate LED element 2 selected from among the LED elements 2 mounted on each of the plurality of sub-boards 10 mounted on the base substrate 30 is combined. A traveling light distribution pattern or a passing light distribution pattern) can be formed. Further, when the light distribution pattern is changed (for example, the light distribution pattern for passing from the light distribution pattern for traveling or the light distribution pattern for traveling from the light distribution pattern for passing) is easily changed by changing the combination of lighting of the LED elements 2. Can be realized.

  The light distribution pattern formed by the combined light of the direct light emitted from the LED element 2 and the reflected light emitted from the LED element 2 and reflected by the inner surface 52a of the rib 52 is It can be easily set by changing the inclination angle of the side surface 52a.

  That is, the vehicle lighting LED module having the above configuration easily realizes light distribution control by ADB.

  As described above, the LED module for vehicle lamps of the present invention (see FIG. 6) includes the LED element 2 serving as a light source, and the upper electrode 6 of the LED element 2 along the one longitudinal direction of the upper surface 5. When the LED element 2 is mounted on the sub-board 10, the LED element 2 is arranged along the other edge along which the upper electrode 6 of the LED element 2 extends along the longitudinal direction of the sub-board 10. The wiring pattern 11c is arranged so as to be close to the arrangement area of the wiring pattern 11c.

  Thus, when the plurality of sub-boards 10 on which the LED elements 2 are mounted are mounted on the base board 30, light is transmitted between the light emitting surfaces 7 of the LED elements 2 mounted on the adjacent sub-boards 10. Regardless of the emission, the gap 14 between the adjacent sub-substrates 10, the arrangement region of the wiring pattern 11c of the sub-substrate 10, and the upper electrode 6 of the LED element 2 are integrated and positioned in one region (non-light-emitting region). .

  When the separator 50 that controls the light distribution of the emitted light from each LED element 2 is disposed above the base substrate 30 on which the plurality of sub-substrates 10 are mounted, between the adjacent openings 51 of the separator 50. The non-light-emitting region is located immediately below the rib 52, which is a non-light-transmitting portion, and the light emitting surface 7 of the LED element 2 is located immediately below the opening 51 of the separator 50.

  Therefore, the non-light-transmitting portion and the non-light-emitting region are located at positions where they overlap each other, and the light-emitting surface 7 of the LED element 2 related to light emission and the opening of the separator 50 related to light passage (light-transmitting). 51 is located at a position where they overlap each other.

  As a result, the arrangement interval between the light emitting surfaces 7 of the LED elements 2 mounted on each of the adjacent sub-boards 10 is efficiently arranged by each of the area related to the optical path formation and the area not related to the optical path formation. Is shortened and the arrangement pitch is also shortened, thereby realizing miniaturization of the vehicle lamp module.

  In the above embodiment, the inner side surface 52a of the rib 52 of the separator 50 has been described as having light reflectivity. However, the inner surface 52a is not necessarily light reflectivity, and may not have light reflectivity. .

  In that case, the light distribution pattern formed by the emitted light of each LED element 2 is substantially due to the direct light of the LED element 2. Therefore, the desired light distribution pattern is realized more accurately because the light distribution pattern obtained is hardly reflected by the inner surface 52a of the rib 52 of the separator 50.

  By the way, as an application example of the above-described embodiment, there is a submount in which all LED elements can be mounted on one submount, or several LED elements are mounted on one submount and a plurality of submounts are mounted. There is also a form in which all LED elements are arranged on the base substrate side by side. In any form, if both the LED element and the die bonding pad on the submount have a rectangular shape, the rib of the separator is arranged in the gap between the upper electrode of the LED element and the adjacent sub-substrate. can do.

DESCRIPTION OF SYMBOLS 1 ... LED module 2 ... LED (LED element)
DESCRIPTION OF SYMBOLS 3 ... Lower surface 4 ... Lower electrode 5 ... Upper surface 6 ... Upper electrode 7 ... Light emission surface 8 ... Bonding wire 10 ... Sub board | substrate 11 ... Wire bonding pad 11a ... Wire bonding pad 11b ... Wire bonding pad 11c ... Wiring pattern 12 ... Base board Connecting electrode 12a ... Base substrate connecting electrode 12b ... Base substrate connecting electrode 13 ... Die bonding pad 14 ... Gap 30 between sub substrates ... Base substrate 31 ... Sub substrate connecting electrode 31a ... Sub substrate connecting electrode 31b ... Sub Substrate connection electrode 32 ... External connection electrode 32a ... External connection electrode 32b ... External connection electrode 50 ... Separator 51 ... Opening (window hole)
51a ... Open end 52 ... Rib 52a ... Inside surface

Claims (4)

An LED module for a vehicle lamp comprising a separator for controlling an irradiation area of emitted light from each LED element above a base substrate on which at least one sub-board on which the LED element is mounted is mounted,
The separator has a window hole having substantially the same shape and dimension as the light emitting surface at a position immediately above each light emitting surface of the LED element, and a rib protruding to the opposite side of the base substrate between the adjacent window holes. The LED module for vehicle lamps characterized by having.   A die bonding pad for mounting the LED element is formed on the submount substrate. The LED element and the die bonding pad both have a rectangular shape, and the LED element has the same longitudinal direction as the sub direction. 2. The LED module for a vehicle lamp according to claim 1, wherein the LED module is mounted on a substrate and the plurality of sub-substrates are arranged in a short direction of the sub-substrate.   3. The vehicle lamp according to claim 1, wherein at least a gap between the upper electrode of the LED element and the adjacent sub-substrate is located below the rib of the separator. 4. LED module.   The rib of the separator has an inner surface that rises from an opening end portion of the window hole and inclines outward toward the opposite side of the base substrate. LED module for vehicle lighting.