JP2017103252A - Display device and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display device having excellent reliability.SOLUTION: A display device comprises: a first substrate; a plurality of light-emitting elements which are arranged in a display region on the first substrate and each of which includes a light-emitting layer; a first inorganic layer located in a hierarchy between the first substrate and the light-emitting layer; a second inorganic layer covering the plurality of light-emitting layers; a third inorganic layer located in a hierarchy between the first inorganic layer and the second inorganic layer; a first organic layer located in a hierarchy between the second inorganic layer and the third inorganic layer in the peripheral region surrounding the display region on the first substrate; and a second organic layer located between a hierarchy between the first inorganic layer and the third inorganic layer in the peripheral region. In the peripheral region, the outer edges of the first organic layer and the second organic layer are covered so as to be shielded by the second inorganic layer.SELECTED DRAWING: Figure 7

Description

  The present disclosure relates to a display device having a self-luminous light emitting element including an organic layer, and an electronic apparatus including such a display device.

  An organic EL element that emits light by utilizing an organic electroluminescence (EL) phenomenon of an organic material includes an organic layer in which an organic hole transport layer or an organic light emitting layer is laminated between an anode and a cathode. It is configured and attracts attention as a light emitting element capable of emitting light with high luminance by low voltage direct current drive. However, in the display device (organic EL display device) using this organic EL element, the organic layer in the organic EL element is deteriorated due to moisture absorption, and the light emission luminance in the organic EL element is lowered or the light emission becomes unstable. There was a problem that the stability over time was low and the life was short.

  Therefore, for example, in Patent Document 1, a cover material for sealing is disposed on the element forming surface side of the substrate on which the organic EL elements and other circuits are formed, and the peripheral portion between the substrate and the cover material is a sealing material. There has been proposed an organic EL display device which is sealed with the above. Further, this Patent Document 1 also proposes a structure in which the outside of the sealing material is covered with a hard carbon film as a protective film that prevents intrusion of water vapor or the like. With such a configuration, the organic EL element formed on the substrate is completely cut off from the outside, and it is possible to prevent substances such as moisture and oxygen that promote deterioration due to oxidation of the organic EL element from entering from the outside. It has become.

  In addition to this, a completely solid organic material in which a cover material for sealing is bonded to an element forming surface side of the substrate on which an organic EL element or other circuit is formed via an adhesive. An EL display device has also been proposed.

  Furthermore, an organic EL display device has also been proposed in which a separation groove for separating the organic insulating film described above into an inner region side and an outer region side is formed at a position surrounding the display region (outer edge side of the display region). (For example, see Patent Documents 2 and 3). By providing such a separation groove, it is possible to prevent moisture existing on the outer region side in the organic insulating film from entering the inner region side (display region side) through the organic insulating film. Therefore, it is possible to suppress the deterioration of the organic layer (organic EL element) due to the moisture left in the display device passing through the organic insulating film.

JP 2002-93576 A JP 2006-54111 A JP 2008-283222 A

By the way, recently, an organic EL display device is also mounted on a portable information terminal device such as a so-called tablet personal computer (PC) or a smartphone (multifunctional mobile phone). In such a portable information terminal, the size of the main body cannot be increased so as to ensure portability. On the other hand, it is necessary to secure an effective screen area as large as possible from the viewpoint of ensuring visibility and operability for the user. Therefore, what is called a narrow frame is desired in which the occupied area of the peripheral area other than the effective screen area in the main body of the portable information terminal is reduced as much as possible.

  However, in the structures proposed in Patent Documents 2 and 3, it is difficult to narrow the frame when using an area mask when forming an organic layer or the like as in the case of a white organic EL element or the like. It was. In other words, in consideration of misalignment of the area mask (mask displacement region) and wraparound of the film (tapered region), it is actually necessary to form the above-described separation groove at a position sufficiently away from the display region. For this reason, it is necessary to take a large frame (need to increase the distance between the display area and the peripheral area), and it becomes difficult to narrow the frame. In addition, it is necessary to increase the distance between the display region and the peripheral region. This is because moisture contained in the organic insulating layer in this region (inner region of the separation groove) enters the organic layer. As a result, the organic layer deteriorates.

  The present disclosure has been made in view of such problems, and an object of the present disclosure is to provide a display device that suppresses deterioration of a light emitting element due to moisture, has high reliability, and has a larger effective screen area, and such a display device. The object is to provide an electronic device equipped.

The first display device of the present disclosure includes the following components.
(1) First substrate.
(2) A plurality of light emitting elements arranged in the display region on the first substrate and each including a light emitting layer.
(3) The 1st inorganic layer located in the hierarchy between a 1st board | substrate and a light emitting layer.
(4) A second inorganic layer covering the plurality of light emitting layers.
(5) The 3rd inorganic layer located in the hierarchy between the 1st inorganic layer and the 2nd inorganic layer.
(6) A first organic layer located in a layer between the second inorganic layer and the third inorganic layer in a peripheral region surrounding the display region on the first substrate.
(7) A second organic layer located in a hierarchy between the first inorganic layer and the third inorganic layer in the peripheral region.
Here, in the peripheral region, the outer edge of the first organic layer and the outer edge of the second organic layer are both covered with the second inorganic layer.

The second display device of the present disclosure includes the following components.
(1) First substrate.
(2) A plurality of light emitting elements arranged in the display region on the first substrate and each including a light emitting layer.
(3) The 1st inorganic layer located in the hierarchy between a 1st board | substrate and a light emitting layer.
(4) A second inorganic layer covering the plurality of light emitting layers.
(5) The 3rd inorganic layer located in the hierarchy between the 1st inorganic layer and the 2nd inorganic layer.
(6) A first organic layer located in a layer between the second inorganic layer and the third inorganic layer in a peripheral region surrounding the display region on the first substrate.
(7) A second organic layer located in a hierarchy between the first inorganic layer and the third inorganic layer in the peripheral region.
Here, in the peripheral region, the outer edge of the first organic layer is covered with the second inorganic layer, and the outer edge of the first organic layer is in a position overlapping the third inorganic layer in the thickness direction. In the peripheral region, the outer edge of the second organic layer is covered with the second inorganic layer, and the outer edge of the second organic layer is in a position overlapping the first inorganic layer in the thickness direction.

  An electronic device according to the present disclosure includes the display device according to the present disclosure.

  According to the display device and the electronic apparatus of the present disclosure, it is possible to effectively prevent moisture from entering from the peripheral region to the display region with a simple structure. Therefore, deterioration of the light-emitting element due to moisture can be suppressed, high reliability can be achieved, and a narrow frame can be achieved.

It is a figure showing the structure of the display apparatus which concerns on one embodiment of this indication. It is a figure showing an example of the pixel drive circuit shown in FIG. It is a top view showing the structure of the display area shown in FIG. It is sectional drawing showing the structure of the display area shown in FIG. FIG. 6 is another cross-sectional view illustrating the configuration of the display area illustrated in FIG. 1. FIG. 6 is an enlarged cross-sectional view illustrating the organic layer illustrated in FIGS. 4 and 5. It is sectional drawing showing the principal part structure of the display apparatus as a 1st modification. It is sectional drawing showing the principal part structure of the display apparatus as a 2nd modification. It is sectional drawing showing the principal part structure of the display apparatus as a 3rd modification. It is sectional drawing showing the principal part structure of the display apparatus as a 4th modification. It is an expanded sectional view showing the principal part structure of the display apparatus as a 5th modification. It is sectional drawing showing the principal part structure of the display apparatus as a 6th modification. It is a top view showing schematic structure of the module containing display apparatuses, such as the said embodiment. It is a perspective view showing the external appearance of the television apparatus as a 1st application example of a display apparatus. It is a 1st perspective view showing the external appearance in the digital camera as a 2nd application example of a display apparatus. It is a 2nd perspective view showing the external appearance in the digital camera as a 2nd example of application of a display apparatus. It is a perspective view showing the external appearance of the notebook type personal computer as a 3rd example of application of a display apparatus. It is a perspective view showing the external appearance of the video camera as a 4th example of application of a display apparatus. FIG. 10 is a front view, a left side view, a right side view, a top view, and a bottom view showing the appearance of a closed state of a mobile phone as a fifth application example of the display device. It is the front view and side view of an open state in the mobile telephone as a 5th example of application of a display. It is a 1st perspective view showing the external appearance in the tablet type PC as a 6th application example using a display apparatus. It is a 2nd perspective view showing the external appearance in the tablet-type PC as a 6th application example using a display apparatus. It is sectional drawing showing the principal part structure of the display apparatus as a 7th modification. It is sectional drawing showing the principal part structure of the display apparatus as an 8th modification. It is an expanded sectional view showing the principal part structure of the display apparatus as a 9th modification. It is sectional drawing showing the principal part structure of the display apparatus as a 10th modification. It is sectional drawing showing the principal part structure of the display apparatus as an 11th modification. It is sectional drawing showing the principal part structure of the display apparatus as a 12th modification. It is sectional drawing showing the principal part structure of the display apparatus as a 13th modification. It is other sectional drawing showing the principal part structure of the display apparatus as a 13th modification. FIG. 23 is a perspective view for explaining a method for manufacturing the display device shown in FIGS. 22A and 22B. It is sectional drawing showing the principal part structure of the display apparatus as a 14th modification. It is other sectional drawing showing the principal part structure of the display apparatus as a 14th modification. It is sectional drawing showing the principal part structure of the display apparatus as a 15th modification. FIG. 26 is a perspective view for explaining a method for manufacturing the display device shown in FIG. 25. It is sectional drawing showing the principal part structure of the display apparatus as a 16th modification.

Hereinafter, embodiments and application examples of the present disclosure will be described in detail with reference to the drawings. The description will be given in the following order.
1. 1. Embodiment (FIGS. 1 to 10): Display device Application example of display device (FIGS. 11 to 17): electronic device

<Embodiment>
[Example of overall configuration of organic EL display device]
FIG. 1 illustrates an overall configuration example of an organic EL display device 1 (hereinafter simply referred to as a display device 1) according to an embodiment of the present disclosure. The display device 1 is used as an organic EL television device or the like, and a display area 110 </ b> A is provided on a substrate 111. In the display area 110A, a plurality of sub-pixels 10R, 10G, and 10B are arranged in a matrix. The sub pixel 10R displays red, the sub pixel 10G displays green, and the sub pixel 10B displays blue. Here, the sub-pixels displaying the same color are arranged in a line in the Y direction and are repeatedly arranged in order in the X direction. Therefore, a combination of three sub-pixels arranged in the X direction forms one pixel (pixel). Further, a signal line driving circuit 120 and a scanning line driving circuit 130 which are drivers for video display (a peripheral circuit 12B described later) are provided in the peripheral area 110B located around the display area 110A (outer edge side, outer peripheral side). It has been.

  The signal line driving circuit 120 supplies a signal voltage of a video signal corresponding to luminance information supplied from a signal supply source (not shown) to the selected pixel via the signal line 120A.

  The scanning line driving circuit 130 includes a shift register that sequentially shifts (transfers) the start pulse in synchronization with the input clock pulse. The scanning line driving circuit 130 scans them in units of rows when writing video signals to the respective pixels, and sequentially supplies the scanning signals to the respective scanning lines 130A.

  A pixel drive circuit 140 is provided in the display area 110A. FIG. 2 shows an example of the pixel driving circuit 140 (an example of a pixel circuit of the subpixels 10R, 10G, and 10B). The pixel driving circuit 140 is an active driving circuit formed in a lower layer (a pixel driving circuit forming layer 112 described later) of the first electrode layer 13 described later. The pixel driving circuit 140 includes a driving transistor Tr1 and a writing transistor Tr2, and a capacitor (holding capacity) Cs therebetween. The pixel driving circuit 140 also includes a white organic EL element 10W (hereinafter simply referred to as an EL element 10W) connected in series to the driving transistor Tr1 between the first power supply line (Vcc) and the second power supply line (GND). .)have. That is, the EL elements 10W are provided in the subpixels 10R, 10G, and 10B, respectively. The driving transistor Tr1 and the writing transistor Tr2 are configured by a general thin film transistor (TFT), and the configuration may be, for example, an inverted staggered structure (so-called bottom gate type) or a staggered structure (top gate type). There is no particular limitation.

  In the pixel driving circuit 140, a plurality of signal lines 120A are arranged in the column direction, and a plurality of scanning lines 130A are arranged in the row direction. An intersection between each signal line 120A and each scanning line 130A corresponds to one of the sub-pixels 10R, 10G, and 10B. Each signal line 120A is connected to the signal line drive circuit 120, and an image signal is supplied from the signal line drive circuit 120 to the source electrode of the write transistor Tr2 via the signal line 120A. Each scanning line 130A is connected to the scanning line driving circuit 130, and a scanning signal is sequentially supplied from the scanning line driving circuit 130 to the gate electrode of the writing transistor Tr2 via the scanning line 130A.

[Example of planar configuration of display device]
FIG. 3 shows an example of the configuration of the display area 110A that extends on the XY plane. Here, the planar configuration of the display region 110A in a state where the second electrode layer 16, the filling layer 18, and the sealing substrate 19 (all of which will be described later) are removed and the peripheral region 110B surrounding the display region 110A is schematically shown. Represent. As shown in FIG. 3, in the display area 110A, a plurality of EL elements 10W are arranged in the X direction and the Y direction, and are arranged in a matrix as a whole. More specifically, the EL elements 10W each including the light emitting portions 20 that are separated from each other by the opening defining insulating film 24 and have a defined outline are arranged one by one in correspondence with the sub-pixels 10R, 10G, and 10B. .

  In FIG. 3, a rectangle indicated by a broken line surrounding the light emitting unit 20 represents a region where the organic layer 14 is formed. Furthermore, the rectangle shown by the broken line surrounding the region where the organic layer 14 is formed represents the region where the first electrode layer 13 is formed. A part of the first electrode layer 13 is provided with, for example, a contact portion 124 that is conductive with the source electrode of the drive transistor Tr1. The number of sub-pixels arranged in the X direction and the Y direction is arbitrarily set, and is not limited to the number shown in FIG. Further, for example, subpixels for displaying yellow and white may be further provided, and one pixel may include four or more EL elements 10W.

[Cross-sectional configuration of display device 1]
FIG. 4 shows a schematic configuration of the XZ section along the IV-IV line shown in FIG. 3 in the vicinity of the boundary between the display area 110A and the peripheral area 110B. FIG. 5 is a cross-sectional view taken along line VV of the display area 110A shown in FIG. FIG. 6 is an enlarged view of a part of the cross section of the organic layer 14 shown in FIGS. 4 and 5.

  In the display device 1 according to the present embodiment, any one of R (red), G (green), and B (blue) color light is emitted from the upper surface (the substrate 111 and the substrate) by using the EL element 10W described above and a color filter described later. This is a top emission type (so-called top emission type) display device that is emitted from an opposing sealing substrate 19). As shown in FIG. 4, in the display area 110 </ b> A, the light emitting element forming layer 12 including the EL element 10 </ b> W is formed on the substrate 11 in which the pixel driving circuit forming layer 112 is provided on the substrate 111. On the EL element 10W, a moisture-proof film 17, a filling layer 18, and a sealing substrate 19 are provided in this order. The display area 110 </ b> A and the peripheral area 110 </ b> B are partitioned by a seal portion 23 provided along the peripheral edge portion of the facing surface 19 </ b> S facing the substrate 111 of the sealing substrate 19. The EL element 10 </ b> W includes a first electrode layer 13 as an anode electrode, an organic layer 14 including a light emitting layer 14 </ b> C (described later), and a cathode electrode on the planarizing film 218 that is the uppermost layer of the pixel drive circuit formation layer 112. The second electrode layers 16 are laminated in order. The organic layer 14 and the first electrode layer 13 are separated for each EL element 10W by the opening defining insulating film 24. Both the planarizing film 218 and the opening regulating insulating film 24 are made of an organic material having good pattern accuracy such as polyimide, acrylic, or siloxane. On the other hand, the second electrode layer 16 is provided in common to all the EL elements 10W. In FIG. 4, the detailed configurations of the drive transistor Tr1 and the write transistor Tr2 in the pixel drive circuit formation layer 112 are not shown.

  The base 11 is obtained by providing a pixel driving circuit forming layer 112 including a pixel driving circuit 140 on a substrate 111. The substrate 111 is a support on which the EL elements 10W are arranged, and for example, quartz, glass, metal foil, or a resin film or sheet is used. Of these, quartz and glass are preferable. In the case of resin, methacrylic resins represented by polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene naphthalate ( Polyesters such as PBN) or polycarbonate resins may be mentioned, but it is necessary to perform a laminated structure and surface treatment that suppress water permeability and gas permeability. On the surface of the substrate 111, as a first layer metal layer, a metal layer 211G as a gate electrode of the drive transistor Tr1, a metal layer 221G (FIG. 5) as a gate electrode of the write transistor Tr2, and a signal line 120A ( And FIG. 5). The metal layers 211G and 221G and the signal line 120A are covered with a gate insulating film 212 made of silicon nitride, silicon oxide, or the like.

  In regions corresponding to the metal layers 211G and 221G on the gate insulating film 212, channel layers 213 and 223 made of a semiconductor thin film such as amorphous silicon are provided. Insulating channel protective films 214 and 224 are provided on the channel layers 213 and 223 so as to occupy the channel regions 213R and 223R which are the center regions thereof, and n-type amorphous silicon or the like is provided on both sides thereof. The drain electrodes 215D and 225D and the source electrodes 215S and 225S made of the n-type semiconductor thin film are provided. The drain electrodes 215D and 225D and the source electrodes 215S and 225S are separated from each other by the channel protective films 214 and 224, and their end faces are separated from each other with the channel regions 213R and 223R interposed therebetween. Furthermore, metal layers 216D and 226D as drain wirings and metal layers 216S and 226S as source wirings are provided as second-layer metal layers so as to cover drain electrodes 215D and 225D and source electrodes 215S and 225S, respectively. Yes. The metal layers 216D and 226D and the metal layers 216S and 226S have a structure in which, for example, a titanium (Ti) layer, an aluminum (Al) layer, and a titanium layer are sequentially stacked. In addition to the metal layers 216D and 226D and the metal layers 216S and 226S, a scanning line 130A (not shown) is provided as the second layer metal layer. The metal layer 216S is connected to an external connection wiring 31 such as an FPC in the peripheral region 110B (FIG. 4).

  The pixel drive circuit 140 is a protection made of an inorganic material having low moisture permeability, such as silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiNxOy), titanium oxide (TiOx), or aluminum oxide (AlxOy). A film (passivation film) 217 is entirely covered, and an insulating planarizing film 218 is provided thereon. The planarization film 218 is desired to have an extremely high surface. Further, fine contact portions 124 are provided in partial regions of the planarizing film 218 and the protective film 217 (FIG. 4). The contact portion 124 is filled with the first electrode layer 13 and is electrically connected to the metal layer 216S constituting the source electrode of the drive transistor Tr1.

  The first electrode layer 13, which is a lower electrode formed on the planarizing film 218, also functions as a reflective layer, and it is desirable that the first electrode layer 13 is made of a material having as high a reflectance as possible in order to increase the light emission efficiency. Therefore, the first electrode layer 13 is made of a highly reflective material such as aluminum (Al) or aluminum neodymium alloy (AlNd). For example, the first electrode layer 13 has a thickness in the stacking direction (hereinafter simply referred to as a thickness) of 10 nm to 1000 nm. The constituent material of the first electrode layer 13 is not limited to the above material, but is chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tungsten (W) or silver (Ag). ) Or a metal element alone or an alloy thereof. In addition, a metal film made of a simple substance or an alloy of these metal elements and a transparent conductive material such as a compound of indium and tin oxide (ITO), InZnO (indium zinc oxide), zinc oxide (ZnO) and aluminum (Al) You may have a laminated structure with a film | membrane.

  The opening regulating insulating film 24 is provided so as to fill a gap between the first electrode layer 13 and the organic layer 14 in the adjacent EL element 10 </ b> W, that is, a gap between the light emitting units 20. The opening defining insulating film 24 is also referred to as a partition wall, and ensures insulation between the first electrode layer 13 and the second electrode layer 16 and accurately defines the contour of the light emitting portion 20 of the EL element 10W. is there. That is, the light emitting region is defined by the opening defining insulating film 24. The opening defining insulating film 24 also has a function as a partition wall when performing application by an ink jet or nozzle coating method in a manufacturing process described later. Note that the organic layer 14 to the second electrode layer 16 may be provided not only on the opening but also on the opening defining insulating film 24, but light emission is caused by light emission corresponding to the opening of the opening defining insulating film 24. Only the part 20 is provided.

  The organic layer 14 is formed over the entire surface of the light emitting unit 20 defined by the opening defining insulating film 24 without any gaps. For example, as shown in FIG. 6, the organic layer 14 has a configuration in which a hole injection layer 14A, a hole transport layer 14B, a light emitting layer 14C, and an electron transport layer 14D are sequentially stacked from the first electrode layer 13 side. . However, layers other than the light emitting layer 14C may be provided as necessary.

  The hole injection layer 14A is a buffer layer for increasing the efficiency of hole injection into the light emitting layer 14C and preventing leakage. The thickness of the hole injection layer 14A is preferably, for example, 5 nm to 100 nm, and more preferably 8 nm to 50 nm. The constituent material of the hole injection layer 14A may be appropriately selected in relation to the material of the electrode and the adjacent layer. Polyaniline, polythiophene, polypyrrole, polyphenylene vinylene, polythienylene vinylene, polyquinoline, polyquinoxaline and derivatives thereof, Examples thereof include conductive polymers such as polymers containing an aromatic amine structure in the main chain or side chain, metal phthalocyanines (such as copper phthalocyanine), and carbon. When the material used for the hole injection layer 14A is a polymer material, the polymer material may have a weight average molecular weight (Mw) in the range of 10,000 to 300,000, particularly about 5,000 to 200,000. preferable. In addition, an oligomer of about 2000 to 10,000 may be used, but if Mw is less than 5000, the hole injection layer may be dissolved when forming the layer after the hole transport layer. If it exceeds 300,000, the material may gel and film formation may be difficult. Typical conductive polymers used as the constituent material of the hole injection layer 14A include polydioxythiophenes such as polyaniline, oligoaniline and poly (3,4-ethylenedioxythiophene) (PEDOT). . In addition, a polymer marketed by Nafion (trademark) manufactured by H.C. Starck, or a polymer marketed in dissolved form by the trade name Liquion (trademark), Elsauce (trademark) manufactured by Nissan Chemical, and Soken Chemical There is a conductive polymer Verazol (trademark) and the like.

  The hole transport layer 14B is intended to increase the hole transport efficiency to the light emitting layer 14C. The thickness of the hole transport layer 14B depends on the entire configuration of the element, but is preferably, for example, 10 nm to 200 nm, and more preferably 15 nm to 150 nm. As the polymer material constituting the hole transport layer 14B, a light-emitting material soluble in an organic solvent, for example, polyvinyl carbazole, polyfluorene, polyaniline, polysilane or a derivative thereof, and an aromatic amine in the side chain or main chain Polysiloxane derivatives, polythiophene and its derivatives, polypyrrole, and the like can be used. When the material used for the hole transport layer 14B is a polymer material, the weight average molecular weight (Mw) is preferably 50,000 to 300,000, and more preferably 100,000 to 200,000. . When the Mw is less than 50,000, when the light emitting layer 14C is formed, the low molecular component in the polymer material is dropped and dots are generated in the hole injection layer 14A and the hole transport layer 14B. There is a risk that the performance may deteriorate or the element may deteriorate. On the other hand, if it exceeds 300,000, the material is gelled, which may make film formation difficult. In addition, a weight average molecular weight (Mw) is the value which calculated | required the weight average molecular weight of polystyrene conversion by the gel permeation chromatography (GPC; Gel Permeation Chromatography) using tetrahydrofuran as a solvent.

The light emitting layer 14C generates light by applying an electric field to recombine electrons and holes. The thickness of the light emitting layer 14C is preferably, for example, 10 nm to 200 nm, and more preferably 15 nm to 150 nm, although it depends on the overall structure of the element. The light emitting layer 14 </ b> C is composed of a mixed material in which a low molecular material is added to a polymer (light emitting) material. Here, the low molecular weight material is preferably a monomer or an oligomer in which 2 to 10 monomers are bonded and has a weight average molecular weight of 50,000 or less. Note that low molecular weight materials having a weight average molecular weight exceeding the above range are not necessarily excluded. The light emitting layer 14C may be formed by a coating method such as inkjet. In this case, the high molecular material and the low molecular material are, for example, toluene, xylene, anisole, cyclohexanone, mesitylene (1,3,5-trimethylbenzene), bsidecumene (1,2,4-trimethylbenzene), dihydrobenzofuran, 1, Organics such as 2,3,4-tetramethylbenzene, tetralin, cyclohexylbenzene, 1-methylnaphthalene, p-anisyl alcohol, dimethylnaphthalene, 3-methylbiphenyl, 4-methylbiphenyl, 3-isopropylbiphenyl, monoisopropylnaphthalene It dissolves in a solvent using at least one kind and forms using this mixed solution. Examples of the polymer material constituting the light emitting layer 14C include polyfluorene polymer derivatives, (poly) paraphenylene vinylene derivatives, polyphenylene derivatives, polyvinylcarbazole derivatives, polythiophene derivatives, perylene dyes, coumarin dyes, rhodamine dyes. Or what doped the organic electroluminescent material to the said polymer | macromolecule is mentioned. As the dope material, for example, rubrene, perylene, 9,10 diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6 and the like can be used.

  Moreover, it is preferable to add a low molecular material to the high molecular material which comprises the light emitting layer 14C. The low molecular weight material added to the light emitting layer 14C is a compound other than a compound composed of a high molecular weight polymer or a condensate molecule generated by repeating the same reaction or a similar reaction in a low molecular weight compound, The molecular weight is substantially single. In addition, no new chemical bond between molecules is generated by heating, and it exists as a single molecule. Such a low molecular weight material preferably has a weight average molecular weight (Mw) of 50,000 or less. This is because a material having a large molecular weight, for example, a material having a molecular weight that is somewhat smaller than a material having a molecular weight of 50,000 or more has various characteristics, and it is easy to adjust the mobility of holes or electrons, the band gap, or the solubility in a solvent. It is. The addition amount of the low molecular weight material is preferably such that the mixing ratio of the high molecular material: low molecular weight material used for the light emitting layer 14C is 10: 1 or more and 1: 2 or less by weight ratio. This is because if the mixing ratio of the polymer material to the low molecular material is less than 10: 1, the effect of the addition of the low molecular material becomes low. In addition, when the mixing ratio exceeds 1: 2, it is difficult to obtain the characteristics of the polymer material as the light emitting material. Examples of such low molecular weight materials include benzine, styrylamine, triphenylamine, porphyrin, triphenylene, azatriphenylene, tetracyanoquinodimethane, triazole, imidazole, oxadiazole, polyarylalkane, phenylenediamine, and arylamine. Oxazole, anthracene, fluorenone, hydrazone, stilbene, or derivatives thereof, or heterocyclic conjugated monomers or oligomers such as polysilane compounds, vinylcarbazole compounds, thiophene compounds, or aniline compounds can be used. More specific materials include α-naphthylphenylphenylenediamine, porphyrin, metal tetraphenylporphyrin, metal naphthalocyanine, hexacyanoazatriphenylene, 7,7,8,8-tetracyanoquinodimethane (TCNQ), 7,7. , 8,8-tetracyano-2,3,5,6-tetrafluoroquinodimethane (F4-TCNQ), tetracyano 4,4,4-tris (3-methylphenylphenylamino) triphenylamine, N, N, N ′, N′-tetrakis (p-tolyl) p-phenylenediamine, N, N, N ′, N′-tetraphenyl-4, 4′-diaminobiphenyl, N-phenylcarbazole, 4-di-p-tolyl Aminostilbene, poly (paraphenylene vinylene), poly (thiophene vinylene), poly (2,2′-thie Rupiroru) and the like, but not limited thereto. The low molecular weight material added to the light emitting layer 14C is not limited to one type, and a plurality of types may be mixed and used.

  As the light-emitting guest material constituting the light-emitting layer 14C, a material having high light emission efficiency, for example, an organic light-emitting material such as a low-molecular fluorescent material, a phosphorescent dye, or a metal complex is used. Here, the blue light-emitting guest material refers to a compound having a peak in the light emission wavelength range of about 400 nm to 490 nm. As such a compound, an organic substance such as a naphthalene derivative, anthracene derivative, naphthacene derivative, styrylamine derivative, or bis (azinyl) methene boron complex is used. Among these, it is preferable to select from aminonaphthalene derivatives, aminoanthracene derivatives, aminochrysene derivatives, aminopyrene derivatives, styrylamine derivatives, and bis (azinyl) methene boron complexes.

  The electron transport layer 14D is for increasing the efficiency of electron transport to the light emitting layer 14C. Examples of the material for the electron transport layer 14D include quinoline, perylene, phenanthroline, bisstyryl, pyrazine, triazole, oxazole, fullerene, oxadiazole, fluorenone, and derivatives and metal complexes thereof. Specifically, tris (8-hydroxyquinoline) aluminum (abbreviated as Alq3), anthracene, naphthalene, phenanthrene, pyrene, anthracene, perylene, butadiene, coumarin, C60, acridine, stilbene, 1,10-phenanthroline, or derivatives thereof A metal complex is mentioned.

  An electron injection layer (not shown) made of LiF, Li2O or the like may be provided between the electron transport layer 14D and the second electrode layer 16. This electron injection layer is for increasing the electron injection efficiency, and is provided on the entire surface of the electron transport layer 14D. Examples of the material for such an electron injection layer include lithium oxide (Li2O) which is an oxide of lithium (Li), cesium carbonate (Cs2CO3) which is a composite oxide of cesium (Cs), and oxides thereof. And a mixture of complex oxides can be used. Further, the electron injection layer is not limited to such a material. For example, alkaline earth metals such as calcium (Ca) and barium (Ba), alkali metals such as lithium and cesium, and indium (In ), Magnesium (Mg) and other metals having a small work function, and oxides and composite oxides and fluorides of these metals alone or a mixture of these metals and oxides and composite oxides and fluorides. Alternatively, it may be used with increased stability as an alloy.

  The organic layer 14 may further include another hole transport layer so as to be in contact with the light emitting layer 14C. Since this other hole transport layer is formed by vapor deposition, it is preferable to use a low molecular weight material, particularly a monomer. This is because polymerized molecules such as oligomers or polymer materials may decompose during vapor deposition. In addition, the low molecular material used for another hole transport layer may be used by mixing two or more materials having different molecular weights. As the low molecular weight material used for the other hole transport layer, for example, benzine, styrylamine, triphenylamine, porphyrin, triphenylene, azatriphenylene, tetracyanoquinodi, similar to the low molecular weight material described in the light emitting layer 14C. Methane, triazole, imidazole, oxadiazole, polyarylalkane, phenylenediamine, arylamine, oxazole, anthracene, fluorenone, hydrazone, stilbene or their derivatives, polysilane compounds, vinylcarbazole compounds, thiophene compounds or anilines Heterocyclic conjugated monomers, oligomers, or polymers such as compounds can be used. More specific materials include α-naphthylphenylphenylenediamine, porphyrin, metal tetraphenylporphyrin, metal naphthalocyanine, hexacyanoazatriphenylene, 7,7,8,8-tetracyanoquinodimethane (TCNQ), 7,7. , 8,8-tetracyano-2,3,5,6-tetrafluoroquinodimethane (F4-TCNQ), tetracyano 4,4,4-tris (3-methylphenylphenylamino) triphenylamine, N, N, N ′, N′-tetrakis (p-tolyl) p-phenylenediamine, N, N, N ′, N′-tetraphenyl-4, 4′-diaminobiphenyl, N-phenylcarbazole, 4-di-p-tolyl Aminostilbene, poly (paraphenylene vinylene), poly (thiophene vinylene), poly (2,2′-thio Nirupiroru) and the like, but not limited thereto.

  The second electrode layer 16 is a common electrode provided in common to two or more or all of the EL elements 10W, and is disposed opposite to the first electrode layer 13 in each EL element 10W. The second electrode layer 16 is formed so as to cover not only the organic layer 14 but also the opening defining insulating film 24, and has a thickness of 2 nm to 15 nm, for example. The 2nd electrode layer 16 is a transparent electrode comprised with the electroconductive material which has translucency with respect to the light which generate | occur | produced in the light emitting layer. Therefore, as the constituent material, for example, ITO, a compound containing indium, zinc (Zn) and oxygen (for example, IZO), ZnO (zinc oxide), or the like is preferable. The second electrode layer 16 is a semi-transmissive reflective film made of a simple substance or an alloy of a metal element such as aluminum (Al), magnesium (Mg), calcium (Ca), sodium (Na). Also good. For example, an alloy of magnesium and silver (MgAg alloy) or an alloy of aluminum (Al) and lithium (Li) (AlLi alloy) is preferable. In particular, in the case of an Mg—Ag alloy, it is desirable that the film thickness ratio is in the range of Mg: Ag = 20: 1 to 1: 1. The second electrode layer 16 may be a mixed layer containing an organic light emitting material such as an aluminum quinoline complex, a styrylamine derivative, or a phthalocyanine derivative. In this case, a layer having optical transparency such as MgAg may be additionally provided as the third layer.

  The moisture-proof film 17 covering the EL element 10W is an inorganic material having low hygroscopicity such as silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiNxOy), titanium oxide (TiOx), or aluminum oxide (AlxOy). Consists of. Alternatively, a metal material such as aluminum may be used. By providing the moisture-proof film 17, the EL element 10 </ b> W is blocked from outside air, and moisture intrusion into the EL element 10 </ b> W from the outside environment is prevented. The moisture-proof film 17 is formed substantially uniformly so as to cover not only the second electrode layer 16 but also the opening defining insulating film 24 and the planarizing film 218 (described later). That is, the moisture-proof film 17 continuously covers the EL element 10W, the opening defining insulating film 24, and the planarizing film 218 from the display area 110A to the peripheral area 110B. However, the moisture-proof film 17 only needs to cover at least the opening defining insulating film 24 and the planarizing film 218 in the peripheral region 110B. As described above, since the opening defining insulating film 24 and the planarizing film 218 are both made of a highly hygroscopic organic material, it is necessary to prevent moisture from entering the EL element 10W through them. Because. When the opening regulating insulating film 24 is not present in the peripheral region 110B, the moisture-proof film 17 only needs to cover the planarizing film 218. The moisture-proof film 17 may have a single layer structure, but may have a multilayer structure when the thickness is increased. This is for relaxing internal stress in the moisture-proof film 17.

  The filling layer 18 is a transparent resin layer formed almost uniformly on the moisture-proof film 17 and also functions as an adhesive layer. The filling layer 18 is made of, for example, an epoxy resin or an acrylic resin. Preferably, the filling layer 18 is made of a thermosetting resin or an ultraviolet curable resin. The filling layer 18 is sealed between the base body 11 and the sealing substrate 19.

  The seal portion 23 is provided at the edge portion of the sealing substrate 19 and has an annular shape so as to surround the display region 110A. The seal portion 23 is a member for sealing each layer between the substrate 111 and the sealing substrate 19 from the outside. Such a seal portion 23 is also made of a nonconductive material such as an epoxy resin or an acrylic resin. However, it may be formed of a conductive adhesive material. In that case, the seal portion 23 can serve as an auxiliary wiring that prevents the filling layer 18 from flowing out and reduces the voltage drop of the second electrode layer 16.

The sealing substrate 19 seals the EL element 10 </ b> W together with the filling layer 18 and the seal portion 23. The sealing substrate 19 is made of a material such as transparent glass having high transparency for each color light emitted from the sub-pixel 10R, sub-pixel 10G, and sub-pixel 10B. On the surface of the sealing substrate 19 on the substrate 111 side, for example, a color filter (not shown) including a red filter, a green filter, and a blue filter, and a BM layer (light-shielding film) are provided. As a result, white light emitted from the EL elements 10W in the sub-pixel 10R, sub-pixel 10G, and sub-pixel 10B passes through the color filters of the respective colors, so that red light, green light, and blue light are respectively transmitted. The light is emitted. Further, the external light reflected in the sub-pixel 10R, sub-pixel 10G, and sub-pixel 10B and the wiring between them is absorbed to improve the contrast. Further, the vernier 32 and the black matrix 33 may be provided on the facing surface 19S in the region between the display region 110A and the peripheral region 110B. The vernier 32 is used for positioning when the sealing substrate 19 is bonded. Further, the black matrix 33 blocks unnecessary light. Each of the red filter, the green filter, and the blue filter is, for example, rectangular and has no gap. These red filter, green filter and blue filter are each composed of a resin mixed with a pigment, and by selecting the pigment, the light transmittance in the target red, green or blue wavelength region is high, The light transmittance in the wavelength range is adjusted to be low. Furthermore, the wavelength range with high transmittance in the color filter and the peak wavelength λ of the spectrum of light desired to be extracted from the resonator structure coincide with each other. As a result, only the external light incident from the sealing substrate 19 has a wavelength equal to the peak wavelength λ of the spectrum of the light to be extracted passes through the color filter, and external light of other wavelengths enters the EL element 10W. Is prevented.

  The light-shielding film is formed of, for example, a black resin film having an optical density of 1 or more mixed with a black colorant, or a thin film filter using thin film interference. Of these, a black resin film is preferable because it can be formed inexpensively and easily. The thin film filter is formed by, for example, laminating one or more thin films made of metal, metal nitride, or metal oxide, and attenuating light by utilizing interference of the thin film. Specific examples of the thin film filter include those in which chromium and chromium oxide (III) (Cr2O3) are alternately laminated.

  The display device 1 can be manufactured as follows, for example. Hereinafter, a method for manufacturing the display device of the present embodiment will be described with reference to FIGS.

  First, the pixel drive circuit 140 including the drive transistor Tr1 and the write transistor Tr2 is formed on the substrate 111 made of the above-described material. Specifically, first, a metal film is formed on the substrate 111 by sputtering, for example. After that, the metal layers 211G and 221G and a part of the signal line 120A are formed on the substrate 111 by patterning the metal film by, for example, photolithography, dry etching, or wet etching. Next, the entire surface is covered with a gate insulating film 212. Further, a channel layer, a channel protective film, a drain electrode and a source electrode, and metal layers 216D and 226D and metal layers 216S and 226S are sequentially formed in a predetermined shape over the gate insulating film 212. Here, together with the formation of the metal layers 216D and 226D and the metal layers 216S and 226S, a part of the signal line 120A and the scanning line 130A are formed as the second metal layer. At that time, a connecting portion that connects the metal layer 221G and the scanning line 130A, a connecting portion that connects the metal layer 226D and the signal line 120A, and a connecting portion that connects the metal layer 226S and the metal layer 211G are formed in advance. . After that, the pixel driving circuit 140 is completed by covering the whole with the protective film 217. At that time, an opening is formed at a predetermined position on the metal layer 216S in the protective film 217 by dry etching or the like.

  After the pixel driving circuit 140 is formed, a photosensitive resin containing, for example, polyimide as a main component is applied over the entire surface by spin coating or the like. Next, the planarizing film 218 having the contact portion 124 is formed by performing a photolithography process on the photosensitive resin. Specifically, for example, the contact portion 124 communicating with the opening provided in the protective film 217 is formed by selective exposure and development using a mask having an opening at a predetermined position. After that, the planarizing film 218 may be fired as necessary. Thereby, the pixel drive circuit formation layer 112 is obtained.

  Furthermore, the first electrode layer 13 made of the predetermined material described above is formed. Specifically, a metal film made of the above-described material is formed on the entire surface by sputtering, for example, and then a resist pattern (not shown) having a predetermined shape is formed on the laminated film using a predetermined mask. Further, the metal film is selectively etched using the resist pattern as a mask. At this time, the first electrode layer 13 is formed so as to cover the surface of the planarizing film 218 and fill the contact portion 124.

  After that, the opening regulating insulating film 24 is formed so as to fill the gap between the adjacent first electrode layers 13. Specifically, for example, an inorganic insulating material such as SiO 2 is formed on the first electrode layer 13 and the planarizing film 218 by, for example, a CVD (Chemical Vapor Deposition) method. By patterning using an etching technique, a lower opening defining insulating film is formed. The upper opening defining insulating film made of the above-described photosensitive resin is formed at a predetermined position of the lower opening defining insulating film, specifically, a position surrounding the light emitting region of the pixel. Thereby, the opening defining insulating film 24 composed of the upper opening defining insulating film and the lower opening defining insulating film is formed.

  After the opening defining insulating film 24 is formed, the surface of the substrate 11 on the side where the first electrode layer 13 and the opening defining insulating film 24 are formed is subjected to oxygen plasma treatment to remove contaminants such as organic substances attached to the surface. Improve wettability. Specifically, the substrate 11 is heated to a predetermined temperature, for example, about 70 to 80 ° C., and then plasma processing (O 2 plasma processing) using oxygen as a reaction gas under atmospheric pressure is performed.

  After performing the plasma treatment, a water repellency treatment (a liquid repellency treatment) is performed to particularly reduce the wettability of the upper surface and the side surface of the upper opening defining insulating film. Specifically, plasma treatment (CF4 plasma treatment) using methane tetrafluoride as a reaction gas under atmospheric pressure is performed, and then the substrate 11 heated for the plasma treatment is cooled to room temperature, thereby opening the upper opening. The upper surface and the side surface of the specified insulating film are made liquid repellent and its wettability is lowered. In this CF4 plasma treatment, the exposed surface of the first electrode layer 13 and the lower opening defining insulating film are somewhat affected, but the structure of the ITO and the lower opening defining insulating film that are the materials of the first electrode layer 13 Since the material such as SiO2 has poor affinity for fluorine, the surface of which the wettability is improved by the oxygen plasma treatment is maintained as it is.

  Next, the hole injection layer 14A having the predetermined material and thickness described above so as to completely cover the exposed portion of the first electrode layer 13 in the region surrounded by the upper opening defining insulating film, hole transport The organic layer 14 is formed by sequentially laminating the layer 14B, the light emitting layer 14C, and the electron transport layer 14D by, for example, a vapor deposition method. Further, the second electrode layer 16 is formed over the entire surface so as to face the first electrode layer 13 with the organic layer 14 interposed therebetween. After that, the EL element 10W is obtained by patterning the second electrode layer 16 into a predetermined shape.

  The hole injection layer 14A may be formed not only by vapor deposition but also by a coating method such as a spin coating method or a droplet discharge method. In that case, in particular, an ink jet method that is a droplet discharge method or a nozzle coat method is used because it is necessary to selectively dispose the forming material of the hole injection layer 14A in a region surrounded by the upper opening defining insulating film. preferable.

  After that, the moisture-proof film 17 made of the above-described material is formed by a film-forming method having a small energy of film-forming particles, for example, a vapor deposition method or a CVD method so as not to affect the base so as to cover the whole. Form. For example, when the moisture-proof film 17 made of amorphous silicon nitride is formed, it is formed to a thickness of 2 to 3 μm by the CVD method. At this time, in order to prevent a decrease in luminance due to deterioration of the organic layer 14, the film formation temperature is set to room temperature, and in order to prevent the moisture-proof film 17 from being peeled off, film formation is performed under conditions that minimize film stress. Is desirable. Further, the formation of the electron transport layer 14D, the electron injection layer 14E, the second electrode layer 16 and the moisture-proof film 17 is desirably performed continuously in the same film forming apparatus without being exposed to the atmosphere. Thereby, the deterioration of the organic layer 14 due to moisture in the atmosphere is prevented.

  Finally, the filling layer 18 is provided on the moisture-proof film 17, and the sealing substrate 19 is bonded through the seal portion 23. Thus, the display device 1 is completed.

[Operation and Effect of Display Device 1]
In the display device 1, a scanning signal is supplied from the scanning line driving circuit 130 to the gate of the writing transistor Tr 2 for each pixel, and an image signal from the signal line driving circuit 120 passes through the writing transistor Tr 2. Is held in the holding capacitor Cs. That is, the driving transistor Tr1 is controlled to be turned on / off according to the signal held in the holding capacitor Cs, whereby the driving current Id is injected into the EL element 10W, and holes and electrons are recombined to emit light. Since the display device 1 is a top emission type (top emission type), the light passes through the second electrode layer 16, the moisture-proof film 17, the filling layer 18, each color filter (not shown), and the sealing substrate 19. Permeated and taken out. In this way, video display (color video display) is performed on the display device 1.

  By the way, in the conventional organic EL display device, the organic layer is deteriorated due to moisture absorption, the light emission luminance of the EL element is lowered, or the light emission becomes unstable. Was pointed out.

  In contrast, in this embodiment, the moisture-proof film 17 covers the planarizing film 218 in the peripheral region 110B. For this reason, the planarization film 218 serving as the base of the EL element 10W is sufficiently shielded from the outside air containing moisture. As a result, moisture permeation from the peripheral region 110B to the display region 110A can be effectively prevented with a simple structure. Therefore, deterioration of the light emitting element due to water can be suppressed, and high operation reliability can be realized. Further, unlike the structures proposed in Patent Documents 2 and 3, for example, it is not necessary to increase the distance between the display area and the peripheral area, so that the frame can be narrowed.

<Modification>
Subsequently, modified examples (modified examples 1 to 6) of the above-described embodiment will be described. In addition, the same code | symbol is attached | subjected to the same thing as the component in the said embodiment, and description is abbreviate | omitted suitably.

[Modification 1]
FIG. 7 illustrates a cross-sectional configuration of a display device 1A as the first modification. In this modification, a moisture-proof film 25 is provided between the protective film 217 and the planarization film 218, and a moisture-proof film 26 is provided between the planarization film 218 and the opening regulating insulating film 24. Has the same configuration as the above embodiment. The moisture-proof films 25 and 26 are both made of an inorganic material having low hygroscopicity like the moisture-proof film 17 and extend from the edge of the planarization film 218 or the edge of the opening defining insulating film 24 toward the display region 110A. doing. By providing the moisture-proof films 25 and 26 in addition to the moisture-proof film 17, moisture intrusion into the EL element 10W from the outside environment is surely prevented. This is because the moisture that reaches the EL element 10 </ b> W through the boundary portion between the protective film 217 and the planarizing film 218 or the boundary portion between the planarizing film 218 and the opening defining insulating film 24 can be reliably blocked.

[Modifications 2 to 5]
8, 9A, and 9B represent cross-sectional configurations of organic EL display devices (hereinafter simply referred to as display devices) 1B, 1C1, and 1C2 as modifications 2 to 5, respectively. FIG. 9C shows an enlarged cross-sectional configuration of a main part of the display device 1C3 as the fifth modification. In each of the second to fifth modifications, a separation groove 27 is provided in a region corresponding to the seal portion 23, and the others have the same configuration as in the above embodiment. Similar to the seal portion 23, the separation groove 27 extends so as to surround the display region 110A so as to form an annular shape in the XY plane. The separation groove 27 separates the opening defining insulating film 24 and the planarizing film 218 provided in the display region 110A from the opening defining insulating film 24 and the planarizing film 218 provided in the peripheral region 110B. The bottom reaches the protective film 217. The separation groove 27 is filled with a moisture-proof film 17 (a moisture-proof film 29 in the display device 1C3). In particular, in the display device 1 </ b> B (Modification 2), the moisture-proof film 17 directly covers the inner wall surface of the separation groove 27. In the display devices 1C1, 1C2, and 1C3 (Modifications 3 to 5), a metal layer 28 is further provided so as to cover the inner wall surface and the bottom surface of the separation groove 27. The metal layer 28 may be made of the same kind of material as that of the second electrode layer 16 and integrated with the second electrode layer 16 as in the display device 1C2 shown in FIG. 9B. Alternatively, when the metal layer 28 is formed separately from the second electrode layer 16 as in the display devices 1C1 and 1C3 shown in FIGS. 9A and 9C, a material different from that of the second electrode layer 16 may be selected. . Further, as in the display device 1C3, the inside of the separation groove 27 is filled separately from the moisture-proof film 17 covering the opening defining insulating film 24 and the second electrode layer 16 in the display area 110A, and the protection in the peripheral area 110B is performed. A moisture-proof film 29 having a three-layer structure covering the film 217 and the planarizing film 218 may be provided. The moisture-proof film 29 is obtained by sequentially stacking first to third layers 291 to 293 on a protective film 217 and a planarizing film 218. The first and third layers 291 and 293 are nitride films made of, for example, silicon nitride (SiNx), and the second layer 292 is an oxide film such as silicon oxide (SiOx). In the display devices 1B, 1C1, 1C2, and 1C3, a plurality of separation grooves 27 may be provided.

  In the display devices 1B, 1C1, and 1C2, since the separation groove 27 is provided in addition to the moisture-proof film 17, moisture intrusion into the EL element 10W from the outside environment can be prevented more reliably. This is because the protective film 217 and the planarization film 218 that are moisture propagation paths are divided between the display region 110A and the peripheral region 110B.

[Modification 6]
FIG. 10 illustrates a cross-sectional configuration of a display device 1D as the sixth modification. The display device 1D of the present modification has the same configuration as that of the above embodiment except that the display device 1D has a moisture-proof film 34 instead of the moisture-proof film 17. The moisture-proof film 34 is provided continuously from the end surface of the substrate 111 to the end surface of the sealing substrate 19, and seals a region including the EL element 10 </ b> W sandwiched between the substrate 111 and the sealing substrate 19. is there. The moisture-proof film 34 is made of, for example, the same inorganic material as the moisture-proof film 17.

  In the display device 1D, since the moisture-proof film 34 is provided, moisture intrusion into the EL element 10W from the outside environment is reliably prevented. This is because the planarization film 218 and the opening regulating insulating film 24 in the peripheral region 110B are covered with the moisture-proof film 34 and sufficiently shielded from the outside air containing moisture. Furthermore, when the moisture-proof film 34 is formed of a conductive inorganic material, it can be used as a signal line. Examples of such conductive materials include platinum (Pt), gold (Au), silver (Ag), chromium (Cr), tungsten (W), nickel (Ni), copper (Cu), iron (Fe), It is composed of a simple substance or an alloy of a metal element such as cobalt (Co), tantalum (Ta), aluminum (Al), neodymium (Nd), or molybdenum (Mo). For example, as such an alloy, an Ag—Pd—Cu alloy containing silver as a main component and containing 0.3 wt% to 1 wt% of palladium (Pd) and 0.3 wt% to 1 wt% of copper, Al-Nd alloy can be used. At that time, one end of a connection wiring 31 such as an FPC for connection with the outside may be embedded in the moisture-proof film 34. Note that the moisture-proof film 34 may be shared with the seal portion 23.

<Application example>
Hereinafter, application examples of the display devices (display devices 1 and 1A to 1D) described in the above embodiments and modifications will be described. The display device in the above embodiment and the like can be applied to electronic devices in various fields such as a television device, a digital camera, a laptop personal computer, a mobile terminal device such as a mobile phone, or a video camera. In other words, the display device according to the above-described embodiment or the like can be applied to electronic devices in various fields that display an externally input video signal or an internally generated video signal as an image or video.

(module)
The display device of the above-described embodiment or the like is incorporated into various electronic devices such as first to sixth application examples 1 to 6 described later, for example, as a module as illustrated in FIG. In this module, for example, a region 210 exposed from the sealing substrate 19 or the like is provided on one side of the substrate 111, and the wiring of the signal line driving circuit 120 and the scanning line driving circuit 130 is extended to the exposed region 210 to externally. A connection terminal (not shown) is formed. The external connection terminal may be provided with a flexible printed circuit (FPC) 220 for signal input / output.

(Application example 1)
FIG. 12 illustrates an appearance of a television device to which the display device of the above-described embodiment or the like is applied. The television apparatus has, for example, a video display screen unit 300 including a front panel 310 and a filter glass 320, and the video display screen unit 300 is configured by the display device according to the above-described embodiment and the like. .

(Application example 2)
13A and 13B show the appearance of a digital camera to which the display device of the above-described embodiment or the like is applied. The digital camera includes, for example, a flash light emitting unit 410, a display unit 420, a menu switch 430, and a shutter button 440. The display unit 420 is configured by the display device according to the above-described embodiment and the like. Yes.

(Application example 3)
FIG. 14 illustrates an appearance of a notebook personal computer to which the display device of the above-described embodiment or the like is applied. The notebook personal computer has, for example, a main body 510, a keyboard 520 for inputting characters and the like, and a display unit 530 for displaying an image. The display unit 530 is a display according to the above-described embodiment and the like. It is comprised by the apparatus.

(Application example 4)
FIG. 15 shows the appearance of a video camera to which the display device of the above-described embodiment or the like is applied. This video camera has, for example, a main body 610, a subject photographing lens 620 provided on the front side surface of the main body 610, a start / stop switch 630 at the time of photographing, and a display 640. Reference numeral 640 denotes the display device according to the above embodiment and the like.

(Application example 5)
16A and 16B show the appearance of a mobile phone to which the display device of the above-described embodiment or the like is applied. For example, the mobile phone is obtained by connecting an upper housing 710 and a lower housing 720 with a connecting portion (hinge portion) 730, and includes a display 740, a sub-display 750, a picture light 760, and a camera 770. Yes. The display 740 or the sub-display 750 is configured by the display device according to the above-described embodiment or the like.

(Application example 6)
17A and 17B show the external configuration of a so-called tablet personal computer (PC). The tablet PC includes, for example, a display unit 810, a non-display unit 820 such as a housing that holds the display unit 810, and an operation unit 830 such as a power switch. Note that the operation unit 830 may be provided on the front surface of the non-display unit 820 as illustrated in FIG. 17A, or may be provided on the upper surface as illustrated in FIG. 17B. The display unit 810 is a touch screen (touch panel) provided with a position input function (pointing function) in addition to a video display function.

<Other variations>
Although the present technology has been described with the embodiment and some modifications, the present technology is not limited to the above-described embodiment and the like, and various modifications can be made. For example, in the above-described embodiment and the like, the present disclosure in which moisture intrusion into the EL element 10W is prevented by covering the planarizing film 218 and the like in the peripheral region 110B with the moisture-proof films 17 and 29 is limited to this. It is not something. For example, as in the display device 1E shown in FIG. 18, a separation groove 27 is provided in a region corresponding to the seal portion 23 instead of the moisture-proof film 17, and the seal portion 23 is formed of a metal material, and a part of the seal portion 23 is formed. May fill the separation groove 27 (seventh modification). Examples of the metal material applied to the seal portion 23 include platinum (Pt), gold (Au), silver (Ag), chromium (Cr), tungsten (W), nickel (Ni), copper (Cu), iron ( Examples include simple elements or alloys of metal elements such as Fe), cobalt (Co), tantalum (Ta), aluminum (Al), neodymium (Nd), and molybdenum (Mo). More specifically, an Ag—Pd—Cu alloy containing silver as a main component and containing 0.3 wt% to 1 wt% palladium (Pd) and 0.3 wt% to 1 wt% copper, Al A -Nd alloy can be used. Alternatively, a jumet wire (copper wire (copper-coated iron-nickel alloy wire) having an iron-nickel alloy wire as a core material) may be applied to the seal portion 23.

  In the display device 1E, since the separation groove 27 filled with a part of the seal portion 23 made of a metal material is provided, moisture intrusion into the EL element 10W from the outside environment can be prevented more reliably. Furthermore, the seal part 23 can also be used as wiring. The seal portion 23 can be formed by using, for example, a mask and using a vacuum deposition method, a sputtering method, an ion plating method, a plating method, or the like. Moreover, when using a jumet line, the seal part 23 should just be formed by heating a dumet line with a burner etc. and welding it in a predetermined position. When forming the seal portion 23, one end of a leader line (not shown) such as an FPC that connects to the outside may be embedded in the seal portion 23.

  Further, in the present technology, for example, as in the display device 1F1 illustrated in FIG. 19A, the separation groove 27 is provided in a region corresponding to the seal portion 23, and the inner surface of the separation groove 27 is covered with the metal layer 28. 27 may be filled with a moisture-proof film 17 (eighth modification). Or you may make it provide the moisture proof film | membrane 29 of the 3 layer structure which fills the inside of the separation groove 27 as a different body from the moisture proof film | membrane 17 like the display apparatus 1F2 shown to FIG. 19B. The moisture-proof film 29 is obtained by sequentially stacking first to third layers 291 to 293. The first and third layers 291 and 293 are nitride films made of, for example, silicon nitride (SiN x), and the second layer 292 is an oxide film such as silicon oxide (SiO x), for example (ninth Modification). Alternatively, as in the display device 1G shown in FIG. 20, two separation grooves 27A and 27B may be provided, and the inside may be filled with the metal layer 28 (tenth modification).

  In the present technology, for example, a moisture-proof film 17 may be provided between the opening defining insulating film 24 and the organic layer 14 in the display region 110A as in the display device 1H1 illustrated in FIG. 21A. Thereby, it is possible to prevent the EL element 10W from being deteriorated by moisture contained in the opening regulating insulating film 24 in the display region 110A (an eleventh modification). Furthermore, it is preferable to provide a moisture-proof film 26 between the planarizing film 218 and the opening defining insulating film 24 as in the display device 1H2 shown in FIG. 21B (a twelfth modification). In order to form the display devices 1H1 and 1H2, after the opening defining insulating film 24 is formed, a predetermined material (for example, SiN) having moisture resistance and insulation so as to cover the opening defining insulating film 24 is formed by CVD. It is formed by a method, a lithography method, and etching. After that, the organic layer 14 is formed by, for example, vapor deposition, and then the second electrode layer 16 is formed to obtain the display devices 1H1 and 1H2.

  In the present technology, a moisture-proof film 35 made of an insulating resin having a high moisture-proof property is provided instead of the moisture-proof film 17 as in the display device 1J (a thirteenth modified example) shown in FIGS. 22A and 22B, for example. You may do it. In the display device 1 </ b> J, the moisture-proof film 35 is provided continuously from the end surface of the substrate 111 to the end surface of the sealing substrate 19, and includes a region including the EL element 10 </ b> W sandwiched between the substrate 111 and the sealing substrate 19. Seal. The display device 1J is obtained, for example, by applying a predetermined resin along the outer edge of the sealing substrate 19 as shown in FIG. 23 and then curing the resin to form the moisture-proof film 35. Further, for example, as in the display device 1K (fourteenth modified example) shown in FIGS. 24A and 24B, after the resin layer 351 is formed, an inorganic material is further deposited on the resin layer 351 by sputtering or the like. A moisture-proof film 35 having a two-layer structure may be formed by forming 352. Note that the moisture-proof film 35 may be formed by directly depositing an inorganic material or a metal material without forming a resin layer. Examples of such inorganic materials include silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiNxOy), silicon carbide (SiCx), titanium oxide (TiOx), and aluminum oxide (AlxOy). Low inorganic materials are preferred. As the metal material, platinum (Pt), gold (Au), silver (Ag), chromium (Cr), tungsten (W), nickel (Ni), copper (Cu), iron (Fe), cobalt (Co ), Tantalum (Ta), titanium (Ti), aluminum (Al), neodymium (Nd), molybdenum (Mo), etc. Ag-Pd-Cu alloy containing aluminum by weight of palladium (Pd) and 0.3% by weight to 1% by weight of copper, Al-Nd alloy, jumet wire (copper wire with iron-nickel alloy wire as core material (copper Coated iron-nickel alloy wire)) and the like are suitable. Further, for example, as in the display device 1L (fifteenth modified example) illustrated in FIG. 25, a region including the EL element 10W between the substrate 111 and the sealing substrate 19 may be sealed by the moisture-proof film 37. . The display device 1L, after applying frit glass along the outer edge of the substrate 111, forms a moisture-proof film 37 made of glass, for example, by irradiating the frit glass with a laser as shown in FIG. And the sealing substrate 19 are obtained by welding. Further, the moisture-proof films 35 and 37 may be formed after processing the end surfaces of the substrate 111 and the sealing substrate 19 into a concave shape as in the display device 1M (sixteenth modified example) shown in FIG.

  In the present technology, instead of the moisture-proof film 17, a separation groove 27 is provided in a region corresponding to the seal portion 23, and the inner surface of the separation groove 27 is covered with a metal layer 28 and a moisture-proof film having a three-layer structure. Good. Such a three-layer moisture-proof film is, for example, a pair of nitride films made of silicon nitride (SiNx) or the like, or a pair of carbide films made of silicon carbide (SiCx) or the like and an oxide film such as silicon oxide (SiOx). Is sandwiched between. Alternatively, a nitride film made of silicon nitride (SiNx) or a carbide film made of silicon carbide (SiCx) is sandwiched between a pair of oxide films made of silicon oxide (SiOx) or the like. Such a three-layer moisture-proof film is obtained by sandwiching an oxide film such as silicon oxide (SiOx) between a pair of nitride films made of silicon nitride (SiNx), for example. Note that it is preferable to extend the moisture-proof film having the three-layer structure to the peripheral region 110B and to cover the planarizing film 218 and the like with the moisture-proof film 34 because the moisture-proof performance is further improved.

  Moreover, in the said embodiment, although all the organic light emitting elements shall emit white light and illustrated about the case where each color light was taken out with the color filter provided separately, this technique is not limited to this. For example, an organic light emitting element that emits red light, green light, and blue light may be provided by coating the organic layer 14 with a predetermined material.

  Further, the organic light emitting elements 10Y and 10B that emit yellow light and blue light, respectively, and the red, green, blue, and yellow color filters are used in combination to extract red light, green light, blue light, and yellow light. It may be a display device. Alternatively, the display device is configured to extract red light, green light, and blue light by using organic light emitting elements 10Y, 10B that respectively emit yellow light and blue light and color filters of red, green, and blue together. Also good.

Further, the present technology is not limited to the material and stacking order of each layer described in the above embodiment, the film formation method, and the like. For example, in the above embodiment, the case where the first electrode layer 13 is the anode and the second electrode layer 16 is the cathode has been described. However, the first electrode layer 13 may be the cathode and the second electrode layer 16 may be the anode. . In addition, when the 1st electrode layer 13 is used as a cathode, it is desirable for the 1st electrode layer 13 to be comprised with the material with a high hole injection property. However, even in a material such as an aluminum alloy in which the presence of an oxide film on the surface or a hole injection barrier due to a low work function is a problem, the first electrode layer 13 is provided by providing an appropriate hole injection layer. It can be used as Furthermore, in the said embodiment, although the structure of the light emission part 20 was mentioned concretely and demonstrated, you may further provide the other layer. For example, between the first electrode layer 13 and the organic layer 14, chromium oxide (III) (Cr ₂ O ₃ ), ITO (Indium-Tin Oxide: indium (In) and tin (Sn) oxide mixed film) A thin film layer for hole injection made of, etc. may be provided.

  DESCRIPTION OF SYMBOLS 10W ... White organic EL element, 11 ... Base | substrate, 111 ... Substrate, 112 ... Pixel drive circuit formation layer, 12 ... Light emitting element formation layer, 13 ... 1st electrode layer, 14 ... Organic layer, 14A ... Hole injection layer, 14B DESCRIPTION OF SYMBOLS ... Hole transport layer, 14C ... Light emitting layer, 14D ... Electron transport layer, 16 ... 2nd electrode layer, 17, 25, 26, 29, 34, 35 ... Dampproof film, 18 ... Filling layer, 19 ... Sealing substrate, DESCRIPTION OF SYMBOLS 20 ... Light-emitting part, 21 ... Gap part, 22 ... Conductive film pattern, 23 ... Seal part, 24 ... Opening regulation insulating film, 124 ... Contact part, 27 ... Separation groove, 28 ... Metal layer, 110A ... Display area, 110B ... Peripheral area, 120 ... signal line drive circuit, 120A ... signal line, 130 ... scan line drive circuit, 130A ... scan line, 140 ... pixel drive circuit, 217 ... protective film (passivation film), 218 ... flattening film, Cs ... Capacitor (holding capacity ), Tr1 ... driving transistor, Tr2 ... write transistor.

Claims (18)

A first substrate;
A plurality of light emitting devices arranged in a display region on the first substrate and each including a light emitting layer;
A first inorganic layer located in a layer between the first substrate and the light emitting layer;
A second inorganic layer covering a plurality of the light emitting layers;
A third inorganic layer located in a hierarchy between the first inorganic layer and the second inorganic layer;
A first organic layer located in a layer between the second inorganic layer and the third inorganic layer in a peripheral region surrounding the display region on the first substrate;
In the peripheral region, the second organic layer located in a layer between the first inorganic layer and the third inorganic layer,
In the peripheral region, the outer edge of the first organic layer and the outer edge of the second organic layer are both covered so as to be sealed by the second inorganic layer. A first substrate;
A plurality of light emitting devices arranged in a display region on the first substrate and each including a light emitting layer;
A first inorganic layer located in a layer between the first substrate and the light emitting layer;
A second inorganic layer covering a plurality of the light emitting layers;
A third inorganic layer located in a hierarchy between the first inorganic layer and the second inorganic layer;
A first organic layer located in a layer between the second inorganic layer and the third inorganic layer in a peripheral region surrounding the display region on the first substrate;
In the peripheral region, the second organic layer located in a layer between the first inorganic layer and the third inorganic layer,
In the peripheral region, the outer edge of the first organic layer is covered with the second inorganic layer, and the outer edge of the first organic layer is in a position overlapping with the third inorganic layer in the thickness direction,
In the peripheral region, the outer edge of the second organic layer is covered with the second inorganic layer, and the outer edge of the second organic layer is in a position overlapping with the first inorganic layer in the thickness direction. . The display device according to claim 2, wherein in the peripheral region, an outer edge of the first organic layer and an outer edge of the second organic layer are both covered with the second inorganic layer. . The first distance from the outer edge of the first organic layer to the outer edge of the display area is different from the second distance from the outer edge of the second organic layer to the outer edge of the display area. Item 4. The display device according to any one of items 3. The display device according to claim 1, wherein the first inorganic layer is an insulating film. The display device according to any one of claims 1 to 4, wherein the first inorganic layer is a metal film. The display device according to claim 1, wherein the second inorganic layer is an insulating film or a metal film. The display device according to claim 1, wherein the third inorganic layer is an insulating film. The display device according to claim 1, wherein the first inorganic layer and a gate insulating film are provided on the first substrate. The display device according to claim 1, wherein the first inorganic layer is a moisture-proof film. The display device according to claim 1, further comprising a third organic layer on the opposite side of the second inorganic layer from the first organic layer. The display device according to claim 11, wherein the third organic layer is a filling layer. The display device according to claim 12, wherein the third organic layer is an adhesive layer. The display device according to claim 11, further comprising a second substrate on the opposite side of the third organic layer from the first organic layer. The display device according to claim 14, wherein the second substrate is made of a transparent material. An electronic device provided with a display device,
The display device
A first substrate;
A plurality of light emitting devices arranged in a display region on the first substrate and each including a light emitting layer;
A first inorganic layer located in a layer between the first substrate and the light emitting layer;
A second inorganic layer covering a plurality of the light emitting layers;
A third inorganic layer located in a hierarchy between the first inorganic layer and the second inorganic layer;
A first organic layer located in a layer between the second inorganic layer and the third inorganic layer in a peripheral region surrounding the display region on the first substrate;
In the peripheral region, the second organic layer located in a layer between the first inorganic layer and the third inorganic layer,
In the peripheral region, the outer edge of the first organic layer and the outer edge of the second organic layer are both covered so as to be sealed by the second inorganic layer. An electronic device provided with a display device,
The display device
A first substrate;
A plurality of light emitting devices arranged in a display region on the first substrate and each including a light emitting layer;
A first inorganic layer located in a layer between the first substrate and the light emitting layer;
A second inorganic layer covering a plurality of the light emitting layers;
A third inorganic layer located in a hierarchy between the first inorganic layer and the second inorganic layer;
A first organic layer located in a layer between the second inorganic layer and the third inorganic layer in a peripheral region surrounding the display region on the first substrate;
In the peripheral region, the second organic layer located in a layer between the first inorganic layer and the third inorganic layer,
In the peripheral region, the outer edge of the first organic layer is covered with the second inorganic layer, and the outer edge of the first organic layer is in a position overlapping with the third inorganic layer in the thickness direction,
In the peripheral region, the outer edge of the second organic layer is covered with the second inorganic layer, and the outer edge of the second organic layer is in a position overlapping with the first inorganic layer in the thickness direction. . The electronic device according to claim 17, wherein in the peripheral region, an outer edge of the first organic layer and an outer edge of the second organic layer are both covered with the second inorganic layer. .

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