JP2017085074A - Printed circuit board and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed circuit board with improved rigidity and a method of manufacturing the same.SOLUTION: A printed circuit board 1000 includes a core. The core includes a carbon reinforcing layer 110 including a carbon material 111 and an insulating layer 112 formed around the carbon material and a first light-sensitive insulating layer 150 laminated on the carbon reinforcing layer.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a printed circuit board and a method for manufacturing the same.

  2. Description of the Related Art In recent years, electronic devices have been required to have higher functions due to technological development, and accordingly, downsizing and weight reduction have been demanded.

  As a result, printed circuit boards mounted on electronic devices are multi-layered, and circuits are becoming more complex.

  In order to reduce the density and size of a printed circuit board, techniques relating to an efficient multilayering process and processing of fine holes are required.

Korean Published Patent No. 2015-0104828

  According to one aspect of the present invention, in a printed circuit board including a core, the core is a carbon reinforcing layer including a carbon material and an insulating layer formed around the carbon material, and a first laminated on the carbon reinforcing layer. A photosensitive insulating layer.

  According to another aspect of the present invention, there is provided a printed circuit board including the steps of: laminating a first photosensitive insulating layer on a carbon reinforcing layer to form a core; and forming a buildup layer on the core. A manufacturing method is provided.

It is a figure which shows the printed circuit board which concerns on one Example of this invention. It is a figure which shows the core of the printed circuit board which concerns on one Example of this invention. It is a figure which shows the buildup layer of the printed circuit board which concerns on one Example of this invention. 3 is a flowchart illustrating a method for manufacturing a printed circuit board according to an embodiment of the present invention. It is a figure which shows one process of forming a core in the manufacturing method of the printed circuit board which concerns on one Example of this invention. It is a figure which shows the next process of the process of FIG. It is a figure which shows the next process of the process of FIG. It is a figure which shows the next process of the process of FIG. It is a figure which shows the next process of the process of FIG. It is a figure which shows the next process of the process of FIG. It is a figure which shows the next process of the process of FIG. FIG. 12 is a diagram showing a step subsequent to the step of FIG. 11. It is a figure which shows the next process of the process of FIG. It is a figure which shows one process of forming a buildup layer in the manufacturing method of the printed circuit board which concerns on one Example of this invention. It is a figure which shows the next process of the process of FIG. FIG. 16 is a diagram showing a step subsequent to the step of FIG. 15. It is a figure which shows the next process of the process of FIG. FIG. 18 is a diagram showing a step subsequent to the step of FIG. 17. It is a figure which shows the next process of the process of FIG. It is a figure which shows the next process of the process of FIG. It is a figure which shows the next process of the process of FIG.

  Embodiments of a printed circuit board and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same or corresponding components are denoted by the same drawing numbers. This is not described repeatedly.

  Further, in this specification, terms such as “first” and “second” are merely identification symbols for distinguishing the same or corresponding components, and the same or corresponding components are defined by terms such as “first” and “second”. It is not limited.

  In addition, the term “coupled” does not mean that the components are in direct contact with each other in the contact relationship between the components, but other configurations are interposed between the components. It is used as a concept encompassing even when components are in contact with each other.

<Printed circuit board>
FIG. 1 is a diagram illustrating a printed circuit board 1000 according to an embodiment of the present invention.

  Referring to FIG. 1, a printed circuit board 1000 according to an embodiment of the present invention includes a core 100 and a buildup layer 200 on the core 100.

  FIG. 2 is a diagram illustrating the core 100 of the printed circuit board 1000 according to an embodiment of the present invention.

  Referring to FIG. 2, the core 100 according to an embodiment of the present invention includes a carbon reinforcing layer 110 and a first photosensitive insulating layer 150, and the carbon reinforcing layer 110 includes a carbon material 111 and an insulating layer 112. And including.

  The carbon reinforcing layer 110 may be formed by stacking insulating layers 112 on and under the carbon material 111 to increase the stiffness of the substrate.

  The carbon material 111 is a concept including a carbon fiber, a graphite sheet, and the like.

  The carbon material 111 has a high tensile strength and a high tensile modulus (tensile modulus), and can increase the stiffness of the substrate.

  The tensile elastic modulus of the carbon material 111 is 400 Gpa or more, preferably 500 Gpa or more.

  The tensile elastic modulus of the printed circuit board 1000 can be improved by 50 Gpa or more due to the high tensile elastic modulus of the carbon material 111.

  Furthermore, the carbon material 111 is excellent in heat resistance and can minimize the deformation of the substrate during the process of processing the printed circuit board.

  The carbon material 111 may include any one or more of a PAN-based carbon fiber having a high modulus and a pitch-based carbon fiber having a high deformation resistance.

  The carbon material 111 may have different contents, types, and arrangement forms contained in the carbon reinforcing layer 110 in order to derive the optimum tensile strength and tensile modulus of the printed circuit board. .

  The insulating layer 112 can be formed on the carbon material 111.

  The insulating layer 112 may be a resin material, and may include a thermosetting resin such as an epoxy resin, or a thermoplastic resin such as polyimide (PI). As the insulating layer 112 according to an embodiment of the present invention, It is preferable to use a photosensitive insulating material.

  Specifically, when the insulating layer 112 is formed of a photosensitive insulating material such as PID or solder resist, a through hole or a via hole can be formed without using a laser, a drill, or the like.

  A method of forming a via penetrating the insulating layer 112 will be described in more detail in a printed circuit board manufacturing method.

  The printed circuit board 1000 may further include a first via 121 that penetrates the carbon reinforcing layer 110.

  The first via 121 may be formed of a conductive material 123 and may be filled with a conductive material 123 such as a conductive paste.

  When the first via 121 is filled with a conductive paste, the electrical conductivity can be increased due to the high adhesive properties of the conductive paste.

  The non-conductive material 122 may be interposed between the first via 121 and the carbon reinforcing layer 110 for electrical insulation between the carbon reinforcing layer 110 and the first via 121.

  The printed circuit board 1000 may further include a first circuit pattern 131 formed on the carbon reinforcing layer 110.

  A first photosensitive insulating layer 150 may be stacked on the carbon reinforcing layer 110 on which the first circuit pattern 131 is formed.

  The first photosensitive insulating layer 150 can be formed of a photosensitive insulating material.

  The photosensitive insulating material includes PID (photo-imageable dielectric), solder resist, and the like.

  PID has an insulating property, a light shielding property, and a chemical resistance property, and is an advantageous material for forming a fine via hole (30 μm or less) inside.

  The second via 151 may be formed through the first photosensitive insulating layer 150 and may be formed on the first circuit pattern 131 so as to be electrically connected to the first circuit pattern 131.

  The first circuit pattern 131 connected to the second via 151 is a pad.

  The second via 151 can be formed by filling the via hole with a conductive paste after forming the via hole by the exposure and development process of the first photosensitive insulating layer 150.

  FIG. 3 is a diagram illustrating the build-up layer 200 of the printed circuit board 1000 according to an embodiment of the present invention.

  Referring to FIG. 3, the buildup layer 200 according to an embodiment of the present invention may be stacked on the core 100 and may include a second photosensitive insulating layer 250.

  The build-up layer 200 may include a second circuit pattern 231 in which the second photosensitive insulating layer 250 is formed or a third via 221 that penetrates the second photosensitive insulating layer 250.

  The second photosensitive insulating layer 250 can be formed of the same material as the first photosensitive insulating layer 150, and the third via 221 can be formed by the same process as the second via 151.

<Method for manufacturing printed circuit board>
FIG. 4 is a flowchart illustrating a method for manufacturing a printed circuit board according to an embodiment of the present invention.

  5 to 21 are process diagrams illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention.

  4 to 21, the method of manufacturing the printed circuit board 1000 according to an embodiment of the present invention includes a step S100 of forming the core 100, a step S200 of forming the buildup layer 200 on the core 100, Step S300 of laminating the build-up layer 200 at once.

  FIGS. 5 to 13 are process diagrams illustrating a manufacturing method for forming the core 100 according to an embodiment of the present invention. Referring to FIGS. 5 to 13, step S <b> 100 for forming the core 100 includes a carbon material 111. Step S110 may be included in which the carbon reinforcing layer 110 is formed by laminating the insulating layer 112 thereon.

  Next, step S <b> 100 for forming the core 100 may further include step S <b> 120 for forming the first via 121 that penetrates the carbon reinforcing layer 110.

  The step S120 for forming the first via 121 includes the step of forming the first through hole 10 penetrating the carbon reinforcing layer 110, the step of filling the inside of the first through hole 10 with the nonconductive material 122, and the nonconductive state. A step of forming the second through hole 20 in the conductive material 122 and a step of filling the conductive material 123 in the second through hole 20 may be included.

  The first through hole 10 or the second through hole 20 can be formed by a CNC drill or the like. In addition, the first through hole 10 can be formed by an exposure and development process when the insulating layer 112 is formed of a photosensitive insulating material.

  In order to insulate between the core 100 and the first via 121, the inside of the first through hole 10 can be filled with a nonconductive material 122.

  Meanwhile, the step S100 of forming the core 100 according to the embodiment of the present invention may further include a step S130 of forming the first circuit pattern 131 on the carbon reinforcing layer 110. The first circuit pattern 131 is a concept including a circuit and a pad.

  After forming the first via 121 or the first circuit pattern 131 in the carbon reinforcing layer 110, the first photosensitive insulating layer 150 is formed on the carbon reinforcing layer 110 on which the first via 121 or the first circuit pattern 131 is formed. (S140).

  Thereafter, the step S100 of forming the core 100 according to the embodiment of the present invention may further include a step S150 of forming the second via 151 penetrating the first photosensitive insulating layer 150.

  The second via 151 may be formed by forming a via hole penetrating the first photosensitive insulating layer 150 and then filling the via hole with a conductive material.

  The via hole can be formed by exposing and developing the first photosensitive insulating layer 150 without processing the hole using a laser, a drill, or the like.

  The second via 151 can be formed by filling a conductive paste, and does not exclude the formation of a plating layer in the via hole.

  14 to 21 are process diagrams showing a manufacturing method for forming the buildup layer 200 according to one embodiment of the present invention. Referring to FIGS. 14 to 21, step S200 for forming build-up layer 200 includes step S210 for preparing metal layer 211 having a carrier layer 222 formed on one surface, and second circuit pattern by etching metal layer 211. Step S220 for forming 231; Step S230 for forming the second photosensitive insulating layer 250 on the second circuit pattern 231; Step S240 for forming the third via 221 penetrating the second photosensitive insulating layer 250; Step S250 for removing the carrier layer 222 may be included.

  In step S210, in which the metal layer 211 having the carrier layer 222 formed on one surface is prepared, the carrier layer 222 is a means for supporting the metal layer 211, such as warpage when the circuit is formed on the metal layer 211. In order to minimize generation, the metal layer 211 is formed on one surface.

  The carrier layer 222 includes a polyethylene terephthalate, a polyethylene naphthalate, a polyimide, a polyethylene, a polyetheretherketone, and a polyetheretherketone. Any one or more of the above may be included.

  The metal layer 211 may be a copper foil and may have a thickness in the range of 2 μm to 36 μm.

  In step S220 in which the metal layer 211 is etched to form the second circuit pattern 231, the metal layer 211 can be plated and the second circuit pattern 231 can be formed through an etching process.

  The second circuit pattern 231 can be formed by using any one of a sub-trackive method, a semi-additive method, and an additive method.

  The second circuit pattern 231 is a concept including a circuit and a pad.

  Next, step S230 of forming the second photosensitive insulating layer 250 on the second circuit pattern 231 can be performed.

  The second photosensitive insulating layer 250 can be formed of the same photosensitive insulating material as the first photosensitive insulating layer 150.

  Next, step S240 of forming a third via 221 that penetrates the second photosensitive insulating layer 250 may be performed.

  The step S240 of forming the third via 221 includes a step of forming the third through hole 30 in the second photosensitive insulating layer 250 and a step of filling the third through hole 30 with a conductive material. It can be performed in the same manner as the step of forming the via 151.

  The build-up layer 200 can be formed by removing the carrier layer 222 from the second photosensitive insulating layer 250 in which the third via 221 or the second circuit pattern 231 is formed (see S250).

  The method for manufacturing a printed circuit board according to an embodiment of the present invention may further include step S300 of forming a plurality of buildup layers 200.

  The method for manufacturing a printed circuit board according to an embodiment of the present invention may further include a step S300 of collectively stacking a plurality of buildup layers 200 on the core 100.

  In the manufacturing method in which the build-up layer is sequentially laminated on the core, the processing of the via hole, the lamination, the plating process, the inspection, and the surface treatment process must be sequentially repeated. Become.

  Therefore, the manufacturing method in which the plurality of buildup layers 200 are collectively stacked on the core 100 is more advantageous in terms of manufacturing time and cost than the manufacturing process in which the buildup layers 200 are sequentially stacked on the core 100.

  The method for manufacturing a printed circuit board according to an embodiment of the present invention may further include forming a solder resist layer 270 on the outermost layer of the buildup layer 200.

  By forming the solder resist layer 270 in the outermost layer of the buildup layer 200, the circuit pattern formed in the buildup layer 200 can be protected.

  In the printed circuit board according to an embodiment of the present invention, the core includes a carbon material such as carbon fiber having high strength and high modulus characteristics, so that the stiffness can be improved.

  Furthermore, since the method for manufacturing a printed circuit board according to an embodiment of the present invention is formed by batch lamination, manufacturing time and manufacturing cost can be reduced when manufacturing a multilayer printed circuit board.

  Although one embodiment of the present invention has been described above, addition and modification of constituent elements are within the scope not departing from the spirit of the present invention described in the scope of claims for those skilled in the art. Various modifications and changes can be made to the present invention by deletion, addition, and the like, and these are also included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 100 Core 110 Carbon reinforcement layer 111 Carbon material 112 Insulating layer 121 1st via | veer 123 Conductive substance 122 Nonconductive substance 131 1st circuit pattern 150 1st photosensitive insulating layer 151 2nd via | veer 200 Build-up layer 211 Metal layer 222 Carrier Layer 221 Third via 231 Second circuit pattern 250 Second photosensitive insulating layer 270 Solder resist layer

Claims (17)

In a printed circuit board including a core,
The core is
A carbon reinforcing layer including a carbon material and an insulating layer formed on the carbon material;
A first photosensitive insulating layer laminated on the carbon reinforcing layer;
Including printed circuit board.   The printed circuit board according to claim 1, further comprising a first via penetrating the carbon reinforcing layer.   The printed circuit board of claim 2, wherein the first via is filled with a conductive material.   The printed circuit board according to claim 2, further comprising a nonconductive material interposed between the first via and the carbon reinforcing layer.   The printed circuit board according to claim 1, further comprising a first circuit pattern formed on the carbon reinforcing layer.   The printed circuit board according to claim 5, further comprising a second via penetrating the first photosensitive insulating layer so as to be electrically connected to the first circuit pattern.   The printed circuit board according to claim 1, further comprising a buildup layer that is laminated on the core and includes a second photosensitive insulating layer. Laminating a first photosensitive insulating layer on the carbon reinforcing layer to form a core;
Forming a build-up layer on the core,
The carbon reinforcing layer includes a carbon material and an insulating layer. Forming the build-up layer comprises:
Providing a metal layer having a carrier layer formed on one side;
Etching the metal layer to form a second circuit pattern;
Forming a second photosensitive insulating layer on the second circuit pattern;
Forming a third via penetrating the second photosensitive insulating layer;
The method for manufacturing a printed circuit board according to claim 8, comprising: removing the carrier layer. The step of forming the third via includes
Forming a third through hole penetrating the second photosensitive insulating layer;
The method of manufacturing a printed circuit board according to claim 9, comprising filling the third through hole with a conductive material. Forming the build-up layer comprises:
The method for manufacturing a printed circuit board according to claim 8, comprising a step of forming a plurality of the buildup layers. Forming the build-up layer comprises:
The method for manufacturing a printed circuit board according to claim 8, comprising a step of collectively laminating a plurality of the buildup layers on the core.   The method for manufacturing a printed circuit board according to claim 8, further comprising a step of forming a solder resist layer on an outermost layer of the buildup layer.   The method of manufacturing a printed circuit board according to claim 8, further comprising forming a first via that penetrates the carbon reinforcing layer. Forming the first via includes:
Forming a first through hole penetrating the carbon reinforcing layer;
Filling the first through hole with a nonconductive material;
Forming a second through hole in the non-conductive material;
The method of manufacturing a printed circuit board according to claim 14, further comprising: filling a conductive material into the second through hole.   The method for manufacturing a printed circuit board according to claim 8, further comprising forming a first circuit pattern on the carbon reinforcing layer.   The method of manufacturing a printed circuit board according to any one of claims 8 to 16, further comprising forming a second via that penetrates the first photosensitive insulating layer.

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