JP2017081177A - Manufacturing method of woody board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a woody board, which can increase strength of the woody board and improve its thermal storage property compared to conventional products.SOLUTION: The manufacturing method of a woody board includes a step of immersing a board-shaped woody molded article 1a obtained by integrating and pressure-molding a wooden material in a latent heat storage material 5a. In the immersion step, the board-shaped woody molded article 1a is immersed in the latent heat storage material 5a so that a continuous heat storage layer 5 is formed all over the surface of the wooden material while leaving voids 8 inside the woody molded article 1a.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a wooden board using a latent heat storage material.

  In recent housing, as represented by smart houses, the keywords are "energy saving", "energy creation", and "energy storage", and the goal is to create a comfortable housing that does not emit carbon dioxide. On the other hand, there is a concept of a passive house, and attention has been paid to housing construction that realizes high energy saving and comfort by providing high-performance heat insulation performance. In any house, it is essential to improve the heat insulation performance of the house and the performance against the thermal environment. On the other hand, as seen in the enactment of the “Wood Utilization Promotion Law” to reduce carbon dioxide emissions, there is an increasing tendency to build houses using wood as much as possible. Against this background, research and development of building materials with thermal storage properties that can conserve heat on floors and walls of houses and provide an energy-saving and comfortable living space are becoming active, considering combinations with wooden materials.

  For example, natural energy such as sunlight, heat energy generated by an air conditioner or the like, or heat energy generated in daily life, etc. is stored in the latent heat storage material to absorb heat and dissipate against fluctuations in the outside air temperature. Proposals and attempts have been made to minimize the temperature change of.

  In view of such points, for example, a heat storage board (see, for example, Patent Document 1) in which a latent heat storage material is enclosed in a metal or plastic container, a microcapsule and a wood fiber containing the latent heat storage material, and an adhesive There has been proposed a heat storage fiberboard obtained by thermocompression-molding a composition comprising (see, for example, Patent Document 2). As another technique, there has been proposed a heat storage inorganic cured body formed by molding an inorganic cured body such as cement on a wood chip impregnated with a latent heat storage material (for example, see Patent Document 3).

Japanese Patent Laid-Open No. 3-160298 JP 2003-260705 A JP 2006-248834 A

  However, as in Patent Document 1, a heat storage board in which a latent heat storage material is sealed in a container can prevent the latent heat storage material from seeping out from the heat storage board, but between the container and the concave wall surface of the board that accommodates the heat storage board. Therefore, it cannot be said that the thermal conductivity is good.

  In view of such points, it is conceivable to mix a microcapsulated latent heat storage material into the heat storage fiber board as in Patent Document 2, but in this case, microcapsules can be mixed in manufacturing. The amount is limited, and the amount of heat stored per unit weight is also reduced. Since the microencapsulated latent heat storage materials are distributed and arranged in the heat storage fiberboard, direct heat conduction between the latent heat storage materials cannot be expected, and the heat storage by the latent heat storage material is not possible. The responsiveness of is not high. Furthermore, particularly when a paraffin-based latent heat storage material is used, the microcapsules may be punctured during molding.

  Therefore, as in Patent Document 3, it is conceivable to press-mold a wooden material impregnated with a latent heat storage material into a board shape, but in order to ensure the adhesion between the wooden materials, a matrix may be used. It is necessary to interpose an inorganic hardened material such as cement. As a result, it cannot be said that the heat storage amount of the latent heat storage material is sufficient, and the responsiveness of heat storage may not be improved. In view of this point, when the wood-based materials are molded so as to be in contact with each other, the wood-based materials are hardly joined to each other, so that the strength of the wood board may be lowered.

  This invention is made in view of such a point, The place made into the objective is improving the intensity | strength of a wooden board, and the wooden board which can improve heat storage property compared with the former thing, and It is in providing the manufacturing method.

  In view of these points, as a result of the intensive studies by the inventors, as a result of impregnating the wooden molded body directly with the latent heat storage material, more latent heat storage material while maintaining the strength of the wooden board. It was thought that can be contained in the wooden board. At this time, the present inventors have found that the density of the wooden molded body is important for suitably impregnating the wooden molded body with the latent heat storage material and holding the impregnated latent heat storage material in the wooden molded body.

The present invention is based on the inventors' new knowledge, and the method of manufacturing a wooden board according to the present invention is a method for producing a latent heat storage material on a board-shaped wooden molded body obtained by accumulating and compressing wooden materials. In the step of impregnating the latent heat storage material, a wooden molded body having a density in the range of 0.3 to 0.5 g / cm ³ is used as the wooden molded body.

  According to the present invention, a wood molded body that is pre-stacked with wood-based materials and press-molded into a board shape so as to be in the above-described density range is impregnated with a latent heat storage material, resulting in a decrease in strength. In addition, it is possible to obtain a wood board in which the content of the latent heat storage material per unit weight is higher than that of conventional wood boards. Furthermore, since the latent heat storage material after impregnation is cooled by cooling or the like, the latent heat storage material can be held in the wooden board.

Here, there are cases where it is difficult to form a wooden molded body of less than 0.3 g / cm ³ by pressure molding, and even if molded, the strength of the wooden board may be insufficient during impregnation. . On the other hand, when the density of the wooden molded body exceeds 0.5 g / cm ³ , not only is the latent heat storage material difficult to be sufficiently impregnated into the wooden molded body, but also the impregnated latent heat storage material is eluted (bleeds out). Sometimes.

As a more preferred embodiment, in the step of impregnating the latent heat storage material, the wooden material constituting the wooden molded body is configured such that the latent heat storage material is contained in the wooden board at 0.20 to 0.33 g / cm ³ . The latent heat storage material is impregnated between the interior and the woody material.

According to this aspect, since the latent heat storage material is contained in an amount of 0.20 to 0.33 g / cm ³ with respect to the above-described wood compact in the density range, the elution of the latent heat storage material from the wooden board is suppressed, and the wood The heat storage property of the board can be increased. Moreover, the latent heat storage material is continuously covered in layers on the surface of the wood-based material, and the layered latent heat storage material is formed in a network shape (mesh shape) in the wooden board. As a result, the mechanical strength of the wood board after impregnation can be greatly improved.

When the content of the latent heat storage material is less than 0.2 g / cm ³ with respect to the above-described density range woody molded article, not only the heat storage performance by the latent heat storage material can be expected, but also the latent heat Even if impregnated with a heat storage material, the mechanical strength of the wooden board may not be significantly improved. On the other hand, when the content of the latent heat storage material exceeds 0.33 g / cm ³ with respect to the above-described woody compact in the density range, the latent heat storage material may be eluted from the wooden board.

  In a more preferred embodiment, a wood piece is used for the wood material. According to this aspect, since the wooden molded body is pressure-molded from the wooden pieces, the porosity of the wooden molded body is higher than that obtained by pressure-molding in a board shape by accumulating other materials, A larger amount of latent heat storage material can be impregnated into the wood molded body.

As the present invention, a wood board for solving the above-described problems is also disclosed. The wooden board according to the present invention is a wooden board that includes at least a wooden molded body obtained by stacking wooden materials and press-molded into a board shape, and a latent heat storage material, and the density of the wooden molded body is 0 .3 to 0.5 g / cm ³ , and the latent heat storage material is 0.20 to 0.33 g / cm ^{3 in} the wood-based material constituting the wood molded body and between the wood-based materials. It is characterized by containing.

  According to the present invention, in the range of the density of the wood molded body in the range described above, the latent heat storage material in the range of the content described above is between the interior of the wood based material constituting the wood molded body and between the wood based materials. Since it contains in both, a wooden board becomes a thing with higher mechanical strength and heat storage than before. In particular, when such a range is satisfied, the latent heat storage material is covered in layers on the surface of the wood-based material, and is formed in a network shape (mesh shape) in the wood board. As a result, since the network-like heat storage layer is continuously formed in the wooden molded body, the thermal conductivity of the latent heat storage material can be increased and the mechanical strength of the wooden board can also be increased.

Here, when the density of the wooden molded body is less than 0.3 g / cm ³ , the wooden molded body has insufficient strength. On the other hand, when the density of the wooden molded body exceeds 0.5 g / cm ³ , it is difficult to increase the mechanical strength of the wooden board, and the latent heat storage material may be eluted (bleed out).

Furthermore, when the content of the latent heat storage material is less than 0.2 g / cm ³ with respect to the above-described density range of the wooden molded body, the latent heat storage material is not sufficiently contained in the wooden molded body. It cannot be said that the heat storage property is sufficient, and further, it cannot be expected that the mechanical strength of the wooden board is greatly improved by the latent heat storage material. On the other hand, when the content of the latent heat storage material exceeds 0.33 g / cm ³ with respect to the above-described density-formed wood molded body, the latent heat storage material may be eluted from the wooden board.

  In a more preferred embodiment, the wood-based material is made of a wood piece. According to this aspect, since the wooden molded body is pressure-molded from the wooden pieces, the porosity of the wooden molded body is higher than that obtained by pressure-molding in a board shape by accumulating other materials, More latent heat storage material can be contained in the wood molded body.

  According to this invention, while impregnating a latent heat storage material, the intensity | strength of a wooden board can be improved, and higher heat storage property can be anticipated compared with the former thing.

The typical conceptual diagram explaining the manufacturing method of the wooden board which concerns on embodiment of this invention. The typical fragmentary sectional view of the wooden board manufactured with the manufacturing method shown in FIG. The figure for demonstrating the method to measure the heat storage amount of a wooden board. The figure which showed the relationship between the board density of the wooden board which concerns on Examples 1-3 and the comparative example 2, and content of paraffin. The figure which showed the relationship between the board density of the wooden board which concerns on Examples 1-3 and the comparative example 2, and a board bending strength improvement rate. The figure which showed the relationship between the board density of the wooden board which concerns on Examples 1-3 and the comparative example 2, and heat storage amount.

  Hereinafter, the present invention will be described based on the present embodiment with reference to the drawings.

  FIG. 1 is a schematic conceptual diagram illustrating a method for manufacturing a wooden board according to an embodiment of the present invention, and FIG. 2 is a schematic partial cross-sectional view of the wooden board manufactured by the manufacturing method shown in FIG. .

  When manufacturing the wooden board 1 according to the present embodiment, first, as shown in FIG. 1, a wooden molded body 1a is prepared which is obtained by accumulating wooden materials and press-molded into a board shape. Examples of the woody molded body include particle board, MDF, insulation board, OSB and the like. Examples of the wood-based material include chip-like pieces of wood or wood fibers obtained from Lauan, which is a South Sea material, and pine and cedar of conifers.

  In the present embodiment, as a more preferable aspect, a particle board is prepared in which wood pieces are used as a wood-based material and the wood pieces are integrated as a wood molded body. Particle boards obtained from wood pieces in wood-based materials have a higher porosity in the wood molded body than those molded from wood fiber, so as will be described later, more latent heat storage material is impregnated in the wood molded body. Can be made.

  In the wood molding, these wood materials are mixed with isocyanate adhesive, phenol formaldehyde adhesive, urea formaldehyde adhesive, and melamine formaldehyde adhesive as necessary, and then integrated and pressed into a board shape. Can be obtained. When molding a woody molded body, pressure heating molding may be performed.

Here, the density of the wooden molded body is in the range of 0.3 to 0.5 g / cm ³ , and such density can be adjusted by adjusting pressure conditions, heating conditions, and the like when pressure forming into a board shape. It can be a range. When the density of the wooden molded body 1a is less than 0.3 g / cm ³ , it may be difficult to mold the wooden board by pressure molding.

  Next, the board-shaped woody molded body 1a thus obtained is impregnated with the latent heat storage material 5a in a molten state (impregnation step). The latent heat storage material 5a is heated to a melting point or higher (usually about a melting point +20 to 30 ° C.) in the bat 9 in which a heating device is installed, and is in a molten state. The wood molded body 1a is immersed in the latent heat storage material 5a in the bat 9 and left for a predetermined time, whereby the heat storage layer 5 made of the latent heat storage material 5a is formed on the surface of the wood piece, and inside the wood piece. The wooden board is impregnated with the molten latent heat storage material 5a so that the latent heat storage material penetrates.

Specifically, in the present embodiment, the interior of the wood-based material constituting the wood molded body 1a and the latent heat storage material 0.20 to 0.33 g / cm ^{3 with} respect to the obtained wood board 1 and The latent heat storage material 5a is impregnated between the wood pieces 3, 3. As a result, the wooden board 1 having a density of 0.6 to 0.7 g / cm ³ can be obtained.

  Here, the latent heat storage material impregnated in the bat 9 is a latent heat storage material that changes in phase from solid to liquid due to solar heat applied by solar light or heat from indoor heating, and is preferably a house Considering the heat storage building material, the phase change temperature (melting point) of the latent heat storage material is in the range of 5 ° C to 60 ° C, more preferably in the range of 20 ° C to 60 ° C. When used for indoor walls, the melting point is preferably in the range of 20 ° C to 30 ° C, and when used for indoor floors, it is preferably in the range of 30 ° C to 60 ° C.

  As latent heat storage materials, n-hexadecane, n-heptadecane, n-octadecane, n-nanodecane, etc. and mixtures thereof, aliphatic hydrocarbons such as n-paraffin and paraffin wax, octanoic acid, capric acid, laurin Examples thereof include long-chain fatty acids composed of acids, myristic acid, and the like, and mixtures thereof, or polyether compounds such as esters of the above fatty acids and polyethylene glycol. For example, n-octadecane is selected if it melts at 28 ° C, and n-hexadecane is selected if it melts at 18 ° C. Furthermore, you may mix and use the latent heat storage material from which melting | fusing point mentioned above differs.

  In the present embodiment, the wooden molded body 1a is immersed in the latent heat storage material 5a in the bat 9, thereby impregnating the wooden molded body with the latent heat storage material. The wooden molded body 1a may be impregnated with the latent heat storage material by flowing or applying.

  Then, as shown in FIG. 1, the wooden board 1 impregnated with the latent heat storage material 5 a is erected, and a part of the liquid of the latent heat storage material 5 a adhering to the surface and the molten latent heat storage material 5 a impregnated inside is placed. After that, the latent heat storage material 5a is solidified by cooling by cooling or the like.

In the present embodiment, since the latent heat storage material 5a is impregnated into the wood molded body 1a having the above-described density range, the content of the latent heat storage material 5a per unit weight in the wooden board is changed to the conventional one. Compared to this, you can get an improved wood board. When the density of the wooden molded body 1a exceeds 0.5 g / cm ³ , not only is the latent heat storage material 5a difficult to be sufficiently impregnated into the wooden molded body 1a, but also the impregnated latent heat storage material is eluted ( May ooze out).

Then, through a series of steps of impregnation of the latent heat storage material, draining of the latent heat storage material, and cooling of the wooden board, the wooden board 1 contains 0.20 to 0.33 g / cm ³ of the latent heat storage material. Therefore, elution of the latent heat storage material 1a from the wooden board 1 can be suppressed, and the heat storage performance of the wooden board can be improved.

  Specifically, as shown in FIG. 2, the obtained wood board 1 has a heat storage layer 5 made of a latent heat storage material on the surface of the wood piece 3 on the whole of the wood board (from the surface of the wood board). The latent heat storage material penetrates into the wood piece where the heat storage layer 5 is formed and is formed in a network shape (to the back surface). Furthermore, a gap is formed inside the wooden board 1.

  As a result, a heat storage layer 5 made of a latent heat storage material is continuously formed on the surface of the wood piece 3, and the latent heat storage material penetrates into the wood piece 3 where the heat storage layer 5 is formed. Therefore, the wooden board 1 can contain more latent heat storage materials than the conventional ones.

  Moreover, since the heat storage layer 5 made of a latent heat storage material is continuously formed in a network from the front surface to the back surface of the wooden board 1, heat storage while increasing the mechanical strength of the wooden board 1. The heat input from the layer 5 can be quickly transmitted to the inside of the wooden board through the latent heat storage material. Further, since the latent heat storage material is infiltrated into the wood piece 3 where the heat storage layer 5 is formed, the heat input from the surface of the wood board 1 is efficiently stored by the permeated latent heat storage material. can do.

  Moreover, since the heat storage layer 5 is continuously formed on the surface of the wood piece 3, it is possible to suppress the hygroscopicity and water absorption of the wood board 1, and further suppress the emission of formaldehyde as an adhesive. can do.

  Moreover, as shown in FIG. 2, since the space | gap 8 is formed in the inside of the wooden board 1, while being able to suppress the seepage of the thermal storage material fuse | melted at the time of thermal storage, the heat insulation effect of the wooden board 1 can be suppressed. Can also be increased.

In addition, when the content of the latent heat storage material is less than 0.2 g / cm ^{3 with} respect to the woody molded body 1a in the density range described above, it is not only possible to sufficiently expect the heat storage performance by the latent heat storage material. In some cases, the improvement of the mechanical strength of the wood board 1 by the latent heat storage material cannot be expected. On the other hand, when the content of the latent heat storage material exceeds 0.33 g / cm ³ with respect to the woody molded body 1a in the density range described above, the latent heat storage material may be eluted from the wooden board 1.

  Hereinafter, the present invention will be described by way of examples.

<Example 1>
Add 10% by mass of urea melamine formaldehyde adhesive to a wood piece made of cedar chips, press temperature 180 ° C, press time 6 minutes, 350mm × 350mm × thickness 12mm particle board (board-like wood molding) density Pressurizing and heating was performed to obtain 0.31 g / cm ³ . The obtained particle board was cut into 200 mm × 200 mm, and a latent heat storage material composed of paraffin wax (PW-115 manufactured by Nippon Seiwa Co., Ltd .: melting point 48 ° C., melting heat storage amount 200 kJ / kg) [hereinafter referred to as paraffin] Heat to 80 ° C, melt in a bat, immerse the cut particle board in the molten latent heat storage material for 5 minutes, impregnate the latent heat storage material in the particle board, cool the latent heat storage material, and let it cool Then, a wooden board was produced.

<Example 2>
A wood board was produced in the same manner as in Example 1. The difference from Example 1 is that a particle board of 350 mm × 350 mm × thickness 12 mm was pressure-heat-molded so as to have a density of 0.40 g / cm ³ .

<Example 3>
A wood board was produced in the same manner as in Example 1. The difference from Example 1 is that a particle board of 350 mm × 350 mm × thickness 12 mm was press-heated and molded so that the density was 0.49 g / cm ³ .

<Comparative Example 1>
As in Example 1, an attempt was made to produce a wood board. Unlike Example 1, an attempt was made to pressure-heat mold a particle board of 350 mm × 350 mm × thickness 12 mm so that the density would be 0.25 g / cm ^3. The board is punctured and cannot be molded.

<Comparative example 2>
A wood board was produced in the same manner as in Example 1. The difference from Example 1 is that a particle board of 350 mm × 350 mm × thickness 12 mm was pressure-heat-molded so as to have a density of 0.6 g / cm ³ .

[Measurement of density of wood board]
The content of the latent heat storage material was calculated from the weight of the particle board before impregnation in Examples 1 to 3 and Comparative Example 2 and the weight of the wooden board after impregnation, and the impregnation rate for the particle board was calculated from the content. Furthermore, the density of the wooden board was calculated from the volume and weight of the wooden board after impregnation. These results are shown in Table 1. FIG. 4 is a diagram showing the relationship between the board density of the wooden boards according to Examples 1 to 3 and Comparative Example 1 and the paraffin content.

[Measurement of bending strength of wood board]
The bending strength of the wood boards before and after impregnating the latent heat storage materials of Examples 1 to 3 and Comparative Example 2 was measured according to JIS A5908, and the board bending strength improvement rate was calculated from this result. The results are shown in Table 1. FIG. 5 is a diagram showing the relationship between the board density of the wooden boards according to Examples 1 to 3 and Comparative Example 1 and the board bending strength improvement rate.

[Measurement of heat storage of wood board]
The heat storage amount of the wood boards of Examples 1 to 3 and Comparative Example 2 was measured. Specifically, as shown in FIG. 3, each wooden board 1 is placed on the heating plate 1, the side surface of the wooden board is surrounded by a heat insulating material, and the heat flow meters 14, 16, Thermocouples 15 and 17 were arranged. The heating plate was heated to 55 ° C. (environmental test room temperature: 40 ° C.) and calculated from the amount of heat obtained by subtracting the amount of heat Q2 flowing out from the amount of heat Q1 flowing into the wood board from the heating plate. The results are shown in Table 1. FIG. 6 is a diagram showing the relationship between the board density of the wooden boards according to Examples 1 to 3 and Comparative Example 1 and the heat storage amount.

[Elution evaluation of latent heat storage materials]
The wood boards of Examples 1 to 3 and Comparative Example 2 were cut into 100 mm × 100 mm, and 65% R.D. H. The sample was allowed to stand for 1 week or longer, then heated with a dryer at 60 ° C. for 3 hours, and the elution state of paraffin on the surface was evaluated by finger touch. The results are shown in Table 1.

◎: Feels not sticky at all ○: Feels a little sticky ×: Feels sticky considerably

<Result 1>
As shown in Table 1, as shown in Examples 1 to 3 and Comparative Example 2, when the density of the particle board (board density) is 0.31 g / cm ³ or more, the latent heat storage material is applied to the particle board. Can be impregnated.

  As shown in FIG. 4, as the board density increases, the paraffin content decreases. Accordingly, it is considered that the heat storage amount of the wooden board also decreases as shown in FIG.

  Further, as shown in FIG. 5, the board bending strength of the wooden boards according to Examples 1 to 3 was improved by impregnating the latent heat storage material, but in the case of Comparative Example 2, the latent heat storage material was impregnated. Even so, the bending strength of the wooden board was hardly improved. This is considered to be because, in the case of Comparative Example 2, the latent heat storage material is not sufficiently impregnated in the particle board. On the other hand, in the case of the wooden boards of Examples 1 to 3, the latent heat storage material is sufficiently impregnated in the particle board, and the paraffin is continuously formed in a layered manner on the surface of the wooden piece. It is considered that the mechanical strength of the wooden board is increased by forming the network (network).

  Furthermore, as shown in Table 1, although the elution evaluation of the wooden board which concerns on Examples 1-3 was favorable, in the case of the wooden board which concerns on the comparative example 2, the elution of the latent heat storage material was seen. In the case of Comparative Example 2, it is considered that the latent heat storage material could not be sufficiently held in the board because the board density was higher than those in Examples 1 to 3.

From the above, as shown in Examples 1 to 3, when the wood molded body obtained by accumulating and pressing the wood pieces is impregnated with the latent heat storage material, the density is 0.3 to 0.5 g / cm ³ . It is clear that the above-described effects can be expected if the wood molded body is in the range. Furthermore, the latent heat storage material is contained in the wood-based material constituting the wooden molded body and between the wood-based materials such that the latent heat storage material is contained in the wood board in this density range at 0.20 to 0.33 g / cm ^3. It is more preferable to impregnate.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various designs can be made without departing from the spirit of the present invention described in the claims. It can be changed.

  A decorative material may be provided on the wooden board of this embodiment. Further, the wood board itself may be further subjected to processing such as cutting and drilling. Thereby, high sound insulation can be exhibited. Furthermore, by combining the wooden board with the heat insulating material, high heat storage and heat insulating effects can be expected.

DESCRIPTION OF SYMBOLS 1a: Wood molded object, 1: Wood board, 3: Wood piece, 5a: Latent heat storage material, 5: Thermal storage layer, 8: Air gap, 9: Bat

Claims (2)

Including a step of impregnating a latent heat storage material into a board-like wood molded body obtained by compressing and molding wood-based materials;
In the step of impregnating the latent heat storage material, a continuous heat storage layer is formed on the surface of the wood-based material while leaving a void inside the wood-molded body from the surface to the back surface of the board-shaped wood material. As described above, a method for producing a wooden board, wherein the latent heat storage material is impregnated.   In the step of impregnating the latent heat storage material, after immersing the wooden molded body in the molten latent heat storage material, the latent heat storage material in the molten state impregnated on the surface of the wooden molded body and inside thereof is added to the latent heat storage material. The method for producing a wooden board according to claim 1, wherein the wooden molded body is drained by its own weight of the heat storage material.

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