JP2017050309A - Cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cut a center of a street of a package substrate.SOLUTION: A cutting device 1 configured to cut a package substrate W which is divided by a street S, along a center of the street S by a cutting blade 62 comprises a calculation part 5 for calculating a ratio of a first distance D1 with respect to an added distance obtained by adding the first distance D1 from an alignment mark M1 of one chip C1 between two chips C which are adjacent with the street S interposed therebetween, to a center of a first street S1 in a width direction and a second distance D2 from an alignment mark M2 of another chip C2 to the center of the street S1 in the width direction. A position displaced from a position of an alignment mark Mm of one chip Cm which is adjacent with an m-th street Sm interposed therebetween, to another chip Cn just by a value calculated by multiplying a distance Lm from the alignment mark Mm to an alignment mark Mn of the other chip Cn and the ratio of the first distance is defined as a position of a cut line.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a cutting apparatus for cutting a workpiece with a cutting blade.

  A package substrate used in semiconductor manufacturing is cut along a street and divided into individual chips by, for example, a cutting device including a cutting blade. In the alignment of the cutting blade and the package substrate when performing cutting, for example, a circuit pattern formed on each chip is imaged. One pattern having a characteristic shape among the circuit patterns captured here is selected in advance as an alignment mark, and the distance from the alignment mark to the street is recognized (measured and stored) by the cutting device. When a circuit pattern having the same shape as the alignment mark previously recognized by imaging each chip is detected, the position of the cut line passing through the center of the street is calculated using the distance to the street recognized previously. Then, cutting is performed by cutting the cutting blade into the calculated cut line (see, for example, Patent Document 1). That is, when cutting is performed, the alignment mark of the chip adjacent to one side of the street is imaged and the position of the cut line is calculated.

Japanese Patent No. 4612441

  Here, when the object to be cut by the cutting device is, for example, a package substrate molded with a resin, the following problems occur. In other words, the distance from the alignment mark to the street may change due to the entire substrate contracting due to the resin being molded and contracting during the manufacturing process of the package substrate. In this case, since the distance from the alignment mark of the chip adjacent to one side of the street to the street changes, the center of the street may not be cut even if the distance from the previously recognized alignment mark to the street is used. .

  Therefore, for example, in the case of cutting a package substrate whose distance from the alignment mark to the street changes with a cutting device, there is a problem of cutting the center of the street.

  The present invention for solving the above-mentioned problems is a cutting apparatus for cutting a package substrate formed by dividing a chip by a street along a cut line at the center of the street with a cutting blade, and the chip has an alignment mark. A first distance from the alignment mark of one of the two chips adjacent across the street to the center in the width direction of the street, and the alignment of the other chip of the two chips A calculation unit that calculates the second distance from the mark to the center in the width direction of the street and the added distance obtained by adding the second distance or the ratio of the second distance, and is adjacent to the street The distance from the alignment mark of one chip to the alignment mark of the other chip and the first calculated by the calculation unit The position displaced from the position of the alignment mark of the one chip toward the other chip by the value multiplied by the separation ratio, or the other chip from the alignment mark of one chip adjacent to the street The position displaced from the position of the alignment mark of the other chip toward the one chip by a value obtained by multiplying the distance to the alignment mark by the ratio of the second distance calculated by the calculation unit is a cut line. It is a cutting device made into the position of.

  In the cutting apparatus according to the present invention, the first distance from the alignment mark of one of the two chips adjacent across the street to the center in the width direction of the street, and the other of the two chips. Provided with a calculation unit that calculates the first distance or the ratio of the second distance to the added distance obtained by adding the second distance from the alignment mark of the chip to the center in the width direction of the street. Alignment of one chip by a value obtained by multiplying the distance from the alignment mark of one adjacent chip to the alignment mark of the other chip by the ratio of the first distance calculated by the calculation unit (the ratio of the second distance). The position displaced from the position of the mark (the other alignment mark) toward the other chip (one chip) is the cut line position. Thus, even if the object to be cut is a package substrate whose distance from the alignment mark to the street changes, for example, the center of the street can always be the cut line, and cutting can be performed along the cut line. .

It is a perspective view which shows an example of a cutting device. It is explanatory drawing which shows the example of the captured image containing an alignment mark. It is a top view which shows the state in which the package board | substrate and the paralleling with the cutting direction are performed. In Embodiment 1, it is a top view which expands and shows a part of surface of the package board | substrate currently cut. It is explanatory drawing which shows the example of the captured image containing an alignment mark. In Embodiment 2, it is a top view which expands and shows a part of surface of the package board | substrate currently cut.

  A cutting apparatus 1 shown in FIG. 1 is an apparatus that performs cutting with a cutting means 6 on a package substrate W held by a chuck table 30. On the base 1a of the cutting apparatus 1, an attachment / detachment area A, which is an area where the package substrate W is attached / detached, and a cutting area B, an area where the cutting means 6 performs the cutting of the package substrate W, etc. Divided.

  On the front side (+ Y direction side) of the base 1a, operating means 10 is provided for the operator to input machining conditions and the like to the cutting apparatus 1. A chuck table 30 that reciprocates between the attachment / detachment area A and the cutting area B in the X-axis direction is disposed behind the operation means 10 (−Y direction side). Further, a temporary placement region 11 in which the package substrate W to be cut is temporarily placed is provided in the attachment / detachment region A, and the package substrate W is aligned at a fixed position in the temporary placement region 11. An alignment means 12 is provided.

  In the vicinity of the temporary placement region 11, a first transport unit 13 a having a turning arm for transporting the package substrate W is disposed between the chuck table 30 and the temporary placement region 11. The package substrate W carried out to the temporary placement area 11 as a cutting target is adsorbed by the first transport means 13 a and transported from the temporary placement area 11 to the chuck table 30.

  A cleaning unit 15 for cleaning the package substrate W after the cutting process is disposed in the vicinity of the first transport unit 13a. Above the cleaning unit 15, a second transport unit 13 b that sucks and transports the package substrate W after cutting from the chuck table 30 to the cleaning unit 15 is disposed.

  The chuck table 30 shown in FIG. 1, for example, has an outer shape formed in a rectangular shape corresponding to the rectangular package substrate W, and sucks and holds the package substrate W on the holding surface 30a. The holding surface 30a communicates with a suction source (not shown), and the suction force generated by the suction source is transmitted to the holding surface 30a. The chuck table 30 can be reciprocated in the X-axis direction by a cutting feed means (not shown) disposed below the chuck table 30 and is rotatably supported.

  Above the movement path of the chuck table 30, an alignment means 17 for detecting a street S to be cut of the package substrate W is disposed. The alignment unit 17 including at least a CPU and a storage element such as a memory includes an image capturing unit 170 that captures an image of the surface Wa of the package substrate W. Based on the image acquired by the image capturing unit 170, an image such as pattern matching is provided. The street S to be cut can be detected by the processing. The image acquired by the imaging unit 170 is displayed on a display unit 18 such as a monitor disposed above the alignment unit 17. Further, in the vicinity of the alignment unit 17, a cutting unit 6 that performs a cutting process on the package substrate W held on the chuck table 30 in the cutting region B is disposed. The cutting means 6 is configured integrally with the alignment means 17, and both move together in the Y-axis direction and the Z-axis direction.

  The calculation unit 5 is connected to the alignment unit 17, and predetermined information is sent from the alignment unit 17 to the calculation unit 5.

  The alignment unit 17 stores, for example, the following data in advance. For example, a chip C on the surface Wa of the package substrate W shown in FIG. 1 is imaged by an operator's operation, and one pattern having a characteristic shape among circuit patterns formed on the surface of the chip C is The alignment mark M shown in FIG. 2 is selected in advance. The captured image Ga in which the alignment mark M is reflected is stored in the alignment means 17 as data. The alignment mark M is formed at the same position for each of a large number of chips C formed on the surface Wa of the package substrate W. The outer shape of the alignment mark M shown in FIG. 2 has a cross shape, but is not limited to this shape.

  The cutting means 6 shown in FIG. 1 includes a spindle 61 having a rotation axis whose axial direction is a direction (Y-axis direction) perpendicular to the horizontal direction with respect to the X-axis direction, and a cutting blade 62 fixed to the spindle 61 and rotatable. And can be moved in the Y-axis direction by an index feed means (not shown), and can be moved in the Z-axis direction by a notch feed means (not shown).

  Before and after the cutting blade 62 in the Y-axis direction, a cutting water nozzle 20 that ejects cutting water to a processing point of the cutting blade 62 with respect to the package substrate W is provided. The cutting water sprayed from the cutting water nozzle 20 cools the contact portion between the cutting blade 62 and the package substrate W.

  As shown in FIG. 1, the package substrate W molded with resin has, for example, a rectangular outer shape. On the surface Wa of the package substrate W, rectangular regions W1 partitioned in a grid pattern by streets S are formed. A plurality are formed. Each rectangular area W1 is surrounded by a surplus area W2 that is made into small pieces and mainly becomes waste material. The rectangular area W1 is cut and cut along each street S to form individual chips C. The same circuit pattern is formed on each chip C. The package substrate W is contracted, for example, by hardening of the resin molded at the time of manufacture. Note that the shape of the package substrate W, the number of rectangular regions W1, and the like are not limited to the examples illustrated in the accompanying drawings.

(Embodiment 1)
The operation of the cutting apparatus 1 when the package substrate W is cut by the cutting apparatus 1 shown in FIG. 1 will be described below with reference to FIGS.

  When performing the cutting, for example, parallelism for aligning the street S extending in the X-axis direction in parallel with the X-axis direction is performed.

  In the parallel placement, one package substrate W is carried out to the temporary placement area 11 and is positioned at a predetermined position by the positioning means 12 in the temporary placement area 11. Thereafter, the first transport unit 13 a sucks the package substrate W and moves the package substrate W from the temporary placement region 11 to the chuck table 30. Next, the package substrate W is sucked and held on the holding surface 30a.

  A cutting feed means (not shown) feeds the package substrate W held on the chuck table 30 in the −X direction. 3 is, for example, a chip Ca that is adjacent to the first street S1 extending in the X-axis direction and separated from each other in the X-axis direction (the most distant position in the illustrated example). The chip Cb is imaged, and the alignment unit 17 detects the alignment mark Ma and the alignment mark Mb in each captured image. Then, by rotating the chuck table 30 so that the coordinates of the alignment mark Ma and the alignment mark Mb in the Y-axis direction coincide with each other, the first street S1 can be aligned in parallel with the X-axis direction. And the alignment means 17 memorize | stores the information about parallelism of the 1st street S1.

  After paralleling is performed, cutting of the package substrate W is started. After the package substrate W held on the chuck table 30 is sent in the −X direction by a cutting feed means (not shown) and positioned immediately below the imaging means 170, the imaging section 170 shows an area to be cut as shown in FIG. G1 (captured image G1) is captured.

  The alignment means 17 performs pattern matching between the circuit pattern formed on the surface of the first chip C1 and the second chip C2 and the stored alignment mark M shown in FIG. The first alignment mark M1 and the second alignment mark M2 shown in FIG. 4 are detected. That is, for example, by matching the matching frame having the same size (number of pixels) as the alignment mark M in units of pixels in the vertical and horizontal directions, the region of the captured image G1 is cut to form a plurality of matching images. The height of similarity between each of the formed images to be matched and the alignment mark M is calculated, and the images to be matched that have the highest similarity with the alignment mark M are obtained as the first chip C1 and the second chip, respectively. And detected as the first alignment mark M1 and the second alignment mark M2.

  The captured image G1 is displayed on the display unit 18 shown in FIG. For example, the operator recognizes the first alignment mark M1 and the first street S1 in the captured image G1 with pixels having unique color information included in each circuit pattern in the captured image G1. Then, based on the number of pixels between the first alignment mark M1 and the center (center line O1) in the width direction of the first street S1, the first alignment mark M1 of the first chip C1 shown in FIG. The first distance D1 to the center line O1 in the width direction of the first street S1 is measured. Further, based on the number of pixels between the second alignment mark M2 and the center of the first street S1 in the width direction (center line O1), the second street from the second alignment mark M2 of the second chip C2 to the first street. A second distance D2 to the center line O1 in the width direction of S1 is measured.

The operator inputs the measured first distance D1 and second distance D2 to the calculation unit 5, and the calculation unit 5 adds an addition distance L1 obtained by adding the first distance D1 and the second distance D2. Further, the ratio of the first distance D1 or the second distance D2 to the addition distance L1 is calculated. For example, the ratio of the first distance D1 and the second distance D2 is as follows (Formula 1).
First distance D1: Second distance D2 = 7: 1 (Expression 1)
In this case, the ratio of the first distance D1 to the addition distance L1 is 7/8, and the ratio of the second distance D2 is 1/8.

  From the calculated ratio, the center line O1 (cut line O1) of the first street S1 is determined. That is, the distance L1 from the first alignment mark M1 to the second alignment mark M2 is multiplied by the calculated ratio 7/8, and the value is obtained by adding the Y coordinate value of the first alignment mark M1. Y1 is determined as the position (Y coordinate value) of the cut line O1. That is, the position displaced from the first alignment mark M1 toward the second chip C2 by the value obtained by multiplying the addition distance L1 and the ratio 7/8 becomes the position of the cut line O1. Note that a position displaced from the second alignment mark M2 toward the first chip C1 by a value obtained by multiplying the addition distance L1 and the ratio 1/8 may be Y1.

  As the cut line O1 of the first street S1 is detected, the cutting means 6 shown in FIG. 1 is driven in the Y-axis direction by an index feed means (not shown), and the cut line O1 to be cut and the cutting blade 62 Is aligned in the Y-axis direction. That is, the cutting blade 62 is positioned at the position Y1.

  After the alignment of the cutting blade 62 and the detected cut line O1 to be cut in the Y-axis direction, a cutting feed means (not shown) further feeds the package substrate W in the -X direction, and a notch feed means (not shown) Lowers the cutting blade 62 in the −Z direction. Further, the cutting blade 62 fixed to the spindle 61 cuts into the package substrate W while rotating at a high speed, and cuts the cut line O1 of the first street S1.

  When the package substrate W advances in the −X direction to a predetermined position in the X-axis direction where the cutting blade 62 finishes cutting the cut line O1 of the first street S1, the cutting feed of the package substrate W is once stopped, and the cutting blade 62 Is pulled up in the + Z direction and separated from the package substrate W, and the package substrate W is sent back in the + X direction to return to the original position.

  The package substrate W held on the chuck table 30 is again fed in the −X direction by a cutting feed means (not shown) and positioned immediately below the imaging means 170, and then the imaging substrate 170 should perform cutting as shown in FIG. A region G2 (captured image G2) is captured.

  The alignment unit 17 performs pattern matching between the circuit pattern formed on the surface of the second chip C2 and the third chip C3 and the stored alignment mark M shown in FIG. 2 from the captured image G2. The second alignment mark M2 and the third alignment mark M3 shown in FIG. 4 are detected.

  The captured image G2 is displayed on the display means 18. For example, based on the number of pixels between the second alignment mark M2 and the third alignment mark M3 in the captured image G2, the operator changes from the second alignment mark M2 of the second chip C2 shown in FIG. The distance L2 from the third chip C3 to the third alignment mark M3 is measured.

  Next, the center line O2 (cut line O2) of the second street S2 is determined. That is, the distance L2 from the second alignment mark M2 to the third alignment mark M3 is multiplied by 7/8, which is the ratio previously calculated by the calculation unit 5, and this value is multiplied by the Y coordinate value of the second alignment mark M2. Is determined as the position (Y coordinate value) of the cut line O2. That is, the position displaced from the second alignment mark M2 toward the third chip C3 by a value obtained by multiplying the distance L2 and the ratio 7/8 becomes the position of the cut line O2. Then, the cutting line 6 cuts the cut line O2 of the second street S2. Note that the position displaced from the third alignment mark M3 toward the second chip C2 by a value obtained by multiplying the distance L2 and the ratio 1/8 may be Y2.

  Hereinafter, the cut line is similarly determined for each street S extending in the X-axis direction, and the same cutting is sequentially performed while the cutting blade 62 is indexed and fed in the Y-axis direction.

  For example, even when the package substrate W has a region P in which the mth chip Cm, the nth chip Cn, and the mth street Sm are contracted as shown in FIG. Cutting is performed in the same manner. That is, the package substrate W is sent in the −X direction, and the imaging unit 170 images the region Gm to be cut (captured image Gm) shown in FIG.

  The alignment unit 17 performs pattern matching between the circuit pattern formed on the surfaces of the m-th chip Cm and the n-th chip Cn and the stored alignment mark M shown in FIG. The m-th alignment mark Mm and the n-th alignment mark Mn shown in FIG. 4 are detected.

  The captured image G2 is displayed on the display means 18. For example, the operator sets the distance Lm from the mth alignment mark Mm to the nth alignment mark Mn based on the number of pixels between the mth alignment mark Mm and the nth alignment mark Mn in the captured image Gm. taking measurement.

  Next, the center line Om (cut line Om) of the mth street Sm is determined. That is, the distance Lm from the m-th alignment mark Mm to the n-th alignment mark Mn is multiplied by 7/8, which is the ratio previously calculated by the calculation unit 5, and this value is multiplied by the Y coordinate value of the m-th alignment mark Mm. Is determined as the position (Y coordinate value) of the cut line Om. That is, the position displaced from the mth alignment mark Mm toward the nth chip Cn by the value obtained by multiplying the distance Lm and the ratio 7/8 becomes the position of the cut line Om. Then, the cutting means 6 cuts the cut line Om of the mth street Sm. Note that a position displaced from the nth alignment mark Mn toward the mth chip Cm by a value obtained by multiplying the distance Lm and the ratio 1/8 may be Ym.

  In the cutting apparatus 1, the calculation unit 5 causes the alignment mark M1 of one of the first chip C1 and the second chip C2 adjacent to each other across the first street S1 (first chip C1). The first distance D1 from the (first alignment mark M1) to the center O1 of the first street S1 width, and the alignment mark M2 (second alignment mark M2) of the other chip C2 (second chip C2) To the second distance D2 from the first street S1 width O1 to the center O1 (7: 1 in the first embodiment), and the first distance D1 and the second distance D2 are added. The ratio of the first distance D1 to the added distance (7/8) or the ratio of the second distance (1/8) can be calculated.

  Generally, when the package substrate W contracts, there is almost no contraction of only the chip C or only the street S, and both the chip C and the street S contract uniformly. Accordingly, since the ratio calculated by the calculation unit 5 is established in any region, one chip Cm adjacent to the mth street Sm distant from the first street S1 (mth chip Cm). The distance Lm from the m-th alignment mark Mm to the n-th alignment mark Mn in the other chip Cn (n-th chip Cn) is multiplied by the calculated ratio 7/8, and this value is multiplied by the m-th alignment mark. The center of the street Sm obtained by adding the Y coordinate value of Mm can be determined as the cut line Om, and the package substrate W can be cut along the cut line Om.

  After cutting all the streets S extending in the X-axis direction, when the same alignment and cutting are performed after the chuck table 30 is further rotated 90 degrees, the centers of all the streets S are all cut vertically and horizontally. Chip C is produced.

(Embodiment 2)
The operation of the cutting apparatus 1 when the package substrate W is cut by the cutting apparatus 1 shown in FIG. 1 will be described below with reference to FIGS. 1, 2, and 5 to 6. In the second embodiment, the cut line is determined using different alignment marks in two chips C adjacent to each other with the street S interposed therebetween.

  In the second embodiment, the alignment means 17 stores another different alignment mark N in addition to the alignment mark M shown in FIG. That is, by the operator's operation, the chip C on the surface Wa of the package substrate W shown in FIG. 1 is imaged, and one pattern having a characteristic shape among the circuit patterns formed on the surface of the chip C is For example, a captured image Gb that is selected in advance as the alignment mark N shown in FIG. 5 and shows the alignment mark N is stored in the alignment means 17. The alignment mark N is formed at the same position for each of a large number of chips C formed on the surface Wa of the package substrate W. Although the shape of the alignment mark N shown in FIG. 5 is X-shaped, it is not limited to this shape.

  First, using the alignment mark M shown in FIG. 2, in parallel with the first embodiment, parallel alignment is performed to align the street S extending in the X-axis direction in parallel with the X-axis direction.

  After paralleling is performed, cutting of the package substrate W is started. As shown in FIG. 1, the package substrate W held on the chuck table 30 is sent in the −X direction by a cutting feed means (not shown) and positioned immediately below the image pickup means 170, and then is picked up by the image pickup means 170. A region G1 to be cut (captured image G1) shown in FIG.

  From the captured image G1, the alignment means 17 stores the circuit patterns formed on the surfaces of the first chip C1 and the second chip C2, the stored alignment mark M shown in FIG. 2, and the alignment mark N shown in FIG. And the first alignment mark N1 and the second alignment mark M2 shown in FIG. 6 are detected.

  Unlike the first embodiment, in the second embodiment, the first alignment mark in one chip C1 (first chip C1) adjacent to the first street S1 is not the alignment mark M but the first alignment mark. The alignment mark N present at a position closer to the street S1 is detected as the first alignment mark N1.

  The captured image G1 is displayed on the display means 18. For example, the operator performs the first alignment of the first chip C1 shown in FIG. 6 based on the number of pixels between the first alignment mark N1 and the center (center line O1) in the width direction of the first street S1. A first distance D11 from the mark N1 to the center line O1 in the width direction of the first street S1 is measured. Further, based on the number of pixels between the second alignment mark M2 and the center of the first street S1 in the width direction (center line O1), the second street from the second alignment mark M2 of the second chip C2 to the first street. The second distance D12 to the center line O1 in the width direction of S1 is measured.

The operator inputs the measured first distance D11 and second distance D12 to the calculation unit 5, and the calculation unit 5 adds an addition distance L11 obtained by adding the first distance D11 and the second distance D12. Further, the ratio of the first distance D11 or the second distance D12 to the addition distance L11 is calculated. For example, the ratio of the first distance D11 and the second distance D12 is as follows (Formula 2).
First distance D11: Second distance D12 = 2: 1 (2)
In this case, the ratio of the first distance D11 to the addition distance L11 is 2/3, and the ratio of the second distance D12 is 1/3.

  Next, 2/3 which is the calculated ratio is multiplied by the added distance L11 from the first alignment mark N1 to the second alignment mark M2, and the Y coordinate value of the first alignment mark N1 is added to the value. Y1 obtained in this way is determined as the position (Y coordinate value) of the cut line O1. That is, the position displaced from the first alignment mark N1 toward the second chip C2 by the value obtained by multiplying the addition distance L11 and the ratio 2/3 becomes the position of the cut line O1. Note that the position displaced from the second alignment mark M2 toward the first chip C1 by a value obtained by multiplying the addition distance L11 and the ratio 1/3 may be Y1.

  As the cut line O1 of the first street S1 is detected, the cutting blade 62 is positioned at the position Y1, and the cutting blade 62 fixed to the spindle 61 cuts into the package substrate W while rotating at high speed. The cut line O1 of the first street S1 is cut. When the cutting blade 62 finishes cutting the cut line O1 of the first street S1, the package substrate W is sent back in the + X direction and returned to the original position.

  The package substrate W held on the chuck table 30 shown in FIG. 1 is again sent in the −X direction, and the imaging unit 170 captures the region G2 to be cut (captured image G2) shown in FIG.

  From the captured image G2, the alignment means 17 stores the circuit patterns formed on the surfaces of the second chip C2 and the third chip C3, the stored alignment mark M shown in FIG. 2, and the alignment mark N shown in FIG. And the second alignment mark N2 and the third alignment mark M3 shown in FIG. 6 are detected.

  In addition, the captured image G2 is displayed on the display unit 18, and the operator determines from the second alignment mark N2 based on the number of pixels between the second alignment mark N2 and the third alignment mark M3 in the captured image G2. The distance L12 to the third alignment mark M3 is measured.

  Next, the distance L12 from the second alignment mark N2 to the third alignment mark M3 is multiplied by 2/3, which is the previously calculated ratio, and the Y coordinate value of the second alignment mark N2 is added to that value. Y2 obtained in this way is determined as the position (Y coordinate value) of the cut line O2, and the cutting means 6 cuts the cut line O2 of the second street S2. That is, the position displaced from the second alignment mark N2 toward the third chip C3 by a value obtained by multiplying the distance L12 and the ratio 2/3 becomes the position of the cut line O2. Note that the position displaced from the third alignment mark M3 toward the second chip C1 by a value obtained by multiplying the distance L12 and the ratio 1/3 may be Y2.

  Hereinafter, the cut line is similarly determined for each street S extending in the X-axis direction, and the same cutting is sequentially performed while the cutting blade 62 is indexed and fed in the Y-axis direction.

  For example, even when the package substrate W has a region P in which the mth chip Cm, the nth chip Cn, and the mth street Sm are contracted as shown in FIG. Cutting is performed in the same manner. That is, the package substrate W is sent in the −X direction, and the imaging unit 170 images the region Gm to be cut (captured image Gm) shown in FIG.

  From the captured image Gm, the alignment means 17 stores the circuit pattern formed on the surfaces of the m-th chip Cm and the n-th chip Cn, the stored alignment mark M shown in FIG. 2, and the alignment mark N shown in FIG. And the m-th alignment mark Nm and the n-th alignment mark Mn shown in FIG. 6 are detected.

  The captured image Gm is displayed on the display means 18. For example, the operator sets the distance L1m from the mth alignment mark Nm to the nth alignment mark Mn based on the number of pixels between the mth alignment mark Nm and the nth alignment mark Mn in the captured image Gm. taking measurement.

  Next, the distance L1m from the mth alignment mark Nm to the nth alignment mark Mn is multiplied by 2/3, which is the previously calculated ratio, and the Y coordinate value of the mth alignment mark Nm is added to the value. The position Ym obtained in this way is determined as the position of the cut line Om. That is, the position displaced from the mth alignment mark Nm toward the nth chip Cn by the value obtained by multiplying the distance L1m and the ratio 2/3 is the position of the cut line Om. Then, the cutting means 6 cuts the cut line Om of the mth street Sm. Note that a position displaced from the nth alignment mark Mn toward the mth chip Cm by a value obtained by multiplying the distance L1m and the ratio 1/3 may be Ym.

  In the cutting apparatus 1, the calculation unit 5 causes the alignment mark N1 of one of the first chip C1 and the second chip C2 adjacent to each other across the first street S1 (first chip C1). The first distance D11 from the (first alignment mark N1) to the center O1 of the width of the first street S1, and the alignment mark M2 (second alignment mark M2) of the other chip C2 (second chip C2) ) To the second distance D12 from the width of the first street S1 to the center O1 (2: 1 in the second embodiment) can be calculated. Here, in the second embodiment, the alignment mark of one chip C1 is the alignment mark N that is closer to the first street S1 than the alignment mark M, so that the ratio calculated by the calculation unit 5 is increased. The error can be reduced.

  Generally, due to the shrinkage of the package substrate W, there is almost no case where only the chip C or the street S shrinks, and both the chip C and the street S shrink uniformly. Accordingly, since the ratio calculated by the calculation unit 5 is also established in a region away from the first street S1, the mth in one chip Cm (mth chip Cm) adjacent to the mth street Sm. The distance Lm from the alignment mark Nm to the n-th alignment mark Mn in the other chip Cn (the n-th chip Cn) is multiplied by 2/3, which is the calculated ratio, and this value is multiplied by Y of the m-th alignment mark Nm. The center of the street Sm obtained by adding the coordinate values can be determined as the cut line Om, and the package substrate W can be cut along the cut line Om.

  After cutting all the streets S extending in the X-axis direction, when the same alignment and cutting are performed after the chuck table 30 is further rotated 90 degrees, the centers of all the streets S are all cut vertically and horizontally. Chip C is produced.

  The cutting device 1 according to the present invention is not limited to the first and second embodiments, and the size and shape of each component illustrated in the accompanying drawings are not limited thereto. Modifications can be made as appropriate within the range where the effects of the invention can be exhibited. Further, the package substrate W to be cut is not limited to a rectangular substrate.

1: Cutting device 1a: Base A: Detachable area B: Cutting area
10: Operating means 11: Temporary placement area 12: Positioning means 13a: First conveying means 13b: Second conveying means 15: Cleaning means 17: Alignment means 170: Imaging means 18: Display means 5: Calculation unit 20: Cutting water nozzle 30: chuck table 30a: holding surface
6: Cutting means 61: Spindle 62: Cutting blade
W: Package substrate Wa: Package substrate surface W1: Rectangular region W2: Surplus region
S: Street M: Alignment mark N: Alignment mark G: Captured image

Claims (1)

A cutting apparatus for cutting a package substrate formed by dividing a chip by a street along a cutting line at the center of the street with a cutting blade,
The chip has an alignment mark,
The first distance from the alignment mark of one of the two chips adjacent to the street to the center in the width direction of the street, and the alignment mark of the other chip of the two chips A calculation unit that calculates the second distance to the center in the width direction of the street, and the ratio of the first distance or the second distance to the added distance obtained by adding together,
Alignment of the one chip by a value obtained by multiplying the distance from the alignment mark of one chip adjacent to the other side of the street to the alignment mark of the other chip by the ratio of the first distance calculated by the calculation unit The position displaced from the position of the mark toward the other chip, or the distance from the alignment mark of one chip adjacent to the street to the alignment mark of the other chip and the second calculated by the calculation unit A cutting apparatus having a position displaced toward the one chip from the position of the alignment mark of the other chip by a value obtained by multiplying the ratio of the distances of the other chip.

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