JP2017045913A - Component mounting device and component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting device and a component mounting method that can compensate for deviation of a mounting position in consideration of tilt of a mounting head.SOLUTION: In a component mounting method for mounting a component on a substrate by a component mounting apparatus which includes a mounting head for picking up the component from a component supply unit and mounting the component on the substrate, and a head moving mechanism for moving the mounting head, the component mounting apparatus includes a reference section containing an imaging target which has the same center position and is different sizes, and a camera which is provided on the mounting head and images the reference section provided on the base stage side when the mounting head is positioned at a reference position. The method comprises an inclination calculation step (ST2) for calculating the inclination of the mounting head positioned at the reference position with respect to the base stage by performing image processing on an image of the reference portion captured by the camera, and a step (ST3) for correcting the position of the mounting head based on the calculated inclination. The inclination calculation step includes calculating the inclination on the basis of the shift amount of the center position of an imaging target.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a component mounting apparatus and a component mounting method for picking up a component by a mounting head and mounting the component on a substrate.

  2. Description of the Related Art Conventionally, a component mounting apparatus that picks up a component from a component supply unit by a mounting head and mounts the component at a predetermined mounting position on a mounting target such as a substrate is known. The mounting head is provided in the component mounting apparatus so as to be horizontally movable, and moves between the component supply unit and the substrate to continuously pick up and mount the components. The alignment of the mounting head with the component supply position of the component supply unit and the stop position of the substrate is based on the image processing result of the image obtained by imaging the component and the substrate of the component supply unit by the imaging means such as a camera provided in the mounting head. This is done by performing movement control for correcting the XY position of the mounting head.

  The head moving mechanism that horizontally moves the mounting head includes an XY beam, and deformation due to heat generated in the process of continuously performing the mounting operation occurs over time. For this reason, even if the position is properly corrected in the initial stage, the mounting quality is deteriorated due to the displacement of the mounting head due to the change over time. In order to solve such a problem, a plurality of recognition marks provided on the base are imaged at a predetermined timing to obtain a horizontal shift amount, and the XY position of the mounting head is corrected based on the shift amount. Has proposed a method for avoiding the influence of changes over time (see Patent Document 1).

JP 2007-233501 A

  However, in the prior art including Patent Document 1, no correction is made in consideration of a shift in the mounting position caused by the mounting head tilting from the vertical direction due to the twist of the beam on which the mounting head is mounted. There was a need for further improvements.

  Accordingly, an object of the present invention is to provide a component mounting apparatus and a component mounting method capable of correcting a shift of a mounting position in consideration of a tilt of a mounting head caused by a change with time.

  A component mounting apparatus according to the present invention is provided so as to be horizontally movable relative to a base, a mounting head for picking up a component from a component supply unit provided on the base and mounting the component on a substrate, and the mounting head A head moving mechanism that moves the camera, a camera that is provided on the mounting head and that images a reference portion provided on the base side when the mounting head is located at a reference position, and the reference imaged by the camera A calculation unit that calculates an inclination of the mounting head located at the reference position with respect to the base by performing image processing on an image of the unit, and a position correction of the mounting head based on the inclination calculated by the calculation unit The reference unit includes imaging targets having the same center position and different sizes, and the calculation unit is configured to calculate the tilt based on a deviation amount of the center position of the imaging target. Calculation, characterized in that.

  A component mounting method according to the present invention includes a mounting head that is provided so as to be horizontally movable relative to a base, picks up a component from a component supply unit provided on the base side, and mounts the component on a substrate, and the mounting head A component mounting method for mounting a component on a board by a component mounting apparatus including a head moving mechanism for moving the component, wherein the component mounting apparatus includes a reference unit including an imaging target having the same center position and different sizes, and the mounting And a camera that images the reference portion provided on the base side when the mounting head is positioned at a reference position, and performs image processing on the image of the reference portion captured by the camera Accordingly, an inclination calculating step for calculating an inclination of the mounting head at the reference position with respect to the base, and a position correction of the mounting head based on the calculated inclination. And a step of performing, the inclination calculation step, and calculates the slope based on the shift of the center position of the imaging target.

  According to the present invention, it is possible to correct the displacement of the mounting position in consideration of the inclination of the mounting head due to the change over time.

The top view of the component mounting apparatus of one embodiment of this invention The fragmentary sectional view of the component mounting apparatus of one embodiment of the present invention (A) (b) Explanatory drawing of the imaging object in the component mounting apparatus of one embodiment of this invention The figure explaining the imaging of the imaging target by the board | substrate recognition camera of the tilted state in the component mounting apparatus of one embodiment of this invention (A) The component mounting apparatus of one embodiment of this invention WHEREIN: (a) The figure which shows the captured image of the imaging target which the board | substrate recognition camera of the ideal state imaged Figure showing The block diagram which shows the structure of the control system of the component mounting apparatus of one embodiment of this invention The flowchart of the component mounting method in the component mounting apparatus of one embodiment of this invention (A) (b) Explanatory drawing of the other imaging object in the component mounting apparatus of one embodiment of this invention

  Next, an embodiment of the present invention will be described with reference to the drawings. First, the configuration of a component mounting apparatus 1 for mounting components on a board will be described with reference to FIGS. The component mounting apparatus 1 has a function of mounting components on a substrate. FIG. 2 partially shows an AA cross section in FIG. In the following, the substrate transport direction (left and right direction in FIG. 1) is the X direction, the direction orthogonal to the X direction in the horizontal plane (up and down direction in FIG. 1) is the Y direction, and the height direction (FIG. 2) is orthogonal to the horizontal plane. Is defined as the Z direction.

  In FIG. 1, a substrate transport mechanism 2 is disposed in the center of the base 1a in the X direction. The substrate transport mechanism 2 includes two transport rails 2a arranged in parallel, and transports the substrate 3 transported from the upstream side and positions it on a mounting stage set for performing component mounting work. And hold. Component supply units 4 are arranged on both sides of the board transport mechanism 2, and a plurality of tape feeders 5 are mounted in parallel on each component supply unit 4. The tape feeder 5 pitches a carrier tape containing components in a direction (tape feed direction) from the outside of the component supply unit 4 toward the substrate transport mechanism 2, so that the component is placed at a component suction position by a mounting head described below. Supply.

  A Y-axis beam 6 provided with a linear drive mechanism is disposed at one end in the X direction on the upper surface of the base 1a. The Y-axis beam 6 includes two linear drive mechanisms similarly provided. The X-axis beam 7 is coupled to be movable in the Y direction. A mounting head 8 is mounted on each of the two X-axis beams 7 so as to be movable in the X direction. The mounting head 8 is a multiple-type head having a plurality of holding heads, and suction nozzles capable of sucking and holding the component D and individually moving up and down at the lower end of each holding head, as shown in FIG. 8a is mounted.

  By driving the Y-axis beam 6 and the X-axis beam 7, the mounting head 8 moves in the X direction and the Y direction. Accordingly, the two mounting heads 8 take out the component D from the component suction position of the tape feeder 5 of the corresponding component supply unit 4 by the suction nozzle 8a and transfer it to the mounting point of the substrate 3 positioned in the substrate transport mechanism 2. Mount. The Y-axis beam 6 and the X-axis beam 7 constitute a head moving mechanism 9 that moves the mounting head 8 in the horizontal direction (X direction, Y direction). As described above, the mounting head 8 is provided so as to be horizontally movable relative to the base 1 a, picks up the component D from the component supply unit 4 provided on the base 1 a side, and mounts it on the substrate 3.

  A component recognition camera 10 is disposed between the component supply unit 4 and the substrate transport mechanism 2. When the mounting head 8 that has taken out the component D from the component supply unit 4 moves above the component recognition camera 10, the component recognition camera 10 captures and recognizes the component D held by the mounting head 8. Mounted on the mounting head 8 are substrate recognition cameras 11 that are located on the lower surface side of the X-axis beam 7 and move together with the mounting head 8. As the mounting head 8 moves, the substrate recognition camera 11 moves above the substrate 3 positioned by the substrate transport mechanism 2 and images and recognizes the substrate 3. In the component mounting operation on the substrate 3 by the mounting head 8, the mounting position correction is performed in consideration of the recognition result of the component D by the component recognition camera 10 and the substrate recognition result by the substrate recognition camera 11.

  In the component mounting operation in which the mounting head 8 is moved by the head moving mechanism 9 and the component D is taken out from the component supply unit 4 and transferred and mounted on the substrate 3, the mounting head 8 is repeated between the component supply unit 4 and the substrate 3. The mounting turn to be moved is executed frequently. By this repetitive operation, heat is generated from the linear drive mechanism of the Y-axis beam 6 and X-axis beam 7 constituting the head moving mechanism 9 and the sliding portion, and the Y-axis beam 6 and X-axis beam 7 are thermally expanded and bent. Or heat distortion occurs. This thermal deformation changes with time because it depends on the temperatures of the Y-axis beam 6 and the X-axis beam 7.

  When the Y-axis beam 6 and the X-axis beam 7 are thermally deformed, the mounting position where the suction nozzle 8a actually mounts the component D on the substrate 3, and the Y-axis beam 6 and the X-axis beam 7 are not thermally deformed. A positional deviation occurs between the ideal mounting position (hereinafter referred to as “ideal mounting position”). In order to detect this misalignment and the like, a plurality of position reference posts 12 and a reference portion 13 are provided around the substrate transport mechanism 2. It should be noted that the position reference post 12 and the reference portion 13 are not displaced with time due to thermal deformation of the Y-axis beam 6 and the X-axis beam 7, but also assembly errors of the component mounting apparatus 1 and the mounting head 8 to the X-axis beam 7. It can also be used to measure misalignment.

  Four position reference posts 12 are erected on the upper surface of the base 1a so as to surround the substrate 3 positioned by the substrate transport mechanism 2 from the periphery. The position reference post 12 is for detecting a horizontal displacement of the mounting head 8. The position reference posts 12 are numbered (1) to (4) in a clockwise direction so that each can be specified individually. The position of the mounting head 8 in the horizontal direction is recognized by recognizing the marks on the position reference posts 12 (1) to 12 (4) by the substrate recognition camera 11 that moves with the mounting head 8 and comparing the marks with the ideal position. Can be detected.

  On the upper surface of the transport rail 2a, six reference portions 13 are provided so as to surround the substrate 3 positioned by the substrate transport mechanism 2 from the periphery. Each reference portion 13 is provided with an imaging mark 20 for detecting the inclination of the mounting head 8 from the Z direction (vertical direction). The reference part 13 is numbered (1) to (6) in the clockwise direction so that each can be specified individually. The board recognition camera 11 images the imaging marks 20 of the reference units 13 (1) to 13 (4), and performs image processing on the recognition-processed image by a calculation unit 30 b (see FIG. 6) to be described later. The inclination from the Z direction is calculated.

  In FIG. 2, an X-axis beam 7 indicated by a solid line indicates a state in which the ideal X-axis beam 7 indicated by a dotted line is twisted due to heat generation or the like. In the ideal state, the ideal mounting position 14 is a position at the mounting height 3 a where the component D held by the suction nozzle 8 a descending is in contact with the substrate 3. That is, the ideal mounting position 14 is a position where the mounting shaft 8b passing through the center of the suction nozzle 8a intersects the upper surface of the substrate 3. On the other hand, when the mounting head 8 attached to the X-axis beam 7 is twisted by the inclination θy from the Z direction to the Y direction by twisting the X-axis beam 7, the mounting position 14 * of the component D on the substrate 3 is changed. The position shifts from the ideal mounting position 14 by a position shift amount ΔY * in the Y direction.

  The board recognition camera 11 is mounted on the mounting head 8 so that its optical axis 11a is parallel to the mounting axis 8b, and the optical axis 11a of the board recognition camera 11 is also tilted from the Z direction by the same inclination θy as the mounting axis 8b. Yes. Therefore, the inclination θy of the substrate recognition camera 11 calculated from the image of the imaging mark 20 imaged by the substrate recognition camera 11 is the inclination θy of the mounting head 8 from the Z direction (the inclination θy of the mounting head 8 with respect to the base 1a). It becomes.

  Next, the structure of the imaging mark 20 will be described with reference to FIGS. The imaging mark 20 has the same size as the first hole 21 formed in the upper part of the transport rail 2a with the depth h1 and the first hole 21 formed below the first hole 21 at the center C. Is a stepped hole composed of a small second hole 22. When calculating the inclination θy, an upper peripheral edge m1 of the first hole 21 (hereinafter referred to as “upper mark m1”) and an upper peripheral edge m2 of the second hole 22 (hereinafter referred to as “upper mark m1”) from the image captured by the substrate recognition camera 11. (Referred to as “lower mark m2”). That is, the upper mark m1 and the lower mark m2 are the imaging target T by the board recognition camera 11.

  As described above, the reference unit 13 includes the imaging target T having the same center position and different sizes, and the imaging target T is the first hole 21 formed below the first hole 21 and the first hole 21. It is the perimeter of a stepped hole consisting of a smaller second hole 22. In addition, the imaging mark 20 in the reference | standard part 13 is not limited to the structure directly formed in the upper part of the conveyance rail 2a, You may make it arrange | position the imaging mark 20 in which the stepped hole was formed on the upper surface of the conveyance rail 2a. Moreover, you may arrange | position the imaging mark 20 in positions other than the conveyance rail 2a.

  The inclination θy is calculated from a shift amount Δy between the center C1 of the upper mark m1 and the center C2 of the lower mark m2 recognized in the image captured by the board recognition camera 11 (see FIG. 5B). Therefore, a captured image in which both the upper mark m1 and the lower mark m2 are simultaneously focused is necessary, and both the upper mark m1 and the lower mark m2 are within the depth of field R of the substrate recognition camera 11 at the time of imaging. There is a need. That is, the imaging target T (upper mark m1, lower mark m2) is within the depth of field R of the substrate recognition camera 11 (camera).

  On the other hand, when the inclination θy is the same, as the depth h1 of the first hole 21, which is the difference in height between the upper mark m1 and the lower mark m2, increases, the shift amount Δy in the captured image increases, and the measurement accuracy of the inclination θy is increased. Will improve. Therefore, the depth h1 of the first hole 21 is as large as possible within a range in which both the upper mark m1 and the lower mark m2 are within the depth of field R of the substrate recognition camera 11 even when the optical axis 11a is inclined. Is set.

  Next, with reference to FIGS. 4 and 5, the imaging of the imaging target T provided in the reference unit 13 by the substrate recognition camera 11 will be described. When imaging the reference unit 13, the reference is such that the optical axis 11 a of the substrate recognition camera 11 provided on the mounting head 8 penetrates the center C of the imaging target T in a state where the Y-axis beam 6 and the X-axis beam 7 are not thermally deformed. The mounting head 8 is moved to the position. That is, the board recognition camera 11 is provided on the mounting head 8 and is a camera that images the reference portion 13 provided on the base 1a side when the mounting head 8 is located at the reference position.

  5A, in the ideal state, when the mounting head 8 is positioned at the reference position, the imaging screen 11b in which the board recognition camera 11 images the imaging target T (upper mark m1, lower mark m2) of the reference unit 13. Indicates. In this state, the center C1 of the captured upper mark m1 and the center C2 of the lower mark m2 coincide with the center of the imaging screen 11b (a point where two one-dot chain lines cross each other).

  FIG. 4 shows the substrate recognition camera 11 when the mounting head 8 is positioned at the reference position in a state where the Y-axis beam 6 and the X-axis beam 7 are thermally deformed. At this time, the optical axis 11a of the substrate recognition camera 11 is inclined by the inclination θy from the Z direction to the Y direction, and the position P of the substrate recognition camera 11 is displaced from the center C of the imaging target T in the Y direction. In this state, the imaging target T is imaged by the substrate recognition camera 11 as a mapping transferred to the XYt plane (corresponding to the XY plane inclined by the inclination θy) orthogonal to the optical axis 11a.

  FIG. 5B shows an imaging screen 11b of the imaging target T captured by the board recognition camera 11 in the state of FIG. Due to the displacement of the substrate recognition camera 11 in the horizontal plane, the center C1 of the upper mark m1 is displaced by ΔX in the X direction and ΔY in the Y direction from the center of the imaging screen 11b. Further, due to the inclination θy of the substrate recognition camera 11 in the Y direction from the Z direction, the center C2 of the lower mark m2 is displaced in the Y direction from the center C1 of the upper mark m1 by a positional deviation amount Δy. Note that the arc between the upper mark m1 and the lower mark m2 is a part of the peripheral edge m1 * at the lower part of the first hole 21 seen by the inclination of the optical axis 11a.

  In FIG. 5B, the positional deviation amount Δy between the center C1 of the upper mark m1 and the center C2 of the lower mark m2 and the depth of the first hole 21 which is the difference in the height direction between the upper mark m1 and the lower mark m2. By performing a predetermined calculation based on h1, the inclination θy of the board recognition camera 11, that is, the inclination θy of the mounting head 8 is calculated. Further, by performing a predetermined calculation based on the calculated inclination θy and the positional deviation (ΔX, ΔY) of the center C1 of the upper mark m1 from the center of the imaging screen 11b, an ideal state of the mounting head 8 in the horizontal direction A positional deviation amount (ΔX *, ΔY *) from is calculated.

  Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. The control unit 30 is an overall control device of the component mounting apparatus 1, and the control unit 30 executes a processing program stored in the storage unit 31 to execute the substrate transport mechanism 2, the component supply unit 4, and the mounting head 8 of the component mounting apparatus 1. The head moving mechanism 9 and the display unit 33 are controlled. The display unit 33 is a liquid crystal display that displays various types of information including the imaging screens of the component recognition camera 10 and the board recognition camera 11.

  The storage unit 31 stores various data used for component mounting work such as mounting data 31a, inclination data 31b, positional deviation amount data 31c, and correction amount data 31d. The mounting data 31a is data such as the component type, mounting position, and mounting height 3a of the component D to be mounted, and is stored for each board type to be produced.

  The control unit 30 includes a recognition processing unit 32, a mounting control unit 30a, a calculation unit 30b, and a correction unit 30c as internal control functions. The recognition processing unit 32 performs recognition processing on the imaging results obtained by the component recognition camera 10 and the board recognition camera 11. In the component mounting operation, the mounting position correction is performed in consideration of the recognition results of the component, the board, the position reference post 12, and the reference portion 13. The mounting control unit 30a controls each part of the substrate transport mechanism 2, the component supply unit 4, the mounting head 8, and the head moving mechanism 9 to take out the component D from the component supply unit 4 and transfer and mount it on the substrate 3. Let the work run.

  The calculating unit 30b performs image processing on the image of the imaging target T of the reference unit 13 captured by the board recognition camera 11 (camera), thereby tilting the mounting head 8 positioned at the reference position from the Z direction with respect to the base 1a. θy is calculated. At this time, the calculation unit 30b determines the shift amount Δy of the center position values (center C1, center C2) of the imaging target T (upper mark m1, lower mark m2) obtained by image processing and the height difference ( The inclination θy is calculated based on the depth h1) of the first hole 21. The calculated inclination θy is stored in the storage unit 31 as inclination data 31b.

  The calculation unit 30b also calculates the position of the mounting head 8 positioned at the reference position based on the inclination θy and the amount of positional deviation (ΔX, ΔY) from the center of the imaging screen 11b of the center C1 of the upper mark m1 obtained by image processing. A horizontal displacement amount (ΔX *, ΔY *) with respect to the reference portion 13 is further calculated. The calculated positional deviation amount (ΔX *, ΔY *) of the mounting position 14 * in the horizontal direction is stored in the storage unit 31 as positional deviation amount data 31c.

  The correction unit 30c corrects the positional deviation amount (ΔX *, ΔY *) based on the calculated inclination θy, the height position 13a of the imaging target T (see FIG. 2), and the mounting height 3a of the component D. The correction amount Δy * is calculated. The correction amount Δy * is for correcting a positional deviation caused by the inclination θy when the mounting height 3a of the component D is different from the height position 13a of the imaging target T. The calculated correction amount Δy * is stored in the storage unit 31 as correction amount data 31d. During the component mounting operation, the mounting control unit 30a performs mounting position correction in consideration of the stored positional deviation amount data 31c and correction amount data 31d. That is, the correction unit 30c corrects the position of the mounting head 8 based on the inclination θy calculated by the calculation unit 30b.

  It should be noted that the amount of horizontal displacement (ΔX *, ΔY *) taken into account when correcting the mounting position is the amount of displacement (ΔX *, ΔY *) obtained based on the recognition result of the position reference post 12. Alternatively, the positional deviation amounts (ΔX *, ΔY *) calculated by the calculation unit 30b based on the recognition result of the reference unit 13 may be used. Alternatively, the imaging mark 20 may be disposed on the upper surface of the position reference post 12 so that the position reference post 12 is also used as the reference unit 13 for calculating the inclination θy. By using it also, the number of recognition points can be reduced and the imaging time can be reduced, so that productivity is improved. In the component mounting method described below, an example will be described in which the mounting position correction is performed by taking into account the horizontal displacement amount (ΔX *, ΔY *) calculated based on the recognition result of the reference unit 13.

  Next, a component mounting method for mounting the component D on the substrate 3 by the component mounting apparatus 1 will be described in accordance with the flow of FIG. First, the mounting control unit 30a controls the head moving mechanism 9 to move the mounting head 8 to the reference position, and causes the substrate recognition camera 11 to image the reference unit 13 (ST1: reference unit imaging step). Next, the recognition processing unit 32 performs recognition processing on the imaging target T of the captured reference unit 13. Next, the calculation unit 30b calculates the inclination θy of the mounting head 8 from the Z direction by performing image processing on the recognized image (ST2: inclination calculation step).

  That is, in the tilt calculation step (ST2), the tilt θy of the mounting head 8 located at the reference position with respect to the base 1a is calculated by performing image processing on the image of the reference unit 13 captured by the board recognition camera 11 (camera). The In the inclination calculation step (ST2), the inclination θy is calculated based on the shift amount of the center position of the imaging target T (the center C1 of the upper mark m1 and the center C2 of the lower mark m2). The calculated inclination θy is stored in the storage unit 31 as inclination data 31b.

  Next, the calculation unit 30b calculates a horizontal displacement amount (ΔX *, ΔY *) with respect to the reference unit 13 of the mounting head 8 located at the reference position based on the inclination θy and the image of the imaging target T (ST3: Position deviation calculation step). The calculated misregistration amounts (ΔX *, ΔY *) are stored in the storage unit 31 as misregistration amount data 31c. Next, the correction unit 30c corrects the positional deviation amount (ΔX *, ΔY *) based on the calculated inclination θy, the height position 13a of the imaging target T, and the mounting height 3a of the component D. * Is calculated (ST4: correction amount calculation step). The calculated correction amount Δy * is stored in the storage unit 31 as correction amount data 31d.

  Next, the mounting control unit 30a causes the mounting head 8 to perform a component mounting operation for taking out the component D from the component supply unit 4 and transporting and mounting it on the substrate 3 (ST5: component mounting step). In the component mounting operation, the position correction of the mounting position 14 * is performed in consideration of the position shift amount (ΔX *, ΔY *) of the stored position shift amount data 31c, the correction amount Δy * of the correction amount data 31d, and the like. That is, the positional deviation calculation step (ST3), the correction amount calculation step (ST4), and the component mounting step (ST5) are steps for correcting the position of the mounting head 8 based on the calculated inclination θy.

  Next, the mounting control unit 30a determines whether a predetermined component mounting operation is completed (ST6). When the predetermined component mounting operation has not been completed (No in ST6), the mounting control unit 30a repeatedly executes the component mounting process (ST5). When the predetermined component mounting operation is completed (Yes in ST6), the component mounting is performed. The already mounted substrate is carried out, and then the substrate 3 on which components are mounted is carried in.

  ST1 to ST6 are repeatedly executed until the production of a predetermined number of mounting boards is completed, but each time a new mounting board is mounted, the reference portion imaging step (ST1), the tilt calculation step (ST2), and the position It is not necessary to execute the deviation calculation step (ST3) and the correction amount calculation step (ST4). That is, ST1 to ST4 may be executed at a predetermined frequency in consideration of temporal variation (temporal variation) of thermal deformation of the Y-axis beam 6 and the X-axis beam 7.

  Although the example in which the mounting head 8 is tilted only in the Y direction has been described above, the mounting head 8 may also tilt in the X direction. In this case, the inclination θx and the displacement amount ΔX * in the X direction of the mounting position 14 * are corrected based on the displacement amount in the X direction between the center C1 of the upper mark m1 and the center C2 of the lower mark m2 of the imaging target T. What is necessary is just to calculate the correction amount Δx * for this purpose.

  Next, another embodiment of the imaging target T will be described with reference to FIG. The imaging mark 40 has a configuration in which a first disc 41 having a thickness h2 is provided on the upper surface of a second disc 42 that is larger than the disc 41 with the same center C. In the imaging mark 40, the periphery of the upper surface of the first disc 41 is the upper mark m3, the periphery of the upper surface of the second disc 42 is the lower mark m4, and the upper mark m3 and the lower mark m4 are captured by the substrate recognition camera 11. Target T2. That is, the imaging target T2 includes an upper mark m3 and a lower mark m4 having the same center position and different sizes. The thickness h2 of the first disc is set so that both the upper mark m3 and the lower mark m4 are within the depth of field R of the substrate recognition camera 11 even if the optical axis 11a is tilted.

  The imaging targets are not limited to the imaging target T shown in FIG. 3 and the imaging target T2 shown in FIG. 8, but include those having the same center position and different sizes. It suffices if it is within the depth of field R. For example, the imaging target may be a rectangle having a different size.

  As described above, the component mounting apparatus 1 according to the present embodiment is provided in the mounting head 8 and the reference unit 13 including the imaging target T having the same center position and different sizes, and the mounting head 8 is positioned at the reference position. And a component recognition camera 11 (camera) that images the reference portion 13 provided on the base 1a side. In the component mounting apparatus 1, the mounting head positioned at the reference position based on the shift amount of the center position of the imaging target T obtained by performing image processing on the image of the reference unit 13 captured by the board recognition camera 11. The inclination θy of the eight bases 1a is calculated, and the position of the mounting head 8 is corrected based on the calculated inclination θy. Thereby, the shift of the mounting position can be corrected in consideration of the inclination θy of the mounting head 8.

  The component mounting apparatus and the component mounting method of the present invention have the effect of being able to correct the displacement of the mounting position in consideration of the inclination of the mounting head caused by the change over time, and the component mounting field for mounting components on a substrate Useful in.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 1a Base 3 Board | substrate 4 Component supply part 8 Mounting head 9 Head moving mechanism 11 Board | substrate recognition camera (camera)
13 Reference part 20 Imaging mark (stepped hole)
21 First hole 22 Second hole D Component T Image object R Depth of field ΔY * Y-direction positional shift amount θy Inclination

Claims (8)

A mounting head provided so as to be horizontally movable relative to the base, picking up components from a component supply unit provided on the base side and mounting them on a substrate;
A head moving mechanism for moving the mounting head;
A camera that is provided in the mounting head, and that images a reference portion provided on the base side when the mounting head is located at a reference position;
A calculation unit that calculates an inclination of the mounting head located at the reference position with respect to the base by performing image processing on the image of the reference unit captured by the camera;
A correction unit that corrects the position of the mounting head based on the inclination calculated by the calculation unit;
The reference unit includes imaging targets having the same center position and different sizes,
The component mounting apparatus, wherein the calculation unit calculates the inclination based on a deviation amount of a center position of the imaging target.   2. The stepped hole comprising the first hole and a second hole smaller than the first hole formed below the first hole. Component mounting equipment.   The component mounting apparatus according to claim 1, wherein the imaging target is within a depth of field of the camera.   The component mounting apparatus according to claim 1, wherein the calculation unit further calculates a horizontal displacement amount of the mounting head positioned at the reference position with respect to the reference unit. A mounting head that is provided so as to be horizontally movable relative to the base, picks up a component from a component supply unit provided on the base side, and mounts it on a substrate; and a head moving mechanism that moves the mounting head A component mounting method for mounting a component on a board by a component mounting apparatus provided,
The component mounting apparatus includes:
A reference portion including imaging objects having the same center position and different sizes;
A camera that images the reference portion provided on the base when the mounting head is located at a reference position.
An inclination calculation step of calculating an inclination of the mounting head located at the reference position with respect to the base by performing image processing on the image of the reference portion captured by the camera;
Correcting the position of the mounting head based on the calculated inclination,
In the component mounting method, the tilt calculation step calculates the tilt based on a shift amount of a center position of the imaging target.   The said imaging object is a stepped hole comprising a first hole and a second hole smaller than the first hole formed below the first hole. Component mounting method.   The component mounting method according to claim 5, wherein the imaging target is within a depth of field of the camera in a state where the mounting head is inclined with respect to the base.   The component mounting method according to claim 5, further comprising a positional shift calculation step of calculating a horizontal positional shift amount with respect to the reference portion of the mounting head positioned at the reference position.

Images