JP2016207759A - Semiconductor device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transistor having good electric characteristics, and to provide a fine transistor.SOLUTION: A semiconductor device comprises: a first insulator on a substrate; a second insulator on the first insulator; a semiconductor on the second insulator; a third insulator on the semiconductor; a fourth insulator on the third insulator; a conductor on the fourth insulator; and a fifth insulator on the first insulator and the semiconductor. The semiconductor has a first region, a second region, and a third region. The first region has a region overlapped with the conductor via the third insulator and the fourth insulator. The second region has a region contacted with the fifth insulator. The third region has a region contacted with the fifth insulator. The fourth insulator has a region contacted with a bottom face of the conductor, and a region contacted with a lateral face of the conductor. The fifth insulator has at least one element of nitrogen and hydrogen.SELECTED DRAWING: Figure 1

Description

The present invention relates to, for example, a transistor and a semiconductor device, and a manufacturing method thereof. Alternatively, the present invention relates to, for example, a display device, a light-emitting device, a lighting device, a power storage device, a storage device, an imaging device, a processor, and an electronic device. Alternatively, the present invention relates to a method for manufacturing a display device, a liquid crystal display device, a light-emitting device, a memory device, an imaging device, or an electronic device. Alternatively, the present invention relates to a driving method of a semiconductor device, a display device, a liquid crystal display device, a light-emitting device, a memory device, or an electronic device.

Note that one embodiment of the present invention is not limited to the above technical field. The technical field of one embodiment of the invention disclosed in this specification and the like relates to an object, a method, or a manufacturing method. Alternatively, one embodiment of the present invention relates to a process, a machine, a manufacture, or a composition (composition of matter).

Note that in this specification and the like, a semiconductor device refers to any device that can function by utilizing semiconductor characteristics. A display device, a light-emitting device, a lighting device, an electro-optical device, a semiconductor circuit, and an electronic device may include a semiconductor device.

In recent years, transistors using an oxide semiconductor have attracted attention. A transistor using an oxide semiconductor is known to have extremely small leakage current in a non-conduction state. For example, a low power consumption CPU using a characteristic that a transistor including an oxide semiconductor has low leakage current is disclosed (see Patent Document 1).

In addition, a method in which a transistor using an oxide film semiconductor is formed by embedding a gate electrode in an opening is disclosed (see Patent Document 2 and Patent Document 3).

JP 2012-257187 A JP 2014-241407 A JP 2014-240833 A

An object is to provide a fine transistor. Another object is to provide a transistor with low parasitic capacitance. Another object is to provide a transistor with high frequency characteristics. Another object is to provide a transistor with favorable electrical characteristics. Another object is to provide a transistor with stable electrical characteristics. Another object is to provide a transistor with a low off-state current. Another object is to provide a novel transistor. Another object is to provide a semiconductor device including the transistor. Another object is to provide a semiconductor device with high operating speed. Another object is to provide a novel semiconductor device. Another object is to provide a module including the semiconductor device. Another object is to provide an electronic device including the semiconductor device or the module.

Note that the description of these problems does not disturb the existence of other problems. Note that one embodiment of the present invention does not have to solve all of these problems. Issues other than these will be apparent from the description of the specification, drawings, claims, etc., and other issues can be extracted from the descriptions of the specification, drawings, claims, etc. It is.

One embodiment of the present invention includes a first insulator over a substrate, a second insulator over the first insulator, a semiconductor over the second insulator, and a third insulator over the semiconductor. , A fourth insulator on the third insulator, a conductor on the fourth insulator, and a fifth insulator on the first insulator and on the semiconductor, A first region; a second region; and a third region. The first region includes a region overlapping with the conductor through the third insulator and the fourth insulator. The second region has a region in contact with the fifth insulator, the third region has a region in contact with the fifth insulator, and the fourth insulator has a bottom surface of the conductor. The fifth insulator is a semiconductor device having at least one element of nitrogen or hydrogen. The fifth insulator has a region in contact with the region and a region in contact with a side surface of the conductor.

One embodiment of the present invention includes a first insulator over a substrate, a second insulator over the first insulator, a semiconductor over the second insulator, and a third insulator over the semiconductor. , A fourth insulator on the third insulator, a conductor on the fourth insulator, and a fifth insulator on the first insulator and on the semiconductor, A first region; a second region; and a third region. The first region includes a region overlapping with the conductor through the third insulator and the fourth insulator. The second region has a region overlapping with the fifth insulator via the third insulator, and the third region is a region overlapping with the fifth insulator via the third insulator. The fourth insulator has a region in contact with the bottom surface of the conductor and a region in contact with the side surface of the conductor, and the fifth insulator has at least one element of nitrogen or hydrogen. It is a semiconductor device

One embodiment of the present invention is a semiconductor device in which the fifth insulator includes a region whose nitrogen concentration is greater than or equal to 40 atomic% and less than or equal to 60 atomic%.

One embodiment of the present invention is a semiconductor device in which the fifth insulator includes a region whose hydrogen concentration is greater than or equal to 1 atomic% and less than or equal to 30 atomic%.

One embodiment of the present invention is a semiconductor device in which the second insulator and the third insulator include at least one element other than oxygen included in the semiconductor.

In one embodiment of the present invention, a first insulator is formed over a substrate, a second insulator is formed over the first insulator, a semiconductor is formed over the second insulator, A second insulator and a part of the semiconductor are etched to form a multilayer film having the second insulator and the semiconductor, and a third insulator having at least one element of nitrogen or hydrogen is formed on the multilayer film Forming an opening exposing a part of the semiconductor in the third insulator, forming a fourth insulator on the third insulator and the semiconductor, and forming the fourth insulator on the fourth insulator; This is a method for manufacturing a semiconductor device in which a fifth insulator is formed and a conductor is formed over the fifth insulator.

One embodiment of the present invention is a method for manufacturing a semiconductor device, in which the third insulator includes a region whose nitrogen concentration is greater than or equal to 40 atomic% and less than or equal to 60 atomic%.

One embodiment of the present invention is a method for manufacturing a semiconductor device, in which the third insulator includes a region whose hydrogen concentration is greater than or equal to 1 atomic% and less than or equal to 30 atomic%.

In one embodiment of the present invention, a first insulator is formed over a substrate, a second insulator is formed over the first insulator, a semiconductor is formed over the second insulator, A part of the second insulator and the semiconductor is etched to form a multilayer film including the second insulator and the semiconductor, a third insulator is formed over the multilayer film, and the third insulator is formed. Forming an opening exposing a part of the semiconductor; forming a fourth insulator over the third insulator and the semiconductor; forming a fifth insulator over the fourth insulator; 5 is formed, and the conductor, the fifth insulator, and the fourth insulator are etched to expose a part of the third insulator, and the third insulator is etched. In this method, a part of the multilayer film is exposed and a sixth insulator containing at least one element of nitrogen or hydrogen is formed on the multilayer film.

One embodiment of the present invention is a method for manufacturing a semiconductor device, in which the sixth insulator includes a region whose nitrogen concentration is greater than or equal to 40 atomic% and less than or equal to 60 atomic%.

One embodiment of the present invention is a method for manufacturing a semiconductor device, in which the sixth insulator includes a region whose hydrogen concentration is greater than or equal to 1 atomic% and less than or equal to 30 atomic%.

One embodiment of the present invention is a method for manufacturing a semiconductor device in which the second insulator and the fourth insulator include at least one element other than oxygen included in the semiconductor.

One embodiment of the present invention is a method for manufacturing a semiconductor device, in which the fourth insulator is formed using a collimated sputtering method or a long throw sputtering method.

In one embodiment of the present invention, a first insulator is formed over a substrate, a second insulator is formed over the first insulator, a semiconductor is formed over the second insulator, A part of the second insulator and the semiconductor is etched to form a multilayer film including the second insulator and the semiconductor, a third insulator is formed over the multilayer film, and the third insulator is formed on the third insulator. A fourth insulator is formed, an opening exposing a part of the third insulator is formed in the fourth insulator, and a fifth insulator is formed on the third insulator. Then, a conductor is formed on the fifth insulator, the conductor and the fifth insulator are etched to expose a part of the fourth insulator, and the fourth insulator is etched to form the second insulator. 3 is a method for manufacturing a semiconductor device in which a part of the third insulator is exposed and a sixth insulator containing at least one element of nitrogen or hydrogen is formed on the third insulator.

One embodiment of the present invention is a method for manufacturing a semiconductor device, in which the sixth insulator includes a region whose nitrogen concentration is greater than or equal to 40 atomic% and less than or equal to 60 atomic%.

One embodiment of the present invention is a method for manufacturing a semiconductor device, in which the sixth insulator includes a region whose hydrogen concentration is greater than or equal to 1 atomic% and less than or equal to 30 atomic%.

One embodiment of the present invention is a method for manufacturing a semiconductor device in which the second insulator and the third insulator include at least one element other than oxygen included in the semiconductor.

One embodiment of the present invention is a method for manufacturing a semiconductor device, in which the third insulator is formed using a collimated sputtering method or a long throw sputtering method.

A fine transistor can be provided. Alternatively, a transistor with low parasitic capacitance can be provided. Alternatively, a transistor with high frequency characteristics can be provided. Alternatively, a transistor with favorable electrical characteristics can be provided. Alternatively, a transistor with stable electric characteristics can be provided. Alternatively, a transistor with low off-state current can be provided. Alternatively, a novel transistor can be provided. Alternatively, a semiconductor device including the transistor can be provided. Alternatively, a semiconductor device with high operating speed can be provided. Alternatively, a novel semiconductor device can be provided. Alternatively, a module including the semiconductor device can be provided. Alternatively, an electronic device including the semiconductor device or the module can be provided.

Note that the description of these effects does not disturb the existence of other effects. Note that one embodiment of the present invention need not have all of these effects. It should be noted that the effects other than these are naturally obvious from the description of the specification, drawings, claims, etc., and it is possible to extract the other effects from the descriptions of the specification, drawings, claims, etc. It is.

4A and 4B are a top view and cross-sectional views illustrating a transistor according to one embodiment of the present invention. 4A and 4B are a top view and cross-sectional views illustrating a transistor according to one embodiment of the present invention. FIG. 6 is a cross-sectional view illustrating part of a transistor according to one embodiment of the present invention. FIG. 6 is a cross-sectional view illustrating part of a transistor according to one embodiment of the present invention. FIG. 6 is a cross-sectional view illustrating part of a transistor according to one embodiment of the present invention. FIG. 6 is a cross-sectional view illustrating part of a transistor according to one embodiment of the present invention. 6A and 6B illustrate a band structure according to one embodiment of the present invention. FIGS. 4A to 4C illustrate structural analysis by XRD of a CAAC-OS and a single crystal oxide semiconductor, and a diagram illustrating a limited-field electron diffraction pattern of the CAAC-OS. FIGS. Sectional TEM image of CAAC-OS, planar TEM image and image analysis image thereof. The figure which shows the electron diffraction pattern of nc-OS, and the cross-sectional TEM image of nc-OS. Cross-sectional TEM image of a-like OS. FIG. 6 shows changes in crystal parts of an In—Ga—Zn oxide due to electron irradiation. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A and 4B are a top view and cross-sectional views illustrating a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A and 4B are a top view and cross-sectional views illustrating a transistor according to one embodiment of the present invention. 4A and 4B are a top view and cross-sectional views illustrating a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. 4A to 4C are a top view and cross-sectional views illustrating a method for manufacturing a transistor according to one embodiment of the present invention. FIG. 10 is a circuit diagram of a memory device according to one embodiment of the present invention. FIG. 6 is a cross-sectional view illustrating a semiconductor device according to one embodiment of the present invention. FIG. 6 is a cross-sectional view illustrating a semiconductor device according to one embodiment of the present invention. 6A and 6B are a circuit diagram and a cross-sectional view illustrating a semiconductor device according to one embodiment of the present invention. FIG. 10 is a block diagram illustrating a CPU according to one embodiment of the present invention. FIG. 10 is a circuit diagram of a memory element according to one embodiment of the present invention. The top view which shows an imaging device. The top view which shows the pixel of an imaging device. Sectional drawing which shows an imaging device. Sectional drawing which shows an imaging device. FIG. 6 illustrates a configuration example of an RF tag. FIG. 4 is a circuit diagram, a top view, and a cross-sectional view showing a semiconductor device according to the present invention. 6A and 6B are a circuit diagram and a cross-sectional view illustrating a semiconductor device according to the present invention. The figure explaining a display module. The perspective view showing the cross-section of the package using a lead frame type interposer. FIG. 14 illustrates an electronic device according to one embodiment of the present invention. FIG. 14 illustrates an electronic device according to one embodiment of the present invention. FIG. 14 illustrates an electronic device according to one embodiment of the present invention. The usage example of RF tag based on this invention.

Embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it will be easily understood by those skilled in the art that modes and details can be variously changed. In addition, the present invention is not construed as being limited to the description of the embodiments below. Note that in describing the structure of the present invention with reference to drawings, the same portions are denoted by the same reference numerals in different drawings. In addition, when referring to the same thing, a hatch pattern is made the same and there is a case where it does not attach a code in particular.

Note that the size, the thickness of films (layers), or regions in drawings is sometimes exaggerated for simplicity.

In this specification, for example, when the shape of an object is defined by “diameter”, “particle diameter”, “size”, “size”, “width”, etc., the length of one side in the smallest cube in which the object fits Alternatively, it may be read as the equivalent circle diameter in one cross section of the object. The equivalent circle diameter in one cross section of an object refers to the diameter of a perfect circle having an area equal to that of one cross section of the object.

Note that the voltage often indicates a potential difference between a certain potential and a reference potential (for example, a ground potential (GND) or a source potential). Thus, a voltage can be rephrased as a potential.

The ordinal numbers attached as the first and second are used for convenience and do not indicate the order of steps or the order of lamination. Therefore, for example, the description can be made by appropriately replacing “first” with “second” or “third”. In addition, the ordinal numbers described in this specification and the like may not match the ordinal numbers used to specify one embodiment of the present invention.

Note that the impurity of the semiconductor means, for example, a component other than the main component constituting the semiconductor. For example, an element having a concentration of less than 0.1 atomic% is an impurity. By including impurities, for example, semiconductor DOS (Density of State) may be formed, carrier mobility may be reduced, and crystallinity may be reduced. When the semiconductor is an oxide semiconductor, examples of impurities that change the characteristics of the semiconductor include Group 1 elements, Group 2 elements, Group 14 elements, Group 15 elements, and transition metals other than the main component. In particular, for example, hydrogen (also included in water), lithium, sodium, silicon, boron, phosphorus, carbon, nitrogen and the like. In the case of an oxide semiconductor, oxygen vacancies may be formed by mixing impurities such as hydrogen, for example. In the case where the semiconductor is a silicon film, examples of impurities that change the characteristics of the semiconductor include group 1 elements, group 2 elements, group 13 elements, and group 15 elements excluding oxygen and hydrogen.

Note that in this specification, when it is described that A has a region having a concentration B, for example, when the concentration in the entire depth direction in a region with A is B, the concentration in the depth direction in a region with A When the average value of B is B, when the median value of the concentration in the depth direction in the region of A is B, when the maximum value of the concentration in the depth direction of the region of A is B, there is A When the minimum value of the density in the depth direction in the region is B, and when the convergence value of the density in the depth direction in the region of A is B, the concentration in the region where a probable value of A itself is obtained in the measurement. Including the case of B.

Further, in this specification, when A is described as having a region having a size B, a length B, a thickness B, a width B, or a distance B, for example, the entire size and length in a region with A When the thickness, width, or distance is B, the average value of the size, length, thickness, width, or distance in a region of A is B, and the size, length in the region of A is When the median value of thickness, thickness, width, or distance is B, when the maximum value of size, length, thickness, width, or distance in a region of A is B, in the region of A Measured when the minimum value of size, length, thickness, width, or distance is B, and when the converged value of size, length, thickness, width, or distance in a region of A is B The size, length, thickness, width, or distance in a region where a probable value of A above is obtained is B Case, and the like.

Note that the channel length refers to, for example, a region where a semiconductor (or a portion where current flows in the semiconductor when the transistor is on) and a gate electrode overlap with each other in a top view of the transistor, or a region where a channel is formed The distance between the source (source region or source electrode) and the drain (drain region or drain electrode) in FIG. Note that in one transistor, the channel length is not necessarily the same in all regions. That is, the channel length of one transistor may not be fixed to one value. Therefore, in this specification, the channel length is any one of values, the maximum value, the minimum value, or the average value in a region where a channel is formed.

The channel width is, for example, a region in which a semiconductor (or a portion in which a current flows in the semiconductor when the transistor is on) and a gate electrode overlap each other, or a source and a drain in a region where a channel is formed. This is the length of the part. Note that in one transistor, the channel width is not necessarily the same in all regions. That is, the channel width of one transistor may not be fixed to one value. Therefore, in this specification, the channel width is any one of values, the maximum value, the minimum value, or the average value in a region where a channel is formed.

Note that depending on the structure of the transistor, the channel width in a region where a channel is actually formed (hereinafter referred to as an effective channel width) and the channel width shown in a top view of the transistor (hereinafter, apparent channel width). May be different). For example, in a transistor having a three-dimensional structure, the effective channel width is larger than the apparent channel width shown in the top view of the transistor, and the influence may not be negligible. For example, in a transistor having a fine and three-dimensional structure, the ratio of the channel region formed on the side surface of the semiconductor may be larger than the ratio of the channel region formed on the upper surface of the semiconductor. In that case, the effective channel width in which the channel is actually formed is larger than the apparent channel width shown in the top view.

By the way, in a transistor having a three-dimensional structure, it may be difficult to estimate an effective channel width by actual measurement. For example, in order to estimate the effective channel width from the design value, it is necessary to assume that the shape of the semiconductor is known. Therefore, it is difficult to accurately measure the effective channel width when the shape of the semiconductor is not accurately known.

Therefore, in this specification, in the top view of a transistor, an apparent channel width which is a length of a portion where a source and a drain face each other in a region where a semiconductor and a gate electrode overlap with each other is expressed as “enclosed channel width ( SCW: Surrounded Channel Width). In this specification, in the case where the term “channel width” is simply used, it may denote an enclosed channel width or an apparent channel width. Alternatively, in this specification, in the case where the term “channel width” is simply used, it may denote an effective channel width. Note that the channel length, channel width, effective channel width, apparent channel width, enclosed channel width, and the like can be determined by obtaining a cross-sectional TEM image and analyzing the image. it can.

Note that in the case where the field-effect mobility of a transistor, the current value per channel width, and the like are calculated and calculated, the calculation may be performed using the enclosed channel width. In that case, the value may be different from that calculated using the effective channel width.

In this specification, when it is described that A has a shape protruding from B, it is assumed that at least one end of A has a shape outside of at least one end of B in a top view or a cross-sectional view. May show. Therefore, when it is described that A has a shape protruding from B, for example, in a top view, it can be read that one end of A has a shape outside of one end of B.

In this specification, “parallel” refers to a state in which two straight lines are arranged at an angle of −10 ° to 10 °. Therefore, the case of −5 ° to 5 ° is also included. Further, “substantially parallel” means a state in which two straight lines are arranged at an angle of −30 ° to 30 °. “Vertical” refers to a state in which two straight lines are arranged at an angle of 80 ° to 100 °. Therefore, the case of 85 ° to 95 ° is also included. Further, “substantially vertical” means a state in which two straight lines are arranged at an angle of 60 ° to 120 °.

In this specification, when a crystal is trigonal or rhombohedral, it is represented as a hexagonal system.

Note that in the specification, the term “semiconductor” can be read as “oxide semiconductor”. Semiconductors include group 14 semiconductors such as silicon and germanium, compound semiconductors such as silicon carbide, germanium silicide, gallium arsenide, indium phosphide, zinc selenide, cadmium sulfide, and oxide semiconductors, carbon nanotubes, graphene, and organic A semiconductor or the like can be used.

Note that in this specification and the like, a silicon oxynitride film refers to a film having a higher oxygen content than nitrogen in the composition, and a silicon nitride oxide film has a nitrogen content as compared to oxygen in the composition Refers to membranes with a lot of

Further, in this specification and the like, when at least one specific example is described in a diagram or text described in one embodiment, it is easy for those skilled in the art to derive a superordinate concept of the specific example. To be understood. Therefore, in the case where at least one specific example is described in a drawing or text described in one embodiment, the superordinate concept of the specific example is also disclosed as one aspect of the invention. Aspects can be configured. One embodiment of the invention is clear.

Further, in this specification and the like, at least the contents described in the drawings (may be part of the drawings) are disclosed as one embodiment of the invention and can constitute one embodiment of the invention. It is. Therefore, if a certain content is described in the figure, even if it is not described using sentences, the content is disclosed as one aspect of the invention and may constitute one aspect of the invention. Is possible. Similarly, a drawing obtained by extracting a part of the drawing is also disclosed as one embodiment of the invention, and can constitute one embodiment of the invention. And it can be said that one aspect of the invention is clear.

In addition, it is possible to constitute one aspect of the invention that stipulates that contents not specified in the text and drawings in this specification are excluded. Or, when a numerical value range indicated by an upper limit value and a lower limit value is described for a certain value, the range is unified by arbitrarily narrowing the range or by removing one point in the range. One aspect of the invention excluding a part can be defined. Thus, for example, it can be defined that the prior art does not fall within the technical scope of one embodiment of the present invention.

(Embodiment 1)
<Transistor structure 1>
The structure of the transistor included in the semiconductor device according to one embodiment of the present invention is described below.

1A, 1B, and 1C are a top view and cross-sectional views of a semiconductor device according to one embodiment of the present invention. FIG. 1A is a top view. 1B is a cross-sectional view corresponding to the alternate long and short dash line A1-A2 illustrated in FIG. 1A and illustrates a cross-sectional shape in the channel length direction. FIG. 1C is a cross-sectional view corresponding to the dashed-dotted line A3-A4 illustrated in FIG. 1A and illustrates a cross-sectional shape in the channel width direction. Note that in the top view of FIG. 1A, some elements are omitted for clarity.

1 includes the conductor 413 over the substrate 400, the insulator 401 over the substrate 400, the insulator 402 over the conductor 413, the insulator 406a over the insulator 402, and the insulator 406a. The semiconductor 406b, the insulator 411 over the semiconductor 406b, the insulator 406c in contact with the top and side surfaces of the semiconductor 406b, the insulator 412 over the insulator 406c, and the semiconductor 406b through the insulator 412 and the insulator 406c A conductor 404 to be disposed; an insulator 421 on the insulator 411; an opening that reaches the semiconductor 406b through the insulator 411 and the insulator 421; and a conductor that is embedded in the opening and has a region in contact with the semiconductor 406b. A conductor 416a1 and a conductor 416a2, and a conductor 416a3 having a region embedded in the opening and in contact with the conductor 404 Having a conductor 418a1 on conductors 416A1, a conductor 418a2 on conductors 416A2, a conductor 418a3 on conductors 416A3, a.

The insulator 411 includes at least one element of nitrogen or hydrogen. Accordingly, the resistance value of the region in contact with the insulator 411 in the semiconductor 406b can be reduced. By forming the insulator 411 over the semiconductor 406b, the resistance value of the region in contact with the insulator 411 of the semiconductor 406b can be reduced. In that case, the deposition temperature of the insulator 411 is preferably 100 ° C to 600 ° C. Further, the resistance value of the semiconductor 406b does not have to be reduced when the insulator 411 is formed. In that case, by performing heat treatment after the insulator 411 is formed, the resistance value of a region in contact with the insulator 411 of the semiconductor 406b can be reduced. The heat treatment is preferably performed at 100 ° C. or higher and 600 ° C. or lower. In this manner, part of the semiconductor 406b can be selectively used as a low resistance region. In this embodiment mode, the low resistance region can function as a source region and a drain region.

The insulator 411 preferably includes a region where the nitrogen concentration is greater than or equal to 40 atomic% and less than or equal to 60 atomic%.

The insulator 411 preferably includes a region where the hydrogen concentration is greater than or equal to 1 atomic% and less than or equal to 30 atomic%.

In addition, the range of the said composition is a thing when it measures using Rutherford backscattering method (RBS: Rutherford Backscattering Spectrometry), the hydrogen forward scattering method (HFS: Hydrogen Forward Scattering), etc.

The insulator 411 may have a stacked structure including a plurality of layers. For example, in the insulator 411, an insulator including at least one element of nitrogen or hydrogen is formed in a region in contact with a target whose resistance value is to be decreased (for example, the semiconductor 406b), and the other insulator is formed over the insulator. The insulator 411 may be formed by forming an insulator.

The insulator 406a and the insulator 406c preferably include at least one element other than oxygen included in the semiconductor 406b. Accordingly, generation of defects can be suppressed at the interfaces of the semiconductor 406b and the insulator 406a, and the semiconductor 406b and the insulator 406c.

The semiconductor 406b preferably includes an oxide semiconductor, and particularly preferably includes a CAAC-OS described later.

In the transistor described in this embodiment, a low-resistance region is preferably formed in the insulator 406a and the semiconductor 406b. The low resistance region is preferably formed in a region where the conductor 404, the insulator 412, and the insulator 406c do not overlap with each other in the insulator 406a and the semiconductor 406b. Further, a part of the region overlapping with the conductor 404, the insulator 412, and the insulator 406c may be a low resistance region. As described above, the low resistance region can function as a source region or a drain region of the transistor. In addition, since the low resistance region is formed in the semiconductor 406b, contact resistance between the conductors 416a1 and 416a2 and the semiconductor 406b can be reduced.

The low resistance region preferably has more oxygen vacancies than regions other than the low resistance region. As a result, the formation of donor levels increases the carrier density and lowers the resistance value.

The low resistance region may be a region having lower crystallinity than a region other than the low resistance region.

In this transistor, the conductor 404 functions as a first gate electrode. The conductor 404 can have a stacked structure including a conductor having a function of hardly transmitting oxygen. For example, a decrease in conductivity due to oxidation of the conductor 404 can be prevented by forming a conductor that does not easily transmit oxygen in the lower layer. The insulator 412 functions as a first gate insulator. Note that the conductivity of the conductor can be measured using a two-terminal method or the like.

In addition, the conductor 413 functions as a second gate electrode. The conductor 413 can have a stacked structure including a conductive film having a function of hardly transmitting oxygen. With a stacked structure including a conductive film having a function of hardly transmitting oxygen, reduction in conductivity due to oxidation of the conductor 413 can be prevented. The insulator 402 functions as a second gate insulator. The threshold voltage of the transistor can be controlled by the potential applied to the conductor 413. In addition, by electrically connecting the first gate electrode and the second gate electrode, a current (ON current) at the time of conduction can be increased. Note that the function of the first gate electrode and the function of the second gate electrode may be interchanged.

FIG. 2 shows an example in which the first gate electrode and the second gate electrode are electrically connected. As shown in FIG. 2C, an opening is provided in the insulator 402, the insulator 411, and the insulator 421, and a conductor is formed so as to fill the opening, whereby the conductor 413 and the conductor 404 are formed. Are electrically connected.

The conductors 416a1 and 416a2 are electrically connected to the semiconductor 406b and function as source wirings or drain wirings. In particular, the conductor 416a1 and the conductor 416a2 are preferably electrically connected to a source region and a drain region, which are low resistance regions in the semiconductor 406b. The conductors 416a1 and 416a2 can have a stacked structure including a conductor having a function of hardly transmitting oxygen. For example, by forming a conductor that does not easily transmit oxygen in the upper layer, a decrease in conductivity due to oxidation of the conductors 416a1 and 416a2 can be prevented.

As shown in FIG. 1B, the upper surface of the semiconductor 406b is in contact with the conductor 416a1 and the conductor 416a2. In addition, the semiconductor 406b can be electrically surrounded by an electric field of the conductor 404 functioning as a gate electrode. A structure of a transistor that electrically surrounds a semiconductor by an electric field of a gate electrode is called a surrounded channel (s-channel) structure. Therefore, a channel may be formed in the entire semiconductor 406b. In the s-channel structure, a large current can flow between the source and the drain of the transistor, and a current (on-state current) during conduction can be increased. In addition, since the semiconductor 406b is surrounded by the electric field of the conductor 404, current during off-state (off-state current) can be reduced.

Alternatively, a structure without the conductor 413 may be employed (see FIG. 3A). The insulator 406a and the insulator 406c may be omitted (see FIG. 3B).

The insulator 406a, the semiconductor 406b, and the insulator 406c may each have a stacked structure of two or more layers.

The conductor 416a1 and the conductor 416a2 may be in contact with and electrically connected to the side surface of the semiconductor 406b (see FIG. 4A).

Alternatively, the insulator 421 may be omitted (see FIG. 4B).

In the opening provided in the insulator 411, an insulator 406c may be formed in a region in contact with the bottom surface of the opening (see FIG. 5A). Accordingly, the distance between the low-resistance region formed in the semiconductor 406b and the conductor 404 is reduced, so that the on-state current of the transistor can be increased.

Further, the conductor 404 may have a shape as illustrated in FIG. Such a shape may be formed by, for example, a photolithography method. 6A, the insulator 412 and the insulator 406c may protrude from the conductor 404. Alternatively, as illustrated in FIG. 6B, a structure in which the insulator 412 protrudes from the conductor 404 and the insulator 406 c is not processed may be employed. Alternatively, as illustrated in FIG. 6C, the insulator 412 and the insulator 406c may not be processed.

As the substrate 400, for example, an insulator substrate, a semiconductor substrate, or a conductor substrate may be used. Examples of the insulator substrate include a glass substrate, a quartz substrate, a sapphire substrate, a stabilized zirconia substrate (such as a yttria stabilized zirconia substrate), and a resin substrate. Examples of the semiconductor substrate include a single semiconductor substrate such as silicon or germanium, or a compound semiconductor substrate made of silicon carbide, silicon germanium, gallium arsenide, indium phosphide, zinc oxide, or gallium oxide. Furthermore, there is a semiconductor substrate having an insulator region inside the semiconductor substrate, for example, an SOI (Silicon On Insulator) substrate. Examples of the conductor substrate include a graphite substrate, a metal substrate, an alloy substrate, and a conductive resin substrate. Alternatively, there are a substrate having a metal nitride, a substrate having a metal oxide, and the like. Further, there are a substrate in which a conductor or a semiconductor is provided on an insulator substrate, a substrate in which a conductor or an insulator is provided on a semiconductor substrate, a substrate in which a semiconductor or an insulator is provided on a conductor substrate, and the like. Alternatively, a substrate in which an element is provided may be used. Examples of the element provided on the substrate include a capacitor element, a resistor element, a switch element, a light emitting element, and a memory element.

Further, a flexible substrate may be used as the substrate 400. Note that as a method for providing a transistor over a flexible substrate, there is a method in which after a transistor is manufactured over a non-flexible substrate, the transistor is peeled off and transferred to the substrate 400 which is a flexible substrate. In that case, a separation layer is preferably provided between the non-flexible substrate and the transistor. Note that a sheet, a film, a foil, or the like in which fibers are knitted may be used as the substrate 400. Further, the substrate 400 may have elasticity. Further, the substrate 400 may have a property of returning to the original shape when bending or pulling is stopped. Or you may have a property which does not return to an original shape. The substrate 400 has a region having a thickness of, for example, 5 μm to 700 μm, preferably 10 μm to 500 μm, and more preferably 15 μm to 300 μm. When the substrate 400 is thinned, a semiconductor device including a transistor can be reduced in weight. Further, by making the substrate 400 thin, it may have elasticity even when glass or the like is used, or may have a property of returning to its original shape when bending or pulling is stopped. Therefore, an impact applied to the semiconductor device on the substrate 400 due to a drop or the like can be reduced. That is, a durable semiconductor device can be provided.

As the substrate 400 which is a flexible substrate, for example, a metal, an alloy, a resin, glass, or fiber thereof can be used. The substrate 400, which is a flexible substrate, is preferable because the deformation due to the environment is suppressed as the linear expansion coefficient is lower. For example, a material having a linear expansion coefficient of 1 × 10 ⁻³ / K or less, 5 × 10 ⁻⁵ / K or less, or 1 × 10 ⁻⁵ / K or less is used as the substrate 400 that is a flexible substrate. Good. Examples of the resin include polyester, polyolefin, polyamide (such as nylon and aramid), polyimide, polycarbonate, and acrylic. In particular, since aramid has a low coefficient of linear expansion, it is suitable as the substrate 400 that is a flexible substrate.

Note that by surrounding the transistor with an insulator having a function of blocking impurities such as hydrogen and oxygen, electrical characteristics of the transistor can be stabilized. For example, as the insulator 401, the insulator 402, the insulator 412, the insulator 411, or the insulator 421, an insulator having a function of blocking impurities such as hydrogen and oxygen may be used in a single layer or a stacked layer.

Examples of the insulator having a function of blocking impurities such as hydrogen and oxygen include boron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium, germanium, yttrium, zirconium, and lanthanum. An insulator containing neodymium, hafnium, or tantalum may be used as a single layer or a stacked layer.

For example, as an insulator having a function of blocking impurities such as hydrogen and oxygen, aluminum oxide, magnesium oxide, silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, oxide Neodymium, hafnium oxide, or tantalum oxide may be used.

As the insulator 402, for example, an insulator containing boron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium, germanium, yttrium, zirconium, lanthanum, neodymium, hafnium, or tantalum is used. Or a single layer or a stacked layer. For example, the insulator 402 preferably includes silicon oxide or silicon oxynitride.

The insulator 421 may be formed in a manner similar to that of the insulator 402.

The insulator 411 preferably includes silicon nitride, silicon nitride oxide, aluminum nitride, aluminum nitride oxide, or the like. Alternatively, an insulator that can be used for the insulator 402 or the like may be stacked.

As the insulator 412, for example, an insulator containing boron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium, germanium, yttrium, zirconium, lanthanum, neodymium, hafnium, or tantalum is used. Or a single layer or a stacked layer. For example, the insulator 412 preferably includes silicon oxide or silicon oxynitride.

Note that the insulator 412 preferably includes an insulator having a high relative dielectric constant. For example, the insulator 412 includes gallium oxide, hafnium oxide, an oxide including aluminum and hafnium, an oxynitride including aluminum and hafnium, an oxide including silicon and hafnium, or an oxynitride including silicon and hafnium. It is preferable. Alternatively, the insulator 412 preferably has a stacked structure of silicon oxide or silicon oxynitride and an insulator with a high relative dielectric constant. Since silicon oxide and silicon oxynitride are thermally stable, a stacked structure having high thermal stability and high relative dielectric constant can be obtained by combining with an insulator having high relative dielectric constant. For example, when aluminum oxide, gallium oxide, or hafnium oxide is provided on the insulator 406c side, entry of silicon contained in silicon oxide or silicon oxynitride into the semiconductor 406b can be suppressed. In addition, for example, when silicon oxide or silicon oxynitride is provided on the insulator 406c side, a trap center may be formed at the interface between aluminum oxide, gallium oxide, or hafnium oxide and silicon oxide or silicon oxynitride. is there. In some cases, the trap center can change the threshold voltage of the transistor in the positive direction by capturing electrons.

Examples of the conductor 416a1 and the conductor 416a2 include boron, nitrogen, oxygen, fluorine, silicon, phosphorus, aluminum, titanium, chromium, manganese, cobalt, nickel, copper, zinc, gallium, yttrium, zirconium, molybdenum, ruthenium, A conductor including one or more of platinum, silver, indium, tin, tantalum, and tungsten may be used as a single layer or a stacked layer. For example, an alloy film or a compound film may be used. A conductor containing aluminum, a conductor containing copper and titanium, a conductor containing copper and manganese, a conductor containing indium, tin and oxygen, or titanium and nitrogen A conductive material or the like may be used. The conductor 416a3, the conductor 418a1, the conductor 418a2, and the conductor 418a3 may be formed in a similar manner.

Examples of the conductor 404 and the conductor 413 include boron, nitrogen, oxygen, fluorine, silicon, phosphorus, aluminum, titanium, chromium, manganese, cobalt, nickel, copper, zinc, gallium, yttrium, zirconium, molybdenum, ruthenium, A conductor including one or more of silver, indium, tin, tantalum, and tungsten may be used in a single layer or a stacked layer. For example, an alloy film or a compound film may be used. A conductor containing aluminum, a conductor containing copper and titanium, a conductor containing copper and manganese, a conductor containing indium, tin and oxygen, or titanium and nitrogen A conductive material or the like may be used.

An oxide semiconductor is preferably used as the semiconductor 406b. However, silicon (including strained silicon), germanium, silicon germanium, silicon carbide, gallium arsenide, aluminum gallium arsenide, indium phosphide, gallium nitride, an organic semiconductor, or the like may be used.

As the insulator 406a and the insulator 406c, an oxide including one or more elements other than oxygen included in the semiconductor 406b or two or more elements is preferably used. However, silicon (including strained silicon), germanium, silicon germanium, silicon carbide, gallium arsenide, aluminum gallium arsenide, indium phosphide, gallium nitride, an organic semiconductor, or the like may be used.

The semiconductor 406b is an oxide semiconductor containing indium, for example. For example, when the semiconductor 406b contains indium, the carrier mobility (electron mobility) increases. The semiconductor 406b preferably contains an element M. The element M is preferably aluminum, gallium, yttrium, tin, or the like. Other elements applicable to the element M include boron, silicon, titanium, iron, nickel, germanium, yttrium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, magnesium, tungsten, and the like. However, the element M may be a combination of a plurality of the aforementioned elements. The element M is an element having a high binding energy with oxygen, for example. For example, it is an element whose binding energy with oxygen is higher than that of indium. Alternatively, the element M is an element having a function of increasing the energy gap of the oxide semiconductor, for example. The semiconductor 406b preferably contains zinc. An oxide semiconductor may be easily crystallized when it contains zinc.

Note that the semiconductor 406b is not limited to the oxide semiconductor containing indium. The semiconductor 406b may be an oxide semiconductor containing zinc, an oxide semiconductor containing gallium, an oxide semiconductor containing tin, or the like that does not contain indium, such as zinc tin oxide and gallium tin oxide.

For the semiconductor 406b, an oxide with a wide energy gap is used, for example. The energy gap of the semiconductor 406b is, for example, 2.5 eV to 4.2 eV, preferably 2.8 eV to 3.8 eV, and more preferably 3 eV to 3.5 eV.

As the semiconductor 406b, an oxide having an electron affinity higher than those of the insulators 406a and 406c is used. For example, the semiconductor 406b has an oxide affinity higher than that of the insulators 406a and 406c by 0.07 eV to 1.3 eV, preferably 0.1 eV to 0.7 eV, more preferably 0.15 eV to 0.4 eV. Use things. The electron affinity is an energy difference between the vacuum level and the lower end of the conduction band.

In this manner, in a transistor in which the insulator 406a and the insulator 406c are provided above and below the semiconductor 406b, when a gate voltage is applied, a channel is formed in the semiconductor 406b having a high electron affinity among the insulator 406a, the semiconductor 406b, and the insulator 406c. It is formed. Thus, a so-called buried channel structure can be formed.

Here, in some cases, there is a mixed region of the insulator 406a and the semiconductor 406b between the insulator 406a and the semiconductor 406b. Further, in some cases, there is a mixed region of the semiconductor 406b and the insulator 406c between the semiconductor 406b and the insulator 406c. The mixed region has a low density of defect states. Therefore, the stack of the insulator 406a, the semiconductor 406b, and the insulator 406c has a band diagram in which energy continuously changes (also referred to as a continuous junction) in the vicinity of each interface (see FIG. 7). Note that in some cases, the interfaces of the insulator 406a, the semiconductor 406b, and the insulator 406c cannot be clearly determined.

At this time, electrons move mainly in the semiconductor 406b, not in the insulator 406a and the insulator 406c.

The on-state current of the transistor can be increased as the factor that hinders the movement of electrons is reduced. Electron movement is inhibited, for example, even when the physical unevenness of the channel formation region is large.

In order to increase the on-state current of the transistor, for example, the root mean square (RMS) roughness of the upper surface or the lower surface of the semiconductor 406b (formation surface, here, the insulator 406a) in the range of 1 μm × 1 μm. Is less than 1 nm, preferably less than 0.6 nm, more preferably less than 0.5 nm, and even more preferably less than 0.4 nm. The average surface roughness (also referred to as Ra) in the range of 1 μm × 1 μm is less than 1 nm, preferably less than 0.6 nm, more preferably less than 0.5 nm, and more preferably less than 0.4 nm. The maximum height difference (also referred to as PV) in the range of 1 μm × 1 μm is less than 10 nm, preferably less than 9 nm, more preferably less than 8 nm, and more preferably less than 7 nm. The RMS roughness, Ra, and PV can be measured using a scanning probe microscope system SPA-500 manufactured by SII Nano Technology.

The above three-layer structure is an example. For example, a stacked structure including one or more of the insulators exemplified as the insulator 406a and the insulator 406c above or below the insulator 406a or above or below the insulator 406c may be employed.

<Structure of oxide semiconductor>
Hereinafter, the structure of the oxide semiconductor is described.

An oxide semiconductor is classified into a single crystal oxide semiconductor and a non-single-crystal oxide semiconductor. As the non-single-crystal oxide semiconductor, a CAAC-OS (c-axis-aligned crystal oxide semiconductor), a polycrystalline oxide semiconductor, an nc-OS (nanocrystalline oxide semiconductor), a pseudo-amorphous oxide semiconductor (a-like oxide semiconductor) : Amorphous-like oxide semiconductor) and amorphous oxide semiconductors.

From another point of view, oxide semiconductors are classified into amorphous oxide semiconductors and other crystalline oxide semiconductors. Examples of a crystalline oxide semiconductor include a single crystal oxide semiconductor, a CAAC-OS, a polycrystalline oxide semiconductor, and an nc-OS.

Amorphous structures are generally isotropic, have no heterogeneous structure, are metastable, have no fixed atomic arrangement, have a flexible bond angle, have short-range order, but long-range order It is said that it does not have.

In other words, a stable oxide semiconductor cannot be called a complete amorphous oxide semiconductor. In addition, an oxide semiconductor that is not isotropic (for example, has a periodic structure in a minute region) cannot be called a complete amorphous oxide semiconductor. On the other hand, an a-like OS is not isotropic but has an unstable structure having a void (also referred to as a void). In terms of being unstable, a-like OS is physically close to an amorphous oxide semiconductor.

<CAAC-OS>
First, the CAAC-OS will be described.

A CAAC-OS is a kind of oxide semiconductor having a plurality of c-axis aligned crystal parts (also referred to as pellets).

A case where the CAAC-OS is analyzed by X-ray diffraction (XRD: X-Ray Diffraction) is described. For example, when CAAC-OS having an InGaZnO ₄ crystal classified into the space group R-3m is subjected to structural analysis by an out-of-plane method, a diffraction angle (2θ) as illustrated in FIG. Shows a peak near 31 °. Since this peak is attributed to the (009) plane of the InGaZnO ₄ crystal, in CAAC-OS, the crystal has a c-axis orientation, and the plane on which the c-axis forms a CAAC-OS film (formation target) It can also be confirmed that it faces a direction substantially perpendicular to the upper surface. In addition to the peak where 2θ is around 31 °, a peak may also appear when 2θ is around 36 °. The peak where 2θ is around 36 ° is attributed to the crystal structure classified into the space group Fd-3m. Therefore, the CAAC-OS preferably does not show the peak.

On the other hand, when structural analysis is performed on the CAAC-OS by an in-plane method in which X-rays are incident from a direction parallel to a formation surface, a peak appears at 2θ of around 56 °. This peak is attributed to the (110) plane of the InGaZnO ₄ crystal. Further, even when analysis (φ scan) is performed while rotating the sample with 2θ fixed at around 56 ° and the normal vector of the sample surface as the axis (φ axis), as shown in FIG. No peak appears. On the other hand, when φ scan is performed with 2θ fixed at around 56 ° with respect to single crystal InGaZnO ₄ , as shown in FIG. 8C, six peaks attributed to a crystal plane equivalent to the (110) plane are observed. Is done. Therefore, structural analysis using XRD can confirm that the CAAC-OS has irregular orientations in the a-axis and the b-axis.

Next, a CAAC-OS analyzed by electron diffraction will be described. For example, when an electron beam with a probe diameter of 300 nm is incident on a CAAC-OS including an InGaZnO ₄ crystal in parallel with a formation surface of the CAAC-OS, a diffraction pattern (restricted field of view) illustrated in FIG. Sometimes referred to as an electron diffraction pattern). This diffraction pattern includes spots caused by the (009) plane of the InGaZnO ₄ crystal. Therefore, electron diffraction shows that the pellets included in the CAAC-OS have c-axis alignment, and the c-axis is in a direction substantially perpendicular to the formation surface or the top surface. On the other hand, FIG. 8E shows a diffraction pattern obtained when an electron beam with a probe diameter of 300 nm is incident on the same sample in a direction perpendicular to the sample surface. From FIG. 8E, a ring-shaped diffraction pattern is confirmed. Therefore, it can be seen that the a-axis and the b-axis of the pellet included in the CAAC-OS have no orientation even by electron diffraction using an electron beam with a probe diameter of 300 nm. Note that the first ring in FIG. 8E is considered to originate from the (010) plane and the (100) plane of InGaZnO ₄ crystal. Further, the second ring in FIG. 8E is considered to be due to the (110) plane or the like.

In addition, when a composite analysis image (also referred to as a high-resolution TEM image) of a bright field image and a diffraction pattern of a CAAC-OS is observed with a transmission electron microscope (TEM), a plurality of pellets are confirmed. Can do. On the other hand, even in a high-resolution TEM image, the boundary between pellets, that is, a crystal grain boundary (also referred to as a grain boundary) may not be clearly confirmed. Therefore, it can be said that the CAAC-OS does not easily lower the electron mobility due to the crystal grain boundary.

FIG. 9A shows a high-resolution TEM image of a cross section of the CAAC-OS observed from a direction substantially parallel to the sample surface. For observation of the high-resolution TEM image, a spherical aberration correction function was used. A high-resolution TEM image using the spherical aberration correction function is particularly referred to as a Cs-corrected high-resolution TEM image. The Cs-corrected high resolution TEM image can be observed, for example, with an atomic resolution analytical electron microscope JEM-ARM200F manufactured by JEOL Ltd.

From FIG. 9A, pellets that are regions where metal atoms are arranged in layers can be confirmed. It can be seen that the size of one pellet is 1 nm or more and 3 nm or more. Therefore, the pellet can also be referred to as a nanocrystal (nc). In addition, the CAAC-OS can be referred to as an oxide semiconductor including CANC (C-Axis aligned nanocrystals). The pellet reflects the unevenness of the surface or top surface of the CAAC-OS film, and is parallel to the surface or top surface of the CAAC-OS.

9B and 9C show Cs-corrected high-resolution TEM images of the plane of the CAAC-OS observed from the direction substantially perpendicular to the sample surface. FIGS. 9D and 9E are images obtained by performing image processing on FIGS. 9B and 9C, respectively. Hereinafter, an image processing method will be described. First, an FFT image is acquired by performing a Fast Fourier Transform (FFT) process on FIG. 9B. Then, relative to the origin in the FFT image acquired, for masking leaves a range between 5.0 nm ^-1 from 2.8 nm ^-1. Next, the FFT-processed mask image is subjected to an inverse fast Fourier transform (IFFT) process to obtain an image-processed image. The image acquired in this way is called an FFT filtered image. The FFT filtered image is an image obtained by extracting periodic components from the Cs-corrected high-resolution TEM image, and shows a lattice arrangement.

In FIG. 9D, the portion where the lattice arrangement is disturbed is indicated by a broken line. A region surrounded by a broken line is one pellet. And the location shown with the broken line is the connection part of a pellet and a pellet. Since the broken line has a hexagonal shape, it can be seen that the pellet has a hexagonal shape. In addition, the shape of a pellet is not necessarily a regular hexagonal shape, and is often a non-regular hexagonal shape.

In FIG. 9 (E), a portion where the orientation of the lattice arrangement changes between a region where the lattice arrangement is aligned and a region where another lattice arrangement is aligned is indicated by a dotted line, and the change in the orientation of the lattice arrangement is shown. It is indicated by a broken line. A clear crystal grain boundary cannot be confirmed even in the vicinity of the dotted line. A distorted hexagon can be formed by connecting the surrounding lattice points around the lattice points near the dotted line. That is, it can be seen that the formation of crystal grain boundaries is suppressed by distorting the lattice arrangement. This is because the CAAC-OS can tolerate distortion due to the fact that the bond distance between atoms is not dense in the ab plane direction, or the bond distance between atoms changes when a metal element is substituted. This is thought to be possible.

As described above, the CAAC-OS has a c-axis alignment and a crystal structure in which a plurality of pellets (nanocrystals) are connected in the ab plane direction to have a strain. Therefore, the CAAC-OS can also be referred to as a CAA crystal (c-axis-allocated a-b-plane-anchored crystal).

The CAAC-OS is an oxide semiconductor with high crystallinity. Since the crystallinity of an oxide semiconductor may be deteriorated by entry of impurities, generation of defects, or the like, in reverse, the CAAC-OS can be said to be an oxide semiconductor with few impurities and defects (such as oxygen vacancies).

Note that the impurity means an element other than the main components of the oxide semiconductor, such as hydrogen, carbon, silicon, or a transition metal element. For example, an element such as silicon, which has a stronger bonding force with oxygen than a metal element included in an oxide semiconductor, disturbs the atomic arrangement of the oxide semiconductor by depriving the oxide semiconductor of oxygen, thereby reducing crystallinity. It becomes a factor. In addition, heavy metals such as iron and nickel, argon, carbon dioxide, and the like have large atomic radii (or molecular radii), which disturbs the atomic arrangement of the oxide semiconductor and decreases crystallinity.

In the case where an oxide semiconductor has impurities or defects, characteristics may fluctuate due to light, heat, or the like. For example, an impurity contained in the oxide semiconductor might serve as a carrier trap or a carrier generation source. For example, oxygen vacancies in the oxide semiconductor may serve as carrier traps or may serve as carrier generation sources by capturing hydrogen.

A CAAC-OS with few impurities and oxygen vacancies is an oxide semiconductor with low carrier density. Specifically, less than 8 × ^{10 11} atoms / cm ^3, preferably 1 × ¹⁰ 11 / cm less than ^3, more preferably less than 1 × ^{10 10} atoms / cm ^3, 1 × ^{10 -9} / cm ³ or An oxide semiconductor having the above carrier density can be obtained. Such an oxide semiconductor is referred to as a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor. The CAAC-OS has a low impurity concentration and a low density of defect states. That is, it can be said that the oxide semiconductor has stable characteristics.

<Nc-OS>
Next, the nc-OS will be described.

A case where the nc-OS is analyzed by XRD will be described. For example, when structural analysis is performed on the nc-OS by an out-of-plane method, a peak indicating orientation does not appear. That is, the nc-OS crystal has no orientation.

For example, when an nc-OS including an InGaZnO ₄ crystal is thinned and an electron beam with a probe diameter of 50 nm is incident on a region with a thickness of 34 nm parallel to the formation surface, FIG. A ring-shaped diffraction pattern (nanobeam electron diffraction pattern) as shown is observed. Further, FIG. 10B shows a diffraction pattern (nanobeam electron diffraction pattern) when an electron beam with a probe diameter of 1 nm is incident on the same sample. From FIG. 10B, a plurality of spots are observed in the ring-shaped region. Therefore, nc-OS does not confirm order when an electron beam with a probe diameter of 50 nm is incident, but confirms order when an electron beam with a probe diameter of 1 nm is incident.

Further, when an electron beam having a probe diameter of 1 nm is incident on a region having a thickness of less than 10 nm, an electron diffraction pattern in which spots are arranged in a substantially regular hexagonal shape is observed as shown in FIG. There is a case. Therefore, it can be seen that the nc-OS has a highly ordered region, that is, a crystal in a thickness range of less than 10 nm. Note that there are some regions where a regular electron diffraction pattern is not observed because the crystal faces in various directions.

FIG. 10D illustrates a Cs-corrected high-resolution TEM image of a cross section of the nc-OS observed from a direction substantially parallel to the formation surface. The nc-OS has a region in which a crystal part can be confirmed, such as a part indicated by an auxiliary line, and a region in which a clear crystal part cannot be confirmed in a high-resolution TEM image. A crystal part included in the nc-OS has a size of 1 nm to 10 nm, particularly a size of 1 nm to 3 nm in many cases. Note that an oxide semiconductor in which the size of a crystal part is greater than 10 nm and less than or equal to 100 nm is sometimes referred to as a fine crystal oxide semiconductor. For example, the nc-OS may not be able to clearly confirm a crystal grain boundary in a high-resolution TEM image. Note that the nanocrystal may have the same origin as the pellet in the CAAC-OS. Therefore, the crystal part of nc-OS is sometimes referred to as a pellet below.

Thus, the nc-OS has a periodicity in atomic arrangement in a minute region (for example, a region of 1 nm to 10 nm, particularly a region of 1 nm to 3 nm). In addition, the nc-OS has no regularity in crystal orientation between different pellets. Therefore, orientation is not seen in the whole film. Therefore, the nc-OS may not be distinguished from an a-like OS or an amorphous oxide semiconductor depending on an analysis method.

Note that since the crystal orientation is not regular between pellets (nanocrystals), nc-OS is an oxide semiconductor having RANC (Random Aligned Nanocrystals), or an oxide having NANC (Non-Aligned nanocrystals). It can also be called a semiconductor.

The nc-OS is an oxide semiconductor that has higher regularity than an amorphous oxide semiconductor. Therefore, the nc-OS has a lower density of defect states than an a-like OS or an amorphous oxide semiconductor. Note that the nc-OS does not have regularity in crystal orientation between different pellets. Therefore, the nc-OS has a higher density of defect states than the CAAC-OS.

<A-like OS>
The a-like OS is an oxide semiconductor having a structure between the nc-OS and an amorphous oxide semiconductor.

FIG. 11 shows a high-resolution cross-sectional TEM image of the a-like OS. Here, FIG. 11A is a high-resolution cross-sectional TEM image of the a-like OS at the start of electron irradiation. FIG. 11B is a high-resolution cross-sectional TEM image of the a-like OS after irradiation with electrons (e ⁻ ) of 4.3 × 10 ⁸ e ⁻ / nm ² . From FIG. 11A and FIG. 11B, it can be seen that in the a-like OS, a striped bright region extending in the vertical direction is observed from the start of electron irradiation. It can also be seen that the shape of the bright region changes after electron irradiation. The bright region is assumed to be a void or a low density region.

Since it has a void, the a-like OS has an unstable structure. Hereinafter, in order to show that the a-like OS has an unstable structure as compared with the CAAC-OS and the nc-OS, changes in the structure due to electron irradiation are shown.

As samples, a-like OS, nc-OS, and CAAC-OS are prepared. Each sample is an In—Ga—Zn oxide.

First, a high-resolution cross-sectional TEM image of each sample is acquired. Each sample has a crystal part by a high-resolution cross-sectional TEM image.

Note that a unit cell of an InGaZnO ₄ crystal has a structure in which three In—O layers and six Ga—Zn—O layers have a total of nine layers stacked in the c-axis direction. Are known. The spacing between these adjacent layers is about the same as the lattice spacing (also referred to as d value) of the (009) plane, and the value is determined to be 0.29 nm from crystal structure analysis. Therefore, in the following, a portion where the interval between lattice fringes is 0.28 nm or more and 0.30 nm or less is regarded as a crystal part of InGaZnO ₄ . Note that the lattice fringes correspond to the ab plane of the InGaZnO ₄ crystal.

FIG. 12 is an example in which the average size of the crystal parts (22 to 30 locations) of each sample was investigated. Note that the length of the lattice stripes described above is the size of the crystal part. From FIG. 12, it can be seen that in the a-like OS, the crystal part becomes larger according to the cumulative irradiation amount of electrons related to the acquisition of the TEM image or the like. From FIG. 12, the crystal part (also referred to as the initial nucleus), which was about 1.2 nm in the initial observation by TEM, has a cumulative electron (e ⁻ ) irradiation dose of 4.2 × 10 ⁸ e ⁻ / nm. ^{In FIG. 2} , it can be seen that the crystal has grown to a size of about 1.9 nm. On the other hand, in the nc-OS and the CAAC-OS, there is no change in the size of the crystal part in the range of the cumulative electron dose from the start of electron irradiation to 4.2 × 10 ⁸ e ⁻ / nm ^2. I understand. FIG. 12 shows that the crystal part sizes of the nc-OS and the CAAC-OS are approximately 1.3 nm and 1.8 nm, respectively, regardless of the cumulative electron dose. Note that a Hitachi transmission electron microscope H-9000NAR was used for electron beam irradiation and TEM observation. The electron beam irradiation conditions were an acceleration voltage of 300 kV, a current density of 6.7 × 10 ⁵ e ⁻ / (nm ² · s), and an irradiation region diameter of 230 nm.

As described above, in the a-like OS, a crystal part may be grown by electron irradiation. On the other hand, in the nc-OS and the CAAC-OS, the crystal part is hardly grown by electron irradiation. That is, it can be seen that the a-like OS has an unstable structure compared to the nc-OS and the CAAC-OS.

In addition, since it has a void, the a-like OS has a lower density than the nc-OS and the CAAC-OS. Specifically, the density of the a-like OS is 78.6% or more and less than 92.3% of the density of the single crystal having the same composition. Further, the density of the nc-OS and the density of the CAAC-OS are 92.3% or more and less than 100% of the density of the single crystal having the same composition. An oxide semiconductor that is less than 78% of the density of a single crystal is difficult to form.

For example, in an oxide semiconductor satisfying In: Ga: Zn = 1: 1: 1 [atomic ratio], the density of single crystal InGaZnO ₄ having a rhombohedral structure is 6.357 g / cm ³ . Thus, for example, in an oxide semiconductor that satisfies In: Ga: Zn = 1: 1: 1 [atomic ratio], the density of a-like OS is 5.0 g / cm ³ or more and less than 5.9 g / cm ^3. . For example, in the oxide semiconductor satisfying In: Ga: Zn = 1: 1: 1 [atomic ratio], the density of the nc-OS and the density of the CAAC-OS is 5.9 g / cm ³ or more and 6.3 g / less than cm ³ .

Note that when single crystals having the same composition do not exist, it is possible to estimate a density corresponding to a single crystal having a desired composition by combining single crystals having different compositions at an arbitrary ratio. What is necessary is just to estimate the density corresponding to the single crystal of a desired composition using a weighted average with respect to the ratio which combines the single crystal from which a composition differs. However, the density is preferably estimated by combining as few kinds of single crystals as possible.

As described above, oxide semiconductors have various structures and various properties. Note that the oxide semiconductor may be a stacked film including two or more of an amorphous oxide semiconductor, an a-like OS, an nc-OS, and a CAAC-OS, for example.

<Method 1 for Manufacturing Transistor>
A method for manufacturing the transistor in FIG. 1 according to the present invention will be described below with reference to FIGS.

First, the substrate 400 is prepared.

Next, the insulator 401 is formed over the substrate 400, and the insulator 401 is processed to form openings. Next, a conductor is formed. The conductor can be formed by sputtering, CVD (Chemical Vapor Deposition), MBE (Molecular Beam Epitaxy), PLD (Pulsed Laser Deposition), ALD, or the like. The conductor may have a multilayer structure including a conductor having a function of hardly transmitting oxygen. Next, polishing is performed using chemical mechanical polishing (CMP) or the like until a part of the insulator 401 is exposed, so that the conductor 413 is formed.

As another method for forming the conductor 413, a conductor is formed over the substrate 400 and processed using a photolithography method or the like to form the conductor 413. Next, an insulator to be the insulator 401 is formed, and is polished using chemical mechanical polishing (CMP) or the like until a part of the conductor 413 is exposed, whereby the insulator 401 is formed. Also good.

In the lithography method, first, a resist is exposed through a mask. Next, a resist mask is formed by removing or leaving the exposed region using a developer. Next, a conductor, a semiconductor, an insulator, or the like can be processed into a desired shape by etching through the resist mask. For example, the resist mask may be formed by exposing the resist using KrF excimer laser light, ArF excimer laser light, EUV (Extreme Ultraviolet) light, or the like. Further, an immersion technique may be used in which exposure is performed by filling a liquid (for example, water) between the substrate and the projection lens. Further, instead of the light described above, an electron beam or an ion beam may be used. Note that a mask is not necessary when an electron beam or an ion beam is used. Note that the resist mask is removed by performing a dry etching process such as ashing, performing a wet etching process, performing a wet etching process in addition to the dry etching process, or performing a dry etching process in addition to the wet etching process. be able to.

As the dry etching apparatus, a capacitively coupled plasma (CCP) etching apparatus having parallel plate electrodes can be used. The capacitively coupled plasma etching apparatus having parallel plate electrodes may be configured to apply a high frequency power source to one of the parallel plate electrodes. Alternatively, a configuration in which a plurality of different high-frequency power sources are applied to one electrode of the parallel plate electrode may be employed. Or the structure which applies the high frequency power supply of the same frequency to each parallel plate type | mold electrode may be sufficient. Or the structure which applies the high frequency power source from which a frequency differs to each parallel plate type | mold electrode may be sufficient. Alternatively, a dry etching apparatus having a high-density plasma source can be used. As a dry etching apparatus having a high-density plasma source, for example, an inductively coupled plasma (ICP) etching apparatus or the like can be used.

Next, the insulator 402 is formed. The insulator 402 is formed by sputtering, chemical vapor deposition (CVD), molecular beam epitaxy (MBE) or pulsed laser deposition (PLD), atomic layer deposition (ALD), or the like. Can be done.

The CVD method can be classified into a plasma CVD (PECVD: Plasma Enhanced CVD) method using plasma, a thermal CVD (TCVD: Thermal CVD) method using heat, a photo CVD (Photo CVD) method using light, and the like. . Further, it can be classified into a metal CVD (MCVD: Metal CVD) method and an organic metal CVD (MOCVD: Metal Organic CVD) method depending on the source gas used.

The plasma CVD method is easy to obtain a high-quality film at a relatively low temperature. Further, the thermal CVD method is a film formation method that can reduce plasma damage to an object to be processed because plasma is not used. For example, a wiring, an electrode, an element (a transistor, a capacitor, or the like) included in the semiconductor device may be charged up by receiving electric charge from plasma. At this time, a wiring, an electrode, an element, or the like included in the semiconductor device may be destroyed by the accumulated charge. On the other hand, in the case of a thermal CVD method that does not use plasma, damage due to exposure to plasma does not occur as described above, so that the yield of semiconductor devices can be increased. In addition, since the thermal CVD method is not exposed to plasma during film formation, a film with few defects is easily obtained.

The ALD method is also a film forming method that can reduce plasma damage to an object to be processed.

The CVD method and the ALD method are film forming methods in which a film is formed by a reaction on the surface of an object to be processed, unlike a film forming method in which particles emitted from a target or the like are deposited. Therefore, it is a film forming method that is not easily affected by the shape of the object to be processed and has good step coverage. In particular, the ALD method has excellent step coverage and excellent thickness uniformity, and thus is suitable for covering the surface of an opening having a high aspect ratio. However, since the ALD method has a low film formation rate, it may be preferable to use it in combination with another film formation method such as a CVD method with a high film formation rate.

In the CVD method and the ALD method, the composition of the obtained film can be controlled by the flow rate ratio of the source gases. For example, in the CVD method and the ALD method, a film having an arbitrary composition can be formed depending on the flow rate ratio of the source gases. Further, for example, in the CVD method and the ALD method, a film whose composition is continuously changed can be formed by changing the flow rate ratio of the source gas while forming the film. When film formation is performed while changing the flow rate ratio of the source gas, the time required for film formation can be shortened by the time required for conveyance and pressure adjustment compared to the case where film formation is performed using a plurality of film formation chambers. it can. Therefore, the productivity of the semiconductor device may be increased.

Next, high-density plasma treatment may be performed. The high-density plasma treatment is preferably performed in an oxygen atmosphere or a nitrogen atmosphere. The oxygen atmosphere is a gas atmosphere having oxygen atoms, oxygen, ozone or nitrogen oxide (nitrogen monoxide, nitrogen dioxide, dinitrogen monoxide, dinitrogen trioxide, dinitrogen tetroxide, dinitrogen pentoxide, etc.) Say the atmosphere. Further, in an oxygen atmosphere, an inert gas such as nitrogen or a rare gas (such as helium or argon) may be included. By performing high-density plasma treatment in an oxygen atmosphere in this manner, for example, a group 14 element such as carbon can be desorbed. Further, by performing high-density plasma treatment in an oxygen atmosphere, organic compounds such as hydrocarbons can be easily detached from the object to be processed.

As the high-density plasma treatment in a nitrogen atmosphere, for example, the high-density plasma treatment is performed in an atmosphere containing nitrogen and a rare gas, an atmosphere containing nitrogen, hydrogen, and a rare gas, or an atmosphere containing ammonia and a rare gas. Just do it. Thereby, the surface of the object to be processed and the vicinity thereof can be nitrided. The region to be nitrided can be formed extremely thin on the surface side of the object to be processed. Further, impurity diffusion can be suppressed by the nitrided region.

Further, the high-density plasma treatment may be performed in an oxygen atmosphere and then in a nitrogen atmosphere, or may be performed in a nitrogen atmosphere and then in an oxygen atmosphere. Further, annealing treatment may be performed before and after each high-density plasma treatment. In order to increase the plasma density, it may be preferable to flow a sufficient amount of gas. If the amount of gas is not sufficient, the deactivation rate may be higher than the radical generation rate. For example, it may be preferable to flow the gas at 100 sccm or more, 300 sccm or more, or 800 sccm or more.

For the high-density plasma treatment, for example, a high-frequency generator having a frequency of 0.3 GHz to 3.0 GHz, 0.7 GHz to 1.1 GHz, or 2.2 GHz to 2.8 GHz (typically 2.45 GHz) is used. A microwave generated using the above may be used. The processing pressure is 10 Pa to 5000 Pa, preferably 200 Pa to 1500 Pa, more preferably 300 Pa to 1000 Pa, the substrate temperature is 100 ° C. to 600 ° C. (typically 400 ° C.), and oxygen and argon are mixed. It can be performed using gas.

The high-density plasma is generated by using a microwave of 2.45 GHz, for example, and has an electron density of 1 × 10 ¹¹ / cm ³ or more and 1 × 10 ¹³ / cm ³ or less, an electron temperature of 2 eV or less, or an ion energy of 5 eV. It is preferable to perform the following. Such high-density plasma treatment has low radical kinetic energy, and is less damaged by plasma than conventional plasma treatment. Therefore, a film with few defects can be formed. The distance from the antenna that generates the microwave to the object to be processed is 5 mm to 120 mm, preferably 20 mm to 60 mm.

Alternatively, a plasma power source that applies an RF (Radio Frequency) bias to the substrate side may be provided. For example, 13.56 MHz or 27.12 MHz may be used as the frequency of the RF bias. High-density oxygen ions can be generated by using high-density plasma, and by applying an RF bias to the substrate side, oxygen ions generated by the high-density plasma can be efficiently guided to the object to be processed. Therefore, it is preferable to perform high-density plasma treatment while applying a substrate bias.

Further, after the high density plasma treatment, the annealing treatment may be continuously performed without being exposed to the atmosphere. Further, the high-density plasma treatment may be continuously performed after the annealing treatment without being exposed to the atmosphere. By continuously performing the high-density plasma treatment and the annealing treatment, it is possible to prevent impurities from being mixed between the treatments. In addition, by performing an annealing treatment after performing a high-density plasma treatment in an oxygen atmosphere, unnecessary oxygen that has not been used for compensation of oxygen vacancies can be eliminated from oxygen added to the object to be treated. it can. The annealing process may be performed by lamp annealing, for example.

The treatment time for the high-density plasma treatment is preferably 30 seconds to 120 minutes, 1 minute to 90 minutes, 2 minutes to 30 minutes, or 3 minutes to 15 minutes.

In addition, the annealing treatment is performed at 250 ° C. or higher and 800 ° C. or lower, 300 ° C. or higher and 700 ° C. or lower, or 400 ° C. or higher and 600 ° C. or lower. It is preferable that the time is 3 minutes or less or 3 minutes or less and 15 minutes or less.

Next, an insulator to be the insulator 406a is formed over the insulator 402. The insulator can be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like. In particular, it is preferable to form a film using an opposed target sputtering apparatus. Note that in this specification and the like, a film formation method using an opposed target sputtering apparatus can also be referred to as a VDSP (vapor deposition SP).

By forming an insulator to be the insulator 406a using an opposing target sputtering apparatus, plasma damage during film formation can be reduced. Therefore, oxygen vacancies in the film can be reduced. In addition, by using an opposed target sputtering apparatus, film formation at high vacuum is possible. Accordingly, the impurity concentration (eg, hydrogen, rare gas (such as argon), water, or the like) in the formed insulator can be reduced.

A sputtering apparatus having an inductively coupled antenna conductor plate may be used. Accordingly, a film having a high film formation rate and a large area and high uniformity can be formed.

The film formation is preferably performed using a gas containing oxygen, a rare gas, a gas containing nitrogen, or the like. As the gas containing nitrogen, for example, nitrogen (N ₂ ), dinitrogen monoxide (N ₂ O), ammonia (NH ₃ ), or the like may be used.

Next, a semiconductor to be the semiconductor 406b is formed. The semiconductor to be the semiconductor 406b can be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like. In particular, it is preferable to form a film using an opposed target sputtering apparatus.

By forming a semiconductor film using an opposed target sputtering apparatus, plasma damage during film formation can be reduced. Therefore, oxygen vacancies in the film can be reduced. In addition, by using an opposed target sputtering apparatus, film formation at high vacuum is possible. Accordingly, the impurity concentration (eg, hydrogen, rare gas (such as argon), water, or the like) in the formed semiconductor can be reduced.

A sputtering apparatus having an inductively coupled antenna conductor plate may be used. Accordingly, a film having a high film formation rate and a large area and high uniformity can be formed.

The film formation is preferably performed using a gas containing oxygen, a rare gas, a gas containing nitrogen, or the like. As the gas containing nitrogen, for example, nitrogen (N ₂ ), dinitrogen monoxide (N ₂ O), ammonia (NH ₃ ), or the like may be used.

Next, it is preferable to perform a first heat treatment. The first heat treatment may be performed at 250 ° C to 650 ° C, preferably 450 ° C to 600 ° C. The first heat treatment is performed in an inert gas atmosphere or an atmosphere containing an oxidizing gas at 10 ppm or more, 1% or more, or 10% or more. The first heat treatment may be performed in a reduced pressure state. Alternatively, the first heat treatment may be performed in an atmosphere containing an oxidizing gas of 10 ppm or more, 1% or more, or 10% or more to supplement the desorbed oxygen after the heat treatment in an inert gas atmosphere. Good. By the first heat treatment, the crystallinity of the semiconductor can be increased, impurities such as hydrogen and water can be removed, and the like. Alternatively, the above-described high-density plasma treatment may be performed before or after the first heat treatment.

Next, the insulator to be the insulator 406a and the semiconductor to be the semiconductor 406b are processed by a photolithography method or the like to form a multilayer film including the insulator 406a and the semiconductor 406b (see FIG. 13). Note that when the multilayer film is formed, the insulator 402 is also etched, and part of the region may be thinned. That is, the insulator 402 may have a shape having a protrusion in a region in contact with the multilayer film. In addition, when processing is performed by a photolithography method, an insulator or a conductor may be used as a mask. Further, after the multilayer film is formed, heat treatment may be performed similarly to the first heat treatment.

Next, an insulator 411 is formed (see FIG. 14). The insulator 411 can be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like. Alternatively, a spin coating method, a dip method, a droplet discharge method (such as an ink jet method), a printing method (such as screen printing or offset printing), a doctor knife method, a roll coater method, or a curtain coater method can be used.

The insulator 411 may be formed so that the upper surface has flatness. For example, the insulator 411 may have a flat upper surface immediately after film formation. Alternatively, for example, the insulator 411 may have flatness by removing the insulator and the like from the upper surface so as to be parallel to a reference surface such as the back surface of the substrate after film formation. Such a process is called a flattening process. Examples of the planarization treatment include chemical mechanical polishing treatment and dry etching treatment. Note that the top surface of the insulator 411 does not have to be flat.

The insulator 411 is preferably an insulator including at least one element of nitrogen or hydrogen. Accordingly, the resistance value of the region in contact with the insulator 411 in the semiconductor 406b can be reduced. Further, also in the insulator 406a, the resistance value of the region in contact with the insulator 411 can be reduced.

By forming the insulator 411 over the insulator 406a and the semiconductor 406b, the resistance value of the regions in contact with the insulator 411 of the insulator 406a and the semiconductor 406b can be reduced. In that case, the deposition temperature of the insulator 411 is preferably 100 ° C to 600 ° C. Further, the resistance values of the insulator 406a and the semiconductor 406b do not have to be reduced when the insulator 411 is formed. In that case, the resistance value of the regions in contact with the insulator 411 in the insulator 406a and the semiconductor 406b may be reduced by performing heat treatment after the insulator 411 is formed. The heat treatment is preferably performed at 100 ° C. or higher and 600 ° C. or lower. In this manner, part of the insulator 406a and the semiconductor 406b can be selectively used as a low resistance region. The low resistance region can function as a source region and a drain region of the transistor.

The insulator 411 preferably includes a region where the nitrogen concentration is greater than or equal to 40 atomic% and less than or equal to 60 atomic%.

The insulator 411 preferably includes a region where the hydrogen concentration is greater than or equal to 1 atomic% and less than or equal to 30 atomic%.

Next, a resist mask is formed over the insulator 411 by a lithography method or the like. Here, in order to improve the adhesion between the upper surface of the insulator 411 and the resist mask, for example, an organic coating film may be provided between the insulator 411 and the resist mask. In addition, when processing is performed by a photolithography method, an insulator or a conductor may be used as a mask.

Next, the insulator 411 is processed using a dry etching method or the like until it reaches the upper surface of the semiconductor 406b to form an opening (see FIG. 15). Although the dry etching apparatus described above can be used for the dry etching method, it is preferable to use a dry etching apparatus having a configuration in which high-frequency power sources having different frequencies are connected to the parallel plate electrodes.

At this time, a part of the semiconductor 406b is exposed. In addition, the exposed part of the semiconductor 406b is preferably removed by the above-described processing. Accordingly, the low resistance region formed by being in contact with the insulator 411 can be removed.

Further, an impurity element such as a residual component of an etching gas may adhere to the exposed semiconductor 406b. For example, when a chlorine-based gas is used as an etching gas, chlorine or the like may adhere. In addition, when a hydrocarbon-based gas is used as an etching gas, carbon or hydrogen may adhere. Therefore, it is preferable to reduce impurity elements attached to the exposed surface of the semiconductor 406b. The reduction of the impurities may be performed by, for example, a cleaning process using dilute hydrofluoric acid, a cleaning process using ozone, or a cleaning process using ultraviolet rays. A plurality of cleaning processes may be combined. Accordingly, the exposed surface of the semiconductor 406b, in other words, the channel formation region has a high resistance.

Next, the above-described high-density plasma treatment may be performed. Thus, oxygen can be added to the exposed semiconductor 406b to compensate for oxygen vacancies. Thereby, the channel formation region has a high resistance. Further, when the insulator is processed, a reaction product (also referred to as a rabbit ear) formed on the side surface of the insulator 411 or the like can be removed.

Alternatively, oxygen may be added by ion implantation, ion doping, plasma treatment, or the like after part of the semiconductor 406b is exposed.

Further, ion implantation is preferably performed while heating the substrate. The temperature of the substrate may be 60 ° C. or higher and 700 ° C. or lower, preferably 300 ° C. or higher and 500 ° C. or lower, more preferably 350 ° C. or higher and 450 ° C. or lower.

Next, an insulator to be the insulator 406c is formed. The insulator to be the insulator 406c can be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like. The insulator to be the insulator 406c can be formed in a manner similar to that of the insulator 406a. Further, after the formation of the insulator to be the insulator 406c, the above high-density plasma treatment may be performed.

The insulator 406c is preferably formed using a collimated sputtering method. In the collimated sputtering method, a directional film can be formed by installing a collimator between a target and a substrate. That is, sputtered particles having a component perpendicular to the substrate pass through the collimator and reach the substrate. As a result, the film is formed on a surface parallel to the substrate, but it is difficult to form a film on a surface perpendicular to the substrate. Further, a long throw sputtering method may be used. In the long throw sputtering method, by increasing the vertical distance between the target and the substrate, the incident direction of the sputtered particles to the substrate can be made closer to the vertical.

Next, an insulator to be the insulator 412 is formed over the insulator to be the insulator 406c. The insulator to be the insulator 412 can be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.

The insulator to be the insulator 412 is preferably formed using an ALD method with good coverage, and particularly preferably formed while heating the substrate. The substrate temperature may be 100 ° C. or higher and 600 ° C. or lower, preferably 300 ° C. or higher and 500 ° C. or lower.

Next, a conductor to be the conductor 404 is formed. The conductor to be the conductor 404 can be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like. A conductor to be the conductor 404 is formed so as to fill an opening provided in the insulator 411. Therefore, it is preferable to use the CVD method (particularly the MCVD method). In some cases, a stacked film of a conductor formed by the ALD method or the like and a conductor formed by the CVD method may be preferable in order to improve the adhesion of the conductor formed by the MCVD method. For example, a stacked film in which titanium nitride and tungsten are formed in this order may be used.

Next, the conductor 404, the insulator 412, and the insulator 406c are formed by polishing using CMP or the like until at least the surface of the insulator 411 is exposed (see FIG. 16).

In this manner, the conductor 404 having a function as a gate electrode can be formed in a self-aligned manner without using a lithography method.

Next, the insulator 421 is formed over the insulator 411. The insulator 421 may be formed in a manner similar to that of the insulator 402 or the like.

Next, openings that reach the semiconductor 406 b and the conductor 404 are formed in the insulator 411 and the insulator 421.

Next, a conductor 416a1, a conductor 416a2, and a conductor 416a3 that fill the opening, and a conductor 418a1, a conductor 418a2, and a conductor 418a3 that are connected to the conductor 416a1, the conductor 416a2, and the conductor 416a3, respectively, are formed. (See FIG. 17).

As described above, the transistor illustrated in FIG. 1 can be manufactured.

Note that one embodiment of the present invention is described in this embodiment. Note that one embodiment of the present invention is not limited thereto. That is, in this embodiment and other embodiments, various aspects of the invention are described; therefore, one embodiment of the present invention is not limited to a particular aspect. For example, as an embodiment of the present invention, an example in which an oxide semiconductor is used as a semiconductor is described; however, one embodiment of the present invention is not limited thereto. Depending on circumstances or conditions, one embodiment of the present invention may use silicon, germanium, silicon germanium, silicon carbide, gallium arsenide, aluminum gallium arsenide, indium phosphide, gallium nitride, an organic semiconductor, or the like.

The structures and methods described in this embodiment can be combined as appropriate with any of the structures and methods described in the other embodiments.

(Embodiment 2)
<Transistor structure 2>
Hereinafter, a transistor having a structure different from that in Embodiment 1 and a manufacturing method thereof will be described with reference to FIGS. 18A and 18B are a top view and a cross-sectional view of a semiconductor device according to one embodiment of the present invention. FIG. 18A is a top view. FIG. 18B is a cross-sectional view corresponding to the dashed-dotted line A1-A2 illustrated in FIG. 18C is a cross-sectional view corresponding to the dashed-dotted line A3-A4 in FIG. Note that in the top view of FIG. 18A, some elements are omitted for clarity.

18 differs from the transistor described in Embodiment 1 in the shape of the insulator formed over the semiconductor 406b. For other structures, the transistor described in the above embodiment is referred to.

<Method 2 for manufacturing transistor>
A method for manufacturing the transistor illustrated in FIGS. 18A to 18C is described below with reference to FIGS.

First, the processes up to the step shown in FIG.

Next, the insulator 410 is formed. The insulator 410 may be formed in a manner similar to that of the insulator 402 or the like (see FIG. 20).

Next, similarly to the processing of the insulator 411 in Embodiment 1, the insulator 410 is processed until it reaches the upper surface of the semiconductor 406b by using a dry etching method or the like to form an opening (see FIG. 21). .)

Next, as in Embodiment 1, the insulator 406c, the insulator 412, and the conductor 404 are formed (see FIG. 22).

Next, the insulator 410 is selectively removed (see FIG. 23). The insulator 410 may be removed by wet etching or dry etching. In particular, wet etching is preferable because selective removal of the insulator 410 can be easily performed. In addition, when the insulator 410 is removed, a part other than the insulator 410 may be slightly etched.

Next, the insulator 411 is formed over the insulator 402, the insulator 406a, the semiconductor 406b, the insulator 406c, the insulator 412, and the conductor 404 (see FIG. 24).

By forming the insulator 411 over the insulator 406a and the semiconductor 406b, the resistance value of the regions in contact with the insulator 411 of the insulator 406a and the semiconductor 406b can be reduced. In that case, the deposition temperature of the insulator 411 is preferably 100 ° C to 600 ° C. Further, the resistance values of the insulator 406a and the semiconductor 406b do not have to be reduced when the insulator 411 is formed. In that case, the resistance value of the regions in contact with the insulator 411 in the insulator 406a and the semiconductor 406b may be reduced by performing heat treatment after the insulator 411 is formed. The heat treatment is preferably performed at 100 ° C. or higher and 600 ° C. or lower. In this manner, part of the insulator 406a and the semiconductor 406b can be selectively used as a low resistance region. The low resistance region can function as a source region and a drain region of the transistor.

Next, an opening reaching the semiconductor 406 b and the conductor 404 is formed in the insulator 411.

Next, a conductor 416a1, a conductor 416a2, and a conductor 416a3 that fill the opening, and a conductor 418a1, a conductor 418a2, and a conductor 418a3 that are connected to the conductor 416a1, the conductor 416a2, and the conductor 416a3, respectively, are formed. (See FIG. 25).

As described above, the transistor illustrated in FIGS. 18A to 18C can be manufactured.

In the transistor illustrated in FIG. 25, a method in which part of the semiconductor 406b is removed when an opening is provided in the insulator 410 illustrated in FIG. 21 is not limited thereto. For example, when the opening is provided in the insulator 410, part of the semiconductor 406b may not be removed. Accordingly, a transistor as illustrated in FIG. 26 can be manufactured.

The structures and methods described in this embodiment can be combined as appropriate with any of the structures and methods described in the other embodiments.

(Embodiment 3)
<Transistor structure 3>
Hereinafter, a transistor having a structure different from those in Embodiment 1 and Embodiment 2 and a manufacturing method thereof will be described with reference to FIGS. FIG. 27 illustrates a top view and a cross-sectional view of a semiconductor device according to one embodiment of the present invention. FIG. 27A is a top view. FIG. 27B is a cross-sectional view corresponding to the dashed-dotted line A1-A2 illustrated in FIG. FIG. 27C is a cross-sectional view corresponding to the dashed-dotted line A3-A4 illustrated in FIG. Note that for simplification of the drawing, some components are not illustrated in the top view in FIG.

In the transistor illustrated in FIGS. 27A and 27B, the shape of the insulator 406c is different from the transistors described in Embodiments 1 and 2. For other structures, the transistor described in the above embodiment is referred to.

<Method 3 for manufacturing transistor>
A method for manufacturing the transistor illustrated in FIGS. 27A to 27C is described below with reference to FIGS.

First, steps up to FIG. 13 in Embodiment Mode 1 are performed, and then an insulator 406d is formed (see FIG. 28). The insulator 406d may be formed in a manner similar to that of the insulator 406a or the insulator 406c.

Next, the insulator 410 is formed. The insulator 410 may be formed in a manner similar to that of the insulator 402 or the like.

Next, in the same manner as in Embodiment Mode 2, the insulator 410 is processed until it reaches the upper surface of the insulator 406d by using a dry etching method or the like to form an opening (see FIG. 29).

Next, in the same manner as in Embodiment Mode 1, the insulator 412 and the conductor 404 are formed (see FIG. 30).

Next, the insulator 410 is selectively removed (see FIG. 31). The insulator 410 may be removed by wet etching or dry etching. In particular, wet etching is preferable because selective removal of the insulator 410 can be easily performed. In addition, when the insulator 410 is removed, a part other than the insulator 410 may be slightly etched.

Next, the insulator 411 is formed over the insulator 406d, the insulator 412, and the conductor 404 (see FIG. 32).

By forming the insulator 411 over the insulator 406d, the resistance values of the insulator 406a and the semiconductor 406b can be reduced through the insulator 406d as well as the insulator 406d. In that case, the deposition temperature of the insulator 411 is preferably 100 ° C to 600 ° C. Further, the resistance values of the insulator 406d, the insulator 406a, and the semiconductor 406b do not have to be reduced when the insulator 411 is formed. In that case, the resistance values of the insulator 406d, the insulator 406a, and the semiconductor 406b may be reduced by performing heat treatment after the insulator 411 is formed. The heat treatment is preferably performed at 100 ° C. or higher and 600 ° C. or lower. In this manner, part of the insulator 406d, the insulator 406a, and the semiconductor 406b can be selectively used as a low resistance region. The low resistance region can function as a source region and a drain region of the transistor.

Next, an opening reaching the insulator 406d and the conductor 404 is formed in the insulator 411. Although not particularly illustrated, an opening reaching the semiconductor 406b may be formed in the insulator 411 and the insulator 406d.

Next, a conductor 416a1, a conductor 416a2, and a conductor 416a3 that fill the opening, and a conductor 418a1, a conductor 418a2, and a conductor 418a3 that are connected to the conductor 416a1, the conductor 416a2, and the conductor 416a3, respectively, are formed. (See FIG. 33).

As described above, the transistor illustrated in FIG. 27 can be manufactured.

The structures and methods described in this embodiment can be combined as appropriate with any of the structures and methods described in the other embodiments.

(Embodiment 4)
<Storage device 1>
FIG. 34 illustrates an example of a semiconductor device (memory device) using the transistor according to one embodiment of the present invention, which can hold stored data even in a state where power is not supplied and has no limit on the number of writing times.

A semiconductor device illustrated in FIG. 34A includes a transistor 3200 including a first semiconductor, a transistor 3300 including a second semiconductor, and a capacitor 3400. Note that the above-described transistor can be used as the transistor 3300.

The transistor 3300 is preferably a transistor with low off-state current. As the transistor 3300, for example, a transistor including an oxide semiconductor can be used. Since the off-state current of the transistor 3300 is small, stored data can be held in a specific node of the semiconductor device for a long time. That is, a refresh operation is not required or the frequency of the refresh operation can be extremely low, so that the semiconductor device with low power consumption is obtained.

In FIG. 34A, the first wiring 3001 is electrically connected to the source of the transistor 3200, and the second wiring 3002 is electrically connected to the drain of the transistor 3200. The third wiring 3003 is electrically connected to one of a source and a drain of the transistor 3300, and the fourth wiring 3004 is electrically connected to the gate of the transistor 3300. The other of the gate of the transistor 3200 and the source and drain of the transistor 3300 is electrically connected to the first terminal of the capacitor 3400, and the fifth wiring 3005 is electrically connected to the second electrode of the capacitor 3400. It is connected to the.

The semiconductor device illustrated in FIG. 34A has the property that the potential of the gate of the transistor 3200 can be held; thus, information can be written, held, and read as described below.

Information writing and holding will be described. First, the potential of the fourth wiring 3004 is set to a potential at which the transistor 3300 is turned on, so that the transistor 3300 is turned on. Accordingly, the potential of the third wiring 3003 is supplied to the node FG electrically connected to the gate of the transistor 3200 and the first terminal of the capacitor 3400. That is, predetermined charge is supplied to the gate of the transistor 3200 (writing). Here, it is assumed that one of two charges that give two different potential levels (hereinafter referred to as a Low level charge and a High level charge) is given. After that, the potential of the fourth wiring 3004 is set to a potential at which the transistor 3300 is turned off and the transistor 3300 is turned off, so that charge is held at the node FG (holding).

Since the off-state current of the transistor 3300 is small, the charge of the node FG is held for a long time.

Next, reading of information will be described. When an appropriate potential (reading potential) is applied to the fifth wiring 3005 in a state where a predetermined potential (constant potential) is applied to the first wiring 3001, the second wiring 3002 has a charge held in the node FG. Take a potential according to the amount. This is because, when the transistor 3200 is an n-channel type, the apparent threshold voltage V _{th_H} when a high level charge is applied to the gate of the transistor 3200 is the low level charge applied to the gate of the transistor 3200. This is because it becomes lower than the apparent threshold voltage V _{th_L in the} case of being present. Here, the apparent threshold voltage refers to the potential of the fifth wiring 3005 necessary for bringing the transistor 3200 into a “conducting state”. Therefore, by _setting the potential of the fifth wiring 3005 to a potential V ₀ between V _{th_H} and V _{th_L} , the charge given to the node FG can be determined. For example, in the case where a high-level charge is applied to the node FG in writing, the transistor 3200 is in a “conducting state” if the potential of the fifth wiring 3005 is V ₀ (> V _{th_H} ). On the other hand, when a low-level charge is _{supplied to} the node FG, the transistor 3200 remains in the “non-conductive state” even when the potential of the fifth wiring 3005 becomes V ₀ (<V _{th_L} ). Therefore, by determining the potential of the second wiring 3002, information held in the node FG can be read.

Note that when memory cells are arranged in an array, information of a desired memory cell must be read at the time of reading. In order not to read data in other memory cells, the fifth wiring 3005 is _{supplied with} a potential at which the transistor 3200 is in a “non-conducting state” regardless of the charge applied to the node FG, that is, a potential lower than V _{th_H.} To give. _{Alternatively} , the fifth wiring 3005 may be _{supplied with} a potential at which the transistor 3200 is in a “conducting state” regardless of the charge applied to the node FG, that is, a potential higher than V _{th_L} .

<Structure 1 of Semiconductor Device>
FIG. 35 is a cross-sectional view of the semiconductor device corresponding to FIG. The semiconductor device illustrated in FIG. 35 includes a transistor 3200, a transistor 3300, and a capacitor 3400. The transistor 3300 and the capacitor 3400 are provided above the transistor 3200. Note that although an example in which the transistor illustrated in FIG. 1 is used as the transistor 3300 is described, the semiconductor device according to one embodiment of the present invention is not limited thereto. Therefore, the above description of the transistor is referred to as appropriate.

A transistor 3200 illustrated in FIG. 35 is a transistor using the semiconductor substrate 450. The transistor 3200 includes a region 474a in the semiconductor substrate 450, a region 474b in the semiconductor substrate 450, an insulator 462, and a conductor 454.

In the transistor 3200, the region 474a and the region 474b function as a source region and a drain region. The insulator 462 functions as a gate insulator. The conductor 454 functions as a gate electrode. Therefore, the resistance of the channel formation region can be controlled by the potential applied to the conductor 454. That is, conduction / non-conduction between the region 474a and the region 474b can be controlled by a potential applied to the conductor 454.

As the semiconductor substrate 450, for example, a single semiconductor substrate such as silicon or germanium, or a compound semiconductor substrate made of silicon carbide, silicon germanium, gallium arsenide, indium phosphide, zinc oxide, or gallium oxide may be used. A single crystal silicon substrate is preferably used as the semiconductor substrate 450.

As the semiconductor substrate 450, a semiconductor substrate having an impurity imparting n-type conductivity is used. However, as the semiconductor substrate 450, a semiconductor substrate having an impurity imparting p-type conductivity may be used. In that case, a well having an impurity imparting n-type conductivity may be provided in a region to be the transistor 3200. Alternatively, the semiconductor substrate 450 may be i-type.

The upper surface of the semiconductor substrate 450 preferably has a (110) plane. Thus, the on-state characteristics of the transistor 3200 can be improved.

The region 474a and the region 474b are regions having an impurity imparting p-type conductivity. In this manner, the transistor 3200 constitutes a p-channel transistor.

Although the case where the transistor 3200 is a p-channel transistor has been described, the transistor 3200 may be an n-channel transistor.

Note that the transistor 3200 is separated from an adjacent transistor by the region 460 or the like. The region 460 is a region having an insulating property.

35 includes the insulator 464, the insulator 466, the insulator 468, the insulator 470, the insulator 472, the insulator 475, the insulator 402, the insulator 411, and the insulator. 465, an insulator 467, an insulator 469, an insulator 498, a conductor 480a, a conductor 480b, a conductor 480c, a conductor 478a, a conductor 478b, a conductor 478c, and a conductor 476a, a conductor 476b, a conductor 476c, a conductor 479a, a conductor 479b, a conductor 479c, a conductor 477a, a conductor 477b, a conductor 477c, a conductor 484a, and a conductor 484b, a conductor 484c, a conductor 484d, a conductor 483a, a conductor 483b, a conductor 483c, a conductor 483d, a conductor 485a, and a conductor 485b A conductor 485c, a conductor 485d, a conductor 487a, a conductor 487b, a conductor 487c, a conductor 488a, a conductor 488b, a conductor 488c, a conductor 490a, a conductor 490b, A conductor 489a, a conductor 489b, a conductor 491a, a conductor 491b, a conductor 491c, a conductor 492a, a conductor 492b, a conductor 492c, a conductor 494, a conductor 496, An insulator 406a, a semiconductor 406b, and an insulator 406c.

The insulator 464 is provided over the transistor 3200. The insulator 466 is provided over the insulator 464. The insulator 468 is provided over the insulator 466. The insulator 470 is provided over the insulator 468. The insulator 472 is provided over the insulator 470. The insulator 475 is disposed over the insulator 472. The transistor 3300 is provided over the insulator 475. In addition, the capacitor 3400 is provided over the insulator 465. The insulator 469 is provided over the capacitor 3400.

The insulator 464 includes an opening reaching the region 474a, an opening reaching the region 474b, and an opening reaching the conductor 454. In addition, a conductor 480a, a conductor 480b, or a conductor 480c is embedded in each opening.

The insulator 466 includes an opening reaching the conductor 480a, an opening reaching the conductor 480b, and an opening reaching the conductor 480c. In addition, a conductor 478a, a conductor 478b, or a conductor 478c is embedded in each opening.

The insulator 468 includes an opening reaching the conductor 478a, an opening reaching the conductor 478b, and an opening reaching the conductor 478c. In addition, a conductor 476a, a conductor 476b, or a conductor 476c is embedded in each opening.

Further, over the insulator 468, a conductor 479a in contact with the conductor 476a, a conductor 479b in contact with the conductor 476b, and a conductor 479c in contact with the conductor 476c are provided. The insulator 472 includes an opening that reaches the conductor 479a through the insulator 470 and an opening that reaches the conductor 479b through the insulator 470. In addition, a conductor 477a or a conductor 477b is embedded in each opening.

The insulator 475 includes an opening overlapping with a channel formation region of the transistor 3300, an opening reaching the conductor 477a, an opening reaching the conductor 477b, and an opening reaching the insulator 472. In addition, a conductor 484a, a conductor 484b, a conductor 484c, or a conductor 484d is embedded in each opening.

The conductor 484d may function as a bottom gate electrode of the transistor 3300. Alternatively, for example, electrical characteristics such as a threshold voltage of the transistor 3300 may be controlled by applying a certain potential to the conductor 484d. Alternatively, for example, the conductor 484d and the top gate electrode of the transistor 3300 may be electrically connected. Thus, the on-state current of the transistor 3300 can be increased. In addition, since the punch-through phenomenon can be suppressed, electrical characteristics in the saturation region of the transistor 3300 can be stabilized.

The insulator 402 includes an opening reaching the conductor 484a and an opening reaching the conductor 484c.

The insulator 465 includes an opening reaching the conductor 485a, an opening reaching the conductor 485b, and an opening reaching the conductor 485c. In addition, a conductor 487a, a conductor 487b, or a conductor 487c is embedded in each opening.

Further, over the insulator 465, a conductor 488a in contact with the conductor 487a, a conductor 488b in contact with the conductor 487b, and a conductor 488c in contact with the conductor 487c are provided. The insulator 467 includes an opening reaching the conductor 488a and an opening reaching the conductor 488b. In addition, a conductor 490a or a conductor 490b is embedded in each opening. In addition, the conductor 488c is in contact with the conductor 494 of one electrode of the capacitor 3400.

Further, over the insulator 467, a conductor 489a in contact with the conductor 490a and a conductor 489b in contact with the conductor 490b are provided. The insulator 469 includes an opening reaching the conductor 489a, an opening reaching the conductor 489b, and an opening reaching the conductor 496 which is the other electrode of the capacitor 3400. In addition, a conductor 491a, a conductor 491b, or a conductor 491c is embedded in each opening.

Further, over the insulator 469, a conductor 492a in contact with the conductor 491a, a conductor 492b in contact with the conductor 491b, and a conductor 492c in contact with the conductor 491c are provided.

As the insulator 464, the insulator 466, the insulator 468, the insulator 470, the insulator 472, the insulator 475, the insulator 402, the insulator 411, the insulator 465, the insulator 467, the insulator 469, and the insulator 498, For example, an insulator containing boron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium, germanium, yttrium, zirconium, lanthanum, neodymium, hafnium or tantalum, in a single layer, or What is necessary is just to use it by lamination | stacking. For example, as the insulator 401, aluminum oxide, magnesium oxide, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, or oxide Tantalum may be used.

One or more of the insulator 464, the insulator 466, the insulator 468, the insulator 470, the insulator 472, the insulator 475, the insulator 402, the insulator 411, the insulator 465, the insulator 467, the insulator 469, or the insulator 498 Preferably has an insulator having a function of blocking impurities such as hydrogen and oxygen. When an insulator having a function of blocking impurities such as hydrogen and oxygen is provided in the vicinity of the transistor 3300, electrical characteristics of the transistor 3300 can be stabilized.

Examples of the insulator having a function of blocking impurities such as hydrogen and oxygen include boron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium, germanium, yttrium, zirconium, and lanthanum. An insulator containing neodymium, hafnium, or tantalum may be used as a single layer or a stacked layer.

Conductor 480a, conductor 480b, conductor 480c, conductor 478a, conductor 478b, conductor 478c, conductor 476a, conductor 476b, conductor 476c, conductor 479a, conductor 479b, conductor 479c, conductor Body 477a, conductor 477b, conductor 477c, conductor 484a, conductor 484b, conductor 484c, conductor 484d, conductor 483a, conductor 483b, conductor 483c, conductor 483d, conductor 485a, conductor 485b, conductor 485c, conductor 485d, conductor 487a, conductor 487b, conductor 487c, conductor 488a, conductor 488b, conductor 488c, conductor 490a, conductor 490b, conductor 489a, conductor 489b Conductor 491a, conductor 491b, conductor 491c, conductor 492a, conductor Examples of the body 492b, the conductor 492c, the conductor 494, and the conductor 496 include boron, nitrogen, oxygen, fluorine, silicon, phosphorus, aluminum, titanium, chromium, manganese, cobalt, nickel, copper, zinc, gallium, and yttrium. A conductor containing one or more of zirconium, molybdenum, ruthenium, silver, indium, tin, tantalum, and tungsten may be used in a single layer or a stacked layer. For example, it may be an alloy or a compound, a conductor containing aluminum, a conductor containing copper and titanium, a conductor containing copper and manganese, a conductor containing indium, tin and oxygen, a conductor containing titanium and nitrogen Etc. may be used.

An oxide semiconductor is preferably used as the semiconductor 406b. However, silicon (including strained silicon), germanium, silicon germanium, silicon carbide, gallium arsenide, aluminum gallium arsenide, indium phosphide, gallium nitride, an organic semiconductor, or the like may be used.

As the insulator 406a and the insulator 406c, an oxide including one or more elements other than oxygen included in the semiconductor 406b or two or more elements is preferably used. However, silicon (including strained silicon), germanium, silicon germanium, silicon carbide, gallium arsenide, aluminum gallium arsenide, indium phosphide, gallium nitride, an organic semiconductor, or the like may be used.

The source or the drain of the transistor 3200 is interposed between the conductor 480a, the conductor 478a, the conductor 476a, the conductor 479a, the conductor 477a, the conductor 484a, the conductor 483a, and the conductor 485a. Thus, the transistor 3300 is electrically connected to a conductor which is one of a source electrode and a drain electrode. The conductor 454 that is a gate electrode of the transistor 3200 includes a conductor 480c, a conductor 478c, a conductor 476c, a conductor 479c, a conductor 477c, a conductor 484c, a conductor 483c, and a conductor 483c. And a conductor which is the other of the source electrode and the drain electrode of the transistor 3300 through the body 485c.

The capacitor 3400 includes one of a source electrode and a drain electrode of the transistor 3300, a conductor 483c, a conductor 485c, a conductor 487c, and a conductor 488c, and one electrode of the capacitor 3400 A conductor 494 which is electrically connected, an insulator 498, and a conductor 496 which is the other electrode of the capacitor 3400 are included. Note that it is preferable that the capacitor 3400 be formed above or below the transistor 3300 because the size of the semiconductor device can be reduced.

For other structures, the description of FIG. 1 and the like can be referred to as appropriate.

Note that the semiconductor device illustrated in FIG. 36 is different only in the structure of the transistor 3200 of the semiconductor device illustrated in FIG. Therefore, for the semiconductor device illustrated in FIG. 36, the description of the semiconductor device illustrated in FIG. Specifically, the semiconductor device illustrated in FIG. 36 illustrates the case where the transistor 3200 is a Fin type. By setting the transistor 3200 to a Fin type, an effective channel width can be increased, whereby the on-state characteristics of the transistor 3200 can be improved. In addition, since the contribution of the electric field of the gate electrode can be increased, off characteristics of the transistor 3200 can be improved. Note that the transistor 3200 may be a p-channel transistor or an n-channel transistor.

Although an example of a semiconductor device including the transistor 3300 over the transistor 3200 and the capacitor 3400 over the transistor 3300 is described in this embodiment, one or more transistors including a semiconductor similar to the transistor 330 are included over the transistor 3200. It does not matter even if it has a configuration. With such a configuration, the degree of integration of the semiconductor device can be further increased.

<Storage device 2>
A semiconductor device illustrated in FIG. 34B is different from the semiconductor device illustrated in FIG. 34A in that the transistor 3200 is not provided. In this case as well, information writing and holding operations can be performed by operations similar to those of the semiconductor device illustrated in FIG.

Information reading in the semiconductor device illustrated in FIG. 34B is described. When the transistor 3300 is turned on, the floating third wiring 3003 and the capacitor 3400 are turned on, and charge is redistributed between the third wiring 3003 and the capacitor 3400. As a result, the potential of the third wiring 3003 changes. The amount of change in potential of the third wiring 3003 varies depending on the potential of the first terminal of the capacitor 3400 (or charge accumulated in the capacitor 3400).

For example, the potential of the first terminal of the capacitor 3400 is V, the capacitance of the capacitor 3400 is C, the capacitance component of the third wiring 3003 is CB, and the potential of the third wiring 3003 before charge is redistributed Is VB0, the potential of the third wiring 3003 after the charge is redistributed is (CB × VB0 + C × V) / (CB + C). Therefore, if the potential of the first terminal of the capacitor 3400 has two states of V1 and V0 (V1> V0) as the state of the memory cell, the third wiring 3003 in the case where the potential V1 is held. Potential (= (CB × VB0 + C × V1) / (CB + C)) is higher than the potential of the third wiring 3003 when the potential V0 is held (= (CB × VB0 + C × V0) / (CB + C)). It turns out that it becomes high.

Then, information can be read by comparing the potential of the third wiring 3003 with a predetermined potential.

In this case, a transistor to which the first semiconductor is applied is used as a driver circuit for driving the memory cell, and a transistor to which the second semiconductor is applied is stacked over the driver circuit as the transistor 3300. do it.

The semiconductor device described above can hold stored data for a long time by using a transistor with an off-state current that includes an oxide semiconductor. That is, a refresh operation is unnecessary or the frequency of the refresh operation can be extremely low, so that a semiconductor device with low power consumption can be realized. In addition, stored data can be held for a long time even when power is not supplied (note that a potential is preferably fixed).

In addition, since the semiconductor device does not require a high voltage for writing information, the element hardly deteriorates. For example, unlike the conventional nonvolatile memory, since electrons are not injected into the floating gate and electrons are not extracted from the floating gate, there is no problem of deterioration of the insulator. In other words, the semiconductor device according to one embodiment of the present invention is a semiconductor device in which the number of rewritable times which is a problem in the conventional nonvolatile memory is not limited and the reliability is drastically improved. Further, since data is written depending on the conductive state and non-conductive state of the transistor, high-speed operation is possible. This embodiment can be implemented in appropriate combination with at least part of the other embodiments described in this specification.

(Embodiment 5)
<Structure 2 of Semiconductor Device>
In this embodiment, an example of a circuit using the transistor of one embodiment of the present invention will be described with reference to drawings.
<Cross-section structure>
37A and 37B are cross-sectional views of the semiconductor device of one embodiment of the present invention. 37A, the X1-X2 direction indicates the channel length direction, and in FIG. 37B, the Y1-Y2 direction indicates the channel width direction. The semiconductor device illustrated in FIGS. 37A and 37B includes a transistor 2200 using a first semiconductor material in a lower portion and a transistor 2100 using a second semiconductor material in an upper portion. . 37A and 37B illustrate an example in which the transistor illustrated in FIG. 1 is used as the transistor 2100 including the second semiconductor material.

The first semiconductor material and the second semiconductor material are preferably materials having different band gaps. For example, the first semiconductor material is a semiconductor material other than an oxide semiconductor (silicon (including strained silicon), germanium, silicon germanium, silicon carbide, gallium arsenide, aluminum gallium arsenide, indium phosphide, gallium nitride, organic semiconductor, etc. And the second semiconductor material can be an oxide semiconductor. By using the transistor described in the above embodiment as the transistor including an oxide semiconductor, excellent subthreshold characteristics can be obtained and the transistor can be a minute transistor. Further, since the switch speed is high, high speed operation is possible, and since the off current is low, the leakage current is small.

The transistor 2200 may be either an n-channel transistor or a p-channel transistor, and an appropriate transistor may be used depending on a circuit. In addition to the use of the transistor of one embodiment of the present invention using an oxide semiconductor, the specific structure of the semiconductor device, such as a material and a structure used, is not necessarily limited to that described here.

In the structures illustrated in FIGS. 37A and 37B, the transistor 2100 is provided over the transistor 2200 with the insulator 2201, the insulator 2207, and the insulator 2208 provided therebetween. A plurality of wirings 2202 are provided between the transistors 2200 and 2100. A plurality of plugs 2203 embedded in various insulators electrically connect wirings and electrodes provided in the upper layer where the transistor 2100 is provided and the lower layer where the transistor 2200 is provided, respectively. Yes. An insulator 2204 that covers the transistor 2100 and a wiring 2205 over the insulator 2204 are provided.

Thus, by stacking two types of transistors, the area occupied by the circuit is reduced, and a plurality of circuits can be arranged at a higher density.

Here, in the case where a silicon-based semiconductor material is used for the transistor 2200 provided in the lower layer, hydrogen in the insulator provided in the vicinity of the semiconductor film of the transistor 2200 terminates dangling bonds of silicon, and the reliability of the transistor 2200 is increased. There is an effect to improve. On the other hand, in the case where an oxide semiconductor is used for the transistor 2100 provided in the upper layer, hydrogen in the insulator provided in the vicinity of the semiconductor film of the transistor 2100 is one of the factors that generate carriers in the oxide semiconductor. In some cases, the reliability of the transistor 2100 may be reduced. Therefore, in the case where the transistor 2100 including an oxide semiconductor is stacked over the transistor 2200 including a silicon-based semiconductor material, it is particularly preferable to provide the insulator 2207 having a function of preventing hydrogen diffusion therebetween. It is effective. In addition to improving the reliability of the transistor 2200 by confining hydrogen in the lower layer with the insulator 2207, it is possible to simultaneously improve the reliability of the transistor 2100 by suppressing diffusion of hydrogen from the lower layer to the upper layer. it can.

As the insulator 2207, for example, aluminum oxide, aluminum oxynitride, gallium oxide, gallium oxynitride, yttrium oxide, yttrium oxynitride, hafnium oxide, hafnium oxynitride, yttria-stabilized zirconia (YSZ), or the like can be used.

In addition, a block film having a function of preventing hydrogen diffusion is preferably formed over the transistor 2100 so as to cover the transistor 2100 including the oxide semiconductor film. As the block film, a material similar to that of the insulator 2207 can be used, and aluminum oxide is particularly preferably used. In the aluminum oxide film, excess oxygen can be added to a lower insulator during the film formation, and the excess oxygen is transferred to the oxide semiconductor layer of the transistor 2100 by a thermal process, so that defects in the oxide semiconductor layer are removed. There is an effect to repair. Further, the aluminum oxide film has a high blocking effect that prevents the film from permeating both impurities such as hydrogen and moisture and oxygen. Therefore, by using an aluminum oxide film as the block film covering the transistor 2100, desorption of oxygen from the oxide semiconductor film included in the transistor 2100 is prevented, and mixing of water and hydrogen into the oxide semiconductor film is prevented. Can be prevented. Note that the block film may be used by stacking the insulators 2204 or may be provided below the insulators 2204.

Note that the transistor 2200 can be a transistor of various types as well as a planar transistor. For example, a transistor of FIN (fin) type, TRI-GATE (trigate) type, or the like can be used. Examples of cross-sectional views in that case are shown in FIGS. An insulator 2212 is provided over the semiconductor substrate 2211. The semiconductor substrate 2211 has a convex portion (also referred to as a fin) with a thin tip. Note that an insulator may be provided on the convex portion. The insulator functions as a mask for preventing the semiconductor substrate 2211 from being etched when the convex portion is formed. In addition, the convex part does not need to have a thin tip, for example, it may be a substantially rectangular parallelepiped convex part or a thick convex part. A gate insulator 2214 is provided on the convex portion of the semiconductor substrate 2211, and a gate electrode 2213 is provided thereon. A source region and a drain region 2215 are formed in the semiconductor substrate 2211. Note that although the example in which the semiconductor substrate 2211 includes a convex portion is described here, the semiconductor device according to one embodiment of the present invention is not limited thereto. For example, an SOI substrate may be processed to form a semiconductor region having a convex portion.

This embodiment can be implemented in appropriate combination with at least part of the other embodiments described in this specification.

(Embodiment 6)
[CMOS circuit]
The circuit diagram shown in FIG. 37C shows a structure of a so-called CMOS circuit in which a p-channel transistor 2200 and an n-channel transistor 2100 are connected in series and their gates are connected.

[Analog switch]
A circuit diagram illustrated in FIG. 37D illustrates a structure in which the sources and drains of the transistors 2100 and 2200 are connected to each other. With such a configuration, it can function as a so-called analog switch. This embodiment can be implemented in appropriate combination with at least part of the other embodiments described in this specification.

(Embodiment 7)
<CPU>
Hereinafter, a CPU including a semiconductor device such as the above-described transistor or the above-described memory device will be described.

FIG. 38 is a block diagram illustrating a configuration example of a CPU in which some of the transistors described above are used.

The CPU shown in FIG. 38 has an ALU 1191 (ALU: Arithmetic logic unit), an ALU controller 1192, an instruction decoder 1193, an interrupt controller 1194, a timing controller 1195, a register 1196, a register controller 1197, and a bus interface 1198 on a substrate 1190. A rewritable ROM 1199 and a ROM interface 1189. As the substrate 1190, a semiconductor substrate, an SOI substrate, a glass substrate, or the like is used. The ROM 1199 and the ROM interface 1189 may be provided in separate chips. Needless to say, the CPU illustrated in FIG. 38 is just an example in which the configuration is simplified, and an actual CPU may have various configurations depending on the application. For example, the configuration including the CPU or the arithmetic circuit illustrated in FIG. 38 may be a single core, and a plurality of the cores may be included, and each core may operate in parallel. Further, the number of bits that the CPU can handle with the internal arithmetic circuit or the data bus can be, for example, 8 bits, 16 bits, 32 bits, 64 bits, or the like.

Instructions input to the CPU via the bus interface 1198 are input to the instruction decoder 1193, decoded, and then input to the ALU controller 1192, interrupt controller 1194, register controller 1197, and timing controller 1195.

The ALU controller 1192, interrupt controller 1194, register controller 1197, and timing controller 1195 perform various controls based on the decoded instructions. Specifically, the ALU controller 1192 generates a signal for controlling the operation of the ALU 1191. The interrupt controller 1194 determines and processes an interrupt request from an external input / output device or a peripheral circuit from the priority or mask state during execution of the CPU program. The register controller 1197 generates an address of the register 1196, and reads and writes the register 1196 according to the state of the CPU.

In the CPU illustrated in FIG. 38, a memory cell is provided in the register 1196. As the memory cell of the register 1196, the above-described transistor, memory device, or the like can be used.

In the CPU shown in FIG. 38, the register controller 1197 selects a holding operation in the register 1196 in accordance with an instruction from the ALU 1191. That is, whether to hold data by a flip-flop or to hold data by a capacitor in a memory cell included in the register 1196 is selected. When data retention by the flip-flop is selected, the power supply voltage is supplied to the memory cell in the register 1196. When holding of data in the capacitor is selected, data is rewritten to the capacitor and supply of power supply voltage to the memory cells in the register 1196 can be stopped.

FIG. 39 is an example of a circuit diagram of a memory element that can be used as the register 1196. The memory element 1200 includes a circuit 1201 in which stored data is volatilized by power-off, a circuit 1202 in which stored data is not volatilized by power-off, a switch 1203, a switch 1204, a logic element 1206, a capacitor 1207, and a selection function. Circuit 1220 having. The circuit 1202 includes a capacitor 1208, a transistor 1209, and a transistor 1210. Note that the memory element 1200 may further include other elements such as a diode, a resistance element, and an inductor, as necessary.

Here, the memory device described above can be used for the circuit 1202. When supply of power supply voltage to the memory element 1200 is stopped, GND (0 V) or a potential at which the transistor 1209 is turned off is continuously input to the gate of the transistor 1209 of the circuit 1202. For example, the gate of the transistor 1209 is grounded through a load such as a resistor.

The switch 1203 is configured using a transistor 1213 of one conductivity type (eg, n-channel type), and the switch 1204 is configured using a transistor 1214 of conductivity type (eg, p-channel type) opposite to the one conductivity type. An example is shown. Here, the first terminal of the switch 1203 corresponds to one of the source and the drain of the transistor 1213, the second terminal of the switch 1203 corresponds to the other of the source and the drain of the transistor 1213, and the switch 1203 corresponds to the gate of the transistor 1213. In accordance with the control signal RD input to the second terminal, conduction or non-conduction between the first terminal and the second terminal (that is, the conduction state or non-conduction state of the transistor 1213) is selected. The first terminal of the switch 1204 corresponds to one of the source and the drain of the transistor 1214, the second terminal of the switch 1204 corresponds to the other of the source and the drain of the transistor 1214, and the switch 1204 is input to the gate of the transistor 1214. The control signal RD selects the conduction or non-conduction between the first terminal and the second terminal (that is, the conduction state or non-conduction state of the transistor 1214).

One of a source and a drain of the transistor 1209 is electrically connected to one of a pair of electrodes of the capacitor 1208 and a gate of the transistor 1210. Here, the connection part is referred to as a node M2. One of a source and a drain of the transistor 1210 is electrically connected to a wiring that can supply a low power supply potential (eg, a GND line), and the other is connected to the first terminal of the switch 1203 (the source and the drain of the transistor 1213 On the other hand). A second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) is electrically connected to a first terminal of the switch 1204 (one of the source and the drain of the transistor 1214). A second terminal of the switch 1204 (the other of the source and the drain of the transistor 1214) is electrically connected to a wiring that can supply the power supply potential VDD. A second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213), a first terminal of the switch 1204 (one of a source and a drain of the transistor 1214), an input terminal of the logic element 1206, and the capacitor 1207 One of the pair of electrodes is electrically connected. Here, the connection part is referred to as a node M1. The other of the pair of electrodes of the capacitor 1207 can be configured to receive a constant potential. For example, a low power supply potential (such as GND) or a high power supply potential (such as VDD) can be input. The other of the pair of electrodes of the capacitor 1207 is electrically connected to a wiring (eg, a GND line) that can supply a low power supply potential. The other of the pair of electrodes of the capacitor 1208 can have a constant potential. For example, a low power supply potential (such as GND) or a high power supply potential (such as VDD) can be input. The other of the pair of electrodes of the capacitor 1208 is electrically connected to a wiring (eg, a GND line) that can supply a low power supply potential.

Note that the capacitor 1207 and the capacitor 1208 can be omitted by positively using a parasitic capacitance of a transistor or a wiring.

A control signal WE is input to a first gate (first gate electrode) of the transistor 1209. The switch 1203 and the switch 1204 are selected to be in a conductive state or a non-conductive state between the first terminal and the second terminal by a control signal RD different from the control signal WE. When the terminals of the other switch are in a conductive state, the first terminal and the second terminal of the other switch are in a non-conductive state.

A signal corresponding to data held in the circuit 1201 is input to the other of the source and the drain of the transistor 1209. FIG. 39 illustrates an example in which the signal output from the circuit 1201 is input to the other of the source and the drain of the transistor 1209. A signal output from the second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) is an inverted signal obtained by inverting the logic value by the logic element 1206 and is input to the circuit 1201 through the circuit 1220. .

Note that FIG. 39 illustrates an example in which a signal output from the second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) is input to the circuit 1201 through the logic element 1206 and the circuit 1220. It is not limited to. A signal output from the second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) may be input to the circuit 1201 without inversion of the logical value. For example, when there is a node in the circuit 1201 that holds a signal in which the logical value of the signal input from the input terminal is inverted, the second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) An output signal can be input to the node.

In FIG. 39, among the transistors used for the memory element 1200, a transistor other than the transistor 1209 can be a transistor in which a channel is formed in a film or a substrate 1190 made of a semiconductor other than an oxide semiconductor. For example, a transistor in which a channel is formed in a silicon film or a silicon substrate can be used. Further, all the transistors used for the memory element 1200 can be transistors whose channels are formed using an oxide semiconductor. Alternatively, the memory element 1200 may include a transistor whose channel is formed using an oxide semiconductor in addition to the transistor 1209, and the remaining transistors are formed using a semiconductor layer other than the oxide semiconductor or the substrate 1190. It can also be a transistor.

As the circuit 1201 in FIG. 39, for example, a flip-flop circuit can be used. As the logic element 1206, for example, an inverter, a clocked inverter, or the like can be used.

In the semiconductor device according to one embodiment of the present invention, data stored in the circuit 1201 can be held by the capacitor 1208 provided in the circuit 1202 while the power supply voltage is not supplied to the memory element 1200.

In addition, a transistor in which a channel is formed in an oxide semiconductor has extremely low off-state current. For example, the off-state current of a transistor in which a channel is formed in an oxide semiconductor is significantly lower than the off-state current of a transistor in which a channel is formed in crystalline silicon. Therefore, by using the transistor as the transistor 1209, the signal held in the capacitor 1208 is maintained for a long time even when the power supply voltage is not supplied to the memory element 1200. In this manner, the memory element 1200 can hold stored data (data) even while the supply of power supply voltage is stopped.

Further, by providing the switch 1203 and the switch 1204, the memory element is characterized by performing a precharge operation; therefore, after the supply of power supply voltage is resumed, the time until the circuit 1201 retains the original data again is shortened. be able to.

In the circuit 1202, the signal held by the capacitor 1208 is input to the gate of the transistor 1210. Therefore, after the supply of the power supply voltage to the memory element 1200 is restarted, the signal held by the capacitor 1208 is converted into the state of the transistor 1210 (a conductive state or a non-conductive state) and read from the circuit 1202 Can do. Therefore, the original signal can be accurately read even if the potential corresponding to the signal held in the capacitor 1208 slightly fluctuates.

By using such a storage element 1200 for a storage device such as a register or a cache memory included in the processor, loss of data in the storage device due to stop of supply of power supply voltage can be prevented. In addition, after the supply of the power supply voltage is resumed, the state before the power supply stop can be restored in a short time. Accordingly, power can be stopped in a short time in the entire processor or in one or a plurality of logic circuits constituting the processor, so that power consumption can be suppressed.

Although the memory element 1200 has been described as an example of use for a CPU, the memory element 1200 can be applied to DSPs (Digital Signal Processors), custom LSIs, LSIs such as PLDs (Programmable Logic Devices), and RF-Tags (Radio Frequency Tags). It is.

This embodiment can be implemented in appropriate combination with at least part of the other embodiments described in this specification.

(Embodiment 8)
<Imaging device>
FIG. 40A is a top view illustrating an example of an imaging device 200 according to one embodiment of the present invention. The imaging device 200 includes a pixel unit 210, a peripheral circuit 260 for driving the pixel unit 210, a peripheral circuit 270, a peripheral circuit 280, and a peripheral circuit 290. The pixel unit 210 includes a plurality of pixels 211 arranged in a matrix of p rows and q columns (p and q are integers of 2 or more). The peripheral circuit 260, the peripheral circuit 270, the peripheral circuit 280, and the peripheral circuit 290 are connected to the plurality of pixels 211 and have a function of supplying signals for driving the plurality of pixels 211, respectively. Note that in this specification and the like, the peripheral circuit 260, the peripheral circuit 270, the peripheral circuit 280, the peripheral circuit 290, and the like are all referred to as “peripheral circuits” or “driving circuits” in some cases. For example, the peripheral circuit 260 can be said to be part of the peripheral circuit.

The imaging apparatus 200 preferably includes a light source 291. The light source 291 can emit the detection light P1.

The peripheral circuit includes at least one of a logic circuit, a switch, a buffer, an amplifier circuit, and a conversion circuit. In addition, the peripheral circuit may be disposed on a substrate over which the pixel portion 210 is formed. The peripheral circuit may be partially or entirely mounted with a semiconductor device such as an IC. Note that one or more of the peripheral circuit 260, the peripheral circuit 270, the peripheral circuit 280, and the peripheral circuit 290 may be omitted from the peripheral circuit.

In addition, as illustrated in FIG. 40B, in the pixel portion 210 included in the imaging device 200, the pixel 211 may be arranged to be inclined. By arranging the pixels 211 at an angle, the pixel interval (pitch) in the row direction and the column direction can be shortened. Thereby, the quality of imaging in the imaging apparatus 200 can be further improved.

<Pixel Configuration Example 1>
A single pixel 211 included in the imaging apparatus 200 is configured by a plurality of sub-pixels 212, and a color image display is realized by combining each sub-pixel 212 with a filter (color filter) that transmits light in a specific wavelength band. Information can be acquired.

FIG. 41A is a top view illustrating an example of the pixel 211 for acquiring a color image. A pixel 211 illustrated in FIG. 41A includes a sub-pixel 212 (hereinafter also referred to as “sub-pixel 212R”) provided with a color filter that transmits a red (R) wavelength band, and a green (G) wavelength band. Sub-pixel 212 (hereinafter also referred to as “sub-pixel 212G”) provided with a transparent color filter and sub-pixel 212 (hereinafter referred to as “sub-pixel 212B”) provided with a color filter that transmits the blue (B) wavelength band. Also called). The sub-pixel 212 can function as a photosensor.

The subpixel 212 (subpixel 212R, subpixel 212G, and subpixel 212B) is electrically connected to the wiring 231, the wiring 247, the wiring 248, the wiring 249, and the wiring 250. Further, the sub-pixel 212R, the sub-pixel 212G, and the sub-pixel 212B are each connected to an independent wiring 253. In this specification and the like, for example, the wiring 248 and the wiring 249 connected to the pixel 211 in the n-th row are referred to as a wiring 248 [n] and a wiring 249 [n], respectively. For example, the wiring 253 connected to the pixel 211 in the m-th column is referred to as a wiring 253 [m]. Note that in FIG. 41A, the wiring 253 connected to the sub-pixel 212R included in the pixel 211 in the m-th column is the wiring 253 [m] R, the wiring 253 connected to the sub-pixel 212G is the wiring 253 [m] G, and A wiring 253 connected to the subpixel 212B is described as a wiring 253 [m] B. The subpixel 212 is electrically connected to a peripheral circuit through the wiring.

In addition, the imaging apparatus 200 has a configuration in which subpixels 212 provided with color filters that transmit the same wavelength band of adjacent pixels 211 are electrically connected to each other via a switch. In FIG. 41B, the sub-pixel 212 included in the pixel 211 arranged in n rows (n is an integer of 1 to p) and m columns (m is an integer of 1 to q) is adjacent to the pixel 211. A connection example of the sub-pixel 212 included in the pixel 211 arranged in n + 1 rows and m columns is shown. In FIG. 41B, a sub-pixel 212R arranged in n rows and m columns and a sub-pixel 212R arranged in n + 1 rows and m columns are connected through a switch 201. Further, the sub-pixel 212G arranged in n rows and m columns and the sub-pixel 212G arranged in n + 1 rows and m columns are connected via a switch 202. Further, the sub-pixel 212B arranged in n rows and m columns and the sub-pixel 212B arranged in n + 1 rows and m columns are connected via a switch 203.

Note that the color filter used for the sub-pixel 212 is not limited to red (R), green (G), and blue (B), and transmits cyan (C), yellow (Y), and magenta (M) light, respectively. A color filter may be used. A full color image can be acquired by providing the sub-pixel 212 that detects light of three different wavelength bands in one pixel 211.

Alternatively, in addition to the sub-pixel 212 provided with a color filter that transmits red (R), green (G), and blue (B) light, a color filter that transmits yellow (Y) light is provided. A pixel 211 having a sub-pixel 212 may be used. Alternatively, in addition to the sub-pixel 212 provided with a color filter that transmits cyan (C), yellow (Y), and magenta (M) light, a color filter that transmits blue (B) light is provided. A pixel 211 having a sub-pixel 212 may be used. By providing the sub-pixel 212 that detects light of four different wavelength bands in one pixel 211, the color reproducibility of the acquired image can be further enhanced.

Further, for example, in FIG. 41A, the pixel number ratio of the sub-pixel 212 that detects the red wavelength band, the sub-pixel 212 that detects the green wavelength band, and the sub-pixel 212 that detects the blue wavelength band (or (Light receiving area ratio) may not be 1: 1: 1. For example, a Bayer array in which the pixel number ratio (light receiving area ratio) is red: green: blue = 1: 2: 1 may be used. Alternatively, the pixel number ratio (light receiving area ratio) may be red: green: blue = 1: 6: 1.

Note that the number of subpixels 212 provided in the pixel 211 may be one, but two or more are preferable. For example, by providing two or more sub-pixels 212 that detect the same wavelength band, redundancy can be increased and the reliability of the imaging apparatus 200 can be increased.

In addition, by using an IR (IR: Infrared) filter that absorbs or reflects visible light and transmits infrared light, the imaging device 200 that detects infrared light can be realized.

Further, by using an ND (ND: Neutral Density) filter (a neutral density filter), it is possible to prevent output saturation that occurs when a large amount of light enters the photoelectric conversion element (light receiving element). By using a combination of ND filters having different light reduction amounts, the dynamic range of the imaging apparatus can be increased.

In addition to the filters described above, a lens may be provided in the pixel 211. Here, an arrangement example of the pixel 211, the filter 254, and the lens 255 will be described with reference to the cross-sectional view of FIG. By providing the lens 255, the photoelectric conversion element can receive incident light efficiently. Specifically, as illustrated in FIG. 42A, the light 256 is supplied to the photoelectric conversion element 220 through the lens 255, the filter 254 (filter 254R, the filter 254G, and the filter 254B) formed in the pixel 211, the pixel circuit 230, and the like. It can be set as the structure made to enter.

However, as illustrated in the region surrounded by the alternate long and short dash line, part of the light 256 indicated by the arrow may be blocked by part of the wiring 257. Therefore, a structure in which a lens 255 and a filter 254 are disposed on the photoelectric conversion element 220 side as illustrated in FIG. 42B so that the photoelectric conversion element 220 efficiently receives the light 256 is preferable. By making the light 256 incident on the photoelectric conversion element 220 from the photoelectric conversion element 220 side, the imaging device 200 with high detection sensitivity can be provided.

As the photoelectric conversion element 220 illustrated in FIG. 42, a photoelectric conversion element in which a pn-type junction or a pin-type junction is formed may be used.

Alternatively, the photoelectric conversion element 220 may be formed using a substance having a function of generating charges by absorbing radiation. Examples of the substance having a function of absorbing radiation and generating a charge include selenium, lead iodide, mercury iodide, gallium arsenide, cadmium telluride, and cadmium zinc alloy.

For example, when selenium is used for the photoelectric conversion element 220, the photoelectric conversion element 220 having a light absorption coefficient over a wide wavelength band such as X-rays and gamma rays in addition to visible light, ultraviolet light, and infrared light can be realized.

Here, one pixel 211 included in the imaging apparatus 200 may include a sub-pixel 212 including a first filter in addition to the sub-pixel 212 illustrated in FIG.

<Pixel Configuration Example 2>
Hereinafter, an example in which a pixel is formed using a transistor including silicon and a transistor including an oxide semiconductor according to the present invention will be described.

43A and 43B are cross-sectional views of elements included in the imaging device.

43A includes a transistor 353 and a transistor 354 that use oxide semiconductors stacked over a transistor 351 that uses silicon provided over a silicon substrate 300, and the silicon substrate 300. The imaging device illustrated in FIG. And a photodiode 360 having an anode 361 and a cathode 362. Each transistor and photodiode 360 has electrical connection with various plugs 370 and wirings 371. Further, the anode 361 of the photodiode 360 is electrically connected to the plug 370 through the low resistance region 363.

In addition, the imaging device is provided in contact with the layer 305 including the transistor 351 and the photodiode 360 provided over the silicon substrate 300, the layer 320 including the wiring 371, and the layer 320 including the wiring 371. A layer 331 including the transistor 354 and a layer 340 provided in contact with the layer 331 and including a wiring 372 and a wiring 373.

Note that in the example of the cross-sectional view in FIG. 43A, the silicon substrate 300 includes the light receiving surface of the photodiode 360 on the surface opposite to the surface where the transistor 351 is formed. With this configuration, an optical path can be secured without being affected by various transistors and wirings. Therefore, a pixel with a high aperture ratio can be formed. Note that the light receiving surface of the photodiode 360 may be the same as the surface on which the transistor 351 is formed.

Note that in the case where a pixel is formed using a transistor, the layer 305 may be a layer including a transistor. Alternatively, the layer 305 may be omitted, and the pixel may be formed using only transistors.

In the cross-sectional view in FIG. 43A, the photodiode 360 provided in the layer 305 and the transistor provided in the layer 331 can be formed to overlap with each other. Then, the integration degree of pixels can be increased. That is, the resolution of the imaging device can be increased.

In FIG. 43B, the imaging device can have a structure in which a photodiode 365 is provided over a transistor on the layer 340 side. 43B, for example, the layer 305 includes a transistor 351 and a transistor 352 using silicon, the layer 320 includes a wiring 371, and the layer 331 includes a transistor 353 including an oxide semiconductor layer. The layer 340 includes a photodiode 365, and the photodiode 365 includes a semiconductor layer 366, a semiconductor layer 367, and a semiconductor layer 368, and includes a wiring 373 and a wiring 374 through a plug 370. And is electrically connected.

With the element structure illustrated in FIG. 43B, the aperture ratio can be increased.

As the photodiode 365, a pin-type diode element using an amorphous silicon film, a microcrystalline silicon film, or the like may be used. The photodiode 365 has a structure in which an n-type semiconductor layer 368, an i-type semiconductor layer 367, and a p-type semiconductor layer 366 are sequentially stacked. Amorphous silicon is preferably used for the i-type semiconductor layer 367. For the p-type semiconductor layer 366 and the n-type semiconductor layer 368, amorphous silicon, microcrystalline silicon, or the like containing a dopant imparting each conductivity type can be used. The photodiode 365 using amorphous silicon as a photoelectric conversion layer has high sensitivity in the wavelength region of visible light and can easily detect weak visible light.

Here, an insulator 380 is provided between the layer 305 including the transistor 351 and the photodiode 360 and the layer 331 including the transistor 353 and the transistor 354. However, the position of the insulator 380 is not limited.

Hydrogen in the insulator provided in the vicinity of the channel formation region of the transistor 351 has an effect of terminating the dangling bond of silicon and improving the reliability of the transistor 351. On the other hand, hydrogen in the insulator provided in the vicinity of the transistor 353, the transistor 354, and the like is one of the factors that generate carriers in the oxide semiconductor. Therefore, the reliability of the transistor 353, the transistor 354, and the like may be reduced. Therefore, in the case where a transistor including an oxide semiconductor is stacked over a transistor including a silicon-based semiconductor, an insulator 380 having a function of blocking hydrogen is preferably provided therebetween. By confining hydrogen below the insulator 380, the reliability of the transistor 351 can be improved. Further, since diffusion of hydrogen from a lower layer than the insulator 380 to an upper layer than the insulator 380 can be suppressed, reliability of the transistor 353, the transistor 354, and the like can be improved.

This embodiment can be implemented in appropriate combination with at least part of the other embodiments described in this specification.

(Embodiment 9)
<RF tag>
In this embodiment, an RF tag including the transistor or the memory device described in the above embodiment will be described with reference to FIGS.

The RF tag in this embodiment has a storage circuit inside, stores necessary information in the storage circuit, and exchanges information with the outside using non-contact means, for example, wireless communication. Because of these characteristics, the RF tag can be used in an individual authentication system that identifies an article by reading individual information about the article. Note that extremely high reliability is required for use in these applications.

The configuration of the RF tag will be described with reference to FIG. FIG. 44 is a block diagram illustrating a configuration example of an RF tag.

As shown in FIG. 44, the RF tag 800 includes an antenna 804 that receives a radio signal 803 transmitted from an antenna 802 connected to a communication device 801 (also referred to as an interrogator or a reader / writer). The RF tag 800 includes a rectifier circuit 805, a constant voltage circuit 806, a demodulation circuit 807, a modulation circuit 808, a logic circuit 809, a storage circuit 810, and a ROM 811. Note that a material that can sufficiently suppress a reverse current, such as an oxide semiconductor, may be used for the transistor including the rectifying action included in the demodulation circuit 807. Thereby, the fall of the rectification effect | action resulting from a reverse current can be suppressed, and it can prevent that the output of a demodulation circuit is saturated. That is, the output of the demodulation circuit with respect to the input of the demodulation circuit can be made closer to linear. Note that there are three major data transmission formats: an electromagnetic coupling method in which a pair of coils are arranged facing each other to perform communication by mutual induction, an electromagnetic induction method in which communication is performed by an induction electromagnetic field, and a radio wave method in which communication is performed using radio waves. Separated. The RF tag 800 described in this embodiment can be used for any of the methods.

Next, the configuration of each circuit will be described. The antenna 804 is for transmitting and receiving a radio signal 803 to and from the antenna 802 connected to the communication device 801. Further, the rectifier circuit 805 rectifies an input AC signal generated by receiving a radio signal by the antenna 804, for example, half-wave double voltage rectification, and the signal rectified by a capacitive element provided in the subsequent stage. It is a circuit for generating an input potential by smoothing. Note that a limiter circuit may be provided on the input side or the output side of the rectifier circuit 805. The limiter circuit is a circuit for controlling not to input more than a certain amount of power to a subsequent circuit when the amplitude of the input AC signal is large and the internally generated voltage is large.

The constant voltage circuit 806 is a circuit for generating a stable power supply voltage from the input potential and supplying it to each circuit. Note that the constant voltage circuit 806 may include a reset signal generation circuit. The reset signal generation circuit is a circuit for generating a reset signal of the logic circuit 809 using a stable rise of the power supply voltage.

The demodulation circuit 807 is a circuit for demodulating an input AC signal by detecting an envelope and generating a demodulated signal. The modulation circuit 808 is a circuit for performing modulation in accordance with data output from the antenna 804.

A logic circuit 809 is a circuit for analyzing and processing the demodulated signal. The memory circuit 810 is a circuit that holds input information and includes a row decoder, a column decoder, a storage area, and the like. The ROM 811 is a circuit for storing a unique number (ID) or the like and outputting it according to processing.

Note that the above-described circuits can be appropriately disposed as necessary.

Here, the memory circuit described in the above embodiment can be used for the memory circuit 810. Since the memory circuit of one embodiment of the present invention can retain information even when the power is turned off, the memory circuit can be preferably used for an RF tag. Further, the memory circuit of one embodiment of the present invention does not cause a difference in maximum communication distance between data reading and writing because power (voltage) necessary for data writing is significantly smaller than that of a conventional nonvolatile memory. It is also possible. Furthermore, it is possible to suppress the occurrence of malfunction or erroneous writing due to insufficient power during data writing.

The memory circuit of one embodiment of the present invention can also be applied to the ROM 811 because it can be used as a nonvolatile memory. In that case, it is preferable that the producer separately prepares a command for writing data in the ROM 811 so that the user cannot freely rewrite the command. By shipping the product after the producer writes the unique number before shipping, it is possible to assign a unique number only to the good products to be shipped, rather than assigning a unique number to all the produced RF tags, The unique number of the product after shipment does not become discontinuous, and customer management corresponding to the product after shipment becomes easy.

Note that this embodiment can be combined with any of the other embodiments and examples in this specification as appropriate.

(Embodiment 10)
<Display device>
Hereinafter, a display device according to one embodiment of the present invention is described with reference to FIGS.

As a display element used for the display device, a liquid crystal element (also referred to as a liquid crystal display element), a light-emitting element (also referred to as a light-emitting display element), or the like can be used. The light-emitting element includes, in its category, an element whose luminance is controlled by current or voltage, and specifically includes inorganic EL (Electroluminescence), organic EL, and the like. Hereinafter, a display device using an EL element (an EL display device) and a display device using a liquid crystal element (a liquid crystal display device) will be described as examples of the display device.

Note that a display device described below includes a panel in which a display element is sealed, and a module in which an IC or the like including a controller is mounted on the panel.

The display device described below refers to an image display device or a light source (including a lighting device). The display device includes all connectors, for example, a module to which FPC and TCP are attached, a module having a printed wiring board at the end of TCP, or a module in which an IC (integrated circuit) is directly mounted on a display element by a COG method.

FIG. 45 illustrates an example of an EL display device according to one embodiment of the present invention. FIG. 45A shows a circuit diagram of a pixel of an EL display device. FIG. 45B is a top view showing the entire EL display device. FIG. 45C is an MN cross section corresponding to part of the dashed-dotted line MN in FIG.

FIG. 45A is an example of a circuit diagram of a pixel used in the EL display device.

Note that in this specification and the like, a person skilled in the art can connect all terminals of an active element (a transistor, a diode, etc.), a passive element (a capacitor element, a resistance element, etc.) without specifying connection destinations. Thus, it may be possible to constitute an aspect of the invention. That is, it can be said that one aspect of the invention is clear without specifying the connection destination. And, when the content specifying the connection destination is described in this specification etc., it is possible to determine that one aspect of the invention that does not specify the connection destination is described in this specification etc. There is. In particular, when a plurality of locations are assumed as the connection destination of the terminal, it is not necessary to limit the connection destination of the terminal to a specific location. Therefore, it is possible to constitute one embodiment of the present invention by specifying connection destinations of only some terminals of active elements (transistors, diodes, etc.) and passive elements (capacitance elements, resistance elements, etc.). There are cases.

Note that in this specification and the like, it may be possible for those skilled in the art to specify the invention when at least the connection portion of a circuit is specified. Alternatively, it may be possible for those skilled in the art to specify the invention when at least the function of a circuit is specified. That is, if the function is specified, it can be said that one aspect of the invention is clear. Then, it may be possible to determine that one embodiment of the invention whose function is specified is described in this specification and the like. Therefore, if a connection destination is specified for a certain circuit without specifying a function, the circuit is disclosed as one embodiment of the invention, and can constitute one embodiment of the invention. Alternatively, if a function is specified for a certain circuit without specifying a connection destination, the circuit is disclosed as one embodiment of the invention, and can constitute one embodiment of the invention.

An EL display device illustrated in FIG. 45A includes a switch element 743, a transistor 741, a capacitor 742, and a light-emitting element 719.

Note that FIG. 45A is an example of a circuit configuration, and thus a transistor can be further added. On the other hand, it is also possible not to add a transistor, a switch, a passive element, or the like at each node in FIG.

A gate of the transistor 741 is electrically connected to one end of the switch element 743 and one electrode of the capacitor 742. A source of the transistor 741 is electrically connected to the other electrode of the capacitor 742 and electrically connected to one electrode of the light-emitting element 719. The source of the transistor 741 is supplied with the power supply potential VDD. The other end of the switch element 743 is electrically connected to the signal line 744. A constant potential is applied to the other electrode of the light-emitting element 719. Note that the constant potential is set to the ground potential GND or lower.

As the switch element 743, a transistor is preferably used. By using a transistor, the area of a pixel can be reduced and an EL display device with high resolution can be obtained. In addition, when a transistor manufactured through the same process as the transistor 741 is used as the switch element 743, the productivity of the EL display device can be increased. Note that as the transistor 741 and / or the switch element 743, for example, the transistor illustrated in FIG. 1 can be used.

FIG. 45B is a top view of the EL display device. The EL display device includes a substrate 700, a substrate 750, a sealant 734, a driver circuit 735, a driver circuit 736, a pixel 737, and an FPC 732. The sealant 734 is disposed between the substrate 700 and the substrate 750 so as to surround the pixel 737, the drive circuit 735, and the drive circuit 736. Note that the drive circuit 735 and / or the drive circuit 736 may be disposed outside the sealant 734.

FIG. 45C is a cross-sectional view of the EL display device corresponding to part of the dashed-dotted line MN in FIG.

FIG. 45C illustrates a region where the transistor 741 includes an insulator 712a over a substrate 700 and a conductor 704a, and is over the insulator 712a and the conductor 704a and partially overlaps with the conductor 704a. An insulator 706a, a semiconductor 706b over the insulator 706a, an insulator 710, an insulator 706c over the semiconductor 706b, an insulator 718b over the insulator 706c, and a conductor over the insulator 718b and overlapping with the semiconductor 706b. A structure having a body 714a. Note that the structure of the transistor 741 is an example, and a structure different from the structure illustrated in FIG.

In the transistor 741 illustrated in FIG. 45C, the conductor 704a functions as a gate electrode, the insulator 712a functions as a gate insulator, and the insulator 718b functions as a gate insulator. The conductor 714a functions as a gate electrode. Note that the electrical characteristics of the insulator 706a, the semiconductor 706b, and the insulator 706c may fluctuate when exposed to light. Therefore, it is preferable that at least one of the conductor 704a and the conductor 714a have a light-shielding property.

45C, the capacitor 742 includes an insulator 706d which is over the conductor 704b and partially overlaps with the conductor 704b; a semiconductor 706e over the insulator 706d; an insulator 710; A structure including an insulator 706f over 706e, an insulator 718b over the insulator 706f, and a conductor 714b over the insulator 718b and overlapping with the semiconductor 706e is shown.

In the capacitor 742, the conductor 704b functions as one electrode and the conductor 714b functions as the other electrode.

The capacitor 742 can be manufactured using a film in common with the transistor 741. The conductors 704a and 704b are preferably the same kind of conductors. In that case, the conductor 704a and the conductor 704b can be formed through the same process. The conductors 714a and 714b are preferably the same kind of conductors. In that case, the conductor 714a and the conductor 714b can be formed through the same process.

A capacitor 742 illustrated in FIG. 45C has a large capacitance per occupied area. Accordingly, FIG. 45C illustrates an EL display device with high display quality. Note that the structure of the capacitor 742 is merely an example, and a structure different from the structure illustrated in FIG.

An insulator 720 is provided over the transistor 741 and the capacitor 742. Here, the insulator 720 may have an opening reaching the low resistance region of the semiconductor 706b functioning as a source region or a drain region of the transistor 741. A conductor 781 is provided over the insulator 720. The conductor 781 may be electrically connected to the transistor 741 through the opening of the insulator 720.

A partition 784 having an opening reaching the conductor 781 is provided over the conductor 781. A light-emitting layer 782 that is in contact with the conductor 781 through the opening of the partition 784 is provided over the partition 784. A conductor 783 is provided over the light-emitting layer 782. A region where the conductor 781, the light emitting layer 782, and the conductor 783 overlap with each other serves as the light emitting element 719.

Up to this point, an example of an EL display device has been described. Next, an example of a liquid crystal display device will be described.

FIG. 46A is a circuit diagram illustrating a structural example of a pixel of a liquid crystal display device. A pixel illustrated in FIG. 46A includes a transistor 751, a capacitor 752, and an element (liquid crystal element) 753 in which liquid crystal is filled between a pair of electrodes.

In the transistor 751, one of a source and a drain is electrically connected to the signal line 755 and a gate is electrically connected to the scanning line 754.

In the capacitor 752, one electrode is electrically connected to the other of the source and the drain of the transistor 751, and the other electrode is electrically connected to a wiring for supplying a common potential.

In the liquid crystal element 753, one electrode is electrically connected to the other of the source and the drain of the transistor 751, and the other electrode is electrically connected to a wiring for supplying a common potential. Note that the common potential applied to the wiring to which the other electrode of the capacitor 752 is electrically connected may be different from the common potential applied to the other electrode of the liquid crystal element 753.

Note that the top view of the liquid crystal display device is the same as that of the EL display device. A cross-sectional view of the liquid crystal display device corresponding to the dashed-dotted line MN in FIG. 45B is illustrated in FIG. In FIG. 46B, the FPC 732 is connected to a wiring 733a through a terminal 731. Note that the wiring 733a may be formed using the same kind of conductor or semiconductor as the conductor or semiconductor included in the transistor 751.

The description of the transistor 741 is referred to for the transistor 751. For the capacitor 752, the description of the capacitor 742 is referred to. Note that FIG. 46B illustrates a structure of the capacitor 752 corresponding to the capacitor 742 in FIG. 46C; however, the structure is not limited thereto.

Note that in the case where an oxide semiconductor is used for the semiconductor of the transistor 751, a transistor with extremely low off-state current can be obtained. Therefore, the charge held in the capacitor 752 is unlikely to leak, and the voltage applied to the liquid crystal element 753 can be maintained for a long time. Therefore, when a moving image or a still image with little movement is displayed, the transistor 751 is turned off, so that power for the operation of the transistor 751 is not necessary and a liquid crystal display device with low power consumption can be obtained. In addition, since the area occupied by the capacitor 752 can be reduced, a liquid crystal display device with a high aperture ratio or a liquid crystal display device with high definition can be provided.

An insulator 721 is provided over the transistor 751 and the capacitor 752. Here, the insulator 721 has an opening reaching the transistor 751. A conductor 791 is provided over the insulator 721. The conductor 791 is electrically connected to the transistor 751 through the opening of the insulator 721.

An insulator 792 functioning as an alignment film is provided over the conductor 791. A liquid crystal layer 793 is provided over the insulator 792. An insulator 794 functioning as an alignment film is provided over the liquid crystal layer 793. A spacer 795 is provided over the insulator 794. A conductor 796 is provided over the spacer 795 and the insulator 794. A substrate 797 is provided over the conductor 796.

With the above structure, a display device including a capacitor with a small occupied area can be provided, or a display device with high display quality can be provided. Alternatively, a high-definition display device can be provided.

For example, in this specification and the like, a display element, a display device that is a device including a display element, a light-emitting element, and a light-emitting device that is a device including a light-emitting element have various forms or have various elements. Can do. Examples of display elements, display devices, light-emitting elements, or light-emitting devices include white, red, green, and blue light-emitting diodes (LEDs), transistors (transistors that emit light in response to current), electron-emitting devices, Liquid crystal element, electronic ink, electrophoretic element, grating light valve (GLV), plasma display (PDP), display element using MEMS (micro electro mechanical system), digital micromirror device (DMD), DMS (digital)・ Micro shutter), IMOD (interference modulation) element, shutter type MEMS display element, optical interference type MEMS display element, electrowetting element, piezoelectric ceramic display, carbo At least one of display elements using carbon nanotubes. In addition to these, a display medium in which contrast, luminance, reflectance, transmittance, or the like is changed by an electric or magnetic action may be included.

An example of a display device using an EL element is an EL display. As an example of a display device using an electron-emitting device, there is a field emission display (FED), a SED type flat display (SED: Surface-Conduction Electron-Emitter Display), or the like. As an example of a display device using a liquid crystal element, there is a liquid crystal display (a transmissive liquid crystal display, a transflective liquid crystal display, a reflective liquid crystal display, a direct view liquid crystal display, a projection liquid crystal display) and the like. An example of a display device using electronic ink or an electrophoretic element is electronic paper. Note that in the case of realizing a transflective liquid crystal display or a reflective liquid crystal display, part or all of the pixel electrode may have a function as a reflective electrode. For example, part or all of the pixel electrode may have aluminum, silver, or the like. Further, in that case, a memory circuit such as an SRAM can be provided under the reflective electrode. Thereby, power consumption can be further reduced.

In addition, when using LED, you may arrange | position graphene or graphite under the electrode and nitride semiconductor of LED. Graphene or graphite may be a multilayer film in which a plurality of layers are stacked. Thus, by providing graphene or graphite, a nitride semiconductor such as an n-type GaN semiconductor having a crystal can be easily formed thereon. Furthermore, a p-type GaN semiconductor having a crystal or the like can be provided thereon to form an LED. Note that an AlN layer may be provided between graphene or graphite and an n-type GaN semiconductor having a crystal. Note that the GaN semiconductor included in the LED may be formed by MOCVD. However, by providing graphene, the GaN semiconductor included in the LED can be formed by a sputtering method.

For example, in this specification and the like, a transistor can be formed using various substrates. The kind of board | substrate is not limited to a specific thing. Examples of the substrate include a semiconductor substrate (for example, a single crystal substrate or a silicon substrate), an SOI substrate, a glass substrate, a quartz substrate, a plastic substrate, a sapphire glass substrate, a metal substrate, a stainless steel substrate, and a stainless steel foil. There are a substrate, a tungsten substrate, a substrate having a tungsten foil, a flexible substrate, a bonded film, a paper containing a fibrous material, a base film, and the like. Examples of the glass substrate include barium borosilicate glass, aluminoborosilicate glass, and soda lime glass. Examples of the flexible substrate, the laminated film, and the base film include the following. For example, there are plastics represented by polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), and polytetrafluoroethylene (PTFE). Another example is a synthetic resin such as acrylic. Alternatively, examples include polypropylene, polyester, polyvinyl fluoride, and polyvinyl chloride. As an example, there are polyamide, polyimide, aramid, epoxy, an inorganic vapor deposition film, papers, and the like. In particular, by manufacturing a transistor using a semiconductor substrate, a single crystal substrate, an SOI substrate, or the like, a transistor with small variation in characteristics, size, or shape, high current capability, and small size can be manufactured. . When a circuit is formed using such transistors, the power consumption of the circuit can be reduced or the circuit can be highly integrated.

Alternatively, a flexible substrate may be used as the substrate, and the transistor may be formed directly over the flexible substrate. Alternatively, a separation layer may be provided between the substrate and the transistor. The separation layer can be used to separate a semiconductor device from another substrate and transfer it to another substrate after a semiconductor device is partially or entirely completed thereon. At that time, the transistor can be transferred to a substrate having poor heat resistance or a flexible substrate. Note that, for example, a structure of a laminated structure of an inorganic film of a tungsten film and a silicon oxide film or a structure in which an organic resin film such as polyimide is formed over a substrate can be used for the above-described release layer.

That is, a transistor may be formed using a certain substrate, and then the transistor may be transferred to another substrate, and the transistor may be disposed on another substrate. Examples of a substrate to which a transistor is transferred include a paper substrate, a cellophane substrate, an aramid film substrate, a polyimide film substrate, a stone substrate, a wood substrate, a cloth substrate (natural fiber) in addition to the above-described substrate capable of forming a transistor. (Silk, cotton, hemp), synthetic fibers (including nylon, polyurethane, polyester) or recycled fibers (including acetate, cupra, rayon, recycled polyester), leather substrates, rubber substrates, and the like. By using these substrates, it is possible to form a transistor with good characteristics, a transistor with low power consumption, manufacture a device that is not easily broken, impart heat resistance, reduce weight, or reduce thickness.

Note that this embodiment can be combined with any of the other embodiments and examples in this specification as appropriate.

(Embodiment 11)
In this embodiment, a display module to which the semiconductor device of one embodiment of the present invention is applied will be described with reference to FIGS.

<Display module>
A display module 6000 shown in FIG. 47 includes a touch panel 6004 connected to the FPC 6003, a display panel 6006 connected to the FPC 6005, a backlight unit 6007, a frame 6009, a printed circuit board 6010, between the upper cover 6001 and the lower cover 6002. A battery 6011 is included. Note that the backlight unit 6007, the battery 6011, the touch panel 6004, and the like may not be provided.

The semiconductor device of one embodiment of the present invention can be used for, for example, the display panel 6006 or an integrated circuit mounted on a printed board.

The shapes and dimensions of the upper cover 6001 and the lower cover 6002 can be changed as appropriate in accordance with the sizes of the touch panel 6004 and the display panel 6006.

As the touch panel 6004, a resistive touch panel or a capacitive touch panel can be used by being superimposed on the display panel 6006. Further, the counter substrate (sealing substrate) of the display panel 6006 can have a touch panel function. Alternatively, an optical sensor can be provided in each pixel of the display panel 6006 and an optical touch panel function can be added. Alternatively, a touch sensor electrode may be provided in each pixel of the display panel 6006 to add a capacitive touch panel function.

The backlight unit 6007 has a light source 6008. The light source 6008 may be provided at the end of the backlight unit 6007 and a light diffusing plate may be used.

The frame 6009 has a function as an electromagnetic shield for blocking electromagnetic waves generated from the printed board 6010 in addition to a protective function of the display panel 6006. The frame 6009 may function as a heat sink.

The printed board 6010 includes a power supply circuit, a signal processing circuit for outputting a video signal and a clock signal. As a power source for supplying power to the power circuit, an external commercial power source or a battery 6011 provided separately may be used. Note that the battery 6011 can be omitted when a commercial power source is used.

Further, the display module 6000 may be additionally provided with a member such as a polarizing plate, a retardation plate, and a prism sheet.

Note that this embodiment can be combined with any of the other embodiments and examples in this specification as appropriate.

(Embodiment 12)
<Package using lead frame type interposer>
FIG. 48A is a perspective view showing a cross-sectional structure of a package using a lead frame type interposer. In the package illustrated in FIG. 48A, a chip 551 corresponding to a semiconductor device according to one embodiment of the present invention is connected to a terminal 552 over the interposer 550 by a wire bonding method. The terminal 552 is disposed on the surface on which the chip 551 of the interposer 550 is mounted. The chip 551 may be sealed with a mold resin 553, but is sealed with a part of each terminal 552 exposed.

FIG. 48B shows the structure of a module of an electronic device (mobile phone) in which a package is mounted on a circuit board. In the mobile phone module illustrated in FIG. 48B, a package 602 and a battery 604 are mounted on a printed wiring board 601. In addition, a printed wiring board 601 is mounted by an FPC 603 on a panel 600 provided with a display element.

Note that this embodiment can be combined with any of the other embodiments and examples in this specification as appropriate.

(Embodiment 13)
In this embodiment, an electronic device and a lighting device of one embodiment of the present invention will be described with reference to drawings.

<Electronic equipment>
An electronic device or a lighting device can be manufactured using the semiconductor device of one embodiment of the present invention. A highly reliable electronic device or lighting device can be manufactured using the semiconductor device of one embodiment of the present invention. Further, an electronic device or a lighting device with improved detection sensitivity of a touch sensor can be manufactured using the semiconductor device of one embodiment of the present invention.

Examples of the electronic device include a television device (also referred to as a television or a television receiver), a monitor for a computer, a digital camera, a digital video camera, a digital photo frame, a mobile phone (also referred to as a mobile phone or a mobile phone device). ), Large game machines such as portable game machines, portable information terminals, sound reproducing devices, and pachinko machines.

In the case where the electronic device or the lighting device of one embodiment of the present invention has flexibility, it can be incorporated along an inner wall or an outer wall of a house or a building, or a curved surface of an interior or exterior of an automobile.

The electronic device of one embodiment of the present invention may include a secondary battery, and it is preferable that the secondary battery can be charged using non-contact power transmission.

Secondary batteries include, for example, lithium ion secondary batteries such as lithium polymer batteries (lithium ion polymer batteries) using a gel electrolyte, lithium ion batteries, nickel metal hydride batteries, nickel-cadmium batteries, organic radical batteries, lead storage batteries, air batteries A secondary battery, a nickel zinc battery, a silver zinc battery, etc. are mentioned.

The electronic device of one embodiment of the present invention may include an antenna. By receiving a signal with an antenna, video, information, and the like can be displayed on the display unit. Further, when the electronic device has a secondary battery, the antenna may be used for non-contact power transmission.

FIG. 49A illustrates a portable game machine including a housing 7101, a housing 7102, a display portion 7103, a display portion 7104, a microphone 7105, speakers 7106, operation keys 7107, a stylus 7108, and the like. The semiconductor device according to one embodiment of the present invention can be used for an integrated circuit, a CPU, or the like incorporated in the housing 7101. With the use of the light-emitting device according to one embodiment of the present invention for the display portion 7103 or the display portion 7104, a portable game machine that has an excellent usability and is unlikely to deteriorate in quality can be provided. Note that the portable game machine illustrated in FIG. 49A includes two display portions 7103 and 7104; however, the number of display portions included in the portable game device is not limited thereto.

FIG. 49B illustrates a smart watch, which includes a housing 7302, a display portion 7304, operation buttons 7311 and 7312, a connection terminal 7313, a band 7321, a clasp 7322, and the like. The semiconductor device according to one embodiment of the present invention can be used for a memory, a CPU, or the like incorporated in the housing 7302.

FIG. 49C illustrates a portable information terminal which includes an operation button 7503, an external connection port 7504, a speaker 7505, a microphone 7506, a display portion 7502, and the like in addition to a display portion 7502 incorporated in a housing 7501. The semiconductor device according to one embodiment of the present invention can be used for a mobile memory, a CPU, or the like incorporated in the housing 7501. Note that since the display portion 7502 can have very high definition, the display portion 7502 can perform various displays such as full high-definition, 4k, or 8k while being small and medium, and can obtain a very clear image. it can.

FIG. 49D illustrates a video camera, which includes a first housing 7701, a second housing 7702, a display portion 7703, operation keys 7704, a lens 7705, a connection portion 7706, and the like. The operation key 7704 and the lens 7705 are provided in the first housing 7701, and the display portion 7703 is provided in the second housing 7702. The first housing 7701 and the second housing 7702 are connected by a connection portion 7706, and the angle between the first housing 7701 and the second housing 7702 can be changed by the connection portion 7706. is there. The video on the display portion 7703 may be switched in accordance with the angle between the first housing 7701 and the second housing 7702 in the connection portion 7706. The imaging device of one embodiment of the present invention can be provided at a position where the lens 7705 is focused. The semiconductor device according to one embodiment of the present invention can be used for an integrated circuit, a CPU, or the like incorporated in the first housing 7701.

FIG. 49E illustrates digital signage, which includes a display portion 7902 installed on a utility pole 7901. The display device according to one embodiment of the present invention can be used for the control circuit of the display portion 7902.

FIG. 50A illustrates a laptop personal computer, which includes a housing 8121, a display portion 8122, a keyboard 8123, a pointing device 8124, and the like. The semiconductor device according to one embodiment of the present invention can be applied to a CPU or a memory built in the housing 8121. Note that since the display portion 8122 can have very high definition, the display portion 8122 can display 8k while being small and medium-sized, and a very clear image can be obtained.

FIG. 50B illustrates the appearance of the automobile 9700. FIG. 50C illustrates a driver seat of the automobile 9700. The automobile 9700 includes a vehicle body 9701, wheels 9702, a dashboard 9703, lights 9704, and the like. The semiconductor device of one embodiment of the present invention can be used for a display portion of the automobile 9700 and an integrated circuit for control. For example, the semiconductor of one embodiment of the present invention can be provided in the display portion 9710 to the display portion 9715 illustrated in FIG.

The display portion 9710 and the display portion 9711 are display devices or input / output devices provided on a windshield of an automobile. A display device or an input / output device of one embodiment of the present invention is a so-called see-through state in which an electrode of the display device or the input / output device is made of a light-transmitting conductive material so that the opposite side can be seen through. Display devices or input / output devices. If the display device or the input / output device is in a see-through state, the view is not hindered even when the automobile 9700 is driven. Thus, the display device or the input / output device of one embodiment of the present invention can be provided on the windshield of the automobile 9700. Note that in the case where a transistor for driving the display device or the input / output device is provided in the display device or the input / output device, an organic transistor using an organic semiconductor material, a transistor using an oxide semiconductor, or the like, A transistor having a light-transmitting property may be used.

A display portion 9712 is a display device provided in the pillar portion. For example, the field of view blocked by the pillar can be complemented by displaying an image from the imaging means provided on the vehicle body on the display portion 9712. A display portion 9713 is a display device provided in the dashboard portion. For example, by displaying an image from an imaging unit provided on the vehicle body on the display portion 9713, the view blocked by the dashboard can be complemented. That is, by projecting an image from the imaging means provided outside the automobile, the blind spot can be compensated and safety can be improved. Also, by displaying a video that complements the invisible part, it is possible to confirm the safety more naturally and without a sense of incongruity.

FIG. 50D shows the interior of an automobile in which bench seats are used for the driver seat and the passenger seat. The display portion 9721 is a display device or an input / output device provided in the door portion. For example, the field of view blocked by the door can be complemented by displaying an image from an imaging unit provided on the vehicle body on the display portion 9721. The display portion 9722 is a display device provided on the handle. The display unit 9723 is a display device provided at the center of the seat surface of the bench seat. Note that the display device can be installed on a seating surface or a backrest portion, and the display device can be used as a seat heater using heat generated by the display device as a heat source.

The display portion 9714, the display portion 9715, or the display portion 9722 can provide various other information such as navigation information, a speedometer and a tachometer, a travel distance, an oil supply amount, a gear state, and an air conditioner setting. In addition, display items, layouts, and the like displayed on the display unit can be changed as appropriate according to the user's preference. Note that the above information can also be displayed on the display portion 9710 to the display portion 9713, the display portion 9721, and the display portion 9723. The display portions 9710 to 9715 and the display portions 9721 to 9723 can also be used as lighting devices. The display portions 9710 to 9715 and the display portions 9721 to 9723 can also be used as heating devices.

FIG. 51A shows the appearance of the camera 8000. FIG. A camera 8000 includes a housing 8001, a display portion 8002, operation buttons 8003, a shutter button 8004, a coupling portion 8005, and the like. A lens 8006 can be attached to the camera 8000.

The coupling portion 8005 includes electrodes, and can connect a strobe device or the like in addition to a finder 8100 described later.

Here, the camera 8000 is configured such that the lens 8006 can be removed from the housing 8001 and replaced, but the lens 8006 and the housing may be integrated.

An image can be taken by pressing a shutter button 8004. In addition, the display portion 8002 has a function as a touch panel and can capture an image by touching the display portion 8002.

The display device or the input / output device of one embodiment of the present invention can be applied to the display portion 8002.

FIG. 51B shows an example in which a finder 8100 is attached to a camera 8000.

The viewfinder 8100 includes a housing 8101, a display portion 8102, a button 8103, and the like.

The housing 8101 includes a coupling portion that engages with the coupling portion 8005 of the camera 8000, and the finder 8100 can be attached to the camera 8000. In addition, the coupling portion includes an electrode, and an image received from the camera 8000 via the electrode can be displayed on the display portion 8102.

The button 8103 has a function as a power button. A button 8103 can be used to switch display on the display portion 8102 on and off.

The semiconductor device of one embodiment of the present invention can be applied to an integrated circuit or an image sensor in the housing 8101.

51A and 51B, the camera 8000 and the viewfinder 8100 are separate electronic devices and can be attached and detached. However, a display of one embodiment of the present invention is displayed on the housing 8001 of the camera 8000. A finder provided with a device or an input / output device may be incorporated.

FIG. 51C shows the appearance of the head mounted display 8200.

The head mounted display 8200 includes a mounting portion 8201, a lens 8202, a main body 8203, a display portion 8204, a cable 8205, and the like. In addition, a battery 8206 is built in the mounting portion 8201.

A cable 8205 supplies power from the battery 8206 to the main body 8203. The main body 8203 includes a wireless receiver and the like, and can display video information such as received image data on the display portion 8204. In addition, it is possible to use the user's viewpoint as an input unit by capturing the movement of the user's eyeball or eyelid with a camera provided in the main body 8203 and calculating the coordinates of the user's viewpoint based on the information. it can.

In addition, the mounting portion 8201 may be provided with a plurality of electrodes at a position where the user touches the user. The main body 8203 may have a function of recognizing the user's viewpoint by detecting a current flowing through the electrode in accordance with the movement of the user's eyeball. Moreover, you may have a function which monitors a user's pulse by detecting the electric current which flows into the said electrode. The mounting portion 8201 may have various sensors such as a temperature sensor, a pressure sensor, and an acceleration sensor, and may have a function of displaying the user's biological information on the display portion 8204. Further, the movement of the user's head or the like may be detected, and the video displayed on the display unit 8204 may be changed in accordance with the movement.

The semiconductor device of one embodiment of the present invention can be applied to the integrated circuit in the main body 8203.

This embodiment can be implemented in appropriate combination with at least part of the other embodiments described in this specification.

(Embodiment 14)
In this embodiment, an example of using an RF tag using a semiconductor device according to one embodiment of the present invention will be described with reference to FIGS.

<Usage example of RF tag>
Applications of RF tags are wide-ranging. For example, banknotes, coins, securities, bearer bonds, certificate documents (driver's license, resident's card, etc., see FIG. 52A), vehicles (bicycles, FIG. 52, etc.) (See (B)), packaging containers (wrapping paper, bottles, etc., see FIG. 52 (C)), recording media (DVDs, video tapes and other personal items (such as bags and glasses, see FIG. 52 (D)), food , Plants, animals, human bodies, clothing, daily necessities, medical products including medicines and drugs, or articles such as electronic devices (liquid crystal display devices, EL display devices, television devices, or mobile phones), or each It can be used by being provided on a tag attached to an article (see FIGS. 52E and 52F) or the like.

The RF tag 4000 according to one embodiment of the present invention is fixed to an article by being attached to the surface or embedded. For example, a book is embedded in paper, and a package made of an organic resin is embedded in the organic resin and fixed to each article. The RF tag 4000 according to one embodiment of the present invention achieves small size, thinness, and light weight, and thus does not impair the design of the article itself even after being fixed to the article. In addition, by providing the RF tag 4000 according to one embodiment of the present invention to bills, coins, securities, bearer bonds, or certificates, etc., an authentication function can be provided. Counterfeiting can be prevented. In addition, by attaching the RF tag according to one embodiment of the present invention to packaging containers, recording media, personal items, foods, clothing, daily necessities, electronic devices, etc., the efficiency of a system such as an inspection system can be improved. Can be planned. Even in the case of vehicles, the security against theft or the like can be improved by attaching the RF tag according to one embodiment of the present invention.

As described above, operating power including writing and reading of information can be reduced by using an RF tag including a semiconductor device according to one embodiment of the present invention for each application described in this embodiment. It is possible to increase the communication distance. In addition, since the information can be held for a very long period even when the power is cut off, it can be suitably used for applications where the frequency of writing and reading is low.

Note that this embodiment can be combined with any of the other embodiments and examples in this specification as appropriate.

200 imaging device 201 switch 202 switch 203 switch 210 pixel unit 211 pixel 212 subpixel 212B subpixel 212G subpixel 212R subpixel 220 photoelectric conversion element 230 pixel circuit 231 wiring 247 wiring 248 wiring 249 wiring 250 wiring 253 wiring 254 filter 254B filter 254G Filter 254R Filter 255 Lens 256 Light 257 Wiring 260 Peripheral circuit 270 Peripheral circuit 280 Peripheral circuit 290 Peripheral circuit 291 Light source 300 Silicon substrate 305 Layer 320 Layer 330 Transistor 331 Layer 340 Layer 351 Transistor 352 Transistor 353 Transistor 354 Transistor 360 Photodiode 361 Anode 362 Cathode 363 Low resistance region 365 Photodiode 366 Semiconductor layer 367 Semiconductor Layer 368 semiconductor layer 370 plug 371 wiring 372 wiring 373 wiring 374 wiring 380 insulator 400 substrate 401 insulator 402 insulator 404 conductor 406a insulator 406b semiconductor 406c insulator 406d insulator 410 insulator 411 insulator 412 insulator 413 conductor Body 416a1 conductor 416a2 conductor 416a3 conductor 418a1 conductor 418a2 conductor 418a3 conductor 421 insulator 450 semiconductor substrate 454 conductor 460 region 462 insulator 464 insulator 465 insulator 466 insulator 467 insulator 469 insulator 469 insulator Body 470 Insulator 472 Insulator 474a Region 474b Region 475 Insulator 476a Conductor 476b Conductor 476c Conductor 477a Conductor 477b Conductor 477c Conductor 478a Conductor 478b Conductor 78c conductor 479a conductor 479b conductor 479c conductor 480a conductor 480b conductor 480c conductor 483a conductor 483b conductor 483c conductor 483d conductor 484a conductor 484b conductor 484c conductor 484d conductor 485a conductor 485a Conductor 485c conductor 485d conductor 487a conductor 487b conductor 487c conductor 488a conductor 488b conductor 488c conductor 489a conductor 489b conductor 490a conductor 490b conductor 491a conductor 491b conductor 492b conductor 492b conductor 492b Conductor 492c Conductor 494 Conductor 496 Conductor 498 Insulator 550 Interposer 551 Chip 552 Terminal 553 Mold resin 600 Panel 601 Printed wiring board 602 Package 6 03 FPC
604 battery 700 substrate 704a conductor 704b conductor 706a insulator 706b semiconductor 706c insulator 706d insulator 706e semiconductor 706f insulator 710 insulator 712a insulator 714a conductor 714b conductor 718b insulator 719 light-emitting element 720 insulator 721 insulator 731 Terminal 732 FPC
733a wiring 734 sealant 735 drive circuit 736 drive circuit 737 pixel 741 transistor 742 capacitor element 743 switch element 744 signal line 750 substrate 751 transistor 752 capacitor element 753 liquid crystal element 754 scan line 755 signal line 781 conductor 782 light emitting layer 783 conductor 784 Partition 791 Conductor 792 Insulator 793 Liquid crystal layer 794 Insulator 795 Spacer 796 Conductor 797 Substrate 800 RF tag 801 Communication device 802 Antenna 803 Radio signal 804 Antenna 805 Rectifier circuit 806 Constant voltage circuit 807 Demodulator circuit 808 Modulator circuit 809 Logic circuit 810 Memory circuit 811 ROM
1189 ROM interface 1190 board 1191 ALU
1192 ALU Controller 1193 Instruction Decoder 1194 Interrupt Controller 1195 Timing Controller 1196 Register 1197 Register Controller 1198 Bus Interface 1199 ROM
1200 memory element 1201 circuit 1202 circuit 1203 switch 1204 switch 1206 logic element 1207 capacitor element 1208 capacitor element 1209 transistor 1210 transistor 1213 transistor 1214 transistor 1220 circuit 2100 transistor 2200 transistor 2201 insulator 2202 wiring 2203 plug 2204 insulator 2205 wiring 2207 insulator 2208 Insulator 2211 Semiconductor substrate 2212 Insulator 2213 Gate electrode 2214 Gate insulator 2215 Source region and drain region 3001 Wiring 3002 Wiring 3003 Wiring 3004 Wiring 3005 Wiring 3200 Transistor 3300 Transistor 3400 Capacitance element 4000 RF tag 6000 Display module 6001 Upper cover 6002 Lower cover 6003 FPC
6004 Touch panel 6005 FPC
6006 Display panel 6007 Backlight unit 6008 Light source 6009 Frame 6010 Printed circuit board 6011 Battery 7101 Case 7102 Case 7103 Display portion 7104 Display portion 7105 Microphone 7106 Speaker 7107 Operation key 7108 Stylus 7302 Case 7304 Display portion 7311 Operation button 7312 Operation button 7313 Connection terminal 7321 Band 7322 Clasp 7501 Case 7502 Display unit 7503 Operation button 7504 External connection port 7505 Speaker 7506 Microphone 7701 Case 7702 Case 7703 Display unit 7704 Operation key 7705 Lens 7706 Connection unit 7901 Power pole 7902 Display unit 8000 Camera 8001 Case Body 8002 Display unit 8003 Operation button 8004 Shutter button 8005 Coupling unit 006 Lens 8100 Viewfinder 8101 Case 8102 Display unit 8103 Button 8121 Case 8122 Display unit 8123 Keyboard 8124 Pointing device 8200 Head mounted display 8201 Mounting unit 8202 Lens 8203 Body 8204 Display unit 8205 Cable 8206 Battery 9700 Car 9701 Car body 9702 Wheel 9703 Dashboard 9704 Light 9710 Display unit 9711 Display unit 9712 Display unit 9713 Display unit 9714 Display unit 9715 Display unit 9721 Display unit 9722 Display unit 9723 Display unit

Claims (18)

A first insulator on the substrate;
A second insulator on the first insulator;
A semiconductor on the second insulator;
A third insulator on the semiconductor;
A fourth insulator on the third insulator;
A conductor on the fourth insulator;
A fifth insulator on the first insulator and the semiconductor;
The semiconductor has a first region, a second region, and a third region,
The first region has a region overlapping the conductor via the third insulator and the fourth insulator,
The second region has a region in contact with the fifth insulator;
The third region has a region in contact with the fifth insulator;
The fourth insulator has a region in contact with a bottom surface of the conductor, and a region in contact with a side surface of the conductor,
The semiconductor device, wherein the fifth insulator includes at least one element of nitrogen or hydrogen. A first insulator on the substrate;
A second insulator on the first insulator;
A semiconductor on the second insulator;
A third insulator on the semiconductor;
A fourth insulator on the third insulator;
A conductor on the fourth insulator;
A fifth insulator on the first insulator and the semiconductor;
The semiconductor has a first region, a second region, and a third region,
The first region has a region overlapping the conductor via the third insulator and the fourth insulator,
The second region has a region overlapping with the fifth insulator through the third insulator,
The third region has a region overlapping with the fifth insulator through the third insulator,
The fourth insulator has a region in contact with a bottom surface of the conductor, and a region in contact with a side surface of the conductor,
The semiconductor device, wherein the fifth insulator includes at least one element of nitrogen or hydrogen. In claim 1 or claim 2,
The semiconductor device according to claim 5, wherein the fifth insulator has a region where the nitrogen concentration is 40 atomic% or more and 60 atomic% or less. In any one of Claims 1 thru | or 3,
The semiconductor device according to claim 5, wherein the fifth insulator includes a region having a hydrogen concentration of 1 atomic% or more and 30 atomic% or less. In any one of Claims 1 thru | or 4,
The semiconductor device, wherein the second insulator and the third insulator include at least one of elements other than oxygen included in the semiconductor. Depositing a first insulator on the substrate;
Depositing a second insulator on the first insulator;
Depositing a semiconductor on the second insulator;
Etching the second insulator and a part of the semiconductor to form a multilayer film including the second insulator and the semiconductor;
Forming a third insulator having at least one element of nitrogen or hydrogen on the multilayer film;
Forming an opening exposing a portion of the semiconductor in the third insulator;
Depositing a fourth insulator on the third insulator and the semiconductor;
Depositing a fifth insulator on the fourth insulator;
A method for manufacturing a semiconductor device, wherein a conductor is formed over the fifth insulator. In claim 6,
The method for manufacturing a semiconductor device, wherein the third insulator includes a region having a nitrogen concentration of 40 atomic% or more and 60 atomic% or less. In claim 6 or claim 7,
The method for manufacturing a semiconductor device, wherein the third insulator has a region where a hydrogen concentration is greater than or equal to 1 atomic% and less than or equal to 30 atomic%. Depositing a first insulator on the substrate;
Depositing a second insulator on the first insulator;
Depositing a semiconductor on the second insulator;
Etching the second insulator and a part of the semiconductor to form a multilayer film including the second insulator and the semiconductor;
Forming a third insulator on the multilayer film;
Forming an opening exposing a portion of the semiconductor in the third insulator;
Depositing a fourth insulator on the third insulator and the semiconductor;
Depositing a fifth insulator on the fourth insulator;
Depositing a conductor on the fifth insulator;
Etching the conductor, the fifth insulator, and the fourth insulator to expose a portion of the third insulator;
Etching the third insulator to expose a portion of the multilayer film;
A method for manufacturing a semiconductor device, comprising forming a sixth insulator containing at least one element of nitrogen or hydrogen over the multilayer film. In claim 9,
The method for manufacturing a semiconductor device is characterized in that the sixth insulator has a region where the nitrogen concentration is 40 atomic% or more and 60 atomic% or less. In claim 9 or claim 10,
The method for manufacturing a semiconductor device is characterized in that the sixth insulator has a region in which a hydrogen concentration is greater than or equal to 1 atomic% and less than or equal to 30 atomic%. In any one of Claims 6 to 11,
The method for manufacturing a semiconductor device, wherein the second insulator and the fourth insulator include at least one of elements other than oxygen included in the semiconductor. In any one of Claims 6 to 12,
The method for manufacturing a semiconductor device, wherein the fourth insulator is formed by a collimated sputtering method or a long throw sputtering method. Depositing a first insulator on the substrate;
Depositing a second insulator on the first insulator;
Depositing a semiconductor on the second insulator;
Etching the second insulator and a part of the semiconductor to form a multilayer film including the second insulator and the semiconductor;
Forming a third insulator on the multilayer film;
Depositing a fourth insulator on the third insulator;
Forming an opening in the fourth insulator to expose a part of the third insulator;
Depositing a fifth insulator on the third insulator;
Depositing a conductor on the fifth insulator;
Etching the conductor and the fifth insulator to expose a portion of the fourth insulator;
Etching the fourth insulator to expose a portion of the third insulator;
A method for manufacturing a semiconductor device, comprising forming a sixth insulator including at least one element of nitrogen or hydrogen over the third insulator. In claim 14,
The method for manufacturing a semiconductor device is characterized in that the sixth insulator has a region where the nitrogen concentration is 40 atomic% or more and 60 atomic% or less. In claim 14 or claim 15,
The method for manufacturing a semiconductor device is characterized in that the sixth insulator has a region in which a hydrogen concentration is greater than or equal to 1 atomic% and less than or equal to 30 atomic%. In any one of Claims 14 thru / or Claim 16,
The method for manufacturing a semiconductor device, wherein the second insulator and the third insulator include at least one of elements other than oxygen included in the semiconductor. In any one of Claims 14 thru / or Claim 17,
The third insulator is formed using a collimated sputtering method or a long throw sputtering method.