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Publication number
JP2016138030A5
JP2016138030A5 JP2015015569A JP2015015569A JP2016138030A5 JP 2016138030 A5 JP2016138030 A5 JP 2016138030A5 JP 2015015569 A JP2015015569 A JP 2015015569A JP 2015015569 A JP2015015569 A JP 2015015569A JP 2016138030 A5 JP2016138030 A5 JP 2016138030A5
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JP
Japan
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heating
metal
drying
core
melting point
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JP2015015569A
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Japanese (ja)
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JP6448394B2 (en
JP2016138030A (en
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Priority to JP2015015569A priority Critical patent/JP6448394B2/en
Priority claimed from JP2015015569A external-priority patent/JP6448394B2/en
Priority to DE102016000586.6A priority patent/DE102016000586A1/en
Publication of JP2016138030A publication Critical patent/JP2016138030A/en
Publication of JP2016138030A5 publication Critical patent/JP2016138030A5/ja
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鉄、アルミニウム、銅、ステンレス等の高融点金属を中子11として用いる場合には、接合部13’(接合材13)の加熱乾燥前に引き抜くことが可能だが、接合材13を加熱乾燥後に引き抜くことが好ましい。加熱乾燥後に金属製の中子11を引き抜くことは、引き抜き時に金属製の中子11により穴部14を傷つけることが少ないという利点を有する。なお、上記高融点金属とは、接合13の加熱乾燥温度では溶融しない、つまり、加熱乾燥温度よりも高い融点を有する金属を意味する。 When a high melting point metal such as iron, aluminum, copper, or stainless steel is used as the core 11, it can be pulled out before the joint 13 ′ (joining material 13) is heat-dried, but the joint material 13 is pulled out after the heat-drying. It is preferable. Pulling out the metal core 11 after heating and drying has the advantage that the hole 14 is less likely to be damaged by the metal core 11 when being pulled out. The refractory metal means a metal that does not melt at the heating and drying temperature of the bonding material 13, that is, has a melting point higher than the heating and drying temperature.

一方、ハンダ等の低融点金属を中子11として用いる場合には、他の熱可塑性材料(例えば、蝋)と同様に加熱乾燥時に溶解させて流出させることにより、容易に取り除くことが可能である。また、加熱溶解以外に、加熱乾燥の前に引き抜くことにより、当該中子11を取り除くことも可能である。なお、上記低融点金属とは、接合13の加熱乾燥温度で溶融する、つまり、加熱乾燥温度以下の融点を有する金属を意味する。 On the other hand, when a low-melting-point metal such as solder is used as the core 11, it can be easily removed by dissolving and flowing out at the time of heating and drying like other thermoplastic materials (for example, wax). . In addition to melting by heating, the core 11 can be removed by pulling out before heating and drying. The low melting point metal means a metal that melts at the heating and drying temperature of the bonding material 13, that is, has a melting point equal to or lower than the heating and drying temperature.

JP2015015569A 2015-01-29 2015-01-29 Manufacturing method of honeycomb structure Active JP6448394B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015015569A JP6448394B2 (en) 2015-01-29 2015-01-29 Manufacturing method of honeycomb structure
DE102016000586.6A DE102016000586A1 (en) 2015-01-29 2016-01-21 Process for producing a honeycomb structure and honeycomb structure produced by this production method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015015569A JP6448394B2 (en) 2015-01-29 2015-01-29 Manufacturing method of honeycomb structure

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018207965A Division JP6694934B2 (en) 2018-11-05 2018-11-05 Honeycomb structure

Publications (3)

Publication Number Publication Date
JP2016138030A JP2016138030A (en) 2016-08-04
JP2016138030A5 true JP2016138030A5 (en) 2018-01-25
JP6448394B2 JP6448394B2 (en) 2019-01-09

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JP2015015569A Active JP6448394B2 (en) 2015-01-29 2015-01-29 Manufacturing method of honeycomb structure

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JP (1) JP6448394B2 (en)
DE (1) DE102016000586A1 (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4382367B2 (en) 2003-01-14 2009-12-09 日本碍子株式会社 Method for joining ceramic honeycomb structures
CN100473628C (en) 2003-11-12 2009-04-01 揖斐电株式会社 Ceramic structure body, and method for producing the same
JP4890903B2 (en) 2006-03-28 2012-03-07 日本碍子株式会社 Honeycomb structure
JP5384148B2 (en) * 2008-03-21 2014-01-08 日本碍子株式会社 Honeycomb structure
JP5068207B2 (en) * 2008-03-25 2012-11-07 日本碍子株式会社 Honeycomb structure
JP5188435B2 (en) * 2009-03-26 2013-04-24 日本碍子株式会社 Honeycomb structure
JP6184776B2 (en) 2013-07-04 2017-08-23 ローム株式会社 Visible light communication system

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