JP2016119454A - Fluorescent material layer coated optical semiconductor element and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fluorescent material layer coated optical semiconductor element excellent in emission intensity and a manufacturing method of the same.SOLUTION: A fluorescent material layer encapsulated LED 1 includes: an LED 2; a fluorescent material layer 3, for coating the LED 2; and a transparent layer 4, for coating at least part of the fluorescent material layer 3.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a phosphor layer-coated optical semiconductor element and a method for manufacturing the same, and more particularly to a phosphor layer-coated optical semiconductor element and a method for manufacturing the same.

  2. Description of the Related Art Conventionally, a phosphor layer-covered optical semiconductor element has been proposed that includes an optical semiconductor element whose lower surface is exposed and a phosphor layer that covers the upper surface and side surfaces of the optical semiconductor element (see, for example, Patent Document 1).

JP 2012-39013 A

  However, the phosphor layer-coated optical semiconductor element is required to have excellent emission intensity. However, the phosphor layer-coated optical semiconductor element described in Patent Document 1 has a problem that it cannot satisfy the above-described emission intensity.

  An object of the present invention is to provide a phosphor layer-coated optical semiconductor element having excellent emission intensity and a method for producing the same.

  To achieve the above object, a phosphor layer-covered optical semiconductor element of the present invention includes an optical semiconductor element, a phosphor layer that covers the optical semiconductor element, and a transparent layer that covers at least a part of the phosphor layer. It is characterized by comprising.

  Since this phosphor layer-covered optical semiconductor element includes a transparent layer that covers at least a part of the phosphor layer, the emission intensity can be improved.

In the phosphor layer-coated optical semiconductor element of the present invention, the optical semiconductor element has an element-side contactable surface that can contact the substrate and a distance x on one side with respect to the element-side contactable surface. An element-side facing surface disposed opposite to each other, an element-side contactable surface, and an element-side coupling surface coupled to the element-side facing surface, and the phosphor layer is disposed on the element-side facing surface. A phosphor-side first opposing surface arranged to face the one side with a distance y and a phosphor-side second opposing surface arranged to face the element-side connecting surface with a distance α in a direction orthogonal to the one direction. The transparent layer is connected to the transparent side facing surface, the transparent side facing surface disposed opposite to the phosphor side first facing surface at a distance z from the one side, and the transparent side facing surface, When projected in one direction, the direction perpendicular to the element-side coupling surface And a transparent side connecting surface disposed at intervals in the,
It is preferable that all of the following (1) to (4) are satisfied.

  (1) A value (y / x) obtained by dividing the distance y by the distance x is 1 or more and 5 or less.

  (2) The sum (y + z) of the distance y and the distance z is not less than 0.25 mm and not more than 2 mm.

  (3) The sum (α + β) of the distance α and the distance β between the phosphor-side second facing surface and the transparent connecting surface is 50 μm or more and 2000 μm or less. However, the distance β is 0 or more.

  (4) A value (y / α) obtained by dividing the distance y by the distance α is 1 or more and 2.5 or less.

  Since this phosphor layer-coated optical semiconductor element satisfies all of the above (1) to (4), it has excellent color uniformity and further suppresses color unevenness while further improving the light emission intensity. be able to.

  In the phosphor layer-coated optical semiconductor element of the present invention, the phosphor layer contains a phosphor and a first transparent composition, and the refractive index RIp of the first transparent composition is 1. It is preferable that it is 45 or more and 1.60 or less.

  In this phosphor layer-coated optical semiconductor element, the refractive index RIp of the first transparent composition is 1.45 or more and 1.60 or less, so that the emission intensity can be improved.

  In the phosphor layer-coated optical semiconductor element of the present invention, the phosphor layer contains a phosphor and a first transparent composition, and the transparent layer contains a second transparent composition, A value obtained by subtracting the refractive index RIt of the second transparent composition from the refractive index RIp of the first transparent composition (RIp−RIt) is preferably −0.70 or more and 0.20 or less. is there.

  In this phosphor layer-coated optical semiconductor element, a value (RIp−RIt) obtained by subtracting the refractive index RIt of the second transparent composition from the refractive index RIp of the first transparent composition is −0.70 or more, and 0. Since it is 20 or less, the emission intensity can be improved.

  In the phosphor layer-coated optical semiconductor element of the present invention, it is preferable that the RIp−RIt is 0.05 or more.

  In this phosphor layer-coated optical semiconductor element, since RIp-RIt is 0.05 or more, the emission intensity can be further improved.

  In the phosphor layer-coated optical semiconductor element of the present invention, it is preferable that the phosphor-side second facing surface and the transparent-side coupling surface are formed flush with each other in the one direction.

  The phosphor-side second opposing surface and the transparent-side connecting surface can be formed on the phosphor layer and the transparent layer in the phosphor layer-coated optical semiconductor element by a simple method.

  In the phosphor layer-coated optical semiconductor element of the present invention, it is preferable that the distance α exceeds 50 μm.

  In this phosphor layer-coated optical semiconductor element, the distance α exceeds 50 μm, so that the color uniformity can be improved.

  The method for manufacturing a phosphor layer-covered optical semiconductor element of the present invention is a method for manufacturing the above-described phosphor layer-covered optical semiconductor element, wherein the phosphor layer is formed on the surface of the transparent layer. And a step of manufacturing a covering sheet, and a step of arranging the covering sheet so that the phosphor layer covers a plurality of optical semiconductor elements.

  According to this method for manufacturing a phosphor layer-covered optical semiconductor element, a phosphor layer-covered optical semiconductor element having excellent emission intensity can be easily manufactured using a cover sheet.

  Moreover, it is preferable that the manufacturing method of the phosphor layer-covered optical semiconductor element of the present invention further includes a step of cutting the cover sheet so that the phosphor layer-covered optical semiconductor element is separated into pieces. .

  According to this method for manufacturing a phosphor layer-covered optical semiconductor element, a phosphor layer-covered optical semiconductor element having a desired dimension can be easily manufactured.

  Moreover, the manufacturing method of the phosphor layer-covered optical semiconductor element of the present invention is a method for manufacturing the above-described phosphor layer-covered optical semiconductor element, and a phosphor layer preparation step of preparing a sheet-like phosphor layer And, after the phosphor layer arranging step of arranging the sheet-like phosphor layer so as to cover the optical semiconductor element, and after the phosphor layer arranging step, the transparent layer is placed at least on the phosphor layer. And a transparent layer arranging step of arranging so as to cover a part.

  The phosphor layer-covered optical semiconductor device includes a phosphor layer preparing step of preparing a sheet-like phosphor layer, and a phosphor in which the sheet-like phosphor layer is disposed so as to cover the optical semiconductor device. And a layer arrangement step, a phosphor layer-covered optical semiconductor element having excellent emission intensity can be easily produced using a sheet-like phosphor layer.

  In the method for producing a phosphor layer-covered optical semiconductor element of the present invention, in the phosphor layer arranging step, the sheet-like phosphor layer is arranged so as to embed a plurality of the optical semiconductor elements, and After the phosphor layer arranging step and before the transparent layer arranging step, the phosphor layer is separated into pieces corresponding to the plurality of optical semiconductor elements, and remote from the optical semiconductor elements. It is preferable that the method further comprises a singulation / removal step for removing the phosphor layer.

  According to this method for manufacturing a phosphor layer-covered optical semiconductor element, in the singulation / removal step, the phosphor layer is placed in a plurality of light after the phosphor layer placement step and before the transparent layer placement step. Since the phosphor layer remote from the optical semiconductor element is removed at the same time as being separated into pieces corresponding to the semiconductor element, a phosphor layer-covered optical semiconductor element having a desired size can be manufactured with a small number of man-hours. it can.

  In the method for manufacturing a phosphor layer-covered optical semiconductor element of the present invention, the optical semiconductor element has an element-side contactable surface that can contact a substrate and a distance on one side with respect to the element-side contactable surface. an element-side facing surface opposed to each other across x, an element-side contactable surface, and an element-side connecting surface connected to the element-side facing surface, and in the phosphor layer arranging step, the sheet-like surface The phosphor layer is disposed so as to cover the element-side connection surfaces of the plurality of optical semiconductor elements, and in the individualization / removal step, the phosphor layer covering the element-side connection surfaces remains. Is preferable.

  According to this method for manufacturing a phosphor layer-covered optical semiconductor element, in the singulation / removal step, the phosphor layer that covers the element-side connecting surface remains, so that the phosphor layer having a phosphor layer with a desired size is provided. The coated optical semiconductor element can be easily manufactured.

  The method for producing a phosphor layer-coated optical semiconductor element of the present invention further includes a transparent layer preparation step of preparing a sheet-like transparent layer, and in the transparent layer preparation step, the sheet-like transparent layer is provided with the fluorescent layer. It is suitable to arrange so as to cover at least a part of the body layer.

  According to this method for manufacturing a phosphor layer-covered optical semiconductor element, since a sheet-like transparent layer is used, a phosphor layer-covered optical semiconductor element having excellent emission intensity can be easily manufactured.

  The phosphor layer-coated optical semiconductor element of the present invention can improve the emission intensity.

  The method for producing a phosphor layer-coated optical semiconductor element of the present invention can easily produce a phosphor layer-coated optical semiconductor element having excellent emission intensity.

FIG. 1 is a cross section of a phosphor layer-sealed LED (embodiment in which a side surface of a transparent layer is formed flush with a side surface of a phosphor layer), which is a first embodiment of a phosphor layer-coated optical semiconductor element of the present invention. The figure is shown. 2A to 2F are process diagrams showing a method for manufacturing the phosphor layer-sealed LED shown in FIG. 1 and a method for manufacturing an LED device using the phosphor layer-sealed LED, and FIG. Step of preparing a sheet, FIG. 2B is a step of preparing a plurality of LEDs, FIG. 2C is a step of sealing a plurality of LEDs with a sealing sheet, and FIG. 2D is an individualized phosphor layer-sealed LED. 2E shows a step of obtaining a phosphor layer-sealed LED, and FIG. 2F shows a step of mounting the phosphor layer-sealed LED on a substrate. 3A to 3D are process diagrams showing a modification of the phosphor layer-sealed LED manufacturing method and the LED device manufacturing method shown in FIGS. 2A to 2F, and FIG. 3A shows the LED and the first dam. Step of preparing, FIG. 3B is a step of arranging the first dam, FIG. 3C is a step of forming a phosphor layer in the first dam, and FIG. 3D is a step of raising the first dam and then preparing the second dam. FIG. 3E shows a step of arranging the second dam. FIG. 4F to FIG. 4I are process diagrams showing modifications of the phosphor layer-sealed LED manufacturing method and the LED device manufacturing method shown in FIG. 2A to FIG. 2E, following FIG. 3E. 4G is a step of cutting the phosphor layer and the transparent layer along the interface between the second dam and FIG. 4H is a step of cutting the phosphor layer-sealed LED. FIG. 4I shows the step of mounting the phosphor layer-sealed LED on the substrate. FIG. 5 shows a cross-sectional view of a modification of the phosphor layer-sealed LED shown in FIG. 1 (a mode in which the lower surface of the phosphor layer is located above the lower surface of the LED). FIG. 6 shows a phosphor layer-sealed LED (embodiment in which the side surface of the transparent layer is formed outside the side surface of the phosphor layer) which is the second embodiment of the phosphor layer-coated optical semiconductor element of the present invention. A cross-sectional view is shown. 7A to 7F are process diagrams showing a method for manufacturing the phosphor layer-sealed LED shown in FIG. 6 and a method for manufacturing an LED device using the phosphor layer-sealed LED. FIG. 7A shows a plurality of steps. FIG. 7B is a step of sealing a plurality of LEDs with a phosphor layer, FIG. 7C is a step of peeling the release sheet from the phosphor layer, and FIG. 7E shows a step of separating the phosphor layer-sealed LED from the support plate, and FIG. 7F shows a step of obtaining the phosphor layer-sealed LED. FIG. 8G to FIG. 8K are process diagrams showing the manufacturing method of the phosphor layer-sealed LED shown in FIG. 6 and the manufacturing method of the LED device using the phosphor layer-sealed LED shown in FIG. 8G is a process of rearranging a plurality of phosphor layer-sealed LEDs on the second support plate and preparing a transparent sheet. FIG. 8H is a process of sealing a plurality of phosphor layer-sealed LEDs with a transparent layer. 8I is a step of peeling the second release sheet from the transparent layer, FIG. 8J is a step of separating the phosphor layer-sealed LED, FIG. 8K is a step of obtaining the phosphor layer-sealed LED, and FIG. The process of mounting fluorescent substance layer sealing LED on a board | substrate is shown. 9 shows a modification of the phosphor layer-sealed LED shown in FIG. 6 (the lower surface of the phosphor layer and the lower surface of the transparent layer have an exposed surface exposed from the LED, and the exposed surface is located above the lower surface of the LED. FIG. 10A to 10F are process diagrams showing a modification of the method for obtaining the phosphor layer-sealed LED shown in FIG. 7, and FIG. 10A is a process of preparing a plurality of LEDs and a fluorescent sealing sheet, FIG. 10B is a step of sealing a plurality of LEDs with a phosphor layer, FIG. 10C is a step of peeling off the release sheet from the phosphor layer, and FIG. 10D is a step of separating into individual phosphor layer-sealed LEDs. 10E shows the process of obtaining fluorescent substance layer sealing LED. FIG. 11 shows a cross-sectional view of a phosphor layer-sealed LED (a mode in which the transparent layer has a collar portion) which is a third embodiment of the phosphor layer-coated optical semiconductor element of the present invention. 12A to 12D are process diagrams showing a method for manufacturing the phosphor layer-sealed LED shown in FIG. 11 and a method for manufacturing an LED device using the phosphor layer-sealed LED. FIG. 12A shows a plurality of steps. Step of preparing LED and fluorescent sealing sheet, FIG. 12B is a step of sealing a plurality of LEDs with a phosphor layer, FIG. 12C is a step of forming recesses in the phosphor layer, and FIG. 12D is a transparent sheet. The process of preparing is shown. FIG. 13E to FIG. 13I are process diagrams showing the manufacturing method of the phosphor layer-sealed LED shown in FIG. 11 and the manufacturing method of the LED device using the phosphor layer-sealed LED shown in FIG. 13E is a step of disposing a transparent layer on the upper surface of the phosphor layer, and then peeling the second release sheet from the transparent layer, FIG. 13F is a step of separating into individual phosphor layer-sealed LEDs, and FIG. Step of obtaining the phosphor layer-sealed LED, FIG. 13H shows a step of transferring the phosphor layer-sealed LED to the transfer sheet, and FIG. 13I shows a step of mounting the phosphor layer-sealed LED on the substrate. 14A to 14D are process diagrams showing a modification of the method for manufacturing the phosphor layer-sealed LED shown in FIG. 11 and the method for manufacturing the LED device using the phosphor layer-sealed LED, and FIG. 14B is a step of preparing a plurality of LEDs and a phosphor encapsulating sheet, FIG. 14B is a step of encapsulating a plurality of LEDs with a phosphor layer, and FIG. 14C is a step of peeling off the release sheet from the phosphor layer. These show the process of preparing a transparent sheet. FIG. 15E to FIG. 15H are process diagrams showing a modification of the method for manufacturing the phosphor layer-sealed LED shown in FIG. 11 and the method for manufacturing the LED device using the phosphor layer-sealed LED, following FIG. 14D. 15E shows a step of disposing the transparent layer on the upper surface of the phosphor layer and then peeling the second release sheet from the transparent layer. FIG. 15F shows a step of separating the phosphor layer-sealed LED into individual pieces. 15G shows a step of obtaining a phosphor layer-sealed LED, and FIG. 15H shows a step of mounting the phosphor layer-sealed LED on a substrate. 16 shows a cross-sectional view of the phosphor layer-sealed LED of Comparative Example 1 (embodiment without a transparent layer). FIG. 17 shows a cross-sectional view of the phosphor layer-sealed LED of Comparative Example 2 (an embodiment in which a collar portion is formed in the phosphor layer but there is no transparent layer).

  The phosphor layer-covered optical semiconductor element of the present invention includes an optical semiconductor element, a phosphor layer that covers the optical semiconductor element, and a transparent layer that covers at least a part of the phosphor layer.

  Hereinafter, with reference to FIGS. 1 to 15H, an example of the phosphor layer-covered optical semiconductor element of the present invention and a method for manufacturing the same will be described according to the first to third embodiments.

<First Embodiment>
In FIG. 1, the vertical direction of the paper is the vertical direction (first direction, thickness direction), the upper side of the paper is the upper side (one side in the first direction, the one side in the thickness direction), and the lower side of the paper is the lower side (the other in the first direction). Side, the other side in the thickness direction). The left and right direction on the paper surface is the left and right direction (second direction orthogonal to the first direction), the left side on the paper surface is the left side (second side in the second direction), and the right side on the paper surface is the right side (the other side in the second direction). The paper thickness direction is the front-rear direction (the third direction orthogonal to the first direction and the second direction), the front side of the paper is the front side (one side in the third direction), and the back side of the paper is the rear side (the other side in the third direction). is there.

[Phosphor layer sealed LED]
As shown in FIG. 1, a phosphor layer-sealed LED 1 as an example of a phosphor layer-covered optical semiconductor element includes an LED 2 as an example of an optical semiconductor element, a phosphor layer 3 that covers the upper surface and side surfaces of the LED 2, And a transparent layer 4 covering the upper surface of the phosphor layer 3.

[Description of each member]
The LED 2 is an optical semiconductor element that converts electrical energy into light energy. The optical semiconductor element does not include a rectifier such as a transistor having a technical field different from that of the optical semiconductor element. The LED 2 is formed, for example, in a substantially rectangular shape in cross-sectional view and a substantially rectangular shape in plan view in which the thickness (maximum length in the vertical direction) is shorter than the length in the surface direction (specifically, the length in the horizontal direction and the length in the front-rear direction). Has been. The LED 2 has a lower surface 21, an upper surface 22, and a side surface 23.

  The lower surface 21 of the LED 2 is an example of an element-side contactable surface that can contact the substrate 50. A part of the lower surface 21 of the LED 2 is formed by a bump (not shown) and is electrically connected to a terminal (not shown in FIG. 2) provided on the upper surface of the substrate 50. The lower surface 21 of the LED 2 is the lowermost surface of the phosphor layer-sealed LED 1.

  The upper surface 22 of the LED 2 is an example of an element-side facing surface that is disposed to face the lower surface 21 of the LED 2 on the upper side (an example of one side) with a distance x. Note that the distance x at which the upper surface 22 of the LED 2 is separated from the lower surface 21 is the same as the thickness x of the LED 2.

  The side surfaces 23 of the LED 2, that is, the front surface, the rear surface, the left surface, and the right surface are examples of element-side connection surfaces that are connected to the lower surface 21 and the upper surface 22.

  The upper surface 22 and the side surface 23 of the LED 2 are formed by a light emitting layer (not shown).

  As LED2, blue LED (light emitting diode element) which light-emits blue light is mentioned, for example.

  The phosphor layer 3 is a wavelength conversion layer that yellow-lights part of the blue light emitted from the LED 2. The phosphor layer 3 is formed in a shape including the LED 2 in plan view. The phosphor layer 3 is disposed so as to cover the upper surface 22 and the side surface 23 of the LED 2 while exposing the lower surface 21 of the LED 2. That is, a housing portion 30 that houses the LED 2 is formed in the center of the lower portion of the phosphor layer 3. The accommodating portion 30 is a concave portion that is recessed upward from the lower surface 32 of the phosphor layer 3, and is formed to correspond to the outer shape of the LED 2. That is, the phosphor layer 3 is formed in a substantially rectangular shape in cross-section in which the accommodating portion 30 is formed and a substantially rectangular shape in plan view. The phosphor layer 3 has a lower surface 32, an upper surface 31, a side surface 33, and an inner surface 34 formed in the housing portion 30.

  The lower surface 32 of the phosphor layer 3 is the lowermost surface of the phosphor layer 3 and is a phosphor-side contactable surface that can contact the substrate 50.

  The upper surface 31 of the phosphor layer 3 is an example of a phosphor-side first facing surface that is disposed to face the upper surface 22 of the LED 2 on the upper side (an example of one side) at a distance y. Further, the upper surface 31 of the phosphor layer 3 is also a surface that is opposed to the upper surface 22 of the LED 2 with a distance y therebetween. In the phosphor layer 3, the distance y at which the upper surface 31 is separated upward from the lower surface 32 of the phosphor layer 3 (that is, the upper surface 22 of the LED 2) is opposed to the upper side of the LED 2 in the phosphor layer 3. The thickness y of the portion.

  The side surface 33 of the phosphor layer 3, that is, the front surface, the rear surface, the left surface, and the right surface are opposed to the side surface 23 of the LED 2 in the surface direction (an example of the orthogonal direction) and are opposed to each other with a distance α. It is an example of a surface. Further, the side surface 33 of the phosphor layer 3 is formed as an exposed surface exposed to the side. Note that the distance α at which the side surface 33 of the phosphor layer 3 is separated outward from the side surface 23 of the LED 2 is the length in the left-right direction of the portion (side portion 35) facing the outside of the LED 2 in the phosphor layer 3. The longitudinal length (minimum length) α.

  The inner surface 34 of the accommodating portion 30 of the phosphor layer 3 is in contact with the upper surface 22 and the side surface 23 of the LED 2.

  The phosphor layer 3 is formed of, for example, a phosphor resin composition.

  The phosphor resin composition contains a phosphor and a transparent resin composition (a first transparent resin composition that is an example of a first transparent composition).

  Examples of the phosphor include a yellow phosphor that can convert blue light into yellow light, and a red phosphor that can convert blue light into red light.

Examples of the yellow phosphor include silicate phosphors such as (Ba, Sr, Ca) ₂ SiO ₄ ; Eu, (Sr, Ba) ₂ SiO ₄ : Eu (barium orthosilicate (BOS)), for example, Y ₃ Al Garnet-type phosphors having a garnet-type crystal structure such as ₅ O ₁₂ : Ce (YAG (yttrium, aluminum, garnet): Ce), Tb ₃ Al ₃ O ₁₂ : Ce (TAG (terbium, aluminum, garnet): Ce) Examples thereof include oxynitride phosphors such as Ca-α-SiAlON.

Examples of the red phosphor include nitride phosphors such as CaAlSiN ₃ : Eu and CaSiN ₂ : Eu.

  Examples of the shape of the phosphor include a spherical shape, a plate shape, and a needle shape. Preferably, spherical shape is mentioned from a fluid viewpoint.

  The average value of the maximum length of the phosphor (in the case of a sphere, the average particle diameter) is, for example, 0.1 μm or more, preferably 1 μm or more, and for example, 200 μm or less, preferably 100 μm or less. But there is.

  The specific gravity of the phosphor exceeds, for example, 2.0 and is, for example, 9.0 or less.

  The phosphors can be used alone or in combination.

  The blending ratio of the phosphor is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, for example, 80 parts by mass or less, preferably 50 parts by mass with respect to 100 parts by mass of the transparent resin composition. It is below mass parts. The blending ratio of the phosphor is, for example, 0.1% by mass or more, preferably 0.5% by mass or more, for example, 90% by mass or less, preferably 80% by mass with respect to the phosphor resin composition. It is below mass%.

  As for a transparent resin composition, the transparent resin composition used as a sealing material for sealing LED2 is mentioned, for example. Specifically, examples of the transparent resin composition include a thermosetting resin composition and a thermoplastic resin composition, preferably a thermosetting resin composition.

  Examples of the thermosetting resin composition include a two-stage reaction curable resin composition and a one-stage reaction curable resin composition.

  The two-stage reaction curable resin composition has two reaction mechanisms. In the first stage reaction, the A stage state is changed to B stage (semi-cured), and then in the second stage reaction, B C stage (complete curing) can be performed from the stage state. That is, the two-stage reaction curable resin composition is a thermosetting resin composition that can be in a B stage state under appropriate heating conditions. However, the two-stage reaction curable resin composition can be changed from the A-stage state to the C-stage state at a time without maintaining the B-stage state by intense heating. The B stage state is a state between the A stage state in which the thermosetting resin composition is in a liquid state and the C stage state in which the thermosetting resin composition is completely cured. It is a semi-solid or solid state whose modulus is smaller than the elastic modulus in the C-stage state.

  The one-stage reaction curable resin composition has one reaction mechanism, and can be C-staged (completely cured) from the A-stage state by the first-stage reaction. The first-stage reaction curable resin composition can be changed from the A-stage state to the B-stage state in the middle of the first-stage reaction. The thermosetting resin composition that can be C-staged (completely cured) from the B-stage state is included. That is, this thermosetting resin composition is a thermosetting resin composition that can be in a B-stage state. On the other hand, the first-stage reaction curable resin composition cannot be controlled to stop in the middle of the first-stage reaction, that is, cannot enter the B-stage state, and is changed from the A-stage state to the C-stage ( A thermosetting resin composition that completely cures).

  Examples of the transparent resin composition include silicone resin, epoxy resin, urethane resin, polyimide resin, phenol resin, urea resin, melamine resin, and unsaturated polyester resin. As a transparent resin composition, Preferably, a silicone resin and an epoxy resin are mentioned.

  The above-mentioned transparent resin composition may be the same type or a plurality of types.

  Examples of the silicone resin include silicone resin compositions such as an addition reaction curable silicone resin composition and a condensation / addition reaction curable silicone resin composition from the viewpoint of transparency, durability, heat resistance, and light resistance. . Silicone resins may be used alone or in combination.

  The addition reaction curable silicone resin composition is a one-stage reaction curable resin composition, and includes, for example, an alkenyl group-containing polysiloxane, a hydrosilyl group-containing polysiloxane, and a hydrosilylation catalyst.

  The alkenyl group-containing polysiloxane contains two or more alkenyl groups and / or cycloalkenyl groups in the molecule. The alkenyl group-containing polysiloxane is specifically represented by the following average composition formula (1).

Average composition formula (1):
R ¹ _a R ² _b SiO _{(4-ab) / 2}
(In the formula, R ¹ represents an alkenyl group having 2 to 10 carbon atoms and / or a cycloalkenyl group having 3 to 10 carbon atoms. R ² represents an unsubstituted or substituted monovalent carbon atom having 1 to 10 carbon atoms. A hydrogen group (excluding an alkenyl group and a cycloalkenyl group); a is from 0.05 to 0.50, and b is from 0.80 to 1.80.
In formula (1), examples of the alkenyl group represented by R ¹ include alkenyl having 2 to 10 carbon atoms such as vinyl group, allyl group, propenyl group, butenyl group, pentenyl group, hexenyl group, heptenyl group, and octenyl group. Groups. Examples of the cycloalkenyl group represented by R ¹ include cycloalkenyl groups having 3 to 10 carbon atoms such as a cyclohexenyl group and a norbornenyl group.

R ¹ is preferably an alkenyl group, more preferably an alkenyl group having 2 to 4 carbon atoms, and still more preferably a vinyl group.

The alkenyl groups represented by R ¹ may be the same type or a plurality of types.

The monovalent hydrocarbon group represented by R ² is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group and a cycloalkenyl group.

  Examples of the unsubstituted monovalent hydrocarbon group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, a hexyl group, and a pentyl group. , Heptyl group, octyl group, 2-ethylhexyl group, nonyl group, decyl group and other alkyl groups having 1 to 10 carbon atoms such as cyclopropyl, cyclobutyl group, cyclopentyl group and cyclohexyl group. Examples include alkyl groups such as aryl groups having 6 to 10 carbon atoms such as phenyl, tolyl and naphthyl groups, and aralkyl groups having 7 to 8 carbon atoms such as benzyl and benzylethyl groups. Preferably, a C1-C3 alkyl group and a C6-C10 aryl group are mentioned, More preferably, a methyl group and / or a phenyl group are mentioned.

  On the other hand, examples of the substituted monovalent hydrocarbon group include those in which the hydrogen atom in the above-described unsubstituted monovalent hydrocarbon group is substituted with a substituent.

  Examples of the substituent include a halogen atom such as a chlorine atom, for example, a glycidyl ether group.

  Specific examples of the substituted monovalent hydrocarbon group include a 3-chloropropyl group and a glycidoxypropyl group.

  The monovalent hydrocarbon group may be unsubstituted or substituted, and is preferably unsubstituted.

The monovalent hydrocarbon groups represented by R ² may be of the same type or a plurality of types. Preferably, a methyl group and / or a phenyl group are mentioned, More preferably, combined use of a methyl group and a phenyl group is mentioned.

  a is preferably 0.10 or more and 0.40 or less.

  b is preferably 1.5 or more and 1.75 or less.

  The weight average molecular weight of the alkenyl group-containing polysiloxane is, for example, 100 or more, preferably 500 or more, and for example, 10,000 or less, preferably 5000 or less. The weight average molecular weight of the alkenyl group-containing polysiloxane is a conversion value based on standard polystyrene measured by gel permeation chromatography.

  The alkenyl group-containing polysiloxane is prepared by an appropriate method, and a commercially available product can also be used.

  The alkenyl group-containing polysiloxanes may be of the same type or a plurality of types.

  The hydrosilyl group-containing polysiloxane contains, for example, two or more hydrosilyl groups (SiH groups) in the molecule. Specifically, the hydrosilyl group-containing polysiloxane is represented by the following average composition formula (2).

Average composition formula (2):
^{_{H c R 3 d SiO (4}} -c-d) / 2
(In the formula, R ³ represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms (excluding an alkenyl group and / or a cycloalkenyl group). C is 0.30 or more. 1.0, and d is 0.90 or more and 2.0 or less.)
In formula (2), the unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms represented by R ³ is an unsubstituted or substituted carbon group having 1 to 10 carbon atoms represented by R ² in formula (1). The same thing as the monovalent hydrocarbon group of is illustrated. Preferably, an unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms, or an aryl group having 6 to 10 carbon atoms, and more preferably a methyl group. And / or a phenyl group.

  c is preferably 0.5 or less.

  d is preferably 1.3 or more and 1.7 or less.

  The weight average molecular weight of the hydrosilyl group-containing polysiloxane is, for example, 100 or more, preferably 500 or more, and for example, 10,000 or less, preferably 5000 or less. The weight average molecular weight of the hydrosilyl group-containing polysiloxane is a conversion value based on standard polystyrene measured by gel permeation chromatography.

  The hydrosilyl group-containing polysiloxane is prepared by an appropriate method, and a commercially available product can also be used.

  Further, the hydrosilyl group-containing polysiloxane may be of the same type or a plurality of types.

Average composition formula described above (1) and the average compositional formula (2), at least one of the hydrocarbon groups R ² and R ³ preferably includes a phenyl group, more preferably, R ² and R ³ Both hydrocarbons contain a phenyl group. When at least one of the hydrocarbon groups of R ² and R ³ contains a phenyl group, the addition reaction curable silicone resin composition is a phenyl silicone resin composition. This phenyl silicone resin composition is a one-stage reaction curable resin composition that can be in a B-stage state. The refractive index of the phenyl silicone resin composition is, for example, 1.45 or more, and further 1.50 or more.

On the other hand, when both R ² and R ³ hydrocarbons are methyl groups, the addition reaction curable silicone resin composition is a methyl silicone resin composition. The methyl silicone resin composition is a one-stage reaction curable resin composition that cannot be in a B-stage state. The refractive index of the methyl silicone resin composition is, for example, 1.50 or less, and further 1.45 or less.

  Among the addition reaction curable silicone resin compositions, a methyl silicone resin composition is preferable from the viewpoint of obtaining excellent gas permeability.

  The blending ratio of the hydrosilyl group-containing polysiloxane is the ratio of the number of moles of alkenyl groups and cycloalkenyl groups of the alkenyl group-containing polysiloxane to the number of moles of hydrosilyl groups of the hydrosilyl group-containing polysiloxane (number of moles of alkenyl groups and cycloalkenyl groups). / Number of moles of hydrosilyl group) is adjusted to be, for example, 1/30 or more, preferably 1/3 or more, and for example, 30/1 or less, preferably 3/1 or less.

  The hydrosilylation catalyst is a substance (addition catalyst) that improves the reaction rate of the hydrosilylation reaction (hydrosilyl addition) between the alkenyl group and / or cycloalkenyl group of the alkenyl group-containing polysiloxane and the hydrosilyl group of the hydrosilyl group-containing polysiloxane. If it exists, it will not specifically limit, For example, a metal catalyst is mentioned. Examples of the metal catalyst include platinum catalysts such as platinum black, platinum chloride, chloroplatinic acid, platinum-olefin complexes, platinum-carbonyl complexes, and platinum-acetyl acetate, for example, palladium catalysts such as rhodium catalyst.

  The blending ratio of the hydrosilylation catalyst is, for example, 1.0 ppm or more on a mass basis with respect to the alkenyl group-containing polysiloxane and the hydrosilyl group-containing polysiloxane as the metal amount of the metal catalyst (specifically, metal atom). Yes, for example, 10000 ppm or less, preferably 1000 ppm or less, and more preferably 500 ppm or less.

  The addition reaction curable silicone resin composition is prepared by blending an alkenyl group-containing polysiloxane, a hydrosilyl group-containing polysiloxane, and a hydrosilylation catalyst in the above proportions.

  The above addition reaction curable silicone resin composition is prepared and used in an A stage (liquid) state by blending an alkenyl group-containing polysiloxane, a hydrosilyl group-containing polysiloxane, and a hydrosilylation catalyst.

  As described above, the phenyl silicone resin composition undergoes a hydrosilylation addition reaction between the alkenyl group and / or cycloalkenyl group of the alkenyl group-containing polysiloxane and the hydrosilyl group of the hydrosilyl group-containing polysiloxane by heating under desired conditions. After that, the hydrosilylation addition reaction is once stopped. As a result, the A stage state can be changed to the B stage (semi-cured) state. Thereafter, the above-described hydrosilylation addition reaction is resumed and completed by heating under further desired conditions. As a result, the B stage state can be changed to the C stage (fully cured) state.

  When the phenyl silicone resin composition is in the B stage (semi-cured) state, it is solid. The B-staged phenyl silicone resin composition can have both thermoplasticity and thermosetting properties. That is, the B-stage phenyl silicone resin composition is once cured by heating and then completely cured.

  On the other hand, in the above-described methyl silicone resin composition, a hydrosilylation addition reaction between an alkenyl group and / or cycloalkenyl group and a hydrosilyl group occurs and is promoted and completed without stopping. As a result, the A stage state can be changed to the C stage (fully cured) state. A commercial item is used for the methyl silicone resin composition. Examples of commercially available products include ELASTOSIL series (manufactured by Asahi Kasei Wacker Silicone Co., specifically, methyl silicone resin compositions such as ELASTOSIL LR7665), KER series (manufactured by Shin-Etsu Silicone Co., Ltd.), and the like.

  The condensation / addition reaction curable silicone resin composition is a two-stage reaction curable resin, and specifically described in, for example, JP 2010-265436 A, JP 2013-187227 A, and the like. 1 to 8 condensation / addition reaction curable silicone resin compositions, for example, JP2013-091705A, JP2013-001815A, JP2013-001814A, JP2013-001813A, Examples thereof include a cage-type octasilsesquioxane-containing silicone resin composition described in JP2012-102167A. The condensation / addition reaction curable silicone resin composition is solid and has both thermoplasticity and thermosetting properties.

  Examples of the epoxy resin include bisphenol type epoxy resins (for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol A type epoxy resin, dimer acid-modified bisphenol type epoxy resin, etc.), Novolak type epoxy resins (for example, phenol novolak type epoxy resins, cresol novolak type epoxy resins, biphenyl type epoxy resins), naphthalene type epoxy resins, fluorene type epoxy resins (for example, bisarylfluorene type epoxy resins), triphenylmethane Type epoxy resins (for example, trishydroxyphenylmethane type epoxy resins) and the like, such as aromatic epoxy resins, for example, triepoxypropyl isocyanurate (tri Nitrogen-containing epoxy resins such as lysidyl isocyanurate) and hydantoin epoxy resins, for example, aliphatic epoxy resins such as alicyclic epoxy resins (for example, dicyclocyclic epoxy resins such as dicyclopentadiene type epoxy resins) For example, a glycidyl ether type epoxy resin, for example, a glycidyl amine type epoxy resin, etc. are mentioned. In addition, examples of the epoxy resin include diglycidyl esters of dicarboxylic acids such as phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methyltetrahydrophthalic acid, nadic acid, and methylnadic acid. Furthermore, examples of the epoxy resin include glycidyl esters such as nuclear hydrogenated trimellitic acid and nuclear hydrogenated pyromellitic acid having an alicyclic structure in which an aromatic ring is hydrogenated.

  Epoxy resins can be used alone or in combination.

  The epoxy resin may be in any form of liquid, semi-solid and solid. The average epoxy equivalent of an epoxy resin is 90-1000, for example. When the epoxy resin is solid, for example, the softening point is 50 to 160 ° C. from the viewpoint of convenience of handling.

  The epoxy resin is usually used in combination with a curing agent. Examples of the curing agent include an acid anhydride curing agent and an isocyanuric acid derivative curing agent.

  Examples of the acid anhydride curing agent include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, glutaric anhydride. Examples include acid, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and the like. The acid anhydride curing agents can be used alone or in combination of two or more.

  Examples of the isocyanuric acid derivative curing agent include 1,3,5-tris (1-carboxymethyl) isocyanurate, 1,3,5-tris (2-carboxyethyl) isocyanurate, 1,3,5-tris. (3-carboxypropyl) isocyanurate, 1,3-bis (2-carboxyethyl) isocyanurate and the like can be mentioned. Isocyanuric acid derivative-based curing agents can be used alone or in combination of two or more.

  The curing agents can be used alone or in combination of two or more.

  The blending ratio of the epoxy resin and the curing agent is such that, for example, 0.5 equivalent of an active group (an acid anhydride group or a carboxyl group) that can react with the epoxy group in the curing agent with respect to 1 equivalent of the epoxy group in the epoxy resin. It sets so that it may become -1.5 equivalent, Preferably, it sets so that it may become 0.7-1.2 equivalent.

  Moreover, the transparent resin composition can further contain a filler.

  Examples of the filler include particles such as inorganic particles and organic particles.

Examples of the inorganic particles include silica (SiO ₂ ), talc (Mg ₃ (Si ₄ O ₁₀ ) (HO) ₂ ), alumina (Al ₂ O ₃ ), boron oxide (B ₂ O ₃ ), calcium oxide (CaO). ), Zinc oxide (ZnO), strontium oxide (SrO), magnesium oxide (MgO), zirconium oxide (ZrO ₂ ), barium oxide (BaO), antimony oxide (Sb ₂ O ₃ ), and other oxides such as aluminum nitride Examples thereof include inorganic particles (inorganic materials) such as nitrides such as (AlN) and silicon nitride (Si ₃ N ₄ ). Examples of the inorganic particles include composite inorganic particles prepared from the inorganic materials exemplified above, and preferably, composite inorganic oxide particles prepared from an oxide (specifically, glass particles). .

  The composite inorganic oxide particles include, for example, silica, or silica and boron oxide as main components, and alumina, calcium oxide, zinc oxide, strontium oxide, magnesium oxide, zirconium oxide, barium oxide, antimony oxide, and the like. Is contained as a minor component. The content ratio of the main component in the composite inorganic oxide particles is, for example, more than 40% by mass, preferably 50% by mass or more, and for example, 90% by mass or less, preferably with respect to the composite inorganic oxide particles. Is 80 mass% or less. The content ratio of the subcomponent is the remainder of the content ratio of the main component described above.

  The composite oxide particles are blended with the main component and subcomponents described above, heated and melted, rapidly cooled, and then pulverized by, for example, a ball mill or the like. It is obtained by applying surface processing (specifically, spheroidization, etc.).

  The inorganic particles can be used alone or in combination.

  Examples of organic materials for organic particles include acrylic resins, styrene resins, acrylic-styrene resins, silicone resins, polycarbonate resins, benzoguanamine resins, polyolefin resins, polyester resins, polyamide resins, and polyimide resins. Resin etc. are mentioned. These can be used alone or in combination.

  Of these organic materials, a silicone resin is preferable from the viewpoint of light diffusibility and availability.

  The organic particles can be used alone or in combination.

  The filler can be used alone or in combination.

  The refractive index of the filler is, for example, 1.40 or more and, for example, 1.600 or less.

  The shape of the filler is not particularly limited, and examples thereof include a spherical shape, a plate shape, and a needle shape. Preferably, spherical shape is mentioned from a fluid viewpoint.

  The average particle diameter of the filler is, for example, 3 μm or more, preferably 5 μm or more, and for example, 70 μm or less, preferably 50 μm or less.

  The content rate of a filler is 1 mass% or more with respect to a transparent resin composition, Preferably, it is 3 mass% or more, for example, is 80 mass% or less, Preferably, it is 75 mass% or less.

  The refractive index RIp of the transparent resin composition (an example of the first transparent composition) is, for example, 1.40 or more, preferably 1.45 or more, preferably 1.50 or more, 1.63 or less, preferably 1.60 or less, more preferably 1.57 or less. If the refractive index RIp of the transparent resin composition is not less than the above lower limit, the emission intensity of the phosphor layer-sealed LED 1 can be improved.

  The refractive index RIp of the transparent resin composition is calculated by an Abbe refractometer. In addition, when a transparent resin composition contains a thermosetting resin, it calculates as a refractive index of a hardening state (completely hardening state). In addition, the refractive index of the transparent resin composition before hardening is substantially the same as the refractive index of the transparent resin composition after hardening.

  In addition, the phosphor resin composition includes a silane coupling agent, an anti-aging agent, a modifier, a surfactant, a dye, a pigment (excluding the filler described above), a discoloration preventing agent, an ultraviolet absorber, and the like as necessary. These known additives can be added at an appropriate ratio.

  As shown in FIG. 1, the transparent layer 4 is the uppermost layer in the phosphor layer-sealed LED 1. Specifically, the transparent layer 4 is disposed so as to cover the entire phosphor-side first facing surface 31 of the phosphor layer 3. The shape of the transparent layer 4 in plan view is the same as the shape of the phosphor-side first opposing surface 31 of the phosphor layer 3. That is, the transparent layer 4 is formed in a substantially rectangular shape in sectional view and a substantially rectangular shape in plan view. The transparent layer 4 has a lower surface 41, an upper surface 42, and side surfaces 43.

  The lower surface 41 of the transparent layer 4 is a transparent side contact surface that contacts the phosphor side first opposing surface 31.

  The upper surface 42 of the transparent layer 4 is an example of a transparent-side facing surface that is disposed to face the upper surface 31 (an example of one side) of the phosphor layer 3 with a distance z therebetween. The upper surface 42 of the transparent layer 4 is the uppermost surface of the phosphor layer-sealed LED 1. The distance z at which the upper surface 42 of the transparent layer 4 is separated upward from the upper surface 31 of the phosphor layer 3 is the same as the thickness z of the transparent layer 4.

  The side surface 43 of the transparent layer 4 is connected to the lower surface 41 and the upper surface 42 of the transparent layer 4. When the side surface 43 of the transparent layer 4 is projected in the up and down direction (an example of one direction), the transparent side connection is arranged with a space α on the outer side in the surface direction (an example of the orthogonal direction) with respect to the side surface 23 of the LED 2. It is an example of a surface. The side surface 43 of the transparent layer 4 is formed flush with the side surface 33 of the phosphor layer 3 in the vertical direction.

  The transparent layer 4 is formed from, for example, a second transparent composition such as a transparent resin composition or an inorganic material.

  Examples of the transparent resin composition include the above-described transparent resin composition (transparent resin composition contained in the phosphor resin composition). Each component included in the transparent resin composition and the blending ratio thereof are within a range overlapping with each component included in the transparent resin composition (transparent resin composition contained in the phosphor resin composition) and the blending ratio thereof. is there.

  Examples of the inorganic material include glass. The glass is not particularly limited, and examples thereof include alkali-free glass, soda glass, quartz glass, borosilicate glass, lead glass, and fluoride glass. Examples of the glass include heat-resistant glass, and specifically, commercially available products such as Tempax glass, Vycor glass, and Pyrex glass. As glass, Preferably, an alkali free glass and soda glass are mentioned.

  The refractive index RIt of the second transparent composition was obtained by subtracting the refractive index RIt of the second transparent composition from the refractive index RIp of the first transparent resin composition (transparent resin composition contained in the phosphor layer 3). The value (RIp−RIt) is, for example, −1.0 or more, preferably −0.7 or more, more preferably 0 or more, still more preferably 0.05 or more, and particularly preferably 0.10 or more. For example, it is set to be 0.20 or less. If RIp-RIt is equal to or greater than the above lower limit, much more excellent emission intensity can be obtained. If RIp-RIt is not more than the above upper limit, reflection of light at the interface between the transparent layer 4 and the phosphor layer 3 can be suppressed.

  The transparent layer 4 may be formed of a multilayer, for example.

[Size]
The dimensions of the LED 2, the phosphor layer 3, and the transparent layer 4 are appropriately set according to the use and purpose.

  The distance x (thickness x of the LED 2) is, for example, 10 μm or more, preferably 50 μm or more, and for example, 1000 μm or less, preferably 500 μm or less.

  The length 2 in the left-right direction and the length in the front-rear direction (not shown in FIG. 1) of the LED 2 are minimum lengths in the surface direction of the LED 2 and are, for example, 0.1 μm or more, preferably 0.2 μm or more. For example, it is 5000 micrometers or less, Preferably, it is 2000 micrometers or less.

  The distance y (the thickness y of the portion facing the upper side of the LED 2 in the phosphor layer 3) is, for example, 50 μm or more, and preferably 150 μm or more. Further, the distance y is, for example, 1000 μm or less, preferably 500 μm or less, more preferably less than 350 μm, still more preferably 300 μm or less, particularly preferably 200 μm or less, further 150 μm or less, and further 100 μm or less. is there. If the distance y is less than the upper limit described above, the gas permeability of the phosphor layer 3 is increased, and when the LED device 60 includes the phosphor layer-sealed LED 1, the occurrence of black burn in the phosphor layer 3 is suppressed. As a result, the reliability of the phosphor layer-sealed LED 1 can be improved, and as a result, the reliability of the LED device 60 can be improved.

  The distance z (thickness z of the transparent layer 4) is, for example, 100 μm or more, preferably 200 μm or more. The distance z is, for example, 1000 μm or less, preferably 500 μm or less, more preferably less than 400 μm, still more preferably 300 μm or less, particularly preferably 200 μm or less, and most preferably 100 μm or less. If the distance z is less than the upper limit described above, the gas permeability of the transparent layer 4 is increased, and when the LED device 60 includes the phosphor layer-sealed LED 1, it is possible to suppress the occurrence of black burn in the transparent layer 4. Thus, the reliability of the phosphor layer-sealed LED 1 can be improved, and as a result, the reliability of the LED device 60 can be improved.

Moreover, LED2, the phosphor layer 3, and the transparent layer 4 preferably satisfy all of the following (1) to (4).
(1) The value obtained by dividing the distance y by the distance x (y / x) is, for example, 1 or more, preferably 1.25 or more, and for example, 5 or less, preferably less than 5, more preferably 4 or less, more preferably 3 or less. If y / x is not less than the above lower limit, excellent color uniformity can be obtained. If y / x is less than or equal to the above upper limit, color unevenness can be suppressed.
(2) The sum (y + z) of the distance y and the distance z is, for example, 0.20 mm or more, preferably 0.25 mm or more, more preferably 0.5 mm or more, and for example, 2 mm or less, preferably Is 1.5 mm or less. When y + z is not less than the above lower limit, excellent emission intensity can be obtained. If y + z is not more than the above upper limit, the material cost can be suppressed.
(3) The distance α (minimum length α of the side portion 35 of the phosphor layer 3) is, for example, 50 μm or more, preferably more than 50 μm, more preferably 100 μm or more, and for example, 2000 μm or less, preferably Is 1000 μm or less. If the distance α is equal to or greater than the above lower limit, it is possible to prevent a decrease in color uniformity or to suppress color unevenness.
(4) The value (y / α) obtained by dividing the distance y by the distance α is, for example, 1 or more, preferably 1.2 or more, and for example, 2.5 or less, preferably 2.0 or less. It is. If y / α is not more than the above upper limit, color unevenness can be suppressed.

[Method for producing phosphor layer-sealed LED]
Next, a method for producing the phosphor layer-sealed LED shown in FIG. 1 and a method for producing an LED device using the phosphor layer-sealed LED will be described with reference to FIGS. 2A to 2F.

  The manufacturing method of fluorescent substance layer sealing LED1 is the process (refer FIG. 2A) which manufactures the sealing sheet 5 as an example of the coating sheet provided with the transparent layer 4 and the fluorescent substance layer 3, and the sealing sheet 5 is made into fluorescent substance. The step of arranging the layer 3 so as to cover the plurality of LEDs 2 (see FIG. 2C) and the step of cutting the sealing sheet 5 so that the phosphor layer-sealed LEDs 1 are separated into pieces (see FIG. 2D). ). The step of manufacturing the sealing sheet 5 (see FIG. 2A) includes a step of preparing the transparent layer 4 and a step of forming the phosphor layer 3 on the surface of the transparent layer 4.

  As shown in FIG. 2A, when the transparent layer 4 is formed from a transparent resin composition in the step of preparing the transparent layer 4, first, a release sheet 6 indicated by a virtual line is prepared.

  The release sheet 2 seals the LED 2 with the transparent layer 4 (when the transparent layer 4 is formed from a thermosetting resin composition, the transparent layer 4 is cured). In order to protect, it is detachably attached to the back surface of the transparent layer 4 (the lower surface in FIG. 1A). That is, the release sheet 6 is laminated on the back surface of the transparent layer 4 so as to cover the back surface of the transparent layer 4 when the sealing sheet 5 is shipped, transported, and stored. It is a flexible film that can be peeled off from the back surface of the layer 4 so as to be bent in a substantially U shape. That is, the release sheet 6 consists only of a flexible film. Moreover, the sticking surface of the release sheet 6, that is, the contact surface with respect to the transparent layer 4 is subjected to release treatment such as fluorine treatment as necessary.

  Examples of the release sheet 6 include polymer films such as a polyethylene film and a polyester film (such as PET), such as a ceramic sheet, such as a metal foil. Preferably, a polymer film is used. Moreover, the shape of the release sheet 2 is not particularly limited, and is formed in, for example, a substantially rectangular shape in plan view (including a strip shape and a long shape). The thickness of the release sheet 6 is, for example, 1 μm or more, preferably 10 μm or more, and for example, 2000 μm or less, preferably 1000 μm or less.

  Subsequently, when forming the transparent layer 4 from a transparent resin composition, the varnish of a transparent resin composition is apply | coated to the surface of the peeling sheet 6. FIG. In order to apply the transparent resin composition to the surface of the release sheet 6, for example, an application device such as a dispenser, an applicator, or a slit die coater is used.

  A coating film of the transparent resin composition is formed by applying the transparent resin composition to the release sheet 2.

  Thereafter, the coating film is completely cured (C stage). As heating conditions, the heating temperature is 80 ° C or higher, preferably 100 ° C or higher, and 200 ° C or lower, preferably 150 ° C or lower. The heating time is, for example, 10 minutes or longer, preferably 30 minutes or longer, and for example, 5 hours or shorter.

  Thus, the A stage transparent resin composition in the coating film is completely cured (C stage).

  When the transparent resin composition contains an addition reaction curable silicone resin composition, the hydrosilylation reaction between the alkenyl group and / or cycloalkenyl group and the hydrosilyl group proceeds partway and then stops.

  On the other hand, when the transparent resin composition contains a condensation reaction / addition reaction curable silicone resin, the condensation reaction is completed.

  As a result, the transparent layer 4 is formed from a B-stage transparent resin composition.

  On the other hand, when the transparent layer 4 is formed from an inorganic material, specifically, an inorganic material previously formed into a plate shape is prepared. Preferably, a glass plate is prepared without using the release sheet 6 (imaginary line in FIG. 2A).

  Thereby, the transparent layer 4 is formed from an inorganic substance.

  Next, as shown in FIG. 2A, the phosphor layer 3 is formed on the surface of the transparent layer 4.

  When the phosphor layer 3 is formed from a phosphor resin composition, the phosphor resin composition is applied to the surface of the transparent layer 4 using the above-described coating apparatus. Thereby, a coating film of the phosphor resin composition is formed.

  Thereafter, when the phosphor resin composition contains a thermosetting resin composition that can be in a B-stage state, the coating film is B-staged. The heating conditions are the same as the above range. As a result, the coating film is made into a B-stage.

  When the phosphor resin composition contains an addition reaction curable silicone resin composition, the hydrosilylation reaction between the alkenyl group and / or cycloalkenyl group and the hydrosilyl group proceeds partway and then stops.

  On the other hand, when the phosphor resin composition contains a condensation reaction / addition reaction curable silicone resin, the condensation reaction is completed.

  Thereby, the phosphor layer 3 is formed from the phosphor resin composition.

  Subsequently, the plate-like phosphor layer 3 is disposed on the upper surface of the transparent layer 4.

  Thereby, as shown in FIG. 2A, a sealing sheet 5 including a transparent layer 4 and a phosphor layer 3 is obtained. Preferably, the sealing sheet 5 includes the transparent layer 4 and the phosphor layer 3.

  The sealing sheet 5 has a flat plate shape, specifically, has a predetermined thickness, extends in the left-right direction and the front-rear direction, and has a flat surface and a flat back surface. In addition, the sealing sheet 5 is not the LED device 60 (see FIG. 2F described later), but is a component of the LED device 60, that is, a component for producing the LED device 60, and the substrate on which the LED 2 and the LED 2 are mounted. This is an industrially available device that does not include 50 and is distributed by itself.

  In addition, when the transparent layer 4 is formed from a transparent resin composition, the sealing sheet 5 includes the release sheet 6, the transparent layer 4, and the phosphor layer 3. Preferably, the sealing sheet 5 includes a release sheet 6, a transparent layer 4, and a phosphor layer 3.

  Separately, as shown in FIG. 2B, a plurality of LEDs 2 are prepared. Specifically, the plurality of LEDs 2 are arranged on the upper surface of the support plate 7.

  The support plate 7 covers and seals the plurality of LEDs 2 with the phosphor layer 3 to obtain a sealed LED assembly 8 (see FIG. 2C described later), cut the sealed LED assembly 8, In order to protect the LED 2 of the phosphor layer-sealed LED 1 until the phosphor layer-sealed LED 1 is peeled after the phosphor layer-sealed LED 1 is obtained, the exposed surface of the LED 2 in the phosphor layer-sealed LED 1 ( It is attached to the lower surface 21) in FIG. That is, the support plate 7 is laminated on the lower surface 21 of the LED 2 so as to support the LED 2 and cover the lower surface 21 of the LED 2 when the phosphor layer-sealed LED 1 is shipped, transported, and stored. Immediately before mounting, as shown by the phantom lines in FIG. 2D, the release plate can peel off the phosphor layer-sealed LED 1. That is, the support plate 7 consists only of a peeling plate.

  The support plate 7 is formed from the same material as the release sheet 6 described above. Moreover, the support plate 7 can also be formed from a heat release sheet from which the sealed LED assembly 8 can be easily peeled off by heating. Furthermore, a pressure sensitive adhesive layer can be disposed on the surface of the support plate 7.

  The thickness of the support plate 7 is, for example, 10 μm or more, preferably 50 μm or more, and for example, 1000 μm or less, preferably 100 μm or less.

  Then, the plurality of LEDs 2 are arranged on the surface (upper surface) of the support plate 7. Specifically, the plurality of LEDs 2 are aligned and arranged in the left-right direction and at intervals in the front-rear direction. In addition, the plurality of LEDs 2 are arranged on the surface (upper surface) of the support plate 7 so that the lower surface 21 (including bumps not shown) of the LED 2 is in contact with the surface (upper surface) of the support plate 7.

  The pitch P of the plurality of LEDs 2, that is, the total P of one LED 2 and the distance between one LED 2 and the adjacent LED 2 is, for example, 0.3 mm or more, preferably 0.5 mm or more. For example, it is 5 mm or less, preferably 3 mm or less. Moreover, the space | interval of several LED2 is 0.1 mm or more, for example, Preferably, it is 0.3 mm or more, for example, is 3 mm or less, Preferably, it is 2 mm or less.

  Then, as shown to the arrow of FIG. 2B, and FIG. 2C, several LED2 is sealed with the sealing sheet 5. FIG.

  For example, the sealing sheet 5 is pressure-bonded to the release sheet 6 that supports the plurality of LEDs 2. Preferably, the sealing sheet 5 is thermocompression-bonded (heat pressed) to the release sheet 6 that supports the plurality of LEDs 2.

  Specifically, first, the sealing sheet 5 and the plurality of LEDs 2 and the release sheet 6 are installed in a flat plate press or the like equipped with a heat source. Although not shown, the flat plate press includes a lower mold and an upper mold disposed to face the upper mold. Specifically, the release sheet 6 is disposed on the upper surface of the lower mold so that the plurality of LEDs 2 face upward. Further, after the sealing sheet 5 shown in FIG. 2A is turned upside down, the release sheet 6 is placed on the upper plate so that the phosphor layer 3 faces downward, that is, the phosphor layer 3 faces the LED 2. Place on the bottom of the mold.

  And the sealing sheet 5, several LED2, and the support plate 7 are hot-pressed by flat plate press.

  When the phosphor layer 3 and / or the transparent layer 4 contains a thermoplastic silicone-based thermosetting resin composition, the temperature in the flat plate press is the thermoplastic temperature of the phenyl-based silicone resin composition or More preferably, from the viewpoint of carrying out the thermoplastic and thermosetting of the phenyl silicone resin composition at a time, it is a heat curing temperature or higher, specifically, for example, 60 ° C. or higher, Preferably, it is 80 degreeC or more, for example, 150 degreeC or less, Preferably, it is 120 degreeC or less.

  The press pressure is, for example, 0.1 MPa or more, preferably 1 MPa or more, and for example, 10 MPa or less, preferably 5 MPa or less.

  The pressing time is, for example, 1 minute or more, preferably 5 minutes or more, and for example, 60 minutes or less, preferably 20 minutes or less.

  When the phosphor layer 3 contains a phenyl silicone resin composition having thermoplasticity and thermosetting property, the phosphor layer 3 is plasticized by the above-described hot pressing. Subsequently, a plurality of LEDs 2 are embedded by the plasticized phosphor layer 3. Specifically, as shown in FIG. 1, the upper surface 22 and the side surface 23 of the LED 2 are covered with the phosphor layer 3.

  Further, when the transparent layer 4 contains a phenyl silicone resin composition having thermoplasticity and thermosetting property by the above-described hot pressing, the transparent layer 4 is plasticized and is in close contact with the phosphor layer 3.

  Thereby, as shown in FIG. 2C, the plurality of LEDs 2 are sealed by the phosphor layer 3 of the sealing sheet 5.

  Thereafter, when the phosphor layer 3 and / or the transparent layer 4 contains a two-stage reaction curable resin composition in a B-stage state, it is C-staged.

  In the case where the two-stage reaction curable resin composition contains a phenyl silicone resin composition, the alkenyl group and / or cycloalkenyl group of the alkenyl group-containing polysiloxane is used in the reaction of the phenyl silicone resin composition (C-stage reaction). And the hydrosilyl addition reaction of the hydrosilyl group-containing polysiloxane with the hydrosilyl group is further promoted. Thereafter, the alkenyl group and / or cycloalkenyl group or the hydrosilyl group of the hydrosilyl group-containing polysiloxane disappears, and the hydrosilyl addition reaction is completed, whereby the product of the C-stage phenyl-based silicone resin composition, A cured product is obtained. That is, by completing the hydrosilyl addition reaction, curability (specifically, thermosetting) is exhibited in the phenyl silicone resin composition.

  The product described above is represented by the following average composition formula (3).

Average composition formula (3):
R ⁵ _e SiO _{(4-e) / 2}
(In the formula, R ⁵ represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms (excluding an alkenyl group and a cycloalkenyl group) including a phenyl group, and e is 0. .5 or more and 2.0 or less.)
The unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms represented by R ⁵ is an unsubstituted or substituted monovalent carbon group having 1 to 10 carbon atoms represented by R ² in the formula (1). Examples thereof are the same as the hydrogen group and the unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms represented by R ³ in the formula (2). Preferably, an unsubstituted monovalent hydrocarbon group, more preferably an alkyl group having 1 to 10 carbon atoms, or an aryl group having 6 to 10 carbon atoms, and more preferably a combination of a phenyl group and a methyl group is used. Can be mentioned.

  e is preferably 0.7 or more and 1.0 or less.

The proportion of the phenyl groups in R ⁵ in the average composition formula of the product (3) is, for example, 30 mol% or more, preferably is 35 mol% or more, and is, for example, 55 mol% or less, preferably 50 mol% or less.

The content ratio of the phenyl group in R ⁵ of the average composition formula (3) of the product is a monovalent hydrocarbon group directly bonded to the silicon atom of the product (indicated by R ⁵ in the average composition formula (3)). This is the phenyl group concentration.

The content ratio of the phenyl group in R ⁵ of the average composition formula (3) of the product is calculated by ¹ H-NMR and ²⁹ Si-NMR. The details of the calculation method of the content ratio of the phenyl group in R ⁵ are calculated by ¹ H-NMR and ²⁹ Si-NMR based on the description of WO2011 / 125463, for example.

  Next, as shown by the arrow in FIG. 2C, the release sheet 6 is peeled off from the transparent layer 4.

  Thereby, the sealed LED assembly 8 including the plurality of LEDs 2, the phosphor layer 3, and the transparent layer 4 is obtained in a state of being supported by the support plate 7.

  Thereafter, as shown by a one-dot chain line in FIG. 2D, the sealed LED assembly 8 is cut so as to divide the plurality of LEDs 2 into pieces. Specifically, the phosphor layer 3 and the transparent layer 4 corresponding to each LED 2 are cut along the front-rear direction and the left-right direction. Thus, the support plate 7 supports the phosphor layer-sealed LED 1 including one LED 2, the phosphor layer 3 that embeds and covers the LED 2, and the transparent layer 4 disposed on the upper surface of the phosphor layer 3. Get in the state that is done.

  Next, as indicated by arrows and phantom lines in FIG. 2D, the plurality of phosphor layer-sealed LEDs 1 are peeled from the support plate 7.

  As a result, as shown in FIG. 2E, a phosphor layer-sealed LED 1 including one LED 2, a phosphor layer 3 that embeds and covers the LED 2, and a transparent layer 4 disposed on the upper surface of the phosphor layer 3. Get.

  The phosphor layer-sealed LED 1 does not include the support plate 7 (see FIG. 2C) and the substrate 50 (described later, see FIG. 2F), and preferably includes the LED 2, the phosphor layer 3, and the transparent layer 4. That is, the phosphor layer-sealed LED 1 is not the LED device 60 (FIG. 2F) described below, that is, does not include the substrate 50 provided in the LED device 60. That is, the phosphor layer-sealed LED 1 is configured so as not to be electrically connected to a terminal (not shown) provided on the substrate 50 of the LED device 60. In addition, the phosphor layer-sealed LED 1 is a component for producing the LED device 60, that is, a component for producing the LED device 60, and is a device that can be distributed and used industrially.

  Thereafter, the plurality of phosphor layer-sealed LEDs 1 are selected according to the emission wavelength and the emission efficiency.

  Next, as illustrated in FIG. 2F, the phosphor layer-sealed LED 1 is mounted on the substrate 50.

  Specifically, first, a substrate 50 having terminals (not shown) provided on the upper surface is prepared.

  The board | substrate 50 comprises the substantially rectangular flat plate shape extended in the front-back direction and the left-right direction, for example, is an insulated substrate. Moreover, the board | substrate 50 is equipped with the terminal (not shown) arrange | positioned on an upper surface.

  Thereafter, as shown in FIG. 2F, the phosphor layer-sealed LED 1 is mounted on the substrate 50.

  Specifically, the bumps (not shown) of the LEDs 2 in the phosphor layer-sealed LED 1 are brought into contact with the terminals (not shown) of the substrate 50 to be electrically connected. That is, the LED 2 of the phosphor layer sealing LED 1 is flip-chip mounted on the substrate 50. Further, the lower surface 32 of the phosphor layer 3 is brought into contact with the substrate 50.

  Thereby, the LED device 60 provided with the board | substrate 50 and fluorescent substance layer sealing LED1 mounted in the board | substrate 50 is obtained. Preferably, the LED device 60 includes a substrate 50 and a phosphor layer-sealed LED 1. That is, the LED device 60 does not include the release sheet 6 and / or the support plate 7, and preferably includes the substrate 50, the LED 2, the phosphor layer 3, and the transparent layer 4.

[Effects of First Embodiment]
And as shown in FIG. 1, since this fluorescent substance layer sealing LED1 is provided with the transparent layer 4 which coat | covers the upper surface 31 of the fluorescent substance layer 3, it can improve emitted light intensity. Specifically, the interface between the transparent resin composition (transparent layer 4) and air can be moved away (separated) from the substrate 50 or the LED 2 (interface between the LED 2 and the phosphor layer 3) which is a light absorber. it can. Therefore, light that is emitted upward from the LED 2 and wavelength-converted by the phosphor layer 3 and light that is not wavelength-converted by the phosphor layer 3 and passes through the phosphor layer 3 are transparent resin composition (transparent layer). 4) Since it is difficult to return to the substrate 50 or the LED 2 (light absorber) even if it is reflected at the interface between air and the light emission intensity of the phosphor layer-sealed LED 1, it can be improved.

  Moreover, since this fluorescent substance layer sealing LED1 satisfies all of (1)-(4) regarding x, y, z, and (alpha) mentioned above, it is excellent in color uniformity, further improving emitted light intensity. And color unevenness can be suppressed.

  Moreover, in this fluorescent substance layer sealing LED1, if the refractive index RIp of the first transparent composition (transparent resin composition contained in the fluorescent substance layer 3) is 1.45 or more and 1.60 or less, fluorescence The emitted light intensity of body layer sealing LED1 can be improved.

  In this phosphor layer-sealed LED 1, the second transparent composition (transparent resin contained in the transparent layer 4) is determined from the refractive index RIp of the first transparent composition (transparent resin composition contained in the phosphor layer 3). If the value obtained by subtracting the refractive index RIt of the composition (refractive index RIp−refractive index RIt) is −0.70 or more and 0.20 or less, the emission intensity of the phosphor layer-sealed LED 1 can be improved. it can.

Further, in this phosphor layer-sealed LED1, if RIp-RIt is 0.05 or more,
The light emission intensity of the phosphor layer-sealed LED 1 can be further improved.

  Moreover, in this fluorescent substance layer sealing LED1, if the distance (alpha) exceeds 50 micrometers, color uniformity can be improved.

  According to the manufacturing method of this fluorescent substance layer sealing LED1, the fluorescent substance layer sealing LED1 can be manufactured simply using the sealing sheet 5. FIG.

  According to the method for manufacturing the phosphor layer-sealed LED 1, the phosphor layer-sealed LED 1 having desired dimensions (y, z, α, etc.) can be easily produced.

[Modification]
In the modification, the same members and steps as those in the first embodiment described above are denoted by the same reference numerals, and detailed description thereof is omitted.

  In 1st Embodiment, although LED2, the fluorescent substance layer 3, and the transparent layer 4 are each formed in the planar view substantially rectangular shape, the shape is not specifically limited. Although not shown, the LED 2, the phosphor layer 3, and the transparent layer 4 can be formed in, for example, a substantially circular shape in plan view and a substantially polygonal shape (except for a substantially rectangular shape) in plan view.

  Furthermore, in the first embodiment, as shown in FIG. 1, the transparent layer 4 is formed in a substantially rectangular shape in sectional view. For example, although not shown, the transparent layer 4 has a sectional dome shape (or convex lens shape) whose upper surface is curved. It can also be formed. In this case, the distance z is a distance from the upper surface 31 of the phosphor layer 3 to the uppermost surface of the transparent layer 4.

  Furthermore, the transparent layer 4 can also be formed in a substantially pyramid shape with a flat cross-section that decreases upward, specifically, a polygonal pyramid shape such as a quadrangular pyramid shape or a triangular pyramid shape.

  Furthermore, in the first embodiment, as shown in FIG. 1, the lower surface 32 around the accommodating portion 30 of the phosphor layer 3 is configured as a phosphor-side contactable surface that can contact the substrate 50. However, for example, as shown in FIG. 5, the lower surface 32 can be configured as a space ensuring surface that can be spaced from the substrate 50.

  As shown in FIG. 5, the lower surface 32 around the housing part 30 of the phosphor layer 3 is exposed from the LED 2 and is located on the upper side of the lower surface 21 of the LED 2. Specifically, the lower surface 32 of the phosphor layer 3 is located between the lower surface 21 and the upper surface 22 of the LED 2 when projected in the surface direction. That is, the lower surface 32 of the phosphor layer 3 is disposed at a position included in the side surface 23 of the LED 2 when projected in the front-rear direction and the left-right direction.

  Thereby, the lower surface 32 of the phosphor layer 3 exposes the lower end portion of the side surface 23 of the LED 2.

  Furthermore, in the first embodiment, the phosphor layer 3 and the transparent layer 4 are sequentially C-staged, that is, the phosphor layer 3 is C-staged, and then the transparent layer 4 is C-staged. The phosphor layer 3 and the transparent layer 4 in the state can be simultaneously C-staged.

  Moreover, in above-described 1st Embodiment, as shown to FIG. 2A-FIG. 2E, the sealing sheet 5 is formed on the peeling sheet 6, and LED2 is sealed with the sealing sheet 5 after that.

  However, as shown in FIGS. 3A to 4H, the sealing sheet 5 is not formed on the release sheet 6, and the phosphor resin composition varnish and the transparent resin composition varnish are formed on the support plate 7. The phosphor layer 3 and the transparent layer 4 can be sequentially formed by sequentially dropping (potting).

  In this method, as shown in FIG. 3C, the varnish of the phosphor resin composition is dropped onto the support plate 7 (potting).

  In order to drop the varnish of the phosphor resin composition onto the support plate 7, first, one LED 2 is arranged on the upper surface of the support plate 7 as shown in FIG. 3A. Thereby, one LED 2 supported by the support plate 7 is prepared.

  Separately, as shown in FIG. 3A, a first dam 11 is prepared.

  The first dam 11 is formed in a substantially rectangular shape in plan view. A first opening 13 that penetrates the first dam 11 in the vertical direction is formed at the center of the first dam 11. The first opening 13 is formed in a substantially rectangular shape in plan view corresponding to the outer shape of the phosphor layer 3.

  Examples of the material of the first dam 11 include a resin, a resin-impregnated glass cloth, and a metal. These can be used alone or in combination. Preferably, a resin is used.

  Examples of the resin include a thermosetting resin and a thermoplastic resin. Preferably, a thermosetting resin is used. Preferably, the thermosetting resin includes a one-stage reaction curable resin that cannot be in a B-stage state. Examples of such a one-step reaction curable resin include a one-step reaction curable methyl silicone resin composition. As the one-step reaction curable methyl silicone resin composition, for example, ELASTOSIL series (manufactured by Asahi Kasei Wacker Silicone, specifically, methyl silicone resin compositions such as ELASTOSIL LR7665), KER series (manufactured by Shin-Etsu Silicone) Commercial products such as are used.

  In addition, resin may be prepared as a resin composition which mix | blended the filler.

  The thickness of the 1st dam 11 is 100 micrometers or more, for example, Preferably, it is 200 micrometers or more, More preferably, it is 400 micrometers or more, for example, is 1500 micrometers or less.

  Next, as shown in FIG. 3B, the first dam 11 is disposed on the upper surface of the support plate 7 so as to surround the LED 2.

  In order to arrange the first dam 11 on the upper surface of the support plate 7 so as to surround the LED 2, first, when the material of the first dam 11 is resin, a varnish containing resin is prepared, and then the varnish is illustrated. Apply to the surface of the release sheet. Thereafter, when the material contains a thermosetting resin, the varnish is heated and cured. Thereafter, the cured product is externally processed into the pattern described above.

  Thereafter, as shown by the arrow in FIG. 3A and FIG. 3B, the first dam 11 is placed on the upper surface of the support plate 7 so that the LED 2 is inserted into the first opening 13 of the first dam 11.

  Alternatively, as shown in FIG. 3B, the first dam 11 can be directly formed on the upper surface of the support plate 7 by directly applying the varnish around the LED 2 in the pattern described above.

  Accordingly, the first dam 11 is arranged on the upper surface of the support plate 7 so as to surround the LED 2.

  Next, as shown in FIG. 3C, the varnish of the phosphor resin composition is dropped into the first opening 13 of the first dam 11 in the support plate 7. Specifically, the varnish is dropped into the first opening 13 so that the liquid level of the varnish is flush with the upper surface of the first dam 11.

Thereafter, when the phosphor resin composition contains a thermosetting resin composition that can be in a B-stage state, the phosphor resin composition is B-staged.

  Thereby, the phosphor layer 3 that covers the upper surface 22 and the side surface 23 of the LED 2 is formed in the first opening 13 of the first dam 11.

  Next, as shown by the arrow in FIG. 3C, the first dam 11 is peeled off from the support plate 7. At this time, the side surface of the first opening 13 of the first dam 11 is peeled from the side surface 33 of the phosphor layer 3.

  Subsequently, as shown in FIGS. 3D and 3E, the second dam 12 is disposed on the upper surface of the support plate 7.

  The second dam 12 is configured in the same manner as the first dam 11 except for the thickness. The thickness of the second dam 12 is formed to be thicker than the thickness of the first dam 11, and specifically, the thickness can be adjusted so that the phosphor layer 3 can be fitted and the transparent layer 4 can be formed. Has been. The thickness of the second dam 12 is, for example, 0.1 μm or more, preferably 0.2 μm or more, and, for example, 2 μm or less, preferably 1 μm or less.

  As shown in FIG. 3D, the second dam 12 has a second opening 14 having the same shape as the phosphor layer 3 in plan view.

  As shown in FIG. 3E, the second dam 12 is placed on the upper surface of the support plate 7 on the support plate 7 so that the phosphor layer 3 is inserted into the second opening 14. As a result, the phosphor layer 3 is fitted into the second opening 14.

  Thereafter, as shown in FIG. 4F, a varnish of the transparent resin composition is dropped (potted) into the second opening 14 on the upper surface of the phosphor layer 3. Specifically, the varnish is dropped into the second opening 14 so that the liquid level of the varnish is flush with the upper surface of the second dam 12.

  Thereafter, when the transparent resin composition contains a thermosetting resin composition that can be in a B-stage state, the transparent resin composition is thermoset (specifically, C-staged). Thereby, the transparent layer 4 is formed on the upper surface of the phosphor layer 3.

  When the transparent resin composition is C-staged, if the phosphor resin composition of the phosphor layer 3 is in a B-staged state of the two-stage reaction curable resin composition, it is C-staged.

  Thereafter, as shown in FIG. 4G, they are cut along the interface between the phosphor layer 3 and the transparent layer 4 and the second dam 12.

  As a result, a phosphor layer-sealed LED 1 including one LED 2, a phosphor layer 3, and a transparent layer 4 is obtained in a state where it is supported by the support plate 7.

  Next, as shown in the arrows and phantom lines in FIG. 4G and FIG. 4H, the phosphor layer sealing LED 1 is peeled from the support plate 7.

  Thereafter, the phosphor layer-sealed LEDs 1 are sorted according to the emission wavelength and the emission efficiency.

  Thereafter, as shown in FIG. 4I, the phosphor layer-sealed LED 1 is mounted on the substrate 50.

  And according to the method of FIG. 4A-FIG. 4I, since it is not necessary to once manufacture the sealing sheet 5 on the peeling sheet 6 like 1st Embodiment (refer FIG. 2A), phosphor resin composition The phosphor layer 3 and the transparent layer 4 can be easily formed sequentially from the varnish of the product and the varnish of the transparent resin composition.

Second Embodiment
In the second embodiment, the same members and steps as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

[Phosphor layer sealed LED]
In the first embodiment, as shown in FIG. 1, the side surface 33 of the phosphor layer 3 is exposed. However, in the second embodiment, as shown in FIG. 6, the side surface 33 of the phosphor layer 3 is covered with the transparent layer 4.

  That is, the transparent layer 4 covers the upper surface 31 and the side surface 33 of the phosphor layer 3. The transparent layer 4 is formed in a shape that includes the phosphor layer 3 in plan view. The transparent layer 4 has a side portion 45 that covers the side surface 33 of the phosphor layer 3. The lower surface 41 of the side portion 45 of the transparent layer 4 is a transparent side contactable surface that can contact the substrate 50 (virtual line).

  And since the transparent layer 4 has the side part 45, the side surface 43 (transparent side connection surface) of the transparent layer 4 is opposingly arranged on the outer side of the side surface 33 of the fluorescent substance layer 3 across the distance (beta).

  The distance β at which the side surface 43 of the transparent layer 4 is separated from the side surface 33 of the phosphor layer 3 is the left-right direction length and the front-rear direction length (minimum length) of the side portion 45 of the transparent layer 4.

  The distance β is appropriately selected from a range exceeding 0.

  In the second embodiment, it is preferable that the following (3) ′ is satisfied instead of (3) among (1) to (4) of the first embodiment.

  (3) ′ The sum (α + β) of the distance α and the distance β is, for example, 50 μm or more, preferably more than 50 μm, more preferably 100 μm or more, and, for example, 2000 μm or less, preferably 1000 μm or less. It is. If α + β is equal to or greater than the above lower limit, color uniformity can be prevented from being lowered, or color unevenness can be suppressed. If α + β is less than or equal to the above upper limit, useless use of materials can be suppressed.

  In the first embodiment, β is 0. Therefore, in the present invention, β is preferably 0 or more.

[Method for producing phosphor layer-sealed LED]
Next, a method for manufacturing the phosphor layer-sealed LED shown in FIG. 6 and a method for manufacturing an LED device using the phosphor layer-sealed LED will be described with reference to FIGS. 7A to 8L.

  The manufacturing method of the phosphor layer-sealed LED 1 includes a step of manufacturing a phosphor sealing sheet 15 including the phosphor layer 3 (an example of a phosphor layer preparing step, see FIG. 7A), a phosphor sealing sheet 15 The step of arranging the layer 3 so as to cover the plurality of LEDs 2 (an example of the step of arranging the phosphor layer, see FIG. 7B), and the step of removing the phosphor layer 3 remote from the LED 2 (individualization / An example of the removing step, see FIG. 7D), a step of manufacturing the transparent sheet 18 including the transparent layer 4 (an example of the transparent layer preparing step, see FIG. 8G), and the phosphor layer sealing LED1 on the second support plate 17 The process of rearrangement (refer FIG. 8G) and the process of arrange | positioning the transparent sheet 18 on the fluorescent substance layer 3 (an example of a transparent layer arrangement | positioning process, FIG. 8H) are provided.

  In this method, first, a plurality of LEDs are prepared as shown in FIG. 7A.

  Separately, a fluorescent sealing sheet 15 including the phosphor layer 3 is prepared.

  In order to prepare the fluorescent sealing sheet 15, first, as shown in FIG. 7A, a release sheet 6 is prepared.

  Next, the phosphor layer 3 is formed in a sheet shape on the lower surface of the release sheet 6. The method for forming the phosphor layer 3 is the same as the method for forming the phosphor layer 3 in the first embodiment.

  Thereby, the fluorescent sealing sheet 15 provided with the peeling sheet 6 and the fluorescent substance layer 3 formed in the lower surface of the peeling sheet 6 is prepared.

  In addition, the fluorescence sealing sheet 15 does not have the transparent layer 4 (refer FIG. 8G) demonstrated later. Preferably, the fluorescent sealing sheet 15 includes the release sheet 6 and the phosphor layer 3.

  Next, as shown in FIG. 7B, the plurality of LEDs 2 are sealed with the phosphor layer 3. That is, the fluorescent sealing sheet 15 is pressure-bonded to the support plate 7 that supports the LED 2. Thereby, the lower surface 32 in the fluorescent sealing sheet 15 is formed in a shape corresponding to the surface of the plurality of LEDs 2 by embedding the plurality of LEDs 2. On the other hand, the upper surface 31 of the phosphor layer 3 in the phosphor encapsulating sheet 15 is formed flat. The phosphor layer 3 covers the side surface 23 and the upper surface 22 of the LED 2.

  Thereafter, in this method, the release sheet 6 is peeled off from the phosphor layer 3 as shown in FIG. 7C.

  Then, in this method, as shown in FIG. 7D, the phosphor layer 3 that is remote from the LED 2 is removed.

  Specifically, the phosphor layer 3 remote from the LED 2 is cut by a disc-shaped dicing saw (dicing blade) 9 having a predetermined width (wall thickness). Accordingly, in the phosphor layer 3, the length α of the side portion 35 is adjusted to a desired dimension. That is, the phosphor layer 3 is trimmed so as to have a predetermined dimension.

  At the same time, the phosphor layer-sealed LED 1 is singulated. That is, the fluorescent sealing sheet 15 is cut so that the phosphor layer sealing LEDs 1 are separated into individual pieces. At this time, the phosphor layer 3 covering the side surface 23 of the LED 2 is left.

  Subsequently, as shown in FIG. 7E, the separated phosphor layer-sealed LED 1 is peeled off from the support plate 7.

  Thereby, fluorescent substance layer sealing LED1 provided with LED2 and the fluorescent substance layer 3 which has a predetermined dimension is obtained. In the second embodiment, the phosphor layer-sealed LED 1 indicated by the phantom line in FIG. 7E and the solid line in FIG. 7F does not include the transparent layer 4. That is, the phosphor layer-sealed LED 1 is preferably composed of the LED 2 and the phosphor layer 3.

  In this method, as shown in FIG. 8G, the plurality of phosphor layer-sealed LEDs 1 are then aligned on the second support plate 17 with a space therebetween in the front-rear direction and the left-right direction. That is, the phosphor layer sealing LED 1 is rearranged with respect to the second support plate 17.

  The second support plate 17 has the same configuration as the above-described support plate 7.

  Separately, as shown in FIG. 8G, a transparent sheet 18 including the transparent layer 4 is prepared.

  In order to prepare the transparent sheet 18, first, as shown in FIG. 8G, the transparent layer 4 is formed in a sheet shape on the lower surface of the second release sheet 19. The second release sheet 19 has the same configuration as the release sheet 6 described above. The method for forming the transparent layer 4 is the same as the method for forming the phosphor layer 3 in the first embodiment. The second transparent composition preferably contains a filler.

  Thereby, the transparent sheet 18 provided with the 2nd peeling sheet 19 and the transparent layer 4 formed in the lower surface of the 2nd peeling sheet 19 is prepared.

  The transparent sheet 18 does not have the phosphor layer 3 described above. Preferably, the transparent sheet 18 includes the second release sheet 19 and the transparent layer 4.

  Next, in this method, as shown in FIG. 8H, the transparent layer 4 covers the plurality of phosphor layers 3 that cover the plurality of LEDs 2.

  Specifically, the 2nd peeling sheet 19 is crimped | bonded with respect to the 2nd support plate 17 which supports fluorescent substance layer sealing LED1.

  When the transparent resin composition contains a B-stage (semi-cured) phenyl silicone resin composition, thermocompression bonding is performed. Thereby, the B-stage phenyl-based silicone resin composition is once plasticized by heating, whereby the transparent resin composition is filled between the plurality of phosphor layers 3. Thereafter, the transparent resin composition is completely cured.

  Next, as shown in FIG. 8I, the second release sheet 19 is peeled off from the transparent layer 4.

  As a result, as shown in FIG. 8I, the sealed LED assembly 8 in which the plurality of LEDs 2 are sealed is obtained by the phosphor layer 3 on which the transparent layer 4 is laminated while being supported by the second support plate 17. It is done.

  Next, as shown in FIG. 8J, the sealed LED assembly 8 is cut so that the plurality of LEDs 2 are separated.

  Next, as shown in the arrow in FIG. 8J and FIG. 8K, the plurality of phosphor layer-sealed LEDs 1 are peeled off from the support plate 7 to obtain the phosphor layer-sealed LED 1.

  Then, as shown to FIG. 8L, fluorescent substance layer sealing LED1 is mounted in the board | substrate 50, and the LED device 60 is obtained. Specifically, the lower surface 41 of the side portion 45 of the transparent layer 4 is in contact with the substrate 50 so that the virtual line in FIG.

[Effects of Second Embodiment]
And in this fluorescent substance layer sealing LED1, as shown in FIG. 6, since the transparent layer 4 has the side part 45 which coat | covers the side surface 33 of the fluorescent substance layer 3, it is transparent resin like 1st Embodiment. The interface between the composition (transparent layer 4) and air can be moved away (separated) from the substrate 50 and the LED 2 (interface between the LED 2 and the phosphor layer 3) which are light absorbers. Therefore, light that is emitted upward from the LED 2 and wavelength-converted by the phosphor layer 3 and light that is not wavelength-converted by the phosphor layer 3 and passes through the phosphor layer 3 are transparent resin composition (transparent Even if it is reflected at the interface between the layer 4) and the air, it is difficult to return to the substrate 50 or the LED 2 (light absorber), so that the emission intensity of the phosphor layer-sealed LED 1 can be improved.

  On the other hand, in the second embodiment, as shown in FIG. 8G, the phosphor layer-sealed LED 1 on which the phosphor layer 3 is disposed is then placed on a support stand different from the support plate 7, that is, the second support plate. Then, the phosphor layer 3 is covered with the transparent layer 4 as shown in FIG. 8H.

  On the other hand, in the method of the first embodiment, as described above, unlike the second embodiment, it is not necessary to rearrange the LED 2 on which the phosphor layer 3 is disposed on the second support plate 17. Therefore, the phosphor layer-sealed LED 1 is manufactured by a simple method.

  Further, the side surface 33 and the side surface 43 can be formed on the phosphor layer 3 and the transparent layer 4 in the phosphor layer-sealed LED 1 by a simple method such as cutting, respectively.

  As shown in FIG. 7A, the phosphor layer-sealed LED 1 is manufactured by a phosphor layer preparing step for preparing a phosphor encapsulating sheet 15 including a sheet-like phosphor layer 3, and a sheet-like phosphor layer 3. The phosphor layer-sealed LED 1 having excellent emission intensity can be easily produced using the sheet-like phosphor layer 3. .

  Moreover, according to the manufacturing method of this fluorescent substance layer sealing LED1, as shown to FIG. 7D, in an individualization / removal process, after a fluorescent substance layer arrangement | positioning process, before a transparent layer arrangement | positioning process, The phosphor layer 3 is separated into pieces corresponding to the plurality of LEDs 2 and at the same time, the phosphor layer 3 remote from the LED 2 is removed, so that the phosphor layer-sealed LED 1 having a desired size can be obtained with a small number of man-hours. Can be manufactured.

  Furthermore, according to the method for manufacturing the phosphor layer-sealed LED 1, as shown in FIG. 7D, in the singulation / removal step, the phosphor layer 3 covering the side surface 23 of the LED 2 is left, so that a desired dimension is obtained. The phosphor layer-sealed LED 1 including the phosphor layer 3 can be easily manufactured.

  Moreover, according to the manufacturing method of this fluorescent substance layer sealing LED1, as shown to FIG. 8G, since the sheet-like transparent layer 4 is used, fluorescent substance sealing LED 1 which is excellent in emitted light intensity can be manufactured simply. it can.

[Modification]
In the second embodiment, as shown in FIG. 6, the lower surface 32 around the accommodating portion 30 of the phosphor layer 3 and the lower surface 41 of the side portion 45 of the transparent layer 4 can contact the substrate 50. The phosphor-side contactable surface and the transparent-side contactable surface are configured. However, for example, as shown in FIG. 9, both the lower surface 32 around the accommodating portion 30 of the phosphor layer 3 and the lower surface 41 of the side portion 45 of the transparent layer 4 can be separated from the substrate 50. It can be configured as a space ensuring surface.

  As shown in FIG. 9, the lower surface 32 around the accommodating portion 30 of the phosphor layer 3 and the lower surface 41 of the side portion 45 of the transparent layer 4 are located in an upper portion than the lower surface 21 of the LED 2. Specifically, the lower surface 32 around the housing portion 30 of the phosphor layer 3 and the lower surface 41 of the side portion 45 of the transparent layer 4 are between the lower surface 21 and the upper surface 22 of the LED 2 when projected in the surface direction. Is located. That is, the lower surface 32 around the housing portion 30 of the phosphor layer 3 and the lower surface 41 of the side portion 45 of the transparent layer 4 are located at positions included in the side surface 23 of the LED 2 when projected in the front-rear direction and the left-right direction. Has been placed.

  Moreover, in 2nd Embodiment, as shown to FIG. 7B, although the upper surface 31 of the fluorescent substance layer 3 in the fluorescent sealing sheet 15 is formed flat, for example, as shown to FIG. The upper surface 31 of the layer 3 can also be formed in the uneven | corrugated shape corresponding to the surface of several LED2.

  Such a modification includes a step of manufacturing a phosphor encapsulating sheet 15 including the phosphor layer 3 (an example of a phosphor layer preparing step, see FIG. 10A), and a plurality of phosphor encapsulating sheets 15 including the phosphor layer 3. The step of arranging the LED 2 so as to cover the LED 2 (an example of the phosphor layer arranging step, see FIG. 10B) and the step of removing the phosphor layer 3 remote from the LED 2 (an example of the removing step, see FIG. 10D). ), A step of manufacturing a transparent sheet 18 including the transparent layer 4 (an example of a transparent layer preparation step, see FIG. 8G), and a step of rearranging the phosphor layer-sealed LED 1 on the second support plate 17 (see FIG. 8G). ) And a step of placing the transparent sheet 18 on the phosphor layer 3 (FIG. 8H).

  In this method, first, a plurality of LEDs are prepared as shown in FIG. 10A.

  Separately, a fluorescent sealing sheet 15 including the phosphor layer 3 is prepared. In order to prepare the fluorescent sealing sheet 15, first, as shown in FIG. 10A, a release sheet 6 is prepared.

  Next, the phosphor layer 3 is formed on the lower surface of the release sheet 6. Thereby, the fluorescent sealing sheet 15 provided with the peeling sheet 6 and the fluorescent substance layer 3 formed in the lower surface of the peeling sheet 6 is prepared.

  Next, as shown in FIG. 10B, the plurality of LEDs 2 are sealed with the phosphor layer 3. That is, the fluorescent sealing sheet 15 is pressure-bonded to the support plate 7 that supports the LED 2. At this time, the fluorescent encapsulating sheet 15 is placed on the LED 2 and the support plate 7 by a press which is disposed on the upper side of the release sheet 6 and includes a top mold having recesses corresponding to the plurality of LEDs 2 and a flat bottom mold. Crimp against. The phosphor layer 3 has a plurality of convex portions corresponding to the plurality of LEDs 2 by the press described above. The release sheet 6 covers the surface of the phosphor layer 3 (including the side surface of the surface of the protrusion).

  Thereafter, in this method, the release sheet 6 is peeled off from the phosphor layer 3 as shown in FIG. 10C.

  Next, in this method, as shown in FIG. 10D, the phosphor layer 3 is cut and then separated into the phosphor layer-sealed LEDs 1 as shown in FIG. 10E. Thereafter, the separated phosphor layer-sealed LED 1 is peeled off from the support plate 7.

  That is, as shown in FIG. 10D, the phosphor layer 3 is trimmed so as to have a predetermined dimension. As a result, the phosphor layer 3 remote from the LED 2 is removed.

  Thereby, as shown to FIG. 10E, fluorescent substance layer sealing LED1 provided with LED2 and the fluorescent substance layer 3 which has a predetermined dimension is obtained. In the second embodiment, the phosphor layer-sealed LED 1 indicated by the phantom line in FIG. 10D and the solid line in FIG. 10E does not include the transparent layer 4. That is, the phosphor layer-sealed LED 1 is preferably composed of the LED 2 and the phosphor layer 3.

  Then, the transparent layer 4 is laminated | stacked on the fluorescent substance layer 3 like 2nd Embodiment (FIG. 8G-FIG. 8L).

  Specifically, as shown in FIG. 8G, first, a plurality of phosphor layer-sealed LEDs 1 are aligned and arranged on the second support plate 17 at intervals in the front-rear direction and the left-right direction. Separately, as shown in FIG. 8G, a transparent sheet 18 including the transparent layer 4 is prepared.

  Next, as shown in FIG. 8H, the transparent layer 4 covers the plurality of phosphor layers 3 that cover the plurality of LEDs 2. Specifically, the transparent layer 4 is pressure-bonded to the phosphor layer 3 and the second support plate 17 by a flat plate press having a lower mold and a lower mold.

  Next, as shown in FIG. 8I, the second release sheet 19 is peeled off from the transparent layer 4. Next, as shown in FIG. 8J, the sealed LED assembly 8 is cut so that the plurality of LEDs 2 are separated. Next, as shown in the arrow in FIG. 8J and FIG. 8K, the plurality of phosphor layer-sealed LEDs 1 are peeled off from the support plate 7 to obtain the phosphor layer-sealed LED 1. Then, as shown to FIG. 8L, fluorescent substance layer sealing LED1 is mounted in the board | substrate 50, and the LED device 60 is obtained.

  Moreover, in 2nd Embodiment, as shown to FIG. 8G, first, the transparent sheet 18 provided with the transparent layer 4 is prepared, and the several fluorescent substance layer which coat | covers several LED2 with the sheet-like transparent layer 4 after that is prepared. For example, as shown in FIG. 8I, the LED 2 is directly mounted on the second support plate 17 from the transparent resin composition (varnish, powder, tablet, etc. prepared from). For example, the transparent layer 4 may be formed into a sheet shape by potting, transfer molding, compression molding, or the like so as to cover it.

<Third Embodiment>
In the third embodiment, the same members and steps as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

[Phosphor layer sealed LED]
As shown in FIG. 11, the phosphor layer 3 has a flange 36 at the peripheral end thereof.

  The eaves part 36 is an overhang | projection part which protrudes in the surface direction outer side from the part which coat | covers the side surface 23 of LED2. The upper surface of the flange portion 36 of the phosphor layer 3 is located so as to be lowered one step downward from the portion covering the upper surface 22 of the LED 2 in the phosphor layer 3. Therefore, the upper surface of the flange portion 36 and the above-described portion A step is formed between the upper surface 31 and the upper surface 31. The outer peripheral surface 37 of the flange portion 36 is exposed outward from the side surface 43 of the transparent layer 4. The outer peripheral surface 37 of the flange portion 36 is formed flush with the side surface 43 of the transparent layer 4 in the vertical direction.

  The upper surface 39 of the flange portion 36 is in contact with the lower surface 41 of the side portion 45 of the transparent layer 4.

[Method of manufacturing phosphor layer-sealed LED and method of manufacturing LED device]
Next, a method for manufacturing the phosphor layer-sealed LED shown in FIG. 11 and a method for manufacturing an LED device using the phosphor layer-sealed LED will be described with reference to FIGS. 12A to 13I.

  In the method for manufacturing the phosphor layer-sealed LED 1, the step of manufacturing the phosphor sealing sheet 15 (see FIG. 12A) and the phosphor sealing sheet 15 are arranged so that the phosphor layer 3 covers the plurality of LEDs 2. A step (see FIG. 12B), a step of forming the recess 24 in the phosphor layer 3 between the adjacent LEDs 2 (see FIG. 12C), and a step of manufacturing the transparent sheet 18 including the transparent layer 4 (see FIG. 12D). The step of disposing the transparent sheet 18 on the phosphor layer 3 (see FIG. 13E) and the phosphor layer 3 and the transparent layer 4 that are remote from the LED 2 are cut into individual phosphor layer-sealed LEDs 1. And a step of separating (see FIG. 13F).

  As shown by the arrow in FIG. 12B, after the fluorescent sealing sheet 15 is disposed on the support plate 7, the release sheet 6 is peeled off.

  The upper surface of the phosphor layer 3 has a flat surface.

  As shown in FIG. 12C, in order to form the recess 24 in the phosphor layer 3, the phosphor layer 3 remote from the LED 2 is removed.

  Specifically, the upper end portion of the phosphor layer 3 remote from the LED 2 is half-cut by the dicing saw 9.

  By forming the recess 24, the flange 36 is formed in the phosphor layer 3.

  Thereafter, as shown in FIG. 13E, the transparent layer 4 of the transparent sheet 18 is disposed on the phosphor layer 3. The transparent layer 4 is preferably made of a transparent resin composition made of a methyl silicone resin composition from the viewpoint of obtaining excellent gas permeability.

  Next, as shown in FIG. 13F, the phosphor layer 3 and the transparent layer 4 which are remote from the LED 2 are cut.

  As a result, as shown in FIG. 13G, a plurality of phosphor layer-sealed LEDs 1 are obtained in a state where they are supported by the second support plate 17.

  Thereafter, as shown in FIG. 13H, the plurality of phosphor layer-sealed LEDs 1 are transferred to the transfer sheet 25.

  Thereafter, as shown in FIG. 13I, the phosphor layer-sealed LED 1 is retransferred from the transfer sheet 25 to the substrate 50, and the phosphor layer-sealed LED 1 is mounted on the substrate 50. Thereby, the LED device 60 is obtained.

[Effects of Third Embodiment]
In this phosphor layer-sealed LED 1, as shown in FIG. 11, the inner peripheral surface 38 of the housing portion 30 covers the side surface 23 of the LED 2, while the outer peripheral surface 37 of the collar portion 36 of the phosphor layer 3 is lateral. Is exposed. Therefore, the light emitted from the LED 2 toward the side is sufficiently wavelength-converted by the flange portion 36 of the phosphor layer 3, while the light emitted upward from the LED 2 is wavelength-converted by the phosphor layer 3. The converted light and the light that is not wavelength-converted and passes through the phosphor layer 3 can be appropriately mixed in the transparent layer 4. As a result, the phosphor layer-sealed LED 1 is excellent in light distribution (suppression of color unevenness).

  Moreover, the methyl silicone resin composition contained in the transparent layer 4 has a higher pressure-sensitive adhesive force (adhesive strength) than the phenyl silicone resin composition. Therefore, in the method shown in FIGS. 7A to 8K of the second embodiment, if the plurality of LEDs 2 exposing the upper surface of the second support plate 17 are covered with the transparent layer 4 described above in the process of FIG. 4 adheres to the upper surface of the second support plate 17 with a relatively high pressure-sensitive adhesive force (adhesive force). Therefore, there is a case where the transfer sheet 25 (see FIGS. 13G and 13H) cannot be successfully transferred thereafter (that is, the transparent layer 4 does not peel from the upper surface of the second support plate 17).

  However, in the method shown in FIGS. 12A to 13I of the third embodiment, since the transparent layer 4 does not contact (pressure-sensitive adhesion) with the upper surface of the support plate 7, the transparent layer 4 is pressure-sensitively bonded to the support plate 7. (Adhesion) can be prevented.

  Furthermore, this method does not need to include the step of rearranging the phosphor layer-sealed LED 1 on the second support plate 17 as shown in FIG. 8G as in the second embodiment. Therefore, the manufacturing man-hour can be reduced and the manufacturing cost can be reduced.

<Modification>
A modification of the manufacturing method of the phosphor layer-sealed LED 1 is shown in FIG. 7D, and the step of removing the phosphor layer 3 remote from the LED 2 is shown in FIG. The manufacturing method of the second embodiment is the same as the manufacturing method of the second embodiment except that the step of rearranging the second support plate 17 is not provided.

  Moreover, this modification is the same as the manufacturing method of 3rd Embodiment except not providing the process (refer FIG. 12C) which forms the recessed part 24 of 3rd Embodiment.

  That is, in this method, first, a plurality of LEDs 2 are prepared on the support plate 7 as shown in FIG. 14A. At the same time, a fluorescent sealing sheet 15 including the release sheet 6 and the phosphor layer 3 is prepared.

  Next, as shown in FIG. 14B, the plurality of LEDs 2 are encapsulated by the phosphor layer 3 of the phosphor encapsulating sheet 15. Specifically, the phosphor layer 3 is pressure-bonded to the plurality of LEDs 2 and the support plate 7 by a flat plate press including a lower mold and a lower mold.

  As a result, a recess 24 is formed in the phosphor layer 3. Therefore, the collar part 36 is formed in the phosphor layer 3.

  Next, as shown in FIG. 14C, the release sheet 6 is peeled off from the phosphor layer 3.

  Next, as illustrated in FIG. 14D, a transparent sheet 18 including the transparent layer 4 and the second release sheet 19 is prepared.

  Next, as shown in FIG. 15E, the transparent layer 4 of the transparent sheet 18 is disposed on the upper surface of the phosphor layer 3, and then the second release sheet 19 is peeled off from the transparent layer 4. Thereby, the sealed LED aggregate 8 is obtained.

  Thereafter, as shown in FIG. 15F, the sealed LED assembly 8 is cut into individual phosphor-layer-sealed LEDs 1.

  Thereby, as shown to FIG. 15G, fluorescent substance layer sealing LED1 is obtained.

  Thereafter, after selecting the phosphor layer-sealed LED 1, as shown in FIG. 15H, the sorted phosphor layer-sealed LED 1 is mounted on the substrate 50 to obtain the LED device 60.

  And in this modification, there exists an effect similar to above-described 3rd Embodiment.

  In addition, the method shown in FIGS. 14A to 15G removes the phosphor layer 3 shown in FIG. 7D and remote from the LED 2 as compared to the method of manufacturing the phosphor layer-sealed LED 1 in the second embodiment. It is not necessary to include the process of performing and the process of rearranging the phosphor layer-sealed LED1 on the second support plate 17 as shown in FIG. 8G. Therefore, the manufacturing man-hour can be reduced and the manufacturing cost can be reduced.

  Specific numerical values such as blending ratio (content ratio), physical property values, and parameters used in the following description are described in the above-mentioned “Mode for Carrying Out the Invention”, and the corresponding blending ratio (content ratio) ), Physical property values, parameters, etc. may be replaced with the upper limit values (numerical values defined as “less than” or “less than”) or lower limit values (numbers defined as “greater than” or “exceeded”). it can.

<Synthesis of alkenyl group-containing polysiloxane and hydrosilyl group-containing polysiloxane>
Synthesis example 1
In a four-necked flask equipped with a stirrer, reflux condenser, charging port and thermometer, 93.2 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 140 g of water, trifluoromethanesulfone 0.38 g of acid and 500 g of toluene were added and mixed. While stirring, a mixture of 729.2 g of methylphenyldimethoxysilane and 330.5 g of phenyltrimethoxysilane was added dropwise over 1 hour, and then heated under reflux for 1 hour. Then, it cooled, the lower layer (water layer) was isolate | separated and removed, and the upper layer (toluene solution) was washed with water 3 times. 0.40 g of potassium hydroxide was added to the toluene solution washed with water, and the mixture was refluxed while removing water from the water separation tube. After completion of water removal, the mixture was further refluxed for 5 hours and cooled. Thereafter, 0.6 g of acetic acid was added for neutralization, and then the toluene solution obtained by filtration was washed with water three times. Then, liquid alkenyl group containing polysiloxane A was obtained by concentrating under reduced pressure. The average unit formula and average composition formula of the alkenyl group-containing polysiloxane A are as follows.

Average unit formula:
((CH ₂ = CH) (CH ₃ ) ₂ SiO _1/2 ) _0.15 (CH ₃ C ₆ H ₅ SiO _2/2 ) _0.60 (C ₆ H ₅ SiO _3/2 ) _0.25
Average composition formula:
(CH ₂ = CH) _0.15 (CH ₃ ) _0.90 (C ₆ H ₅ ) _0.85 SiO _1.05
That is, the alkenyl group-containing polysiloxane A is represented by the above average composition formula (1) in which R ¹ is a vinyl group, R ² is a methyl group and a phenyl group, and a = 0.15 and b = 1.75. .

  Moreover, it was 2300 when the weight average molecular weight of polystyrene conversion of the alkenyl group containing polysiloxane A was measured by the gel permeation chromatography.

Synthesis example 2
In a four-necked flask equipped with a stirrer, reflux condenser, charging port and thermometer, 93.2 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 140 g of water, trifluoromethanesulfone 0.38 g of acid and 500 g of toluene were added and mixed. While stirring, a mixture of 173.4 g of diphenyldimethoxysilane and 300.6 g of phenyltrimethoxysilane was added dropwise over 1 hour. After completion of the addition, the mixture was heated to reflux for 1 hour. Then, it cooled, the lower layer (water layer) was isolate | separated and removed, and the upper layer (toluene solution) was washed with water 3 times. 0.40 g of potassium hydroxide was added to the toluene solution washed with water, and the mixture was refluxed while removing water from the water separation tube. After completion of water removal, the mixture was further refluxed for 5 hours and cooled. After neutralizing by adding 0.6 g of acetic acid, the toluene solution obtained by filtration was washed with water three times. Then, liquid alkenyl group containing polysiloxane B was obtained by concentrating under reduced pressure. The average unit formula and average composition formula of the alkenyl group-containing polysiloxane B are as follows.

Average unit formula:
(CH ₂ = CH (CH ₃ ) ₂ SiO _1/2 ) _0.31 ((C ₆ H ₅ ) ₂ SiO _2/2 ) _0.22 (C ₆ H ₅ SiO _3/2 ) _0.47
Average composition formula:
(CH ₂ = CH) _0.31 (CH ₃ ) _0.62 (C ₆ H ₅ ) _0.91 SiO _1.08
That is, the alkenyl group-containing polysiloxane B is represented by the above average composition formula (1) in which R ¹ is a vinyl group, R ² is a methyl group and a phenyl group, and a = 0.31 and b = 1.53. .

  Moreover, it was 1000 when the weight average molecular weight of polystyrene conversion of the alkenyl group containing polysiloxane B was measured by gel permeation chromatography.

Synthesis example 3
Diphenyldimethoxysilane (325.9 g), phenyltrimethoxysilane (564.9 g), and trifluoromethanesulfonic acid (2.36 g) were added to a four-necked flask equipped with a stirrer, reflux condenser, inlet, and thermometer. Then, 134.3 g of 1,1,3,3-tetramethyldisiloxane was added, and 432 g of acetic acid was added dropwise over 30 minutes while stirring. After completion of dropping, the mixture was heated to 50 ° C. with stirring and reacted for 3 hours. After cooling to room temperature, toluene and water were added, mixed well and allowed to stand, and the lower layer (aqueous layer) was separated and removed. Thereafter, the upper layer (toluene solution) was washed with water three times and then concentrated under reduced pressure to obtain hydrosilyl group-containing polysiloxane C (crosslinking agent C).

  The average unit formula and average composition formula of the hydrosilyl group-containing polysiloxane C are as follows.

Average unit formula:
(H (CH ₃ ) ₂ SiO _1/2 ) _0.33 ((C ₆ H ₅ ) ₂ SiO _2/2 ) _0.22 (C ₆ H ₅ PhSiO _3/2 ) _0.45
Average composition formula:
H _0.33 (CH ₃ ) _0.66 (C ₆ H ₅ ) _0.89 SiO _1.06
That is, the hydrosilyl group-containing polysiloxane C is represented by the above average composition formula (2) in which R ³ is a methyl group and a phenyl group, and c = 0.33 and d = 1.55.

  Moreover, it was 1000 when the weight average molecular weight of polystyrene conversion of hydrosilyl group containing polysiloxane C was measured by gel permeation chromatography.

<Other raw materials>
Raw materials other than alkenyl group-containing polysiloxane and hydrosilyl group-containing polysiloxane will be described in detail below.
LR7665:
Product name, methyl silicone resin composition, refractive index 1.41, inorganic filler A manufactured by Asahi Kasei Wacker Silicone Co., Ltd .:
Refractive index 1.55, composition and composition ratio (mass%): SiO ₂ / Al ₂ O ₃ / CaO / MgO = 60/20/15/5 inorganic filler, average particle diameter: 15 μm (average particle diameter (Adjusted by classification)
Tospearl TS2000B:
Silicone resin particles, average particle size 6.0 μm, manufactured by Momentive Performance Materials Japan Co., Ltd. <Preparation of silicone resin composition>
Preparation Example 1
20 g of alkenyl group-containing polysiloxane A (Synthesis Example 1), 25 g of alkenyl group-containing polysiloxane B (Synthesis Example 2), 25 g of hydrosilyl group-containing polysiloxane C (Synthesis Example 3, crosslinker C), and 5 mg of platinum carbonyl complex By mixing, a silicone resin composition A was prepared.

Preparation Example 2
A silicone resin composition of Example 1 described in JP 2010-265436 A was prepared as a silicone resin composition B (condensation / addition reaction curable silicone resin composition).

<Manufacture of phosphor layer-sealed LED>
Example 1
Inorganic filler A was mixed with silicone resin composition A so as to be 50% by mass with respect to the total amount thereof, and transparent resin composition X was prepared as a varnish. The refractive index RIt of the transparent resin composition X was 1.56.

  By blending YAG468 (phosphor, manufactured by Root Special Chemical Co., Ltd.) to the transparent resin composition X so as to be 20% by mass with respect to the total amount thereof, and mixing them, the phosphor resin A composition was prepared.

  Thereafter, the transparent resin composition X was applied on the surface of a release sheet (PTE sheet, trade name “SS4C”, manufactured by Nipper Co., Ltd.) having a thickness of 50 μm with an applicator so that the thickness after heating was 650 μm. Thereafter, a B-stage transparent layer was produced by heating at 90 ° C. for 20 minutes.

  Next, the phosphor resin composition is applied to the surface (upper surface) of the transparent layer with an applicator so that the thickness after heating becomes 350 μm, and then heated at 80 ° C. for 11 minutes, so that B A stage phosphor layer was prepared.

  Thereby, the sealing sheet which consists of a peeling sheet, a transparent layer, and a fluorescent substance layer was produced (refer FIG. 2A).

  Then, a double-sided tape (pressure-sensitive adhesive layer) is pasted on the stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co.) are formed thereon. , Arranged at a pitch of 1.44 mm (see FIG. 2B). Then, the sealing sheet was thermocompression bonded with respect to several LED for 10 minutes using the vacuum flat plate press heated at 90 degreeC (refer FIG. 2C). Specifically, the sealing sheet was thermocompression bonded to the plurality of LEDs so that the phosphor layer was in contact with the LEDs and the double-sided tape around them. By this thermocompression bonding, the phosphor layer and the transparent layer were once plasticized. Thereby, several LED was sealed with the sealing sheet.

  Thereafter, post-curing was performed at 150 ° C. for 2 hours. As a result, the phosphor layer and the transparent layer were changed to the C stage. Then, the sealing sheet was separated into pieces by cutting, and a phosphor layer-sealed LED including one LED, a phosphor layer, and a transparent layer was manufactured on a stainless steel plate (see FIG. 2C).

  Subsequently, the release sheet was peeled off from the transparent layer (see a virtual line in FIG. 2C). Subsequently, the sealed LED assembly was cut so as to separate a plurality of LEDs (see FIG. 2D).

  Thereafter, the phosphor layer-sealed LED was peeled off from the double-sided tape (see the arrow in FIG. 2D and FIG. 2E).

  Thereby, a phosphor layer-sealed LED was obtained (see FIG. 2E).

Example 2
Inorganic filler A was mixed with silicone resin composition A so as to be 50% by mass with respect to the total amount thereof, and transparent resin composition X was prepared as a varnish. The refractive index RIt of the transparent resin composition X was 1.56.

  Moreover, by blending YAG468 (phosphor, manufactured by Root Special Chemical Co., Ltd.) with respect to the total amount of the transparent resin composition X so as to be 12% by mass, and mixing them, fluorescence is obtained. A body resin composition was prepared.

  Thereafter, the transparent resin composition X was applied on the surface of a release sheet (PTE sheet, trade name “SS4C”, manufactured by Nipper Co., Ltd.) having a thickness of 50 μm with an applicator so that the thickness after heating becomes 500 μm. Thereafter, a B-stage transparent layer was produced by heating at 90 ° C. for 20 minutes.

  On top of that, the phosphor resin composition was applied with an applicator so that the thickness after heating was 500 μm, and then heated at 80 ° C. for 11 minutes to prepare a B-stage phosphor layer. .

  Thereby, the sealing sheet which consists of a peeling sheet, a transparent layer, and a fluorescent substance layer was produced (refer FIG. 2A).

  Then, a double-sided tape (pressure-sensitive adhesive layer) is pasted on the stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co.) are formed thereon. , Arranged at a pitch of 1.64 mm (see FIG. 2B). Then, the sealing sheet was thermocompression bonded with respect to several LED for 10 minutes using the vacuum flat plate press heated at 90 degreeC (refer FIG. 2C). Specifically, the sealing sheet was thermocompression bonded to the plurality of LEDs so that the phosphor layer was in contact with the LEDs and the double-sided tape around them. By this thermocompression bonding, the phosphor layer and the transparent layer were once plasticized. Thereby, several LED was sealed with the sealing sheet.

  Thereafter, post-curing was performed at 150 ° C. for 2 hours. As a result, the phosphor layer and the transparent layer were changed to the C stage. Then, the sealing sheet was separated into pieces by cutting, and a phosphor layer-sealed LED including one LED, a phosphor layer, and a transparent layer was manufactured on a stainless steel plate (see FIG. 2C).

  Subsequently, the release sheet was peeled off from the transparent layer (see a virtual line in FIG. 2C). Subsequently, the sealed LED assembly was cut so as to separate a plurality of LEDs (see FIG. 2D).

  Thereafter, the phosphor layer-sealed LED was peeled off from the double-sided tape (see the arrow in FIG. 2D and FIG. 2E).

  Thereby, a phosphor layer-sealed LED was obtained (see FIG. 2E).

Example 3
Inorganic filler A was mixed with silicone resin composition A so as to be 50% by mass with respect to the total amount thereof, and transparent resin composition X was prepared as a varnish. The refractive index RIt of the transparent resin composition X was 1.56.

  The transparent resin composition X is blended with YAG468 (phosphor, manufactured by Root Special Chemical Co., Ltd.) so as to be 10% by mass with respect to the total amount thereof, and mixed to obtain a phosphor resin. A composition was prepared.

  Thereafter, the transparent resin composition X was applied to the surface of a release sheet (PTE sheet, trade name “SS4C”, manufactured by Nipper Co., Ltd.) having a thickness of 50 μm with an applicator so that the thickness after heating becomes 400 μm. Thereafter, a B-stage transparent layer was produced by heating at 90 ° C. for 20 minutes.

  Next, the phosphor resin composition is applied to the surface (upper surface) of the transparent layer with an applicator so that the thickness after heating becomes 600 μm, and then heated at 80 ° C. for 11 minutes, so that B A stage phosphor layer was prepared.

  Thereby, the sealing sheet which consists of a peeling sheet, a transparent layer, and a fluorescent substance layer was produced (refer FIG. 2A).

  Then, a double-sided tape (pressure-sensitive adhesive layer) is pasted on the stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co.) are formed thereon. 1 and a pitch of 1.84 mm (see FIG. 2B). Then, the sealing sheet was thermocompression bonded with respect to several LED for 10 minutes using the vacuum flat plate press heated at 90 degreeC (refer FIG. 2C). Specifically, the sealing sheet was thermocompression bonded to the plurality of LEDs so that the phosphor layer was in contact with the LEDs and the double-sided tape around them. By this thermocompression bonding, the phosphor layer and the transparent layer were once plasticized. Thereby, several LED was sealed with the sealing sheet.

  Thereafter, post-curing was performed at 150 ° C. for 2 hours. As a result, the phosphor layer and the transparent layer were changed to the C stage. Then, the sealing sheet was separated into pieces by cutting, and a phosphor layer-sealed LED including one LED, a phosphor layer, and a transparent layer was manufactured on a stainless steel plate (see FIG. 2C).

  Subsequently, the release sheet was peeled off from the transparent layer (see a virtual line in FIG. 2C). Subsequently, the sealed LED assembly was cut so as to separate a plurality of LEDs (see FIG. 2D).

  Thereafter, the phosphor layer-sealed LED was peeled off from the double-sided tape (see the arrow in FIG. 2D and FIG. 2E).

  Thereby, a phosphor layer-sealed LED was obtained (see FIG. 2E).

Example 4
Inorganic filler A was mixed with silicone resin composition A so as to be 50% by mass with respect to the total amount thereof, and transparent resin composition X was prepared as a varnish. The refractive index RIt of the transparent resin composition X was 1.56.

  The transparent resin composition X is blended with YAG468 (phosphor, manufactured by Root Special Chemical Co., Ltd.) so as to be 10% by mass with respect to the total amount thereof, and mixed to obtain a phosphor resin. A composition was prepared.

  Thereafter, the transparent resin composition X was applied to the surface of a release sheet (PTE sheet, trade name “SS4C”, manufactured by Nipper Co., Ltd.) having a thickness of 50 μm with an applicator so that the thickness after heating becomes 900 μm. Thereafter, a B-stage transparent layer was produced by heating at 90 ° C. for 20 minutes.

  Next, the phosphor resin composition is applied to the surface (upper surface) of the transparent layer with an applicator so that the thickness after heating becomes 600 μm, and then heated at 80 ° C. for 11 minutes, so that B A stage phosphor layer was prepared.

  Thereby, the sealing sheet which consists of a peeling sheet, a transparent layer, and a fluorescent substance layer was produced (refer FIG. 2A).

  Then, a double-sided tape (pressure-sensitive adhesive layer) is pasted on the stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co.) are formed thereon. 1 and a pitch of 1.84 mm (see FIG. 2B). Then, the sealing sheet was thermocompression bonded with respect to several LED for 10 minutes using the vacuum flat plate press heated at 90 degreeC (refer FIG. 2C). Specifically, the sealing sheet was thermocompression bonded to the plurality of LEDs so that the phosphor layer was in contact with the LEDs and the double-sided tape around them. By this thermocompression bonding, the phosphor layer and the transparent layer were once plasticized. Thereby, several LED was sealed with the sealing sheet.

  Thereafter, post-curing was performed at 150 ° C. for 2 hours. As a result, the phosphor layer and the transparent layer were changed to the C stage. Then, the sealing sheet was separated into pieces by cutting, and a phosphor layer-sealed LED including one LED, a phosphor layer, and a transparent layer was manufactured on a stainless steel plate (see FIG. 2C).

  Subsequently, the release sheet was peeled off from the transparent layer (see a virtual line in FIG. 2C). Subsequently, the sealed LED assembly was cut so as to separate a plurality of LEDs (see FIG. 2D).

  Thereafter, the phosphor layer-sealed LED was peeled off from the double-sided tape (see the arrow in FIG. 2D and FIG. 2E).

  Thereby, a phosphor layer-sealed LED was obtained (see FIG. 2E).

Example 5
Inorganic filler A was mixed with silicone resin composition A so as to be 50% by mass with respect to the total amount thereof, and transparent resin composition X was prepared as a varnish. The refractive index RIt of the transparent resin composition X was 1.56.

  In addition, YAG468 (phosphor, manufactured by Root Special Chemical Co., Ltd.) is blended with the transparent resin composition X so as to be 11% by mass with respect to the total amount thereof, and mixed to obtain fluorescence. A body resin composition was prepared.

  Thereafter, the transparent resin composition X was applied on the surface of a release sheet (PTE sheet, trade name “SS4C”, manufactured by Nipper Co., Ltd.) having a thickness of 50 μm with an applicator so that the thickness after heating becomes 500 μm. Thereafter, a B-stage transparent layer was produced by heating at 90 ° C. for 20 minutes.

  Next, the phosphor resin composition is applied to the surface (upper surface) of the transparent layer with an applicator so that the thickness after heating becomes 500 μm, and then heated at 80 ° C. for 11 minutes, so that B A stage phosphor layer was prepared.

  Thereby, the sealing sheet which consists of a peeling sheet, a transparent layer, and a fluorescent substance layer was produced (refer FIG. 2A).

  Then, a double-sided tape (pressure-sensitive adhesive layer) is pasted on the stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co.) are formed thereon. 1 and a pitch of 1.84 mm (see FIG. 2B). Then, the sealing sheet was thermocompression bonded with respect to several LED for 10 minutes using the vacuum flat plate press heated at 90 degreeC (refer FIG. 2C). Specifically, the sealing sheet was thermocompression bonded to the plurality of LEDs so that the phosphor layer was in contact with the LEDs and the double-sided tape around them. By this thermocompression bonding, the phosphor layer and the transparent layer were once plasticized. Thereby, several LED was sealed with the sealing sheet.

  Thereafter, post-curing was performed at 150 ° C. for 2 hours. As a result, the phosphor layer and the transparent layer were changed to the C stage. Then, the sealing sheet was separated into pieces by cutting, and a phosphor layer-sealed LED including one LED, a phosphor layer, and a transparent layer was manufactured on a stainless steel plate (see FIG. 2C).

  Subsequently, the release sheet was peeled off from the transparent layer (see a virtual line in FIG. 2C). Subsequently, the sealed LED assembly was cut so as to separate a plurality of LEDs (see FIG. 2D).

  Thereafter, the phosphor layer-sealed LED was peeled off from the double-sided tape (see the arrow in FIG. 2D and FIG. 2E).

  Thereby, a phosphor layer-sealed LED was obtained (see FIG. 2E).

Example 6
Inorganic filler A was mixed with silicone resin composition A so as to be 50% by mass with respect to the total amount thereof, and transparent resin composition X was prepared as a varnish. The refractive index RIt of the transparent resin composition X was 1.56.

  The transparent resin composition X is blended with YAG468 (phosphor, manufactured by Root Special Chemical Co., Ltd.) so as to be 13% by mass with respect to the total amount, and mixed to obtain a phosphor resin. A composition was prepared.

  Thereafter, the transparent resin composition X was applied on the surface of a release sheet (PTE sheet, trade name “SS4C”, manufactured by Nipper Co., Ltd.) having a thickness of 50 μm with an applicator so that the thickness after heating becomes 500 μm. Thereafter, a B-stage transparent layer was produced by heating at 90 ° C. for 20 minutes.

  Next, the phosphor resin composition is applied to the surface (upper surface) of the transparent layer with an applicator so that the thickness after heating becomes 500 μm, and then heated at 80 ° C. for 11 minutes, so that B A stage phosphor layer was prepared.

  Thereby, the sealing sheet which consists of a peeling sheet, a transparent layer, and a fluorescent substance layer was produced (refer FIG. 2A).

  Then, a double-sided tape (pressure-sensitive adhesive layer) is pasted on the stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co.) are formed thereon. , Arranged at a pitch of 1.44 mm (see FIG. 2B). Then, the sealing sheet was thermocompression bonded with respect to several LED for 10 minutes using the vacuum flat plate press heated at 90 degreeC (refer FIG. 2C). Specifically, the sealing sheet was thermocompression bonded to the plurality of LEDs so that the phosphor layer was in contact with the LEDs and the double-sided tape around them. By this thermocompression bonding, the phosphor layer and the transparent layer were once plasticized. Thereby, several LED was sealed with the sealing sheet.

  Thereafter, post-cure (C stage) is performed at 150 ° C. for 2 hours, and then the sealing sheet is cut into pieces, and a phosphor layer-sealed LED including one LED, a phosphor layer and a transparent layer is obtained. And manufactured on a stainless steel plate (see FIG. 2C).

  Subsequently, the release sheet was peeled off from the transparent layer (see a virtual line in FIG. 2C). Subsequently, the sealed LED assembly was cut so as to separate a plurality of LEDs (see FIG. 2D).

  Thereafter, the phosphor layer-sealed LED was peeled off from the double-sided tape (see the arrow in FIG. 2D and FIG. 2E).

  Thereby, a phosphor layer-sealed LED was obtained (see FIG. 2E).

Example 7
Tospar TS2000B was mixed with silicone resin composition B so as to be 30% by mass with respect to the total amount thereof, and transparent resin composition Y was prepared as a varnish.

  Moreover, by blending YAG468 (phosphor, manufactured by Root Special Chemical Co., Ltd.) to the transparent resin composition Y so that the total amount thereof is 18% by mass, and mixing them, fluorescence is obtained. A body resin composition was prepared.

  Next, a phosphor resin composition is applied on a 500 μm glass plate (refractive index RIt: 1.52) as a transparent layer with an applicator so that the thickness after heating becomes 500 μm, and then A B-stage phosphor layer was prepared on a glass plate by heating at 135 ° C. for 15 minutes. Thereby, the sealing sheet provided with a glass plate and a fluorescent substance layer was prepared (refer FIG. 2A).

  Then, a double-sided tape (pressure-sensitive adhesive layer) is pasted on the stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co.) are formed thereon. , Arranged at a pitch of 1.64 mm (see FIG. 2B). Then, the sealing sheet was crimped | bonded with respect to several LED for 10 minutes using the vacuum flat plate press of room temperature. Specifically, the sealing sheet was pressure-bonded to the plurality of LEDs so that the phosphor layer was in contact with the LEDs and the double-sided tape around them. Thereby, several LED was sealed with the sealing sheet.

  Thereafter, the phosphor layer is heated at 150 ° C. for 2 hours to thermoset (C stage), and then the sealing sheet is cut into pieces to obtain one LED, phosphor layer, and glass plate. The phosphor layer-sealed LED provided was manufactured on a stainless steel plate (see FIG. 2C).

  Subsequently, the sealed LED assembly was cut so as to separate a plurality of LEDs (see FIG. 2D).

  Thereafter, the phosphor layer-sealed LED was peeled off from the double-sided tape (see the arrow in FIG. 2D and FIG. 2E).

  Thereby, a phosphor layer-sealed LED was obtained (see FIG. 2E).

Example 8
Inorganic filler A was mixed with silicone resin composition A so as to be 50% by mass with respect to the total amount thereof, and transparent resin composition X was prepared as a varnish. The refractive index RIt of the transparent resin composition X was 1.56.

  The transparent resin composition X is blended with YAG468 (phosphor, manufactured by Root Special Chemical Co., Ltd.) so as to be 12% by mass with respect to the total amount, and mixed to obtain a phosphor resin. A composition was prepared.

  Next, the varnish (refractive index RIt: 1.41) mixed with Tospearl TS2000B at 30% by mass with respect to the total amount of LR7665 is applied to the release sheet with a thickness of 50 μm using an applicator. A C-stage transparent layer is prepared by coating the PTE sheet (trade name “SS4C”, manufactured by Nipper Co., Ltd.) so that the thickness after heating is 500 μm, and then heating at 100 ° C. for 10 minutes. did.

  Next, the phosphor resin composition is applied to the surface (upper surface) of the transparent layer with an applicator so that the thickness after heating becomes 500 μm, and then heated at 80 ° C. for 11 minutes, so that B A stage phosphor layer was prepared.

  Thereby, the sealing sheet which consists of a peeling sheet, a transparent layer, and a fluorescent substance layer was produced (refer FIG. 2A).

  Then, a double-sided tape (pressure-sensitive adhesive layer) is pasted on the stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co.) are formed thereon. , Arranged at a pitch of 1.64 mm (see FIG. 2B). Then, the sealing sheet was thermocompression bonded with respect to several LED for 10 minutes using the vacuum flat plate press heated at 90 degreeC (refer FIG. 2C). Specifically, the sealing sheet was thermocompression bonded to the plurality of LEDs so that the phosphor layer was in contact with the LEDs and the double-sided tape around them. By this thermocompression bonding, the phosphor layer was once plasticized. Thereby, several LED was sealed with the sealing sheet.

  Thereafter, post-curing was performed at 150 ° C. for 2 hours. Thereby, the phosphor layer was changed to the C stage. Then, the sealing sheet was separated into pieces by cutting, and a phosphor layer-sealed LED including one LED, a phosphor layer, and a transparent layer was manufactured on a stainless steel plate (see FIG. 2C).

  Subsequently, the release sheet was peeled off from the transparent layer (see a virtual line in FIG. 2C). Subsequently, the sealed LED assembly was cut so as to separate a plurality of LEDs (see FIG. 2D).

  Thereafter, the phosphor layer-sealed LED was peeled off from the double-sided tape (see the arrow in FIG. 2D and FIG. 2E).

  Thereby, a phosphor layer-sealed LED was obtained (see FIG. 2E).

Example 9
YAG468 (manufactured by Nemoto Special Chemical Co., Ltd.) was mixed with respect to 100 parts by mass of the silicone resin composition A so as to be 17% by mass with respect to the total amount thereof to prepare a phosphor resin composition as a varnish.

  A double-sided tape was pasted on the stainless steel plate, and one LED (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar) was mounted (arranged) on the stainless steel plate (see FIG. 3A). ).

  Separately, a first dam and a second dam were produced (see FIGS. 3A and 3D).

  That is, LR7665 (refractive index of 1.41) was applied to a thickness of 500 μm and cured (thermosetting) at 100 ° C. for 10 minutes, and then the cured sheet was formed into an outer frame size of 10 mm × 10 mm, an inner frame size (inner size). ) The first dam was fabricated by processing into a rectangular frame shape of 1.64 mm × 1.64 mm (see FIG. 3A). That is, the outer dimension of the first dam is 10 mm × 10 mm, and the inner dimension of the rectangular opening is 1.64 mm × 1.64 mm.

  Next, a second dam was produced in the same manner as the first dam except that the thickness was changed to 1 mm (see FIG. 3D).

  Next, on the stainless steel plate, a first dam was installed around the LED (see FIG. 3B). Subsequently, the varnish of the phosphor resin composition was hung in the first opening of the first dam, the amount was adjusted so as to have a liquid thickness of 500 μm, and the phosphor resin composition was B-staged at 100 ° C. for 10 minutes. (See FIG. 3C). Thereby, a phosphor layer in a B stage state was obtained. Then, the 1st dam was removed (refer the arrow of FIG. 3C).

  Furthermore, the 2nd dam was installed in the circumference | surroundings of the fluorescent substance layer on the stainless steel plate (refer FIG. 3E). Thereafter, the silicone resin composition A was hung in the second opening of the second dam, and the liquid amount was adjusted so that the total thickness became 1 mm. Subsequently, the silicone resin composition A was thermally cured (C stage) at 150 ° C. for 2 hours to obtain a transparent layer in a C stage state (see FIG. 4F). Subsequently, dicing was performed along the boundary (interface) between the phosphor layer and the transparent layer (see FIG. 4G) to prepare a phosphor layer-sealed LED (see FIG. 4H).

Example 10
YAG468 (manufactured by Nemoto Special Chemical Co., Ltd.) was mixed with the silicone resin composition A so as to be 18% by mass with respect to the total amount thereof to prepare a phosphor resin composition as a varnish.

  A double-sided tape was attached on the stainless steel plate, and one LED (EDI-FA4545A, size: 1.41 mm × 1.41 mm × 150 μm, manufactured by Epistar) was mounted (arranged) on the stainless steel plate (see FIG. 3A). ).

  Separately, a first dam and a second dam were produced (see FIGS. 3A and 3D).

  That is, LR7665 (refractive index of 1.41) was applied to a thickness of 500 μm and cured (thermosetting) at 100 ° C. for 10 minutes, and then the cured sheet was formed into an outer frame size of 10 mm × 10 mm, an inner frame size (inner size). ) The first dam was fabricated by processing into a rectangular frame shape of 1.64 mm × 1.64 mm (see FIG. 3A). That is, the outer dimension of the first dam is 10 mm × 10 mm, and the inner dimension of the rectangular opening is 1.64 mm × 1.64 mm.

  Next, a second dam was produced in the same manner as the first dam except that the thickness was changed to 1 mm (see FIG. 3D).

  Next, on the stainless steel plate, a first dam was installed around the LED (see FIG. 3B). Subsequently, the varnish of the phosphor resin composition was hung in the first opening of the first dam, the amount was adjusted so as to have a liquid thickness of 500 μm, and the phosphor resin composition was B-staged at 100 ° C. for 10 minutes. (See FIG. 3C). Thereby, a phosphor layer in a B stage state was obtained. Then, the 1st dam was removed (refer the arrow of FIG. 3C).

  Furthermore, the 2nd dam was installed in the circumference | surroundings of the fluorescent substance layer on the stainless steel plate (refer FIG. 3E). Then, LR7665 (refractive index 1.41) was hung in the 2nd opening part of the 2nd dam, and the liquid quantity was adjusted so that the total thickness might be 1 mm. Subsequently, the silicone resin composition A was thermally cured (C stage) at 150 ° C. for 2 hours to obtain a transparent layer in a C stage state (see FIG. 4F). Subsequently, dicing was performed along the boundary (interface) between the phosphor layer and the transparent layer (see FIG. 4G) to prepare a phosphor layer-sealed LED (see FIG. 4H).

Example 11
Inorganic filler A was mixed with silicone resin composition A so as to be 50% by mass with respect to the total amount thereof, and transparent resin composition X was prepared as a varnish. The refractive index of the transparent resin composition X was 1.56.

  The transparent resin composition X is blended with YAG468 (phosphor, manufactured by Root Special Chemical Co., Ltd.) so as to be 50% by mass with respect to the total amount thereof, and mixed to obtain a phosphor resin. A composition was prepared.

  Thereafter, the transparent resin composition X was applied to the surface of a release sheet (PTE sheet, trade name “SS4C”, manufactured by Nipper Co., Ltd.) having a thickness of 50 μm with an applicator so that the thickness after heating becomes 800 μm. Thereafter, a B-stage transparent layer was produced by heating at 90 ° C. for 20 minutes.

  Next, the phosphor resin composition is applied to the surface (upper surface) of the transparent layer with an applicator so that the thickness after heating becomes 200 μm, and then heated at 80 ° C. for 11 minutes, so that B A stage phosphor layer was prepared.

  Thereby, the sealing sheet which consists of a peeling sheet, a transparent layer, and a fluorescent substance layer was produced (refer FIG. 2A).

  Then, a double-sided tape (pressure-sensitive adhesive layer) is pasted on the stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co.) are formed thereon. , Arranged at a pitch of 1.24 mm (see FIG. 2B). Then, the sealing sheet was thermocompression bonded with respect to several LED for 10 minutes using the vacuum flat plate press heated at 90 degreeC (refer FIG. 2C). Specifically, the sealing sheet was thermocompression bonded to the plurality of LEDs so that the phosphor layer was in contact with the LEDs and the double-sided tape around them. By this thermocompression bonding, the phosphor layer and the transparent layer were once plasticized. Thereby, several LED was sealed with the sealing sheet.

  Thereafter, post-curing was performed at 150 ° C. for 2 hours. As a result, the phosphor layer and the transparent layer were changed to the C stage. Then, the sealing sheet was separated into pieces by cutting, and a phosphor layer-sealed LED including one LED, a phosphor layer, and a transparent layer was manufactured on a stainless steel plate (see FIG. 2C).

  Subsequently, the release sheet was peeled off from the transparent layer (see a virtual line in FIG. 2C). Subsequently, the sealed LED assembly was cut so as to separate a plurality of LEDs (see FIG. 2D).

  Thereafter, the phosphor layer-sealed LED was peeled off from the double-sided tape (see the arrow in FIG. 2D and FIG. 2E).

  Thereby, a phosphor layer-sealed LED was obtained (see FIG. 2E).

Example 12
Inorganic filler A was mixed with silicone resin composition A so as to be 50% by mass with respect to the total amount thereof, and transparent resin composition X was prepared as a varnish. The refractive index of the transparent resin composition X was 1.56.

  The transparent resin composition X is blended with YAG468 (phosphor, manufactured by Root Special Chemical Co., Ltd.) so as to be 30% by mass with respect to the total amount thereof, and mixed to obtain a phosphor resin. A composition was prepared.

  Thereafter, the transparent resin composition X was applied to the surface of a release sheet (PTE sheet, trade name “SS4C”, manufactured by Nipper Co., Ltd.) having a thickness of 50 μm with an applicator so that the thickness after heating becomes 50 μm. Thereafter, a B-stage transparent layer was produced by heating at 90 ° C. for 20 minutes.

  Next, the phosphor resin composition is applied to the surface (upper surface) of the transparent layer with an applicator so that the thickness after heating becomes 300 μm, and then heated at 80 ° C. for 11 minutes, so that B A stage phosphor layer was prepared.

  Thereby, the sealing sheet which consists of a peeling sheet, a transparent layer, and a fluorescent substance layer was produced (refer FIG. 2A).

  Then, a double-sided tape (pressure-sensitive adhesive layer) is pasted on the stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co.) are formed thereon. 1.34 mm pitch (see FIG. 2B). Then, the sealing sheet was thermocompression bonded with respect to several LED for 10 minutes using the vacuum flat plate press heated at 90 degreeC (refer FIG. 2C). Specifically, the sealing sheet was thermocompression bonded to the plurality of LEDs so that the phosphor layer was in contact with the LEDs and the double-sided tape around them. By this thermocompression bonding, the phosphor layer and the transparent layer were once plasticized. Thereby, several LED was sealed with the sealing sheet.

  Thereafter, post-curing was performed at 150 ° C. for 2 hours. As a result, the phosphor layer and the transparent layer were changed to the C stage. Then, the sealing sheet was separated into pieces by cutting, and a phosphor layer-sealed LED including one LED, a phosphor layer, and a transparent layer was manufactured on a stainless steel plate (see FIG. 2C).

  Subsequently, the release sheet was peeled off from the transparent layer (see a virtual line in FIG. 2C). Subsequently, the sealed LED assembly was cut so as to separate a plurality of LEDs (see FIG. 2D).

  Thereafter, the phosphor layer-sealed LED was peeled off from the double-sided tape (see the arrow in FIG. 2D and FIG. 2E).

  Thereby, a phosphor layer-sealed LED was obtained (see FIG. 2E).

Example 13
Inorganic filler A was mixed with silicone resin composition A so as to be 50% by mass with respect to the total amount thereof, and transparent resin composition X was prepared as a varnish. The refractive index of the transparent resin composition X was 1.56.

  By blending YAG468 (phosphor, manufactured by Root Special Chemical Co., Ltd.) with respect to the total amount of the transparent resin composition X so as to be 8 parts by mass, and mixing them, the phosphor resin A composition was prepared.

  Thereafter, the transparent resin composition X was applied on the surface of a release sheet (PTE sheet, trade name “SS4C”, manufactured by Nipper Co., Ltd.) having a thickness of 50 μm with an applicator so that the thickness after heating becomes 100 μm. Thereafter, a B-stage transparent layer was produced by heating at 90 ° C. for 20 minutes.

  Next, the phosphor resin composition is applied to the surface (upper surface) of the transparent layer with an applicator so that the thickness after heating becomes 900 μm, and then heated at 80 ° C. for 11 minutes, so that B A stage phosphor layer was prepared.

  Thereby, the sealing sheet which consists of a peeling sheet, a transparent layer, and a fluorescent substance layer was produced (refer FIG. 2A).

  Then, a double-sided tape (pressure-sensitive adhesive layer) is pasted on the stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co.) are formed thereon. , Arranged at a pitch of 1.64 mm (see FIG. 2B). Then, the sealing sheet was thermocompression bonded with respect to several LED for 10 minutes using the vacuum flat plate press heated at 90 degreeC (refer FIG. 2C). Specifically, the sealing sheet was thermocompression bonded to the plurality of LEDs so that the phosphor layer was in contact with the LEDs and the double-sided tape around them. By this thermocompression bonding, the phosphor layer and the transparent layer were once plasticized. Thereby, several LED was sealed with the sealing sheet.

  Thereafter, post-curing was performed at 150 ° C. for 2 hours. As a result, the phosphor layer and the transparent layer were changed to the C stage. Then, the sealing sheet was separated into pieces by cutting, and a phosphor layer-sealed LED including one LED, a phosphor layer, and a transparent layer was manufactured on a stainless steel plate (see FIG. 2C).

  Subsequently, the release sheet was peeled off from the transparent layer (see a virtual line in FIG. 2C). Subsequently, the sealed LED assembly was cut so as to separate a plurality of LEDs (see FIG. 2D).

  Thereafter, the phosphor layer-sealed LED was peeled off from the double-sided tape (see the arrow in FIG. 2D and FIG. 2E).

  Thereby, a phosphor layer-sealed LED was obtained (see FIG. 2E).

Example 14
Inorganic filler A was mixed with silicone resin composition A so as to be 50% by mass with respect to the total amount thereof, and transparent resin composition X was prepared as a varnish. The refractive index of the transparent resin composition X was 1.56.

  The transparent resin composition X is blended with YAG468 (phosphor, manufactured by Root Special Chemical Co., Ltd.) so as to be 28% by mass with respect to the total amount, and mixed to obtain a phosphor resin. A composition was prepared.

  Thereafter, the phosphor resin composition was applied to the surface of a release sheet (PTE sheet, trade name “SS4C”, manufactured by Nipper Co., Ltd.) having a thickness of 50 μm with an applicator so that the thickness after heating was 150 μm. Thereafter, a B-stage phosphor layer was produced by heating at 90 ° C. for 20 minutes. Thereby, the fluorescent sealing sheet which consists of a peeling sheet and a fluorescent substance layer was produced (refer fluorescent substance layer preparation process, FIG. 7A).

  Then, a double-sided tape (pressure-sensitive adhesive layer) is pasted on the stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co.) are formed thereon. Arranged at a pitch of 1.54 mm. Then, the fluorescent sealing sheet was thermocompression bonded for 10 minutes with respect to several LED using the vacuum flat plate press heated at 90 degreeC. Specifically, the phosphor encapsulating sheet was thermocompression bonded to the plurality of LEDs using a vacuum flat plate press so that the phosphor layer was in contact with the LED and the double-sided tape around the LED (phosphor layer arranging step). FIG. 7B). The upper surface of the phosphor layer was formed flat.

  Thereafter, the release sheet was peeled off from the phosphor layer (see FIG. 7C).

  Next, the phosphor layer remote from the LED was removed, and at the same time, the phosphor layer-sealed LED was singulated (see singulation / removal step, see FIG. 7D). That is, the transparent sheet was cut with a dicing saw having a thickness of 200 μm.

  Thereby, a phosphor layer-sealed LED was obtained (see FIG. 7F).

  Thereafter, the plurality of phosphor layer-sealed LEDs were arranged on the second support plate at intervals in the front-rear direction and the left-right direction (see FIG. 8G).

  Further, the transparent resin composition X is applied with an applicator so that the thickness after heating is 850 μm on the surface of a second release sheet (PTE sheet, trade name “SS4C”, manufactured by Nippers) having a thickness of 50 μm. Then, a B-stage transparent layer was produced by heating at 90 ° C. for 20 minutes. Thereby, the transparent sheet which consists of a 2nd peeling sheet and a transparent layer was produced (refer transparent layer preparation process, FIG. 8G).

  Next, a plurality of phosphor layers covering a plurality of LEDs were covered with a transparent layer of a transparent sheet (transparent layer arranging step, see FIG. 8H).

  Subsequently, the second release sheet was peeled off from the transparent layer (see FIG. 8I). Subsequently, the sealed LED assembly was cut so as to separate a plurality of LEDs (see FIG. 8J).

  Thereafter, the phosphor layer-sealed LED was peeled off from the double-sided tape (see the arrow in FIG. 8J).

  Thereby, a phosphor layer-sealed LED was obtained (see FIG. 8K).

Comparative Example 1
A phosphor sheet encapsulated LED was obtained in the same manner as in Example 8 except that a cover sheet without forming a transparent layer was prepared and the LED was covered with the transparent layer of this cover sheet (see FIG. 16).

Comparative Example 2
A phosphor sheet encapsulated LED was obtained in the same manner as in Example 14 except that a cover sheet without forming a transparent layer was prepared and the LED was covered with the transparent layer of the cover sheet (see FIG. 17).

<Evaluation>
[Luminescence intensity]
The phosphor layer-sealed LEDs of each Example and each Comparative Example were mounted on a substrate to produce an LED device (see the imaginary line in FIG. 1, FIG. 2F, the imaginary line in FIG. 16, and the imaginary line in FIG. 17). Subsequently, the total luminous flux measurement apparatus was turned on at a current of 300 mA, and the emission intensity was obtained.

  The obtained emission intensity was evaluated based on the following criteria.

A: Emission intensity is 135 lm or more B: Emission intensity is 128 lm or more and less than 135 lm C: Emission intensity is 118 lm or more and less than 128 lm D: Emission intensity is 110 lm or more and less than 118 lm E: Emission intensity is less than 110 lm [ Color uniformity]
Ten phosphor layer-sealed LEDs of each example and each comparative example (n = 10) were mounted on a substrate to produce an LED device (virtual line in FIG. 1, virtual line in FIG. 2F and FIG. 16). , See the virtual line in FIG. Subsequently, the CIE y of the optical characteristics was measured, and the variation of the 10 phosphor layer-sealed LEDs was obtained. And the case where the difference of the maximum value and the minimum value was 0.03 or less was evaluated as (circle), and the case where it exceeded 0.03 was evaluated as x.

[Light distribution (color unevenness)]
The phosphor layer-sealed LEDs of each Example and each Comparative Example were mounted on a substrate to produce an LED device (see the imaginary line in FIG. 1, FIG. 2F, the imaginary line in FIG. 16, and the imaginary line in FIG. 17). Subsequently, the chromaticity in the −85 ° to 85 ° direction was measured in increments of 5 ° with a light distribution measuring device (GP-7 manufactured by Otsuka Electronics Co., Ltd.). The chromaticity variation in each direction was determined. And the case where the difference of the maximum value and the minimum value was 0.02 or less was evaluated as (circle), and the case where it exceeded 0.02 was evaluated as x.

[Reliability (black baldness)]
The phosphor layer-sealed LEDs of each Example and each Comparative Example were mounted on a substrate to produce an LED device (see the imaginary line in FIG. 1, FIG. 2F, the imaginary line in FIG. 16, and the imaginary line in FIG. 17). Subsequently, the total luminous flux measurement device is turned on for 1,000 hours at a current of 1 A, the phosphor layer and the transparent layer are visually observed, and the reliability of the phosphor layer-sealed LED and LED device is evaluated according to the following criteria. did.
○: No dark burn was observed in the phosphor layer or the transparent layer.
Δ: Slight black burnt was observed in the phosphor layer or the transparent layer.
X: Black burn was observed in the phosphor layer or the transparent layer.

[Measurement of Phenyl Group Content in Hydrocarbon Group (R ⁵ ) of Product Obtained by Reaction of Silicone Resin Composition A]
In the product obtained by the reaction of the silicone resin composition A (that is, the silicone resin composition A containing no filler), in the hydrocarbon group (R ⁵ in the average composition formula (3)) directly bonded to the silicon atom The phenyl group content (mol%) was calculated by ¹ H-NMR and ²⁹ Si-NMR.

  Specifically, the A-stage silicone resin composition A was reacted (completely cured, C-staged) at 100 ° C. for 1 hour without adding a filler to obtain a product.

Next, by measuring ¹ H-NMR and ²⁹ Si-NMR of the obtained product, the proportion (mol%) of the phenyl group in the hydrocarbon group (R ⁵ ) directly bonded to the silicon atom is calculated. did.

  As a result, it was 48%.

  Table 1 shows the composition and formulation of each layer in each example and each comparative example.

  Table 2 shows the dimensions of each layer and the evaluation of the phosphor layer-sealed LED in each example and each comparative example.

1 Phosphor layer sealed LED
2 LED
3 Phosphor layer 4 Transparent layer 5 Sealing sheet 21 Lower surface (LED element side contactable surface)
22 Upper surface (LED element side facing surface)
23 Side (LED element side connecting surface)
31 Upper surface (phosphor side first opposing surface of the phosphor layer)
33 side surface (phosphor side second facing surface of phosphor layer)
42 Upper surface (transparent side facing surface of transparent layer)
43 Side (Transparent side connecting surface of transparent layer)
RIp refractive index of the first transparent composition RIt refractive index of the second transparent composition

Claims (13)

An optical semiconductor element;
A phosphor layer covering the optical semiconductor element;
A phosphor layer-covered optical semiconductor device comprising: a transparent layer that covers at least a part of the phosphor layer. The optical semiconductor element is:
An element-side contactable surface capable of contacting the substrate;
An element-side facing surface disposed opposite to the element-side contactable surface at a distance x on one side;
An element side connecting surface connected to the element side contactable surface and the element side facing surface;
The phosphor layer is
A phosphor-side first opposing surface disposed opposite to the element-side opposing surface at a distance y on the one side;
A phosphor-side second opposing surface disposed opposite to the element-side coupling surface in a direction orthogonal to the one direction with a distance α,
The transparent layer is
A transparent-side facing surface disposed opposite to the phosphor-side first facing surface at a distance z on the one side;
A transparent side connection surface that is connected to the transparent side facing surface and is disposed at an interval in the orthogonal direction with respect to the element side connection surface when projected in the one direction;
The phosphor layer-coated optical semiconductor element according to claim 1, wherein all of the following (1) to (4) are satisfied.
(1) A value (y / x) obtained by dividing the distance y by the distance x is 1 or more and 5 or less.
(2) The sum (y + z) of the distance y and the distance z is not less than 0.25 mm and not more than 2 mm.
(3) The sum (α + β) of the distance α and the distance β between the phosphor-side second facing surface and the transparent connecting surface is 50 μm or more and 2000 μm or less. However, the distance β is 0 or more.
(4) A value (y / α) obtained by dividing the distance y by the distance α is 1 or more and 2.5 or less. The phosphor layer contains a phosphor and a first transparent composition,
3. The phosphor layer-coated optical semiconductor element according to claim 1, wherein a refractive index RIp of the first transparent composition is 1.45 or more and 1.60 or less. The phosphor layer contains a phosphor and a first transparent composition,
The transparent layer contains a second transparent composition,
A value obtained by subtracting the refractive index RIt of the second transparent composition from the refractive index RIp of the first transparent composition (RIp−RIt) is −0.70 or more and 0.20 or less. The phosphor layer-covered optical semiconductor element according to claim 1, wherein:   The phosphor layer-coated optical semiconductor element according to claim 4, wherein the RIp−RIt is 0.05 or more.   The phosphor layer-covered optical semiconductor element according to claim 2, wherein the phosphor side second facing surface and the transparent side connection surface are formed flush with each other in the one direction.   The phosphor layer-coated optical semiconductor element according to claim 2, wherein the distance α exceeds 50 μm. A method for producing the phosphor layer-coated optical semiconductor element according to any one of claims 1 to 7,
Forming the phosphor layer on the surface of the transparent layer to produce a covering sheet;
And a step of arranging the covering sheet so that the phosphor layer covers a plurality of optical semiconductor elements.   The method for producing a phosphor layer-covered optical semiconductor element according to claim 8, further comprising a step of cutting the cover sheet so that the phosphor layer-covered optical semiconductor element is singulated. . A method for producing the phosphor layer-coated optical semiconductor element according to any one of claims 1 to 7,
A phosphor layer preparation step of preparing a sheet-like phosphor layer;
A phosphor layer arranging step of arranging the sheet-like phosphor layer so as to cover the optical semiconductor element;
A phosphor layer-covered optical semiconductor device comprising: a transparent layer arranging step of arranging the transparent layer so as to cover at least a part of the phosphor layer after the phosphor layer arranging step. Manufacturing method. In the phosphor layer arranging step, the sheet-like phosphor layer is arranged so as to embed a plurality of the optical semiconductor elements,
After the phosphor layer arranging step and before the transparent layer arranging step, the phosphor layer is separated into pieces corresponding to the plurality of optical semiconductor elements, and the optical semiconductor elements The method for manufacturing a phosphor layer-covered optical semiconductor device according to claim 10, further comprising a singulation / removal step of removing the remote phosphor layer. The optical semiconductor element is:
An element-side contactable surface capable of contacting the substrate;
An element-side facing surface disposed opposite to the element-side contactable surface at a distance x on one side;
An element side connecting surface connected to the element side contactable surface and the element side facing surface;
In the phosphor layer arranging step, the sheet-like phosphor layer is arranged so as to cover the element side connection surfaces of the plurality of optical semiconductor elements,
12. The method for manufacturing a phosphor layer-covered optical semiconductor element according to claim 11, wherein the phosphor layer covering the element side connection surface is left in the singulation / removal step. Further comprising a transparent layer preparation step of preparing a sheet-like transparent layer,
The said transparent layer arrangement | positioning process arrange | positions the said sheet-like transparent layer so that at least one part of the said fluorescent substance layer may be coat | covered, It is characterized by the above-mentioned. A method for producing a phosphor layer-coated optical semiconductor element.

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