JP2016192434A - Led backlight and led display device employing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED element substrate which is capable of improving shieldability with respect to light leaked to a back side in light emitted from an LED element and facilitating luminance adjustment as an LED backlight without scattering light.SOLUTION: An LED element substrate 1 comprises a resin base material 11 and a metal wiring part 13 which is laminated on a surface of the resin base material 11 via an adhesive layer 12. The adhesive layer 12 and/or the resin base material 11 contains a pigment, and ΔLof the pigment containing adhesive layer 12 or the pigment containing resin base material 11 compliant to JIS-Z8722 and under the condition of D65 light source and 10° view angle is 60 or less.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an LED backlight and an LED display device using the LED backlight.

  In recent years, as an alternative to conventional cathode ray tube type monitors, it is possible to meet the demands for lower power consumption, larger and thinner devices, and LEDs such as liquid crystal televisions and liquid crystal displays that use LED elements as backlight sources. The spread of display devices is progressing rapidly.

  In order to mount an LED element as a light source in these display devices, various types of LED element substrates each including a support substrate and a wiring portion are usually used. And the laminated body which mounts the LED element on these board | substrates (this laminated body member is hereafter called "LED mounting module") is the light source of various display apparatuses, such as said liquid crystal television, That is, it is widely used as an LED backlight.

  The LED element is mounted on the LED element substrate and emits light, but visible light leaking to the back side out of visible light emitted from the LED element emits light on the opposite side of the light emitting surface that is not assumed by the LED display device. In order to block such light leaking to the back side, the LED element substrate is required to have a concealing property for visible light.

  Examples of means for imparting concealability to the resin include a light diffusing resin (Patent Document 1) including polyester resin, organic resin particles, and titanium oxide particles, and light including particles whose average particles are within a specific range. It is conceivable to provide the LED element substrate with a diffusion resin (Patent Document 2) or the like.

  However, these light diffusing resins impart concealability by diffusing visible light. When visible light is diffused and reflected, it may be difficult to adjust the luminance of the LED display device, and it is not always appropriate to use it as a concealing layer for blocking visible light leaking to the back side.

JP 2013-254105 A JP 2011-209657 A

  The present invention has been made in view of the situation as described above, and improves the concealability of the light emitted from the LED element, which leaks to the back side, and does not diffuse the LED display. An object of the present invention is to provide an LED element substrate and a mounting module using the same, which can facilitate brightness adjustment as a device.

As a result of intensive research, the present inventors have included a pigment in the resin substrate and / or adhesive layer disposed on the back surface of the LED element, and the resin substrate containing the pigment or the adhesion containing the pigment. If the LED layer is an LED element substrate in which the agent layer is based on JIS-Z8722 and the ΔL ^* is 60 or less under the conditions of a D65 light source and a 10 ° viewing angle, the light leaking to the back side is not diffusely reflected and concealed. The inventors have found that the properties can be improved, and have completed the present invention.

(1) An LED element substrate comprising a resin base material and a metal wiring portion laminated on the surface of the resin base material via an adhesive layer, the adhesive layer and / or the resin base material Includes a pigment, and either an adhesive layer containing the pigment or a resin base material containing the pigment, in accordance with JIS-Z8722, a D65 light source and a ΔL ^* according to a 10 ° viewing angle condition ^. However, the LED element substrate is 60 or less.

  (2) The board | substrate for LED elements as described in (1) whose said pigment is a pigment which permeate | transmits near infrared rays with a wavelength of 750 nm or more and 1500 nm or less.

  (3) The LED element substrate according to (2), wherein the pigment contains an oxazine pigment.

  (4) The pigment comprises a benzimidazolone pigment and a phthalocyanine pigment, and a content ratio of the benzimidazolone pigment to the phthalocyanine pigment in the pigment is 30:70 to The board | substrate for LED elements as described in (2) which exists in the range of 70:30.

  (5) The LED element substrate according to any one of (1) to (4), wherein the LED element substrate is a flexible resin substrate.

  (6) An LED mounting module in which an LED element is mounted on the LED element substrate according to any one of (1) to (5).

  (7) An LED display device using the LED mounting module of (6) as a backlight light source.

According to the present invention, the resin base material and / or the adhesive layer disposed on the back surface of the LED element contains a pigment, and the resin base material containing the pigment or the adhesive layer containing the pigment is JIS- If the LED element substrate has a D65 light source and ΔL ^* of 60 ° or less in accordance with Z8722, the light leaking to the back side is not diffusely reflected and the concealability is improved. Can do.

It is a fragmentary sectional view of the LED mounting module of this invention, and is a schematic diagram with which it uses for description of the mounting aspect of the LED element in the LED mounting module of this invention. It is a perspective view which shows typically the outline of the layer structure of the image display apparatus which uses the LED mounting module of this invention.

  Hereinafter, embodiments of the LED element substrate, the LED mounting module, and the LED display device of the present invention will be described. The present invention is not limited to the following embodiments, and can be implemented with appropriate modifications within the scope of the object of the present invention.

<LED element substrate>
The board | substrate for LED elements of this invention is demonstrated. As shown in FIG. 1, the LED element substrate on which the LED element 2 can be mounted has a conductive metal wiring portion 13 made of a metal foil or the like on the surface of the resin base material 11 via the adhesive layer 12. Is formed. And the metal wiring part 13 is laminated | stacked on the surface of the resin base material 11 through the adhesive bond layer 12. As shown in FIG. The adhesive layer and / or the resin base material contains a pigment. The LED element 2 can be provided on the metal wiring. In addition, as shown in FIG. When providing a reflective layer, it may be laminated on the substrate via an adhesive layer or the like on the surface of the substrate. Note that the reflective layer is not an essential component of the present invention.

  Moreover, a pigment is contained in the adhesive bond layer and / or resin base material of the board | substrate for LED elements of this invention. By containing the pigment, the concealability is improved, and light leaking to the back side of the LED element can be blocked. A conventionally well-known pigment can be used for a pigment. For example, an inorganic pigment such as carbon black or a dark organic pigment may be used, or a pigment obtained by mixing two or more of these may be used.

Further, either the adhesive layer containing the pigment of the substrate for LED element of the present invention or the resin base material containing the pigment, ΔL according to the conditions of D65 light source, 10 ° viewing angle in accordance with JIS-Z8722. ^* Is 60 or less, preferably 50 or less, and more preferably 40 or less. ΔL ^* is a parameter representing lightness in color tone, and lightness represents the degree of brightness and darkness of a color. When ΔL ^* is 60 or less, the adhesive layer or the resin base material can absorb visible light leaking to the back side, and as a result, the concealability can be improved. In addition, since ΔL ^{* of the} adhesive layer or the resin base material is 60 or less, it is not difficult to adjust the brightness of the LED display device by the visible light being diffusely reflected by the adhesive layer or the resin base material.

  Moreover, when a pigment is contained in the resin base material, the thermal expansion coefficient of the resin base material increases and the dimensional stability of the resin base material deteriorates depending on the resin base material, the type of pigment, and the pigment content. Therefore, it is more preferable that the LED element substrate of the present invention contains the pigment only in the adhesive layer. By including the pigment only in the adhesive layer, an increase in the coefficient of thermal expansion due to the pigment being included in the resin base material can be suppressed. The base resin is generally thicker than the adhesive layer from the viewpoint of the mechanical strength of the LED element substrate. For this reason, it is not preferable from the viewpoint of productivity to add a pigment to the base resin so as to have a concealing property. Also in this respect, it is preferable that the pigment is contained only in the adhesive layer.

  Conventionally known pigments can be used as the pigment that can be used in the present invention, but a pigment that transmits near infrared rays having a wavelength of 750 nm to 1500 nm is more preferable. When a pigment that transmits near-infrared rays having a wavelength of 750 nm to 1500 nm is used, the resin layer containing the pigment can suppress generation of heat due to absorption of near-infrared rays. Therefore, the resin layer containing the pigment can suppress a decrease in light emission efficiency of the LED element due to heat generation. In the present invention, a pigment that transmits near infrared rays having a wavelength of 750 nm to 1500 nm is a pigment that transmits about 65% or more, preferably 75% of near infrared rays.

  Examples of pigments that transmit near infrared rays having a wavelength of 750 nm to 1500 nm include, for example, oxazine pigments, benzimidazolone pigments, pyrrole pigments, quinacridone pigments, azo pigments, perylene pigments, dioxane pigments, isoindolinones. And organic pigments such as pigments, indanthrene pigments, quinophthalone pigments, perinone pigments, and phthalocyanine pigments. You may mix and use these organic pigments.

  As the oxazine-based organic pigment, for example, violet 23 (molecular weight 589), CI direct violet 37 (molecular weight: 789), or a dioxazine-based compound described in JP-A-2003-105217 can be used. . Oxazine-based organic pigments have high UV resistance and can be preferably used. Further, when it is contained in a urethane-based, polycarbonate-based, or epoxy-based adhesive layer, the oxazine-based organic pigment itself contributes to the improvement of the adhesiveness, and the adhesiveness can also be improved.

  Among the pigments, a pigment comprising a benzimidazolone pigment and a phthalocyanine pigment is particularly preferable. By using a benzimidazolone pigment and a phthalocyanine pigment, a resin layer having a sufficient hiding property can be obtained even when the thickness of the resin substrate or the adhesive layer is reduced. Therefore, using a pigment comprising a benzimidazolone pigment and a phthalocyanine pigment can be a preferable substrate for an LED element from the viewpoint of productivity. Furthermore, when the benzimidazolone pigment and the phthalocyanine pigment are contained in the urethane, polycarbonate, or epoxy adhesive layer, the adhesive layer has the same adhesiveness as the adhesive layer containing the oxazine pigment. can do.

  The benzimidazolone pigment is a pigment having a benzimidazolone skeleton represented by the following general formula (1). Specifically, PigmentYellow120, PigmentYellow151, PigmentYellow154, PigmentYellow175, PigmentYellow180, PigmentYellow181, PigmentYellow194, Pigment Red175, PigmentRed176, PigmentRed185, PigmentRed208, Pigment Violet32, PigmentOrange36, PigmentOrange62, PigmentOrange72, but PigmentBrown25 etc., not limited thereto . C. from the viewpoint of color gamut. I. Pigment Brown 25 is more preferable.

  The primary particle size of the benzimidazolone pigment is preferably 0.01 μm or more and 0.20 μm. By setting the primary particle size of the benzimidazolone pigment in such a range, the dispersibility in the ink can be improved.

  A phthalocyanine pigment is a pigment having a phthalocyanine skeleton. Specifically, C.I. I. PigmentGreen 7, C.I. I. PigmentGreen 36, C.I. I. Pigment Green 37, C.I. I. PigmentBlue 16, C.I. I. PigmentBlue 75, or C.I. I. Pigment Blue 15 and the like can be mentioned, but the invention is not limited to this. It is preferable to use an amorphous phthalocyanine pigment and a blue pigment.

  The primary particle size of the phthalocyanine pigment is preferably 0.15 μm or more and 0.20 μm or less. By setting it as such a range, the dispersibility in ink can be improved.

  The pigment in the dark ink layer preferably has a mass ratio of benzimidazolone pigment and phthalocyanine pigment of 40:60 to 70:30. The color tone can be within a range where the object of the present invention can be achieved.

  The pigment is preferably 20 parts by mass or more and 50 parts by mass or less, and more preferably 35 parts by mass or more and 45 parts by mass or less with respect to 100 parts by mass of the resin component. By adjusting the pigment content within this range, the color tone can be stabilized.

The adhesive layer or the resin base material conforms to JIS-Z8722, and ΔL ^{* under} the conditions of a D65 light source and a 10 ° viewing angle is 60 or less, and more preferably 50 or less. As shown in FIG. 1, a metal wiring portion, an adhesive layer, and a resin base material are disposed on the back surface of the LED element 2. Therefore, by setting the range of ΔL ^* to such a range, the adhesive layer or the resin substrate can be made sufficiently dark, so that the light leaking to the back side is sufficiently concealed. It can have a property.

  The board | substrate for LED elements is not specifically limited, The rigid board | substrate manufactured with materials, such as a bakelite, an epoxy resin, or an alumina, may be sufficient, and the resin board | substrate which has flexibility may be sufficient. Among these, a resin substrate having flexibility is preferable. Among these, it is particularly preferable that the LED mount substrate is a flexible resin substrate. In the case of a resin substrate having flexibility, the degree of freedom of sizing of the substrate is extremely high. For example, an LED having a large display screen with a diagonal length of 32 inches or more, more preferably 65 inches or more The present invention can be easily and suitably applied to a display device.

[Resin substrate]
The resin base material is not particularly limited, but a thermoplastic resin is preferably used. The material for the resin base material is required to have high heat resistance and insulation. As such a resin, polyimide resin (PI) or polyethylene naphthalate (PEN) which is excellent in heat resistance, dimensional stability during heating, mechanical strength, and durability can be used. Among them, polyethylene naphthalate (PEN) that has been improved in heat resistance and dimensional stability by performing heat resistance improvement treatment such as annealing treatment can be preferably used. In addition, polyethylene terephthalate (PET) whose flame retardancy is improved by addition of a flame retardant inorganic filler or the like can also be selected as a material resin for the resin base.

  It is preferable to use a resin base material having a heat shrinkage starting temperature of 100 ° C. or higher, or a material having improved heat resistance so that the temperature becomes 100 ° C. or higher by the above-described annealing treatment or the like. Usually, the peripheral portion of the element reaches a temperature of about 90 ° C. due to heat generated from the LED element. From this viewpoint, it is preferable that the thermoplastic resin forming the substrate resin has heat resistance equal to or higher than the above temperature.

  In this specification, “thermal shrinkage start temperature” means that a sample film made of a thermoplastic resin to be measured is set in a TMA apparatus, a load of 1 g is applied, and the temperature is increased to 120 ° C. at a rate of temperature increase of 2 ° C./min. Measure the amount of shrinkage (in%) at that time, output this data and record the temperature and amount of shrinkage, read the temperature that deviates from the 0% baseline due to shrinkage, and heat shrink the temperature This is the starting temperature. In addition, the “thermosetting temperature” in the present specification is the measurement and calculation of the temperature at the rising position of the thermosetting reaction when the thermosetting resin to be measured is heated, and that temperature is the thermosetting temperature. .

Further, the LED element substrate is required to be a resin having an insulating property that can provide the insulating property required for the LED element substrate when the LED display device is integrated as a backlight or the like. In general, the substrate has a volume resistivity of preferably 10 ¹⁴ Ω · cm or more, and more preferably 10 ¹⁸ Ω · cm or more. The volume resistivity can be measured by using, for example, a digital ultra high resistance / microammeter 5450/5451 manufactured by ADC.

  The thickness of the resin base material is not particularly limited, but in the case of a flexible resin substrate, it is approximately 10 μm or more and 100 μm or less from the viewpoint of the balance between heat resistance and insulating properties and manufacturing cost. It is preferable. Also, the thickness is preferably within the above-mentioned thickness range from the viewpoint of maintaining good productivity when manufacturing by the roll-to-roll method.

[Adhesive layer]
The formation of the metal wiring portion 13 on the surface of the base resin is preferably performed by a dry laminating method through the adhesive layer 12. As the adhesive forming the adhesive layer 12, a known resin adhesive can be used as appropriate. Of these resin adhesives, urethane-based, polycarbonate-based, or epoxy-based adhesives can be particularly preferably used.

[Metal wiring section]
The metal wiring part 13 is a wiring pattern formed on the surface of the LED element substrate 1 by a conductive base material such as a metal foil.

  The arrangement of the metal wiring part 13 is not limited to a specific arrangement as long as the LED elements can be mounted in a matrix. However, in the LED element substrate, it is preferable that at least 80% or more, preferably 90% or more preferably 95% or more of one surface of the substrate is covered with the metal wiring portion 13. Thereby, it can contribute to the improvement of the heat dissipation calculated | required in the LED display apparatus which uses the metal wiring part 13 and the board | substrate for LED elements.

The metal thermal conductivity λ constituting the metal wiring part 13 is preferably 200 W / (m · K) or more and 500 W / (m · K) or less, and preferably 300 W / (m · K) or more and 500 W / (m · K) or less. More preferred. The metal resistivity R constituting the metal wiring part 13 is preferably 3.00 × 10 ⁻⁸ Ω · m or less, more preferably 2.50 × 10 ⁻⁸ Ω · m or less. Here, the measurement of the thermal conductivity λ can use, for example, a thermal conductivity meter QTM-500 manufactured by Kyoto Electronics Industry Co., Ltd. Can be used. According to this, for example, in the case of copper, the thermal conductivity λ is 403 W / (m · K), and the electrical resistivity R is 1.55 × 10 ⁻⁸ Ω · m. Thereby, both heat dissipation and electrical conductivity can be achieved. More specifically, since the heat dissipation from the LED element 2 is stabilized and an increase in electrical resistance can be prevented, the variation in light emission between the LEDs is reduced, and the LED element can stably emit light, and the life of the LED element is also increased. Is also extended. Furthermore, since deterioration of peripheral members such as a substrate due to heat can be prevented, the product life of the image display device itself incorporating the LED element substrate 1 as a backlight can be extended.

  The surface resistance value of the metal wiring portion 13 is preferably 500Ω / □ or less, more preferably 300Ω / □ or less, further preferably 100Ω / □ or less, and particularly preferably 50Ω / □ or less. The lower limit is about 0.005Ω / □.

  Examples of the metal used as the material of the metal wiring part 13 include metal foils such as aluminum, gold, silver, and copper. The thickness of the metal wiring portion 13 may be set as appropriate according to the magnitude of the current resistance required for the LED element substrate, and is not particularly limited, but examples include a thickness of 10 μm to 50 μm. From the viewpoint of improving heat dissipation, the thickness of the metal wiring portion 13 is preferably 10 μm or more. Further, if the metal layer thickness is less than the lower limit, the influence of thermal contraction of the substrate is large, and the warp after the treatment is likely to increase during the solder reflow process. From this viewpoint, the thickness of the metal wiring portion 13 is 10 μm. The above is preferable. When the thickness is 50 μm or less, sufficient flexibility can be maintained, and a decrease in handling property due to an increase in weight can be prevented.

[Solder layer]
In the LED element substrate, the metal wiring portion 13 and the LED element 2 are preferably bonded via the solder layer 14. This joining by soldering can be performed by, for example, a reflow method or a laser method.

[Insulation protective film]
The insulating protective film 15 is not an essential component in the present invention. However, when the insulating protective film is provided, the metal wiring portion 13 and the LED element are formed by thermosetting ink or coverlay film as described above. In order to improve the migration resistance of the LED element substrate, it is mainly formed in other parts except for a part where electrical bonding is required on the surface of the LED substrate.

  As the thermosetting ink, a known ink can be suitably used as long as the thermosetting temperature is about 100 ° C. or less. Specifically, as a representative example of an ink that can preferably use an insulating ink having a polyester resin, an epoxy resin, an epoxy resin and a phenol resin, an epoxy acrylate resin, a silicone resin, or the like as a base resin, respectively. Can be mentioned. Of these, polyester-based thermosetting insulating ink is particularly preferable as a material for forming the insulating protective film 15 of the LED element substrate 1 because of its excellent flexibility.

  The thermosetting ink for forming the insulating protective film 15 may be a white ink further containing an inorganic white pigment such as titanium dioxide. By improving the whiteness of the insulating protective film 15, it is possible to improve the design.

  The formation of the insulating protective film 15 using the above insulating thermosetting ink can be performed by a known method such as screen printing.

  In the case of using a cover lay film, it can be formed by applying an adhesive to a resin film having high heat resistance such as polyimide resin and affixing on the LED mount substrate 112.

[Reflective layer]
Although the reflective layer 16 is not an essential constituent element in the present invention, in the case where the reflective layer is provided, in the present embodiment, in order to improve the light emitting capability in the LED mounting module 10, the LED element is used. The LED element 2 is laminated on the outermost surface on the light emitting surface side of the circuit board except for the mounting portion of the LED element 2. It is not particularly limited as long as it is a member having a reflective surface for reflecting the light emitted from the LED element and guiding it in a predetermined direction, but white polyester foam type white polyester, white polyethylene resin, silver vapor-deposited polyester, etc. And can be used as appropriate according to the required specifications.

<Method for producing LED element substrate>
The LED element substrate is not particularly limited, and can be manufactured by a conventionally known method for manufacturing an electronic substrate. For example, it can be manufactured through the etching process described below. Further, it is preferable to subject the resin in advance to a heat resistance improving process by annealing according to the material resin to be selected.

[Annealing treatment]
Although not essential in the present invention, conventionally known heat treatment means can be used when annealing is performed. As an example of the annealing treatment temperature, when the resin substrate is PEN, it is in the range of the glass transition temperature to the melting point, more specifically in the range of 160 ° C. to 260 ° C., more preferably 180 ° C. to 230 ° C. An example of the annealing time is about 10 seconds to 5 minutes. According to such heat treatment conditions, the thermal contraction start temperature of PEN, which is generally about 80 ° C., can be improved to about 100 ° C.

[Etching process]
It is possible to obtain a laminated body that is a material for an LED element substrate by laminating a metal wiring portion 13 such as a copper foil as a material for the metal wiring portion on the surface of the resin substrate that has undergone the annealing treatment. As a lamination method, a method of adhering a metal foil to the surface of a resin substrate with an adhesive, or a plating method or a vapor deposition method (sputtering, ion plating, electron beam evaporation, vacuum evaporation) directly on the surface of the resin substrate. , Chemical vapor deposition, and the like). From the viewpoint of cost and productivity, a method of bonding the metal foil to the surface of the resin substrate with a urethane-based adhesive is advantageous.

  Next, an etching mask patterned in the shape of the metal wiring portion 13 is formed on the surface of the metal foil of the laminate. In the future, the etching mask is provided so that the wiring pattern forming portion of the metal foil that will become the metal wiring portion 13 is free from corrosion by the etching solution. The method for forming the etching mask is not particularly limited. For example, the etching mask may be formed on the surface of the laminated sheet by exposing the photoresist or dry film through the photomask and then developing the ink mask. An etching mask may be formed on the surface of the laminated sheet by this printing technique.

  Next, the metal foil in a portion not covered with the etching mask is removed with an immersion liquid. Thereby, parts other than the location used as the metal wiring part 13 are removed among metal foil.

  Finally, the etching mask is removed using an alkaline stripping solution. As a result, the etching mask is removed from the surface of the metal wiring portion 13.

[Insulating protective film and reflective layer forming step]
After forming the metal wiring portion, an insulating protective film 114 and a reflective layer 16 are further laminated as necessary. These laminations can be performed by a known method. Depending on the material to be employed, various laminating methods such as screen printing, dry lamination, thermal lamination, and the like can be used.

<LED mounting module>
The LED mounting module 10 can be obtained by mounting an LED element on the LED element substrate 1 described above.

  The manufacturing method of the LED mounting module 10 using the board | substrate 1 for LED elements is demonstrated. The joining of the LED element 2 to the metal wiring part 13 can be preferably performed by soldering. This solder bonding can be performed by a reflow method or a laser method. In the reflow method, the LED element 2 is mounted on the metal wiring part 13 via solder, and then the LED element substrate is transported into the reflow furnace, and hot air of a predetermined temperature is blown to the metal wiring part 13 in the reflow furnace. In this method, the solder paste is melted to attach the LED element 2 to the metal wiring portion 13. The laser method is a method of soldering the LED element 2 to the metal wiring portion 13 by locally heating the solder with a laser.

  When performing solder joining of the LED element 2 to the metal wiring part 13, it is preferable to use a method of performing solder reflow by laser irradiation from the back side of the LED element substrate. Thereby, it becomes possible to more reliably suppress the ignition of the organic component of the solder due to heating and the accompanying damage to the base material.

<LED display device>
FIG. 2 is a perspective view schematically showing an outline of a layer configuration of the LED display device 100 using the LED mounting module 10. The LED display device 100 displays information (images) such as characters and videos on the monitor 3 by driving (emitting light) the plurality of LED elements 2 arranged in a substantially matrix at predetermined intervals. The LED element 2 is mounted on the metal wiring portion 13 of the LED element substrate 1. In addition, although it is not essential in this invention, as shown in FIG. 2, the heat dissipation structure 4 for radiating the heat radiated from the LED mounting module 10 to the outside more efficiently is installed on the back side of the base material. Is more preferable.

  The LED mounting module of the present invention described above and the LED display device using the same have the following effects.

(1) A substrate for an LED element comprising a resin base material and a metal wiring portion laminated on the surface of the resin base material via an adhesive layer, wherein the adhesive layer and / or the resin base material has a pigment In accordance with JIS-Z8722, ΔL ^{* under} the conditions of a D65 light source, 10 ° viewing angle is 60 or less, either of an adhesive layer containing a pigment or a resin substrate containing a pigment. It was set as the board | substrate for a certain LED element.

  Thereby, the concealability can be improved without diffusing the light leaking to the back side among the light emitted from the LED element.

  (2) The LED element substrate according to (1), wherein the pigment is a pigment that transmits near infrared rays having a wavelength of 750 nm to 1500 nm.

  Thereby, in addition to the effect of (1), generation | occurrence | production of the heat | fever by near-infrared absorption of the resin layer containing a pigment can be suppressed. Therefore, it is possible to suppress a decrease in light emission efficiency of the LED element due to the generation of heat in the resin layer containing the pigment.

  (3) The substrate for an LED element according to (2), wherein the pigment contains an oxazine pigment.

  Thereby, in addition to the effects of (1) and (2), the oxazine pigment can be used as an adhesive layer and / or a resin substrate having high UV resistance and high durability. Further, when the oxazine pigment is contained in the adhesive layer, the adhesiveness can also be improved.

  (4) The pigment includes a benzimidazolone pigment and a phthalocyanine pigment, and the content ratio of the benzimidazolone pigment to the phthalocyanine pigment in the pigment is from 30:70 to 70:30 in mass ratio. It was set as the board | substrate for LED elements as described in (2) in the range.

  Thereby, in addition to the effects of (1) and (2), even when the thickness of the resin base material or the adhesive layer is reduced, the resin layer having sufficient concealability can be obtained. Therefore, it can be set as the preferable board | substrate for LED elements from a viewpoint of productivity. Further, when the benzimidazolone pigment and the phthalocyanine pigment are contained in the adhesive layer, the adhesive layer can have the same adhesiveness as the adhesive layer containing the oxazine pigment.

  (5) The LED element substrate according to any one of (1) to (4), wherein the LED element substrate is a flexible resin substrate.

  As a result, in addition to the effects (1) to (4), it is possible to simplify the work of aligning the metal wiring portion and forming the adhesion. For this reason, it is particularly useful to use a flexible resin substrate as the LED element substrate from the viewpoints of freedom of wiring design and productivity.

  (6) It was set as the LED mounting module which mounted the LED element on the board | substrate for LED elements in any one of (1) to (5).

  Thereby, it can be set as the LED mounting module which has the effect of (1) to (5).

  (7) An LED display device using the LED mounting module of (6) as a backlight light source.

  Thereby, it can be set as the LED display device which has the effect of (6).

DESCRIPTION OF SYMBOLS 1 LED element substrate 11 Base resin 12 Adhesive layer 13 Metal wiring part 14 Solder layer 15 Insulating protective film 16 Reflective layer 10 LED mounting module 100 LED display device

Claims (7)

A resin substrate;
A metal wiring part laminated on the surface of the resin base material via an adhesive layer, and an LED element substrate,
The adhesive layer and / or the resin substrate contains a pigment,
Either an adhesive layer containing the pigment or a resin substrate containing the pigment, an LED having a ΔL ^* of 60 or less according to JIS-Z8722 and a D65 light source, 10 ° viewing angle Device substrate.   The LED element substrate according to claim 1, wherein the pigment is a pigment that transmits near infrared rays having a wavelength of 750 nm to 1500 nm.   The LED element substrate according to claim 2, wherein the pigment contains an oxazine pigment. The pigment comprises a benzimidazolone pigment and a phthalocyanine pigment,
The LED element substrate according to claim 2, wherein a content ratio of the benzimidazolone pigment and the phthalocyanine pigment in the pigment is in a range of 30:70 to 70:30 by mass ratio.   The LED element substrate according to claim 1, wherein the LED element substrate is a flexible resin substrate. The LED mounting module which mounted the LED element on the board | substrate for LED elements in any one of Claim 1 to 5.   The LED display apparatus which uses the LED mounting module of Claim 6 as a backlight light source.

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