JP2016173932A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC socket which improves the work efficiency by eliminating the need for disassembly work, and for an adjustment mechanism, and can adjust the pressing force of an IC package having a different thickness, while reducing the number of components.SOLUTION: An IC socket has a pair of locking members, and at least a pair of engaging parts. One of the pair of locking members includes locking pawls having a convex part in the central part at the tip, and concave parts at the right and left parts. The other of the pair of locking members includes locking pawls having a concave part in the central part at the tip, and convex parts at the right and left parts. One of the pair of engaging parts has a shape having a convex part in the central part, and concave parts at the right and left parts. The other of the pair of engaging parts has a shape having a concave part in the central part, and convex parts at the right and left parts. Pressing force of an IC package having a different thickness is adjusted, by turning the direction of a lid body unit, and changing the direction of engagement of the pair of locking members and the pair of engaging parts.SELECTED DRAWING: Figure 7

Description

  The present invention relates to an IC socket used for inspecting an IC package such as a semiconductor package or a module, and more particularly to an IC socket capable of adjusting a pressing force corresponding to the thickness of the IC package.

  In an IC socket to which an IC package such as a semiconductor package or a module as an electrical component is mounted, an IC socket that holds an IC package mounted on a contact pin of an IC socket main body fixed to a printed board by a press plate is known. ing.

  Conventionally, when measuring an IC package with different thicknesses in such an IC socket with one type of IC socket, the height of the pressing surface that presses the IC package is adjusted by removing the screw that fixes the spacer. There is a problem in that the work to be disassembled has to be performed, the work is difficult and complicated, and it takes man-hours, time and cost.

  As a conventional technique for solving such a problem, the technique disclosed in Patent Document 1 includes four cam surfaces having different heights, a spacer having a pressing portion, an operation knob, and an adjustment mechanism such as a spring member. An IC socket is disclosed that can adjust the pressing force corresponding to the thickness of the IC package by rotating the operation knob by 90 degrees.

  In addition, the technique disclosed in Patent Document 2 discloses a socket for a semiconductor device to which a feeding function for pushing a pushing member with an adjusting knob is added in order to eliminate a spacer replacement operation.

JP 2003-243117 A JP 2006-252946 A

  However, the conventional techniques described in Patent Document 1 and Patent Document 2 do not require disassembly work, but the structure becomes complicated, so that separate components are required, resulting in an increase in parts cost, man-hours, and the like. It was.

  Accordingly, the object of the present invention is to eliminate the need for disassembling work such as replacement of a spacer and to have an adjustment mechanism in order to solve such a conventional problem. And it is providing the IC socket which can adjust the pressing force of IC package which has different thickness, reducing a number of parts.

  In order to solve the above problems, an IC socket of the present invention includes a socket body unit fixed to a printed circuit board, a socket body unit having a plurality of contacts implanted in the socket body unit, and the socket body. The lid body that presses the IC package placed on the unit and the left and right sides of the lid body are pivotally supported, and the lid body is locked to the socket body. A lid body unit having a locking mechanism having a pair of locking members that can be attached, and a pair of protrusions provided on the left and right sides of the outer edge of the socket body, and the pair of locking members The engaging member has at least a pair of engaging portions, and one of the pair of locking members includes a locking claw having a convex portion at the center portion and a concave portion at the left and right portions at the tip portion, and the other. At the tip, A locking claw having a concave portion in the central portion and a convex portion in the left and right portions is provided, and one of the pair of engaging portions has a shape having a convex portion in the central portion and a concave portion in the left and right portions. The other has a shape having a concave portion in the central portion and a convex portion in the left and right portions, and rotates the direction of the lid main body unit to attach the pair of locking members to the socket main body unit. And the pair of engaging portions are changed in engagement direction to adjust the pressing force of IC packages having different thicknesses.

  The socket main body may further include another pair of engaging portions which are a pair of protrusions provided on a surface different from the pair of protrusions of the outer edge portion.

  In addition, both of the other pair of engaging portions have flat surfaces, and the direction of the lid main body unit is rotated and attached to the socket main body unit, whereby the pair of locking members and the pair of the paired engaging portions are attached. It is also possible to adjust the pressing force of the IC package having three different thicknesses by changing the direction of engagement between the engaging portion and the other pair of engaging portions.

  In addition, one of the other pair of engaging portions has a shape having a convex portion in the central portion and a concave portion in the left and right portions, and the other has a concave portion in the central portion and a convex portion in the left and right portions. The pair of locking members, the pair of engaging portions, and the other pair of engaging portions are attached to the socket body unit by rotating the direction of the lid body unit. It is good also as what adjusts the pressing force of IC package which has four types of different thickness by changing the direction of meshing.

  In addition, an IC thickness display is provided at the four corners of the surface of the socket body, and a notch and an instruction mark are provided at one of the four corners of the lid body. The IC thickness display may be instructed at a position corresponding to the instruction mark in accordance with the direction of the combination of the lid body unit and the socket body unit.

  According to the present invention, it is not necessary to perform a disassembly operation such as spacer replacement, and it is not necessary to have an adjustment mechanism or the like, so that the work efficiency can be increased and the number of parts is reduced and the thickness is different. An IC socket capable of adjusting the pressing force of the IC package can be provided.

It is a center longitudinal cross-sectional view which shows the structure of the IC socket by a prior art. It is a figure which shows the structure of the pushing lid unit which comprises a part of another IC socket by a prior art. It is a figure which shows the structure of the pushing lid unit which comprises a part of one Embodiment of IC socket which concerns on this invention. It is a figure which shows the structure of the 2 type switching type socket main body unit which comprises a part of one Embodiment of IC socket which concerns on this invention. It is a figure which shows the structure of the 3 type switching type socket main body unit which comprises a part of another embodiment of the IC socket which concerns on this invention. It is a figure which shows the structure of the 4 types switching type socket main body unit which comprises a part of further another embodiment of the IC socket which concerns on this invention. FIG. 5 is a view showing an IC socket according to an embodiment of the present invention, in which the socket body unit shown in FIG. 4 and the push-in lid unit shown in FIG. 3 are combined. FIG. 8 is a view showing the IC socket shown in FIG. 7 in combination with the direction of the push-in lid unit opposite to that in FIG. 7. FIG. 6 is a view showing another embodiment of the IC socket according to the present invention, which is an IC socket in which the socket body unit shown in FIG. 5 and the push-in lid unit shown in FIG. 3 are combined. FIG. 7 is a view showing an IC socket according to still another embodiment of the IC socket according to the present invention, in which the socket body unit shown in FIG. 6 and the push-in lid unit shown in FIG. 3 are combined.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a central longitudinal sectional view showing a configuration of an IC socket 100 according to the prior art.

  In FIG. 1, a conventional IC socket 100 includes a socket body unit 110 on which an IC package 10 fixed to a printed circuit board 1 is placed, and a push-in lid unit 120 attached to the upper part of the socket body unit 110. The socket body unit 110 includes a socket body 111 fixed to the printed circuit board 1, a plurality of probe pins 112 implanted in the socket body 111, and a support substrate that holds the probe pins 112 together with the socket body 111. 113, a screw 114 for fixing the support substrate 113 to the socket main body 111, and a movable base 115 for holding the IC package 10.

  The socket main body 111 is attached to the printed circuit board 1 together with the reinforcing plate 2 by screws 3. A support substrate 113 is disposed on the upper portion of the socket main body 111 and is integrally fixed by screws 114. A plurality of probe pins 112 are upright with respect to the socket main body 111 and the support substrate 113. Have been planted.

  The pushing lid unit 120 includes a lid main body 121 placed on the socket main body unit 110, a pressing block 122 disposed inside the lid main body 121, and pressing the IC package 10 disposed on the probe pin 112. The lid main body 121 is detachably attached to the socket main body 111 and locked, and a locking mechanism 123 is provided, and an adjustment mechanism 124 for adjusting the pressing force for pressing the pressing block 122 is provided.

  The locking mechanism 123 includes a pair of locking members 125 that can lock and attach the lid main body 121 to the socket main body 111. The locking member 125 is pivotally supported by pins 126 on both the left and right sides of the lid main body 121 so as to be rotatable. The locking member 125 protrudes toward the inside upper side of the lid main body 121 and the pressing arm for attaching the spring member 127 between the lid main body 121 and the operation arm 125 a projecting toward the upper outside of the lid main body 121. 125b, a locking arm 125c projecting outward and downward from the lid main body 121, and a pair of protrusions provided on the left and right of the outer edge of the socket main body 111, provided at the tip of the locking arm 125c. A locking claw 125d that engages with the engaging portion 111a.

  The adjustment mechanism 124 includes an operation knob 128 that is attached to the tip of the shaft portion 122a that protrudes from the upper center of the pressing block 122, a spring member 129 that is disposed between the upper surface of the lid main body 121 and the operation knob 128, and a pressing member. And an adjustment cam 130 which is attached to the upper portion of the block 122 and has cam surfaces with different heights in four stages.

  The push-in lid unit 120 is configured so that the pressing block 122 of the push-in lid unit 120 abuts on the IC package 10 after the IC package 10 is placed on the probe pin 112 of the socket body unit 110. 110. After the pushing lid unit 120 is disposed on the socket body unit 110, the operation arm 125a of the locking member 125 is operated, and the locking claw 125d of the locking member 125 is locked to the engaging portion 111a of the socket body 111. The pushing lid unit 120 is fixed on the socket body unit 110 so as to stop and hold the IC package 10.

  When the IC packages 10 having different thicknesses are used, the cams having different heights of the adjusting cams 130 are rotated by rotating the operation knob 128 attached to the tip of the shaft portion 122a of the pressing block 122 by 90 °. Each surface is operated by switching, and the pressing force can be adjusted.

  As described above, the IC socket 100 shown in FIG. 1 can be adjusted by using the adjusting mechanism 124 when the IC packages 10 having different thicknesses are used. However, since the structure is complicated, additional components are required, and there is a problem that the cost of parts, man-hours, and the like increase.

  FIG. 2 is a diagram showing a configuration of a push-in lid unit 200 constituting a part of another IC socket according to the prior art, FIG. 2 (a) is a top view, and FIG. 2 (b) is a diagram of FIG. It is IIb-IIb sectional drawing shown to (a), FIG.2 (c) is a left side view, FIG.2 (d) is a right side view.

  The pushing lid unit 200 shown in FIG. 2 has a configuration that is more conventional than that of the IC socket 100 shown in FIG. 1, but will be described in order to clarify the difference from the configuration of the present invention that will be described later. In FIG. 2, the pushing lid unit 200 includes a lid main body portion 201 placed on a socket main body unit (not shown), a pressing block 202 that presses the IC package 10 mounted on the probe pin, and a lid main body portion 201. A locking mechanism 203 that is detachably attached and locked to the socket main body, and a spacer 204 that is disposed between the lid main body 201 and the pressing block 202 are provided.

  The lid main body 201 is formed in a substantially square shape so as to match the shape of the IC package 10, and a spacer 204 and a recess for fixing the pressing block 202 are provided in the center, and the spacer 204 is provided inside the recess. Then, the pressing block 202 is fixed with two screws 208.

  The locking mechanism 203 includes a pair of locking members 205 that can be locked and attached to the lid body 201. The locking member 205 is pivotally supported by pins 206 on both the left and right sides of the lid main body 201 so as to be rotatable. The locking member 205 is an operation arm 205 a that protrudes toward the upper outside of the lid main body 201 and a pressing arm that protrudes toward the upper inner side of the lid main body 201 and attaches the spring member 207 between the lid main body 201. 205b, a locking arm 205c that protrudes outward and downward from the lid body 201, and a pair of protrusions provided at the left and right of the outer edge of the socket body unit (not shown) provided at the tip of the locking arm 205c. And a locking claw 205d that engages with a certain engaging portion.

  Such a pushing lid unit 200 is configured such that after the IC package 10 is placed on the probe pin 112 of the socket body unit 110 as shown in FIG. 1, the pushing block 202 of the pushing lid unit 200 is placed on the IC package 10. Is disposed on the socket body unit 110 so as to abut. After the pushing lid unit 200 is disposed on the socket body unit 110, the operation arm 205a of the locking member 205 is operated, and the locking claw 205d of the locking member 205 is locked to the engaging portion 111a of the socket body 111. The pushing lid unit 200 is fixed on the socket body unit 110 so as to stop and hold the IC package 10.

  Such a conventional IC socket push-in lid unit 200 shown in FIG. 2 requires the spacer 204 to be changed when the IC package 10 having a different thickness is used, which increases the amount of work, man-hours, and the like. was there.

  FIG. 3 is a diagram showing a configuration of a push-in lid unit 300 constituting a part of an embodiment of an IC socket according to the present invention, FIG. 3A is a top view, and FIG. Fig. 3 (a) is a cross-sectional view taken along line IIIb-IIIb, Fig. 3 (c) is a left side view, and Fig. 3 (d) is a right side view.

  In FIG. 3, an IC socket push-in lid unit 300 is used in combination with socket body units 400, 500, and 600 shown in FIGS. The pushing lid unit 300 is placed on the socket body units 400, 500, and 600, is formed in a substantially square shape so as to match the shape of the IC package 10, and has a pressing portion that presses the IC package 10 on the lower surface. A main body part 301 and a locking mechanism 303 for detachably attaching and locking the lid main body part 301 to the socket main body part are provided.

  The locking mechanism 303 includes a pair of locking members 305 that can be locked and attached to the lid main body 301. The locking member 305 is pivotally supported by the pins 306 on both the left and right sides of the lid main body 301 so as to be rotatable. The locking member 305 protrudes toward the inside upper side of the lid main body 301 and the pressing arm for attaching the spring member 307 between the lid main body 301 and the operation arm 305 a that projects toward the upper outside of the lid main body 201. 305b, a locking arm 305c projecting outward and downward from the lid main body 301, and a pair of protrusions provided at the left and right of the outer edge of the socket body unit (not shown) provided at the tip of the locking arm 305c. It has the locking claw 310 engaged with a certain engaging part.

  The locking member 305 of the IC socket according to the present invention is not the same shape as the left and right, but a locking member 305A having a locking claw 310A formed in a shape having a convex portion in the central portion and a concave portion in the left and right portions. And a locking member 305B having a locking claw 310B formed in a shape having a concave portion in the central portion and a convex portion in the left and right portions. An indication mark 309 indicating IC thickness indications 406, 506, and 606 displayed on socket body portions 401, 501, and 601 described later is provided at one of the four cutouts at the four corners of the surface of the lid body portion 301. Is provided.

  FIG. 4 is a diagram showing a configuration of a two-type switching type socket body unit 400 that constitutes a part of an embodiment of an IC socket according to the present invention, and FIG. 4 (a) is a top view. 4 (b) is a left side view, and FIG. 4 (c) is a right side view.

  In FIG. 4, a socket body unit 400 of an IC socket is fixed to a printed circuit board, and includes a socket body portion 401 including a probe pin housing portion that houses a plurality of probe pins in the center, and has a floating structure. A movable pedestal 403 configured to hold the IC package 10 and four screws 404 that restrict the upward movement of the movable pedestal 403 and hold the movable pedestal 403 in the socket body 401 are provided. The present invention can be applied to other similar IC packages corresponding to such a pressing structure, such as a ball grid array type. The probe pin is not particularly limited, and a contact such as a contact terminal that can obtain an appropriate pressing force can be used. Moreover, the shape without the movable base of a floating structure may be sufficient.

  The socket main body 401 according to the present embodiment includes an engagement portion 405 that is a pair of protrusions provided on the left and right sides of the outer edge portion. The engaging portion 405 of the present embodiment is not the same shape on the left and right, but has a convex portion in the center portion, and has a concave portion in the central portion, and has a concave portion in the central portion. And an engaging portion 405B formed in a shape having convex portions on the left and right portions.

  In addition, IC thickness displays 406 are provided that are arranged at two diagonal positions of the four corners of the surface of the socket body 401 of the present embodiment. Here, an IC thickness display 406A when the thickness of the IC is thin (2.20) is provided at the upper left of the surface of the socket main body 401, and when the thickness of the IC is thick at the lower right of the surface (2 . 80) IC thickness indication 406B. The thickness display is an example, and the present invention is not limited to this.

  The socket body unit 400 shown in FIG. 4 is used in combination with the pushing lid unit 300 shown in FIG. 3, and is used by rotating the pushing lid unit 300 by 180 degrees as shown in FIGS. By doing so, the IC package 10 having two types of thicknesses can be used by being pressed with an appropriate pressing force.

  FIG. 5 is a diagram showing a configuration of a three-type switching type socket body unit 500 constituting a part of another embodiment of the IC socket according to the present invention, and FIG. 5 (a) is a top view, 5 (b) is a front view, FIG. 5 (c) is a left side view, and FIG. 5 (d) is a right side view.

  In FIG. 5, a socket body unit 500 of an IC socket is fixed to a printed circuit board, and includes a socket body portion 501 including a probe pin housing portion in which a plurality of probe pins are implanted and housed in the center, and a floating structure. A movable pedestal 503 configured to hold the IC package 10 and four screws 504 for restricting the upward movement of the movable pedestal 503 and holding the movable pedestal 503 in the socket main body 501 are provided.

  Unlike the socket main body unit 400 shown in FIG. 4, the socket main body 501 of the present embodiment includes four engaging portions 505 on the front, rear, left and right sides of the outer edge of the socket main body 501. The engaging portion 505 is provided on the left and right sides of the socket main body portion 501, has a convex portion in the central portion, and has a concave portion in the central portion, and has a concave portion in the central portion. It includes engaging portions 505B formed in a shape having convex portions on the left and right portions, and engaging portions 505C and 505D that are provided before and after the socket body portion 501 and have a flat surface without any irregularities.

  In addition, IC thickness displays 506 are provided at four locations on the four corners of the surface of the socket body 501 of the present embodiment. As described later, the IC thickness display 506 of the present embodiment is obtained by rotating the direction of the pushing lid unit 300 by 180 degrees when using the engaging portions 505C and 505D provided at the front and rear of the socket main body portion 501. Since the height does not change even when used, three types of IC thickness indications 506 are provided. Here, an IC thickness display 506A with an IC thickness of 2.20 is provided at the upper left of the surface of the socket body 501 and an IC thickness display 506B with an IC thickness of 2.80 is provided at the lower right. IC thickness indications 506C and 506D having an IC thickness of 2.45 are provided at the lower left and upper right. The thickness display is an example, and the present invention is not limited to this.

  The socket body unit 500 shown in FIG. 5 is used in combination with the pushing lid unit 300 shown in FIG. 3, and used by rotating the pushing lid unit 300 to four types of positions as shown in FIG. 9 described later. By doing so, the IC package 10 having three kinds of thicknesses can be used by being pressed with an appropriate pressing force.

  FIG. 6 is a diagram showing a configuration of a four-type switching type socket body unit 600 constituting a part of still another embodiment of the IC socket according to the present invention, and FIG. 6A is a top view. 6 (b) is a front view, FIG. 6 (c) is a left side view, FIG. 6 (d) is a right side view, and FIG. 6 (e) is a rear view. .

  In FIG. 6, a socket body unit 600 of an IC socket is fixed to a printed circuit board, and includes a socket body portion 601 including a probe pin housing portion that houses a plurality of probe pins in the center and accommodates them in a floating structure. A movable pedestal 603 configured to hold the IC package 10 and four screws 604 that restrict the upward movement of the movable pedestal 603 and hold the movable pedestal 603 in the socket main body 601 are provided.

  The socket body 601 of this embodiment is provided with four engaging portions 605 on the front, rear, left and right of the outer edge portion. The engaging portion 605 is provided on the left and right of the socket body 601 and has a convex portion at the central portion and a concave portion at the central portion, and has a concave portion at the central portion. Engagement portion 605B formed in a shape having a convex portion on the left and right portions, and an engagement formed in a shape having a concave portion in the central portion and a convex portion on the left and right portions provided on the front and rear of the socket body 601. Part 605C, and engaging part 605D formed in a shape having a convex part in the central part and a concave part in the left and right parts.

  In addition, IC thickness displays 606 are provided at four locations on the four corners of the surface of the socket body 601 of the present embodiment. The IC thickness display 606 of this embodiment is provided with four types of IC thickness displays 606. Here, an IC thickness display 606A with an IC thickness of 2.20 is provided at the upper left of the surface of the socket body 601 and an IC thickness display 606B with an IC thickness of 2.80 is provided at the lower right. An IC thickness display 606C having a lower left IC thickness of 2.45 is provided, and an IC thickness display 606D having an IC thickness of 3.00 is provided at the upper right. The thickness display is an example, and the present invention is not limited to this.

  The socket body unit 600 shown in FIG. 6 is used in combination with the pushing lid unit 300 shown in FIG. 3, and used by rotating the pushing lid unit 300 to four types of positions as shown in FIG. By doing so, the IC package 10 having four kinds of thicknesses can be used by being pressed with an appropriate pressing force.

  7 is a diagram showing an IC socket 700 according to an embodiment of the present invention, which is an IC socket 700 in which the socket body unit 400 shown in FIG. 4 and the push-in lid unit 300 shown in FIG. 3 are combined. 7 (a) is a top view, FIG. 7 (b) is a front view, FIG. 7 (c) is a left side view, and FIG. 7 (d) is a right side view.

  In FIG. 7, the IC socket 700 is configured by combining a socket body unit 400 and a pushing lid unit 300. In the present embodiment, the socket body unit 400 is arranged in such a direction that the locking claw 310A of the locking member 305A and the engaging portion 405A are engaged, and the locking claw 310B of the locking member 305B and the engaging portion 405B are engaged. And the push-in lid unit 300 are combined.

  The locking claw 310A is formed in a shape having a convex portion in the central portion and a concave portion in the left and right portions, and the engaging portion 405A is formed in a shape having a convex portion in the central portion and a concave portion in the left and right portions. Therefore, the convex portions of the central portion are engaged with each other. Further, the locking claw 310B is formed in a shape having a concave portion in the central portion and having a convex portion in the left and right portions, and the engaging portion 405B is a shape having a concave portion in the central portion and having a convex portion in the left and right portions. Therefore, the left and right convex portions are engaged with each other. For this reason, since the socket main body unit 400 and the push-in lid unit 300 are engaged deeply, they are used when the thickness of the IC is thin. Here, as shown in FIG. 7B, the IC package upper surface is 7.50, the IC package lower surface is 5.30, and the IC package thickness is 2.20. Further, an IC thickness display 406A of 2.20 is displayed at the position indicated by the instruction mark 309 of the socket body 401.

  FIG. 8 is a view showing the IC socket 700 shown in FIG. 7 in which the direction of the push-in lid unit 300 is opposite to that shown in FIG. 7, and FIG. 8A is a top view. 8 (b) is a front view, FIG. 8 (c) is a left side view, and FIG. 8 (d) is a right side view.

  In FIG. 8, the IC socket 700 is configured by combining a socket body unit 400 and a pushing lid unit 300. In the present embodiment, the socket main body unit 400 is arranged in such a direction that the locking claw 310A of the locking member 305A and the engaging portion 405B are engaged, and the locking claw 310B of the locking member 305B and the engaging portion 405A are engaged. And the push-in lid unit 300 are combined.

  The locking claw 310A is formed in a shape having a convex portion in the central portion and a concave portion in the left and right portions, and the engaging portion 405B is formed in a shape having a concave portion in the central portion and having a convex portion in the left and right portions. Therefore, the convex portion of the central portion of the locking claw 310A and the concave portion of the central portion of the engaging portion 405B are engaged with each other. In addition, the locking claw 310B is formed in a shape having a concave portion in the central portion and a convex portion in the left and right portions, and the engaging portion 405A has a convex portion in the central portion and a concave portion in the left and right portions. Therefore, the convex portions on the left and right portions of the locking claw 310B and the concave portions on the left and right portions of the engaging portion 405B are engaged with each other. For this reason, since the socket main body unit 400 and the push-in lid unit 300 are meshed shallower than those in FIG. 7, they are used when the thickness of the IC is thick. Here, as shown in FIG. 8B, the IC package upper surface is 8.10, the IC package lower surface is 5.30, and the IC package thickness is 2.80. Further, an IC thickness display 406B of 2.80 is displayed at the position indicated by the instruction mark 309 of the socket body 401.

  FIG. 9 is a view showing an IC socket 900 according to another embodiment of the IC socket according to the present invention, which is a combination of the socket body unit 500 shown in FIG. 5 and the pushing lid unit 300 shown in FIG. 9 (a) is a top view, FIG. 9 (b) is a front view, FIG. 9 (c) is a left side view, and FIG. 9 (d) is a right side view.

  In FIG. 9, the IC socket 900 is configured by combining a socket body unit 500 and a pushing lid unit 300. In the present embodiment, the socket body unit 400 is arranged in such a direction that the locking claw 310A of the locking member 305A and the engaging portion 505C are engaged, and the locking claw 310B of the locking member 305B and the engaging portion 505D are engaged. And the push-in lid unit 300 are combined.

  The locking claw 310A is formed in a shape having a convex portion in the central portion and a concave portion in the left and right portions, and the engaging portion 505C is formed in a shape having a flat surface. The convex part of the center part and the flat surface of the engaging part 405B are engaged with each other. Further, the locking claw 310B is formed in a shape having a concave portion in the central portion and a convex portion in the left and right portions, and the engaging portion 405A is formed in a shape having a flat surface. The convex portions of the left and right portions of 310B and the flat surface of the engaging portion 405B are engaged with each other. For this reason, the socket body unit 500 and the push-in lid unit 300 are meshed at the same height even when rotated 180 degrees. Here, as shown in FIG. 9B, the IC package upper surface is 7.75, the IC package lower surface is 5.30, and the IC package thickness is 2.45. In addition, an IC thickness display 506C or 506D of 2.45 is displayed at a position indicated by the instruction mark 309 of the socket body 501.

  Here, the configuration in which the engaging portions 505C and 505D are engaged with the locking claws 310A and 310B is shown, but the engaging portions 505A and 505B are also used in the same manner as the configurations shown in FIGS. Therefore, the IC package 10 having three kinds of thicknesses can be used by being pressed with an appropriate pressing force.

  FIG. 10 shows still another embodiment of the IC socket according to the present invention, and shows an IC socket 1000 in which the socket body unit 600 shown in FIG. 6 and the push-in lid unit 300 shown in FIG. 3 are combined. 10 (a) is a top view, FIG. 10 (b) is a front view, FIG. 10 (c) is a left side view, and FIG. 10 (d) is a right side view. .

  In FIG. 10, the IC socket 1000 is configured by combining a socket body unit 600 and a pushing lid unit 300. In the present embodiment, the socket main body unit 600 is in the direction in which the locking claw 310A of the locking member 305A and the engaging portion 605C are engaged, and the locking claw 310B of the locking member 305B and the engaging portion 605D are engaged. And the push-in lid unit 300 are combined.

  The locking claw 310A is formed in a shape having a convex portion in the central portion and a concave portion in the left and right portions, and the engaging portion 605C is formed in a shape having a concave portion in the central portion and having a convex portion in the left and right portions. Therefore, the convex portion at the center portion of the locking claw 310A and the concave portion are engaged with the central portion of the engaging portion 605B. Further, the locking claw 310B has a concave portion in the central portion and is formed in a shape having convex portions in the left and right portions, and the engaging portion 605D has a convex portion in the central portion and has concave portions in the left and right portions. Therefore, a convex portion is engaged with the left and right portions of the locking claw 310B, and a concave portion is engaged with the left and right portions of the engaging portion 605D. For this reason, since the socket body unit 600 and the push-in lid unit 300 are meshed shallowly, they are used when the thickness of the IC is large. Here, as shown in FIG. 10B, the IC package upper surface is 8.30, the IC package lower surface is 5.30, and the IC package thickness is 3.00. Further, an IC thickness display 606D of 3.00 is displayed at a position indicated by the instruction mark 309 of the socket main body 601.

  Here, the configuration in which the engaging portions 605C and 605D and the locking claws 310A and 310B are engaged with each other is shown. However, the engaging portions 605A and 605B can also be used after being rotated 180 degrees. 8 can be used in the same manner as the configuration shown in FIG. 8, and therefore, the IC package 10 having four types of thicknesses can be used by being pressed with an appropriate pressing force.

  As shown in FIGS. 4 to 6, in this embodiment, the socket body unit is a rectangular one, but other polygonal socket body units such as a hexagon and an octagon are used. Furthermore, it is good also as what adjusts the pressing force of IC package which has many different thickness. Although the package thickness is displayed on the IC thickness display, the display is not limited to this, and other displays such as large, medium, and small may be used.

  As described above, according to the IC socket according to the present invention, it is not necessary to perform disassembly work such as spacer replacement, and it is not necessary to have an adjustment mechanism, so that work efficiency can be improved and the number of parts can be increased. An IC socket capable of adjusting the pressing force of IC packages having different thicknesses can be provided.

DESCRIPTION OF SYMBOLS 10 IC package 300 Push-in lid unit 301 Cover body part 303, 303A, 303B Locking mechanism 305, 305A, 305B Locking member 305a Operation arm 305b Pressing arm 305c Locking arm 306 Pin 307 Spring member 309 Instruction mark 310, 310A, 310B Locking claw 400, 500, 600 Socket body unit 401, 501, 601 Socket body portion 403, 503, 603 Movable base 404, 504, 604 Screw 405, 405A, 405B, 505, 505A, 505B, 505C, 505D, 605A, 605B, 605C, 605D Engagement part 406, 406A, 406B, 506, 506A, 506B, 506C, 506D, 606, 606A, 606B, 606C, 606D IC thickness display 700 900,1000 IC socket

Claims (5)

A socket body fixed to a printed circuit board; and
A socket body unit having a plurality of contacts implanted in the socket body part;
A lid body for pressing an IC package placed on the socket body unit; and
A lid body having a locking mechanism having a pair of locking members pivotally supported on the left and right sides of the lid body portion and capable of locking and attaching the lid body portion to the socket body portion. Unit and
A pair of protrusions provided on the left and right of the outer edge of the socket main body, and having at least a pair of engaging portions that engage with the pair of locking members
One of the pair of locking members is provided with a locking claw having a convex portion at the central portion and a concave portion at the left and right portions at the tip portion, and the other has a concave portion at the central portion at the tip portion, It has a locking claw with convex parts on the left and right parts,
One of the pair of engaging portions has a shape having a convex portion in the central portion and a concave portion in the left and right portions, and the other has a shape having a concave portion in the central portion and a convex portion in the left and right portions. Have
By rotating the direction of the lid body unit and attaching it to the socket body unit, the direction of meshing between the pair of locking members and the pair of engaging portions is changed, and the IC packages having different thicknesses An IC socket characterized by adjusting a pressing force.   The said socket main-body part further has another pair of engaging parts which are a pair of projection part provided in the surface different from the said pair of projection part of an outer edge part. IC socket. Both of the other pair of engaging portions have flat surfaces,
By rotating the direction of the lid body unit and attaching it to the socket body unit, the direction of meshing between the pair of locking members and the pair of engaging portions and the other pair of engaging portions is changed. 3. The IC socket according to claim 2, wherein the pressing force of the IC package having three different thicknesses is adjusted. One of the another pair of engaging portions has a shape having a convex portion at the central portion and a concave portion at the left and right portions, and the other has a concave portion at the central portion and a convex portion at the left and right portions. Has a shape,
By rotating the direction of the lid body unit and attaching it to the socket body unit, the direction of meshing between the pair of locking members and the pair of engaging portions and the other pair of engaging portions is changed. The IC socket according to claim 2, wherein the pressing force of the IC package having four different thicknesses is adjusted. In the four corners of the surface of the socket body, IC thickness indications are provided,
At one of the four corners of the lid main body portion, a notch and an instruction mark are provided around it, and the indication mark is arranged in accordance with the direction of combination of the lid main body unit and the socket main body unit. 5. The IC socket according to claim 1, wherein the IC thickness indication is instructed at a corresponding position.