JP2015133369A - Optical device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive, functional and high quality optical device, and a method of manufacturing the same.SOLUTION: The optical device includes: an LED chip 30; an upper substrate 20 disposed while facing a light-emission surface of the LED chip 30; and a resin 40 that covers the LED chip 30 and is provided between the upper substrate 20 and the LED chip 30. The resin 40 is formed by compression molding. The upper substrate 20 is a glass substrate and the glass substrate includes a fluorescent substance.

Description

  The present invention relates to an optical device and a method for manufacturing an optical device.

  Conventionally, a light emitting diode (LED) that emits light by applying a forward bias between a pair of electrodes of an anode electrode and a cathode electrode is known. For example, Patent Document 1 discloses a method for manufacturing an LED package (optical device) that can easily mold a resin layer that protects an LED chip and functions as a lens.

  Also, in an optical device configured to sandwich a resin using a plurality of base materials, an optical device manufactured through a molding process such as pre-coating a resin and bonding the plurality of base materials together is known. ing.

JP 2009-206370 A

  However, many silicone resins used when manufactured by a conventional molding process have high elasticity and low strength like rubber materials even after being cured. For this reason, in order to protect this resin layer, a cover member is required, or a wavelength conversion sheet member for wavelength conversion is often used in combination. In this case, assembling these members with a resin layer having low strength often requires a complicated process, resulting in an increase in manufacturing cost.

  In addition, air between the plurality of base materials sandwiching the resin is not completely removed, and the probability of forming defects is relatively high. For this reason, a stable molding process cannot be obtained, and it is difficult to manufacture a high-quality optical device.

  Therefore, the present invention provides an inexpensive, functional and high-quality optical device and a method for manufacturing the optical device.

  An optical device according to an aspect of the present invention is provided between an optical element, a base material disposed toward a light emitting surface of the optical element, and the optical element covering the optical element and between the base material and the optical element. The resin is formed by compression molding.

  According to another aspect of the present invention, there is provided a method for manufacturing an optical device, comprising: placing an optical element on a first base material via an adhesive member; and the first base material and the second base material. A step of producing a compression-molded body by compression molding so as to sandwich a resin for sealing the optical element; a step of separating the first base material by separating the adhesive member from the compression-molded body; Cutting the compression molded body at a predetermined position and separating it after separating the first substrate.

  Other objects and advantages of the present invention are illustrated in the following examples.

  According to the present invention, it is possible to provide an inexpensive, functional and high-quality optical device and an optical device manufacturing method.

6 is a manufacturing process diagram of the optical device in Example 1. FIG. 6 is a manufacturing process diagram of the optical device in Example 1. FIG. It is explanatory drawing of the modification in Example 1. FIG. FIG. 10 is a manufacturing process diagram of an optical device as a modification in the first embodiment. 6 is a manufacturing process diagram of an optical device in Example 2. FIG. 6 is a manufacturing process diagram of an optical device in Example 2. FIG. 6 is a manufacturing process diagram of an optical device in Example 3. FIG. 6 is a manufacturing process diagram of an optical device in Example 3. FIG. 6 is a manufacturing process diagram of an optical device in Example 3. FIG. 10 is a perspective view of an optical device in Example 3. FIG. 6 is a manufacturing process diagram of an optical device in Example 4. FIG. 6 is a manufacturing process diagram of an optical device in Example 4. FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  First, with reference to FIG.1 and FIG.2, the manufacturing method of the optical device in Example 1 of this invention is demonstrated. FIG. 1 and FIG. 2 are manufacturing process diagrams of an optical device in the present embodiment, which are shown in time series in the order of FIG. 1 (A), (B), and FIG. 2 (A) to (C). The optical device of this example is manufactured by compression-molding a substrate using a compression molding apparatus (mold).

  First, as shown in FIG. 1A, the structure 100 is placed on a mold that includes one mold 50 (upper mold) and the other mold 60 (lower mold). The lower substrate 10 (first substrate or carrier) is, for example, a rectangular or circular metal substrate such as stainless steel. However, the present embodiment is not limited to this, and a silicon substrate (semiconductor substrate) manufactured as a silicon wafer or a glass substrate may be used as the lower substrate 10.

  A plurality of LED chips 30 (optical elements) are arranged on the lower base material 10 via the adhesive member 12. The LED chip 30 is a light emitting chip (light emitting element) that emits light of a specific color by applying a forward bias between a pair of electrodes of an anode electrode and a cathode electrode. The emission color varies depending on the material used for the LED chip 30. For example, AlGaAs that emits red light, GaP that emits green light, GaN that emits blue light, and the like are used. In this embodiment, the LED chip 30 is not limited to an LED chip that emits visible light, but may be a chip that emits light outside the visible light region such as ultraviolet light and infrared light. Further, instead of the LED chip 30, other types of optical elements such as a light receiving chip (light receiving element) that receives various kinds of light may be used.

  As the adhesive member 12, for example, a pressure-sensitive adhesive sheet having a property of peeling by heating to a predetermined temperature can be used. Only one LED chip 30 may be mounted on the lower substrate 10. On one main surface of the LED chip 30, an anode electrode and a cathode electrode are provided. In this embodiment, the LED chip 30 is bonded to the lower base material 10 by the adhesive member 12 with one main surface provided with these electrodes facing downward in FIG. Note that the LED chip 30 may be arranged facing upward. In this case, by attaching a wire or the like connected to the electrode to the adhesive member 12, an electrical connection surface (electrode) can be provided on the lower surface.

  A resin 40 (liquid resin) is provided on the lower substrate 10 so as to cover the LED chip 30. The resin 40 is, for example, a translucent resin. The resin 40 is supplied onto the lower substrate 10 using a dispenser (not shown) before placing the lower substrate 10 on which the LED chip 30 is placed on the other mold 60. In this embodiment, as the resin 40, for example, a silicone resin having translucency and thermosetting is used. The “translucency” in the present embodiment means that light emitted from the LED chip 30 can be emitted at least to the outside, and it is necessary to be so-called “colorless and transparent” in which the internal structure is clearly visible. There is no. The resin 40 may contain various phosphors (wavelength conversion materials) and phosphors as necessary. For example, an LED package (optical device) capable of emitting white light can be manufactured by using the LED chip 30 that emits blue light and using the resin 40 containing a phosphor that converts the wavelength of incident light into yellow. In addition, a resin 40 containing two kinds of phosphors can be used so that the wavelength of incident light can be converted into red and green. Further, the resin 40 may contain a white pigment. The silicone resin is suitable for sealing the LED chip 30 because the translucency is less likely to be lowered by ultraviolet rays or heat than, for example, an epoxy resin. However, another thermosetting resin such as an epoxy resin may be used as the resin 40.

  On the other hand, the mold 50 includes, for example, a cavity piece 52 formed in a cylindrical or rectangular block shape, a frame-shaped clamper 54 disposed on the outer periphery, a spring 55 (biasing member), and an O-ring 56 (seal). Ring). The cavity piece 52 is formed with a passage 58a (suction hole) for sucking air. Similarly, the clamper 54 is formed with a passage 58b for sucking air. A release film 72 is provided on the lower surface of the cavity piece 52 and the clamper 54. Further, the upper base material 20 (second base material) is sucked and held on the lower surface of the cavity piece 52 via the release film 72. By interposing the release film 72 in this way, the gap between the upper base material 20 and the cavity piece 52 can be eliminated (reduced), and the upper base material 20 is securely held by the cavity piece 52 by suction. Can do. Thereby, the upper base material 20 is disposed toward the upper surface of the LED chip 30.

  In addition, although the upper base material 20 can use the protective member made from glass, for example, it is not limited to this. Since the resin 40 such as a silicone resin has a low gas barrier property, the gas that has permeated through the resin 40 such as a silicone resin deteriorates the LED chip 30 by providing a glass protective member (upper base material 20) having a high gas barrier property. Or a problem that the resin on the chip surface is peeled off can be prevented.

  Moreover, you may use a protective member as a fluorescent substance layer by containing fluorescent substance or apply | coating fluorescent substance on the surface. In this case, various organic materials such as a thermosetting resin and a thermoplastic resin such as an epoxy resin, a polycarbonate resin, and a Teflon (registered trademark) resin can be used. An inorganic material such as glass can also be used. Since the protection member is not directly heated by the LED chip 30, it does not have to be a resin having high heat resistance. Further, when a fluorescent material is applied to the protective member, a fluorescent film containing the fluorescent material may be formed on at least one surface (for example, a contact surface with the resin 40). Moreover, it is preferable that the upper base material 20 and the lower base material 10 have the same or close linear expansion coefficient. For this reason, although it is preferable that the upper base material 20 and the lower base material 10 are comprised from the mutually same kind of material, a mutually different material may be sufficient.

  A vacuum pump (not shown) is connected to the passages 58a and 58b, and air in the passages 58a and 58b is sucked. The air is sucked from the passage 58 b formed in the clamper 54, whereby the release film 72 is attracted and fixed on the lower surface of the clamper 54. The release film 72 has a hole 72 a at a position corresponding to the passage 58 a formed in the cavity piece 52. Therefore, the upper base member 20 disposed on the lower surface of the cavity piece 52 through the hole 72 a of the release film 72 is attracted and fixed on the lower surface of the cavity piece 52 by sucking the air in the passage 58 a. The hole 72a may be formed after the release film 72 is attached to the one mold 50, or may be formed in advance. In this case, the hole 72a of the release film 72 can be formed by pressing a needle-like member.

  The other mold 60 is formed with a passage 68 for sucking air. Further, an O-ring 66 (seal ring) is provided on the upper surface of the other mold 60 along the outer periphery of the mold outside the passage 68. In the present embodiment, the structure 100 including the lower substrate 10, the adhesive member 12, the LED chip 30, and the resin 40 is formed on the other mold 60 as shown in FIG. Placed (held).

  Subsequently, the one mold 50 and the other mold 60 are closed, and the structure 100 is clamped using them. Further, by clamping, the spring 55 is contracted by pushing the clamper 54 up to the other mold 60, and the depth of the cavity recess formed by the cavity piece 52 and the clamper 54 becomes shallower. At this time, the resin 40 is filled in the cavity recess. 1B, the upper base material 20 presses the resin 40, and the resin 40 is sandwiched between the upper base material 20 and the lower base material 10 to cover all of the plurality of LED chips 30. Is flattened (compression molding). In addition, the upper base 20 is integrated with the structure 100 to form the structure 101. When the structure 100 is clamped by the one mold 50 and the other mold 60, the air in the space formed by the O-ring 66 and the mold surface provided in the other mold 60 is discharged through the passage 68. The As a result, the space between the one mold 50 and the other mold 60 is in a substantially vacuum (depressurized) state, and the air (air) between the upper base material 20 and the lower base material 10 is discharged to be in a depressurized state. By doing so, generation of voids in the resin 40 can also be prevented. For this reason, it is possible to prevent a molding defect that occurs due to air bubbles being sandwiched between the resin 40 and the upper base member 20 and realize a stable molding process. Further, by adjusting the height of the O-ring 66 and the height of the supplied resin 40 so that the resin 40 can be in a reduced pressure state before contacting the upper substrate 20, the resin 40 and the upper substrate 20 It is possible to more reliably prevent air bubbles from being sandwiched between them.

  Subsequently, the one mold 50 and the other mold 60 are opened, and the structure 101 is removed (released). As a result, a structure 101 is formed as shown in FIG. The structure 101 has a structure in which a resin 40 covering the LED chip 30 is sandwiched between the upper base material 20 and the lower base material 10.

  Subsequently, the lower base material 10 is removed (separated) from the structure 101. The adhesive member 12 that adheres the lower substrate 10 has a property of being peeled off by heating. For this reason, for example, the lower base material 10 can be easily separated by setting the temperature higher than the molding temperature of compression molding. Then, as shown in FIG. 2B, the electrodes of the LED chip 30 are reconnected so as to appropriately connect the region (the lower surface of the LED chip 30, that is, the electrode surface) formed after the lower base material 10 is removed. The wiring layer 14 is formed (rewiring process). As a result, the LED chip 30 is disposed on the rewiring layer 14. Thereby, the rewiring layer with respect to the LED chip exposed by peeling of the adhesive member 12 is formed. The rewiring layer 14 includes a wiring layer for electrically connecting the electrode of the LED chip 30 to a connection portion such as an arbitrary electrode or a terminal, and an insulating layer interposed therebetween for insulation. The insulating layer can also function as a reflecting surface. For this reason, a reflectance can also be improved by making an insulating layer white. As the rewiring layer, at least electrical connection is possible if there is only a wiring layer, and an insulating layer is not necessarily provided.

  The LED package molded body 120 (compression molded body) including a plurality of package regions is configured by the above steps. Thereby, it can be set as the structure which has arrange | positioned the upper base material 20 toward the light emission surface of the LED chip 30 in the state which pinched | interposed the resin 40. FIG. The “light emitting surface” here is a surface that emits most of the light emitted when the LED chip 30 emits light, and corresponds to the upper surface of the LED chip shown in FIG.

  2B is shown as a state in which the structure 101 of FIG. 2A is turned upside down in a rewiring process, for example. Further, as long as electrical connection between the electrode of the LED chip 30 and the wiring layer can be secured, at least a part of the adhesive member 12 may be left.

  Subsequently, as shown in FIG. 2C, the LED package molded body 120 is cut along the broken line 150 (at a predetermined position). Thereby, as indicated by an arrow in FIG. 2C, the LED package molded body 120 is separated into a plurality of optical devices 200 (LED packages). The optical device 200 can be used as, for example, a chip-type package by exposing the wiring layer on the back surface of the LED package by the rewiring layer 14, and mounted by mounting on a solder paste on a substrate for a light emitting device and reflowing. Is possible.

  Thus, in the optical device 200 of the present embodiment, the resin 40 is formed by compression molding so as to be sandwiched between the upper base material 10 (base material), so that the upper base material with the resin 40 sandwiched between the LED chips 30. A material 10 (base material) is disposed. For this reason, since the upper base material 10 is also integrated when the resin 40 for the LED chip 30 is compression-molded, the upper base material 10 capable of imparting various effects can be integrally molded without performing a separate process. The functional optical device 200 can be manufactured by a simple process. Therefore, it can be manufactured at low cost.

  In this case, for example, by using a glass substrate as the upper substrate 10, gas permeation can be prevented from being transmitted to the LED chip 30, and desired optical characteristics can be imparted. Further, by providing the translucent upper base material 10 that functions as a phosphor layer, the wavelength of light emitted from the LED chip 30 can be converted by the phosphor layer. For example, since the resin 40 does not need to contain and disperse the phosphor, the light from the LED chip 30 can be wavelength-converted through a phosphor layer having a uniform thickness to emit light with a uniform hue. In addition, the type of phosphor and the thickness of the phosphor layer can be easily adjusted, and the emission color as an optical device can be easily adjusted.

  Next, with reference to FIG. 3, the modification in a present Example is demonstrated. FIG. 3 is an explanatory diagram of a modified example of the upper substrate 20 (optical component) in the present embodiment.

  FIG. 3A is a cross-sectional view of the structure 101a provided with the upper substrate 20a. Unlike the flat upper substrate 20, the upper substrate 20 a is a glass substrate (convex lens) having a convex (hemispherical) lower surface (surface facing the LED chip 30 side of the upper substrate 20 a). Moreover, adhesiveness with the resin 40 can also be improved by using the upper base material which has a Fresnel lens-like unevenness | corrugation instead of a convex lens.

  FIG. 3B is a cross-sectional view of the structure body 101b including the upper substrate 20b. Unlike the flat upper substrate 20, the upper substrate 20 b is a glass substrate (concave lens) having a concave (hemispherical) lower surface (a surface facing the LED chip 30 side of the upper substrate 20 b). In this case, the structure 101 b is formed by the upper base material 20 b and the lower base material 10 by making the height (depth) of the concave portion disposed on the LED chip 30 sufficiently higher than the height of the LED chip 30. You may clamp so that these may touch. In this case, the structure can be protected by the upper substrate 20b without exposing the side surface of the resin 40 even in the state of the separated optical device. According to this, the light emitted from the side of the LED chip 30 can also pass through the upper substrate 20b, and the gas barrier property can be further enhanced. The upper base materials 20a and 20b can be molded even by a compression molding die using the cavity piece 52 constituting the flat cavity bottom surface as described above.

  FIG. 3C is a configuration diagram of a mold when the upper base material 20c is used. The upper base member 20c has a convex surface (semispherical surface) on its upper surface (surface adsorbed to the cavity piece 52a) and a flat surface on its lower surface (surface facing the LED chip 30). Note that the lower surface of the upper substrate 20c may also have a lens shape. In this case, a cavity piece 52a having a concave bottom surface (suction surface) is used in accordance with the shape of the convex upper base material 20c. Thus, the present embodiment can be applied to each structure as shown in FIGS. 3A to 3C, and any optical function such as light collection and diffusion by each of these upper base materials. Can be provided.

  Next, with reference to FIG. 4, the modification in a present Example is demonstrated. FIG. 4 is a manufacturing process diagram of an optical device 200d as a modification of the present embodiment, which is shown in time series in the order of FIGS. 4 (A) to 4 (E). An optical device 200d as a modification shown in FIG. 4 is different from the optical device 200 in which only one LED chip 30 is arranged in that a plurality of LED chips 30 are arranged.

  First, as shown in FIG. 4A, a plurality of LED chips 30 corresponding to one optical device 200 d are arranged on the first base material 10 via the adhesive member 12. Further, the resin 40 is formed so as to cover the plurality of LED chips 30 by the compression molding described above, and is sandwiched between the first base material 10 and the second base material 20. FIG. 4 shows a state in which three LED chips 30 (18 LED chips 30 in total) corresponding to one optical device 200d are arranged. However, the present invention is not limited to this. Absent.

  Subsequently, the first substrate 10 is separated as shown in FIG. Then, as shown in FIG. 4C, a rewiring layer 14d is formed. The rewiring layer 14 d includes a wiring layer that is electrically connected to each electrode portion of the plurality of LED chips 30, and a wiring layer that is connected to the electrodes of the LED chip 30 and exposed to the back surface of the optical device. Further, as shown in FIG. 4D, solder balls 16 as external connection terminals are formed in the wiring layer at a predetermined position of the rewiring layer 14d. Thereby, the LED package molded body 120d is obtained.

  Subsequently, as illustrated in FIG. 4E, the LED package molded body 120 d is cut along the broken line portion 150. Thereby, as shown by the arrow in FIG. 4E, the LED package molded body 120d is separated into a plurality of optical devices 200d (LED packages).

  According to the present embodiment, it is possible to provide an inexpensive, functional and high-quality optical device and an optical device manufacturing method.

  Next, with reference to FIG.5 and FIG.6, the manufacturing method of the optical device in Example 2 of this invention is demonstrated. 5 and 6 are manufacturing process diagrams of the optical device in the present embodiment, which are shown in time series in the order of FIGS. 5 (A) to (D) and FIGS. 6 (A) to (C).

  First, as shown in FIG. 5A, a plurality of LED chips 30 are arranged on the lower base material 10 (first base material) via the adhesive member 12. Subsequently, as shown in FIG. 5B, the reflecting member 25 is disposed. The reflection member 25 is made of, for example, a resin, configures the outer shape of the LED package (optical device), ensures strength, and has a reflection surface R on the inner surface thereof. Moreover, it has the function to reflect the light from the reflection member 25 and the LED chip 30 upward. Further, the reflecting member 25 also has a function as a dam part for storing a resin 40e (translucent resin) described later in the reflecting member 25. In the present embodiment, the reflecting member 25 is formed in an annular shape in which the inner side has a mortar shape on the upper surface of the lower substrate 10. However, the reflector of a present Example is not limited to this. The inner circumference of the reflector may be configured to have other shapes such as a rectangular shape, or may be sized so that a plurality of LED chips 30 can be arranged on the inner circumference of the reflector.

The reflecting member 25 of the present embodiment can be molded using, for example, a thermosetting resin such as an epoxy resin or a silicone resin. Preferably, the reflecting member 25 contains a filler. Examples of the filler include white pigment such as titanium oxide (TiO ₂ or the like), aluminum nitride (AlN), or alumina (Al ₂ O ₃ ), silica, or the like for light reflection and heat dissipation. When a white pigment such as titanium oxide is contained, the color of the reflecting member 25 is white (white resin) as a whole, and the light from the LED chip 30 is effectively reflected and the thermal conductivity is high. The heat generated by the LED chip 30 can be efficiently conducted to the outside and dissipated. However, a filler is not what was mentioned above and you may make the reflection member 25 contain another filler. Further, the color of the reflecting member 25 is not limited to white, and may have other colors. Further, the reflecting member 25 may be formed of a thermosetting resin or a thermoplastic resin other than the above-described composition, or may be formed of a non-resin material such as ceramics, metal, glass, etc. You may shape | mold as.

  Subsequently, as shown in FIG. 5C, a resin 40e (lens resin) having translucency is supplied from the dispenser of the resin 40e through the nozzle 82 so as to cover the plurality of LED chips 30. The Thereby, the structure 100e is configured. Subsequently, as shown in FIG. 5D, a metal mold comprising one mold 50e (upper mold) and the other mold 60e (lower mold) having the same configuration as in the above-described embodiment. The structure 100e is placed on the mold.

  Subsequently, as shown in FIG. 6A, compression molding is performed by closing the structure 100e using one mold 50e and the other mold 60e. Thereby, the upper base material 20 is integrated with the structure 100e to form the structure 101e.

  Subsequently, the structural body 101 is removed (released) from the one mold 50e and the other mold 60e. As a result, a structure 101e is formed as shown in FIG. The structure 101e has a structure in which a resin 40e that covers the LED chip 30 is sandwiched between the upper substrate 20 and the lower substrate 10. And the adhesive member 12 is peeled and the 1st base material 10 is isolate | separated from the structure 101e. Next, although not shown, a rewiring layer similar to that in Example 1 is formed. Finally, the LED package 120 is cut along the broken line portion 150 so as to divide the reflecting member 25 at the position of the broken line shown in FIG. Thereby, it is separated into a plurality of LED packages.

  According to the present embodiment, the reflecting member 25 can be integrated with the resin 40e covering the LED chip 30, and in addition to the effects in the above-described embodiment, the light can be emitted at an arbitrary angle. Can also be played. In addition, when using the upper base material 20 that functions as a phosphor layer, the light emitted from the LED chip 30 to the side is reflected upward by the reflecting member 25, so that it passes through the upper base material 20 as a phosphor layer. Without being injected outside. For this reason, for example, when white light is emitted using the LED chip 3 that emits blue light and the yellow phosphor layer, it is possible to prevent the blue light from leaking from the side and reliably emit white light. it can.

  Next, with reference to FIG. 7 thru | or FIG. 9, the manufacturing method of the optical device in Example 3 of this invention is demonstrated. FIGS. 7 to 9 are manufacturing process diagrams of the optical device 200f in the present embodiment, and FIGS. 7A to 7E, FIGS. 8A to 8B, and FIGS. 9A to 9D. These are shown in chronological order.

  First, as shown in FIG. 7 (A), a conductor 35 (via) such as copper together with a plurality of LED chips 30 on the lower substrate 10 (first substrate) via the adhesive member 12. ) Is provided. As will be described later, the conductor 35 constitutes an electrode portion (external connection terminal) of the optical device 200f of the present embodiment.

  Subsequently, as shown in FIG. 7B, the structure of FIG. 7A is clamped by using a mold (transfer molding mold). The mold according to the present embodiment includes one mold 500 and the other mold 600. On the other hand, cavity recesses 501 and 502 are formed in the mold 500. The cavity recess 501 is provided at a position corresponding to a region (LED chip placement region 28) where the LED chip 30 is placed. The cavity recess 502 is configured to abut on the surface (upper surface) of the conductor 35 at the bottom surface thereof when the mold is clamped. On the other hand, a recess 601 is formed in the mold 600, and the structure shown in FIG. 7A is placed in the recess 601. The other mold 600 has a pot 612. Inside the pot 612, a plunger (not shown) for pumping the resin is provided.

  On the other hand, the mold 500 is formed with a cull 511, a runner 512, and a gate 513. The runner 512 communicates with the cavity recess 502 via the gate 513. On the other hand, the mold 500 presses the lower substrate 10 from the upper surface side (one surface side) during resin molding. On the other hand, the other mold 600 presses the lower substrate 10 from the lower surface side (the other surface side) during resin molding. At the time of resin molding, the lower substrate 10 is clamped (sandwiched) between the one mold 500 and the other mold 600, and the resin 26 is filled into the cavity recess 502.

  The resin 26 is a liquid thermosetting resin supplied to the pot 612. Moreover, it may replace with liquid resin and may supply the resin tablet shape | molded in tablet (column) shape. At the time of resin molding, a liquid resin (not shown) is heated in the pot 612 of the other mold 600. Then, a heated resin 26 is pumped by moving a plunger (not shown) configured to slide up and down along the pot 612 by a transfer mechanism (not shown). As a result, as shown in FIG. 7C, the space between the one mold 500 and the other mold 600 (inside the cavity recess 502) is filled with the resin 26.

  After the resin 26 is filled, the resin 26 is waited for a predetermined time to cure the resin 26, the one mold 500 and the other mold 600 are opened, and the molded product is released. As a result, as shown in FIG. 7D, a structure as a molded product formed by resin molding by transfer molding is formed. In FIG. 7D, the exposed portion where the resin 26 is not formed is an LED chip arrangement region 28. Further, the resin 26 has a function similar to that of the reflecting member 25 in the first embodiment, and constitutes a reflecting member 25a (reflector) having a reflecting surface R on the inner surface thereof. The resin 26 also has a function of supporting the conductor 35 (external connection terminal of the optical device 200f). Subsequently, as shown in FIG. 7E, the resin 40f (translucent resin) that is a lens resin (liquid resin) is placed inside the resin 26, that is, in the LED chip arrangement region 28 (reflector (resin 26)). Supply (dispense) to the enclosed area. Thereby, the resin 40 f covers the light emitting surface (upper surface) of the LED chip 30. Specifically, as illustrated in FIG. 7E, the resin 40 f is supplied from the nozzle 84 of the dispenser toward the LED chip placement region 28. At this time, since the resin 40f is blocked by the resin 26 (reflector resin), an amount necessary for lens molding can be supplied. As shown in FIG. 7E, the supplied resin 40f fills the plurality of LED chips 30 in the LED chip arrangement region 28 and covers the light emitting surface of the LED chip 30. Thereby, the structure 100f is configured.

  Subsequently, as shown in FIGS. 8A and 8B, the structure 100f is placed on a mold, and compression molding is performed. As a result, the upper substrate 20 is integrated with the structure 100f to form the structure 101f. Subsequently, the structure 101f is formed as shown in FIG. 9A by removing the structure 101 from the one mold 50e and the other mold 60e. Similarly to Example 1, the rewiring layer 14 f is formed at the position of the peeled lower base material 10. Thereby, an LED package molded body 120f as shown in FIG. 9B is formed. In the present embodiment, since the electrical connection is made to the outside through the conductor 35 (via), the rewiring layer 14f includes the wiring layer that connects the electrodes of the LED chip 30, the electrodes of the LED chip 30, and the conductor 35. A wiring layer for connecting the two.

  Finally, as shown in FIG. 9C, the LED package molded body 120 f is cut along the broken line 150. At this time, by cutting the reflecting member 25a, the conductor 35 (via) is also cut and divided together with the resin 26. Thereby, it is separated into a plurality of optical devices 200f (LED packages). As shown in FIG. 9D, the optical device 200f is mounted on the mounting surface 170. Further, the conductor 35 of the optical device 200f is cut and exposed on the side surface to constitute an external connection terminal, and is electrically connected to a predetermined portion of the mounting surface 170 using the solder 18.

  FIG. 10 is a perspective view for explaining the arrangement of each member of the optical device 200f. In the drawing, the illustration of the upper base material 20 and the resin 40f is omitted for easy understanding of the arrangement of the LED chip 30 and the conductor 35. As shown in FIG. 10, in the optical device 200f, a plurality of LED chips 30 are two-dimensionally arranged in an LED chip arrangement region 28 surrounded by a resin 26 having a reflective surface R. In addition, conductors 35 as external connection terminals are provided at the four corners of the optical device 200f. The periphery of the conductor 35 is covered with a resin 26 (thermosetting resin). The conductor 35 is exposed on the side surface of the optical device 200f. Thus, the optical device 200f can be easily mounted on the mounting surface 170 using the solder 18 even if the upper surface of the optical device 200f is covered with the upper base material 20.

  Although the example in which four conductors 35 are provided as shown in FIG. 10 has been described, at least two conductors may be provided as the external connection terminals on the anode side and the cathode side. A plurality of conductors 35 may be provided according to the number of LED chips 30 to be connected. For example, the same number as the number of all electrodes of the LED chip 30 included in the optical device may be provided. Further, the conductor 35 may have a cylindrical shape as shown in FIG. 10 or may have another shape such as a prismatic shape. Further, a conductive material such as a lead frame may be bent and provided. The conductor 35 may not be exposed on the side surface of the optical device 200f. In this case, by removing the upper base material 20 and the resin 40f at that position, the upper surface of the conductor 35 can be exposed to be electrically connected to the outside.

  Further, the reflection member 25a having the conductor 35 may be separately prepared and used without being molded in the series of processes by transfer molding on the lower substrate 10 as described above.

  Next, with reference to FIG.11 and FIG.12, the manufacturing method of the optical device in Example 4 of this invention is demonstrated. In this example, a method for manufacturing a side-view type optical device capable of emitting light from a side surface will be described. 11 and 12 are manufacturing process diagrams of the optical device 200g in the present embodiment, which are shown in time series in the order of FIGS. 11 (A), (B), and FIGS. 12 (A) to (C).

  First, as shown in FIG. 11A, the lower substrate 10 (first substrate), the adhesive member 12, the LED chip 30, and the resin 40g (translucent resin) constitute a structure 100g. The Then, using the same mold (not shown) as in the above-described embodiment, the structure 100g including the lower base material 10 and the upper base material 20g (second base material) are clamped, and compression molding of resin 40g is performed. I do. In addition, by flattening the upper surface of the upper base material 20g, the flat cavity piece in the above-described embodiment can be sucked.

  In the present embodiment, the upper substrate 20g has a function of reflecting the light from the LED chip toward the side. This upper base material 20g can be manufactured, for example with the material similar to the above-mentioned reflective member.

  A plurality of recesses 22 are formed in the upper base material 20g. The plurality of recesses 22 are provided at positions corresponding to the LED chips 30. The concave portion 22 includes a reflection surface configured by a curved surface or a slope to reflect light to the side surface, and a wall surface corresponding to the light emission surface and standing upright.

  By clamping the lower base material 10 and the upper base material 20g using a mold similar to the above-described embodiment and compressing the resin 40g, the upper base material 20g adsorbed and held by a cavity piece (not shown) is obtained. Resin 40 g is filled so as to cover the LED chip 30 inside the recess 22. As a result, a structure 101g as shown in FIG. 11B is formed.

  Subsequently, the adhesive member 12 is peeled from the structural body 101g to separate the lower substrate 10. And the rewiring layer 14g is formed in the area | region which isolate | separated the lower base material 10. FIG. Thereby, an LED package molded body 120g as shown in FIG. 12A is formed.

  Subsequently, the LED package molded body 120g is cut into pieces into a plurality of optical devices 200g by cutting at a broken line portion 151 (interface (contact surface) between the resin 40g and the upper substrate 20g). When the LED package molded body 120g is cut, as shown by the arrow in FIG. 12B, the resin 40g is exposed on the cut surface by cutting with a predetermined width at the position of the wall surface described above. Thereby, as shown in FIG. 12C, the optical device 200g can emit light from its side surface (the right side surface in FIG. 12C) as shown by the arrow. As described above, since a large number of optical devices 200g can be formed in one cavity, the side-view type optical device 200g can be manufactured at low cost. In addition, when compared with a normal side-view type optical device, the LED chip can be electrically connected without using a wire, and the member constituting the reflection surface can be formed extremely thin, so that it is compact. Can be made thinner and thinner.

  According to each embodiment, an inexpensive, functional and high quality optical device and a method for manufacturing the optical device can be provided.

  In the above, the Example of this invention was described concretely. However, the present invention is not limited to the matters described in the above embodiments, and can be appropriately changed without departing from the technical idea of the present invention.

  For example, in each of the embodiments, the case where the translucent resin such as the resin 40 includes a fluorescent material has been described. However, the present invention is not limited to this. After the LED chip 30 is sealed with a colorless and transparent resin 40 that does not contain a phosphor, one or more phosphor layers may be formed. Alternatively, a single-layer or multilayer phosphor layer may be formed on the LED chip 30 and then sealed with a colorless and transparent resin 40. In addition, a light shielding resin or a light distribution resin can be used instead of the light transmitting resin. Further, each resin such as the resin 40 and the resin 26 may be a thermoplastic resin instead of a thermosetting resin.

  Further, as an upper base material, in order to prevent the light from the LED chip 30 from being reflected within the resin 40 and to prevent the ultraviolet light of the light from the LED chip 30 from being reflected and emitted to the outside You may integrate and use various functional sheet-like members, such as functioning as an ultraviolet reflective film provided.

  In addition, the mold used for compression molding may have a configuration in which the one mold 50 and the other mold 60 are turned upside down. That is, the compression molding mold in this case is configured to include a lower mold having the same configuration as the above-described one mold 50 and an upper mold having the same configuration as the above-described other mold 60. . As a result, the lower substrate 10 as the first substrate is fixed to the lower surface of the upper mold, and the upper substrate 20 as the second substrate is adsorbed to the upper surface of the other mold 60 via the release film. Compression molding can be performed in the held state. In this case, for example, the resin can be supplied by mounting the resin 40 on the upper base material 20 disposed on the lower mold side and carrying it in the mold.

  Further, although an example in which one upper base material 20 is attracted and held by the cavity piece 52 has been described, a plurality of upper base materials 20 having a size smaller than the size of the cavity piece 52 may be used. According to this, since the upper base material 20 can be prepared at low cost and the size can be easily increased, the optical device can be manufactured at lower cost. Furthermore, by setting the upper substrate 20 to a size corresponding to at least one optical device, the same configuration as the example in which the upper substrate 20 is cut as described above can be obtained.

  In each embodiment, the configuration for forming the redistribution layer electrically connected to the LED chip has been described. However, the present invention is not limited to this, and the redistribution layer may not be formed. In this case, the optical device manufactured as in each of the embodiments can be used like an LED chip by mounting it on a lead frame or a substrate, for example, and sealing it in a translucent resin. .

10 Lower substrate (first substrate)
12 Adhesive member 20 Upper substrate (second substrate)
25 Resin (white resin)
30 LED chip (optical element)
40 Resin (Translucent resin)
50 One mold 60 The other mold 72 Release film 100, 101 Structure 120 LED package molded body 200 Optical device

Claims (15)

An optical element;
A substrate disposed toward the light emitting surface of the optical element;
A resin that covers the optical element and is provided between the base material and the optical element;
The optical device, wherein the resin is formed by compression molding.   The optical device according to claim 1, wherein the substrate is a glass substrate.   The optical device according to claim 2, wherein the glass substrate contains a phosphor.   The optical device according to claim 1, wherein the resin is a translucent resin.   The optical device according to claim 1, further comprising a reflector that reflects light from the optical element.   The optical device according to claim 1, further comprising a conductor constituting an external connection terminal of the optical device.   The optical device according to claim 6, wherein the conductor is provided inside a reflector.   5. The optical device according to claim 1, wherein the base material includes a thermosetting resin including a reflector having a light reflection surface. Disposing an optical element on the first substrate via an adhesive member;
Producing a compression-molded body by compression molding so as to sandwich a resin for sealing the optical element between the first base material and the second base material;
Separating the first base material by separating the adhesive member from the compression molded body;
And a step of cutting the compression-molded body at a predetermined position and separating it after separating the first base material.   The step of forming a rewiring layer on the optical element exposed by peeling off the adhesive member before separating the compression molded body into pieces is further included. Manufacturing method of optical device.   The resin is compression-molded by clamping one mold holding the second base material and the other mold holding the first base material. The manufacturing method of the optical device of description.   The method of manufacturing an optical device according to claim 11, wherein the second substrate is held by the one mold through a release film.   The thermosetting resin functioning as a reflector that reflects light from the optical element is further formed on the first base material via the adhesive member. The manufacturing method of the optical device of any one of these. Further comprising providing a conductor constituting an external connection terminal of the optical device on the first base material via the adhesive member;
The method of manufacturing an optical device according to claim 13, wherein the thermosetting resin is molded so as to cover the periphery of the conductor.   The method of manufacturing an optical device according to claim 9, wherein the second base material includes a thermosetting resin including a reflector having a light reflecting surface.