JP2015125128A - Structure analyzer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To excessively extract surfaces in surface extraction based on three-dimensional position data for a structure.SOLUTION: A structure analyzer includes three-dimensional position data measurement means, three-dimensional position data generation means, and surface extraction means. The three-dimensional position data measurement means measures three-dimensional position data for each point on a structure as first position data. The three-dimensional data generation means generates three-dimensional position data, which is about the structure and has less information about positions of points per unit area on a surface of the structure than the first position data, as second position data. The surface extraction means extracts multiple constituent surfaces constituting the structure, on the basis of the second position data.

Description

  The present invention relates to a structure analyzing apparatus, a structure analyzing method, and a program for extracting surfaces constituting a structure.

  Various structure analyzers have been proposed for diagnosing structures by measuring vibration waveforms of structures such as bridges.

  For example, a vibration waveform at a measurement point set on a civil engineering building structure is measured with a non-contact type vibrometer such as a CCD camera (Charge-coupled device camera) to detect the natural frequency of the structure. It has been proposed as a first related technique related to the present invention to determine deterioration of a structure by comparing with a natural frequency (see, for example, Patent Document 1).

  In addition, the vibration waveform at the measurement point set on the structure is measured with a non-contact vibrometer such as a laser Doppler vibrometer to measure the vibration characteristics such as the natural frequency and natural vibration mode of the structure. Inspecting the soundness level is proposed as a second related technique related to the present invention (see, for example, Patent Document 2).

  In addition, earthquake recorders are installed at several locations in the building and the foundation of the building, and immediately after the earthquake, the input seismic waves obtained from the earthquake recorder at the foundation and the earthquake recorder in the building can be obtained. The transfer function of the response waveform is obtained, and this transfer function is compared with the transfer function of the building before the earthquake occurs to determine whether the building has been damaged, the degree of damage to the building, or the location of the damage. Has been proposed as a third related technique related to the present invention (see, for example, Patent Document 3).

  On the other hand, a segmentation algorithm for extracting a plurality of surfaces of a structure from three-dimensional position data of each point on the structure measured by a distance measuring device such as a laser scanner is proposed as a fourth related technique related to the present invention. (For example, refer to Patent Document 4 and Non-Patent Document 1).

Japanese Patent No. 3404302 Japanese Patent No. 4001806 JP-A-11-44615 WO2012 / 141235

Yukio Sato Junji Murase, Fast Polyhedron Approximation Using Range Images, Information Processing Society of Japan Journal, Information Processing Society of Japan, October 15, 1995, Vol. 36, No. 10, pp 2303-3309

  By the way, in a structure having a plurality of surfaces, there are cases where the vibration characteristics are different for each surface even when there is no deterioration or damage. For example, bridges are composed of a combination of various elements such as bridge piers, bridge girders, abutments, floor boards, and lighting, so the vibration characteristics differ even between the surfaces of the parts that cross between the elements even if they remain normal. Occurs. In addition, when measuring with a non-contact type vibrometer such as a CCD camera or a laser Doppler vibrometer, the planes of the same element that have different angles as viewed from the vibrometer are the amplitudes of the measured vibration waveforms. There is a natural difference.

  Therefore, when diagnosing a structure by measuring the vibration waveform of the structure, it is necessary to consider the surface of the structure. That is, it is necessary to take a measure such that diagnosis is performed for each surface of the structure, or if the location where the vibration characteristics have changed is a connection location of a plurality of surfaces, it is not determined as abnormal.

  However, in the fourth related technique related to the present invention in which the surface of the structure is mechanically extracted based on the three-dimensional position data of each point on the structure, cracks and the like generated on the surface of the structure There is a problem that an abnormal part is detected as an edge of a structure and is extracted as a plurality of surfaces although it is originally one surface.

  An object of the present invention is to provide a structure analyzing apparatus that solves the above-described problem, that is, the problem that a surface is excessively extracted in extracting a surface based on three-dimensional position data of the structure.

A structure analyzing apparatus according to a first aspect of the present invention is:
3D position data measuring means for measuring 3D position data of each point on the structure as first position data;
The three-dimensional position data of each point on the structure, which is less than the first position data, has less information about the position of the point per unit area of the surface of the structure. Three-dimensional position data generating means for generating data;
Surface extraction means for extracting a plurality of constituent surfaces constituting the structure based on the second position data.

The structure analysis method according to the second aspect of the present invention is:
A structure analysis method executed by a structure analysis apparatus,
Measure the three-dimensional position data of each point on the structure as the first position data,
The three-dimensional position data of each point on the structure, which is less than the first position data, has less information about the position of the point per unit area of the surface of the structure. As data,
Based on the second position data, a plurality of constituent surfaces constituting the structure are extracted.

The program according to the third aspect of the present invention is:
Computer
3D position data measuring means for measuring 3D position data of each point on the structure as first position data;
The three-dimensional position data of each point on the structure, which is less than the first position data, has less information about the position of the point per unit area of the surface of the structure. Three-dimensional position data generating means for generating data;
Based on the second position data, it functions as a surface extracting means for extracting a plurality of constituent surfaces constituting the structure.

  Since this invention has the structure mentioned above, it can prevent extracting a surface excessively in the extraction of the surface based on the three-dimensional position data of each point on a structure.

It is a figure which shows the structure analysis apparatus which concerns on the 1st Embodiment of this invention, and the structure used as a surface extraction object. 1 is a block diagram of a structure analyzing apparatus according to a first embodiment of the present invention. It is a figure which shows the structural example of the 1st three-dimensional position data in the structure analysis apparatus which concerns on the 1st Embodiment of this invention. It is a figure which shows the structural example of the 2nd three-dimensional position data in the structure analysis apparatus which concerns on the 1st Embodiment of this invention. It is a figure which shows the structural example of the structural surface data in the structure analysis apparatus which concerns on the 1st Embodiment of this invention. It is a figure which shows an example of the three-dimensional position data generation process of the structure analysis apparatus which concerns on the 1st Embodiment of this invention. It is a figure which shows the other example of the three-dimensional position data generation process of the structure analysis apparatus which concerns on the 1st Embodiment of this invention. It is a flowchart which shows operation | movement of the structure analysis apparatus which concerns on the 1st Embodiment of this invention. It is a schematic diagram explaining the effect of the structure analysis apparatus which concerns on the 1st Embodiment of this invention. It is a block diagram of the structure analysis apparatus which concerns on the 2nd Embodiment of this invention. It is a figure which shows the structural example of the 2nd surface data in the structure analysis apparatus which concerns on the 2nd Embodiment of this invention. It is a figure which shows the structural example of the structural surface data in the structure analysis apparatus which concerns on the 2nd Embodiment of this invention. It is a flowchart which shows the analysis of the structure analysis apparatus which concerns on the 2nd Embodiment of this invention. It is a block diagram of the structure analysis apparatus which concerns on the 3rd Embodiment of this invention. It is a figure which shows the structural example of the vibration measurement data of the structure analysis apparatus which concerns on the 3rd Embodiment of this invention. It is a flowchart which shows an example of the operation | movement which measures and measures the vibration waveform of a structure in the structure analysis apparatus which concerns on the 3rd Embodiment of this invention. It is a schematic diagram in which the structure analysis apparatus which concerns on the 3rd Embodiment of this invention pays attention to one structural surface of a structure, and measures a vibration waveform. It is a block diagram of the structure analysis apparatus which concerns on the 4th Embodiment of this invention. It is a flowchart which shows the analysis of the structure analysis apparatus which concerns on the 4th Embodiment of this invention.

Next, embodiments of the present invention will be described in detail with reference to the drawings.
[First embodiment]
Referring to FIG. 1, the structure analyzing apparatus 100 according to the first embodiment of the present invention measures the three-dimensional position of each point on the structure 110 from a remote place, and configures the structure 110 from the measurement result. It has a function to extract the surface to be mechanically extracted.

  The structure 110 is a civil engineering building such as a bridge. Alternatively, the structure 110 may be a structure other than a civil engineering building such as an industrial product such as an automobile or a train. Hereinafter, for convenience of explanation, it is assumed that the structure 110 has two surfaces 110 </ b> A and 110 </ b> B as surfaces that can be observed from the structure analyzing apparatus 100. Further, it is assumed that a crack 110C having a width L is generated on the surface 110A in the vertical direction of the paper surface.

  The structure analyzing apparatus 100 first measures the three-dimensional position data of each point of the structure 110 when extracting the surfaces constituting the structure 110. Next, the structure analyzing apparatus 100 obtains a second three-dimensional data set that is a data set obtained by thinning out some information from the first three-dimensional position data that is a set of three-dimensional position data of each point of the measured structure 110. Convert to position data. The set of three-dimensional position data is typically a point cloud as an example, but is not limited to this form. And the structure analysis apparatus 100 extracts the some structural surface which comprises the structure 110 based on 2nd three-dimensional position data.

  Referring to FIG. 2, the structure analyzing apparatus 100 includes a three-dimensional position detection sensor 101, a communication interface unit (hereinafter referred to as a communication I / F unit) 102, an operation input unit 103, a screen display unit 104, a storage unit 105, And an arithmetic processing unit 106.

  The three-dimensional position detection sensor 101 has a function of measuring the three-dimensional position of each point on the structure 110 from a remote place. The three-dimensional position detection sensor 101 may be a ToF (Time of Flight) distance measuring device such as a three-dimensional distance image sensor, a millimeter wave radar, or a range finder, or may be a distance measuring sensor based on a triangulation method. .

  The communication I / F unit 102 includes a dedicated data communication circuit and has a function of performing data communication with various devices connected via a communication line.

  The operation input unit 103 includes an operation input device such as a keyboard and a mouse, and has a function of detecting an operator operation and outputting the operation to the arithmetic processing unit 106.

  The screen display unit 104 includes a screen display device such as an LCD (Liquid Crystal Display) or a PDP (Plasma Display Panel), and various information such as data on the configuration surface of the structure 110 according to an instruction from the arithmetic processing unit 106. Is displayed on the screen.

  The storage unit 105 includes a storage device such as a hard disk or a memory, and has a function of storing processing information and programs 105P necessary for various processes in the arithmetic processing unit 106. The program 105P is a program that realizes various processing units by being read and executed by the arithmetic processing unit 106, and an external device (not shown) or the like via a data input / output function such as the communication I / F unit 102. It is read in advance from a storage medium (not shown) and stored in the storage unit 105. Main processing information stored in the storage unit 105 includes first three-dimensional position data 105A, second three-dimensional position data 105B, and configuration surface data 105C.

The first three-dimensional position data 105 </ b> A is three-dimensional position data of each point of the structure 110 measured by the three-dimensional position detection sensor 101. FIG. 3 shows a configuration example of the first three-dimensional position data 105A. The first three-dimensional position data 105 </ b> A has a point ID that is identification information and position information for each point of the structure 110 measured by the three-dimensional position detection sensor 101. For example, the first line in FIG. 3 indicates that the position information of the point with ID = P1 is X _P1, Y _P1, Z _P1 . In this specific example, the position information uses coordinate values of the XYZ coordinate system set in the space where the structure 110 exists. Although the orientation of the XYZ coordinate system is arbitrary, in the present embodiment, the Z axis is set in parallel to the line connecting the center of the three-dimensional position detection sensor 101 and the structure 110.

In the present embodiment, the second three-dimensional position data 105B is data generated from the first three-dimensional position data 105A. Specifically, the second three-dimensional position data 105B is generated by reducing information about the positions of some points from the first three-dimensional position data 105A. For example, the following two methods are listed as examples of methods for reducing the information on the positions of some points from the first three-dimensional position data 105A, but the methods are not limited to the following.
1) A method of leaving one piece of data and deleting the remaining data from data within a certain range of coordinates of two dimensions among the three dimensions.
2) The coordinate value of the remaining one dimension other than the two dimensions of each data in the range where the coordinates of the two dimensions among the three dimensions are the average value of the dimensions of the plurality of data in the range, A method of unifying into one value such as the minimum value.
The second three-dimensional position data 105B generated by the method exemplified above has, for example, the following characteristics. That is, the information about the position of the point per unit area on the plane perpendicular to the line connecting the centers of the three-dimensional position detection sensor 101 and the structure 110 is the second three-dimensional than the first three-dimensional position data 105A. The feature is that the position data 105B is less. FIG. 4 is a configuration example of the second three-dimensional position data 105B. The second three-dimensional position data 105B has, for each point of the structure 110, a point ID that is identification information and position information based on the same XYZ coordinate system as the first three-dimensional position data 105A. . For example, the first line in FIG. 4 indicates that the position information of the point with ID = Q1 is X _Q1, Y _{Q1, and} Z _Q1 .

The construction plane data 105C is data relating to the construction plane constituting the structure 110 extracted based on the second three-dimensional position data 105B. FIG. 5 shows a configuration example of the configuration plane data 105C. The configuration surface data 105C includes a configuration surface ID that is identification information and position information that specifies the configuration surface for each extracted configuration surface. The position information may be, for example, a set of second three-dimensional position data belonging to the constituent plane, or may be a mathematical expression that defines the constituent plane. Or when a constituent surface is a plane, it may be expressed by position information of each vertex of the plane. For example, in the first row of FIG. 5, the constituent surface of ID = R1 is a point (X _Q1, Y _Q1, Z _Q1 ), a point (X _Q11, Y _Q11, Z _Q11 ), a point (X _Q31, Y _Q31, Z _Q31 ) and a point (X _Q51, Y _Q51, Z _Q51 ) as a vertex. Further, the second line of FIG. 5, constituent surface of the ID = R2 is the point _{(X Q12, Y Q12, Z} Q12), the point _{(X Q19, Y Q19, Z} Q19), the point (X _Q52, Y _Q52, Z _Q52 ) and a point (X _Q59, Y _Q59, Z _Q59 ) as a vertex. The constituent surface with ID = R1 corresponds to the surface 110A of the structure 110, and the constituent surface with ID = R2 corresponds to the surface 110B of the structure 110.

  The arithmetic processing unit 106 has a microprocessor such as an MPU and its peripheral circuits, and reads and executes the program 105P from the storage unit 105, thereby realizing various processing units by cooperating the hardware and the program 105P. It has a function to do. As main processing units realized by the arithmetic processing unit 106, there are a three-dimensional position data measurement unit 106A, a three-dimensional position data generation unit 106B, and a surface extraction unit 106C.

  The three-dimensional position data measurement unit 106 </ b> A has a function of measuring the three-dimensional position data of each point of the structure 110 using the three-dimensional position detection sensor 101. The number of points per unit area measured by the three-dimensional position data measuring unit 106A is defined by the performance of the three-dimensional position detection sensor 101 used. Here, the three-dimensional position detection sensor 101 is sufficiently more than a crack having a width L generated in a plane perpendicular to a line connecting the centers of the three-dimensional position detection sensor 101 and the structure 110 (a plane on the structure 110). It is assumed that the position information of each point on the structure 110 can be measured at a short interval.

  When the three-dimensional position data measurement unit 106A completes the measurement of the three-dimensional position data of each point of the structure 110, the three-dimensional position data measurement unit 106A adds a point ID to the measurement value for each measurement point and stores it as the first three-dimensional position data 105A. Stored in the unit 105.

  The 3D position data generation unit 106 </ b> B has a function of reading the first 3D position data 105 </ b> A from the storage unit 105, performing information reduction processing, calculating the second 3D position data 105 </ b> B, and storing it in the storage unit 105. Have. The information reduction process performed by the three-dimensional position data generation unit 106B is a process of converting the three-dimensional position data into three-dimensional position data with a smaller amount of information, and an arbitrary process can be considered. The information reduction process is exemplified below, but the present invention is not limited to the following process.

<Example 1>
The position information of each point in the first three-dimensional position data 105A is replaced with the average value of the position information of that point and the surrounding n−1 points. For example, when n = 9, as shown in FIG. 6, the X coordinate value, the Y coordinate value, and the Z coordinate value of the point P5 are changed to the average value of the X coordinate values of the points P1 to P9, the average value of the Y coordinate values, Replace with the average of the Z coordinate values. At this time, as n is set to a larger value, information regarding the position of the point is further reduced. In the case of an XYZ coordinate system having a Z axis parallel to a line connecting the center of the three-dimensional position detection sensor 101 and the structure 110, the X coordinate value and the Y coordinate value of each point are the original values, and the Z coordinate value It is possible to perform an approximate calculation by replacing only the average value of the Z coordinate values of the point and the surrounding n-1 points, and in this case, information regarding the position of the Z coordinate of the point is reduced.

<Example 2>
Point position information is thinned out from the first three-dimensional position data 105A at regular intervals. For example, the position information of other points is deleted except for one point among n points whose X coordinate values are adjacent to each other. Similarly, the position information of other points is deleted except for one point among n points whose Y coordinate values are adjacent to each other. When n = 5, the first three-dimensional position data 105A shown on the left side of FIG. 7 is converted into the second three-dimensional position data 105B shown on the right side of FIG.

<Example 3>
After the processing of Example 1 is performed, the processing of Example 2 is performed.

  The surface extraction unit 106C reads the second three-dimensional position data 105B from the storage unit 105, and extracts a plurality of constituent surfaces constituting the structure 110 from the second three-dimensional position data 105B using a segmentation algorithm. Have A segmentation algorithm for extracting the surface of the structure 110 from the three-dimensional position data of the structure 110 is known as described in Patent Document 4 and Non-Patent Document 1, for example. Upon completion of the surface extraction process, the surface extraction unit 106C stores information regarding the extracted surface in the storage unit 105 as the component surface data 105C. The surface extraction unit 106 </ b> C may read the configuration surface data 105 </ b> C from the storage unit 105, display it on the screen display unit 104, and transmit it to an external device through the communication I / F unit 102.

  FIG. 8 is a flowchart showing the operation of the structure analyzing apparatus 100 according to this embodiment. Hereinafter, the operation of the structure analyzing apparatus 100 will be described with reference to FIG.

  First, the three-dimensional position data measuring unit 106A of the structure analyzing apparatus 100 measures the three-dimensional position data of each point of the structure 110 using the three-dimensional position detection sensor 101, and the measurement result is shown in FIG. The first three-dimensional position data 105A is stored in the storage unit 105 (step S101).

  Next, the three-dimensional position data generation unit 106B reads out the first three-dimensional position data 105A from the storage unit 105 and performs information reduction processing to generate second three-dimensional position data 105B as shown in FIG. And stored in the storage unit 105 (step S102).

  Finally, the surface extraction unit 106C reads the second three-dimensional position data 105B from the storage unit 105, and extracts a plurality of constituent surfaces constituting the structure 110 from the second three-dimensional position data by a predetermined segmentation algorithm. The extraction result is stored in the storage unit 105 as configuration surface data 105C as shown in FIG. 5 (step S103).

  As described above, according to the present embodiment, it is possible to prevent the surface from being excessively extracted in the surface extraction based on the three-dimensional position data of each point of the structure 110. The reason is that the three-dimensional position data generation unit 106B uses the measured three-dimensional position data 105A of each point of the structure 110 as the second three less information on the position of the point per unit area of the surface of the structure. This is because it is converted into the dimensional position data 105B, and the surface extraction unit 106C extracts a plurality of constituent surfaces constituting the structure 110 based on the second three-dimensional position data 105B.

  FIG. 9 is a schematic diagram for explaining the effect of the present embodiment. FIG. 9A is an image of the surfaces 110A and 110B of the structure 110 identified by the first three-dimensional position data 105A. Since the density of the points to be measured is high, the crack 110C generated on the surface 110A is clearly shown. Have been identified. On the other hand, FIG. 9B is an image of the surfaces 110A and 110B identified by the second three-dimensional position data 105B, and information regarding the position of the point per unit area is reduced from the first three-dimensional position data 105A. Therefore, the crack 110C cannot be identified. Therefore, the surface extraction unit 106C that extracts the surface of the structure 110 based on the second three-dimensional position data 105B does not extract the surface excessively.

[Second Embodiment]
Referring to FIG. 10, a structure analyzing apparatus 200 according to the second embodiment of the present invention includes a three-dimensional position detection sensor 201, a communication I / F unit 202, an operation input unit 203, a screen display unit 204, and a storage unit 205. And an arithmetic processing unit 206. Among these, the three-dimensional position detection sensor 201, the communication I / F unit 202, the operation input unit 203, and the screen display unit 204 are included in the structure analysis apparatus 100 according to the first embodiment of the present invention illustrated in FIG. The three-dimensional position detection sensor 101, the communication I / F unit 102, the operation input unit 103, and the screen display unit 104 have the same functions.

  The storage unit 205 includes a storage device such as a hard disk or a memory, and has a function of storing processing information and programs 205P necessary for various processes in the arithmetic processing unit 206. The program 205P is a program that realizes various processing units by being read and executed by the arithmetic processing unit 206, and an external device (not shown) or the like via a data input / output function such as the communication I / F unit 202. It is read in advance from a storage medium (not shown) and stored in the storage unit 205. As main processing information stored in the storage unit 205, there are first three-dimensional position data 205A, second three-dimensional position data 205B, component surface data 205C, first surface data 205D, and second surface data 205E. is there. Among these, the first three-dimensional position data 205A and the second three-dimensional position data 205B are the first three-dimensional position in the structure analyzing apparatus 100 according to the first embodiment of the present invention shown in FIG. It is the same as the data 105A and the second three-dimensional position data 105B.

  The first surface data 205D is data relating to the surface constituting the structure 110 extracted based on the second three-dimensional position data 205B. The first surface data 205D is the same as the configuration surface data 105C in the structure analyzing apparatus 100 according to the first embodiment of the present invention shown in FIG. That is, the configuration example of the first surface data 205D is the same as the configuration surface data 105C illustrated in FIG.

The second surface data 205E is data relating to the surfaces constituting the structure 110 extracted based on the first three-dimensional position data 205A. FIG. 11 shows a configuration example of the second surface data 205E. The second surface data 205E has, for each extracted surface, a component surface ID that is identification information and position information that identifies the component surface. The position information may be, for example, a set of first three-dimensional position data belonging to the constituent plane, or a mathematical expression defining the constituent plane. Or when a constituent surface is a plane, it may be expressed by position information of each vertex of the plane. For example, in the first row of FIG. 11, the constituent surface of ID = S1 is a point (X _P1, Y _P1, Z _P1 ), a point (X _P5, Y _P5, Z _P5 ), a point (X _P31, Y _P31, Z _P31 ) and a point (X _P41, Y _P41, Z _P41 ) as a vertex. In the second line of FIG. 5, the constituent surface of ID = S2 is a point (X _P6, Y _P6, Z _P6 ), a point (X _P7, Y _P7, Z _P7 ), a point (X _P36, Y _P36, Z _P36 ) and a plane having a point (X _P37, Y _P37, Z _P37 ) as a vertex. The third line in FIG. 5 shows that the constituent surface of ID = S3 is a point (X _P8, Y _P8, Z _P8 ), a point (X _P11, Y _P11, Z _P11 ), a point (X _P37, Y _P37, Z _P37 ) and a point (X _P51, Y _P51, Z _P51 ) as a vertex. Further, the fourth line of FIG. 5 shows that the constituent surface of ID = S4 is a point (X _P12, Y _P12, Z _P12 ), a point (X _P19, Y _P19, Z _P19 ), a point (X _P52, Y _P52, Z _P52 ) and a point (X _P59, Y _P59, Z _P59 ) as a vertex. Note that the constituent surface of ID = S2 corresponds to the crack 110C of the structure 110, the constituent surface of ID = S1 corresponds to the left surface 110B of the crack 110C, and the constituent surface of ID = S3 corresponds to the crack 110C. Corresponding to the right surface 110B, the component surface with ID = S4 corresponds to the surface 110B.

The component surface data 205C integrates a plurality of surfaces corresponding to the same one surface identified by the first surface data 205D into one component surface among the plurality of surfaces identified by the second surface data 205E. It is data. FIG. 12 shows a configuration example of the configuration plane data 205C. The configuration surface data 205C includes a configuration surface ID that is identification information and position information for each configuration surface. For example, in the first row of FIG. 12, the constituent surface of ID = T1 is a point (X _P1, Y _P1, Z _P1 ), a point (X _P11, Y _P11, Z _P11 ), a point (X _P31, Y _P31, Z _P31 ) and a point (X _P51, Y _P51, Z _P51 ) as a vertex. The second line in FIG. 5 shows that the constituent surface of ID = T2 is a point (X _P12, Y _P12, Z _P12 ), a point (X _P19, Y _P19, Z _P19 ), a point (X _P52, Y _P52, Z _P52 ) and a point (X _P59, Y _P59, Z _P59 ) as a vertex. The configuration surface of ID = T1 is obtained by integrating the three surfaces of ID = S1, S2, and S3 in FIG. 11 into one, and the configuration surface of ID = T2 is the surface of ID = S4 in FIG. It corresponds to.

  The arithmetic processing unit 206 includes a microprocessor such as an MPU and its peripheral circuits, and reads and executes the program 205P from the storage unit 205, thereby realizing various processing units by cooperating the hardware and the program 205P. It has a function to do. As main processing units realized by the arithmetic processing unit 206, there are a three-dimensional position data measuring unit 206A, a three-dimensional position data generating unit 206B, and a surface extracting unit 206C. Among these, the three-dimensional position data measuring unit 206A and the three-dimensional position data generating unit 206B are the three-dimensional position data measuring unit 106A of the structure analyzing apparatus 100 according to the first embodiment of the present invention shown in FIG. It has the same function as the three-dimensional position data generation unit 106B.

  The surface extraction unit 206 </ b> C has a function of extracting constituent surfaces constituting the structure 110. The surface extraction unit 206C includes a first surface extraction unit 2061, a second surface extraction unit 2062, and a surface integration unit 2063.

  The first surface extraction unit 2061 reads the second three-dimensional position data 205B from the storage unit 205, and extracts a plurality of surfaces constituting the structure 110 from the second three-dimensional position data 205B using a segmentation algorithm. The extraction result is stored in the storage unit 205 as the first surface data 205D. The second surface extraction unit 2062 reads the first three-dimensional position data 205A from the storage unit 205, and uses a segmentation algorithm to extract a plurality of surfaces constituting the structure 110 from the first three-dimensional position data 205A. It has a function of extracting and saving the extraction result in the storage unit 205 as the second surface data 205E. A segmentation algorithm for extracting the surface of the structure 110 from the three-dimensional position data of the structure 110 is known as described in Patent Document 4 and Non-Patent Document 1, for example.

  The surface integration unit 2063 reads the first surface data 205D and the second surface data 205E from the storage unit 205, and the first surface among the plurality of second surfaces identified by the second surface data 205E. It has a function of integrating a plurality of surfaces fitting to the same first surface identified by the data 205D into one surface. For example, for each second surface, the first surface having the smallest inter-surface distance is detected, and the detected first surface is determined as the surface to be fitted by the second surface. Then, a plurality of second surfaces fitting to the same first surface are integrated into one surface. A method of integrating a plurality of surfaces into one surface is arbitrary. For example, one plane or a curved surface having a curvature equal to or smaller than a threshold may be calculated so that the distance from a plurality of surfaces integrated with each other is the minimum. When the surface integration process is completed, the surface integration unit 2063 stores the generated information regarding the configuration surface in the storage unit 205 as configuration surface data 205C. Further, the surface integration unit 2063 may read the configuration surface data 205C from the storage unit 205, display the configuration surface data 205C on the screen display unit 204, and transmit the configuration surface data 205C to an external apparatus through the communication I / F unit 202.

  FIG. 13 is a flowchart showing the operation of the structure analyzing apparatus 200 according to this embodiment. Hereinafter, the operation of the structure analyzing apparatus 200 will be described with reference to FIG.

  First, the three-dimensional position data measuring unit 206A of the structure analyzing apparatus 200 measures the three-dimensional position data of each point of the structure 110 using the three-dimensional position detection sensor 201, and the measurement result is shown in FIG. The first three-dimensional position data 205A similar to the first three-dimensional position data 105A is stored in the storage unit 205 (step S201).

  Next, the three-dimensional position data generation unit 206B reads the first three-dimensional position data 205A from the storage unit 205 and performs information reduction processing, for example, to obtain a second similar to the second three-dimensional position data 105B of FIG. Is generated and stored in the storage unit 205 (step S202).

  Next, the first surface extraction unit 2061 of the surface extraction unit 206C reads the second three-dimensional position data 205B from the storage unit 205, and configures the structure 110 from the second three-dimensional position data by a predetermined segmentation algorithm. A plurality of first surfaces to be extracted are extracted, and for example, an extraction result similar to the component surface data 105C of FIG. 5 is stored in the storage unit 205 as the first surface data 205D (step S203).

  Next, the second surface extraction unit 2062 of the surface extraction unit 206C reads the first three-dimensional position data 205A from the storage unit 205, and configures the structure 110 from the first three-dimensional position data by a predetermined segmentation algorithm. A plurality of second surfaces to be extracted are extracted, and the extraction result is stored in the storage unit 205 as second surface data 205E as shown in FIG. 11, for example (step S204).

  Finally, the surface integration unit 2063 of the surface extraction unit 206C reads the first surface data 205D and the second surface data 205E from the storage unit 205, and sets a plurality of second surfaces to be fitted to the same first surface as 1 For example, the integration result is stored in the storage unit 205 as component plane data 205C as shown in FIG. 12 (step S205).

  As described above, according to the present embodiment, it is possible to prevent the surface from being excessively extracted in the surface extraction based on the three-dimensional position data of the structure 110. The reason is that the three-dimensional position data generation unit 206B uses the first three-dimensional position data 205A of the measured structure 110 as the second three less information on the position of the points per unit area of the surface of the structure. The surface extraction unit 206C extracts a plurality of first surfaces constituting the structure 110 on the basis of the second three-dimensional position data 205B and converts the first position data 205B on the basis of the first three-dimensional position data 205A. This is because the plurality of second surfaces constituting the structure 110 are extracted, and the plurality of second surfaces fitting to the same first surface are integrated into one surface.

  In addition, according to the present embodiment, the spatial resolution of the extracted component surface data 205C can be increased as compared with the first embodiment of the present invention. The reason is that the surface extraction unit 206C extracts a plurality of first surfaces constituting the structure 110 based on the second three-dimensional position data 205B, and the structure based on the first three-dimensional position data 205A. This is because a plurality of second surfaces constituting 110 are extracted, and a plurality of second surfaces fitting to the same first surface are integrated into one surface.

[Third Embodiment]
Referring to FIG. 14, the structure analysis apparatus 300 according to the third embodiment of the present invention measures the three-dimensional position of each point on the structure 110 from a remote place, and configures the structure 110 from the measurement result. A function of mechanically extracting the surface to be performed, and a function of performing vibration analysis of the structure 110 in consideration of the extracted component surface. The structure analyzing apparatus 300 includes a three-dimensional position detection sensor 301, a communication I / F unit 302, an operation input unit 303, a screen display unit 304, a storage unit 305, an arithmetic processing unit 306, and a vibrometer 307. Among these, the three-dimensional position detection sensor 301, the communication I / F unit 302, the operation input unit 303, and the screen display unit 304 are included in the structure analysis apparatus 200 according to the second embodiment of the present invention illustrated in FIG. The three-dimensional position detection sensor 201, the communication I / F unit 202, the operation input unit 203, and the screen display unit 204 have the same functions.

  The vibrometer 307 has a function of measuring vibration waveforms at a plurality of measurement points set on the structure 110. The vibrometer 307 may be a contact vibrometer or a non-contact vibrometer. The contact-type vibrometer may use a piezoelectric element. The vibration-type vibration meter may use an acceleration sensor or a speed sensor such as a moving coil type or a servo type. On the other hand, the non-contact type vibrometer may be a camera imaging system such as a CCD camera or a laser Doppler vibrometer. Further, in the camera imaging method, when a decrease in resolution becomes a problem in long-distance observation, a high resolution method such as a sampling moire method may be used in combination.

  The storage unit 305 includes a storage device such as a hard disk or a memory, and has a function of storing processing information and programs 305P necessary for various processes in the arithmetic processing unit 306. The program 305P is a program that realizes various processing units by being read and executed by the arithmetic processing unit 306, and an external device (not shown) or the like via a data input / output function such as the communication I / F unit 302. It is read in advance from a storage medium (not shown) and stored in the storage unit 305. As main processing information stored in the storage unit 305, first three-dimensional position data 305A, second three-dimensional position data 305B, configuration surface data 305C, first surface data 305D, second surface data 305E, There is vibration measurement data 305F. Among these, the first three-dimensional position data 305A, the second three-dimensional position data 305B, the component surface data 305C, the first surface data 305D, and the second surface data 305E are the first and second surface data 305E shown in FIG. Same as the first three-dimensional position data 205A, the second three-dimensional position data 205B, the configuration surface data 205C, the first surface data 205D, and the second surface data 205E in the structure analyzing apparatus 200 according to the second embodiment. It is.

The vibration measurement data 305 </ b> F is vibration waveform measurement data at each point of the structure 110 measured by the vibration meter 307. FIG. 15 shows a configuration example of the vibration measurement data 305F. In the vibration measurement data 305F, a point ID that is identification information and a measurement value V that is a measurement result are stored for each measurement point. For example, the first line in FIG. 15 indicates that the measured value at the point of ID = P1 is V ₁ . Here, the measured value V is, for example, a time history waveform in which a vibration waveform is recorded together with time information.

  The arithmetic processing unit 306 has a microprocessor such as an MPU and its peripheral circuits, and reads and executes the program 305P from the storage unit 305, thereby realizing various processing units by cooperating the hardware and the program 305P. It has a function to do. As main processing units realized by the arithmetic processing unit 306, there are a three-dimensional position data measurement unit 306A, a three-dimensional position data generation unit 306B, a surface extraction unit 306C, a vibration measurement unit 306D, and a diagnosis unit 306E. Among these, the three-dimensional position data measuring unit 306A, the three-dimensional position data generating unit 306B, and the surface extracting unit 306C are the three-dimensional position of the structure analyzing apparatus 200 according to the second embodiment of the present invention shown in FIG. The data measurement unit 206A, the three-dimensional position data generation unit 206B, and the surface extraction unit 206C have the same functions.

  The vibration measurement unit 306 </ b> D has a function of measuring the vibration waveform at each point on the structure 110 using the vibration meter 307. The position information recorded in the first three-dimensional position data 305A is used as the position information of the measurement point on the structure 110 that is measured by the vibration measurement unit 306D using the vibration meter 307. However, position information different from the first three-dimensional position data 305A may be used. When a non-contact type vibrometer such as a CCD camera or a laser Doppler vibrometer is used as the vibrometer 301, the vibration measuring unit 306A uses a non-contact vibrometer to measure the measurement points according to the position information in the three-dimensional position data 305A. Optically collimate and electrically extract vibration waveform data at the measurement point. The distance between the measurement points on the structure 110 determines the minimum size of the abnormal region that can be detected. The shorter the distance between the measurement points and the higher the measurement points are set, the smaller the abnormal area can be detected. Therefore, it is desirable that the distance between the measurement points is sufficiently shorter than the minimum size of the abnormal region to be detected.

  It is desirable that the vibration measurement unit 306D simultaneously measures vibration waveforms at a plurality of measurement points using the vibration meter 307. However, it is not always necessary to measure simultaneously. The vibration waveform measured by the vibration measuring unit 306D using the vibrometer 307 may be a vibration waveform of the structure 110 when artificial vibration such as vehicle running or impact vibration is applied, or such an artificial waveform. It may be a vibration waveform of the structure 110 that is always generated in a state where there is no typical vibration. Further, the direction of vibration measured by the vibration measuring unit 306D using the vibrometer 307 is arbitrary as long as the measurement points are close to each other. For example, when the vibration waveform of the structure 110 is measured using a contact-type vibrometer, the vibration waveforms of three components (east-west direction, north-south direction, top-and-bottom direction, etc.) orthogonal to each other may be measured. Alternatively, when a non-contact type vibrometer such as a CCD camera is used, a vibration waveform in a direction orthogonal to a line connecting the vibrometer and the measurement point is measured. In the measurement by the laser Doppler vibrometer, the vibration waveform in the direction parallel to the line connecting the vibrometer and the measurement point is measured. Of course, it is also possible to measure a plurality of vibration waveforms of different directions by installing a plurality of non-contact type vibrometers at different locations and simultaneously measuring the vibration waveforms at the same measurement point. The sampling frequency for vibration measurement is desirably at least twice the vibration frequency generated in the structure 110. In addition, it is desirable that the vibration measurement time length is such that a steady spectrum can be obtained when frequency spectrum analysis is performed based on the measured vibration waveform.

  When the vibration measurement unit 306D completes the measurement of the vibration waveform, the measurement point ID is added to the measurement value for each measurement point, and the vibration measurement data 305F is stored in the storage unit 305.

  The diagnosis unit 306E has a function of reading the first three-dimensional position data 305A, the configuration surface data 305C, and the vibration measurement data 305F from the storage unit 305, and diagnosing the structure 110 based on these data. Here, the diagnosis is to determine the appropriateness of the structure or the presence or absence of defects based on the vibration measurement data. As long as the diagnosis is made, a diagnosis result is generated and saved or output. In other words, if information indicating the appropriateness of the structure or the presence or absence of defects is stored or output, it means that the structure has been diagnosed.

  In the present embodiment, the diagnosis unit 306E includes a determination unit 3061 and a region output unit 3062. The determination unit 3061 has a function of determining whether or not the structure 110 has a defect. The region output unit 3062 has a function of outputting the region of the structure 110 that is determined to be defective by the determination unit 3061 to the screen display unit 304 and / or outputting it to an external device through the communication I / F unit 302.

  Next, the operation of the structure analyzing apparatus 300 according to this embodiment will be described. The operation of the structure analyzing apparatus 300 is broadly classified into an operation for extracting a constituent surface of the structure 110 and an operation for diagnosing the structure by measuring a vibration waveform of the structure. The former component surface extraction operation is the same as the operation of the structure analyzing apparatus 200 according to the second embodiment of the present invention shown in FIG. Below, the operation | movement which measures and diagnoses the vibration waveform of a structure is demonstrated in detail.

  FIG. 16 is a flowchart showing an example of an operation for performing diagnosis by measuring a vibration waveform of a structure. First, the vibration measurement unit 306D of the structure analyzing apparatus 300 reads the configuration surface data 305E from the storage unit 305, and pays attention to one of the configuration surfaces described therein (step S301). Next, the vibration measurement unit 306 </ b> D reads position information of each point on the component surface under attention from the first three-dimensional position data 305 </ b> A, and uses the vibration meter 307 to determine the vibration waveform of the structure 110 at these points. The measurement result is stored in the storage unit 305 as vibration measurement data 305F (step S301). For example, as shown in FIG. 17, paying attention to the configuration surface 110A of the structure 110, the vibration waveform of each measurement point 111 on the configuration surface 110A is measured, and the measurement result is stored.

  Next, the determination unit 3061 of the diagnosis unit 306 reads the vibration measurement data 305F from the storage unit 305, and calculates a predetermined feature amount from the measured value of the measured vibration waveform for each measurement point (step S303). The type of feature amount is arbitrary. For example, the maximum amplitude and phase of the vibration waveform, the frequency spectrum of the vibration waveform, the natural frequency, and the like may be used as the feature amount. Next, the determination unit 3061 divides the constituent surface under attention into partial regions that satisfy the uniformity of the feature amount based on the position information of the respective points on the constituent surface under attention and the feature amount (step). S304). That is, the region of the constituent surface under attention is divided into partial regions including measurement points where feature quantities satisfying a predetermined condition among the feature quantities of the vibration waveform are calculated.

  Next, the determination unit 3061 smoothes the feature amount of each measurement point on the partial area for each partial area (step S305). In the smoothing of the feature amount, the average is calculated for each feature amount of the same type. For example, for the smoothed maximum amplitude, an average value of the maximum amplitudes of all measurement points belonging to the same partial region is calculated. The smoothed frequency spectrum calculates the average of the frequency spectra of all measurement points belonging to the same partial region.

  Next, the determination unit 3061 diagnoses the structure 110 based on the smoothed vibration feature amount (step S306). Specifically, the determination unit 3061 diagnoses a structure based on the degree of correlation between the smoothed vibration waveform feature amounts between the partial areas adjacent to each other. For example, the determination unit 3061 diagnoses whether there is an abnormality in the partial region by comparing the degree of correlation with a predetermined threshold. The determination unit 3061 diagnoses the structure based on whether or not a specific frequency component is included in the frequency spectrum of the vibration waveform.

  When the diagnosis of the structure 110 relating to the constituent surface being noticed has been completed, and there is a constituent surface that has not been noticed yet in the structure 110, attention is transferred to one of the constituent surfaces (step S307). Returning to the process, the same process as described above is repeated. When the processing for all the component surfaces described in the component surface data 305C is completed (YES in step S308), the region output unit 3062 of the diagnosis unit 306E determines the structure 110 that is determined to be defective in step S306. The area is output to the screen display unit 304 or / and output to the external device through the communication I / F unit 302 (step S309).

  As described above, according to this embodiment, the same effects as those of the second embodiment of the present invention can be obtained, and diagnosis can be performed by measuring the vibration waveform for each structural surface of the mechanically extracted structure 110. it can.

  Further, according to the present embodiment, the accuracy of the diagnosis result of the structure is not lowered due to the influence of noise on the measurement value of the vibrometer 307, and a robust diagnosis against noise becomes possible. The reason is that the diagnosis unit 306E divides an area (one component plane) formed by a plurality of measurement points into partial areas that satisfy the uniformity of the feature quantity based on the feature quantity of the vibration waveform at each measurement point. This is because the structure 110 is diagnosed based on the result of the division. Further, this is because the feature amount of the vibration waveform is smoothed for each partial region.

[Fourth Embodiment]
Referring to FIG. 18, the structure analyzing apparatus 400 according to the fourth embodiment of the present invention includes a three-dimensional position detection sensor 401, a communication I / F unit 402, an operation input unit 403, a screen display unit 404, and a storage unit 405. And an arithmetic processing unit 406. Among these, the three-dimensional position detection sensor 401, the communication I / F unit 402, the operation input unit 403, and the screen display unit 404 are included in the structure analyzing apparatus 200 according to the second embodiment of the present invention illustrated in FIG. The three-dimensional position detection sensor 201, the communication I / F unit 202, the operation input unit 203, and the screen display unit 204 have the same functions.

  The three-dimensional position detection sensor 408 has a function of measuring the three-dimensional position of each point on the structure 110 from a remote place. The three-dimensional position detection sensor 408 may be a ToF distance measuring device such as a three-dimensional distance image sensor, a millimeter wave radar, or a range finder, or may be a distance measuring sensor based on a triangulation method. However, the three-dimensional position detection sensor 408 has fewer points per unit area to be measured than the three-dimensional position detection sensor 401. For example, in the case of a millimeter wave radar ToF distance measuring device, the three-dimensional position detection sensor 401 corresponds to a high resolution type using a short wavelength, and the three-dimensional position detection sensor 408 corresponds to a low resolution type using a long wavelength. In this embodiment, two three-dimensional position detection sensors 401 and 408 having different resolutions are used. However, instead of these two sensors, one three-dimensional position detection sensor that can switch the resolution between high and low is used. Also good.

  The storage unit 405 includes a storage device such as a hard disk and a memory, and has a function of storing processing information and programs 405P necessary for various processes in the arithmetic processing unit 406. The program 405P is a program that implements various processing units by being read and executed by the arithmetic processing unit 406. It is read in advance from a storage medium (not shown) and stored in the storage unit 405. As main processing information stored in the storage unit 405, there are first three-dimensional position data 405A, second three-dimensional position data 405B, component surface data 405C, first surface data 405D, and second surface data 405E. is there. Among these, the first three-dimensional position data 405A is the same as the three-dimensional position data 205A in the structure analyzing apparatus 200 according to the second embodiment of the present invention shown in FIG.

  In the present embodiment, the second three-dimensional position data 405B is obtained by measuring the three-dimensional position data of each point on the structure 110 with the three-dimensional position detection sensor 408. The second three-dimensional position data 405B corresponds to the second three-dimensional position data 105B in the structure analyzing apparatus 100 according to the first embodiment of the present invention shown in FIG. That is, the configuration example of the second three-dimensional position data 405B is the same as the second three-dimensional position data 105B shown in FIG.

  The first surface data 405D is data related to a surface constituting the structure 110 extracted based on the second three-dimensional position data 405B. The first surface data 405D is the same as the configuration surface data 105C in the structure analyzing apparatus 100 according to the first embodiment of the present invention shown in FIG. That is, the configuration example of the first surface data 405D is the same as the configuration surface data 105C shown in FIG.

  The second surface data 405E is data related to the surface constituting the structure 110 extracted based on the first three-dimensional position data 405A. The second surface data 405E is the same as the second surface data 205E in the structure analyzing apparatus 200 according to the second embodiment of the present invention shown in FIG. That is, the configuration example of the second surface data 405E is the same as the second surface data 205E shown in FIG.

  In the configuration surface data 405C, a plurality of surfaces corresponding to the same one surface identified by the first surface data 405D among the plurality of surfaces identified by the second surface data 405E are integrated into one configuration surface. It is data. This configuration surface data 405C is the same as the configuration surface data 205C in the structure analyzing apparatus 200 according to the second embodiment of the present invention shown in FIG. That is, the configuration example of the configuration plane data 405C is the same as the configuration plane data 205C shown in FIG.

  The arithmetic processing unit 406 has a microprocessor such as an MPU and its peripheral circuits, and reads and executes the program 405P from the storage unit 405, thereby realizing various processing units by cooperating the hardware and the program 405P. It has a function to do. Main processing units realized by the arithmetic processing unit 406 include a three-dimensional position data measurement unit 406A, a three-dimensional position data generation unit 406B, and a surface extraction unit 406C. Among these, the three-dimensional position data measuring unit 406A has the same function as the three-dimensional position data measuring unit 106A of the structure analyzing apparatus 100 according to the first embodiment of the present invention shown in FIG.

  The three-dimensional position data generation unit 406B has a function of measuring the three-dimensional position data of each point of the structure 110 using the three-dimensional position detection sensor 408. The number of points per unit area measured by the three-dimensional position data generation unit 406B is defined by the performance of the three-dimensional position detection sensor 408 used. Here, the three-dimensional position detection sensor 408 is wider than a crack having a width L generated in a plane perpendicular to a line connecting the centers of the three-dimensional position detection sensor 101 and the structure 110 (a plane on the structure 110). The position information of each point of the structure 110 is measured at intervals.

  When the 3D position data measurement unit 406B completes the measurement of the 3D position data of each point of the structure 110, the 3D position data measurement unit 406B adds a point ID to the measurement value for each measurement point and stores it as the second 3D position data 405B. The data is stored in the part 405.

  The surface extraction unit 406 </ b> C has a function of extracting the constituent surfaces constituting the structure 110. The surface extraction unit 406C includes a first surface extraction unit 4061, a second surface extraction unit 4062, and a surface integration unit 4063. The first surface extraction unit 4061, the second surface extraction unit 4062, and the surface integration unit 4063 are the surface extraction unit 206C in the structure analyzing apparatus 200 according to the second embodiment of the present invention shown in FIG. The first surface extraction unit 2061, the second surface extraction unit 2062, and the surface integration unit 2063 have the same functions.

  FIG. 19 is a flowchart showing the operation of the structure analyzing apparatus 400 according to the present embodiment. Hereinafter, the operation of the structure analyzing apparatus 400 will be described with reference to FIG.

  First, the three-dimensional position data measurement unit 406A of the structure analyzing apparatus 400 measures the three-dimensional position data of each point of the structure 110 using the three-dimensional position detection sensor 401, and the measurement result is shown in FIG. The first three-dimensional position data 405A similar to the first three-dimensional position data 105A is stored in the storage unit 405 (step S401).

  Next, the three-dimensional position data generation unit 406B measures the three-dimensional position data of each point of the structure 110 using the three-dimensional position detection sensor 408, and the measurement result is, for example, the second three-dimensional position data in FIG. The second three-dimensional position data 405B similar to 105B is stored in the storage unit 405 (step S402).

  Next, the first surface extraction unit 4061 of the surface extraction unit 406C reads the second three-dimensional position data 405B from the storage unit 405, and constructs the structure 110 from the second three-dimensional position data by a predetermined segmentation algorithm. A plurality of first surfaces to be extracted are extracted, and for example, an extraction result similar to the component surface data 105C of FIG. 5 is stored in the storage unit 405 as first surface data 405D (step S403).

  Next, the second surface extraction unit 4062 of the surface extraction unit 406C reads the first three-dimensional position data 405A from the storage unit 405, and configures the structure 110 from the first three-dimensional position data by a predetermined segmentation algorithm. A plurality of second surfaces to be extracted are extracted, and the extraction result is stored in the storage unit 405 as second surface data 405E as shown in FIG. 11, for example (step S404).

  Finally, the surface integration unit 4063 of the surface extraction unit 406C reads the first surface data 405D and the second surface data 405E from the storage unit 405, and sets a plurality of second surfaces to be fitted to the same first surface. For example, the integration result is stored in the storage unit 405 as configuration surface data 405C as shown in FIG. 12 (step S405).

  As described above, according to the present embodiment, it is possible to prevent the surface from being excessively extracted in the surface extraction based on the three-dimensional position data of the structure 110. The reason is that the three-dimensional position data generation unit 406B measures the three-dimensional position data of the structure 110 as second three-dimensional position data 405B having little information regarding the position of the point per unit area of the surface of the structure, The surface extraction unit 406C extracts a plurality of first surfaces constituting the structure 110 based on the second three-dimensional position data 405B, and a plurality of parts constituting the structure 110 based on the first three-dimensional position data 405A. This is because the second surface is extracted and the plurality of second surfaces fitting to the same first surface are integrated into one surface.

  In addition, according to the present embodiment, the spatial resolution of the extracted component surface data 405C can be increased as compared with the first embodiment of the present invention. The reason is that the surface extraction unit 406C extracts a plurality of first surfaces constituting the structure 110 based on the second three-dimensional position data 405B, and the structure based on the first three-dimensional position data 405A. This is because a plurality of second surfaces constituting 110 are extracted, and a plurality of second surfaces fitting to the same first surface are integrated into one surface.

[Other Embodiments]
Although the present invention has been described with reference to some embodiments, the present invention is not limited to the above embodiments, and various other additions and modifications can be made. For example, the following embodiments are also included in the present invention.

  In the third embodiment, the vibration analysis is performed in consideration of the structural surface of the structure extracted in the configuration according to the second embodiment. However, according to the first embodiment or the fourth embodiment. The vibration analysis may be performed in consideration of the configuration surface of the structure extracted by the configuration.

  In the third embodiment, diagnosis is performed by measuring the vibration waveform for each structural surface of the structure 110. However, the method of performing the vibration analysis in consideration of the configuration surface of the structure 110 is not limited to the method of measuring and diagnosing the vibration waveform for each configuration surface. For example, when making a diagnosis by measuring the vibration waveforms of a plurality of surfaces of the structure 110, a method may be used in which a difference in the characteristic amount of the vibration waveform at the connection portion between the component surfaces is not determined to be abnormal.

  In each of the above embodiments, the surface of the structure is extracted based on the three-dimensional position data. However, even if the constituent surface of the structure extracted based on the three-dimensional position data is further divided using other data. Good. For example, by using a reflectance detection sensor composed of a combination of a hyperspectral camera and a light projection device that illuminates the structure 110, the spectral reflectance of each point on the structure 110 is measured from a remote location, and 3 Each constituent surface extracted based on the dimension position data may be further divided into a plurality of surfaces according to the difference in spectral reflectance. For example, when the structure 110 is composed of a plurality of types of materials having different spectral reflectances such as concrete, iron, aluminum, and resin, if there are a plurality of different surfaces on the same plane, the three-dimensional position Data alone cannot extract surfaces with different materials as one component surface, but it can be obtained by using spectral reflectance.

  The present invention is applied to the field in which structural surfaces of civil engineering buildings such as bridges and structures such as various industrial products / equipment are mechanically extracted, or vibration is measured for each extracted structural surface to diagnose the structure. it can.

A part or all of the above embodiments can be described as in the following supplementary notes, but is not limited thereto.
(Appendix 1)
3D position data measuring means for measuring 3D position data of each point on the structure as first position data;
The three-dimensional position data of each point on the structure, the three-dimensional position data having less information about the position of the point per unit area of the surface of the structure than the first position data. Three-dimensional position data generating means for generating data;
A structure analyzing apparatus having surface extracting means for extracting a plurality of constituent surfaces constituting the structure based on the second position data.
(Appendix 2)
The structure analysis apparatus according to appendix 1, wherein the three-dimensional position data generation unit generates the second position data by converting the first position data.
(Appendix 3)
The structure analysis apparatus according to appendix 1, wherein the three-dimensional position data generation unit generates the second position data by measuring three-dimensional position data of each point on the structure.
(Appendix 4)
The surface extraction means extracts a plurality of first surfaces constituting the structure based on the second position data, and a plurality of first surfaces constituting the structure based on the first position data. The structure analysis apparatus according to appendix 2 or 3, wherein two surfaces are extracted and a plurality of the second surfaces corresponding to the same first surface are integrated into one surface among the second surfaces.
(Appendix 5)
Vibration measuring means for measuring vibration waveforms at a plurality of measurement points set on the structure;
The structure analysis apparatus according to any one of appendices 1 to 4, further comprising a diagnosis unit that diagnoses the structure based on the vibration waveform.
(Appendix 6)
The vibration measuring unit measures a vibration waveform for each of the constituent surfaces of the structure,
The structure analysis apparatus according to appendix 5, wherein the diagnosis unit diagnoses the structure based on the vibration waveform for each of the constituent surfaces.
(Appendix 7)
The vibration measuring means measures vibration waveforms of the plurality of constituent surfaces of the structure,
The structure analysis apparatus according to appendix 5, wherein the diagnosis unit diagnoses the structure based on the vibration waveforms of the plurality of constituent surfaces.
(Appendix 8)
The diagnostic means includes
Determining means for determining whether or not the structure has a defect;
The structure analysis apparatus according to any one of appendices 5 to 7, further comprising a region output unit that outputs a region of the structure determined to have the defect.
(Appendix 9)
A structure analysis method executed by a structure analysis apparatus,
Measure the three-dimensional position data of each point on the structure as the first position data,
The three-dimensional position data of each point on the structure, the three-dimensional position data having less information about the position of the point per unit area of the surface of the structure than the first position data. As data,
A structure analysis method for extracting a plurality of constituent surfaces constituting the structure based on the second position data.
(Appendix 10)
The structure analysis apparatus according to appendix 9, wherein in the generation of the second position data, the first position data is converted to generate the second position data.
(Appendix 11)
The structure analyzing apparatus according to appendix 9, wherein the second position data is generated by measuring the three-dimensional position data of each point on the structure to generate the second position data.
(Appendix 12)
In the extraction of the component surface, a plurality of first surfaces constituting the structure are extracted based on the second position data, and a plurality of components constituting the structure based on the first position data are extracted. The structure analysis method according to appendix 7, wherein a second surface is extracted and a plurality of the second surfaces corresponding to the same first surface among the second surfaces are integrated into one surface.
(Appendix 13)
Measure vibration waveforms at a plurality of measurement points set on the structure,
The structure analysis method according to any one of appendices 9 to 12, wherein the structure is diagnosed based on the vibration waveform.
(Appendix 14)
In the measurement of the vibration waveform, the vibration waveform is measured for each component surface of the structure,
The structure analysis method according to supplementary note 13, wherein in the diagnosis, the structure is diagnosed based on the vibration waveform for each of the constituent surfaces.
(Appendix 15)
In the measurement of the vibration waveform, the vibration waveform of the plurality of constituent surfaces of the structure is measured,
The structure analysis method according to supplementary note 13, wherein in the diagnosis, the structure is diagnosed based on the vibration waveforms of the plurality of constituent surfaces.
(Appendix 16)
In the diagnosis,
Determine whether the structure is defective,
16. The structure analysis method according to any one of supplementary notes 13 to 15, wherein an area of the structure determined to have the defect is output.
(Appendix 17)
Computer
3D position data measuring means for measuring 3D position data of each point on the structure as first position data;
The three-dimensional position data of each point on the structure, the three-dimensional position data having less information about the position of the point per unit area of the surface of the structure than the first position data. Three-dimensional position data generating means for generating data;
The program for functioning as a surface extraction means which extracts the some structural surface which comprises the said structure based on said 2nd position data.

DESCRIPTION OF SYMBOLS 100 ... Structure analysis apparatus 101 ... Three-dimensional position detection sensor 102 ... Communication I / F part 103 ... Operation input part 104 ... Screen display part 105 ... Memory | storage part 105A ... First three-dimensional position data 105B ... Second three-dimensional Position data 105C ... construction surface data 105P ... program 106A ... 3D position data measurement unit 106B ... 3D position data generation unit 106C ... surface extraction unit 110 ... structure 110A, 110B ... construction surface 110C ... crack

Claims (10)

3D position data measuring means for measuring 3D position data of each point on the structure as first position data;
The three-dimensional position data of each point on the structure, the three-dimensional position data having less information about the position of the point per unit area of the surface of the structure than the first position data. Three-dimensional position data generating means for generating data;
A structure analyzing apparatus having surface extracting means for extracting a plurality of constituent surfaces constituting the structure based on the second position data. The structure analysis apparatus according to claim 1, wherein the three-dimensional position data generation unit generates the second position data by converting the first position data.   The three-dimensional position data generating means measures the three-dimensional position data of each point on the structure and generates the second position data. The surface extraction means extracts a plurality of first surfaces constituting the structure based on the second position data, and a plurality of first surfaces constituting the structure based on the first position data. The structure analysis apparatus according to claim 2 or 3, wherein two surfaces are extracted and a plurality of the second surfaces corresponding to the same first surface are integrated into one surface among the second surfaces. . Vibration measuring means for measuring vibration waveforms at a plurality of measurement points set on the structure;
The structure analyzing apparatus according to claim 1, further comprising a diagnosis unit that diagnoses the structure based on the vibration waveform. The vibration measuring unit measures a vibration waveform for each of the constituent surfaces of the structure,
The structure analysis apparatus according to claim 5, wherein the diagnosis unit diagnoses the structure based on the vibration waveform for each component surface. The vibration measuring means measures vibration waveforms of the plurality of constituent surfaces of the structure,
The structure analysis apparatus according to claim 5, wherein the diagnosis unit diagnoses the structure based on the vibration waveforms of the plurality of constituent surfaces. The diagnostic means includes
Determining means for determining whether or not the structure has a defect;
The structure analyzing apparatus according to claim 5, further comprising a region output unit that outputs a region of the structure determined to have the defect. A structure analysis method executed by a structure analysis apparatus,
Measure the three-dimensional position data of each point on the structure as the first position data,
The three-dimensional position data of each point on the structure, the three-dimensional position data having less information about the position of the point per unit area of the surface of the structure than the first position data. As data,
A structure analysis method for extracting a plurality of constituent surfaces constituting the structure based on the first position data. Computer
3D position data measuring means for measuring 3D position data of each point on the structure as first position data;
The three-dimensional position data of each point on the structure, the three-dimensional position data having less information about the position of the point per unit area of the surface of the structure than the first position data. Three-dimensional position data generating means for generating data;
The program for functioning as a surface extraction means which extracts the some structural surface which comprises the said structure based on said 2nd position data.

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