JP2015190890A - Device and method for determining defect - Google Patents

Abstract

PROBLEM TO BE SOLVED: To specify a defect caused by a manufacturing apparatus.SOLUTION: A device (10) for determining a defect comprises: a first candidate specification part (14) for dividing an inspection area in a work piece into a plurality of predetermined division areas to set a division area including defects equal to or more than a threshold value as a first defect candidate area; and a second candidate specification part (15) for determining a position of a division area including the first defect candidate area in B or more work pieces as a second defect candidate area in a group of A work pieces continuously processed in a specific manufacturing apparatus.

Description

  The present invention relates to a defect determination apparatus that determines a defect caused by a manufacturing apparatus.

  Inspection system that identifies abnormal processes or abnormal equipment that may cause product defects, etc., in order to improve product quality and ensure stable operation of production lines for semiconductor devices and liquid crystal display devices that include many processes Has been introduced. In the inspection system, various in-line inspections are performed on the production line, and abnormal processes or abnormal facilities are specified based on the inspection results.

  Patent Document 1 classifies defect distribution states of product substrates based on information obtained in pattern defect inspection, which is one of in-line inspections, and is common based on the similarity of defect distribution states using product history information. A technique for performing path analysis and identifying problem device candidates is disclosed.

  Patent Document 2 discloses a technique for identifying common defects common to a plurality of substrates by classifying defects detected on the plurality of substrates according to their occurrence positions. As a result, it is possible to identify defects caused by the process of collectively transferring a pattern using a mask and to determine an abnormal portion of the apparatus.

  Patent Document 3 discloses a technique for estimating a defect generation device by quantitatively evaluating the similarity of a defect distribution and evaluating the periodicity of a data string of the similarity.

JP 2005-197629 A (published July 21, 2005) JP 2006-190844 A (published July 20, 2006) JP 2003-100825 A (published April 4, 2003)

  In the manufacturing process of a TFT (thin film transistor) substrate or a color filter substrate used in a liquid crystal display device, defects due to adhesion of dust contained in the atmosphere, and defects due to deposits or scratches due to film formation abnormalities, Can occur on the substrate. Including a defect having a size of about several μm, generally, a manufactured substrate has a great number of defects. As the substrate becomes larger, the number of defects tends to increase accordingly. In addition, when the restrictions on the process become severe, it becomes necessary to handle even smaller deposits of 1 μm or less as defects, so that the number of target defects increases. In such a situation, even when trying to specify a defect caused by the manufacturing apparatus from many defects, it becomes difficult to specify the defect caused by the manufacturing apparatus because other defects become noise.

  For example, when determining a defect having a position reproducibility that occurs frequently at a specific position on a substrate due to a manufacturing apparatus as a defect pattern, the defect having the above position reproducibility is usually on the substrate. In addition to the above, many other defects are included, and it is often difficult to distinguish both. In such a case, the defect pattern described above is buried in other defect groups existing on the substrate, so that the accuracy of determining the defect pattern is reduced or the above tendency is remarkably large. In this case, the above defect pattern cannot be discriminated at all.

  Another problem is as follows. Depending on the manufacturing process, a plurality of manufacturing apparatuses may be included in one manufacturing process, and the substrates may be processed in parallel by the plurality of manufacturing apparatuses. In this case, even in the same manufacturing process, which manufacturing apparatus is used for processing differs for each substrate. Therefore, when attention is paid to a specific inspection apparatus in the subsequent process, substrates processed by various manufacturing apparatuses are shuffled in a random order and flow to the inspection apparatus. Even if it is attempted to detect a specific defect pattern caused by a manufacturing apparatus, it is difficult to discriminate the defect pattern because the defect information of the substrate processed by another manufacturing apparatus is included.

  In the techniques of Patent Documents 1 and 3, an abnormal device is detected based on a feature amount of a defect pattern or defect distribution, but noise when detecting a defect other than a defect caused by a manufacturing apparatus, that is, a defect caused by a manufacturing apparatus. When there are a lot of defects, the defect caused by the manufacturing apparatus cannot be specified.

  In the technique of Patent Document 2, a common defect common to a plurality of substrates is specified. However, when the plurality of substrates include substrates processed by various manufacturing apparatuses, a specific manufacturing apparatus is used. It is difficult to discriminate defects caused by.

  According to one embodiment of the present invention, a defect caused by a manufacturing apparatus can be accurately determined.

  The defect determination apparatus according to an aspect of the present invention performs one or more manufacturing processes on a workpiece using one or more manufacturing apparatuses capable of executing the manufacturing processes, and after the manufacturing processes. A defect determination apparatus applicable to a production line that executes an inspection process using one or more inspection apparatuses that detect defects on the workpiece, and is processed by a specific manufacturing apparatus in a specific manufacturing process. For a plurality of workpieces, defect information acquisition means for acquiring defect information including defect position information in each workpiece detected in the inspection step, and inspection for dividing the inspection area of the workpiece into a plurality of predetermined divided areas Area dividing means, defect area setting means for setting, as the defect area, a defect area having a number of defects equal to or greater than a threshold among the divided areas in each workpiece; A defect area is compared in a set of A pieces of workpieces processed continuously by the specific manufacturing apparatus in the manufacturing process of B, and B pieces or more of the workpieces (where 2 ≦≦ First determination means for determining the position of the divided area including the defect area in B ≦ A) as the position of the specific defect in the comparison set.

  In the defect determination method according to one aspect of the present invention, one or more manufacturing steps are performed on a workpiece using one or more manufacturing apparatuses capable of executing the manufacturing steps, respectively, and after the manufacturing steps are performed. A defect determination method applicable to a production line in which an inspection process is performed using one or more inspection apparatuses that detect defects on the workpiece, and is processed by a specific manufacturing apparatus in a specific manufacturing process. A defect information acquisition step for acquiring defect information including information on the position of a defect in each workpiece detected in the inspection process for a plurality of the workpieces, and an inspection for dividing the inspection area of the workpiece into a plurality of predetermined divided areas An area division step, and a defect area setting step for setting, as a defect area, a defect whose number of defects equal to or greater than a threshold is included in each of the divided areas in each workpiece. In addition, the defect regions are compared in the set of A workpieces processed continuously by the specific manufacturing apparatus in the specific manufacturing process, and B or more workpieces are compared among the A workpieces compared. A first determination step of determining the position of the divided area in which the defect area is included in (2 ≦ B ≦ A) as the position of the specific defect in the comparison set.

  According to one embodiment of the present invention, a defect caused by a specific manufacturing apparatus can be accurately determined.

It is a figure showing a schematic structure of a manufacturing system concerning one embodiment of the present invention. It is a block diagram which shows the function structure of the defect determination apparatus which concerns on one Embodiment of this invention. It is a figure which shows the processing flow of the said defect determination apparatus regarding extraction of the defect candidate resulting from a specific manufacturing apparatus. It is a figure which shows the test | inspection area | region divided | segmented into the some division area. It is a figure which shows distribution of the 1st defect candidate area | region of the several board | substrate with a continuous processing order. It is a figure which shows distribution of the 2nd defect candidate area | region which displayed the 2nd defect candidate area | region specified in the some board | substrate superimposed on one board | substrate. It is a block diagram which shows the function structure of the defect determination apparatus which concerns on other embodiment of this invention. It is a graph showing the time change of the number of defects about five division area where a 2nd defect candidate area | region may appear in the defect map shown in FIG.

Embodiment 1
Hereinafter, embodiments of the present invention will be described in detail. Generally, defects detected for a substrate include defects that affect product quality and minor defects that do not. Further, the defects that affect the quality of the product include a defect caused by the manufacturing apparatus and a defect not caused by the manufacturing apparatus. In order to reduce the defect rate of the substrate, it is important to monitor the manufacturing process, to quickly find and deal with defects caused by the manufacturing apparatus. Therefore, it is necessary to extract a defect caused by the manufacturing apparatus from many defects. Insufficient defect narrowing increases the number of defects that become noise, making it difficult to detect abnormalities in the manufacturing apparatus. For example, a defect caused by dust (dust) in the atmosphere adhering to the substrate is a defect not caused by a manufacturing apparatus. On the other hand, when a foreign substance adheres to the printing plate etc. which apply | coat polyimide etc. in a manufacturing apparatus, the defect will arise in a board | substrate when the foreign material of a printing plate adheres to a board | substrate. This defect is a defect caused by the manufacturing apparatus. In the defect determination apparatus according to the present embodiment, a defect candidate caused by the manufacturing apparatus is specified from among many defects.

  In the following, a case where a substrate such as a TFT substrate for a liquid crystal display device is inspected will be described. However, the present invention is not limited to this, and can be applied to a case where an arbitrary product (work) is inspected. It is.

(Manufacturing system 1)
FIG. 1 is a diagram illustrating a schematic configuration of a manufacturing system 1. The manufacturing system 1 (manufacturing line) includes a manufacturing apparatus for a plurality of manufacturing processes, an inspection apparatus for a plurality of inspection processes, a manufacturing process information database 2, an inspection process information database 3, and a defect determination apparatus 10. The defect determination device 10 is connected to the input device 4 and the output device 5. The manufacturing process information database 2 and the inspection process information database 3 are databases composed of a storage device or the like.

  A substrate (work) that is a product is processed in the order of a first manufacturing process, a second manufacturing process, a first inspection process, a third manufacturing process, and a second inspection process. In each manufacturing process, processing such as film formation is performed. A substrate ID (substrate identification information) for identifying each substrate is attached to each of the plurality of substrates. In addition, a device ID (device identification information) for identifying each device is assigned to each manufacturing device and each inspection device.

  In the first manufacturing process, the plurality of first manufacturing apparatuses a1, a2, and a3 perform processing. The first manufacturing apparatuses a1, a2, and a3 are provided in parallel. Each of the plurality of substrates is allocated and carried into one of the plurality of first manufacturing apparatuses a1, a2, and a3. Each of the first manufacturing apparatuses a1, a2, and a3 performs an equivalent process on the substrate passing therethrough. The substrate processed in the first manufacturing process is transported to the second manufacturing process.

  When the processing for the substrate is completed, the first manufacturing apparatuses a1, a2, and a3 have the process number, their own apparatus ID, the substrate ID of the processed substrate, the processing start time (date and time), and the processing end time. Are transmitted to the manufacturing process information database 2. The manufacturing process information database 2 stores (stores) the process number, device ID, substrate ID, process start time, and process end time in association with each other. The process number is an identification number indicating the process (for example, the first process).

  In the second manufacturing process, the plurality of second manufacturing apparatuses b1, b2, and b3 perform processing. Here, the board | substrate conveyed to the 2nd manufacturing process is preferentially carried into the vacant 2nd manufacturing apparatus. Therefore, the substrate processed by the first manufacturing apparatus a1 in the first manufacturing process is not necessarily processed by the second manufacturing apparatus b1 in the second manufacturing process. The substrate processed by the first manufacturing apparatus a1 can be processed by the second manufacturing apparatus b1, the second manufacturing apparatus b2, or the second manufacturing apparatus b3. The same applies to the substrate processed by the first manufacturing apparatus a2. Therefore, it is not determined which manufacturing apparatus in each process each substrate is processed. In addition, the number of manufacturing apparatuses provided in parallel for each process may differ depending on the length of the processing time of the process. The substrate processed in the second manufacturing process is transferred to the first inspection process.

  When the processing on the substrate is completed, like the first manufacturing apparatus, the second manufacturing apparatuses b1, b2, and b3 have the process number, their own apparatus ID, the substrate ID of the processed substrate, and the processing start time. The process end time is associated and transmitted to the manufacturing process information database 2. The manufacturing process information database 2 stores the process number, the device ID, the substrate ID, the process start time, and the process end time in association with each other.

  In the first inspection process, a plurality of first inspection devices c1, c2, and c3 perform processing. Here, as in the second manufacturing process, the substrate carried to the first inspection process is preferentially carried to the vacant first inspection apparatus. The first inspection devices c1, c2, and c3 obtain a substrate image by photographing a predetermined inspection region on the surface of each substrate. The first inspection devices c1, c2, and c3 perform predetermined image processing and defect determination processing on the image, thereby specifying the positions of a plurality of defects existing on the surface of the substrate. The substrate inspected in the first inspection process is transported to the third manufacturing process.

  The first inspection devices c1, c2, and c3 associate the process number, its own device ID, the substrate ID of the substrate that has been inspected, the inspection start time, the inspection end time, and the inspection data (inspection result). To the inspection process information database 3. The inspection process information database 3 stores the process number, device ID, substrate ID, inspection start time, inspection end time, and inspection data in association with each other. The inspection data includes an image of the substrate and information on positions (coordinates) of a plurality of defects on the substrate.

  In the third manufacturing process, a plurality of third manufacturing apparatuses d1, d2, and d3 perform processing. Here, similarly to the second manufacturing process, the substrate transported to the third manufacturing process is preferentially transported to an empty third manufacturing apparatus. The substrate processed in the third manufacturing process is transferred to the second inspection process.

  When the processing on the substrate is completed, the third manufacturing apparatuses d1, d2, and d3 associate the process number, its own apparatus ID, the substrate ID of the processed substrate, the processing start time, and the processing end time. And sent to the manufacturing process information database 2. The manufacturing process information database 2 stores the process number, the device ID, the substrate ID, the process start time, and the process end time in association with each other.

  In the second inspection process, the plurality of second inspection devices e1, e2, and e3 perform processing. Here, similarly to the second manufacturing process, the substrate carried to the second inspection process is preferentially carried to the vacant second inspection apparatus. The second inspection devices e1, e2, and e3 specify the position of the defect from the image obtained by photographing the surface of each substrate. The substrate that has been inspected in the second inspection step is transported from the manufacturing system 1.

  The second inspection devices e1, e2, and e3 associate the process number, its own device ID, the substrate ID of the inspected substrate, the inspection start time, the inspection end time, and the inspection data, It transmits to the information database 3. The inspection process information database 3 stores the process number, device ID, substrate ID, inspection start time, inspection end time, and inspection data in association with each other.

  In this way, the manufacturing tact time can be shortened by arranging a plurality of manufacturing apparatuses in parallel in each process and allocating the next substrate to the vacant manufacturing apparatus. In such a parallel manufacturing system, which substrate is processed in which first manufacturing apparatus in the first step and which second manufacturing device is processed in the second step is different for each substrate. Even when a defect in a substrate is increased due to an abnormality occurring in a certain manufacturing apparatus, the cause is not easily identified because the manufacturing apparatus that has passed for each substrate is different. The defect determination apparatus 10 according to the present embodiment identifies a defect candidate caused by the manufacturing apparatus in the manufacturing system 1.

(Defect determination device 10)
FIG. 2 is a block diagram illustrating a functional configuration of the defect determination apparatus 10. FIG. 2 also shows the manufacturing process information database 2, the inspection process information database 3, the input device 4, and the output device 5 connected to the defect determination device 10. The defect determination device 10 can be realized by a computer or the like that includes an arithmetic processing device and a storage device.

  The input device 4 is a device for inputting user instructions to the defect determination device 10 such as a mouse and a keyboard.

  The output device 5 is a device for presenting information to the user, such as a display device and a speaker.

  The defect determination apparatus 10 includes an input control unit 11, an inspection data acquisition unit 12 (defect information acquisition unit), a sort processing unit 13, a first candidate specifying unit 14 (inspection region dividing unit, defect region setting unit), and a second candidate specification. A unit 15 (first determination unit) and an output control unit 16 (notification unit) are provided.

  The input control unit 11 receives a user instruction input to the input device 4. The input control unit 11 outputs the input user instruction to the inspection data acquisition unit 12.

  The inspection data acquisition unit 12 acquires substrate IDs of a plurality of substrates processed in a specific manufacturing apparatus from the manufacturing process information database 2 based on a user instruction. The inspection data acquisition unit 12 acquires inspection data in a specific inspection process regarding the substrates of the plurality of acquired substrate IDs from the inspection process information database 3 based on a user instruction. The inspection data acquisition unit 12 outputs the board ID and the inspection data to the sort processing unit 13.

  The sort processing unit 13 rearranges the sets of inspection data and board IDs in the order processed in a specific manufacturing apparatus. For example, the plurality of substrates that have passed through the first manufacturing apparatus a1 are not necessarily processed in the order of the substrate IDs. In order to be able to determine the presence or absence of a causal relationship between the occurrence of a defect and the manufacturing apparatus, the sort processing unit 13 rearranges the combination of the inspection data and the substrate ID in the processing order (time order) in the manufacturing apparatus of interest. . The sort processing unit 13 outputs a set of inspection data and board IDs rearranged in the processing order to the first candidate specifying unit 14.

  The first candidate specifying unit 14 divides the inspection area of each substrate into a plurality of predetermined divided areas, and specifies in which divided area each defect of the substrate is located. Specifically, the first candidate specifying unit 14 sets a plurality of divided regions (small regions) arranged in a matrix for the rectangular inspection region of the substrate. The first candidate specifying unit 14 refers to the inspection data of the substrate and specifies (sets) the divided region where the defect is located as the first defect candidate region (defect region) on the substrate. When a plurality of defects exist on one substrate, a plurality of first defect candidate regions are set on the substrate. In addition, the 1st candidate specific | specification part 14 may specify this division area as a 1st defect candidate area, when the defect more than a 1st threshold value (for example, 2 pieces) is located in one division area. In this case, when the defect located in one division area is less than the first threshold, the first candidate identification unit 14 does not identify the division area as the first defect candidate area. The first candidate specifying unit 14 outputs the divided region, first defect candidate region, inspection data, and substrate ID information to the second candidate specifying unit 15.

  In a case where the divided region at the specific position is the first defect candidate region over a predetermined number (A) of substrates that are consecutive in the processing order, the second candidate specifying unit 15 selects the first defect candidate region as the second defect region. It is specified as a defect candidate area. That is, when there are defects continuously in the same divided region over a plurality of substrates in time, the second candidate specifying unit 15 determines the divided region (first defect candidate region) where the continuous defect is located as the first. Two defect candidate areas are identified. Defects that occur successively at the same position on different substrates are likely due to the manufacturing equipment. That is, the second defect candidate area is an area where a defect candidate due to the manufacturing apparatus is located. The second candidate specifying unit 15 outputs information on the second defect candidate region, the divided region, the first defect candidate region, the inspection data, and the substrate ID to the output control unit 16.

  The output control unit 16 causes the output device 5 to display information on the specified second defect candidate region and the substrate ID. When the number (average value) of second defect candidate areas per substrate is equal to or greater than the second threshold, the output control unit 16 displays that the target manufacturing apparatus is abnormal by the output apparatus 5. Alternatively, the user is notified by an alarm sound.

(Processing flow of defect determination device)
FIG. 3 is a diagram illustrating a processing flow of the defect determination apparatus 10 related to extraction of defect candidates caused by a specific manufacturing apparatus.

  The input control unit 11 receives specification (input) of extraction conditions from the user via the input device 4 (S1). The user designates the manufacturing process to be investigated, the manufacturing apparatus to be investigated, the inspection process to be investigated, and the period to be investigated as extraction conditions. These extraction conditions may be set in advance. The defect determination apparatus 10 may periodically perform defect candidate extraction processing in accordance with preset extraction conditions. Here, it is assumed that the first manufacturing process is designated as the manufacturing process to be investigated, the first manufacturing apparatus a1 is designated as the manufacturing apparatus to be investigated, and the first inspection process is designated as the inspection process to be investigated.

  The inspection data acquisition unit 12 acquires the substrate IDs of the plurality of substrates processed by the first manufacturing apparatus a1 in the first manufacturing process from the manufacturing process information database 2 during the investigation target period. And the inspection data acquisition part 12 acquires the inspection data in a 1st inspection process regarding the board | substrate of several acquired board | substrate ID from the inspection process information database 3 (S2).

  The sort processing unit 13 rearranges the sets of inspection data and substrate IDs in the order in which processing is performed in the first manufacturing apparatus a1 (S3). The order of passing through the first inspection devices c1, c2, and c3 in the first inspection step is different from the order of passing through the first manufacturing device a1, but due to this sorting, pay attention to the processing order in the first manufacturing device a1, Defect candidates resulting from the first manufacturing apparatus a1 can be extracted.

  The first candidate specifying unit 14 divides the rectangular inspection region of each substrate into a plurality of divided regions arranged in a matrix (S4). FIG. 4 is a diagram illustrating an inspection area divided into a plurality of divided areas. Numbers 1 to 10 attached to the periphery of the inspection area 30 are coordinates (x, y) indicating the position of the divided area. Here, the rectangular inspection area 30 is divided into 10 × 10 divided areas 31. The number of divisions can be arbitrarily set according to the manufacturing process and the product. Here, each divided region 31 on one substrate has the same size, but the size of the plurality of divided regions 31 is different, for example, some regions are more finely divided according to the film formation pattern. Also good. However, the divided areas are common to each substrate.

  The first candidate specifying unit 14 specifies, as the first defect candidate area 32, a divided area 31 including a number of defects equal to or more than the first threshold among the divided areas of each substrate based on the substrate inspection data. (S5). In FIG. 4, the position of each defect is indicated by a cross. Here, a divided region 31 including one or more defects is set as a first defect candidate region 32. A plurality of first defect candidate regions 32 may exist on one substrate. Information on the position (coordinates) of each defect on the substrate is included in the inspection data. Note that the first inspection devices c1, c2, and c3 specify the position of the defect in more detail than the coordinates (1 to 10) of the divided area, and record it as inspection data.

  The distribution of the first defect candidate region 32 is generally different for each substrate. For example, even if the divided area of coordinates (4, 5) is the first defect candidate area 32 on a certain substrate, the divided area of coordinates (4, 5) of the next processed substrate is the first defect candidate area 32. Not necessarily. It is considered that the position of the defect due to the dust in the atmosphere adhering to the substrate has little correlation between the substrates. On the other hand, when the divided region at the same position (3, 3) is the first defect candidate region 32 in several substrates that are consecutive in the processing order, the defect at the position (3, 3) is the first to be investigated. There is a high possibility that it is caused by an abnormality in the manufacturing apparatus a1. The greater the number of substrates in which the first defect candidate region 32 is continuously generated at the same position, the higher the possibility that the defect is caused by the abnormality of the first manufacturing apparatus a1.

  The second candidate specifying unit 15 compares the positions of the first defect candidate areas with respect to a set of A substrates that are continuously processed by the manufacturing apparatus to be investigated in the manufacturing process to be investigated. The second candidate specifying unit 15, when the divided region (at the same position) at a specific position is the first defect candidate region 32 over the comparison set (A substrate set), The position of the area is specified (determined) as the position of the second defect candidate area in the comparison set (S6). Here, when the divided region 31 at the same position is the first defect candidate region 32 over three substrates that are consecutive in the processing order, the second candidate specifying unit 15 sets the position of the divided region to the above-described comparison group. It is determined as the second defect candidate region in (a set of three consecutive substrates). In other words, the second defect candidate area is a divided area including defects that appear three times in succession at the same position (area) when a plurality of substrates are viewed in the processing order. Here, the second defect candidate region is referred to as a continuous defect (specific defect). Note that the second defect candidate region is determined for each group (a group of A substrates) that has been compared. For example, the second candidate specifying unit 15 divides 100 substrates into 5 groups (20 sets), and the first defect candidate regions are consecutively repeated five times at the same position in each divided region of each set. The presence or absence of continuous defects may be determined on the condition. Each set may include a part of the substrates. For example, in each set of comparisons, a plurality of workpieces included therein may be shifted one by one in the processing order, or may be shifted by five (a certain number) in the processing order.

  FIG. 5 is a diagram illustrating the distribution of the first defect candidate regions of a plurality of substrates that are sequentially processed. FIGS. 5A to 5F show the divided regions and the first defect candidate regions of the substrates SB1 to SB6, respectively. In FIG. 5, the hatched hatched area is a first defect candidate area that includes a defect. In FIG. 5, the area specified as the second defect candidate area is indicated by a thick frame. The substrates SB1 to SB6 are substrates that are successively processed in this order.

  The first defect candidate region 32a in the substrate SB1 does not appear in the same divided region of the next substrate SB2. The same applies to the other first defect candidate regions on the substrate SB1. Therefore, since the defect included in the first defect candidate region that is not a continuous defect is unlikely to be a defect caused by the first manufacturing apparatus a1, the position of the first defect candidate region 32a on the substrate SB1 is the second defect. It is assumed that it is not a candidate area.

  On the other hand, the first defect candidate region 32b in the substrate SB2 appears in the same divided region four times continuously in the substrates SB2 to SB5. Since the defect included in the first defect candidate region that appears continuously at the same position is likely to be a defect caused by the first manufacturing apparatus a1, the first defect candidate region 32b in the substrates SB2 to SB5 is the first defect region 32b. It is assumed that there are two defect candidate areas. Similarly, the first defect candidate regions 32c, 32d, and 32e that appear at the same position three times in succession on the substrates SB2 to SB4 are also assumed to be second defect candidate regions. Also, the first defect candidate region 32f that appears at the same position three times in succession on the substrates SB4 to SB6 is also assumed to be the second defect candidate region.

  Note that in the substrates SB3 to SB4, the first defect candidate region 32g appears twice in the same divided region. However, it is possible that defects that are not caused by the first manufacturing apparatus a1 occur by chance in the same divided area. Therefore, here, the first defect candidate region 32g having the number of consecutive times less than 3 is not regarded as the second defect candidate region.

  Thus, the 2nd candidate specific part 15 is the 2nd defect candidate area | region with high possibility that it is an area | region containing the defect resulting from 1st manufacturing apparatus a1 to be investigated from several 1st defect candidate area | regions. Is extracted (specified). The first defect candidate area that is not regarded as the second defect candidate area is excluded as noise that makes the causal relationship difficult to see.

  For the sake of simplicity, here, when A = 3, that is, the first defect candidate region that appears continuously at the same position three times or more is specified as the second defect candidate region. However, it is not limited to this. If there are many defects (first defect candidate areas) that cause noise, A may be made larger (for example, A = 5) to eliminate noise. In order to eliminate noise, A ≧ 3 can be set.

  Here, since the inspection data is viewed in the processing order of the first manufacturing apparatus a1, it can be determined that there is a high possibility that consecutive defects are caused by the first manufacturing apparatus a1. As described above, since the manufacturing apparatus that passes through each process is indefinite, the processing order of the first manufacturing apparatus a1 in the first manufacturing process is the processing order of the second manufacturing apparatus b1 in the other second manufacturing process. Correlation is small. Therefore, it can be determined that there is a high possibility that the continuous defect is caused by the first manufacturing apparatus a1 instead of the other second manufacturing apparatus b1. Thereby, the 1st manufacturing apparatus a1 in which abnormality has occurred can be specified easily. For example, if the parallel system is such that the substrate processed by the first manufacturing apparatus a1 is always processed by the second manufacturing apparatus b1, the first manufacturing apparatus a1 and the second manufacturing apparatus 2 are obtained from the extraction result of the second defect candidate region. It is only possible to specify that an abnormality has occurred in any of the manufacturing apparatuses b1.

  Here, the second candidate specifying unit 15 specifies the second defect candidate region on the condition that defects (first defect candidate regions) continuously appear on the same position on the A substrates. Not limited to this, the second candidate specifying unit 15 may specify the second defect candidate region based on the appearance frequency of the first defect candidate region at the same position in the continuous A substrates. For example, the second candidate specifying unit 15 determines the position of the divided region where the first defect candidate region is included in B or more substrates (where 2 ≦ B ≦ A) in a set of A substrates that are consecutive in the processing order, You may determine as a 2nd defect candidate area | region in a group. In the case of A = B, it is a condition that the first defect candidate regions appear continuously at the same position on the A substrates. Since noise increases when B is too small with respect to A, for example, the condition is that the first defect candidate region continuously appears at least once in the same position among A substrates that are consecutive in the processing order. can do. Moreover, it can be made a condition that the first defect candidate region appears at the same position in at least half of the A substrates that are consecutive in the processing order. When these conditions are expressed by equations, B> A / 2 when A is an even number, and B> (A + 1) / 2 when A is an odd number. For example, if A = 10 and B is greater than 5, the first defect candidate region appears at the same position on more than half of the 10 substrates in the order of processing, and at least once The first defect candidate areas appear continuously at the positions. In the case of A = 11, if B is greater than 6, the condition represents the same meaning as described above. A and B are parameters that can be arbitrarily determined by the user according to the number of defects generated in the substrate, the size of the substrate, and the like.

  The output control unit 16 causes the output device 5 to display information (determination result) of the second defect candidate area specified for each substrate (S7). In addition, the output control unit 16 causes the output device 5 to display the number (average value) of second defect candidate regions per substrate. If the number of second defect candidate regions per substrate (per comparison set) (that is, the frequency of appearance of the second defect candidate regions) is equal to or greater than the second threshold, an abnormality has occurred in the target manufacturing apparatus. Is displayed on the output device 5. In this case, the output control unit 16 may instruct the output device 5 to sound an alarm sound indicating that an abnormality has occurred in the first manufacturing apparatus a1. Thus, by regularly monitoring the number of second defect candidate regions for each manufacturing apparatus, it is possible to easily determine whether or not an abnormality has occurred in the manufacturing apparatus.

  In addition, the output control unit 16 stores, in a storage device (not shown) included in the defect determination apparatus 10, the position of the second defect candidate area identified as the substrate ID and the extraction condition (such as the manufacturing process and the manufacturing apparatus to be investigated). Information) may be stored in association with each other.

  Further, the output control unit 16 may display the second defect candidate regions of a plurality of substrates in an overlapping manner. For example, FIG. 6 is a diagram showing a distribution of second defect candidate regions displayed by superimposing the second defect candidate regions specified in the plurality of substrates SB1 to SB6 on one substrate (inspection region). From the distribution (defect map) of the second defect candidate area, the user can recognize in which position (divided area) a defect caused by the first manufacturing apparatus a1 may occur. Thereby, it is possible to easily identify the cause of the occurrence of the abnormality. Further, the output control unit 16 displays the number of defects (vertical axis) included in the divided area in a processing order (horizontal axis) of a plurality of substrates in a graph for a certain divided area where the second defect candidate area appears. May be. The output control unit 16 can present the obtained information of the second defect candidate area to the user in an arbitrary format, and can contribute to the cause identification.

  According to the defect determination apparatus 10 of the present embodiment, a defect candidate (second defect candidate area) caused by a specific manufacturing apparatus can be identified from among many defects generated on a plurality of substrates. Thereby, it can be determined whether abnormality has arisen in the specific manufacturing apparatus. Moreover, since the result (distribution of 2nd defect candidate area | region) which excluded the defect used as noise can be obtained, the cause specification of abnormality generation can be made easy.

[Embodiment 2]
Another embodiment of the present invention will be described below. For convenience of explanation, members having the same functions as those described in the embodiment are given the same reference numerals, and descriptions thereof are omitted. The present embodiment is the same as the first embodiment up to the point where the second defect candidate area is specified. In the present embodiment, the second defect candidate area is evaluated.

  FIG. 7 is a block diagram illustrating a functional configuration of the defect determination apparatus 20 according to the present embodiment. The defect determination device 20 includes an input control unit 11, an inspection data acquisition unit 12, a sort processing unit 13, a first candidate specifying unit 14, a second candidate specifying unit 15, and an analysis unit 17 (second determination unit, third determination unit). And an output control unit 16.

  The analysis unit 17 determines whether or not the second defect candidate region appears simultaneously at a plurality of positions having a predetermined positional relationship in a specific comparison set. For example, the four second defect candidate regions (32b to 32e) in the substrates SB2 to SB4 (a set of three substrates compared) in FIG. 5B are at the positions of the vertices of a square. The analysis unit 17 determines whether or not there are a plurality of second defect candidate regions having such a positional relationship between the vertices of a predetermined square. The predetermined positional relationship may specify a pitch between two positions. For example, when the pressing member of the first manufacturing apparatus a1 presses and fixes or conveys the four places on the substrate, it is conceivable that a defect occurs at the four places at the same time due to foreign matters attached to the pressing member. The predetermined positional relationship can be set by the user based on the configuration of the first manufacturing apparatus a1 and past cases. The analysis unit 17 outputs the determination result to the output control unit 16.

  The output control unit 16 causes the output device 5 to display the determination result. The output control unit 16 displays on the output device 5 that an abnormality has occurred in the manufacturing apparatus when the second defect candidate region appears simultaneously at a plurality of positions having a predetermined positional relationship in a specific comparison set. By doing so, the user is notified. The notification of abnormality may be performed by voice or alarm sound, as in the above-described embodiment. As described above, for each manufacturing apparatus, whether or not an abnormality has occurred in the manufacturing apparatus by periodically determining whether or not the second defect candidate region exists simultaneously at a plurality of positions having a predetermined positional relationship. Can be easily determined.

(Modification)
When the analysis unit 17 views a plurality of comparison sets in the processing order, the second defect candidate regions at a plurality of positions are synchronized with each other in some of the plurality of comparison sets viewed in the processing order. It may be determined whether or not they appear (simultaneously in the same comparison pair). The analysis unit 17 outputs the determination result to the output control unit 16.

  FIG. 8 is a graph showing the change in the number of defects over time for five divided regions corresponding to the second defect candidate regions (32b to 32f) in the defect map shown in FIG. The vertical axis represents the number of defects generated in the divided area. The horizontal axis represents the time when the first manufacturing apparatus a1 performs processing, that is, the substrates arranged in the processing order. FIG. 8 shows a divided area of coordinates (3, 3), a divided area of coordinates (3, 8), a divided area of coordinates (8, 3), a divided area of coordinates (8, 8), and a coordinate (7, The time variation of the number of defects is shown for the divided region 5). A range (divided region) in which defects are continuously generated over a plurality of (three or more) substrates corresponds to the second defect candidate region determined in the comparison group. In the graph of FIG. 8, a thin bar corresponds to one substrate, and a thick block corresponds to a plurality of substrates included in the comparison set.

  Referring to FIG. 8, for the four divided regions at coordinates (3, 3), (3, 8), (8, 3), (8, 8), the continuous defect 33 (second defect candidate region) is It can be seen that they appear synchronously (simultaneously in the same set of comparisons). When continuous defects (second defect candidate regions) at a plurality of positions appear in synchronization with a plurality of comparison sets, the second defect candidate regions are caused by the first manufacturing apparatus a1 to be investigated. Probability is high. Note that the analysis unit 17 may determine whether or not consecutive defects at a plurality of positions appear in a plurality of sets of comparisons synchronously with a certain period. Further, the plurality of positions may be positions having a predetermined positional relationship as described above.

  The output control unit 16 causes the output device 5 to display the determination result. The second defect candidate areas of coordinates (3, 3), (3, 8), (8, 3), (8, 8) appearing at the same timing are located at the vertices of the rectangle. From this, the user can guess the cause of abnormality of the 1st manufacturing apparatus a1.

[Embodiment 3]
Still another embodiment of the present invention will be described below. For convenience of explanation, members having the same functions as those described in the embodiment are given the same reference numerals, and descriptions thereof are omitted. The present embodiment is the same as the first embodiment up to the point where the second defect candidate area is specified. Further, the functional configuration of the defect determination apparatus 20 of the present embodiment is the same as that of the second embodiment.

  In this embodiment, when the analysis unit 17 looks at the second defect candidate region for each set of substrates that have been compared in the processing order of the first manufacturing apparatus a1 to be investigated, the analysis unit 17 has a predetermined period in the same divided region. It is determined whether or not a second defect candidate region appears. The predetermined period may be set by the user together with the extraction condition, or may be set in advance. Any constant period can be set as the predetermined period.

  For example, the coordinates (3, 3), (3, 8), (8, 3) shown in FIG. ), (8, 8), when the continuous defect (second defect candidate region) appears in a predetermined cycle, the analysis unit 17 generates the second defect candidate region that appears in a predetermined cycle. Judge that there is.

  In the manufacturing process, some parts (printing plates, etc.) of the manufacturing apparatus may be exchanged at a constant cycle. For example, there are cases where two printing plates are used alternately every certain period. In such a case, a defect may be generated (increased) on the substrate in synchronization with the timing at which the parts are replaced. Therefore, if the period for exchanging the parts is set as a predetermined period, it is possible to easily detect the occurrence of a defect due to the exchange of the parts of the manufacturing apparatus. Similarly, it is considered that the second defect candidate region that occurs at the same position in a certain cycle is caused by the manufacturing apparatus for some reason. Thus, it is considered that the defect that appears at the same position in a predetermined cycle is likely to be caused by the manufacturing apparatus. The analysis unit 17 outputs the determination result to the output control unit 16.

  The output control unit 16 displays the determination result on the output device 5 as in the second embodiment. Further, the output control unit 16 causes the output device 5 to display a cycle in which periodic continuous defects appear. The user can infer the cause of the abnormality of the first manufacturing apparatus a1 based on the period in which the continuous defects appear.

  In addition, when there is a second defect candidate region that appears at a predetermined cycle, the output control unit 16 causes the output device 5 to display that an abnormality has occurred in the target manufacturing apparatus. In this way, it is possible to easily determine whether or not an abnormality has occurred in the manufacturing apparatus by periodically determining whether or not there is a second defect candidate area that appears at the same position for each manufacturing apparatus. can do.

[Example of software implementation]
Control blocks (in particular, input control unit 11, inspection data acquisition unit 12, sort processing unit 13, first candidate identification unit 14, second candidate identification unit 15, analysis unit 17, and output control unit 16 of defect determination apparatuses 10 and 20 ) May be realized by a logic circuit (hardware) formed in an integrated circuit (IC chip) or the like, or may be realized by software using a CPU (Central Processing Unit).

  In the latter case, the defect determination apparatuses 10 and 20 include a CPU that executes instructions of a program that is software that realizes each function, and a ROM (Read Only) in which the program and various data are recorded so as to be readable by a computer (or CPU). Memory) or a storage device (these are referred to as “recording media”), a RAM (Random Access Memory) for expanding the program, and the like. And the objective of this invention is achieved when a computer (or CPU) reads the said program from the said recording medium and runs it. As the recording medium, a “non-temporary tangible medium” such as a tape, a disk, a card, a semiconductor memory, a programmable logic circuit, or the like can be used. The program may be supplied to the computer via an arbitrary transmission medium (such as a communication network or a broadcast wave) that can transmit the program. The present invention can also be realized in the form of a data signal embedded in a carrier wave in which the program is embodied by electronic transmission.

[Summary]
The defect determination apparatus according to the first aspect of the present invention performs one or more manufacturing processes on a workpiece by using one or more manufacturing apparatuses capable of executing the manufacturing processes, and after the manufacturing processes. A defect determination apparatus applicable to a production line that executes an inspection process using one or more inspection apparatuses that detect defects on the workpiece, and is processed by a specific manufacturing apparatus in a specific manufacturing process. For a plurality of the workpieces, defect information acquisition means (inspection data acquisition unit 12) that acquires defect information including information on the position of the defect in each workpiece detected in the inspection step, and a predetermined plurality of inspection areas in the workpiece. Inspection area dividing means (first candidate specifying unit 14) for dividing the divided area into a plurality of divided areas, and the number of defects equal to or greater than a first threshold among the divided areas in each work is included in the divided areas The defect area is compared between the defect area setting means (first candidate specifying unit 14) to be set as the defect area and the set of A pieces of workpieces successively processed by the specific manufacturing apparatus in the specific manufacturing process. First, the position of the divided region where the defect region is included in the B or more workpieces (where 2 ≦ B ≦ A) among the A workpieces compared is determined as the position where the specific defect exists in the comparison set. 1 determination means (2nd candidate specific | specification part 15).

  According to the above configuration, based on the relationship between the plurality of workpieces continuously processed in the specific manufacturing apparatus and the frequency of occurrence of defects in the specific divided area, the position of the divided area where the defect area is frequently generated Is determined as the position of the specific defect in the comparison set. Here, the plurality of divided areas are common to a plurality of workpieces. Defects not caused by a specific manufacturing apparatus are considered to have a small relevance of occurrence positions in a plurality of workpieces processed in succession. On the other hand, a defect caused by a specific manufacturing apparatus is considered to have a large relevance between occurrence positions in a plurality of workpieces processed in succession. Therefore, there is a high possibility that the specific defect corresponds to a defect caused by a specific manufacturing apparatus. Therefore, the defect resulting from a specific manufacturing apparatus can be determined.

  The defect determination apparatus according to Aspect 2 of the present invention is the defect determination apparatus according to Aspect 1, wherein the first determination means is configured such that the workpieces included in each set of comparisons are in the order of processing of the specific manufacturing apparatus in the specific manufacturing process. A configuration may be adopted in which a plurality of comparison sets are set so as to be shifted by a number, and the position of the specific defect is determined for each of the plurality of comparison sets.

  The defect determination apparatus according to aspect 3 of the present invention is the defect determination apparatus according to aspect 2 described above, in the above-described aspect 2, when the specific defect for each set of comparisons is viewed in the processing order of the specific manufacturing apparatus in the specific manufacturing process. The structure provided with the 2nd determination means which determines whether a specific defect appears in a predetermined period may be sufficient.

  According to said structure, it can be determined whether there exists the specific defect which appears in a predetermined period in the same position. If a defect at the same position appears in a predetermined cycle, it can be estimated that there is a cause in the manufacturing apparatus. Therefore, it can be determined whether or not a specific defect has occurred in a predetermined cycle due to the manufacturing apparatus.

  The defect determination apparatus according to aspect 4 of the present invention is the defect determination apparatus according to aspects 1 to 3, in which the specific defect exists simultaneously at the first position and the second position that are in a predetermined positional relationship with each other in the comparison set. It may be configured to include third determination means for determining whether or not.

  When the above occurs in the manufacturing apparatus, it is conceivable that defects are simultaneously generated at a plurality of positions having a predetermined positional relationship. When the positions of the plurality of specific defects (the first position and the second position) are in a predetermined positional relationship, the plurality of specific defects are considered to be caused by the manufacturing apparatus. According to said structure, it can be determined whether the specific defect which has a predetermined positional relationship resulting from the manufacturing apparatus generate | occur | produced.

  If the appearance frequency of the said specific defect is more than a 2nd threshold value in the said aspect 1 to 4, the defect determination apparatus which concerns on aspect 5 of this invention is a user that abnormality has arisen in the said specific manufacturing apparatus. The structure provided with the alerting | reporting means (output control part 16) to alert | report may be sufficient.

  The specific defect is one in which a defect (noise) not caused by a specific manufacturing apparatus is eliminated. Therefore, when the frequency of occurrence of specific defects is high, it is considered that an abnormality has occurred in a specific manufacturing apparatus. According to said structure, it can alert | report to a user that abnormality has arisen in the manufacturing apparatus based on the appearance frequency of a specific defect.

  The defect determination apparatus according to Aspect 6 of the present invention is the defect determination apparatus according to Aspect 4, when the specific defect exists simultaneously at the first position and the second position in the comparison set. A configuration may be provided that includes notification means for notifying the user that the error has occurred.

  In the comparison set, when a specific defect is present at the first position and the second position in a predetermined positional relationship at the same time, the specific defect is caused by the specific manufacturing apparatus. Conceivable. Therefore, it is considered that an abnormality has occurred in the specific manufacturing apparatus.

  The defect determination apparatus according to aspect 7 of the present invention is the defect determination apparatus according to aspect 3 described above, in the above-described aspect 3, when the specific defect for each pair of comparisons is viewed in the processing order of the specific manufacturing apparatus in the specific manufacturing process. When the specific defect appears in a predetermined cycle, a configuration may be provided that includes notification means for notifying the user that an abnormality has occurred in the manufacturing apparatus.

  When the specific defect appears in the same position at a predetermined period when the specific defect for each set of comparisons is viewed in the processing order of the specific manufacturing apparatus, the specific defect is caused by the specific manufacturing apparatus. This is thought to have occurred. Therefore, it is considered that an abnormality has occurred in the specific manufacturing apparatus.

  In the defect determination device according to aspect 8 of the present invention, A = B in the above aspects 1 to 7.

  According to said structure, a 1st determination means is a case where a defect area | region is contained in the same division area over the said A piece of workpiece | work processed continuously with the said specific manufacturing apparatus in the said specific manufacturing process. Then, the position of the divided area including the defect area is determined as the position where the specific defect exists in the comparison set. When a defect appears at the same position in a plurality of workpieces that are consecutive in the order of processing in a specific manufacturing apparatus, the defect is likely to be caused by the manufacturing apparatus. Therefore, the defect resulting from a specific manufacturing apparatus can be determined.

  In the defect determination device according to Aspect 9 of the present invention, B ≧ 3 in Aspect 8 above.

  According to the above configuration, when there is a defect area in the divided area at the same position continuously in at least three workpieces, the divided area at the position is determined as the specific defect in the comparison group. Therefore, a case in which a defect occurs in a divided region at the same position in the preceding and succeeding workpieces can be excluded from the specific defect. Therefore, it is possible to easily identify the cause of the abnormality by reducing the noise included in the specific defect.

  In the defect determination device according to aspect 10 of the present invention, in the above aspects 1 to 7, when A is an even number, B> A / 2, and when A is an odd number, B> (A + 1) / 2 Good.

  According to the above configuration, (a) a defect area exists in a divided area at the same position in more than half of A continuous works, and (b) division of the position at least once among them. The presence of a defect area continuously in the area is a condition for determining as a specific defect. Therefore, a defect (noise) not caused by a specific manufacturing apparatus can be excluded from the specific defect.

  In the defect determination method according to aspect 11 of the present invention, one or more manufacturing steps are performed on a workpiece using one or more manufacturing apparatuses capable of executing the manufacturing steps, respectively, and after the manufacturing steps are performed. A defect determination method applicable to a production line in which an inspection process is performed using one or more inspection apparatuses that detect defects on the workpiece, and is processed by a specific manufacturing apparatus in a specific manufacturing process. A defect information acquisition step for acquiring defect information including information on the position of a defect in each workpiece detected in the inspection process for a plurality of the workpieces, and an inspection for dividing the inspection area of the workpiece into a plurality of predetermined divided areas An area division step, and a defect area setting for setting, as a defect area, a defect including a number of defects equal to or greater than a first threshold among the divided areas in each workpiece. The defect region is compared in the set of the A workpieces that are continuously processed by the specific manufacturing apparatus in the specific manufacturing process, and B or more of the B workpieces in the A workpieces that are compared. And a first determination step of determining the position of the divided area where the defect area is included in the workpiece (where 2 ≦ B ≦ A) as the position of the specific defect in the comparison set.

  In the defect determination method according to aspect 12 of the present invention, in the aspect 11, in the first determination step, the workpieces included in each comparison set are processed in the order of processing of the specific manufacturing apparatus in the specific manufacturing process. A configuration may be employed in which a plurality of the comparison sets are set so as to be shifted by a fixed number, and the existence position of the specific defect is determined for each of the plurality of comparison sets.

  The defect determination method according to the aspect 13 of the present invention is the defect determination method according to the aspect 12 described above, in the same position when the specific defect for each group of the comparison is viewed in the processing order of the specific manufacturing apparatus in the specific manufacturing process. A second determination step for determining whether or not the specific defect appears in a predetermined cycle is included.

  In the defect determination method according to aspect 14 of the present invention, in the aspects 11 to 13, the specific defect exists simultaneously at the first position and the second position that are in a predetermined positional relationship with each other in the comparison set. It may be configured to include a third determination step for determining whether or not.

  The defect determination apparatus according to each aspect of the present invention may be realized by a computer. In this case, the defect determination apparatus is realized by a computer by operating the computer as each unit included in the defect determination apparatus. A control program for the defect determination device and a computer-readable recording medium on which the control program is recorded also fall within the scope of the present invention.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention. Furthermore, a new technical feature can be formed by combining the technical means disclosed in each embodiment.

  INDUSTRIAL APPLICABILITY The present invention can be used for a defect determination apparatus that identifies a defect candidate caused by a manufacturing apparatus in a manufacturing system.

1 Production system (production line)
2 Manufacturing Process Information Database 3 Inspection Process Information Database 4 Input Device 5 Output Device 10/20 Defect Determination Device 11 Input Control Unit 12 Inspection Data Acquisition Unit (Defect Information Acquisition Unit)
13 Sort processing unit 14 First candidate specifying unit (inspection area dividing means, defect area setting means)
15 2nd candidate specific part (1st determination means)
16 Output control unit (notification means)
17 Analysis unit (second determination means, third determination means)
30 Inspection area 31 Divided areas 32, 32a to 32g First defect candidate areas SB1 to SB6 Substrate (workpiece)
a1, a2, a3 First manufacturing apparatus b1, b2, b3 Second manufacturing apparatus c1, c2, c3 First inspection apparatus d1, d2, d3 Third manufacturing apparatus e1, e2, e3 Second inspection apparatus

Claims (10)

One or more manufacturing processes are performed on the workpiece using one or more manufacturing apparatuses capable of executing the manufacturing processes, and the inspection process after the manufacturing process is detected for defects on the workpiece. A defect determination apparatus applicable to a production line that is executed using one or more inspection apparatuses to perform,
For a plurality of workpieces processed by a specific manufacturing apparatus in a specific manufacturing process, defect information acquisition means for acquiring defect information including information on the position of the defect in each workpiece detected in the inspection process;
Inspection area dividing means for dividing the inspection area of the workpiece into a plurality of predetermined divided areas;
A defect area setting means for setting, as a defect area, a defect having a number of defects equal to or greater than a threshold value among the respective divided areas in each workpiece;
In the set of A workpieces successively processed by the specific manufacturing apparatus in the specific manufacturing process, the defect areas are compared, and in the A workpieces compared, B or more workpieces (however, A defect determination apparatus comprising: first determination means for determining a position of a divided area including a defect area in 2 ≦ B ≦ A) as a position of a specific defect in the comparison set. The first determination means includes
A plurality of sets of comparisons are set so that the workpieces included in each set of comparisons are shifted by a certain number in the processing order of the specific manufacturing apparatus in the specific manufacturing process;
The defect determination apparatus according to claim 1, wherein the position of the specific defect is determined for each of the plurality of comparison sets.   A second method for determining whether or not the specific defect appears at the same position in a predetermined cycle when the specific defect for each set of comparisons is viewed in the processing order of the specific manufacturing apparatus in the specific manufacturing process. The defect determination apparatus according to claim 2, further comprising a determination unit.   The third comparison means further comprises third determination means for determining whether or not the specific defect exists simultaneously at a first position and a second position that are in a predetermined positional relationship with each other. The defect determination apparatus according to any one of 1 to 3.   The defect determination apparatus according to claim 1, wherein A = B.   The defect determination apparatus according to claim 5, wherein B ≧ 3. Each of the one or more manufacturing processes for the workpiece is performed using one or more manufacturing apparatuses capable of executing the manufacturing process, and the inspection process after the manufacturing process is detected for defects in the workpiece. A defect determination method applicable to a production line that is executed using one or more inspection apparatuses that perform
For a plurality of workpieces processed by a specific manufacturing apparatus in a specific manufacturing process, a defect information acquisition step for acquiring defect information including information on the position of the defect in each workpiece detected in the inspection process;
An inspection area dividing step of dividing the inspection area of the workpiece into a plurality of predetermined divided areas;
A defect area setting step for setting, as a defect area, a defect having a number of defects equal to or greater than a threshold value among the respective divided areas in each workpiece;
In the set of A workpieces successively processed by the specific manufacturing apparatus in the specific manufacturing process, the defect areas are compared, and in the A workpieces compared, B or more workpieces (however, And a first determination step of determining a position of a divided area in which the defect area is included in 2 ≦ B ≦ A) as a position where the specific defect exists in the comparison set. In the first determination step,
A plurality of sets of comparisons are set so that the workpieces included in each set of comparisons are shifted by a certain number in the processing order of the specific manufacturing apparatus in the specific manufacturing process;
The defect determination method according to claim 7, wherein the presence position of the specific defect is determined for each of the plurality of comparison sets.   A second method for determining whether or not the specific defect appears at the same position in a predetermined cycle when the specific defect for each set of comparisons is viewed in the processing order of the specific manufacturing apparatus in the specific manufacturing process. The defect determination method according to claim 8, further comprising a determination step.   3. The method according to claim 1, further comprising a third determination step of determining whether or not the specific defect exists simultaneously at a first position and a second position that are in a predetermined positional relationship with each other in the comparison set. The defect determination method according to any one of 7 to 9.

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