JP2015034948A - Display device and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display device in which contrast can be improved.SOLUTION: The display device includes: a plurality of light emitting sections; a light absorbing section that surrounds each of the light emitting sections; and a low-reflection layer that is provided on the surfaces of both of the light emitting sections and the light absorbing section. The surface of the light absorbing section is a recessed and projected surface that diffuses light, and the low-reflection layer is provided conforming to the recessed and projected surface.

Description

  The present technology relates to a display device and an electronic apparatus. Specifically, the present invention relates to a display device and an electronic device having an antireflection function.

  Conventionally, the outermost surface of a display device is generally a flat surface made of a single component of a glass layer or a transparent resin layer. However, in recent years, a display device in which the outermost surface is constituted by an uneven surface (step surface) made of a plurality of constituent materials has also been proposed. For example, in Patent Documents 1 and 2, the outermost surface of the display device is configured by repeatedly arranging unit structures composed of LED (Light Emitting Diode) sealing portions and the surrounding black portions. For this reason, the surface of an LED sealing part and a black part is not located in the same height, but the surface of a display apparatus becomes an uneven surface which has a level difference. In addition, the LED sealing portion or the black portion may have an uneven surface instead of a flat surface.

  At the boundary surface between the outermost surface of the display device and air, external light reflection having a reflectance (Fresnel's reflection law) corresponding to the difference in refractive index between the two occurs, so that the contrast in the bright place is lowered. Therefore, a technique that suppresses external light reflection and improves contrast in a bright place is also desired for a display device having an uneven surface on the outermost surface as described above.

JP 2003-173149 A

JP 2009-076949 A1

  Therefore, an object of the present technology is to provide a display device and an electronic apparatus that can improve contrast.

In order to solve the above-mentioned problem, the first technique is:
A plurality of light emitting units;
A light absorbing portion surrounding each of the plurality of light emitting portions;
A low reflection layer provided on both surfaces of the light emitting part and the light absorbing part,
The surface of the light absorbing portion is an uneven surface that diffuses light,
The low reflection layer is a display device provided so as to follow the uneven surface.

The second technology is
A plurality of display cells arranged two-dimensionally;
The display cell is
Including a plurality of light emitting units, a light absorbing unit surrounding each of the plurality of light emitting units, and a low reflection layer provided on both surfaces of the light emitting unit and the light absorbing unit,
The surface of the light absorbing portion is an uneven surface that diffuses light,
The low reflection layer is a display device provided so as to follow the uneven surface.

The third technology is
A display device including a plurality of light emitting units, a light absorbing unit surrounding each of the plurality of light emitting units, and a low reflection layer provided on both surfaces of the light emitting unit and the light absorbing unit,
The surface of the light absorbing portion is an uneven surface that diffuses light,
The low reflection layer is an electronic device provided to follow the uneven surface.

  As described above, according to the present technology, the contrast of the display device can be improved.

FIG. 1A is a perspective view illustrating an example of an appearance of a display device according to the first embodiment of the present technology. 1B is a cross-sectional view taken along the line II of FIG. 1A. FIG. 2 is an enlarged cross-sectional view of a part of FIG. 1B. FIG. 3 is a perspective view illustrating an example of the configuration of the large screen display device according to the first embodiment of the present technology. FIG. 4A is a schematic diagram for explaining the operation of a large screen display device as a comparative example. FIG. 4B is a schematic diagram for explaining the operation of the large screen display device according to the first embodiment of the present technology. FIG. 5 is a schematic diagram illustrating a configuration of a display device as a comparative example. 6A to 6D are process diagrams for explaining an example of the method for manufacturing the display device according to the first embodiment of the present technology. 7A and 7B are process diagrams for explaining an example of the method for manufacturing the display device according to the first embodiment of the present technology. FIG. 8 is a cross-sectional view of an example of a configuration of a display device according to the second embodiment of the present technology. 9A to 9C are process diagrams for explaining an example of a method for manufacturing a display device according to the second embodiment of the present technology. FIG. 10A is an external view illustrating an example of a television device as an electronic apparatus. FIG. 10B is an external view illustrating an example of a notebook personal computer as an electronic apparatus. FIG. 11A is a diagram illustrating measurement conditions of the reflection spectrum of the sample of Reference Example 1. FIG. 11B is a diagram showing the evaluation result of the reflection spectrum of the sample of Reference Example 1. FIG. 12A is a diagram showing measurement conditions for the angle dependence of the reflected light intensity of the sample of Reference Example 4. 12B is a diagram illustrating an evaluation result of the angle dependency of the reflected light intensity of the sample of Reference Example 4. FIG. FIG. 13A is a cross-sectional view illustrating an example of a configuration of a display device according to a third embodiment of the present technology. 13B to 13D are cross-sectional views illustrating a configuration example of a display device according to a modification of the third embodiment of the present technology. 14A to 14C are cross-sectional views illustrating configuration examples of display devices according to modifications of the third embodiment of the present technology. FIG. 15A is a diagram illustrating an FFP when no diffusion layer is provided. FIG. 15B is a diagram illustrating an FFP in the case where a diffusion layer is provided. FIG. 16A is a diagram illustrating transmission and scattering characteristics when parallel light is perpendicularly incident on a diffusion layer. FIG. 16B is a diagram illustrating transmission and scattering characteristics when parallel light is obliquely incident on the diffusion layer. FIG. 17 is a diagram showing the relationship of the light distribution variation before and after passing through the light diffusion layer having a certain fine particle concentration. FIG. 18A is a diagram illustrating an FFP when no diffusion layer is provided. FIG. 18B is a diagram illustrating the FFP when a diffusion layer is provided.

Embodiments of the present technology will be described in the following order with reference to the drawings.
1 First Embodiment (First Example of Display Device)
1.1 Configuration of Display Device 1.2 Configuration of Large Screen Display Device 1.3 Action of Display Device 1.4 Manufacturing Method of Display Device Second Embodiment (Second Example of Display Device)
2.1 Configuration of display device 2.2 Manufacturing method of display device Third Embodiment (Third Example of Display Device)
3.1 Overview 3.2 Configuration of Display Device 3.3 Light Diffusion Layer Film Forming Method 3.4 Effects 3.5 Modification 4 Fourth Embodiment (Example of Electronic Device)

<1 First Embodiment>
[1.1 Configuration of display device]
As shown in FIGS. 1A and 1B, a display device 10 according to the first embodiment of the present technology includes a circuit board 11, a light absorbing unit 12 and a plurality of light emitting units 13 provided on the surface of the circuit board 11. Is provided. The display device 10 is a so-called LED (Light Emitting Diode) display device, and has a rectangular display surface 10s through which a user visually recognizes a display image. In this specification, two directions orthogonal to each other in the in-plane direction of the display surface 10s are referred to as an “x-axis direction” and a “y-axis direction”, respectively, and are perpendicular to the display surface 10s (ie, the thickness of the display device 10). Direction) is referred to as “z-axis direction”. Of the two main surfaces of the display device 10 or the members constituting the display device, the main surface on the side where the display image is visually recognized by the user is referred to as “front surface”, and the main surface on the opposite side is referred to as “back”. It is called “face”.

  The display surface 10 s is configured by the surfaces of the light absorbing unit 12 and the plurality of light emitting units 13. Since the light absorbing portion 12 and the light emitting portion 13 have a step in the z-axis direction, the display surface 10s is an uneven surface.

(Light absorption part)
The light absorption part (light absorption layer) 12 is a black layer (so-called black matrix) having a plurality of openings 12a. The plurality of openings 12a are two-dimensionally arranged on the surface of the circuit board 11 in the x-axis direction and the y-axis direction at regular intervals. The surface of the light emitting unit 13 is exposed through the opening 12a. Examples of the shape of the opening 12a include, but are not limited to, a polygonal shape such as a rectangular shape and a diamond shape, and a circular shape. 1A shows an example in which the opening 12a is rectangular.

  As shown in FIG. 2, the surface of the light absorbing portion 12 is provided with a fine uneven surface 12s that diffuses light. The fine uneven surface 12 s is configured by projecting the surface of a plurality of fine particles from the surface of the light absorbing portion 12, or formed by transferring the shape of the fine uneven shape to the surface of the light absorbing portion 12. In addition, you may use combining these both structures.

  The average particle diameter of the fine particles is, for example, in the range of 4 to 20 μm. As the fine particles, at least one of inorganic fine particles and organic fine particles can be used. As organic fine particles, for example, those containing urethane, acrylic (PMMA), polystyrene (PS), acrylic-styrene copolymer, melamine, polycarbonate (PC) and the like can be used. As the inorganic fine particles, for example, those containing silicon oxide, titanium oxide, aluminum oxide, zinc oxide, tin oxide, calcium carbonate, barium sulfate, talc, kaolin, calcium sulfate and the like can be used.

(Light emitting part)
As shown in FIG. 2, the light emitting unit 13 includes a light emitting element 31 and a sealing unit 32 and constitutes a pixel of the display device 10. As the light emitting element 31, for example, a single color LED, a red (R) and green (G) two color LED, and a red (R), green (G) and blue (B) three color LED are used. When the display device 10 is a full-color display device, a three-color LED is used as the light emitting unit 13.

  The plurality of light emitting units 13 are two-dimensionally arranged on the surface of the circuit board 11 in the x-axis direction and the y-axis direction at regular intervals. The periphery of each of the plurality of light emitting units 13 arranged in this manner is surrounded by the light absorbing unit 12. The light emitting element 31 is preferably provided in the opening 12a. More specifically, it is preferable that the light emitting element 31 is provided at substantially the same height as the back surface of the light absorbing portion 12 or at a position higher than the back surface when viewed from the direction perpendicular to the display surface 10s. . Thereby, compared with the case where the light emitting element 31 is provided in the position deeper than the back surface of the light absorption part 12, the opening 12a can be made small. Therefore, since the aperture ratio can be reduced, the bright place contrast can be improved. In addition, as compared with the case where the light emitting element 31 is provided at a position deeper than the back surface of the light absorbing portion 12, highly accurate alignment is not required. Therefore, since the allowable range of alignment errors can be expanded, the yield can be improved.

  The sealing unit 32 seals the light emitting element 31 by covering the light emitting element 31 provided on the surface of the circuit board 11. The sealing part 32 is made of, for example, a transparent resin material or a substantially transparent resin material that diffuses and transmits light.

  Examples of the shape of the upper surface of the sealing portion 32 (that is, the surface constituting the display surface 10s) include a flat surface, a curved surface, and an uneven surface. Examples of the curved surface include a curved surface that is convex or concave with respect to the front surface of the circuit board 11, and among these curved surfaces, a convex curved surface is preferable. This is because the viewing angle can be improved by spreading the light emitted from the light emitting element 31 in the wide angle direction. Examples of the convex curved surface include a partial spherical shape, a dome shape, and a free curved surface shape. Here, the partial spherical shape is a shape obtained by cutting out a part of a sphere. The partial spherical shape is defined to include substantially the partial spherical shape. The substantially partial spherical shape is a shape obtained by slightly distorting the partial spherical shape within a range that does not cause a significant decrease in optical characteristics.

(Low reflective layer)
As shown in FIG. 2, a low reflection layer 14 a and a low reflection layer 14 b are provided on the surfaces of the light absorption unit 12 and the sealing unit 32, respectively. The low reflection layer 14 a is provided so as to follow the fine uneven surface 12 s of the light absorbing portion 12. The low reflection layer 14 b is provided so as to follow the upper surface of the sealing portion 32. Thereby, external light reflection by the sealing part 32 and the light absorption part 12 is reduced.

  The low reflection layers 14a and 14b preferably contain a low refractive index material having a refractive index n of 1.5 or less as a main component. This is because the refractive index of the low reflection layers 14 a and 14 b can be set to an intermediate refractive index between the refractive index of air and the refractive indexes of the sealing portion 32 and the light absorbing portion 12. Examples of the low refractive index material that can be used include fluororesins, porous particles such as porous silica particles (porous silica particles), and hollow particles such as hollow silica particles. These materials may be used alone or in combination of two or more. Here, the porous particles and the hollow particles are nanoparticles having a particle diameter equal to or smaller than the wavelength of light. From the viewpoint of improving the drip-proof property, antifouling property and fingerprint wiping property, it is preferable to use a fluorine-based resin as the low refractive index material.

  As the low reflection layers 14a and 14b, a first layer containing porous particles and having a film thickness of λ / (4 · n), a fluorine-containing resin, and a film thickness that is an order of magnitude smaller than the wavelength of light. You may employ | adopt what laminated | stacked the 2nd layer which has (for example, about 10 nm). In this case, the second layer is the outermost layer side. By adopting the low reflection layers 14a and 14b having such a configuration, it is possible to reduce the reflectance and to provide effects other than the optical characteristics such as drip-proofing property, antifouling property and fingerprint wiping property.

  The low reflection layers 14a and 14b are preferably low reflection coating layers produced by a wet process. This is because by producing the low reflection layers 14a and 14b by a wet process, the cost of raw materials and equipment can be reduced compared to the case of producing by a dry process such as sputtering.

  The low reflection layers 14a and 14b are, for example, a fluorine-containing low reflection layer, a porous low reflection layer, or a fluorine-containing porous low reflection layer. The fluorine-containing low reflection layer is a low reflection layer containing a fluororesin. The porous low reflection layer is a low reflection layer having a porous structure, and includes at least one of porous particles such as porous silica particles and hollow particles such as hollow silica particles. The fluorine-containing porous low reflection layer is a low reflection layer containing a fluororesin and having a porous structure made of porous particles or the like.

  From the viewpoint of forming the low reflection layers 14a and 14b having excellent uniformity by a wet process, the thickness of the low reflection layers 14a and 14b is preferably equal to or greater than the wavelength λ of incident light for the purpose of low reflection. On the other hand, from the viewpoint of reducing reflection of external light, the film thickness of the low reflection layers 14a and 14b is λ / (4 · n) (λ: wavelength of incident light for low reflection, n: low reflection layer 14a. 14b). Reflected light between the air and the low reflective layer 14a and between the low reflective layer 14a and the light absorbing portion 12 can be interfered with each other with a half wavelength (λ / 2 in the air) shifted. Optimal reflection reduction conditions are realized. In addition, the reflected light between the air and the low reflection layer 14b and between the low reflection layer 14b and the sealing portion 32 can be interfered with each other while being shifted by a half wavelength (λ / 2 in the air) and cancel each other as a whole. Thus, the optimum reflection reduction condition is realized. The wavelength band of light for the purpose of reducing reflection is the wavelength band of visible light. Here, the wavelength band of visible light means a wavelength band of 360 nm to 830 nm.

(Circuit board)
As shown in FIG. 2, the circuit board 11 includes a substrate 21, a wiring layer 22 provided on the surface of the substrate 21, a planarizing film 23 provided on the surface of the wiring layer 22, and a surface of the planarizing film 23. And a plurality of driving ICs (Integrated Circuits) 24 provided in.

  As the substrate 21, for example, a resin substrate or a glass substrate can be used. Examples of the resin substrate material include polycarbonate, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyethylene terephthalate, polyethylene naphthalate, methacrylic resin, nylon, polyacetal, fluorine resin, phenol resin, polyurethane, epoxy resin, polyimide resin, Examples thereof include polyamide resin, melamine resin, polyether ether ketone, polysulfone, polyether sulfone, polyphenylene sulfide, polyarylate, polyetherimide, polyamideimide, and methyl methacrylate (co) polymer. Examples of the glass substrate material include soda lime glass, lead glass, hard glass, quartz glass, liquid crystal glass, and glass epoxy.

  The wiring layer 22 includes wiring provided on the surface of the substrate 21. The driver IC 24 and a driver IC (not shown) are connected via this wiring. The drive IC 24 is controlled by a control signal from the driver IC. The planarization film 23 is a film for planarizing the surface of the substrate 21 provided with the wiring layer 22.

  The driving IC 24 is provided corresponding to the light emitting unit 13, and the driving IC 24 and the light emitting unit 13 form one set. The drive IC 24 is covered with the light absorption unit 12. The driving operation of the light emitting unit 13 is controlled by the driving IC 24.

[1.2 Large screen display device]
As illustrated in FIG. 3, the large screen display device 1 according to the first embodiment of the present technology includes a plurality of display devices (display cells) 10 according to the first embodiment described above. The large-screen display device 1 is a tiling display configured by two-dimensionally arranging a plurality of display devices 10 in a tile shape. Note that FIG. 3 shows an example in which the large screen display device 1 is configured by nine display devices 10, but the number of display devices 10 constituting the large screen display device 1 is not limited to this example. Instead, the large-screen display device 1 may be configured by several tens or hundreds of display devices 10.

[1.3 Operation of display surface of display device]
Hereinafter, the operation of the display surface 10s of the display device 10 having the above-described configuration will be described with reference to FIGS. 4A and 4B.

  FIG. 4A shows an example in which a large screen display device 201 is configured by a plurality of display devices 210 as a comparative example. As shown in FIG. 5, the display device 210 is a flat surface instead of the light absorbing portion (matte black layer) 12 having the fine uneven surface 12 s in the display device 10 according to the first embodiment (see FIG. 2). The light absorption part (glossy black layer) 212 having 212s is employed. That is, instead of the display surface 10 s constituted by the surfaces of the light absorbing portion 12 and the plurality of light emitting portions 13, the display surface 210 s constituted by the surfaces of the light absorbing portion 212 and the plurality of light emitting portions 13 may be adopted. On the other hand, FIG. 4B shows an example in which the large-screen display device 1 is configured by a plurality of display devices 10 according to the first embodiment of the present technology. As shown in FIG. 2, the display device 10 includes a light absorbing portion (matte black layer) 12 having a fine uneven surface 12 s.

  As shown in FIG. 4A, in the display device 210 as a comparative example, when the external light 53 from the light source 51 such as the sun is incident on the flat surface 212s of the light absorption unit 212, a part of the external light 53 is absorbed. Whereas the portion 12 is absorbed, the remainder is regularly reflected by the flat surface of the flat surface 212s.

  The display surface 201s of the large screen display device 201 is preferably a flat surface, but the display surface 201s may be slightly curved due to the arrangement accuracy when arranging the plurality of display devices 210. When there is such a curvature, a difference occurs in the direction of regular reflection by the flat surface 212 s of the light absorption unit 212 by each display device 210 constituting the large screen display device 201. When there is such a difference, the appearance of each display device 210 constituting the large screen display device 201 is felt differently by the user 52.

  On the other hand, as shown in FIG. 4B, in the display device 10 according to the first embodiment, when the external light 53 from the light source 51 such as the sun enters the fine uneven surface 12 s of the light absorbing unit 12, Is absorbed by the light absorbing portion 12, while the rest is diffusely reflected by the fine uneven surface 12 s of the light absorbing portion 12. Thereby, the reflected light in all directions has almost the same luminance. Therefore, even if the display surface 1 s is slightly curved, each display device 10 constituting the large screen display device 1 looks almost the same to the user 52.

[1.4 Manufacturing method of display device]
Hereinafter, an example of a method for manufacturing the display device according to the first embodiment of the present technology will be described with reference to FIGS. 6A to 6D, FIG. 7A, and FIG. 7B.

(Wiring layer formation process)
First, as shown in FIG. 6A, the wiring layer 22 is formed on the surface of the substrate 21.

(Platformation film formation process)
Next, as shown in FIG. 6B, a planarizing film 23 is formed on the surface of the wiring layer 22.

(Formation process of light emitting element and driving IC)
Next, as shown in FIG. 6C, a plurality of light emitting elements 31 and drive ICs 24 are formed at predetermined positions on the surface of the planarizing film 23.

(Light absorption part forming process)
Next, a matrix-like coating film made of a resin composition for forming a light absorbing portion is formed on the surface of the planarizing film 23 by, for example, a printing method. Examples of the printing method include inkjet printing, offset printing, and screen printing. The resin composition for forming the light absorbing portion is a resin composition containing black particles such as carbon black. This resin composition contains at least one selected from the group consisting of a natural curable resin composition, an energy ray curable resin composition, and a thermosetting resin composition.

  Here, the energy ray curable resin composition means a resin composition that can be cured by irradiation with energy rays. Energy rays are polymerization reactions of radicals such as electron beams, ultraviolet rays, infrared rays, laser beams, visible rays, ionizing radiation (X rays, α rays, β rays, γ rays, etc.), microwaves, high frequencies, cations, anions, etc. Shows energy lines that can trigger. As the energy ray curable resin composition, it is preferable to use an ultraviolet curable resin composition that is cured by ultraviolet rays. Moreover, a natural curable resin means the resin composition which can be hardened by natural drying.

  Next, when the resin composition for light absorption part formation contains a solvent, a solvent is volatilized by drying a coating film. When the resin composition for forming the light absorbing portion is a natural curable resin composition, the coating film is cured in this step, and the light absorbing portion 12 having a plurality of openings 12a is formed as shown in FIG. 6D. It is formed on the surface of the planarizing film 23.

  Next, when the resin composition for forming the low reflective layer contains at least one of an energy ray curable resin composition and a thermosetting resin composition, the coating film is subjected to energy ray irradiation or heat treatment. By applying, the coating film is cured. Thereby, as shown in FIG. 6D, the light absorbing portion 12 having a plurality of openings 12 a is formed on the surface of the planarizing film 23.

  As a method for forming the fine uneven surface 12s on the surface of the light absorbing portion 12, for example, a resin composition for forming the light absorbing portion is preliminarily contained with a plurality of fine particles, and a plurality of fine particles are formed from the surface of the light absorbing portion 12. Examples thereof include a method of projecting the surface of fine particles, a method of transferring irregularities to a resin composition for forming a light absorbing portion by molding, and a method of forming irregularities on the surface of the light absorbing portion 12 by sandblasting.

(Sealing part formation process)
Next, after applying a sealing material to the opening 12a, it is cured by energy beam irradiation or heat treatment. As a result, as shown in FIG. 7A, the sealing portion 32 is formed in the opening 12a. As a method for applying the sealing material, for example, ink jet printing, offset printing, screen printing, dispenser, jet dispenser, or the like can be used. As the material of the sealing material, one or more selected from the group consisting of an energy ray curable resin composition and a thermosetting resin composition can be used. From the viewpoint of heat resistance, silicone such as modified silicone can be used. Resins are preferred.

(Low reflection layer formation process)
Next, a coating film is formed by applying the resin composition for forming the low reflection layer substantially uniformly so as to follow the fine uneven surface 12 s of the light absorbing portion 12 and the upper surface of the sealing portion 32. As the coating method, spin coating, spray coating, slit coating, bar coating, dip coating, die coating, gravure coating, knife coating, resist coating, capillary coating, and the like can be used. When the spray coating method is used as the coating method, the resin composition can be applied by a non-contact method, and therefore, coating without film breakage that does not depend on the uneven shape of the display surface 10s is possible. Further, it is possible to reduce the scattering of the resin composition into the ambient air during application and to form the low reflection layers 14a and 14b having excellent film thickness uniformity. When the spray coating method is used as the coating method, a coating film can be formed on the surfaces of the light absorbing portion 12 and the sealing portion 32 at the same time.

  When the spray coating method is used as the coating method, a coating material is prepared by diluting the fluororesin to about 0.5% so that the coating thickness is about 20 μm in the wet (before drying) state. If applied, the film thickness after curing can be reduced to about 100 nm.

  The resin composition for forming a low reflection layer is a resin containing at least one selected from the group consisting of a fluorine-containing compound (hereinafter referred to as “fluorine-based compound”), a plurality of porous particles, and a plurality of hollow particles. It is a composition. This resin composition contains at least one selected from the group consisting of a natural curable resin composition, an energy ray curable resin composition, and a thermosetting resin composition.

  Next, when the resin composition contains a solvent, the solvent is volatilized by drying the coating film as necessary. When the resin composition for forming the low reflection layer is a natural curable resin composition, the coating film is cured in this step, and as shown in FIG. 7B, the surfaces of the light absorbing portion 12 and the sealing portion 32 The low reflection layers 14a and 14b are respectively formed.

Next, when the resin composition for forming the low reflective layer contains at least one of an energy ray curable resin composition and a thermosetting resin composition, the coating film is subjected to energy ray irradiation or heat treatment. By applying, the coating film is cured. As a result, as shown in FIG. 7B, the low reflection layers 14a and 14b are formed on the surfaces of the light absorbing portion 12 and the sealing portion 32, respectively.
Thus, the target display device 10 is obtained.

[effect]
In the first embodiment, since each of the light emitting units 13 is surrounded by the light absorbing unit 12, the contrast can be improved. Moreover, since the low reflection layer 14a is provided with respect to the fine uneven surface 12s of the light absorption part 12 of the display apparatus 10, the diffuse reflection of the external light in the fine uneven surface 12s can be reduced. Further, since the low reflection layer 14 b is provided on the upper surface of the light emitting unit 13 of the display device 10, reflection of external light on the upper surface of the light emitting unit 13 can be reduced.

  The light emitting element 31 is provided in the opening 12a, and the light emitting element 31 is sealed by the sealing portion 32 in the opening 12a. Therefore, since it is not necessary to form a sealing layer over the entire interface between the surface of the circuit board 11 and the light absorbing portion 12, the display device 10 can be thinned.

<2. Second Embodiment>
[2.1 Configuration of display device]
As illustrated in FIG. 8, the display device 70 according to the second embodiment of the present technology is different from the display device 10 according to the first embodiment in that the display device 70 includes a light absorption unit 41 having a two-layer structure. . The light absorption unit 41 includes a light absorption layer 42 having a flat surface 42s and a diffusion layer (shape layer) 43 provided on the flat surface 42s. Further, the upper surface of the sealing portion 32 may cover the periphery of the opening 12a.

  The light absorbing layer 42 is the same as the light absorbing unit 12 in the first embodiment except that the light absorbing layer 42 has a flat surface 42s instead of the fine uneven surface 12s.

  The diffusion layer 43 has a fine uneven surface 41s that diffuses light. The diffusion layer 43 includes a plurality of fine particles and a resin material. The fine uneven surface 41s is composed of a plurality of fine particles. More specifically, the fine concavo-convex surface is configured by projecting a part of the surface of the plurality of fine particles from the surface of the diffusion layer 43. The low reflection layer 14 is provided so as to follow the fine uneven surface 41 s of the diffusion layer 43 and the upper surface of the sealing portion 32. As the fine particles, the same fine particles as those included in the light absorbing portion 12 in the first embodiment can be used.

[2.3 Manufacturing method of display device]
In the method for manufacturing a display device according to the second embodiment of the present technology, the steps up to the step of forming the light absorption layer are the same as those in the first embodiment. Therefore, hereinafter, only the subsequent steps will be described with reference to FIGS. 9A to 9C.

(Sealing part formation process)
First, a sealing material is applied to the opening 12a. At this time, the sealing material is applied so that the upper surface of the sealing material covers the periphery of the opening 12a. Next, the applied sealing material is subjected to energy ray irradiation or heat treatment and cured. As a result, as shown in FIG. 9A, the sealing portion 32 is formed in the opening 12a.

(Diffusion layer formation process)
Next, a resin composition, a plurality of fine particles, and a solvent as necessary are mixed to prepare a coating material in which the fine particles are dispersed. At this time, additives such as a light stabilizer, an ultraviolet absorber, an antistatic agent, a flame retardant, and an antioxidant may be further added as necessary. The resin composition contains at least one of an energy ray curable resin composition and a thermosetting resin composition. Next, a matrix-like coating film made of the prepared paint is formed on the light absorption layer 42 by, for example, a printing method.

  Next, when the resin composition contains a solvent, the solvent is volatilized by drying the resin composition as necessary. The drying conditions are not particularly limited, and may be natural drying or artificial drying that adjusts the drying temperature, drying time, and the like. However, when wind is applied to the surface of the paint at the time of drying, it is preferable not to generate a wind pattern on the surface of the coating film. Further, the drying temperature and the drying time can be appropriately determined depending on the boiling point of the solvent contained in the paint. In that case, it is preferable to select the drying temperature and the drying time in a range in which the substrate 21 is not deformed by heat shrinkage in consideration of the heat resistance of the substrate 21.

  Next, the applied sealing material is subjected to energy ray irradiation or heat treatment and cured. Thereby, as shown in FIG. 9B, the diffusion layer 43 is formed on the flat surface 42 s of the light absorption layer 42.

(Low reflection layer formation process)
Next, the resin composition for forming the low reflection layer is applied almost uniformly so as to follow the fine uneven surface 41 s of the diffusion layer 43 and the upper surface of the sealing portion 32, thereby forming a coating film. Next, the coating film is cured by subjecting the coating film to energy beam irradiation or heat treatment. As a result, as shown in FIG. 9C, the low reflection layer 14 is formed following both the fine uneven surface 41 s of the diffusion layer 43 and the upper surface of the sealing portion 32.
Thus, the target display device 10 is obtained.

<3. Third Embodiment>
[3.1 Overview]
In a display device or a display panel, if the optical characteristics in the screen vary, the display becomes uneven. This is because microscopically, structural variations occur in each pixel unit in the process. It is difficult to avoid such variations. In particular, the problem of different light distribution characteristics for each pixel is one of serious problems. In order to make the inside of the screen appear uniform even when observed from all angles, the light distribution characteristics need to match with high precision in pixel units over the entire display screen. In the production of various types of display devices such as liquid crystal and organic EL, it is desired to achieve in-plane uniformity, but it is difficult to achieve complete uniformity not only in vertical observation but also in all observation angles. It is considered that the variation in optical characteristics is fundamentally due to the limitation of in-plane homogenization of materials and processes. There is a similar problem in LED display devices and the like in which millions of fine LEDs are arranged as individual pixel structures, and the cause is the variation in the light distribution characteristics of individual LEDs and the variation in their mounting processes. . In order to allow these process limits, a method of improving the yield of the display device by newly providing a light distribution control structure for stabilizing the light distribution in the panel structure is desired.

  In a display device in which an LCD, an organic EL, and an LED are arranged as pixels, the internal optical path is changed only by a slight change in the shape of the pixels, and as a result, the light distribution characteristics at the time of light extraction vary greatly. . Such variations in light distribution characteristics are directly connected to in-plane variations in the display device, and cause serious problems that are not uniform as a display device screen and low yield during mass production. Therefore, in the third embodiment, as the in-plane light distribution characteristic of the display device, the light distribution that stabilizes the light distribution in the display device in order to separate the relationship between the light distribution characteristic that varies from pixel to pixel and the pre-process that causes it. A technique for providing a control structure and ensuring in-plane uniformity as a display device will be described.

[3.2 Configuration of display device]
As illustrated in FIG. 13A, the display device 50 according to the third embodiment includes a circuit board 51, a plurality of light emitting units 52, and a cover glass 53. The plurality of light emitting units 52 are two-dimensionally arranged on the surface of the circuit board 51 at regular intervals. The cover glass 53 is disposed to face the circuit board 51 so as to cover the plurality of light emitting units 52. Hereinafter, these components will be sequentially described.

(Circuit board)
The circuit board 51 is the same as the circuit board 51 in the first embodiment described above.

(Light emitting part)
The light emitting part 52 includes a light emitting element 61, a light reflecting layer 62, a light diffusing layer 63, and a hollow part 64. The light emitting element 61 is the same as the light emitting element 31 in the first embodiment described above. The light reflection layer 62 is provided so as to surround the periphery of the light emitting element 61. The light reflecting layer 62 reflects the light emitted from the light emitting element 61. The hollow portion 64 is a hollow space surrounded by the circuit board 51, the light reflection layer 62, and the cover glass 53. As the gas filling the hollow portion 64, for example, air or a predetermined gas can be used.

  The light diffusion layer 63 is provided on the main surface of the cover glass 53 on the side facing the circuit board 51. The light diffusion layer 63 has a function of diffusing the light emitted from the light emitting element 61 or the light reflected by the light reflection layer 62. The light diffusion layer 63 has a light diffusion transmission structure.

  The light diffusion layer 63 is configured by processing the surface of the cover glass 53, for example. As the cover glass 53 having such a configuration, for example, processed glass such as rubbed glass, etching glass, frosted glass, Fuchs glass, and opal glass can be used. Examples of such glass processing methods include a sand blasting method in which a hard powder such as sand collides with the glass surface at a high speed, and an etching method by melting the glass using an acid. It is possible to control the light diffusion characteristics by adjusting the processing amount (for example, speed, time, etc.) in the glass processing.

  When viewing the display device 50 from the Z-axis direction, the light diffusion layer 63 preferably covers the light emitting element 61. More specifically, when the size of one side of the light emitting element 61 is about 10 μm to several hundred μm, the size of one side of the light diffusion layer 63 is preferably larger than that. The thickness of the light diffusion layer 63 is not necessarily thick, and may be a very thin layer, for example, around 5 μm.

  The surface of the processed glass described above has a fine uneven structure, and the microscopic structure can be regarded as a fine grain shape. The two-dimensional particle size when the glass surface is observed from a direction perpendicular to the surface, or the interval between the particle shapes is, for example, in the range of about several μm to several tens of μm. Further, the depth is in the range of several hundred nm to several μm. In general, the smaller the particle size or interval and the deeper the depth, the weaker the linearly transmitted component of the transmitted light and the stronger the diffuse component.

  Further, the light diffusion layer 63 may be formed on the surface of the cover glass 53, for example. Examples of a method for forming such a light diffusion layer 63 include a method in which fine particles are stirred in a transparent resin material that is a binder to prepare a coating material, and then coated and cured on the surface of the cover glass 53.

[3.3 Film formation method of light diffusion layer]
Hereinafter, an example of a method for forming the light diffusion layer 63 on the surface of the cover glass 53 will be described in detail. First, a coating material is prepared by stirring fine particles in a transparent resin material as a binder. For the stirring, it is preferable to use an agitator that can agitate the paint efficiently in a short time with little aggregation of fine particles. Examples of such a stirring device include a self-revolving centrifugal stirrer. It is preferable to pass the stirred paint through a mill such as a bead mill or a triple mill. This is because even when slight agglomeration of fine particles occurs by stirring, the agglomeration is pulverized and a homogeneous slurry can be obtained while maintaining a desired concentration.

  The light diffusion function of the light diffusion layer 63 can be controlled by adjusting the ratio of the fine particles to the binder and / or the thickness of the light diffusion layer 63. Examples of the binder include a two-component thermosetting silicone resin. Examples of the fine particle material include melamine, silica, alumina, and titanium oxide. As the fine particles, for example, those having a constant particle size controlled in the range of several hundred nm to several μm are used.

  Next, the prepared paint is applied to the surface of the cover glass 53 to form a coating film. As the coating method, for example, a printing process such as dispense coating or screen printing can be used. The thickness of the light diffusion layer 63 can be adjusted, for example, by setting a control parameter for the printing process. For example, in screen printing, the coating thickness can be stably maintained at 5 μm or 30 μm by selecting the mesh diameter and aperture ratio of the plate.

  Next, the coating film on the surface of the cover glass 53 is cured. The curing method is selected according to the type of transparent resin material contained in the paint. For example, when the transparent resin material is a thermosetting resin, the coating film can be cured by baking at several hundred degrees for several hours.

[3.4 Effects]
The effect obtained by providing the light diffusion layer 63 can be confirmed by actually measuring the light distribution characteristics by pixel emission before and after the cover glass 53 with the light diffusion layer 63 is put on the display element 61 (FIGS. 15A and 15B). reference). On the other hand, as a basic evaluation of the cover glass 53 with the light diffusing layer, it is necessary to grasp the outgoing light distribution (transmission scattering characteristic BTDF (see Bidirectional Transmittance Distribution Function), see FIG. 16A and FIG. 16B) at the time of parallel light incident. Using the obtained pixel light distribution (light distribution characteristics before covering the cover glass 53 with the light diffusion layer 63, see FIG. 15A), the light distribution characteristics after covering the cover glass 53 with the light diffusion layer (see FIG. 15A). 15B) can be predicted with high accuracy. Since BTDF varies depending on the concentration of fine particles, it is an important reverse calculation method for setting the minimum concentration to be required. As a result, when comparing the light distribution FFP (Far Field Pattern) of FIG. 15A and FIG. 15B before and after diffusion for a certain angle θ, in the light diffusion layer 63 with a certain fine particle concentration, 17 can be expressed as shown in FIG. In other words, the slope is called light distribution control sensitivity, and a value smaller than 1 is evidence that the light distribution variation is suppressed. The same applies to the light distribution FFP shown in FIGS. 18A and 18B. 18A and 18B show, as an example, two types of light distribution variations that are reversed left and right on the assumption that the light distribution FFP is asymmetrical. By covering the cover glass 53 with the light diffusing layer 63, the symmetry can be increased and the variation can be reduced. Further, even when the light distribution is disturbed to the left and right through the manufacturing process or the like, the variation can be corrected by adding the light diffusion layer 63.

  In the display device 50 according to the third embodiment, since the light diffusion layer 63 is provided on the light emitting element 61, it is possible to suppress variations in light distribution. Therefore, the yield in the mass production process can be improved. Moreover, it can contribute to the cost reduction of the display apparatus 50. FIG.

[3.5 Modification]
Hereinafter, a configuration example of the display device 50 according to a modification of the above-described third embodiment will be described with reference to FIGS. 13B to 14C.

  In the display device 50, as shown in FIG. 13B, the light diffusion layer 63 may be provided over substantially the entire main surface of the cover glass 53 on the side facing the circuit substrate 51. By adopting such a configuration, the mass productivity of the display device 50 can be improved.

  As shown in FIG. 13C, the display device 50 may further include a light diffusion layer 65 filled in a hollow space surrounded by the circuit board 51, the light reflecting layer 62, and the cover glass 53. By adopting such a configuration, the entire exposed portion of the light emitting element 61 is directly included in the light diffusion layer 65. In this case, the light diffusion layer 63 shown in FIG. 13A can be omitted.

  As illustrated in FIG. 13D, the display device 50 further includes a sealing portion 66 made of a transparent resin material in a hollow space surrounded by the circuit board 51, the light reflection layer 62, and the cover glass 53. It may be.

  As shown in FIG. 14A, the display device 50 may further include a light diffusion layer 67 that covers the entire exposed portion of the light emitting element 61. Alternatively, as shown in FIG. 14B, a light diffusion layer 67 that covers a part of the exposed portion of the light emitting element 61 such as the upper surface portion may be further provided.

  The display device 50 may further include a black matrix 68 between the cover glass 53 and the light diffusion layer 63, as shown in FIG. 14C. The black matrix 68 has a plurality of openings 68a, and each opening 68a is provided on each light emitting element 61 when viewed from the Z-axis direction. Since the thickness of the black mask 68 is as extremely thin as about 1 μm, for example, it can be easily formed on the surface of the cover glass by a printing process or the like, and the configuration of the display device 50 is not significantly changed.

<4. Fourth Embodiment>
The electronic apparatus according to the fourth embodiment of the present technology includes the display device 10 according to the first embodiment, the display device 70 according to the second embodiment, the display device 50 according to the third embodiment, or the first. The display apparatus 50 which concerns on the modification of 3rd Embodiment is provided. An example of an electronic device according to the fourth embodiment of the present technology will be described below.

  FIG. 10A is an external view illustrating an example of a television device as an electronic apparatus. The television device 111 includes a housing 112 and a display device 113 accommodated in the housing 112. Here, the display device 113 is the display device 10 according to the first embodiment, the display device 70 according to the second embodiment, the display device 50 according to the third embodiment, or a modification of the third embodiment. The display device 50 according to FIG.

  FIG. 10B is an external view illustrating an example of a notebook personal computer as an electronic apparatus. The notebook personal computer 121 includes a computer main body 122 and a display device 125. The computer main body 122 and the display device 125 are housed in a housing 123 and a housing 124, respectively. Here, the display device 125 is the display device 10 according to the first embodiment, the display device 70 according to the second embodiment, the display device 50 according to the third embodiment, or a modification of the third embodiment. It is the display apparatus 50 which concerns on an example.

  Hereinafter, the present technology will be specifically described with reference examples, but the present technology is not limited only to these reference examples.

This reference example will be described in the following order.
I Reduction of regular reflection on the sealing surface
II Reduction of regular reflection and diffuse reflection on the surface of the light absorption layer

<I Reduction of regular reflection on the surface of the sealing portion>
The reflectance reduction effect produced by forming a low-reflection layer on the curved surface (for example, a partial spherical surface) of the sealing portion having the same refractive index as that of glass was confirmed in a simulated manner as follows. .

(Reference Example 1)
First, a glass substrate having a flat surface was prepared. Next, after applying a low-reflection coating on one main surface (flat surface) of the glass substrate by a spray coating method, the glass substrate was naturally dried to form a low-reflection layer. As a material for the low reflection coating, a fluororesin (Harves Co., Ltd., trade name: DS-5305C) was used. Next, a light absorption layer was formed on the other main surface of the glass substrate (the surface opposite to the surface on which the low reflection layer was formed). The target sample was obtained by the above.

(Reference Example 2)
A glass substrate similar to that of Reference Example 1 was prepared and used as a sample.

(Reference Example 3)
The reflection spectrum when a low reflection layer (refractive index n = 1.4, film thickness = 95 nm) was formed on the glass substrate surface was determined by simulation.

(Evaluation of reflection spectrum)
Next, the reflectance at an incident angle of 5 ° on the surface of the sample obtained as described above was measured using a spectrophotometer (trade name: U-4100, manufactured by Hitachi High-Technologies Corporation) (FIG. 11A). reference). The measurement results are shown in FIG. 11B.

From FIG. 11B, the actually measured value (Reference Example 1) obtained from the actually produced sample and the theoretical value (Reference Example 3) obtained by the simulation almost coincide with each other, and the expected reflectance reduction effect is obtained. It can be confirmed that it is expressed.
Even when a low-reflection layer is formed on the curved surface (for example, a partial spherical surface) of a sealing portion having a refractive index equivalent to that of glass, the same effect as when a low-reflection layer is formed on a flat surface of a glass substrate is exhibited. Guessed.

<II. Reduction of regular reflection and diffuse reflection on the surface of the light absorption layer>
The reflectance reduction effect produced by forming the low reflection layer on the fine uneven surface of the light absorbing layer was confirmed in a simulated manner as follows.

(Reference Example 4)
First, a glass substrate having a flat surface was prepared. Next, surface black was formed on one main surface (flat surface) of the glass substrate. Next, after applying a low-reflection coating on the surface black surface by spray coating, a low-reflection layer was formed by natural drying. As a material for the low reflection coating, a fluororesin (Harves Co., Ltd., trade name: DS-5305C) was used. Next, a light absorption layer was formed on the other main surface of the glass substrate (the surface opposite to the surface on which the low reflection layer was formed). The target sample was obtained by the above.

(Evaluation of angle dependence of reflected light intensity)
Next, the angle dependence of the reflected light intensity on the low reflection layer side of the sample obtained as described above is as follows.
It measured using the photometer (GENESIA Gonio / Far Field Profiler) (refer FIG. 12A). The measurement result is shown in FIG. 12B. In addition, a laser (product name: GLM-A2 (λ = 532 nm) manufactured by Kochi Hoyonaka Giken Co., Ltd.) was used as the light source, and the incident angle with respect to the surface of the sample was set to 35 °.

  From FIG. 11B, it can be confirmed that regular reflection can be suppressed while maintaining diffuse reflection.

  As mentioned above, although embodiment of this technique was described concretely, this technique is not limited to the above-mentioned embodiment, Various deformation | transformation based on the technical idea of this technique is possible.

  For example, the configurations, methods, processes, shapes, materials, numerical values, and the like given in the above-described embodiments are merely examples, and different configurations, methods, processes, shapes, materials, numerical values, and the like are used as necessary. Also good.

  The configurations, methods, processes, shapes, materials, numerical values, and the like of the above-described embodiments can be combined with each other without departing from the gist of the present technology.

  In the above-described embodiment, the structure in which the light emitting element is sealed by the sealing portion and the low reflection layer is provided on the surface of the sealing portion has been described as an example. However, the present technology is not limited to this example. Absent. A configuration in which the formation of the sealing portion is omitted and the low reflection layer is directly formed on the surface of the light emitting element may be employed. That is, a configuration in which the light emitting portion is not sealed by the sealing portion but is constituted by an exposed light emitting element, and the low reflection layer is directly formed on the exposed light emitting element surface may be adopted.

  In the above-described embodiment, the case where the light emitting element is an LED has been described as an example. However, the light emitting element is not limited to this example, and examples of the light emitting element include an organic electroluminescent element or an inorganic electroluminescent element. An element or the like may be used.

The present technology can also employ the following configurations.
(1)
A plurality of light emitting units;
A light absorbing portion surrounding each of the plurality of light emitting portions;
A low reflection layer provided on both surfaces of the light emitting part and the light absorbing part,
The surface of the light absorbing portion is an uneven surface that diffuses light,
The display device in which the low reflection layer is provided following the uneven surface.
(2)
The display device according to (1), wherein the light emitting unit includes a light emitting element and a sealing unit that seals the light emitting element.
(3)
The said sealing part is a display apparatus as described in (2) which has a flat surface, an uneven surface, or a curved surface.
(4)
The sealing portion has a convex or concave curved surface,
The display device according to (2), wherein the low reflection layer is provided following the curved surface.
(5)
The display device according to (2), wherein the light emitting element is a light emitting diode or an electroluminescence element.
(6)
The light absorber has a plurality of openings,
The display device according to any one of (2) to (5), wherein a light emitting element is provided in the opening.
(7)
The display device according to any one of (2) to (6), wherein the sealing portion includes a substantially transparent material having transparency or diffuse transmission.
(8)
The display device according to (1), wherein the light emitting unit includes an exposed light emitting element.
(9)
The display device according to any one of (1) to (8), wherein the uneven surface includes a plurality of fine particles.
(10)
The light absorber is
A light absorbing layer;
The display device according to any one of (1) to (9), including: a shape layer having the uneven surface provided on a surface of the light absorption layer.
(11)
The display device according to any one of (1) to (10), wherein the low reflection layer includes at least one selected from the group consisting of a fluororesin, porous particles, and hollow particles.
(12)
The display device according to any one of (1) to (11), wherein the low reflection layer has a film thickness equal to or greater than a wavelength of light intended for low reflection.
(13)
The low reflection layer has a film thickness of about λ / (4 · n) (where λ is the wavelength of light intended for low reflection and n is the refractive index of the low reflection layer) (1) To (11).
(14)
The display device according to any one of (1) to (13), wherein the light emitting unit and the light absorbing unit have a step.
(15)
A plurality of display cells arranged two-dimensionally;
The display cell includes a plurality of light emitting units, a light absorbing unit that surrounds each of the plurality of light emitting units, and a low reflection layer provided on both surfaces of the light emitting unit and the light absorbing unit,
The surface of the light absorbing portion is an uneven surface that diffuses light,
The display device in which the low reflection layer is provided following the uneven surface.
(16)
A display device comprising: a plurality of light emitting units; a light absorbing unit surrounding each of the plurality of light emitting units; and a low reflection layer provided on both surfaces of the light emitting unit and the light absorbing unit.
The surface of the light absorbing portion is an uneven surface that diffuses light,
The low reflection layer is an electronic device provided to follow the uneven surface.

The present technology can also employ the following configurations.
(1) It has a plurality of light emitting elements,
A display device in which a light diffusion structure is provided in the vicinity of the light emitting element.
(2) The display device according to (1), wherein the light diffusion characteristics of the light diffusion structure are optically transmissive.
(3) The display device according to (1) or (2), wherein the light diffusion structure is directly provided on a surface of the light emitting element.
(4) further comprising a cover glass,
The said light-diffusion structure is a display apparatus as described in (1) or (2) provided in the surface of the cover glass.
(5) The display device according to (4), wherein the cover glass is rubbed glass, etching glass, frosted glass, glass, or opal glass.
(6) The display device according to (4) or (5), wherein light diffusion characteristics are controlled by adjusting a processing amount of the cover glass.
(7) The display device according to (1), wherein the light diffusion structure is a light diffusion layer including a binder and a plurality of fine particles.
(8) The display device according to (7), wherein the light diffusion characteristics are controlled by adjusting the content of the plurality of fine particles contained in the light diffusion layer.
(9) The binder includes a silicone resin,
The display device according to (7) or (8), wherein the fine particles include fine particles containing melamine, silica, alumina, or titanium oxide.
(10) By adjusting the processing amount of the cover glass, the light distribution variation after diffusion can be suppressed with a desired sensitivity amount less than 1 in relative ratio with respect to the light distribution variation before diffusion. The display device according to any one of (4) to (6).
(11) By adjusting the content of the fine particles contained in the light diffusion layer, a desired sensitivity amount in which the light distribution variation after diffusion is less than 1 in relative ratio with respect to the light distribution variation before diffusion. The display device according to any one of (7) to (9).
(12) comprising a plurality of display cells arranged two-dimensionally;
The display cell includes a plurality of light emitting elements,
A display device in which a light diffusion structure is provided in the vicinity of the light emitting element.
(13)
A display device including a plurality of light emitting elements;
An electronic device in which a light diffusion structure is provided in the vicinity of the light emitting element.

DESCRIPTION OF SYMBOLS 1 Large screen display device 10, 50 Display device 11, 51 Circuit board 12 Light absorption part 12a, 68a Opening 13, 52 Light emission part 13, 13a, 13b Low reflection layer 21 Substrate 22 Wiring layer 23 Flattening film 24 Driver IC
31, 61 Light-emitting element 32, 66 Sealing portion 41 Light absorbing portion 42 Light absorbing layer 43, 63, 65, 67 Diffusion layer 53 Cover glass 62 Light reflecting layer 64 Hollow portion 68 Black matrix

Claims (16)

A plurality of light emitting units;
A light absorbing portion surrounding each of the plurality of light emitting portions;
A low reflection layer provided on both surfaces of the light emitting part and the light absorbing part,
The surface of the light absorbing portion is an uneven surface that diffuses light,
The display device in which the low reflection layer is provided following the uneven surface.   The display device according to claim 1, wherein the light emitting unit includes a light emitting element and a sealing unit that seals the light emitting element.   The display device according to claim 2, wherein the sealing portion has a flat surface, an uneven surface, or a curved surface. The sealing portion has a convex or concave curved surface,
The display device according to claim 2, wherein the low reflection layer is provided following the curved surface.   The display device according to claim 2, wherein the light emitting element is a light emitting diode or an electroluminescence element. The light absorber has a plurality of openings,
The display device according to claim 2, wherein a light emitting element is provided in the opening.   The display device according to claim 2, wherein the sealing portion includes a substantially transparent material having transparency or diffuse transmission.   The display device according to claim 1, wherein the light emitting unit includes an exposed light emitting element.   The display device according to claim 1, wherein the uneven surface includes a plurality of fine particles. The light absorber is
A light absorbing layer;
The display device according to claim 1, further comprising: a shape layer having the uneven surface provided on a surface of the light absorption layer.   The display device according to claim 1, wherein the low reflection layer includes at least one selected from the group consisting of a fluororesin, porous particles, and hollow particles.   The display device according to claim 1, wherein the low reflection layer has a film thickness equal to or greater than a wavelength of light intended for low reflection.   2. The low reflection layer has a film thickness of about λ / (4 · n) (where λ is a wavelength of light for low reflection and n is a refractive index of the low reflection layer). The display device described in 1.   The display device according to claim 1, wherein the light emitting unit and the light absorbing unit have a step. A plurality of display cells arranged two-dimensionally;
The display cell includes a plurality of light emitting units, a light absorbing unit that surrounds each of the plurality of light emitting units, and a low reflection layer provided on both surfaces of the light emitting unit and the light absorbing unit,
The surface of the light absorbing portion is an uneven surface that diffuses light,
The display device in which the low reflection layer is provided following the uneven surface. A display device comprising: a plurality of light emitting units; a light absorbing unit surrounding each of the plurality of light emitting units; and a low reflection layer provided on both surfaces of the light emitting unit and the light absorbing unit.
The surface of the light absorbing portion is an uneven surface that diffuses light,
The low reflection layer is an electronic device provided to follow the uneven surface.

Images