JP2015026688A5 - - Google Patents
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- Publication number
- JP2015026688A5 JP2015026688A5 JP2013154703A JP2013154703A JP2015026688A5 JP 2015026688 A5 JP2015026688 A5 JP 2015026688A5 JP 2013154703 A JP2013154703 A JP 2013154703A JP 2013154703 A JP2013154703 A JP 2013154703A JP 2015026688 A5 JP2015026688 A5 JP 2015026688A5
- Authority
- JP
- Japan
- Prior art keywords
- plate
- holding pin
- wafer
- rotating plate
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000011109 contamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
本発明はこのような事情の下になされたものであり、その目的は、投光部及び受光部の汚染を避けつつ、基板の姿勢を検出することが可能な液処理装置を提供することにある。 The present invention has been made under such circumstances, and an object, while avoiding contamination of the light projecting section and the light receiving unit, to provide a liquid processing apparatus capable of detecting a posture of the substrate is there.
回転軸222は、保持ピン221の上端部が回転プレート21の径方向内側へ向けて移動する方向に付勢されており、この付勢力により他の保持ピン221との間でウエハWを挟み、回転プレート21の上面との間に隙間を開けた状態でウエハWを水平に保持する。各作動片223の下方位置には、連結板253、棒状の昇降部材252を介して昇降機構254に連結された円環形状の押上板251が設けられている。この押上板251を上昇させて、作動片223を押し上げると、回転軸222周りに保持ピン221が回転し、回転プレート21の径方向外側へ向けて保持ピン221が移動することにより、ウエハWの保持が解除される(図4)。
The rotating shaft 222 is urged in a direction in which the upper end portion of the holding pin 221 moves inward in the radial direction of the rotating plate 21, and the urging force sandwiches the wafer W with the other holding pin 221. The wafer W is held horizontally with a gap between it and the upper surface of the rotating plate 21. An annular push-up plate 251 connected to the lifting mechanism 254 via a connecting plate 253 and a bar-shaped lifting member 252 is provided at a position below each operating piece 223. When the push-up plate 251 is raised and the operating piece 223 is pushed up, the holding pin 221 rotates around the rotation shaft 222 and the holding pin 221 moves toward the outer side in the radial direction of the rotating plate 21, thereby causing the wafer W to move. The holding is released (FIG. 4).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013154703A JP6090035B2 (en) | 2013-07-25 | 2013-07-25 | Liquid processing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013154703A JP6090035B2 (en) | 2013-07-25 | 2013-07-25 | Liquid processing equipment |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015026688A JP2015026688A (en) | 2015-02-05 |
JP2015026688A5 true JP2015026688A5 (en) | 2015-12-24 |
JP6090035B2 JP6090035B2 (en) | 2017-03-08 |
Family
ID=52491127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013154703A Active JP6090035B2 (en) | 2013-07-25 | 2013-07-25 | Liquid processing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6090035B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7021877B2 (en) * | 2017-08-08 | 2022-02-17 | 株式会社Screenホールディングス | Board processing equipment, alignment equipment and alignment method |
JP6908474B2 (en) * | 2017-09-06 | 2021-07-28 | 株式会社ディスコ | Wafer cleaning device |
KR102685189B1 (en) * | 2022-08-23 | 2024-07-16 | 엘에스이 주식회사 | Substrate cleaning apparatus |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5853483A (en) * | 1995-05-02 | 1998-12-29 | Dainippon Screen Mfg. Co., Ltd. | Substrate spin treating method and apparatus |
JP3544747B2 (en) * | 1995-05-15 | 2004-07-21 | 大日本スクリーン製造株式会社 | Rotary substrate processing equipment |
JP3640373B2 (en) * | 1999-08-27 | 2005-04-20 | 大日本スクリーン製造株式会社 | Substrate mounting table |
JP2002319563A (en) * | 2001-04-20 | 2002-10-31 | Tokyo Electron Ltd | Device and method for processing substrate |
JP4439464B2 (en) * | 2005-12-06 | 2010-03-24 | 東京エレクトロン株式会社 | Substrate transport method and substrate transport apparatus |
JP2009200063A (en) * | 2006-05-22 | 2009-09-03 | Tokyo Electron Ltd | Basal plate deformation detecting mechanism, processing system, basal plate deformation detection method and recording medium |
JP5009254B2 (en) * | 2008-08-14 | 2012-08-22 | 株式会社ディスコ | Resin coating equipment |
US9082802B2 (en) * | 2011-11-28 | 2015-07-14 | Macronix International Co., Ltd. | Wafer centering hardware design and process |
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2013
- 2013-07-25 JP JP2013154703A patent/JP6090035B2/en active Active
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