JP2015012166A - Board work system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board work system for preventing a defective board from being manufactured, without reducing productivity.SOLUTION: In a system comprising a packaging machine 12 which executes packaging onto a circuit board and an inspection machine 14 which inspects a result of work by the packaging machine, a first program and a second program including processing for confirming appropriateness of work by the packaging machine in the first program are stored. The packaging machine executes work in accordance with the first program normally. In the case where a result of inspection by the inspection machine is not excellent, the packaging machine executes work in accordance with the second program. Therefore, confirmation processing is prevented from being executed in the state where the work by the packaging machine is appropriate, and reduction of productivity can be prevented. If a defective board is generated, on the other hand, the second program including the confirmation processing is executed, thereby preventing the defective board from being manufactured. Thus, by executing the confirmation processing just as needed, the defective board can be prevented from being manufactured, without reducing productivity.

Description

  The present invention relates to an on-board working system including an on-board working machine that performs work on a circuit board and an inspection machine that inspects work results on the circuit board on which the work has been performed by the on-board working machine.

  As described in the following patent document, the on-board work system includes an on-board work machine that performs work on the circuit board, and an inspection that checks work results on the circuit board on which the work is performed by the on-board work machine. There is a system equipped with a machine. According to such an on-board working system, a circuit board with a good inspection result, that is, a circuit board with a good inspection result is shipped, and a circuit board with a poor inspection result (hereinafter sometimes referred to as “defective substrate”). Can be prevented from being shipped.

JP-A-6-45753

  According to the substrate working system described in the above-mentioned patent document, it is possible to prevent shipment of defective substrates. However, the production of defective substrates is useless, and it is desirable to suppress the production of defective substrates as much as possible. For this reason, in order to suppress the manufacture of defective substrates, it is conceivable to perform a predetermined process for confirming the suitability of the work performed by the substrate work machine. Specifically, for example, in a mounting machine that mounts an electronic component on a circuit board, it is conceivable to perform processing for confirming the mounting direction of the electronic component before the electronic component is mounted on the circuit board. By performing such processing, for example, when the mounting direction of the electronic component is appropriate, the mounting operation is performed, and when it is not appropriate, a process for optimizing the mounting direction of the electronic component can be performed. This makes it possible to suppress the production of defective substrates. However, productivity is reduced by performing such processing. This invention is made | formed in view of such a situation, and makes it a subject to provide the to-substrate working system which can suppress manufacture of a defective board | substrate, without reducing productivity.

  In order to solve the above-mentioned problem, an on-board working system according to claim 1 of the present application includes an on-board working machine that performs work on a circuit board, and an operation on a circuit board on which the work is performed by the on-board working machine. An on-board working system comprising an inspection machine for inspecting results and a control device for controlling the operation of the on-board working machine, wherein the control device performs work on a circuit board by the on-board working machine. A program storage unit for storing a first program for processing, a second program including processing for confirming the suitability of the work by the substrate work machine in the first program, and the work result by the inspection machine is not good And an operation control unit that controls the operation of the substrate work machine according to the second program.

  Further, in the on-board work system according to claim 2, in the on-board work system according to claim 1, the operation control unit judges that the work result is not good by the inspection machine, and judges that the work result is not good. When the generated work result can be prevented by the processing included in the second program, the operation of the substrate work machine is controlled according to the second program.

  Further, in the on-board working system according to claim 3, in the on-board working system according to claim 1 or 2, the processing included in the second program is an imaging provided in the on-board working machine. It is a process for confirming the suitability of the work by the substrate working machine based on the imaging data by the apparatus.

  According to a fourth aspect of the present invention, there is provided the on-board working system according to any one of the first to third aspects, wherein the working by the on-board working machine according to the second program is performed. An operation button for prohibiting execution, and even when the operation control unit determines that the work result is not good by the inspection machine, when the operation button is operated by a user, The operation of the substrate working machine is controlled according to one program.

  In the on-board work system according to claim 1, a first program and a process for confirming whether the work by the on-board work machine is appropriate for the first program (hereinafter, may be abbreviated as “confirmation process”). The included second program is stored. Then, the substrate work machine executes the work according to the first program in a normal time, and executes the work according to the second program when the inspection result by the inspection machine is not good. For this reason, it is possible to prevent the execution of the confirmation process in a state where the inspection result by the inspection machine is good, that is, in a state where the work for the substrate work machine is appropriately performed, which reduces the productivity. It becomes possible to suppress. On the other hand, when a defective substrate is generated or when a defective substrate is likely to be generated, the second program including the confirmation process is executed, thereby suppressing the manufacture of the defective substrate. As described above, in the on-board working system according to the first aspect, by performing the confirmation process only when necessary, it is possible to minimize the decrease in productivity and suppress the production of defective substrates. .

  Further, in the on-board work system according to claim 2, it is possible to prevent the occurrence of the work result that is judged to be unsatisfactory by the confirmation process included in the second program, because the inspection result by the inspection machine is not good. In such a case, the substrate work machine executes the work according to the second program. Specifically, for example, when a circuit board mounted with the electronic component facing in a direction different from the correct direction is manufactured, the confirmation processing is performed before mounting the electronic component on the circuit board. If it is the process for confirming, it is possible to suppress manufacture of a defective substrate. For this reason, in such a case, the substrate work machine executes work according to the second program. On the other hand, when a circuit board on which no electronic component is mounted is manufactured, even if the confirmation process is a process for confirming the mounting direction of the electronic component before being mounted on the circuit board The production of defective substrates cannot be suppressed. For this reason, in such a case, the substrate work machine does not perform work according to the second program. As a result, the execution of the second program is allowed only when the manufacture of the defective substrate can be suppressed, so that the manufacture of the defective substrate is effectively suppressed and the decrease in productivity is suppressed. Is possible.

  In the on-board working system according to the third aspect, the confirmation process is performed based on the image data obtained by the imaging device provided in the on-board working machine. As a result, it is possible to suitably check the suitability of the work by the substrate working machine.

  According to a fourth aspect of the present invention, there is provided the operation button for prohibiting the execution of the work by the substrate work machine according to the second program. And even if it is a case where the test result by an inspection machine is not favorable, when an operation button is operated by the operator, a substrate work machine performs work according to the 1st program. In other words, even when a defective substrate is generated, it is possible to prohibit the execution of the confirmation process according to the operator's intention, and it is possible to perform work with an emphasis on production efficiency.

It is a top view which shows the to-substrate working system which is an Example of this invention. It is a block diagram which shows the control apparatus with which a substrate working system is provided. It is a flowchart which shows a control program. It is a flowchart which shows a control program. It is a flowchart which shows a control program.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

<Configuration of electronic component mounting system>
FIG. 1 shows an electronic component mounting system (hereinafter sometimes abbreviated as “mounting system”) 10 according to an embodiment of the present invention. The mounting system 10 is a system for mounting an electronic circuit component (hereinafter sometimes abbreviated as “electronic component”) on a circuit board. The mounting system 10 includes an electronic component mounting machine (hereinafter sometimes abbreviated as “mounting machine”) 12 and an inspection machine 14. The inspection machine 14 is disposed on the downstream side of the mounting machine 12. ing. In the following description, the arrangement direction of the mounting machine 12 and the inspection machine 14 is referred to as an X-axis direction, and a horizontal direction perpendicular to the direction is referred to as a Y-axis direction.

  The mounting machine 12 includes a transport device 20, a mounting head moving device 22, a mounting head 24, and a supply device 26.

  The conveyance device 20 includes a pair of conveyor belts 30 extending in the X-axis direction, and an electromagnetic motor (see FIG. 2) 32 that rotates the conveyor belt 30. The circuit board is supported by the pair of conveyor belts 30 and is conveyed in the X-axis direction by driving of the electromagnetic motor 32. Further, the transfer device 20 includes a substrate holding device (see FIG. 2) 36. The substrate holding device 36 fixedly holds the circuit board supported by the conveyor belt 30 at a predetermined position.

  The mounting head moving device 22 includes an X-axis direction slide mechanism 50 and a Y-axis direction slide mechanism 52. The X-axis direction slide mechanism 50 has an X-axis slider 56 provided on the base 54 so as to be movable in the X-axis direction. The X-axis slider 56 is moved to an arbitrary position in the X-axis direction by driving an electromagnetic motor (see FIG. 2) 58. The Y-axis direction slide mechanism 52 has a Y-axis slider 60 provided on the side surface of the X-axis slider 56 so as to be movable in the Y-axis direction. The Y-axis slider 60 is moved to an arbitrary position in the Y-axis direction by driving an electromagnetic motor (see FIG. 2) 62. The mounting head 24 is attached to the Y-axis slider 60. With such a structure, the mounting head 24 is moved to an arbitrary position on the base 54 by the mounting head moving device 22.

  The mounting head 24 mounts electronic components on a circuit board. The mounting head 24 has a suction nozzle 70 provided on the lower end surface. The suction nozzle 70 communicates with a positive / negative pressure supply device (see FIG. 2) 76 through negative pressure air and positive pressure air passages. The suction nozzle 70 sucks and holds the electronic component with a negative pressure, and releases the held electronic component with a positive pressure. Further, the mounting head 24 has a lifting device (see FIG. 2) 78 that lifts and lowers the suction nozzle 70. The mounting head 24 changes the vertical position of the electronic component to be held by the lifting device 78. The suction nozzle 70 can be attached to and detached from the mounting head 24.

  The supply device 26 is a feeder-type supply device and includes a plurality of tape feeders 80. The tape feeder 80 accommodates the taped component in a wound state. The taped component is a taped electronic component. Then, the tape feeder 80 sends out the taped parts by a delivery device 86 (see FIG. 2). Thereby, the feeder type supply device 26 supplies the electronic component at the supply position by feeding the taped component. The tape feeder 80 can be attached to and detached from the base 54, and can cope with replacement of electronic parts, shortage of electronic parts, and the like.

  The mounting machine 12 includes a parts camera (see FIG. 2) 90, a mark camera (see FIG. 2) 92, and a side view camera (see FIG. 2) 96. The parts camera 90 is provided on the base 54 so as to face upward, and images the electronic components held by the suction nozzle 70 of the mounting head 24 from below. Further, the mark camera 92 is fixed to the lower surface of the Y-axis slider 60 in a state of facing downward. As a result, the Y-axis slider 60 is moved by the mounting head moving device 22 so that an arbitrary position on the base 54 can be imaged. Further, the side view camera 96 is fixed to the Y-axis slider 60 in a state where the suction nozzle 70 of the mounting head 24 faces, and images an electronic component held by the suction nozzle 70 from the side.

  Furthermore, the mounting machine 12 includes a control device 100 as shown in FIG. The control device 100 includes a controller 102 and a plurality of drive circuits 106. The plurality of drive circuits 106 are connected to the electromagnetic motors 32, 58, 62, the substrate holding device 36, the positive / negative pressure supply device 76, the lifting / lowering device 78, and the delivery device 86. The controller 102 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 106. Thereby, the operations of the transport device 20 and the mounting head moving device 22 are controlled by the controller 102. The controller 102 is connected to the image processing apparatus 108. The image processing apparatus 108 processes image data obtained by the part camera 90, the mark camera 92, and the side view camera 96, and the controller 102 acquires various types of information from the data processed by the image processing apparatus 108. .

  In addition, as shown in FIG. 1, the inspection machine 14 includes a transport device 110, an inspection head 112, and an inspection head moving device 114. The transport device 110 has the same structure as the transport device 20 of the mounting machine 12 and is connected to the transport device 20. Thereby, the circuit board carried out from the transfer device 20 of the mounting machine 12 is carried into the transfer device 110 of the inspection machine 14.

  The inspection head 112 has an inspection camera 116 provided on the lower end surface, and the quality of the mounting operation of the electronic component on the circuit board is inspected by imaging of the inspection camera 116. The inspection head moving device 114 has the same structure as the mounting head moving device 22 of the mounting machine 12, and the inspection head 112 is attached to the Y-axis slider 118 of the inspection head moving device 114. Thereby, the inspection camera 116 can image an arbitrary position on the circuit board.

  Moreover, the inspection machine 14 is provided with the control apparatus 120, as shown in FIG. The control device 120 includes a controller 122 and a plurality of drive circuits 124. The plurality of drive circuits 124 are connected to the electromagnetic motor 126 and the substrate holding device 128 of the transport device 110 and the electromagnetic motors 130 and 132 of the inspection head moving device 114. The controller 122 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 124. Thereby, the operations of the transport device 110 and the inspection head moving device 114 are controlled by the controller 122. The controller 122 is connected to the image processing device 136. The image processing device 136 processes image data obtained by the inspection camera 116, and the controller 122 determines whether the electronic component is mounted on the circuit board based on the data processed by the image processing device 136. Determine.

<Working with electronic component mounting system>
In the mounting system 10, the mounting operation for mounting the electronic component on the circuit board is performed in the mounting machine 12 by the configuration described above. In the inspection machine 14, the inspection work is performed on the circuit board on which the mounting work has been performed by the mounting machine 12.

  Specifically, in the mounting machine 12, first, according to a command from the controller 102 of the control device 100, the transport device 20 transports the circuit board to the working position and holds it fixedly at that position. Next, in response to a command from the controller 102, the mounting head 24 moves onto the supply position of the supply device 26 and sucks and holds the electronic component from the supply device 26. Subsequently, the mounting head 24 moves onto the circuit board and mounts electronic components on the circuit board. Then, the circuit board for which the mounting operation has been completed is transported toward the inspection machine 14 by the transport device 20.

  Next, in the inspection machine 14, in response to a command from the controller 122 of the control device 120, the transport device 110 transports the circuit board to the work position and holds the circuit board at that position. Then, according to a command from the controller 122, the inspection head 112 moves onto the circuit board, and the inspection camera 116 images the circuit board. The image data obtained by the inspection camera 116 is processed by the image processing device 136, and information regarding the mounting state of the electronic component on the circuit board is acquired. Based on the information, an inspection operation is performed on the circuit board on which the electronic component is mounted. Then, the circuit board on which the inspection work has been performed is carried out of the inspection machine 14 by the transfer device 110.

<Confirmation of mounting work by electronic component mounting machine>
As described above, in the mounting system 10, the inspection work is performed on the circuit board on which the mounting work has been performed by the mounting machine 12. As a result, it is possible to prevent shipment of circuit boards with good test results, that is, only normal circuit boards, and circuit boards with poor test results (hereinafter may be abbreviated as “defective substrates”). It becomes. However, the production of defective substrates is useless, and it is desirable to suppress the production of defective substrates as much as possible. For this reason, in the mounting system 10, in the mounting machine 12, it is possible to perform a predetermined process for confirming the suitability of the mounting work in order to suppress the manufacture of defective substrates.

  For example, as an example of a defective board, there is a circuit board (hereinafter, sometimes referred to as a “direction board”) in which an electronic component is mounted in a direction different from a correct direction. For such circuit boards, confirmation of the orientation of electronic components before they are mounted on the circuit board (hereinafter sometimes referred to as “direction confirmation”) suppresses the production of boards with different directions. Is possible.

  Specifically, in accordance with a command from the controller 102, the mounting head 24 in a state where the electronic component is held by the suction nozzle 70 moves above the parts camera 90, and the parts camera 90 is moved to the electronic held by the suction nozzle 70. Image the part. The image data obtained by the parts camera 90 is processed by the image processing apparatus 108, and information about the electronic component held by the suction nozzle 70 is acquired. Then, the controller 102 determines whether or not the orientation of the electronic component is normal based on the information. When the orientation of the electronic component is normal, the electronic component held by the suction nozzle 70 is mounted on the circuit board. On the other hand, if the orientation of the electronic component is not normal, the electronic component held by the suction nozzle 70 is discarded in a disposal box (not shown) provided on the base 54 of the mounting machine 12. Then, another electronic component is held by the suction nozzle 70, and the direction confirmation is performed on the electronic component. Thus, by performing direction confirmation, it becomes possible to suppress manufacture of a board with a different direction.

  The direction can also be confirmed by confirming the orientation of the electronic component before being held by the suction nozzle 70, that is, the electronic component being supplied at the supply position of the supply device 26. Specifically, in response to a command from the controller 102, the mark camera 92 moves above the supply position of the electronic component by the supply device 26, and the mark camera 92 images the electronic component being supplied at the supply position. To do. The image data obtained by the mark camera 92 is processed by the image processing device 108, and information regarding the electronic component being supplied at the supply position is acquired. Then, the controller 102 determines whether or not the orientation of the electronic component is normal based on the information. When the orientation of the electronic component is normal, the electronic component is held by the suction nozzle 70, and the subsequent mounting operation is continued. On the other hand, when the orientation of the electronic component is not normal, the electronic component is held by the suction nozzle 70, and the held electronic component is discarded in the disposal box. Then, the supply device 26 supplies a new electronic component, and the direction confirmation is performed on the electronic component. As described above, it is possible to suppress the manufacture of a substrate with a different direction by checking the direction. In the direction confirmation with respect to the electronic component held by the suction nozzle 70 and the direction confirmation with respect to the electronic component supplied at the supply position, if it is repeatedly determined that the orientation of the electronic component is not normal, an error notification is issued. And inspection by the worker is performed.

  Further, for example, as an example of a defective substrate, there is a circuit substrate (hereinafter, sometimes referred to as a “backing substrate”) on which electronic components are mounted face down. For such a circuit board, the electronic component before being mounted on the circuit board is confirmed to be face-up or face-down (hereinafter, sometimes referred to as “front-back check”). It is possible to suppress the manufacture of the substrate.

  Specifically, according to a command from the controller 102, the side view camera 96 images the electronic component held by the suction nozzle 70. The image data obtained by the side view camera 96 is processed by the image processing device 108, and information about the electronic component held by the suction nozzle 70 is acquired. Then, the controller 102 determines whether the electronic component is face up or face down based on the information. When the electronic component is face up, the electronic component held by the suction nozzle 70 is mounted on the circuit board. On the other hand, when the electronic component is face down, the electronic component held by the suction nozzle 70 is discarded in the disposal box. Then, another electronic component is held by the suction nozzle 70, and the above-described front / back determination is performed on the electronic component. Thus, by performing the front / back determination, it becomes possible to suppress the production of the backing substrate. In the front / back determination, if it is repeatedly determined that the electronic component is face down, an error notification is given and an inspection by the operator is performed.

  Further, for example, as an example of a defective board, there is a circuit board in which an electronic component is not mounted at a position where the electronic component is to be mounted (hereinafter, it may be referred to as a “shortage substrate”). For such a circuit board, it is confirmed whether or not the suction nozzle 70 holds the electronic component before and after mounting the electronic component on the circuit board (hereinafter, sometimes referred to as “electronic component holding confirmation”). By doing so, it is possible to suppress the production of the missing substrate.

  Specifically, in accordance with a command from the controller 102, the side view camera 96 images the tip of the suction nozzle 70 after performing the process of holding the electronic component from the supply device 26. Image data obtained by the side view camera 96 is processed by the image processing device 108, and information regarding the tip of the suction nozzle 70 is acquired. Then, the controller 102 determines whether or not the suction nozzle 70 holds an electronic component based on the information. When the suction nozzle 70 holds an electronic component, the electronic component held by the suction nozzle 70 is mounted on the circuit board. On the other hand, when the suction nozzle 70 does not hold an electronic component, an electronic component suction error has occurred, and therefore the step of holding the electronic component from the supply device 26 by the suction nozzle 70 is performed again. Then, the electronic component holding confirmation is performed on the suction nozzle 70.

  Further, even after the step of mounting the electronic component held by the suction nozzle 70 on the circuit board is performed, the side view camera 96 images the tip of the suction nozzle 70. Image data obtained by the side view camera 96 is processed by the image processing device 108, and information regarding the tip of the suction nozzle 70 is acquired. Then, the controller 102 determines whether or not the suction nozzle 70 holds an electronic component based on the information. When the suction nozzle 70 does not hold an electronic component, the electronic component is mounted on the circuit board, and the subsequent work is performed. On the other hand, when the suction nozzle 70 holds an electronic component, the electronic component is brought back by the suction nozzle 70, and the electronic component is not mounted on the circuit board. For this reason, the mounting process to the circuit board of the electronic component held by the suction nozzle 70 is performed again. In this way, by performing the electronic component holding confirmation, it is possible to suppress the production of the missing substrate. In the electronic component holding confirmation, when an electronic component suction error or an electronic component take-away occurs repeatedly, an error is notified and an inspection is performed by an operator.

<Selection of work program according to inspection results>
As described above, it is possible to suppress the production of defective substrates by performing direction confirmation, front / back confirmation, and electronic component holding confirmation. On the other hand, when performing direction confirmation, front / back confirmation, and electronic component holding confirmation, it takes time for imaging by the mark camera 92 or the like, processing of the imaging data, and the like, which may reduce productivity. In view of such a situation, in the mounting system 10, a control program (hereinafter referred to as a “confirmation processing containing program”) including a process for executing the various types of confirmation as a production program for performing the mounting operation by the mounting machine 12. And a control program that does not include the processing for executing the above various checks (hereinafter also referred to as “confirmation processing non-contained program”) are prepared. Depending on the result, a production program is selected.

  Specifically, the controller 102 of the control device 100 of the mounting machine 12 includes a confirmation process non-contained program for executing the mounting work by the mounting machine 12 shown in the column <Work by electronic component mounting system> The confirmation processing non-contained program stores a plurality of confirmation processing containing programs including processing for executing at least one of direction confirmation, front / back confirmation, and electronic component holding confirmation. The plurality of confirmation process inclusion programs include a first confirmation process inclusion program including a process for executing direction confirmation in the confirmation process non-containment program, and a process for executing front / back confirmation in the confirmation process non-containment program. The second confirmation processing inclusion program, the confirmation processing non-containment program, the third confirmation processing inclusion program including the processing for executing the electronic component holding confirmation, and the confirmation processing non-containment program execute direction confirmation and front / back confirmation. A fourth confirmation process inclusion program including a process for confirmation, a confirmation process non-containment program, a fifth confirmation process inclusion program including a process for executing direction confirmation and electronic component holding confirmation, and a confirmation process non-containment program In the 6th confirmation process inclusion program including the process for executing the front and back confirmation and the electronic component holding confirmation, and the confirmation process non-containment program Check direction, front and back check, there is a seventh confirmation process containing program containing a process for performing an electronic component holding confirmation.

  When the mounting operation is executed, a confirmation process non-containing program is usually executed. When the circuit board manufactured by the execution of the program is determined not to be good by the inspection machine 14, the inspection result determined to be not good is fed back to the mounting machine 12. The mounting machine 12 recognizes the cause of the defective board from the fed back inspection result, and determines whether or not the cause of the defective board can be dealt with by direction confirmation, front / back confirmation, and electronic component holding confirmation processing. In other words, it is determined whether or not a defective substrate that has been determined to have a poor inspection result by the inspection machine 14 corresponds to any of a misdirected substrate, a backing substrate, and a missing substrate.

  When the defective board falls under any of the wrong direction board, backing board, and missing part board, it includes any of direction confirmation, front / back confirmation, and electronic component holding confirmation depending on the cause of the defective board. The first to seventh confirmation process-containing programs are selected. For this reason, the mounting machine 12 does not execute the confirmation process that does not correspond to the cause of the defective substrate among the direction confirmation, the front and back confirmation, and the electronic component holding confirmation process at the time of the mounting operation, and the confirmation that corresponds to the cause of the defective substrate Only processing is performed. As a result, it is possible to appropriately suppress the production of defective substrates and to minimize the decrease in productivity.

  On the other hand, if the defective board does not correspond to any of the wrong direction board, backing board or missing part board, the cause of the defective board cannot be dealt with by direction confirmation, front / back confirmation, electronic component holding confirmation, direction confirmation, front / back confirmation , A confirmation processing non-contained program not including the electronic component holding confirmation processing is selected. That is, if the manufacture of defective substrates cannot be suppressed by executing the direction confirmation, front / back confirmation, and electronic component holding confirmation processing, the direction confirmation, front / back confirmation, and electronic component holding confirmation processing are not executed. As a result, it is possible to prevent execution of useless confirmation processing at the time of mounting work, and it is possible to suppress a decrease in productivity. In addition, also when the inspection result in the inspection machine 14 is good, the confirmation processing non-containing program is selected. As a result, it is possible to prevent the execution of the confirmation process in a state in which a defective substrate is not manufactured, that is, in a state in which the mounting operation by the mounting machine 12 is appropriately performed, and suppress a decrease in productivity. It becomes possible.

  Further, in the mounting system 10, even if it is determined that the inspection result is not good in the inspection machine 14 and the defective substrate corresponds to any of the wrong direction substrate, the backing substrate, and the missing substrate, the operator is in accordance with the intention. It is possible to prohibit the execution of the confirmation process during the mounting operation. Specifically, the mounting system 10 is provided with a confirmation button (not shown), and when the confirmation button is operated, a program change confirmation screen is displayed before the program containing the confirmation process is executed. Displayed on a panel (not shown). On the program change confirmation screen, since a defective substrate has occurred, a comment to change from the confirmation processing non-contained program to the confirmation processing containing program and a change button (not shown) are displayed. The display panel is a touch panel, and when the change button is operated, the production program for performing the mounting operation is changed from the confirmation process non-containment program to the confirmation process inclusion program. On the other hand, when the change button is not operated, the execution of the confirmation process containing program is prohibited, and the confirmation process non-containing program is continuously executed. This allows the operator to select a mounting operation that emphasizes production efficiency and a mounting operation that focuses on suppressing the occurrence of defective substrates, which is convenient. When the confirmation button is not operated, it is determined that the inspection result is not good in the inspection machine 14, and the defective substrate corresponds to any one of the wrong direction substrate, the backing substrate, and the missing substrate, The production program is changed from the confirmation processing non-containing program to the confirmation processing containing program.

<Control program>
The production program is changed according to the inspection result of the inspection machine 14 described above by executing the control program shown in the flowchart in FIGS. In the control program, in step 1 (hereinafter simply referred to as “S1”, the same applies to other steps), a command to carry the circuit board is transmitted to the transfer device 20 of the mounting machine 12. Next, in S <b> 2, a command for executing the mounting operation is transmitted to the mounting head moving device 22, the mounting head 24, and the like of the mounting machine 12.

  Subsequently, in S3, a command to execute the inspection work is transmitted to the inspection head moving device 114, the inspection camera 116, and the like of the inspection machine 14. Then, in S4, it is determined whether or not the inspection result by the inspection machine 14 is good. If the inspection result is good, the process returns to S1. On the other hand, if the inspection result is not good, the process proceeds to S5.

  In S <b> 5, information on the defective substrate as the inspection result is fed back from the controller 122 of the inspection machine 14 to the controller 102 of the mounting machine 12. In S6, the controller 102 of the mounting machine 12 confirms the cause of the defective substrate from the information regarding the defective substrate. Subsequently, in S7, the controller 102 of the mounting machine 12 determines whether or not the cause of the defective board can be dealt with by direction confirmation, front / back confirmation, and electronic component holding confirmation processing. If the cause of the defective substrate cannot be dealt with by the direction confirmation, front / back confirmation, and electronic component holding confirmation processing, the process returns to S1. On the other hand, if the cause of the defective substrate can be dealt with by direction confirmation, front / back confirmation, and electronic component holding confirmation processing, the process proceeds to S8.

  In S8, the controller 102 of the mounting machine 12 determines whether the confirmation button is operated. If the confirmation button has not been operated, the process proceeds to S11. On the other hand, if the confirmation button is operated, the process proceeds to S9. In S9, the controller 102 displays a program change confirmation screen on the display panel. In S10, the controller 102 determines whether or not the change button has been operated. If the change button is not operated, the process returns to S1. On the other hand, when the change button is operated, the process proceeds to S11.

  In S11, the controller 102 executes a program determination subroutine. In the program determination subroutine, in S21, the controller 102 determines whether or not the cause of the defective board is caused by the electronic component being mounted face down on the circuit board. That is, it is determined whether or not the defective substrate is a backing substrate. If the defective substrate is a backing substrate, in S22, a confirmation processing-containing program in which processing for executing front / back confirmation is added to the production program is selected. Then, the process proceeds to S23. On the other hand, if the defective substrate is not the backing substrate, the process proceeds to S23.

  In S <b> 23, the controller 102 determines whether or not the cause of the defective board is caused by mounting the electronic component in a direction different from the normal direction. That is, it is determined whether or not the defective substrate is a substrate with a different direction. If the defective substrate is a board with a different direction, in S24, a confirmation process-containing program in which a process for executing direction confirmation is added to the production program is selected. Then, the process proceeds to S25. On the other hand, if the defective substrate is not the backing substrate, the process proceeds to S25.

  In S25, the controller 102 determines whether or not the cause of the defective board is caused by the fact that the electronic component is not mounted at the planned mounting position. That is, it is determined whether or not the defective substrate is a missing substrate. If the defective substrate is a missing substrate, in S26, a confirmation processing containing program in which processing for executing electronic component holding confirmation is added to the production program is selected. Then, the program determination subroutine ends. On the other hand, also when the defective substrate is not the backing substrate, the program determination subroutine ends.

  When the program determination subroutine ends, in S12, the controller 102 changes the production program to the confirmation process inclusion program selected from the confirmation process non-containment program. With the above processing, this control program ends.

<Functional configuration of control device>
The controller 102 of the control device 100 that executes the control program and the controller 122 of the control device 120 can be considered to have a functional configuration as shown in FIG. 2 in view of the execution process. As can be seen from the figure, the controller 102 of the control device 100 includes a program storage unit 150, a determination unit 152, and an operation control unit 154. The program storage unit 150 is a functional unit that stores the confirmation process non-containing program and the confirmation process containing program. The determination unit 152 is a functional unit that determines whether the cause of the defective substrate can be dealt with by direction confirmation, front / back confirmation, and electronic component holding confirmation processing. The operation control unit 154 is a functional unit that controls the operation of the mounting machine 12 according to the confirmation process non-containing program or the confirmation process containing program. In addition, the controller 122 of the control device 120 includes an inspection unit 156. The inspection unit 156 is a functional unit that executes inspection work by the inspection machine 14.

  Incidentally, in the above-described embodiment, the electronic component mounting system 10 is an example of a substrate working system. The electronic component mounting machine 12 is an example of a substrate working machine. The inspection machine 14 is an example of an inspection machine. The parts camera 90, the mark camera 92, and the side view camera 96 are examples of an imaging device. The control device 100 is an example of a control device. The program storage unit 150 is an example of a program storage unit. The operation control unit 154 is an example of an operation control unit. Moreover, the confirmation process non-containing program is an example of the first program. The confirmation process-containing program is an example of a second program.

  In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, direction confirmation, front / back confirmation, and electronic component holding confirmation processing are adopted as processing for confirming the suitability of the mounting work by the mounting machine 12, but various confirmation processing Can be adopted. Specifically, for example, confirmation processing of an electronic component suction position by the suction nozzle 70, an electronic component supply position by the supply device 26, a circuit board holding position by the transport device 20, a warp of the circuit board, and the like may be performed. Is possible.

  Further, in the above embodiment, an imaging device such as the parts camera 90 is used to check the suitability of the mounting work. However, not only the imaging device but also various sensors such as a height sensor and a position sensor are used. Is possible.

  Further, in the above embodiment, the mounting machine 12 is adopted as the work machine for the substrate, but the work machine for discharging and applying the fluid to the circuit board, the work machine for executing various processes on the circuit board, etc. Various work machines can be employed.

  10: Electronic component mounting system (for board work system) 12: Electronic component mounting machine (for board work machine) 14: Inspection machine 90: Parts camera (imaging device) 92: Mark camera (imaging device) 96: Side view camera ( Imaging device) 100: Control device 150: Program storage unit 154: Operation control unit

Claims (4)

An on-board work machine for performing work on the circuit board;
An inspection machine for inspecting a work result for the circuit board on which the work is performed by the substrate work machine;
A substrate working system comprising: a control device that controls the operation of the substrate working machine;
The control device is
A program for storing a first program for performing work on a circuit board by the substrate working machine, and a second program including processing for confirming whether the work by the substrate working machine is appropriate for the first program A storage unit;
And an operation control unit that controls the operation of the substrate work machine according to the second program when it is determined that the work result is not good by the inspection machine. The operation controller is
When it is determined that the work result is not good by the inspection machine, and the occurrence of the work result determined to be not good can be prevented by the processing included in the second program, the counter-to-board according to the second program The on-board working system according to claim 1, wherein the operation of the working machine is controlled. The process included in the second program is:
The on-board work system according to claim 1, wherein the on-board work system is a process for confirming whether or not the work by the on-board work machine is appropriate based on image data obtained by an imaging device provided in the on-board work machine. The board-to-board working system is
An operation button for prohibiting execution of work by the substrate work machine according to the second program;
The operation controller is
Even when the operation result is determined to be not good by the inspection machine, when the operation button is operated by the user, the operation of the substrate work machine is controlled according to the first program. The board | substrate working system as described in any one of Claim 1 thru | or 3.

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