JP2015062037A - Handler device and testing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a handler device that connects devices to be tested to sockets of a testing device at high speed with low power consumption.SOLUTION: A handler device conveys a plurality of devices to be tested and connects the devices to a plurality of sockets provided on a test head of a testing device. The handler device comprises: a position adjustment section that moves each device to be tested on a test tray where the plurality of devices to be tested are mounted, and adjusts the position of each device with respect to the corresponding socket; and a device attachment section that attaches the plurality of devices to be tested whose positions have been adjusted by the position adjustment section to the plurality of sockets.

Description

  The present invention relates to a handler device and a test method.

Conventionally, a handler apparatus is connected to a test apparatus for testing a device under test, transports the device under test in a state of being placed on a test tray, and connects the device under test placed on the test tray and the test apparatus. They were electrically connected (for example, see Patent Documents 1 to 5).
Patent Document 1 JP 2000-147055 JP Patent Document 2 JP 2000-46902 JP Patent Document 3 JP 2009-2860 JP Patent Document 4 JP 2011-39059 JP Patent Document 5 JP 2011-40758 A

  However, when the size of the electrodes of the device under test and the pitch of the electrodes are reduced, the handler apparatus must place the device under test on the test tray with high accuracy. For example, it is difficult for the handler device to place a number of devices under test such as several hundred in a short time while maintaining accuracy.

  In a first aspect of the present invention, a handler device is provided for transporting a plurality of devices under test and connecting them to a plurality of sockets provided in a test head of the test apparatus, wherein the plurality of devices under test are placed. A device for mounting each of the devices under test on the open tray to adjust the position of each socket and a plurality of devices under test whose positions have been adjusted by the position adjusting unit in a plurality of sockets A handler device.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

The structural example of the handler apparatus 100 which concerns on this embodiment is shown with the test head 110, the test tray 20, and the user tray 10. FIG. A configuration example of the socket board 120 of the test head 110 according to the present embodiment is shown together with a socket imaging unit 228. A configuration example of the position adjustment unit 218 according to the present embodiment is shown together with the test tray 20. The operation | movement flow of the handler apparatus 100 and test apparatus which concern on this embodiment is shown. The operation | movement flow with which the handler apparatus 100 which concerns on this embodiment mounts a device under test to a socket is shown. A configuration example at a stage where the fixing unit 510 according to the present embodiment is fixed to the reference pin 422 of the test tray 20 is shown. The test tray 20 according to the present embodiment shows a stage where the lock of the inner unit 410 of the test tray 20 is released. The stage which the actuator 520 which concerns on this embodiment moved the inner unit 410 is shown. The position adjusting unit 218 according to the present embodiment shows a stage in which the movement of the inner unit 410 is finished and moved from the test tray 20 after the inner unit 410 is locked. A stage in which the transport unit 240 according to the present embodiment loads the test tray 20 onto the test unit 220 is shown. The device mounting part 222 according to the present embodiment shows a stage where the device under test 22 is mounted on the socket 122. The 1st modification of the position adjustment part 218 which concerns on this embodiment is shown with the test tray 20 and the temperature control part 212. FIG. A first modification of the position adjustment unit 218 according to the present embodiment shows a stage where the outer unit 420 of the test tray 20 is held. The 2nd modification of the position adjustment part 218 which concerns on this embodiment is shown with the test tray 20 and the temperature control part 212. FIG. The 3rd modification of the position adjustment part 218 which concerns on this embodiment is shown with the test tray 20 and the temperature control part 212. FIG. The third modification of the position adjustment unit 218 according to the present embodiment shows a stage where the third adjustment example is fitted to the reference pin 422 of the outer unit 420 of the test tray 20. The 4th modification of the position adjustment part 218 which concerns on this embodiment is shown with the test tray 20 and the temperature control part 212. FIG. A stage in which the fourth modification of the position adjusting unit 218 according to the present embodiment is fitted to the reference pin 422 of the outer unit 420 of the test tray 20 is shown.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 shows a configuration example of a handler device 100 according to the present embodiment, together with a test head 110, a test tray 20, and a user tray 10. The handler apparatus 100 is connected to the test head 110 of the test apparatus, transports the plurality of devices under test 22 and connects them to the plurality of sockets provided in the test head 110 of the test apparatus.

  Here, the test head 110 includes a socket board 120 having a plurality of sockets, and is electrically connected to the plurality of devices under test 22 via the plurality of sockets. The test head 110 is a part of a test apparatus, and the test apparatus inputs a test signal based on a test pattern for testing a plurality of devices under test 22 to each of the plurality of devices under test 22 to perform a test. The quality of the plurality of devices under test 22 is determined based on the output signals output from the devices under test 22 according to the signals.

  The test apparatus tests a plurality of devices under test 22 such as an analog circuit, a digital circuit, an analog / digital mixed circuit, a memory, and a system on chip (SOC). Each of the plurality of devices under test 22 may have an electrode such as a BGA (Ball Grid Array) or an LGA (Land Grid Array).

  Instead of this, a terminal such as a small outline J-lead (SOJ), a plastic lead chip carrier (PLCC), a quad flat package (QFP), or a small outline package (SOP) may be provided. The socket board 120 has a socket that can be electrically connected to an electrode or terminal of the device under test 22 to be tested.

  The handler device 100 includes a first placement device 200, a heat application unit 210, a test unit 220, a heat removal unit 230, a transport unit 240, a second placement device 250, a detection unit 260, and a control unit. 270. The first placement apparatus 200 places the plurality of devices under test 22 on the test tray 20 from the user tray 10 on which the plurality of devices under test 22 are mounted. The first mounting apparatus 200 may have an arm that sucks the device under test 22, and may move the device under test 22 from the user tray 10 to the test tray 20 by sucking and fixing the device under test 22.

  The test tray 20 may be mounted with a plurality of devices under test 22 arranged in the row direction and the column direction. Even if the test tray 20 is mounted with a plurality of devices under test 22 and is subjected to a temperature condition of a high temperature / low temperature test executed by the test apparatus, stress on the device under test 22 due to cracking, chipping, deformation or the like is applied. It is made of a material that does not generate.

  The heat application unit 210 includes a carry-in loader, and the test tray 20 on which a plurality of devices to be tested 22 before testing are placed is loaded into the heat application unit 210 by the carry-in loader. Prior to the test, the heat application unit 210 controls the temperature of the device under test 22 to the test temperature. Further, the positions of the plurality of devices under test 22 on the test tray 20 are adjusted in the heat application unit 210. The heat application unit 210 includes a temperature control unit 212, a device imaging unit 216, and a position adjustment unit 218.

  The temperature control unit 212 is equipped with the test tray 20 and controls the temperatures of the plurality of devices under test 22 on the test tray 20. The temperature control unit 212 controls the temperatures of the plurality of devices under test 22 to be substantially the same as the temperature conditions of the test executed by the test apparatus. The temperature control unit 212 may include a plurality of temperature control units 214.

  A plurality of temperature control units 214 are provided corresponding to the plurality of devices under test 22, and each device under test 22 is individually provided from the side opposite to the electrode surface or terminal surface connected to the socket of the socket board 120. Heat or cool to. The temperature control unit 214 may be a thermoelectric element such as a Peltier element, and may instead be a cooler or a heater that circulates a refrigerant or a heat medium.

  When the temperature control unit 214 directly controls the temperature from the back surface of the device under test 22 for each device under test 22, the heat application unit 210 performs high speed and low power consumption without precisely controlling the temperature of the entire chamber. Thus, the temperature of the plurality of devices under test 22 can be controlled. Instead, the temperature control unit 212 may control the temperature in the heat application unit 210 to be substantially the same temperature.

  The device imaging unit 216 images the mounting positions of the plurality of devices under test 22 mounted on the test tray 20. The device imaging unit 216 may image the mounting position for each device under test 22, and may instead image the mounting positions of two or more devices under test 22. The device imaging unit 216 may image a plurality of devices under test 22 that have a movable part and are mounted on the test tray 20.

  For example, the device imaging unit 216 includes an imaging camera and the like, and the imaging direction of the imaging camera is arranged so that the test tray 20 is parallel to the mounting surface on which the device under test 22 is mounted. The device under test 22 on the test tray 20 is imaged through the mounted mirror. In this case, the mirror may have an angle of approximately 45 degrees with respect to the mounting surface of the test tray 20 in order to reflect the image of the device under test 22 to the imaging camera.

  The device imaging unit 216 moves the mirror in a direction parallel to the mounting surface of the test tray 20 in the substantially same direction as the imaging direction of the imaging camera, and a plurality of devices under test mounted side by side in the parallel direction. The 22 mounting positions may be imaged. Instead, the device imaging unit 216 may capture the mounting positions of the plurality of devices under test 22 mounted side by side in the parallel direction by moving the mirror and the imaging camera in substantially the same direction as the imaging direction. Here, the parallel direction of the mounting surface of the test tray 20 is taken as the row direction of the mounting surface as an example.

  In this case, the device imaging unit 216 may move the imaging camera and the mirror in a direction substantially perpendicular to the imaging direction of the imaging camera and substantially parallel to the mounting surface of the test tray 20. Thereby, the device imaging unit 216 images the mounting positions of the plurality of devices under test 22 arranged in the row direction of the mounting surface of the test tray 20. In this case, the imaging camera may be mounted on the position adjustment unit 218.

  As described above, the device imaging unit 216 includes an imaging camera, a mirror, and a movable unit, and may image the mounting positions of the plurality of devices under test 22 arranged in the row and column directions of the mounting surface of the test tray 20. . Instead, the device imaging unit 216 arranges the imaging direction of the imaging camera or the like toward the mounting surface of the test tray 20, and moves the imaging camera in the row and column directions of the mounting surface to thereby provide a plurality of devices under test. The 22 mounting positions may be imaged. In this case, the imaging camera may be mounted on the position adjustment unit 218.

  The position adjusting unit 218 moves each device under test 22 on the test tray 20 on which the plurality of devices under test 22 are placed, and adjusts the position with respect to each socket. The position adjustment unit 218 adjusts the position of each device under test 22 in the heat application unit 210. The position adjustment unit 218 may adjust the position of each of the plurality of devices under test 22 controlled to the test temperature in the heat application unit 210. A plurality of position adjusting units 218 may be provided in the heat applying unit 210 to adjust the positions of the plurality of devices under test 22.

  The test unit 220 is a space for testing a plurality of devices under test 22, and the test tray 20 in the heat application unit 210 is transported. The test unit 220 is connected to a test apparatus, and a socket board 120 mounted on the test head 110 of the test apparatus is disposed in the chamber. In the test unit 220, the test tray 20 is conveyed to the socket board 120, and the plurality of devices under test 22 are electrically connected to corresponding sockets. The test unit 220 includes a device mounting unit 222, a drive unit 226, and a socket imaging unit 228.

  The device mounting unit 222 mounts the plurality of devices under test 22 whose positions have been adjusted by the position adjusting unit 218 to the plurality of sockets of the socket board 120. The device mounting part 222 has a plurality of pressing parts 224. A plurality of pressing portions 224 are provided corresponding to the plurality of devices under test 22. The pressing unit 224 pushes the surface opposite to the electrode surface or terminal surface connected to the socket of each device under test 22 toward the socket board 120, and attaches each device under test 22 to the corresponding socket. To do.

  The device mounting unit 222 controls the temperatures of the plurality of devices under test 22 on the test tray 20. The device mounting unit 222 controls the temperatures of the plurality of devices under test 22 so as to satisfy the temperature conditions of the test executed by the test apparatus. The device mounting unit 222 may cause the plurality of pressing units 224 to control the temperatures of the plurality of devices under test 22. Here, the plurality of pressing portions 224 may individually control the temperatures, and instead, the temperatures of the two or more pressing portions 224 may be collectively controlled.

  In this case, the pressing unit 224 is individually heated or cooled from the surface side opposite to the electrode surface or terminal surface of each device under test 22. The pressing unit 224 may include a thermoelectric element such as a Peltier element, and may instead include a cooler or a heater that circulates a refrigerant or a heat medium. Since the pressing unit 224 directly controls the temperature from the back surface of the device under test 22 for each device under test 22, the test unit 220 can perform a plurality of operations at high speed and with low power consumption without precisely controlling the temperature of the entire chamber. The temperature of the device under test 22 can be controlled.

  The drive unit 226 drives the device mounting unit 222. The drive unit 226 controls the movement of the device mounting unit 222 to convey the test tray 20 to the socket board 120 and electrically connect the plurality of devices under test 22 to the corresponding sockets. Further, the driving unit 226 may drive heating or cooling of the pressing unit 224.

  The socket imaging unit 228 images the mounting positions of a plurality of sockets included in the socket board 120. The socket imaging unit 228 may image the mounting position for each socket, and may instead image the mounting positions of two or more sockets. The socket imaging unit 228 may have a movable part and image a plurality of sockets.

  For example, the socket imaging unit 228 has an imaging camera or the like, and the mirror image is mounted on the movable unit by arranging the imaging direction of the imaging camera in a direction parallel to the mounting surface on which the socket board 120 mounts the socket. The socket on the mounting surface is imaged via In this case, the mirror may have an angle of approximately 45 degrees with respect to the mounting surface of the socket board 120 in order to reflect the image of the socket to the imaging camera.

  Also, the socket imaging unit 228 images the mounting positions of a plurality of sockets mounted side by side in the parallel direction by moving the mirror in the parallel direction of the mounting surface of the socket board 120 that is the imaging direction of the imaging camera. . Here, the parallel direction of the mounting surface of the socket board 120 is taken as a row direction of the mounting surface as an example. In this case, the socket imaging unit 228 may move the imaging camera and the mirror in a direction substantially perpendicular to the imaging direction of the imaging camera and substantially parallel to the mounting surface of the socket board 120. Thereby, the socket imaging unit 228 images the mounting positions of the plurality of sockets arranged in the row direction of the mounting surface of the socket board 120.

  As described above, the socket imaging unit 228 includes an imaging camera, a mirror, and a movable unit, and may image the mounting positions of a plurality of sockets arranged in the row and column directions of the mounting surface of the socket board 120. Instead, the socket imaging unit 228 arranges the imaging direction of the imaging camera or the like toward the mounting surface of the socket board 120, and moves the imaging camera in the row and column directions of the mounting surface to mount a plurality of sockets. The position may be imaged.

  The heat removal unit 230 is a space in which the test tray 20 is carried from the test unit 220, and the carried test tray 20 is carried out of the heat removal unit 230. The heat removal unit 230 has a carry-out loader, and the test tray 20 on which a plurality of devices under test 22 are placed by the carry-out loader is unloaded outside the heat removal unit 230. The heat removal unit 230 includes a temperature control unit 280.

  The temperature control unit 280 controls the temperature of the loaded test tray 20 in the heat removal unit 230. The temperature control unit 280 heats or cools the plurality of devices under test 22 having the test temperatures that are carried in from the test unit 220 to a predetermined temperature range that is approximately the same as the room temperature. The temperature control unit 280 may include a thermoelectric element such as a Peltier element, and may instead include a cooler or a heater that circulates a refrigerant or a heat medium.

  The transport unit 240 transports the test tray 20 from the heat application unit 210 to the test unit 220 and from the test unit 220 to the heat removal unit 230. The transport unit 240 may receive the test tray 20 that is transported from a transport loader included in the heat application unit 210. Moreover, the conveyance part 240 may deliver the test tray 20 to the carrying-out loader which the heat removal part 230 has.

  The second placement apparatus 250 places the plurality of devices under test 22 on the user tray 10 from the test tray 20 on which the plurality of devices under test 22 are mounted. The second mounting apparatus 250 may have an arm that sucks the device under test 22, and may move the device under test 22 from the test tray 20 to the user tray 10 by sucking and fixing the device under test 22.

  From the images captured by the device imaging unit 216 and the socket imaging unit 228, the detection unit 260 arranges each of the plurality of devices under test 22 on the test tray 20 and each of the plurality of sockets included in the socket board 120. Is detected. The detection unit 260 compares the arrangement on the test tray 20 with the arrangement of the socket to which the device under test 22 is connected for each device under test 22, and adjusts the position of the device under test 22 with respect to the socket. Is detected.

  The detection unit 260 detects the movement direction and the movement amount that are the adjustment amount of the device under test 22 to be adjusted. The detection unit 260 may detect the XY direction on the test tray and the amount of movement in each direction as the adjustment amount, and may detect the rotation direction and the rotation angle θ on the test tray. The detection unit 260 transmits the detection result to the control unit 270.

  The control unit 270 receives the detection result of the detection unit 260, specifies the device under test 22 to be adjusted and the adjustment amount to the position adjustment unit 218 based on the detection result, and adjusts the position of the device under test 22 Let The control unit 270 is connected to the first mounting device 200, the transport unit 240, the driving unit 226, the second mounting device 250, a loader loader, a loader loader, and the like, and mounts and tests a plurality of devices under test 22. The loading / unloading of the tray 20, the driving of the device mounting unit 222, and the conveyance of the test tray 20 may be controlled.

  The control unit 270 may be connected to the temperature control unit 212, the device mounting unit 222, and the temperature control unit 280 to control the temperatures of the plurality of devices under test 22. The control unit 270 may notify the test apparatus of the completion of mounting of the plurality of devices under test 22 after mounting the plurality of devices under test 22 in the corresponding sockets.

  FIG. 2 shows a configuration example of the socket board 120 of the test head 110 according to the present embodiment together with the socket imaging unit 228. This figure shows a schematic configuration of a cross section of the socket board 120. The socket board 120 includes a socket 122 and a reference pin insertion portion 124.

  The socket 122 is electrically connected to the device under test 22, transmits a test signal supplied from the test apparatus to the device under test 22, and transmits a response signal corresponding to the test signal to the test apparatus. A plurality of sockets 122 may be provided on the socket board 120, and may be mounted in a row direction and a column direction on the opposite surface of the socket board 120 from the test head 110. The socket 122 includes a plurality of electrodes 126 that can be electrically connected to electrodes or terminals of the device under test 22.

  The reference pin insertion part 124 is provided on the surface on which the socket 122 of the socket board 120 is mounted, and the reference pin included in the test tray 20 is inserted therein. Two or more reference pin insertion portions 124 may be provided for one socket 122. The reference pin insertion portions 124 are preferably provided in the vicinity of the four corners of the socket 122, respectively.

  The socket imaging unit 228 images each of the plurality of sockets 122 together with the corresponding reference pin insertion unit 124. The socket imaging unit 228 images the socket 122 and the corresponding reference pin insertion unit 124 as the mounting position of the socket 122. The detection unit 260 is inserted from the captured image into the center position of the socket 122 indicated by the line AA ′ and the reference pin insertion unit 124 indicated by the lines BB ′ and CC ′ in the drawing. The center position of the reference pin is extracted. That is, the detection unit 260 detects the relative position between the center position of the socket 122 and the center position of the reference pin as the mounting position of the socket 122.

  FIG. 3 shows a configuration example of the position adjustment unit 218 according to the present embodiment together with the test tray 20. This figure shows a schematic configuration of a cross section. The position adjustment unit 218 circulates each of the two or more devices under test 22 to adjust the position of the device under test 22 relative to the socket 122. The position adjustment unit 218 has a movable part and may circulate on the test tray 20. Here, the test tray 20 includes an inner unit 410, an outer unit 420, and a reference pin 422 corresponding to each of the plurality of devices under test 22. Further, the position adjustment unit 218 includes a fixing unit 510 and an actuator 520.

  The inner unit 410 mounts each device under test 22. The inner unit 410 is placed so that the center of the device under test 22 is located at a predetermined position. For example, the inner unit 410 is placed with the center of the device under test 22 positioned at a position indicated by a line dd ′ in the drawing. The inner unit 410 may include a spring that applies a force in a direction parallel to the mounting surface of the test tray 20 to fix the device under test 22. The inner unit 410 may be formed with a through hole to expose a part of the surface of the device under test 22 on the temperature control unit 212 side.

  The outer unit 420 is fixed to the test tray 20 and includes a lock mechanism that mechanically switches whether the inner unit 410 is locked or movable. The outer unit 420 includes a release portion 430 as the lock mechanism. The release unit 430 may unlock the inner unit 410 by an instruction from the control unit 270 or an unlocking operation of the position adjusting unit 218. The outer unit 420 may be formed with a through hole to expose a part of the surface of the inner unit 410 on the temperature control unit 212 side.

  The plurality of reference pins 422 are arranged at predetermined positions on the mounting surface of the test tray 20 and are respectively inserted into the plurality of reference pin insertion portions 124 provided on the socket board 120. In the figure, an example is shown in which the reference pin 422 is placed on the test tray 20 around the positions indicated by the line ee ′ and the line ff ′. In the drawing, an example in which a plurality of reference pins 422 are placed on the outer unit 420 is shown. A line AA ′ in the drawing indicates an example of the center position of the socket 122 detected by the detection unit 260 described in FIG. 2.

  The fixing unit 510 is fixed to a plurality of reference pins 422 arranged on the test tray 20. The fixing unit 510 includes a guide, a groove, a rail, or the like corresponding to the shape of the reference pin 422 and may be fixed to the reference pin 422. Instead of this, the fixing part 510 may have a reference pin insertion part into which the reference pin 422 is inserted and may be fixed to the reference pin 422.

  The actuator 520 adjusts the position of the device under test 22 relative to the socket 122. For example, the actuator 520 moves the inner unit 410 relative to the outer unit 420 after the inner unit 410 is unlocked. The figure shows an example in which one set of device under test 22 is provided with one set of fixing portion 510 and actuator 520 and the position of the device under test 22 is adjusted.

  Instead, a plurality of actuators 520 may be provided for one fixed portion 510, and the positions of the plurality of devices under test 22 may be adjusted. In this case, the plurality of actuators 520 may be arranged in the row direction according to the positions of the plurality of devices under test 22 arranged in the row direction of the test tray 20. Here, each of the plurality of actuators 520 arranged in the row direction sequentially adjusts the positions of two or more devices under test 22 in the column direction.

  Instead, the plurality of actuators 520 may be arranged in the row direction according to the positions of the plurality of devices under test 22 arranged in the row direction of the test tray 20. In this case, each of the plurality of actuators 520 arranged in the column direction sequentially adjusts the positions of two or more devices under test 22 in the row direction.

  As described above, when the plurality of actuators 520 are provided in the heat application unit 210, the lock mechanism releases the inner unit 410 for each of the devices under test 22, and each of the plurality of actuators 520 includes the inner unit 410 as the outer unit. After being moved relative to 420, the locking mechanism may lock the outer unit 420. Thus, the position adjustment unit 218 can adjust the position on the test tray 20 for each device under test 22 using a plurality of actuators 520.

  Here, the device imaging unit 216 images the inner unit 410 and the outer unit 420 for each of the plurality of devices under test 22. For example, the device imaging unit 216 images the device under test 22 and the corresponding reference pin 422 as the mounting position of the device under test 22.

  The detection unit 260 detects the relative positions of the inner unit 410 and the outer unit 420 from the image captured by the imaging unit. For example, the detection unit 260 determines, from the captured image, the center position of the device under test 22 indicated by a line dd ′ in the figure, and a reference pin indicated by a line ee ′ and a line ff ′ in the figure. The center position of 422 is extracted, and the relative position of the device under test 22 from the reference pin 422 is detected.

  FIG. 4 shows an operation flow of the handler apparatus 100 and the test apparatus according to the present embodiment. First, the handler apparatus 100 places the device under test 22 on the test tray 20 (S400). The first placement device 200 places a plurality of devices under test 22 from the user tray 10 to the inner unit 410 of the test tray 20.

  Next, the loader included in the heat application unit 210 loads the test tray 20 onto the heat application unit 210 (S410). In the heat application unit 210, the temperature control unit 212 receives and mounts the test tray 20 from the loading loader, and the temperature control unit 214 executes the temperatures of the plurality of devices under test 22 on the test tray 20. The temperature is controlled to be substantially the same as the test temperature condition.

  When the inner unit 410 and the outer unit 420 are formed with through holes, the temperature control unit 214 may directly contact the corresponding device under test 22 and heat or cool it. When the through hole is not formed in the inner unit 410, the temperature control unit 214 may be heated or cooled by contacting a part of the inner unit 410 adjacent to the corresponding device under test 22.

  Next, the socket imaging unit 228 images the mounting positions of the plurality of sockets 122 included in the socket board 120, and the detection unit 260 detects each mounting position of the plurality of sockets 122 based on the image captured by the socket imaging unit 228. Is detected (S420). Here, the socket imaging unit 228 and the detection unit 260 may detect the position of the socket 122 in parallel with the temperature control of the device under test 22 of the temperature control unit 214.

  Instead of this, the socket imaging unit 228 and the detection unit 260 may perform the position detection of the socket 122 in advance before the temperature control of the temperature control unit 214. For example, the socket imaging unit 228 and the detection unit 260 may detect the position of the socket 122 before the test is started. Instead, the socket imaging unit 228 and the detection unit 260 may detect the position of the socket 122 after the temperature in the test unit 220 is controlled to be substantially the same as the test temperature.

  Next, the device imaging unit 216 images the inner unit 410 and the outer unit 420 for each of the plurality of devices under test 22, and the detection unit 260 determines the center position of the device under test 22 from the captured images. A relative position with respect to the reference pin 422 is detected (S430). Here, the detection unit 260 may detect whether or not the position on the test tray 20 should be adjusted by comparing the relative position of the device under test 22 with the mounting position of the corresponding socket 122. For example, the detection unit 260 determines that the device under test 22 should be adjusted when the difference between the relative position of the device under test 22 and the mounting position of the corresponding socket 122 is outside a predetermined range.

  The device imaging unit 216 and the detection unit 260 may detect the position of the device under test 22 after the temperature control of the device under test 22 by the temperature control unit 214 is completed. Instead, the device imaging unit 216 and the detection unit 260 may detect the position of the device under test 22 in parallel with the temperature control of the device under test 22 by the temperature control unit 214.

  Next, the handler apparatus 100 attaches the plurality of devices under test 22 to the corresponding sockets 122 (S440). The flow of mounting a plurality of devices under test 22 to the corresponding sockets 122 will be described in detail with reference to FIG.

  Next, the test apparatus executes a test of the plurality of devices under test 22 (S450). The test apparatus may execute tests on a plurality of devices under test 22 at the same time.

  Next, the handler apparatus 100 loads the test tray 20 from the test unit 220 to the heat removal unit (S460). Here, the drive unit 226 drives the device mounting unit 222 to move the test tray 20 and detaches the plurality of devices under test 22 from the corresponding sockets 122.

  In addition, the drive unit 226 drives the device mounting unit 222 to deliver the test tray 20 to the transport unit 240. The transport unit 240 transports the received test tray 20 from the test unit 220 to the heat removal unit 230. The temperature controller 280 controls the plurality of devices under test 22 within a predetermined temperature range in the heat removal unit 230.

  Next, the second placement device 250 places the plurality of devices under test 22 on the user tray 10 (S470). Through the above operation flow, the handler apparatus 100 attaches a plurality of devices under test 22 placed on the user tray 10 to the corresponding sockets 122, executes a test of the test apparatus, and then again places a plurality of devices on the user tray 10 on the user tray 10. The device under test 22 is placed.

  FIG. 5 shows an operation flow in which the handler apparatus 100 according to the present embodiment attaches the device under test to the socket. 6 to 11 show configuration examples of the handler device 100 at each stage of the operation flow.

  First, the fixing unit 510 of the position adjusting unit 218 is fixed to a plurality of reference pins 422 arranged on the test tray 20 (S500). Here, the control unit 270 may be connected to a movable unit included in the position adjustment unit 218 and may move the position adjustment unit 218 to fix the fixing unit 510 to the reference pin 422. FIG. 6 shows a configuration example at a stage where the fixing portion 510 according to the present embodiment is fixed to the reference pin 422 of the test tray 20. A line AA ′ in the drawing indicates an example of the center position of the socket 122 detected by the detection unit 260 described with reference to FIGS. 2 and 3.

  Next, the handler device 100 unlocks the inner unit 410 (S510). Here, the heat application unit 210 may include an operation unit that operates the lock mechanism in response to an unlocking instruction from the control unit 270. The operation unit may contact the release unit 430 and move the release unit 430 in accordance with an instruction from the control unit 270 to release the lock.

  Instead, the test tray 20 may include an operation unit that receives an unlock signal from the control unit 270 via the temperature control unit 212 and releases the lock of the release unit 430. FIG. 7 shows a stage where the test tray 20 according to the present embodiment unlocks the inner unit 410 of the test tray 20.

  Next, the actuator 520 moves the inner unit 410 relative to the outer unit 420 (S520). The actuator 520 adjusts the position of the inner unit 410 with respect to the outer unit 420 based on the relative position detected by the detection unit 260. Thus, the position adjusting unit 218 can adjust the position of the device under test 22 on the test tray 20. For example, the detection unit 260 determines the movement direction and movement of the inner unit 410 based on the difference between the relative position from the center position of the reference pin 422 to the center position of the socket 122 and the relative position from the reference pin 422 to the device under test 22. Detect distance.

  In other words, the detection unit 260 matches the relative position from the center position of the reference pin 422 to the center position of the socket 122 and the relative position from the reference pin 422 to the device under test 22 or a predetermined range. Detect the moving direction and moving distance inside. Here, the detection unit 260 may set the predetermined range as the range of the movement error of the actuator 520.

  The actuator 520 moves the inner unit 410 according to the moving direction and moving distance detected by the detection unit 260. In FIG. 8, the stage which the actuator 520 which concerns on this embodiment moved the inner unit 410 is shown. In the drawing, the actuator 520 moves the inner unit 410 in the direction of the arrow in the drawing, and the line AA ′ that is the center position of the socket 122 and the line dd ′ that is the center position of the device under test 22. An example in which is matched.

  Next, the handler apparatus 100 locks the inner unit 410 (S530). Here, when the heat application unit 210 includes an operation unit, the operation unit may contact the release unit 430 and move the release unit 430 to be locked in accordance with an instruction from the control unit 270. Instead, the test tray 20 may receive the lock signal from the control unit 270 via the temperature control unit 212 and lock the release unit 430.

  Next, the position adjustment unit 218 moves by removing the reference pin 422 of the test tray 20 (S540). The position adjustment unit 218 may move to the device under test 22 to be adjusted next. The handler apparatus 100 performs relative position detection and position adjustment for each of the plurality of devices under test 22.

  The handler apparatus 100 may execute relative position detection and position adjustment for each device under test 22. Instead, the handler apparatus 100 detects relative positions of a plurality of devices under test 22 and then adjusts the position. May be performed. FIG. 9 shows a stage in which the position adjusting unit 218 according to the present embodiment has finished moving the inner unit 410 and moved from the test tray 20 after the inner unit 410 is locked.

  After completing the adjustment of the plurality of devices under test 22 to be adjusted on the test tray 20, the handler apparatus 100 transports the test tray 20 to the test unit 220 (S550). Here, the temperature control unit 212 delivers the mounted test tray 20 to the transport unit 240, and the transport unit 240 transports the received test tray 20 to the test unit 220. The transport unit 240 delivers the transported test tray 20 to the device mounting unit 222 in the test unit 220.

  FIG. 10 shows a stage where the transport unit 240 according to the present embodiment loads the test tray 20 onto the test unit 220. The device mounting portion 222 uses the pressing portion 224 to individually heat or cool the device under test 22 from the surface side opposite to the electrode surface or terminal surface connected to the socket 122.

  When the through-hole is formed in the inner unit 410 and the outer unit 420, the pressing unit 224 may be heated or cooled by directly contacting the corresponding device under test 22. When the through-hole is not formed in the inner unit 410, the pressing unit 224 may be heated or cooled by contacting a part of the inner unit 410 adjacent to the corresponding device under test 22.

  Next, the device mounting unit 222 mounts the device under test 22 on the socket 122 (S560). When the through hole is formed in the inner unit 410 and the outer unit 420, the pressing unit 224 may directly contact the corresponding device under test 22 and press the device under test 22. When the through hole is not formed in the inner unit 410, the pressing unit 224 may contact and press a part of the inner unit 410 adjacent to the corresponding device under test 22.

  Here, since the position adjustment unit 218 matches the center positions of the socket 122 and the device under test 22 with the reference pin 422 as a reference, the pressing unit 224 pushes the device under test 22 to move the reference pin 422. When inserted into the reference pin insertion portion 124, the device under test 22 is attached to the socket 122. That is, the plurality of electrodes 24 included in the device under test 22 and the plurality of electrodes 126 of the corresponding socket 122 are electrically connected. FIG. 11 shows a stage where the device mounting portion 222 according to the present embodiment mounts the device under test 22 on the socket 122.

  Through the above operation flow, the handler apparatus 100 adjusts the positions of the plurality of devices under test 22 on the test tray 20 with respect to the corresponding sockets 122, and attaches the plurality of devices under test 22 to the corresponding sockets 122. The apparatus can test the plurality of devices under test 22. Further, the handler apparatus 100 places the plurality of devices under test 22 on the user tray 10 again after the test of the test apparatus is executed from the state where the plurality of devices under test 22 are placed on the user tray 10. Processing up to this can be automatically executed.

  Further, since the position adjustment unit 218 sequentially adjusts the positions of the plurality of devices under test 22 with reference to the reference pin 422, when the device mounting unit 222 presses the test tray 20, the plurality of devices under test 22 correspond. The socket 122 is attached. Therefore, the handler apparatus 100 can automatically and quickly attach a plurality of devices under test 22 to the corresponding sockets 122 even when several hundreds of devices under test 22 are attached to the sockets 122. Further, the handler apparatus 100 increases the position detection accuracy of the device under test 22, the socket 122, and the reference pin 422 and the movement accuracy of the actuator 520 as compared with the electrode size and electrode pitch of the device under test 22. The device under test 22 having a fine electrode structure can be attached to the corresponding socket 122.

  FIG. 12 shows a first modification of the position adjustment unit 218 according to the present embodiment, together with the test tray 20 and the temperature control unit 212. FIG. 13 shows a stage where the first modification of the position adjustment unit 218 according to the present embodiment is fixed to the reference pin 422 of the outer unit 420 of the test tray 20. In the position adjustment unit 218 of the present modification, the same reference numerals are given to the substantially same operations as those of the position adjustment unit 218 according to the present embodiment shown in FIG.

  The test tray 20 further includes a release pin 424. The release pin 424 is provided on the frame of the outer unit 420 and is pushed by the position adjusting unit 218 when the inner unit 410 is released. The release pin 424 may be provided in the outer unit 420 via an elastic spring or the like, and may release the lock by releasing the inner unit 410 while being pushed by the position adjusting unit 218.

  The release part 430 according to the present embodiment releases the pressing of the inner unit 410 when the release pin 424 is pressed. In the drawing, an example in which the release pin 424 and the release portion 430 are integrally formed is shown.

  In addition, the temperature control unit 212 according to the present embodiment further includes a positioning pin insertion unit 622. The positioning pin insertion part 622 may be provided at a position where the relative distance and direction from the plurality of reference pins 422 on the test tray 20 are predetermined. A plurality of positioning pin insertion portions 622 are provided on the surface side on which the test tray 20 of the temperature control unit 212 is mounted, and determines the position of the position adjustment unit 218. The positioning pin insertion unit 622 is provided for each row and column when the position adjustment unit 218 adjusts the positions of the plurality of devices under test 22 arranged in the row direction or the column direction of the test tray 20. The position of 218 may be determined.

  The position adjustment unit 218 according to the present embodiment includes a reference pin insertion unit 512, a pin pressing unit 514, and a base unit 610. The reference pin 422 is inserted into the reference pin insertion portion 512. When the reference pin 422 is inserted into the reference pin insertion portion 512, the fixing portion 510 is fixed to the reference pin 422. The pin pushing part 514 may push the release pin 424 in response to the position adjustment part 218 being fitted to the inner unit 410 or the outer unit 420. Thereby, the release part 430 releases the lock of the inner unit 410.

  Base portion 610 fixes fixing portion 510 and pin pressing portion 514. The base portion 610 includes an actuator 520 that can move in the XYZ and θ directions with respect to the base portion 610. The base portion 610 includes a positioning pin 612, a spring portion 614, a driving portion 710, and a driving portion 720.

  The positioning pin 612 is inserted into the positioning pin insertion part 622 of the temperature control part 212 and determines the position of the reference pin 422 and the base part 610 of the test tray 20. That is, when the positioning pin 612 is inserted into the positioning pin insertion portion 622, the corresponding reference pin 422 of the test tray 20 is inserted into the reference pin insertion portion 512, and the fixing portion 510 is fixed. That is, if the control unit 270 inserts the positioning pin 612 of the position adjusting unit 218 into the corresponding positioning pin insertion unit 622 according to the device under test 22 to be adjusted, the outer unit 420 corresponding to the device under test 22 is inserted. The fixing portion 510 can be fixed to the reference pin 422.

  The spring portion 614 is provided between the base portion 610 and the fixing portion 510 and absorbs an impact or the like when the fixing portion 510 comes into contact with and fits with the outer unit 420. The spring portion 614 adjusts the strength with which the fixing portion 510 is pushed when the fixing portion 510 is fitted to the outer unit 420. The spring portion 614 has a smaller spring constant than the spring or the like that the release pin 424 has.

  The drive unit 710 moves the base unit 610 in the XY directions. The position adjustment unit 218 can adjust the positions of the plurality of devices under test 22 on the test tray 20 by the movement in the XY direction by the driving unit 710 and the movement in the Z direction by the temperature control unit 212. The driving unit 710 may move the base unit 610 in the θ direction and / or the Z direction. The driving unit 710 may be connected to the control unit 270 and instructed by the control unit 270 to move the base unit 610.

  The driving unit 720 is connected to the pin pressing unit 514 and moves the pin pressing unit 514. The driving unit 720 moves the pin pressing unit 514 toward the test tray 20 and presses the release pin 424 to release the lock of the inner unit 410. Further, the drive unit 720 moves the pin pressing unit 514 in a direction away from the test tray 20 to release the lock of the inner unit 410. According to the first modified example of the position adjusting unit 218 according to the present embodiment described above, the fixing unit 510 can be accurately fixed to the reference pin 422 corresponding to the device under test 22 to be adjusted.

  FIG. 14 shows a second modification of the position adjustment unit 218 according to the present embodiment, together with the test tray 20 and the temperature control unit 212. In the position adjustment unit 218 of the present modification, the same reference numerals are given to the substantially same operations as those of the position adjustment unit 218 according to the present embodiment shown in FIGS. 3, 12, and 13, and description thereof is omitted. To do.

  The test tray 20 according to this modification includes a release pin 424 and a release unit 430 individually. Moreover, in this modification, the example in which the test tray 20 has the function of an outer unit and locks the inner unit 410 is shown. The release pin 424 is provided on the test tray 20 and is pushed by the position adjusting unit 218 when the inner unit 410 is released. The release unit 430 releases the pressing of the inner unit 410 when the release pin 424 is pressed. The release portion 430 may be provided on the test tray 20 via an elastic spring or the like, and the inner unit 410 may be released to release the lock while the release pin 424 is pressed by the position adjustment portion 218. .

  Thereby, the test tray 20 can increase the design freedom of the release pin 424 and the release part 430. Further, since the test tray 20 transmits the strength with which the release pin 424 is pressed to the release portion 430 via a part such as a lever, the degree of freedom in designing the strength with which the position adjusting portion 218 should press the release pin 424 is increased. Can do. In the present modification, the example in which the test tray 20 has the function of the outer unit has been described, but instead, the test tray 20 may have an outer unit.

  FIG. 15 shows a third modification of the position adjustment unit 218 according to the present embodiment, together with the test tray 20 and the temperature control unit 212. FIG. 16 shows a stage where the third modification of the position adjusting unit 218 according to the present embodiment is fitted to the reference pin 422 of the outer unit 420 of the test tray 20. In the position adjustment unit 218 of the present modification, the same reference numerals are given to the substantially same operations as those of the position adjustment unit 218 according to the present embodiment shown in FIGS. 3, 12, and 13, and description thereof is omitted. To do.

  The position adjustment unit 218 according to the present embodiment moves the outer unit 420 to adjust the positions of the plurality of devices under test 22 relative to the corresponding sockets 122. That is, the fixing portion 510 is fixed to the inner unit 410. The actuator 520 has a reference pin insertion portion 512 and moves the outer unit 420. In addition, the drive unit 720 according to the present embodiment is connected to the actuator 520 and moves the actuator 520.

  For example, when the positioning pin 612 is inserted into the positioning pin insertion portion 622, the corresponding reference pin 422 of the test tray 20 is inserted into the reference pin insertion portion 512, and the actuator 520 is fitted with the outer unit 420. Further, the fixing portion 510 is fixed to the inner unit 410. Here, the inner unit 410 may be fixed by being sandwiched between the temperature control unit 214 and the fixing unit 510 via the device under test 22.

  Here, the drive unit 720 moves the actuator 520 in the direction of the test tray 20 and pushes the reference pin 422 via the reference pin insertion unit 512. As a result, the release part 430 moves and the lock between the inner unit 410 and the outer unit 420 is released.

  The actuator 520 moves the outer unit 420 in response to the unlocking. After the actuator 520 completes the movement of the outer unit 420, the driving unit 720 moves the actuator 520 in the direction opposite to the test tray 20 to lock the inner unit 410 and the outer unit 420.

  According to the third modification of the position adjustment unit 218 according to the above-described embodiment, the test tray 20 does not need to include the release pin 424, and the position adjustment unit 218 does not include the pin pressing unit 514. Good. That is, the position adjusting unit 218 can adjust the positions of the plurality of devices under test 22 with a simple configuration.

  FIG. 17 shows a fourth modification of the position adjustment unit 218 according to this embodiment, together with the test tray 20 and the temperature control unit 212. FIG. 18 shows a stage where the fourth modification of the position adjusting unit 218 according to the present embodiment is fitted to the reference pin 422 of the outer unit 420 of the test tray 20. In the position adjustment unit 218 of the present modification, the same reference numerals are given to the substantially same operations as those of the position adjustment unit 218 according to the present embodiment shown in FIGS. 15 and 16, and the description thereof is omitted.

  The position adjustment unit 218 according to the present embodiment moves the outer unit 420 and adjusts the positions of the plurality of devices under test 22 relative to the corresponding sockets 122, as in the third modification of the position adjustment unit 218 described above. . The position adjustment unit 218 according to this embodiment further includes a spring portion 522 having a larger spring constant than the spring portion 614. Further, the fixed portion 510 moves as the spring portion 522 contracts, and the relative position with the actuator 520 changes. As an example, the fixed portion 510 moves in a direction away from the test tray 20 when the spring portion 522 contracts.

  Similar to the above-described third modification of the position adjustment unit 218, when the positioning pin 612 is inserted into the positioning pin insertion unit 622, the corresponding reference pin 422 of the test tray 20 is inserted into the reference pin insertion unit 512, and the actuator 520 fits with the outer unit 420.

  Here, when the positioning pin 612 is inserted deeper into the positioning pin insertion portion 622, the spring portion 614 having a small spring constant contracts, and the fixing portion 510 is fixed to the inner unit 410. Further, when the positioning pin 612 is inserted deeper into the positioning pin insertion portion 622, the elastic force of the spring portion 614 and the elastic force of the spring portion 522 become approximately the same, and the spring portion 522 contracts. It moves in a direction away from the test tray 20 as compared to the actuator 520.

  That is, the actuator 520 pushes the reference pin 422 via the reference pin insertion portion 512, and the release portion 430 moves and the lock between the inner unit 410 and the outer unit 420 is released. Thus, the actuator 520 can move the outer unit 420. Further, after the actuator 520 completes the movement of the outer unit 420, the inner unit 410 and the outer unit 420 can be locked by separating the positioning pin 612 from the positioning pin insertion portion 622.

  According to the fourth modified example of the position adjustment unit 218 according to the above-described embodiment, the drive unit can be made one. That is, the position adjusting unit 218 can adjust the positions of the plurality of devices under test 22 with a simpler configuration.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

10 user tray, 20 test tray, 22 device under test, 24 electrodes, 100 handler device, 110 test head, 120 socket board, 122 socket, 124 reference pin insertion portion, 126 electrodes, 200 first mounting device, 210 heat application Unit, 212 temperature control unit, 214 temperature control unit, 216 device imaging unit, 218 position adjustment unit, 220 test unit, 222 device mounting unit, 224 pressing unit, 226 drive unit, 228 socket imaging unit, 230 heat removal unit, 240 Conveying unit, 250 Second mounting device, 260 detection unit, 270 control unit, 280 temperature control unit, 410 inner unit, 420 outer unit, 422 reference pin, 424 release pin, 430 release unit, 510 fixing unit, 512 reference pin Insertion part, 51 Pushpin unit, 520 actuator, 522 spring portion 610 base portion 612 positioning pin, 614 spring portion 622 positioning pin insertion portion, 710 driver, 720 driver

According to a first aspect of the present invention , there is provided a mechanism for mounting a device, comprising: an inner unit for mounting the device; and an outer unit movable relative to the inner unit; Provided is a mechanism capable of mechanically switching between locking an outer unit or releasing a lock .

Claims (11)

A handler device that conveys a plurality of devices under test and connects them to a plurality of sockets provided in a test head of a test apparatus,
A position adjusting unit that moves each of the devices under test on a test tray on which the plurality of devices under test are placed, and adjusts the position with respect to each of the sockets;
A device mounting section for mounting the plurality of devices under test whose positions are adjusted by the position adjusting section to the plurality of sockets;
A handler device comprising: A heat application unit loaded with the test tray on which the plurality of devices under test before testing are placed;
A test unit that is a space for testing the plurality of devices under test and that transports the test tray in the heat application unit;
With
The handler device according to claim 1, wherein the position adjustment unit adjusts the position of each device under test in the heat application unit. The heat application unit controls the temperature of the device under test to a test temperature prior to the test,
The handler device according to claim 2, wherein the position adjustment unit adjusts the position of each of the plurality of devices under test controlled to a test temperature in the heat application unit.   A plurality of temperature control units that are provided corresponding to the plurality of devices under test and that individually heat or cool each device under test from the side opposite to the terminal surface connected to the socket; The handler apparatus of Claim 3 provided.   The said position adjustment part circulates each of the two or more devices under test, and has an actuator which adjusts the position with respect to the said socket of each said device under test. Handler device. The test tray is arranged with the plurality of devices under test arranged in a row direction and a column direction,
The handler apparatus according to claim 5, wherein each of the plurality of actuators arranged in a row direction sequentially adjusts the positions of two or more devices under test in a column direction. The test tray corresponds to each of the plurality of devices under test,
An inner unit for mounting each of the devices under test;
An outer unit including a lock mechanism that mechanically switches whether the inner unit is locked or movably held;
Have
For each of the devices under test, the position adjusting unit releases the inner unit by the lock mechanism, moves the inner unit relative to the outer unit, and then moves the inner unit by the lock mechanism. The handler device according to claim 5 or 6. The locking mechanism is
A release pin that is provided on a frame of the outer unit and is pushed by the position adjusting unit when releasing the inner unit;
When the release pin is pressed, a release portion that releases the pressing of the inner unit;
Including
The handler device according to claim 7, wherein the position adjusting unit includes a pin pressing unit that presses the release pin in response to the fitting with the inner unit or the outer unit. For each of the plurality of devices under test, a device imaging unit that images the inner unit and the outer unit;
A detection unit that detects a relative position of the inner unit and the outer unit from an image captured by the device imaging unit;
With
The handler device according to claim 7 or 8, wherein the actuator adjusts the position of the inner unit with respect to the outer unit based on the detected relative position. A socket imaging unit that images the mounting positions of the plurality of sockets on the test head;
The detection unit compares an image captured by the socket imaging unit with an image captured by the device imaging unit, and adjusts the device under test to be adjusted by the position adjustment unit and the device under test to be adjusted The handler device according to claim 9, wherein the amount is detected. A test method for testing a plurality of devices under test,
A position adjustment step of moving each of the devices under test on a test tray on which the plurality of devices under test are placed, and adjusting the position with respect to the corresponding socket;
A device mounting step of mounting the plurality of devices under test whose positions have been adjusted in the position adjustment step to a plurality of sockets;
Testing the plurality of devices under test mounted in the plurality of sockets;
A test method comprising:

Images