JP2015053012A - Method for determining parameter of current plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for determining parameters of current plates for improving exhaust heat efficiency of an ICT device while considering a specific state per server room.SOLUTION: A method for determining parameters of current plates comprises the steps of: modeling a server room on the basis of dimension information of the server room, position information of an ICT device, dimension information of the ICT device, and parameters of the current plates, and simulating a flow of cool air supplied into the ICT device on the basis of temperature information of the cool air blown out from an indoor machine, air volume information of the cool air blown out from the indoor machine, heat output information generated from a load of the ICT device, and air volume information of a fan of the ICT device; calculating a suction temperature and an exhaust temperature of the ICT device while changing the parameters of the current plates; and calculating exhaust heat efficiency on the basis of the suction temperature and the exhaust temperature and determining parameters of a current plate in which the exhaust heat efficiency becomes the maximum.

Description

  The present invention relates to a method of determining rectifying plate parameters, and more particularly to a method of determining rectifying plate parameters for efficiently removing heat generated from a load of an ICT device.

  In recent years, an enormous number of ICT devices have been used with the rapid increase in the use of ICT (Information and Communication Technology) by companies. In this specification, the ICT device refers to a server, a router, or the like. In order to cool loads such as the CPU and power supply unit of the ICT apparatus, the problem of an increase in power consumption in the cooling operation of air conditioning is becoming serious, and improvement in air conditioning efficiency is required.

  The ICT apparatus is generally stored in a 19-inch server rack conforming to the US EIA standard and accommodated in a server room. In addition, the spatial interval between adjacent server racks is constant, and a plurality of ICT devices are installed in the case of one server rack.

  Cold air from the indoor unit of the air conditioner enters from the front of the intake port of the ICT device, and is sent into the ICT device by a fan built in the ICT device. Then, the cold air is warmed by the heat generated by the load of the CPU of the ICT device, and the hot air is exhausted from the exhaust port of the ICT device. Therefore, it is required to cool the load of the ICT device by efficiently sucking the cool air surrounding the ICT device.

  Conventionally, there is an air conditioning method in which an indoor unit of an air conditioner in a server room blows out cold air under the floor and the cold air blows out from under the floor toward the ceiling. Server racks often take in cool air from the front and exhaust from the top or back, and each server rack is arranged in a horizontal row with the front, top, and back facing in the same direction. Server rack rows arranged with the intake and exhaust surfaces facing in the same direction in the server room are arranged in a plurality of rows with the intake and intake surfaces of adjacent rows facing each other and the exhaust and exhaust surfaces facing each other. The passage between the intake surfaces is called cold aisle because cold air is supplied from the double floor. On the other hand, the passage between the exhaust surfaces is called hot aisle because the temperature rises due to exhaust from the server rack. By shielding the cold aisle from mixing between the cold aisle and the hot aisle, the cool air can be efficiently supplied to the ICT device.

  Furthermore, in order to make the best use of the cold air blown from the indoor unit of the air conditioner, a method has been proposed to improve the cooling efficiency of the ICT device by devising the arrangement of a mesh floor from which the cold air is blown from under the floor. (For example, see Non-Patent Document 1).

Hendrik Hamann, Madhusudan Iyengar, and Martin O’Boyle, “THE IMPACT OF AIR FLOW LEAKAGE ON SERVER INLET AIR TEMPERATURE IN A RAISED FLOOR DATA CENTER”, 11th Intersociety Conf. Thermal and Thermomechanical Phenomena in Electronic Systems, 2008

  However, the technology disclosed in Non-Patent Document 1 cannot cope with the situation for each server room, for example, where the exhaust heat of the ICT device is accumulated due to the shape unique to the server room. When air is drawn in from the cold aisle that has accumulated heat, cold air containing heat is sent into the ICT device, the temperature detected by the temperature sensor in the ICT device exceeds the upper limit temperature, and the ICT device operates stably. become unable.

  Therefore, if a rectifying plate is attached to the intake port or the exhaust port of the ICT device, more cold air can be taken into the ICT device, and the cooling efficiency of the ICT device can be increased. On the other hand, the server room has various shapes, and there are various arrangements of server racks in which ICT devices are stored. Therefore, the flow of the cold air blown from the indoor unit of the air conditioning is different for each server room, and in order to efficiently supply the cold air to the ICT device, the current plate must be attached while adjusting the position for each ICT device. Therefore, if the current plate is attached to each server room by trial and error based on an empirical rule, there is a problem that it takes time and costs increase.

  The present invention has been made in view of such problems, and the object of the present invention is to consider parameters of the rectifying plate such as the shape and opening angle of the rectifying plate attached to the ICT device while considering the situation of each server room. It is to provide a method of determining.

  As means for solving the above problems, in the present invention, the flow circulation efficiency in the server room is improved by attaching flow straightening plates to the inlet and exhaust ports of the ICT device and adjusting the opening angle of the flow straightening plate. Says. Further, it also describes that a rectifying plate having a planar shape or a curved shape is applied in combination according to the opening angle of the rectifying plate attached to the intake port and the exhaust port of the ICT device.

  In order to achieve such an object, the present invention provides a method for determining parameters of a current plate attached to an intake port of an ICT device and / or an exhaust port of the ICT device. The server room is modeled based on the dimension information of the server room in which the ICT apparatus is installed, the position information of the ICT apparatus, the dimension information of the ICT apparatus, and the parameters of the current plate. The temperature information of the cold air blown from the indoor unit for cooling the ICT device, the air volume information of the cold air blown from the indoor unit, the heat amount information generated from the load of the ICT device, and the ICT Based on the air flow information of the fan of the device, the step of simulating the flow of the cold air supplied into the ICT device, and the parameters of the rectifying plate are changed. However, the step of calculating the intake temperature of the ICT device and the exhaust temperature of the ICT device based on the result of the simulation, and the exhaust heat efficiency based on the calculated intake temperature of the ICT device and the calculated exhaust temperature of the ICT device And calculating a parameter of the rectifying plate that maximizes the exhaust heat efficiency.

  As described above, according to the present invention, it is possible to improve the overall cooling circulation efficiency in the server room.

It is a figure showing an example of modeling of the structure of a server room concerning one embodiment of the present invention. It is a figure which shows the comparison of the shape of the baffle plate attached to the inlet port of an ICT apparatus concerning one Embodiment of this invention. It is a figure shown in one embodiment of the present invention about the opening angle of a plane-shaped current plate, and the opening angle of a curved-surface shape current plate. It is a figure showing a plurality of examples of temperature distribution in a server room concerning one embodiment of the present invention. It is a figure which shows an example of the heat flow inside the ICT apparatus which attached the curved-surface-shaped baffle plate concerning one Embodiment of this invention. It is a figure which shows the example which carried out the simulation experiment about the intensity | strength of the airflow inside the ICT apparatus and vicinity of the ICT apparatus concerning one Embodiment of this invention. It is a figure which shows the relationship between the shape and opening angle of the baffle plate attached to an ICT apparatus, the intake air temperature and exhaust temperature of ICT apparatus, and RHI 'concerning one Embodiment of this invention. An arrangement of a server rack row, a server rack, and an ICT device in a server room to which cold air is supplied from a double floor is shown. It is a flowchart which shows the method of determining the parameter of the baffle plate concerning one Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Modeling the server room)
FIG. 1 shows an example of modeling of the structure of a server room according to an embodiment of the present invention. 1A is a plan view of the server room as viewed from A, and FIG. 1B is a perspective view of the server room as viewed from an oblique direction. FIG. 1C illustrates a side view of the server room viewed from the C direction, and FIG. 1D illustrates a side view of the server room viewed from the D direction.

The server room 1 includes server rack rows 11a to 11f in which a plurality of ICT devices are accommodated, and indoor units 12a to 12d that blow out cool air for cooling a load in the ICT device. The server rack row 11f includes a server rack row 11f ₁ to a server rack row 11f ₇ . Each ICT device has a built-in fan for taking in cool air from the indoor units 12a to 12d.

  As a premise for carrying out the numerical calculation in the simulation of the heat flow in the server room 1, a model of the structure of the server room 1 is generated by software. By software, the dimensions of the server room 1, the dimensions of the server rack rows 11a to 11f, the dimensions of the indoor units 12a to 12d, the dimensions of the ICT device, the load position of the ICT device, the position of the fan of the ICT device, and the ICT device to be described later The structure in the server room 1 is modeled based on the first parameters such as the shape of the rectifying plate attached to and the opening angle of the rectifying plate (the rectifying plate parameter). Next, a server room structure model is created.

  FIG. 2 shows a comparison of modeling of the shape of the current plate attached to the air inlet of the ICT device according to one embodiment of the present invention. FIG. 2A shows a model in which the modeled ICT device 2 is a rectangular parallelepiped abcd-efgh, and a planar rectifying plate 23a is attached to a line segment ab of the intake port abcd of the ICT device 2, and the planar rectification is illustrated. The figure which attached the board 23b to the line segment cd of the inlet port abcd of the ICT apparatus 2 is represented. FIG. 2A shows a diagram in which a planar rectifying plate 23c is attached to a line segment ef of the intake port efgh of the ICT device 2, and a planar rectifying plate 23d is line segment of the intake port efgh of the ICT device 2. The figure attached to gh is represented.

  FIG. 2B shows a model in which the modeled ICT device 2 is a rectangular parallelepiped ijkl-mnop, and a curved rectifying plate 33a is attached to a line segment ij of the intake port ijkl of the ICT device 2, and the curved rectified shape The figure which attached the board 33b to the line segment kl of the inlet ijkl of the ICT apparatus 2 is represented. FIG. 2B shows a view in which a curved rectifying plate 33c is attached to a line segment mn of the intake port mnop of the ICT device 2, and a curved rectifying plate 33d is attached to the line segment of the intake port mnop of the ICT device 2. The figure attached to op is represented.

  The ICT device 2 shown in FIG. 2A has a fan 21 for removing heat inside the ICT device 2, a load 22 that generates heat, and a planar shape attached to the intake port and the exhaust port of the ICT device 2. And current plates 23a to 23d. The ICT device 2 shown in FIG. 2B has a fan 21 for removing the heat inside the ICT device 2, a load 22 that generates heat, and a curved surface shape attached to the intake and exhaust ports of the ICT device 2. Current plate 33a to 33d.

  By attaching rectifying plates to the intake port and the exhaust port of the ICT device 2, circulation of the airflow in the ICT device 2 is promoted, and efficient heat exchange in the ICT device 2 can be realized. The amount of cool air taken into the ICT device 2 also changes depending on the shape of the current plate or the angle attached to the intake port and the exhaust port of the ICT device 2. The current plate is also called a guide ben. For modeling the internal shape of the ICT device 2 and the shape of the current plate, an unstructured grid model is used in order to flexibly support the expression of the curved surface shape.

  FIG. 3 shows the opening angle of the planar rectifying plate and the opening angle of the curved rectifying plate in one embodiment of the present invention. FIG. 3A shows the opening angle of the planar current plate, and FIG. 3B shows the opening angle of the curved current plate.

  The angle (E) shown in FIG. 3 (a) is on a half straight line extending the f side of the line segment bf in the planar rectifying plate 23c attached to the ICT device 2 shown in FIG. 2 (a). Is the angle αfβ where β is β. Also, the angle (F) shown in FIG. 3 (b) is a straight line passing through the point j on the curved rectifying plate 33a attached to the ICT device 2 shown in FIG. The angle δjε when a point on the half line on the arc γ side is δ and a point on the half line obtained by extending the j side of the line segment jn is ε. When the angle (E) is 45 degrees, the plane is expressed as 45 degrees for convenience. Further, when the angle (F) is 23 degrees, it is expressed as a curved surface 23 degrees for convenience.

  The angle range when the current plate is planar is 1 to 89 degrees, and the angle range when the current plate is curved is 1 to 44 degrees. The reason why the angle when the current plate is curved is up to 44 degrees is that airflow collides between the current plate and the wall surface of the server rack, which prevents the airflow from entering the ICT device.

  The shape of the rectifying plate is not limited to a planar shape or a curved surface shape. For example, a shape in which the planar shape is folded in two or a wave shape can be considered. Various shapes of the rectifying plate can be selected so as to increase the exhaust heat efficiency of the ICT device based on the simulation of the heat flow in the ICT device.

(Modeled simulation of heat flow in server room)
FIG. 4 shows a plurality of examples of temperature distribution in the server room according to an embodiment of the present invention. 4A shows an example of the temperature distribution in the server room 1 when curved rectifying plates are attached at 45 degrees to the intake port and the exhaust port of the ICT device 2, and FIG. The other example of the temperature distribution in a server room at the time of attaching the curved-surface-shaped rectifying plate to the inlet port and the exhaust port of the apparatus 2 at 45 degrees is shown.

  A thermohydrodynamic equation is used for the numerical calculation of the heat flow in the server room 1. The heat flow of the entire server room 1 is determined according to a predetermined thermohydrodynamic equation such as the amount and temperature of cool air blown from the indoor unit, the amount of heat generated from the load 22 of the ICT device 2, and the amount of air of the fan 21 of the ICT device 2. Based on the value obtained by substituting the parameters of 2 and the created server room structure model, it can be known by performing simulation with software. When the heat flow inside the ICT device 2 is simulated, data representing the heat flow in the server room shown in FIGS. 4A and 4B is displayed on the display device.

  4 (a) and 4 (b), the difference in the temperature distribution in the server room 1 is caused by the difference in the opening angle of the rectifying plate attached to the intake port and the exhaust port of the ICT device 2. Easily and efficiently understood by numerical calculation of flow.

  FIG. 5 shows an example of the heat flow inside the ICT device to which a curved rectifying plate is attached. FIG. 5A shows a view in which curved rectifying plates 33a to 33d are attached to the intake port of the ICT device 2, shows the position of the load 22 that is a heat source in the ICT device 2, and includes a built-in cooling fan 21. Indicates the position. FIG. 5B is a diagram showing the flow of heat inside the ICT device 2 to which the rectifying plates 33a to 33d having curved shapes are attached, and is a diagram seen from diagonally above. FIG. 5C is a view showing the heat flow inside the ICT device 2 to which the curved shape rectifying plates 33a to 33d are attached, and is a view seen from the G direction. FIG. 5D is a diagram showing a heat flow inside the ICT device 2 to which the curved rectifying plates 33a to 33d are attached, and is a diagram seen from the H direction.

  Based on the server room structural model and the value obtained by substituting the second parameter into a predetermined thermohydrodynamic equation, the heat flow inside the ICT device 2 is simulated, and FIGS. Data representing the heat flow inside the ICT device 2 shown in (d) is displayed on a display device such as a display.

  Also, using GUI (Graphical User Interface), changing the opening angle to see the heat flow inside the ICT device 2, changing the curvature of the curved surfaces of the rectifying plates 33a to 33d, changing the position of the load 22, and the position of the fan 21 Can be changed. As for the temperature distribution of heat inside the ICT device 2, for example, the display device can display a region having a high temperature in red and a region having a low temperature in green and blue.

  FIG. 6 shows an example in which a simulation experiment is performed on the airflow in and around the ICT apparatus. FIG. 6A shows an air flow in the ICT device 2 when the rectifying plate attached to the ICT device 2 has a planar shape and is 1 degree in the plane. FIG. 6B shows an air flow in the ICT device 2 when the rectifying plate attached to the ICT device 2 has a planar shape and a flat surface of 45 degrees. FIG. 6C shows an air flow in the ICT device 2 when the rectifying plate attached to the ICT device 2 has a planar shape and has a plane of 89 degrees.

  FIG. 6D shows an air flow in the ICT device 2 when the rectifying plate attached to the ICT device 2 has a curved surface shape and has a curved surface of 1 degree. FIG. 6E shows an air flow in the ICT device 2 when the rectifying plate attached to the ICT device 2 has a curved surface shape and a curved surface of 23 degrees. FIG. 6F shows an air flow in the ICT device 2 when the rectifying plate attached to the ICT device 2 has a curved surface shape and a curved surface of 44 degrees.

  FIG. 6A to FIG. 6F are one screen displayed on the GUI. The screens shown in FIGS. 6 (a) to 6 (f) are expressed in color, and the scale on the left side of FIG. 6 represents the wind speed (m / s) of the air current, the top of the scale is red, the middle is green, The lower part may be a rainbow gradation display such as blue. Corresponding to the iridescent gradation, red may be high in wind speed and blue may be low in wind speed. A rainbow-colored gradation display may be applied to the movement of cold air in the ICT apparatus and expressed using the color of the arrow.

  Based on the value obtained by substituting the second parameter into a predetermined thermohydrodynamic equation, the heat flow in the ICT device 2 and in the vicinity of the ICT device 2 is simulated by the software. The wind speed strength is also calculated. The direction of the arrow in FIG. 6 represents the direction of airflow. The size of the arrow represents the strength of the wind speed of the airflow. It is confirmed that the direction of the air current, the wind speed, and the strength of the wind speed in the ICT device 2 vary greatly depending on the shape and opening angle of the rectifying plate attached to the intake port and the exhaust port of the ICT device 2. For example, in FIG. 6 (b), which is a case of a 45 degree flat surface, since the bundle of arrows is directed to the inside of the ICT device in the vicinity of the flat shape rectifying plate of the ICT device 2, the air flow is also inside the ICT device. You can see that you are heading. FIG. 6B, which is a case of a flat surface of 45 degrees, shows that the baffle plate is collecting wind compared to FIG. 6C, which is a case of a flat surface of 89 degrees. In addition, it can be seen that a large amount of airflow is gathered at a position slightly inside the inlet of the ICT device.

(Determination of current plate)
FIG. 7 shows the relationship between the shape and opening angle of the current plate attached to the ICT device, the intake air temperature and exhaust temperature of the ICT device 2, and the RHI (Return Heat Index) representing the exhaust heat efficiency of the ICT device 2. It shows that the higher the RHI, the lower the mixing of cold and warm air and the higher the exhaust heat efficiency. FIG. 7A shows a graph of a rectifying plate having a planar shape or a curved shape attached to the ICT device 2 with the horizontal axis as the opening angle of the rectifying plate and the vertical axis as the average intake air temperature of the ICT device 2. A line graph with rhombus marks every 5 degrees indicates the relationship between the average intake air temperature of the ICT device 2 and the opening angle of the rectifying plate in a planar rectifying plate, and is described from 0 degrees to 85 degrees. A line graph with square marks every 5 degrees indicates the relationship between the average intake air temperature of the ICT device 2 and the opening angle of the rectifying plate in the curved rectifying plate, and is described from 0 degree to 40 degrees.

  FIG. 7B shows a graph of the straight or curved rectifier plate attached to the ICT device 2 with the horizontal axis as the opening angle of the rectifier plate and the vertical axis as the average exhaust temperature of the ICT device 2. A line graph with rhombus marks every 5 degrees indicates the relationship between the average exhaust temperature of the ICT device 2 and the opening angle of the rectifying plate in a planar rectifying plate, and is described from 0 to 85 degrees. A line graph with square marks every 5 degrees indicates the relationship between the average exhaust temperature of the ICT device 2 and the opening angle of the rectifying plate in a curved rectifying plate, and is described from 0 degree to 40 degrees.

  FIG. 7C shows a graph of the flat or curved rectifier plate attached to the ICT device 2 with the horizontal axis as the opening angle of the rectifier plate and the vertical axis as RHI '. A line graph with rhombus marks every 5 degrees indicates the relationship between RHI 'and the opening angle of the rectifying plate in a planar rectifying plate, and is described from 0 to 85 degrees. A line graph in which square marks are included every 5 degrees indicates the relationship between RHI 'and the opening angle of the rectifying plate in a curved rectifying plate, and is described from 0 degree to 40 degrees.

  The heat flow in the ICT device 2 and in the vicinity of the ICT device 2 is simulated based on the value obtained by substituting the second parameter into a predetermined thermohydrodynamic equation. In the simulation of the heat flow, modeling is performed. The intake air temperature and the exhaust gas temperature of the ICT device 2 thus made can be measured. In this specification, the intake air temperature of the ICT device 2 refers to the temperature near the intake port of the modeled ICT device 2. The exhaust temperature of the ICT device 2 refers to the temperature near the exhaust port of the modeled ICT device 2.

  Therefore, the data relating to the graph of FIG. 7A can be acquired based on the average intake air temperature obtained by averaging the measured intake air temperature of the ICT device 2 over a predetermined time, the shape of the rectifying plate, and the opening angle. Moreover, the data concerning the graph of FIG.7 (b) is acquirable by the average exhaust temperature which averaged the exhaust temperature of the measured ICT apparatus 2 over a fixed time, the shape and opening angle of a baffle plate. For the exhaust heat efficiency of the ICT device 2, RHI 'is used. The data relating to the graph of FIG. 7C can be obtained by a calculation method described later based on the data relating to the graphs of FIG. 7A and FIG. 7B.

  FIG. 8 shows the arrangement of server rack rows, server racks, and ICT devices in a server room to which cold air is supplied from a double floor. Fig.8 (a) is the top view which looked at the server room from the upper part. Server racks are arranged in rows in the order of 1, 2,..., P, and are arranged in rows in the order of 1, 2,. FIG. 8B is a side view of FIG. 8A viewed from the I direction. ICT devices housed in the server rack are arranged from the top in the order of 1, 2,..., N. The cold air blown out from the indoor unit to the floor is blown out from a hole formed in the floor surface through the floor, and the cold air from the floor surface is supplied to the server rack.

  In order to quantitatively evaluate the heat circulation efficiency (exhaust heat efficiency) in the server room, RHI and SHI (Supply Heating Index) are used. It shows that the larger the RHI, the less the mixture of the exhaust heat of the ICT device and the cool air blown from the indoor unit, and the higher the heat circulation efficiency. It shows that the larger the SHI is, the more the mixture of the exhaust heat of the ICT device and the cool air blown from the indoor unit is, and the lower the heat circulation efficiency.

  The RHI and SHI in the server room are defined using the total heat quantity Q from all the server racks in the server room and the increase δh in the enthalpy of the cold air before entering the server rack. (Expression 1) representing the total amount of exhaust heat Q is shown below.

m ^r _{i, j} is the air flow through the i and j th server racks, (T ^r _in ) _{i, j} is i and the average inflow temperature in the j th server rack, and (T ^r _out ) _{i, j} is The average outflow temperature in the i and jth server racks. The number i is an arbitrary number from 1 to p, and the number j is an arbitrary number from 1 to q. C _p is a constant pressure calorie. r indicates that the air flow rate m ^r _{i, j} , the average inflow temperature (T ^r _in ) _{i, j} , and the average outflow temperature (T ^r _out ) _{i, j} are variables relating to the server rack.

  Further, (Expression 2) representing the increase amount δh is shown below.

  Tref is the inflow temperature of cold air from the floor. It is assumed that the inflow temperature Tref of the cold air from the floor surface is the same for all floor surfaces. It is also assumed that there is no heat loss or generation in the space under the floor. In the calculation of enthalpy, it is assumed that the inflow temperature of the cold air from the floor and the temperature of the cold air blown out from the air conditioner to the floor are the same. The inflow temperature Tref of the cold air from the floor surface can be a temperature near the floor surface where the cold air is blown out in the modeled server room.

  The RHI in the server room is defined by the following (Formula 3).

  The numerator on the right side of (Expression 3) indicates the total calorific value Q, and the denominator on the right side of (Expression 3) indicates the increase in the amount of heat obtained by exhaust heat from the entire server rack.

  The SHI in the server room is defined by the following (Formula 4). The relational expression between RHI and SHI is shown by (Formula 5).

RHI + SHI = 1 (Formula 5)

  The numerator on the right side of (Equation 4) indicates an increase in the amount of heat obtained through the airflow on the cold aisle side before flowing into the server rack, and the denominator on the right side of (Equation 4) is obtained by exhaust heat from the entire server rack. Indicates an increase in the amount of heat.

  In the present embodiment, RHI 'and SHI' in the server room are redefined so as to cope with the difference in the number of ICT devices for each server rack. First, the total amount of exhaust heat Q ′ from all server racks in the server room and the increase δh ′ of the enthalpy of cold air before entering the server rack are expressed by the following (formula 6) using (formula 1) and (formula 2): ) And (Formula 7).

m ^r _{i, j, k} represents the air flow rate in the k-th ICT device in the i-th and j-th server racks. The number k is an arbitrary number from 1 to n. (T ^r _in ) _{i, j, k} is the average intake air temperature in the k-th ICT device in the i-th and j-th server racks, and (T ^r _out ) _{i, j, k} is in the i-th and j-th server racks The average exhaust temperature in the k-th ICT device. T _ref is the inflow temperature of cold air from the floor.

  SHI 'is redefined by the following (Expression 8) obtained by substituting (Expression 6) and (Expression 7) into (Expression 4).

  Therefore, RHI ′ is redefined by the following (Expression 9) obtained by substituting (Expression 8) into (Expression 5).

The average intake temperature (T ^r _in ) _{i, j, k} can be obtained from the graph shown in FIG. 7 (a), and the average exhaust temperature (T ^r _out ) _{i, j, k} is obtained from FIG. 7 (b). It can be obtained from the graph shown.

Therefore, RHI ′ can be obtained by specifying the inflow temperature T _ref of the cold air from the floor and the location in the server room of the operating ICT apparatus. If the shape and opening angle of the current plate are set, RHI ′ can be obtained, and the graph shown in FIG. 7C can be created.

  In the example shown in FIG. 7C, RHI ′ has a maximum value of 0.64 when the opening angle of the planar rectifying plate is 40 degrees. Therefore, in the example shown in FIG. 7C, when the shape of the rectifying plate attached to the ICT device 2 is a planar shape and the opening angle of the rectifying plate is 40 degrees, the exhaust heat efficiency of the ICT device 2 Will be the highest. Therefore, according to FIG. 7C, the shape and opening angle of the current plate that has the highest exhaust heat efficiency can be determined. Based on the data concerning the graph of FIG.7 (c), if a baffle plate is attached to the ICT apparatus 2 and air conditioning is operated, the air-conditioning control which can cool the ICT apparatus 2 efficiently is realizable.

  In the example of the simulation result shown in FIG. 7, when the opening angle of the rectifying plate is less than 20 degrees and a curved rectifying plate is employed, RHI 'is higher than that of the planar rectifying plate. Further, when the opening angle of the rectifying plate is 20 to 44 degrees and the flat rectifying plate is employed, the RHI ′ is higher than that of the curved rectifying plate. Therefore, it is found that considering both the shape of the rectifying plate and the opening angle of the rectifying plate is effective for improving the exhaust heat efficiency of the ICT device 2, and suggests that power saving of the air conditioning of the server room is achieved. Is done. That is, according to the environment in which the ICT device 2 is installed, a server room design that considers both the opening angle of the rectifying plate and the shape of the rectifying plate is effective for power saving of air conditioning.

  FIG. 9 shows a flowchart of a method for determining parameters of a current plate according to an embodiment of the present invention. The computer can execute software incorporating a system for determining parameters of the current plate according to an embodiment of the present invention in accordance with instructions input by a user. A system for determining parameters of a current plate according to an embodiment of the present invention includes a structure calculation unit, a simulation unit, a first generation unit, a second generation unit, a current plate determination unit, and a storage unit. Is provided.

  The structure calculation unit inputs the dimensions of the entire server room 1, the dimensions of the indoor unit, the dimensions of the server rack, the installation position of the ICT device 2, the dimensions of the ICT device 2, the position of the load 22 of the ICT device 2, the ICT device A server room structure model is created based on the first parameters such as the position of the second fan 21, the shape of the current plate attached to the ICT device 2, and the opening angle (S101). The created server room structure model is stored in the storage unit.

  The simulation unit includes a server room structure model, second parameters such as the temperature and air volume of the cool air blown from the input air conditioner indoor unit, the amount of heat generated from the load 22 of the ICT device 2, and the air volume of the fan 21 of the ICT device 2. Based on the value obtained by substituting for a predetermined thermohydrodynamic equation, the flow of heat in the server room 1 is simulated to generate simulation data (S102). The simulation data is stored in the storage unit.

  The first generator is based on the simulation data, and the data relating to the first graph representing the relationship between the shape of the rectifying plate attached to the ICT device 2, the opening angle of the rectifying plate, and the intake air temperature of the ICT device 2. Is generated. The data relating to the first graph is a function obtained by calculating the intake air temperature of the ICT device 2 based on the result of simulation while changing the parameters of the rectifying plate. Further, data relating to the second graph representing the relationship between the shape of the rectifying plate attached to the ICT device 2 and the opening angle of the rectifying plate and the exhaust temperature of the ICT device 2 is generated (S103). The data relating to the second graph is a function obtained by calculating the exhaust temperature of the ICT device 2 based on the simulation result while changing the parameters of the rectifying plate. Data relating to the first graph and data relating to the second graph are stored in the storage unit.

  Based on the data relating to the first graph and the data relating to the second graph, the second generator generates the relationship between the shape of the rectifying plate attached to the ICT device 2, the opening angle of the rectifying plate, and RHI ′. Data relating to the represented third graph is generated (S104). The third graph is a function for calculating the exhaust heat efficiency based on the calculated intake temperature of the ICT device and the calculated exhaust temperature of the ICT device. Data relating to the third graph is stored in the storage unit.

  The rectifying plate determination unit determines the shape of the rectifying plate attached to the ICT device 2 and the opening angle of the rectifying plate with the highest heat exhaust efficiency based on the data relating to the third graph (S105).

  According to the present embodiment, it is possible to improve the overall cooling circulation efficiency in the server room.

  INDUSTRIAL APPLICABILITY The present invention can be used in industrial fields related to monitoring and image sensing in a real environment in the electric power field, energy field, communication field, and sensing field.

1 server room 2 ICT devices 11a, 11b, 11c, 11d, 11e, 11f server rack rows _{11f 1, 11f 2, 11f 3} , 11f 4, 11f 5, 11f 6, 11f 7 server racks 12a, 12b, 12c, 12d room Machine 21 Fan 22 Load 23a, 23b, 23c, 23d, 33a, 33b, 33c, 33d

Claims (2)

A method of determining parameters of a current plate attached to an inlet of an ICT device and / or an exhaust port of the ICT device,
Based on the dimension information of the server room where the ICT device is installed, the position information where the ICT device is installed, the dimension information of the ICT device, and the parameters of the rectifying plate, the server room is modeled. The temperature information of the cold air blown out from the indoor unit for cooling the ICT device, the air volume information of the cold air blown out from the indoor unit, the heat amount information generated from the load of the ICT device, and the ICT device Simulating the flow of the cold air supplied into the ICT device based on the fan air volume information;
Calculating the intake air temperature of the ICT device and the exhaust temperature of the ICT device based on the result of the simulation while changing the parameters of the rectifying plate;
Calculating exhaust heat efficiency based on the calculated intake temperature of the ICT device and the calculated exhaust temperature of the ICT device, and determining a parameter of the rectifying plate that maximizes the exhaust heat efficiency. A method for determining the parameters of the current plate.   The method of determining parameters of the current plate, wherein the parameters of the current plate include a shape of the current plate and an opening angle of the current plate.