JP2014203981A - Power supply - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power supply in which a circuit board can be attached to the chassis easily.SOLUTION: A power supply comprises: a circuit board mounting an electronic component; and a chassis 2 to which the circuit board is attached. The chassis 2 is configured to include a bottom plate 11 and side plates 12, 13. In the side plates 12, 13, substrate holding portions 12a, 12b, 13a having a holding protrusion 21 protruding along the plate surface of the bottom plate 11 so as to come into contact with the surface of the circuit board facing the bottom plate 11 at the outer edge thereof, and a holding protrusion 22 protruding along the plate surface of the bottom plate 11 so as to come into contact with the rear surface of the circuit board facing the bottom plate 11 at the outer edge thereof are formed. The holding protrusions 21, 22 are formed so that the tip side part in the holding protrusion 21 of the substrate holding portions 12a, 12b, 13a does not overlap with the holding protrusion 22 in the thickness direction of the bottom plate 11.

Description

  The present invention relates to a power supply device including a circuit board on which electronic components are mounted and a chassis to which the circuit board is attached.

  As this type of power supply, the applicant discloses a switching power supply in which a circuit board on which electronic components are mounted is attached to an open frame type chassis in Japanese Patent Laid-Open No. 10-290081. In this switching power supply, the chassis described above includes a bottom plate, and a back plate and a left plate that are bent at two adjacent sides of the bottom plate. In addition, fixing pieces for screwing the circuit board in a state of being held in parallel with the bottom plate are respectively disposed on the right side of the center portion of the bottom plate of the chassis and the end portion on the back plate side of the left side plate. ing. Further, a pair of upper and lower clamping pieces are disposed near the front face of the left side plate so as to be able to hold a corner portion of the circuit board near the left front face. Further, a pair of upper and lower clamping pieces (hereinafter, these upper and lower pair of clamping pieces are also referred to as “clamping parts”) are provided at the right end of the back plate so as to be able to hold a corner near the right rear side of the circuit board. It is arranged.

  In this case, the sandwiching portion provided on the left side plate is formed such that both sandwiching pieces are formed in parallel to the bottom plate by bending a part of the left side plate so as to protrude upward from the inner surface of the left side plate. Yes. Further, the sandwiching portion provided on the back plate is formed with both sandwiched pieces parallel to the bottom plate by bending a part of the back plate so as to protrude from the inner surface of the back plate toward the upper side of the bottom plate. . Furthermore, both the sandwiching portions are formed so that the length (separation length) between the upper surface of the lower sandwiching piece and the lower surface of the upper sandwiching piece is approximately the same as the thickness of the circuit board, Thereby, the groove part which can insert a circuit board is formed between both clamping pieces. In this case, in the chassis described above, the leading end portions of both sandwiching pieces are tapered so that the groove portions gradually expand toward the leading end portions of both sandwiching pieces, thereby guiding the circuit board to the groove portions. Is provided.

  When assembling the switching power supply, first, the circuit board is set above the bottom plate so that the circuit board is inserted between the above-described sandwiching pieces from the right front side of the chassis. At this time, the corner portion closer to the left front side of the circuit board is sandwiched by the clamping portion provided on the left side plate, and the corner portion closer to the right rear side of the circuit board is sandwiched by the clamping portion provided on the back plate. At the same time, the back surface of the circuit board is in contact with the upper surfaces of both the fixing pieces provided on the bottom plate and the left side plate, and then the screw is inserted through the screw insertion holes formed on the circuit board. Screw the screws into the screw holes of both fixed pieces. Thereby, the chassis and the circuit board are integrated to complete the switching power supply.

JP-A-10-290081 (page 2-3, Fig. 1-4)

  However, the switching power supply disclosed by the applicant has the following problems to be improved. That is, in the switching power supply disclosed by the applicant, the circuit board is sandwiched by the two sandwiching portions provided on the left side plate and the back plate of the chassis, and the circuit is provided on the two fixed pieces provided on the bottom plate and the left side plate of the chassis. A structure is employed in which the circuit board is attached to the chassis by screwing the board.

  In this case, in the switching power supply disclosed by the applicant, as described above, the guide portion for guiding the circuit board is provided in the groove portion between the sandwiching pieces in the sandwiching portion. Thereby, in this switching power supply, when the circuit board is attached to the chassis, the edge of the circuit board can be easily inserted between the sandwiching pieces (grooves). However, in this switching power supply, two clamping portions are formed, and there are two groove portions into which the circuit board is to be inserted. For this reason, it is difficult to hold (position) the circuit board so that it can be inserted into both grooves when the circuit board is attached to the chassis, which further improves the assembly work efficiency. Has become difficult. Therefore, it is preferable to improve this point.

  The present invention has been made in view of the problems to be improved, and a main object of the present invention is to provide a power supply device in which a circuit board can be easily attached to a chassis.

  In order to achieve the above object, a power supply device according to the present invention includes a circuit board on which electronic components are mounted, and a chassis to which the circuit board is attached, and the chassis has a first surface on which the circuit board is opposed. A plate portion and a second plate portion disposed on one side of the first plate portion along the thickness direction of the first plate portion; and Is a first clamping convex portion that is projected along the plate surface of the first plate portion so that the surface facing the first plate portion at the outer edge portion of the circuit board is in contact with the circuit board, and the circuit A substrate clamping portion having a second clamping convex portion protruding along the plate surface of the first plate portion so that the back surface of the opposing surface at the outer edge portion of the substrate is in contact with the substrate; The sandwiching portion is configured such that at least the tip side portion of the first sandwiching convex portion is the first sandwiching portion. Said second clamping projection such so as not to overlap with the first clamping projection and the second holding projection portion in the thickness direction of the plate portion.

  Further, in the power supply device according to the present invention, the board clamping portion is a plate surface of the first plate portion between a tip portion of the first clamping convex portion and a plate surface of the second plate portion. Is longer than the length along the plate surface of the first plate portion between the tip portion of the second sandwiching convex portion and the plate surface of the second plate portion. The first sandwiching convex portion and the second sandwiching convex portion are formed.

  Further, in the power supply device according to the present invention, the substrate clamping portion is configured such that the second clamping convex portion is shorter than the first clamping convex portion, and the second clamping convex portion is The first clamping convex portion and the second clamping convex portion are formed so as to overlap with the base end side portion of the first clamping convex portion in the thickness direction of the first plate portion.

  Furthermore, in the power supply device according to the present invention, the board holding portion has a board contact portion between the first holding convex portion and the second holding convex portion so that a side portion of the circuit board contacts. Is provided.

  In the power supply device according to the present invention, at least two of the substrate holding portions are formed on the second plate portion.

  Furthermore, the power supply device according to the present invention is configured such that the chassis follows the thickness direction of the first plate portion on one side adjacent to the one side of the first plate portion on which the second plate portion is disposed. A third plate portion is provided and is provided with the substrate clamping portion.

  Further, in the power supply device according to the present invention, the first plate portion is formed with a substrate supporting convex portion so that the facing surface of the circuit board is in contact with the first plate portion.

  According to the power supply device of the present invention, the first sandwiching convex portion that protrudes along the plate surface of the first plate portion so that the surface facing the first plate portion at the outer edge portion of the circuit board is in contact. And a board clamping part having a second clamping convex part protruding along the plate surface of the first plate part so that the back surface of the opposing surface at the outer edge part of the circuit board is in contact with the second board part. The first clamping convex portion and the second clamping convex portion are formed so that at least the tip side portion of the first clamping convex portion does not overlap the second clamping convex portion in the thickness direction of the first plate portion. When the power supply device is assembled, the circuit board is placed on the tip side portion of the first holding convex part in the board holding part of the chassis. Whether the circuit board is moved relative to the chassis along the upper surface of the sandwiching projection In a state where the circuit board is positioned so as to contact the lower surface of the tip side portion of the second clamping convex portion in the substrate clamping portion, the circuit board is placed on the chassis along the lower surface of the second clamping convex portion. The outer edge of the circuit board can be clamped by the first clamping convex part and the second clamping convex part only by relatively moving. Therefore, unlike the assembly of the switching power supply disclosed by the applicant, the difficult work of inserting the outer edge of the circuit board into the groove between the pair of upper and lower clamping pieces is unnecessary, and the power supply apparatus can be easily assembled. As a result, the assembly work efficiency can be sufficiently improved. As a result, the manufacturing cost of the power supply device can be sufficiently reduced.

  Further, according to the power supply device according to the present invention, the length along the plate surface of the first plate portion between the tip portion of the first clamping convex portion and the plate surface of the second plate portion is: The first sandwiching convex portion and the second sandwiching convex portion are longer than the length along the plate surface of the first plate portion between the tip portion of the second sandwiching convex portion and the plate surface of the second plate portion. When the power supply device is assembled, the circuit board is placed on the tip side portion of the first holding convex part in the board holding part of the chassis. By simply moving the circuit board relative to the chassis along the upper surface of one clamping convex part, the outer edge part of the circuit board is clamped by the first clamping convex part and the second clamping convex part. be able to. As a result, the power supply device can be assembled more easily, and the assembly work efficiency can be further improved. As a result, the manufacturing cost of the power supply device can be further reduced.

  Further, according to the power supply device of the present invention, the second clamping convex portion is formed shorter than the first clamping convex portion, and the second clamping convex portion is in the thickness direction of the first plate portion. In the first clamping convex portion, the first clamping convex portion and the second clamping convex portion are formed so as to overlap the base end portion side portion of the first clamping convex portion, so that the second clamping convex portion is the first clamping convex portion. In the thickness direction of the plate portion, the first clamping convex portion does not overlap the base end side portion, that is, the second clamping convex portion is projected in a different direction from the first clamping convex portion. Unlike the configuration, both the first clamping convex portion and the second clamping convex portion can be formed by a single press working (bending operation), thereby further reducing the manufacturing cost of the power supply device. can do.

  Furthermore, according to the power supply device according to the present invention, by providing the substrate abutting portion between the first clamping convex portion and the second clamping convex portion so that the side portion of the circuit board abuts, As a result that the position (fixed position) on the first plate portion of the circuit board in the state of being clamped by the first clamping convex portion and the second clamping convex portion can be reliably and easily positioned, the power supply device The manufacturing cost can be further reduced.

  Further, according to the power supply device of the present invention, since the at least two board sandwiching portions are formed on the second plate portion, the circuit board in a state where the attachment is completed moves (displaces) with respect to the chassis. The situation can be avoided reliably.

  Furthermore, according to the power supply device according to the present invention, the first plate portion disposed on the one side adjacent to the one side on which the second plate portion is disposed along the thickness direction of the first plate portion. By forming the board sandwiching portion on the three plate portions, it is possible to more reliably avoid the situation where the circuit board in a state where the attachment is completed moves (displaces) with respect to the chassis.

  In addition, according to the power supply device of the present invention, the substrate support convex portion is formed on the first plate portion so that the opposing surface of the circuit substrate is in contact, so that the circuit board in a state where the attachment is completed is attached to the chassis. Thus, it is possible to more reliably avoid the situation of shifting (displacement).

1 is an external perspective view of a power supply device 1. FIG. 2 is an external perspective view of a chassis 2. FIG. FIG. 5 is a side view of the vicinity of a board holding portion 12a in a state where a circuit board 3 is held. 2 is a plan view of a chassis 2 and a circuit board 3. FIG. It is a side view for demonstrating the operation | work which clamps the circuit board 3. FIG. 5 is a plan view for explaining an operation of attaching the circuit board 3 to the chassis 2. FIG. It is a top view of the state which made the circuit board 3 clamped by the board | substrate clamping part 12c of the chassis 2a in the power supply device 1A which concerns on other embodiment. It is a top view of the state which made the circuit board 3 clamped by the board | substrate clamping part 12d of the chassis 2b in the power supply device 1B which concerns on other embodiment. FIG. 10 is a side view of a state in which a circuit board 3 is held by a board holding portion 12e of a chassis 2c in a power supply device 1C according to still another embodiment.

  Hereinafter, embodiments of a power supply device will be described with reference to the accompanying drawings.

  A power supply device 1 shown in FIG. 1 is an example of a “power supply device” and includes a chassis 2 and a circuit board 3. In this case, the circuit board 3 is mounted on the chassis 2 on which various electronic components, a connector for connecting power input / output terminals, and the like are mounted. In each drawing referred to in this specification, illustration of an electronic component, a connector for connection, and the like mounted on the circuit board 3 is omitted. Further, the power supply device 1 is configured such that a cover that forms a housing space for the circuit board 3 in combination with the chassis 2 can be attached to the chassis 2, but illustration and explanation of the cover are omitted. To do.

  The chassis 2 is an open frame type base material similar to the chassis of the switching power source disclosed by the applicant, and as an example, by pressing an aluminum plate, as shown in FIG. Side plates 12 and 13 are integrally formed. The bottom plate 11 is an example of a “first plate portion”. As shown in FIG. 1, in the power supply device 1 of this example, the circuit board 3 is attached to the chassis 2 so as to face the bottom plate 11. Is adopted. The bottom plate 11 is formed in a flat plate shape that is slightly larger than the circuit board 3, and the substrate support portion 11 a (an example of a “substrate support convex portion”) so that the surface of the circuit board 3 facing the bottom plate 11 can be contacted. Is formed. In this case, the board support portion 11a is formed with a screw hole 4a into which the male screw 4 inserted through the insertion hole formed in the circuit board 3 can be screwed.

  The side plate 12 is an example of a “second plate portion”, and is disposed on one side of the bottom plate 11 along the thickness direction of the bottom plate 11 (so as to be orthogonal to the bottom plate 11 in a side view). . The side plate 12 has substrate holding portions 12a and 12b (an example of two “substrate holding portions”). 2-4, the board | substrate clamping part 12a bends a part on the opposite side to the side board 13 side in the side board 12 toward the upper direction of the bottom board 11 (toward the inside of the chassis 2) by press work. Thus, the sandwiching protruding pieces 21 and 22 and the substrate abutting portion 23 are formed.

  The sandwiching protruding piece 21 corresponds to a “first sandwiching protrusion”, and as shown in FIG. 3, the bottom plate 11 is in contact with the back surface 3 a (the surface facing the bottom plate 11) at the outer edge of the circuit board 3. It protrudes from the side plate 12 along the plate surface. The sandwiching protruding piece 22 corresponds to a “second sandwiching convex portion”, and the plate surface of the bottom plate 11 is in contact with the surface 3 b (the back surface opposite to the bottom plate 11) at the outer edge of the circuit board 3. Is protruded from the side plate 12 along the line. In this case, in the chassis 2 in the power supply device of this example, the length (separation length) between the upper surface A1 of the sandwiching protrusion piece 21 and the lower surface A2 of the sandwiching protrusion piece 22 is slightly larger than the thickness of the circuit board 3. Clamping protruding pieces 21 and 22 are formed so as to be long.

  Further, in the chassis 2 in the power supply device 1 of the present example, as shown in FIG. 4, the sandwiching protruding piece 22 is formed shorter than the sandwiching projecting piece 21, and the tip side portion of the sandwiching projecting piece 21 is the bottom plate. 11 are formed so as not to overlap the sandwiching projecting piece 22 in the thickness direction of 11. Specifically, in the board holding portion 12a in the chassis 2 of this example, the length L1 along the plate surface of the bottom plate 11 between the tip portion of the holding protruding piece 21 and the plate surface of the side plate 12 is nipping. Both sandwiching projecting pieces 21 and 22 are formed so as to be longer than the length L2 along the plate surface of the bottom plate 11 between the front end portion of the projecting piece 22 and the plate surface of the side plate 12. The leading end of the protruding piece 21 is protruded larger from the plate surface of the side plate 12 than the leading end of the sandwiching protruding piece 22. Further, in the chassis 2 in the power supply device 1 of the present example, the sandwiching projecting pieces 21 and 22 are formed so that the sandwiching projecting piece 22 overlaps with the base end side portion of the sandwiching projecting piece 21 in the thickness direction of the bottom plate 11. ing.

  In the figure, the upper surface A1 of the sandwiching protruding piece 21 and the upper surface A3 of the substrate support portion 11a described above are shown by being filled with diagonal lines that are lowered to the left, and the lower surface A2 of the sandwiching protruding piece 22 is lowered to the right. It is shown painted with diagonal lines. Therefore, in the same figure, the part where the diagonal line that falls to the left and the diagonal line that falls to the right intersect (the part that is filled with the mesh line) is the upper surface A1 of the sandwiching protruding piece 21 and the sandwiching protruding piece 22 A range in which the lower surface A2 overlaps in the thickness direction of the bottom plate 11 is shown.

  Further, the substrate abutting portion 23 is an example of a “substrate clamping portion”, and as shown in FIG. 3, the side portion 3 c in the circuit board 3 in a state of being sandwiched by the sandwiching protruding pieces 21, 22 is provided. It is provided between the projecting pieces 21 and 22 for clamping so as to come into contact with each other. In the chassis 2 of the power supply device 1 of the present example, the base end portion side portion of the sandwiching protruding piece 21, the base end portion side portion of the sandwiching protruding piece 22, and the substrate contact portion 23 are integrally formed. Thereby, the board | substrate clamping part 12a becomes concave shape.

  In this case, as described above, in the chassis 2 of this example, the sandwiching projecting pieces 21 and 22 are arranged such that the sandwiching projecting piece 22 overlaps with the base end side portion of the sandwiching projecting piece 21 in the thickness direction of the bottom plate 11. A substrate contact portion 23 is formed between the sandwiching protruding pieces 21 and 22. Therefore, it is possible to simultaneously form the sandwiching protruding pieces 21 and 22 and the board contact portion 23 by performing only one press process of bending a part of the side plate 12 in the same direction when the chassis 2 is manufactured. .

  As shown in FIGS. 2 and 4, the substrate clamping portion 12b is used for clamping by bending a part of the side plate 12 on the side plate 13 side toward the upper side of the bottom plate 11 (toward the inside of the chassis 2) by pressing. The protruding piece 21, the holding protruding piece 22, and the substrate contact portion 23 are formed. Note that the projecting direction of the sandwiching projecting pieces 21 and 22 and the substrate contact part 23 of the substrate sandwiching part 12b, and the projecting members 21 and 22 and the substrate contact part 23 of the substrate sandwiching part 13a described later are Since only the difference is formed in the same manner as the sandwiching protruding pieces 21 and 22 and the substrate abutting portion 23 in the substrate sandwiching portion 12a, the description thereof is omitted.

  The side plate 13 is an example of a “third plate portion”, and the side plate 12 in the bottom plate 11 is disposed along the thickness direction of the bottom plate 11 (so as to be orthogonal to the bottom plate 11 in a side view). It is arranged on one side adjacent to the one side. The side plate 13 is formed with a substrate holding portion 13a (another example of “substrate holding portion”). As shown in FIGS. 2 and 4, the substrate clamping portion 13 a bends a part of the side plate 13 opposite to the side plate 12 side toward the upper side of the bottom plate 11 (toward the inside of the chassis 2) by pressing. Thus, the sandwiching protruding pieces 21 and 22 and the substrate abutting portion 23 are formed.

  When the circuit board 3 is attached to the chassis 2, first, as shown in FIGS. 5 and 6, the board holding portions 12 a, 12 b, 13 a are arranged so that the back surface 3 a of the circuit board 3 faces the surface of the bottom plate 11. The circuit board 3 is placed on each of the sandwiching protruding pieces 21 and the board support portion 11a. At this time, in the chassis 2 of the power supply device 1 of the present example, as described above, the tip end side portions of the sandwiching protruding pieces 21 of the substrate sandwiching portions 12a, 12b, and 13a are sandwiched in the thickness direction of the bottom plate 11. It is formed so as not to overlap with the protruding piece 22 for use. For this reason, the circuit board 3 can be easily mounted on the front end side portion of each holding protrusion piece 21 and the board support portion 11a by allowing the circuit board 3 to enter from above the bottom plate 11 in the chassis 2. It is possible to place.

  Next, the circuit board 3 is moved relative to the chassis 2 in the direction of the arrow B shown in FIGS. 5 and 6 (the direction toward the corner formed by the side plates 12 and 13). At this time, the circuit board 3 is the chassis while the back surface 3a of the circuit board 3 is in contact with the upper surface A1 of each of the holding protrusions 21a, 12b, and 13a and the upper surface A3 of the substrate support 11a. 3 and 4, as shown in FIGS. 3 and 4, the outer edge portion of the circuit board 3 is caused to enter between the holding projecting pieces 21 and 22 in the board holding portions 12a, 12b, and 13a. The outer edge portion 3 is sandwiched between the projecting pieces 21 and 22 for sandwiching.

  Further, in the chassis 2 in the power supply device 1 of the present example, as described above, the substrate contact portions 23 are formed between the sandwiching protruding pieces 21 and 22 in the substrate sandwiching portions 12a, 12b, and 13a, respectively. Therefore, the circuit board 3 is moved relative to the chassis 2 until the side part 3c of the circuit board 3 comes into contact with the board contact part 23 of each of the board holding parts 12a, 12b, 13a. It will be in the state positioned in the fixed position on the baseplate 11. Subsequently, the screw part of the male screw 4 is screwed into the screw hole 4a of the board support part 11a so that the screw insertion hole formed in the circuit board 3 is inserted. Thereby, as shown in FIG. 1, the chassis 2 and the circuit board 3 are integrated, and the power supply device 1 is completed.

  Thus, in this power supply device 1, the sandwiching protruding piece 21 that protrudes along the plate surface of the bottom plate 11 so that the back surface 3 a (the surface facing the bottom plate 11) at the outer edge of the circuit board 3 contacts, Substrate holding portions 12a and 12b having holding protrusions 22 protruding along the plate surface of the bottom plate 11 so that the surface 3b (the back surface opposite to the bottom plate 11) at the outer edge portion of the substrate 3 is in contact with the side plate 12. The sandwiching projecting pieces 21 and 22 are formed so that the tip side portion of the sandwiching projecting piece 21 does not overlap the sandwiching projecting piece 22 in the thickness direction of the bottom plate 11. Specifically, in the power supply device 1, the length L1 along the plate surface of the bottom plate 11 between the tip portion of the sandwiching protruding piece 21 and the plate surface of the side plate 12 is the tip portion of the sandwiching projecting piece 22. Both projecting pieces 21 and 22 are formed so as to be longer than a length L2 along the plate surface of the bottom plate 11 between the plate plate and the side plate 12.

  For this reason, according to the power supply device 1, the circuit board 3 is placed on the tip side portion of each of the holding projecting pieces 21 such as the board holding portions 12 a and 12 b in the chassis 2 during assembly. By merely moving the circuit board 3 relative to the chassis 2 along the upper surface A <b> 1 of the sandwiching protruding piece 21, the outer edge portion of the circuit board 3 can be sandwiched by the sandwiching projecting pieces 21 and 22. Therefore, unlike the assembly of the switching power supply disclosed by the applicant, the difficult work of inserting the outer edge portion of the circuit board into the groove between the pair of upper and lower clamping pieces becomes unnecessary, and the power supply device 1 is easily assembled. As a result, the assembly work efficiency can be sufficiently improved. As a result, the manufacturing cost of the power supply device 1 can be sufficiently reduced.

  Further, according to the power supply device 1, the sandwiching protruding piece 22 is formed shorter than the sandwiching projecting piece 21, and the sandwiching projecting piece 22 is in the base plate side of the sandwiching projecting piece 21 in the thickness direction of the bottom plate 11. By forming the protruding protrusions 21 and 22 so as to overlap with the portion, the “second clamping convex portion” is the base in the “first clamping convex portion” in the thickness direction of the “first plate portion”. Unlike the configuration in which the “second clamping convex portion” is protruded in a direction different from that of the “first clamping convex portion”, the press does not overlap with the end side portion. Since both of the sandwiching protruding pieces 21 and 22 can be formed by processing (bending operation), the manufacturing cost of the power supply device 1 can be further reduced.

  Furthermore, according to the power supply device 1, since the board contact portion 23 is provided between the holding protrusion pieces 21 and 22 so that the side portion 3 c of the circuit board 3 contacts, the holding protrusion pieces 21 and 22. As a result, the position (fixed position) of the circuit board 3 on the bottom plate 11 in the state of being sandwiched between the two can be reliably and easily positioned. As a result, the manufacturing cost of the power supply device 1 can be further reduced.

  Further, according to the power supply device 1, the circuit board 3 in a state where the attachment is completed moves (displaces) with respect to the chassis 2 by forming the board clamping portions 12 a and 12 b on the side plate 12. The situation can be avoided reliably.

  Furthermore, according to the power supply device 1, the substrate clamping portion 13 a is formed on the side plate 13 disposed along the thickness direction of the bottom plate 11 on one side adjacent to the one side of the bottom plate 11 on which the side plate 12 is disposed. The situation where the circuit board 3 in the state where the attachment is completed moves (displaces) with respect to the chassis 2 can be avoided more reliably.

  Further, according to the power supply device 1, the circuit board 3 in a state where the attachment is completed moves with respect to the chassis 2 by forming the board support portion 11 a on the bottom plate 11 so that the back surface 3 a of the circuit board 3 is in contact. The situation of misalignment can be avoided more reliably.

  The configuration of the “power supply device” is not limited to the configuration of the power supply device 1 described above. For example, the example in which the substrate holding portions 12a and 12b are formed on the side plate 12 corresponding to the “second plate portion” has been described, but only the substrate holding portion 12a is formed on the side plate 12 and the substrate holding portion 12b. Instead of this, it is also possible to adopt a configuration in which the circuit board 3 is held by forming a fixed piece similar to the fixed piece in the chassis of the switching power supply disclosed by the applicant on the side plate 12 or the side plate 13 or the bottom plate 11. .

  Further, for example, when the length along the side plate 12 in the circuit board 3 is long, in addition to the board holding parts 12a and 12b, one or more “board holding parts” (that is, a plurality (three or more)) are provided. A “substrate clamping portion”) can also be formed on the side plate 12. Further, the example in which only one substrate clamping portion 13a is formed on the side plate 13 corresponding to the “third plate portion” has been described, but instead of such a configuration, a plurality of (two or more) “substrate clamping portions” are provided. Can also be formed on the side plate 13.

  Further, the sandwiching projecting piece 22 is formed shorter than the sandwiching projecting piece 21, the tip side portion of the sandwiching projecting piece 21 does not overlap the sandwiching projecting piece 22 in the thickness direction of the bottom plate 11, and A chassis 2 having substrate sandwiching portions 12a, 12b, 13a in which sandwiching projecting pieces 21, 22 are formed so that the projecting piece 22 for sandwiching overlaps a base end side portion of the projecting piece 21 for sandwiching in the thickness direction of the bottom plate 11. Although described as an example, the configuration of the “substrate clamping unit” is not limited to this.

  For example, like the substrate clamping portion 12c (another example of the “substrate clamping portion”) in the chassis 2a of the power supply apparatus 1A shown in FIG. 7, the clamping protruding piece 22a corresponding to the “second clamping convex portion” is provided. The projecting pieces 21 and 22a for sandwiching are formed so as to have the same length as the projecting piece 21 for sandwiching and the tip side portion of the projecting piece 21 for sandwiching does not overlap the projecting piece 22a for sandwiching in the thickness direction of the bottom plate 11. Can be projected in different directions to constitute a “substrate clamping portion”. The power supply device 1A (chassis 2a) shown in the figure and the power supply devices 1B and 1C (chassis 2b and 2c) shown in FIGS. About the component which has a function, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.

  In this case, in the board sandwiching portion 12c in the chassis 2a, the length L1 along the plate surface of the bottom plate 11 between the tip portion of the sandwiching projecting piece 21 and the plate surface of the side plate 12 is the length in the sandwiching projecting piece 22a. Both sandwiching protrusions 21 and 22a are formed so as to be longer than the length L2a along the plate surface of the bottom plate 11 between the front end portion and the plate surface of the side plate 12. The front end is protruded larger from the plate surface of the side plate 12 than the front end of the sandwiching protruding piece 22a.

  Further, as shown in FIG. 8, a sandwiching protruding piece 22 b corresponding to a “second sandwiching protrusion”, such as a substrate sandwiching part 12 d (a further example of the “board sandwiching part”) in the chassis 2 b of the power supply device 1 </ b> B. Are formed so as to be shorter than the sandwiching projecting piece 21, and the projecting pieces for sandwiching 21 and 22b are arranged so that the tip side portion of the projecting piece for sandwiching 21 does not overlap the projecting piece for sandwiching 22b in the thickness direction of the bottom plate 11. The “substrate clamping portion” can also be configured by protruding in different directions.

  In the board holding portion 12d in the chassis 2b, the length L1 along the plate surface of the bottom plate 11 between the tip portion of the holding protrusion piece 21 and the plate surface of the side plate 12 is the same as the tip portion of the holding protrusion piece 22b. Both clamping projecting pieces 21 and 22b are formed so as to be longer than the length L2b along the plate surface of the bottom plate 11 between the side plates 12 and the tip of the clamping projecting piece 21 is thereby formed. It is made to protrude largely from the plate | board surface of the side plate 12 rather than the front-end | tip part of the protrusion piece 22b for clamping.

  Moreover, although the chassis 2 having the substrate holding portions 12a, 12b, and 13a integrally formed with the holding protruding pieces 21 and 22 and the substrate contact portion 23 has been described as an example, the invention is not limited thereto. For example, like the board holding portion 12e (a further example of the “board holding portion”) in the chassis 2c of the power supply device 1C shown in FIG. 9, the holding protruding piece 21c corresponding to the “first holding protrusion” , And a sandwiching protruding piece 22c corresponding to the “second sandwiching convex portion” and a substrate contacting portion 23c corresponding to the “substrate contacting portion” are separately formed, that is, the sandwiching protruding piece 21c. Further, the “substrate clamping portion” can be configured by separately bending and forming the sandwiching protruding piece 22c and the substrate contact portion 23c.

  In the board holding portion 12e in the chassis 2c, the length L1c along the plate surface of the bottom plate 11 between the tip portion of the holding protrusion piece 21c and the plate surface of the side plate 12 is equal to the tip portion of the holding protrusion piece 22c. Both clamping protrusions 21c and 22c are formed so as to be longer than the length L2c along the plate surface of the bottom plate 11 between the side plate 12 and the plate surface of the side plate 12, whereby the tip of the clamping protrusion 21c is formed. It is made to protrude largely from the plate | board surface of the side plate 12 rather than the front-end | tip part of the protrusion piece 22c for clamping. Also in the power supply devices 1A to 1C including the chassis 2a to 2c having the substrate holding portions 12c to 12e, the same effect as that of the power supply device 1 including the chassis 2 having the substrate holding portions 12a, 12b, and 13a is obtained. Can play.

  Further, the length L1 between the tip of the sandwiching protruding piece 21 and the plate surface of the side plate 12 is the length between the tip of the sandwiching protruding piece 22 (22a, 22b) and the plate surface of the side plate 12. The power supply device 1 (1A, 1B) in which the protruding protrusions 21, 22 (22a, 22b) are formed so as to be longer than L2 (L2a, L2b) has been described as an example. The configuration of is not limited to the configuration example of the substrate clamping portions 12a to 12e and 13a in the power supply device 1 (1A and 1B). For example, the length along the “plate surface of the first plate portion” between the tip portion of the “first clamping convex portion” and the “plate surface of the second plate portion” is “the second plate portion”. The “first clamping convexity” is shorter than the length along the “plate surface of the first plate part” between the front end part of the “projection part for clamping” and the “plate surface of the second plate part”. The “substrate clamping portion” can also be configured by forming the “portion” and the “second clamping convex portion” (not shown).

  When such a configuration is adopted, when the “power supply device” is assembled, the “circuit board” is positioned so as to contact the lower surface of the tip side portion of the “second clamping convex portion”. By simply moving the “circuit board” relative to the “chassis” along the lower surface of the “second clamping convex part”, the “first clamping convex part” and the “second clamping convex part” The outer edge portion of the “circuit board” can be held by the “portion”. Therefore, even when such a configuration is adopted, a difficult operation of inserting the outer edge portion of the circuit board into the groove portion between the pair of upper and lower clamping pieces is unnecessary, and the “power supply device” can be easily assembled. As a result of sufficiently improving the assembly work efficiency, the manufacturing cost of the “power supply device” can be sufficiently reduced.

  Further, a chassis in which two plates, a side plate 12 corresponding to a “second plate portion” and a side plate 13 corresponding to a “third plate portion”, are arranged on a bottom plate 11 corresponding to a “first plate portion”. 2 has been described as an example, but a configuration in which only the “second plate portion” is formed on one side of the “first plate portion” may be employed. Further, without forming the “third plate portion”, a plate portion facing the “second plate portion” can be formed, or in addition to the “second plate portion” and the “third plate portion”. In addition, a plate portion facing the “second plate portion” and a plate portion facing the “third plate portion” may be formed.

DESCRIPTION OF SYMBOLS 1,1A-1C Power supply device 2,2a-2c Chassis 3 Circuit board 3a Back surface 3b Front surface 3c Side part 11 Bottom board 11a Substrate support part 12, 13 Side board 12a-12e, 13a Substrate clamping part 21,21c, 22,22a-22c Protruding piece 23, 23c Substrate contact part A1, A3 Upper surface A2 Lower surface L1, L2, L2a, L2b Length

Claims (7)

A circuit board on which electronic components are mounted, and a chassis to which the circuit board is mounted;
The chassis includes a first plate portion that faces the circuit board, and a second plate portion that is disposed on one side of the first plate portion along the thickness direction of the first plate portion. Comprising at least
The first sandwiched portion is projected along the plate surface of the first plate portion so that the second plate portion is in contact with the surface of the outer edge portion of the circuit board facing the first plate portion. Substrate sandwiching having a convex portion for projecting and a second convex portion for clamping projecting along the plate surface of the first plate portion so that the back surface of the opposing surface at the outer edge portion of the circuit board is in contact Part is formed,
The substrate sandwiching portion includes the first sandwiching protrusion so that at least a tip side portion of the first sandwiching projection does not overlap the second sandwiching projection in the thickness direction of the first plate portion. The power supply device in which the convex part for an object and the said 2nd convex part for clamping are formed.   The substrate sandwiching portion has a length along the plate surface of the first plate portion between the tip portion of the first sandwiching convex portion and the plate surface of the second plate portion. The first sandwiching convex portion so as to be longer than the length along the plate surface of the first plate portion between the tip portion of the sandwiching convex portion and the plate surface of the second plate portion. The power supply device according to claim 1, wherein the second clamping convex portion is formed.   In the substrate clamping portion, the second clamping convex portion is formed shorter than the first clamping convex portion, and the second clamping convex portion is in the thickness direction of the first plate portion. 3. The power supply device according to claim 1, wherein the first clamping convex portion and the second clamping convex portion are formed so as to overlap with a base end side portion of the first clamping convex portion.   2. The substrate abutting portion is provided with a substrate abutting portion between the first clamping convex portion and the second clamping convex portion so that a side portion of the circuit board abuts. 4. The power supply device according to any one of 3.   5. The power supply device according to claim 1, wherein at least two of the substrate holding portions are formed on the second plate portion.   The chassis is disposed on one side of the first plate portion adjacent to the one side on which the second plate portion is disposed along the thickness direction of the first plate portion, and the substrate holding portion. The power supply device according to any one of claims 1 to 5, further comprising a third plate portion on which is formed.   The power supply device according to any one of claims 1 to 6, wherein a convex portion for supporting a substrate is formed on the first plate portion so that the facing surface of the circuit board is in contact therewith.

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