JP2014115373A - Liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal display device capable of suppressing decline in manufacturing yield.SOLUTION: A liquid crystal display device includes: a first substrate, which is formed on a first insulation substrate, including an organic insulation film having a first thick film part of a first film thickness on an active area side out of surrounding areas around the active area, and having a first thin film part of a second film thickness, which is thinner than the first film thickness, on a substrate end part side of the first insulation substrate; and a second substrate, which is formed on a second insulation substrate, including a peripheral light shielding layer which faces the first thick film part and the first thin film part and extends across the surrounding areas, a first color filter which is laminated on the peripheral light shielding layer in a position facing the first thick film part and divided into a plurality of pieces via a slit, a second color filter which is laminated on the peripheral light shielding layer in a position facing the first thin film part, and an overcoat layer having a second thin film part of a third film thickness which is laminated on the first color filter and having a second thick film part of a fourth film thickness, which is thicker than the third film thickness, which is laminated on the second color filter.

Description

  Embodiments described herein relate generally to a liquid crystal display device.

  Liquid crystal display devices are utilized in various fields as display devices for OA equipment such as personal computers and televisions, taking advantage of features such as light weight, thinness, and low power consumption. In recent years, liquid crystal display devices are also used as mobile terminal devices such as mobile phones, display devices such as car navigation devices and game machines.

  A liquid crystal display panel has a configuration in which a liquid crystal layer is held between an array substrate and a counter substrate bonded together by a sealant. Due to the difference between the volume of the liquid crystal layer and the volume between the substrates, The cell gap may vary. In order to solve such a problem, a technique for obtaining a desired cell gap in an active area for displaying an image by accommodating an excessive liquid crystal material in a region that does not contribute to display among regions surrounded by a sealing material is disclosed. Has been.

JP 2012-3149 A

  An object of the present embodiment is to provide a liquid crystal display device capable of suppressing a decrease in manufacturing yield.

According to this embodiment,
A first insulating substrate and a first thick film portion having a first film thickness on the active area side in a peripheral area surrounding the active area formed on the first insulating substrate and displaying an image, and of the first insulating substrate A first substrate comprising: an organic insulating film having a first thin film portion having a second film thickness smaller than the first film thickness on the substrate end side; a second insulating substrate; and the second insulating substrate. A peripheral light-shielding layer formed on the side facing the substrate and facing the first thick film part and the first thin film part and extending over a peripheral area; and the peripheral part at a position facing the first thick film part A first color filter laminated on the light shielding layer and divided into a plurality through slits; a second color filter laminated on the peripheral light shielding layer at a position facing the first thin film portion; and the first color filter And having a second thin film portion having a third film thickness. An overcoat layer that is laminated on the second color filter and has a second thick film portion having a fourth thickness larger than the third thickness, the first thick film portion, and the second thick film portion. A first columnar spacer interposed between the thin film portion, a second columnar spacer interposed between the first thin film portion and the second thick film portion, and between the first substrate and the second substrate. A liquid crystal display device is provided.

FIG. 1 is a plan view schematically showing an example of a display panel PNL applicable to the liquid crystal display device of this embodiment. FIG. 2 is a cross-sectional view schematically showing an example of the structure of the peripheral area PRP of the display panel PNL shown in FIG. FIG. 3 is a plan view showing an example of the layout of the first color filter 221 and the second color filter 222 in the display panel PNL of the present embodiment. FIG. 4 is a schematic cross-sectional view for explaining the cleaving process of the mother substrate pair. FIG. 5 is a diagram for explaining the relationship between the shape of the first color filter 221 and the film thickness of the overcoat layer 23.

  Hereinafter, the present embodiment will be described in detail with reference to the drawings. In each figure, the same reference numerals are given to components that exhibit the same or similar functions, and duplicate descriptions are omitted.

  FIG. 1 is a plan view schematically showing an example of a display panel PNL applicable to the liquid crystal display device of this embodiment.

  That is, the display panel PNL is an active matrix type liquid crystal display panel, and includes an array substrate AR, a counter substrate CT arranged to face the array substrate AR, and a liquid crystal held between the array substrate AR and the counter substrate CT. And a layer LQ. The array substrate AR and the counter substrate CT are bonded together with a sealant SE in a state where a predetermined cell gap is formed between them. This cell gap is formed by columnar spacers (not shown) formed on the array substrate AR or the counter substrate CT. The liquid crystal layer LQ is held on the inner side surrounded by the sealing material SE in the cell gap between the array substrate AR and the counter substrate CT.

  Such a display panel PNL includes an active area ACT for displaying an image inside surrounded by the seal material SE. The active area ACT has, for example, a substantially rectangular shape and includes a plurality of pixels PX arranged in an m × n matrix (where m and n are positive integers).

  The array substrate AR includes a gate line G extending along the first direction X, a source line S extending along the second direction Y and intersecting the gate line G, and a switching connected to the gate line G and the source line S. The pixel electrode PE etc. which were connected to element SW and switching element SW are provided. The counter electrode CE that faces each of the pixel electrodes PE via the liquid crystal layer LQ is provided, for example, on the counter substrate CT, but may be provided on the array substrate AR.

  Although the detailed configuration of the display panel PNL is not described, a mode that mainly uses a vertical electric field such as a TN (Twisted Nematic) mode, an OCB (Optically Compensated Bend) mode, a VA (Vertical Aligned) mode, and the like, IPS A mode that mainly uses a lateral electric field such as an (In-Plane Switching) mode and an FFS (Fringe Field Switching) mode can be applied. In a configuration in which a mode using a lateral electric field is applied, both the pixel electrode PE and the counter electrode CE are provided on the array substrate AR.

  Signal supply sources necessary for driving the display panel PNL such as the driving IC chip 2 and the flexible printed circuit (FPC) substrate 3 are mounted in the peripheral area PRP outside the active area ACT. In the illustrated example, the drive IC chip 2 and the FPC board 3 are mounted on the mounting portion MT of the array substrate AR that extends outward from the substrate end portion CTE of the counter substrate CT. The peripheral area PRP is an area surrounding the active area ACT and includes an area where the sealing material SE is disposed, and is formed in a rectangular frame shape.

  FIG. 2 is a cross-sectional view schematically showing an example of the structure of the peripheral area PRP of the display panel PNL shown in FIG.

  The array substrate AR is formed using a transparent first insulating substrate 10 such as a glass substrate or a resin substrate. In the peripheral area PRP, the array substrate AR includes the outer peripheral wiring W and the organic insulating film 11 on the side of the first insulating substrate 10 facing the counter substrate CT. Although not shown, the array substrate AR includes a switching element, a pixel electrode, an alignment film, and the like on the side of the first insulating substrate 10 facing the counter substrate CT in the active area ACT. In the peripheral area PRP, another insulating film may be interposed between the first insulating substrate 10 and the organic insulating film 11.

  The peripheral wiring W is disposed at a relatively high density on the side close to the active area ACT in the peripheral area PRP, and is hardly disposed on the side close to the substrate end 10E of the first insulating substrate 10. . The outer peripheral wiring W is formed in the same layer as the gate wiring G and the source wiring S.

  The organic insulating film 11 extends not only to the peripheral area PRP but also to the active area ACT. In the peripheral area PRP, the organic insulating film 11 has the first thick film portion 11A on the side close to the active area ACT, and the first thin film portion 11B on the side close to the substrate end 10E. The first thick film portion 11A covers the outer peripheral wiring W located in the peripheral area PRP, and the outer peripheral wiring W serves as a base, and thus has a relatively thick first film thickness T1. On the other hand, the outer periphery wiring W does not exist in the foundation | substrate of the 1st thin film part 11B. For this reason, the first thin film portion 11B has a second film thickness T2 that is thinner than the first film thickness T1. In the illustrated example, in the organic insulating film 11, a groove portion 11C is formed between the first thick film portion 11A and the first thin film portion 11B. The groove portion 11 </ b> C has a depth to reach the first insulating substrate 10. Such an organic insulating film 11 is made of, for example, a transparent resin material.

  On the other hand, the counter substrate CT is formed using a transparent second insulating substrate 20 such as a glass substrate or a resin substrate. The counter substrate CT includes a peripheral light shielding layer 21, a first color filter 221, a second color filter 222, an overcoat layer 23, and the like on the side of the peripheral area PRP facing the array substrate AR of the second insulating substrate 20. Yes. Although not shown, the counter substrate CT includes a black matrix, a color filter layer, an alignment film, and the like in the active area ACT.

  The peripheral light shielding layer 21 is formed on the side of the second insulating substrate 20 facing the array substrate AR, and extends over the peripheral area PRP. That is, the peripheral light-shielding layer 21 is formed continuously without interruption while facing the first thick film portion 11A and the first thin film portion 11B, and is also formed at a position facing the groove portion 11C. The peripheral light shielding layer 21 has a substantially constant film thickness. The peripheral light shielding layer 21 is formed of the same material as the black matrix of the active area ACT and is connected to the black matrix. Such a peripheral light shielding layer 21 is formed of, for example, a resin material colored in black or a light shielding metal material such as chromium (Cr).

  The first color filter 221 and the second color filter 222 are stacked on the peripheral light shielding layer 21. The first color filter 221 is located on the side close to the active area ACT in the peripheral area PRP, and is formed at a position facing the first thick film portion 11A or above the outer peripheral wiring W. The first color filter 221 is divided into a plurality through the slit SL. In the illustrated example, the segment is divided into three segments 2211 to 2213 by two slits SL. The second color filter 222 is separated from the first color filter 221 and is located on the side of the peripheral area PRP that is close to the substrate end 20E of the second insulating substrate 20 and is opposed to the first thin film portion 11B. Is formed. In the illustrated example, the second color filter 222 also extends to a position facing the groove portion 11C, and is continuously formed without interruption from a position facing the first thin film portion 11B. Further, the distance between the first color filter 221 and the second color filter 222 is wider than the width of the slit SL.

  The first width W 1 of each segment of the first color filter 221 is smaller than the second width W 2 of the second color filter 222. That is, the first color filter 221 is divided into a plurality of segments so as to have a width smaller than that of the second color filter 222. The first color filter 221 and the second color filter 222 have a substantially constant film thickness. The first color filter 221 and the second color filter 222 are made of, for example, the same material.

  The overcoat layer 23 covers the first color filter 221 and the second color filter 222 and also covers the peripheral light shielding layer 21 exposed from the slit SL and between the first color filter 221 and the second color filter 222. . This overcoat layer 23 extends not only to the peripheral area PRP but also to the active area ACT.

  In the peripheral area PRP, the overcoat layer 23 has the second thin film portion 23A on the side close to the active area ACT, and the second thick film portion 23B on the side close to the substrate end 20E. The second thin film portion 23A is stacked on the first color filter 221 and has a relatively thin third film thickness T3. The second thin film portion 23A faces the first thick film portion 11A. The second thick film portion 23B is stacked on the second color filter 222 and has a fourth film thickness T4 that is thicker than the third film thickness T3. The second thick film portion 23B faces the first thin film portion 11B and also faces a part of the groove portion 11C. Such an overcoat layer 23 is formed of, for example, a transparent resin material.

  The counter substrate CT further includes a first columnar spacer SP1 and a second columnar spacer SP2 in the peripheral area PRP. The first columnar spacer SP1 and the second columnar spacer SP2 are stacked on the overcoat layer 23, and are formed in a tapered shape that tapers toward the array substrate AR.

  The first columnar spacer SP1 is interposed between the first thick film portion 11A and the second thin film portion 23A. The first columnar spacer SP1 is stacked on the second thin film portion 23A, and in the illustrated example, is positioned directly below the segments 2212 and 2213 of the first color filter 221. The tip of the first columnar spacer SP1 is in contact with the first thick film portion 11A.

  The second columnar spacer SP2 is interposed between the first thin film portion 11B and the second thick film portion 23B. That is, the second columnar spacer SP2 is located on the outermost periphery of the display panel PNL. The second columnar spacer SP2 is stacked on the second thick film portion 23B, and in the illustrated example, is positioned immediately below the second color filter 222. The tip of the second columnar spacer SP2 is in contact with the first thin film portion 11B.

  When the sealing material SE is interposed between the tip of the first columnar spacer SP1 and the first thick film portion 11A and between the tip of the second columnar spacer SP2 and the first thin film portion 11B. There is also a possibility. Further, the first columnar spacer SP1 and the second columnar spacer SP2 may be provided on the array substrate AR. In this case, the first columnar spacer SP1 is stacked on the first thick film portion 11A of the organic insulating film 11, and the second columnar spacer SP2 is stacked on the first thin film portion 11B of the organic insulating film 11.

  The array substrate AR and the counter substrate CT as described above are arranged so that the organic insulating film 11 and the overcoat layer 23 face each other. As an example, the film thickness difference (T1−T2) between the first thick film portion 11A and the first thin film portion 11B in the organic insulating film 11 is equal to (the second thick film portion 23B and the second thin film portion 23A in the overcoat layer 23). In this case, the first height (the gap between the first thick film portion 11A and the second thin film portion 23A) H1 of the first columnar spacer SP1 is: This is equivalent to the second height (gap between the first thin film portion 11B and the second thick film portion 23B) H2 of the second columnar spacer SP2.For this reason, in the peripheral area PRP, the array substrate AR and the counter substrate CT. Is substantially parallel.

  The sealing material SE for bonding the array substrate AR and the counter substrate CT is interposed between the first thick film portion 11A and the second thin film portion 23A. The first columnar spacer SP1 is surrounded by the sealing material SE. In the illustrated example, the sealing material SE is also interposed between the groove portion 11C and the second thick film portion 23B.

  The liquid crystal layer LQ is sealed inside (active area side) from the sealing material SE.

  FIG. 3 is a plan view showing an example of the layout of the first color filter 221 and the second color filter 222 in the display panel PNL of the present embodiment. Here, only the main parts necessary for explanation are shown.

  In the illustrated example, the three segments 2211 to 2213 of the first color filter 221 all have the same shape, are formed in strips extending in the first direction X and the second direction Y, and are rectangular active. It is formed in a rectangular frame shape surrounding the area ACT. The segment 2211 is close to the active area ACT, the segment 2212 is located outside the segment 2211 across the slit SL, and the segment 2213 is located outside the segment 2212 across the slit SL. Although not shown, the dot-like first columnar spacers SP <b> 1 are scattered at positions overlapping the segments of the first color filter 221.

  The second color filter 222 is formed in a strip shape extending in each of the first direction X and the second direction Y, and is formed in a substantially rectangular frame shape surrounding the outside of the first color filter 221. The second color filter 222 is located on the outermost periphery (panel end) of the display panel PNL. In other words, the first color filter 221 is located inside the display panel PNL with respect to the second color filter 222. Although not shown, the dot-like second columnar spacers SP <b> 2 are scattered at positions overlapping the second color filter 222.

  In the example shown here, each of the first color filter 221 and the second color filter 222 has a continuously formed frame shape, but may be interrupted in the middle, and a plurality of straight lines arranged on the same straight line. It may be formed by a part.

  The color filters arranged in the active area ACT are arranged corresponding to the red color filter CFR arranged corresponding to the red pixel, the green color filter CFG arranged corresponding to the green pixel, and the blue pixel. It consists of a blue color filter CFB. These color filters are made of, for example, resin materials colored in red, green, blue, and the like.

  The first color filter 221 and the second color filter 222 are made of the same material as one of the color filter layers arranged in the active area ACT. In the present embodiment, the first color filter 221 and the second color filter 222 are made of the same material as the blue color filter CFB, for example.

  Next, an example of a method for manufacturing the display panel PNL will be described.

  First, a first mother substrate on which a plurality of array substrates AR are collectively formed is prepared. This first mother substrate is formed using an insulating substrate to be a first insulating substrate, and includes various wirings such as gate wiring, source wiring, and peripheral wiring, various insulating films such as organic insulating films, pixel electrodes, alignment films, and the like. I have.

  On the other hand, a second mother substrate on which a plurality of counter substrates CT are collectively formed is prepared. The second mother substrate is formed using an insulating substrate to be a second insulating substrate, and includes a black matrix, a peripheral light shielding layer, a first color filter, a second color filter, a color filter layer, an overcoat layer, and a first columnar spacer. SP1, a second columnar spacer SP2, an alignment film, and the like are provided.

  Subsequently, after disposing a sealing material on the first mother substrate or the second mother substrate so as to surround each active area, a liquid crystal material is dropped on the inner side surrounded by the sealing material, and the first mother substrate and the second mother substrate are then dropped. Two mother boards are bonded together.

  Thereafter, the display panel PNL is taken out from the mother substrate pair in which the liquid crystal layer is formed between the first mother substrate and the second mother substrate. In this step, both the first mother substrate and the second mother substrate are cleaved with a cutting line. This process will be described more specifically below.

  FIG. 4 is a schematic cross-sectional view for explaining the cleaving process of the mother substrate pair.

  That is, the teeth of the cut member used at the time of cleaving are pressed against the cleaving lines CTL of the first mother board M1 and the second mother board M2. At this time, in the vicinity of the breaking line CTL, the second columnar spacer SP2 formed on the second mother substrate M2 is in contact with the first thin film portion 11B of the organic insulating film 11 formed on the first mother substrate M1. Therefore, when the teeth of the cut member are pressed, the second columnar spacer SP2 receives a pressing force from the cut member, and suppresses the bending of each of the first mother substrate M1 and the second mother substrate M2. For this reason, the pressing force from the cutting member is transmitted to the respective insulating substrates of the first mother substrate M1 and the second mother substrate M2, cracks develop, and the mother substrate pair is cut along the cutting line CTL. Thereby, the display panel PNL holding the liquid crystal layer LQ between the array substrate AR and the counter substrate CT is manufactured.

  According to this embodiment, the second columnar spacer SP2 located on the outermost periphery (panel end) of the display panel is the first thin film portion 11B on the array substrate AR side and the second thick film portion on the counter substrate CT side. 23B and holding the gap between them, the pressing force applied from the cutting member when the mother substrate pair is cleaved is reliably transmitted to the mother substrate pair, and cracks occur along the normal direction of the mother substrate. Can be progressed, and it becomes possible to suppress cleaving defects. As a result, it is possible to suppress a decrease in manufacturing yield. In addition, it is possible to suppress a reduction in the strength of the display panel due to a crack progressing in an undesired direction.

  In particular, in recent years, there has been an increasing demand for a narrow frame with a short distance from the sealing material SE to the substrate end portions 10E and 20E. In addition, as the density of the pixels PX increases and the functionality of the display panel PNL increases, the peripheral area PRP The outer peripheral wiring W tends to be arranged at a high density. For this reason, since the outer periphery wiring W is arrange | positioned with high density also in the area (seal area) where the sealing material SE is arrange | positioned, the film thickness of the organic insulating film 11 which covers the outer periphery wiring W in a seal area becomes thick. On the other hand, in the outer area closer to the substrate end than the seal area, the outer peripheral wiring W is not arranged at high density in order to avoid the exposure of the outer peripheral wiring W, and the film thickness of the first organic insulating film 11 is not provided in the outer area. Is thinner than the seal area. Such a film thickness difference of the organic insulating film 11 forms a step on the surface of the array substrate AR. In the peripheral area PRP of the counter substrate CT, a peripheral light shielding layer, a color filter, and an overcoat layer having a uniform film thickness are stacked, and the first columnar spacer SP1 and the second columnar spacer SP2 having the same height are connected to the array substrate AR. When bonded, the first columnar spacer SP1 contacts the organic insulating film 11 in the seal area, while a gap is formed between the second columnar spacer SP2 and the organic insulating film 11 in the outer area. For this reason, when the mother substrate pair is cleaved, the pressing force from the cut member is not transmitted to the second columnar spacer SP2, and there is a possibility that cleaving failure may occur.

  In order to compensate for such a step on the surface of the array substrate, when an outer peripheral wiring is added to the outer area as the base of the organic insulating film 11, the outer peripheral wiring is exposed due to variation in the cleaving position, and there are concerns about problems such as corrosion and short circuit. Is done.

  As another method to compensate for the step on the surface of the array substrate, when a plurality of color filters are stacked in the outer area, the outer peripheral area on the counter substrate side becomes too thicker than the seal area, resulting in gap unevenness in the active area. There is concern about the display failure. When a plurality of color filters are simply stacked, it is difficult to adjust the thickness. Therefore, when another layer different from the color filter is added, the manufacturing process of the counter substrate is increased by one process, which increases the cost. Invite rise.

  In the present embodiment, a first color filter 221 that is divided into a plurality of segments via slits SL is disposed at a position facing the first thick film portion 11A formed on the array substrate side, and the first thin film The second color filter 222 is disposed at a position facing the portion 11B, and the first color filter 221 and the second color filter 222 are covered with the overcoat layer 23. The overcoat layer 23 at a position facing the first thick film portion 11A is formed as the second thin film portion 23A having a relatively thin film thickness because part of the overcoat layer 23 flows into the slit SL between the segments in the manufacturing process. Further, since the overcoat layer 23 at a position facing the first thin film portion 11B is laminated on the second color filter 222, the overcoat layer 23 is formed as a relatively thick second thick film portion 23B. That is, a step is formed on the surface of the organic insulating film 11 on the array substrate AR side, and a step on the surface of the overcoat layer 23 is formed on the counter substrate CT side, and the thick film portion and the thin film portion face each other. ing. As a result, the first columnar spacer SP1 disposed in the seal area and the second columnar spacer SP2 disposed in the outer area can hold the gap between the array substrate AR and the counter substrate CT, and the mother substrate pair It becomes possible to suppress cleaving defects when cleaving.

  Moreover, since the outer peripheral wiring is not arranged in the outer peripheral area, it is possible to suppress the occurrence of problems due to the exposure of the outer peripheral wiring.

  In addition, since both the first color filter 221 and the second color filter 222 are formed in the same process as the color filter layer disposed in the active area, an increase in cost due to an increase in the number of manufacturing steps of the counter substrate CT is suppressed. It becomes possible to do.

  In the first color filter 221, the film thickness of the overcoat layer 23 covering the first color filter 221 can be adjusted by changing the width of the slit SL and the width of each segment. That is, it is possible to freely adjust the third film thickness T3 of the second thin film portion 23A. Therefore, the film thickness difference between the first film thickness T1 of the first thick film portion 11A on the array substrate side and the second film thickness T2 of the first thin film portion 11B, the first height H1 of the first columnar spacer SP1, the first Considering the second height H2 of the two-column spacer SP2, the fourth film thickness T4 of the second thick film part 23B, etc., it is possible to obtain the optimum third film thickness T3 in the second thin film part 23A.

  Further, according to the present embodiment, it is possible to improve the adhesion strength of the first color filter 221, the second color filter 222, and the overcoat layer 23 that are stacked on the peripheral light shielding layer 21. That is, since the first color filter 221 and the second color filter 222 are resin materials containing pigments, their adhesive strength is low. On the other hand, since the overcoat layer 23 does not contain a pigment and is formed of a transparent resin material, the overcoat layer 23 has higher adhesive force than the first color filter 221 and the second color filter 222. As described above, the interface between the peripheral light shielding layer 21 having relatively weak adhesive force and the first color filter 221 and the second color filter 222 is reduced, and the overcoat layer 23 replaces the first color filter 221 and the second color filter 222 with each other. Surrounding and adhering to the peripheral light shielding layer 21 through the slit SL and the gap between the first color filter 221 and the second color filter 222, the first color filter 221 and the second color filter 222 from the peripheral light shielding layer 21 It becomes possible to suppress peeling.

  In addition, as described above, the sealing material SE is filled not only between the organic insulating film 11 and the overcoat layer 23 but also in the groove 11C, so that the application amount of the sealing material SE can be increased. The area of the array substrate surface with which the sealing material SE comes into contact can be enlarged. For this reason, it becomes possible to improve the adhesive force with the array substrate AR by the sealing material SE.

  Next, the relationship between the total film thickness T of the peripheral light shielding layer 21, the first color filter 221, and the overcoat layer 23 and the width W and slit width D of the first color filter 221 will be examined. FIG. 5 is a diagram showing the results of this study.

  Here, the width W of the first color filter 221 is 1 times the reference value (W = 1), 2 times (W = 2), 3 times (W = 3), 4 times as large as the reference value. Things (W = 4) and 6 times (W = 6) were prepared. Further, the slit width D is zero (that is, equivalent to the case where the first color filter 221 is not divided) (D = 0), one that is a reference value (D = 1), and two times. (D = 2) Three times (D = 3) and four times (D = 4) were prepared.

  Regarding the total thickness T, the case where W = 6 and D = 2 is set as a reference (0). When W = 4 and D = 2, it is reduced by about 0.04 μm from the reference, and when W = 3 and D = 3, it is reduced by about 0.15 μm from the reference, and W = 2 and D = 0or1or2or3or4. In this case, it is reduced by 0.3 μm to 0.4 μm from the reference, and in the case of W = 1 and D = 0or1or2or3or4, it is reduced by 0.5 μm to 0.65 μm from the reference.

  The difference in the total film thickness T is mainly caused by the difference in the film thickness of the overcoat layer 23 that overlaps the first color filter 221. That is, the leveling property of the overcoat layer 23 varies depending on the width W and the slit width D of the first color filter 221 serving as the base. That is, the smaller the area of the first color filter 221 serving as the base of the overcoat layer 23, the thinner the film thickness of the overcoat layer 23 laminated on the first color filter 221. Further, as the distance (slit width) between the first color filters 221 serving as the base of the overcoat layer 23 is larger, the film thickness of the overcoat layer 23 laminated on the first color filter 221 is thinner.

  In the present embodiment, such a film thickness difference of the overcoat layer 23 is used, and it is confirmed that the total film thickness T can be controlled by the width W and the slit width D of the first color filter 221. It was. In the example shown here, it was confirmed that control was possible in a range up to 0.65 μm.

  As described above, according to the present embodiment, it is possible to provide a liquid crystal display device capable of suppressing a decrease in manufacturing yield.

  In addition, this invention is not limited to the said embodiment itself, In the stage of implementation, it can change and implement a component within the range which does not deviate from the summary. Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, you may combine suitably the component covering different embodiment.

DESCRIPTION OF SYMBOLS 1 ... Liquid crystal display device PNL ... Display panel AR ... Array substrate CT ... Opposite substrate LQ ... Liquid crystal layer ACT ... Active area PX ... Pixel PRP ... Peripheral area PE ... Pixel electrode CE ... Counter electrode 11 ... Organic insulating film 11A ... 1st thickness Film part 11B ... 1st thin film part 21 ... Peripheral light shielding layer 221 ... 1st color filter 222 ... 2nd color filter 23 ... Overcoat layer 23A ... 2nd thin film part 23B ... 2nd thick film part SP1 ... 1st columnar spacer SP2 ... Second columnar spacer

Claims (8)

A first insulating substrate and a first thick film portion having a first film thickness on the active area side in a peripheral area surrounding the active area formed on the first insulating substrate and displaying an image, and of the first insulating substrate A first substrate comprising: an organic insulating film having a first thin film portion having a second film thickness smaller than the first film thickness on the substrate end side;
A second insulating substrate, and a peripheral light-shielding layer formed on a side of the second insulating substrate facing the first substrate and facing the first thick film portion and the first thin film portion and extending over a peripheral area. A first color filter laminated on the peripheral light-shielding layer at a position facing the first thick film portion and divided into a plurality of portions through slits; and on the peripheral light-shielding layer at a position facing the first thin film portion. A second color filter that is stacked; a second thin film portion that is stacked on the first color filter and has a third thickness; and a fourth film that is stacked on the second color filter and is thicker than the third thickness. A second substrate provided with an overcoat layer having two thick film portions;
A first columnar spacer interposed between the first thick film portion and the second thin film portion;
A second columnar spacer interposed between the first thin film portion and the second thick film portion;
A liquid crystal layer held between the first substrate and the second substrate;
A liquid crystal display device comprising:   The first film thickness difference between the first thick film part and the first thin film part is equivalent to a second film thickness difference between the second thick film part and the second thin film part. Liquid crystal display device.   3. The liquid crystal display device according to claim 1, wherein a first width of the first color filter is smaller than a second width of the second color filter.   4. The liquid crystal display device according to claim 1, wherein the first color filter and the second color filter are made of the same material as the blue color filter. 5.   5. The liquid crystal display device according to claim 1, wherein a first height of the first columnar spacer is equal to a second height of the second columnar spacer. 6.   The liquid crystal display device according to claim 1, wherein the first columnar spacer and the second columnar spacer are provided on the second substrate.   Furthermore, the sealing material which intervened between the said 1st thick film part and the said 2nd thin film part and bonded together the said 1st board | substrate and the said 2nd board | substrate was provided. The liquid crystal display device described.   In the organic insulating film, a groove is formed between the first thick film portion and the first thin film portion, and the sealing material is interposed between the groove portion and the second thick film portion. A liquid crystal display device according to 1.

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