JP2014187502A - Electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sealed electronic device with which an external intake port and an external exhaust port, which become a noise source, are not included in a casing and heat of an internal heat source component can be efficiently deprived and discharged to the outside by a radiator, which is disposed on a side surface of the casing, and a cover.SOLUTION: The sealed electronic device in which a heat source component is packaged, air from a fan disposed at a lower side of the heat source component is blown to the heat source component and air warmed by the heat source component is circulated within a casing for cooling, a lateral side surface of the casing is formed from a radiator which including a plurality of fins having recessed groove parts insides and arranged in a perpendicular direction, and a cover is provided which covers the fins of the radiator. Air warmed by the heat source component is caused to flow into the recessed groove parts of the fins of the radiator by air blowing from the fan, warmed air is heat-transferred to the fins and heat-dissipated in outside air, and heat dissipated into outside air is cooled by air flowing in an external flow passage formed between the cover and the fins and including upper and lower openings.

Description

  The present invention relates to a cooling structure for a sealed electronic device, and more particularly to an electronic device having a cooling structure that can be applied to a broadcast camera.

  In a conventional television camera for broadcasting, a fan is mounted inside the camera casing, cooling air is sucked from an air intake port provided at the bottom of the camera casing to cool the internal heat source, and is heated by the internal heat source. The inside of the camera was cooled by discharging the air from an exhaust port provided at the top or rear of the camera casing.

In Patent Document 1, the heat generated in the electronic circuit device on the circuit board can be efficiently discharged out of the housing by heat radiation by the convection of the fan and heat radiation by heat conduction, and temperature rise in the housing can be suppressed. Television camera technology is disclosed.
Further, in the portable type television camera of Patent Document 1, a fan for heat dissipation is provided in the casing of the television camera, and the air taken in from the air inlets provided in the bottom part and the lower part of the side surface of the television camera dissipates heat. After passing between the fins and the plurality of circuit boards, it is discharged to the outside from an exhaust port provided in the lower part on the back side of the housing.

JP 2011-1752055 A

However, unlike a portable type television camera as disclosed in Patent Document 1, a broadcasting studio camera is provided with a cooling fan that is taken in from the air inlets provided at the bottom and the lower side of the casing, even if a fan is provided in the casing. It is structurally impossible to provide an exhaust port for exhausting air for the rear side of the housing.
Here, a cooling method of the camera body of the conventional broadcasting studio camera will be described with reference to FIGS. FIG. 7 is a front perspective view showing an appearance of a camera body of a conventional broadcasting studio camera. FIG. 8 is an assembly cut sectional view of the camera body of the broadcasting studio camera of FIG. In addition, the black thick arrow has shown the flow of the air for cooling.

As shown in FIGS. 7 and 8, in a camera body 100 that is used as a broadcasting studio camera with a large lens mounted on the conventional front surface, an air cooling fan 101 is arranged on the upper part of the camera body 100, and the lower part of the camera body 100 is placed. A cooling structure is adopted in which air is taken in from an intake port (not shown) provided, the heat source component 102 is cooled by the taken-in air, and then the warmed air is discharged to the outside from an exhaust port (not shown).
However, since the air cooling fan 101 is arranged on the upper portion of the camera body 100, the arrangement location of the air cooling fan 101 is restricted and the air cooling fan 101 must be arranged in a narrow space, and the size of the air cooling fan 101 itself is restricted. There was a problem that.
In addition, the various parts mounted on the camera body 100 complicate the flow path of the air sucked from the air inlet, causing the air flow inside the camera body 100 to become muffled and preventing efficient cooling. was there.

Further, since the cooling fan 101 is downsized, the cooling fan 101 has to be rotated at a high speed in order to secure a necessary flow rate, resulting in noise. In addition, by disposing the cooling fan 101 on the upper part of the camera body 100, the cooling fan 101 is closer to the cameraman, and the noise from the cooling fan 101 causes discomfort to the cameraman.
In addition, a conventional broadcast studio camera requires an air intake port for taking in air and an air exhaust port for discharging warm air to the outside, and noise from the cooling fan 101 always leaks from the air intake port and the exhaust port. It was necessary to reduce the number of rotations of the cooling fan 101 or sometimes stop the cooling fan 101 itself. Therefore, there is a problem that the internal temperature of the camera body 100 rises and has a great influence on the photographing.

  The present invention has been made to solve such a problem, and the housing does not have an external air inlet and an external air outlet that cause noise. It is an object of the present invention to provide a sealed electronic device capable of taking heat of a heat source component and discharging it to the outside.

  In order to achieve the above object, an electronic device according to the present invention includes a heat source component mounted therein, air from a fan disposed below the heat source component applied to the heat source component, and air heated by the heat source component In a sealed electronic device that circulates the inside of the casing for cooling, the left and right side surfaces of the casing are configured with a heat radiator that includes a plurality of fins that have concave grooves on the inside and are aligned in the vertical direction, and A cover that covers the fins of the radiator; and air blown from the fan causes the air heated by the heat source component to flow through the concave grooves of the fins of the radiator and heats the heated air to the fins. The heat is transferred to the outside air to dissipate heat, and the heat released into the outside air is cooled by the air flowing in the external flow path formed between the cover and the fin and having an opening at the top and bottom. To.

  In order to achieve the above object, an electronic device according to the present invention includes an inner wall plate attached so as to close an intermediate portion of the concave groove portion in the electronic device described above, and an inlet port is formed above the concave groove portion by the inner wall plate. In addition, since an internal flow path having a discharge port is formed in the lower part of the concave groove portion, air heated by the heat source component flows into the internal flow path, and heat is efficiently transferred to the fins. It is characterized by that.

  In order to achieve the above object, an electronic device according to the present invention includes, in the above-described electronic device, a partition plate that is disposed at an intermediate portion in the casing and partitions the space in the casing in the vertical direction. The fan is attached to a plate, and air from the fan flows from the lower space toward the upper space.

  In order to achieve the above object, an electronic device according to the present invention is characterized in that in the above electronic device, the inner wall plate is formed of a heat insulating material.

  As described above, according to the present invention, the housing does not have the external air inlet and the external air outlet that cause noise, and the heat from the internal heat source component is efficiently removed by the radiator and the cover disposed on the side surface of the housing. A sealed electronic device that can be discharged to the outside can be provided.

It is a front perspective view which shows an example of the electronic device which concerns on Embodiment 1 of this invention. It is a figure which shows the structure of the electronic device which concerns on Embodiment 1 of this invention. It is sectional drawing at the time of cut | disconnecting by the DD plane shown in FIG.1 and FIG.5. It is a front perspective view of sectional drawing shown in FIG. It is sectional drawing at the time of cut | disconnecting by the AA surface shown to FIG.1 and FIG.3. It is sectional drawing at the time of cut | disconnecting by the BB surface shown to FIG.1 and FIG.3. It is a front perspective view which shows the external appearance of the camera main body of the conventional broadcasting studio camera. It is an assembly cut sectional view of the camera body of the broadcasting studio camera of FIG.

<Embodiment 1>
[Configuration of Electronic Device 1]
Hereinafter, the electronic device according to Embodiment 1 of the present invention will be described in detail with reference to FIGS.
FIG. 1 is a front perspective view showing an example of an electronic apparatus according to Embodiment 1 of the present invention. FIG. 2 is a diagram showing the configuration of the electronic device according to Embodiment 1 of the present invention. 3 is a cross-sectional view taken along the line DD shown in FIGS. 1 and 5, and FIG. 4 is a front perspective view of the cross-sectional view shown in FIG. 3. FIG. 5 is a cross-sectional view taken along the plane AA shown in FIGS. 1 and 3. Moreover, FIG. 6 is sectional drawing at the time of cut | disconnecting by the BB surface shown to FIG.1 and FIG.3.
The electronic apparatus 1 according to the first embodiment of the present invention will be described with reference to a camera body of a broadcast studio camera that has a large lens attached to the front surface and is used in a broadcast station studio or the like. The present invention is applicable not only to studio cameras but also to sealed electronic devices used outdoors.

  As shown in FIGS. 1 and 2, the housing portion of the electronic device 1 includes a chassis 11, a side radiator (LF) 12 and a side radiator (attached to the chassis 11 so as to close the left side opening of the chassis 11. LB) 13, a side radiator (RF) 14 and a side radiator (RB) 15 attached to the chassis 11 so as to close the opening on the right side of the chassis 11, a side radiator (LF) 12, and a side radiator (LB). ) And the side cover (LF) 21 and the side cover (LB) 22 that are attached to the chassis 11 so as to cover the chassis 13, the side radiator (RF) 14, and the side radiator (RB) 15 respectively. The side cover (RF) 23 and the side cover (RB) 24 are attached to the head.

  A partition plate (M) 35 for partitioning the space in the front-rear direction of the electronic device 1 is attached to the chassis 11. A CCD (Charge Coupled Device) or the like is located in front of the partition plate (M) 35. A heat source component (F) 36 accompanied by heat generation is mounted, and a plurality of substrates such as a control substrate for controlling the electronic device 1 are mounted on the rear side, and a CPU (Central Processing Unit) is mounted on these substrates. A heat source component (B) 37 that generates heat such as the above is mounted. A fan (F) 31 for cooling the heat source component (F) 36 is disposed below the heat source component (F) 36. The fan (F) 31 is attached to a partition plate (F) 33 for partitioning the space in the vertical direction. The fan (F) 31 discharges air from the lower space toward the upper space, and the heat source component (F) so that the discharged air directly hits it. ) 36 is arranged. Further, as shown in FIG. 5, a fan (B) 32 for cooling the heat source component (B) 37 is disposed below the heat source component (B) 37. The fan (B) 32 is attached to a partition plate (B) 34 for partitioning the space in the vertical direction. The fan (B) 32 discharges air from the lower space toward the upper space, and the heat source component (B ) 37 is arranged.

The side radiator (LF) 12 and the side radiator (LB) 13 include a plurality of fins arranged in the vertical direction protruding outward, and each has a concave groove portion inside the fin. Further, as shown in FIG. 2, the inner side walls (LF) 16 and the inner flow path inner walls (LF) 16 and the center portions of the side heat radiator (LF) 12 and the side heat radiator (LB) 13 are respectively plugged at the inner center of the side groove. An internal flow path inner wall (LB) 17 is attached. Due to the inner flow path inner wall (LF) 16 and the inner flow path inner wall (LB) 17, the side flow radiator (LF) 12 and the side heat radiator (LB) 13 are connected to the internal flow path inlet (LF) 12a, A flow path exhaust port (LF) 12b, an internal flow path intake port (LB) 13a, and an internal flow path exhaust port (LB) 13b are formed. In addition, a concave groove is provided on the inner periphery of the side radiator (LF) 12 and the side radiator (LB) 13, and an O-ring is fitted therein and attached to the opening on the left side surface of the chassis 11. Airtightness is maintained. That is, the inside of the fin forms an internal sealing structure together with the chassis 11.
Similarly, the side radiator (RF) 14 and the side radiator (RB) 15 include a plurality of fins arranged in the vertical direction protruding outward, and each has a concave groove portion inside the fin. Further, as shown in FIG. 3, the inner side walls (RF) 18 and the inner flow path inner walls (RF) 18 and the center portions of the side heat radiator (RF) 14 and the side heat radiator (RB) 15, respectively, are plugged at the inner centers of the side grooves. An internal flow path inner wall (RB) 19 is attached. By the internal flow path inner wall (RF) 18 and the internal flow path inner wall (RB) 19, an internal flow path inlet (RF) 14 a (not shown) is provided to each of the side surface radiator (RF) 14 and the side surface radiator (RB) 15. , An internal channel exhaust port (RF) 14b, an internal channel intake port (RB) 15a, and an internal channel exhaust port (RB) 15b are formed. In addition, a concave groove is provided on the inner periphery of the side radiator (RF) 14 and the side radiator (RB) 15, and an O-ring is fitted therein and attached to the opening on the right side of the chassis 11. Airtightness is maintained. That is, the inside of the fin forms an internal sealing structure together with the chassis 11.

[Method of cooling electronic device 1]
Next, a method for cooling the electronic device 1 according to the present invention will be described in detail with reference to FIGS. In FIGS. 5 and 6, black thick arrows indicate cooling air flow paths.

In the rear space partitioned by the partition plate (M) 35 of the electronic device 1 as indicated by the arrow of the internal flow path R1 in FIG. 5, the fan ( B) The cool air from 32 is blown directly onto the heat source component (B) 37 to take heat away, and the warmed wind is sent upward. The warm air sent upward is divided in the left and right side directions, and the internal flow path inlet (LB) 13a of the side radiator (LB) 13 and the side radiator (RB) 15 disposed on the left and right sides of the electronic device 1. And the warm air flowing into the concave groove inside the fin from the internal flow passage inlet (RB) 15a, and the heat that has been taken away by heat transfer to the fin, the side radiator (LB) 13 and the side radiator ( RB) 15 is discharged from the internal flow path exhaust port (LB) 13b and the internal flow path exhaust port (RB) 15b. The discharged cold air is sucked from the fan (B) 32 and is discharged upward again.
As described above, the internal circulation of the wind is performed in the internal sealed structure, and the cooling efficiency is increased.

  Further, as shown in FIG. 6, by attaching the side cover (LB) 22 and the side cover (RB) 24 to the chassis 11 so as to cover the side radiator (LB) 13 and the side radiator (RB) 15, respectively. External flow paths R2 that are air passages are provided between the side radiator (LB) 13 and the side cover (LB) 22 and between the side radiator (RB) 15 and the side cover (RB) 24, respectively. The cold air that is formed and enters from the lower openings of the side cover (LB) 22 and the side cover (RB) 24 flows upward. That is, the air that has entered through the lower openings of the side cover (LB) 22 and the side cover (RB) 24 passes through the concave grooves inside the fins of the side radiator (LB) 13 and the side radiator (RB) 15 from above. Heat is taken from the warm air of the internal flow path R1 flowing toward the air through the fins, and flows from the lower side to the upper side due to the chimney effect. The chimney effect is natural convection caused by rising warm air, and warm air is discharged from the upper openings of the side cover (LB) 22 and the side cover (RB) 24 at the upper part of the external flow path R2. At this time, external cold air is sucked from the lower openings of the side cover (LB) 22 and the side cover (RB) 24 at the bottom, and further from the fins of the side radiator (LB) 13 and the side radiator (RB) 15. Convection that takes heat away.

In addition, since the surface area inside a fin can be taken wide by providing a concave groove part inside the fin of each of the side surface radiator (LB) 13 and the side surface radiator (RB) 15, the heat from the internal flow path R1 to the fin Transmission can be performed efficiently and the thickness of the fin itself can be reduced, so that heat conduction in the fin can be performed efficiently. As a result, the efficiency of heat exchange from the internal channel R1 to the external channel R2 is improved. To do.
Further, heat conduction to the internal flow path inner wall (LB) 17 and the internal flow path inner wall (RB) 19 for forming the internal flow path R1 between the side heat radiator (LB) 13 and the side heat radiator (RB) 15. By using a heat insulating material having a low rate (resin such as plastic), the inside of the electronic device 1 is not warmed again by heat transfer to the inner channel inner wall (LB) 17 and the inner channel inner wall (RB) 19 due to warm air, It is possible to reliably transfer heat from the internal flow path R1 to the fins that are the flow path outer walls. By repeating the internal circulation of the wind described above, the heat generated from the inside of the device can be efficiently led to the outside, and the inside of the electronic device 1 can be efficiently cooled.

  Further, as shown in FIGS. 5 and 6, a partition plate (B) 34 that partitions the space in the vertical direction is provided, and the fan (B) 32 is arranged on the partition plate (B) 34, whereby the fan (B) 32. The cooling efficiency can be improved by eliminating the short path of air blow. This arrangement is not limited by the size of the fan, and it is easy to increase the size of the fan. The flow rate obtained by rotating a large fan at low speed has the same effect as rotating a small fan at high speed. For this reason, since the rotation of the fan can be reduced, the noise caused by the rotation of the fan can be reduced. In addition, the inside and the outside of the flow path are completely separated, and there is no wind flow from the inside to the outside and from the outside to the inside, and the inside can be made a completely sealed structure. The electronic device 1 having an internal hermetic structure can reduce noise discomfort caused by the fan without leakage of sound generated from the fan.

Further, in the front space partitioned by the partition plate (M) 35 of the electronic device 1, a fan (F) arranged upward on the lower side of the main heat source component (F) 36, similar to the internal flow path R 1 of FIG. 5 described above. F) Cold air from 31 is blown directly onto the heat source component (F) 36 to take heat away, and the warmed wind is sent upward. The warm air sent upward is divided into the left and right side surfaces, and the side flow radiator (LF) 12 and the internal flow path intake port (LF) 12a of the side radiator (RF) 14 disposed on the left and right side surfaces of the electronic device 1. And after flowing into the concave groove inside the fin from the internal flow passage inlet (RF) 14a, the heat that has flowed is taken away by heat transfer to the fin, and then the side radiator (LF) 12 and the side radiator ( RF) 14 is exhausted from the internal channel exhaust port (LF) 12b and the internal channel exhaust port (RF) 14b. The discharged cool air is sucked from the fan (F) 31 and is discharged upward again.
As described above, the internal circulation of the wind is performed in the internal sealed structure, and the cooling efficiency is increased.

  Further, similarly to the external flow path R2 of FIG. 6 described above, the side cover (LF) 21 and the side cover (RF) 23 are chassis to cover the side radiator (LF) 12 and the side radiator (RF) 14, respectively. 11, between the side radiator (LF) 12 and the side cover (LF) 21, and between the side radiator (RF) 14 and the side cover (RF) 23, respectively. A certain external flow path R <b> 2 is formed, and cold air that has entered through the lower openings of the side cover (LF) 21 and the side cover (RF) 23 flows upward. That is, the air that has entered through the lower openings of the side cover (LF) 21 and the side cover (RF) 23 passes through the recessed grooves inside the fins of the side radiator (LF) 12 and the side radiator (RF) 14 from above. Heat is taken from the warm air of the internal flow path R1 flowing toward the air through the fins, and flows from the lower side to the upper side due to the chimney effect. The chimney effect is natural convection caused by rising warm air, and warm air is discharged from the upper openings of the side cover (LF) 21 and the side cover (RF) 23 at the upper part of the external flow path R2. At this time, external cold air is sucked from the lower openings of the side cover (LF) 21 and the side cover (RF) 23 at the lower part, and further from the fins of the side radiator (LF) 12 and the side radiator (RF) 14. Convection that takes heat away.

In addition, since the surface area inside a fin can be taken large by providing a concave groove part inside the fin of each of the side surface radiator (LF) 12 and the side surface radiator (RF) 14, heat from the internal flow path R1 to the fin Transmission can be performed efficiently and the thickness of the fin itself can be reduced, so that heat conduction in the fin can be performed efficiently. As a result, the efficiency of heat exchange from the internal channel R1 to the external channel R2 is improved. To do.
Further, heat conduction to the inner flow path inner wall (LF) 16 and the inner flow path inner wall (RF) 18 for forming the internal flow path R1 between the side heat radiator (LF) 12 and the side heat radiator (RF) 14. By using a heat insulating material having a low rate (resin such as plastic), the inside of the electronic device 1 is not heated again by heat transfer to the inner flow path inner wall (LF) 16 and the inner flow path inner wall (RF) 18 due to warm air. It is possible to reliably transfer heat from the internal flow path R1 to the fins that are the flow path outer walls. By repeating the internal circulation of the wind described above, the heat generated from the inside of the device can be efficiently led to the outside, and the inside of the electronic device 1 can be efficiently cooled.

  Further, by providing a partition plate (F) 33 for partitioning the space in the vertical direction and disposing the fan (F) 31 on the partition plate (F) 33, a short path of air blown by the fan (F) 31 is eliminated and cooling efficiency is improved. I can give you. This arrangement is not limited by the size of the fan, and it is easy to increase the size of the fan. The flow rate obtained by rotating a large fan at low speed has the same effect as rotating a small fan at high speed. For this reason, since the rotation of the fan can be reduced, the noise caused by the rotation of the fan can be reduced. Further, the inside and the outside of the flow path are completely separated, and there is no flow of air from the inside to the outside and from the outside to the inside, and a complete internal sealed structure can be obtained. The electronic apparatus 1 having a sealed structure can reduce noise discomfort caused by the fan without leakage of sound generated from the fan.

  As described above, according to the present invention, there are no external air inlets and external air outlets that cause noise, and heat from the internal heat source components is efficiently removed and discharged to the outside by the radiator and the cover disposed on the side of the housing. can do.

  Note that the present invention is not limited to the above-described embodiments as they are, and can be embodied by modifying constituent elements without departing from the scope of the invention in the implementation stage. Moreover, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above embodiments. For example, some components may be deleted from all the components shown in each embodiment. Furthermore, you may combine suitably the component covering different embodiment.

1: Electronic device, 11: Chassis, 12: Side radiator (LF), 12a: Internal channel inlet (LF), 12b: Internal channel exhaust (LF), 13: Side radiator (LB), 13a : Internal flow path inlet (LB), 13b: Internal flow path exhaust (LB), 14: Side radiator (RF), 14a: Internal flow path intake (RF), 14b: Internal flow path exhaust (RF) ), 15: side radiator (RB), 15a: internal flow inlet (RB), 15b: internal flow exhaust (RB), 16: internal flow wall (LF), 17: internal flow wall ( LB), 18: inner channel inner wall (RF), 19: inner channel inner wall (RB), 21: side cover (LF), 22: side cover (LB), 23: side cover (RF), 24: side Cover (RB), 31: Fan (F), 32: Fan (B), 33: Partition plate (F), 4: partition plate (B), 35: partition plate (M), 36: heat source component (F), 37: heat source component (B), 100: camera body, 101: air cooling fan, 102: heat source component, R1: inside Channel, R2: External channel.

Claims (4)

A sealed electronic device in which a heat source component is mounted therein, air from a fan disposed below the heat source component is applied to the heat source component, and air heated by the heat source component is circulated in the housing for cooling. In
The left and right side surfaces of the housing are composed of a radiator having a plurality of fins arranged in the vertical direction and having a concave groove inside, and a cover that covers the fins of the radiator.
Air blown from the fan causes air heated by the heat source component to flow in the concave groove portion of the fin of the radiator, and heat is transferred to the fin to dissipate heat into the outside air. The electronic device is cooled by air flowing through an external flow path formed between the cover and the fin and having an upper and lower opening formed between the cover and the fin. The electronic device according to claim 1, further comprising an inner wall plate attached so as to close an intermediate portion of the concave groove portion.
The inner wall plate forms an internal flow path having a suction port at the upper part of the concave groove part and a discharge port at the lower part of the concave groove part, so that the air heated by the heat source component enters the internal flow path. An electronic device that flows in and efficiently transfers heat to the fins. The electronic device according to claim 1 or 2, further comprising: a partition plate that is disposed in an intermediate portion in the housing and partitions the space in the housing in the vertical direction.
An electronic apparatus, wherein the fan is attached to the partition plate, and air from the fan flows from a lower space toward an upper space. 4. The electronic device according to claim 2, wherein the inner wall plate is formed of a heat insulating material.