JP2014158148A - Breaking-off method for element and breaking-off device for element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a breaking-off method and a breaking-off device for element capable of breaking off a plurality of elements formed in a wafer simultaneously without degrading the characteristics.SOLUTION: In a breaking-off method and a breaking-off device for element, a wafer 20 is arranged between a wafer mounting section having a first aperture 72, and a wafer pressing section having a second aperture 62 the length of which along the long side of an element 12 is shorter than that of the first aperture 72 of the wafer mounting section, and the element is broken off from the wafer by reducing the atmospheric pressure against the wafer 20 lower on the wafer mounting section side than on the wafer pressing side.

Description

  The present invention relates to an element folding method and an element folding apparatus.

Conventionally, as a method of manufacturing a semiconductor element (IC) or a piezoelectric vibration element, a plurality of elements are formed on a substrate generally called a wafer by a photolithography technique, and wiring, electrodes, etc. are formed in the form of this substrate. There is known a method of obtaining a single element by forming each element from a substrate by dicing or breaking after formation. In particular, the method of dividing into pieces by folding is not widely required as a method of manufacturing at low cost without requiring a special device or process.
However, along with recent demands for smaller and thinner devices using the aforementioned elements, there has been a problem that the elements have been reduced in size, and manual folding has increased man-hours and cost reduction cannot be achieved. .
For this reason, in Patent Document 1, there are folding pins opposed to a plurality of elements formed on the wafer, the folding pins are pressed against the elements, and the plurality of elements are simultaneously folded from the wafer. An element folding method and an element folding apparatus that can improve the working efficiency by making the element easy to use in subsequent work processes are disclosed.

JP 2007-135132 A

  However, since the element is broken from the wafer by directly pressing the folding pin against the element, there is a problem that the electrode formed on the element is damaged and the characteristics of the element deteriorate.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 An element folding method according to this application example includes a wafer supporting an element, a wafer mounting part having a first opening, and the first of the wafer mounting part. Preparing a device folding device including a wafer pressing portion having a second opening portion having a shorter length along the long side direction of the device than the opening portion of the wafer, and mounting the wafer The device is positioned inside the outer edge of the first opening of the wafer mounting unit in the plan view of the mounting unit, the wafer, and the wafer pressing unit, and the first of the wafer mounting unit Laminating and arranging the wafer mounting portion, the wafer and the wafer pressing portion at a position where the center of the opening of the wafer and the second opening of the wafer pressing portion is shifted, and the element On the other hand, the wafer is more than the wafer holding part side. The pressure of the mounting portion side and lower, characterized in that it comprises the steps of break off the device from the wafer.

  According to this application example, the length along the long side direction of the element of the first opening portion of the wafer mounting portion is longer than the length along the long side direction of the element of the second opening portion of the wafer holding portion. With this configuration, when the wafer is sucked from the wafer mounting portion side, the pressure on the wafer mounting portion side can be further lowered, so that the element can be easily broken off. Further, the first opening portion of the wafer mounting portion and the second opening portion of the wafer holding portion are arranged so as to be shifted from each other, and in particular, the opening portion of the wafer holding portion is a support portion for the wafer of the element. By disposing it so as to shift to the tip side on the opposite side, when sucked from the wafer mounting part side, the pressure at the tip part of the element becomes lower and the amount of displacement to the wafer mounting part side becomes larger. There is an effect that can be more easily broken.

  Application Example 2 In the element folding method according to the application example described above, in the folding step, the element is sucked from the wafer mounting portion side to break the element.

  According to this application example, since the element is displaced to the wafer mounting part side by sucking from the wafer mounting part side and lowering the atmospheric pressure, the stress is concentrated on the supporting part with the wafer. There is an effect that it is easy to do.

  [Application Example 3] In the element folding method according to the application example described above, the second of the wafer pressing unit in a plan view in a direction in which the wafer mounting unit, the wafer, and the wafer pressing unit are stacked. The opening is arranged on the end side of the element opposite to the support portion between the element and the wafer.

  According to this application example, the wafer is sucked from the wafer mounting portion side by disposing the second opening of the wafer pressing portion on the end portion side of the element opposite to the support portion between the element and the wafer. In this case, since the tip of the element has a lower atmospheric pressure and a larger displacement, the element can be more easily folded.

  Application Example 4 In the element folding method according to the application example described above, the length of the second opening of the wafer pressing unit along the long side direction of the element is the length of the wafer mounting unit. The first opening is in the range of ½ or more and 3/4 or less of the length along the long side direction of the element.

  According to this application example, the length along the long side direction of the element of the second opening portion of the wafer holding portion is set to the length along the long side direction of the element of the first opening portion of the wafer mounting portion. If it is smaller than 1/2, the area of the second opening of the wafer holding part is small, so that when the air is sucked from the wafer mounting part side, the pressure difference between the wafer holding part side and the wafer mounting part side becomes small. The suction force is reduced, making it difficult to break. In addition, when the length of the second opening of the wafer pressing portion is larger than 3/4, the second opening of the wafer pressing portion is longer than the tip of the element, and is an opening portion from the tip of the element. Therefore, the air that flows out from the wafer holding part side to the wafer mounting part side increases, and the pressure difference between the wafer holding part side and the wafer mounting part side is reduced, so that the element suction force is reduced and the element is removed. It becomes difficult. Therefore, the length of the second opening of the wafer holding unit is set within a range of 1/2 or more and 3/4 or less of the length of the first opening of the wafer mounting unit, so that the element can be folded. Since the factor which becomes difficult can be reduced, there is an effect that the element can be easily broken.

  Application Example 5 In the element folding method according to the application example described above, the wafer pressing portion has a protrusion, and in the arranging step, the planar view in a direction in which the wafer and the wafer pressing portion are stacked. The protrusions are arranged so as to overlap the elements.

  According to this application example, the wafer pressing portion is arranged so that the protruding portion overlaps with the element, so that when the wafer is pressed, the protruding portion pushes the element toward the wafer mounting portion, so that it becomes easier to break. There is.

  Application Example 6 In the device folding method according to the application example described above, the length of the second opening of the wafer pressing portion along the long side direction of the device is the length of the wafer mounting portion. The first opening is in the range of 1/8 to 1/2 of the length along the long side direction of the element.

  According to this application example, the length along the long side direction of the element of the second opening portion of the wafer pressing portion is set to the length along the long side direction of the element of the first opening portion of the wafer mounting portion. Breaking down due to a decrease in suction force caused by a decrease in the pressure difference between the wafer holding part side and the wafer mounting part side that occurs when the value is within the range of 1/8 to 1/2. The risk of difficulty can be reduced. On the other hand, when the ratio is larger than ½, the second opening of the wafer pressing portion is longer than the end portion of the element, and the open portion with the end portion of the element is widened, so that from the wafer pressing portion side to the wafer mounting portion side. The amount of air that flows out increases, the pressure difference between the wafer pressing portion side and the wafer mounting portion side decreases, and the suction force of the element decreases, so that there is an effect that the possibility of difficulty in folding can be reduced.

  Application Example 7 In the element folding method according to the application example described above, the height of the protrusion is in the range of 0.03 mm to 0.18 mm.

  According to this application example, when the height of the protrusion is in the range of 0.03 mm or more and 0.18 mm or less, the amount of displacement that pushes in the element that occurs when the height is lower than 0.03 mm becomes small, and it is difficult to break off. If it is higher than 0.18 mm, it is easier to bend off, but there is an effect that it is possible to reduce the risk of scratching the element and causing deterioration of characteristics.

  Application Example 8 In the element folding method according to the application example described above, the wafer mounting portion side includes a suction port, and the wafer mounting portion side suction port includes the wafer mounting portion and the wafer mounting portion side. It is inside the outer edge of the element in a plan view in a direction in which the wafer is laminated.

  According to this application example, since the suction port on the wafer mounting part side is inside the outer edge of the element, when the suction is performed from the wafer mounting part side, the center part of the element can be sucked. There is an effect that it is possible to make it easier to break off.

  Application Example 9 An element folding apparatus according to this application example includes a wafer mounting unit for mounting a wafer having a first opening and supporting an element, and the wafer mounting unit. A wafer pressing portion having a second opening portion having a shorter length along the long side direction of the element than the first opening portion and fixing the wafer so as to sandwich the wafer together with the wafer mounting portion; And a suction means for sucking the element on the wafer mounting portion side.

  According to the element folding apparatus of this application example, the wafer mounting unit for mounting the wafer having the first opening and supporting the element, and the first opening of the wafer mounting unit A wafer holding portion for fixing the wafer so as to sandwich the wafer together with the wafer placement portion, and a wafer on the wafer placement portion side. By using the suction device for sucking, there is an effect that a plurality of elements can be collectively broken from the wafer without damaging the elements.

  Application Example 10 In the element folding apparatus according to the application example described above, the length of the second opening of the wafer pressing unit along the long side direction of the element is the first of the wafer mounting unit. One opening is in a range of ½ or more and 3/4 or less of the length along the long side direction of the element.

  According to the element folding apparatus of this application example, the length along the long side direction of the element of the second opening portion of the wafer holding portion is set in the long side direction of the element of the first opening portion of the wafer mounting portion. If the length is smaller than ½ of the length, the area of the second opening of the wafer holding part is small, so when sucked from the wafer mounting part side, the pressure difference between the wafer holding part side and the wafer mounting part side Becomes smaller, the force for attracting the element is reduced, and it becomes difficult to break off. In addition, when the length of the second opening of the wafer pressing portion is longer than 3/4, the second opening of the wafer pressing portion is longer than the end of the element, and is an open portion from the end of the element. Therefore, the air that flows out from the wafer holding part side to the wafer mounting part side increases, and the pressure difference between the wafer holding part side and the wafer mounting part side is reduced, so that the element suction force is reduced and the element is removed. It becomes difficult. Therefore, the length along the long side direction of the element of the second opening portion of the wafer holding portion is not less than ½ of the length along the long side direction of the element of the first opening portion of the wafer mounting portion. By making it within the range of / 4 or less, it is possible to reduce the factor that makes it difficult for the element to be broken, so that there is an effect that the element can be easily broken.

  Application Example 11 In the element folding apparatus according to the application example described above, the wafer pressing portion has a protrusion.

  According to the element folding apparatus of this application example, the protrusion is provided on the wafer holding portion, and the protrusion is arranged so as to overlap the element. Since it pushes in to the side, there exists an effect that it becomes easy to break.

  Application Example 12 In the element folding apparatus according to the application example described above, the length of the second opening of the wafer pressing unit along the long side direction of the element is the first of the wafer mounting unit. One opening is within a range of 1/8 to 1/2 of the length along the long side direction of the element.

  According to the element folding apparatus of this application example, the length along the long side direction of the element of the second opening portion of the wafer pressing portion is set along the long side direction of the element of the first opening portion of the wafer mounting portion. The suction force generated by reducing the pressure difference between the wafer pressing portion side and the wafer mounting portion side that occurs when the length is shorter than 1/8 by setting it within the range of 1/8 to 1/2 of the length. It is possible to reduce the possibility that it will be difficult to break off due to the lowering of. When the length is longer than ½, the second opening of the wafer pressing portion is longer than the tip of the element and the open portion with respect to the tip of the element is widened, so that the wafer holding portion side is shifted to the wafer mounting portion side. The amount of air that flows out increases, the pressure difference between the wafer pressing portion side and the wafer mounting portion side decreases, and the suction force of the element decreases, so that there is an effect that the possibility of difficulty in folding can be reduced.

  Application Example 13 In the element folding apparatus according to the application example described above, the height of the protrusion is in the range of 0.03 mm to 0.18 mm.

  According to the element folding apparatus of this application example, by setting the height of the protrusion provided on the wafer pressing portion within a range of 0.03 mm or more and 0.18 mm or less, an element generated when the height is lower than 0.03 mm is obtained. The possibility that it will be difficult to break by reducing the amount of displacement is reduced, and if it is higher than 0.18 mm, it will be easier to break, but the risk of damage to the element and deterioration of characteristics can be reduced. effective.

  Application Example 14 In the element folding apparatus according to the application example described above, a suction port is provided on the wafer mounting unit side, and the suction port on the wafer mounting unit side includes the wafer mounting unit and the wafer mounting unit. It is characterized by being inside the outer edge of the element in a plan view in the direction in which the wafer is laminated.

  According to the element folding apparatus of this application example, the suction port on the wafer mounting part side is inside the outer edge of the element, so that when the suction is performed from the wafer mounting part side, the central part of the element can be sucked. Therefore, there is an effect that the suction force is increased and it can be easily broken.

It is the schematic of the vibrator | oscillator which mounts the element broken by the element folding apparatus which concerns on the 1st Embodiment of this invention, (a) is a top view, (b) is AA sectional view. It is the schematic of the wafer in which the element concerning the 1st Embodiment of this invention was formed in multiple numbers, (a) is a top view, (b) is an enlarged view of the support part of an element and a flame | frame. 1 is a schematic perspective view showing an element breaker according to a first embodiment of the present invention. It is the expansion schematic of the element folding part of the element folding apparatus which concerns on the 1st Embodiment of this invention, (a) is a top view, (b) is a BB sectional drawing. It is the expansion schematic of the element folding part of the element folding apparatus which concerns on the 1st Embodiment of this invention, (a) is a top view, (b) is CC sectional view taken on the line. It is the expansion schematic of the element folding part of the element folding apparatus which concerns on the 2nd Embodiment of this invention, (a) is a top view, (b) is DD sectional view taken on the line. The schematic perspective view which shows the element folding apparatus based on the 3rd Embodiment of this invention. The schematic perspective view which shows the element folding apparatus which concerns on the 4th Embodiment of this invention. The expanded sectional view of the element folding part of the element folding apparatus which concerns on the 4th Embodiment of this invention. The schematic perspective view which shows the element folding apparatus which concerns on the 5th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a schematic view of a vibrator on which an element is mounted after being folded using an element folding apparatus according to each embodiment of the present invention. FIG. 1 (a) is a plan view and FIG. 1 (b). FIG. 2 is a cross-sectional view taken along line AA in FIG. In FIG. 1A, for convenience of explaining the internal configuration of the vibrator 10, a state where the lid 32 is removed is shown.

A vibrator 10 shown in FIG. 1 includes an element 12 folded by an element folding apparatus according to each embodiment of the present invention, a base 30 on which the element 12 is mounted, and a lid 32 for hermetically sealing the element 12. And including.
The base 30 and the lid 32 are joined by a joining member 40 such as low-melting glass in order to hermetically seal the cavity portion in which the element 12 is mounted.

  The element 12 has a substantially rectangular shape with the X-axis direction as the long side direction, and an excitation electrode 14, a lead electrode 16, and a pad electrode 18 are formed on the front and back of the main surface. The excitation electrode 14 is disposed substantially at the center of the element 12, and the pad electrode 18 is disposed at the end of the element 12. The excitation electrode 14 and the pad electrode 18 are electrically connected by the lead electrode 16. Further, the pad electrode 18 is bonded to the connection electrode 34 provided in the cavity of the base 30 by a bonding member 42 such as a bump made of metal or solder or a conductive adhesive, for example. The connection electrode 34 is electrically connected to the external terminal 36 through a through electrode (not shown) provided inside the base 30.

  2 is a schematic view of a wafer 20 on which a plurality of elements 12 used in the vibrator 10 of FIG. 1 are formed. FIG. 2A is a plan view of the wafer 20, and FIG. 2B is a plan view of FIG. 2) is an enlarged view of a support portion between the element 12 and the frame portion 22. The excitation electrode 14, the lead electrode 16, and the pad electrode 18 of the element 12 are not shown.

  As shown in FIG. 2A, the wafer 20 has a plurality of elements 12 arranged in a matrix. Further, as shown in FIG. 2B, the wafer 20 has a frame portion 22, and the element 12 is supported on the frame portion 22 via a support portion 24. The support portion 24 has a constricted portion 26 for facilitating the folding of the device 12 on the side where the device 12 is connected. can do. The length along the long side direction of the element is a direction connecting the support portion 24 and a free end portion on the opposite side of the support portion 24, that is, a length in the X-axis direction. Further, in this embodiment, one element 12 is supported by the two support portions 24, but any number of support portions 24 may be used as long as the number is one or more.

<First Embodiment>
FIG. 3 is a schematic perspective view showing the element breaker according to the first embodiment of the present invention. FIG. 4 is an enlarged schematic view of the element folding part of the element folding apparatus according to the first embodiment of the present invention, FIG. 4 (a) is a plan view, and FIG. 4 (b) is FIG. It is BB sectional drawing of a).
Hereinafter, the element folding apparatus 50 for breaking the plurality of elements 12 from the wafer 20 and the element folding method using the element folding apparatus 50 will be described.

  As shown in FIG. 3, the element breaker 50 according to the first embodiment of the present invention includes a wafer mounting mask 70 having a wafer mounting portion and a wafer pressing portion having a wafer pressing portion for fixing the wafer 20 so as to be pressed. A mask 60 and suction means for sucking the elements 12 formed on the wafer 20 from the wafer mounting mask 70 side are provided. The suction means drives a vacuum generator (not shown) connected to a vent pipe 112 provided in the suction box 110 from a suction port of the suction plate 100 installed at the upper part of the suction box 110, and is mounted on the wafer. The air pressure on the mask 70 side is lowered.

  Further, as shown in FIG. 4, the second opening 62 provided in the wafer holding mask 60, the first opening 72 provided in the wafer mounting mask 70, and the accommodation provided in the element accommodation tray 80. The part 82 is formed at a position facing each of the plurality of elements 12 formed on the wafer 20. Further, a suction hole 84 that is a suction port provided in the storage portion 82 of the element storage tray 80 and a suction hole 102 that is a suction port provided in the suction plate 100 are formed in the plurality of elements 12 formed on the wafer 20. They are formed at positions facing each other and inside the outer edge of the element 12.

  In the element folding method according to the first embodiment of the present invention, first, an element folding apparatus 50 including a wafer 20 supporting a plurality of elements 12, a wafer mounting mask 70, and a wafer pressing mask 60. Prepare. Next, the element storage tray 80 is disposed on a base plate 90 having positioning pins (not shown) and magnets (not shown) for holding the mask. Thereafter, the wafer mounting mask 70, the wafer 20, and the wafer holding mask 60 are stacked on the element storage tray 80 in this order. Here, the positions of the first opening 72, the second opening 62, the accommodating portion 82, and the suction hole 84 are the positioning holes provided in the wafer holding mask 60, the wafer mounting mask 70, and the element accommodating tray 80. By inserting (not shown) into positioning pins provided on the base plate 90, it is possible to adjust the positions to be opposed to the plurality of elements 12 formed on the wafer 20. Therefore, the second opening 62 of the wafer pressing mask 60, the element 12, and the first of the wafer mounting mask 70 are viewed in a plan view in the direction in which the wafer pressing mask 60, the wafer 20, and the wafer mounting mask 70 are stacked. It arrange | positions so that it may overlap with the opening part 72 of this.

  Next, the base plate 90 on which the wafer 20 is arranged is installed so as to overlap the suction plate 100 installed on the upper part of the suction box 110. Here, the suction holes 84 provided in the element storage tray 80 and the suction holes 102 provided in the suction plate 100 are arranged so as to overlap each other. Next, by driving a vacuum generator such as a vacuum pump connected to a vent pipe 112 provided in the suction box 110 to suck the element 12, the pressure on the first opening 72 side of the wafer mounting mask 70 is lowered. Then, the element 12 is bent and bent toward the wafer mounting mask 70 side. Therefore, the plurality of elements 12 supported by the frame portion 22 of the wafer 20 can be folded together. Thereafter, the elements 12 singulated and accommodated in the accommodating portion 82 of the element accommodating tray 80 are moved to a package mounting process which is the next process.

Next, the positional relationship between the second opening 62 of the wafer pressing mask 60 and the first opening 72 of the wafer mounting mask 70 will be described.
FIG. 5 is an enlarged schematic view of an element folding part of the element folding apparatus according to the first embodiment of the present invention, FIG. 5 (a) is a plan view, and FIG. 5 (b) is FIG. 5 (a). It is a CC sectional view taken on the line. Here, the length L1 along the long side direction of the element of the first opening 72 and the length L2 along the long side direction of the element of the second opening 62 are the length LX of the element 12 and Similarly, it is the length in the X-axis direction.

  As shown in FIG. 5, the length L1 (length in the X-axis direction) of the first opening 72 of the wafer mounting mask 70 is longer than the length LX (length in the X-axis direction) of the element 12. This is to ensure that the broken element 12 is surely contained in the accommodating portion 82 of the element accommodating tray 80. Further, the length L2 (length in the X-axis direction) of the second opening 62 of the wafer pressing mask 60 is shorter than the length LX of the element 12, and the length of the first opening 72 of the wafer mounting mask 70. It is within the range of 1/2 or more and 3/4 or less of L1.

  This is because, when the length L2 of the second opening 62 of the wafer pressing mask 60 is shorter than ½, the area of the second opening 62 of the wafer pressing mask 60 is small, and therefore the wafer mounting mask 70 side. , The pressure difference between the wafer holding mask 60 side and the wafer mounting mask 70 side is reduced, and the force for sucking the element 12 is reduced. When the length L2 of the second opening 62 of the wafer pressing mask 60 is longer than 3/4, the second opening 62 of the wafer pressing mask 60 is longer than the end of the element 12, and the element 12 The open part with the end of the spreads. Therefore, the air flowing out from the wafer pressing mask 60 side to the wafer mounting mask 70 side increases, and the pressure difference between the wafer pressing mask 60 side and the wafer mounting mask 70 side is reduced, so that the force for sucking the element 12 is reduced. And it becomes difficult to break.

  Therefore, the length L2 (the length in the X-axis direction) of the second opening 62 of the wafer pressing mask 60 is shorter than the length LX of the element 12, and the length of the first opening 72 of the wafer mounting mask 70. By setting it within the range of 1/2 or more and 3/4 or less of L1, the possibility that the element 12 that is caused by the difference in atmospheric pressure between the wafer pressing mask 60 side and the wafer mounting mask 70 side becomes difficult to break down is reduced. be able to.

  Further, the center line C2 of the length L2 of the second opening 62 of the wafer holding mask 60 is connected to the element 12 from the center line C1 of the length L1 of the first opening 72 of the wafer mounting mask 70. The elements 12 are provided so as to be shifted in the end direction (−X axis direction) of the element 12 on the side opposite to the frame part 22. This is because the second opening 62 of the wafer pressing mask 60 is located on the end side of the element 12, so that the suction force generated by the suction from the wafer mounting mask 70 side is concentrated on the end of the element 12. This is because the amount of displacement of the end portion is increased to facilitate breakage.

  With the element folding method and the element folding apparatus 50 according to the first embodiment, the elements 12 are sucked from the wafer mounting mask 70 side, whereby the plurality of elements 12 are collectively broken from the wafer 20. Therefore, there is an effect that it is possible to reduce characteristic deterioration due to damage to the element 12 by the conventional method.

<Second Embodiment>
FIG. 6 is an enlarged schematic view of an element folding part of an element folding apparatus according to a second embodiment of the present invention, FIG. 6 (a) is a plan view, and FIG. 6 (b) is FIG. 6 (a). It is the DD sectional view taken on the line.
Hereinafter, the second embodiment will be described with a focus on differences from the first embodiment described above, and description of similar matters will be omitted.

  As shown in FIG. 6, the wafer pressing mask 60 a according to the second embodiment is provided with a protrusion 64 on the side where the element 12 is arranged, as compared with the wafer pressing mask 60 according to the first embodiment. Is different. The protrusion 64 of the wafer holding mask 60a is disposed so as to overlap the element 12, and the height H1 (the length in the Y′-axis direction) of the protrusion 64 is in the range of 0.03 mm to 0.18 mm. The length L3 (length in the X-axis direction) of the opening of the wafer holding mask 60a is within a range of 1/8 or more and 1/2 or less with respect to the length L1 of the first opening 72 of the wafer mounting mask 70. It is. Further, the center line C3 of the length L3 of the second opening 62a of the wafer holding mask 60a is connected to the element 12 from the center line C1 of the length L1 of the first opening 72 of the wafer mounting mask 70. The elements 12 are provided so as to be shifted in the end direction (−X axis direction) of the element 12 on the side opposite to the frame part 22.

  The protrusion 64 of the wafer pressing mask 60a is provided on the side in contact with the element 12 and is disposed so as to overlap the element 12, so that when the wafer 20 is pressed, the protrusion 64 causes the element 12 to hold the element 12 on the wafer mounting mask 70. Since it pushes in to the side, there exists an effect that it becomes easy to break. Further, by setting the height H1 of the protrusion 64 within the range of 0.03 mm or more and 0.18 mm or less, the amount of displacement that pushes in the element 12 that occurs when the height is lower than 0.03 mm may be reduced, making it difficult to break off. If the height is higher than 0.18 mm, it is easier to bend, but there is an effect that it is possible to reduce the risk of scratching the element 12 and causing deterioration of characteristics.

  Further, the length L3 of the second opening 62a of the wafer holding mask 60a is set within a range of 1/8 to 1/2 of the length L1 of the first opening 72 of the wafer mounting mask 70. When the distance is shorter than 1/8, it is possible to reduce the possibility of difficulty in folding due to a decrease in suction force caused by a decrease in the pressure difference between the wafer holding mask 60a side and the wafer mounting mask 70 side. When the length is longer than ½, the second opening 62a of the wafer pressing mask 60 is longer than the tip of the element 12, and the opening with the tip of the element 12 is widened. Air flowing out to the wafer mounting mask 70 side increases, the pressure difference between the wafer holding mask 60a side and the wafer mounting mask 70 side decreases, and the force for sucking the element 12 decreases, thereby reducing the possibility of difficulty in folding. There is an effect that can be done.

  Further, the center line C3 having the length L3 of the second opening 62a is shifted from the center line C1 having the length L1 of the first opening 72 in the end direction (−X axis direction) of the element 12. As a result, the end portion of the element 12 in a direction not connected to the frame portion 22 can be sucked, so that an effect of increasing stress due to suction and facilitating the folding.

<Third Embodiment>
FIG. 7 is a schematic diagram showing an element folding method and element folding apparatus according to the third embodiment of the present invention.
Hereinafter, along with the description of the element folding apparatus 50a, a folding method using the element folding apparatus 50a will be described.
In addition, the third embodiment will be described with a focus on differences from the first embodiment described above, and description of similar matters will be omitted.

  As shown in FIG. 7, the element folding apparatus 50a according to the third embodiment is different from the element folding apparatus 50 according to the first embodiment in that an assist roller 120 is provided. . When the element 12 is sucked from the suction hole 102 provided in the suction plate 100 by the assist roller 120, the element 12 that cannot be broken only by suction can be folded by rolling on the wafer pressing mask 60. There is an effect that can be done.

<Fourth Embodiment>
FIG. 8 is a schematic view showing an element folding method and element folding apparatus according to the fourth embodiment of the present invention. FIG. 9 is an enlarged cross-sectional view of an element folding part of an element folding apparatus according to the fourth embodiment of the present invention.
Hereinafter, along with the description of the element folding device 50b, a folding method using the element folding device 50b will be described.
Further, the fourth embodiment will be described with a focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.

  As shown in FIG. 8, the element folding apparatus 50b according to the fourth embodiment is different from the element folding apparatus 50 according to the first embodiment in that an assist mask 130 is provided. . As shown in FIG. 9, the assist mask 130 has a protrusion 134 and an opening 132 having a size that can be accommodated in the second opening 62 of the wafer pressing mask 60. The height H2 (the length in the Y′-axis direction) of the protrusion 134 of the assist mask 130 is a height obtained by adding a range of 0.03 mm to 0.18 mm to the plate thickness of the wafer pressing mask 60. The length L4 (length in the X-axis direction) of the opening of the assist mask 130 is within a range of 1/8 to 1/2 of the length L1 of the first opening 72 of the wafer mounting mask 70. is there. The center line C4 of the opening portion L4 of the assist mask 130 is opposite to the frame portion 22 connected to the element 12 than the center line C1 of the length L1 of the first opening portion 72 of the wafer mounting mask 70. The element 12 is shifted in the end direction (−X axis direction) of the element 12 on the side.

  By setting the height H2 of the protrusion 134 of the assist mask 130 to a height obtained by adding a thickness of 0.03 mm to 0.18 mm to the plate thickness T1 (the length in the Y′-axis direction) of the wafer pressing mask 60, Since the protrusion 134 can push the element 12 toward the wafer mounting mask 70 in a state where the wafer 20 is held by the wafer holding mask 60, the element 12 can be more reliably folded.

  Even if the element 12 remains unremoved from the wafer 20 by sucking the element 12 by the element folding method and the element folding apparatus 50b according to the fourth embodiment, the assist mask Since the element 12 can be pushed in by the protrusions 134 of 130, there is an effect that the element 12 can be reliably broken.

<Fifth Embodiment>
FIG. 10 is a schematic view showing an element folding method and element folding apparatus according to the fifth embodiment of the present invention.
Hereinafter, along with the description of the element folding apparatus 50c, a folding method using the element folding apparatus 50c will be described.
Further, the fifth embodiment will be described focusing on the differences from the above-described fourth embodiment, and description of similar matters will be omitted.

  As shown in FIG. 10, the element folding device 50c according to the fifth embodiment is different from the element folding device 50b according to the fourth embodiment in that an assist roller 120 is provided. . When the element 12 is sucked from the suction hole 102 provided in the suction plate 100 by the assist roller 120, the element 12 that cannot be broken only by suction can be folded by rolling the assist mask 130. There is an effect.

  DESCRIPTION OF SYMBOLS 10 ... Vibrator, 12 ... Element, 14 ... Excitation electrode, 16 ... Lead electrode, 18 ... Pad electrode, 20 ... Wafer, 22 ... Frame part, 24 ... Support part, 26 ... Constriction part, 30 ... Base, 32 ... Lid , 34 ... connection electrode, 36 ... external terminal, 40 ... bonding member, 42 ... bonding member, 50 ... element breaker, 60 ... wafer pressing mask, 62 ... second opening, 64 ... projection, 70 ... wafer Mounting mask, 72 ... first opening, 80 ... element receiving tray, 82 ... receiving portion, 84 ... suction hole, 90 ... base plate, 100 ... suction plate, 102 ... suction hole, 110 ... suction box, 112 ... venting pipe , 120 ... assist roller, 130 ... assist mask, 132 ... opening, 134 ... projection.

Claims (14)

A wafer supporting the element, a wafer mounting portion having a first opening, and a length along the long side direction of the element from the first opening of the wafer mounting portion. A step of preparing an element folding device including a wafer pressing portion having a short second opening;
The wafer mounting portion, the wafer, and the wafer pressing portion are viewed in plan, the element is located inside the outer edge of the first opening of the wafer mounting portion, and the wafer mounting portion Laminating and arranging the wafer mounting portion, the wafer, and the wafer pressing portion at a position where the center of the first opening and the second opening of the wafer pressing portion is deviated,
Lowering the pressure on the wafer mounting part side relative to the wafer holding part side with respect to the element, and folding the element from the wafer;
An element folding method comprising:   The element folding method according to claim 1, wherein in the folding step, the element is sucked from the wafer mounting portion side to break the element.   In the plan view in the direction in which the wafer mounting portion, the wafer, and the wafer pressing portion are stacked, the second opening of the wafer pressing portion is opposite to the support portion between the element and the wafer. 3. The element folding method according to claim 1, wherein the element is folded on an end side of the element.   The length of the second opening of the wafer holding part along the long side direction of the element is the length of the first opening of the wafer mounting part along the long side direction of the element. 4. The element folding method according to claim 1, wherein the element folding method is within a range of ½ or more and 3/4 or less. 5.   The wafer pressing portion has a protrusion, and in the arranging step, the wafer pressing portion is arranged so that the protrusion overlaps the element in a plan view in a direction in which the wafer and the wafer pressing portion are stacked. The element folding method according to any one of claims 1 to 3.   The length of the second opening of the wafer holding part along the long side direction of the element is the length of the first opening of the wafer mounting part along the long side direction of the element. The element folding method according to claim 5, wherein the element folding range is within a range from 1/8 to 1/2.   6. The element folding method according to claim 5, wherein the height of the protrusion is in a range of 0.03 mm to 0.18 mm.   There is a suction port on the wafer mounting part side, and the suction port on the wafer mounting part side is inside the outer edge of the element in a plan view in a direction in which the wafer mounting part and the wafer are stacked. The element folding method according to claim 2, wherein the element is folded. A wafer mounting portion for mounting a wafer having a first opening and supporting the element;
The wafer mounting portion has a second opening portion whose length along the long side direction of the element is shorter than that of the first opening portion, and is fixed so as to sandwich the wafer together with the wafer mounting portion. A wafer holding part for
A suction means for sucking the element toward the wafer mounting portion;
An element folding device comprising:   The length of the second opening of the wafer holding part along the long side direction of the element is the length of the first opening of the wafer mounting part along the long side direction of the element. The element folding apparatus according to claim 9, wherein the element folding apparatus is in a range of ½ or more and 3/4 or less.   The device folding device according to claim 9, wherein the wafer pressing portion has a protrusion.   The length of the second opening of the wafer holding part along the long side direction of the element is the length of the first opening of the wafer mounting part along the long side direction of the element. The element folding apparatus according to claim 11, wherein the element folding apparatus is in a range from 1/8 to 1/2.   13. The element folding device according to claim 11, wherein a height of the protrusion is in a range of 0.03 mm or more and 0.18 mm or less.   There is a suction port on the wafer mounting part side, and the suction port on the wafer mounting part side is inside the outer edge of the element in a plan view in a direction in which the wafer mounting part and the wafer are stacked. The element folding device according to claim 9, wherein the device folding device is provided.

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