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JP2014151599A - Woody board - Google Patents

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JP2014151599A
JP2014151599A JP2013024943A JP2013024943A JP2014151599A JP 2014151599 A JP2014151599 A JP 2014151599A JP 2013024943 A JP2013024943 A JP 2013024943A JP 2013024943 A JP2013024943 A JP 2013024943A JP 2014151599 A JP2014151599 A JP 2014151599A
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wood
board
bamboo
fiber
bamboo fiber
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Seishi Morita
清史 守田
Teppei Asada
鉄平 朝田
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Panasonic Corp
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Panasonic Corp
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Abstract

PROBLEM TO BE SOLVED: To provide, by targeting a woody board using woody chips or woody fibers, a woody board having a high dimensional stability by inhibiting dimensional variations accompanying humidity absorption and release.SOLUTION: The provided woody board molded by adhering woody chips or woody fibers via an adhesive includes soft cell-removed bamboo fibers 12 obtained by removing soft cells from bamboo fibers 11 provided by pulverizing a bamboo 10.

Description

本発明は、木質ボードに関する。   The present invention relates to a wooden board.

従来、住宅等に用いられる床材、壁材等の基材として、木質チップを用いたパーティクルボードや、木質繊維を用いたMDF(中密度繊維板)等の木質ボードが広く用いられている。   Conventionally, wood boards such as particle boards using wood chips and MDF (medium density fiber board) using wood fibers are widely used as base materials such as floor materials and wall materials used in houses and the like.

これらの木質ボードは、一般に、針葉樹や広葉樹等の木材を破砕や切削して小片化した木質チップ、又はケナフやジュート等の植物の靱皮部分等から得られる木質繊維を接着剤と均一に混合し、これを熱圧成形して製造される。   These wood boards are generally made by mixing wood chips obtained by crushing or cutting coniferous or hardwood wood into small pieces, or bast parts of plants such as kenaf and jute, etc. This is manufactured by hot pressing.

しかしながら、このように製造される木質ボードは、合板等に比べて木質ボードを構成するエレメントが小さいため、湿度等の外部環境変化により吸放湿して膨張、収縮しやすく、寸法安定性が劣るという問題があった。   However, the wood board manufactured in this way has smaller elements constituting the wood board than plywood, etc., so it easily absorbs and releases moisture due to changes in the external environment such as humidity, and expands and contracts, resulting in poor dimensional stability. There was a problem.

このような問題に対し、木質チップ又は木質繊維を用いた木質ボードをオートクレーブ内に入れて加熱することにより、木質ボードに含まれる水分を高圧水蒸気化して処理し、寸法安定性を向上させようとする提案がなされている(例えば、特許文献1を参照)。   In order to improve the dimensional stability, the wood board using wood chips or wood fibers is placed in an autoclave and heated to treat the moisture contained in the wood board by high-pressure steaming. (See, for example, Patent Document 1).

特開平09−216206号公報JP 09-216206 A

この提案によれば、木質ボード表層の寸法安定性は改善されるものの、木質ボードの厚さや形状等によっては、芯層まで高圧水蒸気化の処理が及ばず、表層と芯層の吸放湿に伴う寸法変化に差が生じてしまい、寸法安定性が十分に改善されないという問題があった。   According to this proposal, although the dimensional stability of the wooden board surface layer is improved, depending on the thickness and shape of the wooden board, the high-pressure steaming treatment does not reach the core layer, so moisture absorption and desorption of the surface layer and the core layer can be prevented. There is a problem that a difference occurs in the accompanying dimensional change and the dimensional stability is not sufficiently improved.

本発明は、以上のとおりの事情に鑑みてなされたものであり、木質チップ又は木質繊維を用いた木質ボードにおいて、吸放湿に伴う寸法変化を抑制した、高い寸法安定性を有する木質ボードを提供することを課題としている。   The present invention has been made in view of the circumstances as described above, and in a wooden board using a wooden chip or a wooden fiber, a wooden board having high dimensional stability in which dimensional changes associated with moisture absorption and release are suppressed. The issue is to provide.

本発明は、上記の課題を解決するために、以下のことを特徴としている。   The present invention is characterized by the following in order to solve the above problems.

即ち、本発明の木質ボードは、木質チップ又は木質繊維を接着剤により接着して成形してなる木質ボードであって、竹を破砕した竹繊維から柔細胞を除去した柔細胞除去竹繊維を含有することを特徴とする。   That is, the wooden board of the present invention is a wooden board formed by adhering a wood chip or wood fiber with an adhesive, and contains soft cell-removed bamboo fiber obtained by removing soft cells from bamboo fiber obtained by crushing bamboo. It is characterized by doing.

また、この木質ボードにおいては、前記木質ボードが、目の細かい前記木質チップからなる表層と、目の粗い前記木質チップからなる芯層からなり、少なくとも前記表層が前記柔細胞除去竹繊維を含有することが好ましい。   Further, in this wood board, the wood board comprises a surface layer made of the fine wood chip and a core layer made of the wood chip having a coarse mesh, and at least the surface layer contains the soft cell-removed bamboo fiber. It is preferable.

本発明によれば、木質チップ又は木質繊維を用いた木質ボードにおいて、吸放湿に伴う寸法変化を抑制した、高い寸法安定性を有する木質ボードを提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the wood board which has the high dimensional stability which suppressed the dimensional change accompanying moisture absorption / release in the wood board using a wood chip or wood fiber can be provided.

柔細胞除去竹繊維の製造工程を示す概略説明図である。It is a schematic explanatory drawing which shows the manufacturing process of a soft cell removal bamboo fiber. 木質チップを用いた3層パーティクルボードの構成を示す断面写真である。It is a cross-sectional photograph which shows the structure of the three-layer particle board using a wood chip.

以下に、本発明の木質ボードの一実施形態について詳細に説明する。本発明の木質ボードは、木質チップ又は木質繊維を接着剤により接着して成形してなる木質ボードであって、竹を破砕した後、竹を破砕した竹繊維から柔細胞を除去した柔細胞除去竹繊維を含有することを特徴とするものである。   Hereinafter, an embodiment of the wood board of the present invention will be described in detail. The wood board of the present invention is a wood board formed by adhering a wood chip or wood fiber with an adhesive and crushing the bamboo, and then removing the soft cells from the bamboo fibers obtained by crushing the bamboo. It is characterized by containing bamboo fiber.

本発明の木質ボードとしては、木質チップと柔細胞除去竹繊維及び接着剤を含有するパーティクルボードが好ましく、また、木質繊維と柔細胞除去竹繊維及び接着剤を含有するMDF(中密度繊維板)が好ましい。   The wood board of the present invention is preferably a particle board containing a wood chip, soft cell-removed bamboo fiber and an adhesive, and MDF (medium density fiber board) containing a wood fiber, soft cell-removed bamboo fiber and an adhesive. Is preferred.

本発明の木質ボードのパーティクルボードに用いる木質チップとしては、例えば、マツ、スギ、ヒノキ等の針葉樹、又はラワン、カポール、ポプラ等の広葉樹、ケナフの芯部等を原料とした木質チップを挙げることができる。また、木質系の建築廃材を使用することもできる。   Examples of the wood chip used for the particle board of the wood board of the present invention include, for example, wood chips made from softwood such as pine, cedar and cypress, or broad-leaved trees such as lauan, capol, and poplar, and the core of kenaf. Can do. Also, wood-based building waste can be used.

また、本発明の木質ボードのMDF(中密度繊維板)に用いる木質繊維としては、例えば、マツ、スギ、ヒノキ等の針葉樹、またはラワン、カポール、ポプラ等の広葉樹を高温、高圧で分解して得られるウッドファイバーを加熱および加圧しながら加工した木質繊維を挙げることができる。   The wood fiber used in the MDF (medium density fiber board) of the wood board of the present invention includes, for example, coniferous trees such as pine, cedar and cypress, or broad-leaved trees such as lauan, capol and poplar, decomposed at high temperature and high pressure. The wood fiber which processed the obtained wood fiber while heating and pressurizing can be mentioned.

本発明の木質ボードでは、上記の木質チップ又は木質繊維に竹繊維を含有させる。この竹繊維は、図1に示すように、まず、原料の竹10を破砕して竹繊維11を製造する。   In the wood board of the present invention, bamboo fiber is contained in the wood chip or wood fiber. As shown in FIG. 1, first, the bamboo fiber 11 is produced by crushing the raw bamboo 10.

次に、この竹繊維11をさらに粗粉砕、分級して、竹繊維11の柔細胞を除去した柔細胞除去竹繊維12を製造する。なお、柔細胞を除去した柔細胞除去竹繊維12は、吸放湿による寸法変化が非常に少ない特性を有する繊維である。   Next, this bamboo fiber 11 is further coarsely pulverized and classified to produce a soft cell-removed bamboo fiber 12 from which the soft cells of the bamboo fiber 11 have been removed. The parenchyma-removed bamboo fiber 12 from which parenchyma cells have been removed is a fiber having very little dimensional change due to moisture absorption / release.

竹繊維11から柔細胞を除去する理由は、竹の繊維同士を強固に結びつけている柔細胞が、吸放湿により寸法変化を起こすため、柔細胞が除去しきれていない竹繊維11を木質ボードに含有させても寸法安定性を改善させることが困難なためである。   The reason why the parenchyma cells are removed from the bamboo fibers 11 is that the parenchyma cells that firmly connect the bamboo fibers cause a dimensional change due to moisture absorption and desorption. This is because it is difficult to improve the dimensional stability even if it is contained in the composition.

なお、原料の竹は繊維束が柔細胞により強固に結びついているため、原料の竹を破砕した竹繊維11の状態では柔細胞が除去しきれていない。そのため、竹繊維11をさらに粗粉砕して分級することにより柔細胞を除去して柔細胞除去竹繊維12とするものである。なお、柔細胞は全て除去されているものに限定するものではなく、多少は残っていてもよい。   In addition, since the fiber bundle of the raw material bamboo is tightly bound to the soft cells, the soft cells are not completely removed in the state of the bamboo fiber 11 obtained by crushing the raw material bamboo. Therefore, the bamboo fibers 11 are further coarsely pulverized and classified to remove the soft cells to obtain the soft cell-removed bamboo fibers 12. The parenchyma cells are not limited to those that have been removed, and some of them may remain.

柔細胞を除去した柔細胞除去竹繊維12の太さ及び長さは、竹の種類や竹の成長の程度により異なるが、通常、平均径10〜100μm、平均長さ1.5〜20mm程度である。   The thickness and length of the parenchyma-removed bamboo fiber 12 from which parenchyma cells have been removed vary depending on the type of bamboo and the degree of growth of the bamboo, but are usually 10 to 100 μm in average diameter and 1.5 to 20 mm in average length. is there.

柔細胞除去竹繊維12の配合割合は特に制限はないが、通常、木質ボードの原材料の合計量に対して10〜50質量%の範囲である。吸放湿による寸法変化が少ない柔細胞除去竹繊維12の配合量をこの範囲とすることにより、極めて寸法安定性に優れた木質ボードとすることができる。   The mixing ratio of the soft cell-removed bamboo fiber 12 is not particularly limited, but is usually in the range of 10 to 50% by mass with respect to the total amount of raw materials of the wooden board. By setting the blending amount of the soft cell-removed bamboo fiber 12 with little dimensional change due to moisture absorption / release within this range, a wood board with extremely excellent dimensional stability can be obtained.

また、木質ボードの製造に際しては、原料の木質チップ又は木質繊維及び、柔細胞除去竹繊維12を予め成形に適した含水率に調湿しておくのが好ましい。   Further, in the production of the wood board, it is preferable that the raw material wood chips or wood fibers and the soft cell-removed bamboo fibers 12 are preconditioned to a moisture content suitable for molding.

本発明の木質ボードは、上記の木質チップ又は木質繊維と柔細胞除去竹繊維を混合した後、接着剤を添加して、ブレンダー等を用いて均一に混合し、加熱加圧成形することにより木質ボードを製造することができる。   The wood board of the present invention is obtained by mixing the above wood chip or wood fiber and soft cell-removed bamboo fiber, adding an adhesive, mixing uniformly using a blender or the like, and heating and pressing to form a woody material. A board can be manufactured.

接着剤としては、製造するパーティクルボードやMDF(中密度繊維板)に応じた合成樹脂接着剤を適宜選択して用いることができる。   As the adhesive, a synthetic resin adhesive suitable for the particle board or MDF (medium density fiberboard) to be manufactured can be appropriately selected and used.

これらのものとしては、例えば、MDI(ジフェニルメタンジイソシアネート)、TDI(トリレンジイソシアネート)、MDIプレポリマー、TDIプレポリマー等のイソシアネート樹脂接着剤、ユリア樹脂接着剤、メラミン樹脂接着剤、ユリア・メラミン共縮合樹脂接着剤、フェノール樹脂接着剤等を挙げることができる。   These include, for example, MDI (diphenylmethane diisocyanate), TDI (tolylene diisocyanate), MDI prepolymer, TDI prepolymer and other isocyanate resin adhesives, urea resin adhesives, melamine resin adhesives, urea-melamine cocondensation A resin adhesive, a phenol resin adhesive, etc. can be mentioned.

これらの中でも、木質ボードの耐水性や、シックハウス症候群の原因となるホルムアルデヒドの放出量等を考慮した場合、ホルムアルデヒドを原料としないイソシアネート樹脂接着剤を好適に用いることができる。   Among these, when considering the water resistance of the wooden board and the amount of formaldehyde released causing sick house syndrome, an isocyanate resin adhesive not using formaldehyde as a raw material can be preferably used.

木質チップと柔細胞除去竹繊維12を用いたパーティクルボードにおける接着剤の添加量は特に制限はないが、例えば、乾燥状態の木質チップと柔細胞除去竹繊維12の合計量100質量部に対して5〜15質量部とすることができる。   The amount of the adhesive added to the particle board using the wood chip and the soft cell-removed bamboo fiber 12 is not particularly limited. For example, the total amount of the dry wood chip and the soft cell-removed bamboo fiber 12 is 100 parts by mass. It can be set to 5-15 mass parts.

また、木質繊維と柔細胞除去竹繊維12を用いたMDF(中密度繊維板)における接着剤の添加量は特に制限はないが、例えば、平面引張強度、曲げ強度、耐水性等を考慮して、乾燥状態の木質繊維と柔細胞除去竹繊維12の合計量100質量部に対して5〜25質量部とすることができる。   The amount of adhesive added to the MDF (medium density fiberboard) using the wood fiber and the soft cell-removed bamboo fiber 12 is not particularly limited. For example, considering the plane tensile strength, bending strength, water resistance, etc. Moreover, it can be 5-25 mass parts with respect to 100 mass parts of total amounts of the dry wood fiber and the soft cell removal bamboo fiber 12.

また、本発明の木質ボードには、本発明の効果を損なわない範囲内において、ワックス等の他の添加剤を含有させることができる。   Further, the wood board of the present invention can contain other additives such as wax within the range not impairing the effects of the present invention.

本発明の木質ボードのパーティクルボードにおいては、例えば、図2に示すような、目の細かい木質チップにより形成された表層21及び、目の粗い木質チップにより形成された芯層22からなる3層パーティクルボード20とすることができる。   In the wood board particle board of the present invention, for example, as shown in FIG. 2, a three-layer particle comprising a surface layer 21 formed of fine wood chips and a core layer 22 formed of coarse wood chips. It can be a board 20.

ここで、本発明で用いる目の細かい木質チップ及び目の粗い木質チップの用語の意味は、一般に公知の、3層パーティクルボードの表層及び芯層に用いる、相対的にサイズの異なるそれぞれの木質チップを意味するものであり、具体的には、表層21に用いる目の細かい木質チップとは平均長さ2〜5mmのチップを意味し、芯層22に用いる目の粗い木質チップとは平均長さ8〜20mmのチップを意味する。   Here, the meanings of the terms of fine-grained wood chips and coarse-grained wood chips used in the present invention are generally used for the surface layer and the core layer of a well-known three-layer particle board, each having a relatively different size. Specifically, the fine wood chip used for the surface layer 21 means a chip with an average length of 2 to 5 mm, and the coarse wood chip used for the core layer 22 has an average length. It means 8-20mm chip.

また、この構成の3層パーティクルボード20とする際には、少なくとも表層21に柔細胞除去竹繊維12を含有させる。   When the three-layer particle board 20 having this configuration is used, at least the surface layer 21 contains the soft cell-removed bamboo fibers 12.

通常、目の細かい木質チップのみを用いて製造した単層のパーティクルボードと、目の粗い木質チップのみを用いて製造した単層のパーティクルボードでは、目の細かい木質チップのみを用いて製造したパーティクルボードの方が吸放湿による寸法変化率が大きくなる。   In general, a single-layer particle board manufactured using only fine-grained wood chips and a single-layer particle board manufactured using only coarse-grained wood chips are particles manufactured using only fine-grained wood chips. The board has a larger dimensional change rate due to moisture absorption and desorption.

これは、目の細かい木質チップは目の粗い木質チップに比べて、パーティクルボードとした際の繊維密度が大きくなるために、目の細かい木質チップ自体の吸放湿による寸法変化が大きくなるものと考えられる。   This is because fine wood chips have a higher fiber density when used as particle boards than coarse wood chips, so the dimensional change due to moisture absorption and release of fine wood chips themselves is greater. Conceivable.

また、表層は特に湿度の影響を受ける層であり、吸放湿による寸法変化が大きくなる傾向がある。従って、少なくとも目の細かい木質チップを用いた表層21に、吸放湿による寸法変化が非常に少ない柔細胞除去竹繊維12を含有させるのが3層パーティクルボード20の寸法変化を抑制する観点から好ましい。   Further, the surface layer is a layer particularly affected by humidity, and the dimensional change due to moisture absorption / release tends to increase. Therefore, it is preferable from the viewpoint of suppressing the dimensional change of the three-layer particle board 20 to include the soft cell-removed bamboo fiber 12 with very little dimensional change due to moisture absorption and release in the surface layer 21 using at least fine wood chips. .

なお、目の粗い木質チップを用いた芯層22に対して柔細胞除去竹繊維12を含有させても問題はない。   It should be noted that there is no problem even if the soft cell-removed bamboo fiber 12 is contained in the core layer 22 using a rough wood chip.

上記の実施形態の構成とした本発明の木質ボードによれば、吸放湿に伴う寸法変化を抑制した、高い寸法安定性を有する木質ボードとすることができる。   According to the wood board of the present invention having the configuration of the above-described embodiment, a wood board having high dimensional stability in which a dimensional change accompanying moisture absorption / release is suppressed can be obtained.

以上、実施形態に基づき本発明を説明したが、本発明は上記の実施形態に何ら限定されるものではなく、その要旨を逸脱しない範囲内において各種の変更が可能である。   While the present invention has been described based on the embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

例えば、上記の実施形態では図2に示す3層パーティクルボード20として説明をしたが、少なくとも表層が目の細かい木質チップ及び柔細胞除去竹繊維12からなる構成であれば、4層以上の多層パーティクルボードであっても構わない。   For example, although the above embodiment has been described as the three-layer particle board 20 shown in FIG. 2, if at least the surface layer is composed of fine wood chips and soft cell-removed bamboo fibers 12, four or more layers of multi-layer particles It can be a board.

以下に、実施例により本発明をさらに詳しく説明するが、本発明はこれらの実施例に何ら限定されるものではない。
<実施例1>
木質ボードとして、目の細かい木質チップ、柔細胞除去竹繊維及び接着剤からなる単層のパーティクルボードを製造した。
EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.
<Example 1>
As the wood board, a single-layer particle board made of a fine wood chip, soft cell-removed bamboo fiber, and an adhesive was manufactured.

パーティクルボードの材料として、目の細かい木質チップ(木材(建築用廃材の解体材)を平均長さ3.5mmに加工したチップ)、柔細胞除去竹繊維、接着剤(イソシアネート樹脂とメラミン樹脂)を用いた。   As fine particle board materials, fine wood chips (chips made by processing wood (demolition material for construction waste) to an average length of 3.5 mm), soft cell-removed bamboo fibers, and adhesives (isocyanate resin and melamine resin) Using.

柔細胞除去竹繊維は、まず、竹原材料を自動竹繊維作成装置((株)バンブーケミカル研究所製)に導入して竹繊維(平均長さ15mm、平均幅1.5mm、平均厚さ0.2mm)を製造した。次に、この竹繊維を更に微粉砕機(増野製作所製、ニューミクロシクロマット)に導入して粉砕すると共に分級して、柔細胞を除去した柔細胞除去竹繊維(平均長さ5mm、平均径60μm)を用いた。   The soft cell-removed bamboo fiber is first introduced into an automatic bamboo fiber production apparatus (manufactured by Bamboo Chemical Laboratories Co., Ltd.) and bamboo fiber (average length 15 mm, average width 1.5 mm, average thickness 0. 0). 2 mm). Next, this bamboo fiber was further introduced into a fine pulverizer (manufactured by Masuno Seisakusho, New Microcyclomat) and pulverized and classified to remove parenchyma cells. Bamboo fiber removed bamboo fibers (average length 5 mm, average diameter) 60 μm) was used.

上記の目の細かい木質チップ80質量部、柔細胞除去竹繊維20質量部、接着剤各5質量部を高速ミキサーに投入し混合してパーティクルボード形成用混合物を調製した。   80 parts by mass of the above-mentioned fine wood chips, 20 parts by mass of soft cell-removed bamboo fibers, and 5 parts by mass of each adhesive were put into a high-speed mixer and mixed to prepare a particle board forming mixture.

次に、調整したパーティクルボード形成用混合物を予備圧縮した後、180℃、40kg/cm2の条件で熱圧成形し、仕上げ工程を経て縦横300×300mm、厚み12mmのパーティクルボードを製造した。
<実施例2>
実施例1に用いた目の細かい木質チップを、目の粗い木質チップ(木材(建築用廃材の解体材)を平均長さ12mmに加工したチップ)に変更した以外は実施例1と同様にして、パーティクルボードを製造した。
<比較例1>
実施例1に用いた柔細胞除去竹繊維に替えて、竹原材料を自動竹繊維作成装置((株)バンブーケミカル研究所製)に導入して得た竹繊維(平均長さ15mm、平均幅1.5mm、平均厚さ0.2mm)を用いた以外は実施例1と同様にして、パーティクルボードを製造した。
<比較例2>
実施例2に用いた柔細胞除去竹繊維に替えて、比較例1の竹繊維を用いた以外は実施例2と同様にしてパーティクルボードを製造した。
<比較例3>
実施例1に用いた柔細胞除去竹繊維を含有させず、目の細かい木質チップの配合量を100質量部とした以外は実施例1と同様にしてパーティクルボードを製造した。
<比較例4>
実施例2に用いた柔細胞除去竹繊維を含有させず、目の粗い木質チップの配合量を100質量部とした以外は実施例2と同様にしてパーティクルボードを製造した。
[吸放湿時の寸法変化率]
実施例1、2及び比較例1〜4で製造した各パーティクルボードの、吸放湿時の長さ変化率及び厚さ変化率を求めた。20℃、60%RHで恒量とした後、40℃、90%RHで恒量とし、そのときの平面方向の寸法変化を測定して長さ変化率を求め、厚さ方向の寸法変化を測定して厚さ変化率を求めた。その結果を表1に示す。
Next, the prepared particle board forming mixture was pre-compressed and then subjected to hot pressing under conditions of 180 ° C. and 40 kg / cm 2 , and a particle board having a length and width of 300 × 300 mm and a thickness of 12 mm was manufactured through a finishing process.
<Example 2>
Except that the fine wood chip used in Example 1 was changed to a coarse wood chip (chip obtained by processing wood (demolition material for building waste) into an average length of 12 mm), the same as in Example 1. Manufactured particle board.
<Comparative Example 1>
Bamboo fiber (average length 15 mm, average width 1) obtained by introducing bamboo raw material into an automatic bamboo fiber creation device (manufactured by Bamboo Chemical Laboratory Co., Ltd.) instead of the soft cell-removed bamboo fiber used in Example 1 A particle board was manufactured in the same manner as in Example 1 except that 0.5 mm and an average thickness of 0.2 mm were used.
<Comparative example 2>
A particle board was produced in the same manner as in Example 2 except that the bamboo fiber of Comparative Example 1 was used instead of the soft cell-removed bamboo fiber used in Example 2.
<Comparative Example 3>
A particle board was produced in the same manner as in Example 1, except that the soft cell-removed bamboo fiber used in Example 1 was not contained, and the compounding amount of fine wood chips was 100 parts by mass.
<Comparative example 4>
A particle board was produced in the same manner as in Example 2, except that the soft cell-removed bamboo fiber used in Example 2 was not contained, and the blending amount of the coarse wood chips was 100 parts by mass.
[Dimensional change rate during moisture absorption / release]
The length change rate and thickness change rate at the time of moisture absorption / release of each particle board manufactured in Examples 1 and 2 and Comparative Examples 1 to 4 were determined. After making constant weight at 20 ° C. and 60% RH, make constant weight at 40 ° C. and 90% RH, measure the dimensional change in the plane direction at that time to obtain the length change rate, and measure the dimensional change in the thickness direction. The thickness change rate was obtained. The results are shown in Table 1.

表1から、柔細胞除去竹繊維を含有する実施例1、2のパーティクルボードは、比較例1〜4の柔細胞除去竹繊維を含有しないパーティクルボードに比べて、長さ、厚さ共に吸放湿による寸法変化率が小さく、柔細胞除去竹繊維が吸放湿による寸法変化を抑制することが確認された。   From Table 1, the particle boards of Examples 1 and 2 containing soft cell-removed bamboo fibers absorb and release both in length and thickness compared to the particle boards of Comparative Examples 1 to 4 that do not contain soft cell-removed bamboo fibers. It was confirmed that the dimensional change rate due to moisture was small, and the soft cell-removed bamboo fiber suppressed dimensional change due to moisture absorption and desorption.

また、柔細胞除去竹繊維を含有させた実施例1、2と竹繊維を含有させた比較例1、2の比較から、竹の柔細胞を除去した柔細胞除去竹繊維を含有させることにより、吸放湿による寸法変化を抑制できることが確認された。   In addition, from the comparison of Examples 1 and 2 containing soft cell-removed bamboo fiber and Comparative Examples 1 and 2 containing bamboo fiber, by containing the soft cell-removed bamboo fiber from which bamboo soft cells were removed, It was confirmed that dimensional changes due to moisture absorption and desorption can be suppressed.

これらの結果から、木質ボードに竹の柔細胞を除去した柔細胞除去竹繊維を含有させることにより、吸放湿に伴う寸法変化を抑制した、高い寸法安定性を有する木質ボードとすることができることが確認された。   From these results, it is possible to obtain a wooden board having high dimensional stability by suppressing the dimensional change due to moisture absorption and desorption, by including the soft cell-removed bamboo fiber from which the bamboo soft cells have been removed in the wooden board. Was confirmed.

10 竹
11 竹繊維
12 柔細胞除去竹繊維
20 3層パーティクルボード
21 表層
22 芯層
DESCRIPTION OF SYMBOLS 10 Bamboo 11 Bamboo fiber 12 Soft cell removal bamboo fiber 20 3 layer particle board 21 Surface layer 22 Core layer

Claims (2)

木質チップ又は木質繊維を接着剤により接着して成形してなる木質ボードであって、竹を破砕した竹繊維から柔細胞を除去した柔細胞除去竹繊維を含有することを特徴とする木質ボード。   A wooden board formed by bonding a wood chip or a wood fiber with an adhesive, and comprising a soft cell-removed bamboo fiber obtained by removing soft cells from bamboo fiber obtained by crushing bamboo. 前記木質ボードが、目の細かい前記木質チップからなる表層と、目の粗い前記木質チップからなる芯層からなり、少なくとも前記表層が前記柔細胞除去竹繊維を含有することを特徴とする請求項1に記載の木質ボード。
The said wooden board consists of the surface layer which consists of the said fine wood chip | tip with a fine grain, and the core layer which consists of the said fine wood chip | tip, and at least the said surface layer contains the said soft cell removal bamboo fiber. Woody board described in.
JP2013024943A 2013-02-12 2013-02-12 Woody board Pending JP2014151599A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015157456A (en) * 2014-02-25 2015-09-03 大倉工業株式会社 particle board
CN105328763A (en) * 2015-10-21 2016-02-17 苏州东邦家具有限公司 Preparation method for recombined bamboo wood for furniture manufacturing
JP2022011342A (en) * 2020-06-30 2022-01-17 永大産業株式会社 Oil palm material vascular bundle extraction method and compact manufacturing method
JP7536157B1 (en) 2023-09-12 2024-08-19 大建工業株式会社 Particleboard and manufacturing method thereof
JP7536153B1 (en) 2023-08-03 2024-08-19 大建工業株式会社 Particleboard and manufacturing method thereof
JP7536976B1 (en) 2023-09-12 2024-08-20 大建工業株式会社 Particleboard and manufacturing method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015157456A (en) * 2014-02-25 2015-09-03 大倉工業株式会社 particle board
CN105328763A (en) * 2015-10-21 2016-02-17 苏州东邦家具有限公司 Preparation method for recombined bamboo wood for furniture manufacturing
JP2022011342A (en) * 2020-06-30 2022-01-17 永大産業株式会社 Oil palm material vascular bundle extraction method and compact manufacturing method
JP7498041B2 (en) 2020-06-30 2024-06-11 永大産業株式会社 Method for extracting vascular bundles from oil palm wood and method for manufacturing molded bodies
JP7536153B1 (en) 2023-08-03 2024-08-19 大建工業株式会社 Particleboard and manufacturing method thereof
JP7536157B1 (en) 2023-09-12 2024-08-19 大建工業株式会社 Particleboard and manufacturing method thereof
JP7536976B1 (en) 2023-09-12 2024-08-20 大建工業株式会社 Particleboard and manufacturing method thereof

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