JP2014006865A - Conductive film and touch panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductive film exhibiting excellent conductivity even when folded and excellent flexibility.SOLUTION: A conductive film includes a support and conductive thin wires provided on the support and containing a binder and a metal. The conductive thin wires have a Young's modulus of 5.5 GPa or less. A height a of the conductive thin wires from a surface of the support in cross sections in a vertical direction with respect to surfaces of the conductive thin wires and a height b to the metal in the conductive thin wires located farthest from the surface of the support in the vertical direction satisfy the following expression (X): b/a≤0.975.

Description

  The present invention relates to a conductive film, in particular, a conductive film having excellent conductive characteristics even when bent, and a touch panel using the conductive film.

Conductive films with transparent conductive thin wires formed on a support are transparent electrodes for various electronic devices such as solar cells, inorganic EL elements, and organic EL elements, electromagnetic wave shields for various display devices, touch panels, transparent planar heating elements, etc. Widely used. In particular, in recent years, the rate of mounting touch panels on mobile phones, portable game devices, and the like has increased, and the demand for conductive films for capacitive touch panels capable of multipoint detection is rapidly expanding.
As such a conductive film, for example, Patent Document 1 discloses a conductive film having an electrode portion that satisfies a desired relationship in a predetermined bending test. Further, Patent Document 2 discloses a conductive film having conductive fine wires formed by exposing and developing an emulsion layer containing silver halide and a binder coated on a support.

JP 2009-004348 A JP 2010-251734 A

On the other hand, in recent years, in order to increase the productivity of products and the degree of freedom in product design, a conductive film having excellent flexibility that can be bent is desired.
For example, in recent years, application of touch panels to small information terminal devices has progressed, and in order to ensure a wide input area, it is required to narrow the width of the frame portion (narrow frame). Normally, it is difficult to narrow the frame because there is a peripheral wiring (lead wiring) in the frame part of the touch panel. be able to.

  However, in the case of a conductive film provided with a known conductive thin wire as described in Patent Document 1 or 2 described above, if the conductive film is to be folded, the conductive thin wire is cracked or broken, There was a problem that the conductivity decreased.

  In view of the above circumstances, an object of the present invention is to provide a conductive film excellent in flexibility that exhibits excellent conductivity even when folded, and a touch panel using this conductive film.

  As a result of intensive studies on the above problems, the present inventors have found that the above problems can be solved by controlling the Young's modulus of the conductive thin wires and the distribution state of the metal in the conductive thin wires. .

(1) a support;
A conductive film comprising a conductive thin wire containing a binder and a metal disposed on a support,
The Young's modulus of the conductive thin wire is 5.5 GPa or less,
In a cross section in the vertical direction with respect to the surface of the conductive thin wire, the height a from the support surface of the conductive thin wire, and the height b to the metal in the conductive thin wire that is farthest from the support surface in the vertical direction, Is a conductive film satisfying the relationship of the following formula (X).
Formula (X) b / a ≦ 0.975

(2) a support;
A conductive film comprising a conductive thin wire containing a binder and a metal disposed on a support,
The conductive film which satisfy | fills the relationship of the following formula | equation (Y), when the resistance value of the electroconductive thin wire before performing a bending test is R1, and the resistance value of the electroconductive thin wire after performing a bending test is R2.
Formula (Y) R2 / R1 <1.10
(In the bending test, a conductive film is disposed across a groove on a table having a pair of inclined surfaces and a groove having a width that decreases from the opening side toward the bottom surface side, and has a radius of curvature of 3 The conductive film is pressed into the concave groove with the tip of the pushing member having a hemispherical tip of 5 mm, and the conductive film is brought into contact with the inclined surface, where the inner angle formed by the pair of inclined surfaces is 30 degrees. The depth of the groove is 10 mm, and the width of the bottom surface of the groove is 7 mm.)
(3) The conductive film according to (1) or (2), wherein the conductive fine wire contains silicone oil and / or paraffin oil, and the total content is 10 mg / m ² or less.
(4) The mass ratio (mass of binder / total mass of silicone oil and paraffin oil) of the mass of the binder and the total mass of silicone oil and paraffin oil in the conductive fine wire is 95 or more, (1) to (3 ).
(5) The conductive film according to any one of (1) to (4), wherein a transparent resin layer is provided between the conductive thin wires on the support.

(6) The support includes a first conductive region, a bent region extended from the first conductive region, and a second conductive region that electrically connects the first conductive region to an external circuit. In the first conductive region, the bent region, and the second conductive region, a conductive thin wire, an electrode terminal connected to the conductive thin wire, and a wiring connected to the electrode terminal are arranged. The electrode terminal and the wiring are continuously formed of the same material, and the bending area has a rectangular area when the end area is fitted with a rectangular unit area. A conductive film smaller than the unit area.
(7) The conductive film according to (6), wherein an end of the bent region is cut off.
(8) The conductive film according to (6) or (7), wherein the first conductive region and the bent region are rectangular and at least one corner is cut off.
(9) The conductive film according to any one of (6) to (8), wherein a fold line is formed at a boundary between the first conductive region and the folded region.
(10) The conductive film according to any one of (6) to (9), wherein the second conductive region has a migration prevention layer.
(11) The first conductive region has a first migration prevention layer, the second conductive region has a second migration prevention layer, and the first migration prevention layer and the second migration prevention layer. Are the conductive films according to any one of (6) to (9), which have different migration prevention capabilities.
(12) The conductive film according to (11), wherein the second migration prevention layer has higher migration prevention ability than the first migration prevention layer.
(13) The conductive film according to (11), wherein the second migration prevention layer has a higher content of migration inhibitor than the first migration prevention layer.

(14) A touch panel having the conductive film according to any one of (1) to (13).
(15) A touch panel comprising the conductive film according to any one of (6) to (13), wherein the first conductive area is a sensing area for detecting a touch position.
(16) A display device including a display unit and a drive circuit disposed on the back surface of the display unit, and having a predetermined thickness, wherein the conductive film according to any one of (6) to (13) is provided. The conductive film is disposed on the display unit, and the conductive film includes a first conductive region, a bent region extended from the first conductive region, and a second conductive layer electrically connecting the first conductive region to the drive circuit. A display device comprising a conductive region, wherein the length of the bent region in the extending direction is longer than a predetermined thickness.

  ADVANTAGE OF THE INVENTION According to this invention, the electrically conductive film excellent in the flexibility which shows the outstanding electroconductivity also when folded can be provided.

It is sectional drawing showing the 1st embodiment of the conductive film of this invention. It is an expanded sectional view of the conductive fine wire of the conductive film of the present invention. It is the schematic of the apparatus used by a bending test, (A) shows the state before pressing with a pressing member, (B) shows the state after pressing with a pressing member. It is a top view which shows one embodiment of the pattern formed with a conductive fine wire. It is a top view of one embodiment of the touch panel of the present invention. (A) is a partial plan view of one end side of a general touch panel member, (B) is a partial plan view of one end side of the conductive film for a touch panel of the present invention, (C) is (B) It is the schematic which shows the aspect which bent the electrically conductive film for touchscreens. It is sectional drawing showing the 2nd embodiment of the conductive film of this invention. (A) is a top view which shows the 3rd embodiment of the electrically conductive film of this invention, (B) is a cross-sectional arrow directional view along the CD line of FIG. 8 (A). It is a top view which shows the other embodiment of the pattern formed with a conductive fine wire. It is a top view which shows the other embodiment of the pattern formed with a conductive fine wire. (A) is typical sectional drawing which shows the state which the electrically conductive film of the 3rd embodiment of this invention was bent, (B) shows the state which bent the electrically conductive film of the 3rd embodiment of this invention. It is a typical perspective view. It is a top view showing the modification of the 3rd embodiment of the conductive film of this invention. (A) is a top view showing the 4th embodiment of the conductive film of the present invention, and (B) is a sectional arrow line view along the EF line of Drawing 13 (A). It is a fragmentary sectional view of the 2nd conductive region of the conductive film of the 4th embodiment of the present invention. (A) is a typical perspective view showing the embodiment of the display provided with the conductive film of the present invention, and (B) is a top view showing the state where the conductive film and the display were combined.

Below, the suitable embodiment of the electrically conductive film of this invention is demonstrated.
First, the feature point compared with the prior art of this invention is explained in full detail.
In the present invention, it has been found that a desired effect can be obtained by controlling the Young's modulus of the conductive thin wire and controlling the position of the metal in the conductive thin wire.
More specifically, in the present invention, by controlling the Young's modulus of the conductive thin wire within a predetermined range, even when the conductive film is bent, the bending can be followed without causing cracks or cracks. Is heading. When the Young's modulus of the conductive thin wire is too high, the conductive thin wire cannot follow the bending and breaks.
In addition, by controlling the position of the metal in the conductive thin wire, the metal is covered with a binder of a predetermined thickness, so that when the conductive film is bent, the metal is bent along the movement of the binder, disconnection, etc. Has been found to be suppressed.

<First Embodiment>
Below, the 1st embodiment of the electrically conductive film of this invention is demonstrated with reference to drawings. In FIG. 1, sectional drawing of the 1st embodiment of the electrically conductive film of this invention is shown.
A conductive film 10 shown in FIG. 1 includes a support 12 and a conductive fine wire 14 disposed on the support 12.
Below, the aspect of the support body 12 and the electroconductive thin wire 14 is explained in full detail.
First, the support 12 will be described in detail.

[Support]
The type of the support 12 is not limited as long as it can support the conductive thin wire 14, and is preferably a transparent support, and particularly preferably a plastic film. By using a transparent support, the conductive film of the present invention can be suitably used as a transparent conductive film.
Specific examples of the support 12 include PET (258 ° C.), PEN (269 ° C.), PE (135 ° C.), PP (163 ° C.), polystyrene (230 ° C.), polyvinyl chloride (180 ° C.), and polyvinylidene chloride. A plastic film having a melting point of about 290 ° C. or less such as (212 ° C.) or TAC (290 ° C.) is preferable, and PET is particularly preferable. Figures in parentheses are melting points. The total light transmittance of the support 12 is preferably 85% to 100%.

  Although the thickness in particular of the support body 12 is not restrict | limited, From the point of application to uses, such as a touch panel and an electromagnetic wave shield, it can usually be arbitrarily selected in 50-500 micrometers. In addition, in addition to the function of the support of the transparent conductive film, it can be designed with a thickness exceeding 500 μm when it also functions as a touch surface.

[Conductive wire]
The thin conductive wire 14 is a thin conductive layer provided on the support 12 and contains a binder and a metal. In FIG. 1, the conductive thin wire 14 is formed only on one surface of the support 12, but the embodiment is not limited thereto, and the conductive thin wire 14 may be disposed on both surfaces of the support 12. Good.
Hereinafter, the characteristics of the conductive thin wire 14 will be described in detail, and then the material constituting the conductive thin wire 14 will be described in detail.

(Characteristics of conductive thin wire 14)
The Young's modulus of the conductive thin wire 14 is 5.5 GPa or less. If the Young's modulus is within this range, the conductive thin wire 14 is hardly broken even when the conductive film is bent, and the flexibility is excellent. Especially, 4.0 GPa or less is preferable and 3.3 Pa or less is more preferable at the point which the flexibility of a conductive film is more excellent. In addition, although there is no restriction | limiting in particular about the minimum of Young's modulus, Usually, 2.0 GPa or more is preferable and 3.0 GPa or more is more preferable from points, such as a damage at the time of handling.
In addition, when the Young's modulus of the conductive thin wire 14 exceeds 5.5 GPa, the conductive thin wire 14 is easily cracked or cracked when the conductive film is bent, and the conductive film is inferior in flexibility.

The method for controlling the Young's modulus of the conductive thin wire 14 is not particularly limited. For example, a method for adjusting the Young's modulus using a plasticizer such as silicone oil or paraffin oil described later, or a binder exhibiting a desired Young's modulus. The method to use etc. are mentioned.
Other methods include, for example, a method of adjusting the cross-linking density between binders in the conductive thin wire 14 and a method of adjusting the Young's modulus of the conductive thin wire 14 by mixing binders having different Young's moduli. Can be mentioned.

The measuring method of the Young's modulus of the conductive thin wire 14 is not particularly limited, and a known measuring method can be adopted. For example, it can be measured by an ultra-fine indentation hardness tester (nanoindentation tester, for example, EN-1100 manufactured by Elionix). In addition, a sample film made of a conductive thin wire component may be prepared to measure the Young's modulus. Below, the measuring method in the case of using a sample film | membrane is explained in full detail.
First, a sample film (length 20 mm × width 120 mm × thickness 0.1 mm) having the same composition as the conductive thin wire is prepared. The method for preparing the sample film is not particularly limited. For example, a sample film is prepared by applying a composition containing predetermined components on a PET base (support) having a thickness of 100 μm, and then the sample film is removed from the support. Can be prepared to peel. Next, the Young's modulus of the sample film is measured under the following conditions using an AG-X type tensile tester manufactured by Shimadzu Corporation. Specifically, the sample film is set on the chuck so that the distance between chucks is 100 mm, and the Young's modulus is measured in a measurement environment: 25 ° C., 35% RH, and a pulling speed of 1 mm / min.

When a cross section in the direction perpendicular to the surface of the conductive thin wire 14 is observed with a scanning electron microscope, the height a of the conductive thin wire 14 from the surface of the support 12 and the conductive thin wire at the position farthest from the surface of the support 12 The height b up to the metal in 14 satisfies the relationship of the following formula (X).
Formula (X) b / a ≦ 0.975
In FIG. 2, the expanded cross-section schematic diagram in the orthogonal | vertical direction with respect to the surface of the electroconductive thin wire 14 is shown. As shown in FIG. 2, the metal M is dispersed in the binder in the conductive thin wire 14. As shown in FIG. 2, the height of the conductive thin wire 14 on the support 12 is a height a, and the height to the metal M in the conductive thin wire 14 located farthest from the surface of the support 12 is as follows. It corresponds to height b.
If b / a is within the above range, the metal is coated with a binder having a predetermined thickness in the surface region of the conductive thin wire 14, and the metal is also a binder when the conductive film is bent. As a result, it is easy to bend, and as a result, the occurrence of disconnection of the conductive thin wire 14 is suppressed, and the flexibility is excellent. Especially, 0.950 or less is more preferable at the point which the flexibility of a conductive film is more excellent, and 0.900 or less is further more preferable. In addition, although there is no restriction | limiting in particular about the minimum of b / a, Usually, 0.700 or more is preferable and 0.800 or more is more preferable from the point which ensures contact resistance.

  The height a and the height b are average values obtained by measuring the height a and the height b in three scanning electron micrographs and arithmetically averaging them.

When the resistance value of the conductive thin wire 14 before performing the following bending test is R1, and the resistance value of the conductive thin wire 14 after performing the following bending test is R2, the relationship of the following formula (Y) Meet.
Formula (Y) R2 / R1 <1.10
Below, the method of a bending test is demonstrated based on FIG.
First, a conductive film which is an evaluation plate for a bending test having a length of 600 mm and a width of 800 mm is prepared. As will be described later, the evaluation plate for bending test is bent over the entire width at a position of 400 mm in width.
Next, as shown in FIG. 3A, the concave groove 20 is formed on a table 22 having a pair of inclined surfaces 18 and provided with a concave groove 20 whose width decreases from the opening side toward the bottom surface side. Further, the bending test evaluation plate 24 is arranged so as to straddle (cover). In addition, the angle (inclination angle of the groove 20) θ between the pair of inclined surfaces 18 is 30 °, the depth D of the groove 20 is 10 mm, and the width W of the bottom surface of the groove 20 is 7 mm. As shown in FIG. 3A, the bending test evaluation plate 24 is arranged so that one end and the other end thereof are located on the surfaces on both sides of the table 22 with the concave groove 20 in between. The center of the bending test evaluation plate 24 in the horizontal direction is arranged so as to overlap the center of the bottom surface of the groove 20 in the width direction.
A pressing member 28 having a hemispherical tip 26 with a radius of curvature of 3.5 mm is disposed on the evaluation plate 24 for bending test, and the center of the tip of the pressing member 28 is the bottom of the groove 20. The position is aligned with the center in the width direction in a plan view. In addition, the material which comprises the pushing member 28 is SUS.
Next, after heating so that the temperature of the pressing member 28, the base 22, and the bending test evaluation plate 24 is 100 ° C., the pressing member 28 is moved in the direction of the arrow as shown in FIG. As shown in FIG. 3 (B), the bending test evaluation plate 24 is pressed into the concave groove 20 by the front end portion 26 of the pressing member 28 so that the bending test evaluation plate 24 contacts the inclined surface 18 and bent. . The pressing force of the pressing member 28 to the bending test evaluation plate 24 is 3.6 MPa, and the moving speed of the pressing member 28 is 40 mm / second.

  Two resistance measurement positions are determined across the bending position, and the conductive thin wire in the evaluation board for the bending test before the bending test is performed, and the electrical conductivity in the evaluation board for the bending test after the bending test is performed. The resistance value with the thin wire is measured with a digital multimeter. R2 / R1 is calculated from the obtained values of R1 and R2.

The line width of the conductive thin wire 14 is not particularly limited, but is preferably 30 μm or less, more preferably 15 μm or less, further preferably 10 μm or less, particularly preferably 9 μm or less, most preferably 7 μm or less, and more preferably 0.5 μm or more. More preferably, it is 0.0 μm or more. If it is the said range, a low resistance electrode can be formed comparatively easily.
The thickness of the conductive thin wire 14 is not particularly limited, but is preferably 0.001 mm to 0.2 mm, more preferably 30 μm or less, further preferably 20 μm or less, and particularly preferably 0.01 to 9 μm. Preferably, it is most preferable that it is 0.05-5 micrometers. If it is the said range, it is a low resistance electrode and can form the electrode excellent in durability comparatively easily.

The pattern formed by the conductive thin wire 14 is not particularly limited, and when the conductive film is applied to the touch panel and the sensor electrode is formed by the conductive thin wire 14, the embodiment shown in FIG. As shown in FIG. 4, a plurality of square lattices 16 constituted by intersecting conductive thin wires 14 are included.
The preferred range of the width W of the conductive thin wire 14 is as described above.
The lattice 16 includes an opening region surrounded by the thin conductive wires 14. The grating 16 has a grating pitch Pa of 200 μm to 400 μm (preferably 150 to 300 μm).
From the viewpoint of visible light transmittance, the aperture ratio of the sensor electrode formed from the conductive thin wire 14 is preferably 85% or more, more preferably 90% or more, and most preferably 95% or more. . The aperture ratio corresponds to the ratio of the transmissive portion excluding the conductive thin wires 14 of the sensor electrode in the predetermined region.

  In FIG. 4, the grid 16 has a square shape. However, other polygonal shapes may be used. Further, the shape of one side may be a curved shape or a circular arc shape in addition to a linear shape. In the case of the arc shape, for example, the two opposing sides may have an outwardly convex arc shape, and the other two opposing sides may have an inwardly convex arc shape. The shape of each side may be a wavy shape in which an outwardly convex arc and an inwardly convex arc are continuous. Of course, the shape of each side may be a sine curve.

(binder)
The conductive fine wire 14 contains a binder. The binder serves to disperse the metal and assist the adhesion between the conductive thin wire 14 and the support 12.
The type of the binder is not particularly limited as long as it is a material that plays the above role, but is preferably a water-soluble polymer from the viewpoint that the dispersibility of the metal is more excellent. Examples of binders include gelatin, carrageenan, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), starch and other polysaccharides, cellulose and its derivatives, polyethylene oxide, polysaccharides, polyvinylamine, chitosan, polylysine, and polyacryl. Examples include acid, polyalginic acid, polyhyaluronic acid, carboxycellulose, gum arabic, and sodium alginate. Of these, gelatin is preferable in that the dispersibility of the metal is more excellent.
In addition to lime-processed gelatin, acid-processed gelatin may be used as gelatin, and gelatin hydrolyzate, gelatin enzyme decomposition product, and other gelatins modified with amino groups and carboxyl groups (phthalated gelatin, acetylated gelatin) Can be used.

Another preferred embodiment of the binder is a polymer (copolymer) represented by the following general formula (1) from the viewpoint that water can be further prevented from entering.
General formula (1):-(A) x- (B) y- (C) z- (D) w-
In general formula (1), A, B, C, and D each represent the following repeating unit.

R ¹ represents a methyl group or a halogen atom, preferably a methyl group, a chlorine atom, or a bromine atom. p represents an integer of 0 to 2, 0 or 1 is preferable, and 0 is more preferable.

R ² represents a methyl group or an ethyl group, and a methyl group is preferable.
R ³ represents a hydrogen atom or a methyl group, preferably a hydrogen atom. L represents a divalent linking group, preferably a group represented by the following general formula (2).
Formula ^{(2) :-( CO-X 1} ) r-X 2 -
In the formula, X ¹ represents an oxygen atom or —NR ³⁰ —. Here, R ³⁰ represents a hydrogen atom, an alkyl group, an aryl group, or an acyl group, and each may have a substituent (for example, a halogen atom, a nitro group, a hydroxyl group, etc.). R ³⁰ is preferably a hydrogen atom, an alkyl group having 1 to 10 carbon atoms (for example, methyl group, ethyl group, n-butyl group, n-octyl group, etc.), acyl group (for example, acetyl group, benzoyl group, etc.) It is. Particularly preferred as X ¹ is an oxygen atom or —NH—.
X ² represents an alkylene group, an arylene group, an alkylene arylene group, an arylene alkylene group, or an alkylene arylene alkylene group, and these groups include —O—, —S—, —OCO—, —CO—, —COO—. , —NH—, —SO ₂ —, —N (R ³¹ ) —, —N (R ³¹ ) SO ₂ — and the like may be inserted in the middle. Here, R ³¹ represents a linear or branched alkyl group having 1 to 6 carbon atoms, such as a methyl group, an ethyl group, and an isopropyl group. Preferred examples of X ² include dimethylene group, trimethylene group, tetramethylene group, o-phenylene group, m-phenylene group, p-phenylene group, —CH ₂ CH ₂ OCOCH ₂ CH ₂ —, —CH ₂ CH ₂ OCO ( C ₆ H ₄ ) — and the like.
r represents 0 or 1;
q represents 0 or 1, and 0 is preferable.

R ⁴ represents an alkyl group having 5 to 80 carbon atoms, an alkenyl group, or an alkynyl group, preferably an alkyl group having 5 to 50 carbon atoms, more preferably an alkyl group having 5 to 30 carbon atoms, More preferably, it is a C5-C20 alkyl group.
R ⁵ is a hydrogen atom, a methyl group, an ethyl group, a halogen atom, or a -CH ₂ COOR ^6, a hydrogen atom, a methyl group, a halogen atom, -CH ₂ COOR ⁶ are preferred, hydrogen atom, a methyl group, -CH ₂ COOR ⁶ is more preferable, and a hydrogen atom is particularly preferable.
R ⁶ represents a hydrogen atom or an alkyl group having 1 to 80 carbon atoms, and may be the same as or different from R ^4, and R ⁶ has preferably 1 to 70, more preferably 1 to 60 carbon atoms.

In general formula (1), x, y, z, and w represent the molar ratio of each repeating unit.
x is 3 to 60 mol%, preferably 3 to 50 mol%, more preferably 3 to 40 mol%.
y is 30 to 96 mol%, preferably 35 to 95 mol%, particularly preferably 40 to 90 mol%.
If z is too small, the affinity with a hydrophilic protective colloid such as gelatin is reduced, so that the probability of occurrence of agglomeration / peeling failure of the matting agent is increased. The matting agent of the present invention is dissolved. Therefore, z is 0.5 to 25 mol%, preferably 0.5 to 20 mol%, particularly preferably 1 to 20 mol%.
As w, it is 0.5-40 mol%, Preferably it is 0.5-30 mol%.
In the general formula (1), it is particularly preferable that x is 3 to 40 mol%, y is 40 to 90 mol%, z is 0.5 to 20 mol%, and w is 0.5 to 10 mol%.

  The polymer represented by the general formula (1) is preferably a polymer represented by the following general formula (2).

  In general formula (2), x, y, z and w are as defined above.

The polymer represented by the general formula (1) may include other repeating units other than the general formulas (A), (B), (C) and (D). Examples of monomers for forming other repeating units include acrylic acid esters, methacrylic acid esters, vinyl esters, olefins, crotonic acid esters, itaconic acid diesters, maleic acid diesters, and fumaric acid diesters. , Acrylamides, unsaturated carboxylic acids, allyl compounds, vinyl ethers, vinyl ketones, vinyl heterocycles, glycidyl esters, unsaturated nitriles, and the like. These monomers are also described in [0010] to [0022] of Japanese Patent No. 3754745.
From the viewpoint of hydrophobicity, acrylic acid esters and methacrylic acid esters are preferable, and hydroxyalkyl methacrylates such as hydroxyethyl methacrylate or hydroxyalkyl acrylates are more preferable. The polymer represented by the general formula (1) preferably contains a repeating unit represented by the following general formula (E) in addition to the above general formulas (A), (B), (C) and (D).

In the above formula, L _E represents an alkylene group, preferably an alkylene group having 1 to 10 carbon atoms, more preferably an alkylene group having 2 to 6 carbon atoms, more preferably an alkylene group having 2 to 4 carbon atoms.

  As the polymer represented by the general formula (1), a polymer represented by the following general formula (3) is particularly preferable.

In the above formula, a1, b1, c1, d1, and e1 represent the molar ratio of each monomer unit, a1 is 3 to 60 (mol%), b1 is 30 to 95 (mol%), and c1 is 0.5 to 25 (mol%), d1 represents 0.5 to 40 (mol%), and e1 represents 1 to 10 (mol%).
The preferred range of a1 is the same as the preferred range of x, the preferred range of b1 is the same as the preferred range of y, the preferred range of c1 is the same as the preferred range of z, and the preferred range of d1 is The same as the preferable range of w.
e1 is 1 to 10 mol%, preferably 2 to 9 mol%, more preferably 2 to 8 mol%.

  Specific examples of the polymer represented by the general formula (1) are shown below, but are not limited thereto.

  1000-1 million are preferable, as for the weight average molecular weight of the polymer represented by General formula (1), 2000-750,000 are more preferable, and 3000-500,000 are still more preferable.

  The polymer represented by the general formula (1) can be synthesized with reference to, for example, Japanese Patent No. 3305459 and Japanese Patent No. 3754745.

(metal)
The conductive thin wire 14 contains a metal. The metal is dispersed in the binder and imparts conductivity to the conductive thin wire 14.
The metal material is not particularly limited, and examples thereof include gold, silver, and copper. Especially, silver is preferable at the point which the electroconductivity of the electroconductive fine wire 14 is more excellent.

The volume ratio of the metal to the binder (metal volume / binder volume) in the conductive fine wire 14 is preferably 1.0 or more, and more preferably 1.5 or more. By setting the volume ratio of the metal and the binder to 1.0 or more, the conductivity of the conductive thin wire 14 can be further increased. The upper limit is not particularly limited, but is preferably 4.0 or less and more preferably 2.5 or less from the viewpoint of productivity.
In addition, the volume ratio of the metal and the binder in the present invention can be calculated from the density of the metal and the binder contained in the conductive fine wire 14. For example, when the metal is silver, the density of silver is 10.5 g / cm ³ , and when the binder is gelatin, the density of gelatin is 1.34 g / cm ³ .

  When the polymer represented by the general formula (1) and the water-soluble polymer are contained in the conductive thin wire 14, the mass ratio (the mass of the polymer represented by the general formula (1) / the mass of the water-soluble polymer). ) Is preferably 1.05 or more, more preferably 1.05 to 3.51, and even more preferably 1.51 to 3.01, from the viewpoint that the balance of water content and conductivity of the conductive thin wire 14 is more excellent. 2.00 to 2.51 is particularly preferable.

  When the polymer represented by the general formula (1) is included in the conductive thin wire 14, the mass ratio of the metal and the polymer represented by the general formula (1) (the mass of the metal / the general formula (1)). The mass of the polymer) is preferably 2.25 to 7.5, more preferably 2.62 to 5.24, and more preferably 3.14 to 3 from the viewpoint that the balance between the moisture content and the conductivity of the conductive thin wire 14 is more excellent. .95 is more preferred.

(Other ingredients)
The conductive fine wire 14 may contain other components other than the binder and the metal, and examples thereof include silicone oil and paraffin oil from the viewpoint that the flexibility of the conductive fine wire 14 is further improved.
Silicone oil is generally referred to as polyorganosiloxane, and examples of linear polyorganosiloxane include polydimethylsiloxane and polymethylphenylsiloxane.
Paraffin oil refers to a petroleum base oil obtained by hydrogenating and purifying petroleum fractions or residual oil, or obtained by decomposition. For example, NA Solvent manufactured by Nippon Oil & Fats Co., Ltd., PW-90 and PW-380 manufactured by Idemitsu Kosan Co., Ltd., IP-Solvent 2835 manufactured by Idemitsu Petrochemical Co., Ltd., Neothiozole manufactured by Sanko Chemical Co., Ltd., and the like.
Silicone oil and paraffin oil may be used individually or in combination.

When the conductive fine wire 14 contains silicone oil and / or paraffin oil, the total content is preferably 10 mg / m ² or less. If it is this range, the planar characteristic and flexibility of the electroconductive thin wire 14 will be more excellent. In addition, although a minimum in particular is not restrict | limited, 6 mg / m < ² > or more is preferable at the point which the flexibility of the electroconductive fine wire 14 is more excellent.
Further, the mass ratio of the mass of the binder in the conductive thin wire 14 to the total mass of the silicone oil and the paraffin oil (the mass of the binder / the total mass of the silicone oil and the paraffin oil) is preferably 313 or less, and more preferably 156 or less. . If it is this range, the flexibility of the electroconductive thin wire 14 will be more excellent. The lower limit is not particularly limited, but is preferably 50 or more and more preferably 95 or more from the viewpoint of securing planar characteristics and flexibility.

[Conductive film]
The conductive film 10 includes the support 12 and the conductive thin wires 14 described above.
Note that the conductive film 10 may include another layer (for example, an undercoat layer or an antihalation layer) between the support 12 and the conductive thin wire 14 as necessary.
The undercoat layer is a layer provided in order to further improve the adhesion between the support 12 and the conductive thin wire 14. Although the material which comprises an undercoat layer is not restrict | limited in particular, For example, the binder mentioned above is illustrated. The thickness of the undercoat layer is not particularly limited, but is preferably from 0.01 to 0.1 μm, more preferably from 0.05 to 0.1 μm, in that the adhesion between the support 12 and the conductive thin wire 14 is further improved.
The material used for the antihalation layer and its method of use are not particularly limited, and examples thereof include those described in paragraphs [0029] to [0032] of JP-A-2009-188360.

The conductive film 10 can be used for various applications. For example, it can be used as various electrodes (for example, electrodes for touch panels, electrodes for inorganic EL elements, electrodes for organic EL elements, or electrodes for solar cells), heat generating sheets, or printed wiring boards. Especially, it is preferable that the conductive film 10 is used for a touch panel, and it is especially preferable to be used for a capacitive touch panel.
As another application, the conductive film 10 can also be used as an electromagnetic wave shield that blocks electromagnetic waves such as radio waves or microwaves (extremely short waves) generated from personal computers, workstations, and the like and prevents static electricity. In addition to the electromagnetic wave shield used for the personal computer body, it can also be used as an electromagnetic wave shield used in video imaging equipment, electronic medical equipment, and the like.
Furthermore, the conductive film 10 can also be used as a transparent heating element.
Among these, application to a touch panel is particularly preferable. Below, the aspect of the conductive film 10 for touchscreens is explained in full detail.

(Touch panel)
When the conductive film 10 described above is used for a touch panel, it has excellent visibility due to high transmittance, excellent response to screen operations, and excellent flexibility.
Examples of the touch panel include widely known touch panels, and the conductive film 10 of the present invention can be applied to what is known as a so-called touch sensor and touch pad.
The type of touch panel is not particularly limited as long as it has the conductive film 10, and can be appropriately selected according to the purpose. For example, a surface capacitive touch panel, a projected capacitive touch panel, a resistive film type Examples include touch panels.
Hereinafter, with reference to drawings, the suitable aspect of the conductive film for touchscreens is explained in full detail.

FIG. 5 is a plan view of a conductive film 200 for a touch panel. The conductive film 200 is a conductive film used for a so-called projected capacitive touch panel, and includes transparent electrodes on both surfaces of a single substrate.
As shown in FIG. 5, the conductive film 200 includes a support 12, a first electrode pattern 30 composed of conductive thin wires on one main surface of the support 12, and the other main surface of the support 12. And a second electrode pattern 32 composed of conductive thin wires. The first electrode pattern 30 includes first conductive patterns 34 that extend in a first direction (X direction) and are arranged in parallel in a second direction (Y direction) orthogonal to the first direction. The second electrode pattern 32 includes a second conductive pattern 36 extending in the second direction (Y direction) and arranged in parallel in the first direction (X direction).

Each first conductive pattern 34 is electrically connected to the first electrode terminal 38 at one end thereof. Further, each first electrode terminal 38 is electrically connected to the conductive first wiring 40. Each second conductive pattern 36 is electrically connected to the second electrode terminal 42 at one end thereof. Each second electrode terminal 42 is electrically connected to the conductive second wiring 44. The first wiring 40 and the second wiring 44 are each connected to an external detection circuit (not shown). The external detection circuit is configured by an IC circuit or the like, and detects a change in the value of capacitance between the first conductive pattern 34 and the second conductive pattern 36 caused by touching a finger or the like, and is touched. The coordinates of are specified.
The 1st conductive pattern 34 and the 2nd conductive pattern 36 are comprised with the electroconductive thin wire 14, and contain the some square-shaped grating | lattice 16 comprised with the electroconductive thin wire 14 which cross | intersects as shown in FIG. The lattice 16 includes an opening region surrounded by the thin conductive wires 14. The lattice has a lattice pitch Pa of 200 to 400 μm (preferably 150 to 300 μm).

When the touch panel including the conductive film 200 is touched with a finger or the like, the capacitance value between the first conductive pattern 34 and the second conductive pattern 36 changes. This change in capacitance value is detected by an external detection circuit, and the coordinates of the touched point are specified.
Note that a transparent double-sided PSA sheet and a protective substrate may be further bonded onto the first electrode pattern 30 and the second electrode pattern 32 of the conductive film 200.
Moreover, although it was the aspect which has an electrode on both surfaces of one base material in the conductive film 200, another aspect may be sufficient as a conductive film for touchscreens. For example, two conductive films including a support and an electrode pattern composed of conductive thin wires arranged on one side of the support are prepared, and a transparent double-sided adhesive sheet is interposed so that the electrode patterns face each other. A laminated conductive film obtained by laminating is mentioned. As yet another aspect, two conductive films comprising a support and an electrode pattern composed of conductive thin wires arranged on one side of the support are prepared, and the electrode pattern of one conductive film, The laminated conductive film obtained by laminating | stacking through a transparent double-sided adhesive sheet so that the support body of the other conductive film may oppose is mentioned.

In addition, as described above, in recent years, it has been required to narrow the width of the frame portion of the touch panel (narrow frame). Hereinafter, the narrowing of the frame will be described with reference to FIG. FIG. 6A is a schematic plan view of a part of a general touch panel member.
A touch panel member 300 illustrated in FIG. 6A includes a conductive film 46 and a flexible circuit 48 that is bonded to a predetermined position of the conductive film 46.
The conductive film 46 is provided with a transparent electrode layer 52 on one surface side of the transparent support 50. The transparent electrode layer 52 is formed in a pattern in which a plurality of diamond shapes aligned on the transparent support 50 are linearly connected in one direction. The transparent electrode layer 52 is provided with a plurality of lead wires 54 that are electrically connected. A conductor (not shown) is provided at the end of the lead wiring 54 and is electrically connected to a terminal (not shown) in the flexible circuit 48.
The transparent support 50 includes an active area 56 that functions as a sensing unit (sensor unit) that can be visually recognized by a touch panel user and can detect a touch position in an area where the transparent electrode layer 52 is provided. On the other hand, the outside is an inactive area 58. The frame portion of the touch panel corresponds to the inactive area 58. Usually, since the lead wiring 54 and the flexible circuit 48 exist in the inactive area 58 as described above, it is difficult to narrow the area.

On the other hand, the conductive film of the present invention is excellent in flexibility, and there is little deterioration of the conductive characteristics of the conductive thin wire even when it is bent. Therefore, if the conductive film is used, the touch panel member can be produced without using a flexible circuit. Hereinafter, the touch panel member using the conductive film of the present invention will be described with reference to FIG.
A touch panel member (a conductive film for touch panel) 400 in FIG. 6B includes a support 12 and an electrode pattern portion 60 and a terminal wiring portion 62 provided on the support 12. The electrode pattern part 60 is composed of a plurality of electrodes 64, functions as a sensor, and corresponds to an active area that can be visually recognized by a touch panel user. Note that the electrode 64 is formed in a pattern that connects a plurality of diamond shapes linearly in one direction, as in FIG. Further, the electrode 64 includes a plurality of intersecting conductive thin wires 14 as shown in FIG. 4, and has a pattern in which a plurality of square-shaped opening regions formed in a mesh shape by the conductive thin wires 14 are arranged. The terminal wiring part 62 includes a lead wiring 66 having one end connected to the electrode 64 and the other end connected to a terminal (not shown) connected to an external control circuit. The lead wiring 66 is composed of the conductive thin wire.
In the touch panel member 400 of FIG. 6B, unlike FIG. 6A, the flexible circuit is not provided, and the lead wiring 66 extends to the extended portion 68 extending from the support 12.
As shown in FIG. 6C, the touch panel member 400 is integrally folded back about 180 ° along the planned folding line 70 indicated by a broken line, as shown in FIG. 68 is disposed on the back side of the support 12. If it is this aspect, the area | region in which the lead wiring 66 exists on the support body 12 surface will become small, and a narrow frame can be achieved.
In this aspect, since at least the lead wiring 66 is composed of the conductive thin wire 14 described above, even in the bent state as shown in FIG. Characteristics can be shown. Therefore, even if there is no flexible circuit, it can function as a conductive film for a touch panel.

That is, one of the preferred embodiments of the conductive film of the present invention shown in FIG. 6C is a support, an electrode pattern part formed on the support and functioning as a sensor, and a pattern electrode pattern on the support. A conductive film for a touch panel having a terminal wiring portion comprising a lead wiring connected to an electrode connected to an external control circuit and having one end connected to an external control circuit, wherein at least the lead wiring includes a binder and a metal And the Young's modulus of the lead wire is 5.5 GPa or less, and the height a from the support surface of the lead wire and the position that is farthest from the support surface in the vertical direction in the cross section perpendicular to the surface of the lead wire For the touch panel, the height b to the metal in the lead wiring satisfies the relationship of the following formula (X), and the support and the lead wiring are bent as a unit A conductive film.
Formula (X) b / a ≦ 0.975

[Method for producing conductive film]
The manufacturing method in particular of the said conductive film 10 is not restrict | limited, A well-known method is employable.
For example, a paste containing a binder and metal fine particles can be printed on the support 12 to obtain the conductive thin wires 14 having a desired pattern. For printing, for example, a screen printing method or a gravure printing method is used.
Alternatively, the conductive thin wire 14 may be formed by ejecting a paste containing a binder and metal fine particles onto the support 12 by inkjet in an image-like manner.

In addition, in order to satisfy | fill the relationship of Formula (X) mentioned above, after forming a conductive fine wire once as needed, you may coat | cover a conductive fine wire with a binder further. By further covering the conductive fine wire with the binder, it is possible to prevent the metal from being exposed on the surface of the conductive fine wire, and the relationship of the above-described formula (X) can be satisfied.
In order to perform coating with a binder, a known method such as ink jet, screen printing, or gravure printing can be used.

  As another method for producing the conductive film 10, for example, a desired metal is deposited on the support 12 by sputtering or the like, and then the metal deposited by ink jet, screen printing or gravure printing is used as a binder. For example, a method of obtaining the conductive thin wire 14 by covering it may be used.

  Further, in addition to the above method, a method using silver halide is mentioned as a method for producing a conductive film. The method will be described in detail in a second embodiment described later.

<Second Embodiment>
Below, the 2nd embodiment of the conductive film of this invention is described with reference to drawings. In FIG. 7, sectional drawing of the 2nd embodiment of the electrically conductive film of this invention is shown.
The conductive film 100 shown in FIG. 7 is provided with a support 12, a conductive thin wire 14 disposed on the support 12, and a transparent resin layer 72 disposed between the conductive thin wires 14 on the support 12.
Since the conductive film 100 shown in FIG. 7 has the same configuration as the conductive film 10 shown in FIG. 1 except that the transparent film 72 is provided, the same reference numerals are assigned to the same components. The description thereof will be omitted, and the transparent resin layer 72 will be mainly described below.

[Transparent resin layer]
The transparent resin layer 72 is a layer disposed between the conductive thin wires 14 on the support 12. Due to the presence of the transparent resin layer 72, transparency can be secured even when a metal is used as the conductive thin wire, and the total light transmittance can be improved by increasing the area of the transparent resin layer 72. .

  The material constituting the transparent resin layer 72 is not particularly limited as long as the formed layer is transparent, and examples thereof include the binder described above.

The transparent resin layer 72 may contain materials other than the binder, and examples thereof include a silver difficult solvent.
By including the silver difficult solvent in the transparent resin layer 72, metal ion migration between the conductive thin wires 14 can be further suppressed. As a silver difficult solvent, it is preferable that pKsp is 9 or more, and it is more preferable that it is 10-20. Although it does not specifically limit as a silver difficult solvent, For example, TTHA (triethylenetetramine hexaacetic acid) etc. are mentioned.
The solubility product Ksp of silver is a measure of the strength of interaction of these compounds with silver ions. The measurement method of Ksp is “Kiken Sakaguchi / Shinichi Kikuchi, Journal of the Japan Photography Society, 13, 126, (1951)” and “A. Paliofet and J. Pauladier, Bull. Soc. Chim. France, 1982, I-445 ( 1982) ".

[Method for producing conductive film]
The manufacturing method in particular of the conductive film 100 is not restrict | limited, A well-known method is employable.
For example, after a paste containing a binder and metal fine particles is printed on the support 12 to obtain the conductive fine wires 14 having a desired pattern, the paste containing the binder is applied to the support 12 on which the conductive fine wires 14 are not formed. And a method of forming the transparent resin layer 72 by printing in the region.
Among them, the method of forming a conductive fine wire by applying an emulsion layer containing silver halide, exposing and developing, is superior in productivity and the flexibility of the resulting conductive film is superior. preferable. Below, the method using silver halide is explained in full detail.

As a first aspect of the method using silver halide, for example, a step (1) of forming a photosensitive layer containing silver halide and a binder on a support, after pattern exposure of the photosensitive layer , A step (2) of forming a conductive thin wire containing metallic silver by developing, and a step (3) of forming a transparent resin layer between the conductive thin wires by performing a heat treatment after the developing treatment Is preferred.
Below, each process is demonstrated.

(Process (1): Photosensitive layer forming process)
Step (1) is a step of forming a photosensitive layer containing silver halide and a binder on the support.
The method for forming the photosensitive layer is not particularly limited, but from the viewpoint of productivity, the photosensitive layer forming composition containing silver halide and a binder is brought into contact with the support, and the photosensitive layer is formed on the support. The forming method is preferred.
Below, after explaining in full detail the aspect of the composition for photosensitive layer formation used by this method, the procedure of a process is explained in full detail.

(Materials included in photosensitive layer forming composition)
The photosensitive layer forming composition contains a silver halide and a binder.
The halogen element contained in the silver halide may be any of chlorine, bromine, iodine and fluorine, or a combination thereof. As the silver halide, for example, a silver halide mainly composed of silver chloride, silver bromide or silver iodide is preferably used, and further a silver halide mainly composed of silver bromide or silver chloride is preferably used.
The kind of binder used is as above-mentioned. Moreover, the binder may be contained in the composition for photosensitive layer formation in the form of latex.
The volume ratio of the silver halide and the binder contained in the composition for forming the photosensitive layer is not particularly limited, and is appropriately adjusted so as to be within a preferable volume ratio range of the metal and the binder in the conductive thin wire described above. The

The composition for forming a photosensitive layer contains a solvent, if necessary.
Examples of the solvent used include water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, sulfoxides such as dimethyl sulfoxide, esters such as ethyl acetate, ethers, and the like. Etc.), ionic liquids, or mixed solvents thereof.
The content of the solvent used is not particularly limited, but is preferably in the range of 30 to 90% by mass and more preferably in the range of 50 to 80% by mass with respect to the total mass of the silver halide and the binder.

  In the composition for photosensitive layer formation, other materials other than the material mentioned above may be contained as needed. Examples thereof include metal compounds belonging to Group VIII and VIIB such as rhodium compounds and iridium compounds used for stabilizing silver halide and increasing sensitivity. Further, as described in paragraphs [0220] to [0241] of Patent Document 1, an antistatic agent, a nucleation accelerator, a spectral sensitizing dye, a surfactant, an antifoggant, a hardener, and a black pot. Examples thereof include inhibitors, redox compounds, monomethine compounds, and dihydroxybenzenes.

(Process procedure)
The method for bringing the composition for forming a photosensitive layer and the support into contact with each other is not particularly limited, and a known method can be adopted. For example, the method of apply | coating the composition for photosensitive layer formation on a support body, the method of immersing a support body in the composition for photosensitive layer formation, etc. are mentioned.
The content of the binder in the formed photosensitive layer is not particularly limited, but is preferably 0.3 to 5.0 g / m ² in terms of obtaining a conductive thin wire with more flexibility. 2.0 g / m ² is more preferable.
Further, the content of the silver halide in the photosensitive layer is not particularly limited, but is preferably 1.0 to 20.0 gm ^{2 in} terms of silver, and preferably 5.0 to 15 in that the conductive characteristics of the conductive fine wire are more excellent. 0.0 g / m ² is more preferable.

In step (1), after the photosensitive layer forming composition containing silver halide and a binder is brought into contact with the support, a composition containing no binder and further containing a binder, You may make it contact on the support body in which the layer of the composition for photosensitive layer formation was provided, and may form a photosensitive layer.
By carrying out the above procedure, the binder is easily exposed on the surface in the photosensitive layer, and the conductive fine wire formed is prevented from being scratched and improved in mechanical properties. In addition, by performing this treatment, the conductive thin wire easily satisfies the relationship of the above-described formula (X) b / a ≦ 0.975.

(Process (2): Exposure development process)
Step (2) is a step of forming a conductive thin wire containing metallic silver by patterning the photosensitive layer obtained in step (1) and then developing the photosensitive layer.
First, the pattern exposure process will be described in detail below, and then the development process will be described in detail.

(Pattern exposure)
By subjecting the photosensitive layer to pattern exposure, the silver halide in the photosensitive layer in the exposed region forms a latent image. In the area where the latent image is formed, conductive thin lines are formed by a development process described later. On the other hand, in an unexposed area that has not been exposed, the silver halide dissolves and flows out of the photosensitive layer during the fixing process described later, and a transparent film is obtained.
The light source used in the exposure is not particularly limited, and examples thereof include light such as visible light and ultraviolet light, and radiation such as X-rays.
The method for performing pattern exposure is not particularly limited. For example, surface exposure using a photomask may be performed, or scanning exposure using a laser beam may be performed. The shape of the pattern is not particularly limited, and is appropriately adjusted according to the pattern of the conductive fine wire to be formed.

In addition, when providing a photosensitive layer on both surfaces of a support body and exposing it, you may perform simultaneous exposure with respect to the photosensitive layer of both surfaces (double-sided simultaneous exposure). In this exposure process, the first photosensitive layer disposed on one main surface of the support is irradiated with light toward the support to expose the first photosensitive layer along the first exposure pattern. The first exposure process and the second photosensitive layer disposed on the other main surface of the support are irradiated with light toward the support to expose the second photosensitive layer along the second exposure pattern. Second exposure processing is performed.
More specifically, the first photosensitive layer is irradiated with the first light (parallel light) through the first photomask while the long photosensitive material is conveyed in one direction, and the second photosensitive layer is irradiated with the first photosensitive layer. The second light (parallel light) is irradiated through the second photomask. The first light is obtained by converting the light emitted from the first light source into parallel light by the first collimator lens in the middle, and the second light is obtained by converting the light emitted from the second light source in the middle of the first light. It is obtained by being converted into parallel light by a two-collimator lens.

  In the first exposure process and the second exposure process, the emission timing of the first light from the first light source and the emission timing of the second light from the second light source may be simultaneous or different. At the same time, the first photosensitive layer and the second photosensitive layer can be exposed simultaneously by one exposure process, and the processing time can be shortened. By the way, when both the first photosensitive layer and the second photosensitive layer are not spectrally sensitized, exposure from one side affects the image formation on the other side (back side).

  That is, the first light from the first light source that has reached the first photosensitive layer is scattered by the silver halide grains in the first photosensitive layer, passes through the insulating layer as scattered light, and a part thereof is the first light. Up to 2 photosensitive layers. If it does so, the boundary part of a 2nd photosensitive layer and a support body will be exposed over a wide range, and a latent image will be formed. Therefore, in the second photosensitive layer, exposure by the second light from the second light source and exposure by the first light from the first light source are performed, and when the subsequent development processing is performed, the second exposure pattern In addition to the conductive pattern, a thin conductive layer is formed between the conductive patterns by the first light from the first light source, and a desired pattern (pattern along the second exposure pattern) cannot be obtained. The same applies to the first photosensitive layer.

In order to avoid this, as a result of intensive studies, the thicknesses of the first photosensitive layer and the second photosensitive layer are set within a specific range, and the coating silver amount of the first photosensitive layer and the second photosensitive layer is specified. By doing so, it was found that the silver halide itself absorbs light and can limit light transmission to the back surface. The thickness of the first photosensitive layer and the second photosensitive layer can be set to 1 μm or more and 4 μm or less. The upper limit is preferably 2.5 μm. Moreover, the coating silver amount of the 1st photosensitive layer and the 2nd photosensitive layer was prescribed | regulated to 5-20 g / m < ² >.

  In the above-described double-sided exposure method, there is a problem of image defects due to exposure inhibition due to dust or the like adhering to the sheet surface. It is known to apply a conductive material to the sheet as a dust prevention, but metal oxides remain after processing, impairing the transparency of the final product, and conductive polymers are storable. There is a problem. Thus, as a result of intensive studies, it was found that the silver halide with a reduced amount of binder provided the necessary conductivity for antistatic, and the volume ratio of silver / binder in the first photosensitive layer and the second photosensitive layer was defined. . That is, the silver / binder volume ratio of the first photosensitive layer and the second photosensitive layer is 1/1 or more, and preferably 2/1 or more.

  As described above, by setting and defining the thickness of the first photosensitive layer and the second photosensitive layer, the amount of coated silver, and the volume ratio of silver / binder, the first photosensitive layer reaches the first photosensitive layer from the first light source. The first light does not reach the second photosensitive layer. Similarly, the second light from the second light source that has reached the second photosensitive layer does not reach the first photosensitive layer. As a result, a desired pattern can be obtained when subsequent development processing is performed.

(Development processing)
The development processing method is not particularly limited, and a known method can be employed. For example, the usual development processing technique used for silver salt photographic film, photographic paper, film for printing plate making, emulsion mask for photomask, and the like can be used.
The type of the developer used in the development process is not particularly limited. For example, PQ developer, MQ developer, MAA developer and the like can be used. Commercially available products include, for example, CN-16, CR-56, CP45X, FD-3, Papitol, C-41, E-6, RA-4, D-19, D-72 prescribed by KODAK. Or a developer contained in a kit thereof can be used. A lith developer can also be used.
The development process can include a fixing process performed for the purpose of removing and stabilizing the silver salt in the unexposed part. For the fixing process, a technique of fixing process used for silver salt photographic film, photographic paper, printing plate-making film, photomask emulsion mask and the like can be used.
The fixing temperature in the fixing step is preferably about 20 ° C. to about 50 ° C., and more preferably 25 to 45 ° C. The fixing time is preferably 5 seconds to 1 minute, and more preferably 7 seconds to 50 seconds.
The mass of the metallic silver contained in the exposed area (conductive thin wire) after the development treatment is preferably a content of 50% by mass or more based on the mass of silver contained in the exposed area before the exposure, More preferably, it is at least mass%. If the mass of silver contained in the exposed portion is 50% by mass or more based on the mass of silver contained in the exposed portion before exposure, it is preferable because high conductivity can be obtained.

(Process (3): Heating process)
Step (3) is a step in which a heat treatment is performed after the development processing to form a transparent resin layer between the conductive thin wires. By carrying out this step, fusion occurs between the binders, and a transparent resin layer having a predetermined hardness is formed. In particular, when polymer particles are dispersed in the composition for forming a photosensitive layer, by performing this step (3), fusion occurs between the polymer particles, and a transparent resin layer is formed.
The conditions for the heat treatment are appropriately selected depending on the resin used, but it is preferably 40 ° C. or higher from the viewpoint of the film forming temperature of the polymer particles, more preferably 50 ° C. or higher, and further 60 ° C. or higher. preferable. Further, from the viewpoint of curling of the support, 150 ° C. or lower is preferable, and 100 ° C. or lower is more preferable.
The heating time is not particularly limited, but it is preferably 1 to 5 minutes, more preferably 1 to 3 minutes, from the viewpoint of productivity where the base does not curl.
In addition, since this heat treatment can be combined with a drying step usually performed after exposure and development processing, it is not necessary to increase a new step for film formation of polymer particles, and productivity, cost, etc. Excellent from a viewpoint.

(Other: Any process)
In addition to the steps (1) to (3), other steps may be performed as necessary.
Below, other processes are illustrated.
(Binder coating process)
After the step (2) or after the step (3), a step of further covering the conductive thin wire with a binder may be performed as necessary. By further covering the conductive fine wires with the binder, the conductive fine wires can be prevented from being scratched and the mechanical properties can be improved, and the relationship of the above formula (X) can be easily satisfied.
The kind of binder used is as above-mentioned.
The method for coating with a binder is not particularly limited, and examples thereof include a method of coating a composition containing a binder on a conductive fine wire.

Although the 1st aspect of the method using a silver halide was explained in full detail above, the aspect which manufactures a conductive film using a silver halide is not limited to this.
For example, the following 2nd aspect and 3rd aspect are mentioned.
(Second aspect)
A process of forming a photosensitive layer containing silver halide, physical development nuclei and a binder on a support, and after pattern exposure of the photosensitive layer, a conductive thin line containing metallic silver is formed by development processing The manufacturing method of a conductive sheet which has the process of implementing heat processing after the process to perform, and a development process, and forming a transparent resin layer between electroconductive fine wires.
(Third aspect)
A step of forming a non-photosensitive layer containing a physical development nucleus and a binder on a support, a step of forming a photosensitive layer containing silver halide and a binder on the non-photosensitive layer, and patterning the photosensitive layer After the exposure, there is a step of forming a conductive thin wire containing metallic silver by diffusion transfer development processing, a step of removing the photosensitive layer, and a step of performing a heat treatment to form a transparent resin layer between the conductive thin wires. The manufacturing method of a conductive sheet.

  The conductive film which is the second embodiment described above can also be applied to various uses such as a touch panel, an electromagnetic wave shield, and a planar heating element, similarly to the first embodiment described above.

  The conductive sheet according to the present invention is not limited to the above-described embodiment, and it is needless to say that various configurations can be adopted without departing from the gist of the present invention. Moreover, it combines suitably with the technique disclosed by Unexamined-Japanese-Patent No. 2011-113149, Unexamined-Japanese-Patent No. 2011-129501, Unexamined-Japanese-Patent No. 2011-129112, Unexamined-Japanese-Patent No. 2011-134311, Unexamined-Japanese-Patent No. 2011-175628, etc. Can be used.

<Third Embodiment>
Below, the 3rd embodiment of the electrically conductive film of this invention is demonstrated with reference to drawings. FIG. 8A shows a plan view of the third embodiment of the conductive film of the present invention, and FIG. 8B shows a cross-sectional view taken along line CD in FIG. 8A.
Note that in the conductive film 500 illustrated in FIG. 8A, the same components as those of the conductive film 200 for a touch panel illustrated in FIG. 5 are denoted by the same reference numerals, and description thereof is omitted.

A conductive film 500 illustrated in FIG. 8A is used for a touch panel in the same manner as the conductive film 200 illustrated in FIG. 5. The conductive film 500 includes the support 12, the conductive thin wire 14 disposed on the support 12, the first electrode terminal 38, the first wiring 40, the second electrode terminal 42, and the second wiring 44. Have.
The support 12 includes a first conductive region 502, a bent region 504 extending from the first conductive region 502, and a linear first electrode that electrically connects the first conductive region 502 to an external circuit or the like. 2 conductive regions 506 and an L-shaped second conductive region 508 that is electrically connected to an external circuit or the like.
The first conductive region 502, the bent region 504, and the second conductive regions 506 and 508 are integrally formed. The first conductive region 502 and the bent region 504 are, for example, rectangular. In the conductive film 500, the first conductive region 502 is horizontally long.

The bending area 504 is a part that becomes a frame when used in a device such as a touch panel.
As described above, the end portions of the second conductive regions 506 and 508 are electrically joined to various external circuits. In this embodiment, the two second conductive regions 506 and 508 are provided. However, the number of the second conductive regions is not particularly limited, and may be one or three or more. .

Further, the arrangement positions and shapes of the two second conductive regions 506 and 508 are not particularly limited. The shapes of the second conductive region 506 and the second conductive region 508 may be reversed.
The second conductive regions 506 and 508 are preferably shorter than the first conductive region 502. Furthermore, the second conductive regions 506 and 508 are preferably shorter from the viewpoint of cost for forming the wiring.
In addition, it is preferable that the arm length of the second conductive region 508 is shorter than the distance from the bending line 19b to the second conductive region 506. Thereby, space can be utilized efficiently. In addition, it is preferable that the length L of the bending area 504 in the extending direction D has a length that is equal to or greater than the total thickness of the frame and the casing.

Also in this embodiment, for example, it is a conductive film used for a projected capacitive touch panel, and electrodes are formed on both surfaces of a single substrate.
On the surface 12 a side of the support 12, the second electrode pattern 32 composed of the conductive thin wires 14 is provided in the first conductive region 502. The second electrode pattern 32 includes second conductive patterns 36 extending in the second direction (Y direction) and arranged in parallel in the first direction (X direction). In addition, although the 2nd conductive pattern 36 is shown as one line in FIG.8 (B), it is comprised by the some electroconductive thin wire 14 so that it may mention later.
A second electrode terminal 42 electrically connected to one end of each second conductive pattern 36 is provided in the first conductive region 502. Furthermore, conductive second wirings 44 that are electrically connected to the respective second electrode terminals 42 are provided in the bent region 504 and the second conductive region 506. The conductive thin wire 14, the second electrode terminal 42, and the second wiring 44 are continuously formed of the same material.

On the other hand, on the back surface 12 b side of the support 12, the first electrode pattern 30 composed of the conductive thin wires 14 is provided in the first conductive region 502. The first electrode pattern 30 includes first conductive patterns 34 that extend in the first direction (X direction) and are arranged in parallel in a second direction (Y direction) orthogonal to the first direction. In addition, although the 1st conductive pattern 34 is shown as one line in FIG.8 (B), it is comprised by the some electroconductive thin wire 14 as mentioned later.
A first electrode terminal 38 electrically connected to one end of each first conductive pattern 34 is provided in the first conductive region 502. Further, conductive first wirings 40 that are electrically connected to the first electrode terminals 38 are provided in the bent region 504 and the second conductive region 508. The conductive thin wire 14, the first electrode terminal 38, and the first wiring 40 are continuously formed of the same material.

When the conductive film 500 is used for a touch panel, a region where the first conductive pattern 34 and the second conductive pattern 36 intersect in the first conductive region 502 is a sensing region (sensor unit) that detects the touch position. is there.
Note that the conductive thin wire 14 can be the same as the conductive film 200 illustrated in FIG.
The first wiring 40 formed in the second conductive region 508 and the second wiring 44 formed in the second conductive region 506 are each connected to an external circuit configured by an IC circuit or the like.
The external circuit (IC circuit) detects a change in the capacitance value between the first conductive pattern 34 and the second conductive pattern 36 when the sensing area (sensor part) of the conductive film 500 is touched with a finger or the like. Then, the coordinates of the touched point are specified, that is, the position calculation of the touched point is performed.

Next, the first conductive pattern 34 and the second conductive pattern 36 will be described.
Since the first conductive pattern 34 and the second conductive pattern 36 are the same patterns as those shown in FIG. 1 of Japanese Patent Application Laid-Open No. 2012-14669, detailed description thereof is omitted.

As shown in FIG. 9, the first conductive pattern 34 is composed of the conductive thin wires 14, and electrically connects the plurality of conductive first large lattices 520 and the adjacent first large lattices 520. The first connection part 522 is configured. Each first large lattice 520 is configured by combining two or more small lattices 524. A plurality of first large lattices 520 are connected in the X direction (first direction). Although not shown, the end portion of the first large lattice 520 existing on the other end side of the first conductive pattern 34 is electrically connected to the first electrode terminal 38.
The first conductive pattern 34 can reduce electrical resistance, and when applied to a projected capacitive touch panel, the response speed can be increased and the touch panel can be increased in size.

The first conductive pattern 34 and the second conductive pattern 36 are the same pattern. The second conductive pattern 36 has a plurality of first large lattices 520 connected in the Y direction (second direction). Although not shown, the end portion of the second conductive pattern 36 is electrically connected to the second electrode terminal 42.
In the first conductive region 502 of the conductive film 500, the first conductive pattern 34 and the second conductive pattern 36 are arranged as shown in FIG. Since this arrangement form is the same as the form shown in FIG. 7 of Japanese Patent Application Laid-Open No. 2012-14669, detailed description thereof is omitted.

As shown in FIG. 8A, in the folding region 504, when a rectangle 510 having a unit area is applied to the end 504a, the area of the bending region 504b included in the rectangle 510 is larger than the unit area of the rectangle 510. small. For example, as shown in FIG. 8A, the three end portions 504a are cut out in a triangular shape, and a slope 511 is formed. That is, the bent region 504 has no corners. Thereby, space saving can be achieved.
Note that the area of the bent region 504b included in the rectangle 510 is preferably 80% or less, more preferably 60% or less, with respect to the unit area of the rectangle 510.
The bent region 504 is not limited to the end portion 504a being cut out in a triangular shape, and may be cut out in an arc shape. Further, at least one corner of the bent region 504 may be cut off.

Bending lines 509 a and 509 b are formed at the boundary between the first conductive region 502 and the bending region 504. The folding region 504 is bent based on the folding lines 509a and 509b.
For example, when the bending region 504 to which the second conductive region 506 is connected is bent, the bending region 504 is bent so as to form a corner as shown in FIG. In this case, the first conductive region 502, the bent region 504, and the second conductive regions 506 and 508 are integrally formed, and the conductive thin wire 14 is continuously formed of the same material. Therefore, the adhesiveness is high, and there is no problem such as peeling at the connecting portion when bent, and the signal transmission reliability is excellent. Thereby, the conductive film 500 of this embodiment does not easily cause disconnection or increase in resistance, and exhibits desired conductive characteristics.
Note that the length L in the extending direction D is set in the folding region 504 so that a predetermined distance d is provided between the first conductive region 502 and the second conductive region 506 when being bent. The

  In the present embodiment, the end portion 504a of the bent region 504 is made smaller than the area of the rectangle 510 described above. As a result, as shown in FIG. 11B, the folding region 504 to which the second conductive region 506 is connected is bent so that the folding line 509b is a corner, and the second conductive region 508 is connected. When the folding region 504 is folded so that the folding line 509a has a corner, it can be folded without interfering with each other. Therefore, it is possible to provide a conductive film, a touch panel, and a display device that can save space when folded and can reduce the size of portable communication devices such as smartphones and tablet PCs. In addition, the first conductive region 502, the bent region 504, and the second conductive regions 506, 508 are integrally formed, and the frame can be narrowed by bending the bent region 504. it can.

  The shape of the conductive film is not particularly limited, and the first conductive region 502 may be vertically long like a conductive film 500a shown in FIG. Note that the conductive film 500a illustrated in FIG. 12 is different from the conductive film 500 illustrated in FIG. 8A only in the shape of the first conductive region 502, and other configurations are similar to those in FIG. Since it is the structure similar to the conductive film 500 shown to (B), the detailed description is abbreviate | omitted.

<Fourth embodiment>
Below, the 4th embodiment of the electrically conductive film of this invention is demonstrated with reference to drawings. FIG. 13 (A) shows a plan view of the fourth embodiment of the conductive film of the present invention, and FIG. 13 (B) shows a cross-sectional view taken along line EF in FIG. 13 (A). In FIG. 14, the fragmentary sectional view of the 2nd electroconductive area | region of the electroconductive film of the 4th embodiment of this invention is shown.
In addition, in the conductive film 500b shown to FIG. 13 (A) and (B), the same referential mark is attached | subjected to the same component as the conductive film 500 shown to FIG. 8 (A) and (B), and the description is given. Omitted.
In the conductive film 500b shown in FIGS. 13A and 13B, the first migration prevention layer 550 is formed in the first conductive region 502, and the bent region 504 and the second conductive regions 506 and 508 are formed. Except for the point that the second migration prevention layer 552 is formed, the configuration is the same as that of the conductive film 500 shown in FIGS. 8A and 8B, and thus detailed description thereof is omitted.

As shown in FIG. 13B, the first migration prevention layer 550 is formed on the surface 12 a side of the support 12 so as to cover the second conductive pattern 36.
In addition, a first migration prevention layer 550 is formed on the back surface 12 b side of the support 12 so as to cover the first conductive pattern 34.
Further, as shown in FIG. 14, in the second conductive region 506, a second migration prevention layer 552 is formed on the surface 12 a side of the support 12 so as to cover the second wiring 44.
Although not shown, in the second conductive region 508, a second migration prevention layer 552 is formed on the back surface 12b side of the support 12 so as to cover the first wiring 40.
In the bent region 504, for the first wiring 40, a second migration prevention layer 552 is formed on the back surface 12b side of the support 12 so as to cover the first wiring 40.
In the bent region 504, the second migration prevention layer 552 is formed on the second wiring 44 so as to cover the second wiring 44 on the surface 12 a side of the support 12.

  Since the bent region 504 and the second conductive regions 506 and 508 are arranged in the frame region, migration is likely to occur. For this reason, it is necessary to increase the migration countermeasures of the bent region 504 and the second conductive regions 506 and 508 rather than the first conductive region 502. For example, the first migration prevention layer 550 and the second migration prevention layer 552 are required. Have different migration prevention capabilities. It is preferable that the second conductive regions 506 and 508 have higher migration prevention capability than the first conductive region 502. In this case, the second migration prevention layer 552 has a higher content of migration inhibitor than the first migration prevention layer 550. Here, the migration inhibitor is a compound of the metal ion diffusion suppression layer forming composition shown below.

Next, the first migration prevention layer 550 and the second migration prevention layer 552 will be described.
The first migration prevention layer 550 and the second migration prevention layer 552 are formed of, for example, a metal ion diffusion suppression layer forming composition. In this case, the first migration prevention layer 550 and the second migration prevention layer 552 are composed of metal ion diffusion suppression layers.
When formed with the metal ion diffusion suppression layer forming composition, the conductive thin wire 14 is preferably mainly composed of silver or a silver alloy. When the conductive thin wire 14 is made of a silver alloy, examples of the metal contained other than silver include tin, palladium, gold, nickel, and chromium. In addition, in the electroconductive fine wire 14, in the range which does not impair the effect of this invention, resin components, such as a binder, a photosensitive compound, etc. may be contained, and other components are further contained as needed. Also good.

First, the metal ion diffusion suppression layer forming composition will be described in detail.
<Composition for forming metal ion diffusion suppression layer>
A composition for forming a metal ion diffusion suppression layer (composition for forming a migration suppression layer. Hereinafter, also simply referred to as a composition) is formed on a metal wiring containing silver or a silver alloy (hereinafter also simply referred to as a metal wiring). It is a composition for forming the metal ion diffusion suppression layer (migration suppression layer) which suppresses ion migration. Below, the component contained in a composition is explained in full detail.

(Insulating resin)
The composition contains an insulating resin. The insulating resin covers the metal wiring and is disposed between the metal wirings, thereby ensuring the insulation between the metal wirings.
As the insulating resin to be used, a known insulating resin can be used, and curable insulating resin (for example, thermosetting insulating resin and It is preferable to use a photocurable insulating resin.

Examples of the thermosetting insulating resin include epoxy resin, bismaleimide triazine resin, polyimide resin, acrylic resin, phenol resin, melamine resin, silicon resin, unsaturated polyester resin, cyanate ester resin, isocyanate resin, and modified products thereof. Examples thereof include resins.
Examples of the photocurable insulating resin include unsaturated polyester resins, polyester acrylate resins, urethane acrylate resins, silicone acrylate resins, epoxy acrylate resins, and modified resins thereof.
Other insulating resins include, for example, polyethylene (PE), polypropylene (PP), ethylene-vinyl acetate copolymer (EVA), ethylene-ethyl acrylate copolymer (EEA), polylactic acid, fluorine-containing resin, poly Thermoplastic resins such as ether sulfone resin, polyphenylene sulfide resin, and polyether ether ketone resin are also included.
Especially, an epoxy resin and an acrylic resin are preferable at the point which is more excellent in compatibility with the compound mentioned later.

If necessary, an insulating resin may be impregnated into a core material such as a glass woven fabric, a glass nonwoven fabric, or an aramid nonwoven fabric. Specifically, a glass cloth epoxy resin, a glass cloth bismaleimide triazine resin, a glass cloth polyphenylene ether resin, an aramid nonwoven fabric-epoxy resin, an aramid nonwoven fabric-polyimide resin, or the like may be used.
Furthermore, when the insulating resin is a curable resin, a curing agent, a curing accelerator, or the like may be used in combination as necessary.
Note that two or more insulating resins may be mixed and used as the insulating resin.

  The content of the insulating resin in the composition is not particularly limited, and an optimal amount is appropriately selected. For example, when the composition contains a solvent, the content of the insulating resin is 15 to 80 with respect to the total amount of the composition because the handling is easier and the film thickness of the metal ion diffusion suppressing layer is easily controlled. % By mass is preferable, and 20 to 75% by mass is more preferable.

(Compound)
The composition contains a compound having a structure selected from the group consisting of a triazole structure, a thiadiazole structure, and a benzimidazole structure, a mercapto group, and a specific functional group (hereinafter also referred to as an SH group-containing compound). This SH group-containing compound mainly contacts with the metal wiring through the SH group, and suppresses corrosion of the metal wiring and is also dispersed in the metal ion diffusion suppressing layer to suppress generation of silver ion migration. .

The SH group-containing compound includes a structure selected from the group consisting of a triazole structure, a thiadiazole structure, and a benzimidazole structure. Among these, a triazole structure and a thiadiazole structure are preferable in that the ion migration suppressing ability is more excellent.
In general, it is known that a mercapto group is rich in reactivity to form a covalent bond with silver. The compound X that does not contain the triazole structure, thiadiazole structure, benzimidazole structure, and the like and contains an SH group can form a salt with a silver ion via the SH group, similarly to the SH group-containing compound. However, if the salt formed from the compound X and silver ions is in a composition that is in direct contact with a metal wiring containing silver or a silver alloy, the metal wiring may be greatly affected, such as melting the wiring. On the other hand, in the case of the SH group-containing compound having the above-mentioned predetermined structure, the influence on the metal wiring is suppressed, and the effect of suppressing silver ion migration is excellent.

  In addition, when this structure is illustrated more specifically, it can be represented by the following formulas (X) to (Z), respectively.

The SH group-containing compound includes a mercapto group (HS-). Mercapto groups are highly reactive to form covalent bonds with silver. This mercapto group is bonded to a structure such as the triazole structure.
The amount of mercapto groups in the SH group-containing compound is not particularly limited, but the ratio of the total amount of mercapto groups to the total molecular weight of the compound is based on the better dispersibility of the compound in the insulating resin. It is preferably 50% or less, and particularly preferably 40% or less.
In addition, the mercapto group may contain not only one but multiple.

  The SH group-containing compound has one or more hydrocarbon groups that may contain heteroatoms (hereinafter, also simply referred to as hydrocarbon groups), and the total number of carbon atoms in the hydrocarbon group (in addition, a plurality of hydrocarbon groups). When there is a hydrocarbon group, it means that the total number of carbon atoms in each hydrocarbon group is 5) or more. By including this hydrocarbon group in the compound, the compatibility with the insulating resin is further increased, and the effect of suppressing the ion migration of silver is further increased.

The hydrocarbon group is a group containing a carbon atom and a hydrogen atom. This hydrocarbon group is usually bonded to the triazole structure or the like. More specifically, examples of the hydrocarbon group include an aliphatic hydrocarbon group, an aromatic hydrocarbon group, and a group obtained by combining these.
The number of carbon atoms in each hydrocarbon group is not particularly limited, and is not particularly limited as long as the total carbon number described below is 5 or more. More preferably, 8 or more is particularly preferable. The upper limit is not particularly limited, but is preferably 30 or less, more preferably 24 or less, from the viewpoint that silver ion migration suppressing ability is more excellent.

The aliphatic hydrocarbon group preferably has 4 or more carbon atoms, and more preferably 6 or more carbon atoms. The upper limit is not particularly limited, but 40 or less is preferable because silver ion migration suppressing ability is more excellent. The aliphatic hydrocarbon group may be linear, branched or cyclic, and the carbon of the linear aliphatic hydrocarbon portion is more excellent in dispersibility of the compound in the insulating resin. It is preferable that the number of atoms is 18 or less, or a branched chain containing a tertiary or quaternary carbon atom.
As an aromatic hydrocarbon group, C6 or more is preferable and an aromatic hydrocarbon group more than 2 substitution is more preferable.

The total number of carbon atoms in all hydrocarbon groups bonded to the above structure is 5 or more. If the total number of carbon atoms is in this range, silver ion migration is suppressed, and the insulation reliability between the metal wirings is improved. In addition, 6 or more are preferable and 8 or more are more preferable in the point which this effect is more excellent. The upper limit is not particularly limited, but the total number is preferably 36 or less, and more preferably 24 or less, from the viewpoint of easier synthesis and better dispersibility in the insulating resin.
In the compound, when the number of hydrocarbon groups is one, the number of carbon atoms in the hydrocarbon group may be 5 or more.
Further, when a plurality of hydrocarbon groups are contained in the compound, the total number of carbon atoms contained in each hydrocarbon group may be 5 or more. More specifically, when two hydrocarbon groups (hydrocarbon group Aa, hydrocarbon group Bb) are contained in the compound, the number of carbon atoms in hydrocarbon group Aa and the number of carbon atoms in hydrocarbon group Bb The sum of the numbers may be 5 or more.

In addition, the total number of said carbon atom can also be represented by the following formula | equation (F).
In other words, the compound may be any total number of carbon atoms T _C of the formula (F) is 5 or more.

  In formula (F), Ci represents the number of carbon atoms in the i-th hydrocarbon group contained in the compound, and i represents an integer of 1 to n.

The hydrocarbon group may contain a hetero atom. The kind of the hetero atom contained is not particularly limited, and examples thereof include a halogen atom, an oxygen atom, a nitrogen atom, a sulfur atom, a selenium atom, and a tellurium atom. Among these, -X _1- , -N (R _a )-, -C (= X ₂ )-, -CON (R _b )-, and -C (= X _{3 in} terms of excellent ion migration suppression ability of silver. ) X ₄ —, —SO _n —, —SO ₂ N (R _c ) —, a halogen atom, or a combination of these is preferably included.
X _{1 to} X ₄ are each independently selected from the group consisting of an oxygen atom, a sulfur atom, a selenium atom, and a tellurium atom. Of these, an oxygen atom and a sulfur atom are preferred because they are easier to handle.
R _a , R _b and R _c are independently selected from a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms.
n represents an integer of 1 to 3.

  In addition, when a hetero atom is contained in a hydrocarbon group, it may be contained in a form such as a mercapto group (—SH).

  The molecular weight of the SH group-containing compound is not particularly limited, but is preferably from 50 to 1000, more preferably from 100 to 600, from the viewpoint of better compatibility with the insulating resin.

(Preferred embodiment)
Preferable embodiments of the SH group-containing compound include compounds represented by the following formulas (1) to (3). If it is this compound, it is more excellent in ion migration suppression ability. In particular, the compound represented by the formula (1) or the formula (2) is preferable in that the effect of the present invention is more excellent.

In formula (1), R ₁ and R ₂ each independently represent a hydrogen atom or a hydrocarbon group that may contain a hetero atom, and at least one of R ₁ and R ₂ contains a hetero atom. And the total number of carbon atoms contained in each of R ₁ and R ₂ is 5 or more.
As preferable embodiments of R ₁ and R ₂ , —X ₁ —, —N (R _a ) —, —C (═X ₂ ) —, —CON (R _b ) —, —C (═X ₃ ) X ₄ —, —SO _n —, —SO ₂ N (R _c ) —, or a hydrocarbon group that may contain a halogen atom (for example, an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a combination thereof) Can be mentioned. The definitions of X _{1 to} X ₄ , R _{a to} R _c , and n are as described above. Among them, an aryl group, or —X ₁ —, —N (R _a ) —, —C (═X ₂ ) —, —CON (R _b ) is more excellent in the ability to suppress migration of the SH group-containing compound. -, or _{-C (= X 3) X 4} - include which may contain hydrocarbon group, and more preferably at least one of R ₁ and R ₂ is an aliphatic hydrocarbon group.
In addition, the suitable aspect of a hydrocarbon group (aliphatic hydrocarbon group and aromatic hydrocarbon group) is as above-mentioned, and the kind of hetero atom is also as above-mentioned.

In the formula (1), the total number of carbon atoms contained in each group of R ₁ and R ₂ is 5 or more. In other words, the total number (total carbon number) of the number of carbon atoms in R ₁ and the number of carbon atoms in R ₂ may be 5 or more. The preferred embodiment of the total number is as described above.

In Formula (2), R ₃ represents a hydrocarbon group that may contain a hetero atom, and the number of carbon atoms contained in R ₃ is 5 or more.
The definition of this hydrocarbon group is as described above. In Formula (2), preferred examples of this hydrocarbon group include —X ₁ —, —N (R _a ) —, —C (═X ₂ ) —, —CON (R _b ) —, — C (= X ₃ ) X ₄ —, —SO _n —, —SO ₂ N (R _c ) —, or a hydrocarbon group which may contain a halogen atom (for example, an aliphatic hydrocarbon group, an aromatic hydrocarbon Group, or a combination thereof), and a hydrocarbon group having -X _1- (particularly an aliphatic hydrocarbon group) is more preferable.

In formula (3), R _{4 to} R ₇ each independently represent a hydrogen atom, a halogen atom, or a hydrocarbon group that may contain a hetero atom, and at least one of R _{4 to} R ₇ is carbonized. This represents a hydrogen group, and the total number of carbon atoms contained in each group of R _{4 to} R ₇ is 5 or more.
The definition of this hydrocarbon group is as described above. In the formula (3), preferred examples of this hydrocarbon group include —X ₁ —, —N (R _a ) —, —C (═X ₂ ) —, —CON (R _b ) —, — C (= X ₃ ) X ₄ —, —SO _n —, —SO ₂ N (R _c ) —, or a hydrocarbon group which may contain a halogen atom (for example, an aliphatic hydrocarbon group, an aromatic hydrocarbon Group, or a combination thereof), and a group represented by the following formula (4) is more preferable. With this group, the dispersibility of the SH group-containing compound in the insulating resin is more excellent, and the ion migration suppressing effect is further improved.
* -L ₁ -R ₈ formula (4)
In formula (4), L ₁ represents a single bond, —O—, —NR ₁₁ —, —CO—, —C (R ₉ ) (R ₁₀ ) —, or a group obtained by combining these. R _{9 to} R ₁₁ each independently represents a hydrogen atom or an aliphatic hydrocarbon group.
R ₈ represents an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a group obtained by combining these. Preferred embodiments of the aliphatic hydrocarbon group and the aromatic hydrocarbon group are as described above.
In formula (4), * represents a bonding position.

In the formula (3), at least one of R _{4 to} R ₇ represents a hydrocarbon group that may contain a hetero atom. Among them, in terms of migration suppressing effect more excellent, it is preferable that 1 to 2 of R ₄ to R ₇ is the hydrocarbon group, more preferably one.
The total number of carbon atoms contained in each group of R _{4 to} R ₇ is 5 or more. In other words, the total number of carbon atoms in R ₄ , the number of carbon atoms in R ₅ , the number of carbon atoms in R ₆ , and the number of carbon atoms in R ₇ (total carbon number) May be 5 or more. The preferred embodiment of the total number is as described above.

  The mass relationship between the insulating resin and the compound in the composition is not particularly limited, but the mass ratio (A / B) between the mass A of the compound and the mass B of the insulating resin is more excellent in terms of migration suppression ability. 0.20 or less is preferable and 0.10 or less is more preferable. Although a minimum in particular is not restrict | limited, 0.0001 or more are preferable and 0.0005 or more are preferable at the point from which a predetermined effect is acquired with a small amount of composition.

(Optional component)
The composition contains a solvent, if necessary. By including a solvent in the composition, the handleability of the composition is improved, and a metal ion diffusion suppression layer having a desired film thickness can be easily formed on the insulating substrate.
The kind in particular of solvent used is not restrict | limited, Water or an organic solvent is mentioned.
Examples of the organic solvent used include alcohol solvents (eg, methanol, ethanol, isopropanol, sec-butanol, carbitol, diethylene glycol monoethyl ether), ketone solvents (eg, acetone, methyl ethyl ketone, cyclohexanone), Aromatic hydrocarbon solvents (eg, toluene, xylene), amide solvents (eg, formamide, dimethylacetamide, N-methylpyrrolidone, dimethylpropylene urea), nitrile solvents (eg, acetonitrile, propionitrile), ester solvents (Eg, methyl acetate, ethyl acetate), carbonate solvents (eg, dimethyl carbonate, diethyl carbonate), ether solvents, halogen solvents, and the like. Two or more of these solvents may be mixed and used.

  When a solvent is contained in the composition, the content is not particularly limited, but is preferably 20 to 80% by mass and more preferably 25 to 75% by mass with respect to the total amount of the composition.

It is preferable that a silver ion is not substantially contained in a composition at the point which the ion migration suppression ability of a metal ion diffusion suppression layer is more excellent. If an excessive amount of silver ions is contained, a large amount of silver ions are contained in the metal ion diffusion suppressing layer, and the effect of suppressing silver ion migration may be reduced.
In addition, it means that content of silver ion in a composition is 1 micromol / l or less, and it is more preferable that it is 0.1 micromol / l or less that silver ion is not contained substantially. Most preferably, it is 0 mol / l.

  The first migration prevention layer 550 and the second migration prevention layer 552, for example, the metal ion diffusion suppression layer, preferably contain substantially no silver ions or metal silver. If the metal ion diffusion suppression layer contains excessive silver ions or metal silver, the metal ion migration suppression effect may be reduced.

  The thicknesses of the first migration prevention layer 550 and the second migration prevention layer 552 (metal ion diffusion suppression layer) are not particularly limited, but are preferably 5 to 1000 μm and more preferably 10 to 500 μm in terms of more excellent ion migration suppression ability. More preferred.

The manufacturing method of the first migration prevention layer 550 and the second migration prevention layer 552 is not particularly limited. For example, when the above-described composition for forming a metal ion diffusion suppression layer is a liquid containing a solvent, this composition Is applied to the surface 11a of the support 11 to remove the solvent. Moreover, the method of laminating | stacking the film for metal ion diffusion suppression layers mentioned above directly on the surface 11a of the support body 11 is also mentioned. In addition, when the above-described composition for forming a metal ion diffusion suppressing layer is a liquid containing a solvent, the composition is applied onto a substrate to remove the solvent to form a film, and then the film is peeled off from the substrate. In addition, a method of laminating on the surface 11a of the support 11 can also be used.
In addition, the method by the said application | coating is preferable from the point that adjustment of the thickness of the 1st migration prevention layer 550 and the 2nd migration prevention layer 552 (metal ion diffusion suppression layer) is easy.

In addition, the method in particular of apply | coating the composition for metal ion diffusion suppression layer forming to the surface 11a of the support body 11 is not restrict | limited, Dispensing method, screen printing method, curtain coating method, barcode method, spin coater method, inkjet method, A known method such as a dip dipping method can be employed. The dispense method, the screen printing method, the spin coater method, and the ink jet method are preferable because the amount of adhesion of the metal ion diffusion suppression layer can be easily controlled.
In addition, when the insulating resin is a curable resin, a heat treatment or an exposure treatment may be performed as necessary after applying the composition.
In the case of carrying out the heat treatment, the optimum heating temperature is appropriately selected according to the thermosetting resin to be used, but it is usually preferably 100 to 300 ° C, more preferably 100 to 250 ° C. In addition, the heating time is preferably 0.2 to 10 hours, and more preferably 0.5 to 5 hours from the viewpoint of productivity.
Furthermore, when performing an exposure process, the light used for the exposure is appropriately selected according to the photocurable resin used. For example, ultraviolet rays and visible light can be used. The exposure time is preferably 0.2 to 10 hours and more preferably 0.5 to 5 hours from the viewpoint of productivity.

  When the conductive thin wire 14 is applied as a transparent electrode such as a touch panel, the conductive thin wire 14 may contain a metal nanowire made of silver or a silver alloy (hereinafter also simply referred to as a metal nanowire). preferable. By using this metal nanowire, a conductive film can be formed at a low temperature, and a transparent electrode having high transmittance and low resistance can be provided.

<Metal nanowires>
The metal nanowire is composed of silver or a silver alloy. The kind of silver alloy is as above-mentioned. The metal nanowire has conductivity and has a shape in which the length in the major axis direction is sufficiently longer than the diameter (length in the minor axis direction). It may be a solid fiber or a hollow fiber.

  The material of the metal nanowire is particularly preferably silver or an alloy of silver and another metal in terms of excellent conductivity. Examples of other metals used in the alloy with silver include platinum, osmium, palladium, iridium, tin, bismuth, and nickel. These may be used alone or in combination of two or more.

The average minor axis length of the metal nanowire (sometimes referred to as “average minor axis diameter” or “average diameter”) is 5 to 50 nm, more preferably 5 to 25 nm, and particularly preferably 5 to 20 nm.
When the average minor axis length is less than 5 nm, the oxidation resistance may deteriorate and the durability may deteriorate. On the other hand, when the average minor axis length exceeds 50 nm, the scattering of the metal nanowires increases, and the haze value of the conductive film may increase. In particular, by setting the average minor axis length to 25 nm or less, the scattering of the metal nanowires can be reduced, and the haze value of the conductive film is greatly improved (reduced). A touch panel using a conductive film having a small haze can eliminate the pattern appearance (bone appearance) of the conductive film and improve the visibility of the touch panel.

  The average short axis length of the metal nanowires is determined by observing 300 metal nanowires using a transmission electron microscope (TEM; manufactured by JEOL Ltd., JEM-2000FX) and calculating the average short axis length of the metal nanowires from the average value. I ask for it. The short axis length when the short axis of the metal nanowire is not circular is the shortest axis.

The average major axis length (sometimes referred to as “average length”) of the metal nanowire is preferably 5 μm or more, more preferably 5 μm to 40 μm, and even more preferably 5 μm to 30 μm.
If the average major axis length is less than 5 μm, it is difficult to form a dense network and sufficient conductivity may not be obtained. If it exceeds 40 μm, the metal nanowires are too long and become entangled during production. In the manufacturing process, agglomerates may occur.
The average major axis length of the metal nanowires is, for example, observed with 300 metal nanowires using a transmission electron microscope (TEM; manufactured by JEOL Ltd., JEM-2000FX), and the average length of the metal nanowires from the average value. Find the shaft length. In addition, when the metal nanowire is bent, a circle having the arc as an arc is taken into consideration, and a value calculated from the radius and the curvature is defined as the major axis length.

The method for producing the metal nanowire is not particularly limited and may be produced by any method, but it is preferably produced by reducing metal ions in a solvent in which a halogen compound and a dispersant are dissolved. In addition, after forming the metal nanowire, it is preferable to perform a desalting treatment by a conventional method from the viewpoints of dispersibility and stability of the conductive film over time.
Moreover, as a manufacturing method of metal nanowire, JP2009-215594A, JP2009-242880A, JP2009-299162A, JP2010-84173A, JP2010-86714A, The method described in JP-T-2009-505358 can be used.

The aspect ratio of the metal nanowire can be appropriately selected according to the purpose, but is not particularly limited as long as it is 10 or more, more preferably 50 or more, further preferably 100 or more, further preferably 5000 or more, and from 10,000 100,000 is particularly preferred. The aspect ratio generally means the ratio between the long side and the short side of the fibrous material (ratio of average major axis length / average minor axis length).
There is no restriction | limiting in particular as a measuring method of an aspect ratio, According to the objective, it can select suitably, For example, the method etc. which measure with an electron microscope etc. are mentioned.
When measuring the aspect ratio of a metal nanowire with an electron microscope, it is only necessary to confirm with one field of view of the electron microscope. Further, by measuring the average major axis length and the average minor axis length of the metal nanowire separately, the aspect ratio of the entire metal nanowire can be estimated.
When the metal nanowire has a tube shape, the outer diameter of this tube is used as the diameter for calculating the aspect ratio.

<Fifth Embodiment>
Below, the 5th embodiment of the display apparatus provided with the electrically conductive film of this invention is demonstrated with reference to drawings. FIG. 15A is a schematic perspective view showing an embodiment of a display device provided with the conductive film of the present invention, and FIG. 15B is a plan view showing a state in which the conductive film and the display device are combined. is there.
A display device 600 illustrated in FIGS. 15A and 15B is a display device using the conductive film 500 illustrated in FIGS. 8A and 8B.
Note that in the display device 600 shown in FIGS. 15A and 15B, the same components as those of the conductive film 500 shown in FIGS. Omitted.

The display device 600 includes a protective layer 602, a conductive film 500, and a liquid crystal display panel (display unit) 604.
A conductive film 500 is placed on the display screen 606 of the liquid crystal display panel 604, and a protective layer 602 is provided on the conductive film 500.
The protective layer 602 is for protecting the conductive film 500. The protective layer 602 is made of, for example, glass, (meth) acrylic resin, polycarbonate resin, glass, polyethylene terephthalate resin, or the like. A (meth) acrylic resin is preferable because of its excellent transparency and light weight.

The conductive film 500 is as described above. In addition, as a conductive film, the conductive film 500b of FIG. 13 (A) and (B) in which the migration prevention layer was formed can also be used.
The liquid crystal display panel 604 is a known liquid crystal display panel, and a drive circuit (IC circuit) is provided on the back surface 608 although not shown.
The drive circuit (IC circuit) detects a change in the capacitance value between the first conductive pattern 34 and the second conductive pattern 36 when the touch panel including the conductive film 500 is touched with a finger or the like, and touches the touch panel. The coordinates of the point are specified, that is, the position of the touched point is calculated.

In the display device 600, the bent region 504 of the conductive film 500 is bent, and the second conductive region 506 is bent toward the back side of the liquid crystal display panel 604 as shown in FIG. It is connected to a drive circuit (not shown).
As shown in FIG. 15B, the second conductive region 508 is also bent to the back side of the liquid crystal display panel 604 and connected to a driving circuit (not shown) on the back side 608. In this case, the length of the bending region 504 in the extending direction is longer than the thickness of the liquid crystal display panel 604.
In the display device 600, when the fingertip is brought into contact with the protective layer 602, a change is detected in the capacitance value between the first conductive pattern 34 and the second conductive pattern 36 facing the fingertip by the drive circuit. The coordinates of the touched point are specified. In this way, the position of the fingertip is detected.

  The present invention is basically configured as described above. The conductive film and touch panel of the present invention have been described in detail above. However, the present invention is not limited to the above-described embodiment, and various modifications or changes may be made without departing from the spirit of the present invention. It is.

  Hereinafter, the present invention will be described more specifically with reference to examples of the present invention. In addition, the material, usage-amount, ratio, processing content, processing procedure, etc. which are shown in the following Examples can be changed suitably unless it deviates from the meaning of this invention. Therefore, the scope of the present invention should not be construed as being limited by the specific examples shown below.

(Preparation of silver halide emulsion)
To the following 1 liquid maintained at 38 ° C. and pH 4.5, an amount corresponding to 90% of each of the following 2 and 3 liquids was simultaneously added over 20 minutes while stirring to form 0.16 μm core particles. Subsequently, the following 4 and 5 solutions were added over 8 minutes, and the remaining 10% of the following 2 and 3 solutions were added over 2 minutes to grow to 0.21 μm. Further, 0.15 g of potassium iodide was added and ripened for 5 minutes to complete the grain formation.

1 liquid:
750 ml of water
12g gelatin
Sodium chloride 3g
1,3-Dimethylimidazolidine-2-thione 20mg
Sodium benzenethiosulfonate 10mg
Citric acid 0.7g
Two liquids:
300 ml of water
150 g silver nitrate
3 liquids:
300 ml of water
Sodium chloride 38g
Potassium bromide 32g
5 ml of potassium hexachloroiridium (III) (0.005% KCl 20% aqueous solution)
Ammonium hexachlororhodate
(0.001% NaCl 20% aqueous solution) 7 ml
4 liquids:
100ml water
Silver nitrate 50g
5 liquids:
100ml water
Sodium chloride 13g
Potassium bromide 11g
Yellow blood salt 5mg

  Then, it washed with water by the flocculation method according to a conventional method. Specifically, the temperature was lowered to 35 ° C., and the pH was lowered using sulfuric acid until the silver halide precipitated (the pH was in the range of 3.6 ± 0.2). Next, about 3 liters of the supernatant was removed (first water washing). Further, 3 liters of distilled water was added, and sulfuric acid was added until the silver halide settled. Again, 3 liters of the supernatant was removed (second water wash). The same operation as the second water washing was further repeated once (third water washing) to complete the water washing / desalting process. The emulsion after washing with water and desalting was adjusted to pH 6.4 and pAg 7.5, and gelatin 3.9 g, sodium benzenethiosulfonate 10 mg, sodium benzenethiosulfinate 3 mg, sodium thiosulfate 15 mg and chloroauric acid 10 mg were added. Chemical sensitization is performed to obtain an optimum sensitivity at 0 ° C., and 100 mg of 1,3,3a, 7-tetraazaindene is added as a stabilizer and 100 mg of proxel (trade name, manufactured by ICI Co., Ltd.) is used as a preservative. It was. The finally obtained emulsion contains 0.08 mol% of silver iodide, and the ratio of silver chlorobromide is 70 mol% of silver chloride and 30 mol% of silver bromide. It was a silver iodochlorobromide cubic grain emulsion having a coefficient of 9%.

(Preparation of photosensitive layer forming composition)
1,3,3a, 7-tetraazaindene 1.2 × 10 ⁻⁴ mol / mol Ag, hydroquinone 1.2 × 10 ⁻² mol / mol Ag, citric acid 3.0 × 10 ⁻⁴ mol / Mol Ag, 2,4-dichloro-6-hydroxy-1,3,5-triazine sodium salt 0.90 g / mol Ag, a trace amount of hardener was added, and the coating solution pH was adjusted to 5.6 using citric acid. Adjusted.
Further, the following silicone oil (median particle size distribution: 0.18 μm, manufactured by Shin-Etsu Chemical Co., Ltd.) is added so as to have a content in the conductive thin wire described later to prepare a photosensitive layer forming composition did.

(Photosensitive layer forming step)
After a corona discharge treatment is applied to a 100 μm polyethylene terephthalate (PET) film, the gelatin subbing layer has a thickness of 0.1 μm, and further includes a dye that has an optical density of about 1.0 and is decolorized by the alkali of the developer. An antihalation layer was provided as a support. On the support, the photosensitive layer forming composition was applied, and a gelatin layer having a thickness of 0.15 μm was further provided to form a photosensitive layer. The obtained photosensitive layer had a silver amount of 6.0 g / m ² , a ceratin amount of 1.0 g / m ² , and a silver / gelatin volume ratio of the emulsion layer of 1.6 / 1.

(Exposure development process)
As an evaluation plate for a bending test, the above-mentioned photosensitive layer is irradiated with parallel light using a high-pressure mercury lamp as a light source through a photomask capable of providing a developed silver image of a conductive thin wire pattern as shown in FIG. Exposure was performed. In FIG. 4, the width W of the conductive thin wire 14 is 5 μm, the length Pa of one side of the square lattice 16 is 300 μm, and the entire surface of the main surface of the evaluation board for bending test (length 600 mm × width 800 mm). The pattern of the conductive thin wire was formed over the entire area. After exposure, development is performed with the following developer, development processing is performed using a fixer (trade name: N3X-R for CN16X: manufactured by Fuji Film), rinse with pure water, and drying to form a pattern electrode Got.

(Developer composition)
The following compounds are contained in 1 liter (L) of the developer.
Hydroquinone 0.037mol / L
N-methylaminophenol 0.016 mol / L
Sodium metaborate 0.140 mol / L
Sodium hydroxide 0.360 mol / L
Sodium bromide 0.031 mol / L
Potassium metabisulfite 0.187 mol / L

(Heating process)
The film obtained above was heat-treated at 60 ° C./1 min to obtain a conductive film.
In addition, content of the silicone oil in the obtained electroconductive thin wire was 3.2 mg / m < ² >. Moreover, the mass ratio (binder / silicone oil) of the binder and the silicone oil in the conductive fine wire was 313/1.
Furthermore, when the vertical cross section of the electroconductive fine wire of the obtained electroconductive film was observed with the scanning electron microscope, b / a was 0.860.

(Bending test measurement)
Using the conductive film obtained above, the bending test described in FIG. 3 was performed. The results are shown in Table 1.

(Young's modulus measurement)
The entire surface of the photosensitive layer obtained in the photosensitive layer forming step was exposed to produce a sample film for evaluating Young's modulus on a polyethylene terephthalate (PET) film. The sample film was peeled off from the film to prepare a sample film (length 20 mm × width 120 mm × thickness 0.1 mm). Using the obtained sample film, the Young's modulus of the conductive thin wire was measured by the method described above. The results are shown in Table 1.

(Example 2)
A conductive film was produced according to the same procedure as in Example 1 except that the content of silicone oil was changed. Various measurement results are summarized in Table 1.

(Example 3)
A conductive film was produced according to the same procedure as in Example 1 except that the content of silicone oil was changed. Various measurement results are summarized in Table 1.

Example 4
A conductive film was produced according to the same procedure as in Example 1, except that the silicone oil content was changed and the thickness of the gelatin layer on the photosensitive layer forming composition was changed to 0.05 μm. Various measurement results are summarized in Table 1.

(Comparative Example 1)
A conductive film was produced according to the same procedure as in Example 4 except that the gelatin layer on the photosensitive layer forming composition was not provided. Various measurement results are summarized in Table 1.

(Comparative Example 2)
A conductive film was produced according to the same procedure as in Example 4 except that no silicone oil was used. Various measurement results are summarized in Table 1.

(Comparative Example 3)
Based on Example 3 described in the Example column of Patent Document 1, a conductive film was produced.
The detailed procedure is shown below.
Emulsion B was prepared under the same conditions except that the amount of gelatin described in Example 1 was 8 g and gelatin was not added after washing with water.
The emulsion B was spectrally sensitized by adding sensitizing dye (sd-1) 5.7 × 10 ⁻⁴ mol / mol Ag. Furthermore, KBr 3.4 × 10 ⁻⁴ mol / mol Ag and compound (Cpd-3) 8.0 × 10 ⁻⁴ mol / mol Ag were added and mixed well.
Then, 1,3,3a, 7-tetraazaindene 1.2 × 10 ⁻⁴ mol / mol Ag, hydroquinone 1.2 × 10 ⁻² mol / mol Ag, citric acid 3.0 × 10 ⁻⁴ mol / mol Ag, 90 mg / m ^{2 of} 2,4-dichloro-6-hydroxy-1,3,5-triazine sodium salt, 15 wt% of colloidal silica having a particle size of 10 μm with respect to gelatin, 50 mg of aqueous latex (aqL-6) / M ² , 100 mg / m ^{2 of} polyethyl acrylate latex, latex copolymer of methyl acrylate, 2-acrylamido-2-methylpropanesulfonic acid sodium salt and 2-acetoxyethyl methacrylate (weight ratio 88: 5: 7) 100 mg / m ^2, the core-shell latex core: styrene / butadiene copolymer weight ratio 37/63), shell: styrene / 2-acetoxyethyl acrylate (weight ratio 84/16, core / shell ratio = 50/50) was added 100 mg / m ^2, 4 wt% of the compound to gelatin (Cpd-7), coated with citric acid The liquid pH was adjusted to 5.6.

Using the composition for forming a photosensitive layer obtained above, a conductive film was formed according to the same procedure as in Example 1 except that the gelatin layer on the composition for forming a photosensitive layer was not provided.
The developed sample was calendered. The calender roll is made of a metal roll (iron core + hard chrome plating, roll diameter 250 mm), linear pressure 1960 N / cm (200 kgf / cm, 700 kgf / cm ² in terms of surface pressure) to 7840 N / cm (800 kgf / cm, surface) In terms of pressure, 1850 kgf / cm ² ) was applied and the sample was passed between the rollers. Various measurement results are summarized in Table 1.

(Comparative Example 4)
Based on the Example column of Patent Document 2, a conductive film was produced.
Emulsion C was prepared under the same conditions as in Example 1, except that the amount of gelatin in one solution was 20 g and the amount of gelatin added after washing was changed from 3.9 g to 30 g. Silicone was added to Emulsion C to 20 mg / m ² , and the coating solution pH was adjusted to 5.6 using citric acid. The emulsion layer coating solution thus prepared was coated on the support used in Example 1 to form a photosensitive layer. The obtained photosensitive layer had a silver amount of 6.0 g / m ² and a ceratin amount of 1.0 g / m ² . The developed sample was subsequently immersed in an activation solution and an electroless copper plating solution having the following composition to perform electroless copper plating on the mesh pattern silver image to obtain a conductive film. Here, the activation treatment was performed at 35 ° C. for 5 minutes. Further, the electroless copper plating was processed at 35 ° C. until the surface resistivity became 0.3Ω / mouth or less. Various measurement results are summarized in Table 1.

(Activation solution composition): 0.2 g of PdCl ₂ per liter
HCl (2N aqueous solution) 25.6 ml
Add water to dissolve the above to 1 L.
(Electroless copper plating solution composition)
Copper sulfate 0.06mol / L
Formalin 0.22 mol / L
Triethanolamine 0.12 mol / L
Polyethylene glycol 100ppm
Yellow blood salt 50ppm
Aqueous solution containing 20 ppm of α, α'-bipyridine pH-12.5

As shown in Table 1 above, it was confirmed that the conductive film of the present invention had excellent flexibility without any increase in resistance even after being bent.
In particular, in Examples 2 and 3 in which the Young's modulus was 5.0 GPa or less and b / a was 0.950 or less, a more excellent effect was confirmed.

On the other hand, as shown in Table 1, in Comparative Examples 1 to 4 in which the Young's modulus or b / a was not within the predetermined range, the desired flexibility was not obtained.
In particular, in Comparative Example 3 corresponding to the aspect of Patent Document 1 and Comparative Example 4 corresponding to the aspect of Patent Document 2, a rapid increase in resistance value was confirmed after bending, and the effect was inferior.

DESCRIPTION OF SYMBOLS 10,100,200 Conductive film 12 Support body 14 Conductive thin wire 16 Lattice 18 Inclined surface 20 Concave groove 22 Base 24 Bending test evaluation board 26 Tip part 28 Push member 30 1st electrode pattern 32 2nd electrode pattern 34 1st conductivity Pattern 36 Second conductive pattern 38 First electrode terminal 40 First wiring 42 Second electrode terminal 44 Second wiring 46 Conductive film 48 Flexible circuit 50 Transparent support 52 Transparent electrode layer 54 Lead wiring 56 Active area 58 Inactive area 60 Electrode Pattern portion 62 Terminal wiring portion 64 Electrode 66 Lead wiring 68 Extension portion 70 Bending line 72 Transparent resin layers 300, 400 Touch panel members 500, 500a, 500b Conductive film 502 First conductive region 504 Bending region 506, 508 Second Conductive region 550 of the first gray ® emission preventing layer 552 second migration-preventing layer 600 display device 602 protective layer 604 liquid crystal display panel 606 display screen 608 back

Claims (5)

A support;
A conductive film comprising a conductive thin wire containing a binder and a metal disposed on the support,
The Young's modulus of the conductive thin wire is 5.5 GPa or less,
In the cross section in the vertical direction with respect to the surface of the conductive thin wire, the height a of the conductive thin wire from the surface of the support and the metal in the conductive thin wire at the position farthest from the support surface in the vertical direction A conductive film satisfying the relationship of the following formula (X) with height b.
Formula (X) b / a ≦ 0.975 A support;
A conductive film comprising a conductive thin wire containing a binder and a metal disposed on the support,
A conductive film satisfying the relationship of the following formula (Y), where R1 is the resistance value of the conductive thin wire before performing the following bending test and R2 is the resistance value of the conductive thin wire after performing the following bending test. .
Formula (Y) R2 / R1 <1.10
(In the bending test, the conductive film is disposed on a table having a pair of inclined surfaces, and a groove having a width that decreases from the opening side toward the bottom surface side. The conductive film is pressed into the concave groove by the tip portion of the pressing member having a hemispherical tip portion having a radius of 3.5 mm to bring the conductive film into contact with the inclined surface. (The angle formed by this is 30 degrees, the depth of the groove is 10 mm, and the width of the bottom of the groove is 7 mm.) The conductive film according to claim 1 or 2, wherein the conductive fine wire contains silicone oil and / or paraffin oil, and the total content thereof is 10 mg / m ² or less.   The mass ratio (the mass of the binder / the total mass of the silicone oil and the paraffin oil) of the mass of the binder and the total mass of the silicone oil and the paraffin oil in the conductive thin wire is 95 or more. The conductive film according to any one of 1 to 3.   A touch panel having the conductive film according to claim 1.