JP2014089851A - Power feeding structure of organic el panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power feeding structure of an organic EL panel capable of surely feeding power even when a power feeding region is narrow.SOLUTION: An organic EL device 5 comprises a light-emitting region which actually emits light and a frame region which surrounds a periphery of the light-emitting region. The frame region comprises a first power feeding unit electrically connected to a first electrode layer in the light-emitting region and a second power feeding unit electrically connected to a second electrode layer in the light-emitting region. The first power feeding unit is electrically connected to the outside via a first unevenness forming member. The second power feeding unit is electrically connected to the outside via a second unevenness forming member. A sealing layer covers the light-emitting region. A frame member 6 convers a part or the whole of the frame region, and includes an insertion hole into which a part of a cable member 3 can be inserted. The first power feeding unit and the second power feeding unit are electrically connected to a first power feeding terminal and a second power feeding terminal, respectively, on a projection plane in a thickness direction of the sealing layer. Each of the cable member 3, the first power feeding terminal, and the second power feeding terminal is connected via the insertion hole.

Description

  The present invention relates to a power feeding structure of an organic EL (Electro Luminescence) panel.

  In recent years, organic EL panels have attracted attention as a lighting device that can replace incandescent lamps and fluorescent lamps, and many studies have been made.

Here, the organic EL panel is obtained by applying a sealing structure and a casing to an organic EL device.
In the organic EL device, an organic EL element is laminated on a substrate such as a glass substrate, a transparent resin film, or a metal sheet, and a power feeding structure for feeding power to the organic EL element is formed.
And an organic EL element makes two electrodes which one or both have translucency oppose, and laminated | stacked the light emitting layer which consists of an organic compound between this electrode. The organic EL device emits light by the energy of recombination of electrically excited electrons and holes.
That is, the organic EL device is a self-luminous device and can emit light of various wavelengths by appropriately selecting the material of the light emitting layer.

  In addition, the organic EL panel has a feature that the thickness is extremely small and lighter than incandescent lamps, fluorescent lamps, and LED lighting, and light is emitted in a planar shape. Furthermore, since the organic EL panel has higher luminous efficiency than incandescent lamps and fluorescent lamps, the organic EL panel has features that it consumes less power and generates less heat.

JP 2004-319407 A

By the way, in order to use the organic EL panel as a lighting device, it is naturally necessary to supply power to an electrode in the organic EL device from an external power source. For example, there is a method described in Patent Document 1 as a method of feeding power from an external power source to the electrodes of the organic EL panel.
In the organic EL panel of Patent Document 1, an anisotropic conductive film (anisotropic conductive film) (ACF) and a flexible wiring board (FPC) are used as conductive members that electrically connect an electrode of an organic EL device and an external power source. Is used. That is, ACF is thermocompression-bonded to the electrode in the organic EL device with low-temperature heat and connected to the FPC, thereby electrically connecting the external power source and the organic EL panel. In short, Patent Document 1 employs a method in which ACF is used as an adhesive between an FPC and an electrode, and power is supplied from an external power source to the electrode in the organic EL device via the FPC.

However, when ACF is used as the adhesive, the cost is higher than that of other bonding means, and the contact resistance with the electrode is increased. In particular, when an oxide or the like is used as an electrode, a voltage drop between the electrode / ACF interface increases. In such a case, since it is necessary to apply a considerably high voltage in order to cause the organic EL panel (organic EL device) to emit light as illumination, there is a problem that reliability is lacking.
Moreover, when combining with ACF and FPC, it is necessary to design the shape of FPC each time according to the size of the organic EL panel, and there is a limit (constraint) in the current that can be passed. For this reason, there is a disadvantage that it is not suitable for flowing a large-capacity current as in a large illuminating device.

Furthermore, in order to make use of the feature of the organic EL panel called surface emission, it is preferable to secure a large area of the light emitting region that actually emits light as much as possible. In other words, it is preferable to reduce the area other than the in-plane light emitting region as much as possible.
In the surface of the organic EL panel, when the light emitting region and the power feeding region contributing to the power feeding to the light emitting region are mixed, the area of the power feeding region decreases as the area of the light emitting region increases. Therefore, when using an ACF that adheres in a planar shape, it is necessary to ensure a sufficient adhesion area, and there is a problem that it cannot be used if the adhesion area to the power feeding region is less than a predetermined area.

  Thus, an object of the present invention is to provide an organic EL panel power supply structure that can reliably supply power even when the power supply region is narrow.

  The invention according to claim 1 for solving the above-described problem is a power feeding structure of an organic EL panel that connects an organic EL panel and a cable member electrically connected to an external power source. An EL device, a power feeding member that feeds power to the organic EL device, and a frame member that integrates the organic EL device and the power feeding member. The organic EL device is formed on a substrate having a planar shape. When having a cross-sectional structure having a laminate in which an electrode layer, an organic light emitting layer, and a second electrode layer are laminated, and a sealing layer that covers a part of the laminate, A light-emitting region that emits light, and a frame region surrounding the light-emitting region, wherein the frame region is electrically connected to a first electrode layer in the light-emitting region; Electrically connected to the second electrode layer of The first power supply unit and the second power supply unit are electrically connected to the outside through the first power supply terminal or the second power supply terminal, respectively, and the sealing layer includes: The frame member covers at least a light emitting region, covers a part or all of the frame region, and has an opening through which a part of the cable member can be inserted. The portion is electrically connected to the first feeding terminal and the second feeding terminal on the projection surface in the thickness direction of the sealing layer, and the cable member and the first feeding terminal and the second feeding terminal are connected through the opening. Each of the organic EL panel feeding structures is characterized by being connected to each other.

According to the structure of this invention, the 1st electric power feeding part and the 2nd electric power feeding part are electrically connected with the 1st electric power feeding terminal and the 2nd electric power feeding terminal on the thickness direction projection surface of the said sealing layer. That is, the first power supply unit and the second power supply unit are connected to the first power supply terminal and the second power supply terminal via the sealing layer.
Therefore, it is possible to lay the power supply member up to the region where the sealing layers are stacked, and power can be reliably supplied even if the frame region is narrow.
Moreover, according to the structure of this invention, each of a cable member, a 1st electric power feeding terminal, and a 2nd electric power feeding terminal is connected via opening. That is, the inner and outer members of the frame member are connected via the opening. Therefore, the organic EL panel can be electrically connected to the external power source without removing it from the frame member.

  According to a second aspect of the present invention, the frame region has a width of 100 μm or more and 3 mm or less, and the first power supply terminal or the second power supply terminal is located on a projection surface in the member thickness direction of the light emitting region. The organic EL panel power supply structure according to claim 1, wherein:

According to the structure of this invention, the width | variety of the said frame area is 100 micrometers or more and 3 mm or less. That is, the width of the frame region is extremely narrow, and it is difficult to connect the first power supply unit and the second power supply unit to the first power supply terminal or the second power supply terminal.
Therefore, according to the configuration of the present invention, since the first feeding terminal or the second feeding terminal is located on the projection surface in the member thickness direction of the light emitting area, power can be supplied regardless of the size of the frame area.

  According to a third aspect of the present invention, in the organic EL panel according to the first or second aspect, the opening is a slit and faces in a direction intersecting with a normal to the surface of the substrate. It is a feeding structure.

  According to the structure of this invention, the said opening is a slit and is suitable for the direction which cross | intersects with respect to the perpendicular of the surface of a base material. That is, the hole that forms the opening extends in a direction that intersects the normal to the surface of the substrate. Therefore, when the cable member is connected, the thickness hardly increases, and the feature that the organic EL panel is thin is hardly impaired.

  According to a fourth aspect of the present invention, the frame member has elasticity, and the cable member is pressed against the first power supply terminal or the second power supply terminal by the restoring force of the frame member. Item 4. A power feeding structure for an organic EL panel according to any one of Items 1 to 3.

  According to the configuration of the present invention, the cable member is pressed against the first power supply terminal or the second power supply terminal by the restoring force of the frame member. That is, since the cable member and the first power supply terminal or the second power supply terminal are pressed and directly connected, it can be reliably grounded. Also, the installation work is easy.

  5. The power supply structure for an organic EL panel according to claim 1, wherein the frame member is preferably made of silicone rubber (claim 5).

  According to a sixth aspect of the present invention, the first power supply terminal or the second power supply terminal is a conductive uneven member that forms a plurality of protrusions, and the plurality of protrusions can contact the cable member. 6. The power feeding structure for an organic EL panel according to claim 1, wherein the power feeding structure is an organic EL panel.

According to the structure of this invention, the convex part of a 1st electric power feeding terminal or a 2nd electric power feeding terminal can contact a cable member. That is, when the convex portion of the first power supply terminal or the second power supply terminal is in direct contact with the cable member, the cable member and the first power supply terminal or the second power supply terminal are electrically connected to enable power supply.
Since power is supplied by contact of the convex portion, a space is formed between the portion other than the convex portion and the cable member. Therefore, it is easier to remove the cable member than when the entire surface of the first power supply terminal or the second power supply terminal is in contact with the cable member.
In addition, since power is supplied by the contact of the convex portion, it is possible to ensure a contact pressure and to make grounding more reliably.

  The invention according to claim 7 is characterized in that at least one of the plurality of convex portions is a hemispherical protrusion formed by firing a solder ball or cream solder formed in a dot shape. Item 7. A power feeding structure for an organic EL panel according to Item 6.

The term “solder” as used herein represents so-called soft solder, and represents not only a narrow concept of an alloy of tin and lead but also two or more kinds of metal alloys having adhesiveness in general. That is, it may be other than a lead alloy.
That is, the “solder ball” here is made of solder, and the raw material is not limited to a lead alloy, and a commercially available spherical solder ball can be preferably used.
“Hemispherical protrusions formed by baking cream solder” means hemispherical protrusions formed by printing cream solder in dots on copper foil, etc., flowing into a reflow oven, and baking. It is.

  According to the configuration of the present invention, at least one of the plurality of convex portions is a solder ball or a hemispherical protrusion formed by baking cream solder formed in a dot shape, and the solder ball or the dot shape is formed. The hemispherical protrusions formed by firing the formed cream solder can easily change the form (size and height) depending on the formation time and amount, making it easy to form irregularities and easy to adjust the height of the convex parts It is.

  In the invention according to claim 8, the first power supply terminal and the second power supply terminal are conductive uneven members forming a plurality of convex portions, and the apex of the convex portion of the first power supply terminal is the second power supply terminal. 8. The power feeding structure for an organic EL panel according to claim 6, wherein the height of the top of the convex portion is substantially equal.

  Here, “the heights are substantially equal” represents a state where the difference in height is within −50 μm to 50 μm, and the preferable difference in height is −20 μm to 20 μm, more preferably − It is 10 μm or more and 10 μm or less.

  According to the configuration of the present invention, the first power supply terminal and the second power supply terminal are conductive uneven members that form a plurality of convex portions, and the vertex of the convex portion of the first power supply terminal is the convex shape of the second power supply terminal. The height is almost equal to the apex of the part. That is, the height is adjusted by the convex portion of the first power supply terminal and the convex portion of the second power supply terminal. Therefore, even if the cable member is smooth and thin, there is no step between the first power supply terminal and the second power supply terminal.

  By the way, in order to take advantage of the feature that the thickness of the organic EL panel is extremely small and lightweight, it is necessary to make the thickness of the power feeding member as thin as possible.

  Accordingly, in the invention described in claim 9, the first power feeding unit is connected to the first power feeding terminal via the first conductive member, and the second power feeding unit is connected to the first power feeding terminal via the second conductive member. The first conductive member and the second conductive member are made of metal and are in the form of a foil, a plate, or a film. It is the electric power feeding structure of the organic electroluminescent panel in any one of.

  According to the configuration of the present invention, the first conductive member is used for connection between the first power supply unit and the first power supply terminal, and the second conductive member is used for connection between the second power supply unit and the second power supply terminal. doing. And these 1st conductive members and 2nd conductive members are metal, and since it is either foil shape, plate shape, or film | membrane form, the thickness of the thickness by presence of a 1st conductive member and a 2nd conductive member is used. There is almost no increase. Therefore, power can be reliably supplied without impairing the thin feature of the organic EL panel.

  According to a tenth aspect of the present invention, in the organic EL according to any one of the first to eighth aspects, the cable member has a foil shape, and a reinforcing member is provided at a distal end portion in the insertion direction. This is a panel feeding structure.

According to the structure of this invention, since a cable member is foil shape, when inserting, a cable member tends to bend, and it may break in some cases.
Therefore, according to the configuration of the present invention, since the reinforcing member is provided at the distal end portion in the insertion direction, the strength of the cable member is reinforced, and even if the strength of the cable member is small, it is difficult to bend and break. Hard to do. Therefore, the reliability is high.

  The invention according to claim 11 has a first conductive member, an insulating member, and a second conductive member, and each of the first conductive member and the second conductive member is plate-shaped or foil-shaped, The first conductive member has a first conductive member missing portion that is partially missing, and the second conductive member is a second conductive member that is partially missing. When the first conductive member and the second conductive member are overlapped with the insulating member sandwiched therebetween, at least a part of the first conductive member has the second conductive member missing portion. It is located in a region projected in the overlapping direction, and at least a part of the second conductive member is located in a region where the first conductive member missing portion is projected in the overlapping direction, and the second power feeding unit is Passing through the first conductive member missing portion and being connected to the second conductive member A feed structure of the organic EL panel according to any one of claims 1 to 10, characterized.

According to the configuration of the present invention, the first conductive member and the second conductive member for supplying electricity to the first power supply unit or the second power supply unit of the organic EL device are plate-shaped or foil-shaped, both of which are The thickness is relatively thin. For this reason, even if the first conductive member and the second conductive member are arranged in an overlapped state, the thickness of the entire organic EL panel is not significantly increased, and the organic EL panel can be made sufficiently thin.
Moreover, according to the structure of this invention, the 1st conductive member missing part and the 2nd conductive member missing part which are the parts which made the first conductive member and the 2nd conductive member part missing are formed, respectively. The shape is different between the two members. Then, when both the first conductive member and the second conductive member are overlapped with the insulating member interposed therebetween, at least a part of the first conductive member is in a region where the second conductive member missing portion is projected in the overlapping direction. In addition, at least a part of the second conductive member is positioned in a region where the first conductive member missing portion is projected in the overlapping direction. That is, in the organic EL panel of the present invention, when the first conductive member and the second conductive member are overlapped with the insulating member sandwiched therebetween, most of the conductive member is directly connected to the other conductive member by the insulating member. By not overlapping, the first conductive member and the second conductive member are connected to the first electrode layer and the second electrode layer of the organic EL device without increasing the horizontal size (width and depth). (Contact).

  According to the power supply structure of the organic EL panel of the present invention, the cable member, the first power supply terminal, and the second power supply terminal are connected on the projection surface in the thickness direction of the sealing layer through the opening of the frame member. Even if it is narrow, power can be reliably supplied.

It is a conceptual diagram showing the use condition of the electric power feeding structure of the organic EL panel in 1st Embodiment of this invention. It is the conceptual diagram of the electric power feeding structure of the organic electroluminescent panel in 1st Embodiment of this invention, and is the figure seen from the back side. It is a disassembled perspective view of the organic electroluminescent panel of FIG. It is explanatory drawing of each area | region of the organic electroluminescent apparatus of FIG. It is explanatory drawing of the internal structure of the organic EL apparatus of FIG. 2, (a) represents the schematic diagram of the connection structure of a 1st electric power feeding part and an organic EL element, (b) connected the 2nd electric power feeding part and an organic EL element. A schematic diagram of the structure is shown. It is a disassembled perspective view of the electric power feeding member and frame member of FIG. It is a perspective view of the electric power feeding member of FIG. It is a top view showing the positional relationship of each site | part of the electric power feeding member of FIG. It is sectional drawing of the organic electroluminescent panel of FIG. 2, (a) is AA sectional drawing, (b) is BB sectional drawing. Note that the shape of the solder ball is deformed for the purpose of illustration. It is the perspective view which looked at the frame member of Drawing 3 from another direction. It is a partially broken perspective view of the principal part of the frame member of FIG. It is explanatory drawing of the principal part of the cable member of FIG. 2, (a) is an expansion perspective view of the state of FIG. 2, (b) is the perspective view which looked at (a) from another direction. It is a disassembled perspective view of the principal part of the cable member of FIG.12 (b). It is the perspective view which looked at the electric power feeding member of FIG. 7 from another direction. It is CC sectional drawing of the organic electroluminescent panel of FIG. Note that the shape of the solder ball is deformed for the purpose of illustration. It is explanatory drawing at the time of inserting a cable member in an organic electroluminescent panel, (a) represents the state before inserting and (b) after inserting. It is explanatory drawing of the electric power feeding structure of the organic electroluminescent panel in other embodiment, (a) represents the state before insertion, (b) after insertion. It is explanatory drawing of the electric power feeding structure of the organic electroluminescent panel in other embodiment.

Hereinafter, embodiments of the present invention will be described in detail.
In the following description, unless otherwise specified, the vertical positional relationship of the power feeding structure 1 of the organic EL panel will be described with reference to the posture of FIG. That is, the description will be made based on the posture in which the light emitting surface 33 (see FIG. 1) of the organic EL panel 2 is positioned below.

  The organic EL panel power supply structure 1 of the first embodiment relates to a power supply structure of an organic EL panel 2 mainly used as a lighting device in a living space as shown in FIG. It has a feature in the connection structure of the cable member 3 electrically connected to the power source.

The organic EL panel 2 is formed of an organic EL device 5, a frame member 6, and a power feeding member 7, as shown in FIG.
The organic EL device 5 includes a light emitting region 30 that actually emits light when turned on and a frame region 31 surrounding the light emitting region 30 when viewed in plan as shown in FIG.
The light emitting region 30 is a quadrangular region, and the light emitting surface 33 of the organic EL panel 2 on the substrate 42 side of the organic EL device 5 (the surface on the substrate 42 (see FIG. 5) side, which actually emits light). Is included. The light emitting region 30 of the present embodiment is similar to the substrate 42 and is a square region.
The frame region 31 is a region surrounding the light emitting region 30 in a ring shape as shown in FIG. 4 and is a non-light emitting region that does not emit light when turned on. The frame region 31 is provided with a plurality of power feeding portions 32 that function as electrical contacts with the outside.
The width of the frame region 31 is preferably 100 μm or more and 3 mm or less, more preferably 2.5 mm or less, more preferably 1 mm or less, particularly preferably from the viewpoint of sufficiently securing the occupied area of the light emitting region 30. It is 100 μm or more and 500 μm or less.
The occupied area in the plane of the frame region 31 is preferably 1% or more and 20% or less, and more preferably 1% or more and 10% or less.

  As shown in FIG. 5, the power feeding unit 32 is electrically connected to the first power feeding unit 35 electrically connected to the first electrode layer 43 in the organic EL element 41 and the second electrode layer 46 in the organic EL element 41. The 2nd electric power feeding part 36 connected to is provided.

The 1st electric power feeding part 35 is an area | region which becomes a rectangular shape when planarly viewed like FIG. That is, it is formed from a region parallel to one side of the substrate 42.
The second power supply unit 36 is an area having an “L” shape when seen in a plan view as shown in FIG. 4. In other words, the second power feeding unit 36 is formed in the plane from a region parallel to one side of the substrate 42 and a region perpendicular to the one side.
And the 1st electric power feeding part 35 and the 2nd electric power feeding part 36 are cyclically arrange | positioned at predetermined intervals around the light emission area | region 30 like FIG. That is, the 1st electric power feeding part 35 and the 2nd electric power feeding part 36 are not connected, but are distribute | arranged intermittently.
Specifically, the second power feeding unit 36 is located at a position corresponding to the corner of the substrate 42, and the first power feeding unit 35 is located between the second power feeding units 36 adjacent in the circumferential direction. Yes. That is, in the frame region 31, the second power feeding unit 36 and the first power feeding unit 35 are alternately arranged at a predetermined interval in the circumferential direction around the light emitting region 30.

The organic EL device 5 of the present embodiment has an organic EL element 41 (laminated body) laminated on a light-transmitting substrate 42 (base material) as shown in FIG. 5, and the organic EL element 41 is sealed thereon. The inorganic sealing layer 47 to be stopped is laminated.
The organic EL element 41 includes a functional layer 45 (organic light emitting layer) that actually emits light between at least the first electrode layer 43 and the second electrode layer 46 as shown in FIG. The organic EL device 5 of the present embodiment employs a so-called “bottom emission type” organic EL device 5 that extracts light from at least the substrate 42 side, and the organic EL element 41 includes the first electrode layer 43 from the substrate 42 side. The functional layer 45 and the second electrode layer 46 are laminated in this order.

  The material of the board | substrate 42 will not be specifically limited if it is provided with transparency and insulation, For example, it selects from a glass substrate, a flexible film board | substrate, a plastic substrate etc. suitably, and is used. In particular, a glass substrate or a transparent film substrate is suitable from the viewpoint of transparency and workability, and in this embodiment, a glass substrate is employed as the substrate.

  The first electrode layer 43 is a layer formed of a transparent conductive oxide, and is a layer having transparency when turned off. Specifically, indium tin oxide (ITO) or the like can be used. The first electrode layer 43 of the present embodiment is used as an anode and is made of ITO.

  The functional layer 45 is a layer provided between the first electrode layer 43 and the second electrode layer 46 and including at least one organic light emitting layer. The functional layer 45 of the present embodiment is composed of a plurality of layers mainly made of organic compounds. The functional layer 45 can be formed of a known material such as a low molecular dye material or a conjugated polymer material used in a general organic EL device. In addition, the functional layer 45 may have a multilayer structure including a plurality of layers such as a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and an electron injection layer.

  The material of the 2nd electrode layer 46 is not specifically limited, For example, silver (Ag), aluminum (Al), etc. are mentioned. The second electrode layer 46 of the present embodiment is used as a cathode and is made of Al.

  The material of the inorganic sealing layer 47 is not particularly limited as long as it has insulating properties and sealing properties, but one or more elements selected from oxygen, carbon, and nitrogen, and silicon It is preferably formed of a silicon alloy composed of an element, and silicon nitride or silicon oxide containing a bond such as Si—O, Si—N, Si—H, or N—H, and an oxynitride that is an intermediate solid solution of both. Particularly preferred is silicon. Moreover, you may use the inorganic sealing layer of a multilayer structure.

Next, the power supply member 7 will be described.
The power feeding member 7 is located between the frame member 6 and the organic EL device 5 as shown in FIG. 3 and is electrically connected to the organic EL device 5 from the cable member 3 (see FIG. 2) electrically connected to an external power source. It is a member that forms a supply path.

  As shown in FIG. 6, the power supply member 7 is formed by laminating a heat equalizing member 15, a first conductive member 10, an insulating member 11, and a second conductive member 12 in order from the organic EL device 5 side (lower side). Has been.

The soaking member 15 is a flat plate member having a square shape in plan view as shown in FIG. 6, and is a member having high thermal conductivity.
The soaking member 15 is disposed on the projection surface in the member thickness direction (stacking direction) of the organic EL element 41 in the light emitting region 30. Therefore, the heat generated in the organic EL element 41 in the light emitting region 30 when the organic EL device 5 is turned on is transmitted to the heat equalizing member 15, so that the heat can be uniformly distributed in a flat shape. Therefore, it is possible to prevent heat from being collected locally within the surface of the organic EL device 5 and to prevent the occurrence of light emission defects due to heat.

  The first conductive member 10 is a member having conductivity, and is formed by bending a foil-like body or a plate-like body punched into a predetermined shape. In the present embodiment, the first conductive member 10 is formed by bending a plate-like conductor.

As shown in FIG. 6, the first conductive member 10 includes a flat plate-like first main body portion 16 and first leg portions 17.
The 1st main-body part 16 is a member similar in shape to the soaking | uniform-heating member 15, and is a member made into square shape in this embodiment.
The first leg portion 17 is formed integrally with the side that forms the outer edge of the first main body portion 16. In the present embodiment, a plurality of the first leg portions 17 are formed, and one first leg portion 17 is formed at an intermediate portion of each side (four sides) of the first main body portion 16. That is, the first leg portions 17 are located in the vicinity of the center in the extending direction of each side, and are formed at equal intervals in the circumferential direction of the first main body portion 16.

As shown in FIG. 6, the first leg portion 17 has a protruding piece portion 18 that protrudes outward from the outer edge of the first main body portion 16 in the horizontal direction (surface direction of the first main body portion 16), and an outer end portion of the protruding piece portion 18 The standing wall portion 20 that hangs downward from the lower wall portion 21 and the lower plate portion 21 that protrudes outward from the lower end of the standing wall portion 20 are integrally formed. The protruding piece portion 18, the standing wall portion 20, and the lower plate portion 21 all have a rectangular shape with the side direction of the first main body portion 16 as a long side.
In other words, the outer end portion of the protruding piece 18 is bent downward to form the standing wall portion 20, and the lower end of the standing wall portion 20 is bent outward to form the lower plate portion 21. Accordingly, the lower plate portion 21 is located away from the first main body portion 16 and below the lower surface of the first main body portion 16.

Here, the first leg portion 17 of the first conductive member 10 is positioned near the center of each side of the first main body portion 16 as described above. For this reason, in the edge part of the 1st electrically-conductive member 10, the part in which the 1st leg part 17 is formed protrudes outside rather than the circumference | surroundings. In other words, in the edge portion of the first conductive member 10 where the first leg portion 17 is not formed, the edge end is located inside the periphery (the portion where the first leg portion 17 is formed). doing. In other words, it can be said that the edge portion of the first conductive member 10 is partly cut out and missing.
This missing portion is referred to as a first conductive member missing portion 22 in the following description. In other words, the first conductive member missing portion 22 is a region adjacent to the outside of the edge located inside the periphery.

  As shown in FIG. 6, the first conductive member missing portion 22 is located in the vicinity of the corner (square) of the first main body 16 and has an L shape in plan view (see FIG. 8). ). That is, the first conductive member missing portion 22 extends along the circumferential direction of the edge portion of the first conductive member 10, and a part of the first conductive member missing portion 22 extends while being bent at a right angle. These first conductive member missing portions 22 are arranged at intervals in the circumferential direction of the edge portion of the first conductive member 10.

In the state where the power supply member 7 is assembled as shown in FIG. 7, the first conductive member 10 is formed with first unevenness at a position corresponding to a connector connection hole 50 (communication hole 95) described later of the first main body portion 16. A member 23 is provided.
The first unevenness forming member 23 is a member that forms unevenness on the exposed surface from the communication hole 95. That is, the first unevenness forming member 23 has a plurality of convex portions 28.
The height of the convex portion 28 (height from the first main body portion 16) is slightly larger than the total thickness of the insulating member 11, the second conductive member 12, and the bottom portion 98 of the frame member 6. That is, in the state where the power supply member 7 is assembled as shown in FIG. 7, a part of the convex portion 28 protrudes from the communication hole 95 as shown in FIG. 15.
In the present embodiment, the first unevenness forming member 23 employs solder balls, and a plurality of solder balls are distributed over the surface in the communication holes 95.
Further, the diameter R (major axis) of the solder ball is slightly larger than the total thickness of the insulating member 11, the second conductive member 12, and the bottom portion 98 of the frame member 6.

As shown in FIG. 6, when the eyes are moved to the insulating member 11 sandwiched between the first conductive member 10 and the second conductive member 12, the insulating member 11 is an insulating member, and the first conductive member 10. And a member for electrically separating the second conductive member 12. The insulating member 11 has a square shape, and in this embodiment, has a square shape.
In the insulating member 11, a connector connection hole 50 that penetrates the insulating member 11 in the member thickness direction is formed in the vicinity of one of the four sides forming the edge portion of the insulating member 11. The connector connection hole 50 is located at a position corresponding to the first unevenness forming member 23 of the first conductive member 10 in a state where the power feeding member 7 is assembled as shown in FIG. It can be inserted. In addition, the connector connection hole 50 of the present embodiment is a through hole having a quadrangular opening.

  The second conductive member 12 is a member having conductivity, and is formed by bending a foil-like body or a plate-like body punched into a predetermined shape. In the present embodiment, a plate-like conductor is formed by bending as the second conductive member 12. That is, the second conductive member 12 is formed by the same member and the same method as the first conductive member 10 described above, but is a member having a different shape from the first conductive member 10.

  More specifically, the second conductive member 12 has a flat plate-like second main body portion 56 and second leg portions 57 as shown in FIG.

The 2nd main-body part 56 is a member made into the shape similar to the insulating member 11, and is a member made into square shape in this embodiment.
In the second main body portion 56, a connector connection hole 58 that penetrates the second main body portion 56 in the member thickness direction is formed in the vicinity of one of the four sides forming the edge portion of the second main body portion 56. ing. Specifically, the connector connection hole 58 is provided at a position corresponding to the connector connection hole 50 of the insulating member 11 in a state where the power feeding member 7 is assembled as shown in FIG. That is, the connector connecting hole 58 can be inserted through the first unevenness forming member 23 of the first conductive member 10. The opening shape of the connector connection hole 58 of this embodiment is a rectangular through hole.

  The second leg portion 57 is formed integrally with a side that forms the outer edge of the second main body portion 56. In the present embodiment, a plurality of second leg portions 57 are formed, and one second leg portion 57 is formed in the vicinity of both end portions of the four sides of the second main body portion 56. That is, a total of two second leg portions 57 are formed in the vicinity of the ends in the extending direction of each side. In other words, the second leg portion 57 is formed in the vicinity of the corner portion of the second main body portion 56. And in this embodiment, the clearance gap 60 is formed between the 2nd 2nd leg parts 57 located in a corner | angular part like FIG. That is, the plurality of second leg portions 57 are positioned in the vicinity of both ends in the extending direction of each side, and a plurality of second leg portions 57 are formed around the second main body portion 56 at a predetermined interval.

As shown in FIG. 6, the second leg portion 57 includes a protruding piece portion 61 that protrudes outward in the horizontal direction from the outer edge of the second main body portion 56, and a standing wall portion 62 that is suspended downward from the outer end portion of the protruding piece portion 61. The lower plate portion 63 that protrudes outward from the lower end of the standing wall portion 62 is integrally formed. The protruding piece portion 61, the standing wall portion 62, and the lower plate portion 63 all have a rectangular shape with the side direction of the second main body portion 56 as the long side.
In other words, the outer end portion of the protruding piece portion 61 is bent downward to form the standing wall portion 62, and the lower end of the standing wall portion 62 is bent outward to form the lower plate portion 63. Accordingly, the lower plate portion 63 is located at a position away from the second main body portion 56 and is located below the lower surface of the second main body portion 56.

Here, as described above, the second leg portions 57 of the second conductive member 12 are positioned one by one near both ends in the extending direction of each side of the second main body portion 56. For this reason, in the edge part of the 2nd electrically-conductive member 12, the part in which the 2nd leg part 57 is formed protrudes outside rather than the circumference | surroundings. In other words, the portion of the edge portion of the second conductive member 12 where the second leg portion 57 is not formed is located on the inner side of the periphery (the portion where the second leg portion 57 is formed). doing. That is, it can be said that a part of the edge portion of the second conductive member 12 is cut out and missing.
This missing portion is referred to as a second conductive member missing portion 65 in the following description. That is, the second conductive member missing portion 65 is a region adjacent to the outside of the edge located inside the periphery.

  As shown in FIG. 6, the second conductive member missing portion 65 is located in the vicinity of the center in the extending direction of each side forming the edge portion of the second main body portion 56, and has a rectangular shape in plan view. (See FIG. 8). That is, the second conductive member missing portion 65 is provided in the vicinity of the portion between the squares of the second main body portion 56. The second conductive member missing portions 65 are arranged at intervals in the circumferential direction of the edge portion of the second conductive member 12.

When the power supply member 7 is assembled as shown in FIG. 7, the second conductive member 12 is located at a position corresponding to a connector connection hole 91 (see FIG. 11) of the frame member 6, which will be described later. Is provided.
The second unevenness forming member 66 is a member that forms unevenness on the exposed surface from the connector connection hole 90 as shown in FIG. That is, the second unevenness forming member 66 has a plurality of convex portions 67.
The height of the convex portion 67 (the height from the top surface of the second main body portion 56) is slightly larger than the total thickness of the bottom portion 98 of the frame member 6. That is, in the state where the power feeding member 7 is assembled as shown in FIG. 7, a part of the convex portion 67 protrudes from the connector connection hole 90 as shown in FIG. 15. Further, as shown in FIG. 15, the positions of the vertices of the protrusions 67 and the vertices of the protrusions 28 are substantially the same height.
Specifically, the difference between the apex of the convex portion 67 and the apex of the convex portion 28 is within −10 μm to 10 μm.
In the present embodiment, the second unevenness forming member 66 employs solder balls, and the plurality of solder balls are distributed in a planar shape in the connector connection holes 91.
Further, the diameter r of the solder ball forming the convex portion 67 is slightly larger than the total thickness of the bottom portion 98 of the frame member 6, and is smaller than the diameter R of the convex portion 28 as shown in FIG.

  When attention is paid to the material of the member constituting the power supply member 7, the material of the soaking member 15 is not particularly limited as long as it has high thermal conductivity, and for example, carbon or the like can be adopted.

The material of the 1st conductive member 10 and the 2nd conductive member 12 will not be specifically limited if it has electroconductivity, For example, copper, aluminum, stainless steel etc. can be employ | adopted and it is formed with aluminum among them. Preferably it is. In addition, aluminum has corrosion resistance, high heat conductivity, and therefore has a high heat transfer function, and also has a low moisture permeability and therefore has a high sealing function.
In the present embodiment, tin-plated copper is adopted as the first conductive member 10 and the second conductive member 12.

  The material of the insulating member 11 is not particularly limited as long as it has insulating properties, but PET (polyethylene terephthalate) is preferably employed from the viewpoint of excellent smoothness, heat resistance, and electrical insulating properties.

  The material of the solder balls used for the first unevenness forming member 23 and the second unevenness forming member 66 is one or more elements selected from copper, silver, nickel, zinc, bismuth, indium, and aluminum, respectively. It is preferably formed of an alloy made of tin element.

Next, the frame member 6 will be described.
The frame member 6 is a member that integrates the organic EL device 5 and the power supply member 7 and is a frame that reduces or prevents an impact on the organic EL device 5 received from the outside.
The frame member 6 is a member having flexibility and elasticity. As shown in FIG. 10, the frame member 6 includes a main body 70 that covers the back surface (opposite side of the substrate 42) of the organic EL device 5, and a side wall that continues from the end of the main body 70 and is continuous with the main body 70. It is formed by a portion 71 and a frame surface portion 72 projecting inwardly from the end of the side wall portion 71 toward the light emitting surface 33 side.

The main body portion 70 is a portion having a shape similar to the surface of the substrate 42 of the organic EL device 5 and is a substantially flat portion. The main body portion 70 has a connection portion 73 to which the cable member 3 can be connected.
As shown in FIG. 11, the connecting portion 73 has a notch 96 that is notched from the outside (end side) to the inside (center side), and forms a step in the member thickness direction. That is, the top surface portion 77 that forms most of the top surface of the main body portion 70 and the bottom surface portion 76 that is provided at a position one step lower than the top surface portion 77 are the side surface portions that connect the top surface portion 77 and the bottom surface portion 76. 78 is continuous in a stepped manner.

In addition, the side wall 78 provided on the inner wall of the notch 96 so as to face inwardly has an insertion hole 97 extending in a direction orthogonal to the side wall 78 (horizontal direction). ing. That is, the insertion hole 97 extends in the horizontal direction and is parallel to the top surface of the main body 70.
The insertion hole 97 is a bottomed hole whose opening shape is a rectangular shape. In the present embodiment, the insertion hole 97 is a slit.
The width and length of the insertion hole 97 have substantially the same shape as the distal end portion of the cable member 3 in the insertion direction, and are the distal end portion of the cable member 3, which are the positive electrode side exposed region 86 and the negative electrode side exposed region 87. Can be partly or entirely inserted.

A bottom portion 98 that forms the inner wall surface of the insertion hole 97 is flush with the bottom surface portion 76.
The bottom portion 98 has connector connection holes 90 and 91 penetrating in the member thickness direction (vertical direction) of the bottom portion 98.
Both the connector connecting holes 90 and 91 have a quadrangular opening shape, and the convex portion 28 of the first concave-convex forming member 23 or the convex portion 67 of the second concave-convex forming member 66 can be inserted.
Thus, the connector connection holes 90 and 91 and the insertion hole 97 form a continuous space, and the members inside and outside the frame member 6 are connected via the connector connection holes 90 and 91 and the insertion hole 97. It is possible to connect.

Turning to the side wall 71, the side wall 71 is a part that covers the outer end surface of the organic EL device 5.
The frame surface portion 72 is a portion that covers a part of the substrate 42 of the organic EL device 5, and is continuously formed in an annular shape so as to be substantially “B” -shaped in plan view. have.
The extraction opening 75 is an opening for extracting light emitted from the organic EL device 5 to the outside.

  The material of the frame member 6 is not particularly limited as long as it has flexibility and elasticity, and for example, a silicone resin can be adopted.

  Next, the cable member 3 will be described.

The cable member 3 is a flexible cable and is a bendable sheet-like cable. The cable member 3 has a laminated structure in which the positive electrode side conductive wiring 80 and the negative electrode side conductive wiring 81 are sandwiched between the first insulating film 82 and the second insulating film 83 as shown in FIGS. A reinforcing member 85 is provided on the surface of the second insulating film 83.
Further, the cable member 3 is provided with a positive electrode side exposed region 86 and a negative electrode side exposed region 87 in which a part of each of the positive electrode side conductive wire 80 and the negative electrode side conductive wire 81 is exposed from the first insulating film 82.
The positive electrode side exposed region 86 is a region functioning as a positive electrode terminal, and the negative electrode side exposed region 87 is a region functioning as a negative electrode terminal.
That is, the cable member 3 connects the positive electrode terminal of the external power source and the positive electrode side conductive wire 80, and the negative electrode terminal of the external power source and the negative electrode side conductive wire 81, thereby connecting the positive electrode side conductive wire 80 and the negative electrode side conductive wire 81. Electricity can flow to the positive electrode terminal and the positive electrode exposed region 86 of the external power source and to the negative electrode terminal and the negative electrode exposed region 87 of the external power source.

The positive electrode side conductive wiring 80 is a plate-like or foil-like member having conductivity, and is a conductive foil extending in a rectangular shape in this embodiment.
The negative electrode side conductive wiring 81 is a plate-like or foil-like member having conductivity, and is a conductive foil extending in a rectangular shape in this embodiment.
The first insulating film 82 is a sheet-like member having insulating properties, and a notch for forming a positive electrode side exposed region 86 and a negative electrode side exposed region 87 is provided at an end thereof. The notch is a notch that is notched along the longitudinal direction from the end of the cable member 3.
The second insulating film 83 is a sheet-like member having insulation properties.
The reinforcing member 85 is a member that reinforces the strength of the cable member 3. The reinforcing member 85 is an “L” -shaped member as viewed from the side as shown in FIG. 12, and is formed of a main body portion 88 and a protruding portion 89 protruding upward from a part of the main body portion 88. That is, the top surface of the projecting portion 89 and the top surface of the main body portion 88 are continuous with the side surface of the main body portion 88 (the side surface on the insertion side to the frame member 6).

  The material of the positive electrode side conductive wiring 80 and the negative electrode side conductive wiring 81 is not particularly limited as long as it has conductivity. For example, copper, aluminum, stainless steel, etc. can be adopted, and among these, it is formed of aluminum. Preferably it is.

  The material of the first insulating film 82 and the second insulating film 83 is not particularly limited as long as it has insulating properties. However, from the viewpoint of excellent smoothness, heat resistance, and electrical insulating properties, PET (polyethylene terephthalate) is used. ) Is preferably employed.

  The material of the reinforcing member 85 is not particularly limited as long as the cable member 3 can be prevented from being excessively bent when the cable member 3 is attached to the frame member 6. For example, polyester resin or aluminum can be employed. .

  Then, the positional relationship of each member of the electric power feeding structure 1 of an organic EL panel is demonstrated.

  In the organic EL panel power supply structure 1, the power supply member 7 is placed on the organic EL device 5 as described above, and is integrated by the frame member 6. The cable member 3 is inserted into the connection portion 73 of the frame member 6.

Specifically, the heat equalizing member 15 is placed on the inorganic sealing layer 47 in the light emitting region 30 of the organic EL device 5, and the first conductive member 10, the insulating member 11, Two conductive members 12 are laminated.
At this time, each predetermined member which forms this laminated structure is in a state of being bonded via an adhesive material as necessary. As the adhesive material, RTV rubber or a paste having high thermal conductivity can be suitably used.

  First, attention is paid to the positional relationship among the power supply member 7, the frame member 6, and the cable member 3, which is a characteristic structure of the present invention.

The connector connection hole 50 of the insulating member 11 of the power supply member 7, the connector connection hole 58 of the second conductive member 12, and the connector connection hole 90 of the frame member 6 communicated in the member thickness direction as shown in FIG. In this state, one communication hole 95 penetrating the insulating member 11, the second conductive member 12, and the bottom portion 98 of the frame member 6 is formed. The communication hole 95 is in a state where the convex portion 28 of the first unevenness forming member 23 is inserted.
As shown in FIG. 15, a part of the convex portion 28 of the first unevenness forming member 23 projects from the communication hole 95 and enters the insertion hole 97 of the frame member 6.
A part of the cable member 3 is inserted into the insertion hole 97, and the positive electrode side exposed region 86 and the convex portion 28 are in direct contact with each other in the insertion hole 97. That is, a conductive path is formed between the positive electrode side conductive wiring 80 and the first unevenness forming member 23. In other words, a conductive path between the external power source and the first conductive member 10 is formed.

Further, the connector connecting hole 91 is in a state in which the convex portion 67 of the second concavo-convex forming member 66 is inserted as shown in FIG. 15, and the convex portion 67 partially protrudes from the communication hole 95. And enters the insertion hole 97 of the frame member 6.
A part of the cable member 3 is inserted into the insertion hole 97, and the negative electrode side exposed region 87 and the convex portion 67 are in direct contact with each other in the insertion hole 97. That is, a conductive path is formed between the negative electrode side conductive wiring 81 and the second unevenness forming member 66. In other words, a conductive path between the external power source and the second conductive member 12 is formed.

Further, the distal end portion (the portion on the reinforcing member 85 side) of the cable member 3 is inserted into the connection portion 73 of the frame member 6. That is, the side surface portion 78 of the frame member 6 and the side surface of the reinforcing member 85 are in contact, and the top surface portion 77 of the frame member 6 forms the same plane as the top surface of the reinforcing member 85 of the cable member 3 as shown in FIG. And it is the same.
Therefore, there is almost no gap between the connection part 73 of the frame member 6 and the cable member 3, and dust or the like hardly enters the connection part 73. For this reason, spontaneous ignition or the like hardly occurs and safety is high.

Further, as shown in FIG. 16B, the flexible frame member 6 is attached so as to fasten the power feeding member 7 and the organic EL device 5. That is, the frame member 6, the power supply member 7, and a predetermined portion of the organic EL device 5 are in close contact (or almost in close contact), and the space between the frame member 6 and the power supply member 7 and the organic EL device 5 is closed without any space (with almost no open space). .
Specifically, as shown in FIG. 16, the upper surface of the frame surface portion 72 of the frame member 6 and the lower surface of the organic EL device 5 (on the substrate 42 and the light emitting surface 33) are in close contact with each other. Thus, the organic EL panel 2 is in a state where the first conductive member 10 and the second conductive member 12 are covered with the frame member 6 and is not exposed to the outside, and the first conductive member 10 and the second conductive member 12 are not exposed. The structure is such that water does not enter the part where is placed. Further, the light emitting surface 33 is located in the extraction opening 75, and light can be extracted from the extraction opening 75.

  When attention is paid to the portion where the first conductive member 10 and the second conductive member 12 are laminated, the second conductive member 12 is located above the first conductive member 10 as shown in FIG. 10 first main body portions 16 (see FIG. 6) and second main body portions 56 (see FIG. 6) of the second conductive member 12 are overlapped.

Here, the second leg portion 57 of the second conductive member 12 positioned on the upper side, as shown in FIG. 7, has a vertical direction (member thickness) compared to the first leg portion 17 of the first conductive member 10 positioned on the lower side. Direction) is longer.
Specifically, the vertical length of the standing wall portion 62 of the second leg portion 57 of the second conductive member 12 is equal to the vertical direction of the standing wall portion 20 of the first leg portion 17 of the first conductive member 10. The length of the heat equalizing member 15 is longer than the length of.
Therefore, the lower surface of the lower plate portion 63 positioned at the lower end of the second leg portion 57 of the second conductive member 12 and the lower surface of the lower plate portion 21 positioned at the lower end of the first leg portion 17 of the first conductive member 10 are The height in the vertical direction is the same, and the lower surface of the second leg portion 57 of the second conductive member 12 and the lower surface of the first leg portion 17 of the first conductive member 10 are located on substantially the same plane. Yes.

  Further, in the power supply member 7, as shown in FIG. 14, the first leg 17 of the first conductive member 10 and the second of the second conductive member 12 in the circumferential direction of the edge portion (the edge portion of the power supply member 7). The leg portions 57 are alternately arranged.

More specifically, when the first conductive member 10 and the second conductive member 12 are overlapped, as shown in FIG. 8, the first conductive member missing portion is surrounded around the first main body portion 16 (second main body portion 56). 22 and the second conductive member missing portions 65 are alternately arranged in a ring shape.
At least a part of the first leg 17 of the first conductive member 10 is disposed in the second conductive member missing part 65, and at least a part of the second leg 57 of the second conductive member 12 is the first conductive. It is arranged in the member missing part 22.
Therefore, the second leg portion 57 of the second conductive member 12 has entered the first conductive member missing portion 22, and the first leg portion 17 of the first conductive member 10 and the second leg of the second conductive member 12. Both portions 57 are exposed on the lower surface.

Further, when viewed in plan as in FIG. 8, a gap 59 is formed between the first leg portion 17 of the first conductive member 10 and the second leg portion 57 of the second conductive member 12. Therefore, the first leg portions 17 of the first conductive member 10 and the second leg portions 57 of the second conductive member 12 are alternately arranged with an interval (gap 59) in the circumferential direction of the first main body portion 16. ing.
In the present embodiment, as described above, the gap 60 is also formed between the two second leg portions 57 located at the corners of the second main body portion 56 of the second conductive member 12. Therefore, in the present embodiment, all the leg portions (the first leg portion 17 or the second leg portion 57) including the first leg portion 17 of the first conductive member 10 and the second leg portion 57 of the second conductive member 12 are used. ) Are arranged one by one around the first main body 16 with a gap (gap 59 or gap 60).
That is, around the first main body 16 (second main body 56), the first leg 17 of the first conductive member 10, the second leg 57 of the second conductive member 12, and the second of the second conductive member 12. The leg portion 57, the first leg portion 17 of the first conductive member 10, the second leg portion 57 of the second conductive member 12, the second leg portion 57 of the second conductive member 12, and so on. The first leg portion 17 of the one conductive member 10 and the second leg portions 57 of the two second conductive members 12 are arranged in parallel with an interval in the same order.

Moreover, the protrusion piece part 61 which is a part of the 2nd leg part 57 of the 2nd electrically-conductive member 12 has left | separated to the upper outer side of the edge of the 1st main-body part 16 of the 1st electrically-conductive member 10 like FIG. Arranged in position. Further, the standing wall portion 62, which is a part of the second leg portion 57, is disposed at a position away from the edge of the first main body portion 16 of the first conductive member 10. That is, the second leg portion 57 of the second conductive member 12 is located away from the first conductive member 10 and is not in direct contact with the first conductive member 10.
Further, the first leg portion 17 of the first conductive member 10 is arranged at a position away from the lower outer side of the edge of the second main body portion 56 of the second conductive member 12, and does not contact the second conductive member 12. It is in a state.
As shown in FIG. 6, the insulating member 11 is interposed between the first main body portion 16 of the first conductive member 10 and the second main body portion 56 of the second conductive member 12, and these are not in direct contact with each other. It has become. That is, the first conductive member 10 and the second conductive member 12 are overlapped without being in direct contact.

Paying attention to the positional relationship between the organic EL panel 2 and the power supply member 7, the power supply member 7 and the organic EL device 5 are electrically connected.
That is, in the power supply member 7, the first leg portion 17 of the first conductive member 10 is in contact with the first power supply portion 35 of the organic EL device 5, and the second leg portion of the second conductive member 12. 57 is in contact with the second power feeding unit 36 of the organic EL device 5. That is, the lower surface of the lower plate portion 21 of the first conductive member 10 is in contact with the first power supply portion 35, and the lower surface of the lower plate portion 63 of the second conductive member 12 is in contact with the second power supply portion 36.

  As described above, the first leg portions 17 of the first conductive member 10 are in contact with the different first power feeding portions 35 and are close to each other in the vicinity of the corners of the second leg portions 57 of the second conductive member 12. Two are in contact with the second power feeding unit 36, and two different second leg portions 57 are in contact with each second power feeding unit 36.

Subsequently, an operation when the cable member 3 is connected to the frame member 6 will be described.
As shown in FIG. 16A, the cable member 3 is slid along the notch 96 and inserted into the insertion hole 97.
At this time, as described above, since the frame member 6 has flexibility and elasticity, a part of the top surface portion 77 of the frame member 6 (the portion where the insertion hole 97 is formed) bends outward, and the cable The member 3 is inserted.
Therefore, as shown in FIG. 16B, the positive side exposed region 86 and the negative side exposed region 87 of the cable member 3 are pressed against the convex portion 28 (see FIG. 15) and the convex portion 67 by the elastic restoring force of the frame member 6. It has been. Therefore, power can be reliably supplied.

  In the power feeding structure 1 of the organic EL panel according to the present embodiment, since the convex portions 28 and 67 are intermittently in contact with the cable member 3 by the concave and convex portions 23 and 66, the convex portions 28 and 67 are the cable members. It is easy to bite into 3 and power can be reliably supplied.

In the power feeding structure 1 of the organic EL panel of the present embodiment, the first conductive member 10 and the second conductive member 12 in which the copper foil is bent into a predetermined shape are used as the wiring member of the power feeding member 7. . Thereby, the wiring structure by FPC can be omitted inside the organic EL panel 2, and the wiring material can be formed at low cost. Further, according to the first conductive member 10 and the second conductive member 12, the first conductive member 10 and the second conductive member 12 can function as a heat diffusion medium such as the soaking member 15 described above. it can.
That is, when the organic EL device 5 is turned on, heat is transmitted to the first conductive member 10 or the second conductive member 12 in the organic EL element 41, so that the heat can be uniformly distributed in a flat shape. From this, it can prevent more reliably that heat is collected locally.

  In the above-described embodiment, the first unevenness forming member and the second unevenness forming member are attached to the surfaces of the first conductive member and the second conductive member, but the present invention is not limited to this, and FIG. As described above, the cable member 3 may be provided with the first unevenness forming member and the second unevenness forming member.

  In the above-described embodiment, solder balls are used as the convex portions of the first concavo-convex forming member and the convex portions of the second concavo-convex forming member. However, the present invention is not limited to this, and it is sufficient that the concave and convex portions can be formed. For example, as shown in FIG. 18, the shape of the convex portion may be tapered. Moreover, you may use the hemispherical processus | protrusion formed by baking the cream solder formed in dot shape instead of a solder ball.

  In the above-described embodiment, the convex portions of the first concavo-convex forming member and the convex portions of the second concavo-convex forming member are in direct contact with the positive electrode side exposed region 86 and the negative electrode side exposed region 87 of the cable member 3. However, the present invention is not limited to this, and a conductive member may be interposed therebetween. That is, it may be indirectly connected.

  In the embodiment described above, a bottom emission type organic EL device is adopted as the organic EL device 5, but the present invention is not limited to this, and a top emission type that takes out light from the second electrode layer 46 side. An organic EL device may be used.

  In the above-described embodiment, the first conductive member and the first power feeding unit, and the second conductive member and the second power feeding unit are connected. However, the present invention is not limited to this, and the first conductive member and the second power feeding unit are connected. The power feeding unit, the second conductive member, and the first power feeding unit may be connected to each other.

  In the above-described embodiment, the power supply member has a structure in which the second conductive member is covered on the first conductive member. However, the present invention is not limited to this, and the second conductive member is formed on the second conductive member. A structure in which one conductive member is covered may be used.

DESCRIPTION OF SYMBOLS 1 Feeding structure of organic EL panel 2 Organic EL panel 3 Cable member 6 Frame member 7 Feeding member 10 First conductive member 11 Insulating member 12 Second conductive member 22 First conductive member missing part 23 First unevenness forming member (first feeding member) Terminal, conductive unevenness forming member)
27 Protruding portion 30 Light emitting region 31 Frame region 35 First power feeding portion 36 Second power feeding portion 41 Organic EL element (laminated body)
42 Substrate (base material)
43 First electrode layer 45 Functional layer (organic light emitting layer)
46 Second electrode layer 47 Inorganic sealing layer (sealing layer)
65 Second conductive member missing portion 66 Second unevenness forming member (second feeding terminal, conductive unevenness forming member)
67 Convex 85 Reinforcing member 97 Insertion hole (opening)

Claims (11)

In the feeding structure of the organic EL panel that connects the organic EL panel and the cable member electrically connected to the external power source,
The organic EL panel includes an organic EL device, a power feeding member that feeds power to the organic EL device, and a frame member that integrates the organic EL device and power feeding member.
An organic EL device has a laminate in which a first electrode layer, an organic light emitting layer, and a second electrode layer are laminated on a substrate having a planar shape, and a sealing layer that covers a part of the laminate. It has a cross-sectional structure, and has a light emitting region that actually emits light when the substrate is viewed in plan, and a frame region surrounding the light emitting region,
The frame region includes a first power feeding unit electrically connected to the first electrode layer in the light emitting region and a second power feeding unit electrically connected to the second electrode layer in the light emitting region. And
The first feeding unit and the second feeding unit are electrically connected to the outside through the first feeding terminal or the second feeding terminal,
The sealing layer covers at least the light emitting region,
The frame member covers a part or the whole of the frame region, and has an opening through which a part of the cable member can be inserted,
The first feeding part and the second feeding part are electrically connected to the first feeding terminal and the second feeding terminal on the projection surface in the thickness direction of the sealing layer,
A power supply structure for an organic EL panel, wherein the cable member and each of the first power supply terminal and the second power supply terminal are connected through the opening. The width of the frame region is 100 μm or more and 3 mm or less,
2. The power feeding structure for an organic EL panel according to claim 1, wherein the first power feeding terminal or the second power feeding terminal is located on a projection surface in a member thickness direction of the light emitting region. The opening is a slit;
3. The power feeding structure for an organic EL panel according to claim 1, wherein the power feeding structure is oriented in a direction crossing a perpendicular to the surface of the substrate. The frame member has elasticity,
4. The power feeding structure for an organic EL panel according to claim 1, wherein the cable member is pressed against the first power feeding terminal or the second power feeding terminal by a restoring force of the frame member. 5.   The power supply structure for an organic EL panel according to any one of claims 1 to 4, wherein the frame member is made of silicone rubber. The first power supply terminal or the second power supply terminal is a conductive uneven member that forms a plurality of convex portions,
6. The power feeding structure for an organic EL panel according to claim 1, wherein the plurality of convex portions can contact a cable member.   7. The organic EL panel according to claim 6, wherein at least one of the plurality of protrusions is a solder ball or a hemispherical protrusion formed by baking cream solder formed in a dot shape. Feeding structure. The first power supply terminal and the second power supply terminal are conductive uneven members that form a plurality of convex portions,
The feeding structure for an organic EL panel according to claim 6 or 7, wherein the height of the vertex of the convex portion of the first power supply terminal is substantially equal to the height of the convex portion of the second power feeding terminal. The first power supply unit is connected to the first power supply terminal via the first conductive member,
The second power supply unit is connected to the second power supply terminal via the second conductive member,
The organic EL panel according to any one of claims 1 to 8, wherein the first conductive member and the second conductive member are made of metal and have any of a foil shape, a plate shape, and a film shape. Feeding structure. The cable member is foil-shaped,
The feeding structure for an organic EL panel according to claim 1, wherein a reinforcing member is provided at a distal end portion in the insertion direction. A first conductive member, an insulating member, and a second conductive member;
The first conductive member and the second conductive member are both plate-shaped or foil-shaped, and the shapes are different from each other.
The first conductive member has a first conductive member missing portion, a part of which is missing,
The second conductive member has a second conductive member missing part, a part of which is missing,
When the first conductive member and the second conductive member are overlapped with the insulating member sandwiched therebetween,
At least a part of the first conductive member is located in a region where the second conductive member missing portion is projected in the overlapping direction,
At least a part of the second conductive member is located in a region where the first conductive member missing portion is projected in the overlapping direction,
The said 1st electric power feeding part or a 2nd electric power feeding part passes a 1st electrically-conductive member missing part, and is connected to a 2nd electrically-conductive member, The Claim 1 thru | or 10 characterized by the above-mentioned. Power supply structure for organic EL panels.

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