JP2014080335A - Substrate dividing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate dividing device with a conveying mechanism capable of continuously processing a substrate in a flow operation while saving power of equipment and making the equipment compact.SOLUTION: A substrate dividing device comprises a scribing device D and a breaking device F. The device comprises: an adsorption conveying mechanism E having an adsorption plate 3 for adsorbing a substrate W, and performing an action for adsorbing the substrate W and locating the scribing device D on a table 5, and an action for conveying the substrate W after forming a scribe line S to an adsorption reversing mechanism from the table 5 of the scribing device D; and plural adsorption reversing mechanisms G, Ghaving adsorption plates 29 that can be reversed upside down, and reversing the substrate W from the adsorption conveying mechanism E and locating it on a table 15 of the breaking device F. The reversing mechanisms G, Gare serially arranged in a first direction, and the adsorption reversing mechanism Gat a most downstream side among the plural adsorption reversing mechanisms is configured to also perform an action for removing the substrate W divided by the breaking device F to a next step from the table 15 of the breaking device F.

Description

  The present invention relates to a substrate cutting apparatus for a brittle material substrate such as a glass substrate. In particular, the present invention relates to a substrate cutting apparatus that forms a scribe line on a substrate and breaks along the scribe line.

  Conventionally, a cutter wheel (also referred to as a scribing wheel) is rolled against a large-area mother board placed on a table with a predetermined scribe pressure applied, or thermal distortion caused by laser beam irradiation is used. Then, a plurality of parallel scribe lines orthogonal to each other are formed, and then the mother substrate is turned upside down by the substrate turning mechanism, and the break bar is pushed from the surface opposite to the surface on which the scribe lines are provided. For example, Patent Document 1 discloses a method of separating a substrate by bending the substrate by applying the substrate and taking out a unit product.

  In addition, when the mother substrate on which the two glass substrates are bonded together is cut, the cutter wheel is rolled on the mother substrate placed on the table of the scribe device so that A is one surface of the substrate. A scribe line is formed on the surface. Next, after the substrate is sucked and inverted by the substrate suction device, it is placed on the table of the break device, and the substrate B surface, which is the back surface of the substrate A surface, is pressed with a break bar or the like to divide the substrate A surface. . Next, in the same manner as described above, a scribe line is formed on the surface of the substrate B, the substrate is inverted, and then the surface of the substrate A is pressed with a break bar or the like to divide the surface of the substrate B. Thereafter, a method of removing the material of the divided substrate from the breaking device and moving to the next step is disclosed in, for example, Patent Document 2 (FIG. 45).

Japanese Patent Laid-Open No. 11-116260 International Publication No. WO2002 / 057192

In general, the scribing device and break device move so that the table on which the substrate to be processed is placed passes through the beam that holds the scribing head and break bar (the horizontal beam supported by the gate by the left and right columns). It is formed to do. Therefore, the scribing device and the breaking device require a rectangular installation space in which the moving direction of the table is elongated in plan view.
If such a scribing device or break device having a rectangular shape in plan view is arranged in series in the longitudinal direction to form a processing line for the substrate cutting device, the entire processing line becomes longer and the entire device becomes longer. To do.
Therefore, in order to suppress the lengthening of the apparatus and make it a compact processing line, for example, as shown in the above-mentioned Patent Document 1 (FIG. 3), the processing line direction in which the substrates are sequentially transported, It is preferable that the scribing device and the breaking device are arranged in different directions, for example, orthogonal directions.

  However, in the conventional technique described in Patent Document 1, a reversing mechanism and a pedestal for sucking and reversing the substrate are arranged between the scribe device and the break device, and a substrate is sucked at the subsequent stage of the break device. And the material removal mechanism to which it transfers to the next process is arrange | positioned, and each is arrange | positioned as a separate apparatus. For this reason, there are problems that the number of apparatus members for configuring the processing line is increased, which hinders downsizing and the equipment cost is increased.

  Therefore, in view of the above-described conventional problems, the present invention provides a substrate cutting of a brittle material substrate provided with a conveyance mechanism that can save equipment and can be made compact and can be continuously processed by a flow operation. An object is to provide an apparatus.

In order to achieve the above object, the present invention takes the following technical means. That is, the substrate cutting apparatus according to the present invention has a main path for sequentially transporting substrates as a first direction, a scribe device for forming a scribe line on the substrate surface in the middle of the main path, and a substrate on which the scribe line is formed. And a breaker that breaks along the scribe line, and has a downward suction plate for sucking the substrate, and sucks the substrate onto the table of the scribe device. A suction conveyance mechanism that performs the operation of placing, and the operation of sucking the substrate after forming the scribe line from the table of the scribe device and transferring it to the suction reversal mechanism described later, and a suction plate that can be turned upside down, and A plurality of operations for inverting the substrate after forming the scribe line received from the suction conveyance mechanism and placing the substrate on the table of the breaker A plurality of adsorption reversal mechanisms arranged in series along a first direction, and among the plurality of adsorption reversal mechanisms, the adsorption reversal mechanism at the most downstream of the main path is The breaker is configured to receive a substrate broken by the breaker from the table of the breaker and to remove the material for the next process, and the table of the breaker is sucked at the transfer position on the main path. After receiving the substrate from the reversing mechanism, the substrate moves to a break position on the substrate along a direction different from the first direction, and returns to the delivery position after the break is completed.
Further, in the above invention, the table of the scribing device is along the direction different from the first direction after receiving the substrate from the suction conveyance mechanism at the transfer position on the main path, like the table of the breaking device. It is preferable to move to the scribe line formation position on the substrate and return to the delivery position after completion of the scribe line formation.

In the substrate cutting apparatus according to the present invention, the material removal work for removing the substrate that has been broken from the table of the breaker is performed by the suction reversing mechanism located at the most downstream side of the main path of the substrate. However, the next substrate reversing operation and transport operation can be performed by the suction reversing mechanism on the upstream side of the main path, whereby the substrate dividing operation can be performed continuously in the flow operation.
In addition, the adsorption reversing mechanism located on the most downstream side of the main path also serves as an operation for receiving the substrate from the table of the breaker and removing the material for the next process, so it is necessary to install a mechanism for removing the material separately. There is an effect that the substrate cutting apparatus can be made compact.

  In the present invention, at least the breaker table is moved in the direction different from the first direction from the delivery position of the main path to perform the breaking process, so that the machining line is long in the main path direction. Can be suppressed.

1 is a schematic perspective view showing an overall configuration of a substrate cutting apparatus according to the present invention. FIG. 2 is a schematic plan view of the substrate cutting apparatus in FIG. 1. The side view of the adsorption conveyance mechanism in the board | substrate cutting apparatus of FIG. The perspective view of the scribe apparatus in the board | substrate cutting apparatus of FIG. The perspective view of the breaking apparatus in the board | substrate cutting apparatus of FIG. The perspective view of the adsorption | suction inversion mechanism in the board | substrate cutting apparatus of FIG. The side view of the adsorption | suction inversion mechanism of FIG. The partial cross section top view of the adsorption | suction inversion mechanism of FIG. The schematic plan view which shows the 1st step of the cutting process by the board | substrate cutting apparatus of this invention. The schematic top view which shows the 2nd step of a board | substrate cutting process. The schematic top view which shows the 3rd step of a board | substrate cutting process. The schematic top view which shows the 4th step of a board | substrate cutting process. The schematic top view which shows the 5th step of a board | substrate parting process. The schematic top view which shows the 6th step of a board | substrate cutting process. The schematic top view which shows the 7th step of a board | substrate parting process.

Hereinafter, the details of the substrate cutting apparatus according to the present invention will be described with reference to the drawings.
FIG. 1 is a schematic perspective view showing the overall configuration of a substrate cutting apparatus according to the present invention, and FIG. 2 is a schematic plan view thereof.

As shown in FIGS. 1 and 2, the substrate cutting apparatus of the present invention adsorbs the supplied substrate W and places the supplied substrate W on the table 5 of the scribe device D, as shown in FIGS. 1 and 2. The suction conveyance mechanism E to be placed, the scribing device D for forming a scribe line on the surface of the substrate W, the breaking device F for dividing the substrate W along the scribe line, and the divided substrate W are transferred to the next step. It composed of a discharge conveyor H, two adsorption reversing mechanism _G 1, _{G 2} Prefecture.
The substrate W to be processed is sequentially transferred along the straight line L extending in the first direction from the carry-in conveyor C to the discharge conveyor H through the scribe device D and the break device F, and the first This direction is displayed as the X direction on the drawing. The substrate feed path along the first direction is a processing line, and is referred to as a “substrate main path” in the present invention. A direction orthogonal to the first direction is referred to as a second direction.

The suction conveyance mechanism E that sucks the substrate W from the carry-in conveyor C and places it on the table 5 of the scribing device D, as shown in FIG. 3, along the straight line L in the first direction, that is, the X direction. The guide rail 1 is arranged, a slide member 2 that moves along the guide rail 1, and a suction plate 3 that is attached to the slide member 2 in a horizontal posture so as to be movable up and down. The suction plate 3 has a large number of suction holes on its lower surface, and is connected to a decompression device using a vacuum pump and a suction pipe (not shown) so that the substrate W can be sucked and transported by suction air from the decompression device. Is formed. The guide rail 1 is disposed above the substrate cutting device so as not to hinder the operation of the scribing device D and the suction inversion mechanisms G ₁ and G ₂ .

  As shown in FIG. 4, the scribing device D extends along a rail 4 extending in a second direction (Y direction) orthogonal to the direction of the main path of the substrate (that is, the X direction) on the plane. A moving table 5 is provided, which is driven by a screw shaft 7 that is rotated by a motor 6. Further, the table 5 can be rotated in a horizontal plane by a rotation drive unit 8 incorporating a motor. A pair of left and right support columns 9 and 9 and a beam 11 having a guide 10 extending in the X direction bridged by these support columns 9 and 9 form a gate-shaped support. A scribe head 13 having a cutter wheel 12 is attached to the guide 10 so as to be movable along the guide 10 in the X direction.

  As shown in FIG. 5, the breaking device F is a table 15 that moves along a rail 14 that extends in a second direction (Y direction) orthogonal to the direction of the main path of the substrate (X direction) on the plane. And is driven by a screw shaft 17 rotated by a motor 16. Further, the table 15 can be rotated in a horizontal plane by a rotation drive unit 18 incorporating a motor. A pair of left and right support columns 19 and 19 and a beam 21 provided with a horizontal frame 20 extending in the X direction and bridged by the support columns 19 and 19 form a gate-shaped support. A break bar 22 extending in the X direction is attached to the horizontal frame 20 so as to be moved up and down by a cylinder 23.

The two adsorption reversal mechanisms G ₁ and G ₂ have the same structure, and are arranged so as to move along a common guide rail 24 described later. The following describes one of the suction reversing mechanism G _1.
As shown in FIGS. 6 to 8, the suction reversal mechanism G <b> ₁ is composed of a moving table 25 that is movably disposed along a guide rail 24 that extends in the X direction, and a quadrangular prism that is fixed to the moving table 25 and extends in the vertical direction. A support 26, a mover 27 attached so as to be movable up and down along the support 26, and a support attached to the mover 27 so as to be rotatable around a horizontal axis 28, and provided with a suction plate 29 at the tip. And arm 30. Thus, the suction plate 29 is held on the support column 26 in a cantilever manner. The support arm 30 is rotated by a rotation mechanism 35 incorporated therein.
The suction plate 29 is provided with a suction surface 29a having a large number of suction holes on one surface, and is connected to a decompression device using a vacuum pump via an intake pipe (not shown). Thus, the substrate W is formed so as to be sucked and transported. The moving table 25 is moved in the X direction along the guide rails 24 by a moving mechanism using a conveyor 34. The mover 27 is moved up and down by an electric lifting mechanism (not shown) incorporated therein.

  Reinforcing plates 31, 31 are attached to both sides 26a, 26a shown in FIG. Further, rear reinforcing plates 32 and 32 are provided on the back surface 26 b of the support column 26 on the side opposite to the suction plate 29. The reinforcing plate 31 and the rear reinforcing plate 32 reinforce the column 26. The mover 27 includes a slide surface 27a that comes into contact with the front surface 26c of the support column 26, and an engagement portion that slidably engages with the rear end surface 31a of the reinforcing plate 31 opposite to the suction plate 29. 33, 33. In this way, the mover 27 is attached to the support 26 so that the support 26 is sandwiched from the front and rear by the slide surface 27a and the engaging portion 33, so that the mover 27 and the support 26 are deformed by the load. It is preventing. In particular, in the cantilever method, in addition to the weight of the suction plate 29, the support arm 30, and the rotation mechanism 35, the weight at the time of suction of the substrate is added, so that the suction plate 29 portion is bent downward. Although a moment is generated, when the engaging portion 33 provided at the rear end of the movable element 27 is engaged with the rear end surface 31a of the reinforcing plate 31, the bending moment can be received. Thereby, distortion of a needle | mover 27 and the support | pillar 26 and generation | occurrence | production of a deformation | transformation can be prevented, maintaining the merit of a cantilever system, ie, the compact structure by one support | pillar.

Next, the process of dividing the mother substrate W by the above-described substrate cutting apparatus will be described step by step with reference to FIGS.
As shown in FIG. 9, the first substrate W fed by the carry-in conveyor C is placed on the table 5 at the delivery position of the scribe device D by the suction conveyance mechanism E. Next, as shown in FIG. 10, the table 5 is moved to the position of the scribe head 13 to form the scribe lines S in the XY direction intersecting each other by the cutter wheel (see FIG. 4). To the original position (delivery position). In the scribing device D, while the first substrate W is being scribed, the next substrate W ′ is transported by the carry-in conveyor C and stands by at the end of the conveyor.
Thereafter, as shown in FIG. 11, the substrate W is placed on the suction plate 29 of the suction reversing mechanism G ₂ are adsorbed by suction conveying mechanism E. At this time, the suction plate 29 is kept on standby with its suction surface facing upward as shown in FIG.

Next, as shown in FIG. 12, the suction plate 29 that sucks the substrate W is reversed, and the substrate W that is reversed upside down is placed on the table 15 at the delivery position of the breaker F. In the break device F, as shown in FIG. 13, the table 15 on which the substrate W is placed is moved to a position below the break bar 22, and the substrate W is divided along the scribe line S by the break bar 22. 15 is returned to the original position (delivery position) in FIG. Thereafter, as shown in FIG. 14, shed substrate W is Jozai the discharge conveyor H is adsorbed from the table 15 of the breaking device F again by suction reversing mechanism G _2. Thereafter, suction reversing mechanism G ₂ is waiting on the discharge conveyor H.

During the first substrate W breaking step, on the suction plate 29 of the suction reversing mechanism G ₁ as shown in FIG. 14 through the same process as the first substrate W next substrate W 'is described in Figures 9-11 Placed. Then, by inverting the suction plate 29, the substrate W 'which is reversed as shown in FIG. 15, after mounting on the table 15 at the transfer position of the breaking apparatus F, the adsorption reversing mechanism G ₁ of the following substrate For the operation of W ″, the process is returned to the standby position in FIG.
In the break device F, as in the case of the previous substrate W, the table 15 on which the substrate W ′ is placed is moved below the break bar 22, and the break bar 22 breaks the substrate W ′ along the scribe line S. After that, the table 15 is returned to the original position (delivery position) in FIG. Then, dividing material adsorbed to the discharge conveyor H the substrate W 'which is divided by was allowed to stand on the discharge conveyor H adsorption reversing mechanism G ₂ from the table 15 of the breaking device F.
By repeating the above operation, the substrate sequentially conveyed by the carry-in conveyor C can be continuously broken and removed by the flow operation.

In the said Example, although described about the case where the board | substrate W of a single plate was divided | segmented, when dividing | segmenting the bonding board | substrate which bonded two glass substrates together, one of the board | substrates W with the break apparatus F by the process mentioned above. after break the surface (a surface) is completed, it is inverted by placing the substrate W on the reversing suction plate 29 of the suction reversing mechanism G ₂ by the suction transporting device E. Next, the inverted substrate W is placed on the table 5 of the scribe device D again by the suction conveyance device E. After scribing the other surface of the substrate W (B side) in the scribing device D, it is inverted by placing the substrate W on the reversing suction plate 29 of the suction reversing mechanism G ₂ by the suction transporting device E, the inverted substrate W is again placed on the table 15 of the breaking device F. After breaking the B side of the substrate W in the breaking apparatus F, by adsorption reversing mechanism G _2, a shed substrate W may be such that the material removing on the discharge conveyor H.

As described above, since the material removing operation for removing material of the substrate after cutting from the table 15 of the breaking device F was performed by adsorption reversing mechanism G ₂ on the downstream side of the main path of the substrate, in the material removing working there can also be carried out inverting and conveying work of the next substrate by adsorption reversing mechanism G ₁ on the upstream side of the main path, thereby performing the continuous division of the substrate in the assembly line.
Further, the adsorption reversing mechanism G ₂ on the downstream side of the main path, because receives the substrate from the table of a breaking apparatus and also serves as an operation for removing material in the next step, a mechanism for removing material separately installed Therefore, the substrate cutting apparatus can be made compact.

  The representative examples of the present invention have been described above. However, the present invention is not necessarily limited to the above-described embodiments, and the object of the present invention is achieved and appropriately modified within the scope of the claims. It is possible to change.

  The present invention is used in a substrate cutting apparatus that forms a scribe line on a substrate and breaks along the scribe line.

C carrying-conveyor D scribing apparatus E suction conveying mechanism F breaking device G _{1, G 2} adsorption reversing mechanism H discharging conveyor S scribe line W mother substrate (brittle material substrate)
DESCRIPTION OF SYMBOLS 3 Adsorption board of adsorption conveyance mechanism 5 Table of scribing device 15 Table of break device 29 Adsorption plate of adsorption inversion mechanism

Claims (2)

A scribe device that forms a scribe line on the surface of the substrate in the middle of the main route, and a break that breaks the substrate on which the scribe line is formed along the scribe line. A substrate cutting apparatus in which the apparatus is arranged,
An operation of placing the substrate on the table of the scribing device by adsorbing the substrate, and adsorbing the substrate after forming the scribe line from the table of the scribing device; A suction conveyance mechanism for performing an operation of transferring to the suction reversal mechanism described later;
A plurality of suction reversing mechanisms that have a suction plate that can be turned upside down and that reverses the substrate after scribe line formation received from the suction transport mechanism and places it on the table of the breaker; ,
The plurality of adsorption reversal mechanisms are arranged in series along a first direction, and among the plurality of adsorption reversal mechanisms, the adsorption reversal mechanism located on the most downstream side of the main path is a substrate broken by the break device. Is also configured to receive the material from the table of the break device and remove the material for the next process,
The table of the break device moves to the break position of the substrate along the direction different from the first direction after receiving the substrate from the suction inversion mechanism at the transfer position on the main path, and after the break is completed, A substrate cutting apparatus configured to return to a delivery position. The table of the scribing device moves to the scribe line formation position of the substrate along a direction different from the first direction after receiving the substrate from the suction conveyance mechanism at the delivery position on the main path, and forms the scribe line. The substrate cutting apparatus according to claim 1, wherein the substrate cutting apparatus is configured to return to the delivery position after completion.

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