JP2013115325A - Manufacturing method of sintered structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that, when manufacturing a sintered structure like a ceramic multilayer substrate, it is difficult to improve dimensional precision of the sintered structure since a ceramic green sheet is shrunk by about 15 to 30% in the process of sintering a raw laminate.SOLUTION: A manufacturing method of a sintered structure includes a preparation step for preparing a first ceramic member and a second ceramic member, a lamination step for obtaining a laminate by alternately laminating the ceramic members in such a manner that apertures arrayed in the second ceramic member in a two-dimensional manner are overlapped vertically with substrate regions arrayed in the first ceramic member in the two-dimensional manner, a sintering step for sintering and integrating the laminate, and a dividing step for dividing the laminate into individual pieces. The second ceramic member contains a second sintering material of which the sinter shrinkage factor under the same sintering condition as a first sintering material contained in the first ceramic member is smaller than that of the first sintering material.

Description

  The present invention relates to a method for producing a sintered structure such as a ceramic laminated substrate made of a ceramic material. The sintered structure is used for, for example, a multilayer wiring circuit board, an electronic component storage package, or a pressure sensor.

  In general, a sintered structure such as a ceramic laminated substrate is produced by firing a green laminate formed by laminating a plurality of ceramic green sheets. However, in the process of firing the green laminate, the ceramic green sheet shrinks by about 10 to 25%, so it is difficult to increase the dimensional accuracy of the sintered structure. In particular, when a structure having a plate-like portion and a frame-like portion, such as an electronic component storage package and a pressure sensor, the plate-like portion may be greatly warped or bent.

  Patent Document 1 discloses a film mold in which the firing shrinkage rate of the substrate having the frame-shaped portion is smaller than the firing shrinkage rate of the film plate that is the plate-like portion, that is, the film plate contracts more greatly than the substrate. A method for manufacturing a voltage ceramic element is described. According to the manufacturing method described in Patent Document 1, the film plate is relatively greatly shrunk during firing due to the difference in the firing shrinkage rate, so that the film plate is formed smoothly under tension.

JP 2001-352111 A

  In the manufacturing method described in Patent Document 1, in order to make the firing shrinkage rate of the substrate smaller than the firing shrinkage rate of the membrane plate, the substrate and the membrane plate are produced using different materials. Therefore, a difference arises between the thermal expansion coefficient of the frame-like part and the thermal expansion coefficient of the plate-like part in the sintered structure. As a result, when the sintered structure is used, stress may be concentrated between the frame-like portion and the plate-like portion, and durability may be reduced. Further, in order to reduce the difference between the thermal expansion coefficients of these portions, it is necessary to adjust the thermal expansion coefficient, which causes a problem that it is complicated or the degree of freedom of material selection is reduced.

  This invention is made | formed in view of the said subject, and it aims at providing the manufacturing method which can manufacture easily the sintered structure which has high durability.

  The method for manufacturing a sintered structure according to one aspect of the present invention includes a first sintered material, and a plurality of base regions are provided in a two-dimensional array, and between the base regions adjacent to each other and on the outermost peripheral side. A plurality of substrate regions including a first ceramic member provided with a disposal margin region, and a second sintered material having a sintering shrinkage rate smaller than that of the first sintered material under the same firing conditions as the first sintered material; Preparing a second ceramic member provided with a plurality of openings corresponding to the two-dimensional arrangement, a plurality of the first ceramic members and a plurality of the plurality of the ceramic members so that the openings overlap the base region. Laminating step of alternately laminating second ceramic members to obtain a laminated body, firing step of firing and integrating the laminated body, and firing and integrating the laminated body of the discard margin region and the second ceramic member Part In and separated, it is characterized by having a dividing step of dividing into individual pieces corresponding to the base region.

  In the method for manufacturing a sintered structure according to the above aspect, the first ceramic member and the second ceramic member are alternately laminated so that the opening of the second ceramic member overlaps the base region of the first ceramic member. Yes. That is, a sintered structure adjacent to the material (first ceramic member) that becomes a piece of the sintered structure and the stacking direction is not produced by combining the pieces of the sintered structure with the members of different materials. A material (second ceramic material) which becomes a portion located between individual pieces of the body is a different material.

  Since the sintering shrinkage rate of the second sintered material under the same firing conditions as that of the first sintered material is smaller than that of the first sintered material, the portion that becomes the individual piece of the sintered structure is subjected to tension and is smooth. Formed. As described above, according to the method for manufacturing a sintered structure of the above aspect, a sintered structure having high durability and good flatness can be easily manufactured.

It is a perspective view which shows the preparatory process in the manufacturing method of the sintered structure of 1st Embodiment. It is sectional drawing of the AA cross section in the manufacturing method shown in FIG. It is sectional drawing which shows the lamination process in the manufacturing method shown in FIG. It is sectional drawing which shows the division | segmentation process in the manufacturing method shown in FIG. It is sectional drawing which shows the sintered structure separated into pieces by the division | segmentation process in the manufacturing method shown in FIG. It is a perspective view which shows the preparation process in the manufacturing method of the sintered structure of 2nd Embodiment. It is sectional drawing which shows the lamination process in the manufacturing method shown in FIG. It is sectional drawing which shows the sintered structure separated by the division | segmentation process in the manufacturing method shown in FIG.

  Hereinafter, the manufacturing method of the sintered structure according to the first embodiment (hereinafter, for convenience, the manufacturing method of the sintered structure is also simply referred to as a manufacturing method) will be described in detail with reference to the drawings. However, in the drawings referred to below, for the convenience of explanation, among the members constituting the following embodiments, only the main members necessary for explaining the characteristic configuration are shown in a simplified manner. Therefore, the sintered structure of the following embodiment may include an arbitrary constituent member that is not shown in each drawing referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  As shown in FIGS. 1 to 5, the manufacturing method of this embodiment includes a preparation process for preparing the first ceramic member 3 and the second ceramic member 5, a laminating process for laminating these ceramic members, and these ceramic members. And a dividing step of dividing the piece into individual pieces.

  In the preparation step, a plurality of first ceramic members 3 and a plurality of second ceramic members 5 are prepared. In the first ceramic member 3, a plurality of substrate regions 7 are provided in a two-dimensional array, and a disposal margin region 9, a so-called dummy region, is provided between adjacent substrate regions 7 and on the outermost peripheral side. In the second ceramic member 5, a plurality of openings 11 are provided in a two-dimensional array.

The opening 11 of the second ceramic member 5 is provided so as to correspond to the base region 7 of the first ceramic member 3. Specifically, in the laminating process described in detail later, the openings 11 of the second ceramic member 5 are provided so that the openings 11 overlap with the base regions 7 in the vertical direction.

  The first ceramic member 3 includes a first sintered material. The second ceramic member 5 includes a second sintered material whose sintering shrinkage rate under the same firing conditions as that of the first sintered material is smaller than that of the first sintered material. In the laminating step, the first ceramic member 3 and the second ceramic member 5 are alternately laminated so that the opening 11 overlaps the base region 7 in the vertical direction, thereby producing a laminated body. Therefore, the plurality of openings 11 are blocked by the base region 7 of the first ceramic material.

  In the firing step, the laminate formed by laminating the first ceramic member 3 and the second ceramic member 5 is fired and integrated to produce a fired laminate having a plurality of substrate regions 7, a so-called multi-chip substrate. .

  After this firing step, in the dividing step, the laminated body composed of these ceramic members which are fired and integrated is divided at the disposal margin region 9 and the second ceramic member 5 to be separated into individual pieces corresponding to the respective base region 7. It is divided.

  In addition, the sintering shrinkage rate in this embodiment means the ratio of the size after sintering to the size before sintering. For example, when a ceramic member having a side length of 10 mm before sintering has undergone a firing process and has a side length of 8 mm after sintering, the sintering shrinkage rate is 80%. Can do.

  In the manufacturing method of the present embodiment, a plurality of sintered structures 1 are manufactured using the second ceramic member 5 provided with a plurality of openings 11 arranged two-dimensionally. That is, the sintered structure 1 is not manufactured using only the first ceramic member 3 in which the base region 7 is two-dimensionally arranged, but the second ceramic member is interposed between the stacking directions of the first ceramic members 3. The sintered structure 1 is produced in a state where the is sandwiched.

  Therefore, the part which becomes the piece of the sintered structure 1, that is, each base region 7 is formed smoothly under the tension. In addition, since the first ceramic member 3 and the second ceramic member 5 are fired and integrated in a state where the first ceramic member 3 and the second ceramic member 5 are alternately laminated, the variation in the tension in the laminating direction is reduced. Is done. Therefore, it is possible to suppress the stress from being concentrated on a part of the plurality of first ceramic members 3 to cause cracks, or the second ceramic member 5 from being peeled off from the first ceramic member 3.

  Moreover, in the manufacturing method of this embodiment, the thickness of the partition 13 between the adjacent opening parts 11 in the 2nd ceramic member 5 is made equal. In other words, in the first ceramic member 3, the width of the discard margin region 9 located between the base region 7 is made equal. Therefore, it is possible to suppress tension from being concentrated on a specific one of the plurality of substrate regions 7 in the first ceramic member 3. Therefore, the smoothness of each substrate region 7 can be improved.

  As a shape of the first ceramic member 3, for example, a square plate shape can be used as shown in FIG. The size of the first ceramic member 3 varies depending on the number of sintered structures 1 to be singulated, that is, the number of base regions 7, but the portion of the first ceramic member 3 in the state of the sintered structure 1 is: For example, the size of one side in a plan view can be set to 20 to 150 mm.

For example, assuming that the size of one side in the portion of the first ceramic member 3 in the separated state of the sintered structure 1 is 10 mm, as shown in FIG. Are three-dimensionally arranged in three pieces in the vertical direction and four in the left-right direction, the size of one side in the vertical direction of the sintered first ceramic member 3 is about 40 mm, and one side in the left-right direction. What is necessary is just to set so that a magnitude | size may be about 50 mm. Moreover, as thickness of the 1st ceramic member 3 after sintering, it can set to 0.2-1.3 mm, for example.

  As the shape of the second ceramic member 5, for example, a square plate shape having a plurality of openings 11, and the outer periphery when seen in a plan view can overlap with the outer periphery of the first ceramic member 3. Therefore, for example, when the first ceramic member 3 after sintering is set to be about 40 × 50 mm as described above, the second ceramic member 5 has the same size of one side after sintering. What is necessary is just to set so that it may be set to about 40x50 mm.

  The second ceramic member 5 is provided with a plurality of openings 11 arranged two-dimensionally. As shown in FIGS. 1 and 2, each opening 11 has a shape of a through hole that opens to the upper surface and the lower surface of the second ceramic member 5. Further, the plurality of openings 11 are two-dimensionally arranged so as to overlap each other with the plurality of substrate regions 7 in the stacking process. Specifically, in the manufacturing method of the present embodiment, the openings 11 are provided at equal intervals in the vertical and horizontal directions in FIG. 2 so that the partition walls 13 between the openings 11 are in a lattice shape. .

  In the manufacturing method of the present embodiment, the partition wall 13 has a shape that overlaps the entire disposal margin region 9 in the vertical direction, but is not limited thereto. For example, a notch may be provided in a part of the partition wall 13 so that the partition wall 13 overlaps with a part of the disposal margin region 9 in the vertical direction.

  The substrate region 7 in the present embodiment has a shape with a square outer periphery when viewed in plan. Therefore, the opening 11 has a shape with an inner periphery that is square when viewed in plan. At this time, the size of one side of the inner periphery can be set to 3 to 18 mm, for example. Although the opening 11 in the present embodiment has a quadrangular shape, the opening 11 is not limited to the quadrangular shape as long as it has a shape corresponding to the shape of the base region 7.

  The second ceramic member 5 in the present embodiment is configured such that the width of the second ceramic member 5 that overlaps with the disposal margin region 9 positioned on the outermost peripheral side when viewed from above is disposed between the base regions 7 adjacent to each other. A material that is larger than the width of the second ceramic member 5 that overlaps the upper and lower regions 9 is used. In other words, the thickness of the partition wall 13 between the opening 11 located on the outermost periphery side in the top view and the outermost periphery of the second ceramic member 5 is larger than the thickness of the partition wall 13 between the adjacent openings 11. A thicker one is used.

  As a result, the shape of the substrate can be stably held during the firing process in the partition wall 13 positioned between the opening 11 positioned on the outermost peripheral side in top view and the outermost periphery of the second ceramic member 5. Therefore, it is possible to further suppress warping or bending that occurs in the first ceramic member 3 in the firing step. Moreover, since the stress applied to each partition wall 13 excluding the partition wall 13 can be reduced, the bondability between the first ceramic member 3 and the second ceramic member 5 can be improved.

  As the 1st ceramic member 3 and the 2nd ceramic member 5, the member which has high insulation can be used. Examples of the insulating member include a member such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a glass ceramic. Can be used.

  A mixed member is produced by mixing the raw material powder containing the above members, an organic solvent, and a binder. A green sheet is produced by forming the mixing member into a sheet. As a method for forming the sheet, for example, a doctor blade method may be used.

  A single layer or a laminate of these green sheets can be used as the first ceramic member 3 and the second ceramic member 5 before firing. Further, the green sheet itself may be used, but if the first ceramic member 3 and the second ceramic member 5 can be sintered and integrated in the firing step described later, the green sheet is temporarily fired. Those may be used as the first ceramic member 3 and the second ceramic member 5.

  The first ceramic member 3 in the present embodiment includes a first sintered material. Further, the second ceramic member 5 includes a second sintered material having a sintering shrinkage rate smaller than that of the first sintered material under the same firing conditions as the first sintered material. As a 1st sintered material and a 2nd sintered material, it can select from the member which has said insulation. By selecting a member having a desired sintering shrinkage rate from among the members having the above insulating properties, the sintering shrinkage rate of the second sintered material under the same firing conditions as that of the first sintered material is set to be higher than that of the first sintered material. Can also be reduced.

  Further, the shrinkage rate of the green sheet can also be adjusted by the type or amount of the organic solvent and binder mixed in the insulating member. Therefore, as the first sintered material and the second sintered material, the second sintered material under the same firing condition as the first sintered material is obtained by including the same insulating member and adjusting the kind of the organic solvent and the binder. The sintering shrinkage rate of the binder material may be smaller than that of the first sintered material.

  Moreover, it is preferable to use what has the same thermal expansion coefficient as the 1st ceramic member 3 and the 2nd ceramic member 5 when carrying out baking integration in a baking process. If the above-described thermal expansion coefficients of the first ceramic member 3 and the second ceramic member 5 are different, the first ceramic member 3 and the second ceramic member are caused by a contraction difference caused by the difference in thermal expansion coefficient after sintering in the firing step. Differences in size change from 5 occur. Therefore, a large residual stress may occur between the first ceramic member 3 and the second ceramic member 5 after the firing process.

  However, since the residual stress can be reduced by using the first ceramic member 3 and the second ceramic member 5 having the same thermal expansion coefficient when they are fired and integrated in the firing step, the sintered structure can be reduced. 1 durability can be improved.

  When the sintered structure 1 produced by the manufacturing method of the present embodiment is used as, for example, a ceramic laminated substrate, a metal member that becomes a wiring circuit may be disposed on the surface and inside of the base region 7. Such a metal member can be made into a wiring circuit through the firing step.

  As a metal member, for example, a metal paste obtained by adding and mixing an organic binder, a solvent, a plasticizer, a dispersant, etc. to a metal powder such as copper, silver, gold, platinum, nickel, tungsten and molybdenum is used. Can do. What is necessary is just to print such a metal paste on the surface of the base | substrate area | region 7, for example using a screen printing method. Further, by forming a via hole in the base region 7 and filling the via hole with the metal paste, a wiring circuit can be disposed inside the base region 7. The printed or filled metal paste becomes a predetermined wiring circuit through a baking process.

  In addition, when the sintered structure 1 manufactured by the manufacturing method of the present embodiment is used as, for example, a pressure sensor, a cavity is formed inside each base region 7, and on the upper surface and the lower surface of the cavity, Metal layers (not shown) facing each other may be formed. Through the firing step, such a metal layer can be used as a pair of counter electrodes.

As the metal layer to be the pair of counter electrodes, the same metal paste as the wiring circuit may be used. What is necessary is just to print said metal paste on the upper surface and lower surface of a cavity, for example using a screen printing method. The printed metal paste becomes a pair of counter electrodes through a baking process.

  In the laminating process of the present embodiment, the second ceramic member 5 overlaps with the disposal margin region 9 of the first ceramic member 3 in the vertical direction, and the opening 11 of the second ceramic member 5 extends vertically with the base region 7 of the first ceramic member 3. The first ceramic members 3 and the second ceramic members 5 are alternately stacked so as to overlap each other. Therefore, the base region 7 of each of the plurality of first ceramic members 3 is also laminated so as to overlap vertically. In this way, a green laminate is produced by arranging the second ceramic member 5 so as to overlap the first ceramic member 3.

  In the manufacturing method of the present embodiment, two first ceramic members 3 and three second ceramic members 5 are laminated, but the number of first ceramic members 3 and second ceramic members 5 to be laminated. However, it is not limited to this. In order for the first ceramic member 3 and the second ceramic member 5 to be alternately stacked, at least one first ceramic member 3 and two or more second ceramic members 5 are alternately stacked, or at least It is sufficient that one second ceramic member 5 and two or more first ceramic members 3 are alternately stacked.

  In the firing step of the present embodiment, the first ceramic member 3 and the second ceramic member 5 are fired and integrated by firing the green laminate. The optimum firing temperature varies depending on the materials used as the first ceramic member 3 and the second ceramic member 5, but when a high-temperature fired ceramic material such as aluminum oxide is used, the first ceramic member 3 is heated at 1550 ° C to 1600 ° C. The second ceramic member 5 may be fired. Further, when a low-temperature fired ceramic material such as glass ceramic is used, the first ceramic member 3 and the second ceramic member 5 may be fired at 1350 ° C. to 1400 ° C.

  In the manufacturing method of the present embodiment, a plurality of openings 11 are provided in a two-dimensional array, and a plurality of sintered structures 1 are produced simultaneously. Therefore, the first ceramic member 3 is fired in a state where the tension resulting from the difference in sintering shrinkage between the first ceramic member 3 and the second ceramic member 5 is applied to the first ceramic member 3. Therefore, the sintered structure 1 having high durability and good flatness can be produced.

  In addition, when the first ceramic member 3 is separated into pieces by the dividing step, the first ceramic member 3 also acts as a pulling force between portions located in the adjacent sintered structures 1.

  At this time, since the first ceramic member 3 is planar and the plurality of openings 11 are two-dimensionally arranged, the first ceramic member 3 is dispersed in a plane between adjacent substrate regions 7 in the first ceramic member 3. The Therefore, it can suppress that stress concentrates on the boundary of the 1st ceramic member 3 and the 2nd ceramic member 5 regarding each of the tension | tensile_strength which works in the up-down direction in FIG. Furthermore, since the thickness of the partition wall 13 between the adjacent openings 11 is made equal, it is possible to suppress stress from being excessively concentrated on a part of the plurality of sintered structures 1.

  In the dividing step of the present embodiment, as shown in FIGS. 4 and 5, the first ceramic member 3 and the second ceramic member 5 that are fired and integrated are divided at the disposal margin region 9 and the second ceramic member 5, thereby The region 7 is divided into pieces each including one region. Specifically, as shown by a one-dot chain line X in FIG. Further, the second ceramic member 5 is divided in the horizontal direction perpendicular to the stacking direction.

In the manufacturing method of the present embodiment, the first ceramic member 3 and the second ceramic member 5 are divided along the alternate long and short dash line X shown in FIG. In addition, since the base | substrate area | region 7 of the 1st ceramic member 3 is used as a ceramic laminated substrate, as shown in FIG. 5, you may remove the 2nd ceramic member 5 from the sintered structure 1 separated into pieces. .

  In the plurality of sintered structures 1 manufactured based on the manufacturing method of the present embodiment, stress is dispersed as described above, and stress is excessively concentrated on a part of the plurality of sintered structures 1. Is suppressed. Therefore, the durability of each sintered structure 1 is good and the quality, such as flatness, size, and durability, of the sintered first ceramic member 3 in each of the plurality of sintered structures 1 varies. Can be reduced.

  Next, the manufacturing method of the sintered structure 1 of 2nd Embodiment is demonstrated in detail using drawing. In addition, in each structure concerning this embodiment, about the structure which has a function similar to 1st Embodiment, the same referential mark is attached and the detailed description is abbreviate | omitted. Detailed descriptions of the same steps as those in the first embodiment are also omitted.

  As shown in FIGS. 6-8, the manufacturing method of this embodiment is the same as the manufacturing method of 1st Embodiment, and the preparatory process which prepares the 1st ceramic member 3 and the 2nd ceramic member 5, and these ceramics. It has a laminating step of laminating members, a firing step of firing and integrating these ceramic members, and a dividing step of dividing into individual pieces.

  In the manufacturing method of the first embodiment, the first ceramic member 3 has a square plate shape, and each base region 7 also has a square plate shape. However, in the manufacturing method of the present embodiment, The base region 7 has a recess 15 that opens on the upper surface side. Thus, when the base | substrate area | region 7 has the recessed part 15, the sintered structure 1 separated into pieces can be used for an electronic component storage package etc., for example.

  Since the sintered structure 1 in the present embodiment has good flatness of the first ceramic member 3, that is, the flatness of the bottom surface of the recess 15 is good, the sintered structure 1 is packaged in an electronic component storage package. When used as an electronic component, an electronic component such as a capacitor or an IC element can be stably placed on the bottom surface of the recess 15.

  When the sintered structure 1 is used as an electronic component storage package, the electronic component is sealed by joining the lid member to the sintered structure 1 after placing the electronic component in the recess 15. Can do. Moreover, as a method for sealing the electronic component, resin potting or resin molding may be performed.

  As a modification of the second embodiment, the configuration of the recess 15 of the base region 7 formed on the first ceramic member 3 after singulation is such that the contraction rate of the frame portion that hits the wall surface of the recess is the bottom surface of the recess. It may be configured to have a portion that is larger than the contraction rate of the flat plate portion corresponding to the above and is equivalent to the contraction rate of the second ceramic member 5.

  Although the manufacturing method of the sintered structure of each embodiment has been described as described above, the present invention is not limited to the above-described embodiment. In other words, various modifications and combinations of embodiments can be made without departing from the scope of the present invention.

  For example, in the laminates shown in FIGS. 6 to 8, the recesses 15 formed in the first ceramic member 3 are all open on the upper surface side, but the recesses 15 are formed on the upper surface of the second ceramic member 5 on the upper surface side. The first ceramic member 3 to be opened may be configured by laminating the first ceramic member 3 having a recess 15 on the lower surface side on the lower surface of the second ceramic member 5.

  Further, the second ceramic member 5 may be laminated on the upper surface of the first ceramic member 3 on the upper surface side and the lower surface of the first ceramic member 3 on the lower surface side in the laminate.

  In addition, after the firing step, plating may be performed on a predetermined region on the surface of the recess 15 opening on the upper surface side and the recess 15 opening on the lower surface side in the fired laminate.

DESCRIPTION OF SYMBOLS 1 ... Sintered structure 3 ... 1st ceramic member 5 ... 2nd ceramic member 7 ... Base | substrate area | region 9 ... Discard allowance area | region 11 ... Opening part 13 ... Partition 15 ..Recesses

Claims (4)

A first ceramic member including a first sintered material and provided with a plurality of base regions arranged in a two-dimensional array, and provided with an allowance region between adjacent base regions and on the outermost peripheral side, and the first firing A second sintered material having a sintering shrinkage rate smaller than that of the first sintered material under the same firing conditions as that of the binder material, and a plurality of openings corresponding to the plurality of substrate regions provided in a two-dimensional array; Two preparation steps for preparing ceramic members;
A laminating step of alternately laminating a plurality of the first ceramic members and a plurality of the second ceramic members so that the opening overlaps the substrate region in the vertical direction;
A firing step of firing and integrating the laminate;
A method for producing a sintered structure, comprising: dividing the fired and integrated laminated body at the disposal margin region and the second ceramic member, and dividing the laminate into pieces corresponding to the base region.   The method for manufacturing a sintered structure according to claim 1, wherein the first ceramic member and the second ceramic member have the same thermal expansion coefficient.   About the said 2nd ceramic member, the width | variety of the site | part which overlaps with the said allowance margin area | region located in the outermost periphery side top view, and the area | region which overlaps with the said allowance margin area | region located between the said adjacent base regions mutually The manufacturing method of the sintered structure of Claim 1 or Claim 2 made larger than width | variety of this. The method for manufacturing a sintered structure according to any one of claims 1 to 3, wherein a thickness of the second ceramic member in the stacking direction is made thinner than a thickness of the first ceramic member in the stacking direction.

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