JP2013191775A - Component mounting device and component shape measuring method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To grasp the accurate shape of a component by identifying a shadow formed by an end face of the component from data on a three-dimensional shape obtained by irradiation with periodic light from one direction.SOLUTION: A component mounting device includes: imaging means having a plurality of imaging pixel groups; irradiation means of performing oblique irradiation with periodic light; moving means of moving a component in a first direction relatively to the imaging means; a shape measurement section which derives shape information representing height information and position information on the component in a third direction crossing a reference plane by a phase shift method on the basis of a plurality of images obtained by imaging the same place of the component by the plurality of imaging pixel groups; and an end face specification section which identifies the position of an end face of the component in the first direction on the basis of a shadow part D where the height information of the shape information is equal to or less than a first threshold height f1 and which appears successively by a second threshold length f2 or larger in the first direction.

Description

  The present invention relates to a component mounting apparatus that performs three-dimensional measurement of the shape of an object such as a component held at the tip of a nozzle and performs mounting processing based on the obtained data, and a component shape measuring method.

  In order to improve the yield of products produced using a component mounting apparatus, it is desired to grasp the three-dimensional shape of a component before being mounted on a substrate with high accuracy. For example, in order to improve the mounting accuracy of a component, a process of measuring the three-dimensional shape of the component and removing the component having a non-standard shape is performed before mounting the component on the substrate.

  On the other hand, since high productivity is also desired, a phase shift method capable of measuring a three-dimensional shape at high speed has attracted attention. This phase shift method is the following measurement method. A striped light having periodically different illuminances with a sine wave is irradiated obliquely onto the measurement object, and an image of the measurement object is taken from the front. The position of the stripe pattern with respect to the measurement object is shifted (scanned) little by little (for example, ¼ wavelength), and an image of the measurement object is captured a plurality of times (for example, four times). The luminance data at one point on the measurement object is extracted from the obtained information of the plurality of images, a sine wave is formed based on the plurality of data, and the phase of the reference sine wave and the formed sine wave is calculated. The height of the one point is calculated from the shift (phase difference). The pseudo three-dimensional shape of the entire measurement object is measured by scanning the phase shift over the entire measurement object.

  The above phase shift method can acquire information of a three-dimensional shape at a high speed with a relatively small amount of data, but since the light is irradiated obliquely to the measurement object, the shadow generated on the surface of the measurement object is Since it cannot be avoided and sufficient information for forming a sine wave cannot be obtained in the shadow portion, there is a portion where the three-dimensional shape cannot be measured partially on the surface of the measurement object.

  Therefore, Patent Document 1 (particularly FIGS. 34 to 37) irradiates light at different angles, and combines the two images picked up based on the two lights having different angles to eliminate the presence of the shadow. A technique for improving the measurement accuracy of the phase shift method is described.

Japanese Patent Application Laid-Open No. 11-211443

  However, in order to remove the influence of shadows by irradiating light at different angles, it is necessary to provide a plurality of irradiation means, and the apparatus becomes large. In addition, it is necessary to acquire data more than twice the normal phase shift, and the imaging time and the data analysis time become long, and the production efficiency of the mounting board is reduced.

  The inventor of the present application, as a result of intensive research and experimentation in view of the above problems, obtains the phase shift method even when light is emitted from only one and the shadow of the part is generated on the background object placed in the background of the part. The present inventors have found that the portion corresponding to the shadow can be specified from the pattern of data obtained.

  The present invention has been made on the basis of the above knowledge, and provides a component mounting apparatus and a component shape measuring method for identifying an edge portion of a component by actively utilizing the presence of a shadow while adopting a phase shift method. With the goal.

  In order to achieve the above object, a component mounting apparatus according to the present invention is a component mounting apparatus for mounting a component on a substrate, and includes: an imaging unit having a plurality of imaging pixel groups in which a plurality of imaging pixels are arranged; In the imaging target region, the periodic light that is a light having a luminance distribution in which the luminance periodically changes according to the position in the first direction and the luminance is uniform along the second direction intersecting the first direction is Irradiating means for irradiating obliquely with respect to the first direction; and moving means for moving the component relative to the imaging means in the first direction so that the component passes through an imaging target region of the imaging means. A plane including the first direction and the second direction based on a plurality of images obtained by capturing the same part of the component and a background object disposed on the back of the component with a plurality of different imaging pixel groups. Intersects with a reference plane A shape measuring unit that derives shape information indicating height information of the component in three directions and position information on the reference plane based on a phase shift method, and height information of the shape information derived by the shape measuring unit includes A portion which is not more than one threshold height and continuously appears in the first direction for a second threshold length or more is a shadow portion, and is an end face of the component in the first direction based on the shadow portion, and the periodic light And an end face specifying part that specifies the position of the end face that is not irradiated.

  According to this, it becomes possible to identify the part corresponding to the shadow from the shape information and detect the edge of the component in the first direction.

  The end face specifying portion is a portion in which the height information is equal to or less than a first threshold height, is continuous for a second threshold length in the first direction, and is continuous for a third threshold length in the second direction. May be a shadow.

  According to this, it becomes possible to identify the shadow portion more accurately by separating the shadow caused by the convex portion of the component and the shadow generated outside the edge of the component.

  In addition, the end face specifying unit is adjacent to height information that the height information is equal to or less than a first threshold height, is continuous for a second threshold length in the first direction, and rises above a fourth threshold height. The portion that appears as a shadow may be used as a shadow portion.

  As a result, it is possible to more accurately specify the shadow portion by separating the plane portion that actually exists on the reference plane and the shadow that occurs in the background portion.

  Further, a component information acquisition unit that acquires component information indicating the dimensions of the component to be imaged, and the second threshold length or the third threshold length based on the component information acquired by the component information acquisition unit. A threshold deriving unit for deriving may be provided.

  According to this, by acquiring component information in advance, it is possible to more accurately specify a shadow portion corresponding to a shadow generated by a component that is actually imaged.

  In order to achieve the above object, the part shape measuring method according to the present invention includes an imaging unit having a plurality of imaging pixel groups in which a plurality of imaging pixels are arranged, and a position in a first direction in an imaging target region of the imaging unit. Irradiation that periodically irradiates the first direction with periodic light that is a light having a luminance distribution in which the luminance changes periodically along the second direction intersecting with the first direction. The component using the component mounting apparatus comprising: means for moving the component relative to the imaging unit in the first direction so that the component passes through the imaging target area of the imaging unit A method for measuring a shape of a part of a part, wherein the same part of the part and a background object arranged on the back of the part are imaged by a plurality of different imaging pixel groups and imaged by the imaging unit. Multiple images Based on the phase shift method, the shape information indicating the height information of the component in the third direction intersecting the reference plane that is a plane including the first direction and the second direction and the position information on the reference plane is based on the phase shift method. Derived by the shape measuring unit, the height information of the shape information derived by the shape measuring unit is equal to or lower than the first threshold height, and a portion that appears continuously in the first direction for the second threshold length or longer is a shadow portion. The end face specifying unit specifies the position of the end face of the component in the first direction that is not irradiated with the periodic light based on the shadow part.

  According to this, it becomes possible to identify the part corresponding to the shadow from the shape information and detect the edge of the component in the first direction.

  It should be noted that execution of a program for causing a computer to execute each process included in the component shape measuring method also corresponds to the implementation of the present invention. Of course, implementing the recording medium in which the program is recorded also corresponds to the implementation of the present invention.

  According to the present invention, it is possible to inspect the abnormality of the imaged part and the direction of the part by specifying the shadow part from the shape information without providing a plurality of irradiation means.

FIG. 1 is a perspective view schematically showing a component mounting apparatus. FIG. 2 is a perspective view showing the relationship between the measurement object and the three-dimensional shape measuring apparatus. FIG. 3 is a side view schematically showing the irradiation state of the periodic light of the irradiation unit and the imaging target area of the camera. FIG. 4 is a block diagram illustrating functional units included in the component mounting apparatus. FIG. 5 is a diagram visually showing the shape information derived by the shape measuring unit in a three-dimensional manner. FIG. 6 is a graph showing a profile of shape information on the line II in FIG.

  Next, embodiments of a component mounting apparatus and a component shape measuring method according to the present invention will be described with reference to the drawings. The following embodiments are merely examples of the component mounting apparatus and the component shape measuring method according to the present invention. Accordingly, the scope of the present invention is defined by the wording of the claims with reference to the following embodiments, and is not limited to the following embodiments.

  FIG. 1 is a perspective view schematically showing a component mounting apparatus.

  As shown in the figure, a component mounting apparatus 300 is an apparatus for mounting a component 200 on a substrate 402, and includes a three-dimensional shape measuring apparatus 100 and a moving means 102.

  The moving unit 102 moves the component 200 in the first direction (X in the drawing) so that the component 200 passes through the imaging target area A of the imaging unit 101 (described later) included in the three-dimensional shape measuring apparatus 100. It is a device that moves relatively in the axial direction. In the case of the present embodiment, the moving means 102 includes a head 301 having a plurality of nozzles 311 arranged extending in the vertical direction (Z-axis direction), an X-axis beam 303 arranged extending in the X-axis direction, and a head A drive source (not shown) for moving the 301 along the X-axis beam 303 is provided, and the component 200 sucked and held by the nozzle 311 is moved relative to the imaging unit 101. Yes.

  Furthermore, the component mounting apparatus 300 according to the present embodiment includes a component supply unit 404 in which a plurality of tape feeders 403 and the like are detachably provided. The components 200 supplied by the tape feeder 403 are vacuum-adsorbed by a plurality of nozzles 311. It is meant to be retained.

  A Y-axis beam 304 that extends in the Y-axis direction is a member that slidably guides an X-axis beam 303 that extends in the X-axis direction. The Y-axis beam 304 can freely move in the XY plane.

  FIG. 2 is a perspective view showing the relationship between the measurement object and the three-dimensional shape measuring apparatus.

  As shown in the figure, the three-dimensional shape measuring apparatus 100 is a device that three-dimensionally measures the concavo-convex shape existing on the surface of the component 200 as the shape of the component 200, and includes an imaging unit 101, an irradiation unit 103, and the like. It has. In the case of the present embodiment, the component 200 that is the imaging target is the component 200 that is mounted on the substrate 402, and the three-dimensional shape measuring apparatus 100 determines the shape of the component 200 that is held at the tip of the nozzle 311. The image is taken from below.

  The imaging means 101 is a camera having a plurality of imaging pixel groups 112 in which a plurality of imaging pixels are arranged. In the case of the present embodiment, the imaging unit 101 is an area image in which imaging pixels are arranged in a matrix in a first direction (X-axis direction in the figure) and a second direction (Y-axis direction in the figure) orthogonal to the first direction. A sensor 111 and an optical system (for example, a telecentric lens, not shown) for forming an image on the surface of the area image sensor 111 are provided. In addition, when acquiring an image used for the phase shift method, the imaging pixels arranged in the Y-axis direction (second direction) of the area image sensor 111 are set as the imaging pixel group 112, and are arranged in each of a plurality of regions of the area image sensor 111. The component 200 is imaged using information obtained only from a plurality of imaging pixel groups.

  The area image sensor 111 is an image recognition device in which, for example, about 4000 imaging pixels are arranged in the first direction (X-axis direction) and about 3000 imaging pixels are arranged in the second direction (Y-axis direction). In the present embodiment, the area image sensor 111 employs a complementary metal-oxide semiconductor (CMOS) image sensor. The CMOS image sensor is, for example, a monochrome or color image sensor that outputs the overall intensity of light irradiated to the imaging pixel as digital data. This CMOS image sensor can acquire digital data of only the image pickup pixels included in an arbitrary area among the image pickup pixels arranged in a matrix. Further, the CMOS image sensor can provide a plurality of the regions in the CMOS image sensor, and can acquire only images of necessary portions at high speed without acquiring data from imaging pixels other than the region. Is.

  In addition, it is also possible to use a CCD (Charge Coupled Device) image sensor that can acquire an image of a necessary portion on the matrix.

  As described above, the imaging unit 101 according to the present embodiment has the rectangular imaging target region A corresponding to the area image sensor 111 at a predetermined focal position, and the component 200 that passes through the imaging target region A, and the component 200 The same portion of the lower end surface of the nozzle 311 that adsorbs the component 200 as the background object placed on the back of the image is captured by a plurality of different imaging pixel groups 112, and a plurality of images can be output as digital data. ing. In the case of the present embodiment, the line-shaped imaging pixel group 112 extending along the second direction (Y-axis direction) is set to three or more locations in the first direction (X-axis direction), for example, four locations. .

  FIG. 3 is a side view schematically showing the irradiation state of the periodic light of the irradiation unit and the imaging target area of the camera.

  As shown in the figure, the irradiation means 103 has the same brightness B along the second direction (Y-axis direction in the figure: the direction perpendicular to the paper surface) in the imaging target area A of the imaging means 101, and the first direction. This is an apparatus that irradiates periodic light having a luminance distribution in which the luminance B periodically changes according to the position (X-axis direction in the figure). In the case of the present embodiment, the luminance B of the periodic light changes in a sine wave shape. In addition, the wavelength of the sine wave which shows the change of the brightness | luminance B shown in the figure is typically shown for description, and is shown with the different scale with respect to the imaging object area | region A. FIG.

  The irradiation unit 103 irradiates periodic light obliquely at a predetermined angle with respect to the first direction (X-axis direction) on a plane (XZ plane) that intersects the imaging target area A and includes the first direction (X-axis direction). Are arranged as follows.

  FIG. 4 is a block diagram illustrating functional units included in the component mounting apparatus.

  The component mounting apparatus 300 further includes an image acquisition unit 143, a shape measurement unit 141, and an end surface specifying unit 142 as functional units.

  The image acquisition unit 143 is a processing unit that can select the imaging pixel group 112, which is an area for acquiring an image, from the area image sensor 111, and a target portion (measurement site P, not shown) of the component 200 is selected. A processing unit that acquires an image of a target portion (measurement site P, not shown), which is a specific portion of the component 200, in the corresponding imaging pixel group 112 when positioned at a specific position in the imaging target region A.

  The shape measuring unit 141 is different from the part 200 and, for example, the same part (measurement site P ′, not shown) on the end surface that sucks and holds the part 200 of the nozzle 311 as a background object disposed on the back of the part 200. Based on the plurality of images acquired by the image acquisition unit 143 from the plurality of imaging pixel groups 112, the first direction (X-axis direction) and the second direction (Y-axis direction) are defined, for example, the height of the component 200 Height information and reference plane of the component 200 in the third direction (Z-axis direction) intersecting the reference plane C (see FIG. 3), which is a reference plane in the height direction (third direction) when the height is 0 A processing unit that derives shape information indicating position information (X coordinate and Y coordinate) in C based on the phase shift method.

  The reference surface C is based on the end surface of the nozzle 311 that holds the component 200 by suction. However, the reference surface C is not limited thereto, and the surface that can hold the component 200 other than the reference jig plate or the nozzle 311, It may be obtained by setting an arbitrary background on the side to be held. Further, the reference plane C based on them may be used by being offset to an arbitrary height.

  The information on the reference plane C may be obtained by imaging in a state where the nozzle 311 does not hold the component 200, or may be obtained by imaging in advance using a reference jig plate.

  Further, when the end surface of the nozzle 311 is large with respect to the component 200 as viewed from the side of imaging the imaging target area A by the imaging unit 101 and the component 200 and the reference plane C as a background can be imaged simultaneously, the background The reference plane C by the nozzle 311 as an object may be obtained by simultaneously imaging with the component 200.

  FIG. 5 is a diagram visually showing the shape information derived by the shape measuring unit in a three-dimensional manner.

  This figure is a diagram in which the shape measurement unit 141 uses the phase shift method to highlight and visualize the shape information indicating the uneven shape on the bump side of the BGA (Ball grid array), which is the component 200, and protrudes in a mountain shape. The visible part corresponds to the bump. Further, the height shown in the figure corresponds to the downward height (negative height) from the reference plane C (the suction surface of the nozzle 311 with respect to the component 200). The BGA is an electronic component in which hemispherical bumps are arranged in a matrix on the lower surface of a rectangular package that accommodates semiconductor elements.

  FIG. 6 is a graph showing a profile of shape information on the line II in FIG.

  The figure shows the downward height at a predetermined Y coordinate of the shape information derived by the shape measuring unit 141.

  In the end face specifying unit 142, the height information of the shape information derived by the shape measuring unit 141 is equal to or less than the first threshold height f1, and the second threshold length f2 is continuously continued in the first direction (X-axis direction). The portion appearing in this manner is defined as a shadow portion D, and based on the shadow portion D, the end surface position E, which is the end surface of the component 200 in the first direction (X-axis direction) and is not irradiated with periodic light, is specified.

  Specifically, whether or not the height information is sequentially below the first threshold height f1 in the X axis direction positive direction (movement direction of the component 200) on the X coordinate axis in the predetermined Y coordinate, When height information of height f1 or less appears continuously for the second threshold length f2 or more, the continuous portion is set as the shadow portion D, and the height information first becomes the first threshold height f1 or less. Let the X coordinate be the position of the end face of the component 200.

  Here, the same processing is performed on adjacent Y coordinates, and the portion of the height information not more than the first threshold height f1 and continuing for the second threshold length f2 is the second direction (Y-axis direction). ) May be a shadow portion D that is longer than the third threshold length f3 (see FIG. 5). According to this, it is possible to identify whether the shadow due to the uneven shape existing on the surface of the component 200 or the shadow due to the edge of the component 200 appears on the surface of the nozzle 311.

  In addition, a portion where the height information is equal to or less than the first threshold height f1 continues for the second threshold length f2, and immediately after that (a positive position in the X-axis direction), a rise in which the height information is equal to or greater than the fourth threshold f4 occurs. In some cases, a portion where the height information is equal to or less than the first threshold height f1 may be a shadow portion D where the second threshold length f2 is continuous. Thereby, the case where the surface of the component 200 exists on the reference plane C and the shadow generated by the edge of the component 200 can be more accurately identified.

  As described above, even when the three-dimensional shape measuring apparatus 100 including one irradiation unit 103 is used, the position of the end face of the component 200 can be accurately grasped.

  In the present embodiment, the component mounting apparatus 300 further includes a component information acquisition unit 144, a threshold derivation unit 145, and a determination unit 146 (see FIG. 4).

  The component information acquisition unit 144, for example, from the mounting information stored for the component mounting apparatus 300 to mount the component 200 on the substrate 402, the standard dimension information of the component 200 held by the nozzle 311 and the nozzle 311. Is a processing unit that acquires component information including information on the orientation of the component 200 held by the computer.

  The end face specifying unit 142 may specify the shadow part D using only the height information in the vicinity of the position where the end face of the part 200 is considered to exist from the part information. As a result, the position of the end surface of the component 200 can be identified earlier.

  The threshold deriving unit 145 is a processing unit that derives the second threshold length f2 or the third threshold length f3 based on the component information acquired by the component information acquiring unit 144.

  Specifically, the height of the end surface of the component 200, the position of the nozzle 311 that holds the component 200 on the X axis, the position of the preset reference surface C on the X axis, and the angle of the periodic light emitted by the irradiation unit 103 Based on the above, the length in the X-axis direction of the shadow generated on the end surface of the component 200 may be calculated, and the second threshold length f2 may be derived for each component 200.

  The third threshold length f3 may be derived based on the length in the Y-axis direction held by the nozzle 311.

  The threshold deriving unit 145 acquires a table in which the type of the component 200 corresponds to the second threshold length f2 and the third threshold length f3, and the second threshold length f2 and the third threshold length f3 are obtained based on the table. May be determined.

  The determination unit 146 derives the size and orientation of the component 200 based on the information on the end surface of the component 200 identified by the end surface identification unit 142, and the component information obtained from the derived component 200 information and the component information acquisition unit 144 It is a processing unit that compares the reference information of 200 and determines that the component 200 is abnormal when the two pieces of information are different.

  Specifically, it is determined whether or not the component 200 is abnormal by comparing the distance in the X-axis direction from the surface irradiated with the periodic light of the component 200 to the surface specified by the end surface specifying unit 142 and the component information. To do.

  Further, when the length in the Y-axis direction of the end surface specified by the end surface specifying unit 142 is shorter than the reference, it is determined that the end surface is partially missing and is abnormal.

  Further, the component 200 may be arranged at a correct position by rotating the nozzle 311 based on the inclination of the surface specified by the end surface specifying unit 142.

  According to the component mounting apparatus 300 described above, an end on the shadow D side of a BGA (Ball grid array), which is a component 200 held by the nozzle 311 from the component supply unit 404, is missing, or the chip-shaped component 200 is removed. It is possible to accurately grasp the case of so-called standing adsorption that is not held in the normal direction, and to grasp the shape of the shadow part D side of the component 200 at high speed only by the periodic light irradiated from one direction. be able to. Therefore, it is possible to reduce the possibility that the defective component 200 is mounted on the substrate 402 as it is, and to improve the yield of the component mounting apparatus 300.

  In addition, this invention is not limited to the said embodiment. For example, another embodiment realized by arbitrarily combining the components described in this specification and excluding some of the components may be used as an embodiment of the present invention. In addition, the present invention includes modifications obtained by making various modifications conceivable by those skilled in the art without departing from the gist of the present invention, that is, the meaning described in the claims. It is.

  For example, the change in the luminance of the periodic light may be not only a sine wave but also a sawtooth wave.

  In addition, the image acquisition unit 143, the shape measurement unit 141, the region specification unit 147, the end face specification unit 142, the determination unit 146, and the component information acquisition unit 144 are executed by one arithmetic unit 104 included in a computer or the like executing software. Although described as a processing unit to be realized, each processing unit may be realized by a different calculation unit.

  Further, the imaging pixel group 112 may be a line sensor arranged not only as a part of the area image sensor 111 but also extending in the Y-axis direction. In this case, a plurality (three or more) of the line sensors are used in the X-axis direction.

  The present invention can be used in a component mounting apparatus that mounts components on a substrate.

DESCRIPTION OF SYMBOLS 100 Three-dimensional shape measuring apparatus 101 Imaging means 102 Moving means 103 Irradiation means 111 Area image sensor 112 Imaging pixel group 141 Shape measurement part 142 End surface specific | specification part 143 Image acquisition part 144 Component information acquisition part 145 Threshold value deriving part 146 Judgment part 200 Component 300 Component mounting apparatus 301 Head 303 X-axis beam 304 Y-axis beam 311 Nozzle 402 Substrate 403 Tape feeder 404 Component supply unit

Claims (5)

A component mounting apparatus for mounting a component on a board,
An imaging means having a plurality of imaging pixel groups in which a plurality of imaging pixels are arranged;
In the imaging target area of the imaging means, the light has a luminance distribution in which the luminance periodically changes according to the position in the first direction and the luminance is uniform along the second direction intersecting the first direction. Irradiating means for irradiating periodic light obliquely with respect to the first direction;
Moving means for relatively moving the component in the first direction with respect to the imaging unit so that the component passes through an imaging target region of the imaging unit;
It is a surface including the first direction and the second direction based on a plurality of images obtained by capturing the same part of the component and a background object arranged on the back of the component with a plurality of different imaging pixel groups. A shape measuring unit for deriving shape information indicating the height information of the component in the third direction intersecting the reference plane and the position information on the reference plane based on the phase shift method;
Based on the shadow portion, the height information of the shape information derived by the shape measurement unit is a first threshold height or less, and a portion that continuously appears in the first direction for a second threshold length or more is a shadow portion. A component mounting apparatus comprising: an end surface specifying unit that specifies the position of an end surface of the component in the first direction that is not irradiated with the periodic light. The end face specifying portion is a portion in which the height information is equal to or less than a first threshold height, is continuous for a second threshold length in the first direction, and is continuous for a third threshold length in the second direction. The component mounting apparatus according to claim 1, wherein the shadow portion is a shadow portion. In the end face specifying unit, the height information is equal to or less than a first threshold height, height information that is continuous in the first direction for a second threshold length and rises above a fourth threshold height is adjacent. The component mounting apparatus according to claim 1, wherein the appearing portion is a shadow portion. further,
A component information acquisition unit that acquires component information indicating the dimensions of the component to be imaged;
The component mounting apparatus according to claim 1, further comprising: a threshold deriving unit that derives the second threshold length or the third threshold length based on the component information acquired by the component information acquiring unit. In an imaging unit having a plurality of imaging pixel groups in which a plurality of imaging pixels are arranged, and in an imaging target area of the imaging unit, the luminance periodically changes according to the position in the first direction, and intersects the first direction. Irradiation means for irradiating periodic light, which is light having a luminance distribution with uniform luminance along the second direction, obliquely with respect to the first direction, and the imaging so that the component passes through the imaging target region of the imaging means A component shape measuring method for measuring a concavo-convex shape of the component using a component mounting apparatus comprising a moving means for moving the component relative to the means in the first direction,
Imaging the same part of the component and the background object placed on the back of the component with a plurality of different imaging pixel groups,
Based on a plurality of images picked up by the image pickup means, height information of the component in a third direction intersecting a reference surface that is a surface including the first direction and the second direction, and position information on the reference surface Derived from the shape measurement unit based on the phase shift method,
Based on the shadow portion, the height information of the shape information derived by the shape measurement unit is a first threshold height or less, and a portion that continuously appears in the first direction for a second threshold length or more is a shadow portion. A component shape measuring method in which an end surface specifying unit specifies a position of an end surface of the component in the first direction which is not irradiated with the periodic light.