JP2013036810A5 - - Google Patents
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- JP2013036810A5 JP2013036810A5 JP2011171886A JP2011171886A JP2013036810A5 JP 2013036810 A5 JP2013036810 A5 JP 2013036810A5 JP 2011171886 A JP2011171886 A JP 2011171886A JP 2011171886 A JP2011171886 A JP 2011171886A JP 2013036810 A5 JP2013036810 A5 JP 2013036810A5
- Authority
- JP
- Japan
- Prior art keywords
- sensor module
- leg
- module according
- interface board
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (9)
センサー素子を含む電子部品と、を備え、
前記マウント部材には、相互に非平行な垂線ベクトルを有する複数の面が設けられ、前記面の少なくとも１つには前記センサー素子が備えられ、
かつ、前記脚体と前記天井体とにより区画されるキャビティ内に前記電子部品の少なくとも１つが配置されていることを特徴とするセンサーモジュール。 A mounting member including a leg and a ceiling connected to one end of the leg;
An electronic component including a sensor element,
Wherein the mounting member are mutually plurality of surfaces having non-parallel perpendicular vector is provided, at least one of the previous SL surface provided with the sensor element,
And at least 1 of the said electronic component is arrange | positioned in the cavity divided by the said leg and the said ceiling body, The sensor module characterized by the above-mentioned.
複数の実装面を有する実装基板を有し、
前記電子部品は前記複数の実装面に実装されていることを特徴とするセンサーモジュール。 The sensor module according to claim 1,
A mounting board having a plurality of mounting surfaces;
The sensor module, wherein the electronic component is mounted on the plurality of mounting surfaces .
前記実装基板に第１インターフェース基板が連結され、
前記第１インターフェース基板は前記脚体に接続されていることを特徴とするセンサーモジュール。 The sensor module according to claim 2,
A first interface board is coupled to the mounting board;
The sensor module, wherein the first interface board is connected to the leg.
前記脚体は、前記一端とは異なる他端に弾性部材を備えることを特徴とするセンサーモジュール。 In the sensor module according to any one of claims 1 to 3,
The leg module includes an elastic member at the other end different from the one end.
前記脚体の延長方向からの平面視において、前記の第１インターフェース基板と重ね合わせられる第２インターフェース基板を備え、
前記第１インターフェース基板と前記第２インターフェース基板との間に弾性部材を備えることを特徴とするセンサーモジュール。 The sensor module according to claim 3, wherein
In plan view from the extension direction of the leg, a second interface board which is superimposed with the first interface board of,
A sensor module comprising an elastic member between the first interface board and the second interface board.
少なくとも２つの前記脚体を備えることを特徴とするセンサーモジュール。 In the sensor module according to any one of claims 1 to 5,
A sensor module comprising at least two legs.
前記キャビティ内で前記天井体には中央演算処理装置が配置されていることを特徴とするセンサーモジュール。 In the sensor module according to any one of claims 1 to 6,
A sensor module, wherein a central processing unit is disposed on the ceiling in the cavity.
センサー素子を含む電子部品、を備え、An electronic component including a sensor element,
前記マウント部材には、相互に非平行な垂線ベクトルを有する複数の面が設けられ、前記面の少なくとも１つには前記センサー素子が備えられ、The mount member is provided with a plurality of surfaces having normal vectors that are non-parallel to each other, and at least one of the surfaces includes the sensor element,
かつ、前記凹部内に前記電子部品の少なくとも１つが配置されていることを特徴とするセンサーモジュール。And at least 1 of the said electronic component is arrange | positioned in the said recessed part, The sensor module characterized by the above-mentioned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011171886A JP5957823B2 (en) | 2011-08-05 | 2011-08-05 | Sensor modules and electronics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011171886A JP5957823B2 (en) | 2011-08-05 | 2011-08-05 | Sensor modules and electronics |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013036810A JP2013036810A (en) | 2013-02-21 |
| JP2013036810A5 true JP2013036810A5 (en) | 2014-09-18 |
| JP5957823B2 JP5957823B2 (en) | 2016-07-27 |
Family
ID=47886560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011171886A Active JP5957823B2 (en) | 2011-08-05 | 2011-08-05 | Sensor modules and electronics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5957823B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016122042B4 (en) | 2015-11-20 | 2022-02-17 | Jena Optronik Gmbh | Sensor assembly for determining the position of an object |
| JP7241635B2 (en) * | 2019-07-30 | 2023-03-17 | 京セラ株式会社 | Wiring substrates, electronic devices and electronic modules |
| JPWO2023189324A1 (en) * | 2022-03-28 | 2023-10-05 | ||
| WO2023189823A1 (en) * | 2022-03-28 | 2023-10-05 | 住友精密工業株式会社 | Sensor device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0523140U (en) * | 1991-02-22 | 1993-03-26 | 株式会社東海理化電機製作所 | Acceleration sensor |
| JPH05340960A (en) * | 1992-06-09 | 1993-12-24 | Hitachi Ltd | Multi-dimensional acceleration sensor |
| JPH07306047A (en) * | 1994-05-10 | 1995-11-21 | Murata Mfg Co Ltd | Multi-axial detection type vibration gyro |
| JP2003028892A (en) * | 2001-07-16 | 2003-01-29 | Matsushita Electric Works Ltd | Acceleration sensor |
| JP2006112856A (en) * | 2004-10-13 | 2006-04-27 | Seiko Epson Corp | Sensor element substrate, its manufacturing method, and sensor |
| JP2008190989A (en) * | 2007-02-05 | 2008-08-21 | Denso Corp | Sensor device and its manufacturing method |
| US8100010B2 (en) * | 2008-04-14 | 2012-01-24 | Honeywell International Inc. | Method and system for forming an electronic assembly having inertial sensors mounted thereto |
| JP2009162778A (en) * | 2009-04-20 | 2009-07-23 | Panasonic Corp | Rotation rate sensor |
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2011
- 2011-08-05 JP JP2011171886A patent/JP5957823B2/en active Active
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