JP2013031083A - Oscillator, semiconductor component, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an oscillator that is suitably operable even when a part of terminals among a plurality of terminals are not used.SOLUTION: An oscillator 1 includes: a vibration element 14; an oscillation circuit 27 that applies a voltage to the vibration element 14 to generate an oscillation signal Out; a terminal 5 (Out1) and a terminal 5 (Out2) that can output the oscillation signal Out by being connected to an output part 27a of the oscillation circuit 27; and a connection compensation circuit 37 that compensates change in the frequency of the oscillation circuit 27 according to change in the conduction state between the output part 27a and an external device (including a circuit board 53) via the terminal 5 (Out2).

Description

  The present invention relates to an oscillator such as a crystal oscillator, a semiconductor component for the oscillator, and an electronic device including the oscillator.

  An oscillator having two terminals for outputting an oscillation signal is known (Patent Document 1). In Patent Document 1, one of two terminals is connected to a high-frequency circuit, and an oscillation signal output from the terminal is used as a reference frequency of a PLL synthesizer. The other of the two terminals is connected to a digital circuit, and the oscillation signal output from the terminal is used as a clock signal.

JP 2001-156547 A

  However, it is conceivable that some of the two or more terminals for the oscillation signal are not used.

  For example, when an oscillator having two or more terminals for an oscillation signal is manufactured and sold as a versatile one that can be used for various devices, the various devices on which the oscillator is mounted include two or more. Some devices do not require this terminal (oscillation signal). When an oscillator is mounted on such a device, the output of the oscillation signal from some terminals is turned off by a switch inside the oscillator, and / or the circuit of the device is not connected to some terminals. It is possible.

  For example, even in a device that requires two or more terminals for an oscillation signal, it is considered that two or more oscillation signals (terminals) are not required depending on the operation state of the device. Depending on the operating state, the output of the oscillation signal from some terminals is turned off by the internal switch of the oscillator and / or the connection between some terminals and the circuit is disconnected by the internal switch of the device. It is thought that it is done.

  In the cited document 1, there is a possibility that some of such terminals may not be used, and in this case, what kind of influence is caused on the operation of the oscillator is not disclosed at all.

  An object of the present invention is to provide an oscillator, a semiconductor component, and an electronic device that can operate favorably even when some of a plurality of terminals are not used.

  An oscillator according to one embodiment of the present invention is capable of outputting the oscillation signal by being connected to an oscillation element, an oscillation circuit that generates an oscillation signal by applying a voltage to the oscillation element, and an output side of the oscillation circuit A connection compensation circuit for compensating for a change in the frequency of the oscillation circuit according to a change in a conduction state via the second terminal between the first terminal and the second terminal, and the output side of the oscillation circuit and the external device; Have

  Preferably, the connection compensation circuit includes a circuit element including at least one of a capacitance element, an inductor, and a resistance element, and a switch capable of connecting and disconnecting the output side of the oscillation circuit and the circuit element. Have.

  Preferably, the switch selects and connects one of the second terminal and the circuit element to the output side of the oscillation circuit.

  Preferably, the oscillator further includes a buffer positioned between the output side of the oscillation circuit and the second terminal, and the circuit element is connected to the output side of the buffer by the switch.

  Preferably, the oscillator is located between the output side of the oscillation circuit and the second terminal, and the oscillation from the output side of the oscillation circuit to the second terminal according to an input drive control signal A buffer that allows or prohibits transmission of a signal, and the switch is configured to output the oscillation circuit and the circuit when the buffer permits transmission of the oscillation signal based on the drive control signal; The element is disconnected, and the output side of the oscillation circuit and the circuit element are connected when the buffer prohibits transmission of the oscillation signal.

  Preferably, the circuit element includes a capacitive element.

  Preferably, the capacitive element is a variable capacitive element.

  Preferably, the oscillator further includes a memory for holding designation information for designating a capacity of the variable capacitance element, and the variable capacitance element is set based on the designation information held in the memory.

  Preferably, the oscillator includes a temperature sensor, and a temperature compensation circuit that compensates for a change in frequency of the oscillation circuit due to a temperature change based on a temperature signal output from the temperature sensor and data held in the memory. And further.

  A semiconductor component according to one embodiment of the present invention is a semiconductor component connected to a vibration element, and is connected to an oscillation circuit that generates an oscillation signal by applying a voltage to the vibration element, and to an output side of the oscillation circuit. The frequency of the oscillation circuit according to the change in the conduction state through the second terminal between the first terminal and the second terminal capable of outputting the oscillation signal and the output side of the oscillation circuit and the external device A connection compensation circuit for compensating for the change.

  The electronic device according to one embodiment of the present invention includes the vibration element, an oscillation circuit that generates an oscillation signal by applying a voltage to the vibration element, and an oscillation circuit that is connected to an output side of the oscillation circuit of the oscillation circuit. A first terminal and a second terminal capable of outputting a signal; a device main body connected to the first terminal; and a change in a conduction state via the second terminal between the output side of the oscillation circuit and the device main body. And a connection compensation circuit for compensating for a change in the frequency of the oscillation circuit.

  According to said structure, an oscillator etc. can operate | move suitably, when some terminals are not used among several terminals.

1A and 1B are external perspective views of an oscillator according to the first embodiment of the present invention. Sectional drawing of the II-II line | wire of FIG. The block diagram which shows the structure of the signal processing system of the oscillator of FIG. 4A and 4B are diagrams for explaining information input to the oscillator of FIG. The block diagram which shows the structure of the signal processing system of the oscillator which concerns on the 2nd Embodiment of this invention. The block diagram which shows the structure of the signal processing system of the oscillator which concerns on the 3rd Embodiment of this invention.

  Hereinafter, an oscillator according to an embodiment of the present invention will be described with reference to the drawings. In the second and subsequent embodiments, components that are the same as or similar to those already described may be denoted by the same reference numerals and description thereof may be omitted.

<First Embodiment>
FIG. 1A is an external perspective view of the oscillator 1 according to the first embodiment of the present invention, and FIG. 1B is an external perspective view of the oscillator 1 viewed from the opposite direction to FIG. FIG.

  Note that the oscillator 1 may have either direction upward or downward, but in the following embodiments, for convenience, the orthogonal coordinate system xyz is defined and the positive side in the z direction is defined as the upward direction. In addition, terms such as “upper surface” and “lower surface” may be used.

  The oscillator 1 includes, for example, a base 3, a plurality of terminals 5 exposed from the base 3, and a data input unit 7 exposed from the base 3.

  The base body 3 is formed in, for example, a generally thin rectangular parallelepiped shape. For example, the plurality of terminals 5 are arranged along the outer periphery of the lower surface 3 b on the lower surface 3 b of the base 3. The data input part 7 is arrange | positioned at the side surface 3c of the base | substrate 3, for example. The plurality of terminals 5 and the data input unit 7 are formed by, for example, a conductive layer provided on the surface of the base 3.

  The oscillator 1 is supplied with power via any one of the plurality of terminals 5 and receives necessary signals. The oscillator 1 outputs a signal such as an oscillation signal via any one of the plurality of terminals 5. The data input unit 7 is used to rewrite the contents of a memory described later.

  FIG. 2 is a cross-sectional view taken along the line II-II in FIG. In FIG. 2, a part of the electronic device 51 including the oscillator 1 is illustrated.

  The electronic device 51 includes, for example, an oscillator 1 and a circuit board 53 on which the oscillator 1 is mounted.

  The circuit board 53 is, for example, a printed wiring board. The oscillator 1 is mounted on the circuit board 53 by disposing the lower surface 3b of the base body 3 so as to face the circuit board 53, and connecting the plurality of terminals 5 and the lands 55 of the circuit board 53 with bumps 57. Yes. The circuit board 53 is a member included in the device main body (a part other than the oscillator 1) of the electronic device 51 for the electronic device 51, and a member included in an external device outside the oscillator 1 for the oscillator 1.

  The base 3 of the oscillator 1 includes, for example, a container 9 in which a first recess 9a and a second recess 9b are formed, a lid 11 that closes the first recess 9a, and a resin portion 13 that is filled in the second recess 9b. Have. The vibration element 14 is accommodated in the first recess 9a, and the semiconductor component 17 is accommodated in the second recess 9b.

  Although not particularly shown, the container 9 is configured by, for example, laminating a plurality of substrates made of an insulating material such as ceramic in the z direction. The first concave portion 9a and the second concave portion 9b are configured by openings formed in the substrate, and are concave in opposite directions in the z direction. A pad 20 for mounting the vibration element 14 is formed on the bottom surface of the first recess 9a. A pad 23 for mounting the semiconductor component 17 is formed on the bottom surface of the second recess 9b. A wiring 10 for connecting the vibration element 14 and the semiconductor component 17 and connecting the semiconductor component 17 and the terminal 5 is formed inside the container 9.

  The lid 11 is a flat plate made of a metal such as 42 alloy, for example, and is bonded to the container 9 via a sealing material (not shown). The resin portion 13 is formed by filling and curing a molten resin after the semiconductor component 17 is mounted on the second recess 9b. In addition, the height from the bottom part of the 2nd recessed part 9b of the resin part 13 may be set suitably.

  The vibration element 14 includes a piezoelectric body 15 such as a crystal formed in a flat plate shape, and electrodes 16 provided on both main surfaces of the piezoelectric body 15. The vibration element 14 is fixed and connected on the pad 20 by the conductive adhesive 19.

  The semiconductor component (integrated circuit element) 17 has, for example, a substantially rectangular parallelepiped shape, and a pad 21 is formed on the main surface facing the bottom surface of the second recess 9b. The pad 21 is fixed and connected to a pad 23 provided on the container 9 by a bump 25. The plurality of pads 21 and 23 include one for connecting the semiconductor component 17 to the vibration element 14 and one for connecting the semiconductor component 17 to the terminal 5 of the oscillator 1.

  FIG. 3 is a block diagram showing the configuration of the signal processing system of the oscillator 1.

  As described above, the oscillator 1 includes the vibration element 14 and the semiconductor component 17 accommodated in the base 3. Further, the pads 21 provided on the semiconductor component 17 and the plurality of terminals 5 provided on the base 3 are connected.

  Various potentials or signals are assigned to the plurality of terminals 5 (pads 21). Specifically, a reference potential (reference potential signal GND) applied to the oscillator 1 and a potential different from the reference potential (drive potential signal Vcc) are supplied to each of the plurality of terminals 5, and the first oscillation signal output from the oscillator 1. Out1 and second oscillation signal Out2 (hereinafter, sometimes referred to as “oscillation signal Out” without being distinguished from each other), drive control signal E / D and voltage control signal Vcon input to oscillator 1 are assigned. Yes.

  In the following description, like the “terminal 5 (Out2)”, the terminal 5 or the pad 21 may be distinguished from each other by adding the reference numeral of the signal after the terminal 5 or the pad 21.

  The reference potential signal GND and the drive potential signal Vcc are signals for supplying DC power to the oscillator 1. Note that the terminal 5 (GND and Vcc) is connected to various functional units in the oscillator 1, but FIG. 3 shows only a part of the connection.

  The oscillation signal Out is a wave-like signal (including a pulse-like signal) generated by the oscillator 1 and having a potential that changes at a constant frequency. Note that the first oscillation signal Out1 and the second oscillation signal Out2 may be signals having the same frequency, waveform, or phase, or may be different signals. In the present embodiment, the configuration in the case where the frequency, the waveform, and the phase are all the same is illustrated.

  The drive control signal E / D is a signal for controlling the output of the second oscillation signal Out2 from the oscillator 1 and its stop. The voltage control signal Vcon is a signal for controlling the frequency of the first oscillation signal Out1 and the second oscillation signal Out2.

  These signals are used or generated by the configuration described below.

  The semiconductor component 17 includes an oscillation circuit 27 that generates an oscillation signal Out, and a first buffer 29A and a second buffer 29B that output the generated oscillation signal Out (hereinafter referred to as “buffer 29” without distinguishing between them). And a drive control unit 31 that controls the driving of the second buffer 29B.

  Further, the semiconductor component 17 includes a temperature sensor 33, a temperature compensation circuit 35 that compensates for a frequency change of the vibration element 14 caused by the temperature change according to a detection result of the temperature sensor 33, and a memory referred to by the temperature compensation circuit 35. 39.

  Further, the semiconductor component 17 is a connection that compensates for a change in the frequency of the first oscillation signal Out1 caused by a change in the conduction state between the oscillation circuit 27 and the circuit board 53 (external device, device body) via the terminal 5 (Out2). A compensation circuit 37 is provided.

  The oscillation circuit 27 includes, for example, an inverter 41 whose input side and output side are connected to the vibration element 14, a first capacitive element 43 </ b> A disposed between the input side of the inverter 41 and the reference potential unit, and the output of the inverter 41. The second capacitive element 43B disposed between the side and the reference potential portion (hereinafter simply referred to as “capacitive element 43”, and the first capacitive element 43A and the second capacitive element 43B may not be distinguished). Have. In addition, the oscillation circuit 27 includes a feedback resistor connected in parallel to the inverter 41, but the illustration is omitted.

  The capacitive element 43 is composed of, for example, a variable capacitance diode, and has an anode connected to the reference potential unit and a cathode connected to the inverter 41. The cathode of the capacitive element 43 is connected to the terminal 5 (Vcon). Therefore, when the voltage control signal Vcon is input from the terminal 5 (Vcon) to the cathode of the capacitive element 43, the capacitance of the capacitive element 43 changes, and consequently the frequency of the oscillation signal Out changes.

  The buffer 29 includes, for example, an inverter, and the input side is connected to the output unit 27a of the oscillation circuit 27 (the output side of the inverter 41). The buffer 29 also functions as an amplification unit that amplifies the signal from the oscillation circuit 27. The first buffer 29A is a functional unit that outputs the first oscillation signal Out1, and the output side is connected to the terminal 5 (Out1). The second buffer 29B is a functional unit that outputs the second oscillation signal Out2, and the output side is connected to the terminal 5 (Out2).

  The drive control unit 31 permits or prohibits power supply to the second buffer 29B based on the input drive control signal E / D (switches the drive state (enable state / disable state) of the second buffer 29B). It is a functional part. The drive control unit 31 is configured by, for example, a switch such as a transistor that is disposed between the second buffer 29B and the terminal 5 (Vcc) and connects or disconnects them.

  The temperature sensor 33 includes a thermistor, for example, and outputs a temperature signal T corresponding to the ambient temperature. The temperature signal T is input to the temperature compensation circuit 35.

  Although not particularly illustrated, the temperature compensation circuit 35 includes, for example, a cubic function generation circuit. The memory 39 holds data in which the temperature is associated with the coefficient of the cubic function and a constant, and the temperature compensation circuit 35 refers to the data to respond to the detection result of the temperature sensor 33. A cubic function is output. The output signal is added to the voltage control signal Vcon and applied to the cathode of the capacitive element 43.

  The connection compensation circuit 37 includes, for example, a variable capacitance element 45, a switch 47 that can connect and disconnect the capacitance element 45 and the output node of the second buffer 29B, and a capacitance control unit 49 that controls the capacitance of the capacitance element 45. And have.

  The capacitive element 45 is disposed between the output side of the second buffer 29B (and thus the output unit 27a of the oscillation circuit 27) and the reference potential unit (GND). The capacitive element 45 may be configured by an appropriate capacitive element such as a variable capacitance diode.

  The switch 47 selectively connects one of the capacitive element 45 and the terminal 5 (Out2) to the output side of the second buffer 29B. The switching of the connection is performed according to the driving state of the second buffer 29B, for example. More specifically, for example, first, the drive control signal E / D input to the drive control unit 31 is also input to the switch 47. When the drive control signal E / D is an enable signal for enabling the second buffer 29B, the switch 47 connects the second buffer 29B and the terminal 5 (Out2), and the drive control signal E When / D is a disable signal that disables the second buffer 29B, the second buffer 29B and the capacitive element 45 are connected. The switch 47 may be appropriately configured including a switch such as a transistor.

  The capacitance control unit 49 reads the designation information S1 that designates the capacitance of the capacitive element 45 held in the memory 39, and sets the capacitance of the capacitive element 45 to the capacitance according to the read designation information S1. For example, the capacitance control unit 49 applies a voltage corresponding to the designation information to the cathode of the capacitive element 45 configured by a variable capacitance diode.

  The operation of the oscillator 1 having the above configuration will be described.

  In a state where the terminal 5 (Out2) is not used, the capacitance added to the output unit 27a of the oscillation circuit 27 may change compared to a state where the terminal 5 (Out2) is used. In other words, the capacitance added to the output unit 27a may change according to the change in the conduction state between the output unit 27a and the circuit board 53 via the terminal 5 (Out2). Due to the change in the capacitance, the frequency of the oscillation signal generated by the oscillation circuit 27, in other words, the first oscillation signal Out1 output from the terminal (Out1) may change.

  Therefore, when the terminal 5 (Out2) is not used, the oscillator 1 uses the terminal 5 (Out2) by connecting the capacitive element 45 to the second buffer 29B and adding a capacitance to the output unit 27a. Sometimes, the difference between the capacitance added to the output unit 27a and the capacitance added to the output unit 27a when the terminal 5 (Out2) is not used is reduced, and thus the frequency of the first oscillation signal Out1 is changed. To compensate.

  As the case where the terminal 5 (Out2) is not used, for example, the device main body (the external device as viewed from the oscillator 1) of the electronic device 51 including the circuit board 53 does not require the second oscillation signal Out2 at all. (Out2) is connected to a reference potential or is in a floating state, and is not connected to a circuit. In this embodiment, it is assumed that the second buffer 29B is disabled by the drive control unit 31 in such a case.

  When the circuit is not connected to the terminal 5 (Out2), the oscillation circuit 27 is designed on the assumption that the circuit of the device main body is connected to the terminal 5 (Out2) and a predetermined capacity is added. If it is, the assumed capacity is not added to the output unit 27a of the oscillation circuit 27.

  Further, in this case, when the second buffer 29B is disabled by the drive control unit 31, the terminal 5 (Out2) is used (the second buffer 29B is enabled) depending on the configuration of the second buffer 29B. The capacity of the second buffer 29B and / or the capacity of the output side of the second buffer 29B is added to the output unit 27a of the oscillation circuit 27 as compared with that in the state).

  Therefore, when the circuit of the device main body is not connected to the terminal 5 (Out2), the capacitance of the capacitive element 45 is set to a capacitance equivalent to the assumed capacitance of the device main body, thereby changing the frequency. Is compensated. Further, when the influence of the change in the capacitance added to the output unit 27a due to the second buffer 29B being in the disabled state cannot be ignored, the change in the capacitance of the capacitive element 45 so that the change in the capacitance is also canceled. By setting the capacity, a change in frequency is more preferably compensated.

  Further, for example, when the terminal 5 (Out2) is not used, there is a case where the second oscillation signal Out2 becomes unnecessary depending on the operation state of the device main body including the circuit board 53. Then, the second buffer 29B is enabled / disabled according to the operation state of the device body, and / or the terminal 5 (Out2) is connected to the circuit of the device body by a switch inside the device body.・ It is possible to be disconnected.

  In this case, when the switch inside the device body is composed of a fixed contact and a movable contact, and the connection between the second buffer 29B and the circuit of the device body is physically disconnected, The change in frequency is compensated for by setting the capacitance of the capacitive element 45 in substantially the same manner as when the second oscillation signal Out2 is not required at all.

  Further, depending on the configuration of the switch 47 and the switch inside the device, how the capacitance of the circuit of the device body is added to the oscillation circuit 27 changes. In this case, the frequency is compensated by setting the capacitance of the capacitive element 45 so that the change of the capacitance added to the oscillation circuit 27 according to the change is canceled. As described above, depending on the configuration of the second buffer 29B, the capacitance of the capacitive element 45 is set so as to cancel the influence of the second buffer 29B being disabled. Changes are compensated.

  4A and 4B are diagrams illustrating a method for setting the capacitance of the capacitive element 45. FIG.

  FIG. 4A shows an example of data held in the memory 39. In the example of FIG. 4A, the memory 39 holds the capacitance value of the capacitive element 45 in association with a 3-bit number.

  FIG. 4B shows the difference (frequency fluctuation amount) between the target value and the measured value of the frequency of the first oscillation signal Out1 and the data input in the frequency fluctuation amount when the terminal 5 (Out2) is not used. A 3-bit number to be specified for the oscillator 1 via the unit 7 is illustrated.

  The manufacturer or user of the oscillator 1 first measures the amount of frequency fluctuation when the terminal 5 (Out2) is not used. Then, based on a data sheet as illustrated in FIG. 4B, a number (and thus a capacity) to be input to the data input unit 7 is specified, and the specified number is input to the data input unit 7.

  The number input to the data input unit 7 is held in the memory 39 as designation information S1. Then, the capacitance control unit 49 reads the designation information S1, identifies the capacitance (which may be a voltage to be applied to the capacitance element 45) corresponding to the designation information S1, from the data shown in FIG. The capacitance of the capacitive element 45 is set as the capacitance.

  Note that the data sheet shown in FIG. 4B is not always necessary, and the capacitance of the capacitive element 45 is set to an appropriate value by repeatedly measuring the frequency fluctuation amount and inputting a number to the data input unit 7. May be.

  Further, as can be understood from the setting example of the capacitive element 45, in setting the capacitance of the capacitive element 45, it is not always necessary to grasp the capacity of the external device that is assumed to be connected to the terminal 5 (Out2). Not necessary.

  According to the above embodiment, the oscillator 1 is connected to the oscillation element 14, the oscillation circuit 27 that applies a voltage to the oscillation element 14 to generate the oscillation signal Out, and the output unit 27 a of the oscillation circuit 27. Responding to changes in the conduction state via the terminal 5 (Out1) and the terminal 5 (Out2) that can output the oscillation signal Out, and the terminal 5 (Out2) between the output unit 27a and external devices (including the circuit board 53). And a connection compensation circuit 37 that compensates for a change in the frequency of the oscillation circuit 27.

  Accordingly, it is possible to suppress the amount of frequency fluctuation due to the terminal 5 (Out2) not being used, and to output the first oscillation signal Out1 having a more accurate frequency.

  The connection compensation circuit 37 includes a circuit element (capacitance element 45 in this embodiment) including at least one of a capacitance element, an inductor, and a resistance element, and a switch 47 that can connect and disconnect the output unit 27a and the circuit element. Have.

  Therefore, a change in frequency can be compensated with a simple configuration. Also, by providing a circuit element (capacitance element 45) separately from the capacitance element 43 that adjusts the frequency based on the voltage control signal Vcon or the like, it is suitable for the size of the capacitance to be added to the terminal 5 (Out2). It is possible to select a circuit element having the above configuration. As a result, for example, by selecting the capacitive element 45 having a capacitance order different from that of the capacitive element 43, the frequency change of the oscillator 1 can be compensated more inexpensively and accurately.

  The switch 47 selects and connects one of the terminal 5 (Out2) and the circuit element (capacitance element 45) to the output node of the second buffer 29B.

  Therefore, it is expected that the influence of the difference in various aspects in which the terminal 5 (Out2) is not used is reduced. For example, the reference potential is applied to the terminal 5 (Out2), or the terminal 5 (Out2) is floated or disconnected through a circuit and a switch of an external device. However, the switch 47 causes the output node of the second buffer 29B and the terminal 5 to be disconnected. It is expected that the amount of change in the capacitance added to the output unit 27a due to the difference is suppressed by cutting (out 2) from (Out 2).

  The oscillator 1 further includes a second buffer 29B positioned between the output unit 27a and the terminal 5 (Out2). The circuit element (capacitance element 45) is connected to the output side of the second buffer 29B by the switch 47. The

  Therefore, the circuit element is connected to the output node of the second buffer 29B in the same manner as the circuit of the external device connected to the terminal 5 (Out2), and the capacitance added to the output unit 27a can be reproduced. Easy. For example, since the combined capacity of the second buffer 29B and the capacitive element 45 is a combined capacity of series connection in the same manner as the combined capacity of the second buffer 29B and the external device, the second buffer 29B and the capacitive element 45 are connected in parallel. It is easier to reproduce the composite capacity than in the case of this case (this case is also included in the present invention).

  The oscillator 1 is located between the output unit 27a and the terminal 5 (Out2), and allows the oscillation signal Out to be transmitted from the output unit 27a to the terminal 5 (Out2) according to the input drive control signal E / D. Alternatively, a second buffer 29B to be prohibited is further included. Based on the drive control signal E / D, the switch 47 disconnects the output unit 27a and the circuit element (capacitance element 45) when the second buffer 29B permits the transmission of the oscillation signal Out, and the second buffer 29B When 29B prohibits transmission of the oscillation signal Out, the output unit 27a is connected to the circuit element.

  Accordingly, the drive control signal E / D is used not only for controlling the second buffer 29B but also for controlling the switch 47. As a result, the configuration is simplified compared to a case where a terminal for inputting a signal dedicated to control of the switch 47 is newly provided (this case is also included in the present invention), and the oscillator 1 is mounted. It is not necessary to change the design of the circuit board 53. Further, since the switch 47 is controlled based on a drive control signal E / D that can control the input during the operation of the electronic device 51, the switch 47 is connected via the data input unit 7 and the memory 39. Compared with the case where disconnection is specified (this case is also included in the present invention), it is easier to control the capacitance added to the output unit 27a in accordance with the operating state of the external device.

  The circuit element connected to the output node of the second buffer 29B by the switch 47 includes a capacitive element 45.

  Here, as indicated by a basic expression (1 / f = 2π√ (LC)) indicating the frequency f of the oscillation circuit, L (inductance) and C (capacitance) have a great influence on the frequency. . Therefore, the configuration of the circuit element becomes simpler than when the frequency is adjusted by the resistance element (this case is also included in the present invention).

  The capacitive element 45 is a variable capacitive element.

  Therefore, as compared with the case where a fixed capacitance element is used (this case is also included in the present invention), an appropriate capacitance according to the external device connected (or assumed to be connected) to the terminal 5 (Out2). Can be added to the output unit 27a to compensate for changes in frequency more accurately. In addition, the variable capacitance element can adjust the capacitance more accurately than the variable inductor adjusts the inductance, and is preferable from this viewpoint.

  The oscillator 1 further includes a memory 39 that holds designation information S1 that designates the capacitance of the capacitive element 45. The capacitive element 45 is set based on the designation information S1 that is held in the memory 39.

  Therefore, it is not necessary to newly provide a terminal for inputting a signal for adjusting the capacitance of the capacitive element 45 (this aspect is also included in the present invention). As a result, it is not necessary to change the design of the circuit board 53, and the oscillator 1 is expected to be downsized.

  The oscillator 1 includes a temperature sensor 33, a temperature compensation circuit 35 that compensates for a change in the frequency of the oscillation circuit 27 due to a temperature change, based on the temperature signal T output from the temperature sensor 33 and the data held in the memory 39. It has further.

  Therefore, the frequency change is compensated by the connection compensation circuit 37 and the temperature compensation circuit 35, and it is expected that the first oscillation signal Out1 is output at an accurate frequency. Furthermore, since the memory 39 is shared by the connection compensation circuit 37 and the temperature compensation circuit 35, the configuration is simplified.

<Second Embodiment>
FIG. 5 is a block diagram illustrating a configuration of a signal processing system of the oscillator 201 according to the second embodiment.

  The oscillator 201 is different from the oscillator 1 of the first embodiment only in the configuration of the connection compensation circuit 237 of the semiconductor component 217. Specifically, the switch 347 is provided so that the output side of the first buffer 29A and the capacitive element 45 can be connected and disconnected. The switch 347 connects the output side of the first buffer 29A and the capacitive element 45 when the drive control signal E / D is a disable signal.

  Even in such a configuration, the capacitor to be added to the terminal 5 (Out2) can be added to the output unit 27a by the capacitive element 45, and the same effect as that of the first embodiment can be obtained.

<Third Embodiment>
FIG. 6 is a block diagram illustrating a configuration of a signal processing system of the oscillator 301 according to the third embodiment.

  The oscillator 301 is a configuration example obtained by further simplifying the first embodiment. Specifically, the drive control unit 31 is not provided in the semiconductor component 317 of the oscillator 301. Note that the change in the capacitance on the terminal 5 (Out2) side is assumed to be a change due to the fact that the circuit of the external device is not connected to the terminal 5 (Out2).

  In addition, the connection compensation circuit 337 of the oscillator 301 includes a fixed capacitive element 345 instead of the variable capacitive element 45. The switch 347 provided in place of the switch 47 does not connect or disconnect the output side of the second buffer 29B and the terminal 5 (Out2), and connects and disconnects the output side of the second buffer 29B and the capacitive element 345. Only do. In addition, the switch 347 performs the connection and disconnection based on the information held in the memory 39.

  Even in such a simplified configuration, as in the first embodiment, an effect of compensating for a change in frequency due to the terminal 5 (Out2) not being used is exhibited.

  In the above embodiment, the terminal 5 (Out1 and Out2) is an example of the first terminal and the second terminal of the oscillator or electronic device of the present invention, and the pad 21 is the first of the semiconductor component or electronic device of the present invention. The part including the circuit board 53 of the electronic device 51 is an example of the external device and the device main body of the present invention.

  The present invention is not limited to the above embodiment, and may be implemented in various aspects.

  The number of terminals that can output the oscillation signal is not limited to two, and may be three or more. In this case, the number of terminals that are compensated by the connection compensation circuit may be one or two or more.

  The connection compensation circuit may be provided not in the semiconductor component in the oscillator but in a semiconductor component outside the oscillator in the electronic device.

  The connection compensation circuit is not limited to one that connects and disconnects the output side of the oscillation circuit and the circuit element (capacitance element). For example, the connection compensation circuit may change the capacitance of the capacitive element (43) of the oscillation circuit. For example, the connection compensation circuit may connect the circuit element to a position other than the output side of the oscillation circuit.

  When the connection compensation circuit connects the circuit element to the output side of the oscillation circuit, the position where the circuit element is connected is not limited to the position on the output side of the buffer. It may be connected to the output side of the oscillation circuit at a position closer to the oscillation circuit than the buffer. Further, the circuit elements are not limited to those connected in series to the buffer, but may be connected in parallel to the buffer.

  The circuit element is not limited to the capacitive element, and may be configured to include a resistance element or an inductor. Further, the circuit element is not limited to the capacitive element itself, and may be a circuit configured by combining a plurality of passive elements and / or active elements.

  In the embodiment, the capacitance control unit 49 controls the capacitance of the capacitive element to the designated capacitance (strictly, the capacitance corresponding to the designated number), but the frequency variation amount based on the data of FIG. The capacity control unit 49 may also execute the steps from specifying to the capacity. Conversely, the control voltage applied to the capacitive element may be directly input to the capacitance control unit 49.

  DESCRIPTION OF SYMBOLS 1 ... Oscillator, 5 ... Terminal, 14 ... Vibration element, 27 ... Oscillation circuit, 37 ... Connection compensation circuit, 45 ... Capacitance element, 47 ... Switch.

Claims (11)

A vibrating element;
An oscillation circuit for generating an oscillation signal by applying a voltage to the vibration element;
A first terminal and a second terminal capable of outputting the oscillation signal by being connected to an output side of the oscillation circuit;
A connection compensation circuit that compensates for a change in the frequency of the oscillation circuit in response to a change in the conduction state between the output side of the oscillation circuit and the external device via the second terminal;
Having an oscillator. The connection compensation circuit includes:
A circuit element including at least one of a capacitive element, an inductor, and a resistive element;
The oscillator according to claim 1, further comprising: a switch capable of connecting and disconnecting the output side of the oscillation circuit and the circuit element. The oscillator according to claim 2, wherein the switch selects and connects one of the second terminal and the circuit element to the output side of the oscillation circuit. A buffer located between the output side of the oscillation circuit and the second terminal;
The oscillator according to claim 2, wherein the circuit element is connected to an output side of the buffer by the switch. It is located between the output side of the oscillation circuit and the second terminal, and permits or prohibits transmission of the oscillation signal from the output side of the oscillation circuit to the second terminal according to an input drive control signal. Further comprising a buffer;
The switch disconnects the output side of the oscillation circuit and the circuit element when the buffer permits transmission of the oscillation signal based on the drive control signal, and the buffer transmits the oscillation signal. The oscillator according to any one of claims 2 to 4, wherein an output side of the oscillation circuit and the circuit element are connected when prohibition is prohibited. The oscillator according to claim 2, wherein the circuit element includes a capacitive element. The oscillator according to claim 6, wherein the capacitive element is a variable capacitive element. A memory for holding designation information for designating a capacitance of the variable capacitance element;
The oscillator according to claim 7, wherein the variable capacitance element is set based on the designation information held in the memory. A temperature sensor;
A temperature compensation circuit that compensates for a change in the frequency of the oscillation circuit due to a temperature change, based on a temperature signal output from the temperature sensor and data held in the memory;
The oscillator according to claim 8, further comprising: A semiconductor component connected to the vibration element,
An oscillation circuit for generating an oscillation signal by applying a voltage to the vibration element;
A first terminal and a second terminal capable of outputting the oscillation signal by being connected to an output side of the oscillation circuit;
A connection compensation circuit that compensates for a change in the frequency of the oscillation circuit in response to a change in the conduction state between the output side of the oscillation circuit and the external device via the second terminal;
Semiconductor component having A vibrating element;
An oscillation circuit for generating an oscillation signal by applying a voltage to the vibration element;
A first terminal and a second terminal capable of outputting the oscillation signal by being connected to an output side of the oscillation circuit of the oscillation circuit;
A device body connected to the first terminal;
A connection compensation circuit that compensates for a change in the frequency of the oscillation circuit according to a change in a conduction state between the output side of the oscillation circuit and the device main body via the second terminal;
Electronic equipment having

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