JP2013093485A - Manufacturing method of wiring board and manufacturing method of packaging structure using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which meets a demand for improving electric reliability, and to provide a manufacturing method of a packaging structure which uses the manufacturing method of the wiring board.SOLUTION: A wiring board 4 according to one embodiment of this invention comprises the steps of: preparing a substrate 7 having a fiber layer 14 containing a first resin 10 and glass fibers 12 coated by the first resin 10; jetting fine particles to the substrate 7 using sand blasting technique, thereby forming through holes T on the substrate 7; and forming a through hole conductor 8 in each through hole T.

Description

  The present invention relates to a method of manufacturing a wiring board used for electronic devices (for example, various audiovisual devices, home appliances, communication devices, computer devices and peripheral devices thereof), and a method of manufacturing a mounting structure using the same. is there.

  2. Description of the Related Art Conventionally, as a mounting structure in an electronic device, an electronic component mounted on a wiring board is used.

  Regarding the wiring substrate, Patent Document 1 discloses that a through hole is formed in a core substrate in which an insulating resin is impregnated into a glass cloth by drilling, and a through hole via made of Cu or the like is formed on a side wall of the through hole by a plating method or the like. A configuration in which (through-hole conductor) is formed is disclosed.

  Patent Document 2 discloses a configuration in which a through hole is formed by laser processing on a core substrate reinforced with epoxy resin or the like by glass cloth, and a conductive paste is filled in the through hole.

  By the way, when a through hole is formed in the core substrate by drilling, peeling is likely to occur between the glass cloth and the resin on the inner wall of the through hole due to mechanical stress or frictional heat. On the other hand, when a through hole is formed in the core substrate by laser processing, peeling between the glass cloth and the resin tends to occur on the inner wall of the through hole due to the heat of the laser.

  As described above, when peeling occurs between the glass cloth and the resin on the inner wall of the through hole, when a voltage is applied to the through hole conductor, a part of the through hole conductor ionized by the voltage enters the peeling portion. Adjacent through-hole conductors may be short-circuited. Therefore, the electrical reliability of the wiring board tends to decrease.

JP 2006-324642 A JP 2003-209359 A

  The present invention provides a method for manufacturing a wiring board and a method for manufacturing a mounting structure using the wiring board that meet the demand for improving electrical reliability.

  According to one aspect of the present invention, there is provided a method of manufacturing a wiring substrate, comprising: preparing a substrate having a fiber layer including a first resin and a glass fiber coated with the first resin; A step of forming a through hole in the base by spraying toward the base and a step of forming a through hole conductor in the through hole are provided.

  Moreover, the manufacturing method of the mounting structure concerning one form of this invention is equipped with the process of electrically connecting an electronic component to the wiring board produced with the said manufacturing method.

  According to the method for manufacturing a wiring board according to one aspect of the present invention, the through-hole is formed in the base by injecting the fine particles toward the base using the sandblast method. It is possible to reduce the peeling between the resin 1 and the glass fiber, and thus to produce a wiring board excellent in electrical reliability.

FIG. 1A is a cross-sectional view along the thickness direction of a mounting structure according to an embodiment of the present invention, and FIG. 1B is a through hole of the mounting structure according to an embodiment of the present invention. It is an enlarged view of the surface of the inner wall. 2A to 2D are cross-sectional views cut in the thickness direction for explaining the manufacturing process of the mounting structure shown in FIG. FIG. 3 (a) shows a field emission of a cross section cut in the thickness direction before forming a through-hole conductor in a copper-clad laminate in which through-holes are formed by sandblasting, drilling, or laser processing in an embodiment of the present invention. FIG. 3B is a photograph taken with a scanning microscope or a metallographic microscope. FIG. 3B shows a cross section of the copper-clad laminate shown in FIG. Or it is the photograph image | photographed using the metal microscope. 4A is an enlarged photograph of a portion corresponding to a part of FIG. 3B using a field emission microscope. FIG. 4B shows a through-hole formed by sandblasting or drilling. Then, the reliability of the copper-clad laminate with through-hole conductors is evaluated. FIG. 5 shows a cross-section cut in the thickness direction before forming a through-hole conductor in a copper-clad laminate in which through-holes are formed by sandblasting using crushed particles or spherical particles and a photograph of crushed particles or spherical particles. It is the photograph image | photographed using the emission microscope.

  Hereinafter, a mounting structure including a wiring board manufactured by a manufacturing method according to an embodiment of the present invention will be described in detail with reference to the drawings.

  The mounting structure 1 shown in FIG. 1A is used for electronic devices such as various audiovisual devices, home appliances, communication devices, computer devices or peripheral devices thereof. The mounting structure 1 includes an electronic component 2 and a flat wiring board 4 on which the electronic component 2 is flip-chip mounted via bumps 3.

  The electronic component 2 is a semiconductor element such as an IC or an LSI, for example, and a base material is formed of a semiconductor material such as silicon, germanium, gallium arsenide, gallium arsenide phosphorus, gallium nitride, or silicon carbide. The electronic component 2 is set to have a thickness of 0.1 mm to 1 mm, for example.

  The bump 3 is made of a conductive material such as solder including lead, tin, silver, gold, copper, zinc, bismuth, indium or aluminum.

  The wiring substrate 4 includes a flat core substrate 5 and a pair of wiring layers 6 formed on both sides of the core substrate 5. For example, the wiring board 4 is set to have a coefficient of thermal expansion greater than that of the electronic component 2 in the plane direction.

  The core substrate 5 is intended to increase the strength of the wiring substrate 4 while achieving electrical connection between the pair of wiring layers 6. The core substrate 5 includes a flat substrate 7 having a plurality of through-holes T penetrating in the thickness direction and a plurality of through-holes. A cylindrical through-hole conductor 8 covering the inner wall of the hole T and a columnar insulator 9 formed in a region surrounded by the through-hole conductor 8 are included.

  The base 7 increases the rigidity of the core substrate 5, and as shown in FIGS. 1A and 1B, the resin 10, the inorganic insulating particles 11 coated with the resin 10, and the resin 10 And a flat plate-like base material 13 made of a plurality of glass fibers 12.

  In this base body 7, a layer made of the base material 13 and the resin 10 (first resin) disposed between the glass fibers 12 of the base material 13 is referred to as a fiber layer 14. Further, a layer made of resin 10 (second resin) and inorganic insulating particles 11 that is disposed between the fiber layers 14 and does not include glass fibers is referred to as a resin layer 15. The boundary between the fiber layer 14 and the resin layer 15 is constituted by an interface between the glass fiber 12 of the fiber layer 14 and the resin 10 of the resin layer 15. The fiber layer 14 may include the inorganic insulating particles 11 between the glass fibers 12.

  The substrate 7 has a thickness set to, for example, 0.03 mm or more and 0.4 mm or less, a thermal expansion coefficient in the plane direction set to, for example, 4 ppm / ° C. or more and 15 ppm / ° C. or less, and a thermal expansion coefficient in the thickness direction. For example, it is set to 11 ppm / ° C. or more and 30 ppm / ° C. or less, the thermal expansion coefficient in the thickness direction is set to, for example, 2 to 2.8 times the thermal expansion coefficient in the plane direction, and the Young's modulus is, for example, 20 GPa to 30 GPa. Is set to

  Here, the coefficient of thermal expansion of the substrate 7 is measured by a measuring method according to JISK7197-1991 using a commercially available TMA apparatus. The Young's modulus is measured using a Nano Indentor XP / DCM manufactured by MTS Systems.

  The resin 10 contained in the substrate 7 is, for example, an epoxy resin, a bismaleimide triazine resin, a cyanate resin, a polyparaphenylene benzbisoxazole resin, a wholly aromatic polyamide resin, a polyimide resin, an aromatic liquid crystal polyester resin, a polyether ether ketone resin, or It can be formed of a resin material such as polyether ketone resin. The resin 10 has a coefficient of thermal expansion in the planar direction and thickness direction set to, for example, 20 ppm / ° C. or more and 50 ppm / ° C. or less, and a Young's modulus set to, for example, 3 GPa or more and 10 GPa or less.

  The inorganic insulating particles 11 coated with the resin 10 reduce the coefficient of thermal expansion of the base 7 and increase the rigidity of the base 7, and include an inorganic insulating material such as aluminum hydroxide, magnesium hydroxide, or silicon oxide, Among these, it is desirable to include silicon oxide having properties such as a coefficient of thermal expansion and Young's modulus that are close to those of glass fibers. As a result, the thermal expansion coefficient and Young's modulus of the resin layer 15 can be made closer to the fiber layer 14. When the inorganic insulating particles 11 contain silicon oxide, the inorganic insulating particles 11 desirably contain 65% by weight to 100% by weight of silicon oxide. In addition to silicon oxide, aluminum oxide, magnesium oxide, calcium oxide, nitriding Aluminum, aluminum hydroxide, calcium carbonate or the like may be contained.

  The inorganic insulating particles 11 are formed in, for example, a spherical shape, the particle size is set to, for example, 0.5 μm or more and 5.0 μm or less, and the coefficient of thermal expansion in each direction is, for example, 2.7 ppm / ° C. or more and 6 ppm / ° C. or less. The Young's modulus is set to 70 GPa or more and 85 GPa or less. In addition, as the inorganic insulating particles 11, particles obtained by finely cutting glass fibers may be used.

  The inorganic insulating particles 11 are preferably set to have a content in the resin layer 15 of 40 volume% or more and 75 volume% or less. As a result, when the content of the inorganic insulating particles 11 is 40% by volume or more, the thermal expansion coefficient and Young's modulus of the resin layer 15 can be made closer to the fiber layer 14. Further, since the content of the inorganic insulating particles 11 is 70% by volume or more, the adhesive strength between the inorganic insulating particles 11 located on the inner wall of the through hole T and the resin 10 is increased, and the inorganic insulating particles 11 and the resin 10 Can be reduced, and as a result, peeling between the through-hole conductor 8 and the resin layer 15 can be reduced.

  Here, the particle diameter of the inorganic insulating particles 11 is measured by observing the cross section of the substrate 7 with a field emission electron microscope, measuring the maximum diameter of each particle, and calculating the average value. The content (volume%) of the inorganic insulating particles 11 in the resin layer 15 is determined by observing the cross section of the resin layer 15 with a field emission electron microscope, and the area ratio (area) occupied by the inorganic insulating particles 11 with respect to the resin layer 15. %), And the average value is calculated and regarded as the content (volume%).

  The base material 13 covered with the resin 10 increases the rigidity of the base body 7 and reduces the coefficient of thermal expansion in the planar direction. For example, a woven fabric (glass) in which a plurality of glass fibers 12 are woven vertically and horizontally. Cross) can be used. In addition, you may use a nonwoven fabric as the base material 13, and you may use what arranged the some glass fiber 12 so that a longitudinal direction might become mutually parallel.

  The glass fiber 12 contained in the base material 13 can use a fiber made of glass such as T glass, S glass, or E glass, and the diameter of the cross section perpendicular to the longitudinal direction is set to 4 μm or more and 9 μm or less, for example. The coefficient of thermal expansion in the longitudinal direction and the width direction is set to 2.5 ppm / ° C. or more and 6 ppm / ° C. or less, and the Young's modulus is set to 70 GPa or more and 85 GPa or less.

  On the other hand, the through-hole conductor 8 attached to the inner wall of the through-hole T is for electrically connecting the wiring layers 6 above and below the core substrate 5 and is formed of a conductive material such as copper, aluminum or nickel, for example. It is desirable to use copper having high conductivity. The through-hole conductor 8 has a length from the inner wall of the through-hole T to the insulator 9 set to 3 μm or more and 20 μm or less, and a thermal expansion coefficient in the penetration direction and the width direction is, for example, 16 ppm / ° C. or more and 25 ppm / ° C. or less. The Young's modulus is set to 60 GPa or more and 210 GPa or less, for example. The thermal expansion coefficient of copper is about 18 ppm / ° C. Further, the thermal expansion coefficient and Young's modulus of the through-hole conductor 8 are measured in the same manner as the base body 7.

  An insulator 9 formed in a region surrounded by the through-hole conductor 8 forms a support surface of a via conductor 18 to be described later. For example, polyimide resin, acrylic resin, epoxy resin, cyanate resin, fluororesin, silicon It can be formed of a resin material such as resin, polyphenylene ether resin or bismaleimide triazine resin.

  On the other hand, a pair of wiring layers 6 are formed on both sides of the core substrate 5 as described above. The wiring layer 6 is laminated on the base 7 and has an insulating layer 16 in which a via hole V penetrating in the thickness direction is formed, a conductive layer 17 formed on the base 7 or on the insulating layer 16, and the via hole V And a via conductor 18 electrically connected to the conductive layer 17.

  The insulating layer 16 not only functions as a support member that supports the conductive layer 17 but also functions as an insulating member that prevents a short circuit between the conductive layers 17. Resin and inorganic insulating particles coated with the resin , Including. The insulating layer 16 is set to have a thickness of, for example, 5 μm or more and 40 μm or less, a thermal expansion coefficient in the plane direction and the thickness direction is set to, for example, 15 ppm / ° C. or more and 45 ppm / ° C. or less, and a Young's modulus is, for example, 5 GPa or more and 40 GPa or less. Is set. The thermal expansion coefficient and Young's modulus of the insulating layer 16 are measured in the same manner as the substrate 7.

  Examples of the resin contained in the insulating layer 16 include epoxy resin, bismaleimide triazine resin, cyanate resin, polyparaphenylene benzbisoxazole resin, wholly aromatic polyamide resin, polyimide resin, aromatic liquid crystal polyester resin, and polyether ether ketone resin. Or what was formed with polyetherketone resin etc. can be used.

  As the inorganic insulating particles contained in the insulating layer 16, those similar to the inorganic insulating particles 11 contained in the substrate 7 can be used.

  The conductive layer 17 functions as, for example, a ground wiring, a power supply wiring, or a signal wiring. For example, a conductive layer 17 formed of a metal material such as copper, silver, gold, aluminum, nickel, or chromium is used. Can do. The conductive layer 17 has a thickness set to, for example, 3 μm or more and 20 μm or less, a coefficient of thermal expansion in the plane direction and the thickness direction, for example, set to 5 ppm / ° C. or more and 25 ppm / ° C. or less, and a Young's modulus set to 50 GPa or more and 250 GPa or less. Has been.

  The via conductor 18 connects the conductive layers 17 that are separated from each other in the thickness direction, and is formed in a tapered shape whose width decreases toward the core substrate 5, for example, copper, silver, gold, What was formed with the electrically conductive material of aluminum, nickel, or chromium can be used.

  By the way, since the glass fiber 12 has a smaller coefficient of thermal expansion than the through-hole conductor 8, when heat is applied to the wiring board 4, thermal stress is easily applied between the glass fiber 12 and the through-hole conductor 8.

  On the other hand, in the wiring board 4 of the present embodiment, as shown in FIG. 1B, the glass fiber 12 of the fiber layer 14 is a surface exposed on the inner wall of the through hole T (a surface parallel to the through direction of the through hole T). ) Has a groove-shaped (elongated shape) recess C, and a part of the through-hole conductor 8 is filled inside the recess C. Here, since the recessed part C is groove shape, the filling property of the through-hole conductor 8 to the recessed part C can be improved, and the anchor effect of the recessed part C and the through-hole conductor 8 can be improved. Therefore, the adhesive strength between the glass fiber 12 and the through-hole conductor 8 can be increased, and peeling between the glass fiber 12 and the through-hole conductor 8 can be reduced. As a result, disconnection of the through-hole conductor 8 can be reduced, and as a result, the wiring board 4 excellent in electrical reliability can be obtained.

  It is desirable that the length of the groove-like recess C in the longitudinal direction L is set to be 1.2 times or more and 2.5 times or less of the length in the width direction W. As a result, when the length in the longitudinal direction L is 1.2 times or more the length in the width direction W, the filling property of the through-hole conductor 8 into the concave portion C can be improved, and the length in the longitudinal direction L is increased. However, by being 2.5 times or less of the length in the width direction W, it is possible to suppress the length in the width direction W from becoming too small, and to secure the anchor effect to the through-hole conductor 8. The concave portion C has a length in the longitudinal direction L set to, for example, 3 μm to 8 μm, a length in the width direction W set to, for example, 2 μm to 5 μm, and a depth set to, for example, 0.5 μm to 3 μm. Has been.

  Moreover, as shown in FIG.1 (b), it is desirable for the recessed part C to be the groove shape along the thickness direction of the base | substrate 7. As shown in FIG. As a result, in the glass fiber 12 having a smaller amount of thermal expansion in plan view than the through-hole conductor 8, an anchor effect is generated in the circumferential direction of the through-hole T, and therefore the adhesive strength between the through-hole T inner wall and the through-hole conductor 8. Can be increased.

  The arithmetic average roughness (Ra) of the surface exposed to the inner wall of the through hole T of the glass fiber 12 is set to, for example, 0.3 μm or more and 3 μm or less. The arithmetic average roughness of the surface of the glass fiber 12 covered with the resin 10 (the surface not exposed to the inner wall of the through hole T) is set to 0.1 μm or less, for example, and the through hole T of the glass fiber 12 It is smaller than the arithmetic average roughness of the surface exposed on the inner wall. The arithmetic average roughness of the surface of the glass fiber 12 covered with the resin 10 is set to, for example, 10% or more and 50% or less of the arithmetic average roughness of the surface exposed to the inner wall of the through hole T of the glass fiber 12.

  Thus, the mounting structure 1 described above exhibits a desired function by driving or controlling the electronic component 2 based on the power supply and signals supplied via the wiring board 4.

  Next, the manufacturing method of the mounting structure 1 mentioned above is demonstrated based on FIG.

(Preparation of substrate)
(1) As shown in FIG. 2A, a copper clad laminate 5x comprising a base body 7 and copper foils 17x disposed above and below the base body 7 is prepared. Specifically, for example, it is performed as follows.

  First, a varnish containing uncured resin 10 and inorganic insulating particles 11 is prepared, and the base material 12 is impregnated with the varnish to form a resin sheet. Thus, when the base material 12 is impregnated with the varnish, the inorganic insulating particles 11 are less likely to enter between the glass fibers 12 of the base material 13, and thus are concentrated in a region outside the base material 13 (a region that becomes the resin layer 15). The The uncured state is an A-stage or B-stage according to ISO 472: 1999.

  Next, the resin sheet is laminated to form a substrate precursor, and a copper foil 17x is laminated on and under the substrate precursor to form a laminate, and then the laminate is heated and pressed in the thickness direction. Thus, the resin 10 is thermally cured to form the base 7 and the above-described copper-clad laminate 5x is produced. Thus, when forming the base | substrate 7, the resin between the base material 13 of the resin sheet and the glass fiber 12 becomes the fiber layer 14, and the regions outside the base material 13 of the adjacent resin sheets are bonded to each other to form the resin layer 15. It becomes.

(Through hole formation)
(2) As shown in FIG. 2B, through-holes T are formed in the copper-clad laminate 5x using a sandblast method. Specifically, for example, it is performed as follows.

  First, a resist having openings at the positions where the through holes T are formed is formed on both surfaces of the copper clad laminate 5x. This resist can be formed, for example, by exposure and development of a photosensitive resin. Next, a part (non-penetrating) of the through hole T is formed through the opening of the resist by injecting fine particles from the nozzle of the sand blasting device onto one main surface of the copper clad laminate 5x. Next, the through holes T penetrating the base 7 are formed by spraying fine particles onto the other main surface of the copper clad laminate 5x. Note that the through hole T penetrating the base body 7 may be formed by spraying fine particles only on one main surface of the copper clad laminate 5x. Next, the resist is removed with, for example, 1 to 3 wt% sodium hydroxide solution. Next, by washing the inner wall of the through hole T with high pressure water, the remaining fine particles and the processing waste of the through hole T are removed.

  When the sandblasting method is used in this way, the through hole T is formed by the injection of fine particles, so that the stress and heat applied to the boundary between the glass fiber 12 and the resin 10 can be reduced compared to drilling. it can. Furthermore, compared with laser processing, the heat applied to the boundary between the glass fiber 12 and the resin 10 can be reduced. Therefore, when the sandblasting method is used, it is possible to reduce the peeling between the glass fiber 12 and the resin 10 as compared with drilling or laser processing, so that the short circuit between adjacent through-hole conductors 8 is reduced. The interval can be narrowed, and consequently the wiring density of the wiring board 4 can be increased.

  Further, when the content of the inorganic insulating filler 11 in the substrate 7 is increased, the drill is not worn like the drilling process, and the through hole T can be formed more easily than the laser processing. Therefore, when the content of the inorganic insulating filler 11 in the substrate 7 is high, the through-hole T can be efficiently formed by using the sandblast method.

  In particular, it is desirable that the content of the inorganic insulating particles 11 in the resin layer 15 of the base body 7 on which the fine particles are injected is set to be 40% by volume or more and 75% by volume or less. As a result, by making the content of the inorganic insulating particles 11 40% by volume or more, the machinability of the resin layer 15 by the sandblast method can be improved. In addition, by setting the content of the inorganic insulating particles 11 to 75% by volume or less, the formation of the through holes T reduces the degranulation of the inorganic insulating particles 11 from the inner walls of the through holes T, and the dents caused by the degranulation It can be reduced that the bubbles remain and the adhesion strength between the inner wall of the through hole T and the through hole conductor 8 is lowered.

  Moreover, since sandblasting is performed using a resist, it is possible to process a plurality of through-holes T by spraying a wide range of fine particles, so the through-holes T can be formed more efficiently than drilling or laser processing. it can. In particular, when the thickness of the substrate 7 is set to be as thin as 0.03 mm or more and 0.4 mm or less, the through hole T can be efficiently formed using the sand blast method.

  As described above, in order to form the through hole T by the sand blast method, the sand blast method can be performed under the following conditions.

  First, the sandblasting method is performed by drive last. As a result, since resistance to fine particles is small compared to wet blasting, it is possible to improve the machinability of the through-hole T, reduce the residual machining waste during cutting, and reduce the cutting hindrance due to the machining waste.

  On the other hand, fine particles to be ejected by sandblasting can be, for example, spherical fine particles (spherical particles) or crushed fine particles (crushed particles), and are formed using an inorganic insulating material such as glass, alumina, silicon carbide, or zirconia. be able to.

  Among these, it is desirable to use crushed particles made of an inorganic insulating material whose hardness is higher than that of glass as the fine particles to be ejected by sandblasting. As a result, the glass fiber 12 exposed on the inner wall of the through hole T can be efficiently cut by the sharp end portion of the crushed particles harder than the glass fiber 12, so that it is applied between the glass fiber 12 and the resin 10. The through hole T can be formed efficiently while reducing the applied stress. Moreover, since the surface of the glass fiber 12 exposed to the inner wall of the through hole T is partially cut by the sharp end portion of the crushed particles harder than the glass fiber 12, the groove-shaped recess C along the thickness direction is formed. Can be formed.

  As such an inorganic insulating material having a hardness higher than that of glass, for example, alumina, silicon carbide, zirconia, or the like can be used, and among these, it is desirable to use alumina. As the hardness, Vickers hardness can be used.

  Further, the particle diameter of the fine particles is preferably set to 10 μm or more and 30 μm or less. As a result, by setting the particle diameter to 10 μm or more, it is possible to easily form the through hole T by improving the cutting ability by the fine particles. Further, by setting the particle size to 30 μm or less, the through hole T can be formed without clogging the fine particles. The particle size of the fine particles is an average value of the maximum diameters of the respective particles.

  Moreover, it is desirable that the pressure for injecting the fine particles is set to 0.15 MPa or more and 0.22 MPa or less. As a result, the glass fiber 12 in the through hole T can be efficiently cut by setting the pressure to 0.15 MPa or more. Further, by setting the pressure to 0.22 MPa or less, it is possible to process so that the crushed particles collide with each other and the resin 10 on the inner wall of the through hole T is not excessively cut.

  Moreover, it is desirable that the injection amount of the fine particles is set to 30 g / min or more and 200 g / min or less.

  In addition, the number of times the fine particles are ejected to one through hole T (the number of scans) is set in accordance with the thickness of the base 7. For example, when the thickness of the core substrate 5 is 80 μm or more and 400 μm or less, Is set to less than

  Here, it is desirable that the inner wall of the through hole T formed by the sandblast method is not subjected to desmear treatment. When the through-hole T is formed by the sand blast method, the heat applied to the inner wall of the through-hole T can be reduced to reduce the residue of the carbonized resin as compared with drilling or laser processing, and physically between the molecules. Since the bond is cut, the reaction activity of the surface of the resin 10 exposed on the inner wall of the through hole T can be increased. Further, as described above, an anchor effect with the through-hole conductor 8 is generated by the concave portion C of the glass fiber 12 exposed on the inner wall of the through-hole T.

  Therefore, the adhesive strength between the inner wall of the through hole T and the through hole conductor 8 can be increased without performing a desmear process. By not performing the desmear process in this way, it is possible to reduce only the resin 10 from being selectively etched and to largely expose the side surfaces of the glass fibers 12, and to reduce the peeling between the resin 10 and the glass fibers 12.

(Formation of through-hole conductors)
(3) As shown in FIG. 2 (c), the through-hole conductor 8, the insulator 9 and the conductive layer 17 are formed on the base body 7, and the core substrate 5 is manufactured. Specifically, for example, it is performed as follows.

  First, a cylindrical through-hole conductor 8 is formed by depositing a conductive material on the inner wall of the through-hole T by sequentially using an electroless plating method and an electroplating method. Next, a region surrounded by the cylindrical through-hole conductor 8 is filled with a resin material or the like to form an insulator 9. Next, after a conductive material is deposited on the exposed portion of the insulator 9, the copper foil 17x is patterned by a conventionally known photolithography technique, etching, or the like to form the conductive layer 17. Note that an evaporation method, a CVD method, or a sputtering method may be used for depositing the conductive material.

  Here, when forming the through-hole conductor, the recess C of the inner wall of the through-hole T formed in the step (2) described above is filled with a conductive material. Therefore, since the concave portion C has a groove shape, it is possible to reduce bubbles remaining in the concave portion C when the conductive material is applied, and to improve the filling property of the conductive material into the concave portion C.

  The core substrate 5 can be manufactured as described above.

(Formation of wiring layer)
(4) As shown in FIG. 2 (d), the wiring substrate 4 is manufactured by forming a pair of wiring layers 6 on both sides of the core substrate 5. Specifically, for example, it is performed as follows.

  First, an uncured resin is placed on the conductive layer 17, and the resin is heated and fluidly adhered, and further heated to cure the resin, thereby forming the insulating layer 16 on the conductive layer 17. Next, a via hole V is formed by laser processing, and at least a part of the conductive layer 17 is exposed in the via hole V. Thus, by forming the via hole V by laser processing, damage to the conductive layer 17 exposed in the via hole V can be reduced as compared with the sandblasting method. Next, the via conductor 18 is formed in the via hole V and the conductive layer 17 is formed on the upper surface of the insulating layer 16 by, for example, a semi-additive method, a subtractive method, or a full additive method.

  The wiring board 4 can be produced as described above. By repeating this process, the insulating layer 16 and the conductive layer 17 can be multilayered in the wiring layer 6.

(Electronic component mounting)
(5) The bump 3 is formed on the upper surface of the uppermost conductive layer 17 and the electronic component 2 is flip-chip mounted on the wiring board 4 via the bump 3.

  As described above, the mounting structure 1 shown in FIG. 1A can be manufactured.

  The present invention is not limited to the above-described embodiments, and various modifications, improvements, combinations, and the like can be made without departing from the spirit of the present invention.

  For example, in the above-described embodiment, the configuration using a semiconductor element as an electronic component has been described as an example, but a capacitor or the like may be used as the electronic component.

  In the above-described embodiment, the configuration in which the electronic component is flip-chip mounted on the wiring board has been described as an example. However, the electronic component may be mounted on the wiring board by wire bonding, or the electronic component may be mounted inside the wiring board. May be implemented.

  In the above-described embodiment, the configuration in which the wiring layer includes one insulating layer has been described as an example. However, the wiring layer may include any number of insulating layers.

  In the above-described embodiment, the configuration in which the base includes three fiber layers has been described as an example. However, the base may include any number of fiber layers.

  In the above-described embodiment, the configuration in which the first resin of the fiber layer and the second resin of the resin layer are the same has been described as an example. However, the first resin of the fiber layer and the second resin of the resin layer May be different.

  Moreover, in embodiment mentioned above, although the structure using copper foil was demonstrated to the example in the process of (1), the metal which consists of metal materials, such as an iron nickel alloy or an iron nickel cobalt alloy, for example instead of copper foil A foil may be used.

  Hereinafter, the present invention will be described in detail by way of examples. However, the present invention is not limited to the following examples, and all modifications and embodiments without departing from the gist of the present invention are not limited thereto. Included in range.

<Comparison of through-hole processing methods>
(Evaluation method)
A copper-clad laminate formed by laminating copper foils on the top and bottom of the substrate was prepared, and through holes were formed by sandblasting, drilling or laser processing (355 nm UV). Next, a through-hole conductor was formed on the inner wall of the through-hole using an electroless plating method and an electroplating method. Thereafter, the copper clad laminate before and after forming the through-hole conductor was cut in the thickness direction, and the cut surface was observed using a field emission electron microscope or a metal microscope.

  Also, after forming through-holes with different pitches using sandblasting or drilling, copper-clad laminates with through-hole conductors were subjected to PCBT and THB, which are high-temperature, high-humidity bias tests, and through-hole conductors The insulation reliability was evaluated. The conditions of PCBT are 130 ° C., 85% RH, and bias 5V, and the conditions of THB are 85 ° C., 85% RH, and bias 5V.

(Conditions for copper clad laminate)
First, a resin sheet containing an uncured epoxy resin (resin), silica filler (inorganic insulating particles), and glass cloth (base material) was prepared. In addition, the resin sheet contains 60 volume% of silica fillers.

  Next, four layers of resin sheets were laminated, and a copper foil was laminated on the outermost layer to form a laminate.

  Next, the above-mentioned copper-clad laminate was produced by heating and pressing the laminate in the thickness direction under the conditions of temperature: 220 ° C., pressure: 3 MPa, and time: 90 minutes.

(Through hole processing conditions)
The sandblasting method was performed under the conditions of fine particle injection amount: 50 g / min, fine particle injection pressure: 0.15 MPa, fine particle shape: crushed particles, fine particle size: 26 μm, fine particle material: alumina.

  Drilling was performed under the conditions of spindle: 30 krpm and chip load: 3 μm / rev.

  Laser processing was performed under the conditions of wavelength: 355 nm, frequency: 30 kHz, beam mode: Gaussian beam mode, and speed: 91.6 mm / sec.

(result)
As shown in FIGS. 3 (a), 3 (b) and 4 (a), the through-hole conductor penetrated between the glass cloth and the resin in drilling and laser processing, but in the sandblasting method, the glass cloth and resin Were in close contact with each other, and no penetration of the through-hole conductor was observed.

  As shown in FIG. 4B, in the drilling process, when the through-hole pitch was set to 100 μm, an electrical defect was observed, but in the sandblast method, no electrical defect was observed.

<Comparison of particle shapes to be injected>
(Evaluation method)
A copper clad laminate is produced by laminating copper foils on the top and bottom of the substrate, and crushed particles or spherical particles are sprayed in the sandblast method to form through holes, and then the copper clad laminate is cut in the thickness direction. The cut surface was observed using a field emission electron microscope.

(Conditions for copper clad laminate)
A copper-clad laminate was produced in the same manner as in the comparison of through-hole processing described above.

(Through hole processing conditions)
The spherical particles have a material: magnetic material powder Fe—Si—B—Cr and a particle size: 11 μm. Other conditions are the same as the comparison of the through hole processing mentioned above.

(result)
As shown in FIG. 5, compared to the case of using spherical particles, when crushed particles are used, the processability of the through holes is good, and the side surfaces and end surfaces exposed to the through holes of the glass fiber are recessed. Was formed.

DESCRIPTION OF SYMBOLS 1 Mounting structure 2 Electronic component 3 Bump 4 Wiring board 5 Core board 6 Wiring layer 7 Base body 8 Through-hole conductor 9 Insulator 10 Resin 11 Inorganic insulating particle 12 Glass fiber 13 Base material 14 Fiber layer 15 Resin layer 16 Insulating layer 17 Conductivity Layer 18 Via conductor T Through hole V Via hole C Recess

Claims (10)

Preparing a substrate having a fiber layer including a first resin and a glass fiber coated with the first resin;
Forming a through hole in the substrate by spraying fine particles toward the substrate using a sandblast method;
And a step of forming a through-hole conductor in the through-hole. The wiring board according to claim 1,
The step of forming a through hole in the substrate includes
A method of manufacturing a wiring board, wherein through holes are formed in the substrate by spraying the fine particles, which are crushed particles, toward the substrate. The wiring board according to claim 2,
The step of forming a through hole in the substrate includes
A method for producing a wiring board, comprising forming through holes in the substrate by spraying the fine particles having a hardness higher than that of glass toward the substrate. The wiring board according to claim 3,
The step of forming a through hole in the substrate includes
A method of manufacturing a wiring board, comprising forming a through hole in the substrate by spraying the fine particles made of alumina, silicon carbide, or zirconia toward the substrate. In the manufacturing method of the wiring board of Claim 1,
The step of preparing the substrate includes
A method of manufacturing a wiring board, comprising: preparing a base including a second resin and inorganic insulating particles coated with the second resin, and further having a resin layer disposed on the fiber layer. In the manufacturing method of the wiring board of Claim 5,
The step of preparing the substrate includes
A method for manufacturing a wiring board, comprising: preparing the base further having the resin layer containing the inorganic insulating particles made of silicon oxide. The wiring board according to claim 6,
The step of preparing the substrate includes
A method of manufacturing a wiring board, comprising preparing the base body having the resin layer containing the inorganic insulating particles in an amount of 40% by volume to 75% by volume. The wiring board according to claim 1,
Forming the through-hole conductor in the through-hole,
A method of manufacturing a wiring board, comprising forming the through-hole conductor in the through-hole without performing a desmearing process after the step of forming the through-hole in the base. The wiring board according to claim 8,
Forming the through-hole conductor in the through-hole,
A method of manufacturing a wiring board, wherein the through-hole conductor is formed in the through-hole using a plating method.   A method for manufacturing a mounting structure comprising a step of electrically connecting an electronic component to a wiring board manufactured by the manufacturing method according to claim 1.