JP2013088699A - Mask manufacturing system and mask manufacturing method for screen printing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a screen mask manufacturing system which can prevent printing position deviation caused by dimensional error between the screen mask and a substrate, even for the substrate having variation in dimensional accuracy, and to provide a manufacturing method thereof.SOLUTION: The substrate is imaged by a substrate imaging device M1 to generate image information on an electrode pattern formed on the substrate. On the basis of the image information, an image data processing device M2 generates measured position data indicating the measured position of the electrode pattern on the substrate. Then, on the basis of the measured position data, a laser machining device M3 forms pattern holes corresponding to the electrode pattern to a plate member constituting a screen mask. Consequently, the printing position deviation caused by dimensional error between the screen mask and a substrate can be prevented even for the substrate having variation in dimensional accuracy.

Description

  The present invention relates to a mask manufacturing system and a mask manufacturing method for screen printing for manufacturing a screen mask used in screen printing for printing a paste on a substrate.

  In a board mounting line for producing a mounting board on which electronic components are mounted, screen printing for printing a component bonding paste on the board is executed prior to a component mounting process for mounting the parts on the board. In this screen printing process, the substrate is brought into contact with a screen mask (for example, see Patent Document 1) in which pattern holes are formed corresponding to the connection electrodes of the substrate, and a squeezing operation is performed on the screen mask supplied with the paste. By doing so, a paste is printed on the connection electrode through the pattern hole. Conventionally, including the above-mentioned patent document, the screen mask is manufactured based on design data indicating the arrangement and shape of the connection electrode on the substrate, so-called Gerber data, and the position of the pattern hole is the position of the connection electrode in the design data. It was processed corresponding to.

JP 2007-152613 A

  By the way, with the demand for productivity improvement in the electronic equipment industry, it is required to reduce the manufacturing cost of the board, and the low-priced type whose accuracy characteristics are inferior to the conventional quality is used. . For this reason, even if it is the same kind, even if it is a product of the same manufacturer, even if it is a product of the same manufacturer, a big variation will arise in dimensional accuracy by the difference in a manufacturing lot.

  When screen printing is performed using a screen mask manufactured by the above-described conventional technology for a substrate having such dimensional accuracy variations, pattern holes and connection electrodes are caused by a dimensional error between the screen mask and the substrate. Are not coincident with each other, and the printing position is shifted from the position where the paste should be printed. When the electronic component is mounted in a printing position misaligned state and sent to the next reflow process, normal component bonding quality is not ensured and a mounting failure occurs. This tendency is particularly noticeable in the case of a fine pitch substrate on which fine components are to be mounted. As described above, in the conventional technology, there is a problem that a printing position shift occurs due to a dimensional error between the screen mask and the substrate in the screen printing for the substrate having variation in dimensional accuracy.

  Accordingly, the present invention provides a mask manufacturing system and a mask for manufacturing a screen printing mask capable of preventing a printing position shift caused by a dimensional error between the screen mask and the substrate in screen printing for a substrate having variations in dimensional accuracy. An object is to provide a manufacturing method.

  A mask manufacturing system for screen printing according to the present invention is a mask manufacturing system for screen printing for manufacturing a screen mask used in screen printing for printing a paste on a substrate, and is formed on the substrate by imaging the substrate. Imaging means for acquiring image information of an electrode pattern, measured position data creating means for creating measured position data indicating the measured position of the electrode pattern on the substrate based on the image information, and the measured position data based on the measured position data Pattern hole forming means for forming a pattern hole corresponding to the electrode pattern in the plate member constituting the screen mask is provided.

  A mask manufacturing method for screen printing according to the present invention is a mask manufacturing method for screen printing for manufacturing a screen mask used in screen printing for printing a paste on a substrate, wherein the substrate is imaged and formed on the substrate. An imaging process for acquiring image information of an electrode pattern, an actual position data creation process for creating actual position data indicating an actual position of the electrode pattern on the substrate based on the image information, and the actual position data based on the actual position data A pattern hole forming step of forming a pattern hole corresponding to the electrode pattern in the plate member constituting the screen mask.

  According to the present invention, the actual position data indicating the actual position of the electrode pattern on the substrate is created based on the image information of the electrode pattern formed on the substrate by imaging the substrate, and the screen mask is configured based on the actual position data. By forming a pattern hole corresponding to the electrode pattern in the plate member, even when a substrate having a variation in dimensional accuracy is targeted, a printing position shift caused by a dimensional error between the screen mask and the substrate is prevented. be able to.

The block diagram which shows the structure of the mask manufacturing system for screen printing of one embodiment of this invention The side view of the screen printing apparatus of one embodiment of this invention The top view of the screen printing apparatus of one embodiment of this invention The block diagram which shows the structure of the image data processing apparatus in the mask manufacturing system for screen printing of one embodiment of this invention Explanatory drawing of measurement position data creation in the mask manufacturing system for screen printing of one embodiment of this invention Configuration and function explanatory diagram of a laser beam machine used in a mask manufacturing system for screen printing according to an embodiment of the present invention The block diagram which shows the structure of the control system of the laser processing machine used for the mask manufacturing system for screen printing of one embodiment of this invention Structure explanatory drawing of the component mounting apparatus and inspection apparatus which are used for the mask manufacturing system for screen printing of one embodiment of this invention The flowchart which shows the mask manufacturing method for screen printing of one embodiment of this invention

  First, with reference to FIG. 1, the structure of the mask manufacturing system 1 for screen printing is demonstrated. The mask manufacturing system 1 for screen printing has a function of manufacturing a screen mask used for screen printing in which a component bonding paste is printed on a substrate in a component mounting line for manufacturing a mounting substrate by mounting electronic components on the substrate. It is what you have. In FIG. 1, a mask manufacturing system 1 for screen printing has a substrate imaging device M1, an image data processing device M2, and a laser processing device M3. These devices are interconnected by a LAN system 2, and further a LAN system. 2 is provided with a management computer 3 serving as a host system connected to 2.

  The board imaging device M1 is an imaging unit that takes an image of a board to be screen-printed and acquires image information of an electrode pattern for component bonding formed on the board. As the board imaging device M1, various devices can be used as long as they can capture the board with a predetermined resolution and output image data in addition to the board imaging camera provided in each device constituting the component mounting line. Can be used as appropriate.

  The image data processing device M2 is measured position data creating means for creating measured position data indicating the measured position of the electrode pattern on the substrate based on the image information acquired by the substrate imaging device M1 and transmitted via the LAN system 2. is there. As the image data processing device M2, a personal computer having a predetermined image processing function and capable of various operations via a display screen can be used.

  The laser processing device M3 has a function of cutting the plate member with laser light, and forms a screen mask based on the measured position data created by the image data processing device M2 and transmitted via the LAN system 2. Pattern hole forming means for forming a pattern hole corresponding to the electrode pattern to be printed on the plate member.

  In the present embodiment, the board imaging device M1, the image data processing device M2, and the laser processing device M3 are connected by the LAN system 2 and further have a management computer 3, and this is a hierarchical line configuration. Is not necessarily required. That is, the substrate imaging device M1, the image data processing device M2, and the laser processing device M3 are made independent of each other to transmit image information from the substrate imaging device M1 to the image data processing device M2, and from the image data processing device M2 to the laser processing device M3. The mounting position data may be transmitted via a storage medium such as a USB memory or an SD card.

  Next, the configuration of the screen printing apparatus 4 in which the screen mask manufactured by the mask manufacturing system 1 for screen printing is used and the screen mask will be described with reference to FIGS. In FIG. 2, the screen printing apparatus 4 is configured by disposing a screen printing mechanism above the substrate positioning portion 5. The substrate positioning unit 5 is configured by combining a first Z-axis table 7 and a second Z-axis table 8 on a horizontal movement table 6 movable in the XYΘ directions. By driving the horizontal movement table 6, the substrate positioning unit 5 moves in the X direction, the Y direction, and the Θ direction.

  By driving the first Z-axis table 7, the horizontal base plate 7 a on which the vertical frame 9 is erected moves up and down, whereby the substrate transport mechanism 10 held at the upper end of the vertical frame 9 moves up and down. The substrate transport mechanism 10 is arranged in parallel to the substrate transport direction (X direction--the direction perpendicular to the paper surface in FIG. 2), and both ends of the substrate 11 to be printed by the substrate transport conveyors provided in these substrate transport mechanisms 10. The part is supported and transported. That is, by driving the first Z-axis table 7, the substrate 11 held by the substrate transport mechanism 10 can be lifted and lowered with respect to the screen printing mechanism described below together with the substrate transport mechanism 10.

  By driving the second Z-axis table 8, the base plate 8a provided with the substrate receiving portion 8b on the upper surface is moved up and down. As a result, the substrate receiving portion 8 b comes into contact with the lower surface of the substrate 11 and lifts the substrate 11 from the substrate transport mechanism 10. In this state, the substrate 11 is clamped in the horizontal direction by sandwiching the substrate 11 from both sides by the clamp mechanism 12 provided in the substrate transport mechanism 10.

  Next, the screen printing mechanism disposed above the substrate positioning unit 5 will be described. 2 and 3, a screen mask 13 is extended on a mask frame 13b held by a mask holder (not shown). As shown in FIG. 3A, the screen mask 13 is provided with a pattern hole 13a corresponding to the shape and position of the electrode pattern 11a to be printed on the substrate 11 (see FIG. 3B). Yes. A squeegee unit 14 that reciprocates in the Y direction by a squeegee moving mechanism 15 is disposed above the screen mask 13. The squeegee unit 14 includes two elevating mechanisms 14a that elevate and lower a pair of squeegees 16 arranged opposite to each other. By driving the elevating mechanism 14a, the squeegee 16 descends and contacts the upper surface of the screen mask 13. . Then, by driving the squeegee moving mechanism 15 in this state, a squeegeeing operation in which the lower end portion of the squeegee 16 slides on the upper surface of the screen mask 13 is performed.

  Next, the printing operation by the screen printing mechanism will be described with reference to FIG. First, when the substrate 11 is carried into the printing position by the substrate transport mechanism 10, the second Z-axis table 8 is driven to raise the substrate receiving portion 8 b and receive the lower surface of the substrate 11. In this state, the horizontal movement table 6 is driven to align the substrate 11 with the screen mask 13 in the horizontal direction. Thereafter, the first Z-axis table 7 is driven to raise the substrate 11 together with the substrate transport mechanism 10 so as to contact the lower surface of the screen mask 13 provided with the pattern holes 13 a, and then the substrate 11 is moved by the clamp mechanism 12. Clamp. Thereby, in the squeegeeing operation in which the squeegee moving mechanism 15 moves the squeegee unit 14, the horizontal position of the substrate 11 is fixed.

  In this state, one of the two squeegees 16 is lowered and brought into contact with the screen mask 13 in accordance with the squeezing direction in the squeezing operation. Next, by sliding the squeegee 16 in the squeezing direction (Y direction) on the screen mask 13 to which the paste is supplied, the paste is printed on the substrate 11 through the pattern holes 13a.

  As shown in FIGS. 2 and 3, the screen printing apparatus 4 includes a substrate recognition camera 17 a for imaging the substrate 11 from above and a mask recognition camera 17 b for imaging the screen mask 13 from the lower surface side. A camera head unit 17 is mounted. The camera head unit 17 is moved in the horizontal direction by the camera moving mechanism 18 including the head X-axis table 18X and the head Y-axis table 18Y, whereby the camera head unit 17 is moved in the space between the screen mask 13 and the substrate 11. The screen mask 13 and the substrate 11 are imaged by advancing / retracting to an arbitrary position. Image signals from the substrate recognition camera 17a and the mask recognition camera 17b are sent to the image processing unit 19, where image processing according to the imaging purpose is executed.

  The board recognition camera 17a acquires an image for board recognition for recognizing the position of the board 11 carried into the board positioning unit 5 of the screen printing apparatus 4, and also prints the printed board 11 that has been printed by the screen printing apparatus 4. It is used to acquire an image for print inspection for inspecting the printing state. That is, the substrate recognition camera 17a is provided in the screen printing apparatus 4 and is a recognition camera for recognizing the substrate 11 by an image, and also as an inspection camera that images the printed substrate 11 and inspects the printing state. It also has the function of

  Furthermore, in the example shown in the present embodiment, the function of the camera head unit 17, the camera moving mechanism 18, and the image processing unit 19 provided in the screen printing apparatus 4 is used to capture an image of the substrate 11 to be screen printed. Image information of the electrode pattern 11a for component bonding formed on the substrate 11 is acquired. That is, here, the camera head unit 17, the camera moving mechanism 18, and the image processing unit 19 constitute a substrate imaging device M 1 in the mask manufacturing system 1 for screen printing.

  Next, the configuration and functions of the image data processing device M2 will be described with reference to FIGS. In FIG. 4, the communication unit 21 is connected to the LAN system 2, and exchanges data and signals between the image data processing device M <b> 2 and other devices and the management computer 3. The arithmetic processing control unit 20 controls arithmetic processing by each unit described below. The image data storage unit 22 stores image information transmitted from the substrate imaging device M1, that is, image information of the electrode pattern 11a formed on the substrate 11, and measured position data generated by the image data processing device M2. Is saved.

  The electrode pattern detection unit 23 performs a process of detecting the electrode pattern 11 a based on the image information of the substrate 11 stored in the image data storage unit 22. That is, a part corresponding to the electrode pattern 11a is extracted from image information obtained by imaging the substrate 11 shown in FIG. FIG. 5B shows an example in which the (i) th electrode pattern 11a (i) is extracted from the plurality of electrode patterns 11a. Here, the edges E1 to E4 indicating the contour of the electrode pattern 11a (i) are detected by the image recognition process.

  The pattern position measurement unit 24 performs a process of measuring the position of the detected electrode pattern 11a in the optical coordinate system and specifying it with numerical data. That is, in the example shown in FIG. 5B, the position coordinates (x1, y1) to (x4, y4) that specify the vertices P1 to P4 of the edges E1 to E4 are obtained. The pattern data editing unit 25 compares the position measurement data for all the electrode patterns 11a obtained by position measurement with the arrangement positions on the actual substrate 11 to obtain pattern data for one substrate 11 as a target. To edit. The edited pattern data is stored in the image data storage unit 22 as measured position data for the substrate 11. The input / output unit 26 is an interface, and is used for inputting instructions for operating the image data processing device M2 and for exchanging information via a storage medium without exchanging information via the LAN system 2. Output.

  Next, the configuration and function of the laser processing apparatus M3 will be described with reference to FIGS. In FIG. 6A, an inverted L-shaped frame portion 31 having a built-in laser oscillator 32 is erected in the base portion 30, and a processing provided with a laser irradiation portion 34 at the distal end portion of the frame portion 31. A head 33 is attached. Below the processing head 33, a table drive mechanism 36 including an X-axis table 36X and a Y-axis table 36Y is disposed. A workpiece holding unit 37 provided on the upper surface of the Y-axis table 36Y has a processing target. A certain plate member 13 * is held.

  The plate member 13 * is a thin metal plate made of stainless steel or the like, which is the material of the screen mask 13, and operates the laser oscillator 32 to emit laser light L from the laser irradiation unit 34 as shown in FIG. 6B. By irradiating the plate member 13 * held by the holding portion 37, the irradiated portion of the laser beam L on the plate member 13 * is melted and removed. Then, by horizontally moving the table driving mechanism 36 based on the actually measured pattern data transmitted from the image data processing device M2, a pattern hole 13a corresponding to the electrode pattern 11a is formed in the plate member 13 *. The processing head 33 is equipped with a recognition camera 35 with the imaging direction facing downward, and can pick up an arbitrary position of the imaging target held by the work holding unit 37 by the recognition camera 35.

  In FIG. 7, the communication unit 41 is connected to the LAN system 2, and exchanges data and signals between the laser processing apparatus M <b> 3 and other apparatuses and the management computer 3. The processing control unit 40 controls operation / calculation processing by each unit described below, such as the laser oscillator 32 and the processing head 33. In the processing data storage unit 42, the measured position data transmitted from the image data processing device M2, that is, the information indicating the measured position of the electrode pattern 11a on the substrate 11, and the pattern hole 13a by laser cutting processing based on this measured data. Processing information such as a cutting offset amount and a margin amount at the time of forming is stored. The mechanism driving unit 43 is controlled by the processing control unit 40 to drive the table driving mechanism 36 that horizontally moves the plate member 13 *. The recognition processing unit 44 performs recognition processing on the image data acquired by the recognition camera 35. The input / output unit 45 is an interface, and inputs / outputs information when an instruction is input to operate the laser processing apparatus M3 and information is exchanged via a storage medium without exchanging information via the LAN system 2. I do.

  In the above-described example, the substrate recognition camera 17a provided in the screen printing apparatus 4 is used as the board imaging apparatus M1. However, as the function of the board imaging apparatus M1, there are various other components constituting the component mounting line. Various cameras equipped in the apparatus can be used. For example, a camera provided in the component mounting apparatus M4 and the board inspection apparatus M5 shown in FIG. 8 can be used.

  Hereinafter, schematic configurations of the component mounting apparatus M4 and the board inspection apparatus M5 will be described. In FIG. 8, two rows of substrate transport mechanisms 52 are arranged in the X direction at the center of the upper surface of the base 51. The board transport mechanism 52 receives the printed board 11 carried out from the upstream apparatus, and positions and holds the printed board 11 at the respective work positions by the component mounting apparatus M4 and the board inspection apparatus M5. A carriage 53 having a plurality of tape feeders 54 mounted thereon is set on the component mounting apparatus M4 side of the base 51. The tape feeder 54 pulls out the carrier tape T wound around the supply reel 55, and Supplied to the component mounting mechanism described in (1). A carriage 61 incorporating an inspection processing unit 62 is set on the substrate inspection apparatus M5 side of the base 51.

  A Y-axis moving table 56 is disposed in the Y direction at the downstream end in the X direction on the upper surface of the base 51. Two X-axis movement tables 57 are coupled to the Y-axis movement table 56 so as to be movable in the Y direction. Mounted on the X-axis moving table 57 on the component mounting apparatus M4 side are a mounting head 58 and a board recognition camera 59 in a posture in which the imaging direction is downward. The mounting head 58 has a configuration in which a plurality of suction nozzles 58a are detachably attached to the lower portion, and electronic components that are moved by the Y-axis moving table 56 and the X-axis moving table 57 and taken out from the tape feeder 54 are transported to the substrate. The substrate is transported and mounted on the substrate 11 which is transported and positioned by the mechanism 52. The substrate recognition camera 59 moves integrally with the mounting head 58 and moves upward above the substrate 11 positioned and held by the substrate transport mechanism 52, thereby imaging the substrate 11 and recognizing its position.

  An inspection head 60 is mounted on the X-axis moving table 57 on the substrate inspection apparatus M5 side, and an inspection camera is built in the inspection head 60 with the imaging direction facing downward. A Y-axis moving table 56 and an X-axis moving table 57 are disposed above the substrate 11 before mounting in a state where it is carried into the substrate transport mechanism 52 after printing, or above the substrate 11 after the component mounting operation is executed by the component mounting apparatus M4. Therefore, by moving the inspection head 60, the substrate 11 can be imaged by the inspection camera. The acquired image of the substrate 11 is subjected to recognition processing by the inspection processing unit 62, whereby a printing state inspection on the substrate 11 and an appearance inspection on the substrate 11 after mounting the components are performed.

  That is, when the component mounting line has an imaging function such as the component mounting apparatus M4 and the board inspection apparatus M5, the component mounting apparatus M4 and the board inspection apparatus M5 are equipped as the board imaging apparatus M1 in FIG. A camera can be used. In the example shown in FIG. 8, a board recognition camera 59 that is provided in a component mounting apparatus M4 that mounts electronic components on the board 11 and has a function of recognizing the board 11 can be used as an imaging unit. Further, an inspection camera that is provided in the substrate inspection apparatus M5 for inspecting the substrate 11 and that images and inspects the substrate 11 after printing or mounting can be used as an imaging unit.

  The example shown in FIG. 8 shows an example in which the component mounting apparatus M4 and the board inspection apparatus M5 are arranged on the same base 51, but the component mounting apparatus M4 and the board inspection apparatus M5 configured as a single apparatus. It may be. Further, when the laser processing apparatus M3 is equipped with a recognition camera 35 for recognizing a workpiece, the recognition camera 35 may be used as an imaging unit. In this case, the substrate 11 is imaged by the recognition camera 35 while the substrate 11 held by the work holding unit 37 is moved horizontally.

  Next, a screen mask manufacturing process flow for manufacturing the screen mask 13 used in screen printing for printing a paste on the substrate 11 by laser processing will be described with reference to FIG.

  First, the substrate 11 to be printed is imaged to acquire image information of the electrode pattern 11a formed on the substrate 11 (ST1) (imaging process). For this imaging, any one of the substrate recognition camera 17a, the recognition camera 35, the substrate recognition camera 59, and the inspection head 60 provided in the screen printing device 4, the laser processing device M3, the component mounting device M4, and the substrate inspection device M5, respectively. Although used, a dedicated imaging device as a single device may be used. Next, the acquired image information is transmitted to the image data processing device M2 (ST2). The transmission of the image information is performed via the LAN system 2 or by an input / output operation via a storage medium.

  Based on the transmitted image information, the image data processing device M2 creates actual position data indicating the actual position of the electrode pattern 11a on the substrate 11 (ST3) (actual position data creation step). Next, the created actually measured position data is transmitted to the laser processing apparatus M3 (ST4). The transmission of the actually measured position data is performed via the LAN system 2 or input / output operation via a storage medium.

  Thereafter, a pattern hole 13a corresponding to the electrode pattern 11a is formed in the plate member 13 *, which is a material constituting the screen mask 13, based on the measured position data by the laser processing apparatus M3 (ST5) (pattern hole forming step). . At this time, the machining information stored in advance in the machining data storage unit 42 is referred to, and the plate member 13 * is operated by operating the laser machining apparatus M3 with NC machining data in which the cutting offset amount and the margin amount are added to the measured position data. Cutting. Accordingly, a pattern hole 13a having a desired size can be formed in the plate member 13 * corresponding to the position of the electrode pattern 11a on the substrate 11.

  As described above, in the mask manufacturing for screen printing shown in the present embodiment, the substrate 11 was imaged and formed on the substrate instead of the conventionally used pattern hole cutting processing based on Gerber data. Based on the image information of the electrode pattern 11a, actual position data indicating the actual position of the electrode pattern 11a on the substrate 11 is created. Based on the actual position data, the plate member 13 * constituting the screen mask 13 corresponds to the electrode pattern 11a. The pattern hole 13a is formed. Accordingly, even when the substrate 11 having a variation in dimensional accuracy is used as a printing target using an inexpensive material, it is possible to prevent a printing position shift caused by a dimensional error between the screen mask 13 and the substrate 11. it can.

  The mask manufacturing system and mask manufacturing method for screen printing according to the present invention prevent a printing position shift caused by a dimensional error between the screen mask and the substrate even when the substrate having variations in dimensional accuracy is targeted. This is useful in the field of mounting components in which electronic components are mounted on a substrate.

DESCRIPTION OF SYMBOLS 1 Mask manufacturing system for screen printing 4 Screen printing apparatus 11 Board | substrate 11a Electrode pattern 13 Screen mask 13a Pattern hole 13 * Plate member 17 Camera head unit 17a Board | substrate recognition camera M4 Component mounting apparatus M5 Board | substrate inspection apparatus 59 Board | substrate recognition camera 60 Inspection head

Claims (7)

A mask manufacturing system for screen printing for manufacturing a screen mask used in screen printing for printing a paste on a substrate,
Imaging means for capturing image information of an electrode pattern formed on the substrate by imaging the substrate;
Based on the image information, measured position data creating means for creating measured position data indicating the measured position of the electrode pattern on the substrate;
A mask manufacturing system for screen printing, comprising: pattern hole forming means for forming a pattern hole corresponding to the electrode pattern in a plate member constituting the screen mask based on the measured position data. The imaging means is a recognition camera for recognizing the substrate provided in a screen printing apparatus for printing a paste on the substrate,
2. The mask manufacturing system for screen printing according to claim 1, wherein the pattern hole forming means is a laser processing apparatus that cuts the plate member with laser light. The imaging means is an inspection camera for imaging and inspecting the printed substrate provided in a screen printing apparatus for printing a paste on the substrate,
2. The mask manufacturing system for screen printing according to claim 1, wherein the pattern hole forming means is a laser processing apparatus that cuts the plate member with laser light. The imaging means is a recognition camera for recognizing the board provided in a component mounting apparatus for mounting an electronic component on the board,
2. The mask manufacturing system for screen printing according to claim 1, wherein the pattern hole forming means is a laser processing apparatus that cuts the plate member with laser light. The imaging means is an inspection camera that is provided in an inspection apparatus for inspecting a substrate to inspect and inspect the substrate after printing or mounting,
2. The mask manufacturing system for screen printing according to claim 1, wherein the pattern hole forming means is a laser processing apparatus that cuts the plate member with laser light. The pattern hole forming means is a laser processing apparatus that cuts the plate member with laser light,
2. The screen printing mask manufacturing system according to claim 1, wherein the imaging means is a recognition camera provided in the laser processing apparatus. A mask manufacturing method for screen printing for manufacturing a screen mask used in screen printing for printing a paste on a substrate,
An imaging step of capturing image information of an electrode pattern formed on the substrate by imaging the substrate;
Based on the image information, an actual position data creation step for creating actual position data indicating the actual position of the electrode pattern on the substrate;
And a pattern hole forming step of forming a pattern hole corresponding to the electrode pattern in a plate member constituting the screen mask based on the measured position data.

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