JP2012209620A - Oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an oscillator capable of preventing conduction failure caused by the difference in thermal expansion coefficient between a pin terminal mounted on a case and a circuit board, and improving heat-cycle resistance property.SOLUTION: In an oscillator, a through-hole (main through-hole) for a pin terminal 2 is formed in a substrate 1 made of glass epoxy resin, a through-hole (a first auxiliary through-hole) allowing an electric wire material 5 to pass therethrough is formed in the vicinity of the main through-hole, one end of the electric wire material 5 is wound around the pin terminal 2 protruding to the surface of the substrate 1, the other end of the electric wire material 5 is connected to pattern wiring 3 formed on the rear face of the substrate 1 after passing through the first auxiliary through-hole, and the main through-hole portion and the first auxiliary through-hole portion are fixed by solder 4.

Description

  The present invention relates to an oscillator in which an electronic component is mounted on a circuit board made of glass epoxy resin. In particular, the connection between a pin terminal attached to a case and the board suppresses the occurrence of conduction failure and improves heat cycle resistance. Related to the oscillator.

[Conventional oscillator: Fig. 5]
Conventionally, some oscillators use glass epoxy resin as a circuit board.
A conventional oscillator will be described with reference to FIG. FIG. 5 is a schematic diagram of a conventional oscillator.
As shown in FIG. 5, the conventional oscillator includes a glass epoxy resin made up of a circuit board (substrate) 1, a case 6, and a plurality of pin terminals 2.

The pin terminal 2 is made of, for example, Kovar.
Four pin terminals 2 are attached to the case 6. Therefore, the case 6 may be referred to as a “base with terminal”.
A through hole is formed in the substrate 1 at a position corresponding to the pin terminal 2, the pin terminal 2 penetrates the through hole, the through hole portion is fixed with the solder 4, and the case 6 and the substrate 1 are connected. .
An electronic component such as a crystal oscillator is mounted on the substrate 1.

[Conventional Pin Terminal and Board Connection: FIG. 6]
Next, a connection portion between the conventional pin terminal 2 and the substrate 1 will be described with reference to FIG. FIG. 6 is a cross-sectional explanatory view of a connection portion between a conventional pin terminal and a substrate.
As shown in FIG. 6, pattern wiring 3 is formed around the through hole of the substrate 1. Specifically, the pattern wiring 3 is formed on the front surface and the back surface of the substrate 1 around the side wall of the through hole and around the through hole.
And the pin terminal 2 and the board | substrate 1 are fixed with the solder 4 from the upper surface (surface of the board | substrate 1) of a through-hole, and are electrically connected.

[Related technologies]
In addition, as related prior art, Japanese Patent Laid-Open No. 2005-167772 “Piezoelectric Oscillator” (Seiko Epson Corporation) [Patent Document 1], Japanese Utility Model Laid-Open No. 02-028099 “Crystal Oscillator” (Mitsubishi Electric Corporation) [Patent Reference 2].

  Patent Document 1 discloses that in a piezoelectric oscillator, a piezoelectric vibrating piece and an electronic component (IC chip) are connected by wire bonding in order to reduce stray capacitance generated in a conductive pattern formed inside the package. Yes.

  In Patent Document 2, in a crystal oscillator, a printed circuit board hole is formed in an oscillator printed circuit board, a connection pin attached to a vibrator case is inserted into the printed circuit board hole, and connected to a connection pin protruding on the back surface of the oscillator printed circuit board It is shown that an elastic body is filled so as to wrap the connection wire by attaching a wire and making electrical connection with the back surface of the substrate.

Japanese Patent Laid-Open No. 2005-167772 Japanese Utility Model Publication No. 02-028094

  However, in the conventional oscillator described above, due to the difference in coefficient of thermal expansion between the pin terminal such as Kovar and the circuit board such as glass epoxy resin, the distortion is concentrated on the mounting solder in the usage environment where the heat cycle occurs, and the solder is cracked. There was a problem.

In general, it has been found that these cracks are generated due to the difference in coefficient of thermal expansion of the members used.
Specifically, when the glass epoxy resin substrate is CEM-3, the linear expansion coefficient is about 65 ppm / ° C in the thickness direction, and when the substrate is FR-4, the linear expansion coefficient is about 60 ppm / ° C in the thickness direction. In the case of Kovar used for pin terminals, the coefficient of linear expansion is about 5 ppm / ° C., so there is a difference of 10 times or more in the coefficient of linear expansion. Cracks were generated in the solder between the board and the board, leading to poor conduction.

  In particular, in the Oven Controlled Crystal Oscillator (OCXO), the temperature change from the ambient temperature to the thermostatic chamber control temperature (for example, 85 ° C) is turned on / off in an environment where the power is repeatedly turned on and off. Since it is added every time, a crack occurs in the solder, and there is a problem in long-term reliability.

  In Patent Documents 1 and 2, there is no ingenuity in the method of wire bonding to the substrate, and no consideration is given to improving the heat cycle resistance against thermal expansion.

  The present invention has been made in view of the above circumstances, and can prevent a conduction failure caused by a difference in thermal expansion coefficient between a pin terminal attached to a case and a circuit board, and can improve heat cycle resistance. The purpose is to provide.

  The present invention for solving the problems of the conventional example has a substrate on which a plurality of through holes are formed, on which an electronic component is mounted, and a case on which a plurality of pin terminals are attached. An oscillator for inserting a terminal and fixing a substrate to a case, wherein the substrate has a through hole as a main through hole, a first auxiliary through hole is formed in the vicinity of the main through hole, and the main through hole A common pattern wiring is formed around the first auxiliary through hole, one end of the wire material is connected to the pin terminal protruding on the substrate surface opposite to the case side, and the other end of the wire material is the first The main through-hole and the first auxiliary through-hole are fixed with solder through the auxiliary through-hole and connected to the pattern wiring formed on the case-side substrate surface.

  The present invention has a substrate on which electronic parts are mounted with a plurality of through holes and a case to which a plurality of pin terminals are attached, and the pin terminals are inserted into the through holes to fix the substrate to the case. In the oscillator, the substrate has a through hole as a main through hole, a first auxiliary through hole is formed in the vicinity of the main through hole, and around the main through hole and the first auxiliary through hole. A common pattern wiring is formed, one end of the electric wire material is connected to the pin terminal protruding on the case side substrate surface, and the other end of the electric wire material passes through the first auxiliary through hole to the opposite substrate surface to the case side. The main through hole and the first auxiliary through hole are connected to the formed pattern wiring and fixed by solder.

  The present invention has a substrate on which electronic parts are mounted with a plurality of through holes and a case to which a plurality of pin terminals are attached, and the pin terminals are inserted into the through holes to fix the substrate to the case. In the oscillator, the substrate has a through hole as a main through hole, a first auxiliary through hole is formed in the vicinity of the main through hole, and around the main through hole and the first auxiliary through hole. A common pattern wiring is formed, one end of the electric wire material is connected to the pin terminal protruding on the board surface opposite to the case side, and the other end of the electric wire material is connected to the case side substrate surface through the first auxiliary through hole. The main through hole and the first auxiliary through hole are connected to the protruding pin terminal, and are fixed by solder.

  The present invention has a substrate on which electronic parts are mounted with a plurality of through holes and a case to which a plurality of pin terminals are attached, and the pin terminals are inserted into the through holes to fix the substrate to the case. In the oscillator, the substrate has a through hole as a main through hole, a first auxiliary through hole and a second auxiliary through hole are formed in the vicinity of the main through hole, the main through hole, the first through hole, and the first through hole. A common pattern wiring is formed around the auxiliary through hole and the second auxiliary through hole, and one end of the wire material is connected to the pin terminal protruding on the board surface opposite to the case side. The end is led to the board surface on the case side through the first auxiliary through hole, and is connected to the pattern wiring formed on the substrate opposite to the case side through the second auxiliary through hole. The auxiliary through hole and the second auxiliary through hole are fixed with solder. And features.

  In the oscillator according to the present invention, one end of the electric wire material is wound around and connected to a pin terminal, and a connection portion between the one end of the electric wire material and the pin terminal is fixed with solder.

  According to the present invention, there is provided an oscillator in which a pin terminal is inserted into a through hole to fix a substrate to a case. The substrate has a through hole as a main through hole, and the first auxiliary through hole in the vicinity of the main through hole. Is formed, and a common pattern wiring is formed around the main through hole and the first auxiliary through hole, and one end of the wire material is connected to the pin terminal protruding on the substrate surface opposite to the case side, Since the other end of the electric wire material is connected to the pattern wiring formed on the board surface on the case side through the first auxiliary through hole, and the main through hole and the first auxiliary through hole are fixed by solder Even if a crack is generated in the solder formed in the pin terminal and the main through hole, the conduction between the pin terminal and the pattern wiring on the back surface of the substrate is maintained through the first auxiliary through hole. Can prevent poor conduction with the substrate, heat cycle resistance There is an effect that it is possible to improve the performance.

  According to the present invention, there is provided an oscillator in which a pin terminal is inserted into a through hole to fix a substrate to a case. The substrate has a through hole as a main through hole, and the first auxiliary through hole in the vicinity of the main through hole. Is formed, and a common pattern wiring is formed around the main through hole and the first auxiliary through hole, and one end of the electric wire material is connected to the pin terminal protruding on the case side substrate surface. Since the other end is connected to the pattern wiring formed on the substrate surface opposite to the case side through the first auxiliary through hole, and the main through hole and the first auxiliary through hole are fixed by solder, the oscillator is used. Even if a crack is generated in the solder formed in the pin terminal and the main through hole, the conduction between the pin terminal and the pattern wiring on the substrate surface is maintained through the first auxiliary through hole. Can prevent poor conduction with the substrate, heat cycle resistance There is an effect that it is possible to improve the performance.

  According to the present invention, there is provided an oscillator in which a pin terminal is inserted into a through hole to fix a substrate to a case. The substrate has a through hole as a main through hole, and the first auxiliary through hole in the vicinity of the main through hole. Is formed, and a common pattern wiring is formed around the main through hole and the first auxiliary through hole, and one end of the wire material is connected to the pin terminal protruding on the substrate surface opposite to the case side, Since the other end of the wire material is connected to a pin terminal protruding to the board surface on the case side through the first auxiliary through hole, and the main through hole and the first auxiliary through hole are fixed with solder, Even if a crack is generated in the solder formed in the pin terminal and the main through hole, the electric wire material is connected to the pin terminal and the pin terminal on the back surface of the substrate through the first auxiliary through hole. Since conduction is maintained between the pattern wiring in the auxiliary through hole, Prevents conduction failure between the emission terminal and the substrate, there is an effect that it is possible to improve the resistance to heat cycle performance.

  According to the present invention, there is provided an oscillator in which a pin terminal is inserted into a through hole to fix a substrate to a case. The substrate has a through hole as a main through hole, and the first auxiliary through hole in the vicinity of the main through hole. And a second auxiliary through hole are formed, and a common pattern wiring is formed around the main through hole, the first auxiliary through hole, and the second auxiliary through hole, opposite to the case side. One end of the electric wire material is connected to the pin terminal protruding on the board surface, the other end of the electric wire material is led to the board surface on the case side through the first auxiliary through hole, and the case side through the second auxiliary through hole. Is an oscillator in which the main through hole, the first auxiliary through hole, and the second auxiliary through hole are fixed by solder because they are connected to the pattern wiring formed on the opposite substrate, so that the pin terminal and the main through hole are connected to each other. Even if cracks occur in the formed solder, the pin terminal and the first auxiliary Conductivity between the pattern wiring on the substrate surface is maintained through the through hole and the second auxiliary through hole, so that poor conduction between the pin terminal and the substrate can be prevented and heat cycle resistance can be improved. There is an effect that can be done.

FIG. 3 is a cross-sectional explanatory view of a connection portion between a pin terminal of a first oscillator and a substrate. It is a cross-sectional explanatory view of the connection portion between the pin terminal of the second oscillator and the substrate. It is sectional explanatory drawing of the connection part of the pin terminal and board | substrate of a 3rd oscillator. It is sectional explanatory drawing of the connection part of the pin terminal and board | substrate of a 4th oscillator. It is the schematic of the conventional oscillator. It is sectional explanatory drawing of the connection part of the conventional pin terminal and a board | substrate.

Embodiments of the present invention will be described with reference to the drawings.
[Outline of the embodiment]
An oscillator according to an embodiment of the present invention includes a substrate on which a plurality of through holes are formed and an electronic component is mounted, and a case to which a plurality of pin terminals are attached. The pin terminals are inserted into the through holes. The substrate is fixed to the case, and the substrate has a through hole as a main through hole, an auxiliary through hole is formed in the vicinity of the main through hole, and the periphery of the main through hole and the auxiliary through hole. A common pattern wiring is formed, one end of the wire material is connected to the pin terminal, and the other end of the wire material is connected to the pattern wiring formed on the substrate around the auxiliary through hole through the first auxiliary through hole. Since the main through hole and the auxiliary through hole are fixed with solder, even if a crack occurs in the solder formed in the pin terminal and the main through hole, the board is passed through the pin terminal and the auxiliary through hole. Maintains continuity with the pattern wiring formed on Since the, prevents conduction failure between the pin terminals and the substrate, it is capable of improving the resistance to heat cycle performance.

The oscillator according to the embodiment of the present invention basically includes the configuration shown in FIG. 5 and includes a substrate, a case, and a plurality of pin terminals.
The substrate is made of glass epoxy resin, and the pin terminal is made of Kovar or the like.

[First oscillator: FIG. 1]
An oscillator (first oscillator) according to a first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a cross-sectional explanatory view of a connection portion between a pin terminal of a first oscillator and a substrate.
As shown in FIG. 1, the first oscillator has a glass epoxy resin on a circuit board (substrate) 1, a through hole (main through hole) for a pin terminal 2, and a through hole (a through hole that allows a wire material 5 to pass therethrough). A first auxiliary through-hole) is formed, and one end of the wire member 5 is wound around the pin terminal 2 protruding on the surface of the substrate 1 (the surface opposite to the case 6 side), and the other end of the wire member 5 Is connected to the pattern wiring 3 formed on the back surface of the substrate 1 through the first auxiliary through hole, and the main through hole portion and the first auxiliary through hole portion are fixed by the solder 4.

As a material of the glass epoxy resin of the substrate 1, CEM-3 (Composite Epoxy Material 3) or FR-4 (Flame Retardant Type 4) is used.
CEM-3 is a glass epoxy substrate and is based on a plate in which glass fibers and an epoxy resin are mixed.
FR-4 is a glass epoxy substrate, which is based on a plate made by impregnating a cloth knitted with glass fibers with an epoxy resin.

Further, the connection between the pin terminal 2 and the pattern wiring 3 by the electric wire material 5 has a margin using a wire longer than the actual distance.
Furthermore, the pin terminal 2 and the one end part of the electric wire material 5 are being fixed with the solder.

[Method for Manufacturing First Oscillator]
In the first oscillator, a main through hole and a first auxiliary through hole are formed in the substrate 1, and a pattern wiring 3 is formed around these through holes.
Then, the pin terminal 2 attached to the case 6 is passed through the main through hole, one end of the electric wire material 5 is wound around the pin terminal 2 protruding from the surface of the substrate 1, and the other end of the electric wire material 5 is connected to the first auxiliary The through hole is penetrated and connected to the pattern wiring 3 formed on the back surface of the substrate 1.
Next, the solder 4 is applied from the front surface and the back surface of the substrate 1, and the main through hole portion and the first auxiliary through hole portion are fixed by the solder 4. As a result, the pin terminal 2 is connected to the pattern wiring 3 at the main through hole portion, and the pin terminal 2 is connected to the pattern wiring 3 at the first auxiliary through hole portion via the electric wire material 5.
Furthermore, the pin terminal 2 and the one end part of the electric wire material 5 are fixed with solder.

[Effect of first oscillator]
In the first oscillator, even if a crack occurs in the solder 4 formed in the pin terminal 2 and the main through hole, the pin terminal 2 and the pattern wiring 3 on the back surface of the substrate 1 are passed through the first auxiliary through hole. Therefore, there is an effect that the conduction failure between the pin terminal 2 and the substrate 1 can be prevented, and the heat cycle resistance can be improved.

[Second oscillator: FIG. 2]
An oscillator (second oscillator) according to a second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a cross-sectional explanatory view of a connection portion between the pin terminal of the second oscillator and the substrate.
As shown in FIG. 2, the second oscillator has a through hole for the pin terminal 2 (main through hole) and a through hole (first auxiliary through hole) through which the wire material 5 passes in the vicinity of the substrate 1. Is formed, and one end of the electric wire material 5 is wound around the pin terminal 2 protruding on the back surface (surface on the case 6 side) of the substrate 1, and the other end of the electric wire material 5 passes through the first auxiliary through hole. The main through-hole portion and the first auxiliary through-hole portion are fixed with the solder 4 while being connected to the pattern wiring 3 formed on the surface.

[Method for Manufacturing Second Oscillator]
In the second oscillator, a main through hole and a first auxiliary through hole are formed in the substrate 1, and a pattern wiring 3 is formed around these through holes.
Then, the pin terminal 2 attached to the case 6 is passed through the main through hole, one end of the electric wire material 5 is wound around the pin terminal 2 protruding from the back surface of the substrate 1, and the other end of the electric wire material 5 is made the first auxiliary. The through hole is penetrated and connected to the pattern wiring 3 formed on the surface of the substrate 1.
Next, solder 4 is applied from the surface of the substrate 1, and the main through hole portion and the first auxiliary through hole portion are fixed by the solder 4. As a result, the pin terminal 2 is connected to the pattern wiring 3 at the main through hole portion, and the pin terminal 2 is connected to the pattern wiring 3 at the first auxiliary through hole portion via the electric wire material 5.
Furthermore, the pin terminal 2 and the one end part of the electric wire material 5 are fixed with solder.

[Effect of second oscillator]
In the second oscillator, even if a crack occurs in the solder 4 formed in the pin terminal 2 and the main through hole, the pin terminal 2 and the pattern wiring 3 on the surface of the substrate 1 are passed through the first auxiliary through hole. Therefore, there is an effect that the conduction failure between the pin terminal 2 and the substrate 1 can be prevented, and the heat cycle resistance can be improved.

[Third oscillator: FIG. 3]
An oscillator (third oscillator) according to a third embodiment of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional explanatory view of a connection portion between the pin terminal of the third oscillator and the substrate.
As shown in FIG. 3, the third oscillator has a through hole for the pin terminal 2 (main through hole) and a through hole (first auxiliary through hole) through which the electric wire material 5 passes in the vicinity thereof. Is formed, one end of the wire material 5 is wound around the pin terminal 2 protruding on the surface of the substrate 1 (the surface opposite to the case 6 side), and the other end of the wire material 5 is the first auxiliary through hole. The main through-hole portion and the first auxiliary through-hole portion are fixed with solder 4 by being wound around and connected to the pin terminal 2 protruding through the back surface of the substrate 1.

[Method for Manufacturing Third Oscillator]
In the third oscillator, a main through hole and a first auxiliary through hole are formed in the substrate 1, and a pattern wiring 3 is formed around these through holes.
Then, the pin terminal 2 attached to the case 6 is passed through the main through hole, one end of the electric wire material 5 is wound around the pin terminal 2 protruding from the surface of the substrate 1, and the other end of the electric wire material 5 is connected to the first auxiliary A pin terminal 2 that protrudes from the back surface of the substrate 1 through the through hole is wound and connected.

Next, solder 4 is applied from the surface of the substrate 1, and the main through hole portion and the first auxiliary through hole portion are fixed by the solder 4. As a result, the pin terminal 2 is connected to the pattern wiring 3 at the main through hole portion, and the pin terminal 2 is connected to the pattern wiring 3 at the first auxiliary through hole portion via the electric wire material 5.
Furthermore, the one end part and other end part of the pin terminal 2 and the electric wire material 5 are fixed with solder.

[Effect of third oscillator]
In the third oscillator, even if a crack occurs in the solder 4 formed on the pin terminal 2 and the main through hole, the pin terminal 2 and the pattern wiring 3 formed on the side wall of the first auxiliary through hole Therefore, there is an effect that the conduction failure between the pin terminal 2 and the substrate 1 can be prevented, and the heat cycle resistance can be improved.

[Fourth oscillator: FIG. 4]
An oscillator (fourth oscillator) according to a fourth embodiment of the invention will be described with reference to FIG. FIG. 4 is a cross-sectional explanatory view of the connection portion between the pin terminal of the fourth oscillator and the substrate.
As shown in FIG. 4, the fourth oscillator has a through-hole (main through-hole) for the pin terminal 2 and two through-holes (first auxiliary through-holes) through which the wire material 5 passes in the vicinity thereof. A hole and a second auxiliary through-hole) are formed, and one end of the wire member 5 is wound around the pin terminal 2 protruding on the surface of the substrate 1 (the surface opposite to the case 6 side). The other end is led to the back surface of the substrate 1 through the first auxiliary through hole, and connected to the pattern wiring 3 formed on the surface of the substrate 1 through the second auxiliary through hole. The auxiliary through-hole portion and the second auxiliary through-hole portion are fixed with solder 4.

[Method for Manufacturing Fourth Oscillator]
In the fourth oscillator, a main through hole, a first auxiliary through hole, and a second auxiliary through hole are formed in the substrate 1, and a pattern wiring 3 is formed around these through holes.
Then, the pin terminal 2 attached to the case 6 is passed through the main through hole, one end of the electric wire material 5 is wound around the pin terminal 2 protruding from the surface of the substrate 1, and the other end of the electric wire material 5 is connected to the first auxiliary The through hole is led to the back surface of the substrate 1, and the second auxiliary through hole is further penetrated to be connected to the pattern wiring 3 formed on the surface of the substrate 1.

Next, the solder 4 is applied from the surface of the substrate 1, and the main through hole portion, the first auxiliary through hole portion, and the second auxiliary through hole portion are fixed with the solder 4. Thereby, the pin terminal 2 is connected to the pattern wiring 3 at the main through-hole portion, and the pin terminal 2 is connected to the pattern wiring 3 at the first auxiliary through-hole portion and the second auxiliary through-hole portion via the electric wire material 5. Will be connected.
Furthermore, the pin terminal 2 and the one end part of the electric wire material 5 are fixed with solder.

[Effect of the fourth oscillator]
In the fourth oscillator, even if a crack occurs in the solder 4 formed in the pin terminal 2 and the main through-hole, the substrate 1 passes through the pin terminal 2, the first auxiliary through-hole, and the second auxiliary through-hole. Since conduction between the pattern wiring 3 on the back surface and the front surface is maintained, it is possible to prevent a conduction failure between the pin terminal 2 and the substrate 1 and to improve heat cycle resistance.

[Effect of the embodiment]
According to the first to fourth oscillators, even if cracks occur in the solder 4 formed on the pin terminal 2 and the main through hole, the pattern wiring 3 formed on the substrate 1 through the pin terminal 2 and the auxiliary through hole Therefore, there is an effect that the poor conduction between the pin terminal 2 and the substrate 1 can be prevented and the heat cycle resistance can be improved.

  Further, according to the second to fourth oscillators, since the solder 4 can be applied from the surface of the substrate 1, there is an effect that the manufacture can be facilitated.

  According to the fourth oscillator, since the electric wire material 5 is connected to be wound around the pattern wiring 3 using the two auxiliary through holes, the conduction failure between the pin terminal 2 and the substrate 1 is strongly strengthened. It is possible to prevent the heat cycle performance and improve the heat cycle resistance.

  The first to fourth oscillators are more effective when applied to OCXO.

  INDUSTRIAL APPLICABILITY The present invention is suitable for an oscillator that can prevent conduction failure caused by a difference in thermal expansion coefficient between a pin terminal attached to a case and a circuit board and can improve heat cycle resistance.

  1 ... Board, 2 ... Pin terminal, 3 ... Pattern wiring, 4 ... Solder, 5 ... Wire material, 6 ... Case

Claims (5)

A board having a plurality of through holes formed thereon, on which electronic components are mounted, and a case to which a plurality of pin terminals are attached, the pin terminals being inserted into the through holes to fix the board to the case. An oscillator,
The substrate has the through hole as a main through hole, a first auxiliary through hole is formed in the vicinity of the main through hole, and is common around the main through hole and the first auxiliary through hole. Pattern wiring is formed,
One end of the wire material is connected to the pin terminal protruding on the substrate surface opposite to the case side, and the other end of the wire material is formed on the case side substrate surface through the first auxiliary through hole. Connected to the pattern wiring,
The oscillator characterized in that the main through hole and the first auxiliary through hole are fixed with solder. A board having a plurality of through holes formed thereon, on which electronic components are mounted, and a case to which a plurality of pin terminals are attached, the pin terminals being inserted into the through holes to fix the board to the case. An oscillator,
The substrate has the through hole as a main through hole, a first auxiliary through hole is formed in the vicinity of the main through hole, and is common around the main through hole and the first auxiliary through hole. Pattern wiring is formed,
One end of the wire material is connected to the pin terminal protruding on the case-side substrate surface, and the other end of the wire material is formed on the substrate surface opposite to the case side through the first auxiliary through hole. Connected to the pattern wiring,
The oscillator characterized in that the main through hole and the first auxiliary through hole are fixed with solder. A board having a plurality of through holes formed thereon, on which electronic components are mounted, and a case to which a plurality of pin terminals are attached, the pin terminals being inserted into the through holes to fix the board to the case. An oscillator,
The substrate has the through hole as a main through hole, a first auxiliary through hole is formed in the vicinity of the main through hole, and is common around the main through hole and the first auxiliary through hole. Pattern wiring is formed,
One end of an electric wire material is connected to the pin terminal protruding on the substrate surface opposite to the case side, and the other end of the electric wire material protrudes on the case side substrate surface through the first auxiliary through hole. Connected to the pin terminal,
The oscillator characterized in that the main through hole and the first auxiliary through hole are fixed with solder. A board having a plurality of through holes formed thereon, on which electronic components are mounted, and a case to which a plurality of pin terminals are attached, the pin terminals being inserted into the through holes to fix the board to the case. An oscillator,
The substrate has the through hole as a main through hole, and a first auxiliary through hole and a second auxiliary through hole are formed in the vicinity of the main through hole, and the main through hole and the first through hole are formed. A common pattern wiring is formed around the auxiliary through hole and the second auxiliary through hole,
One end of a wire material is connected to the pin terminal protruding on the substrate surface opposite to the case side, and the other end of the wire material is led to the case side substrate surface through the first auxiliary through hole, Connected to the pattern wiring formed on the substrate opposite to the case side through the second auxiliary through-hole,
The oscillator, wherein the main through hole, the first auxiliary through hole, and the second auxiliary through hole are fixed with solder.   The one end of the electric wire material is wound around and connected to a pin terminal, and the connection portion between the one end of the electric wire material and the pin terminal is fixed by soldering. Oscillator.

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