JP2012138535A - Stacked electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a stacked electronic component capable of forming a shield so as to accurately cover a coil while reducing the size of an electronic component.SOLUTION: A stacked electronic component comprises: a stack including a stack of plurality of ceramic layers; coil-shaped internal conductors embedded in the stack; and metallic members that are embedded in the stack so as to surround the coil-shaped internal conductors and form a closed magnetic region therein.

Description

  The present invention relates to a multilayer electronic component in which a coiled conductor pattern is embedded. Such electronic components are used as a component of a module including an inductor, a transformer, a coil component, an LC component, or a feedthrough capacitor in a wide variety of electronic devices typified by industrial electronic devices and consumer electronic products. it can.

  As an electronic component provided with a coiled conductor pattern, for example, a chip type coil described in Patent Document 1 is known. The chip-type coil described in Patent Document 1 is a metal shield case placed so as to cover one of a pair of adjacent chip-type coils and to be electrically insulated from the chip-type coil. It has.

JP-A-6-163265

  However, in recent years, electronic components are required to be miniaturized as electronic devices are miniaturized. In the case of downsizing electronic components, in the chip type coil described in Patent Document 1, it is required to reduce the distance between the chip type coil and the shield case, but the chip type coil and the shield case are electrically insulated. As described above, it is difficult to place the shield case with high accuracy.

  The present invention has been made in view of such a conventional technique, and an object of the present invention is to provide a multilayer electronic component that can form a shield so as to cover a coil with high accuracy while miniaturizing the electronic component. And

  The multilayer electronic component according to one aspect of the present invention includes a multilayer body formed by laminating a plurality of ceramic layers, a coil-shaped inner conductor embedded in the multilayer body, and the multilayer body surrounding the coil-shaped inner conductor. And a metal member embedded in the body.

  In the multilayer electronic component based on the above aspect, instead of placing a shield case separately formed so as to cover one of the chip-type coils, a coil-shaped inner conductor is embedded in the multilayer body. The metal member which suppresses the leakage of the magnetic field generated from the inner conductor to the outside is embedded. As described above, since the metal members are integrated as the multilayer electronic component, the metal shield can be formed with high accuracy so as to cover the coiled inner conductor even if the multilayer electronic component is miniaturized.

1 is a perspective view showing a multilayer electronic component according to a first embodiment. It is a disassembled perspective view which shows the multilayer electronic component of embodiment shown in FIG. It is AA sectional drawing of the multilayer electronic component of embodiment shown in FIG. It is BB sectional drawing of the multilayer electronic component of embodiment shown in FIG. It is a disassembled perspective view which shows the multilayer electronic component of 2nd Embodiment. It is AA sectional drawing of the multilayer electronic component of embodiment shown in FIG. It is BB sectional drawing of the multilayer electronic component of embodiment shown in FIG.

  Hereinafter, a multilayer electronic component 1 (hereinafter also simply referred to as an electronic component 1) of the present embodiment will be described in detail with reference to the drawings. However, in the drawings referred to below, for the convenience of explanation, among the members constituting the following embodiments, only the main members necessary for explaining the characteristic configuration are shown in a simplified manner. Therefore, the electronic component 1 of the present embodiment can include any constituent member that is not shown in each drawing referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  As shown in FIGS. 1 to 4, the electronic component 1 of the present embodiment includes a laminated body 5 formed by laminating a plurality of ceramic layers 3, a coiled internal conductor 7 embedded in the laminated body 5, and a coiled shape. And a metal member 9 embedded in the laminated body 5 so as to surround the inner conductor 7.

  In the electronic component 1 of the present embodiment, a metal member 9 is embedded in a laminated body 5 in which a coiled inner conductor 7 is embedded. As described above, since the metal member 9 is integrated as the electronic component 1, even if the electronic component 1 is downsized, the metal shield can be formed so as to cover the coiled inner conductor 7 with high accuracy.

  The electronic component 1 of the present embodiment includes a laminate 5 formed by laminating a plurality of ceramic layers 3. As the ceramic layer 3, a member having high insulating properties can be used. Specifically, ceramic materials such as ferrite sintered bodies, forsterite sintered bodies, and glass ceramic materials can be used. Moreover, since the coil-shaped inner conductor 7 is embedded, it is preferable to use a member having high magnetism as the plurality of ceramic layers 3. Specifically, for example, it is preferable to contain a material made of ferrite or a magnetic material such as ferrite. Further, the plurality of insulator layers may be a combination of a nonmagnetic insulating material and a magnetic insulating material. The laminated body 5 can be formed by laminating such ceramic layers 3.

  In addition, although the outer peripheral shape at the time of each planar view of the some insulator layer in this embodiment becomes a rectangular shape, it is not restricted to this in particular. For example, the outer peripheral shape in plan view may be a polygonal shape such as a hexagonal shape or an octagonal shape, or a curved shape such as an elliptical shape or a circular shape.

  In order to improve the durability of the laminate 5, the components of the portion 5a located inside the region surrounded by the metal member 9 and the portion 5b located outside this region in the laminate 5 must be the same. Is preferred. The laminate 5 may thermally expand during the production or use of the electronic component 1 of the present embodiment, but the portion 5a located inside the region surrounded by the metal member 9 and the portion 5b located outside this region. And the components are the same, the difference in thermal expansion between these regions can be reduced. Therefore, the possibility that a large thermal stress is generated at the boundary between these regions can be reduced.

  In particular, as described later, when the metal layer constituting the metal member 9 has a perforation shape, a mesh shape, or a stripe shape, a portion 5a located inside the region surrounded by the metal member 9 and the outside of this region Since the part 5b located directly contacts, the bondability of the ceramic layer 3 constituting the multilayer body 5 can be improved.

In addition, the electronic component 1 of the present embodiment includes a coiled inner conductor 7 embedded in the multilayer body 5. The internal conductor 7 is formed so as to be wound in the stacking direction of the multilayer body 5.
Thus, the inner conductor 7 can be made to act as an inductor by winding the inner conductor 7 in the shape of a coil. In addition, although the internal conductor 7 in this embodiment is wound toward the lamination direction of the laminated body 5, it is not restricted to this. For example, you may form so that it may wind toward the side surface direction of the laminated body 5. FIG.

  As shown in FIG. 2, the coiled inner conductor 7 includes a substantially annular wiring conductor 7 a disposed on the upper surface of the ceramic layer 3 and a via conductor 7 b filled in a through hole formed in the ceramic layer 3. It is equipped with. Wiring conductors 7a adjacent in the stacking direction are electrically connected via via conductors 7b.

  Moreover, like the electronic component 1 of this embodiment, the ceramic member 11 in which the through hole is formed so as to correspond to the shape of the wiring conductor 7a is disposed between the plurality of ceramic layers 3, and the through hole is provided in the through hole. A wiring conductor 7a may be provided.

  In addition, since the wiring conductor 7a adjacent to the lamination direction is electrically connected through the via conductor 7b to form the coil-shaped inner conductor 7, each wiring conductor 7a itself has a coil shape. It is not limited to those that mean. Each of the wiring conductors 7a may have a linear shape composed of one line segment, an L shape composed of two line segments, or a U-shape composed of three line segments.

  Specifically, as the coil-shaped inner conductor 7, it is preferable to use a member having good conductivity as the wiring conductor 7a and the via conductor 7b. For example, a conductor obtained by adding a vitreous material for adding adhesion to an insulating material to a metal material powder such as copper, silver, gold, platinum, or nickel can be used as the internal conductor 7. The above metal materials may be used alone, or may be used as an alloy or a mixture.

  In addition, the electronic device of this embodiment includes a metal member 9 embedded in the multilayer body 5 so as to surround the coiled inner conductor 7. Thus, instead of placing a shield case separately formed so as to cover the laminated body 5 in which the coiled internal electrode 7 is embedded, the laminated body 5 in which the coiled internal conductor 7 is embedded is used. Since the metal member 9 that suppresses leakage of the magnetic field generated from the coiled inner conductor 7 to the outside is embedded, the coiled inner conductor 7 can be accurately attached even if the multilayer electronic component 1 is downsized. A metal shield can be formed to cover.

  The metal member 9 in the present embodiment is formed by combining a plurality of metal layers, and each metal layer is positioned above, below and on the side of the coiled inner conductor 7. As described above, since the inner conductor 7 is surrounded by the metal layer, it is possible to prevent the magnetic field generated in the coiled inner conductor 7 from leaking to the outside.

  The metal member 9 can be arranged as follows, for example. First, the metal layers 9 a and 9 b positioned above and below the coiled inner conductor 7 can be formed by disposing the metal layers 9 a and 9 b on the upper surface or the lower surface of the ceramic layer 3. Further, as the metal layer 9c located on the side of the coiled inner conductor 7, a cavity is formed in a portion of the ceramic layer 3 where the metal layer 9c is disposed, and the metal layer and It can be formed by filling a metal material.

As a method for filling the cavity with the metal material, for example, the insulating layer sheet having the same thickness and the metal layer sheet having the same thickness are stacked, and the metal layer 9c portion of the metal sheet is punched with a mold and insulated. It can be filled by embedding in a sheet. In addition, after partially punching together with the carrier tape, after transferring the green sheet without a metal layer to another carrier tape, filling and drying the metalized paste that becomes the metal layer in the space of the green sheet on the carrier sheet, It is also possible to peel off the carrier tape on one side after lamination.

  At this time, the metal member 9 is provided on the wall surface of the hollow portion provided inside the multilayer body 5 so as to surround the coiled inner conductor 7, and there may be a gap between the metal material and the ceramic layer 3. preferable. Although the metal layer and the ceramic layer 3 have different coefficients of thermal expansion, the presence of the gap as described above allows the metal member 9 and the laminated body 5 to be used when the electronic component 1 of the present embodiment is manufactured or used. This is because even if thermal stress is generated during this period, the stress can be dispersed in this gap.

  In the electronic component 1 of the present embodiment, a flat metal layer is used as the metal member 9, but the present invention is not limited to this. For example, the metal member 9 may have a perforation shape, a mesh shape, or a stripe shape. In particular, when the metal layer constituting the metal member 9 has a perforation shape, a mesh shape, or a stripe shape, the ceramic layer 3 positioned inside the metal member 9 and the ceramic layer 3 positioned outside the metal member 9 include , Partly joined directly rather than via the metal member 9. Therefore, since the bondability of these ceramic layers 3 can be enhanced, the durability of the laminate 5 can be enhanced.

  The metal member 9 has a perforation shape, a mesh shape, or a stripe shape, so that the ceramic layer 3 positioned inside the metal member 9 and the ceramic layer 3 positioned outside the metal member 9 are partially formed. In the case of bonding, in order to suppress leakage of the magnetic field from the coiled inner conductor 7 to the outside, it is preferable to reduce the gaps in the perforation shape, the mesh shape, and the stripe shape. For example, when the current flowing through the inner conductor 7 is flowing at a specific frequency, the gaps in the perforated shape, the mesh shape, and the striped shape correspond to this frequency in the magnetic field generated from the inner electrode and propagating through the ceramic layer 3. It is preferably shorter than half of the wavelength. By reducing the gap in this way, leakage of the magnetic field to the outside can be suppressed.

  As the metal member 9, it is preferable to use a member having good conductivity, like the internal conductor 7. For example, a conductor obtained by adding vitreous for adding adhesion to an insulating material to a metal material powder such as copper, silver, gold, platinum, or nickel can be used as the metal member 9. The above metal materials may be used alone, or may be used as an alloy or a mixture. The metal member 9 is preferably connected to a ground conductor (not shown). Thereby, the magnetic field from the coil-shaped inner conductor 7 can be shielded stably.

  The electronic component 1 according to the present embodiment includes a pair of external electrodes 15 that are located on the upper surface and the lower surface of the multilayer body 5 and are electrically connected to the internal conductor 7 via the connection conductor 13. The external electrode 15 is a member for electrically connecting to external wiring (not shown) via a lead terminal or the like. Therefore, although the external electrode 15 in this embodiment is arrange | positioned at the upper surface and lower surface of the laminated body 5, it is not restricted to this in particular. For example, a pair of external electrodes 15 may be disposed on the upper surface of the multilayer body 5, or a pair of external electrodes 15 may be disposed on the side surfaces of the multilayer body 5.

  In the electronic component 1 of the present embodiment, since the connection conductor 13 that electrically connects the internal conductor 7 and the external electrode 15 is disposed, each of the metal layers 9a and 9b constituting the metal member 9 has openings. 17 is formed. The connection conductor 13 is drawn into the opening 17. In addition, although it is calculated | required that the connection conductor 13 and the metal conductor are separated to the extent which suppresses an electrical short circuit, in order to suppress the leakage of the magnetic field from the coil-shaped inner conductor 7 to the exterior, the connection conductor 13 It is preferable to reduce the distance between the metal member 9 and the metal member 9.

As the external electrode 15, it is preferable to use a member having good conductivity like the internal conductor 7. Specifically, for example, a conductor obtained by adding a vitreous material for adding adhesion to an insulating material to a metal material powder such as copper, silver, gold, platinum, or nickel can be used as the external electrode 15. The above metal materials may be used alone, or may be used as an alloy or a mixture.

  Moreover, it is preferable to form plating on the surface exposed from the laminate 5 of the external electrode 15. This is because deterioration of the external electrode 15 exposed to the outside can be suppressed. In addition, when the external electrode 15 and an external wiring (not shown) are electrically connected via a lead terminal or the like, the bondability between the external electrode 15 and the lead terminal can be improved. As the plating, for example, nickel plating, copper plating, silver plating, gold plating, or tin plating can be used. As an example, after nickel plating is formed on the surface exposed from the laminate 5 of the external electrodes 15, gold plating may be further formed on the surface of the nickel plating.

  Next, the multilayer electronic component 1 of the second embodiment will be described in detail with reference to the drawings. In addition, in each structure concerning this embodiment, about the structure which has the same function as 1st Embodiment, the same referential mark is attached and the detailed description is abbreviate | omitted.

  As shown in FIGS. 5 to 7, the multilayer electronic component 1 of the second embodiment includes a plurality of coiled inner conductors 7 as compared with the multilayer electronic component 1 of the first embodiment. A coil-shaped inner conductor 7 is surrounded by a metal member 9.

  Thus, each coil-shaped inner conductor 7 is surrounded by the metal member 9, so that not only the leakage of the magnetic field from each metal member 9 to the outside of the multilayer body 5 can be suppressed, but also the internal The influence of the magnetic field between the conductors 7 can also be suppressed.

  In the electronic component 1 of the present embodiment, the metal layer 9c that forms the side surface of the metal member 9 that surrounds one internal conductor 7 and the metal layer 9c that forms the side surface of the metal member 9 that surrounds the other internal conductor 7 are provided. It is integrated. Thus, by sharing a part of the metal member 9 surrounding one inner conductor 7 and the metal member 9 surrounding the other inner conductor 7, the electronic component 1 can be reduced in size.

  As described above, the multilayer electronic component 1 of the present embodiment has been described, but the present invention is not limited to the above-described embodiment. In other words, various modifications and combinations of embodiments can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Laminated type electronic component 3 ... Ceramic layer 5 ... Laminate body 7 ... Internal conductor 7a ... Wiring conductor 7b ... Via conductor 9 ... Metal member 11 ... Ceramic member 13: Connection conductor 15 ... External electrode 17 ... Opening

Claims (5)

A laminate formed by laminating a plurality of ceramic layers;
A coiled inner conductor embedded in the laminate;
A multilayer electronic component comprising: a metal member embedded in the multilayer body so as to surround the coiled inner conductor.   2. The multilayer electronic component according to claim 1, wherein the metal member is formed by combining a plurality of metal layers, and the metal layers are respectively positioned above, below, and laterally of the coiled inner conductor. .   The multilayer electronic component according to claim 1, wherein the metal member has a mesh shape or a stripe shape.   The multilayer electronic component according to claim 1, wherein a plurality of the coiled inner conductors are provided, and each of the coiled inner conductors is surrounded by the metal member. 2. The multilayer electronic component according to claim 1, wherein the laminated body has the same component in a portion located inside an area surrounded by the metal member and a portion located outside the area.

Images