JP2012047550A - Radiation detector unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a radiation detector unit such that a plurality of radiation detector units can easily be arranged.SOLUTION: A radiation detector unit 1 for a radiation detection device constituted by connecting the plurality of radiation detector units 1 includes: a radiation detection part 2 which can detect radiation; and a support part which has unit internal wiring electrically connected with the radiation detection part 2 and a connector part connected to the unit internal wiring and provided facing a direction where the plurality of radiation detector units 1 are connected, and supports the radiation detection part 2.

Description

  The present invention relates to a radiation detector unit. In particular, the present invention relates to a radiation detector unit that detects radiation such as gamma rays and X-rays.

  Conventionally, a detector unit configured by arranging a plurality of semiconductor radiation detection elements in a matrix on a detector mounting substrate and a fixing substrate having a through hole, and a coupling screw inserted through the through hole are provided. A plurality of detector units are attached to the fixing board by meshing with the screw holes formed on the detector mounting board, and a pair of positioning pins provided on the detector mounting board are inserted into the positioning holes provided on the fixing board. A radiation detection device is known in which the detector unit is positioned by doing so (see, for example, Patent Document 1).

JP 2005-201642 A

  However, in the radiation detector according to Patent Document 1, for example, when detector units are installed in a matrix of n × n on a fixing substrate (where n is a positive integer), the detector units are fixed one by one. It is difficult to install the semiconductor radiation detection element of the detector unit so that it does not come into contact with other detector units when the last one detector unit is installed on the fixed substrate. It is. Moreover, it is difficult to install the detector unit without applying an undesired load to the connection portion between the detector unit and another detector unit.

  Accordingly, an object of the present invention is to provide a radiation detector unit that can be easily arranged when arranging a plurality of radiation detector units.

  In order to achieve the above object, the present invention provides a radiation detector unit for a radiation detection apparatus configured by connecting a plurality of radiation detector units, a radiation detection unit capable of detecting radiation, and radiation A support that supports the radiation detection unit, and includes an in-unit wiring that is electrically connected to the detection unit, and a connector unit that is connected to the in-unit wiring and is provided in a direction in which a plurality of radiation detector units are coupled. A radiation detector unit is provided.

  In the radiation detector unit, the connector portion may be provided on a side surface of the support portion.

  In the radiation detector unit, the radiation detection unit has a plurality of radiation detector cards including semiconductor elements capable of detecting radiation, and the support unit supports the end portions of the plurality of radiation detector cards. And a mother board on which a support is mounted and in-unit wiring is provided, and the in-unit wiring can be electrically connected to each of the plurality of radiation detector cards.

  Further, in the radiation detector unit, the motherboard is provided on the opposite side of the radiation detection unit and connected to the internal wiring, and further includes a signal processing unit for processing a signal from the radiation detection unit, the signal processing unit, It is also possible to relay signals between a plurality of radiation detector units in a bus type or a signal relay type.

  In the radiation detector unit, the support portion may further include a positioning portion that determines a position with respect to another adjacent radiation detector unit.

  In the radiation detector unit, the connector portion can be electrically connected to another adjacent radiation detector unit or an external electric circuit.

  Moreover, the said radiation detector unit can further be equipped with the radiation absorption layer provided in the surface on the opposite side to the side in which the radiation detection part of a support part is provided.

  Further, in the radiation detector unit, the support portion may have a cooling flow path that penetrates from one side surface of the support portion to the opposite side surface.

  The radiation detector unit according to the present invention can provide a radiation detector unit that can be easily arranged when arranging a plurality of radiation detector units.

It is a perspective view of a radiation detector unit concerning a 1st embodiment of the present invention. (A) is a front view by the side of the female connector of the radiation detector unit which concerns on the 1st Embodiment of this invention, (b) is a bottom view of a radiation detector unit. It is a perspective view of a radiation detector card. It is a schematic diagram of the state with which the some radiation detector unit which concerns on the 1st Embodiment of this invention was mutually connected. It is a figure of the heat sink with which the radiation detector unit which concerns on the 1st Embodiment of this invention is installed. It is sectional drawing of the state in which the radiation detector unit which concerns on the 1st Embodiment of this invention was mounted on the heat sink. It is sectional drawing of the radiation detection apparatus in the state with which the several radiation detector unit which concerns on the 1st Embodiment of this invention was connected. (A) is a block diagram of a radiation detector unit having an in-module wiring of a bus type signal line, and (b) is a block diagram of a radiation detector unit having a signal relay type intra-module wiring. It is a partial figure of the side surface of the radiation detection apparatus which concerns on the 2nd Embodiment of this invention. It is a perspective view of the radiation detector module which concerns on the 3rd Embodiment of this invention. It is a side view of the radiation detector module which concerns on the 4th Embodiment of this invention. (A) is a side view of the radiation detector module which concerns on the 5th Embodiment of this invention, (b) is a side view of the radiation detector module which concerns on 5th Embodiment provided with a thermal radiation block. . (A) is a partial perspective view of the radiation detector module which concerns on the 6th Embodiment of this invention, (b) is the connection of the radiation detector modules which concern on the 6th Embodiment of this invention FIG. (A) is a partial perspective view of the radiation detector module which concerns on the 7th Embodiment of this invention, (b) is the connection of the radiation detector modules which concern on the 7th Embodiment of this invention FIG. It is a partial perspective view of the radiation detector module which concerns on the 8th Embodiment of this invention. (A) is a partial perspective view of the radiation detector module which concerns on the 9th Embodiment of this invention, (b) is the connection of the radiation detector modules which concern on the 9th Embodiment of this invention It is a figure which shows a part. (A) is a partial perspective view of the radiation detector module according to the tenth embodiment of the present invention, and (b) is a plurality of radiation detector modules according to the tenth embodiment of the present invention. It is a figure which shows the state which connected. It is a side view of the radiation detector module which concerns on the 11th Embodiment of this invention. It is a side view of the radiation detector module which concerns on the 12th Embodiment of this invention.

[First Embodiment]
(Outline of configuration of radiation detector unit 1)
FIG. 1A shows an example of a perspective view of a radiation detector unit according to the first embodiment of the present invention. FIG. 1B (a) shows an example of a front view of the female connector side of the radiation detector unit according to the first embodiment of the present invention, and (b) shows the first embodiment of the present invention. An example of the bottom view of the radiation detector unit which concerns on a form is shown.

  The radiation detector unit 1 according to the first exemplary embodiment includes a radiation detector used in a radiation detection apparatus configured by connecting a plurality of radiation detector units 1 that detect radiation such as γ-rays and X-rays. Unit 1. For example, the size of the radiation detector unit 1 in plan view is about 4 cm × 4 cm. As an example, by arranging the radiation detector units 1 in 5 rows × 5 columns, an imaging head of a 20 cm square radiation detection apparatus can be configured. The number of radiation detector units 1 can be increased or decreased depending on the measurement target.

  Specifically, the radiation detector unit 1 according to the first exemplary embodiment includes a radiation detection unit 2 capable of detecting radiation and a radiation detector stand 3 as a support unit that supports the radiation detection unit 2. More specifically, the radiation detection unit 2 includes a plurality of semiconductor elements 200 that detect radiation, and a substrate 210 on which each of the plurality of semiconductor elements 200 is mounted, and a plurality of radiation detector cards that have a card shape. 20 The radiation detector stand 3 has a support 360 that supports each of both ends of the plurality of radiation detector cards 20 in the longitudinal direction. The radiation detector stand 3 can be manufactured using a metal material. When the radiation detector stand 3 is produced using a metal material, it can be produced by cutting the metal material.

  In addition, the radiation detector stand 3 is electrically connected to the intra-unit wiring that is electrically connected to the radiation detection unit 2 and to the direction in which the plurality of radiation detector units 1 are coupled to each other. And a connector portion to be provided. Here, in the first embodiment, the connector portion includes a male connector 30 provided on one side surface of the radiation detector stand 3 and a female connector 32 provided on the other side surface opposite to the one side surface. . That is, in the first embodiment, the male connector 30 and the female connector 32 are provided in the uniaxial direction (that is, the X direction in FIG. 1A). By fitting the male connector 30 of one radiation detector unit 1 and the female connector 32 of another radiation detector unit 1, a plurality of radiation detector units 1 are connected. For example, the plurality of radiation detector units 1 are linearly connected along the horizontal direction of the surface on which the radiation is incident (that is, the X direction in FIG. 1A).

  Furthermore, the radiation detector stand 3 of the radiation detector unit 1 has a positioning unit that determines the position of the radiation detector unit 1 with respect to another adjacent radiation detector unit 1. Specifically, the radiation detector unit 1 is provided at a position where a plurality of positioning pins 34 as positioning portions provided at positions where the male connector 30 is interposed and a female connector 32 is interposed, and a plurality of other radiation detector units 1 are disposed. Each of the positioning pins 34 has a plurality of holes 36 as positioning portions. That is, when the positioning pin 34 of one radiation detector unit 1 is inserted into the hole 36 of the other radiation detector unit 1, the position of the one radiation detector unit 1 relative to the other radiation detector unit 1 is changed. Determined. Here, the positioning pin 34 has a shape protruding outward from the side surface of the radiation detector stand 3. For example, the positioning pin 34 has a substantially cylindrical shape. The hole 36 has a shape corresponding to the outer shape of the positioning pin 34 and can be inserted and removed. Further, the radiation detector stand 3 has a screw hole 38 on the bottom surface used when screwed to a heat sink 4 described later.

(Configuration of radiation detector card 20)
FIG. 1C shows an example of a perspective view of a radiation detector card.

  The radiation 100 enters from the upper side to the lower side of the page. That is, the radiation 100 propagates along the direction from the semiconductor element 200 of the radiation detector card 20 toward the card holder 220 and the card holder 225 and enters the radiation detector card 20. In the radiation detector card 20, the radiation 100 is incident on the side surface of the semiconductor element 200 (that is, the surface facing upward in FIG. 1C). Therefore, the side surface of the semiconductor element 200 is an incident surface for the radiation 100. Thus, a radiation detector card having the side surface of the semiconductor element 200 as the incident surface of the radiation 100 is referred to as an edge-on type radiation detector card.

  Specifically, the radiation detector card 20 is positioned away from each of the pair of semiconductor elements 200 capable of detecting the radiation 100, the thin substrate 210 on which the plurality of semiconductor elements 200 are mounted, and the ends of the pair of semiconductor elements 200. A pair of a card holder 220 and a card holder 225 are provided to support the substrate 210 by sandwiching the substrate 210. As an example, four pairs of semiconductor elements 200 are fixed to the substrate 210 at positions where the substrate 210 is sandwiched. That is, each pair of semiconductor elements 200 is fixed to a symmetric position on one surface and the other surface of the substrate 210 with the substrate 210 as a symmetry plane.

  The substrate 210 is sandwiched and supported by a pair of card holder 220 and card holder 225. Specifically, the card holder 220 and the card holder 225 are formed to have the same shape, and the protrusion 230 of the card holder 225 is fitted into the grooved hole 232 of the card holder 220, and the card holder 225. The substrate 210 is supported by fitting a projection (not shown) of the card holder 220 into a grooved hole (not shown) of the card holder 220.

  Moreover, the board | substrate 210 has the card edge part inserted in the connector which the radiation detector stand 3 has on the opposite side of the side by which the semiconductor element 200 is mounted (In addition, in FIG. 1C, a card edge part is a card holder. 220 and the card holder 225 (not shown). The card edge portion includes a plurality of edge patterns that are electrically connected to the connector. The elastic member 234 such as a leaf spring is configured so that the radiation detector card 20 is placed in the radiation detector stand 3 when the radiation detector card 20 is inserted into the radiation detector stand 3 that supports the plurality of radiation detector cards 20. Press to fix. In this case, the card edge portion is inserted into the connector, and the edge pattern formed on the surface of the card edge portion is electrically connected to the connector, whereby the radiation detector card 20 is electrically connected to an external electric circuit. Connected.

  The radiation detector card 20 electrically connects the electrodes of each semiconductor element 200 and the plurality of substrate terminals 236 provided on the substrate 210 to the opposite side of the substrate 210 of the pair of semiconductor elements 200. A flexible substrate 240 having a wiring pattern is further provided. The flexible substrate 240 is provided on both the one semiconductor element 200 side of the pair of semiconductor elements 200 and the other semiconductor element 200 side (for example, each of the one pair of semiconductor elements 200 on the one semiconductor element 200 side). And a flexible substrate 240 is provided on each of the other semiconductor element 200 side). One end of each of the plurality of wiring patterns of the flexible substrate 240 is electrically connected to an electrode provided on the surface of the semiconductor element 200 opposite to the substrate 210, and the other end of the plurality of wiring patterns of the flexible substrate 240 is connected. Each end is electrically connected to the substrate terminal 236.

(Semiconductor element 200)
The semiconductor element 200 is formed in a substantially rectangular parallelepiped shape (that is, formed in a substantially square shape in front view). The semiconductor element 200 has electrodes on each of the surface on the substrate 210 side and the surface on the opposite side of the surface. And as a material which comprises the semiconductor element 200, CdTe can be used, for example. Further, the semiconductor element 200 is not limited to a CdTe element as long as radiation such as γ rays can be detected. For example, as the semiconductor element 200, a compound semiconductor element such as a CdZnTe (CZT) element or an HgI ₂ element can be used.

(Substrate 210)
As the substrate 210, a thin substrate (for example, a glass epoxy substrate such as FR4) formed with a conductive thin film (for example, copper foil) made of a conductive material such as a metal conductor is used, and an insulating material such as a solder resist is used. The insulating layer is formed between and formed. In addition, the substrate 210 has an element connection portion that is electrically connected to the electrode of the semiconductor element 200. The electrode of the semiconductor element 200 is electrically connected to the element connection portion via a conductive adhesive such as silver paste.

  Further, the element connection portion is electrically connected to the chip component on the substrate 210 and / or the edge pattern of the card edge portion by wiring formed on the substrate 210. Thereby, in the substrate 210, the electrode on the surface of the semiconductor element 200 on the substrate 210 side is electrically connected to the chip component and / or the pattern of the card edge portion by the wiring of the substrate 210. Further, the electrode on the surface opposite to the substrate 210 side of the semiconductor element 200 is electrically connected to the card edge portion pattern via the wiring pattern of the flexible substrate 240, the substrate terminal 236, and the wiring of the substrate 210. Is done. Here, for example, an electrode on the substrate 210 side of the semiconductor element 200 is an anode electrode, and an electrode on the opposite surface of the semiconductor element 200 to the substrate 210 side is a cathode electrode. In this case, the signal from the anode electrode and the signal from the cathode electrode are each led to the pattern of the card edge portion and output to an external electric circuit via the pattern.

(Details of card holder 220 and card holder 225)
Since the card holder 220 and the card holder 225 have substantially the same shape, the card holder 220 will be mainly described below.

  The card holder 220 includes an elastic member 234 such as a leaf spring provided at both ends in the longitudinal direction of the card holder 220, a grooved hole 232 into which the protrusion 230 of the card holder 225 that is a pair of the card holder 220 fits, and a substrate 210. And a plurality of terminal holes 238 through which board terminals 236 are provided. The card holder 220 is in contact with the substrate 210 from one surface side of the substrate 210, and the card holder 225 is in contact with the substrate 210 from the other surface side of the substrate 210, whereby the card holder 220 and the card holder 225 sandwich the substrate 210. . Thereby, the substrate 210 is supported by the card holder 220 and the card holder 225.

  FIG. 1D shows an outline of a state in which a plurality of radiation detector units according to the first embodiment of the present invention are connected to each other.

  By fitting the male connector 30 of one radiation detector unit 1 and the female connector 32 of another radiation detector unit 1, the one radiation detector unit 1 and the other radiation detector unit 1 are connected. The That is, one radiation detector unit 1 is electrically connected to another adjacent radiation detector unit 1. In the example of FIG. 1D, three radiation detector units 1 are connected. Each of the radiation detector units 1 according to the first embodiment has a male connector 30 on one side of the radiation detector stand 3 and a female connector 32 on the side opposite to the one side. Therefore, when a plurality of radiation detector units 1 are connected, they are connected linearly. That is, in FIG. 1D, a plurality of radiation detector units 1 are connected in the X direction. Of the plurality of radiation detector units 1 connected to each other, the male connector 30 and / or the female connector 32 of the radiation detector unit 1 at the end can be electrically connected to an external electric circuit.

(Outline of heat sink 4)
FIG. 2A shows an outline of a heat sink on which the radiation detector unit according to the first embodiment of the present invention is installed.

  The heat sink 4 includes a flat plate portion 40 on which a plurality of radiation detector units 1 are mounted, and a plurality of heat radiation fins 42 provided on the opposite side of the surface of the flat plate portion 40 on which the plurality of radiation detector units 1 are mounted. A positioning portion 44 provided near one side of the flat plate portion 40 and determining a position of the radiation detector unit 1 with respect to the heat sink 4 by contacting a part of the side surface of the radiation detector stand 3 of the radiation detector unit 1. . The positioning portion 44 is provided as a step on one side of the flat plate portion 40 by, for example, having a shape protruding in a direction opposite to the direction in which the fins 42 extend from one side of the flat plate portion 40.

  Further, the radiation detector fitted to the male connector 30 or the female connector 32 of the radiation detector unit 1 on the side surface of the positioning unit 44 (that is, the surface opposite to the surface of the positioning unit 44 that contacts the radiation detector unit 1). A data collection board 5 having a unit connector 50, an integrated circuit 52 connected to the radiation detector unit connector 50, and an external connection connector 54 connected to the integrated circuit 52 is provided. The data collection board 5 has an integrated circuit 52 on one side and / or the other side. The data collection substrate 5 is provided substantially horizontally on the flat plate portion 40 of the heat sink 4. In addition, when forming the heat sink 4 using a metal material, the heat sink 4 can be produced by cutting. Thereby, the form of the heat sink 4 can be defined with high dimensional accuracy.

  FIG. 2B shows an outline of a cross section in a state where the radiation detector unit according to the first embodiment of the present invention is mounted on a heat sink.

  The plurality of radiation detector units 1 are mounted on the flat plate portion 40. Each of the plurality of radiation detector units 1 is fixed to the heat sink 4 by screws 46. That is, the plurality of radiation detector units 1 are fixed to the heat sink 4 by fixing each of the plurality of screw holes 48 of the heat sink 4 and the screw holes 38 of the plurality of radiation detector units 1 with the screws 46. The Here, since the surface of the radiation detector stand 3 opposite to the side where the radiation detector 2 is provided (that is, the lower surface of the radiation detector stand 3) is a substantially flat surface, the surface and the flat plate portion 40 are provided. Will be in surface contact.

  In this case, for example, as shown in FIG. 1D, the end portion of one radiation detector unit 1 among the plurality of radiation detector units 1 linearly connected to each other is brought into contact with the positioning portion 44 of the heat sink 4. The plurality of radiation detector units 1 and the heat sink 4 are fixed with screws 46 in a state where the end of the radiation detector unit 1 is in contact with the positioning portion 44. Further, the male connector 30 and the radiation detector unit connector 50 of the one radiation detector unit 1 are connected. Thereby, signals can be exchanged between the plurality of radiation detector units 1 and the integrated circuit 52.

  More specifically, the plurality of radiation detector units 1 are fixed to the heat sink 4 through the following steps.

  First, a plurality of radiation detector units 1 are connected in a row to assemble a plurality of radiation detector unit 1 rows (hereinafter referred to as “unit rows”). When a plurality of radiation detector units 1 are connected, the radiation detector units 1 can be fixed using screws or clips in order to prevent the connection from being disconnected. Here, since the unit array can be assembled by holding the radiation detector stand 3 of one radiation detector unit 1 and the radiation detector stand 3 of another radiation detector unit 1, a portion of the radiation detector 2 It is not necessary to touch and no force is applied to the radiation detection unit 2. Therefore, since the radiation detector cards 20 of the radiation detection unit 2 are suppressed from contacting each other, the semiconductor element 200 can be prevented from being damaged.

  Next, one unit row is installed on the heat sink 4. Then, each of the plurality of radiation detector units 1 included in one unit row and the heat sink 4 are fixed with screws 46. Here, silicon grease or the like may be applied between the bottom surface of the radiation detector unit 1 and the flat plate portion 40. The position of the radiation detector unit 1 with respect to the heat sink 4 is arranged at a position predetermined by the positioning unit 44 as described above. That is, in the present embodiment, the diameter of the screw hole 48 is made larger than the diameter of the screw 46. Thereby, the positioning of the radiation detector unit 1 in the horizontal direction of the flat plate portion 40 mainly depends on the accuracy of the positioning portion 44. Subsequently, the other unit rows are similarly installed and fixed on the heat sink 4.

  After all the unit rows to be installed on the heat sink 4 are installed, the male connector 30 on the data collection board 5 side provided in the radiation detector unit 1 at the end of each unit row is mounted on the data collection board 5. Each of the plurality of radiation detector unit connectors 50 is inserted. Thereby, the plurality of radiation detector units 1 are installed on the heat sink 4.

  FIG. 3 shows an outline of a cross section of the radiation detection apparatus in a state where a plurality of radiation detector units according to the first embodiment of the present invention are connected.

  First, the plurality of radiation detector cards 20 are mounted on the mother board 25 constituting the radiation detector stand 3. The substantially rectangular mother board 25 in the top view includes support bodies 360 in the vicinity of one side and in the vicinity of the opposite side of the one side. A plurality of radiation detector cards 20 are supported between the supports 360. Further, the mother board 25 has a signal processing unit including an ASIC 300 and an FPGA 302 for processing signals supplied from each of the plurality of radiation detector cards 20 on the surface opposite to the surface on which the plurality of radiation detector cards 20 are mounted. 304. The signal processing unit 304, the male connector 30, and the female connector 32 are connected to each other by intra-unit wiring (not shown).

  Referring to FIG. 3, the male connector 30 of one radiation detector unit 1 and the female connector 32 of another radiation detector unit 1 are connected. Thereby, signals can be exchanged between one radiation detector unit 1 and another radiation detector unit 1. Further, the male connector 30 of the other radiation detector unit 1 and the radiation detector unit connector 50 of the data collection board 5 are connected. As a result, signals from all the radiation detector units 1 are collected on the data collection board 5.

  FIG. 4 shows an outline of a block diagram of in-unit wiring of the radiation detector unit according to the first embodiment of the present invention. Specifically, FIG. 4A shows an example of a block diagram of a radiation detector unit having an in-module wiring of a bus type signal line, and FIG. 4B has an in-module wiring of a signal relay system. An example of the block diagram of a radiation detector unit is shown.

  The signal processing unit 304 performs signal processing on the signal from the radiation detection unit 2a. Then, the signal subjected to the signal processing is supplied to another radiation detector unit 1 and / or the data collection board 5 via a signal line 340 as an intra-unit wiring connected to the signal processing unit 304. Accordingly, each of the plurality of radiation detector cards 20 included in the radiation detection unit 2a and the signal processing unit 304 are electrically connected. Further, a power source / ground line 350 as an intra-unit wiring and a signal processing unit 304 are connected. Accordingly, each of the plurality of radiation detector cards 20 included in the radiation detection unit 2a and the power / ground line 350 are electrically connected.

  In the present embodiment, the signal processing unit 304 can relay signals between the plurality of radiation detector units 1 using the bus-type signal line shown in FIG. When a bus type signal line is employed, the bus is shared between adjacent radiation detector units 1. As shown in FIG. 4B, the signal processing unit 304 can also relay signals between the plurality of radiation detector units 1 by a signal relay method.

(Effects of the first embodiment)
The radiation detector unit 1 according to the first exemplary embodiment is connected to another radiation detector unit 1 on the side surface of the radiation detector stand 3 and electrically connects the radiation detector units 1 to each other. Positioning pins 34 that are provided at positions sandwiching the connector portion and determine the position between the radiation detector units 1 are provided. As a result, the plurality of radiation detector units 1 (particularly, the radiation detection unit 2) are placed on the heat sink 4 by bringing the end portions of the plurality of radiation detector units 1 into contact with the positioning unit 44 without applying an excessive force. The radiation detector unit 1 can be easily arranged with high positional accuracy. That is, when the male connector 30 or the female connector 32 of the radiation detector unit 1 and the radiation detector unit connector 50 are fitted together, it is necessary to push the radiation detector unit 1 down to the heat sink 4 side to some extent. In this case, in the first embodiment, since the plurality of radiation detector units 1 are mounted on the heat sink 4 in a linearly connected state, the radiation detector unit 1 is mounted without touching the radiation detection unit 2. It becomes easy to push down to the heat sink 4 side and fix it to the heat sink 4.

  In addition, since the radiation detector unit 1 includes the connector portion and the positioning pins 34, the position of each of the plurality of radiation detector units 1 is not affected by the positional accuracy of the radiation detector unit connector 50 of the data collection board 5. Can be determined with high accuracy.

  In addition, since the radiation detection apparatus includes the data collection board 5 that receives signals from the plurality of radiation detector units 1 on the side surface of the heat sink 4 on which the plurality of radiation detector units 1 are mounted, the plurality of radiation detector units 1. It is not necessary to provide a wiring board for collecting signals from each of the plurality of radiation detector units 1 immediately below the plurality of radiation detector units 1. Thereby, it is not necessary to create a wiring board having a size corresponding to the number of the plurality of radiation detector units 1.

  In the case of the conventional technique in which a wiring board for collecting signals of a plurality of radiation detector units is provided immediately below the radiation detector unit, the wiring board is interposed between the radiation detector unit and the heat sink. For this reason, the heat radiation characteristic that dissipates the heat generated in the radiation detector unit from the heat sink is deteriorated by the presence of the wiring board in the heat transfer path. On the other hand, since the radiation detector unit 1 does not include a wiring board immediately below the radiation detector unit 1, the heat transfer path from the radiation detector unit 1 to the heat sink is shortened, and the heat dissipation characteristics can be improved. it can.

  Moreover, since the radiation detector unit 1 can use the lower surface, that is, the entire surface on the opposite side of the radiation detector 2 of the radiation detector stand 3 for heat dissipation, the heat dissipation efficiency of the radiation detector is improved. Can do. And since radiation detector units 1 are connected reliably, the penetration | invasion of the noise to the radiation detection part 2 can be suppressed.

[Second Embodiment]
FIG. 5 shows an outline of a part of the side surface of the radiation detection apparatus according to the second exemplary embodiment of the present invention.

  The radiation detector module 1 according to the second embodiment is the same as the radiation detector module 1 according to the first embodiment, and the difference is the connection direction of the data collection board 5 to the heat sink 4. Therefore, a detailed description is omitted except for differences.

  In the second embodiment, the data collection board 5 is provided substantially perpendicular to the flat plate portion 40. The heat sink 4 has a radiation detector unit connector 50 and a signal line connected to the radiation detector unit connector 50 instead of the data collection board 5, and the signal line is located away from the heat sink 4. It is also possible to provide an integrated circuit 52 connected to.

[Third Embodiment]
FIG. 6 shows an example of a perspective view of a radiation detector module according to the third embodiment of the present invention.

  The radiation detector module 1a according to the third embodiment is different from the radiation detector module 1 according to the first embodiment except that the arrangement of the male connector 30 and the female connector 32 is different. 1 has substantially the same configuration and function. Therefore, a detailed description is omitted except for differences. In addition, the radiation detector module 1a which concerns on 3rd Embodiment can also be provided with a one part or all structure and function of the radiation detector module which concerns on 1st-2nd embodiment.

  In the radiation detector module 1a, a male connector 30 and positioning pins 34 are provided on each of one side surface of the radiation detector stand 3 and one side surface adjacent to the one side surface. And the female connector 32 and the hole 36 are provided in the side surface on the opposite side to the side surface in which the male connector 30 and the positioning pin 34 are provided (not shown). That is, in any of the four side surfaces of the radiation detector stand 3 included in the radiation detector module 1a, the radiation detector module 1a can be connected to another radiation detector module 1a. Therefore, the radiation detector module 1a according to the third embodiment can be connected to another radiation detector module 1a in the four directions of the X direction and the Y direction. Thereby, positioning of the radiation detector module 1a and wiring between the radiation detector modules 1a are further facilitated.

[Fourth Embodiment]
FIG. 7 shows an example of a side view of a radiation detector module according to the fourth embodiment of the present invention.

  The radiation detector module 1b according to the fourth embodiment is different from the radiation detector module 1 according to the first embodiment except that the configuration of the radiation detector stand 3a is different from that of the radiation detector module 1. It has substantially the same configuration and function. Therefore, a detailed description is omitted except for differences. In addition, the radiation detector module 1b which concerns on 4th Embodiment can also be provided with a one part or all structure and function of the radiation detector module which concerns on 1st-3rd embodiment.

  The radiation detector stand 3a included in the radiation detector module 1b has a plurality of fins 310 for heat dissipation on the surface. Specifically, the radiation detector stand 3 a has a plurality of fins 310 on the opposite surface of the radiation detection unit 2. By forming the plurality of fins 310 on the surface of the radiation detector stand 3a in advance, it is not necessary to provide a heat sink and / or a heat radiating fin separately from the radiation detector stand 3a. In this case, the radiation detection apparatus is configured by connecting a plurality of radiation detector modules 1b.

[Fifth Embodiment]
FIG. 8A shows an example of a side view of a radiation detector module according to the fifth embodiment of the present invention, and FIG. 8B shows radiation detection according to the fifth embodiment including a heat dissipation block. An example of the side view of a vessel module is shown.

  The radiation detector module 1 according to the fifth embodiment is different from the radiation detector module 1 according to the first embodiment in that a radiation absorbing layer 6 is provided on the surface of the radiation detector stand 3. Except for this, the radiation detector module 1 has substantially the same configuration and functions. Therefore, a detailed description is omitted except for differences. In addition, the radiation detector module 1 which concerns on 5th Embodiment can also be provided with a one part or all structure and function of the radiation detector module which concerns on 1st-4th embodiment.

  First, as shown in FIG. 8A, the radiation detector module 1 further includes a radiation absorbing layer 6 on the surface of the radiation detector stand 3. Specifically, the radiation absorbing layer 6 is provided on substantially the entire surface of the radiation detector stand 3 opposite to the side on which the radiation detector 2 is provided (that is, the lower surface of the radiation detector stand 3). The radiation absorbing layer 6 is formed using, for example, lead or tungsten having a thickness of about several mm. The radiation absorbing layer 6 absorbs radiation incident on the radiation detector module 1 from the outside. That is, by providing the radiation absorbing layer 6 on the side opposite to the side where the radiation detection unit 2 is provided, it is possible to suppress radiation that should not be detected from entering the radiation detection unit 2. In the fifth embodiment, since it is not necessary to provide the radiation absorbing layer 6 outside the radiation detection apparatus including the plurality of radiation detector modules 1 and the heat radiation fins, the size and weight of the radiation detection apparatus as a whole. Can be reduced.

  Further, as shown in FIG. 8B, a heat dissipation block 315 can be provided on the opposite side of the radiation absorbing layer 6 from the radiation detector stand 3. Thereby, since it is not necessary to install the radiation absorption layer 6 on the outside of the heat dissipation block 315 or the like, it is possible to suppress unnecessary radiation from entering the radiation detection unit 2 with a simple configuration.

[Sixth Embodiment]
FIG. 9A shows an example of a partial perspective view of a radiation detector module according to the sixth embodiment of the present invention, and FIG. 9B shows the sixth embodiment of the present invention. The outline | summary of the connection of the radiation detector modules which concern on a form is shown.

  The radiation detector module 1c according to the sixth embodiment is different from the radiation detector module 1 according to the first embodiment except that a radiation pipe 31 is further provided in the radiation detector stand 3. The radiation detector module 1 has substantially the same configuration and functions. Therefore, a detailed description is omitted except for differences. In addition, the radiation detector module 1c which concerns on 6th Embodiment can also be provided with a one part or all structure and function of the radiation detector module which concerns on 1st-5th embodiment.

  The radiation detector stand 3 included in the radiation detector module 1c is provided with a refrigerant pipe 31 penetrating from a side surface where the male connector 30 and the positioning pin 34 are provided to a side surface opposite to the side surface, and the male connector 30. And an insertion port 35 into which the refrigerant pipe 31 of the other radiation detector module 1c is inserted. The refrigerant pipe 31 has a shape protruding outward from the side surface on which the male connector 30 is provided. When the refrigerant pipe 31 is inserted into the insertion port 35 on the outer periphery of the refrigerant pipe 31, the refrigerant pipe 31 is used. A packing 33 such as an O-ring that separates the inside and the outside of the pipe 31 is provided.

  Specifically, the refrigerant pipe 31 is provided through a side surface having the male connector 30 and a side surface having the female connector 32. The radiation detector stand 3 can have a plurality of refrigerant pipes 31. More specifically, the radiation detector stand 3 includes a plurality of refrigerant pipes 31 at a distance on the opposite side of the plurality of positioning pins 34 from the radiation detection unit 2. For example, a plurality of refrigerant pipes 31 are provided at a distance in a direction away from the radiation detection unit 2 with each positioning pin 34 as a base point. By flowing a coolant such as cooling water through the coolant pipe 31, the radiation detector module 1c can be effectively cooled.

  Further, positioning between the plurality of radiation detector modules 1 is performed by a refrigerant pipe 31 protruding outside from a side surface on which the male connector 30 is provided, and an insertion port 35 provided on a side surface on which the female connector 32 is provided. You can also. In this case, the positioning pin 34 and the hole 36 can be omitted.

[Seventh Embodiment]
FIG. 10 (a) shows an example of a partial perspective view of a radiation detector module according to the seventh embodiment of the present invention, and FIG. 10 (b) shows the seventh embodiment of the present invention. The outline | summary of the connection of the radiation detector modules which concern on a form is shown.

  The radiation detector module 1d according to the seventh exemplary embodiment is different from the radiation detector module 1 according to the first exemplary embodiment in that a flow path 37 for air cooling is further provided in the radiation detector stand 3. Except for the above, the radiation detector module 1 has substantially the same configuration and functions. Therefore, a detailed description is omitted except for differences. Note that the radiation detector module 1d according to the seventh embodiment may include a part or all of the configurations and functions of the radiation detector modules according to the first to sixth embodiments.

  The radiation detector stand 3 included in the radiation detector module 1d further includes a flow path 37 that penetrates from the side surface on which the male connector 30 and the positioning pin 34 are provided to the side surface opposite to the side surface. The radiation detector module 1 d can have a plurality of flow paths 37. Moreover, the flow path 37 has a substantially rectangular shape in cross section as an example. And the flow path 37 is provided in the other side of the radiation detection part 2 of the side surface in which the male connector 30 is provided, ie, the downward direction of the male connector 30, for example.

  When the plurality of radiation detector modules 1d are connected to each other, the flow paths 37 of the plurality of radiation detector modules 1d are connected. And the fan 7 is provided in the edge part of the connected several flow path 37. FIG. By operating the fan 7, fluid (for example, air) flows in the plurality of flow paths 37. Thereby, each of the plurality of radiation detector modules 1 d is cooled by the fluid flowing through the flow path 37. When one radiation detector module 1d and another radiation detector module 1d are connected, the flow path 37 of one radiation detector module 1d and the flow path 37 of another radiation detector module 1d are connected. In the meantime, a gasket surrounding the outer periphery of the outlet of the channel 37 can be provided for the purpose of keeping the channel 37 secret.

[Eighth Embodiment]
FIG. 11 shows an example of a partial perspective view of a radiation detector module according to the eighth embodiment of the present invention.

  The radiation detector module 1e according to the eighth embodiment is substantially the same as the radiation detector module 1 except that the configuration of the positioning pins is different from that of the radiation detector module 1 according to the first embodiment. It has a configuration and functions. Therefore, a detailed description is omitted except for differences. In addition, the radiation detector module 1e which concerns on 8th Embodiment can also be provided with a one part or all structure and function of the radiation detector module which concerns on 1st-7th embodiment.

  As for the radiation detector stand 3 with which the radiation detector module 1e is provided, the heat pipe 39 is provided in the side surface in which the male connector 30 is provided. For example, the heat pipe 39 is provided at a position sandwiching the male connector 30. The heat pipe 39 can also have the function of the positioning pin 34 according to the first embodiment. The heat pipe 39 can be formed using a metal material having a good thermal conductivity, for example, copper. In the radiation detector module 1e according to the eighth embodiment, heat generated from the radiation detector module 1e is radiated to the outside via the heat pipe 39, so that the heat sink 4 may not be used.

[Ninth Embodiment]
FIG. 12A shows an example of a partial perspective view of the radiation detector module according to the ninth embodiment of the present invention, and FIG. 12B shows the ninth embodiment of the present invention. The outline of the connection part between radiation detector modules is shown.

  The radiation detector module 1f according to the ninth embodiment is substantially the same as the radiation detector module 1 except that the radiation detector module 1 according to the first embodiment further includes a gasket 8. And equipped with functions. Therefore, a detailed description is omitted except for differences. Note that the radiation detector module 1 f according to the ninth embodiment may include a part or all of the configurations and functions of the radiation detector modules according to the first to eighth embodiments.

  The radiation detector module 1f includes a gasket 8 on each of the four side surfaces. Specifically, the gasket 8 is provided between the radiation detection unit 2 and the male connector 30 and the female connector 32 and on each of the side surfaces of the radiation detector stand 3. The gasket 8 includes, for example, an inner member that is compressed when a force is applied from the outside, and a conductive outer layer that covers the inner member. When one radiation detector module 1f and another radiation detector module 1f are connected, the gasket 8 of the one radiation detector module 1f and the gasket 8 of the other radiation detector module 1f come into contact with each other. Thereby, the electromagnetic waves 110 from the male connector 30 and the female connector 32 are prevented from reaching the radiation detection unit 2.

[Tenth embodiment]
FIG. 13A shows an example of a partial perspective view of the radiation detector module according to the tenth embodiment of the present invention, and FIG. 13B shows the tenth embodiment of the present invention. An outline of a state in which a plurality of radiation detector modules are connected is shown.

  The radiation detector module 1g according to the tenth embodiment is different from the radiation detector module 1 according to the first embodiment in that a plurality of radiation detector modules 1g are fixed by bolts 332 and nuts 334. Except for this, the radiation detector module 1 has substantially the same configuration and functions. Therefore, a detailed description is omitted except for differences. In addition, the radiation detector module 1g which concerns on 10th Embodiment can also be provided with a one part or all structure and function of the radiation detector module which concerns on 1st-9th embodiment.

  The radiation detector stand 3 included in the radiation detector module 1g has a through-hole 330 that penetrates from the side surface where the male connector 30 is provided to the side surface opposite to the side surface, that is, the side surface where the female connector 32 is provided. Have. The through hole 330 can be provided, for example, at a position corresponding to the position where the positioning pin 34 is provided in the radiation detector module 1. That is, in the tenth embodiment, the positioning pin 34 and the hole 36 can be omitted. Then, when connecting a plurality of radiation detector modules 1g, bolts 332 are passed through the through holes 330 of each radiation detector module 1g and fixed with nuts 334. Thereby, each of the plurality of radiation detector modules 1g is firmly fixed.

[Eleventh embodiment]
FIG. 14 shows an outline of a side surface of the radiation detector module according to the eleventh embodiment of the present invention.

  The radiation detector module 1h according to the eleventh embodiment is substantially the same as the radiation detector module 1 except that the radiation detector module 1h is different from the radiation detector module 1 according to the first embodiment in the structure of the radiation detector stand. It has the same configuration and function. Therefore, a detailed description is omitted except for differences. Note that the radiation detector module 1h according to the eleventh embodiment can include a part or all of the configurations and functions of the radiation detector modules according to the first to tenth embodiments.

  The radiation detector stand 3 b included in the radiation detector module 1 h includes a plurality of fins 310 for heat dissipation and a fan 7 that sends fluid to the plurality of fins 310. Specifically, the radiation detector stand 3b has a plurality of fins 310 on the surface opposite to the radiation detection unit 2 (that is, the lower surface of the radiation detector stand 3b), and the fan 7 at the front of the plurality of fins 310. Have. The radiation detector module 1h is forcibly cooled by forming a plurality of fins 310 in advance on the surface of the radiation detector stand 3b and sending a fluid such as air from the outside to the plurality of fins 310 by the fan 7. Thereby, it is not necessary to provide a heat sink and / or a radiation fin separately from the radiation detector stand 3b.

[Twelfth embodiment]
FIG. 15: shows the outline | summary of the side surface of the radiation detector module which concerns on the 12th Embodiment of this invention.

  The radiation detector module 1i according to the twelfth embodiment is different from the radiation detector module 1 according to the first embodiment except that the structure of the lower portion of the radiation detector stand 3 is different. 1 has substantially the same configuration and function. Therefore, a detailed description is omitted except for differences. Note that the radiation detector module 1i according to the twelfth embodiment can include a part or all of the configurations and functions of the radiation detector modules according to the first to eleventh embodiments.

  The radiation detector module 1 i includes a heat radiation block 315 on the side opposite to the side where the radiation detector 2 of the radiation detector stand 3 is provided, and a Peltier element 9 between the radiation detector stand 3 and the heat radiation block 315. Is provided. In addition, a fan 7 for sending a fluid such as air to the heat dissipation block 315 is further provided at the end of the heat dissipation block 315. The radiation detector module 1 i is cooled by the Peltier element 9 provided on the lower surface of the radiation detector stand 3.

  Here, the temperature of the Peltier element 9 can be controlled independently according to the temperature of the radiation detector module 1i. For example, a temperature measurement unit that measures the temperature in the radiation detector module 1 i and a temperature control unit that controls the temperature of the Peltier element 9 according to a signal from the temperature measurement unit are further provided in the radiation detector module 1 i. Then, the temperature control unit controls the temperature of the Peltier element 9 in accordance with the difference between the information indicating the temperature measured by the temperature measurement unit and a preset reference temperature (hereinafter referred to as “reference temperature”). Further, the temperature control unit controls both the temperature of the Peltier element 9 and the rotational speed of the fan 7 so that the temperature inside the radiation detector module 1i approaches the reference temperature in accordance with a signal from the temperature measurement unit. You can also.

  The temperature control unit can be provided outside the radiation detector module 1i. In this case, the temperature of the Peltier element 9 is controlled by a temperature control unit provided outside the radiation detector module 1i.

  While the embodiments of the present invention have been described above, the embodiments described above do not limit the invention according to the claims. In addition, it should be noted that not all the combinations of features described in the embodiments are essential to the means for solving the problems of the invention.

1, 1a, 1b, 1c, 1d Radiation detector unit 1e, 1f, 1g, 1h, 1i Radiation detector unit 2, 2a Radiation detection unit 3, 3a, 3b Radiation detector stand 4 Heat sink 5 Data collection board 6 Radiation absorption Layer 7 Fan 8 Gasket 9 Peltier element 20 Radiation detector card 25 Motherboard 30 Male connector 31 Refrigerant pipe 32 Female connector 33 Packing 34 Positioning pin 35 Insertion hole 36 Hole 37 Flow path 38 Screw hole 39 Heat pipe 40 Flat plate part 42 Fin 44 Positioning part 46 Screw 48 Screw hole 50 Connector for radiation detector unit 52 Integrated circuit 54 External connection connector 100 Radiation 110 Electromagnetic wave 200 Semiconductor element 210 Substrate 220, 225 Card holder 230 Protruding part 232 Grooved hole 234 Bullet Member 236 board terminal 238 terminal hole 240 a flexible substrate 300 ASIC
302 FPGA
304 Signal Processing Unit 310 Fin 315 Heat Dissipation Block 320 Refrigerant Flow Path 330 Through Hole 332 Bolt 334 Nut 340 Signal Line 350 Power / Ground Line 360 Support

Claims (8)

A radiation detector unit for a radiation detection apparatus configured by connecting a plurality of radiation detector units,
A radiation detector capable of detecting radiation;
A wiring in the unit that is electrically connected to the radiation detection unit; and a connector part that is connected to the wiring in the unit and is provided in a direction in which the plurality of radiation detector units are coupled to each other. A radiation detector unit comprising a support part for supporting the part.   The radiation detector unit according to claim 1, wherein the connector part is provided on a side surface of the support part. The radiation detection unit has a plurality of radiation detector cards including semiconductor elements capable of detecting radiation,
The support unit includes a support body that supports end portions of the plurality of radiation detector cards, and a motherboard on which the support body is mounted and the intra-unit wiring is provided.
The radiation detector unit according to claim 2, wherein the in-unit wiring is electrically connected to each of the plurality of radiation detector cards. The motherboard further includes a signal processing unit that is provided on the opposite side of the radiation detection unit and connected to the in-unit wiring, and that processes a signal from the radiation detection unit,
The radiation detector unit according to claim 3, wherein the signal processing unit relays the signal in a bus type or a signal relay type between the plurality of radiation detector units. The radiation detector unit according to claim 4, wherein the support portion further includes a positioning portion that determines a position with respect to another adjacent radiation detector unit.   The radiation detector unit according to claim 5, wherein the connector portion is electrically connected to another adjacent radiation detector unit or an external electric circuit.   The radiation detector unit according to claim 1, further comprising a radiation absorbing layer provided on a surface of the support portion opposite to a side where the radiation detection portion is provided.   The radiation detector unit according to claim 1, wherein the support portion has a cooling flow path penetrating from one side surface to the opposite side surface of the support portion.

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