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JP2011216868A - Light emitting device, and illumination apparatus - Google Patents

Light emitting device, and illumination apparatus Download PDF

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Publication number
JP2011216868A
JP2011216868A JP2011042828A JP2011042828A JP2011216868A JP 2011216868 A JP2011216868 A JP 2011216868A JP 2011042828 A JP2011042828 A JP 2011042828A JP 2011042828 A JP2011042828 A JP 2011042828A JP 2011216868 A JP2011216868 A JP 2011216868A
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Prior art keywords
light emitting
led
red
light
blue
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Japanese (ja)
Inventor
Shuhei Matsuda
周平 松田
Soichi Shibusawa
壮一 渋沢
Sohiko Betsuda
惣彦 別田
Kiyoshi Nishimura
潔 西村
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Priority to JP2011042828A priority Critical patent/JP2011216868A/en
Priority to EP11157862.1A priority patent/EP2365525A3/en
Priority to US13/045,787 priority patent/US8820950B2/en
Publication of JP2011216868A publication Critical patent/JP2011216868A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

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  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device improving luminous efficiency, and allowing influence of change of an emission color depending on the temperature of a red light emitting LED element to be reduced by focusing attention on a temperature characteristic of the red light emitting LED element.SOLUTION: This light emitting device 1 is mounted to this illumination apparatus. The light emitting device 1 emits light having a correlated color temperature of 2,400 to 3,600 K, and includes a substrate 2, blue light emitting LED elements 3 and red light emitting LED elements 4 mounted on the substrate 2, and a wavelength converting unit 6. The red light emitting LED element 4 has a luminous intensity of 0.2 to 2.5 times as large as that of the blue light emitting LED element 3 at normal use temperature in a state mounted to the illumination apparatus. The wavelength converting unit 6 is excited by light emitted from the blue light emitting LED elements 3 and converts the light to light having a peak at a wavelength of 500-600 nm.

Description

本発明の実施形態は、光源としてLED素子を用いた発光装置、及びこの発光装置を具備した照明装置に関する。   Embodiments described herein relate generally to a light emitting device using an LED element as a light source, and an illumination device including the light emitting device.

近時、光源としてLED素子を用いた発光装置が具備した照明装置が提案されてきている。発光装置は、基板に多数のLED素子のベアチップを実装し、これらLEDチップをボンディングワイヤで電気的に接続し、蛍光体を含有した封止体で複数のLEDチップを封止している。そして、白色、昼光色、電球色等の光を得ようとしている。   In recent years, illumination devices equipped with light-emitting devices using LED elements as light sources have been proposed. In a light emitting device, a large number of LED element bare chips are mounted on a substrate, these LED chips are electrically connected by bonding wires, and a plurality of LED chips are sealed with a sealing body containing a phosphor. And it is trying to obtain light such as white, daylight, and light bulb.

しかし、このような発光装置で生成される光は赤み成分が少なく、演色性の高い例えば電球色の光を得るのは困難な状況にある。   However, the light generated by such a light emitting device has a small reddish component, and it is difficult to obtain light of, for example, light bulb color with high color rendering properties.

このため、黄色蛍光体及び赤色蛍光体を含有した封止体で青色発光LED素子を封止することにより、赤み成分を補うことが考えられる。ところが、赤色蛍光体は、エネルギー変換効率が悪く、発光装置の発光効率の低下を招く虞がある。   For this reason, it can be considered that the red component is compensated by sealing the blue light-emitting LED element with a sealing body containing a yellow phosphor and a red phosphor. However, the red phosphor has poor energy conversion efficiency and may cause a decrease in the light emission efficiency of the light emitting device.

また、青色発光LED素子と、赤色発光LED素子と、青色発光LED素子によって励起され青色発光LED素子と赤色発光LED素子との間の波長帯域の発光スペクトルで発光する蛍光体と、を備えた発光装置が提案されている。この発光装置では、赤色発光LED素子を用い、この赤色発光LED素子から赤色光を直接発光させるもので、これにより、発光装置の発光効率が低下することがないとするものである。   A light emitting device comprising: a blue light emitting LED element; a red light emitting LED element; and a phosphor that is excited by the blue light emitting LED element and emits light in an emission spectrum in a wavelength band between the blue light emitting LED element and the red light emitting LED element. A device has been proposed. In this light emitting device, a red light emitting LED element is used, and red light is directly emitted from the red light emitting LED element, whereby the light emission efficiency of the light emitting device is not lowered.

特開2008−227412号公報JP 2008-227212 A 特開2002−57376号公報JP 2002-57376 A

しかしながら、赤色発光LED素子は、温度による特性の変化が大きく、例えば、温度の変化によって、大きく発光色が変わってしまう特質がある。   However, the red light-emitting LED element has a characteristic that a change in characteristics due to temperature is large. For example, the light-emitting color changes greatly according to a change in temperature.

本発明が解決しようとする課題は、発光効率を向上できるとともに、赤色発光LED素子の温度特性に着目し、この赤色発光LED素子の温度による発光色の変化の影響を軽減することができる発光装置及びこの発光装置を具備した照明装置を提供することである。   The problem to be solved by the present invention is a light emitting device capable of improving the light emission efficiency and focusing on the temperature characteristics of the red light emitting LED element and reducing the influence of the change in the light emission color due to the temperature of the red light emitting LED element. And an illumination device including the light emitting device.

実施形態の発光装置は、照明装置に取り付けられ、放射される光の相関色温度が2400K〜3600Kの発光装置であって、基板、この基板に実装された青色発光LED素子及び赤色発光LED素子、波長変換手段を備える。赤色発光LED素子は、照明装置への取付状態での通常使用温度において、青色発光LED素子の光度に対し、0.2倍以上2.5倍以下の光度を有する。波長変換手段は、青色発光LED素子から出射される光に励起されて、その光を500nm〜600nmの波長にピークを有する光に変換する。   The light emitting device of the embodiment is a light emitting device that is attached to a lighting device and has a correlated color temperature of emitted light of 2400K to 3600K, and includes a substrate, a blue light emitting LED element and a red light emitting LED element mounted on the substrate, Wavelength conversion means is provided. The red light-emitting LED element has a light intensity of 0.2 to 2.5 times the light intensity of the blue light-emitting LED element at a normal use temperature in a state of being attached to the lighting device. The wavelength conversion means is excited by light emitted from the blue light emitting LED element and converts the light into light having a peak at a wavelength of 500 nm to 600 nm.

本発明によれば、演色性が良好で、発光効率を向上できるとともに、赤色発光LED素子の温度による発光色の変化の影響を軽減することができる発光装置を提供することが期待できる。   ADVANTAGE OF THE INVENTION According to this invention, it can anticipate providing the light-emitting device which has favorable color rendering property, can improve luminous efficiency, and can reduce the influence of the change of the luminescent color by the temperature of a red light emitting LED element.

第1の実施形態の発光装置を示す斜視図である。It is a perspective view which shows the light-emitting device of 1st Embodiment. 図1中のX−X線に沿って示す断面図である。It is sectional drawing shown along the XX line in FIG. 同上発光装置において、枠部材及び封止部材を形成する前の状態で、青色発光LED素子及び赤色発光LED素子の実装状態を示す平面図である。In a light emitting device same as the above, it is a top view which shows the mounting state of a blue light emitting LED element and a red light emitting LED element in the state before forming a frame member and a sealing member. 同上青色発光LED素子及び赤色発光LED素子の実装状態を拡大して示す平面図である。It is a top view which expands and shows the mounting state of a blue light emitting LED element and a red light emitting LED element same as the above. 同上相関色温度、青色発光LED素子及び赤色発光LED素子の光度、青色発光LED素子と赤色発光LED素子との光度比の測定結果を示す表である。It is a table | surface which shows the measurement result of correlation color temperature same as the above, the luminous intensity of a blue light emitting LED element, and the luminous intensity ratio of a blue light emitting LED element and a red light emitting LED element. 同上相関色温度、青色発光LED素子と赤色発光LED素子との光度比の測定結果を示す表である。It is a table | surface which shows a measurement result of the correlation color temperature same as above, and the luminous intensity ratio of a blue light emitting LED element and a red light emitting LED element. 同上測定結果に基づき、相関色温度が2400Kと3600Kとにおいて、青色発光LED素子の光度に対する赤色発光LED素子の光度の比率の下限値及び上限値を計算により求めた計算値を示すグラフである。It is a graph which shows the calculated value which calculated | required the lower limit and the upper limit of the ratio of the luminous intensity of a red light emitting LED element with respect to the luminous intensity of a blue light emitting LED element in correlation color temperature 2400K and 3600K based on a measurement result same as the above. 同上相関色温度と青色発光LED素子に対する赤色発光LED素子の光度比との関係を示す表である。It is a table | surface which shows the relationship between correlation color temperature same as the above, and the luminous intensity ratio of the red light emitting LED element with respect to a blue light emitting LED element. 同上発光装置を具備した照明装置としてLEDランプを示す断面図である。It is sectional drawing which shows an LED lamp as an illuminating device provided with the light-emitting device same as the above. 同上発光装置を具備した照明装置としてダウンライトを示す斜視図である。It is a perspective view which shows a downlight as an illuminating device provided with the light-emitting device same as the above. 第2の実施形態に係る発光装置であり、枠部材及び封止部材を形成する前の状態で、青色発光LED素子及び赤色発光LED素子の実装状態を示す平面図である。It is a light emitting device concerning a 2nd embodiment, and is a top view showing the mounting state of a blue light emitting LED element and a red light emitting LED element in the state before forming a frame member and a sealing member. 第3の実施形態の発光装置であり、青色発光LED素子及び赤色発光LED素子の実装状態を示す平面図である。It is a light-emitting device of 3rd Embodiment, and is a top view which shows the mounting state of a blue light emitting LED element and a red light emitting LED element. 第4の実施形態の発光装置であり、青色発光LED素子及び赤色発光LED素子の実装状態を示す平面図である。It is a light-emitting device of 4th Embodiment, and is a top view which shows the mounting state of a blue light emitting LED element and a red light emitting LED element. 第5の実施形態の発光装置の発光スペクトルを示すグラフである。It is a graph which shows the emission spectrum of the light-emitting device of 5th Embodiment. 第6の実施形態の発光装置の発光スペクトルを示すグラフである。It is a graph which shows the emission spectrum of the light-emitting device of 6th Embodiment. 同上発光装置であり、枠部材及び封止部材を形成する前の状態で、青色発光LED素子及び赤色発光LED素子の実装状態を示す平面図である。It is a light emitting device same as the above, and is a top view which shows the mounting state of a blue light emitting LED element and a red light emitting LED element in the state before forming a frame member and a sealing member.

以下、第1の実施形態を、図1乃至図10を参照して説明する。なお、各図において同一部分には同一符号を付し重複した説明は省略する。図1乃至図4は発光装置1を示し、図5乃至図8は色温度に関する測定結果を示し、図9及び図10は発光装置1を具備した照明装置41を示す。   Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 10. In addition, the same code | symbol is attached | subjected to the same part in each figure, and the overlapping description is abbreviate | omitted. 1 to 4 show the light emitting device 1, FIGS. 5 to 8 show the measurement results regarding the color temperature, and FIGS. 9 and 10 show the lighting device 41 provided with the light emitting device 1.

図1及び図2に示すように、発光装置1は、基板2と、この基板2に複数実装された青色発光LED素子(以下、青色LEDという。)3及び赤色発光LED素子(以下、赤色LEDという。)4と、枠部材5と、波長変換手段6としての封止部材7とを備えている。すなわち、発光装置1は、基板2上に複数のLED3,4を実装するCOB(Chip On Board)方式が採用されている。   As shown in FIGS. 1 and 2, a light emitting device 1 includes a substrate 2, a plurality of blue light emitting LED elements (hereinafter referred to as blue LEDs) 3 and red light emitting LED elements (hereinafter red LEDs) mounted on the substrate 2. 4), a frame member 5, and a sealing member 7 as wavelength converting means 6. That is, the light emitting device 1 employs a COB (Chip On Board) system in which a plurality of LEDs 3 and 4 are mounted on a substrate 2.

図1乃至図3に示すように、基板2は、基材21と、この基材21の表面側に設けられた実装パッド22及び給電端子23と、基材21の裏面側に設けられた金属板部材24とから構成されている。これら実装パッド22、給電端子23及び金属板部材24は、例えば銅板材料からなり、基材21に直接接合されている。   As shown in FIGS. 1 to 3, the substrate 2 includes a base material 21, a mounting pad 22 and a power supply terminal 23 provided on the front surface side of the base material 21, and a metal provided on the back surface side of the base material 21. And a plate member 24. The mounting pad 22, the power feeding terminal 23, and the metal plate member 24 are made of, for example, a copper plate material and are directly bonded to the base material 21.

基材21は、例えば、白色系の酸化アルミニウム、窒化アルミニウム、窒化ケイ素等のセラミックス材料の平板で略四角形状に形成されている。図3に代表して示すように、この基材21の表面側中央には、青色LED3及び赤色LED4が実装される四角形状の実装パッド22が配設されている。また、基材21の表面側で、実装パッド22の両側には、所定間隔離間して一対の給電端子23が配設されている。   The base material 21 is formed in a substantially rectangular shape with a flat plate made of a ceramic material such as white aluminum oxide, aluminum nitride, silicon nitride, or the like. As representatively shown in FIG. 3, a square mounting pad 22 on which the blue LED 3 and the red LED 4 are mounted is disposed in the center of the surface side of the base material 21. In addition, a pair of power supply terminals 23 are arranged on the surface side of the base material 21 on both sides of the mounting pad 22 with a predetermined spacing.

一方、基材21の裏面側には、その略全面に亘って平板状の金属板部材24が接合されている。この金属板部材24は、基板2の放熱や変形防止の機能を有している。   On the other hand, a flat metal plate member 24 is joined to the back surface side of the substrate 21 over substantially the entire surface thereof. The metal plate member 24 has a function of heat dissipation and deformation prevention of the substrate 2.

なお、基板21には、アルミニウム等の熱伝導性が良好で放熱性に優れた金属材料をベース板として、その一面に絶縁層が積層された金属製基板を適用することもできる。また、ベース板の材料を絶縁材とする場合には、ガラスエポキシ樹脂等の合成樹脂材料を適用できる。   As the substrate 21, a metal substrate in which an insulating layer is laminated on one surface of a metal material having good thermal conductivity and excellent heat dissipation, such as aluminum, can be used. Further, when the base plate material is an insulating material, a synthetic resin material such as a glass epoxy resin can be applied.

図2に示すように、実装パッド22及び給電端子23は、三層構成であり、基材21の表面上に接合された銅板を第1層Aとし、この銅板の表面上には、第2層Bとしてニッケル(Ni)がめっき処理され、第三層Cとして銀(Ag)がめっき処理されている。実装パッド22の第三層C、すなわち表層は、銀(Ag)めっきが施されており、全光線反射率は、90%と高いものとなっている。   As shown in FIG. 2, the mounting pad 22 and the power supply terminal 23 have a three-layer configuration. A copper plate bonded on the surface of the base material 21 is a first layer A, and a second layer A is formed on the surface of the copper plate. The layer B is plated with nickel (Ni) and the third layer C is plated with silver (Ag). The third layer C, ie, the surface layer, of the mounting pad 22 is silver (Ag) plated, and the total light reflectance is as high as 90%.

また、青色LED3及び赤色LED4は、シリコーン樹脂系の絶縁性接着剤26を用いて、実装パッド22上に接着されている。   The blue LED 3 and the red LED 4 are bonded onto the mounting pad 22 using a silicone resin insulating adhesive 26.

青色LED3は、InGaN系又はGaN系等の450nm〜470nmの波長の青色光を発光するLEDチップで構成されている。さらに、青色LED3は、透光性のサファイア等の素子基板上に青色発光をする発光層が積層され、この発光層に電流を流す正負一対の素子電極27を有している。   The blue LED 3 is composed of an LED chip that emits blue light having a wavelength of 450 nm to 470 nm, such as InGaN-based or GaN-based. Further, the blue LED 3 includes a light emitting layer that emits blue light on an element substrate such as a translucent sapphire, and has a pair of positive and negative element electrodes 27 that allow current to flow through the light emitting layer.

赤色LED4は、AlGalnP系又はGaAlAs混晶系等の580nm〜620nmの波長の赤色光を発光するLEDチップで構成されている。さらに、赤色LED4は、透光性のサファイア等の素子基板上に赤色発光をする発光層が積層され、この発光層に電流を流す正負一対の素子電極28を有している。   The red LED 4 is composed of an LED chip that emits red light having a wavelength of 580 nm to 620 nm, such as an AlGalnP system or a GaAlAs mixed crystal system. Further, the red LED 4 includes a light emitting layer that emits red light on an element substrate such as a translucent sapphire, and has a pair of positive and negative element electrodes 28 that allow current to flow through the light emitting layer.

これら各素子電極27,28は、ボンディングワイヤ29により電気的に接続されている。ボンディングワイヤ29は、金(Au)の細線からなっており、実装強度の向上とLEDチップの損傷低減のために金(Au)を主成分とするバンプを介して各素子電極27,28に接続されている。   These element electrodes 27 and 28 are electrically connected by a bonding wire 29. The bonding wire 29 is made of a fine gold (Au) wire and is connected to the device electrodes 27 and 28 via bumps mainly composed of gold (Au) in order to improve mounting strength and reduce damage to the LED chip. Has been.

主として図4(赤色LED4は、図示上、網掛けして表わしている)に示すように、実装パッド22上に、青色LED3及び赤色LED4が交互でかつマトリクス状に実装され、複数の青色LED3及び赤色LED4の素子列を形成している。具体的には、図4の左右方向の素子列において、その素子列が延びる方向に青色LED3と赤色LED4とが交互に配置されている。また、電気的には、複数の素子列うちの3列ずつが直列に接続されて6個の直列回路30が形成され、これら直列回路30が一対の給電端子23に対して並列に接続されている。したがって、6個の直列回路30に、給電端子23を通じて給電されるようになっている。   As shown mainly in FIG. 4 (the red LEDs 4 are shaded in the figure), the blue LEDs 3 and the red LEDs 4 are alternately mounted in a matrix on the mounting pad 22, and a plurality of blue LEDs 3 and An element array of red LEDs 4 is formed. Specifically, in the left and right element rows in FIG. 4, the blue LEDs 3 and the red LEDs 4 are alternately arranged in the direction in which the element rows extend. Electrically, three of the plurality of element rows are connected in series to form six series circuits 30, and these series circuits 30 are connected in parallel to the pair of power supply terminals 23. Yes. Therefore, power is supplied to the six series circuits 30 through the power supply terminal 23.

より詳しくは、1つの直列回路30に注目してみると、例えば、図示上、各青色LED3及び赤色LED4は、交互に並べられて配置されていて、実装パッド22の端部側でターンしてS字状に配置されている。個数的には、青色LED3が18個、赤色LED4が15個である。まず、右側の給電端子23に接続されたボンディングワイヤ29が青色LED3の正極側の素子電極27に接続され、青色LED3の他方の負極側の素子電極27がボンディングワイヤ29によって、隣接する赤色LED4の正極側の素子電極28に接続され、さらに、赤色LED4の負極側の素子電極28がボンディングワイヤ29によって、隣接する青色LED3の正極側の素子電極27に接続されている。   More specifically, when attention is paid to one series circuit 30, for example, in the drawing, the blue LEDs 3 and the red LEDs 4 are alternately arranged and turned on the end side of the mounting pad 22. It is arranged in an S shape. In terms of number, there are 18 blue LEDs 3 and 15 red LEDs 4. First, the bonding wire 29 connected to the right power supply terminal 23 is connected to the element electrode 27 on the positive side of the blue LED 3, and the element electrode 27 on the other negative side of the blue LED 3 is connected to the adjacent red LED 4 by the bonding wire 29. The element electrode 28 on the negative electrode side of the red LED 4 is connected to the element electrode 28 on the positive electrode side, and further connected to the element electrode 27 on the positive electrode side of the adjacent blue LED 3 by a bonding wire 29.

このような接続が順次行われ、その列が延びる方向に隣接された青色LED3及び赤色LED4の異極の電極同士、つまり、隣接された青色LED3又は赤色LED4の正極側の素子電極27,28と、隣接された赤色LED4又は青色LED3の負極側の素子電極28,27とがボンディングワイヤ29で接続されている。そして、列の後尾の青色LED3の負極側の素子電極27が左側の給電端子23にボンディングワイヤ29によって接続されている。   Such connections are sequentially made, and the electrodes of the opposite polarity of the blue LED 3 and the red LED 4 adjacent to each other in the extending direction of the row, that is, the element electrodes 27 and 28 on the positive side of the adjacent blue LED 3 or the red LED 4 are connected to each other. The element electrodes 28 and 27 on the negative side of the adjacent red LED 4 or blue LED 3 are connected by a bonding wire 29. The element electrode 27 on the negative side of the blue LED 3 at the tail of the column is connected to the left feeding terminal 23 by a bonding wire 29.

そして、発光装置1に用いられる青色LED3及び赤色LED4の総数は、青色LED3が108個、赤色LED4が90個となっており、青色LED3に対し、赤色LED4は、約0.8倍の個数となっている。なお、青色LED3及び赤色LED4の実装個数や配列は、格別限定されるものではない。   The total number of blue LEDs 3 and red LEDs 4 used in the light emitting device 1 is 108 blue LEDs 3 and 90 red LEDs 4. The number of red LEDs 4 is about 0.8 times that of blue LEDs 3. It has become. The number and arrangement of the blue LEDs 3 and the red LEDs 4 are not particularly limited.

図1及び図2に示すように、枠部材5は、例えば、ディスペンサを用いて所定の粘度を有する未硬化のシリコーン樹脂を基板2上に枠状に塗布し、その後に加熱硬化することにより、基板2上に接着されている。この枠部材5は、四角形状に塗布され、実装パッド22と同様な略四角形状の内周面を有している。枠部材5の内側に、実装パッド22全体が配設され、つまり、青色LED3及び赤色LED4の実装領域は、枠部材5によって囲まれた状態となっている。   As shown in FIGS. 1 and 2, the frame member 5 is formed by, for example, applying a non-cured silicone resin having a predetermined viscosity on the substrate 2 in a frame shape using a dispenser, and then heat-curing it. Bonded on the substrate 2. The frame member 5 is applied in a rectangular shape and has a substantially rectangular inner peripheral surface similar to the mounting pad 22. The entire mounting pad 22 is disposed inside the frame member 5, that is, the mounting regions of the blue LEDs 3 and the red LEDs 4 are surrounded by the frame member 5.

波長変換手段6としての封止部材7は、透光性合成樹脂、例えば、透明シリコーン樹脂製であり、枠部材5の内側に充填されて基板2上に設けられている。封止部材7は、実装パッド22、給電端子23のボンディングワイヤ29の接続部分、各青色LED3及び赤色LED4を覆って封止している。封止部材7の表面が光を外部へ放射する発光面として構成されている。   The sealing member 7 as the wavelength converting means 6 is made of a light-transmitting synthetic resin, for example, a transparent silicone resin, and is provided on the substrate 2 while being filled inside the frame member 5. The sealing member 7 covers and seals the mounting pad 22, the connecting portion of the bonding wire 29 of the power supply terminal 23, and the blue LEDs 3 and the red LEDs 4. The surface of the sealing member 7 is configured as a light emitting surface that emits light to the outside.

封止部材7は、蛍光体を適量含有している。蛍光体は、青色LED3が発する光で励起されて、青色LED3が発する光の色とは異なる色の光を放射する。青色LED3が発する青色光を白色光に変換できるようにするために、蛍光体には青色の光とは補色の関係にある黄色乃至緑色系の500nm〜600nmの波長にピーク波長を有する光を放射する黄色蛍光体が使用されている。封止部材7は、未硬化の状態で枠部材5の内側に所定量注入された後に加熱硬化させて設けられている。そのため、封止部材7の封止面積は枠部材5で規定されている。なお、波長変換手段6としては、蛍光フィルタを用いるようにしてもよい。   The sealing member 7 contains an appropriate amount of phosphor. The phosphor is excited by light emitted from the blue LED 3 and emits light having a color different from that of the light emitted from the blue LED 3. In order to be able to convert the blue light emitted by the blue LED 3 into white light, the phosphor emits light having a peak wavelength at a wavelength of 500 nm to 600 nm of yellow to green, which is complementary to the blue light. A yellow phosphor is used. The sealing member 7 is provided by being heat-cured after being injected into the frame member 5 in a predetermined amount in an uncured state. Therefore, the sealing area of the sealing member 7 is defined by the frame member 5. As the wavelength conversion means 6, a fluorescent filter may be used.

上記のような構成の発光装置1に給電端子23を通じて給電すると、各青色LED3及び赤色LED4が発光する。青色LED3から出射された青色光は、封止部材7中に含有された黄色蛍光体を励起して、黄色蛍光体から黄色乃至緑色系の蛍光に変換されて封止部材7を透過して外部に放射される。さらに、青色LED3から出射された青色光のうち、黄色蛍光体を励起しなかった光は、そのまま封止部材7を透過して外部に放射される。また、赤色LED4から出射された赤色光は、黄色蛍光体を励起することなく封止部材7を透過して外部に放射される。   When power is supplied to the light emitting device 1 having the above-described configuration through the power supply terminal 23, each blue LED 3 and red LED 4 emits light. The blue light emitted from the blue LED 3 excites the yellow phosphor contained in the sealing member 7, is converted from yellow phosphor to yellow to green fluorescence, passes through the sealing member 7, and is externally transmitted. To be emitted. Further, of the blue light emitted from the blue LED 3, the light that has not excited the yellow phosphor passes through the sealing member 7 as it is and is emitted to the outside. Further, the red light emitted from the red LED 4 passes through the sealing member 7 and is emitted to the outside without exciting the yellow phosphor.

また、各青色LED3及び赤色LED4の発光中において、実装パッド22は、青色LED3及び赤色LED4が発した熱を拡散するヒートスプレッダとして機能する。さらに、青色LED3及び赤色LED4が放射した光のうちで基板2側に向かった光は、実装パッド22の表層で主として光の利用方向に反射される。   Further, during the light emission of each blue LED 3 and red LED 4, the mounting pad 22 functions as a heat spreader that diffuses the heat generated by the blue LED 3 and red LED 4. Further, the light emitted from the blue LED 3 and the red LED 4 toward the substrate 2 is reflected mainly by the surface layer of the mounting pad 22 in the light utilization direction.

したがって、発光装置1から、青色LED3からの青色光、黄色蛍光体からの黄色乃至緑色系の光、及び赤色LED4からの赤色光が混色され、相関色温度が2400K〜3600Kの演色性の良好な電球色の光が放射される。   Therefore, the blue light from the blue LED 3, the yellow to green light from the yellow phosphor, and the red light from the red LED 4 are mixed from the light emitting device 1, and the color rendering property with a correlated color temperature of 2400K to 3600K is good. Light bulb color light is emitted.

この場合、赤色LED4から直接的に赤色光が放射されるので、効率良く赤み成分を混色でき、演色性が良好となる。しかし、既述のように、赤色LED4は、温度による特性の変化が大きく、温度の変化によって、大きく発光色が変わってしまう特性を有している。したがって、赤色LED4は、光度を増加させて、すなわち、例えば、個数を増やして演色性を向上する一方、温度による特性変化の影響を軽減するため、制限的に用いる必要がある。   In this case, since red light is directly emitted from the red LED 4, the reddish component can be mixed efficiently and the color rendering properties are improved. However, as described above, the red LED 4 has a characteristic that a change in characteristics due to temperature is large, and a light emission color greatly changes due to a change in temperature. Therefore, the red LED 4 needs to be used in a limited manner in order to increase the luminous intensity, that is, for example, increase the number to improve the color rendering while reducing the influence of the characteristic change due to temperature.

本実施形態では、赤色LED4による演色性の向上と、温度による特性変化の影響の軽減とのバランスのうえに成り立っているものであり、なおかつ、発光装置1はCOB方式を採用していて発光面が大きいため、青色LED3と赤色LED4との光度比に着目して数値を定めたものである。   In the present embodiment, the red LED 4 is based on a balance between the improvement of color rendering properties and the reduction of the influence of characteristic changes due to temperature, and the light emitting device 1 adopts the COB method and emits light. Therefore, the numerical value is determined by paying attention to the luminous intensity ratio between the blue LED 3 and the red LED 4.

本発明者は、演色性及び赤色LED4の温度による発光色の変化について、実験、観察を実施した。   The inventor conducted experiments and observations on the color rendering properties and the change in emission color depending on the temperature of the red LED 4.

実験における測定条件は、積分球を用い、この積分球により封止部材7による封止前の発光装置1の青色LED3及び赤色LED4の光度、及び色温度を測定したもので、青色LED3及び赤色LED4に対する投入電流を変えて、青色LED3及び赤色LED4の光度、及び色温度について複数の測定値を取得した。青色LED3及び赤色LED4の温度は、照明装置41への発光装置1の取付状態での通常使用温度の範囲内であり、つまり青色LED3及び赤色LED4の各素子のジャンクション温度が120℃以下の範囲内とする。なお、青色LED3及び赤色LED4の各素子のジャンクション温度の下限は発光装置1の雰囲気温度である。   The measurement condition in the experiment is that an integrating sphere is used, and the luminous intensity and color temperature of the blue LED 3 and the red LED 4 of the light emitting device 1 before sealing by the sealing member 7 are measured by this integrating sphere. A plurality of measured values were obtained for the luminous intensity and the color temperature of the blue LED 3 and the red LED 4 while changing the input current to the. The temperatures of the blue LED 3 and the red LED 4 are within the normal operating temperature range when the light emitting device 1 is attached to the lighting device 41, that is, the junction temperature of each element of the blue LED 3 and the red LED 4 is within a range of 120 ° C. or less. And The lower limit of the junction temperature of each element of the blue LED 3 and the red LED 4 is the ambient temperature of the light emitting device 1.

測定の結果の一部を図5の表に示す。色温度2874K及び3283Kのときの青色LED3の光度及び赤色LED4の光度を測定して、青色LED3の光度に対する赤色LED4の光度の比率を求めた結果を示す。また、色温度2500K、3000K、3500Kについて同様に測定して、青色LED3の光度に対する赤色LED4の光度の比率を求めた結果を図6に示す。   A part of the measurement results is shown in the table of FIG. The results of measuring the luminous intensity of the blue LED 3 and the luminous intensity of the red LED 4 at the color temperatures 2874K and 3283K and determining the ratio of the luminous intensity of the red LED 4 to the luminous intensity of the blue LED 3 are shown. FIG. 6 shows the result of measuring the color temperatures of 2500K, 3000K, and 3500K in the same manner and determining the ratio of the luminous intensity of the red LED 4 to the luminous intensity of the blue LED 3.

図7には、図5及び図6に示す測定の結果に基づいて作成したグラフを示す。図7のグラフの横軸は相対色温度、縦軸は青色LED3の光度に対する赤色LED4の光度の比率を示し、図7のグラフ中の3つの線のうち、中央の線は図5及び図6の表に示す複数の実測値をつないだ線である。さらに、図7のグラフ中の中央の線に対して上下の2つの線は、封止部材7に含有する黄色蛍光体で変換する光が短波長か長波長かといった波長の長さの範囲に応じて導き出された許容値の範囲である。   FIG. 7 shows a graph created based on the measurement results shown in FIGS. The horizontal axis of the graph of FIG. 7 shows the relative color temperature, the vertical axis shows the ratio of the luminous intensity of the red LED 4 to the luminous intensity of the blue LED 3, and among the three lines in the graph of FIG. This is a line connecting a plurality of actual measurement values shown in the table. Furthermore, the upper and lower two lines with respect to the central line in the graph of FIG. 7 fall within the wavelength range such as whether the light converted by the yellow phosphor contained in the sealing member 7 is a short wavelength or a long wavelength. The range of tolerances derived accordingly.

図8には、測定結果に基づき、相関色温度が2400Kと3600Kとにおいて、青色LED3の光度に対する赤色LED4の光度の比率の下限値及び上限値を計算により求めた計算値を示す。   FIG. 8 shows calculated values obtained by calculating the lower limit value and the upper limit value of the ratio of the luminous intensity of the red LED 4 to the luminous intensity of the blue LED 3 when the correlated color temperature is 2400K and 3600K based on the measurement result.

このような測定の結果から、照明装置41への発光装置1の取付状態での通常使用温度の範囲内において、つまり点灯状態の青色LED3及び赤色LED4の各素子のジャンクション温度120℃以下の範囲内において、相関色温度が2400K〜3600Kの演色性の良好な電球色の光を得るには、青色LED3の光度に対し、赤色LED4の光度が1.7倍以下0.2倍以上、つまり0.2倍以上1.7倍以下となるように設定するのが望ましいとの見解を得た。   As a result of such measurement, within the range of the normal use temperature in the state in which the light emitting device 1 is attached to the lighting device 41, that is, within the range where the junction temperature of each element of the blue LED 3 and the red LED 4 in the lit state is 120 ° C. or lower. In order to obtain light bulb color light having a correlated color temperature of 2400K to 3600K and good color rendering, the luminous intensity of the red LED 4 is 1.7 times or less and 0.2 times or more, that is, 0. The opinion that it is desirable to set it to be 2 times or more and 1.7 times or less was obtained.

また、観察によれば、青色LED3に対し、赤色LED4の光度が、0.2倍未満であると、赤み成分が少なくなって演色性が悪くなることを確認した。また、1.7倍を超えても2.5倍未満であれば、赤み成分が多くなるものの電球色として許容できる範囲内にあるが、2.5倍を超えると、赤み成分が多くなりすぎて電球色からは外れてしまうとともに、赤色LED4の温度による発光色の変化の影響の度合いが顕著になることを確認した。   Further, according to observation, it was confirmed that when the luminous intensity of the red LED 4 is less than 0.2 times that of the blue LED 3, the redness component is reduced and the color rendering is deteriorated. Moreover, if it exceeds 1.7 times and is less than 2.5 times, the reddish component increases, but it is within the allowable range as the color of the bulb, but if it exceeds 2.5 times, the reddish component increases too much. As a result, it was confirmed that the degree of the influence of the change in the emission color due to the temperature of the red LED 4 becomes significant.

そして、本実施形態の赤色LED4は青色LED3に比較して温度が上昇することに伴う出力低下の率が大きく、青色LED3及び赤色LED4の温度が上昇した場合には赤色LED4の光度が減少し、赤み成分が減るため、青色LED3の光度に対し、赤色LED4の光度の比率が小さくなる傾向がある。また、その逆に、青色LED3及び赤色LED4の温度が低下した場合には、赤色LED4の光度が増加し、赤み成分が増えるため、青色LED3の光度に対し、赤色LED4の光度の比率が大きくなる傾向がある。   And, the red LED 4 of the present embodiment has a large rate of output decrease as the temperature rises compared to the blue LED 3, and when the temperature of the blue LED 3 and the red LED 4 rises, the luminous intensity of the red LED 4 decreases, Since the red component is reduced, the ratio of the luminous intensity of the red LED 4 to the luminous intensity of the blue LED 3 tends to be small. On the other hand, when the temperature of the blue LED 3 and the red LED 4 decreases, the luminous intensity of the red LED 4 increases and the redness component increases. Therefore, the ratio of the luminous intensity of the red LED 4 to the luminous intensity of the blue LED 3 increases. Tend.

したがって、実験、観察を実施した結果から、このような温度特性の赤色LED4および青色LED3を用いた発光装置1を通常使用温度の範囲内において照明装置41に取り付けた状態で使用した場合、つまり点灯状態の青色LED3及び赤色LED4の各素子のジャンクション温度120℃以下の場合であって、相関色温度が2400K〜3600Kの範囲内において青色LED3の光度に対し、赤色LED4の光度を0.2倍以上2.5倍以下となるよう設定するのが望ましく、より好ましくは0.2倍以上1.7倍以下となるように設定するのが望ましいとの見解を得た。要するに、青色LED3の光度に対し、赤色LED4の光度の比率が0.2倍以上2.5倍以下の範囲、より好ましくは0.2倍以上1.7倍以下の範囲にあれば、温度変化による色温度の変化は許容されるものである。   Therefore, based on the results of experiments and observations, when the light emitting device 1 using the red LED 4 and the blue LED 3 having such temperature characteristics is used in a state of being attached to the lighting device 41 within the range of the normal use temperature, that is, lighting When the junction temperature of each element of the blue LED 3 and the red LED 4 in the state is 120 ° C. or lower, and the correlated color temperature is in the range of 2400K to 3600K, the luminous intensity of the red LED 4 is 0.2 times or more with respect to the luminous intensity of the blue LED 3 The opinion was obtained that it is desirable to set it to be 2.5 times or less, more preferably 0.2 to 1.7 times. In short, if the ratio of the luminous intensity of the red LED 4 to the luminous intensity of the blue LED 3 is in the range of 0.2 to 2.5 times, more preferably in the range of 0.2 to 1.7 times, the temperature change The change in color temperature due to is acceptable.

本実施形態では、青色LED3及び赤色LED4の点灯時において、一例として、青色LED3及び赤色LED4の各素子のジャンクションが約90℃のときに、青色LED3に対し、赤色LED4の光度が1.1倍であって、相関色温度が2900Kになるように、青色LED3及び赤色LED4の特性や個数等を考慮して設計されている。これにより、演色性が良好で、赤色LED4の温度による特性の変化の影響が少ない相関色温度が2400K〜3600Kの電球色の発光が可能となる。   In the present embodiment, when the blue LED 3 and the red LED 4 are turned on, as an example, when the junction of each element of the blue LED 3 and the red LED 4 is about 90 ° C., the luminous intensity of the red LED 4 is 1.1 times that of the blue LED 3. And, it is designed in consideration of the characteristics and number of blue LEDs 3 and red LEDs 4 so that the correlated color temperature is 2900K. As a result, it is possible to emit light of a light bulb color having a correlated color temperature of 2400K to 3600K that has good color rendering properties and is less affected by changes in characteristics due to the temperature of the red LED 4.

なお、蛍光体の量子効率は、50%〜95%の範囲で使用することが好ましく、この範囲の量子効率の蛍光体と、青色LED3に対し、赤色LED4の光度を0.2倍以上2.5倍以下とする各素子とを組み合わせて2400K〜3600Kの色温度を実現するのが好適である。   The quantum efficiency of the phosphor is preferably used in the range of 50% to 95%, and the luminous intensity of the red LED 4 is 0.2 times or more of the phosphor with the quantum efficiency in this range and the blue LED 3. It is preferable to realize a color temperature of 2400K to 3600K by combining with each element that is 5 times or less.

なお、本実施形態において、例えば、全光状態から調光状態にする場合には、上記の記載から理解できるように、調光状態の電流値は、全光状態の電流値より低いものであるため、調光状態の方が全光状態に比較して各素子のジャンクション温度が低くなる。すると、全光状態に比べて調光状態の方が赤み成分が多くなるので色温度が高くなる。この調光状態における赤み成分の変化の度合は、白熱電球と同様の傾向を示すものであるため、白熱電球代替に用いる場合には非常に好適な状態である。   In this embodiment, for example, when changing from the all-light state to the dimming state, as can be understood from the above description, the current value in the dimming state is lower than the current value in the all-light state. Therefore, the junction temperature of each element is lower in the dimming state than in the all-light state. Then, since the red component increases in the dimming state compared to the all-light state, the color temperature increases. The degree of change of the redness component in this dimming state shows a tendency similar to that of an incandescent bulb, and is therefore a very suitable state when used as an alternative to an incandescent bulb.

以上のように、本実施形態によれば、照明装置41への発光装置1の取付状態での通常使用温度の範囲内において、つまり点灯状態の青色LED3及び赤色LED4の各素子のジャンクション温度120℃以下の範囲内において、青色LED3の光度に対し、赤色LED4の光度を0.2倍以上2.5倍以下とし、より好ましくは0.2倍以上1.7倍以下とすることにより、演色性が良好で、発光効率を向上できるとともに、赤色LED4の温度による発光色の変化の影響を軽減することができる発光装置1を提供することができる。   As described above, according to the present embodiment, the junction temperature of each element of the blue LED 3 and the red LED 4 in the lit state is 120 ° C. within the range of the normal use temperature when the light emitting device 1 is attached to the lighting device 41. Within the following range, the color rendering property of the red LED 4 is 0.2 to 2.5 times, more preferably 0.2 to 1.7 times the light intensity of the blue LED 3. Thus, it is possible to provide the light emitting device 1 that can improve the light emission efficiency and reduce the influence of the change in the light emission color due to the temperature of the red LED 4.

また、青色LED3と赤色LED4とは、交互に配置されているので、青色LED3から出射される光と赤色LED4から出射される光との混色が良好となり、所期の光色を得ることができる。   Further, since the blue LED 3 and the red LED 4 are alternately arranged, the color mixture of the light emitted from the blue LED 3 and the light emitted from the red LED 4 becomes good, and an intended light color can be obtained. .

さらに、青色LED3と赤色LED4とを封止部材7で一体に封止しているため、青色LED3の温度と赤色LED4の温度とを均一化でき、青色LED3の特性と赤色LED4の特性とのばらつきが少なくなり、青色LED3から出射される光と赤色LED4から出射される光との混色が良好となり、所期の光色を得ることができる。また、青色LED3と赤色LED4とを封止部材7で一体に封止できるので、製造性も良い。   Furthermore, since the blue LED 3 and the red LED 4 are integrally sealed by the sealing member 7, the temperature of the blue LED 3 and the temperature of the red LED 4 can be made uniform, and the variation between the characteristics of the blue LED 3 and the characteristics of the red LED 4 can be achieved. , The color mixture of the light emitted from the blue LED 3 and the light emitted from the red LED 4 becomes good, and the desired light color can be obtained. Moreover, since blue LED3 and red LED4 can be integrally sealed with the sealing member 7, manufacturability is also good.

さらに、青色LED3と赤色LED4とは、直列に接続された直列回路30を有しているので、青色LED3と赤色LED4とをそれぞれ別個の回路で点灯制御することなく、これらを1つの制御系で点灯制御することが可能となり、制御系を簡素化できる。例えば、直列回路30の中で、青色LED3と赤色LED4との個数を選択して混色した所定の光色を実現できる。   Furthermore, since the blue LED 3 and the red LED 4 have a series circuit 30 connected in series, the blue LED 3 and the red LED 4 can be controlled by a single control system without lighting control using separate circuits. Lighting control can be performed, and the control system can be simplified. For example, a predetermined light color can be realized by selecting the number of blue LEDs 3 and red LEDs 4 in the series circuit 30 and mixing the colors.

次に、発光装置1を照明装置41に適用した例を図9及び図10を参照して説明する。   Next, the example which applied the light-emitting device 1 to the illuminating device 41 is demonstrated with reference to FIG.9 and FIG.10.

図9において、照明装置41として電球形のLEDランプ42が示されている。LEDランプ42は、発光装置1、この発光装置1と熱的に結合された装置本体42a、発光装置1を点灯制御する点灯回路42b、この点灯回路42bが収納されたカバー部材42c、カバー部材42cに取付けられた口金42d、及び発光装置1を覆って装置本体42aに取付けられたグローブ42eを備えて構成されている。   In FIG. 9, a light bulb-shaped LED lamp 42 is shown as the illumination device 41. The LED lamp 42 includes a light emitting device 1, a device main body 42a that is thermally coupled to the light emitting device 1, a lighting circuit 42b that controls lighting of the light emitting device 1, a cover member 42c that houses the lighting circuit 42b, and a cover member 42c. 42 d and a globe 42 e that covers the light emitting device 1 and is attached to the apparatus main body 42 a.

装置本体42aは、例えば、熱伝導性が良好なアルミニウム等の金属材料からなり、一端側から他端側へ向かって徐々に拡径された略円柱をなし、外周面には複数の放熱フィンが一体に形成されている。   The device main body 42a is made of, for example, a metal material such as aluminum having good thermal conductivity, and has a substantially cylindrical shape whose diameter is gradually expanded from one end side to the other end side, and a plurality of radiating fins are provided on the outer peripheral surface. It is integrally formed.

点灯回路42bは、四角形平板状の点灯回路基板に回路部品が実装されて構成されている。点灯回路基板には、その両面に亘って、トランジスタ、抵抗素子、定電圧ダイオード、全波整流器及びコンデンサ等の回路部品が実装されている。また、点灯回路基板は、長手方向を上下に縦形配置して、PBT樹脂等の絶縁性を有する材料により形成されたカバー部材42c内に収納されている。なお、発光装置1と点灯回路42bとは、装置本体42aに設けられている図示しない配線孔を挿通するリード線によって電気的に接続されている。   The lighting circuit 42b is configured by mounting circuit components on a rectangular flat lighting circuit board. Circuit components such as a transistor, a resistance element, a constant voltage diode, a full-wave rectifier, and a capacitor are mounted on both sides of the lighting circuit board. Further, the lighting circuit board is vertically arranged vertically and is housed in a cover member 42c formed of an insulating material such as PBT resin. The light emitting device 1 and the lighting circuit 42b are electrically connected by a lead wire that passes through a wiring hole (not shown) provided in the device main body 42a.

このように構成されたLEDランプ42によれば、点灯回路42bを通じて発光装置1に給電することにより、グローブ42eを透過して効率よく所期の光色の放射を得ることができる。   According to the LED lamp 42 configured in this way, by supplying power to the light-emitting device 1 through the lighting circuit 42b, it is possible to efficiently transmit the desired light color through the globe 42e.

また、図10において、照明装置41として天井に埋め込んで使用されるダウンライト43を示している。ダウンライト43は、発光装置1、この発光装置1が収容された装置本体43a、この装置本体43aに取付けられた配光部材43b、発光装置1を覆って前方に配設された透光性のカバー43c、発光装置1に電力を供給する図示しない電源ユニットを備えている。また、装置本体43aの外周側には、取付用板ばね43dが装着されている。   FIG. 10 shows a downlight 43 that is used as a lighting device 41 embedded in a ceiling. The downlight 43 includes a light emitting device 1, a device main body 43 a in which the light emitting device 1 is accommodated, a light distribution member 43 b attached to the device main body 43 a, and a translucent light disposed in front of the light emitting device 1. A cover 43c and a power supply unit (not shown) for supplying power to the light emitting device 1 are provided. An attachment leaf spring 43d is mounted on the outer peripheral side of the apparatus main body 43a.

装置本体43aは、熱伝導性の良好な材料、例えば、アルミニウム合金製のダイカストで形成されている。また、装置本体43aの外面には、鉛直方向に延びる複数の放熱フィンが形成されている。   The apparatus main body 43a is formed of a material having good thermal conductivity, for example, an aluminum alloy die casting. In addition, a plurality of heat radiation fins extending in the vertical direction are formed on the outer surface of the apparatus main body 43a.

このように構成されたダウンライト43によれば、電源ユニットを通じて発光装置1に給電することにより、カバー43cを透過して配光部材43bによって制御された所期の光色の放射を得ることができる。   According to the downlight 43 configured in this way, by supplying power to the light emitting device 1 through the power supply unit, it is possible to obtain the desired light color emission that is transmitted through the cover 43c and controlled by the light distribution member 43b. it can.

次に、第2の実施形態を、図11を参照して説明する。なお、第1の実施形態と同一又は相当部分には同一符号を付し重複した説明は省略する。   Next, a second embodiment will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the part which is the same as that of 1st Embodiment, or an equivalent part, and the overlapping description is abbreviate | omitted.

本実施形態では、青色LED3の個々の配置において、青色LED3の一対の素子電極27の並びが図中左右方向の素子列が延びる方向と直交する方向になるように配置したものである。これにより、素子列が延びる方向の寸法を小さくすることが可能となる。   In the present embodiment, in the individual arrangement of the blue LEDs 3, the arrangement of the pair of element electrodes 27 of the blue LEDs 3 is arranged in a direction orthogonal to the direction in which the element rows in the left-right direction in the drawing extend. This makes it possible to reduce the dimension in the direction in which the element row extends.

青色LED3と赤色LED4とは、実装パッド22上に交互に並べられて、6個の直列回路が相互に並列に接続されている。   The blue LED 3 and the red LED 4 are alternately arranged on the mounting pad 22, and six series circuits are connected in parallel to each other.

そして、照明装置41への発光装置1の取付状態での通常使用温度の範囲内において、つまり点灯状態の青色LED3及び赤色LED4の各素子のジャンクション温度が120℃以下の範囲内において、青色LED3の光度に対し、赤色LED4の光度が0.2倍以上2.5倍以下の範囲に設定され、より好ましくは0.2倍以上1.7倍以下の範囲に設定されている。   And in the range of the normal use temperature in the attachment state of the light-emitting device 1 to the illuminating device 41, that is, in the range where the junction temperature of each element of the blue LED 3 and the red LED 4 in the lighting state is 120 ° C. or less, the blue LED 3 The luminous intensity of the red LED 4 is set in the range of 0.2 to 2.5 times, and more preferably in the range of 0.2 to 1.7 times the luminous intensity.

したがって、第2の実施形態によれば、上述した第1の実施形態と同様の作用効果を奏することができる。   Therefore, according to 2nd Embodiment, there can exist an effect similar to 1st Embodiment mentioned above.

次に、第3の実施形態を、図12を参照して説明する。なお、第1の実施形態と同一又は相当部分には同一符号を付し重複した説明は省略する。   Next, a third embodiment will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the part which is the same as that of 1st Embodiment, or an equivalent part, and the overlapping description is abbreviate | omitted.

本実施形態では、赤色LED4を両側の給電端子23側に寄せて配置したものである。つまり、赤色LED4を実装パッド22の両側に寄せて実装したものである。   In the present embodiment, the red LEDs 4 are arranged close to the power supply terminals 23 on both sides. That is, the red LED 4 is mounted on both sides of the mounting pad 22.

青色LED3と赤色LED4とは、実装パッド22上に並べられて、5個の直列回路30が相互に並列に接続されている。1つの直列回路30をとってみると、まず、図示上、右側の給電端子23に接続されたボンディングワイヤ29が赤色LED4の正極側の素子電極28に接続され、さらに、この赤色LED4の負極側の素子電極28がボンディングワイヤ29によって、隣接する赤色LED4の正極側の素子電極28に接続され、次いで、この赤色LED4の負極側の素子電極28がボンディングワイヤ29によって、青色LED3の正極側の素子電極27に接続されている。以降、青色LED3の素子電極27がボンディングワイヤ29によって順次接続され、左側の2個の赤色LED4へと接続され、左側の給電端子23に接続されている。   The blue LED 3 and the red LED 4 are arranged on the mounting pad 22 and five series circuits 30 are connected in parallel to each other. When one series circuit 30 is taken, first, in the drawing, the bonding wire 29 connected to the right power supply terminal 23 is connected to the element electrode 28 on the positive side of the red LED 4, and further, the negative side of the red LED 4 is connected. The element electrode 28 of the red LED 4 is connected to the element electrode 28 on the positive side of the adjacent red LED 4 by the bonding wire 29, and then the element electrode 28 on the negative side of the red LED 4 is connected to the element on the positive side of the blue LED 3 by the bonding wire 29. It is connected to the electrode 27. Thereafter, the element electrode 27 of the blue LED 3 is sequentially connected by the bonding wire 29, connected to the two left red LEDs 4, and connected to the left power supply terminal 23.

そして、上記各実施形態と同様に、照明装置41への発光装置1の取付状態での通常使用温度の範囲内において、つまり点灯状態の青色LED3及び赤色LED4の各素子のジャンクション温度が120℃以下の範囲内において、青色LED3の光度に対し、赤色LED4の光度が0.2倍以上2.5倍以下の範囲に設定され、より好ましくは0.2倍以上1.7倍以下の範囲に設定されている。   And like said each embodiment, in the range of the normal use temperature in the attachment state of the light-emitting device 1 to the illuminating device 41, that is, the junction temperature of each element of the blue LED3 and red LED4 of a lighting state is 120 degrees C or less. In this range, the luminous intensity of the red LED 4 is set in the range of 0.2 to 2.5 times, more preferably in the range of 0.2 to 1.7 times the luminous intensity of the blue LED 3. Has been.

したがって、第3の実施形態によれば、第1の実施形態の作用効果に加え、赤色LED4の温度変化による特性の変化の影響をより軽減することが可能となる。つまり、基板2上に複数の青色LED3及び複数の赤色LED4が実装された場合、基板2の中央部の温度が上昇しやすく、温度変化が大きくなる傾向となる。そこで、赤色LED4を基板2の端部側、すなわち、中央部に配置しないようにすることにより、赤色LED4が温度変化を受ける度合いを少なくすることができる。   Therefore, according to the third embodiment, in addition to the operational effects of the first embodiment, it is possible to further reduce the influence of the characteristic change due to the temperature change of the red LED 4. That is, when a plurality of blue LEDs 3 and a plurality of red LEDs 4 are mounted on the substrate 2, the temperature of the central portion of the substrate 2 tends to rise, and the temperature change tends to increase. Therefore, the degree to which the red LED 4 is subjected to a temperature change can be reduced by not arranging the red LED 4 at the end portion side of the substrate 2, that is, at the center portion.

次に、第4の実施形態を、図13を参照して説明する。なお、第1の実施形態と同一又は相当部分には同一符号を付し重複した説明は省略する。   Next, a fourth embodiment will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the part which is the same as that of 1st Embodiment, or an equivalent part, and the overlapping description is abbreviate | omitted.

本実施形態では、赤色LED4を並列に接続したものを、青色LED3と交互に直列接続して配置し、直列回路30を構成したものである。そして、これら各赤色LED4と青色LED3との間には、四角形状の接続導体32が絶縁性の接着剤によって接着されている。この直列回路30が9個設けられており、これらが電源側に対して相互に並列に接続されるようになっている。   In the present embodiment, the red LED 4 connected in parallel is arranged in series with the blue LED 3 alternately to constitute a series circuit 30. And between each of these red LEDs 4 and blue LEDs 3, a rectangular connection conductor 32 is bonded with an insulating adhesive. Nine series circuits 30 are provided, and these are connected in parallel to the power supply side.

より詳しくは、1つの直列回路30をとってみると、図示上、右側の給電端子23に接続されたボンディングワイヤ29が青色LED3の正極側の素子電極27に接続され、この青色LED3の負極側の素子電極27が接続導体32に接続されている。さらに、この接続導体32に2本のボンディングワイヤ29が接続され、これらボンディングワイヤ29がそれぞれ隣接する2個の赤色LED4の正極側の素子電極28に接続されている。次いで、この2個の赤色LED4の負極側の素子電極28に接続された各ボンディングワイヤ29が接続導体32に接続され、この接続導体32と隣接する青色LED3の正極側の素子電極27とがボンディングワイヤ29によって接続されている。このように順次青色LED3と赤色LED4とは、ボンディングワイヤ29によって接続されている。   More specifically, when one series circuit 30 is taken, in the drawing, the bonding wire 29 connected to the right power supply terminal 23 is connected to the element electrode 27 on the positive side of the blue LED 3, and the negative side of the blue LED 3. The element electrode 27 is connected to the connection conductor 32. Further, two bonding wires 29 are connected to the connection conductor 32, and these bonding wires 29 are connected to the element electrodes 28 on the positive side of the two adjacent red LEDs 4, respectively. Next, each bonding wire 29 connected to the device electrode 28 on the negative side of the two red LEDs 4 is connected to the connection conductor 32, and the device electrode 27 on the positive side of the blue LED 3 adjacent to this connection conductor 32 is bonded. Connected by wire 29. Thus, the blue LED 3 and the red LED 4 are sequentially connected by the bonding wire 29.

そして、上記各実施形態と同様に、照明装置41への発光装置1の取付状態での通常使用温度の範囲内において、つまり点灯状態の青色LED3及び赤色LED4の各素子のジャンクション温度が120℃以下の範囲内において、青色LED3の光度に対し、赤色LED4の光度が0.2倍以上2.5倍以下の範囲に設定され、より好ましくは0.2倍以上1.7倍以下の範囲に設定されている。   And like said each embodiment, in the range of the normal use temperature in the attachment state of the light-emitting device 1 to the illuminating device 41, that is, the junction temperature of each element of the blue LED3 and red LED4 of a lighting state is 120 degrees C or less. In this range, the luminous intensity of the red LED 4 is set in the range of 0.2 to 2.5 times, more preferably in the range of 0.2 to 1.7 times the luminous intensity of the blue LED 3. Has been.

したがって、第4の実施形態によれば、第1の実施形態の作用効果に加え、赤色LED4を並列に接続することにより、赤色LED4に流れる電流を少なくすることができる。したがって、電流の増加によって効率の低下が大きい赤色LED4の効率の低下を抑制することができる。   Therefore, according to the fourth embodiment, in addition to the operational effects of the first embodiment, the current flowing through the red LED 4 can be reduced by connecting the red LEDs 4 in parallel. Therefore, it is possible to suppress a decrease in efficiency of the red LED 4 that greatly decreases in efficiency due to an increase in current.

次に、第5の実施形態を、図14を参照して説明する。なお、第1の実施形態と同一又は相当部分には同一符号を付し重複した説明は省略する。   Next, a fifth embodiment will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the part which is the same as that of 1st Embodiment, or an equivalent part, and the overlapping description is abbreviate | omitted.

本実施形態は、第1の実施形態を前提に、第1の実施形態における封止部材7に含有された500nm〜600nmの波長にピーク波長を有する光を放射する黄色蛍光体(第1の蛍光体)に加え、これよりも長波長側に変換する蛍光体(第2の蛍光体)を含有させたものである。   In the present embodiment, on the premise of the first embodiment, a yellow phosphor (first fluorescence) that emits light having a peak wavelength at a wavelength of 500 nm to 600 nm contained in the sealing member 7 in the first embodiment. In addition to the phosphor, a phosphor (second phosphor) that converts to a longer wavelength side than this is contained.

具体的には、基板2に青色LED3及び赤色LED4を実装し、その上を第1の蛍光体と第2の蛍光体との2種類の蛍光体を含有させた封止部材7で覆うものである。つまり、青色LED3及び赤色LED4を、青色LED3から出射された青色光によって励起されて黄色乃至緑色系の蛍光を発する黄色蛍光体と、同様に、青色LED3から出射された青色光によって励起されて赤色の蛍光を発する赤色蛍光体とを所望の混合比で混入させた封止部材7で封止するようになっている。   Specifically, the blue LED 3 and the red LED 4 are mounted on the substrate 2, and the top is covered with a sealing member 7 containing two kinds of phosphors, a first phosphor and a second phosphor. is there. That is, the blue LED 3 and the red LED 4 are excited by the blue light emitted from the blue LED 3 to emit yellow or green fluorescence, and similarly, the blue LED 3 and the red LED 4 are excited by the blue light emitted from the blue LED 3 to be red. It seals with the sealing member 7 which mixed red fluorescent substance which emits this fluorescence with a desired mixing ratio.

このような構成により、図14に示すような分光スペクトルが得られる。図14において、横軸は波長(nm)を示しており、縦軸は相対強度を示している。この図からも分かるように、第2の蛍光体によって長波長側の光が追加され、赤み成分の不足を補うことが可能となる。   With such a configuration, a spectrum as shown in FIG. 14 is obtained. In FIG. 14, the horizontal axis indicates the wavelength (nm) and the vertical axis indicates the relative intensity. As can be seen from this figure, light on the long wavelength side is added by the second phosphor, and it becomes possible to compensate for the shortage of the red component.

したがって、第5の実施形態によれば、青色LED3及び赤色LED4によって発光効率が向上でき、一方、赤み成分を赤色蛍光体を用いて補うことにより、赤色LED4の光度を少なくして、赤色LED4の温度変化による特性変化の影響を少なくすることが可能となる。   Therefore, according to the fifth embodiment, the light emission efficiency can be improved by the blue LED 3 and the red LED 4, while the red LED 4 is used to supplement the reddish component to reduce the luminous intensity of the red LED 4. It is possible to reduce the influence of the characteristic change due to the temperature change.

次に、第6の実施形態を、図15及び図16を参照して説明する。なお、第1の実施形態と同一又は相当部分には同一符号を付し重複した説明は省略する。   Next, a sixth embodiment will be described with reference to FIGS. 15 and 16. In addition, the same code | symbol is attached | subjected to the part which is the same as that of 1st Embodiment, or an equivalent part, and the overlapping description is abbreviate | omitted.

本実施形態は、第3の実施形態における基板2に実装された青色LED3及び赤色LED4(第1の赤色LED4a)に加え、第2の赤色LED4bを実装するものである。この第2の赤色LED4bは、図15の発光スペクトルに示すように第1の赤色LED4aより長波長の625nm〜645nmの発光波長を有するものである。このような構成により、赤み成分を補い、さらに演色性の向上を図ることができる。   In the present embodiment, a second red LED 4b is mounted in addition to the blue LED 3 and the red LED 4 (first red LED 4a) mounted on the substrate 2 in the third embodiment. The second red LED 4b has a longer emission wavelength of 625 nm to 645 nm than the first red LED 4a as shown in the emission spectrum of FIG. With such a configuration, it is possible to supplement the reddish component and further improve the color rendering properties.

図16に示すように、例えば、第2の赤色LED4bは、中央の3列の素子列において配置するようにしてもよい。具体的には、素子列における両側の第1の赤色LED4aに隣接して配置されている。また、この場合、第2の赤色LED4bは、発光効率が低いので第1の赤色LED4aの光度よりも低く設定するのが好ましい。例えば、第1の赤色LED4aが14個実装されているのに対し、第2の赤色LED4bは6個実装されるようになっている。   As shown in FIG. 16, for example, the second red LEDs 4b may be arranged in the central three element rows. Specifically, it is disposed adjacent to the first red LEDs 4a on both sides in the element row. In this case, the second red LED 4b is preferably set lower than the luminous intensity of the first red LED 4a because the luminous efficiency is low. For example, 14 first red LEDs 4a are mounted, whereas 6 second red LEDs 4b are mounted.

なお、照明装置41としては、光源や屋内又は屋外で使用される照明器具、ディスプレイ装置等に適用が可能である。   The lighting device 41 can be applied to a light source, a lighting fixture used indoors or outdoors, a display device, and the like.

本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

1 発光装置
2 基板
3 青色発光LED素子
4 赤色発光LED素子
6 波長変換手段
30 直列回路
41 照明装置
42a,43a 装置本体
DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Board | substrate 3 Blue light emission LED element 4 Red light emission LED element 6 Wavelength conversion means
30 series circuit
41 Lighting equipment
42a, 43a Main unit

Claims (4)

照明装置に取り付けられ、放射される光の相関色温度が2400K〜3600Kの発光装置であって、
基板と;
この基板に実装された青色発光LED素子と;
前記基板に実装され、前記照明装置への取付状態での通常使用温度において、前記青色発光LED素子の光度に対し、0.2倍以上2.5倍以下の光度である赤色発光LED素子と;
前記青色発光LED素子から出射される光に励起されて、その光を500nm〜600nmの波長にピークを有する光に変換する波長変換手段と;
を具備することを特徴とする発光装置。
A light emitting device attached to a lighting device and having a correlated color temperature of emitted light of 2400K to 3600K,
A substrate;
A blue light emitting LED element mounted on the substrate;
A red light-emitting LED element mounted on the substrate and having a light intensity of 0.2 to 2.5 times the light intensity of the blue light-emitting LED element at a normal use temperature when attached to the lighting device;
Wavelength conversion means that is excited by light emitted from the blue light emitting LED element and converts the light into light having a peak at a wavelength of 500 nm to 600 nm;
A light-emitting device comprising:
前記青色発光LED素子と前記赤色発光LED素子とが直列に接続された直列回路を有することを特徴とする請求項1に記載の発光装置。   The light emitting device according to claim 1, further comprising a series circuit in which the blue light emitting LED element and the red light emitting LED element are connected in series. 前記青色発光LED素子及び前記赤色発光LED素子は、前記基板に複数実装されており、これらは交互に配置されていることを特徴とする請求項1又は請求項2に記載の発光装置。   3. The light emitting device according to claim 1, wherein a plurality of the blue light emitting LED elements and the red light emitting LED elements are mounted on the substrate, and these are alternately arranged. 装置本体と;
装置本体に配設された請求項1乃至請求項3のいずれか一に記載の発光装置と;
を具備することを特徴とする照明装置。
The device body;
The light emitting device according to any one of claims 1 to 3, wherein the light emitting device is disposed in the device body;
An illumination device comprising:
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