JP2011202066A - Joint filling material for tile, and tile panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a joint filling material for a tile which is hard to generate nitrogen oxide and also has a small combustion heat quantity even in the event of fire; and to provide a tile panel prepared by using the material.SOLUTION: The joint filling material for a tile comprising an epoxy resin composition and a curing agent composition added to the epoxy resin composition is characterized in that the curing agent of the curing agent composition is at least one selected from methyltetrahydrophthalic acid anhydride, methylhexahydrophthalic anhydride, methylnadic acid anhydride, hydrogenated methylnadic acid anhydride and trialkyltetrahydrophtalic acid anhydride. The tile panel is prepared by filling a joint gap with a joint material containing the joint filling material.

Description

  The present invention relates to a tile joint material that is jointed to joints between tiles, and a tile panel using the tile joint material.

  A tile panel is formed by connecting and integrating a plurality of tiles in advance, and often fills joint spaces between the tiles with joint materials.

  The joint joint method is used as a joint filling method. The joint joint method is a joint filling method in which a slurry joint material is spread and filled in the joint, and then the joint material on the tile surface is wiped off (for example, Patent Document 2 below).

  As a joint material, an epoxy joint material using an epoxy resin as a binder is widely used (Patent Document 1 below). In Patent Document 1, as a curing agent for this epoxy joint material, aliphatic amines such as diethylenetriamine and triethylenetetramine, aromatic amines such as m-phenylenediamine and diaminodiphenylmethane, phthalic anhydride, hexahydrophthalic anhydride, It describes acid anhydrides such as tetrahydrophthalic acid anhydride and pyromellitic acid anhydride, polysulfide, acid amide, thiocol and the like.

JP2009-1818 JP2008-163211

  When the curing agent for the epoxy tile joint material is an amine, nitrogen oxides are generated in a fire.

  An object of the present invention is to provide a tile joint material that hardly generates nitrogen oxides even in the event of a fire and has a small amount of combustion heat, and a tile panel using the same.

  The tile joint material of the present invention (Claim 1) is a tile joint material comprising an epoxy resin composition and a curing agent composition added to the epoxy resin composition, and the curing of the curing agent composition. The agent is at least one selected from the group consisting of methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, and trialkyltetrahydrophthalic anhydride. It is a feature.

  The tile joint material according to claim 2 is characterized in that, in claim 1, the curing agent is methyltetrahydrophthalic anhydride or methylhexahydrophthalic anhydride.

  The tile panel of the present invention (Claim 3) is one in which a joint material including the aggregate and the joint material for tile of Claim 1 or 2 is filled in the joint gap.

  The curing agent used in the present invention is methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic acid anhydride, hydrogenated methylnadic acid anhydride, or trialkyltetrahydrophthalic anhydride, and has a nitrogen atom in the molecule. No nitrogen oxides are generated when the joints burn in the event of a fire. Moreover, this hardening | curing agent contains many oxygen atoms in a molecule | numerator, and there are relatively few ratios of C (carbon) and H (hydrogen) atom. Therefore, the amount of combustion heat is also low.

  Note that methyltetrahydrophthalic anhydride and methylhexahydrophthalic anhydride are preferred because of low viscosity at room temperature. Further, methylhexahydrophthalic anhydride is preferable because it is colorless and transparent.

  In this invention, when a hardening | curing agent is liquid at 0-40 degreeC, the viscosity of a mixture when an epoxy resin composition and a hardening | curing agent are mixed is low. Therefore, joint filling can be performed even if a large amount of aggregate is contained in the joint material. When the aggregate content is increased, the proportions of the epoxy resin composition and the curing agent composition are relatively reduced. As a result, the amount of combustion heat of the joint material becomes small.

  The tile panel in which the joint material is filled in the joint gap is suitable for installation on the wall surface near the gas stand of the kitchen.

  Hereinafter, the present invention will be described in more detail.

  Examples of the epoxy resin in the epoxy resin composition (main agent) used in the present invention include bisphenol type epoxy resins such as bisphenol A type and bisphenol F type, novolak type epoxy resins, linear aliphatic epoxy resins, and the like. Epoxy resin can be used.

  The epoxy resin may be aqueous.

  Examples of aqueous epoxy resins include bisphenol A type epoxy resins, novolac type epoxy resins, bisphenol F type epoxy resins, brominated epoxy resins, cycloaliphatic epoxy resins, or the like, or polyester resins, phenol resins, melamine resins, etc. Among these, water-soluble type, water-dispersed type and the like can be used.

  The curing agent used in the present invention includes methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic acid anhydride, hydrogenated methylnadic acid anhydride, and trialkyltetrahydrophthalic anhydride that do not contain N in the molecule. At least one, usually only one is used. These curing agents are preferable because they are liquid in the range of 0 to 40 ° C. (that is, the temperature range during normal filling operation). When the curing agent is in a liquid state, the viscosity of the main agent, the curing agent and the aggregate preparation becomes low, so that even if the proportion of the aggregate is relatively increased, the viscosity can be made sufficient for filling. Increasing the aggregate reduces the amount of heat generated during combustion. Note that methyltetrahydrophthalic anhydride and methylhexahydrophthalic anhydride are preferred because of low viscosity at room temperature. Further, methylhexahydrophthalic anhydride is preferable because it is colorless and transparent.

  The main agent and the curing agent are ethylene resin, vinyl acetate resin, polyester resin, alkyd resin, vinyl chloride resin, epoxy resin, acrylic resin, urethane resin, silicone resin, fluororesin, as long as the effects of the present invention are not impaired. You may contain resin, such as a cellulose and polyvinyl alcohol.

  Furthermore, the main agent and curing agent are pigments, aggregates, dispersants, viscosity modifiers, solvents, film-forming aids, plasticizers, antifreezing agents, antiseptics, antifungal agents, to the extent that the effects of the present invention are not impaired. Algae-proofing agent, antifoaming agent, leveling agent, pH adjusting agent, anti-settling agent, anti-sagging agent, matting agent, UV absorber, drying adjusting agent, coupling agent, dehydrating agent, light stabilizer, antioxidant, Additives such as water can also be contained.

  Examples of pigments include inorganic colors such as titanium oxide, zinc oxide, carbon black, ferric oxide (bengala), lead chromate (molybdate orange), yellow lead, yellow iron oxide, ocher, ultramarine, and cobalt green. Pigments, azo, naphthol, pyrazolone, anthraquinone, perylene, quinacridone, disazo, isoindolinone, benzimidazole, phthalocyanine, quinophthalone, and other organic color pigments, heavy calcium carbonate, clay , Volumetric pigments such as kaolin, talc, precipitated barium sulfate, barium carbonate, white carbon, and diatomaceous earth.

  As the aggregate, quartz sand is suitable, but it is preferable to use aluminum hydroxide as at least a part of the aggregate. By blending aluminum hydroxide, flame retardancy is imparted and the amount of heat generated during combustion is reduced.

  When filling the joint material for tiles of the present invention, it is only necessary to apply a composition prepared by mixing the main agent (epoxy resin composition), the curing agent and the aggregate to the tile construction surface and wipe it off. The procedure itself of the joint method is the same as the conventional joint method. In performing the above mixing, it is preferable to mix the aggregate with at least one of the main agent and the curing agent and then mix the other of the main agent and the curing agent. The aggregate may be mixed in the field, or may be mixed in a commercially available main agent or curing agent.

  The mixing ratio of the aggregate, the epoxy resin composition, and the curing agent composition is preferably about 20 to 40 parts by weight as the total amount of the epoxy resin composition and the curing agent composition with respect to 100 parts by weight of the aggregate. The amount of aluminum hydroxide powder as a part of the aggregate is preferably about 5 to 25 parts by weight in 100 parts by weight of the aggregate.

  Hereinafter, examples and comparative examples will be described.

  The materials used in the following examples and comparative examples are as follows.

[Main agent] Bisphenol A type epoxy resin (Examples 1 and 3, Comparative Examples 1 and 2): JER series 828 manufactured by Japan Epoxy Resin Co., Ltd.
Bisphenol F type epoxy resin (Example 2): YDF-17 manufactured by Tohto Kasei Co., Ltd.
0
[Curing Agent] Methyltetrahydrophthalic anhydride (Examples 1 and 2): Shin Nippon Rika (MT-50)
0TZ) (liquid at room temperature, 30-60 mPa · s)
Methylhexahydrophthalic anhydride (Example 3): Dainippon Ink and Chemicals (B-6)
50) (liquid at normal temperature, 50-80 mPa · s)
Isophorone diamine (Comparative Example 2, amine-based): manufactured by PTI Japan Ltd. Phthalic anhydride (Comparative Example 1, powder): Mitsubishi Chemical Co., Ltd. Imidazole (Shikoku Kasei Co., Ltd. 2E4MZ-CN) was added.
[Aggregate] No. 8 silica sand Silica sand fine powder (average particle size 90μm)
Aluminum hydroxide (Showa Denko Co., Ltd. Heidilite H-10)

[Examples 1 to 3, Comparative Examples 1 and 2]
The formulation was prepared by mixing the main agent, curing agent and aggregate at the blending ratio shown in Table 1. In the mixing procedure, first, the main agent and the aggregate were thoroughly mixed, and then the curing agent was added and mixed.

  After this formulation was applied to the tile construction surface, it was wiped off with a sponge soaked in water and filled into a tile panel joint composed of 16 tiles.

  The size of the tile is 22.5 × 22.5 × 6.0 mm, and the joint spacing is 2.5 mm. The temperature during the filling operation was 25 ° C.

An exothermic test (20-minute combustion test using a corn calorimeter) was carried out in accordance with ISO-5660. The condition of the non-combustible material is that the total calorific value is 8 MJ / m ² or less. The results are shown in Table 1.

  As is clear from the above Examples and Comparative Examples, Examples 1 to 3 are preferable because the total heat generation amount is less than 6 MJ.

Claims (3)

In a joint material for tiles comprising an epoxy resin composition and a curing agent composition added to the epoxy resin composition,
The curing agent of the curing agent composition is selected from the group consisting of methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic acid anhydride, hydrogenated methylnadic acid anhydride, and trialkyltetrahydrophthalic anhydride. A joint material for tiles, which is at least one kind.   The tile joint material according to claim 1, wherein the curing agent is methyltetrahydrophthalic anhydride or methylhexahydrophthalic anhydride.   A tile panel in which a joint material including an aggregate and the joint material for tiles according to claim 1 or 2 is filled in a joint space.