JP2011138930A - Method and apparatus for inspecting and managing electronic substrate, and visual inspection apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To repair a substrate on which a defective portion is found without excluding the substrate from an inspection line to eliminate the necessity of a preliminary program for the inspection portion to check it later for appropriate repair. <P>SOLUTION: (a) A defective portion is repaired in at least a part of inspection processes 12A to 12H. (b) When the defect portion is repaired in the step (a), the defect content, position information, and at least one image before and after repair of the defective portion are read. (c) The defect content, the position information, and at least the one image before and after repair read in step (b) are stored in a database 16. (d) The defect content, the position information, and at least one image before and after repair stored in the database 16 in step (c) are timely read. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an inspection management method, an inspection management device, and a visual inspection device for an electronic substrate that guides an electronic substrate to an inspection line having a plurality of inspection processes, sequentially inspects and repairs a defective portion.

  In recent years, electronic boards (printed wiring boards, also simply referred to as boards) have become increasingly denser and electronic circuits have become more complex. For this reason, the inspection performed at the end of the manufacturing process is performed in a stepwise manner by dividing it into a plurality of inspection processes. For example, automatic visual inspection (AOI), automatic X-ray inspection (AXI), inspection of each part of an electronic circuit (ICT), functional inspection as a product (FCT), priority visual inspection, shipping inspection, and the like.

JP2008-102075

  In Patent Document 1, when using a plurality of automatic appearance inspection devices (having a function of taking (taking) an image for visual observation, the inspector is not here. Paragraph 0027), a plurality of inspectors are used by one inspector. It has been shown to be able to operate automatic visual inspection equipment. That is, when each automatic visual inspection apparatus detects that there is a possibility of a defect in a predetermined inspection part (programmed in advance, paragraph 0032), the image is sent to the monitor screen of the central management apparatus and stored in the server ( Paragraphs 0029, 0030). In the centralized management apparatus, images of inspection parts transmitted from a plurality of visual inspection apparatuses are sequentially displayed on a monitor unit according to a schedule, and one inspector inspects whether or not the defect is a real defect.

  The one disclosed in Patent Document 1 does not perform repair even if there is a defective part (defective part) in each automatic visual inspection apparatus, so it is necessary to remove this board from the inspection line and repair it separately outside the line. There is. For this reason, even if the problem can be solved by simple repair, the board must be removed from the line, which causes a problem of inefficiency. In addition, since the removed board must be repaired by another worker, there is a limit to the reduction in the number of personnel required for the entire line even if there is only one inspector.

  In addition, since the automatic visual inspection device only sends an image of a predetermined inspection site to the centralized management device, if the defective board is removed from the inspection line and repaired, it will be checked later whether the repair has been performed properly. I can't. In particular, when the same substrate is repaired a plurality of times, it is impossible to later detect which repair is defective.

  Furthermore, since the inspection site for detecting the presence / absence of a defect is determined in advance by a program (paragraph 0032), not only an image cannot be taken for an unprogrammed inspection site, but the inspector cannot perform inspection or determination.

  The present invention has been made in view of such circumstances, and improves the inspection / repair efficiency by making it possible to repair a substrate in which a defective portion is found without removing it from the inspection line. Improve the reliability of repairs by checking later whether repairs were appropriate, and eliminate the need to pre-program inspection sites so that new faults can be found and set arbitrarily A first object is to provide an inspection management method for an electronic substrate.

  It is a second object of the present invention to provide an inspection management apparatus used for carrying out this method. A third object is to provide a visual inspection apparatus.

  According to the present invention, a first object is to provide an inspection management method for an electronic substrate, in which an electronic substrate that has been manufactured is guided to an inspection line having a plurality of different inspection steps, and sequentially inspected to repair a defective portion. ) At least a part of the inspection process repairs the defective part; b) When the defective part is repaired in the step a), the defect content of the defective part, position information, and at least one of before and after the repair C) Accumulating the defect contents of the defect portion read in step b), position information, and at least one image before and after repair in the database; d) in step c) Defect contents stored in the database, position information, and at least one of the images before and after repair are read out in a timely manner; an electronic board inspection management method for performing the above steps a) to d), More is achieved.

  A second object of the present invention is an electronic board inspection management apparatus used for carrying out the method of claim 1, which detects a defective part and displays an image thereof to prompt repair, and at least one image before and after repair. A plurality of inspection processes for photographing the image; the contents of the defects detected in the inspection process, the position information, and at least one of the images before and after the repair are accumulated, and the accumulated data is read out in the inspection process An electronic database inspection management device comprising: a database that enables the electronic substrate;

  A third object of the present invention is a visual inspection apparatus used for carrying out the method according to claim 8, wherein an imaging means for reading a defective part detected in the inspection process, a display means for displaying the read image, and a substrate This is achieved by a visual inspection device that includes an ID automatic generation unit that automatically generates an ID to be assigned, a printer that displays the ID on the substrate, and an ID reader that reads the ID attached to the substrate.

  According to the first aspect of the present invention, when a defective part is found in the inspection process, the inspector visually inspects and repairs the board. Therefore, it is not necessary to remove the board from the line and repair it separately. When removing from the line and repairing separately, this board must be re-inspected from the beginning and repaired, so the efficiency is very bad, but according to the present invention, defects found in each process are also repaired in the same process Can be repaired efficiently.

  In addition, since at least one of the images before and after the repair is stored in a database (server, storage means) and can be read out in a timely manner, it is possible to check later which repair was inappropriate. Therefore, an appropriate and responsible response of the inspector (repairer) is required, and the repair reliability can be improved. Further, even if it is other than the pre-programmed inspection part, the part found by the inspection can be repaired, and the defect part can be set as appropriate, so that it is possible to flexibly cope with the occurrence of the defect.

  According to the invention which concerns on Claim 13, the test | inspection management apparatus used for implementation of this method is obtained. According to the invention which concerns on Claim 16, the visual inspection apparatus used for implementation of this method is obtained.

It is a figure which shows the test | inspection process which is one Example of this invention. It is a flowchart of operation | movement similarly. It is a block diagram of a visual inspection apparatus. It is an operation | movement flowchart of ID provision. It is the top view of the board | substrate which provided ID, and is the figure which excluded the circuit. It is a figure which shows the example of the display screen of a display means. It is an operation | movement flowchart at the time of a claim process.

  The contents of defects accumulated in the database (or server, storage means), the position of the defects, and / or images before and after repair (hereinafter also simply referred to as images before and after repair) are used when repaired in a later process. It can be made to read (claim 2). In this case, when repairing in a later process, it is possible to confirm the details of the repair performed in the previous process, which is suitable for determining an accurate repair policy. At this time, the name and the like (ID) of the repaired inspector (repair person), date and time, etc. are also entered in the database.

  Further, the contents of the defect, the position of the defect, and the images before and after the repair may be read by an inspection monitor provided separately from the inspection line (claim 3). In this case, a skilled inspector can look at this inspection monitor and check the repair progress (history) so far to give instructions for more accurate repair to any inspection process, Repair reliability can be increased (claim 4).

  In addition, the database is connected to a recall repair department that is separate from the inspection line. For defects that occur in shipped products, refer to the inspection / repair process data (defect contents, defect location, images, etc.) of the board. (Claim 5). In this case, it is possible to easily find out the cause of the occurrence of a problem, to determine a future repair policy, and to make a design change instruction.

  In claim 1, the plurality of different inspection processes are any of AOI (Auto Optical Inspection), AXI (Antomatic X-ray Inspection), ICT (Incircuit Test), FCT (Functional Test), and visual inspection. (Claim 6).

  Here, the AOI automatically inspects the appearance by comparing a photographed image of the board to be inspected with an image of a normal board that has been programmed (set) in advance, and inspects the appearance of wiring patterns, component placement, and the like. . ICT is a contact probe (pin) with a spring in contact with each part of the electronic circuit using a jig method or flying probe method, and the constants of electronic components (resistors, capacitors, etc.) from the situation of conduction or insulation between lands or pins. Measure the diode characteristics, open / short of the circuit pattern, etc., and compare with the reference data to detect the failure location and content.

  The FCT connects the power supply and inspects the function of the entire board. The visual inspection is performed by the inspector visually observing a magnified image with a microscope or a camera directly on the substrate in which there is no defect in AOI, AXI, ICT, and FCT or the defect has been eliminated by repair. While examining the image, the inspector determines the content of the defect at the defect location, for example, solder defect, circuit pattern disconnection / short circuit, circuit element characteristic inappropriateness, and the like. This determination may be automatically performed by a computer. For example, the defect tracking / specification processing unit according to claim 14 can be determined using software.

  At this time, the database includes BOM (bill of materials, parts table, part composition table, parts development table), Gerber data (Gerber data, data indicating the filling of the circuit pattern figure), CAD data (circuit pattern design) It is preferable that data for creating / determining patterns, which is designed on CAD) is stored in advance, or these data can be accessed and read out in a timely manner (claim 12). In this way, it is possible to quickly and easily determine a component mounting error, a component failure, and the like by comparing the component characteristics of the defective portion with the data read from the BOM during the visual inspection. In addition, a defect in the circuit pattern can be quickly determined using Gerber data or CAD data.

  In step a), when this board does not have an ID at the earliest inspection process in which a defect is detected, an automatically generated ID is attached, and in the subsequent process, the repair history (images before and after repair) of the board with this ID is attached. If it is made possible to read from the database, it is suitable for carrying out appropriate repairs (claim 8). The substrate ID used here is preferably a barcode, and may be a two-dimensional barcode (QR code) or the like (claim 9). When such a barcode is used, a barcode printer (or a laser marker) or a reader may be provided as necessary in the inspection process (claim 10).

  In step d), if the defective part is blinked on the image of the substrate or the position thereof is designated with a cursor or the like, the defective part can be easily confirmed, and the work efficiency is improved.

  In the inspection management apparatus used for carrying out this method, it is preferable to provide a defect tracking / specification processing unit that tracks the cause of occurrence of a defective part and identifies the cause, and outputs the result to the inspection process. ). For example, it is possible to determine a defect from an image of a defective part (in the case of AOI or AXI, an image of wiring disconnection or short-circuit), or to determine whether the component characteristics are appropriate from measurement data (in the case of ICT or FCI), BOM, Gerber data This can be determined using CAD data or the like (claim 15).

  The visual inspection apparatus used in the present invention includes an imaging means, a display means, an automatic board ID generation means, a printer, and an ID reader (claim 16), and the board ID used here is preferably a barcode (claim 17). . Further, if the display means displays the entire substrate image and the enlarged image of the defective part on the same screen at the same time, it is easy to compare the two screens, and the efficiency is good. At this time, if a marker (flashing marker, cursor, etc.) indicating a defective portion is attached to the entire substrate image, it becomes easier to see (claim 19).

  In FIG. 1, the code | symbol 10 is a test | inspection line and arranges the different test | inspection processes 12 (12A-12H) in order. The electronic substrate 14 that has been manufactured is introduced from one end of the inspection line 10 and sequentially inspected in different inspection steps 12 (12A to 12H), and the substrate 14 having no defect and the substrate 14 in which the defect portion has been repaired are shipped. The substrate 14 in which the defect has not been solved is returned to a predetermined inspection step of the inspection line 10, that is, ICT 12C, and sequentially inspected and repaired again in steps 12C to 12H.

  In FIG. 1, reference numeral 16 denotes a database (DB) which is connected to each inspection process 12 via a bus 18 and accumulates data such as defects in each inspection process 12, contents of defects, images before and after repair, and the like. . In this database 16, BOM 20, Gerber data 22, and CAD data 24 are stored (memory) in advance. These are stored in the database 16 instead of being stored in the database 16, and the appropriate inspection process 12, the inspection monitor 50, the claim processing unit 52, and the defect tracking / specification processing unit 54 described later are connected to the bus 18. The necessary data may be fetched by direct access via the network.

  The inspection process 12A is AOI (automatic appearance inspection), and the presence or absence of a defect is automatically determined by taking an image of the substrate 14 and comparing it with a normal image programmed in advance (FIG. 2, step S100). For example, the circuit pattern is inspected for shorts (short circuit), open (disconnection), component placement, and the like from the appearance. The image A captured by the AOI 12A is stored in the database 16 together with the position (address, XY coordinates) of the detected defective part, the board ID, and the like. The content of processing performed by the AOI 12A is described in the “processing content” column of FIG. The substrate ID may be automatically generated if it has not been assigned at this point, and may be automatically generated and attached in the next visual inspection step 12B if there is a defect.

  When a defective portion is detected by the AOI 12A (step S102), the defective portion is visually inspected in the next visual inspection step 12B (step S104). An apparatus (visual inspection apparatus) 26 used for this visual inspection is shown in FIG. This device 26 includes a camera 28 as a photographing means for photographing the substrate 14, a display means 30 for displaying the photographed image, a barcode reader printer 32, a camera driving unit 34, a control unit 36, a database 38, and the like. Is provided. The database 38 may be the database 16 described above, but may be a memory built in the visual inspection device 26 separately.

  The control unit 36 includes a camera position control unit 36A, an image processing unit 36B, an ID generation / determination unit 36C, and an image generation unit 36D. The camera position control unit 36A reads the position data of the defective part detected by the AOI 12A, and sets the photographing position of the camera 28 to this defective part. The camera driving unit 34 moves the camera 28 to this position. In addition, the examiner indicates the inspection location depending on the case while viewing the image, and changes the photographing position to this position. The image is displayed on the display means 30.

  The inspector looks at the image on the display means to determine the defective part. Then, the defective part is repaired, and the image B before and after repair is read, subjected to predetermined image processing by the image processing unit 36B, and stored in the database 38 or 16.

  The ID generating / discriminating means 36C, when the substrate ID determined to be defective by the AOI 12A has not yet been assigned (FIG. 4, step S106), the ID (substrate ID) for this substrate 14 is, for example, a barcode. The ID (bar code) is printed on the card 40 (FIG. 5) by the bar code reader printer 32 (FIG. 4, step S108). The printer 32 may print with a laser marker. The card 40 is attached to the substrate 14 by the inspector. FIG. 5 shows the substrate 14. This ID is a unique serial ID generated by automatic generation software built in the control unit 36 and is recorded in the database 38 or 16. This substrate 14 is subsequently identified by this ID.

  The inspector visually confirms the defect position (defective position) of the board 14 to which the ID is assigned, and inputs the defect content (defective content) from the keyboard 30A (FIG. 3). Then, the defective portion is repaired manually or using an appropriate jig, and the images B before and after repair are stored in the databases 38 and 16 as described above (S104).

  When there is no defect in the substrate 14 (FIG. 4, step S102), if there is no ID (step S103), an ID is automatically generated and attached to the substrate 14 (step 109).

  In FIG. 3, the image generation unit 36 </ b> D generates, for example, the screen illustrated in FIG. 6 and causes the display unit 30 to display the screen. In FIG. 6, a is a display column for a board name, inspection date, inspector name, etc., b is an entire image of the board 14, c is a defective part in this image b, d is an enlarged image of this defective part c, “e” is a display column for the name of the part causing the malfunction, repair contents, repair history, and the like. The defective part c corresponds to the defective part c in FIG. 5, and this defective part c is indicated by an XY cursor line on the screen of FIG. 6. Instead of the cursor, a defective part may blink, or another marker may be used.

  Display contents such as a part name displayed in the display field e are created by referring to the BOM 20, Gerber data 22, CAD data 24 or using data read from the database 16. Further, the image generation unit 36D causes the display means 30 to display the images A and the like before and after the repair of the defective part accumulated in the previous process based on the instructor's instruction.

  The same thing as the visual inspection apparatus 26 comprised in this way is used also in visual inspection process 12D, 12F, 12G, 12H (refer FIG. 1). These are different from step 12B in that when a substrate ID has already been assigned (step S106 in FIG. 4), a visual inspection (S104) is performed without assigning a substrate ID again. Of course, the images A to E before and after the repair in the previous process which can be read out by the image generation unit 36D are also different.

After the process (step S104) in the visual inspection process 12B is completed, an inspection process 12C by ICT is performed next. In this step 12C, as described above, the contact probe is brought into contact with the substrate 14, and the characteristics such as continuity, resistance, capacitance, etc. between lands or pins are measured and compared with the reference data to determine whether the circuit or component is defective or incorrect Etc. are checked (FIG. 2, step S110), and the result is sent to the database 16. If there is a defect (step S112 in FIG. 2), the visual inspection process 12D is entered and a visual inspection is performed (step S114). At this time, the defect tracking / specification processing unit 54 automatically tracks and determines the defect position.

  In this visual inspection step 12D, the visual inspection device 26 (FIG. 3) is used to confirm the presence or absence of the substrate ID as shown in FIG. 4 (step S106). If the substrate has already been given in the previous visual inspection step 12B, the substrate is checked. The ID is read by the barcode reader printer 32 (FIG. 3) (FIG. 4, step S116). Then, the repair is performed in the same manner as in step S104, and the images C before and after the repair are stored in the database 16 (step S114).

  When this visual inspection process 12D is completed, the inspection process 12G by FCT is entered (FIG. 2, step S118). In step 12E, as described above, the substrate 14 is connected to the power source, and it is inspected whether or not the entire substrate has a predetermined function (step S120). This result is sent to the database 16. If there is a defect, a visual inspection process 12F is performed (step S122). The processing contents at this time are the same as those in the step 12D.

  When the visual inspection process 12F is finished, the visual inspection process 12G is entered (step S124). In this step 12G, the inspector inspects the entire substrate 14. For example, a defect location (important inspection location) having a high occurrence frequency peculiar to the substrate 14 is inspected mainly. If the data of this position is stored in the database 36 or 16 in advance and the position is made easy to see by blinking display at the time of inspection, the work efficiency is improved.

  If there is a defect in this inspection (step S126), the image is repaired and the images E before and after the repair are accumulated. At this time, the images A to D accumulated in the previous steps 12A to 12F are referred to (step S128). Finally, a shipping inspection 12H is performed (step S130). In the shipping inspection 12H, a sampling inspection of the substrate 14 is mainly performed, and a precise appearance inspection is performed as quality control (QC) material. If there is a defect at this stage, the process returns to the inspection process 12C and the inspections 12C to 12H are again performed (step S132). Shipped if there are no defects. If there is a defect, another substrate included in the lot including the substrate is rechecked to prevent shipment of defective products.

  In the first embodiment, it is desirable that another skilled inspector can grasp the processing status of each of the inspection steps 12A to 12H and issue an appropriate instruction. For this purpose, an inspection monitor 50 may be connected to the bus 18 of FIG. 1 so that the inspection data stored in the database 16 from the monitor 50 can be read out.

  A skilled inspector who operates the monitor 50 reads the inspection results of the respective steps 12A to 12H and the repair contents such as the steps 12B, 12D, 12F, and 12G from the database 16 in a timely manner and gives a correction policy in a timely manner. Repair can be ordered. At this time, the monitor 50 can confirm the repair status performed before from the images before and after the repair, so that the instruction becomes more appropriate. It is also possible to point out this point to repairers (inspectors) who have performed improper repairs and use them for training repairers.

  Further, if the data stored in the database 16 is used, it is possible to quickly cope with a defect or a complaint that has occurred in a shipped product, or a recall process by a manufacturer (seller). For this purpose, it is preferable to provide a complaint processing unit 52 connected to the bus 18 of FIG. 1 and decide a countermeasure policy such as repair using the inspection data of each of the processes 12A to 12H.

  FIG. 7 is a flowchart of processing performed by the complaint processing unit 52 in this case. First, when a defect occurs in the sold product (step S200) (step S202), the content of the defect is transmitted to the person in charge of complaint processing. The person in charge activates the complaint processing unit 52 (step S204), and inputs the board ID of the board 14 in which the defect has occurred (step S206). Then, stored data in the inspection steps 12A to 12H of the substrate 14 is read from the database (DB) 16 (step S208).

  This accumulated data includes past repair details, repair progress, pre- and post-repair images, etc., and the person in charge can search for the cause and determine an appropriate repair policy. Therefore, it is possible to instruct repair according to this repair policy (step S210). The images before and after the repair may be taken and stored, and used as quality control materials later (step S211). If the cause is considered to be the manufacturing process or design, the corresponding process department is instructed to change the manufacturing process or the design change (step S212). As a result, the same problem can be prevented from occurring. Further, considering the possibility that the same defect may occur in the lot including the substrate 14 having the defect, a countermeasure such as recall of a product incorporating the substrate in the lot unit is examined (step S214).

10 Inspection Line 12 (12A-12H) Inspection Process 14 Substrate 16 Database 18 Bus 20 BOM
22 Gerber data 24 CAD data 26 Visual inspection device 28 Camera (photographing means)
30 Display means 32 Barcode reader printer 34 Camera drive unit 36 Control unit 38 Database 50 Inspection monitor 52 Claim processing unit 54 Defect tracking / specific processing unit

Claims (19)

An electronic board inspection management method in which an electronic board that has been manufactured is led to an inspection line having a plurality of different inspection processes, inspected sequentially, and a defective portion is repaired.
a) At least in some inspection processes, repair the defective part;
b) When the defective part is repaired in the step a), the defect content of the defective part, the position information, and at least one image before and after the repair are read;
c) Accumulating the defect contents of the defect portion read in step b), the position information, and at least one of the images before and after repair in the database;
d) Read in a timely manner the content of the defect accumulated in the database in step c), the position information, and at least one of the images before and after the repair;
An electronic substrate inspection management method for performing the above steps a) to d).   In step d), at the time of repair performed in the inspection process after step a), the defect content of the defective part of step a) stored in step c), position information, and at least one image before and after repair are stored. 2. The inspection management method for an electronic board according to claim 1, wherein the inspection management is performed.   2. An inspection monitor connected to a database, wherein the inspection monitor reads out the failure content of the failure location stored in step c), the position information, and at least one of the images before and after repair in a timely manner. Inspection management method for electronic boards.   4. The inspection management method for an electronic board according to claim 3, wherein the inspection monitor outputs a repair instruction command for an appropriate inspection process.   The electronic board inspection management method according to claim 1, further comprising a recall processing unit connected to the database, wherein the recall processing unit reads data stored in the database in a timely manner in order to investigate defects occurring in shipped products.   The electronic board inspection management method according to claim 1, wherein the plurality of different inspection steps include any one of AOI, AXI, ICT, FCT, and visual inspection apparatus.   The electronic board inspection management method according to claim 1, wherein the repair performed in step a) is performed while an inspector visually inspects an image of the electronic substrate to be inspected by a visual inspection apparatus.   In the earliest inspection process in which a defective part is detected and repaired in step a), a newly generated board ID is attached to the repaired board when there is no board ID, and in the subsequent process, the board ID is repaired in the previous process. 2. The electronic board inspection management method according to claim 1, wherein a defect content of the board, a repair position, and at least one of the images before and after the repair are read from the database.   9. The inspection management method for an electronic board according to claim 8, wherein the board ID attached to the board is a bar code.   The board ID attached to the board is a bar code, the bar code printer is used for the earliest inspection process in which a defective portion is detected, and the bar code is used for the inspection process after the inspection process with the bar code attached. 9. The inspection management method for an electronic board according to claim 8, wherein a reader is provided.   2. The electronic board inspection management method according to claim 1, wherein, in step d), the repaired part in the previous process is displayed by a blinking mark or the like.   2. The inspection management method for an electronic board according to claim 1, wherein BOM, Gerber data, and CAD data are stored in advance in the database, and these data are read at the time of repair in each inspection process. An inspection management apparatus for an electronic board used for carrying out the method of claim 1,
A plurality of inspection steps for detecting a defective portion and displaying the image to promote repair and photographing at least one of the images before and after the repair;
A database that accumulates defect contents of the defect points detected in the inspection process, position information, and at least one of images before and after repair, and enables reading of the accumulated data in the inspection process;
An inspection management apparatus for an electronic board, comprising:   14. The electronic board according to claim 13, further comprising a defect tracking / specification processing unit that traces a cause of occurrence of a defective portion by using data stored in a database and identifies the cause, and outputs the result to an inspection process. Inspection management device.   15. The electronic board inspection management apparatus according to claim 14, wherein the defect tracking / identification processing unit performs processing based on computer software that identifies a cause of a defect using any of BOM, Gerber data, and CAD data.   9. A visual inspection apparatus for use in carrying out the method according to claim 8, wherein an imaging means for reading a defective portion detected in the inspection process, a display means for displaying the read image, and a board ID assigned to the board are automatically generated. A visual inspection apparatus comprising: an automatic ID generation unit that performs a printer that displays a substrate ID on a substrate; and an ID reader that reads the substrate ID attached to the substrate.   The visual inspection apparatus according to claim 16, wherein the substrate ID is displayed as a barcode.   The visual inspection apparatus according to claim 16, wherein the display means can simultaneously display the entire image of the substrate and the enlarged image of the defective portion.   The visual inspection apparatus according to claim 18, wherein a marker indicating a defective portion is attached to the entire image of the substrate.

Images