JP2011129501A - Conductive sheet, method for using conductive sheet, and capacitive touch panel of conductive sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a conductive sheet in which the resistance reduction in a transparent conductive pattern formed on a base body is attained, visibility can be improved, and which is suitable, for example, for a projective-capacitive type touch panel. <P>SOLUTION: In a first conductive sheet 10A, a first large lattice 14A having a conductivity of 2 or more and a first connecting part 16A for electrically connecting between neighboring first large lattices 14A are formed on a first transparent base body, and respective large lattices 14A are constituted, by assembling small lattices 18 of 2 or more, respectively. In the first connecting part 16A, a medium lattice (first medium lattice 20a to fourth medium lattice 20d) of 1 or more, having a pitch which is n times (n is real number larger than 1) the size of the small lattice 18 or larger is arranged. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a conductive sheet, a method for using the conductive sheet, and a capacitive touch pal, and more particularly to a conductive sheet suitable for use in a projected capacitive touch panel, a method for using the conductive sheet, and a capacitive touch panel.

  In general, a capacitive touch panel is a position input device that detects a fingertip position by detecting a change in capacitance between a human fingertip and a conductive film. There are surface type and projection type. The surface type has a simple structure, but cannot detect two or more contacts (multi-touch) at the same time. On the other hand, the projection type has a configuration in which a large number of electrodes are arranged in a matrix like a pixel configuration of a liquid crystal display device, for example, and more specifically, a plurality of electrodes in which a plurality of electrodes arranged in the vertical direction are connected in series. The first electrode group is arranged in the horizontal direction, and a plurality of second electrode groups in which a plurality of electrodes arranged in the horizontal direction are connected in series are arranged in the vertical direction. Multi-touch can be detected by sequentially detecting capacitance changes with the second electrode group. As a prior art of this projected capacitive touch panel, for example, a capacitive input device described in Patent Document 1 can be cited.

JP 2008-310551 A

  However, since the capacitance-type input device described in Patent Document 1 forms the first electrode group and the second electrode group on one main surface of the substrate, the first electrode group, the second electrode group, Therefore, there is a problem that the detection accuracy of the position of the fingertip is inferior. Further, for example, the second electrode group is formed on the connection portion of the electrodes constituting the first electrode group via an insulating layer so that the portion (intersection) where the first electrode group and the second electrode group intersect is not short-circuited. As a result, each intersection is formed thick locally, and when the touch panel surface is viewed, each intersection is displayed as a spot (black spot). There is also a problem that the visibility is remarkably deteriorated. In addition, since an insulating layer and a mask pattern for forming a connection portion on the insulating layer are required, there is a problem that the manufacturing process becomes complicated and the manufacturing cost increases.

Therefore, it is conceivable to form the first electrode group on one main surface of the transparent substrate and form the second electrode group on the other main surface of the transparent substrate.
However, from the perspective of the future, the following problems may occur. At present, the projected capacitive touch panel is mainly applied to a small size such as a PDA (personal digital assistant) or a mobile phone, but an operation system (OS) for a personal computer (personal computer) is multi-purpose. Since the touch system is now available as a standard, it is thought that the size will increase due to the application to personal computer displays.

  In such a future trend, since the conventional electrode uses ITO (indium tin oxide), the resistance increases (several tens of ohms / sq.), And as the application size increases, the current between the electrodes increases. There is a problem that the transmission speed becomes slow and the response speed (the time from when the fingertip is touched until the position is detected) becomes slow.

  The present invention has been made in consideration of such problems, and can reduce the resistance of the transparent conductive pattern formed on the substrate and improve the visibility. It is an object to provide a conductive sheet suitable for use in a capacitive touch panel and a method of using the conductive sheet.

  Another object of the present invention is to reduce the resistance of the transparent conductive pattern formed on the substrate and to improve the visibility. For example, a large projection capacitive touch panel can be used. An object of the present invention is to provide a touch panel that can be adapted to size.

[1] In the conductive sheet according to the first aspect of the present invention, two or more conductive large lattices and a connection portion for electrically connecting the adjacent large lattices are formed on a base. Each of the lattices is formed by combining two or more small lattices, and the connection portion is formed by arranging one or more medium lattices having a pitch n times (n is a real number larger than 1) the small lattices. It is characterized by.
[2] In the first aspect of the present invention, the connecting portion has a shape in which a plurality of the intermediate lattices are arranged in a zigzag shape.
[3] In the first aspect of the present invention, the connecting portion includes a plurality of the intermediate lattices in which one small lattice and an L-shaped space are formed.
[4] In the first aspect of the present invention, the connecting portion arranges one small lattice and a first medium lattice in which an L-shaped space is formed, and four small lattices in a matrix, A second intermediate lattice having a shape obtained by removing the central cross is connected in series.
[5] In the first aspect of the present invention, the arrangement pitch of the medium lattice is 1 to 10 times the arrangement pitch of the small lattice.
[6] In the first aspect of the present invention, when the arrangement pitch of the small lattices is Ps and the arrangement pitch of the medium lattices is Pm, Pm = 2 × Ps is satisfied.
[7] The first aspect of the present invention is characterized in that two or more large lattices are arranged in one direction via the connection portion.
[8] In the first aspect of the present invention, two or more of the large lattices are arranged in the first direction via the connecting portion to constitute one transparent conductive pattern, and two or more of the transparent conductive patterns are the first. An insulating part arranged in a second direction orthogonal to the direction and being electrically insulated is disposed between the adjacent transparent conductive patterns.
[9] A conductive sheet according to a second aspect of the present invention is a first sheet that electrically connects two or more conductive first large lattices and the adjacent first large lattices to one main surface of the substrate. And a second connecting portion that electrically connects two or more conductive second large lattices and the adjacent second large lattices is formed on the other main surface of the base body. In addition, each of the first large lattice and each of the second large lattices is configured by combining two or more small lattices, and each of the first connection portion and the second connection portion is n times as large as the small lattice ( It is characterized in that one or more medium lattices having a pitch (n is a real number larger than 1) are arranged.
[10] In the second aspect of the present invention, two or more first large lattices are arranged in the first direction via the first connection portion to form one first transparent conductive pattern, and two or more first transparent lattices are formed. Two large lattices are arranged in a second direction orthogonal to the first direction via the second connection portion to constitute one second transparent conductive pattern, and two or more first transparent conductive patterns are the second Two or more second transparent conductive patterns arranged in a direction are arranged in the first direction, and between the adjacent first transparent conductive patterns, an electrically insulated first insulating portion is arranged, and the adjacent A second insulating portion that is electrically insulated is disposed between the second transparent conductive patterns, the first connecting portion and the second connecting portion are opposed to each other with the base interposed therebetween, and the first insulating portion The second insulating portion is opposed to the base with the base interposed therebetween. The
[11] In the second aspect of the present invention, an opening having a size in which two or more small lattices are arranged is formed in a portion where the first insulating portion and the second insulating portion face each other with the base interposed therebetween. It has the form which was made.
[12] In the second aspect of the present invention, the portion has a form in which an opening having a size corresponding to one of the medium lattices is formed.
[13] In the second aspect of the present invention, the portion has a form in which an opening having a size in which the plurality of small lattices are arranged in a substantially cross shape is formed.
[14] In the second aspect of the present invention, the first side of the first large lattice has a shape in which a large number of needle-like lines project in a comb-tooth shape from a linear portion continuous along the first side. And the second side opposite to the first side has a form in which a linear portion continuous along the second side is formed, and the base of the second large lattice is The third side facing the first side of the first large lattice has a form in which a linear portion continuous along the third side is formed, and the first side through the base body The fourth side opposite to the second side of one large lattice has a form in which a large number of needle-like lines project in a comb-tooth shape from a linear portion continuous along the first side. To do.
[15] In the second aspect of the present invention, the small lattice has a square shape.
[16] The method of using the conductive sheet according to the third aspect of the present invention includes two or more conductive first large lattices and a first connection portion that electrically connects the adjacent first large lattices. Each of the first large lattices is configured by combining two or more small lattices, and each of the first connecting portions has a pitch n times (n is a real number larger than 1) as the small lattice. A first conductive sheet configured by arranging the above-described middle grids, two or more conductive second large grids, and a second connection portion that electrically connects the adjacent second large grids are formed. Each of the second large lattices is configured by combining two or more small lattices, and each of the second connecting portions has a pitch n times (n is a real number greater than 1) pitch of the small lattice. A conductive sheet using the second conductive sheet having the above-described middle grid disposed thereon Wherein the first conductive sheet has two or more first large lattices arranged in a first direction via the first connection portion to constitute one first transparent conductive pattern, In the second conductive sheet, two or more second large lattices are arranged in a second direction orthogonal to the first direction via the second connection portion to form one second transparent conductive pattern, By combining the first conductive sheet and the second conductive sheet, the first connection portion of the first conductive sheet and the second connection portion of the second conductive sheet are combined to form the arrangement of the small lattices. It is arranged so that it may form.
[17] A capacitive touch panel according to the fourth aspect of the present invention includes the conductive sheet according to the second aspect of the present invention.

As described above, according to the conductive sheet and the method of using the conductive sheet according to the present invention, the resistance of the transparent conductive pattern formed on the substrate can be reduced, and the visibility can be improved. For example, it is suitable for use in a projected capacitive touch panel.
In addition, the touch panel according to the present invention can reduce the resistance of the transparent conductive pattern formed on the substrate and can also improve the visibility. For example, the large size of the projected capacitive touch panel It can be made to correspond.

It is a top view which shows the example of a pattern of the 1st transparent conductive pattern formed in a 1st conductive sheet. It is sectional drawing which abbreviate | omits and shows a 1st conductive sheet. It is a disassembled perspective view which abbreviate | omits and shows the electrically conductive sheet for 1st touch panels. 4A is a cross-sectional view showing a part of the first touch panel conductive sheet with a part omitted, and FIG. 4B is a cross-sectional view showing a part of another example of the first touch panel conductive sheet. It is a top view which shows the example of a pattern of the 2nd transparent conductive pattern formed in a 2nd conductive sheet. It is a top view which abbreviate | omits and shows the example which combined the 1st conductive sheet and the 2nd conductive sheet, and was set as the 1st conductive sheet for touchscreens. It is a disassembled perspective view which abbreviate | omits and shows the electrically conductive sheet for 2nd touch panels. It is a top view which shows the example of a pattern of the 1st transparent conductive pattern formed in the 1st conductive sheet of the conductive sheet for 2nd touch panels. It is a top view which shows the example of a pattern of the 2nd transparent conductive pattern formed in the 2nd conductive sheet of the conductive sheet for 2nd touch panels. It is a top view which abbreviate | omits and shows the example which made the 2nd conductive sheet the 2nd conductive sheet combining the 1st conductive sheet and the 2nd conductive sheet.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a conductive sheet, a method for using a conductive sheet, and a touch panel according to the present invention will be described with reference to FIGS. In the present specification, “to” is used as a meaning including numerical values described before and after the lower limit value and the upper limit value.

  As shown in FIG. 1, the conductive sheet according to the first embodiment (hereinafter referred to as the first conductive sheet 10A) has two or more on one main surface of the first transparent base 12A (see FIG. 2). A conductive first large lattice 14A and a first connection portion 16A that electrically connects the adjacent first large lattices 14A are formed. Each of the first large lattices 14A includes two or more small lattices 18 respectively. The first connecting portion 16A is configured by combining one or more medium lattices 20 (20a to 20d) having a pitch n times that of the small lattice 18 (n is a real number larger than 1). . Here, the small lattice 18 has the smallest square shape.

  Further, two or more first large lattices 14A are arranged in the x direction (first direction) via the first connection portion 16A to constitute one first transparent conductive pattern 22A, and two or more first transparent conductive patterns are formed. 22A is arranged in the y direction (second direction) orthogonal to the x direction, and a first insulating portion 24A that is electrically insulated is disposed between adjacent first transparent conductive patterns 22A.

  More specifically, of the four side portions of the first large lattice 14A, the first side portion 28a and the second side portion 28b that are adjacent to one apex portion 26a that is not connected to the adjacent first large lattice 14A. Is a configuration in which a large number of needle-like lines 32 (sides of the small lattice 18) project in a comb-tooth shape from the straight line portion 30 continuous along the first side portion 28a and the second side portion 28b. On the other hand, the third side portion 28c and the fourth side portion 28d adjacent to the other vertex portion 26b not connected to the adjacent first large lattice 14A are along the third side portion 28c and the fourth side portion 28d, respectively. Thus, the linear portion 30 is formed continuously, and one small lattice 18 (exactly two adjacent sides) corresponding to the other apex portion 26b is removed.

  The first connecting portion 16A has a shape in which four medium lattices 20 having a size including four small lattices 18 (first medium lattice 20a to fourth medium lattice 20d) are arranged in a zigzag shape. That is, the first middle lattice 20a exists at the boundary portion between the straight portion 30 of the second side portion 28b and the straight portion 30 of the fourth side portion 28d, and one small lattice 18 and an L-shaped space are formed. Have a different shape. The second intermediate lattice 20b is adjacent to one side of the first intermediate lattice 20a (the straight portion 30 of the second side portion 28b) and has a shape in which a square space is formed, that is, four small lattices 18. Are arranged in a matrix and have a shape with the central cross removed. The third intermediate lattice 20c is adjacent to the first intermediate lattice 20a and adjacent to the second intermediate lattice 20b, and has the same shape as the second intermediate lattice 20b. The fourth middle lattice 20d includes a second straight portion 30 (second straight portion 30 from the outermost side toward the inside of the first large lattice 14A) of the third side portion 28c, and the first side portion 28a. And adjacent to the second intermediate lattice 20b and adjacent to the third intermediate lattice 20c, and similarly to the first intermediate lattice 20a, one small lattice 18 and an L-shaped space are provided. It has a formed shape. One side of the fourth middle lattice 20d exists on the extension of the straight portion 30 of the fourth side portion 28d in the first large lattice 14A. When the arrangement pitch of the small lattices 18 is Ps, the arrangement pitch Pm of the medium lattice 20 has a relationship of 2 × Ps.

  As described above, in the first conductive sheet 10A, one first transparent conductive pattern 22A is configured by arranging two or more first large lattices 14A in the x direction via the first connection portions 16A. Since one large lattice 14A is configured by combining two or more small lattices 18, and the first connection portion 16A is configured by arranging four medium lattices 20 having a pitch twice that of the small lattice 18, 1 The electrical resistance can be greatly reduced as compared with the configuration in which one electrode is formed by one ITO film. Accordingly, when the first conductive sheet 10A is used for a projection capacitive touch panel, for example, the response speed can be increased, and the touch panel can be increased in size.

Next, a set of conductive sheets for a touch panel using the first conductive sheet 10A described above, that is, a conductive sheet for a touch panel according to the first embodiment (hereinafter referred to as a first conductive sheet for a touch panel 50A). This will be described with reference to FIGS.
As shown in FIGS. 3 and 4A, the first touch panel conductive sheet 50A is configured by laminating the above-described first conductive sheet 10A and a second conductive sheet 10B described later.

  Since the first conductive sheet 10A has been described above, an overlapping description thereof will be omitted here, but as shown in FIG. 3, the first large lattice 14A existing on one end side of each first transparent conductive pattern 22A. The open end has a shape in which the first connecting portion 16A does not exist. An end portion of the first large lattice 14A existing on the other end side of each first transparent conductive pattern 22A is electrically connected to the first external wiring 40A.

  On the other hand, as shown in FIGS. 3 and 4A, the second conductive sheet 10B includes two or more conductive second large lattices 14B and adjacent second large lattices on one main surface of the second transparent base 12B. 14B is formed, and each second large lattice 14B is formed by combining two or more small lattices 18 as shown in FIG. The part 16B is configured by arranging one or more medium lattices 20 having a pitch n times (n is a real number larger than 1) the small lattice 18.

  Further, two or more second large lattices 14B are arranged in the y direction (second direction) via the second connection portion 16B to constitute one second transparent conductive pattern 22B, and two or more second transparent conductive patterns are formed. 22B is arranged in the x direction (first direction) orthogonal to the y direction, and a second insulating portion 24B that is electrically insulated is disposed between the adjacent second transparent conductive patterns 22B.

  More specifically, among the four sides of the second large lattice 14B, the fifth side portion 28e and the sixth side portion 28f adjacent to one vertex portion 26a not connected to the adjacent second large lattice 14B. With regard to the fifth side portion 28e, a number of needles are formed from the straight portion 30 continuous along the fifth side portion 28e in the same manner as the first side portion 28a of the first large lattice 14A in the first conductive sheet 10A. A line 32 (side of the small lattice 18) is formed in a comb-like shape. About the 6th side part 28f, it is set as the form by which the linear part 30 continuous along the 6th side part 28f was formed similarly to the 3rd side part 28c of 14 A of 1st large lattices in the 1st conductive sheet 10A. Yes. Looking at the seventh side portion 28g and the eighth side portion 28h adjacent to the other vertex portion 26b not connected to the adjacent second large lattice 14B, the seventh side portion 26g is the same as the fifth side portion 28e. In addition, a large number of needle-like lines 32 (sides of the small lattice 18) project in a comb-tooth shape from the straight portion 30 continuous along the seventh side portion 28g. Similar to the side portion 28f, a linear portion 30 that is continuous along the eighth side portion 28h is formed.

  The second connecting portion 16B has a shape in which four medium lattices 20 having a size including four small lattices 18 (fifth medium lattice 20e to eighth medium lattice 20h) are arranged in a zigzag shape. Have. That is, the fifth middle lattice 20e includes the second straight portion 30 (second straight portion from the outermost side toward the inside of the second large lattice 14B) and the eighth side portion 28h of the sixth side portion 28f. And has a shape in which one small lattice 18 and an L-shaped space are formed. The sixth intermediate lattice 20f is adjacent to one side of the fifth intermediate lattice 20e (the second straight portion 30 of the sixth side portion 28f), and has a shape in which a square space is formed, that is, four portions. The small lattices 18 are arranged in a matrix, and the cross is removed from the center. The seventh intermediate lattice 20g is adjacent to the fifth intermediate lattice 20e and is adjacent to the sixth intermediate lattice 20f, and has the same shape as the sixth intermediate lattice 20f. The eighth middle lattice 20h exists at the boundary between the straight portion 30 of the seventh side 28g and the fifth side 28e, is adjacent to the sixth middle lattice 20f, and is adjacent to the seventh middle lattice 20g. Similarly to the fifth middle lattice 20e, it has a shape in which one small lattice 18 and an L-shaped space are formed. One side of the eighth middle lattice 20h exists on the extension of the straight portion 30 of the eighth side 28h in the fifth middle lattice 20e. Also in the second conductive sheet 10B, when the arrangement pitch of the small lattices 18 is Ps, the arrangement pitch Pm of the medium lattice 20 has a relationship of 2 × Ps.

  As shown in FIG. 3, the open end of the second large lattice 14B present on one end side of each second transparent conductive pattern 22B has a shape in which the second connection portion 16B does not exist. An end portion of the second large lattice 14B existing on the other end side of each second transparent conductive pattern 22B is electrically connected to the second external wiring 40B.

  For example, when the first conductive sheet 10A is laminated on the second conductive sheet 10B to form the first touch panel conductive sheet 50A, as shown in FIG. 6, the first connection portion 16A of the first transparent conductive pattern 22A and The second connecting portion 16B of the second transparent conductive pattern 22B is opposed to the first transparent base 12A (see FIG. 4A), and the first insulating portion 24A of the first transparent conductive pattern 22A and the second transparent conductive pattern are opposed to each other. Similarly, the second insulating portion 22B of 22B is opposed to the first transparent base 12A. The line widths of the first transparent conductive pattern 22A and the second transparent conductive pattern 22B are the same, but in FIG. 6, the first transparent conductive pattern 22A and the second transparent conductive pattern 22B are shown so that the positions of the first transparent conductive pattern 22A and the second transparent conductive pattern 22B can be seen. The line width of the first transparent conductive pattern 22A is widened and the line width of the second transparent conductive pattern 22B is narrowed and exaggerated.

  When the stacked first conductive sheet 10A and second conductive sheet 10B are viewed from above, the second large size of the second conductive sheet 10B is filled so as to fill the gaps of the first large lattice 14A formed in the first conductive sheet 10A. The lattice 14B is arranged. In other words, a large lattice is spread. At this time, the tips of the comb teeth 32 in the first side portion 28a and the second side portion 28b of the first large lattice 14A are the straight portions 30 of the sixth side portion 28f and the eighth side portion 28h of the second large lattice 14B. As a result, the small lattices 18 are arranged, and similarly, the comb teeth 32 on the fifth side portion 28e and the seventh side portion 28g of the second large lattice 14B are formed. Each tip has a shape connected to each of the straight portions 30 of the third side portion 28c and the fourth side portion 28d of the first large lattice 14A. As a result, the small lattices 18 are arranged, The boundary between the first large lattice 14A and the second large lattice 14B is almost indistinguishable.

  Here, for example, when the side portions of the first large lattice 14A and the second large lattice 14B are all formed as the straight portions 30, the width of the overlapping portion between the straight portions 30 is large due to a slight deviation in the overlay position accuracy. As a result, the boundary between the first large lattice 14A and the second large lattice 14B becomes conspicuous and the visibility deteriorates, but in this embodiment, as described above, Due to the overlap between the tips of the comb teeth 32 and the straight portion 30, the boundary between the first large lattice 14A and the second large lattice 14B becomes inconspicuous, and the visibility is improved. Note that an opening corresponding to one medium lattice is formed at a portion where the first insulating portion 24A and the second insulating portion 24B face each other. However, unlike the above-described line thickening, light is not blocked. Therefore, it is hardly noticeable outside. In particular, an opening corresponding to one medium lattice is almost the same in terms of size as compared with the surrounding small lattice 18, and therefore becomes less conspicuous.

  Further, when the portion where the first connection portion 16A and the second connection portion 16B are opposed to each other is viewed from above, the intersection of the fifth middle lattice 20e and the seventh middle lattice 20g of the second connection portion 16B is the first large lattice. 14A is located substantially at the center of the second middle grating 20b, and the intersection of the sixth middle grating 20f and the eighth middle grating 20h of the second connecting portion 16B is at the middle of the third middle grating 20c of the first large grating 14A. A plurality of small lattices 18 are formed by a combination of the first medium lattice 20a to the eighth medium lattice 20h. That is, a plurality of small lattices 18 are arranged in a portion where the first connection portion 16A and the second connection portion 16B face each other by a combination of the first connection portion 16A and the second connection portion 16B. It becomes indistinguishable from the small lattice 18 constituting the first large lattice 14A and the small lattice 18 constituting the second large lattice 14B, and visibility is improved.

  When this first touch panel conductive sheet 50A is used as a touch panel, a protective layer is formed on the first conductive sheet 10A, and the first conductive sheet 10A is derived from a large number of first transparent conductive patterns 22A. The first external wiring 40A and the second external wiring 40B derived from the multiple second transparent conductive patterns 22B of the second conductive sheet 10B are connected to, for example, an IC circuit that performs position calculation.

  By bringing the fingertip into contact with the protective layer, signals from the first transparent conductive pattern 22A and the second transparent conductive pattern 22B facing the fingertip are transmitted to the IC circuit. The IC circuit calculates the position of the fingertip based on the supplied signal. Therefore, even if two fingertips are brought into contact at the same time, the position of each fingertip can be detected.

  As described above, in the first touch panel conductive sheet 50A, when the first touch panel conductive sheet 50A is applied to, for example, a projected capacitive touch panel, the response speed can be increased. Increase in size can be promoted. Moreover, the boundary between the first large lattice 14A of the first conductive sheet 10A and the second large lattice 14B of the second conductive sheet 10B becomes inconspicuous, and there are a plurality of combinations depending on the combination of the first connection portion 16A and the second connection portion 16B. Since the small lattice 18 is formed, there is no inconvenience such as local thickening of the line, and the visibility is improved as a whole.

  In the first touch panel conductive sheet 50A described above, as shown in FIGS. 3 and 4A, the first transparent conductive pattern 22A is formed on one main surface of the first transparent substrate 12A, and the one main surface of the second transparent substrate 12B. The second transparent conductive pattern 22B is formed on the first transparent substrate 12A, but as shown in FIG. 4B, the first transparent conductive pattern 22A is formed on one main surface of the first transparent substrate 12A. The second transparent conductive pattern 22B may be formed on the other main surface. In addition, there may be another layer between the first conductive sheet 10A and the second conductive sheet 10B, and if the first transparent conductive pattern 22A and the second transparent conductive pattern 22B are in an insulating state, they are You may arrange | position facing.

Next, a touch panel conductive sheet (hereinafter referred to as a second touch panel conductive sheet 50B) according to a second embodiment will be described with reference to FIGS.
The second touch panel conductive sheet 50B has substantially the same configuration as the first touch panel conductive sheet 50A described above, as shown in FIG. 7, but as shown in FIG. Each of the side portions 28a to 28d has a rectangular wave shape in which two or more rectangular shapes are arranged. As shown in FIG. 9, the fifth side portion 28e to the eighth side portion of the second large lattice 14B. 28h is different in that each has a rectangular wave shape in which two or more rectangular shapes are arranged.

  Specifically, for the first large lattice 14A, one comb tooth 32 on each of the first side portion 28a and the second side portion 28b of the first large lattice 14A of the first conductive sheet 10A shown in FIG. Are connected to each other, so that every other small lattice 18 is arranged, and each straight portion 30 of the third side portion 28c and the fourth side portion 28d is separated every other portion, so that one small lattice 18 is provided. As shown in FIG. 8, the first side portion 28a to the fourth side portion 28d of the first large lattice 14A of the second touch panel conductive sheet 50B are each made up of two or more rectangular shapes by arranging them in a separate arrangement. In particular, the rectangular wave shapes of the first side lattice 28a of the first large lattice 14A and the fourth side portion 28d facing the first side portion 28a are staggered so that the shapes are arranged, The second side portion 28b and the second side portion 28b of the first large lattice 14A Each rectangular wave shape of the third side portion 28c which direction is set to be staggered.

Similarly, for the second large lattice 14B, the comb teeth of the fifth side portion 28e and the seventh side portion 28g of the second large lattice 14B of the second conductive sheet 10B (first touch panel conductive sheet 50A) shown in FIG. 32 is connected to every other one, and the small lattices 18 are arranged every other one, and each straight line part 30 of the sixth side part 26f and the eighth side part 28h is separated into every other part, By arranging every other small lattice 18 in an array, the fifth side portion 28e to the eighth side portion 28h of the second large lattice 14B of the conductive sheet 50B for the second touch panel have two or more rectangular shapes, respectively. In particular, the rectangular wave shapes of the fifth side portion 28e of the second large lattice 14B and the eighth side portion 28h opposed to the fifth side portion 28e are staggered, The sixth side portion 28f of the two large lattices 14B and the Each rectangular wave shape of the seventh side portion 28g which faces the side portion 28f is set to be staggered.

  For example, when the first conductive sheet 10A is stacked on the second conductive sheet 10B to form the second touch panel conductive sheet 50B, as shown in FIG. 10, the first touch panel conductive sheet 50A (see FIG. 6) Similarly to the case, the first connection portion 16A of the first transparent conductive pattern 22A and the second connection portion 16B of the second transparent conductive pattern 22B are opposed to each other with the first transparent base 12A (see FIG. 4A) interposed therebetween, The first insulating portion 24A of the first transparent conductive pattern 22A and the second insulating portion 24B of the second transparent conductive pattern 22B are opposed to each other with the first transparent base 12A interposed therebetween. The line widths of the first transparent conductive pattern 22A and the second transparent conductive pattern 22B are the same, but the positions of the first transparent conductive pattern 22A and the second transparent conductive pattern 22B in FIG. 10 are the same as in FIG. As can be seen, the line width of the first transparent conductive pattern 22A is widened and the line width of the second transparent conductive pattern 22B is thinned and exaggerated.

  When the stacked first conductive sheet 10A and second conductive sheet 10B are viewed from above, the second large size of the second conductive sheet 10B is filled so as to fill the gaps of the first large lattice 14A formed in the first conductive sheet 10A. The lattice 14B is arranged. At this time, the opening portions of the rectangular wave-shaped concave portions 42a in the first side portion 28a and the second side portion 28b of the first large lattice 14A correspond to the sixth side portion 28f and the eighth side portion 28h of the second large lattice 14B. It becomes a shape that is connected at the tip of each rectangular wave-shaped convex portion 18b, resulting in a form in which the small lattices 18 are continuously arranged. Similarly, the third large lattice 14A has a third shape. The opening portions of the rectangular wave-shaped concave portions 42a in the side portion 28c and the fourth side portion 28d are the tip portions of the rectangular wave-shaped convex portions 42b of the fifth side portion 28e and the seventh side portion 28g of the second large lattice 14B. As a result, the small lattices are continuously arranged, and the boundary between the first large lattice 14A and the second large lattice 14B is almost indistinguishable. . That is, the overlap between the opening portion of the rectangular wave-shaped concave portion 42a and the tip portion of the convex portion 42b makes the boundary between the first large lattice 14A and the second large lattice 14B inconspicuous, and visibility is improved. Note that a cross-shaped opening is formed at the portion where the first insulating portion 24A and the second insulating portion 24B face each other. However, unlike the above-described line weighting, the portion does not block light. There is almost no noticeable.

  Also about the part where 16 A of 1st connection parts and the 2nd connection part 16B faced, the intersection of the 5th middle grating | lattice 20e of the 2nd connection part 16B and the 7th middle grating | lattice 20g similarly to the conductive sheet 50A for 1st touch panels. Is located approximately at the center of the second intermediate lattice 20b of the first connection portion 16A, and the intersection of the sixth intermediate lattice 20f and the eighth intermediate lattice 20h of the second connection portion 16B is the third intermediate lattice of the first connection portion 16A. The plurality of small lattices 18 are formed by a combination of the first intermediate lattice 20a to the eighth intermediate lattice 20h. That is, a plurality of small lattices 18 are arranged in a portion where the first connection portion 16A and the second connection portion 16B face each other by a combination of the first connection portion 16A and the second connection portion 16B. It becomes indistinguishable from the small lattice 18 constituting the first large lattice 14A and the small lattice 18 constituting the second large lattice 14B, and visibility is improved.

  As described above, in the second touch panel conductive sheet 50B, when the second touch panel conductive sheet 50B is applied to, for example, a projected capacitive touch panel, the response speed can be increased. Increase in size can be promoted. Moreover, the boundary between the first large lattice 14A of the first conductive sheet 10A and the second large lattice 14B of the second conductive sheet 10B becomes inconspicuous, and there are a plurality of combinations depending on the combination of the first connection portion 16A and the second connection portion 16B. Since the small lattice 18 is formed, there is no inconvenience such as local thickening of the line, and the visibility is improved as a whole.

  In particular, in this second touch panel conductive sheet 50B, four sides (first side portion 28a to fourth side portion 28d) of the first large lattice 14A and four sides (fifth side portion) of the second large lattice 14B. 28e to 8th side portion 28h) are all rectangular wave shapes, and the shape of each side is equivalently the same, so the end portions of the first large lattice 14A and the second large lattice 14B In this case, the localization of electric charges at the fingertips is suppressed, and erroneous detection of the fingertip position can be prevented.

  In the first conductive sheet 10A and the second conductive sheet 10B described above, the arrangement pitch Pm of the intermediate lattice 20 constituting the first connection portion 16A and the second connection portion 16B is set to twice the arrangement pitch Ps of the small lattice 18. However, it can be arbitrarily set according to the number of medium lattices, such as 1.5 times or 3 times. Since the arrangement pitch Pm of the medium lattice 20 is too narrow or too large, the arrangement of the large lattice 14 becomes difficult and the appearance may be deteriorated. 10 times is preferable and 1 to 5 times is more preferable.

  Further, the size of the small lattice 18 (the length of one side, the length of the diagonal line, etc.), the number of small lattices 18 constituting the first large lattice 14A, and the number of small lattices 18 constituting the second large lattice 14B, It can be set as appropriate according to the size and resolution (number of wires) of the applied touch panel.

  Next, as a method for producing the first conductive sheet 10A and the second conductive sheet 10B, for example, a photosensitive having an emulsion layer containing a photosensitive silver halide salt on the first transparent substrate 12A and the second transparent substrate 12B. The material is exposed and developed to form the first transparent conductive pattern 22A and the second transparent conductive pattern 22B by forming a metallic silver portion and a light transmissive portion in the exposed portion and the unexposed portion, respectively. May be. In addition, you may make it carry | support a conductive metal to a metallic silver part by giving a physical development and / or a plating process to a metallic silver part further.

  Alternatively, the photoresist film on the copper foil formed on the first transparent substrate 12A and the second transparent substrate 12B is exposed and developed to form a resist pattern, and the copper foil exposed from the resist pattern is etched. The first transparent conductive pattern 22A and the second transparent conductive pattern 22B may be formed.

  Alternatively, the first transparent conductive pattern 22A and the second transparent conductive pattern 22B are formed by printing a paste containing metal fine particles on the first transparent substrate 12A and the second transparent substrate 12B and performing metal plating on the paste. It may be.

  The first transparent conductive pattern 22A and the second transparent conductive pattern 22B may be printed and formed on the first transparent substrate 12A and the second transparent substrate 12B by a screen printing plate or a gravure printing plate.

Next, in the first conductive sheet 10A and the second conductive sheet 10B according to this embodiment, a method using a silver halide photographic light-sensitive material that is a particularly preferable aspect will be mainly described.
The manufacturing method of the first conductive sheet 10A and the second conductive sheet 10B according to the present embodiment includes the following three modes depending on the mode of the photosensitive material and the development process.
(1) An embodiment in which a photosensitive silver halide black-and-white photosensitive material not containing physical development nuclei is chemically developed or thermally developed to form a metallic silver portion on the photosensitive material.
(2) An embodiment in which a photosensitive silver halide black-and-white photosensitive material containing physical development nuclei in a silver halide emulsion layer is dissolved and physically developed to form a metallic silver portion on the photosensitive material.
(3) A photosensitive silver halide black-and-white photosensitive material containing no physical development nuclei and an image receiving sheet having a non-photosensitive layer containing physical development nuclei are overlapped and developed by diffusion transfer, and the metallic silver portion is non-photosensitive image-receiving sheet. Form formed on top.

The aspect (1) is an integrated black-and-white development type, and a light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material. The resulting developed silver is chemically developed silver or heat developed silver, and is highly active in the subsequent plating or physical development process in that it is a filament with a high specific surface.
In the above aspect (2), the light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material by dissolving silver halide grains close to the physical development nucleus and depositing on the development nucleus in the exposed portion. A characteristic film is formed. This is also an integrated black-and-white development type. Although the development action is precipitation on the physical development nuclei, it is highly active, but developed silver is a sphere with a small specific surface.
In the above aspect (3), the silver halide grains are dissolved and diffused in the unexposed area and deposited on the development nuclei on the image receiving sheet, thereby translucent light transmitting conductive film or the like on the image receiving sheet. A conductive film is formed. This is a so-called separate type in which the image receiving sheet is peeled off from the photosensitive material.

  In either embodiment, either negative development processing or reversal development processing can be selected (in the case of the diffusion transfer method, negative development processing is possible by using an auto-positive type photosensitive material as the photosensitive material). .

  The chemical development, thermal development, dissolution physical development, and diffusion transfer development mentioned here have the same meanings as are commonly used in the industry, and are general textbooks of photographic chemistry such as Shinichi Kikuchi, “Photochemistry” (Kyoritsu Publishing) (Published in 1955), C.I. E. K. It is described in "The Theory of Photographic Processes, 4th ed." Edited by Mees (Mcmillan, 1977). Although this case is an invention related to liquid processing, a technique of applying a thermal development system as another development system can also be referred to. For example, the techniques described in Japanese Patent Application Laid-Open Nos. 2004-184893, 2004-334077, and 2005-010752, and Japanese Patent Application Nos. 2004-244080 and 2004-085655 can be applied. it can.

  Here, the configuration of each layer of the first conductive sheet 10A and the second conductive sheet 10B according to the present embodiment will be described in detail below.

[First transparent substrate 12A, second transparent substrate 12B]
Examples of the first transparent substrate 12A and the second transparent substrate 12B include a plastic film, a plastic plate, and a glass plate.

  Examples of the raw material for the plastic film and the plastic plate include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene, and EVA; Resin; In addition, polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetyl cellulose (TAC) and the like can be used.

  As the first transparent substrate 12A and the second transparent substrate 12B, PET (melting point: 258 ° C.), PEN (melting point: 269 ° C.), PE (melting point: 135 ° C.), PP (melting point: 163 ° C.), polystyrene (melting point: 230 ° C.), polyvinyl chloride (melting point: 180 ° C.), polyvinylidene chloride (melting point: 212 ° C.), TAC (melting point: 290 ° C.) or the like, preferably a plastic film or plastic plate having a melting point of about 290 ° C. or less, In particular, PET is preferable from the viewpoints of light transmittance and processability. Since the transparent conductive films such as the first conductive sheet 10A and the second conductive sheet 10B used for the first touch panel conductive sheet 50A and the second touch panel conductive sheet 50B are required to be transparent, the first transparent substrate is used. The transparency of 12A and the second transparent substrate 12B is preferably high.

[Silver salt emulsion layer]
Silver used as conductive layers (conductive portions such as the first large lattice 14A, the first connecting portion 16A, the second large lattice 14B, the second connecting portion 16B, and the small lattice 18) of the first conductive sheet 10A and the second conductive sheet 10B. The salt emulsion layer contains additives such as a solvent and a dye in addition to the silver salt and the binder.

  Examples of the silver salt used in the present embodiment include inorganic silver salts such as silver halide and organic silver salts such as silver acetate. In the present embodiment, it is preferable to use silver halide having excellent characteristics as an optical sensor.

Silver coating amount of silver salt emulsion layer (coating amount of silver salt) is preferably from 1 to 30 g / ^{m 2} in terms of silver, more preferably 1 to 25 g / ^{m 2,} more preferably 5 to 20 g / ^{m 2} . By setting the coated silver amount within the above range, a desired surface resistance can be obtained when the first touch panel conductive sheet 50A and the second touch panel conductive sheet 50B are used.

  Examples of the binder used in this embodiment include gelatin, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), starch and other polysaccharides, cellulose and derivatives thereof, polyethylene oxide, polyvinyl amine, chitosan, polylysine, and polyacryl. Examples include acid, polyalginic acid, polyhyaluronic acid, carboxycellulose and the like. These have neutral, anionic, and cationic properties depending on the ionicity of the functional group.

  The content of the binder contained in the silver salt emulsion layer 16 of the present embodiment is not particularly limited, and can be appropriately determined as long as dispersibility and adhesion can be exhibited. The content of the binder in the silver salt emulsion layer 16 is preferably 1/4 or more, and more preferably 1/2 or more in terms of a silver / binder volume ratio. The silver / binder volume ratio is preferably 100/1 or less, and more preferably 50/1 or less. The silver / binder volume ratio is more preferably 1/1 to 4/1. Most preferably, it is 1/1 to 3/1. By setting the silver / binder volume ratio in the silver salt emulsion layer within this range, even when the amount of coated silver is adjusted, variation in the resistance value is suppressed, and the first touch panel conductive sheet 50A having a uniform surface resistance and the second A conductive sheet 50B for two touch panels can be obtained. The silver / binder volume ratio is converted from the amount of silver halide in the raw material / the amount of binder (weight ratio) to the amount of silver / the amount of binder (weight ratio). / It can obtain | require by converting into binder amount (volume ratio).

<Solvent>
The solvent used for forming the silver salt emulsion layer is not particularly limited. For example, water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, dimethyl sulfoxide, etc. Sulphoxides such as, esters such as ethyl acetate, ethers, etc.), ionic liquids, and mixed solvents thereof.
The content of the solvent used in the silver salt emulsion layer of the present embodiment is in the range of 30 to 90% by mass with respect to the total mass of the silver salt and binder contained in the silver salt emulsion layer, and 50 to 80 It is preferably in the range of mass%.
<Other additives>
There are no particular restrictions on the various additives used in the present embodiment, and known ones can be preferably used.

[Other layer structure]
A protective layer (not shown) may be provided on the silver salt emulsion layer. In the present embodiment, the “protective layer” means a layer made of a binder such as gelatin or a high molecular polymer, and is formed on a silver salt emulsion layer having photosensitivity in order to exhibit an effect of preventing scratches and improving mechanical properties. It is formed. The thickness is preferably 0.5 μm or less. The coating method and forming method of the protective layer are not particularly limited, and a known coating method and forming method can be appropriately selected. An undercoat layer, for example, can be provided below the silver salt emulsion layer 16.

  Next, each step of the manufacturing method of the first conductive sheet 10A and the second conductive sheet 10B will be described.

[exposure]
The present embodiment includes the case where the first transparent conductive pattern 22A and the second transparent conductive pattern 22B are applied by a printing method, but the first transparent conductive pattern 22A and the second transparent conductive pattern 22B are exposed by exposure except for the printing method. It is formed by development or the like. That is, exposure is performed on a photosensitive material having a silver salt-containing layer provided on the first transparent substrate 12A and the second transparent substrate 12B or a photosensitive material coated with a photolithography photopolymer. The exposure can be performed using electromagnetic waves. Examples of the electromagnetic wave include light such as visible light and ultraviolet light, and radiation such as X-rays. Furthermore, a light source having a wavelength distribution may be used for exposure, or a light source having a specific wavelength may be used.

[Development processing]
In this embodiment, after the emulsion layer is exposed, development processing is further performed. The development processing can be performed by a normal development processing technique used for silver salt photographic film, photographic paper, printing plate-making film, photomask emulsion mask, and the like. The developer is not particularly limited, but a PQ developer, MQ developer, MAA developer and the like can also be used. Commercially available products include, for example, CN-16, CR-56, CP45X, and FD prescribed by FUJIFILM Corporation. -3, Papitol, a developer such as C-41, E-6, RA-4, D-19, D-72, etc. formulated by KODAK, or a developer included in the kit can be used. A lith developer can also be used.

  The development processing in the present invention can include a fixing processing performed for the purpose of removing and stabilizing the silver salt in the unexposed portion. For the fixing process in the present invention, a fixing process technique used for silver salt photographic film, photographic paper, film for printing plate making, emulsion mask for photomask, and the like can be used.

The fixing temperature in the fixing step is preferably about 20 ° C. to about 50 ° C., more preferably 25 to 45 ° C. The fixing time is preferably 5 seconds to 1 minute, more preferably 7 seconds to 50 seconds. The replenishing amount of the fixing solution is preferably 600 ml / ^{m 2} or less with respect to the processing of the photosensitive material, more preferably 500 ml / ^{m 2} or less, 300 ml / ^{m 2} or less is particularly preferred.

The light-sensitive material that has been subjected to development and fixing processing is preferably subjected to water washing treatment or stabilization treatment. In the water washing treatment or the stabilization treatment, the washing water amount is usually 20 liters or less per 1 m ^{2 of the} light-sensitive material, and can be replenished in 3 liters or less (including 0, ie, rinsing with water).

  The mass of the metallic silver contained in the exposed portion after the development treatment is preferably a content of 50% by mass or more, and 80% by mass or more with respect to the mass of silver contained in the exposed portion before exposure. More preferably. If the mass of silver contained in the exposed portion is 50% by mass or more based on the mass of silver contained in the exposed portion before exposure, it is preferable because high conductivity can be obtained.

  The gradation after the development processing in the present embodiment is not particularly limited, but is preferably more than 4.0. When the gradation after the development processing exceeds 4.0, the conductivity of the conductive metal portion can be increased while keeping the light transmissive property of the light transmissive portion high. Examples of means for setting the gradation to 4.0 or higher include the aforementioned doping of rhodium ions and iridium ions.

  Although the conductive sheet is obtained through the above steps, the surface resistance of the obtained conductive sheet is 0.1 to 100 ohm / sq. Is preferably in the range of 1 to 10 ohm / sq. It is more preferable that it is in the range. Further, the conductive sheet after the development treatment may be further subjected to a calendar treatment, and can be adjusted to a desired surface resistance by the calendar treatment.

[Physical development and plating]
In the present embodiment, for the purpose of improving the conductivity of the metallic silver portion formed by the exposure and development processing, physical development and / or plating treatment for supporting the conductive metal particles on the metallic silver portion is performed. May be. In the present invention, the conductive metal particles may be supported on the metallic silver portion by only one of physical development and plating treatment, or the conductive metal particles are supported on the metallic silver portion by combining physical development and plating treatment. May be. In addition, the thing which performed the physical development and / or the plating process to the metal silver part is called "conductive metal part".

  “Physical development” in the present embodiment means that metal particles such as silver ions are reduced by a reducing agent on metal or metal compound nuclei to deposit metal particles. This physical phenomenon is used for instant B & W film, instant slide film, printing plate manufacturing, and the like, and the technology can be used in the present invention. Further, the physical development may be performed simultaneously with the development processing after exposure or separately after the development processing.

  In the present embodiment, the plating treatment can use electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or both electroless plating and electrolytic plating. For the electroless plating in the present embodiment, a known electroless plating technique can be used, for example, an electroless plating technique used in a printed wiring board or the like can be used. Plating is preferred.

[Oxidation treatment]
In the present embodiment, it is preferable to subject the metallic silver portion after the development treatment and the conductive metal portion formed by physical development and / or plating treatment to oxidation treatment. By performing the oxidation treatment, for example, when a metal is slightly deposited on the light transmissive portion, the metal can be removed and the light transmissive portion can be made almost 100% transparent.

[Conductive metal part]
The line width of the conductive metal portion of the present embodiment can be selected from 5 μm to 200 μm (0.2 mm), but is preferably 5 μm to 50 μm when used as a touch panel material. More preferably, they are 5 micrometers or more and 30 micrometers or less, Most preferably, they are 5 micrometers or more and 20 micrometers or less. The line spacing is preferably 30 μm or more and 500 μm or less, more preferably 50 μm or more and 400 μm or less, and most preferably 100 μm or more and 350 μm or less. The conductive metal portion may have a portion whose line width is wider than 200 μm for the purpose of ground connection or the like.

  The conductive metal portion in the present embodiment preferably has an aperture ratio of 85% or more, more preferably 90% or more, and most preferably 95% or more from the viewpoint of visible light transmittance. The aperture ratio is the ratio of the light-transmitting portions excluding the conductive portions such as the first large lattice 14A, the first connecting portion 16A, the second large lattice 14B, the second connecting portion 16B, and the small lattice 18 to the whole. For example, the aperture ratio of a square lattice having a line width of 15 μm and a pitch of 300 μm is 90%.

[Light transmissive part]
The “light transmissive part” in the present embodiment means a part having translucency other than the conductive metal part in the first conductive sheet 10A and the second conductive sheet 10B. As described above, the transmittance in the light transmissive part is the transmission indicated by the minimum value of the transmittance in the wavelength region of 380 to 780 nm excluding the contribution of light absorption and reflection of the first transparent substrate 12A and the second transparent substrate 12B. The rate is 90% or more, preferably 95% or more, more preferably 97% or more, even more preferably 98% or more, and most preferably 99% or more.

  Regarding the exposure method, a method through a glass mask or a pattern exposure method by laser drawing is preferable.

[First conductive sheet 10A and second conductive sheet 10B]
The thickness of the first transparent base 12A and the second transparent base 12B in the first conductive sheet 10A and the second conductive sheet 10B according to the present embodiment is preferably 5 to 350 μm, and preferably 30 to 150 μm. Further preferred. If it is the range of 5-350 micrometers, the transmittance | permeability of a desired visible light will be obtained and handling will also be easy.

  The thickness of the metallic silver portion provided on the first transparent substrate 12A and the second transparent substrate 12B depends on the coating thickness of the silver salt-containing layer coating applied on the first transparent substrate 12A and the second transparent substrate 12B. Can be determined as appropriate. The thickness of the metallic silver portion can be selected from 0.001 mm to 0.2 mm, but is preferably 30 μm or less, more preferably 20 μm or less, and further preferably 0.01 to 9 μm. And most preferably 0.05 to 5 μm. Moreover, it is preferable that a metal silver part is pattern shape. The metallic silver part may be a single layer or a multilayer structure of two or more layers. When the metallic silver portion is patterned and has a multilayer structure of two or more layers, different color sensitivities can be imparted so as to be sensitive to different wavelengths. Thereby, when the exposure wavelength is changed and exposed, a different pattern can be formed in each layer.

  As the thickness of the conductive metal part, the thinner the display panel, the wider the viewing angle of the display panel, and the thinner the display is required for improving the visibility. From such a viewpoint, the thickness of the layer made of the conductive metal carried on the conductive metal part is preferably less than 9 μm, more preferably 0.1 μm or more and less than 5 μm, and more preferably 0.1 μm or more. More preferably, it is less than 3 μm.

  In the present embodiment, the thickness of the layer made of conductive metal particles is formed by controlling the coating thickness of the silver salt-containing layer described above to form a metallic silver portion having a desired thickness, and further by physical development and / or plating treatment. Therefore, even the first conductive sheet 10A and the second conductive sheet 10B having a thickness of less than 5 μm, preferably less than 3 μm, can be easily formed.

  In addition, in the manufacturing method of the first conductive sheet 10A and the second conductive sheet 10B according to the present embodiment, a process such as plating is not necessarily performed. In the manufacturing method of the first conductive sheet 10A and the second conductive sheet 10B according to the present embodiment, a desired surface resistance can be obtained by adjusting the coating silver amount of the silver salt emulsion layer and the silver / binder volume ratio. It is. In addition, you may perform a calendar process etc. as needed.

(Hardening after development)
It is preferable to perform a film hardening process by immersing the film in a hardener after the silver salt emulsion layer is developed. Examples of the hardener include dialdehydes such as glutaraldehyde, adipaldehyde, 2,3-dihydroxy-1,4-dioxane, and those described in JP-A-2-141279 such as boric acid. .

  In addition, this invention can be used in combination with the technique of the publication gazette and international publication pamphlet which are described in following Table 1 and Table 2. FIG. Notations such as “JP,” “Gazette” and “No. Pamphlet” are omitted.

  Hereinafter, the present invention will be described more specifically with reference to examples of the present invention. In addition, the material, usage-amount, ratio, processing content, processing procedure, etc. which are shown in the following Examples can be changed suitably unless it deviates from the meaning of this invention. Accordingly, the scope of the present invention should not be construed as being limited by the specific examples shown below.

(Silver halide photosensitive material)
An emulsion containing 10.0 g of gelatin per 150 g of Ag in an aqueous medium and containing silver iodobromochloride grains having an average equivalent sphere diameter of 0.1 μm (I = 0.2 mol%, Br = 40 mol%) was prepared. .

In this emulsion, K ₃ Rh ₂ Br ₉ and K ₂ IrCl ₆ were added so as to have a concentration of 10 ⁻⁷ (mol / mol silver), and silver bromide grains were doped with Rh ions and Ir ions. . After adding Na ₂ PdCl ₄ to this emulsion and further performing gold-sulfur sensitization using chloroauric acid and sodium thiosulfate, together with the gelatin hardener, the coating amount of silver was 10 g / m ^2. The coating was applied on the first transparent substrate 12A and the second transparent substrate 12B (both here are polyethylene terephthalate (PET)). At this time, the volume ratio of Ag / gelatin was 2/1.

  Coating was performed for 20 m with a width of 25 cm on a PET support having a width of 30 cm, and both ends were cut off by 3 cm so as to leave a central portion of the coating, thereby obtaining a roll-shaped silver halide photosensitive material.

(exposure)
The pattern of exposure is the pattern shown in FIGS. 1 and 3 for the first conductive sheet 10A of the conductive sheet 50A for the first touch panel, and the pattern shown in FIGS. 3 and 5 for the second conductive sheet 10B. 210 mm × 297 mm) for the first transparent substrate 12A and the second transparent substrate 12B. The first conductive sheet 10A of the second touch panel conductive sheet 50B has the pattern shown in FIGS. 7 and 8, and the second conductive sheet 10B has the pattern shown in FIGS. 7 and 9, and has an A4 size (210 mm × 297 mm). This was performed on the first transparent substrate 12A and the second transparent substrate 12B. The arrangement pitch Ps of the small lattice 18 was 200 μm, and the arrangement pitch Pm of the medium lattice 20 was 2 × Ps. The thickness of the conductive portion of the small lattice 18 was 2 μm, and the width was 10 μm. The exposure was performed using parallel light using a high-pressure mercury lamp as a light source through the photomask having the above pattern.

(Development processing)
・ Developer 1L formulation Hydroquinone 20 g
Sodium sulfite 50 g
Potassium carbonate 40 g
Ethylenediamine tetraacetic acid 2 g
Potassium bromide 3 g
Polyethylene glycol 2000 1 g
Potassium hydroxide 4 g
Adjusted to pH 10.3 and formulated 1L fixer ammonium thiosulfate solution (75%) 300 ml
Ammonium sulfite monohydrate 25 g
1,3-diaminopropane tetraacetic acid 8 g
Acetic acid 5 g
Ammonia water (27%) 1 g
Adjusted to pH 6.2 Processed photosensitive material using the above processing agent using Fujifilm's automatic processor FG-710PTS Processing conditions: development 35 ° C. for 30 seconds, fixing 34 ° C. for 23 seconds, washed water (5 L / Min) for 20 seconds.

[Evaluation]
(Surface resistance measurement)
In order to evaluate the uniformity of the surface resistivity, the surface resistivity of the first conductive sheet 10A and the second conductive sheet 10B is measured with a Learstar GP (model number MCP-T610) in-line four probe probe (ASP) manufactured by Dia Instruments. It is an average value of values measured at arbitrary 10 locations.

(Visibility evaluation)
The first conductive sheet 10A and the second conductive sheet 10B were bonded together to produce the first touch panel conductive sheet 50A and the second touch panel conductive sheet 50B, and it was confirmed with naked eyes whether there were no line thickening or black spots. .

(Evaluation results)
The surface resistance is 5 ohm / sq. For both the first conductive sheet 10A and the second conductive sheet 10B. Thus, it was found that the invention can be sufficiently applied to a projected capacitive touch panel having an A4 size. Moreover, neither the thickening of a line nor the black spot was confirmed in the conductive sheet 50A for the first touch panel and the conductive sheet 50B for the second touch panel, and the visibility was good.

  Note that the conductive sheet, the method of using the conductive sheet, and the touch panel according to the present invention are not limited to the above-described embodiments, and various configurations can be adopted without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 10A ... 1st conductive sheet 10B ... 2nd conductive sheet 12A ... 1st transparent base | substrate 12B ... 2nd transparent base | substrate 14A ... 1st large lattice 14B ... 2nd large lattice 16A ... 1st connection part 16B ... 2nd connection part 18 ... Small lattice 20... Medium lattice 20 a to 20 h... First intermediate lattice to eighth intermediate lattice 22 A... First transparent conductive pattern 22 B... Second transparent conductive pattern 24 A. 1st side part-8th side part 50A ... conductive sheet for first touch panel 50B ... conductive sheet for second touch panel

Claims (17)

On the substrate, two or more conductive large lattices and a connecting portion for electrically connecting the adjacent large lattices are formed,
Each of the large lattices is configured by combining two or more small lattices,
The conductive sheet is characterized in that one or more medium lattices having a pitch n times (n is a real number larger than 1) pitch of the small lattices are arranged in the connection portion. The conductive sheet according to claim 1,
The connecting portion has a shape in which a plurality of the intermediate grids are arranged in a zigzag shape. The conductive sheet according to claim 1,
The connection portion includes a plurality of the intermediate lattices in which one small lattice and an L-shaped space are formed. The conductive sheet according to claim 1,
The connecting portion has a shape in which one small lattice and a first middle lattice in which an L-shaped space is formed, and the four small lattices are arranged in a matrix, and a central cross is removed. 2. A conductive sheet comprising a grid of 2 connected in series. The conductive sheet according to claim 1,
The conductive sheet is characterized in that the arrangement pitch of the medium lattice is 1 to 10 times the arrangement pitch of the small lattice. The conductive sheet according to claim 1,
When the arrangement pitch of the small lattices is Ps and the arrangement pitch of the medium lattices is Pm,
Pm = 2 × Ps
A conductive sheet characterized by satisfying The conductive sheet according to claim 1,
A conductive sheet, wherein two or more of the large lattices are arranged in one direction through the connecting portion. The conductive sheet according to claim 1,
Two or more of the large lattices are arranged in the first direction through the connection portion to constitute one transparent conductive pattern,
Two or more transparent conductive patterns are arranged in a second direction orthogonal to the first direction;
An electrically conductive sheet, wherein an electrically insulated insulating portion is disposed between the adjacent transparent conductive patterns. One main surface of the base is formed with two or more conductive first large lattices and a first connection portion that electrically connects the adjacent first large lattices,
Two or more conductive second large lattices and a second connection portion for electrically connecting the adjacent second large lattices are formed on the other main surface of the base body,
Each of the first large lattice and each of the second large lattices is configured by combining two or more small lattices,
The first connection part and the second connection part are configured by arranging one or more medium lattices each having a pitch n times as large as the small lattice (n is a real number larger than 1). Conductive sheet. The conductive sheet according to claim 9, wherein
Two or more of the first large lattices are arranged in the first direction via the first connection portion to constitute one first transparent conductive pattern,
Two or more second large lattices are arranged in a second direction orthogonal to the first direction via the second connection portion to constitute one second transparent conductive pattern,
Two or more first transparent conductive patterns are arranged in the second direction;
Two or more second transparent conductive patterns are arranged in the first direction;
A first insulating portion that is electrically insulated is disposed between the adjacent first transparent conductive patterns,
A second insulating portion that is electrically insulated is disposed between the adjacent second transparent conductive patterns,
The first connection portion and the second connection portion are opposed to each other with the base interposed therebetween,
The conductive sheet, wherein the first insulating portion and the second insulating portion are opposed to each other with the base interposed therebetween. The conductive sheet according to claim 10,
The portion where the first insulating portion and the second insulating portion face each other with the base interposed therebetween has a form in which an opening having a size in which two or more small lattices are arranged is formed. Conductive sheet. The conductive sheet according to claim 11,
The conductive sheet is characterized in that the portion has a form in which an opening having a size corresponding to the one of the middle grids is formed. The conductive sheet according to claim 11,
The conductive sheet is characterized in that the portion has a form in which an opening having a size in which a plurality of the small lattices are arranged in a substantially cross shape is formed. The conductive sheet according to claim 9, wherein
Of the first large lattice, the first side has a form in which a large number of needle-like lines project in a comb-tooth shape from a linear portion continuous along the first side, and the first side and The opposing second side has a form in which a straight line portion continuous along the second side is formed,
Of the second large lattice, a third side facing the first side of the first large lattice through the base is formed with a linear portion continuous along the third side. And the fourth side facing the second side of the first large lattice via the base body has a plurality of needle-like lines combed from a straight line portion continuous along the first side. A conductive sheet characterized by having a shape protruding in a shape. The conductive sheet according to claim 9, wherein
The conductive sheet is characterized in that the small lattice has a square shape. Two or more conductive first large lattices and a first connection portion for electrically connecting the adjacent first large lattices are formed, and each of the first large lattices has two or more small lattices. A first conductive sheet configured by combining one or more medium lattices each having a pitch of n times (n is a real number larger than 1) each of the small lattices.
Two or more conductive second large lattices and a second connection portion for electrically connecting the adjacent second large lattices are formed, and each of the second large lattices has two or more small lattices. A second conductive sheet configured by arranging one or more medium lattices each having a pitch of n times (n is a real number larger than 1) each of the small lattices. A method of using a conductive sheet to be used,
In the first conductive sheet, two or more first large lattices are arranged in the first direction via the first connection portion to constitute one first transparent conductive pattern,
In the second conductive sheet, two or more second large lattices are arranged in a second direction orthogonal to the first direction via the second connection portion to constitute one second transparent conductive pattern,
By combining the first conductive sheet and the second conductive sheet, the first connection portion of the first conductive sheet and the second connection portion of the second conductive sheet are combined to form the arrangement of the small lattices. A method of using a conductive sheet, wherein the conductive sheet is arranged so as to form a film.   A capacitive touch panel comprising the conductive sheet according to claim 9.

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