JP2011102713A - Radiation detection element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a radiation detection element that can suppress the deterioration of characteristics caused by an external force or moisture. <P>SOLUTION: The radiation detection element 10 which is formed like a rectangular parallelepiped or a plate, and can detect radiation includes a front surface 10a having a first electrode, a rear surface 10b having a second electrode, a plurality of side surfaces 10c including a radiation incident surface 140 where radiation enters, side-surface covering layers 100 formed on the plurality of side surfaces 10c, and a rear-surface covering layer 120 that is formed at the edge of the rear surface 10b and has a larger thickness than the side-surface covering layer 100. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a radiation detection element. In particular, the present invention relates to a radiation detection element used in a radiation detection apparatus such as a gamma camera.

  As a conventional radiation detecting element, at least one electrode is a plurality of electrodes formed on two opposing surfaces of a rectangular parallelepiped compound semiconductor crystal, and ECR plasma CVD is applied to an end surface portion that is not an electrode forming surface of the compound semiconductor. 2. Description of the Related Art A radiation detection element in which an insulating protective thin film formed by vapor phase growth is formed is known (see, for example, Patent Document 1).

  In the radiation detection element described in Patent Document 1, an insulating protective thin film is formed on an end surface portion where no electrode is formed. Therefore, an oxide film is formed on the end surface portion, and solder bumps on the electrode portion are heated and melted. It is possible to prevent Sn or Pb, which is a component of solder, and impurities in the flux from entering the crystal.

JP-A-9-36410

  However, the radiation detection element according to Patent Document 1 does not consider damage that may occur in the compound semiconductor due to the force applied to the compound semiconductor constituting the element, and deterioration of characteristics due to moisture in the external environment. The characteristics of the element may be deteriorated due to the above.

  Accordingly, an object of the present invention is to provide a radiation detection element capable of suppressing deterioration of characteristics due to external force and humidity.

  In order to achieve the above object, the present invention is a radiation detecting element that is formed in a rectangular parallelepiped shape or a flat plate shape and capable of detecting radiation, and includes a surface having a first electrode, a back surface having a second electrode, and radiation. Radiation detection element comprising: a plurality of side surfaces including a radiation incident surface on which light is incident; a side surface coating layer provided on the plurality of side surfaces; Is provided.

  In the radiation detection element, the side surface coating layer and the back surface coating layer may be provided integrally.

  Further, in the radiation detection element, when the radiation detection element is fixed to the substrate, the second electrode is fixed to the substrate by the conductive member, and the back surface coating layer has a thickness equal to or less than the thickness of the conductive member. It is preferable to have.

  The radiation detection element may further include a surface coating layer provided on an edge portion of the surface.

  In the radiation detection element, the side surface coating layer may have a thickness of 1 μm to 2 μm, and the back surface coating layer may have a thickness of 5 μm to 10 μm.

  In the radiation detection element, the side surface coating layer and the back surface coating layer are preferably formed of an insulating material.

  The radiation detection element may be used in a radiation detector including a substrate and a support member that supports the substrate at a portion adjacent to the radiation detection element.

  In the radiation detection element, the substrate has the radiation detection element on the first end portion side of the substrate, and the support member is on the second end portion side opposite to the first end portion. May be supported.

  According to the radiation detector according to the present invention, it is possible to provide a radiation detection element capable of suppressing deterioration of characteristics due to external force and humidity.

It is a perspective view of the element for radiation detection concerning an embodiment of the invention. (A) is a front view of the element for radiation detection concerning this embodiment, and (b) is a back view of the element for radiation detection concerning this embodiment. It is sectional drawing of the element for radiation detection which concerns on this Embodiment. It is a perspective view of a radiation detector. It is a perspective view at the time of removing a flexible substrate from a radiation detector. It is a front view of the board | substrate with which a radiation detector is provided. It is a perspective view at the time of mounting the several element for radiation detection which concerns on this Embodiment on the board | substrate with which a radiation detector is equipped. It is sectional drawing in the case of mounting the radiation detection element concerning this Embodiment on a board | substrate. It is sectional drawing in case a radiation detection element inclines when the radiation detection element which concerns on this Embodiment is mounted in a board | substrate. It is a perspective view from the surface side of a card holder. It is a perspective view from the back side of a card holder. It is a figure of the masking jig used when forming a coating layer in the semiconductor element concerning this embodiment. It is sectional drawing which shows the outline | summary of the positional relationship of a semiconductor element and a mask.

[Summary of embodiment]
In a radiation detection element formed in a rectangular parallelepiped shape or a flat plate shape and capable of detecting radiation, a front surface having a first electrode, a back surface having a second electrode, and a plurality of side surfaces including a radiation incident surface on which the radiation is incident There is provided a radiation detection element comprising a side surface coating layer provided on the plurality of side surfaces and a back surface coating layer provided at an edge portion of the back surface and having a thickness greater than that of the side surface coating layer.

[Embodiment]
1A is a perspective view of a radiation detection element according to an embodiment of the present invention, FIG. 1B (a) shows the surface of the radiation detection element according to the present embodiment, and FIG. 1B (b) The back surface of the element for radiation detection which concerns on this Embodiment is shown. Furthermore, FIG. 1C shows a schematic cross section of the radiation detection element according to the present exemplary embodiment.

(Outline of configuration of radiation detecting element 10)
The radiation detection element 10 according to the present embodiment is configured using a semiconductor element 150 that can detect radiation such as γ-rays and X-rays. As shown in FIG. 1A, the radiation detection element 10 is formed in a rectangular parallelepiped shape or a flat plate shape, and a radiation incident surface 140 on which radiation enters one of the two side surfaces having the largest area among the plurality of side surfaces 10c. Can be. As an example, the radiation detection element 10 has a size of length × width × thickness of 11.1 mm × 5 mm × 1.2 mm.

In the present embodiment, the radiation detection element 10 can be configured using a semiconductor element 150 mainly composed of a compound semiconductor. For example, the semiconductor element 150 can be mainly composed of CdTe. Further, the semiconductor element 150 is not limited to being made of CdTe as long as radiation such as γ rays can be detected. For example, the semiconductor element 150 can be configured using a compound semiconductor such as CdZnTe (CZT) or HgI ₂ .

  The radiation detecting element 10 includes a front surface 10a having a cathode electrode 130 as a first electrode, a back surface 10b having an anode electrode 135 as a second electrode, a plurality of side surfaces 10c including a radiation incident surface 140, and a plurality of side surfaces 10c. The side surface coating layer 100 provided on the side surface 10c of the surface 10 and the surface coating layer 110 provided on the edge portion of the surface 10a. Furthermore, the radiation detection element 10 includes a back surface coating layer 120 provided at an edge portion of the back surface 10 b and having a thickness thicker than that of the side surface coating layer 100. In the present embodiment, the side surface coating layer 100 and the surface coating layer 110 are provided integrally. Further, the side surface coating layer 100 and the back surface coating layer 120 are integrally provided.

  Further, as shown in FIGS. 1B (b) and 1C, a plurality of grooves 10d are formed on the back surface 10b of the radiation detection element 10. The plurality of groove portions 10d are provided at substantially equal intervals on the back surface 10b. Each of the portions of the radiation detection element 10 separated by the groove 10d corresponds to one pixel (pixel) that detects radiation. Thereby, one radiation detection element 10 has a plurality of pixels. Then, the anode electrode 135 is formed on the surface of the convex portion formed between the one groove portion 10d and another groove portion 10d adjacent to the one groove portion 10d (that is, the surface of the back surface 10b). Therefore, the back surface 10b of the radiation detection element 10 according to the present exemplary embodiment is formed with a plurality of linear anode electrodes 135 extending along the short side direction in a plan view of the back surface 10b. Note that the number of pixels of one radiation detection element 10 can be increased or decreased by increasing or decreasing the number of groove portions 10d.

(Side coating layer 100, surface coating layer 110, and back coating layer 120)
The side surface coating layer 100 is provided so as to cover the side surface of the radiation detection element 10. On the other hand, the surface covering layer 110 is provided on the edge portion of the surface 10a, and the short side surface covering layer 110a provided on the edge portion along the short side direction and the long side surface provided on the edge portion along the long side direction. And a coating layer 110b. That is, the surface coating layer 110 is formed with a substantially rectangular opening so that the surface of the cathode electrode 130 is exposed on the surface 10a. The edge portion of the cathode electrode 130 is covered with the short-side surface coating layer 110a and the long-side surface coating layer 110b. Further, in the present embodiment, as shown in FIG. 1B (a), as an example, the width t ₁ of the short side surface coating layer 110a is formed narrower than the width t ₂ of the longitudinal side surface covering layer 110b. For example, the width t ₁ of the short-side surface coating layer 110a is 0.3 mm, and the width t ₂ of the long-side surface coating layer 110b is 0.5 mm.

  Further, the back surface coating layer 120 is provided at the edge portion of the back surface 10b, and the short side back surface coating layer 120a provided at the edge portion along the short side direction and the long side back surface provided at the edge portion along the longitudinal direction. And a coating layer 120b. That is, the back surface coating layer 120 is formed with a substantially rectangular opening so that each of the surfaces of the plurality of anode electrodes 135 is exposed on the back surface 10b. Similarly to the surface coating layer 110, the back surface coating layer 120 can be configured to have a short side back surface coating layer 120a formed narrower than the width of the long side back surface coating layer 120b.

  Reference is now made to FIG. 1C. In the present embodiment, the back surface coating layer 120 is formed thicker than the side surface coating layer 100 formed on the side surface of the radiation detection element 10. That is, when the thickness of the side surface coating layer 100 is “a” and the thickness of the back surface coating layer 120 is “b”, the side surface coating layer 100 and the back surface coating layer 120 are formed so as to satisfy the relationship of “a <b”. It is formed. As an example, the side surface coating layer 100 is formed with a thickness of 1 μm or more and 2 μm or less, and the back surface coating layer 120 is formed with a thickness of 5 μm or more and 10 μm or less. Note that the thickness of the surface coating layer 110 may be formed to be greater than the thickness of the side surface coating layer 100.

  In the present embodiment, the side surface coating layer 100, the surface coating layer 110, and the back surface coating layer are mainly formed from an insulating material. As the insulating material, a fluorine-based resin such as polytetrafluoroethylene and other insulating resins can be used.

(Outline of configuration of radiation detector 1)
FIG. 2A is a perspective view of a radiation detector provided with the radiation detection element 10 according to the present exemplary embodiment, and FIG. 2B is a perspective view when a flexible substrate is removed from the radiation detector.

  The radiation detector 1 includes a plurality of radiation detection elements 10. Here, as shown in FIG. 2A, it is assumed that the radiation 300 propagates from the top to the bottom of the page. In this case, the radiation 300 propagates along the direction from the radiation detection element 10 side of the radiation detector 1 toward the card holder 30 and the card holder 31. The radiation detector 1 detects the radiation 300 on the radiation incident surface 140 (that is, the side surface facing upward in FIG. 2A) which is one of the side surfaces 10c of the radiation detection element 10. In this way, a radiation detector in which a part of the side surface of the radiation detection element 10 is the radiation incident surface 140 is referred to as an edge-on type radiation detector. The radiation detector 1 detects the radiation 300 via a collimator having a plurality of openings through which the radiation 300 propagating along a specific direction (for example, a direction from the subject toward the radiation detector 1) passes. The radiation detector 1 for an edge-on type radiation detection apparatus configured by arranging a plurality of radiation detectors 1 may be configured. The radiation detector 1 has a card shape.

  The radiation detector 1 can include a collimator. The radiation detector 1 can also be used without a collimator. When using a collimator, a porous parallel collimator, a pinhole collimator, or the like can be used. In the following description, a case where a porous parallel collimator is used will be described as an example.

  Specifically, referring to FIG. 2A, the radiation detector 1 has a radiation detection element 10 that can detect the radiation 300 through a plurality of openings of the collimator and a wall portion that separates the plurality of openings of the collimator or A card holder 30 and a card holder as a support member for supporting the substrate 20 by sandwiching the substrate 20 between adjacent portions of the thin substrate 20 having a thickness equal to or less than the wall portion and the pair of radiation detection elements 10 31. In FIG. 2A, four pairs of radiation detection elements 10 are fixed to the substrate 20 at positions where the substrate 20 is sandwiched. That is, the pair of radiation detection elements 10 of each set is fixed to a symmetric position with the substrate 20 as a symmetry plane on each of one surface and the other surface of the substrate 20.

  Since the side surface 10c of the radiation detection element 10 according to this exemplary embodiment is covered with the side surface coating layer 100, a plurality of radiation detection elements are arranged when the plurality of radiation detection elements 10 are arranged on the substrate 20. Even if the 10 side surfaces come into contact with each other, damage to the side surface 10c of the radiation detection element 10, that is, damage to the semiconductor element 150 can be suppressed.

  The substrate 20 is sandwiched and supported by a card holder 30 as a first support portion and a card holder 31 as a second support portion. The card holder 30 and the card holder 31 are formed to have the same shape, and the protruding portion 36 of the card holder 31 is fitted into the grooved hole 34 of the card holder 30 and the grooved hole of the card holder 31 is fitted. The board | substrate 20 is supported by the projection part 36 (not shown) which the card holder 30 has fitted in 34 (not shown).

  The elastic member mounting portion 32 and the recess 32a are fixed by pressing the radiation detector 1 against the radiation detector stand when the radiation detector 1 is inserted into the radiation detector stand supporting the plurality of radiation detectors 1. This is a portion where an elastic member such as a leaf spring is provided. The radiation detector stand has a connector into which the card edge portion 29 is inserted. In the radiation detector 1, the card edge portion 29 is inserted into the connector, and the connector and the pattern 29a are electrically connected. Thus, the circuit is electrically connected to a control circuit as an external electric circuit, an external power supply line, a ground line, and the like.

  The radiation detector 1 has a wiring pattern that electrically connects the cathode electrode 130 of each radiation detection element 10 and the plurality of substrate terminals 22 on the opposite side of the substrate 20 of the pair of radiation detection elements 10. A flexible substrate 40 is further provided.

  The flexible substrate 40 is provided on both the radiation detection element 10 side and the other radiation detection element 10 side of the pair of radiation detection elements 10 (in the example of FIGS. 2A and 2B, four sets of A flexible substrate 40 is provided on each of the radiation detection element 10 side of the pair of radiation detection elements 10 and each of the other radiation detection element 10 side). Then, one end of the plurality of wiring patterns of the flexible substrate 40 is electrically connected to the substrate terminal 22 at each of the joint portions 38 as the plurality of flexible lead coupling portions of the card holder 30 and the card holder 31. Specifically, one end of the wiring pattern of the flexible substrate 40 is connected to the cathode electrode 130 of the radiation detection element 10 with a conductive adhesive or the like. The other end of the wiring pattern is electrically connected to the terminal surface of the substrate terminal 22 using a conductive adhesive or the like.

  FIG. 3A is a front view of a substrate included in the radiation detector, and FIG. 3B is a perspective view when a plurality of radiation detection elements according to the present embodiment are mounted on the substrate included in the radiation detector.

(Details of substrate 20)
The substrate 20 is a thin substrate (for example, a glass epoxy substrate such as FR4) on which a conductive thin film (for example, copper foil) made of a conductive material such as a metal conductor is formed, and is made of an insulating material such as a solder resist. It is formed by being sandwiched between insulating layers 20b. And the board | substrate 20 has the thickness which is the same as the wall part which divides several opening of a collimator, or below the thickness of the said wall part while having flexibility. As an example, the plurality of openings of the collimator are formed in a substantially square shape. The size of the opening diameter of the plurality of openings is formed such that one side is 1.2 mm and the openings are arranged in a matrix at a pitch of 1.4 mm. Therefore, the collimator has a wall thickness of 0.2 mm separating one opening and another opening adjacent to the one opening. In the present embodiment, for example, the substrate 20 has a thickness (for example, 0.2 mm) that is substantially the same as the thickness of the wall that separates the openings of the collimator, or a thickness that is equal to or less than the thickness of the wall. It is formed.

  In addition, the substrate 20 has a width on the first end side on which each of the plurality of radiation detection elements 10 is mounted on a side opposite to the first end side on which the plurality of radiation detection elements 10 are mounted. It is formed wider than the second end side. The substrate 20 is supported by the card holder 30 and the card holder 31 on the second end side. In addition, a plurality of element connection portions 20a that are electrically connected to the plurality of anode electrodes 135 included in the plurality of radiation detection elements 10 are provided in a part of the wide region of the substrate 20, and the elements A card provided with a plurality of patterns 29a capable of electrically connecting the radiation detector 1 and an external control circuit on the second end side facing the first end provided with the connecting portion 20a An edge portion 29 is provided. In addition, a plurality of electronic component mounting portions 26 for mounting electronic components such as resistors and capacitors that are electrically connected to each of the plurality of radiation detection elements 10 are provided between the element connecting portion 20a and the card edge portion 29. Provided. Note that an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), or the like can be mounted on the electronic component mounting unit 26.

  As an example, the substrate 20 is formed to have a length of about 40 mm in the wide direction, that is, the longitudinal direction. The substrate 20 is short from the end of the wide portion to the end of the narrowed portion, that is, from the end of the portion where the element connecting portion 20a is provided to the end of the card edge portion 29. In the direction, it is formed with a length of about 20 mm.

  Further, the substrate 20 has a plurality of columnar substrate terminals 22 formed to protrude from the surface of the substrate 20 along the normal direction of the surface between the element connection portion 20a and the electronic component mounting portion 26. As an example, four cylindrical substrate terminals 22 are formed on one surface of the substrate 20. The substrate terminal 22 may be a column having a rectangular cross section. Further, the substrate 20 has a ground 28 at the corner of the wide portion, and a plurality of through holes 24 into which the card holder 30 and the protrusions 36 of the card holder 31 are inserted are provided in the area where the ground 28 is provided. .

  In addition, the element connection portion 20a, the substrate terminal 22, the electronic component mounting portion 26, the ground 28, and the pattern 29a are each formed by using a conductive thin film located at the center in the thickness direction of the substrate 20 as a symmetry plane. 20 is provided on each of one surface and the other surface. Here, the element connecting portion 20a, the electronic component mounting portion 26, the ground 28, and the pattern 29a are provided at substantially symmetrical positions on one surface and the other surface, respectively, with the substrate as a symmetry plane. On the other hand, the plurality of substrate terminals 22 are provided at positions that alternate between one surface and the other surface. Further, each of the plurality of grounds 28 is formed by exposing the conductive thin film to the outside by removing the insulating layer 20b covering the conductive thin film.

(Mounting of radiation detection element 10 on substrate 20)
By connecting each of the plurality of anode electrodes 135 included in the plurality of radiation detection elements 10 to each of the element connection portions 20a of the substrate 20 illustrated in FIG. 3A, a plurality of radiation detection elements as illustrated in FIG. A substrate 20 on which 10 is mounted is formed. Specifically, the anode electrode 135 provided in each of the plurality of radiation detection elements 10 is fixed to each of the plurality of element connection portions 20a using a conductive adhesive 200, for example, Ag paste or the like. In the present embodiment, since four radiation detection elements 10 are fixed to one surface and the other surface of the substrate 20, one radiation detector 1 includes eight radiation detection elements 10. Become.

  4A shows an outline of a cross section when the radiation detection element according to the present embodiment is mounted on a substrate, and FIG. 4B shows radiation detection when the radiation detection element according to the present embodiment is mounted on the substrate. The outline of a section in case an element is inclined is shown. 4A and 4B, illustration of the anode electrode 135 and the element connection portion 20a included in the substrate 20 is omitted for the sake of simplicity.

  Each of the plurality of anode electrodes 135 of the radiation detection element 10 is mounted on the substrate 20 via a conductive adhesive 200 as a conductive member. If the shape of the conductive adhesive 200 does not change, the radiation detection element 10 is mounted on the substrate 20 so as to be horizontal to the surface of the substrate 20 as shown in FIG. 4A. However, when the conductive adhesive 200 is fluidized by heating when the radiation detection element 10 is mounted on the substrate 20, the radiation detection element 10 may tilt as shown in FIG. 4B. Here, the back surface coating layer 120 included in the radiation detection element 10 according to the present exemplary embodiment has a thickness equal to or less than the thickness of the conductive adhesive 200, and each of the end portions of the radiation detection element 10. Is protecting. The conductive adhesive 200 is formed with a thickness of 10 μm to 15 μm. Therefore, even when the radiation detection element 10 is tilted, the short side back surface coating layer 120a and / or the long side back surface coating layer 120b exhibit a function as a cushion, and the semiconductor element 150 is directly applied to the substrate 20. Can be prevented from touching.

(Details of card holder 30 and card holder 31)
FIG. 5A is a perspective view from the front side of the card holder, and FIG. 5B is a perspective view from the back side of the card holder.

  Since the card holder 30 and the card holder 31 have the same shape, only the card holder 30 will be described below.

  Referring to FIG. 5A, the card holder 30 includes a plurality of grooved holes 34 in which the elastic member mounting portion 32 and the concave portion 32 a to which the elastic member is fixed and the projection portion 36 of the card holder 31 that is a pair of the card holder 30 are fitted. And a plurality of joints 38 to which the wiring pattern of the flexible substrate 40 is connected, and a plurality of terminal holes 38a through which the substrate terminals 22 of the substrate 20 pass. Further, the card holder 30 has a protrusion 30a and a notch 30b at both lower ends when the side on which the plurality of radiation detection elements 10 of the radiation detector 1 are provided is the upper side.

  5B, the card holder 30 further includes a plurality of protrusions 36 that fit into the grooved holes 34 of the card holder 31 on the back surface thereof. Further, the card holder 30 further includes a recessed portion 39 at a position corresponding to the plurality of electronic component mounting portions 26 of the substrate 20. The electronic parts mounted on the electronic part mounting part 26 of the substrate 20 are covered with the card holder 30 and the card holder 31 by the indented part 39 and come into contact with another radiation detector 1 adjacent to the one radiation detector 1. Is prevented.

  The elastic member mounting portion 32 and the concave portion 32a are provided at each end portion in the longitudinal direction of the card holder 30. The plurality of joints 38 and the terminal holes 38 a are respectively provided in regions near the center of the card holder 30 so as to correspond to the positions of the board terminals 22 included in the board 20. Further, the plurality of grooved holes 34 are regions between the elastic member mounting portion 32 and the joint portion 38, and the grooved holes 34 closest to the elastic member mounting portion 32 among the plurality of grooved holes 34. It is provided at a position closer to the elastic member mounting portion 32 than. Each of the card holder 30 and the card holder 31 can be formed from an insulating resin material.

(Method for manufacturing radiation detecting element 10)
FIG. 6A shows a masking jig used when forming a coating layer on the semiconductor element according to the present embodiment, and FIG. 6B is a cross-sectional view showing an outline of the positional relationship between the semiconductor element and the mask. 6A and 6B, illustration of the cathode electrode 130 and the anode electrode 135 is omitted for convenience of explanation.

  First, the semiconductor element 150 in which the cathode electrode 130 and the anode electrode 135 are formed is prepared. In the present embodiment, a masking jig 2 having a recess 2 a is used to form a coating layer in a predetermined region of the semiconductor element 150. Specifically, first, as shown in FIGS. 6A and 6B, the semiconductor element 150 is mounted in the recess 2 a of the masking jig 2 via the spacer 5. Further, the mask 4 is placed on the surface of the semiconductor element 150 opposite to the concave portion 2 a with the spacer 5 interposed. Then, the surface of the mask 4 is fixed with 3. In addition, since the spacer 5 is formed from elastic materials, such as rubber | gum, it can suppress that a semiconductor element 150 is damaged.

  In this state, as shown in FIG. 6B, a predetermined insulating material is sprayed onto the semiconductor element 150 (see the spraying direction 400 in FIG. 6B). Since the front surface or the back surface of the semiconductor element 150 is masked by the mask 4 and the back surface or the front surface faces the concave portion 2a, the resin material does not adhere to the cathode electrode 130 or the anode electrode 135. Through the above steps, the radiation detection element 10 according to the present embodiment is manufactured.

(Effect of embodiment)
In the radiation detection element 10 according to the embodiment of the present invention, the side surface coating layer 100 is formed on each of the side surfaces 10c, the surface coating layer 110 is formed on the edge of the front surface 10a, and the back surface coating layer 120 is formed on the edge of the back surface 10b. Therefore, the force applied to the end of the semiconductor element 150 can be reduced, and damage to the radiation detection element 10 can be suppressed. Moreover, it can suppress that the characteristic of the element 10 for radiation detection deteriorates by the water | moisture content in air | atmosphere by coat | covering most of the elements 10 for radiation detection. Thereby, since the moisture resistance and durability of the radiation detection element 10 according to the present embodiment can be improved, the reliability of the radiation detection element 10 can be improved.

  In addition, since the radiation detection element 10 according to the present exemplary embodiment includes the side surface coating layer 100 on each of the side surfaces 10c, even if the radiation detection element 10 is thin, The voltage that can be generated when a high voltage is applied between the anode electrode 135 and noise due to the surface current flowing in the side surface 10c can be reduced.

  And since the element 10 for radiation detection which concerns on this Embodiment made the thickness of the coating layer formed in the edge part of the back surface 10b and / or the edge part of the surface 10a thicker than the side surface 10c, it is electroconductive. Even when the radiation detection element 10 is mounted on the substrate 20 or the like via the adhesive 200, damage to the semiconductor element 150 due to the inclination of the radiation detection element 10 can be prevented.

  While the embodiments of the present invention have been described above, the embodiments described above do not limit the invention according to the claims. In addition, it should be noted that not all the combinations of features described in the embodiments are essential to the means for solving the problems of the invention.

DESCRIPTION OF SYMBOLS 1 Radiation detector 2 Masking jig 2 Recessed part 3 Press 4 Mask 5 Spacer 10 Radiation detection element 10a Front surface 10b Back surface 10c Side surface 10d Groove part 20 Substrate 20a Element connection part 20b Insulating layer 22 Substrate terminal 24 Through hole 26 Electronic component mounting part 28 Ground DESCRIPTION OF SYMBOLS 29 Card edge part 29a Pattern 30, 31 Card holder 32 Elastic member mounting part 32a Recessed part 34 Grooved hole 36 Projection part 38 Coupling part 40 Flexible substrate 100 Side surface coating layer 110 Surface coating layer 110a Short side surface coating layer 110b Long side surface Covering layer 120 Back surface coating layer 120a Short side back surface coating layer 120b Long side back surface coating layer 130 Cathode electrode 135 Anode electrode 140 Radiation incident surface 150 Semiconductor element 200 Conductive adhesive 300 Radiation 400 Spraying direction

Claims (8)

A radiation detecting element formed in a rectangular parallelepiped shape or a flat plate shape and capable of detecting radiation,
A surface having a first electrode;
A back surface having a second electrode;
A plurality of side surfaces including a radiation incident surface on which the radiation is incident;
A side surface coating layer provided on the plurality of side surfaces;
A radiation detection element comprising a back surface coating layer provided at an edge portion of the back surface and having a thickness greater than that of the side surface coating layer.   The radiation detection element according to claim 1, wherein the side surface coating layer and the back surface coating layer are provided integrally. When the radiation detection element is fixed to a substrate, the second electrode is fixed to the substrate by a conductive member,
The radiation detection element according to claim 2, wherein the back surface coating layer has a thickness equal to or less than a thickness of the conductive member. The radiation detection element according to claim 3, further comprising a surface coating layer provided on an edge portion of the surface. The side surface coating layer has a thickness of 1 μm or more and 2 μm or less,
The radiation detection element according to claim 4, wherein the back surface coating layer has a thickness of 5 μm to 10 μm.   The radiation detection element according to claim 5, wherein the side surface coating layer and the back surface coating layer are formed of an insulating material.   The radiation detection element according to claim 6, wherein the radiation detection element is used in a radiation detector including the substrate and a support member that supports the substrate at a portion adjacent to the radiation detection element. The substrate has the radiation detection element on the first end side of the substrate,
The radiation detection element according to claim 7, wherein the support member supports the substrate on a second end side opposite to the first end portion.

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