JP2011195907A - Mask holding device and thin film forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mask holding device holding a mask without wrinkles so that a single mask having no mask frame is conveyed on a substrate or the position of the mask to the substrate is adjusted.SOLUTION: A mask holding and positioning device 5 including a magnetic material, and holding a sheet-shaped mask having openings for patterning a thin film formed on a substrate, is provided with a mask magnetically attracting plate 54 by which the mask is magnetically attracted on one surface side by a plurality of permanent magnets disposed on the other side. The plurality of permanent magnets are so constituted that magnetic field distribution of a first region on the one surface side of the mask magnetically attracting plate 54 and magnetic field distribution of a second region of the one surface side are different from each other.

Description

  The present invention relates to a mask holding device for holding a mask for carrying a pattern forming mask on the substrate or adjusting the position of the mask relative to the substrate, and a thin film forming apparatus including the mask holding device.

In recent years, an organic EL color display provided with an organic EL (Electro-Luminescence) light emitting element has attracted attention. The organic EL light-emitting element includes an organic layer formed by laminating a hole injection layer, a hole transport layer, an organic light-emitting layer, and the like between a lower electrode and an upper electrode, and emits light by low-voltage direct current driving.
In order to manufacture a full color organic EL color display using an organic EL light emitting element, an organic light emitting layer corresponding to each color component of red (R), green (G), and blue (B) in the manufacturing process. The electrode layer or the like needs to be formed into a pattern on the substrate by vapor deposition. For the pattern formation of each layer, vapor deposition masks matched to the pattern of each layer are used. Since the mask is a thin plate, the mask is generally used in a state in which the mask is stretched and welded to a holding frame called a mask frame to eliminate bending (for example, Patent Document 1). In addition, in order to form each film at a desired position on the substrate, it is necessary to accurately align the substrate and the mask.

JP 2004-183044 A

  However, the conventional film formation method using the mask stretched and welded by the mask frame has a problem that it is difficult to cope with future enlargement of the substrate. When the mask is increased in size, there is a problem in that it is difficult to align the substrate and the mask because the positional deviation between the substrate and the mask becomes large even with a small amount of bending. Furthermore, when the mask is increased in size, there is a problem that the mask frame is also increased in size, and accordingly, the transfer device is also increased in size and cost.

  A method of dividing the mask into a plurality of parts, placing a single mask made of a magnetic material not provided with a mask frame on the substrate, and fixing the mask on the substrate with a magnet is conceivable.

  The present invention has been made in view of such circumstances, and an object of the present invention is to convey a single mask not provided with a mask frame onto the substrate or to accurately adjust the position of the mask with respect to the substrate. An object of the present invention is to provide a mask holding device and a thin film forming apparatus including the mask holding device.

  A mask holding device according to the present invention includes a magnetic material and a plurality of magnets arranged on one side in a mask holding device that holds a sheet-like mask in which an opening for patterning a thin film is formed on a substrate. The mask includes a mask magnetized plate on which the mask is magnetized on the other surface side, and the plurality of magnets includes a distribution of the magnetic field in the first region on the other surface side of the mask magnetized plate and a first magnetic field on the other surface side. The magnetic field distribution of the two regions is different from each other.

In the present invention, the mask is magnetized on the other surface side of the mask magnetized plate by the magnetic force of the magnet disposed on the one surface side of the mask magnetized plate. Since the distribution of the magnetic field in the first region on the other surface side of the mask magnetized plate is different from the distribution of the magnetic field in the second region on the other surface side, the magnetic field is first strong when the mask magnetized plate is close to the mask. A mask is magnetized on the area, and then the mask is magnetized on the area where the magnetic field is low. Since the mask is sequentially magnetized on the mask magnetized plate in this way, it is possible to hold the mask without any problems.
Needless to say, the present invention is not limited to the case where the distribution of the magnetic field is different in the first region and the second region, and includes the case where the distribution of the magnetic field is different in three or more regions.

  According to the present invention, a single mask without a mask frame can be transferred onto a substrate, or the position of the mask can be accurately adjusted with respect to the substrate.

It is the top view which showed typically the example of 1 structure of the thin film formation system which concerns on embodiment of this invention for manufacturing an organic EL light emitting element. It is the sectional side view which showed typically the principal part of the thin film formation system which concerns on embodiment. It is the top view which showed typically the principal part of the thin film formation system which concerns on this Embodiment. It is the sectional side view which showed typically the example of 1 structure of the mask holding | maintenance / position alignment apparatus which concerns on embodiment of this invention. It is a schematic diagram of a magnet array. It is the side view which showed the permanent magnet typically. It is explanatory drawing which showed typically the principal part of the mask holding | maintenance / position alignment apparatus. It is the sectional side view which showed typically the example of 1 structure of the board | substrate holding | maintenance part. It is explanatory drawing which shows a mask holding method notionally. It is explanatory drawing which shows notionally the attachment method of the mask with respect to a board | substrate. It is explanatory drawing which showed notionally the position adjustment method of the mask with respect to a board | substrate. It is explanatory drawing which showed notionally the position adjustment method of the mask with respect to a board | substrate. It is a schematic diagram of the board | substrate with which the mask was distribute | arranged. It is explanatory drawing which shows notionally the rearrangement method of the mask with respect to a board | substrate. It is a schematic diagram of a magnet support plate and a magnet array according to Modification 1. 10 is a schematic diagram of a magnet array according to Modification 2. FIG. 10 is a schematic diagram of an electromagnet array according to Modification 3. FIG. It is the schematic diagram which showed the circuit structure of the electromagnet array. It is explanatory drawing which shows notionally the mask holding | maintenance method in the modification 4. It is a schematic diagram of a magnet support plate and a magnet array according to Modification 5. It is a schematic diagram of the magnet support plate, mask magnetic deposition plate, and magnet array according to Modification 6. It is explanatory drawing which shows notionally the mask holding | maintenance method in the modification 6. FIG. It is explanatory drawing which shows notionally the mask holding | maintenance method in the modification 6. FIG. 10 is a side cross-sectional view schematically showing a configuration example of a substrate holding unit according to Modification Example 7. FIG. It is explanatory drawing which showed typically the principal part of the mask holding | maintenance / position alignment apparatus which concerns on the modification 8. It is explanatory drawing which showed typically the principal part of the mask holding | maintenance / position alignment apparatus which concerns on the modification 9. It is explanatory drawing which showed the principal part of the thin film forming apparatus which concerns on the modification 10 typically in the cross section. It is explanatory drawing which showed typically the principal part of the thin film forming apparatus which concerns on the modification 11 in the cross section.

Hereinafter, the present invention will be described in detail with reference to the drawings illustrating embodiments thereof.
FIG. 1 is a plan view schematically showing a configuration example of a thin film forming system according to an embodiment of the present invention for manufacturing an organic EL light emitting device. The thin film forming system 1001 is a so-called linear bay type system. As shown in FIG. 1, in this thin film formation system 1001, a loader 1020, first to seventh pressure regulating chambers 1021 to 1027 (hereinafter referred to as a first PTM 1021) along the transport direction (rightward in FIG. 1) of the substrate G. The first PTM 1021 to the seventh PTM 1027 and the first to sixth transfer modules 1031 to 1036 (hereinafter referred to as the first TM 1031 to the sixth TM 1036) and the unloader 1040, which are alternately arranged with the first PTM 1021 to the seventh PTM 1027, are arranged in series. A conveying path L is formed. In the present embodiment, the first PTM 1021 to the seventh PTM 1027 are illustrated as being configured in two stages.

  In front of the loader 1020 (left side in FIG. 1), between the loader 1020 and the first PTM1021, between the first PTM1021 to the seventh PTM1027 and the first TM1031 to the sixth TM1036, between the seventh PTM1027 and the unloader 1040, and the unloader 1040. A gate valve 1042 is disposed behind (to the right in FIG. 1), and the loader 1020, the first PTM1021 to the seventh PTM1027, the first TM1031 to the sixth TM1036, and the unloader 1040 are each vacuumed by a vacuum pump (not shown). Pulling is possible. In addition, a transfer robot 1045 having a transfer arm is disposed inside each of the first TM 1031 to the sixth TM 1036.

  A cleaning processing device 1050 for cleaning the substrate G by vacuum ultraviolet light (VUV: Vacuum UltraViolet) or the like is connected to one side surface of the first TM 1031 through a gate valve 1051. The other side surface is connected with a pretreatment device 1052 for forming an anode layer on the substrate G by, for example, sputtering. The transfer robot 1045 in the first TM 1031 transfers the substrate G from the first PTM 1021 to the first TM 1031 along the transfer path L, and moves the substrate G directly between the inside of the first TM 1031 and the cleaning processing apparatus 1050 along the transfer path L. Can be transported in the direction of movement.

  A thin film forming apparatus 1 for forming a thin film pattern such as an organic layer, for example, a hole injection layer, a hole transport layer, and an organic light emitting layer, is connected to the substrate G through a gate valve 1062 on one side surface of the second TM 1032. A buffer module 1060 is connected to the other side surface via a gate valve 1061. A mask transfer module 3 (hereinafter referred to as MTM3) that transports the mask M to and from the thin film forming apparatus 1 is provided via a gate valve 1063 on the side surface opposite to the connection surface of the thin film forming apparatus 1 with the second TM 1032. Connected. The mask stock chamber 2 is connected to one side of the MTM 3 via a gate valve 1064. The mask stock chamber 2 contains a magnetic material such as Invar, which is an alloy of iron Fe and nickel Ni, and accommodates a sheet-like mask M in which openings for patterning a thin film are formed on the substrate G. Further, a used mask accommodating portion 7 that accommodates a used mask M is connected to the other side surface of the MTM 3 via a gate valve 1065. Here, the transfer of the substrate G between the second TM 1032 and the thin film forming apparatus 1 is performed by the transfer robot 1045 inside the second TM 1032. Details of the thin film forming apparatus 1, the MTM 3, and the mask stock chamber 2 will be described later.

  A sputtering apparatus 1070 for forming a cathode layer on the substrate G by, for example, a sputtering method using a pattern mask is connected to the side surface of the third TM 1033 via a gate valve 1071. Here, the transfer of the substrate G between the third TM 1033 and the sputtering apparatus 1070 is performed by the transfer robot 1045 inside the third TM 1033.

  An inspection device 1080 (SEM) and a buffer module 1081 are connected to both side surfaces of the fourth TM 1034. Here, it is inspected whether or not each process has been performed with a predetermined accuracy or higher for the substrate G that has been formed up to the cathode layer.

  A CVD processing apparatus 1090 is connected to one side surface of the fifth TM 1035 via a gate valve 1091, and a buffer module 1092 is connected to the other side surface. Further, CVD processing apparatuses 1100 and 1101 are connected to both side surfaces of the sixth TM 1036 via gate valves 1102 and 1103. In each of the CVD processing apparatuses 1090, 1100, and 1101, a sealing film layer is formed. Here, the transfer of the substrate G between the fifth TM 1035 and the sixth TM 1036 and the respective CVD processing apparatuses 1090, 1100, and 1101 is performed by the transfer robot 1045 inside the fifth TM 1035 and the sixth TM 1036. Note that the number of CVD processing apparatuses may be changed as appropriate depending on the film structure of the sealing film layer. For example, only the CVD processing apparatus 1090 may be installed, and the sixth TM 1036 and the CVD processing apparatuses 1100 and 1101 may not be installed.

  The buffer modules 1060, 1081, and 1092 are modules having a general buffer function, and absorb fluctuations in each processing module (periodic cleaning in a steady state, variation in processing time). For this reason, it is not always necessary to dispose them at the positions described above, and it is preferable to provide them at locations where fluctuations occur appropriately.

  FIG. 2 is a side sectional view schematically showing the main part of the thin film forming system according to the embodiment, and FIG. 3 is a plan view schematically showing the main part of the thin film forming system according to the present embodiment. is there.

The thin film forming apparatus 1 is an apparatus for forming a hole injection layer, a hole transport layer, a blue light emitting layer, a red light emitting layer, a green light emitting layer, an electron transport layer and an electron injection layer on a substrate G by a vacuum deposition method. is there. The thin film forming apparatus 1 includes a processing chamber 11 for accommodating a substrate G and for forming a thin film such as a film forming process on the substrate G inside. The processing chamber 11 has a hollow, substantially rectangular parallelepiped shape whose longitudinal direction is the transport direction, and is made of aluminum, stainless steel, or the like. A substrate loading / unloading port 11a for loading and unloading the substrate G into and from the processing chamber 11 is formed on the surface on the one end side in the longitudinal direction of the processing chamber 11 (the surface on the right side in FIG. 2). A mask loading / unloading port 11b for loading and unloading the mask M into and from the processing chamber 11 is formed on the left side in FIG. The substrate loading / unloading port 11a and the mask loading / unloading port 11b have a slit shape having a longitudinal direction perpendicular to the loading direction, and the longitudinal directions of the substrate loading / unloading port 11a and the mask loading / unloading port 11b are substantially the same. Hereinafter, the longitudinal direction of the substrate loading / unloading port 11a and the mask loading / unloading port 11b is referred to as a horizontal direction, and the direction perpendicular to the horizontal direction and the conveyance direction is referred to as a vertical direction. Further, an exhaust hole 11 c is formed at an appropriate location of the storage chamber, and a vacuum pump 16 disposed outside the processing chamber 11 is connected to the exhaust hole 11 c through an exhaust pipe 15. When the vacuum pump 16 is driven, the inside of the processing chamber 11 is depressurized to a predetermined pressure, for example, 10 ⁻² Pa. Furthermore, the thin film forming apparatus 1 includes gate valves 1062 and 1063 that close the substrate loading / unloading port 11a and the mask loading / unloading port 11b so that they can be opened and closed.

  In the processing chamber 11, a transfer device 12 is provided for transferring the substrate G from the substrate loading / unloading port 11 a side to the mask loading / unloading port 11 b side or from the mask loading / unloading port 11 b side to the substrate loading / unloading port 11 a side. The transfer device 12 includes a guide rail 12a provided at the bottom of the processing chamber 11 along the longitudinal direction, and a moving member 12b that is guided by the guide rail 12a and is movable in the transfer direction, that is, the longitudinal direction. Is provided. A substrate holding portion 13 that supports the substrate G so as to be substantially parallel to the bottom portion is provided at the upper end portion of the moving member 12b. The substrate holder 13 is configured to move by a linear motor.

  In addition, a plurality of vapor deposition heads 14 that form a film on the substrate G by a vacuum vapor deposition method are provided in the upper portion of the processing chamber 11 and in the substantially central portion in the transport direction. The vapor deposition head 14 includes a first head 14a for vapor-depositing a hole injection layer, a second head 14b for vapor-depositing a hole transport layer, a third head 14c for vapor-depositing a blue light-emitting layer, a fourth head 14d for vapor-depositing a red light-emitting layer, and green. The fifth head 14e for vapor-depositing the light emitting layer and the sixth head 14f for vapor-depositing the electron transport layer are sequentially arranged along the transport direction. A vapor generating unit disposed outside the processing chamber 11 is connected to the vapor deposition head 14 via a pipe. The steam generation unit includes a container and a heating mechanism disposed inside the container. The heating mechanism is configured to heat the organic film forming material with electric power supplied from a power source. For example, it is configured to heat with an electric resistor. In this way, the organic film forming material stored in the heating mechanism is heated to generate vapor of the organic film forming material. Further, the container is connected to a transport gas supply pipe for supplying a transport gas made of an inert gas, for example, a rare gas such as Ar, to the substrate G, and transport supplied from the transport gas supply pipe to the container. Along with the gas, the vapor of the organic film forming material is supplied from the vapor generation unit to the vapor deposition head 14 via a pipe. Similarly, the first to sixth heads 14a, 14b, 14c, 14d, 14e, and 14f are configured to be supplied with vapor of a predetermined organic film forming material from a vapor generation unit (not shown). .

The mask accommodating portion 2 includes a hollow substantially rectangular parallelepiped housing 21 having a carry-in port 21a into which the mask M is carried in and a carry-out port 21b through which the mask M is carried out to the thin film forming apparatus 1 side. A mask mounting table 22 on which the mask M is mounted is provided at the bottom of the housing 21. The mask mounting table 22 is urged upward and is configured to be pushed down by the weight of the mask M stacked on the mask mounting table 22. In addition, a mask holding / positioning device 6 for holding the mask M placed on the mask placing table 22 by magnetic force is provided at the upper part. The carry-in port 21a is closed by a gate valve 1064 so as to be opened and closed.
The MTM 3 includes a hollow substantially rectangular parallelepiped housing 31 having a carry-in port 31 a into which the mask M is carried from the mask housing unit 2 and a carry-out port (not shown) through which the mask M is carried out to the used mask housing unit 7. In the interior of 31, a transfer robot 32 is provided for transferring the mask M between the mask housing portion 2 and the used mask housing portion 7 and the thin film forming apparatus 1. The second TM 1032 includes a hollow substantially rectangular parallelepiped housing 41 having a transport port 41a, and a transport robot 1045 for delivering the substrate G loaded by the loader to the thin film forming apparatus 1 is provided in the housing 41. It has been.

  FIG. 4 is a side sectional view schematically showing one configuration example of the mask holding / positioning device 5 according to the embodiment of the present invention. Since the mask holding / alignment device 6 provided in the mask storage unit 2 and the used mask storage unit 7 is the same as the configuration of the mask holding / positioning device 5 provided in the thin film forming apparatus 1, The configuration of the mask holding / positioning device 5 will be described. The mask holding / positioning device 5 includes a magnet support plate 51 having a substantially rectangular plate shape that is substantially the same shape as the mask M. A magnet array 52 is arranged on the upper surface of the magnet support plate 51. Further, a plurality of holes are formed at appropriate positions of the magnet support plate 51, for example, at the four corners of the magnet support plate 51, and a cylindrical pin 54a is inserted into the hole so as to be movable in the vertical direction. . The pin 54a has a head having a large outer diameter on the upper end side, and the head and the magnet support plate 51 are connected by a biasing member 54b. The urging member 54 b is, for example, a coil spring inserted into the pin 54 a, and one end of the coil spring is connected to the head, and the other end of the coil spring is connected to the magnet support plate 51.

  Below the magnet support plate 51, a mask magnetized plate 54 having a substantially rectangular plate shape that is substantially the same size and the same size as the mask M is separated from the magnet support plate 51 and substantially parallel to the magnet support plate 51. It is arranged to become. The mask magnetic plate 54 is connected to the lower ends of a plurality of pins 54a penetrating through the holes, and the mask magnetic plate 54 is suspended from the magnet support plate 51 by the pins 54a. ing.

  The mask holding / positioning device 5 includes an elevating mechanism 53 for elevating and lowering the magnet support plate 51 together with the magnet array 52 and the mask magnetized plate 54. The elevating mechanism 53 includes two support columns 53 a provided substantially perpendicular to the outer surface of the upper portion of the processing chamber 11, and a moving plate 53 b supported by the support columns 53 a and moving up and down above the processing chamber 11. Is provided. The moving plate 53b is provided with a linear bush 53c through which each of the columns 53a is inserted. The moving plate 53b can be moved up and down while being substantially parallel to the outer surface of the upper portion of the processing chamber 11. Through the column 53a. An elevating shaft 53d for elevating the magnet array 52 and the mask magnetized plate 54 together with the magnet support plate 51 is provided substantially vertically at the substantially central portion of the lower surface of the moving plate 53b. A magnet support plate 51 is connected to the lower end of the elevating shaft 53d so that the magnetized surface of the mask M magnetized portion is substantially horizontal. Further, a top plate portion 53g is provided at the upper end portion of the column 53a, and a screw shaft 53f constituting a ball screw mechanism passes through the top plate portion 53g via a bearing. A screw nut 53e that is screwed into the screw shaft 53f is provided at an appropriate location of the moving plate 53b, and a ball screw mechanism that raises and lowers the moving plate 53b is configured by the screw nut 53e and the screw shaft 53f. A driven pulley 53h for rotating the screw shaft 53f is provided at the upper end portion of the screw shaft 53f. Further, the elevating mechanism 53 includes a motor 53k that supplies a rotational force that rotates the screw shaft 53f, and a motor drive unit 53l that drives the motor 53k. The motor 53k is fixed so that the output shaft faces vertically upward, and a drive pulley 53j is provided on the output shaft. A belt 53i is wound around the driving pulley 53j and the driven pulley 53h, and the driving force of the motor 53k is transmitted to the screw shaft 53f through the driving pulley 53j, the belt 53i, and the driven pulley 53h. When the screw shaft 53f rotates, the moving plate 53b moves up and down by the ball screw mechanism, and the mask magnetized plate 54 moves up and down as the moving plate 53b moves up and down. The driving pulley 53j, the driven pulley 53h, and the belt 53i are, for example, a timing pulley and a timing belt.

  FIG. 5 is a schematic view of the magnet array 52, and FIG. 6 is a side view schematically showing the permanent magnets 52a and 52b. The magnet array 52 includes a plurality of permanent magnets 52a, ..., 52l arranged in a matrix on the magnet support plate 51. The strength of the magnetic field created by each permanent magnet is different. For example, the strength of the magnetic field created by the permanent magnets 52a,... 52l arranged on one side (right side in FIG. 5) of the magnet support plate 51 is equal to the permanent magnet 52a, arranged on the other side (left side in FIG. 5). ... 52l is configured to be stronger than the strength of the magnetic field created by 52l. Here, an example in which the S pole and the N pole are alternately arranged has been described, but a configuration in which only the N pole or only the S pole is arranged may be employed.

FIG. 7 is an explanatory view schematically showing a main part of the mask holding / positioning device 5. The mask holding / alignment apparatus 5 includes a plurality of imaging units 55 for aligning the mask M with respect to the substrate G. The processing chamber 11 has light-transmitting portions 11d and 11d made of a light-transmitting member, for example, quartz at a part of the upper portion, and a magnet support plate located below the light-transmitting portions 11d and 11d. Through holes 51c, 51c, 54c and 54c are provided in a part of 51 and the mask magnetized plate 54. Each of the light transmitting portions 11d and 11d and the through holes 51c, 51c, 54c, and 54c are provided at specific positions of the mask M to be disposed on the substrate G, for example, at locations corresponding to two vertex portions that form a diagonal. . The imaging unit 55 is, for example, a CCD camera, and each imaging unit 55 is arranged so that the substrate G and the mask M can be imaged through the light transmitting unit 11d and the through holes 51c and 51c. Details of the method for adjusting the position of the mask M with respect to the substrate G will be described later.
Here, an example in which the imaging unit 55 is disposed above the processing chamber 11 has been described, but the imaging unit 55 is disposed on the substrate holding unit 13 so that the substrate G and the mask M are imaged from below. Also good.
Further, the mask holding / positioning device 5 includes a position adjusting mechanism 56 for moving the mask magnetized plate 54 in the surface direction. The position adjustment mechanism 56 is, for example, an XY stage that is provided on the magnet support plate 51 and moves the magnet support plate 51 in the horizontal direction by the motor 53k with respect to the lifting shaft 53d.

  The mask holding / positioning device 5 includes cooling pipes 51 a and 51 b that are provided inside the mask magnetic deposition plate 54 and cool the mask magnetic deposition plate 54. The cooling pipes 51a and 51b are routed outside the thin film forming apparatus 1 through the inside of the elevating shaft 53d. For example, cooling water is supplied to the cooling pipes 51 a and 51 b to cool the magnet M 52 and the mask M magnetically attached to the mask magnetic attachment plate 54.

FIG. 8 is a side sectional view schematically showing a configuration example of the substrate holding unit 13. The substrate holding part 13 includes a hollow body having a substantially rectangular parallelepiped shape, and a space part 13 a that is shielded from the atmosphere inside the processing container is formed inside the body part. An electrostatic chuck 13 b for holding the substrate G placed on the substrate holding unit 13 is provided inside the upper surface of the substrate holding unit 13. A power supply line 13c is connected to the electrostatic chuck 13b. The power supply line 13c is drawn out to a space inside the main body and is connected to an external power source through a hollow duct arm (not shown).
Further, a heat medium flow path 13 d for adjusting the temperature of the substrate G placed on the substrate holding unit 13 is embedded in the upper surface of the substrate holding unit 13. A pipe 13e for supplying a heat medium such as ethylene glycol to the heat medium flow path 13d is connected to the heat medium flow path 13d, and the pipe 13e is also drawn out to the space inside the main body, similarly to the power supply line 13c. These are connected to an external heat medium supply source through a hollow duct arm (not shown).
Further, on the upper surface of the substrate holding unit 13, there is a heat transfer gas supply unit 13 f that supplies heat transfer gas to a gap between the lower surface of the substrate G placed on the substrate holding unit 13 and the upper surface of the substrate holding unit 13. Is provided. The heat transfer gas is, for example, helium. A gas supply pipe 13g is connected to the heat transfer gas supply part 13f, and is connected to an external heat transfer gas supply source through an internal space of the main body part and a hollow duct arm (not shown).
Furthermore, a wiring 13h for grounding the mask M is provided in the main body of the substrate holding part 13, and an organic film formed at a predetermined position on the surface of the mask M, for example, a peripheral part is formed at the tip of the wiring. A pin 13j that breaks the film and conducts is provided movably. For example, the pin may be provided at the tip of an arm portion that is bent so as to rotate, and may include a drive unit that rotates the arm portion by an external force such as an electromagnetic force. Of course, you may comprise so that the base of an arm part may be supported by a rotating shaft. A switch 13i is connected in the middle of the wiring 13h.
After the vapor deposition is completed, the driving unit moves the pin 13j to break the organic film formed on the surface of the mask M, establish electrical connection with the wiring 13h, and turn on the switch 13i. The surface of the deposited mask M is covered with an insulating organic film. However, the organic film on the mask M can be destroyed by the pins 13j to be conductive. When the switch 13i is in the on state, the mask M is grounded. When the mask M is grounded, the charge of the mask M charged by the power supply to the electrostatic chuck 13b escapes to the ground, so that the mask M can be easily detached from the substrate G.

  Incidentally, it is necessary to reduce the thickness of the mask M in order to make the film formation pattern finer. However, when the thickness of the mask M is about 10 to 100 microns, the method of simultaneously sucking the entire surface of the mask M as usual is caused by wrinkles or the like at the time of suction and cannot be accurately held. It was found that the positioning of the could not be performed accurately. In addition, wrinkles and the like may occur when the conventional mask holding / positioning apparatus is arranged on the substrate G. Conventionally, there has been no technology that makes it possible to hold such a thin mask M without loss, transport it onto the substrate G, and perform alignment. Therefore, as a result of earnest study, the inventor of the present application has confirmed that the generation of wrinkles and the like can be suppressed by adsorbing the mask M step by step without adsorbing the entire surface of the mask M at the time when holding the mask M. discovered.

  FIG. 9 is an explanatory diagram conceptually showing the mask M holding method. In FIG. 9, a method of holding the mask M placed on the arm portion 32 a of the transfer robot 32 using the mask holding / positioning device 5 will be described. First, the mask magnetic plate 54 is raised so as to be positioned above the arm portion 32a, and then the mask magnetic plate 54 is lowered as shown in FIG. 9A. When the mask magnetized plate 54 approaches the arm portion 32a, as shown in FIGS. 9B to 9D, the mask M is magnetized on the mask magnetized plate 54 in order from the region where the magnetic field is strong. In this state, the mask magnetized plate 54 is biased so as to be separated from the magnet support plate 51 by the biasing member 54b, and thus is separated by a certain distance. Accordingly, the magnetic field acting on the mask M is suddenly increased, and it is prevented that the mask M is magnetically attached to the mask magnetized plate 54 in a state where wrinkles are formed. As shown in FIG. 9E, when the mask magnetized plate 54 is in close contact with the arm portion 32a, the mask M is in a state of being magnetized to the mask magnetized plate 54 without any defects. Further, since the mask magnetizing plate 54 and the magnet support plate 51 are close to or in close contact with the biasing force of the biasing member 54b, a stronger magnetic force acts on the mask M, and the mask M adheres to the mask magnetizing. Magnetically attached to the plate 54. As shown in FIG. 9 (f), when the elevating shaft 53d is raised, the mask M is raised together with the mask magnetized plate 54 while still being magnetized on the mask magnetized plate 54.

  FIG. 10 is an explanatory diagram conceptually showing a method of attaching the mask M to the substrate G. In FIG. 10, a method of placing the held mask M on the substrate G will be described. A mask M is magnetized on the mask magnetized plate 54 by the method shown in FIG. Then, as shown in FIG. 10A, by driving the position adjustment mechanism 56, the mask M is moved in a direction substantially parallel to the substrate G, and the position of the mask M with respect to the substrate G is adjusted.

  11 and 12 are explanatory diagrams conceptually showing a method for adjusting the position of the mask M with respect to the substrate G. FIG. The imaging unit 55 images the alignment marks G1 and G2 on the substrate G and the alignment marks M1 and M2 on the mask M. The alignment marks G1 and G2 of the substrate G are formed of, for example, a metal thin film such as chromium, and the alignment marks M1 and M2 of the mask M are formed of, for example, through holes. Note that the alignment marks M1 and M2 are provided not at the central portion of the substrate G but at the peripheral portion when the mask M is disposed on the substrate G. This is because there is no problem even if the substrate G is formed through the alignment marks M1 and M2 of the mask M at the peripheral portion of the substrate G. Then, the position adjusting mechanism 56 is driven so that the alignment marks M1, M2, G1, and G2 have a predetermined positional relationship. That is, by driving the position adjustment mechanism 56 so that the alignment mark G1 and the alignment mark M1 in the horizontal plane direction coincide with each other and the alignment mark G2 and the alignment mark M2 coincide with each other, the mask M is placed on the substrate G. The position of the mask M with respect to the substrate G is adjusted. 11 and 12, the position adjustment of one mask M is described, but the method of adjusting the position of other masks M is the same.

  When the alignment marks on the mask M and the substrate G are in a predetermined positional relationship, as shown in FIG. 10B, the mask magnetized plate 54 is lowered and the mask is applied to the substrate G held on the substrate holder 13. Adhere M. Then, power is supplied to the electrostatic chuck 13 b of the substrate holding unit 13, and the mask M placed on the substrate G is held by the substrate holding unit 13 together with the substrate G by electrostatic force. Next, the mask magnetized plate 54 is raised. A plurality of masks M are arranged on the substrate G in the same procedure.

  FIG. 13 is a schematic diagram of the substrate G on which the mask M is arranged. 13A is a plan view of the substrate G on which the mask M is placed, and FIG. 13B is a side view of the substrate G on which the mask is placed. 9 to 12, the mask M without the mask frame is held without any loss, and the mask M is aligned with the substrate G. As shown in FIG. Can be retained.

  FIG. 14 is an explanatory diagram conceptually showing a method of rearranging the mask M with respect to the substrate G. In FIG. 14, a method of holding the mask M placed on the substrate G again and changing the position of the mask M with respect to the substrate G will be described. For example, after the deposition of the organic light emitting layer corresponding to red (R) of the organic EL light emitting element is finished with the mask M placed, the mask M is shifted to deposit the organic light emitting layer corresponding to green (G). If the other organic light emitting layers are sequentially deposited, the position of the mask M needs to be changed. First, as shown in FIG. 14A, the mask magnetic plate 54 is lowered with respect to the substrate G on which the mask M is placed, and the mask magnetic plate 54 is used as the mask M as shown in FIG. Adhere closely. In this state, the power supply to the electrostatic chuck 13b is stopped and the switch 13i is closed. Accordingly, the electrostatic force acting on the mask M is eliminated, and the mask M is magnetically attached to the mask magnetic plate 54 by the magnetic field generated by the magnet array 52. Next, as shown in FIG. 14C, the mask holding / positioning device 5 is raised. As described above, since the electrostatic force has disappeared, the mask M is separated from the substrate G while being magnetically attached to the mask magnetic plate 54, and rises together with the mask magnetic plate 54. Next, as shown in FIG. 14D, the mask M is aligned with the substrate G. The subsequent steps are the same as those in FIG. In addition, although the case where the position of the mask M was shifted and the vapor deposition of the several organic light emitting layer was demonstrated, it cannot be overemphasized, whenever the vapor deposition of each layer is completed, the mask M is discarded and new mask M is used. You may comprise so that it may do.

  In the thin film forming apparatus 1 and the mask holding / positioning apparatus 5 configured as described above, a single mask M not provided with a mask frame is transferred onto the substrate G, or the position of the mask M with respect to the substrate G is adjusted. In order to do so, the mask M can be held without any defects. For this reason, a plurality of masks M smaller than the substrate G can be placed on the substrate G, and organic vapor deposition can be performed on the large substrate G, and a pattern can be formed on the large substrate.

  Further, since the mask magnetized plate 54 is biased by the biasing member 54b so as to be separated from the magnet support plate 51, the magnetic field acting on the mask M suddenly increases and the mask magnetism plate 54 is in a state of wrinkles. It can be prevented from being magnetically attached to the attachment plate 54.

  Furthermore, since the magnet array 52 and the mask magnetized plate 54 are cooled by the cooling pipes 51a and 51b, it is possible to prevent the magnetic force from being lowered. Further, the mask M can be prevented from being deformed.

  Furthermore, since the mask M is placed on the upper surface of the substrate G and the organic vapor deposition is performed from the upper side, the mask M placed on the substrate G is not bent by its own weight, and the mask M is displaced. Hole deformation does not occur. Therefore, it is possible to form a pattern with higher accuracy.

  Furthermore, since the wiring 13h and the switch 13i for grounding the mask M are provided, the electrostatic force acting between the mask M and the substrate G can be removed, and the mask M can be easily detached from the substrate G.

  Furthermore, since the substrate holding unit 13 includes the heat medium flow path 13d, the substrate G can be cooled, the patterned film is damaged, and the mask M on the substrate G is deformed. Can be prevented.

  In the embodiment, the substrate G is held so that the surface on which pattern formation is performed is upward and organic vapor deposition is performed. However, the surface on which pattern formation is performed is directed in the horizontal direction. The substrate G may be held, and the mask holding / positioning device 5 may be disposed on the side of the substrate holding unit 13.

  Further, the mask M accommodated in the mask accommodating portion 2 is configured to be held using the mask holding / positioning device 6, but the mask M arranged on a shelf having a comb-shaped groove is It may be configured such that it is directly lifted by a transfer robot 32 having a comb-like arm portion 32a formed following the groove and transferred to the thin film forming apparatus 1.

  Further, the thin film forming apparatus 1 for organic vapor deposition of the organic layer on the substrate G has been described. However, various apparatuses for performing a process of forming a thin film on the substrate G by placing a patterned mask M on the substrate G, such as CVD (Chemical The present invention may be applied to a Vapor Deposition (PVD) apparatus and a PVD (Physical Vapor Deposition) apparatus.

(Modification 1)
Since the thin film forming apparatus 1 and the mask holding / positioning apparatus 5 according to the modification 1 are different only in the configuration of the magnet support plate 151 and the magnet array 152, the difference will be mainly described below.
FIG. 15 is a schematic diagram of the magnet support plate 151 and the magnet array 152 according to the first modification. The magnet array 152 includes a plurality of permanent magnets 152a arranged in a matrix on the magnet support plate 151. The strength of the magnetic field created by each permanent magnet 152a is substantially the same. The magnet support plate 151 is arranged such that the distance between the permanent magnet 152a arranged on one side (right side in FIG. 15) of the magnet support plate 151 and the mask magnetized plate 54 is on the other side (left side in FIG. 15). In addition, a stepped portion is provided on the arrangement surface on which the permanent magnet 152a is arranged so as to be shorter than the distance between the permanent magnet 152a and the mask magnetized plate 54.
In the mask holding / alignment apparatus 5 configured as described above, the strength of the magnetic field created on one side of the magnet support plate 151 is higher than the strength of the magnetic field created on the other side.

  In the first modification, the same effects as those of the above-described embodiment can be obtained. Moreover, since the magnetic force of the permanent magnet 152a is the same, it is not necessary to consider the arrangement position of the magnet with a strong magnetic force and the magnet with a weak magnetic force, and the magnet array 152 can be comprised easily. Therefore, the present invention can be manufactured at a lower cost.

(Modification 2)
Since the thin film forming apparatus 1 and the mask holding / positioning apparatus 5 according to the modified example 2 are different only in the configuration of the magnet support plate 251 and the magnet array 252, the differences will be mainly described below.
FIG. 16 is a schematic diagram of a magnet array 252 according to the second modification. The magnet array 252 includes a plurality of permanent magnets 252a, 252b, and 252c arranged in a matrix on the magnet support plate 251. The strength of the magnetic field generated by each permanent magnet 252a, 252b, 252c is substantially the same. Further, the distance between the plurality of permanent magnets 252c arranged on one side (the right side in FIG. 16) of the magnet support plate 251 is the distance between the plurality of permanent magnets 252a arranged on the other side (the left side in FIG. 16). It is comprised so that it may become short compared with.
In the mask holding / alignment apparatus 5 configured as described above, the strength of the magnetic field created on one side of the magnet support plate 251 is higher than the strength of the magnetic field created on the other side.

  In the second modification, the same effects as those of the above-described embodiment can be obtained. In addition, since the magnetic forces of the permanent magnets 252a, 252b, and 252c are the same, it is not necessary to consider the arrangement positions of the strong magnetic force and the weak magnetic force, and the magnet array 252 can be easily configured. Therefore, the present invention can be manufactured at a lower cost.

(Modification 3)
The thin film forming apparatus 1 and the mask holding / positioning apparatus 5 according to the modified example 3 are different only in the configuration of the mask magnetizing plate 351 that also serves as a magnet support plate and the electromagnet array 352. explain.
FIG. 17 is a schematic diagram of an electromagnet array 352 according to Modification 3. FIG. 18 is a schematic diagram illustrating a circuit configuration of the electromagnet array 352. The electromagnet array 352 includes a plurality of electromagnets 352a arranged in a matrix on a resin mask magnetized plate 351. The electromagnet 352a has, for example, the strength of the magnetic field created by the electromagnet 352a arranged on one side (the right side in FIG. 17) of the mask magnetized plate 351, and the electromagnet 352a arranged on the other side (the left side in FIG. 17). It is configured to be stronger than the strength of the magnetic field created. The mask holding / positioning device 5 is connected to an electromagnet power source 352b that supplies current to the electromagnet 352a. The strength of the magnetic field generated by the electromagnet 352a can be changed by providing a difference in the number of turns of the coil, the strength of the current supplied by the coil, the material of the core, and the like.

In the third modification, the same effects as those of the above-described embodiment can be obtained.
Also, in the case where a difference is provided in the strength of the magnetic field generated by each electromagnet 352a by changing the number of turns of the coil and the material of the core, the distribution of the strength of the magnetic field is biased only by flowing the same amount of current through each electromagnet 352a. Control is easy.
Furthermore, when a difference is provided in the strength of the magnetic field created by each electromagnet 352a by controlling the amount of current flowing through each electromagnet 352a, the electromagnet array 352 can be manufactured simply by arranging the same electromagnet 352a in an array. Therefore, the present invention can be manufactured at a lower cost.
Furthermore, for example, when the amount of current supplied to the electromagnet 352a is increased or decreased in accordance with the elevation of the mask magnetized plate 54, the pins 54a and the biasing member 54b described in the embodiment may be eliminated. it can. Specifically, the longer the distance between the mask magnetized plate 54 and the mask M, the weaker the current supplied to the electromagnet 352a, and the shorter the distance between the mask magnetized plate 54 and the mask M, the supplied to the electromagnet 352a. It is better to increase the current. When comprised in this way, it can prevent that the mask M attracts | sucks the mask magnetic attachment board 54 rapidly, and a wrinkle arises. Further, after the mask M is magnetized on the mask magnetized plate 54, the mask M can be magnetized by a strong magnetic field.

In addition, although the example which provides the difference in the electric current amount sent for every some electromagnet 352a and provides a difference in the intensity | strength of a magnetic field was demonstrated, the mask M is hold | maintained thoroughly by controlling the timing which sends an electric current to the electromagnet 352a. You may comprise as follows. For example, an electric current is passed from the electromagnet 352a disposed on one side (the right side in FIG. 17) of the mask magnetized plate 351, and then the electromagnet 352a on the one side is sequentially transferred to the electromagnet 352a on the other end (the left side in FIG. 17) You may comprise so that an electric current may be sent. In this case, the mask M is magnetically adhered to the mask magnetic adhesion plate 351 in order from one side to the other end.
Alternatively, a current may be supplied from the electromagnet 352a disposed in the central portion of the mask magnetic plate 351, and then a current may be supplied to the electromagnet 352a in the order from the central portion to the peripheral side.

(Modification 4)
Since the thin film forming apparatus 1 and the mask holding / positioning device 405 according to the modification 4 are different only in the structure of the mask holding / positioning device 405, the differences will be mainly described below. The mask holding / positioning device 405 includes the same magnet support plate and magnet array as in the embodiment. The magnet array includes a plurality of permanent magnets arranged in a matrix on a magnet support plate. The strength of the magnetic field created by each permanent magnet is different. Specifically, it is configured such that the strength of the magnetic field created by the permanent magnet disposed in the center of the magnet support plate is stronger than the strength of the magnetic field created by the permanent magnet disposed on the peripheral side. .
FIG. 19 is an explanatory diagram conceptually showing the mask holding method in the fourth modification. In FIG. 19, a method of holding the mask M placed on the arm portion 32 a of the transfer robot 32 using the mask holding / positioning device 405 will be described. First, the mask magnetic plate 54 is raised so as to be positioned above the arm portion 32a, and then the mask magnetic plate 54 is lowered as shown in FIG. When the mask magnetized plate 54 approaches the arm portion 32a, as shown in FIGS. 19B to 19D, the mask M is magnetized on the mask magnetized plate 54 in order from the region where the magnetic field is strong. In particular, in the fourth modification, the mask M is magnetized on the mask magnetized plate 54 from the central portion, and then the mask M is magnetized on the mask magnetized plate 54 in order from the central portion to the peripheral side. As shown in FIG. 19 (e), when the mask magnetized plate 54 is in close contact with the arm portion 32a, the mask M is in a state of being magnetized to the mask magnetized plate 54 without any defects. Further, since the mask magnetizing plate 54 and the magnet support plate 51 are close to or in close contact with the biasing force of the biasing member 54b, a stronger magnetic force acts on the mask M, and the mask M adheres to the mask magnetizing. Magnetically attached to the plate 54. Then, as shown in FIG. 19F, when the lifting shaft is raised, the mask M is raised together with the mask magnetized plate 54 while still being magnetized on the mask magnetized plate 54.
(Modification 5)
Since the thin film forming apparatus 1 and the mask holding / positioning apparatus 5 according to the modification 5 are different only in the configuration of the magnet support plate 551 and the magnet array 552, the differences will be mainly described below.
FIG. 20 is a schematic diagram of a magnet support plate 551 and a magnet array 552 according to the fifth modification. The magnet array 552 includes a plurality of permanent magnets 552a arranged in a matrix on the magnet support plate 551. The strength of the magnetic field generated by each permanent magnet 552a is substantially the same. The magnet support plate 551 includes a permanent magnet 552a disposed in the central portion of the magnet support plate 551 and a distance between the mask magnetized plate 54 and the permanent magnet 552a disposed on the peripheral side, and the mask magnetized plate 54 Has a stepped portion on the arrangement surface on which the permanent magnet 552a is disposed.
In the mask holding / alignment apparatus 5 configured as described above, the strength of the magnetic field created at the center of the mask magnetized plate 54 is higher than the strength of the magnetic field created at the peripheral side. The mode of suction of the mask M is the same as that of the fourth modification.

In the modified example 5, the same effects as those of the above-described embodiment are obtained. Moreover, since the magnetic force of the permanent magnet 552a is the same, it is not necessary to consider the arrangement position of the magnet with a strong magnetic force and the magnet with a weak magnetic force, and the magnet array 552 can be comprised easily. Therefore, the present invention can be manufactured at a lower cost.
(Modification 6)
Since the thin film forming apparatus 1 and the mask holding / positioning apparatus 5 according to the modified example 6 are different only in the configuration of the magnet support plate 658, the mask magnetic deposition plate 651, and the magnet array 652, the following mainly describes the differences. To do.
FIG. 21 is a schematic diagram of a magnet support plate 658, a mask magnetized plate 651, and a magnet array 652 according to Modification 6. The magnet support plate 658 is a plate material that supports the magnet array 652. The magnet support plate 658 has a substantially rectangular shape, for example, and side walls 659 are provided substantially vertically downward on opposite sides. At the lower end of the side wall 659, a mask magnetized plate 651 is provided substantially parallel to the magnet support plate 658.
The magnet array 652 includes a plurality of permanent magnets 652a arranged in a matrix on the magnet support plate 658 so as to be movable in the vertical direction, that is, in a direction in which the magnet magnet 652a is in contact with or separated from the mask magnetized plate. Specifically, the magnet array 652 includes a plurality of motors 652b that move the permanent magnets 652a in the vertical direction, and the motors 652b are fixed to the magnet support plate 658 in a matrix. The motor 652b includes a shaft portion 652c that advances and retreats in the vertical direction, and a permanent magnet 652a is fixed to an end portion of each shaft portion 652c. The operation of each motor 652b is controlled by a control unit (not shown).

22 and 23 are explanatory views conceptually showing the mask holding method in the sixth modification. First, as shown in FIG. 22 (a), the mask magnetized plate 651 is lowered, and as shown in FIG. 22 (b), some permanent magnets 652a are moved closer to the masked magnetized plate 651 using the motor 652b. Let For example, the three permanent magnets 652a arranged on one side (the right side in FIG. 22) of the magnet support plate 658 are moved to the mask magnetized plate 651 side.
Next, as shown in FIG. 22 (c), while moving the three permanent magnets 652a, the remaining three permanent magnets 652a arranged on one side of the magnet support plate 658 are also moved to the mask magnetized plate 651 side. Let When the mask magnetized plate 651 approaches the arm portion 32a and a part of the permanent magnets 652a approaches the mask magnetized plate 651, a magnetic field is generated on a part of the mask magnetized plate 651 as shown in FIG. A strong region is generated, and the mask M is magnetically attached to the mask magnetized plate 651 in that order. Therefore, the magnetic field acting on the mask M is suddenly increased, and it is prevented that the mask M is magnetically attached to the mask magnetic plate 651 in a state where wrinkles are formed. Hereinafter, similarly, as shown in FIGS. 23D to 23G, the mask magnetized plate 651 is brought close to the arm portion 32a while moving from one side of the magnet support plate 658 to the other side (left side in FIG. 22). When the permanent magnet 652a is brought close to the mask magnetized plate 651 in this order, the mask M is magnetized in sequence from one side to the other side. When the magnetic masking plate 651 is lifted after the completion of the magnetic bonding of the mask M, the mask M is lifted together with the mask magnetic bonding plate 651 while being completely attached to the mask magnetic bonding plate 651.

In the modified example 6, the same effects as those of the above-described embodiment can be obtained. Further, since the distribution of the strength of the magnetic field can be changed by controlling the position of the permanent magnet 652a, the control of the magnetic field is easy.
Furthermore, since the position of each permanent magnet 652a is controlled, the magnet array 652 can be manufactured simply by arranging the same permanent magnet 652a in an array, so that a thin film forming apparatus can be manufactured at a lower cost. be able to.
Furthermore, the pin 54a and the urging member 54b described in the above embodiment can be eliminated.

(Modification 7)
Since the thin film forming apparatus 1 and the mask holding / positioning apparatus 5 according to the modified example 7 are different from the above-described embodiment only in the configuration of the substrate holding unit 713, the differences will be mainly described below.
FIG. 24 is a side cross-sectional view schematically showing a configuration example of the substrate holding unit 713 according to Modification 7. A mask holding mechanism 8 is provided inside the substrate holding portion 713 of the thin film forming apparatus 1 according to Modification Example 7. The mask holding mechanism 8 includes a moving magnet support plate 81 having a permanent magnet array 82 provided on the upper surface, and an elevating mechanism 83 that moves the moving magnet support plate 81 up and down inside the substrate holding portion 713. As in the embodiment, the permanent magnet array 82 is configured such that the strength of the magnetic field of the permanent magnet arranged on one side is higher than the strength of the magnetic field of the permanent magnet arranged on the other side. . The elevating mechanism 83 includes a bottom plate 83a, two first support posts 83b provided substantially perpendicular to the upper surface of the bottom plate 83a, and a screw shaft support plate 83c provided at the upper end of the first support post 83b. . The elevating mechanism 83 includes two second support columns 83d provided substantially vertically on the upper surface of the screw shaft support plate 83c, and a top plate portion 83e provided at the upper end of the second support column 83d. . A movable magnet support plate 81 that moves up and down in the substrate holding portion 713 is supported by the second support column 83d. The moving magnet support plate 81 is provided with a linear bush 83f through which the first and second support columns 83b and 83d are inserted. The moving magnet support plate 81 is substantially parallel to the outer surface of the upper portion of the substrate holding portion 713. The second support 83 is inserted through the linear bush 83f so that it can be moved up and down. A screw shaft 83g constituting a ball screw mechanism passes through the screw shaft support plate 83c through a bearing. A screw nut 83i that is screwed into the screw shaft 83g is provided at an appropriate position of the moving magnet support plate 81, and a ball screw mechanism that moves the moving magnet support plate 81 up and down is configured by the screw nut 83i and the screw shaft 83g. . A driven pulley 83h for rotating the screw shaft 83g is provided at the lower end of the screw shaft 83g. Similarly to the lifting mechanism described in the embodiment, the driven pulley 83h is connected to a drive pulley provided on the output shaft of the motor via a belt (not shown), and a moving magnet support plate 81 is provided by the rotational force of the motor. It is configured to move up and down. The rotation of the motor is controlled by a control unit (not shown).

  The configuration of the heat medium flow path 13d, the pipe 13e, the heat transfer gas supply unit 13f, the gas supply pipe 13g, the switch 13i, and the like is the same as that of the embodiment. An electrostatic chuck 13b may be further provided on the substrate holding part 713 according to the modification example 7.

  In the modified example 7, the substrate holding unit 713 can hold the mask M on the substrate G with a magnetic force as in the mask holding / positioning device 5.

(Modification 8)
Since the thin film forming apparatus 1 and the mask holding / positioning device 805 according to the modification 8 are different from the above-described embodiment only in the configuration of the mask holding / positioning device 805, the differences will be mainly described below. To do.
FIG. 25 is an explanatory view schematically showing a main part of a mask holding / positioning device 805 according to Modification 8. The mask holding / alignment device 805 grips the edge of the mask M magnetically attached to the mask magnetic attachment plate 54, and provides a clamp portion 57 for applying a tension in the outer side in the surface direction to the mask M. A plurality of outer peripheral portions are provided. The clamp portion 57 includes a guide shaft 57b that protrudes outward from the side portion of the magnet support plate 51, that is, an outward direction along the surface of the mask magnetized plate 54, and a main body portion 57a that moves along the guide shaft 57b. Prepare. The main body 57a has a gripping protrusion 57c for gripping the mask M magnetically attached to the mask magnetic attachment plate 54. The gripping protrusion 57c is, for example, a plate member that protrudes from the main body portion 57a to the mask magnetic adhesion plate 54 side. The main body 57a includes a gripping claw 57d that is rotatably provided on the main body 57a so as to be in contact with and away from the gripping protrusion 57c. Further, the clamp unit 57 includes a main body drive motor (not shown) that moves the main body 57a along the guide shaft 57b, and a grip claw drive motor that rotates the grip claw 57d, and the rotation of each motor is controlled by the control unit. It is configured to be controlled.

The control unit drives the main body drive motor to move the main body 57a to the outside and drives the gripping claw drive motor to drive the gripping claw 57d before magnetizing the mask M to the mask magnetized plate 54. Separated from the gripping projection 57c.
When the mask M is magnetized on the mask magnetized plate 54, the control unit then drives the main body drive motor to move the main body 57a inward, and drives the grip claw drive motor to move the grip claw 57d. Rotate in a direction to contact the gripping protrusion 57c. When the mask M is gripped by the gripping protrusions 57c and the gripping claws 57d, the control unit drives the body portion driving motor to move the body portion 57a outward.
When the main body 57a moves to the outside while the mask M is gripped by the gripping protrusions 57c and the gripping claws 57d, the mask M is applied with a tension on the outer side in the surface direction, and the wrinkles are stretched.

  In the modified example 8, the mask M is applied with a tension on the outer side in the plane direction, and the wrinkles are extended, so that the mask M can be magnetically attached without any wrinkles.

  In the modification 8, the mask magnetic plate 54 is formed in a frame shape, for example, a rectangular frame shape, and when the mask M is magnetically attached to the mask magnetic plate 54, the region of the mask M where no vapor deposition is performed is masked. You may comprise so that it may contact with the magnetized board 54. FIG. When configured in this manner, the organic layer deposited on the mask M does not come into contact with the mask magnetic plate 54, and the organic material can be prevented from adhering to the mask magnetic plate 54.

(Modification 9)
Since the thin film forming apparatus 1 and the mask holding / positioning apparatus 905 according to the modification 9 are different from the above-described embodiment only in the configuration of the mask holding / positioning apparatus 905, the following mainly describes the differences. To do.

  FIG. 26 is an explanatory view schematically showing the main part of a mask holding / positioning device 905 according to Modification 9. The mask holding / positioning device 905 includes a pin 54 d for grounding the mask M on the mask magnetic adhesion plate 54. The pins 54d are provided, for example, at the peripheral edge portion of the mask magnetized plate 54. The pin 54d is grounded by a wiring (not shown).

In the modified example 9, after the vapor deposition is completed, when the mask holding / positioning device 905 is driven and the mask magnetic deposition plate 54 comes into contact with the mask M, the film is formed on the surface of the mask M by the pins 54d. The organic film is destroyed and the mask M is grounded. When the mask M is grounded, the charge of the mask M charged by the power supply to the electrostatic chuck 13b escapes to the ground, so that the mask M can be easily detached from the substrate G.
Particularly, in the modified example 9, since the rotation mechanism of the pin 54d is unnecessary, the generation of particles can be suppressed.

(Modification 10)
The thin film forming apparatus according to the modified example 10 is different in that it is configured using a smaller number of mask holding / alignment apparatuses 5 than the total number of masks M arranged on the substrate G. The differences will be described. Specifically, the thin film forming apparatus according to the modified example 10 includes the same number of mask holding / alignment devices 5 as the number of masks M arranged along the direction orthogonal to the transport direction of the substrate G.

  FIG. 27 is an explanatory view schematically showing a main part of a thin film forming apparatus according to Modification 10 in cross section. As shown in FIG. 27, the thin film forming apparatus according to Modification 10 includes two mask holding / positioning apparatuses 5 and is configured to dispose four masks M on a substrate G. The two mask holding / alignment devices 5 are juxtaposed in a direction orthogonal to the transport direction of the substrate G, and each device is provided at the top of the processing chamber 11 so as to be movable in the transport direction of the substrate G. Specifically, the thin film forming apparatus includes a moving mechanism 91 that moves the mask holding / positioning apparatus 5 in the transport direction of the substrate G.

  The moving mechanism 91 includes two transport rails 91a provided in parallel on the top of the processing chamber 11 so that the longitudinal direction thereof coincides with the transport direction of the substrate G. The mask holding / positioning device 5 is supported by the two transport rails 91a so as to be movable in the transport direction of the substrate G. Further, the moving mechanism 91 includes a driving mechanism 91b that moves the mask holding / positioning device 5 along the transport rail 91a.

  In the thin film forming apparatus configured as described above, by driving the driving mechanism 91b, the two mask holding / alignment apparatuses 5 are moved to the left side, and the two masks M are arranged on the left side of the substrate G. To do. Next, the mask holding / positioning device 5 holds the two masks M conveyed from the mask stock chamber 2 and drives the driving mechanism 91b to move the two mask holding / positioning devices 5 to the right side. Then, two masks M are arranged on the right side of the substrate G.

  In the modified example 10, a thin film forming apparatus can be configured at a low cost by using a smaller number of mask holding / alignment apparatuses 5 than the total number of masks M arranged on the substrate G.

  In the above-described modification 10, the configuration in which the mask holding / positioning device 5 is horizontally moved has been described. However, instead of moving the mask holding / positioning device 5 in the transport direction of the substrate G, the substrate holding unit 13 side You may comprise so that it may move to this conveyance direction. In this case, particles falling on the substrate G from the top side of the processing chamber 11 can be reduced.

(Modification 11)
The thin film forming apparatus according to the modified example 11 is different in that a plurality of masks M are arranged on the substrate G using a single mask holding / positioning apparatus 5, and therefore mainly the above will be described below. The differences will be described.

  FIG. 28 is an explanatory view schematically showing a main part of a thin film forming apparatus according to Modification 11 in a cross section. As shown in FIG. 28, the thin film forming apparatus according to Modification 11 includes a single mask holding / positioning apparatus 5 and is configured to arrange four masks M on a substrate G. The mask holding / positioning device 5 is provided at the top of the processing chamber 11 so as to be movable in two directions, ie, the transport direction of the substrate G and the lateral direction (vertical direction in FIG. 28). Specifically, the thin film forming apparatus includes a moving mechanism 92 that moves the mask holding / positioning apparatus 5 in the transport direction and the lateral direction of the substrate G. The lateral direction is a direction defined in the embodiment, that is, a direction orthogonal to the transport direction.

  The moving mechanism 92 is supported so as to be orthogonal to the transport rail 92a and one transport rail 92a provided at the top of the processing chamber 11 so that the longitudinal direction coincides with the transport direction of the substrate G. A transport rail 92b that moves along the transport rail 92a. The mask holding / positioning device 5 is supported so as to be movable along the transport rail 92b. The moving mechanism 92 includes a driving mechanism 92c that moves the mask holding / positioning device 5 along the transport rail 92b, and a driving mechanism 92d that moves the transport rail 92b along the transport rail 92a.

  In the thin film forming apparatus configured as described above, by driving the drive mechanisms 92c and 92d, the two mask holding / alignment apparatuses 5 are moved to the upper left in FIG. To do. Next, the mask holding / positioning device 5 holds one mask M transported from the mask stock chamber 2 and drives the driving mechanism 92c to move the mask holding / positioning device 5 to the upper right side in FIG. To move one mask M. Similarly, by driving the driving mechanisms 92c and 92d, the mask holding / positioning device 5 is moved to the lower left side and the lower right side in FIG. can do.

  In the modification 11, the thin film forming apparatus can be configured at a low cost by using the single mask holding / positioning apparatus 5.

  In the above-described modification 11, the configuration in which the mask holding / positioning device 5 is moved in the transport direction and the horizontal direction has been described. However, the mask holding / positioning device 5 is moved only in the horizontal direction by the moving mechanism, and the substrate is moved. The holding unit 13 may be configured to move in the transport direction. In this case, particles falling on the substrate G from the top side of the processing chamber 11 can be reduced as compared with the case where the mask holding / positioning device 5 is moved in two directions.

  The embodiment disclosed this time is to be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the meanings described above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

DESCRIPTION OF SYMBOLS 1 Thin film formation apparatus 2 Mask accommodating part 3 Mask transfer chamber 4 Substrate transfer chamber 5, 6 Mask holding | maintenance and alignment apparatus 7 Used mask accommodating part 13 Substrate holding part 13b Electrostatic chuck 13d Heat medium flow path 13f Gas supply for heat transfer Portion 13g Gas supply piping 13h Wiring 13i Switch 51 Magnet support plate 51a, 51b Cooling tube 52 Magnet array 53 Lifting mechanism 53a Strut 53b Moving plate 53c Linear bush 53d Lifting shaft 53e Screw nut 53f Screw shaft 53g Top plate portion 53h Passive pulley 53i Belt Drive pulley 53k Motor 53l Motor drive unit 54 Mask magnetized plate 54a Pin 54b Biasing member 55 Imaging unit 56 Position adjustment mechanism G Substrate M Mask

Claims (14)

In a mask holding device for holding a sheet-like mask containing a magnetic material and having an opening for patterning a thin film on a substrate,
With a plurality of magnets arranged on one side, a mask magnetized plate on which the mask is magnetized on the other side,
The plurality of magnets are:
A mask holding device, wherein the distribution of the magnetic field of the first region on the other surface side of the mask magnetic plate is different from the distribution of the magnetic field of the second region on the other surface side. The strength of the magnetic field created by the magnet disposed on the one surface side corresponding to the first region is different from the strength of the magnetic field created by the magnet disposed on the one surface side corresponding to the second region. 2. The mask holding device according to 1. The distance between the magnet arranged on one side corresponding to the first region and the mask magnetic plate is different from the distance between the magnet arranged on one side corresponding to the second region and the mask magnetic plate. The mask holding device according to claim 1, wherein: The distance between the plurality of magnets arranged on the one surface side corresponding to the first region and the distance between the plurality of magnets arranged on the one surface side corresponding to the second region are different. The mask holding device according to any one of claims 1 to 3. The mask holding device according to claim 1, wherein the plurality of magnets are permanent magnets or electromagnets. A support member that supports the mask magnetized plate so as to be able to move in a direction in which the magnet is in contact with or separated from the plurality of magnets;
The mask holding device according to claim 1, further comprising: an urging member that urges the mask magnetized plate in a direction away from the plurality of permanent magnets. The mask holding device according to any one of claims 1 to 6, further comprising means for cooling the plurality of magnets or the mask magnetized plate. 8. The apparatus according to claim 1, further comprising means for gripping an edge portion of the mask magnetically attached to the mask magnetic attachment plate at a plurality of locations and applying a tension on the outer side in the surface direction to the mask. The mask holding device according to one. A substrate holding unit that holds a substrate with a surface on which pattern formation is performed facing upward or laterally, and the mask holding device according to any one of claims 1 to 8, wherein the mask holding device includes: A thin film forming apparatus for placing a mask held in place on a substrate and forming a thin film pattern on the substrate,
The mask holding device is
The thin film forming apparatus, wherein the mask magnetized plate is disposed above or to the side of the substrate holding unit in a posture in which the mask magnetized plate is substantially parallel to the substrate held by the substrate holding unit. The thin film forming apparatus according to claim 9, further comprising a position adjusting mechanism that moves the mask magnetic adhesion plate in a direction substantially parallel to and substantially perpendicular to the substrate held by the substrate holding unit. The substrate holder is
The thin film forming apparatus according to claim 9, further comprising an electrostatic chuck mechanism that holds the substrate by electrostatic force. The substrate holder is
The thin film forming apparatus according to claim 11, further comprising a grounding unit that grounds a surface on which the substrate is attracted. The substrate holder is
A plurality of magnets for magnetizing a mask on a substrate are provided,
The plurality of magnets are:
The magnetic field distribution of the first region and the magnetic field distribution of the second region on the surface of the substrate holding unit on which the substrate is held are configured to be different from each other. The thin film forming apparatus described. The substrate holder is
The thin film forming apparatus according to claim 9, further comprising means for cooling the substrate.

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